TI1 MSP430F2330TRHAR Mixed signal microcontroller Datasheet

MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
2
•
•
•
•
•
•
Low Supply Voltage Range: 1.8 V to 3.6 V
Ultra-Low Power Consumption
– Active Mode: 270 µA at 1 MHz, 2.2 V
– Standby Mode: 0.7 µA
– Off Mode (RAM Retention): 0.1 µA
Ultra-Fast Wake-Up From Standby Mode in
Less Than 1 µs
16-Bit RISC Architecture, 62.5-ns Instruction
Cycle Time
Basic Clock Module Configurations
– Internal Frequencies up to 16 MHz With
Four Calibrated Frequencies to ±1%
– Internal Very-Low-Power Low-Frequency
(LF) Oscillator
– 32-kHz Crystal
– High-Frequency (HF) Crystal up to 16 MHz
– Resonator
– External Digital Clock Source
– External Resistor
16-Bit Timer_A With Three Capture/Compare
Registers
16-Bit Timer_B With Three Capture/Compare
Registers
On-Chip Comparator for Analog Signal
Compare Function or Slope Analog-to-Digital
(A/D) Conversion
•
•
•
•
•
•
•
•
Universal Serial Communication Interface
– Enhanced UART Supporting Auto Baudrate
Detection (LIN)
– IrDA Encoder and Decoder
– Synchronous SPI
– I2C™
Brownout Detector
Serial Onboard Programming, No External
Programming Voltage Needed, Programmable
Code Protection by Security Fuse
Bootstrap Loader
On-Chip Emulation Module
Family Members Include:
– MSP430F2330
– 8KB + 256B Flash Memory
– 1KB RAM
– MSP430F2350
– 16KB + 256B Flash Memory
– 2KB RAM
– MSP430F2370
– 32KB + 256B Flash Memory
– 2KB RAM
Available in 40-Pin QFN Package and 49-Pin
Die-Sized BGA Package (See Table 1)
For Complete Module Descriptions, See the
MSP430x2xx Family User's Guide (SLAU144)
DESCRIPTION
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.
The MSP430F23x0 series is an ultra-low-power microcontroller with two built-in 16-bit timers, one universal serial
communication interface (USCI), a versatile analog comparator, and 32 I/O pins.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP430 is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. Available Options
PACKAGED DEVICES (1) (2)
TA
-40°C to 85°C
-40°C to 105°C
(1)
(2)
PLASTIC 49-PIN DSBGA
(YFF)
PLASTIC 40-PIN QFN
(RHA)
MSP430F2330IYFF
MSP430F2330IRHA
MSP430F2350IYFF
MSP430F2350IRHA
MSP430F2370IYFF
MSP430F2370IRHA
-
MSP430F2330TRHA
-
MSP430F2350TRHA
-
MSP430F2370TRHA
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Development Tool Support
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
• Debugging and Programming Interface with Target Board
– MSP-FET430U23X0 (RHA package)
• Debugging and Programming Interface
– MSP-FET430UIF (USB)
– MSP-FET430PIF (Parallel Port)
• Target Board
– MSP-TS430QFN23X0 (RHA package)
• Production Programmer
– MSP-GANG430
2
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Device Pinout, RHA Package
31
32
33
35
34
36
38
37
1
30
2
29
3
28
4
27
5
26
Exposed Thermal Pad
6
25
20
19
18
P4.4/TB1
P4.3/TB0
P4.2/TB2
P4.1/TB1
P4.0/TB0
P3.7
P3.6
P3.5/UCA0RXD/UCA0SOMI
P3.4/UCA0TXD/UCA0SIMO
P3.3/UCB0CLK/UCA0STE
P1.7/TA2
P2.0/ACLK/CA2
P2.1/TAINCLK/CA3
P2.2/CAOUT/TA0/CA4
P2.3/CA0/TA1
P2.4/CA1/TA2
P2.5/ROSC/CA5
P3.0/UCB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
P3.2/UCB0SOMI/UCB0SCL
17
21
15
22
10
16
23
9
13
8
14
24
11
7
12
DVCC
XIN/P2.6/CA6
XOUT/P2.7/CA7
P1.0/TACLK
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK
P1.5/TA0
P1.6/TA1
39
40
AVCC
D/AVSS
RST/NMI
TCK
TMS
TDI/TCLK
TDO/TDI
P4.7/TBCLK
P4.6/TBOUTH/ACLK
P4.5/TB2
RHA PACKAGE
(TOP VIEW)
Copyright © 2006–2011, Texas Instruments Incorporated
3
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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Device Pinout, YFF Package
YFF PACKAGE
(TOP VIEW)
A1
A2
A3
A4
A5
A6
A7
B1
B2
B3
B4
B5
B6
B7
C1
C2
C3
C4
C5
C6
C7
D1
D2
D3
D4
D5
D6
D7
E1
E2
E3
E4
E5
E6
E7
F1
F2
F3
F4
F5
F6
F7
G1
G2
G3
G4
G5
G6
G7
Package Dimensions
The package dimensions for this YFF package are shown in the following table. See the package drawing at the
end of this data sheet for more details.
