ON MT9M021IA3XTMZ-DRBR Cmos digital image sensor Datasheet

MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features
1/3-Inch CMOS Digital Image Sensor
MT9M021/MT9M031 Datasheet, Rev. G
For the latest datasheet revision, please visit www.onsemi.com
Features
•
•
•
•
•
•
•
•
•
•
Table 1:
Superior low-light performance
HD video (720p60)
Global shutter
Video/Single Frame mode
Flexible row-skip modes
On-chip AE and statistics engine
Parallel and serial output
Support for external LED or flash
Auto black level calibration
Context switching
Parameter
Typical Value
Optical format
Active pixels
Pixel size
1/3-inch (6 mm)
1280 x 960 = 1.2 Mp
3.75m
RGB Bayer or
Color filter array
Monochrome
Shutter type
Global shutter
Input clock range
6 – 50 MHz
74.25 MHz
Output pixel clock (maximum)
Serial
HiSPi (iBGA package only)
Output
Parallel
12-bit
Full resolution 45 fps
Frame rate
720p
60 fps
Responsivity (Monochrome)
6.1 V/lux-sec
Responsivity (Color)
5.3 V/lux-sec
38 dB
SNRMAX
Dynamic range
64 dB
I/O
1.8 or 2.8 V
Digital
1.8 V
Supply
voltage
Analog
2.8 V
HiSPi
0.4 V
Power consumption
<400 mW
Operating temperature (ambient) –30°C to +70°C
9 x 9 mm 64-pin iBGA
Package options
10x10mm 48-pin iLCC
Applications
• Scene processing
• Scanning and machine vision
• 720p60 video applications
General Description
The ON Semiconductor MT9M021/MT9M031 is a 1/3inch CMOS digital image sensor with an active-pixel
array of 1280H x 960V. It includes sophisticated camera
functions such as auto exposure control, windowing,
scaling, row skip mode, and both video and single
frame modes. It is designed for low light performance
and features a global shutter for accurate capture of
moving scenes. It is programmable through a simple
two-wire serial interface. The MT9M021/MT9M031
produces extraordinarily clear, sharp digital pictures,
and its ability to capture both continuous video and
single frames makes it the perfect choice for a wide
range of applications, including scanning and HD
video.
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
Key Parameters
1
©Semiconductor Components Industries, LLC,2015
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
MT9M021IA3XTC-DPBR
1.2 MP 1/3" GS CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M021IA3XTC-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M021IA3XTM-DPBR
1.2 MP 1/3" GS CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M021IA3XTM-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M021IA3XTMZ-DPBR
1.2 MP 1/3" GS CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M021IA3XTMZ-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M021IA3XTMZ-TPBR
1.2 MP 1/3" GS CIS
Tape & Reel with Protective Film, Double Side BBAR Glass
MT9M031D00STMC24BC1-200
1 MP 1/6" SOC
Die Sales, 200 m Thickness
MT9M031I12STC-DPBR
1 MP 1/6" SOC
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M031I12STC-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M031I12STM-DPBR
1.2 MP 1/3" GS CIS
Dry Pack with Protective Film, Double Side BBAR Glass
MT9M031I12STM-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M031I12STMZ-DRBR
1.2 MP 1/3" GS CIS
Dry Pack without Protective Film, Double Side BBAR Glass
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
2
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Ordering Information
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
3
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Ordering Information
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Features Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
List of Figures
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
Figure 15:
Figure 16:
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Typical Configuration: Serial Four-Lane HiSPi Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9x9mm 64-Ball iBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
48 iLCC Package, Parallel Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Differential Output Voltage for Clock or Data Pairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Eye Diagram for Clock and Data Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Skew Within the PHY and Output Channels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Quantum Efficiency – Monochrome Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Quantum Efficiency – Color Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
64-Ball iBGA Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
48-pin iLCC Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Descriptions - 64-Ball iBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Pin Descriptions - 48 iLCC Package, Parallel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
I/O Timing Characteristics1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
I/O Rise Slew Rate (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
I/O Fall Slew Rate (2.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
I/O Rise Slew Rate (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
I/O Fall Slew Rate (1.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Operating Current Consumption for Parallel Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Standby Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Input Voltage and Current (HiSPi Power Supply 0.4 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Rise and Fall Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
General Description
General Description
The ON Semiconductor MT9M021/MT9M031 can be operated in its default mode or
programmed for frame size, exposure, gain, and other parameters. The default mode
output is a full-resolution image at 45 frames per second (fps). It outputs 12-bit raw data,
using either the parallel or serial (HiSPi) output ports. The device may be operated in
video (master) mode or in frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a
synchronized pixel clock. A dedicated FLASH pin can be programmed to control
external LED or flash exposure illumination.
The MT9M021/MT9M031 includes additional features to allow application-specific
tuning: windowing, adjustable auto-exposure control, auto black level correction,
on-board temperature sensor, and row skip and digital binning modes.
The sensor is designed to operate in a wide temperature range (–30°C to +70°C).
Functional Overview
The MT9M021/MT9M031 is a progressive-scan sensor that generates a stream of pixel
data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be
optionally enabled to generate all internal clocks from a single master input clock
running between 6 and 50 MHz. The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor.
