TI CD74HC151MG4 High-speed cmos logic 8-input multiplexer Datasheet

[ /Title
(CD74H
C151,
CD74H
CT151)
/Subject
(High
Speed
CMOS
Logic 8Input
Multi-
CD54HC151, CD74HC151,
CD54HCT151, CD74HCT151
Data sheet acquired from Harris Semiconductor
SCHS150C
High-Speed CMOS Logic
8-Input Multiplexer
September 1997 - Revised October 2003
Features
Description
• Complementary Data Outputs
The ’HC151 and ’HCT151 are single 8-channel digital
multiplexers having three binary control inputs, S0, S1 and
S2 and an active low enable (E) input. The three binary
signals select 1 of 8 channels. Outputs are both inverting (Y)
and non-inverting (Y).
• Buffered Inputs and Outputs
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
TEMP. RANGE (oC)
PACKAGE
CD54HC151F3A
-55 to 125
16 Ld CERDIP
CD54HCT151F3A
-55 to 125
16 Ld CERDIP
CD74HC151E
-55 to 125
16 Ld PDIP
CD74HC151M
-55 to 125
16 Ld SOIC
CD74HC151MT
-55 to 125
16 Ld SOIC
CD74HC151M96
-55 to 125
16 Ld SOIC
CD74HCT151E
-55 to 125
16 Ld PDIP
CD74HCT151M
-55 to 125
16 Ld SOIC
CD74HCT151MT
-55 to 125
16 Ld SOIC
CD74HCT151M96
-55 to 125
16 Ld SOIC
PART NUMBER
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• Alternate Source is Philips/Signetics
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel
of 250.
Pinout
CD54HC151, CD54HCT151
(CERDIP)
CD74HC151, CD74HCT151
(PDIP, SOIC)
TOP VIEW
I3 1
16 VCC
I2 2
15 I4
I1 3
14 I5
I0 4
13 I6
Y 5
12 I7
Y 6
11 S0
E 7
10 S1
GND 8
9 S2
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC151, CD74HC151, CD54HCT151, CD74HCT151
Functional Diagram
4
I0
3
I1
2
I2
5
1
I3
Y
15
6
I4
Y
14
I5
13
I6
12
I7
11
S0
S1
10
9
S2
GND = 8
VCC = 16
7
E
TRUTH TABLE
SELECT INPUTS
DATA INPUTS
ENABLE
OUTPUT
S2
S1
S0
I0
I1
I2
I3
I4
I5
I6
I7
E
Y
Y
X
X
X
X
X
X
X
X
X
X
X
H
H
L
L
L
L
L
X
X
X
X
X
X
X
L
H
L
L
L
L
H
X
X
X
X
X
X
X
L
L
H
L
L
H
X
L
X
X
X
X
X
X
L
H
L
L
L
H
X
H
X
X
X
X
X
X
L
L
H
L
H
L
X
X
L
X
X
X
X
X
L
H
L
L
H
L
X
X
H
X
X
X
X
X
L
L
H
L
H
H
X
X
X
L
X
X
X
X
L
H
L
L
H
H
X
X
X
H
X
X
X
X
L
L
H
H
L
L
X
X
X
X
L
X
X
X
L
H
L
H
L
L
X
X
X
X
H
X
X
X
L
L
H
H
L
H
X
X
X
X
X
L
X
X
L
H
L
H
L
H
X
X
X
X
X
H
X
X
L
L
H
H
H
L
X
X
X
X
X
X
L
X
L
H
L
H
H
L
X
X
X
X
X
X
H
X
L
L
H
H
H
H
X
X
X
X
X
X
X
L
L
H
L
H
H
H
X
X
X
X
X
X
X
H
L
L
H
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
2
CD54HC151, CD74HC151, CD54HCT151, CD74HCT151
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD54HC151, CD74HC151, CD54HCT151, CD74HCT151
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 2)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
Select
1.5
Data
0.45
Enable
0.3
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
170
-
215
-
255
ns
4.5
-
-
34
-
43
-
51
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
29
-
37
-
43
ns
HC TYPES
Propagation Delay (Figure 1)
tPLH, tPHL CL = 50pF
Any Data Input to Y
4
CD54HC151, CD74HC151, CD54HCT151, CD74HCT151
Switching Specifications Input tr, tf = 6ns
PARAMETER
Any Data Input to Y
Any Select to Y
Any Select to Y
Enable to Y
Enable to Y
Output Transition Time
(Figure 1)
(Continued)
TEST
CONDITIONS
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
185
-
230
-
280
ns
4.5
-
-
37