Table 2. YFF Package Dimensions
4
PACKAGED DEVICES
D
E
MSP430F2370IYFF
MSP430F2350IYFF
MSP430F2330IYFF
3.20 ± 0.05 mm
3.20 ± 0.05 mm
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Functional Block Diagram
XIN
XOUT
DVCC
D/AVSS
AVCC 1.x/P2.x
P
P3.x/P4.x
2x8
2x8
ACLK
Basic Clock
System+ SMCLK
MCLK
Flash
RAM
32kB
16kB
8kB
2kB
2kB
1kB
16MHz
CPU
MAB
incl. 16
Registers
MDB
Hardware
Multiplier
Emulation
JTAG
Interface
Brownout
Protection
MPY,
MPYS,
MAC,
MACS
Ports
P1/P2
2x8 I/O
Interrupt
capability
Watchdog
WDT+
15-Bit
Ports
P3/P4
2x8 I/O
Timer_A3
Timer_B3
Comp_A+
3 CC
Registers
3 CC
Registers
8
Channels
USCI A0:
UART
IrDA, SPI
USCI B0:
SPI, I2C
RST/NMI
Copyright © 2006–2011, Texas Instruments Incorporated
5
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions
TERMINAL
NAME
DESCRIPTION
YFF
RHA
DVCC
B3
1
XIN/P2.6/CA6
A2
2
I/O
Input terminal of crystal oscillator/general-purpose digital I/O pin/Comparator_A input
XOUT/P2.7/CA7
A3
3
I/O
Output terminal of crystal oscillator/general-purpose digital I/O pin/Comparator_A input
P1.0/TACLK
B4
4
I/O
General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0
C4
5
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0A input, compare: Out0 output
P1.2/TA1
A5
6
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1 output
P1.3/TA2
B5
7
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI2A input, compare: Out2 output
P1.4/SMCLK
A6
8
I/O
General-purpose digital I/O pin/SMCLK signal output
P1.5/TA0
B6
9
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output
P1.6/TA1
A7
10
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output
P1.7/TA2
B7
11
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output
P2.0/ACLK/CA2
C5
12
I/O
General-purpose digital I/O pin/ACLK output/Comparator_A input
P2.1/TAINCLK/CA3
C7
13
I/O
General-purpose digital I/O pin/Timer_A, clock signal at INCLK/Comparator_A input
P2.2/CAOUT/TA0/CA4
C6
14
I/O
General-purpose digital I/O pin/Comparator_A output/Timer_A, capture: CCI0B
input/Comparator_A input
P2.3/CA0/TA1
D7
15
I/O
General-purpose digital I/O pin/Comparator_A input/Timer_A, compare: Out1 output
P2.4/CA1/TA2
D6
16
I/O
General-purpose digital I/O pin/Comparator_A input/Timer_A, compare: Out2 output
P2.5/ROSC/CA5
E7
17
I/O
General-purpose digital I/O pin/input for external resistor defining the DCO nominal
frequency/Comparator_A input
P3.0/UCB0STE/
UCA0CLK
E6
18
I/O
General-purpose digital I/O pin/USCIB0 slave transmit enable/USCIA clock input/output
P3.1/UCB0SIMO/
UCB0SDA
F7
19
I/O
General-purpose digital I/O pin/USCIB0 slave in/master out in SPI mode, SDA I2C data
in I2C mode
P3.2/UCB0SOMI/
UCB0SCL
F6
20
I/O
General-purpose digital I/O pin/USCIB0 slave out/master in in SPI mode, SCL I2C
clock in I2C mode
P3.3/UCB0CLK/
UCA0STE
G7
21
I/O
General-purpose digital I/O/USCIB0 clock input/output, USCIA0 slave transmit enable
P3.4/UCA0TXD/
UCA0SIMO
G6
22
I/O
General-purpose digital I/O pin/USCIA0 transmit data output in UART mode, slave data
in/master out in SPI mode
P3.5/UCA0RXD/
