Revised July 2003 MM74HC154 4-to-16 Line Decoder General Description The MM74HC154 decoder utilizes advanced silicon-gate CMOS technology, and is well suited to memory address decoding or data routing applications. It possesses high noise immunity, and low power consumption of CMOS with speeds similar to low power Schottky TTL circuits. The MM74HC154 have 4 binary select inputs (A, B, C, and D). If the device is enabled these inputs determine which one of the 16 normally HIGH outputs will go LOW. Two active LOW enables (G1 and G2) are provided to ease cascading of decoders with little or no external logic. Each output can drive 10 low power Schottky TTL equivalent loads, and is functionally and pin equivalent to the 74LS154. All inputs are protected from damage due to static discharge by diodes to VCC and ground. Features ■ Typical propagation delay: 21 ns ■ Power supply quiescent current: 80 µA ■ Wide power supply voltage range: 2–6V ■ Low input current: 1 µA maximum Ordering Code: Order Number Package Number MM74HC154WM M24B MM74HC154MTC MTC24 MM74HC154N N24C Package Description 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram Truth Table Inputs Pin Assignments for DIP, SOIC and TSSOP G1 G2 Top View Low D C B A Output (Note 1) L L L L L L 0 L L L L L H 1 L L L L H L 2 L L L L H H 3 L L L H L L 4 L L L H L H 5 L L L H H L 6 L L L H H H 7 L L H L L L 8 L L H L L H 9 L L H L H L 10 L L H L H H 11 L L H H L L 12 L L H H L H 13 L L H H H L 14 L L H H H H 15 L H X X X X — H L X X X X — H H X X X X — Note 1: All others HIGH © 2003 Fairchild Semiconductor Corporation DS005122 www.fairchildsemi.com MM74HC154 4-to-16 Line Decoder September 1983 MM74HC154 Logic Diagram www.fairchildsemi.com 2 Recommended Operating Conditions (Note 3) Supply Voltage (VCC) −0.5 to +7.0V DC Input Voltage (VIN) −1.5 to VCC +1.5V DC Output Voltage (VOUT) −0.5 to VCC +0.5V Clamp Diode Current (IIK, IOK) ±20 mA DC Output Current, per pin (IOUT) ±25 mA Power Dissipation (PD) 600 mW S.O. Package only 500 mW VIL VOH −40 +85 °C (tr, tf) VCC = 2.0V 1000 ns VCC = 4.5V 500 ns VCC = 6.0V 400 ns Note 4: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. 260°C DC Electrical Characteristics VIH V Note 3: Unless otherwise specified all voltages are referenced to ground. (Soldering 10 seconds) Parameter V VCC Note 2: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Lead Temperature (TL) Symbol 6 0 Input Rise or Fall Times −65°C to +150°C (Note 4) 2 DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) ±50 mA DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Min Max Units Supply Voltage (VCC) (Note 5) VCC Conditions TA = 25°C Typ TA = −40 to 85°C Guaranteed Limits Minimum HIGH 2.0V 1.5 1.5 Level Input 4.5V 3.15 3.15 Voltage 6.0V 4.2 4.2 Maximum LOW 2.0V 0.5 0.5 Level Input 4.5V 1.35 1.35 Voltage 6.0V 1.8 1.8 Minimum HIGH VIN = VIH or VIL Level Output |IOUT| ≤ 20 µA 2.0V 2.0 1.9 1.9 4.5V 4.5 4.4 4.4 6.0V 6.0 5.9 5.9 |IOUT| ≤ 4.0 mA 4.5V 4.2 3.98 3.84 |IOUT| ≤ 5.2 mA 6.0V 5.7 5.48 5.34 Voltage Units V V V VIN = VIH or VIL VOL Maximum LOW VIN = VIH or VIL Level Output |IOUT| ≤ 20 µA V 2.0V 0 0.1 0.1 4.5V 0 0.1 0.1 6.0V 0 0.1 0.1 |IOUT| ≤ 4.0 mA 4.5V 0.2 0.26 0.33 |IOUT| ≤ 5.2 mA 6.0V 0.2 0.26 0.33 VIN = VCC or GND 6.0V ±0.1 ±1.0 µA Maximum VIN = VCC or GND 6.0V 8.0 80 µA Quiescent IOUT = 0 µA Voltage V VIN = VIH or VIL IIN Maximum V Input Current ICC Supply Current Note 5: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. 3 www.fairchildsemi.com MM74HC154 Absolute Maximum Ratings(Note 2) MM74HC154 AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol Parameter tPHL, tPLH Conditions Maximum Propagation Delay, G1 , G2 or A, B, C, D Typ Guaranteed Limit Units 21 32 ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) VCC TA = −40 to 85°C Parameter tPHL, tPLH Maximum Propagation 2.0V 63 160 190 Delay, G1 or G2 4.5V 24 36 42 or A, B, C, D 6.0V 20 30 35 Maximum Output 2.0V 25 75 95 Rise and Fall Time 4.5V 7 15 19 6.0V 6 13 16 tTLH, tTHL CPD Conditions TA = 25°C Symbol Power Dissipation Guaranteed Limits 90 Capacitance (Note 6) CIN Typ Maximum Input 5 Capacitance 4 ns ns pF 10 10 Note 6: CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD V CC f + ICC. www.fairchildsemi.com Units pF MM74HC154 Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M24B 5 www.fairchildsemi.com MM74HC154 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC24 www.fairchildsemi.com 6 MM74HC154 4-to-16 Line Decoder Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 24-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N24C Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 7 www.fairchildsemi.com