Figure 1:
Block Diagram
Active Pixel Sensor
(APS)
Array
Power
Temperature
OTPM
sensor
Timing and Control
(Sequencer)
PLL
External
Clock
Auto Exposure
and Stats Engine
Pixel Data Path
(Signal Processing)
Analog Processing and
A/D Conversion
Serial
Output
Parallel
Output
Flash
Trigger
Two-Wire
Serial
Interface
Memory
Control Registers
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 1.2 Mp Active- Pixel Sensor array. The MT9M021/MT9M031 features global
shutter technology for accurate capture of moving images. The exposure of the entire
array is controlled by programming the integration time by register setting. All rows
simultaneously integrate light prior to readout. Once a row has been read, the data from
the columns is sequenced through an analog signal chain (providing offset correction
and gain), and then through an analog-to- digital converter (ADC). The output from the
ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
processing signal chain (which provides further data path corrections and applies digital
gain). The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line
synchronization signals.
Features Overview
The MT9M021/MT9M031 Global Sensor shutter has a wide array of features to enhance
functionality and to increase versatility. A summary of features follows. Please refer to
the MT9M021/MT9M031 Developer Guide for detailed feature descriptions, register
settings, and tuning guidelines and recommendations.
• Operating Modes
The MT9M021/MT9M031 works in master (video), trigger (single frame), or Auto Trigger modes. In master mode, the sensor generates the integration and readout timing.
In trigger mode, it accepts an external trigger to start exposure, then generates the
exposure and readout timing. The exposure time is programmed through the twowire serial interface for both modes.
Note:
Trigger mode is not compatible with the HiSPi interface.
• Window Control
Configurable window size and blanking times allow a wide range of resolutions and
frame rates. Digital binning and skipping modes are supported, as are vertical and
horizontal mirror operations.
• Context Switching
Context switching may be used to rapidly switch between two sets of register values.
Refer to the MT9M021/MT9M031 Developer Guide for a complete set of context
switchable registers.
• Gain
The MT9M021/MT9M031 Global Shutter sensor can be configured for analog gain of
up to 8x, and digital gain of up to 8x.
• Automatic Exposure Control
The integrated automatic exposure control may be used to ensure optimal settings of
exposure and gain are computed and updated every other frame. Refer to the
MT9M021/MT9M031 Developer Guide for more details.
• HiSPi
The MT9M021/MT9M031 Global Shutter image sensor supports two or three lanes of
Streaming-SP or Packetized-SP protocols of ON Semiconductor's High-Speed Serial
Pixel Interface.
• PLL
An on chip PLL provides reference clock flexibility and supports spread spectrum
sources for improved EMI performance.
• Reset
The MT9M021/MT9M031 may be reset by a register write, or by a dedicated input pin.
• Output Enable
The MT9M021/MT9M031 output pins may be tri-stated using a dedicated output
enable pin.
• Temperature Sensor
• Black Level Correction
• Row Noise Correction
• Column Correction
• Test Patterns
Several test patterns may be enabled for debug purposes. These include a solid color,
color bar, fade to grey, and a walking 1s test pattern.
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Typical Configuration: Serial Four-Lane HiSPi Interface
VDD_IO
1.5kΩ2, 3
1.5kΩ2
Digital Digital
I/O
Core
power1 power1
Master clock
(6–50 MHz)
VDD
HiSPi
power1
VDD_SLVS
Figure 2:
EXTCLK
VDD_PLL
VAA
VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SDATA
SCLK
OE_BAR
STANDBY
RESET_BAR
From
controller
Analog Analog
PLL
power1 power1 power1
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
To
controller
TEST
FLASH
VDD_IO
VDD
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
VDD_SLVS
VDD_PLL
VAA
DGND
AGND
Digital
ground
Analog
ground
VAA_PIX
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but it may be greater for slower two-wire
speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The parallel interface output pads can be left unconnected if the serial output interface is used.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the MT9M021/MT9M031 demo headboard schematics for
circuit recommendations.
6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized.
7. Although 4 serial lanes are shown, the MT9M021/MT9M031 supports only 2 or 3 lane HiSPi.
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©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Figure 3:
Typical Configuration: Parallel Pixel Data Interface
1.5kΩ2, 3
1.5kΩ2
Digital Digital
core
I/O
power1 power1
Master clock
(6–50 MHz)
VDD_IO
PLL Analog Analog
power1 power1 power1
VDD
VDD_PLL VAA
DOUT [11:0]
EXTCLK
PIXCLK
LINE_VALID
FRAME_VALID
SDATA
SCLK
TRIGGER
OE_BAR
STANDBY
RESET_BAR
From
Controller
VAA_PIX
To
controller
FLASH
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
AGND
Analog
ground
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but it may be greater for slower two-wire
speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The serial interface output pads can be left unconnected if the parallel output interface is used.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the MT9M021/MT9M031 demo headboard schematics for
circuit recommendations.
6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized.