UCA0SOMI
G5
23
I/O
General-purpose digital I/O pin/USCIA0 receive data input in UART mode, slave data
out/master in in SPI mode
P3.6
F5
24
I/O
General-purpose digital I/O pin
P3.7
G4
25
I/O
General-purpose digital I/O pin
P4.0/TB0
F4
26
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI0A input, compare: Out0 output
P4.1/TB1
G3
27
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI1A input, compare: Out1 output
P4.2/TB2
G2
28
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI2A input, compare: Out2 output
P4.3/TB0
F3
29
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI0B input, compare: Out0 output
P4.4/TB1
G1
30
I/O
General-purpose digital I/O pin/Timer_B, capture: CCI1B input, compare: Out1 output
P4.5/TB2
F1
31
I/O
General-purpose digital I/O pin/Timer_B, compare: Out2 output
P4.6/TBOUTH/ACLK
F2
32
I/O
General-purpose digital I/O pin/switch all PWM digital outputs to high impedance Timer_B3: TB0 to TB2/ACLK output
P4.7/TBCLK
E2
33
I/O
General-purpose digital I/O pin/input clock TBCLK - Timer_B3
TDO/TDI
E1
34
I/O
Test data output port. TDO/TDI data output or programming data input terminal
TDI/TCLK
D1
35
I
Test data input or test clock input. The device protection fuse is connected to
TDI/TCLK.
TMS
D2
36
I
Test mode select. TMS is used as an input port for device programming and test.
TCK
C1
37
I
Test clock. TCK is the clock input port for device programming and test.
RST/NMI
C2
38
I
Reset input, nonmaskable interrupt input port.
D/AVSS
B1
39
6
I/O
Digital supply voltage, positive terminal. Supplies all digital parts.
Digital/analog supply voltage, negative terminal
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 3. Terminal Functions (continued)
TERMINAL
NAME
AVCC
DESCRIPTION
YFF
RHA
I/O
A1
40
QFN Pad
-
NA
NA
Analog supply voltage, positive terminal
QFN package pad. Connection to D/AVSS recommended.
Reserved
A4,
B2,
C3,
D3,
D4,
D5,
E3,
E4, E5
-
NA
BGA package GND balls. Connection to DVSS/AVSS is recommended.
Copyright © 2006–2011, Texas Instruments Incorporated
7
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
SHORT-FORM DESCRIPTION
CPU
The MSP430™ CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions, are
performed as register operations in conjunction with
seven addressing modes for source operand and four
addressing modes for destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
SR/CG1/R2
Status Register
Constant Generator
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
Instruction Set
General-Purpose Register
R11
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 4 shows examples of the three types of
instruction formats; Table 5 shows the address
modes.
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
The CPU is integrated with 16 registers that provide
reduced
instruction
execution
time.
The
register-to-register operation execution time is one
cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register, and
constant generator respectively. The remaining
registers are general-purpose registers.
