QFET ® FQA13N80_F109 800V N-Channel MOSFET Features Description • • • • • • These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology. 12.6A, 800V, RDS(on) = 0.75Ω @VGS = 10 V Low gate charge ( typical 68 nC) Low Crss ( typical 30pF) Fast switching 100% avalanche tested Improved dv/dt capability D G TO-3PN FQA Series G DS S Absolute Maximum Ratings Symbol Parameter FQA13N80_F109 Units VDSS Drain-Source Voltage 800 V ID Drain Current - Continuous (TC = 25°C) 12.6 A IDM Drain Current - Pulsed VGSS Gate-Source Voltage EAS - Continuous (TC = 100°C) 8.0 A (Note 1) 50.4 A ± 30 V Single Pulsed Avalanche Energy (Note 2) 1100 mJ IAR Avalanche Current (Note 1) 12.6 A EAR Repetitive Avalanche Energy (Note 1) 30 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) PD Power Dissipation (TC = 25°C) TJ, TSTG Operating and Storage Temperature Range TL Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds - Derate above 25°C 4.0 V/ns 300 W 2.38 W/°C -55 to +150 °C 300 °C Thermal Characteristics Symbol Parameter RθJC Thermal Resistance, Junction-to-Case RθCS Thermal Resistance, Case-to-Sink RθJA Thermal Resistance, Junction-to-Ambient ©2007 Fairchild Semiconductor Corporation FQA13N80_F109 Rev. A2 1 Typ Max Units -- 0.42 °C/W 0.24 -- °C/W -- 40 °C/W www.fairchildsemi.com FQA13N80_F109 800V N-Channel MOSFET July 2007 Device Marking Device Package Reel Size Tape Width Quantity FQA13N80 FQA13N80_F109 TO-3PN -- -- 30 Electrical Characteristics Symbol TC = 25°C unless otherwise noted Parameter Test Conditions Min Typ Max Units 800 -- -- V -- V/°C Off Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA ∆BVDSS/ ∆TJ Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C -- 0.95 IDSS Zero Gate Voltage Drain Current VDS = 800 V, VGS = 0 V -- -- 10 µA VDS = 640 V, TC = 125°C -- -- 100 µA IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA VDS = VGS, ID = 250 µA 3.0 -- 5.0 V On Characteristics VGS(th) Gate Threshold Voltage RDS(on) Static Drain-Source On-Resistance VGS = 10 V, ID = 6.3A gFS Forward Transconductance VDS = 50 V, ID = 6.3A (Note 4) -- 0.58 0.75 Ω -- 13 -- S -- 2700 3500 pF Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz -- 275 360 pF -- 30 39 pF -- 60 130 ns -- 150 310 ns -- 155 320 ns -- 110 230 ns -- 68 88 nC -- 15 -- nC -- 32 -- nC Switching Characteristics td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time tf Turn-Off Fall Time Qg Total Gate Charge Qgs Gate-Source Charge Qgd VDD = 400 V, ID = 12.6A, RG = 25 Ω (Note 4, 5) VDS = 640 V, ID = 12.6A, VGS = 10 V (Note 4, 5) Gate-Drain Charge Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current -- -- 12.6 A ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 50.4 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS =12.6A -- -- 1.4 V trr Reverse Recovery Time -- 850 -- ns Qrr Reverse Recovery Charge VGS = 0 V, IS = 12.6 A, dIF / dt = 100 A/µs -- 11.3 -- µC (Note 4) NOTES: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 13mH, IAS =12.6A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 12.6A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2% 5. Essentially independent of operating temperature FQA13N80_F109 Rev. A2 2 www.fairchildsemi.com FQA13N80_F109 800V N-Channel MOSFET Package Marking and Ordering Information FQA13N80_F109 800V N-Channel MOSFET Typical Performance Characteristics Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top : ID, Drain Current [A] 1 10 ID, Drain Current [A] 1 10 0 10 o 150 C o 25 C 0 10 o -55 C ※ Notes : 1. 