11
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Figure 4:
9x9mm 64-Ball iBGA Package
1
A
2
3
4
5
6
7
8
SLVS0N
SLVS0P
SLVS1N
SLVS1P
VDD
VDD
STANDBY
SLVS2N
SLVS2P
VDD
VAA
VAA
VDD
AGND
AGND
VAA_PIX
VAA_PIX
B
VDD_PLL
SLVSCN
SLVSCP
C
EXTCLK
VDD_
SLVS
SLVS3N
SLVS3P
DGND
D
SADDR
SCLK
SDATA
DGND
DGND
E
LINE_
VALID
FRAME_
VALID
PIXCLK
FLASH
DGND
VDD_IO
RESERVED
RESERVED
F
DOUT8
DOUT9
DOUT10
DOUT11
DGND
VDD_IO
TEST
RESERVED
G
DOUT4
DOUT5
DOUT6
DOUT7
DGND
VDD_IO
TRIGGER
OE_BAR
H
DOUT0
DOUT1
DOUT2
DOUT3
DGND
VDD_IO
VDD_IO
RESET
_BAR
VDD
Top View
(Ball Down)
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
12
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Table 3:
Pin Descriptions - 64-Ball iBGA Package
Name
iBGA Pin
Type
Description
SLVS0_N
A2
Output
HiSPi serial data, lane 0, differential N.
SLVS0_P
A3
Output
HiSPi serial data, lane 0, differential P.
SLVS1_N
A4
Output
HiSPi serial data, lane 1, differential N.
SLVS1_P
A5
Output
HiSPi serial data, lane 1, differential P.
STANDBY
A8
Input
Standby-mode enable pin (active HIGH).
VDD_PLL
B1
Power
PLL power.
SLVSC_N
B2
Output
HiSPi serial DDR clock differential N.
SLVSC_P
B3
Output
HiSPi serial DDR clock differential P.
SLVS2_N
B4
Output
HiSPi serial data, lane 2, differential N.
SLVS2_P
B5
Output
HiSPi serial data, lane 2, differential P.
VAA
B7, B8
Power
Analog power.
External input clock.
EXTCLK
C1
Input
VDD_SLVS
C2
Power
HiSPi power.
SLVS3_N
C3
Output
HiSPi serial data, lane 3, differential N.
SLVS3_P
C4
Output
HiSPi serial data, lane 3, differential P.
DGND
Power
Digital GND.
VDD
C5, D4, D5, E5, F5, G5,
H5
A6, A7, B6, C6, D6
Power
Digital power.
AGND
C7, C8
Power
Analog GND.
SADDR
D1
Input
Two-Wire Serial address select.
SCLK
D2
Input
Two-Wire Serial clock input.
SDATA
D3
I/O
Two-Wire Serial data I/O.
VAA_PIX
D7, D8
Power
Pixel power.
LINE_VALID
E1
Output
Asserted when DOUT line data is valid.
FRAME_VALID
E2
Output
Asserted when DOUT frame data is valid.
PIXCLK
E3
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
FLASH
E4
Output
Control signal to drive external light sources.
VDD_IO
E6, F6, G6, H6, H7
Power
I/O supply power.
DOUT8
F1
Output
Parallel pixel data output.
DOUT9
F2
Output
Parallel pixel data output.
DOUT10
F3
Output
Parallel pixel data output.
DOUT11
F4
Output
Parallel pixel data output (MSB)
TEST
F7
Input
Manufacturing test enable pin (connect to DGND).
DOUT4
G1
Output
Parallel pixel data output.
DOUT5
G2
Output
Parallel pixel data output.
DOUT6
G3
Output
Parallel pixel data output.
DOUT7
G4
Output
Parallel pixel data output.
TRIGGER
G7
Input
Exposure synchronization input.
OE_BAR
G8
Input
Output enable (active LOW).
DOUT0
H1
Output
Parallel pixel data output (LSB)
DOUT1
H2
Output
Parallel pixel data output.
DOUT2
H3
Output
Parallel pixel data output.
DOUT3
H4
Output
Parallel pixel data output.
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
13
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Table 3:
Pin Descriptions (continued)- 64-Ball iBGA Package
Name
iBGA Pin
RESET_BAR
H8
Reserved
E7, E8, F8
7
Description
Input
Asynchronous reset (active LOW). All settings are restored to factory
default.
n/a
Reserved (do not connect).
6
5
4
3
2
1
48
47
46
45
44
43
E X T C LK
V DD_P LL
DOUT6
DOUT5
DOUT4
DOUT3
DOUT2
DOUT1
DOUT0
DGND
NC
48 iLCC Package, Parallel Output
D GND
Figure 5:
Type
DOUT7
NC
42
8
DOUT8
NC
41
9
DOUT9
V AA
40
10
DOUT10
AGND
39
11
DOUT11
VAA_PIX
38
12
V DD_IO
VAA_PIX
37
13
PIXCLK
VAA
36
14
V DD
AGND
15
S CLK
VAA
34
16
S DATA
Reserved
33
17
RESET _BAR
Reserved
32
Reserved
31
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
FLASH
T R IG G E R
FRAME_VALID
LINE_VALID
22
23
24
25
26
27
28
29
14
D GND
TEST
21
S ADDR
20
OE_BAR
NC
19
STANDBY
NC
V DD_IO
V DD
18
35
30
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Features Overview
Table 4:
Pin Descriptions - 48 iLCC Package, Parallel
Pin Number
Name
Type
Description
1
DOUT4
Output
Parallel pixel data output.