Peripherals are connected to the CPU using data,
address, and control buses and can be handled with
all instructions.
Table 4. Instruction Word Formats
EXAMPLE
OPERATION
Dual operands, source-destination
INSTRUCTION FORMAT
ADD R4,R5
R4 + R5 → R5
Single operands, destination only
CALL R8
PC → (TOS), R8 → PC
JNE
Jump-on-equal bit = 0
Relative jump, unconditional/conditional
Table 5. Address Mode Descriptions
ADDRESS MODE
SYNTAX
EXAMPLE
OPERATION
✓
✓
MOV Rs,Rd
MOV R10,R11
R10 → R11
Indexed
✓
✓
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
M(2+R5) → M(6+R6)
Symbolic (PC relative)
✓
✓
MOV EDE,TONI
M(EDE) → M(TONI)
Absolute
✓
✓
MOV &MEM,&TCDAT
M(MEM) → M(TCDAT)
Indirect
✓
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) → M(Tab+R6)
Indirect autoincrement
✓
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) → R11
R10 + 2 → R10
Immediate
✓
MOV #X,TONI
MOV #45,TONI
#45 → M(TONI)
8
D
(2)
Register
(1)
(2)
S
(1)
S = source
D = destination
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
www.ti.com
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
Operating Modes
The MSP430 microcontrollers have one active mode and five software-selectable low-power modes of operation.
An interrupt event can wake up the device from any of the five low-power modes, service the request, and
restore back to the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
• Active mode (AM)
– All clocks are active.
• Low-power mode 0 (LPM0)
– CPU is disabled.
– ACLK and SMCLK remain active. MCLK is disabled.
• Low-power mode 1 (LPM1)
– CPU is disabled ACLK and SMCLK remain active. MCLK is disabled.
– DCO dc-generator is disabled if DCO not used in active mode.
• Low-power mode 2 (LPM2)
– CPU is disabled.
– MCLK and SMCLK are disabled.
– DCO dc-generator remains enabled.
– ACLK remains active.
• Low-power mode 3 (LPM3)
– CPU is disabled.
– MCLK and SMCLK are disabled.
– DCO dc-generator is disabled.
– ACLK remains active.
• Low-power mode 4 (LPM4)
– CPU is disabled.
– ACLK is disabled.
– MCLK and SMCLK are disabled.
– DCO dc-generator is disabled.
– Crystal oscillator is stopped.
Copyright © 2006–2011, Texas Instruments Incorporated
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SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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Interrupt Vector Addresses
The interrupt vectors and the power-up starting address are located in the address range of 0xFFFF to 0xFFC0.
The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
If the reset vector (located at address 0xFFFE) contains 0xFFFF (for example, if flash is not programmed), the
CPU goes into LPM4 immediately after power up.
Table 6. Interrupt Vector Addresses
INTERRUPT SOURCE
INTERRUPT FLAG
Power-up
PORIFG
External Reset
RSTIFG
Watchdog
WDTIFG
Flash key violation
KEYV
PC out of range (1)
WORD ADDRESS
PRIORITY
Reset
0xFFFE
31, highest
0xFFFC
30
(2)
NMI
NMIIFG
(non)–maskable
Oscillator Fault
OFIFG
(non)–maskable
Flash memory access violation
ACCVIFG (2) (3)
(non)–maskable
Timer_B3
TBCCR0 CCIFG (4)
maskable
0xFFFA
29
Timer_B3
TBCCR1 and TBCCR2,
CCIFGs, TBIFG (2) (4)
maskable
0xFFF8
28
Comparator_A+
CAIFG
maskable
0xFFF6
27
Watchdog timer
WDTIFG
maskable
0xFFF4
26
Timer_A3
TACCR0 CCIFG (4)
maskable
0xFFF2
25
Timer_A3
TACCR1 CCIFG,
TACCR2 CCIFG,
TAIFG (2) (4)
maskable
0xFFF0
24
USCI_A0/USCI_B0 Receive
USCI_B0 I2C Status
UCA0RXIFG,
UCB0RXIFG (2) (5)
maskable
0xFFEE
23
USCI_A0/USCI_B0 Transmit
USCI_B0 I2C Receive/Transmit
UCA0TXIFG,
UCB0TXIFG (2) (6)
maskable
0xFFEC
22
0xFFEA
21
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
10
SYSTEM
INTERRUPT
0xFFE8
20
I/O port P2 (eight flags)
P2IFG.0 to P2IFG.7 (2) (3)
maskable
0xFFE6
19
I/O port P1 (eight flags)
P1IFG.0 to P1IFG.7 (2) (3)
maskable
0xFFE4
18
0xFFE2
17
0xFFE0
16
See
(7)
0xFFDE
15
See
(8)
0xFFDC to 0xFFC0
14 to 0, lowest
A reset is generated if the CPU tries to fetch instructions from within the module register memory address range (0x0000 to 0x01FF) or
from within unused address range.
