LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 LP3981 Micropower, 300mA Ultra Low-Dropout CMOS Voltage Regulator Check for Samples: LP3981 FEATURES APPLICATIONS • • • • • • • 1 2 • • • • Small, Space Saving VSSOP-8 Low Thermal Resistance in WSON-6 Package Gives Excellent Power Capability Logic Controlled Enable Stable with Ceramic and High Quality Tantalum Capacitors Fast Turn-On Thermal Shutdown and Short-Circuit Current Limit KEY SPECIFICATIONS • • • • • • • • • 2.5 to 6.0V Input Range 300mA Output 60dB PSRR at 1kHz ≤1μA Quiescent Current when Shut Down Fast Turn-On Time: 120 μs (Typ.) with CBYPASS = 0.01uF 132mV Typ Dropout with 300mA Load 35μVrms Output Noise over 10Hz to 100kHz −40 to +125°C Junction Temperature Range for Operation 2.5V, 2.7V, 2.8V, 2.83V, 3.0V, 3.03V, and 3.3V Outputs Standard CDMA Cellular Handsets Wideband CDMA Cellular Handsets GSM Cellular Handsets Portable Information Appliances Tiny 3.3V ± 5% to 2.5V, 300mA Converter DESCRIPTION The LP3981's performance is optimized for battery powered systems to deliver ultra low noise, extremely low dropout voltage and low quiescent current. Regulator ground current increases only slightly in dropout, further prolonging the battery life. Power supply rejection is better than 60 dB at low frequencies. This high power supply rejection is maintained down to lower input voltage levels common to battery operated circuits. The device is ideal for mobile phone and similar battery powered wireless applications. It provides up to 300 mA, from a 2.5V to 6V input, consuming less than 1µA in disable mode. The LP3981 is available in VSSOP-8 package. For LP3981 in WSON-6 package, contact TI sales offices. Performance is specified for −40°C to +125°C temperature range. The device available in the following output voltages; 2.5V, 2.7V, 2.8V, 2.83V, 3.0V, 3.03V and 3.3V as standard. Other output options can be made available, please contact your local TI sales office. Typical Application Circuit Note: Pin Numbers in parenthesis indicate WSON-6 package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2013, Texas Instruments Incorporated LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Block Diagram PIN DESCRIPTIONS Name VSSOP-8 WSON-6 VEN 7 6 Enable Input Logic, Enable High. Function GND 5 4 Common Ground. Connect to PAD. VOUT 1 1 Output Voltage of the LDO. VIN 2 2 Input Voltage of the LDO. Bypass 6 5 Optional bypass capacitor for noise reduction. VOUT-SENSE 4 3 Output. Voltage Sense Pin. Should be connected to VOUT for proper operation. N.C. 3, 8 GND PAD Common Ground. Connect to pin 4. Connection Diagrams VOUT 1 VIN 2 6 VEN Device Code 5 Bypass 4 GND VOUT-SENSE 3 GND Figure 1. Top View VSSOP-8 Package See Package Number DGK 2 Figure 2. Top View WSON-6 Package See Package Number NGC0006D Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 ORDERING INFORMATION (1) (2) WSON-6 LP3981 Supplied as 1000 Units Tape and Reel LP3981 Supplied as 4500 Units Tape and Reel Package Marking 2.5V LP3981ILD-2.5 LP3981ILDX-2.5 LO1UB 2.7V LP3981ILD-2.7 LP3981ILDX-2.7 LO1VB 2.8V LP3981ILD-2.8 LP3981ILDX-2.8 LO1ZB LP3981ILD-2.83 LP3981ILDX-2.83 L01SB Output Voltage 2.83V Grade STD 3.0V LP3981ILD-3.0 LP3981ILDX-3.0 L017B 3.03V LP3981ILD-3.03 LP3981ILDX-3.03 LO1YB 3.3V LP3981ILD-3.3 LP3981ILDX-3.3 LO1XB LP3981 Supplied as 1000 Units Tape and Reel LP3981 Supplied as 3500 Units Tape and Reel Package Marking 2.5V LP3981IMM-2.5 LP3981IMMX-2.5 LFKB 2.7V LP3981IMM-2.7 LP3981IMMX-2.7 LFLB 2.8V LP3981IMM-2.8 LP3981IMMX-2.8 LFTB LDUB VSSOP-8 Package Output Voltage 2.83V (1) (2) Grade LP3981IMM-2.83 LP3981IMMX-2.83 3.0V STD LP3981IMM-3.0 LP3981IMMX-3.0 LF3B 3.03V LP3981IMM-3.03 LP3981IMMX-3.03 LFPB 3.3V LP3981IMM-3.3 LP3981IMMX-3.3 LFNB For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 3 LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) −0.3 to 6.5V VIN, VEN −0.3 to VIN + 0.3, Max 6.5V VOUT, VOUT-SENSE Junction Temperature 150°C Storage Temperature −65°C to +150°C Lead Temp. Pad Temp. Power Dissipation θJA (VSSOP-8) θJA (WSON-6) (4) 210°C/W 50°C/W Maximum Power Dissipation at 25°C VSSOP-8 WSON-6 595mW 2.5W ESD Rating (5) Human Body Model Machine Model (1) (2) (3) (4) (5) 2kV 200V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the potential at the GND pin. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. The figures given for Absolute Maximum Power dissipation for the device are calculated using the following equations: where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. E.g. for the WSON package θ JA=50°C/W, TJ(MAX)=150°C and using TA=25°C the maximum power dissipation is found to be 2.5W. The derating factor (−1/θJA) = −20mW/°C, thus below 25°C the power dissipation figure can be increased by 20 mW per degree, and similarity decreased by this factor for temperatures above 25°C The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) (2) VIN 2.7 to 6V VEN 0 to VIN −40°C to +125°C Junction Temperature Maximum Power Dissipation VSSOP-8 WSON-6 (1) (2) (3) 4 (3) 476mW 2.0W Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the potential at the GND pin. As for the Maximum Power dissipation, the maximum power in operation is dependant on the ambient temperature. This can be calculated in the same way using TJ=125°C, giving 2W as the maximum power dissipation for the WSON package in operation. The same derating factor applies. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Electrical Characteristics Unless otherwise specified: VEN = 1.2V, VIN = VOUT + 0.5V, CIN = 2.2 µF, CBP = 0.033 µF, IOUT = 1mA, COUT = 2.2 µF. Typical values and imits appearing in standard typeface are for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (1) (2) Symbol Parameter Conditions Typ Output Voltage Tolerance ΔVOUT VIN = VOUT + 0.5V to 6.0V, TA < +85°C Line Regulation Error Load Regulation Error (3) PSRR Power Supply Rejection Ratio IQ Quiescent Current Dropout Voltage (4) (6) IOUT = 1 mA to 300 mA 0.0003 VIN = VOUT(nom) + 1V, f = 1 kHz, IOUT = 50 mA (Figure 4) 50 VIN = VOUT(nom) + 1V, f = 10 kHz, IOUT = 50 mA (Figure 4) 55 0.1 %/V −0.2 0.2 0.005 %/V %/mA dB 210 VEN = 0.4V 0.003 1.5 IOUT = 1 mA 0.5 5 IOUT = 200 mA 88 133 IOUT = 300 mA 132 200 600 BW = 10 Hz to 100 kHz, CBP = 0.033µF µA mV mA 35 µVrms Thermal Shutdown Temperature 160 °C Thermal Shutdown Hysteresis 20 IOUT(PK) Peak Output Current VOUT ≥ VOUT (nom) - 5% IEN Maximum Input Current at VEN VEN = 0 and VIN VIL Logic Low Input threshold VIN = 2.7 to 6.0V VIH Logic High Input threshold VIN = 2.7 to 6.0V (7) −0.1 120 Output Noise Voltage (2) (3) (4) (5) (6) % of VOUT(nom) 70 en (1) 2 3 170 Output Grounded (Steady State) TON −2 −3 VEN = 1.2V, IOUT = 1 to 300 mA, VOUT = 2.5V (5) Short Circuit Current Limit Units Max VEN = 1.2V, IOUT = 1 mA ISC TSD 0.005 VIN = VOUT + 0.5V to 6.0V, TJ ≤125°C Limit Min Turn-On Time (4) (7) CBYPASS = 0.033 µF 455 °C 300 0.001 µA 0.4 1.4 240 V V 350 µs Min and Max Limits are specified by design, test, or statistical analysis. Typical (Typ.) numbers are not verified, but do represent the most likely norm. The target output voltage, which is labeled VOUT(nom), is the desired voltage option. An increase in the load current results in a slight decrease in the output voltage and vice versa. Specified by design. Not production tested. For VOUT > 2.5C, Increase IQ(MAX) by 2.5µA for every 0.1V increase in VOUT(NOM).i.e. IQ(MAX) = 210 + ((VOUT(NOM) - 2.5) * 25)µA Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification does not apply for input voltages below 2.5V. Turn-on time is time measured between the enable input just exceeding VIH and the output voltage just reaching 95% of its nominal value. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 5 LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Electrical Characteristics Output Capacitor, Recommended Specification Limit Symbol Parameter Conditions Typ COUT Output Capacitor Capacitance 2.2 22 µF ESR 5 500 mΩ Min Max Units Figure 3. Line Transient Response Input Perturbation Figure 4. PSRR Input Perturbation 6 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. Output Voltage vs. Temperature (VOUT = 2.83V) Dropout Voltage vs. Temperature (VOUT = 2.85V) Ground Current vs. Load Current (VOUT = 2.85V) Output Short Circuit Current Output Short Circuit Current Ripple Rejection (VIN = VOUT + 1V) Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 7 LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. 8 Ripple Rejection (VIN = VOUT + 1V) Ripple Rejection (VIN = VOUT + 1V) Load Transient Response (VIN = 3.5V) Load Transient Response (VIN = 3.5V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to VIN. Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Line Transient Response (VIN = VOUT + 1V to VOUT + 1.6V) Enable Response (TON) Enable Response (TON) Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 9 LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com APPLICATION HINTS POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependant on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. As stated in the notes for Absolute Maximum Ratings and Operating Ratings, the allowable power dissipation for the device in a given package can be calculated using the equation: (1) With a θJA = 50°C/W, the device in the WSON package returns a value of 2.0W with a maximum junction temperature of 125°C and an ambient temperature of 25°C. The device in a VSSOP package returns a figure of 0.476W, ( θJA = 210°C/W). The actual power dissipation across the device can be represented by the following equation: PD = (VIN − VOUT) x IOUT (2) This establishes the relationship between the power dissipation allowed due to thermal considerations, the voltage drop across the device, and the continuous current capability of the device. The device can deliver 300mA but care must be taken when choosing the continuous current output for the device under the operating load conditions. EXTERNAL CAPACITORS Like any low-dropout regulator, the LP3981 requires external capacitors for regulator stability. The LP3981 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitors must be correctly selected for good performance. INPUT CAPACITOR An input capacitance of ≊ 2.2µF is required between the LP3981 input pin and ground (the amount of the capacitance may be increased without limit). This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input. Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a lowimpedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be specified by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will be ≊ 2.2µF over the entire operating temperature range. OUTPUT CAPACITOR The LP3981 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor (dielectric types Z5U, Y5V or X7R) in 2.2 to 22 µF range with 5mΩ to 500mΩ ESR range is suitable in the LP3981 application circuit. It may also be possible to use tantalum or film capacitors at the output, but these are not as attractive for reasons of size and cost (see CAPACITOR CHARACTERISTICS). The output capacitor must meet the requirement for minimum amount of capacitance and also have an ESR (Equivalent Series Resistance) value which is within a stable range (5 mΩ to 500 mΩ). NO-LOAD STABILITY The LP3981 will remain stable and in regulation with no external load. This is specially important in CMOS RAM keep-alive applications. 10 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 LP3981 www.ti.com SNVS159G – OCTOBER 2001 – REVISED MAY 2013 NOISE BYPASS CAPACITOR Connecting a 0.033µF capacitor between the CBP pin and ground significantly reduces noise on the regulator output. This cap is connected directly to a high impedance node in the bad gap reference circuit. Any significant loading on this node will cause a change on the regulated output voltage. For this reason, DC leakage current through this pin must be kept as low as possible for best output voltage accuracy. The types of capacitors best suited for the noise bypass capacitor are ceramic and film. Hight-quality ceramic capacitors with either NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate film capacitors are available in small surface-mount packages and typically have extremely low leakage current. Unlike many other LDO's, addition of a noise reduction capacitor does not effect the transient response of the device. CAPACITOR CHARACTERISTICS The LP3981 is designed to work with ceramic capacitors on the output to take advantage of the benefits they offer: for capacitance values in the range of 1µF to 4.7µF range, ceramic capacitors are the smallest, least expensive and have the lowest ESR values (which makes them best for eliminating high frequency noise). The ESR of a typical 1µF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the ESR requirement for stability by the LP3981. The ceramic capacitor's capacitance can vary with temperature. Most large value ceramic capacitors (≊ 2.2µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by more than 50% as the temperature goes from 25°C to 85°C. A better choice for temperature coefficient in a ceramic capacitor is X7R, which holds the capacitance within ±15%. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range. Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly ) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed. ON/OFF INPUT OPERATION The LP3981 is turned off by pulling the VEN pin low, and turned on by pulling it high. If this feature is not used, the VEN pin should be tied to VIN to keep the regulator output on at all time. To assure proper operation, the signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. FAST ON-TIME The LP3981 utilizes a speed up circuitry to ramp up the internal VREF voltage to its final value to achieve a fast output turn on time. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 11 LP3981 SNVS159G – OCTOBER 2001 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision F (May 2013) to Revision G • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LP3981 PACKAGE OPTION ADDENDUM www.ti.com 12-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP3981ILD-2.5 NRND WSON NGC 6 1000 TBD Call TI Call TI -40 to 125 LO1UB LP3981ILD-2.5/NOPB ACTIVE WSON NGC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1UB LP3981ILD-2.8/NOPB ACTIVE WSON NGC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L01ZB LP3981ILD-3.0/NOPB ACTIVE WSON NGC 6 1000 Green (RoHS & no Sb/Br) CU SN | Call TI Level-3-260C-168 HR LP3981ILD-3.3/NOPB ACTIVE WSON NGC 6 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1XB LP3981ILDX-2.5/NOPB ACTIVE WSON NGC 6 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1UB LP3981ILDX-2.7/NOPB ACTIVE WSON NGC 6 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1VB LP3981ILDX-2.8/NOPB ACTIVE WSON NGC 6 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 L01ZB LP3981ILDX-2.83/NOPB ACTIVE WSON NGC 6 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1SB LP3981ILDX-3.03/NOPB ACTIVE WSON NGC 6 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 LO1YB LP3981IMM-2.5 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 LFKB LP3981IMM-2.5/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFKB LP3981IMM-2.7/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFLB LP3981IMM-2.8/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFTB LP3981IMM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LP3981IMM-3.03 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 LFPB LP3981IMM-3.03/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFPB LP3981IMM-3.3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 LFNB LP3981IMM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFNB Addendum-Page 1 L017B LF3B Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 12-Nov-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP3981IMMX-2.5/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFKB LP3981IMMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LFNB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Nov-2013 Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3981ILD-2.5 WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-2.5/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-2.8/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-3.0/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILD-3.3/NOPB WSON NGC 6 1000 178.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILDX-2.5/NOPB WSON NGC 6 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILDX-2.7/NOPB WSON NGC 6 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILDX-2.8/NOPB WSON NGC 6 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILDX-2.83/NOPB WSON NGC 6 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981ILDX-3.03/NOPB WSON NGC 6 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LP3981IMM-2.5 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-2.5/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-2.7/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-2.8/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-3.03 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-3.03/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3981IMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMMX-2.5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LP3981IMMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3981ILD-2.5 WSON NGC 6 1000 210.0 185.0 35.0 LP3981ILD-2.5/NOPB WSON NGC 6 1000 213.0 191.0 55.0 LP3981ILD-2.8/NOPB WSON NGC 6 1000 213.0 191.0 55.0 LP3981ILD-3.0/NOPB WSON NGC 6 1000 213.0 191.0 55.0 LP3981ILD-3.3/NOPB WSON NGC 6 1000 213.0 191.0 55.0 LP3981ILDX-2.5/NOPB WSON NGC 6 4500 367.0 367.0 35.0 LP3981ILDX-2.7/NOPB WSON NGC 6 4500 367.0 367.0 35.0 LP3981ILDX-2.8/NOPB WSON NGC 6 4500 367.0 367.0 35.0 LP3981ILDX-2.83/NOPB WSON NGC 6 4500 367.0 367.0 35.0 LP3981ILDX-3.03/NOPB WSON NGC 6 4500 367.0 367.0 35.0 LP3981IMM-2.5 VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-2.5/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-2.7/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-2.8/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3981IMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.03 VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.03/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LP3981IMMX-2.5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LP3981IMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 3 MECHANICAL DATA NGC0006D LDC06D (Rev B) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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