-
46
-
56
ns
CL =15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
31
-
39
-
48
ns
tPLH, tPHL CL = 50pF
2
-
-
185
-
230
-
280
ns
4.5
-
-
37
-
46
-
56
ns
CL =15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
31
-
39
-
48
ns
tPLH, tPHL CL = 50pF
2
-
-
205
-
255
-
310
ns
4.5
-
-
41
-
51
-
62
ns
CL =15pF
5
-
17
-
-
-
-
-
ns
CL = 50pF
6
-
-
35
-
43
-
53
ns
tPLH, tPHL CL = 50pF
2
-
-
140
-
175
-
210
ns
4.5
-
-
28
-
35
-
42
ns
CL =15pF
5
-
11
-
-
-
-
-
ns
CL = 50pF
6
-
-
24
-
30
-
36
ns
tPLH, tPHL CL = 50pF
2
-
-
145
-
180
-
220
ns
4.5
-
-
29
-
36
-
44
ns
CL =15pF
5
-
12
-
-
-
-
-
ns
CL = 50pF
6
-
-
25
-
31
-
38
ns
tTLH, tTHL CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
SYMBOL
tPLH, tPHL CL = 50pF
Input Capacitance
CIN
-
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 3, 4)
CPD
-
5
-
59
-
-
-
-
-
pF
CL = 50pF
4.5
-
-
38
-
48
-
57
ns
CL =15pF
5
-
16
-
-
-
-
ns
4.5
-
-
36
-
45
-
54
ns
5
-
15
-
-
-
-
-
ns
4.5
-
41
-
51
-
62
ns
5
-
17
-
-
-
-
-
ns
4.5
-
-
43
-
54
-
65
ns
5
-
18
-
-
-
-
-
ns
4.5
-
-
29
-
36
-
44
ns
5
-
12
-
-
-
-
-
ns
HCT TYPES
Propagation Delay (Figure 2)
Any Data Input to Y
Any Data Input to Y
tPLH, tPHL
tPLH, tPHL CL = 50pF
CL =15pF
Any Select to Y
tPLH, tPHL CL = 50pF
CL =15pF
Any Select to Y
tPLH, tPHL CL = 50pF
CL =15pF
Enable to Y
tPLH, tPHL CL = 50pF
CL =15pF
5
CD54HC151, CD74HC151, CD54HCT151, CD74HCT151
Switching Specifications Input tr, tf = 6ns
PARAMETER
Enable to Y
SYMBOL
TEST
CONDITIONS
CL = 50pF CL = 50pF
CL =15pF
Output Transition Time
(Continued)
CL =15pF
tTLH, tTHL CL = 50pF
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5
-
-
36
-
46
-
54
ns
5
15
-
-
-
-
-
-
ns
4.5
-
-
15
-
19
-
22
ns
-
-
10
-
10
-
10
pF
58
-
-
-
-
-
pF
Input Capacitance
CIN
-
-
Power Dissipation Capacitance
(Notes 3, 4)
CPD
-
5
NOTES:
3. CPD is used to determine the dynamic power consumption, per gate.
4. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
Test Circuit and Waveform
tr = 6ns
tf = 6ns
INPUT LEVEL
ENABLE
SELECT
In
90%
VS
10%
tTHL
tTLH
GND
90%
VS
10%
Y OUTPUT
tPLH
tPLH
tPHL
tPHL
VS
Y OUTPUT
tTHL
FIGURE 1.
6
tTLH
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9065201MEA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC151F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT151F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC151E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC151EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC151M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC151MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT151EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT151M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT151MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
The marketing status values are defined as follows:
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC151M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
CD74HCT151M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC151M96
D
16
SITE 27
342.9
336.6
28.58
CD74HCT151M96
D
16
SITE 27
342.9
336.6
28.58
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
Similar pages