Multiple source flags
(non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
Nonmaskable: neither the individual nor the general interrupt-enable bit will disable an interrupt event.
Interrupt flags are located in the module.
In SPI mode: UCB0RXIFG. In I2C mode: UCALIFG, UCNACKIFG, ICSTTIFG, UCSTPIFG
In UART/SPI mode: UCB0TXIFG. In I2C mode: UCB0RXIFG, UCB0TXIFG
This location is used as bootstrap loader security key (BSLSKEY).
A 0xAA55 at this location disables the BSL completely.
A zero (0x0) disables the erasure of the flash if an invalid password is supplied.
The interrupt vectors at addresses 0xFFDC to 0xFFC0 are not used in this device and can be used for regular program code if
necessary.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Special Function Registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
not allocated to a functional purpose are not physically present in the device. Simple software access is provided
with this arrangement.
Legend
rw
rw-0, 1
rw-(0), (1)
Bit can be read and written.
Bit can be read and written. It is Reset or Set by PUC.
Bit can be read and written. It is Reset or Set by POR.
SFR bit is not present in device.
Table 7. Interrupt Enable 1
Address
7
6
00h
WDTIE
OFIE
NMIIE
ACCVIE
5
4
1
0
ACCVIE
NMIIE
3
2
OFIE
WDTIE
rw-0
rw-0
rw-0
rw-0
Watchdog timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog timer is configured in interval
timer mode.
Oscillator fault interrupt enable
(Non)maskable interrupt enable
Flash access violation interrupt enable
Table 8. Interrupt Enable 2
Address
7
6
5
4
01h
UCA0RXIE
UCA0TXIE
UCB0RXIE
UCB0TXIE
3
2
1
0
UCB0TXIE
UCB0RXIE
UCA0TXIE
UCA0RXIE
rw-0
rw-0
rw-0
rw-0
USCI_A0 receive-interrupt enable
USCI_A0 transmit-interrupt enable
USCI_B0 receive-interrupt enable
USCI_B0 transmit-interrupt enable
Table 9. Interrupt Flag Register 1
Address
7
6
5
02h
WDTIFG
OFIFG
RSTIFG
PORIFG
NMIIFG
4
3
2
1
0
NMIIFG
RSTIFG
PORIFG
OFIFG
WDTIFG
rw-0
rw-(0)
rw-(1)
rw-1
rw-(0)
Set on watchdog timer overflow (in watchdog mode) or security key violation.
Reset on VCC power-up or a reset condition at RST/NMI pin in reset mode.
Flag set on oscillator fault
External reset interrupt flag. Set on a reset condition at RST/NMI pin in reset mode. Reset on VCC power up.
Power-on reset interrupt flag. Set on VCC power up.