2
DOUT5
Output
Parallel pixel data output.
3
DOUT6
Output
Parallel pixel data output.
4
VDD_PLL
Power
PLL power.
5
EXTCLK
Input
External input clock.
6
DGND
Power
Digital ground.
7
DOUT7
Output
Parallel pixel data output.
8
DOUT8
Output
Parallel pixel data output.
Output
Parallel pixel data output.
9
DOUT9
10
DOUT10
Output
Parallel pixel data output.
11
DOUT11
Output
Parallel pixel data output (MSB).
12
VDD_IO
Power
I/O supply power.
13
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
14
VDD
Power
Digital power.
15
SCLK
Input
Two-Wire Serial clock input.
16
SDATA
I/O
17
RESET_BAR
Input
Asynchronous reset (active LOW). All settings are restored to factory
default.
18
VDD_IO
Power
I/O supply power.
19
VDD
Power
20
NC
Two-Wire Serial data I/O.
Digital power.
No connection.
21
NC
22
STANDBY
Input
No connection.
Standby-mode enable pin (active HIGH).
23
OE_BAR
Input
Output enable (active LOW).
24
SADDR
Input
Two-Wire Serial address select.
Manufacturing test enable pin (connect to DGND).
25
TEST
Input
26
FLASH
Output
Flash output control.
27
TRIGGER
Input
28
FRAME_VALID
Output
Asserted when DOUT frame data is valid.
Exposure synchronization input.
29
LINE_VALID
Output
Asserted when DOUT line data is valid.
30
DGND
Power
Digital ground
31
Reserved
n/a
Reserved (do not connect).
32
Reserved
n/a
Reserved (do not connect).
33
Reserved
n/a
34
VAA
Power
35
AGND
Power
Analog ground.
36
VAA
Power
Analog power.
37
VAA_PIX
Power
Pixel power.
38
VAA_PIX
Power
Pixel power.
Reserved (do not connect).
Analog power.
39
AGND
Power
Analog ground.
40
VAA
Power
Analog power.
41
NC
No connection.
42
NC
No connection.
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
15
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 4:
Pin Descriptions (continued)- 48 iLCC Package, Parallel
Pin Number
Name
Type
Description
43
NC
44
DGND
Power
No connection.
Digital ground.
45
DOUT0
Output
Parallel pixel data output (LSB)
46
DOUT1
Output
Parallel pixel data output.
47
DOUT2
Output
Parallel pixel data output.
48
DOUT3
Output
Parallel pixel data output.
Electrical Specifications
Unless otherwise stated, the following specifications apply to the following conditions:
VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;
VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +70°C; output load = 10pF;
PIXCLK frequency = 74.25 MHz; HiSPi off.
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 6 and Table 5.
Figure 6:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
Note:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
tHD;DAT
tHIGH
tSU;STA
Sr
tSU;STO
P
S
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register
address are issued.
16
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 5:
Two-Wire Serial Bus Characteristics
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V;
VDD_PLL = 2.8V; TA = 25°C
Standard-Mode
Parameter
Symbol
Fast-Mode
Min
Max
Min
Max
Unit
SCL
0
100
0
400
KHz
HD;STA
4.0
-
0.6
-
S
4.7
-
1.3
-
S
f
SCLK Clock Frequency
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
t
LOW period of the SCLK clock
t
HIGH period of the SCLK clock
t
LOW
HIGH
4.0
-
0.6
-
S
Set-up time for a repeated START
condition
tSU;STA
4.7
-
0.6
-
S
Data hold time:
tHD;DAT
04
3.455
06
0.95
S
Data set-up time
tSU;DAT
250
-
1006
-
nS
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
nS
Fall time of both SDATA and SCLK signals
tf
-
300
20 + 0.1Cb7
300
nS
tSU;STO
4.0
-
0.6
-
S
tBUF
4.7
-
1.3
-
S
Cb
-
400
-
400
pF
Set-up time for STOP condition
Bus free time between a STOP and START
condition
Capacitive load for each bus line
Serial interface input pin capacitance
SDATA max load capacitance
SDATA pull-up resistor
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
CIN_SI
-
3.3
-
3.3
pF
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
1.
2. Two-wire control is I2C-compatible.
3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.
4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
t
SU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according
to the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
17
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
I/O Timing
By default, the MT9M021/MT9M031 launches pixel data, FV and LV with the falling edge
of PIXCLK. The expectation is that the user captures DOUT[11:0], FV and LV using the
rising edge of PIXCLK. The launch edge of PIXCLK can be configured in register R0x3028.
See Figure 7 below and Table 6 on page 18 for I/O timing (AC) characteristics.
