IDT IDT71V424L12YGI 3.3v cmos static ram 4 meg (512k x 8-bit) Datasheet

IDT71V424S
IDT71V424L
3.3V CMOS Static RAM
4 Meg (512K x 8-Bit)
Features
Description
◆
The IDT71V424 is a 4,194,304-bit high-speed Static RAM organized
as 512K x 8. It is fabricated using IDT’s high-perfomance, high-reliability
CMOS technology. This state-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for highspeed memory needs.
The IDT71V424 has an output enable pin which operates as fast as
5ns, with address access times as fast as 10ns. All bidirectional inputs and
outputs of the IDT71V424 are TTL-compatible and operation is from a
single 3.3V supply. Fully static asynchronous circuitry is used, requiring
no clocks or refresh for operation.
The IDT71V424 is packaged in a 36-pin, 400 mil Plastic SOJ and 44pin, 400 mil TSOP.
◆
◆
◆
◆
◆
◆
◆
512K x 8 advanced high-speed CMOS Static RAM
JEDEC Center Power / GND pinout for reduced noise
Equal access and cycle times
— Commercial and Industrial: 10/12/15ns
Single 3.3V power supply
One Chip Select plus one Output Enable pin
Bidirectional data inputs and outputs directly
TTL-compatible
Low power consumption via chip deselect
Available in 36-pin, 400 mil plastic SOJ package and
44-pin, 400 mil TSOP.
Functional Block Diagram
A0
A18
•
•
•
•
•
•
ADDRESS
DECODER
8
I/O0 - I/O7
4,194,304-BIT
MEMORY ARRAY
I/O CONTROL
8
8
WE
OE
CS
CONTROL
LOGIC
3622 drw 01
JULY 2004
1
©2004 Integrated Device Technology, Inc.
DSC-3622/06
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Pin Configuration
A0
A1
A2
A3
A4
CS
I/O 0
I/O 1
VDD
VSS
I/O 2
I/O 3
WE
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
SO36-1
Pin Configuration
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
SOJ
Top View
NC
A18
A17
A16
A15
OE
I/O 7
I/O 6
VSS
VDD
I/O 5
I/O 4
A14
A13
A12
A11
A10
NC
3622 drw 02
NC
1
44
NC
NC
2
43
NC
A0
3
A1
4
42
41
A2
A3
5
40
NC
A18
A17
6
39
A16
A4
7
38
A15
CS
8
37
OE
I/00
9
36
I/07
I/01
10
35
I/06
V DD
11
34
V SS
V SS
12
33
I/02
13
32
V DD
I/05
I/03
14
31
WE
A5
A6
15
30
I/04
A14
16
29
A13
17
28
A12
A7
18
27
A11
A8
19
26
A9
20
25
A10
NC
NC
21
24
NC
22
23
SO44-2
TSOP
Top View
Pin Description
(TA = +25°C, f = 1.0MHz, SOJ package)
Address Inputs
Input
CS
Chip Select
Input
Symbol
WE
Write Enable
Input
CIN
Input Capacitance
OE
Output Enable
Input
CI/O
I/O Capacitance
Data Input/Output
VDD
3.3V Power
VSS
Ground
3622 drw 11
Capacitance
A0 – A18
I/O0 - I/O7
NC
NC
Parameter(1)
Conditions
Max.
Unit
VIN = 3dV
7
pF
VOUT = 3dV
8
pF
3622 tbl 03
I/O
NOTE:
1. This parameter is guaranteed by device characterization, but not production
tested.
Power
Gnd
3622 tbl 02
Truth Table(1,2)
CS
OE
WE
I/O
L
L
H
DATAOUT
Read Data
L
X
L
DATAIN
Write Data
L
H
H
High-Z
Output Disabled
X
X
High-Z
Deselected - Standby (I SB)
X
X
High-Z
Deselected - Standby (I SB1 )
H
VHC
(3)
NOTES:
1. H = VIH, L = VIL, x = Don't care.
2. VLC = 0.2V, VHC = VDD -0.2V.
3. Other inputs ≥VHC or ≤VLC.
6.42
2
Function
3622 tbl 01
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Recommended Operating
Temperature and Supply Voltage
Absolute Maximum Ratings(1)
Symbol
VDD
Rating
Value
Unit
Supply Voltage Relative to
VSS
-0.5 to +4.6
V
VIN, VOUT
Terminal Voltage Relative
to VSS
-0.5 to VDD+0.5
TBIAS
Temperature Under Bias
-55 to +125
o
TSTG
Storage Temperature
-55 to +125
o
PT
Power Dissipation
1
W
IOUT
DC Output Current
50
mA
Grade
Temperature
VSS
VDD
Commercial
0°C to +70°C
0V
See Below
Industrial
–40°C to +85°C
0V
See Below
V
3622 tbl 05
C
Recommended DC Operating
Conditions
C
Symbol
3622 tbl 04
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
Parameter
VDD
Supply Voltage
VSS
Ground
VIH
VIL
Input High Voltage
Input Low Voltage
Min.