Set via RST/NMI pin
Table 10. Interrupt Flag Register 2
Address
7
6
03h
UCA0RXIFG
UCA0TXIFG
UCB0RXIFG
UCB0TXIFG
5
4
3
2
1
0
UCB0TXIFG
UCB0RXIFG
UCA0TXIFG
UCA0RXIFG
rw-0
rw-0
rw-0
rw-0
USCI_A0 receive-interrupt flag
USCI_A0 transmit-interrupt flag
USCI_B0 receive-interrupt flag
USCI_B0 transmit-interrupt flag
Copyright © 2006–2011, Texas Instruments Incorporated
11
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Memory Organization
Table 11. Memory Organization
MSP430F2330
Memory
MSP430F2350
MSP430F2370
Size
8KB Flash
16KB Flash
32KB
Main: interrupt vector
Flash
0xFFFF - 0xFFC0
0xFFFF - 0xFFC0
0xFFFF - 0xFFC0
Main: code memory
Flash
0xFFFF - 0xE000
0xFFFF - 0xC000
0xFFFF - 0x8000
Information memory
Size
256 Byte
256 Byte
256 Byte
Flash
0x10FF - 0x1000
0x10FF - 0x1000
0x10FF - 0x1000
Size
1KB
1KB
1KB
ROM
0x0FFF - 0x0C00
0x0FFF - 0x0C00
0x0FFF - 0x0C00
Size
1KB
2KB
2KB
0x5FF - 0x0200
0x9FF - 0x0200
0x09FF - 0x0200
16–bit
0x01FF - 0x0100
0x01FF - 0x0100
0x01FF - 0x0100
8–bit
0x00FF - 0x0010
0x00FF - 0x0010
0x00FF - 0x0010
8–bit SFR
0x000F - 0x0000
0x000F - 0x0000
0x000F - 0x0000
Boot memory
RAM
Peripherals
Bootstrap Loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap
Loader User’s Guide, literature number SLAU319.
Table 12. BSL Function Pins
BSL FUNCTION
YFF PACKAGE PINS
Data transmit
C4 - P1.1
RHA PACKAGE PINS
5 - P1.1
Data receive
C6 - P2.2
14 - P2.2
Flash Memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
64 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually, or as a group with segments 0 to n.
Segments A to D are also called information memory.
• Segment A contains calibration data. After reset, segment A is protected against programming and erasing. It
can be unlocked, but care should be taken not to erase this segment if the device-specific calibration data is
required.
12
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the MSP430x2xx Family User's Guide (SLAU144).
Oscillator and System Clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal very-low-power low-frequency oscillator, an internal digitally-controlled oscillator (DCO), and
a high-frequency crystal oscillator. The basic clock module is designed to meet the requirements of both low
system cost and low power consumption. The internal DCO provides a fast turn-on clock source and stabilizes in
less than 1 µs. The basic clock module provides the following clock signals:
• Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high-frequency crystal, or the internal
very-low-power LF oscillator.
• Main clock (MCLK), the system clock used by the CPU.
• Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
The DCO settings to calibrate the DCO output frequency are stored in the information memory segment A.
Table 13. DCO Calibration Data, Provided From Factory In Flash Info Memory
Segment A
DCO FREQUENCY
CALIBRATION REGISTER
SIZE
CALBC1_1MHZ
byte
0x10FF
CALBC0_1MHZ
byte
0x10FE
CALBC1_8MHZ
byte
0x10FD
CALBC0_8MHZ
byte
0x10FC
CALBC1_12MHZ
byte
0x10FB
CALBC0_12MHZ
byte
0x10FA
CALBC1_16MHZ
byte
0x10F9
CALBC0_16MHZ
byte
0x10F8
1 MHz
8 MHz
12 MHz
16 MHz
ADDRESS
Brownout
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on and
power off.
Digital I/O
There are four 8-bit I/O ports implemented—ports P1, P2, P3, and P4:
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt condition is possible.
• Edge-selectable interrupt input capability for all eight bits of port P1 and P2.
• Read/write access to port-control registers is supported by all instructions.
• Each I/O has an individually programmable pullup/pulldown resistor.
The MSP430F23x0 devices provide 32 total port I/O pins available externally. See the device pinout for more
information.