Figure 7:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
PIXCLK
t PD
Data[11:0]
Pxl _0
LINE_VALID/
FRAME_VALID
Table 6:
Pxl _1
Pxl _2
Pxl _n
t PLH
t PFL
t PFH
t PLL
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
I/O Timing Characteristics1
Parallel Output
VDD_IO=2.8V
Symbol
Definition
fEXTCLK
Input clock frequency
Condition
Min
6
tEXTCLK
Input clock period
20
Typ
VDD_IO=1.8V
Max
Min
50
6
166
20
Typ
Max
Unit
50
MHz
166
ns
PLL enabled
3
4
3
4
ns
Input clock fall time
PLL enabled
3
4
3
4
ns
tRP
PIXCLK rise time
Slew setting = 4
(default)
2.3
4.6
2.3
4.6
ns
tFP
PIXCLK fall time
Slew setting = 4
(default)
3
4.4
3
4.4
ns
60
40
60
%
74.25
6
74.25
MHz
4
-3
4.5
ns
tR
Input clock rise time
tF
40
PIXCLK duty cycle
fPIXCLK
PIXCLK frequency2
Nominal
voltages, PLL
Enabled
6
Nominal
voltages, PLL
Enabled
-3
PIXCLK to data valid
tPD
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
18
50
2.3
50
2.3
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 6:
I/O Timing Characteristics1 (continued)
Parallel Output
VDD_IO=2.8V
Symbol
Definition
Condition
tPFH
VDD_IO=1.8V
Min
Typ
Max
Min
Typ
Max
Unit
Nominal
voltages, PLL
Enabled
-3
1.5
4
-3
1.5
4.5
ns
PIXCLK to FV HIGH
Nominal
voltages, PLL
Enabled
-3
2.3
4
-3
2.3
4.5
ns
PIXCLK to LV HIGH
Nominal
voltages, PLL
Enabled
-3
1.5
4
-3
1.5
4.5
ns
PIXCLK to FV LOW
Nominal
voltages, PLL
Enabled
-3
2
4
-3
2
4.5
ns
PIXCLK to LV LOW
tPLH
tPFL
tPLL
Notes:
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C
ambient at 90% of VDD_IO, and -30°C at 110% of VDD_IO. All values are taken at the 50% transition
point. The loading used is 20pF.
2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.
I/O Rise Slew Rate (2.8V VDD_IO)1
Table 7:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.08
0.77
0.58
0.44
0.32
0.23
0.16
0.10
1.77
1.26
0.95
0.70
0.51
0.37
0.25
0.15
2.72
1.94
1.46
1.08
0.78
0.56
0.38
0.22
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C
ambient at 90% of VDD_IO, and -30°C at 110% of VDD_IO. All values are taken at the 50% transition
point. The loading used is 20pF.
19
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
I/O Fall Slew Rate (2.8V VDD_IO)1
Table 8:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.00
0.76
0.60
0.46
0.35
0.25
0.17
0.11
1.62
1.24
0.98
0.75
0.56
0.40
0.27
0.16
2.41
1.88
1.50
1.16
0.86
0.61
0.41
0.24
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C
ambient at 90% of VDD_IO, and -30°C at 110% of VDD_IO. All values are taken at the 50% transition
point. The loading used is 20pF.
I/O Rise Slew Rate (1.8V VDD_IO)1
Table 9:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
Note:
Min
Typ
Max
Units
0.41
0.30
0.24
0.19
0.14
0.10
0.07
0.04
0.65
0.47
0.37
0.28
0.21
0.15
0.10
0.06
1.10
0.79
0.61
0.46
0.34
0.24
0.16
0.10
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C
ambient at 90% of VDD_IO, and -30°C at 110% of VDD_IO. All values are taken at the 50% transition
point. The loading used is 20pF.
I/O Fall Slew Rate (1.8V VDD_IO)1
Table 10:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
0.42
0.32
0.26
0.20
0.16
0.12
0.08
0.05
0.68
0.51
0.41
0.32
0.24
0.18
0.12
0.07
1.11
0.84
0.67
0.52
0.39
0.28
0.19
0.11
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
1. Minimum and maximum values are taken at the temperature and voltage limits; for instance, 70°C
ambient at 90% of VDD_IO, and -30°C at 110% of VDD_IO. All values are taken at the 50% transition
point. The loading used is 20pF.
20
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
DC Electrical Characteristics
The DC electrical characteristics are shown in Table 11, Table 12, Table 13, and Table 14.
Table 11:
DC Electrical Characteristics
Symbol
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.95
V
VDD_IO
I/O digital voltage
1.7/2.5
1.8/2.8
1.9/3.1
V
VAA
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
Pixel supply voltage
2.5
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.5
2.8
3.1
V
VDD_SLVS
HiSPi supply voltage
0.3
0.4
0.6
V
VIH
Input HIGH voltage
VDD_IO * 0.7
–
–
V
–
–
V
20
–
VDD_IO *
0.3
–
A
VDD_IO – 0.3
–
–
V
VIL
Input LOW voltage
IIN
Input leakage current
VOH
Output HIGH voltage
VOL
Output LOW voltage
VDD_IO = 2.8V
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
–22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
Caution
Table 12:
No pull-up resistor; VIN = VDD_IO or
DGND
Stresses greater than those listed in Table 12 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Parameter
Minimum
Maximum
Unit
Symbol
VSUPPLY
Power supply voltage (all supplies)
–0.3
4.5
V
VSUPPLY
ISUPPLY
IGND
Total power supply current
–
200
mA
ISUPPLY
Total ground current
–
200
mA
IGND
VIN
VOUT
DC input voltage
–0.3
VDD_IO + 0.3
V
VIN
DC output voltage
–0.3
VDD_IO + 0.3
V
TSTG1
VOUT
Storage temperature
–40
+85
°C
TSTG1
Note:
Table 13:
1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Operating Current Consumption for Parallel Output
VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8V; VDD= 1.8V; PLL Enabled and PIXCLK = 74.25 MHz; TA = 25°C; CLOAD = 10pF
