Datasheet Ambient Light Sensor IC Series Analog Current Output Type Ambient Light Sensor IC BH1682FVC General Description Key Specifications ■ ■ ■ ■ ■ BH1682FVC is an analog current output type ambient light sensor IC. The output is proportion to logarithm of illuminance. It has wide illuminance detection range and is suitable for the application of display brightness control. Package Features VCC Voltage Range: Detection Range: IOUT Output Current at 100lx: Shutdown Current: Operating Temperature Range: WSOF5 Built-in log scale current AMP Built-in Ircut filter Built-in shutdown function Correspond to 1.8V logic interface 2.3V to 5.5V 55klx (Typ) 20μA (Typ) 0.1μA (Typ) -40°C to +85°C W(Typ) x D(Typ) x H(Max) 1.60mm x 1.60mm x 0.60mm Applications Mobile Phone, LCD TV, Note PC, Portable Game Machine, Digital Camera, LCD Display, etc. WSOF5 Typical Application Circuits 0.1µF VCC EN Micro Controller IRCUT FILTER NC PD Log scale current AMP IOUT RL GND 〇Product structure：Silicon monolithic integrated circuit. 〇This product has no designed protection against radioactive rays. 〇This product does not include laser transmitter. 〇This product does not include optical load. 〇This product includes Photo detector, ( Photo Diode ) inside of it. .www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 1/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Pin Configuration TOP VIEW 1 VCC 2 GND 3 EN IOUT 5 NC 4 Pin Description Pin No. Pin Name Function 1 VCC Power supply 2 GND 3 EN Ground Mode select H: Operating mode, L: Shutdown mode 4 NC 5 IOUT Non connect Current output pin It outputs current which depends on illuminance. Block Diagram VCC EN IRCUT FILTER NC PD Log scale current AMP IOUT GND Description of Blocks ・ PD Photodiode ・ Log scale current AMP Current amplifier. It amplifies PD current and perform logarithmic transform. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Supply Voltage VCCMR V Input Voltage VINMR Operating Temperature Range Topr 7 -0.3 to (VCC+0.3) or +7 whichever is less -40 to +85 °C Tstg -40 to +100 °C Tjmax 100 °C Storage Temperature Range Maximum Junction Temperature V Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter Thermal Resistance (Typ) Symbol 1s (Note 3) (Note 4) 2s2p Unit WSOF5 Junction to Ambient Junction to Top Characterization Parameter (Note 2) θJA 466.9 131.0 °C/W ΨJT 163 49 °C/W (Note 1)Based on JESD51-2A(Still-Air) (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm Recommended Operating Conditions (Ta = -40°C to +85°C) Parameter Symbol Min Typ Max Unit Supply Voltage VCC 2.3 3.0 5.5 V Input Voltage VIN 0 - 5.5 V www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Electrical Characteristics (Unless otherwise specified VCC=3.0V, Ta=25°C, EN=VCC) Parameter (Note) Symbol Min Typ Max Unit Conditions Supply Current1 ICC1 - 75 105 µA Ev=1000lx Supply Current2 ICC2 - 28 42 µA Ev=0lx Supply Current3 ICC3 - 0.1 0.4 µA EN=0V, No Input Light IOUT Output Current1 IOUT1 - - 0.5 µA Ev=0lx IOUT Output Current2 IOUT2 17 20 23 µA Ev=100lx Saturated Output Voltage VOMAX 2.6 2.9 3.0 V Ev=100lx, RL=220kΩ EN Input 'L' Voltage VIL - - 0.4 V EN Input 'H' Voltage 1 VIH1 1.4 - - V 2.3V ≤ VCC ≤ 3.6V EN Input 'H' Voltage 2 VIH2 2.0 - - V 3.6V < VCC ≤ 5.5V Wake-up Time tWU - 65 130 µs Shutdown to Operating mode Ev=100lx (Note) White LED is used as optical source. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC 1.0 50 0.8 40 0.6 30 IOUT [µA] Ratio converted into linear scale Typical Performance Curves 0.4 20 10 0.2 0 0.0 400 500 600 700 800 900 1 1000 1100 Wavelength [nm] 100 1000 10000 100000 Illuminance [lx] Figure 1. Ratio converted into linear scale vs Wavelength (Spectral Response) Figure 2. IOUT vs Illuminance 10.00 IOUT rise time after supplying VCC [ms] 50 40 1000lx IOUT [µA] 10 30 100lx 20 10 0 1.00 0.10 0.01 -40 -20 0 20 40 60 80 100 Ta [°C] 100 1000 Illiuminance [lx] Figure 4. IOUT rise time after supplying VCC vs Illuminance Figure 3. IOUT vs Ta www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10 5/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Optical design for the device Top View 0.8 mm 0.6 mm 0.4 mm 0.4 mm PD area: 0.25mm x 0.3mm 0.4 mm 0.4 mm Please design the optical window so that light can cover at least this area. Regarding optical design, need to be done with sufficient evaluation. I/O Equivalent Circuit Pin Name Equivalent Circuit EN VCC IOUT www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VCC VCC VCC 6/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Ordering Information B H 1 6 8 Part Number 2 F V C Package FVC: WSOF5 - TR Packaging and forming specification TR: Embossed tape and reel Marking Diagram WSOF5(TOP VIEW) A Part Number Marking H LOT Number www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 WSOF5 10/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 BH1682FVC Revision History Date Revision 13.May.2016 001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/11 TSZ02201-0M3M0F616040-1-2 13.May.2016 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. 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Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BH1682FVC - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BH1682FVC WSOF5 3000 3000 Taping inquiry Yes