Watchdog Timer (WDT+)
The primary function of the WDT+ module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the module can be disabled or configured as an interval timer and can generate interrupts at
selected time intervals.
Copyright © 2006–2011, Texas Instruments Incorporated
13
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs 16×16, 16×8,
8×16, and 8×8 bit operations. The module is capable of supporting signed and unsignedmultiplication as well as
signed and unsignedmultiply and accumulate operations. The result of an operation can be accessed
immediately after the operands have been loaded into the peripheral registers. No additional clock cycles are
required.
Comparator_A+
The primary function of the comparator_A+ module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
Timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 14. Timer_A3 Signal Connections
INPUT PIN NUMBER
YFF
RHA
DEVICE INPUT
SIGNAL
B4 – P1.0
4 – P1.0
TACLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN NUMBER
YFF
RHA
C7 – P2.1
13 – P2.1
TAINCLK
INCLK
C4 – P1.1
5 – P1.1
TA0
CCI0A
C4 – P1.1
5 – P1.1
C6 – P2.2
14 – P2.2
TA0
CCI0B
B6 – P1.5
9 - P1.5
VSS
GND
A5 – P1.2
6 – P1.2
A7 – P1.6
10 – P1.6
D7 – P2.3
15 – P2.3
A5 – P1.2
B5 – P1.3
14
MODULE
INPUT NAME
6 – P1.2
7 – P1.3
VCC
VCC
TA1
CCI1A
CAOUT
(internal)
CCI1B
VSS
GND
VCC
VCC
CCR0
CCR1
TA0
TA1
TA2
CCI2A
B5 – P1.3
7 – P1.3
ACLK (internal)
CCI2B
B7 – P1.7
11 – P1.7
VSS
GND
D6 – P2.4
16 – P2.4
VCC
VCC
CCR2
TA2
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Timer_B3
Timer_B3 is a 16–bit timer/counter with three capture/compare registers. Timer_B3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_B3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 15. Timer_B3 Signal Connections
INPUT PIN NUMBER
YFF
RHA
DEVICE INPUT
SIGNAL
MODULE
INPUT NAME
E2 – P4.7
33 – P4.7
TBCLK
TACLK
ACLK
ACLK
SMCLK
SMCLK
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
Timer
NA
OUTPUT PIN NUMBER
YFF
RHA
TBCLK
INCLK
F4 – P4.0
26 – P4.0
TB0
CCI0A
F4 – P4.0
26 – P4.0
F3 – P4.3
29 – P4.3
TB0
CCI0B
F3 – P4.3
29 – P4.3
VSS
GND
G3 – P4.1
27 – P4.1
G1 – P4.4
30 – P4.4
VCC
VCC
G3 – P4.1
27 – P4.1
TA1
CCI1A
G1 - P4.4
30 - P4.4
TB1
CCI1B
VSS
GND
VCC
VCC
G2 – P4.2
28 – P4.2
CCR0
CCR1
TB0
TB1
TB2
CCI2A
G2 – P4.2
28 – P4.2
ACLK (internal)
CCI2B
F1 – P4.5
31 – P4.5
VSS
GND
VCC
VCC
CCR2
TB2
Universal Serial Communications Interface (USCI)
The USCI module is used for serial data communication. The USCI module supports synchronous
communication protocols like SPI (3 or 4 pin), I2C and asynchronous communication protocols such as UART,
enhanced UART with automatic baudrate detection (LIN), and IrDA.
USCI_A0 provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA.
USCI_B0 provides support for SPI (3 or 4 pin) and I2C.