Typ.
Max.
Unit
3.0
3.3
3.6
V
0
0
0
2.0
____
-0.3
(2)
V
VDD+0.3
____
(1)
V
0.8
V
3622 tbl 06
NOTES:
1. VIH (max.) = VDD+2V for pulse width less than 5ns, once per cycle.
2. VIL (min.) = –2V for pulse width less than 5ns, once per cycle.
DC Electrical Characteristics
(VDD = Min. to Max., Commercial and Industrial Temperature Ranges)
IDT71V424
Symbol
Parameter
Test Condition
Min.
Max. Unit
Input Leakage Current
VDD = Max., VIN = VSS to VDD
___
5
µA
|ILO|
Output Leakage Current
VDD = Max., CS = VIH, VOUT = VSS to VDD
___
5
µA
VOL
Output Low Voltage
IOL = 8mA, VDD = Min.
___
0.4
V
VOH
Output High Voltage
IOH = -4mA, VDD = Min.
2.4
___
|ILI|
V
3622 tbl 07
DC Electrical Characteristics(1, 2, 3)
(VDD = Min. to Max., VLC = 0.2V, VHC = VDD – 0.2V)
71V424S/L 10
71V424S/L 12
71V424S/L 15
Unit
Com'l.
Ind.(5)
Com'l.
Ind.(5)
Com'l.
Ind. (5)
S
180
180
170
170
160
160
mA
L
165
___
155
155
145
145
mA
Dynamic Standby Power Supply Current
CS > VHC, Outputs Open, V DD = Max., f = fMAX(4)
S
60
60
55
55
50
50
mA
L
55
___
50
50
45
45
mA
Full Standby Power Supply Current (static)
CS > VHC, Outputs Open, V DD = Max., f = 0(4)
S
20
20
20
20
20
20
mA
L
10
___
10
10
10
10
Symbol
Parameter
ICC
Dynamic Operating Current
CS < VLC, Outputs Open, V DD = Max., f = fMAX(4)
ISB
ISB1
NOTES:
1. All values are maximum guaranteed values.
2. All inputs switch between 0.2V (Low) and VDD - 0.2V (High).
3. Power specifications are preliminary.
4. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.
5. Standard power 10ns (S10) speed grade only.
6.42
3
mA
3622 tbl 08
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
AC Test Conditions
GND to 3.0V
Input Pulse Levels
Input Rise/Fall Times
1.5ns
Input Timing Reference Levels
1.5V
Output Reference Levels
1.5V
AC Test Load
See Figure 1, 2 and 3
3622 tbl 09
AC Test Loads
+1.5V
3.3V
50Ω
I/O
320Ω
Z0 = 50Ω
DATA OUT
30pF
5pF*
350Ω
3622 drw 03
3622 drw 04
*Including jig and scope capacitance.
Figure 1. AC Test Load
Figure 2. AC Test Load
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)
7
•
6
∆tAA, tACS
(Typical, ns) 5
4
•
3
•
2
•
1
•
•
8 20
•
40
60 80 100 120 140 160 180 200
CAPACITANCE (pF)
Figure 3. Output Capacitive Derating
6.42
4
3622 drw 05
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VCC = 3.3V ± 10%, Commercial and Industrial Temperature Ranges)
71V424S/L10(2)
71V424S/L12
71V424S/L15
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Read Cycle Time
10
____
12
____
15
____
ns
Address Access Time
____
10
____
12
____
15
ns
tACS
Chip Select Access Time
____
10
____
12
____
15
ns
tCLZ (1)
Chip Select to Output in Low-Z
4
____
4
____
4
____
ns
tCHZ(1)
Chip Deselect to Output in High-Z
____
5
____
6
____
7
ns
tOE
Output Enable to Output Valid
____
5
____
6
____
7
ns
tOLZ (1)
Output Enable to Output in Low-Z
0
____
0
____
0
____
ns
tOHZ (1)
Output Disable to Output in High-Z
____
5
____
6
____
7
ns
4
____
4
____
ns
Symbol
Parameter
READ CYCLE
tRC
tAA
tOH
Output Hold from Address Change
4
____
tPU(1)
Chip Select to Power Up Time
0
____
0
____
0
____
ns
tPD(1)
Chip Deselect to Power Down Time
____
10
____
12
____
15
ns
Write Cycle Time
10
____
12
____
15
____
ns
8
____
8
____
10
____
ns
8
____
8
____
10
____
ns
0
____
0
____
0
____
ns
8
____
8
____
10
____
ns
0
____
0
____
0
____
ns
6
____
6
____
7
____
ns
0
____
0
____
0
____
ns
3
____
3
____
ns
____
7
____
7
WRITE CYCLE
tWC
Address Valid to End of Write
tAW
Chip Select to End of Write
tCW
Address Set-up Time
tAS
Write Pulse Width
tWP
Write Recovery Time
tWR
Data Valid to End of Write
tDW
Data Hold Time
tDH
(1)
tOW
Output Active from End of Write
3
____
tWHZ(1)
Write Enable to Output in High-Z
____
6
ns
3622 tbl 10
NOTES:
1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested.