Condition
Digital operating current
Symbol
Parallel, Streaming, Full resolution 45 fps
Typ
Max
Unit
IDD1
Min
45
55
mA
I/O digital operating current
Parallel, Streaming, Full resolution 45 fps
IDD_IO
501
–
mA
Analog operating current
Parallel, Streaming, Full resolution 45 fps
IAA
45
50
mA
Pixel supply current
Parallel, Streaming, Full resolution 45 fps
IAA_PIX
6
10
mA
PLL supply current
Parallel, Streaming, Full resolution 45 fps
IDD_PLL
6
8
mA
Note:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
1. IDD_IO operating current is specified with image at 1/2 saturation level.
21
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 14:
Standby Current Consumption
Analog - VAA + VAA_PIX + VDD_PLL; Digital - VDD + VDD_IO; TA = 25°C
Definition
Hard standby (clock off, driven low)
Hard standby (clock on, EXTCLK = 20 MHz)
Soft standby (clock off, driven low)
Soft standby (clock on, EXTCLK = 20 MHz)
Condition
Min
Typ
Max
Unit
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
–
–
–
–
–
–
–
–
3
8
12
0.87
3
8
12
0.87
10
75
20
1.3
10
75
20
1.3
A
A
A
mA
A
A
A
mA
HiSPi Electrical Specifications
The ON Semiconductor MT9M021/MT9M031 sensor supports SLVS mode only, and
does not have a DLL for timing adjustments. Refer to the High-Speed Serial Pixel (HiSPi)
Interface Physical Layer Specification v2.00.00 for electrical definitions, specifications,
and timing information. The VDD_SLVS supply in this datasheet corresponds to VDD_TX
in the HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as
referenced in the specification. The HiSPi transmitter electrical specifications are listed
at 700 MHz.
Table 15:
Input Voltage and Current (HiSPi Power Supply 0.4 V)
Measurement Conditions: Max Freq 700 MHz
Parameter
Symbol
Min
Typ
Max
Unit
IDD_SLVS
–
10
15
mA
HiSPi common mode voltage
(driving 100 load)
VCMD
VDD_SLVS x 0.45
VDD_SLVS/2
VDD_SLVS x 0.55
V
HiSPi differential output voltage
(driving 100 load)
|VOD|
VDD_SLVS x 0.36
VDD_SLVS/2
VDD_SLVS x 0.64
V
Change in VCM between logic 1 and 0
VCM
25
mV
Change in |VOD| between logic 1 and
0
|VOD|
25
mV
Supply current (PWRHiSPi)
(driving 100 load)
Vod noise margin
30
%
Difference in VCM between any two
channels
|VCM|
50
mV
Difference in VOD between any two
channels
|VOD|
100
mV
Common-mode AC voltage (pk)
without VCM cap termination
VCM_ac
50
mV
Common-mode AC voltage (pk) with
VCM cap termination
VCM_ac
30
mV
Max overshoot peak |VOD|
VOD_ac
1.3 x |VOD|
V
Max overshoot Vdiff pk-pk
Vdiff_pkpk
2.6 x |VOD|
V
70

20
%
Eye Height
Single-ended output impedance
Output impedance mismatch
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
NM
–
Veye
1.4 x VOD
Ro
35
Ro
22
50
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Figure 8:
Differential Output Voltage for Clock or Data Pairs
VDIFFmax
VDIFFmin
0V Diff)
Output Signal is 'Cp - Cn' or 'Dp - Dn'
Table 16:
Rise and Fall Times
Measurement Conditions: HiSPi Power Supply 0.4V, Max Freq 700 MHz
Parameter
Symbol
Min
Typ
Max
Unit
Data Rate
1/UI
280
–
700
Mb/s
Max setup time from transmitter
TxPRE
0.3
–
–
UI1
Max hold time from transmitter
TxPost
0.3
–
–
UI
Rise time (20% - 80%)
RISE
–
0.25UI
–
Fall time (20% - 80%)
FALL
150ps
0.25 UI
–
50
Clock duty
PLL_DUTY
45
Bitrate Period
tpw
1.43
Eye Width
teye
0.3
55
%
3.57
ns1
UI1, 2
ttotaljit
0.2
UI1, 2
Clock Period Jitter(RMS)
tckjit
50
ps2
Clock cycle to cycle jitter (RMS)
tcyjit
100
ps2
0.1
UI1, 2
2.1
UI1, 5
100
ps6
Data Total jitter (pk pk)@1e-9
Clock to Data Skew
tchskew
PHY-to-PHY Skew
t|PHYskew|
Mean diferential skew
tDIFFSKEW
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
-0.1
–100
1. One UI is defined as the normalized mean time between one edge and the following edge of the
clock.
2. Taken from 0V crossing point w/ DLL off.
3. Also defined with a maximum loading capacitance of 10pF on any pin. The loading capacitance
may also need to be less for higher bitrates so the rise and fall times do not exceed the maximum
0.3UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any
edges.