250µs Pulse Test 2. TC = 25℃ ※ Notes : 1. VDS = 50V 2. 250µs Pulse Test -1 -1 10 -1 0 10 10 1 10 2 10 4 6 8 10 VGS, Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 1.5 IDR, Reverse Drain Current [A] RDS(ON) [Ω ], Drain-Source On-Resistance 1.8 VGS = 10V 1.2 VGS = 20V 0.9 0.6 1 10 0 10 150℃ 25℃ ※ Notes : 1. VGS = 0V 2. 250µ s Pulse Test ※ Note : TJ = 25℃ 0.3 -1 0 5 10 15 20 25 30 35 40 10 45 0.2 0.4 0.6 Figure 5. Capacitance Characteristics 5000 Capacitance [pF] VGS, Gate-Source Voltage [V] Ciss 3000 Coss 2000 ※ Notes : 1. VGS = 0 V 2. f = 1 MHz 1500 Crss 1000 VDS = 400V VDS = 640V 8 6 4 2 500 0 -1 10 ※ Note : ID = 12.6 A 0 0 10 1 10 0 10 20 30 40 50 60 70 80 QG, Total Gate Charge [nC] VDS, Drain-Source Voltage [V] FQA13N80_F109 Rev. A2 1.4 VDS = 160V 10 2500 1.2 12 4000 3500 1.0 Figure 6. Gate Charge Characteristics Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 4500 0.8 VSD, Source-Drain voltage [V] ID, Drain Current [A] 3 www.fairchildsemi.com Figure 7. Breakdown Voltage Variation vs. Temperature Figure 8. On-Resistance Variation vs. Temperature 3.0 RDS(ON), (Normalized) Drain-Source On-Resistance BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 ※ Notes : 1. VGS = 0 V 2. ID = 250 µA 0.9 0.8 -100 -50 0 50 100 150 2.5 2.0 1.5 1.0 ※ Notes : 1. VGS = 10 V 2. ID = 6.3 A 0.5 0.0 -100 200 -50 0 50 100 150 200 o TJ, Junction Temperature [ C] o TJ, Junction Temperature [ C] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature 14 Operation in This Area is Limited by R DS(on) ID, Drain Current [A] 12 1 10 DC 100µ s 1 ms 10 ms 10µ s ID, Drain Current [A] 2 10 0 10 ※ Notes : o 1. TC = 25 C o 2. TJ = 150 C 3. Single Pulse -1 10 0 10 1 2 10 8 6 4 2 -2 10 10 0 25 3 10 10 50 75 100 125 150 TC, Case Temperature [℃] VDS, Drain-Source Voltage [V] Zθ JC(t), Thermal Response Figure 11. Transient Thermal Response Curve D = 0 .5 10 -1 ※ N o te s : 1 . Z θ J C (t) = 0 .4 2 ℃ /W M a x . 2 . D u ty F a c to r, D = t 1 /t 2 3 . T J M - T C = P D M * Z θ J C (t) 0 .2 0 .1 0 .0 5 PDM 0 .0 2 10 t1 0 .0 1 -2 s in g le p u ls e 10 -5 10 -4 10 -3 10 -2 10 -1 t2 10 0 10 1 t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ] FQA13N80_F109 Rev. A2 4 www.fairchildsemi.com FQA13N80_F109 800V N-Channel MOSFET Typical Performance Characteristics (Continued) FQA13N80_F109 800V N-Channel MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms FQA13N80_F109 Rev. A2 5 www.fairchildsemi.com FQA13N80_F109 800V N-Channel MOSFET Peak Diode Recovery dv/dt Test Circuit & Waveforms FQA13N80_F109 Rev. A2 6 www.fairchildsemi.com FQA13N80_F109 800V N-Channel MOSFET Mechanical Dimensions TO-3PN Dimensions in Millimeters FQA13N80_F109 Rev. 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A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I30