2. 0ºC to +70ºC temperature range only for low power 10ns (L10) speed grade.
6.42
5
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Timing Waveform of Read Cycle No. 1(1)
tRC
ADDRESS
tAA
OE
tOE
tOLZ
CS
tCLZ
DATAOUT
VCC SUPPLY ICC
CURRENT ISB
(5)
(5)
tACS
(3)
tCHZ
HIGH IMPEDANCE
(5)
tOHZ (5)
DATAOUT VALID
tPD
tPU
3622 drw 06
Timing Waveform of Read Cycle No. 2(1, 2, 4)
tRC
ADDRESS
tAA
tOH
DATAOUT
tOH
PREVIOUS DATAOUT VALID
DATAOUT VALID
3622 drw 07
NOTES:
1. WE is HIGH for Read Cycle.
2. Device is continuously selected, CS is LOW.
3. Address must be valid prior to or coincident with the later of CS transition LOW; otherwise tAA is the limiting parameter.
4. OE is LOW.
5. Transition is measured ±200mV from steady state.
6.42
6
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1, 2, 4)
tWC
ADDRESS
tAW
CS
tWR
tAS
tWP
WE
tWHZ
DATAOUT
(2)
(5)
tOW
HIGH IMPEDANCE
(3)
(3)
tDH
tDW
DATAIN
tCHZ (5)
(5)
DATAIN VALID
3622 drw 08
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1, 4)
tWC
ADDRESS
tAW
CS
tAS
tCW
tWR
WE
tDW
tDH
DATAIN VALID
DATAIN
3622 drw 09
NOTES:
1. A write occurs during the overlap of a LOW CS and a LOW WE.
2. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and
data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse
is the specified tWP.
3. During this period, I/O pins are in the output state, and input signals must not be applied.
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS must be active during the tCW
write period.
5. Transition is measured ±200mV from steady state.
6.42
7
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Ordering Information
IDT 71V424
Device
Type
X
X
Die
Power
Revision
XX
XXX
Speed
Package
X
X
Process/
Temperature
Range
Blank
I
Commercial (0°C to +70°C)
Industrial (–40°C to +85°C)
G
Restricted hazardous substance device
Y
PH
36-pin 400 mil SOJ (SO36-1)
44-pin TSOP Type II (SO44-2)
10*
12
15
Speed in nanoseconds
S
L
Standard Power
Low Power
Blank
First Generation or current stepping being shipped
* Commercial only for low power 10ns (L10) speed grade.
3622 drw 10
6.42
8
IDT71V424S, IDT71V424L, 3.3V CMOS Static RAM
4 Meg (512K x 8-bit)
Commercial and Industrial Temperature Ranges
Datasheet Document History
8/13/99
Pg. 2
Pg. 7
8/31/99
11/22/02
07/31/03
07/28/04
Pg. 9
Pg. 1–9
Pg. 8
Pg. 8
Pg. 3
Pg. 8
Updated to new format
Removed SO44-1 from TSOP pinout
Revised footnotes on Write Cycle No. 1 diagram
Removed footnote for tWR on Write Cycle No. 2 diagram
Added Datasheet Document History
Added Industrial temperature range offerings
Added die revision option to ordering information
Updated note, L10 speed grade commercial temperature only and updated die stepping from YF to Y.
Increased ISB for all "L" and S15 speeds by 10mA and increased for S12 speed by 5mA (refer to
PCN# SR-0402-02).
Added "Restricted hazardous substance device" to the ordering information.
CORPORATE HEADQUARTERS
2975 Stender Way
Santa Clara, CA 95054
for SALES:
800-345-7015 or 408-727-6116
fax: 408-492-8674
www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
6.42
9
for Tech Support:
[email protected]
800-544-7726
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