5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY
between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the
absolute time between the two complementary edges at mean VCM point.
23
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Figure 9:
Eye Diagram for Clock and Data Signals
RISE
80%
D A T A M A SK
V d i ff
20%
T x Pr e
T x Po s t
FALL
UI/ 2
UI/ 2
V d i ff
M a x V d i ff
C L O C K M A SK
T r i g ge r/ R efe re nce
C L K JIT T ER
Figure 10:
Skew Within the PHY and Output Channels
V C MD
t C M PSK EW
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
t C HSKEW1 PHY
24
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Power-On Reset and Standby Timing
Power-Up Sequence
The recommended power-up sequence for the MT9M021/MT9M031 is shown in
Figure 11. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA,
VAA_PIX) must have the separation specified below.
1. Turn on VDD_PLL power supply.
2. After 0–10s, turn on VAA and VAA_PIX power supply.
3. After 0–10s, turn on VDD_IO power supply.
4. After the last power supply is stable, enable EXTCLK.
5. Assert RESET_BAR for at least 1ms.
6. Wait 150000 EXTCLKs (for internal initialization into software standby.
7. Configure PLL, output, and image settings to desired values.
8. Wait 1ms for the PLL to lock.
9. Set streaming mode (R0x301a[2] = 1).
Figure 11:
Power Up
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD_IO (1.8/2.8)
t0
t1
t2
VDD (1.8)
t3
VDD_SLVS (0.4)
EXTCLK
t4
RESET_B
tx
t5
Internal
Initialization
Hard Reset
Table 17:
t6
Software
Standby
PLL Lock
Streaming
Power-Up Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_PLL to VAA/VAA_PIX
t0
0
10
–
s
VAA/VAA_PIX to VDD_IO
t1
0
10
–
s
VDD_IO to VDD
t2
0
10
–
s
VDD to VDD_SLVS
t3
0
10
–
s
Xtal settle time
tx
–
301
–
ms
Hard Reset
t4
12
–
–
ms
Internal Initialization
t5
150000
–
–
EXTCLKs
PLL Lock Time
t6
1
–
–
ms
Notes:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
1. Xtal settling time is component-dependent, usually taking about 10 – 100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where hard
reset is held down by RC circuit, then the RC time must include the all power rail settle time and
Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered
before or at least at the same time as the others. If the case happens that VDD_PLL is powered after
25
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
other supplies then the sensor may have functionality issues and will experience high current draw
on this supply.
Power-Down Sequence
The recommended power-down sequence for the MT9M021/MT9M031 is shown in
Figure 12. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA,
VAA_PIX) must have the separation specified below.
1. Disable streaming if output is active by setting standby R0x301a[2] = 0
2. The soft standby state is reached after the current row or frame, depending on configuration, has ended.
3. Turn off VDD_SLVS.
4. Turn off VDD.
5. Turn off VDD_IO
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
Figure 12:
Power Down
VDD_SLVS (0.4)
t0
VDD (1.8)
t1
V DD_IO (1.8/2.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Table 18:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_SLVS to VDD
VDD to VDD_IO
VDD_IO to VAA/VAA_PIX
VAA/VAA_PIX to VDD_PLL
t0
t1
t2
t3
0
0
0
0
–
–
–
–
–
–
–
–
S
S
S
S
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
26
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Table 18:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
PwrDn until Next PwrUp Time
t4
100
–
–
mS
Note:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
t4 is required between power down and next power up time; all decoupling caps from regulators
must be completely discharged.
27
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Figure 13:
Quantum Efficiency – Monochrome Sensor
80
70
Quantum Efficiency (%)
60
50
40
30
20
10
0
350
450
550
650
750
850
950
1050
1150
Wavelength (nm)
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
28
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Figure 14:
Quantum Efficiency – Color Sensor
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
29
©Semiconductor Components Industries, LLC,2015.
64-Ball iBGA Package Outline Drawing
Figure 15:
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
Package Dimensions
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Package Dimensions
30
All dimensions in millimeters.
©Semiconductor Components Industries, LLC,2015
Note:
48-pin iLCC Package Drawing
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
Figure 16:
©Semiconductor Components Industries, LLC,2015
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Package Dimensions
31
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Revision History
Revision History
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/15/15
• Updated “Ordering Information” on page 2
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/4/12
• Converted to ON Semiconductor template
• Removed Confidential marking
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9/4/12
• Updated to Production
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 2, “Available Part Numbers,” on page 2
• Updated “General Description” on page 8
• Updated Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface,” on
page 10
• Updated Figure 3: “Typical Configuration: Parallel Pixel Data Interface,” on page 11
• Updated Table 5, “Two-Wire Serial Bus Characteristics,” on page 17
• Updated Figure 7: “I/O Timing Diagram,” on page 18
• Updated Table 6, “I/O Timing Characteristics1,” on page 18
• Added Table 7, I/O Rise Slew Rate (2.8V Vdd_IO)1 and
Table 8, “I/O Fall Slew Rate (2.8V Vdd_IO)1,” on page 20
• Added Table 9, I/O Rise Slew Rate (1.8V Vdd_IO)1 and
Table 10, “I/O Fall Slew Rate (1.8V Vdd_IO)1,” on page 20
• Updated Table 13, “Operating Current Consumption for Parallel Output,” on page 21
• Updated Table 14, “Standby Current Consumption,” on page 22
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/17/12
• Added MT9M031
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 2, “Available Part Numbers,” on page 2
• Updated “LV Format Options” on page 14
• Updated “HiSPi Physical Layer” on page 15
• Added Figure 5: “48 iLCC Package, Parallel Output,” on page 14
• Added Table 4, “Pin Descriptions - 48 iLCC Package, Parallel,” on page 15
• Updated Figure 7: “I/O Timing Diagram,” on page 18
• Updated Table 6, “I/O Timing Characteristics1,” on page 18
• Updated “HiSPi Electrical Specifications” on page 22
• Added Table 15, “Input Voltage and Current (HiSPi Power Supply 0.4 V),” on page 22
• Added Figure 8: “Differential Output Voltage for Clock or Data Pairs,” on page 23
• Added Table 16, “Rise and Fall Times,” on page 23
• Added Figure 9: “Eye Diagram for Clock and Data Signals,” on page 24
• Added Figure 10: “Skew Within the PHY and Output Channels,” on page 24
• Added Figure 16: “48-pin iLCC Package Drawing,” on page 31
• Deleted the following major sections and their sub-sections. Refer to the Developer
Guide:
– Pixel Data Format
– Output Data Format
– Two-Wire Serial Register Interface
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
32
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Revision History
– Real-Time Context Switching
• Replaced “Feature Description” with “Functional Overview” on page 8 and “Features
Overview” on page 9
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6/14/11
• Updated to Preliminary
• Updated operating temperature in Table 1, “Key Parameters,” on page 1 and in
“General Description” on page 8
• Updated Figure 6: “Two-Wire Serial Bus Timing Parameters,” on page 16
• Updated Table 5, “Two-Wire Serial Bus Characteristics,” on page 17
• Updated Figure 7: “I/O Timing Diagram,” on page 18
• Added Table 6, “I/O Timing Characteristics1,” on page 18
• Updated Table 6, “DC Electrical Characteristics,” on page 14
• Replaced Table 10, Power Consumption with Table 13, “Operating Current Consumption for Parallel Output,” on page 21
• Added Table 14, “Standby Current Consumption,” on page 22
• Updated Table 14, Power Supply and Operating Temperatures
• Deleted Table 14, “Input Voltage and Current,” on page 39
• Added Table 15, “SLVS Electrical DC Specification,” on page 40
• Updated Table 16, “SLVS Electrical Timing Specification,” on page 40
• Updated Table 17, “Power-Up Sequence,” on page 25
• Updated Figure 13: “Quantum Efficiency – Monochrome Sensor,” on page 28
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/16/09
• Updated the following parameters in Table 1, “Key Parameters,” on page 1
– input clock range
– responsivity
– dynamic range
• Updated Table 2, “Available Part Numbers,” on page 2
• Replaced “scaling” with “digital binning” in third paragraph of “General Description”
on page 8
• Updated master clock range in Figure 2 on page 10 and Figure 3 on page 11
• Updated number of rows in first sentence of first paragraph in “Pixel Array Structure”
on page 10
• Updated array pixel coordinates in Figure 6 on page 12
• Added “Default Readout Order” on page 12
• Updated “Output Data Format” on page 13
• Added “Readout Sequence” on page 13
• Replaced “Parallel Data Timing” section with “Parallel Output Data Timing” on
page 14
• Moved Figure 13, Line Timing and FRAME_VALID/LINE_VALID Signals and Table 5,
Frame Time: Long Integration Time to new section “Frame Time” on page 17; added
Table 4, “Frame Time (Example Based on 1280 x 960, 45 Frames Per Second),” on
page 17
• Updated first paragraph of “Real-Time Context Switching” on page 19
• Updated Table 6, “Real-Time Context-Switchable Registers,” on page 19
• Updated “Features” section as follows:
– Updated “Trigger Mode” on page 20
– Moved “Hard Reset of Logic” and Soft Reset of Logic” to “Reset” on page 21
MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
33
©Semiconductor Components Industries, LLC,2015.
MT9M021/MT9M031: 1/3-Inch CMOS Digital Image Sensor
Revision History
•
•
•
•
– Added “Readout Modes” on page 25; “Mirror” on page 27, “Maintaining a Constant
Frame Rate” on page 28, “Synchronizing Register Writes to Frame Boundaries” on
page 28; “Restart” on page 29, “Automatic Exposure Control” on page 29,and “Test
Patterns” on page 32
– Deleted “Pixel Integration Control,” “Pixel Clock Speed,” “Statistics and Settings
Readout,” “Read Mode Options,” and “Line_Valid”
Updated “Electrical Specifications” on page 16
Moved “Power-On Reset and Standby Timing” on page 25 from appendix to main
body of document
Replaced Figure 13: “Quantum Efficiency – Monochrome Sensor,” on page 28 with
placeholder
Updated Figure 15: “64-Ball iBGA Package Outline Drawing,” on page 30
Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/18/09
• Initial release
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MT9M021-MT9M031_DS Rev. G Pub. 4/15 EN
34
©Semiconductor Components Industries, LLC,2015 .