Copyright © 2006–2011, Texas Instruments Incorporated
15
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Peripheral File Map
Table 16. Peripherals With Word Access
MODULE
Timer_B3
Timer_A3
Flash Memory
Hardware Multiplier
Watchdog Timer+
REGISTER NAME
SHORT NAME
ADDRESS
OFFSET
Capture/compare register
TBCCR2
0x0196
Capture/compare register
TBCCR1
0x0194
Capture/compare register
TBCCR0
0x0192
Timer_B register
TBR
0x0190
Capture/compare control
TBCCTL2
0x0186
Capture/compare control
TBCCTL1
0x0184
Capture/compare control
TBCCTL0
0x0182
Timer_B control
TBCTL
0x0180
Timer_B interrupt vector
TBIV
0x011E
Capture/compare register
TACCR2
0x0176
Capture/compare register
TACCR1
0x0174
Capture/compare register
TACCR0
0x0172
Timer_A register
TAR
0x0170
Capture/compare control
TACCTL2
0x0166
Capture/compare control
TACCTL1
0x0164
Capture/compare control
TACCTL0
0x0162
Timer_A control
TACTL
0x0160
Timer_A interrupt vector
TAIV
0x012E
Flash control 3
FCTL3
0x012C
Flash control 2
FCTL2
0x012A
Flash control 1
FCTL1
0x0128
Sum extend
SUMEXT
0x013E
Result high word
RESHI
0x013C
Result low word
RESLO
0x013A
Second operand
OP2
0x0138
Multiply signed +accumulate/operand1
MACS
0x0136
Multiply+accumulate/operand1
MAC
0x0134
Multiply signed/operand1
MPYS
0x0132
Multiply unsigned/operand1
MPY
0x0130
Watchdog/timer control
WDTCTL
0x0120
Table 17. Peripherals With Byte Access
MODULE
USCI_B0
16
REGISTER NAME
SHORT NAME
ADDRESS
OFFSET
USCI_B0 transmit buffer
UCB0TXBUF
0x06F
USCI_B0 receive buffer
UCB0RXBUF
0x06E
USCI_B0 status
UCB0STAT
0x06D
USCI_B0 bit rate control 1
UCB0BR1
0x06B
USCI_B0 bit rate control 0
UCB0BR0
0x06A
USCI_B0 control 1
UCB0CTL1
0x069
USCI_B0 control 0
UCB0CTL0
0x068
USCI_B0 I2C slave address
UCB0SA
0x011A
USCI_B0 I2C own address
UCB0OA
0x0118
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 17. Peripherals With Byte Access (continued)
MODULE
USCI_A0
Basic Clock System+
Port P4
Port P3
Port P2
Port P1
Special Function
REGISTER NAME
SHORT NAME
ADDRESS
OFFSET
USCI_A0 transmit buffer
UCA0TXBUF
0x0067
USCI_A0 receive buffer
UCA0RXBUF
0x0066
USCI_A0 status
UCA0STAT
0x0065
USCI_A0 modulation control
UCA0MCTL
0x0064
USCI_A0 baud rate control 1
UCA0BR1
0x0063
USCI_A0 baud rate control 0
UCA0BR0
0x0062
USCI_A0 control 1
UCA0CTL1
0x0061
USCI_A0 control 0
UCA0CTL0
0x0060
USCI_A0 IrDA receive control
UCA0IRRCTL
0x005F
USCI_A0 IrDA transmit control
UCA0IRTCTL
0x005E
USCI_A0 auto baud rate control
UCA0ABCTL
0x005D
Basic clock system control 3
BCSCTL3
0x0053
Basic clock system control 2
BCSCTL2
0x0058
Basic clock system control 1
BCSCTL1
0x0057
DCO clock frequency control
DCOCTL
0x0056
Port P4 resistor enable
P4REN
0x0011
Port P4 selection
P4SEL
0x001F
Port P4 direction
P4DIR
0x001E
Port P4 output
P4OUT
0x001D
Port P4 input
P4IN
0x001C
Port P3 resistor enable
P3REN
0x0010
Port P3 selection
P3SEL
0x001B
Port P3 direction
P3DIR
0x001A
Port P3 output
P3OUT
0x0019
Port P3 input
P3IN
0x0018
Port P2 resistor enable
P2REN
0x002F
Port P2 selection
P2SEL
0x002E
Port P2 interrupt enable
P2IE
0x002D
Port P2 interrupt edge select
P2IES
0x002C
Port P2 interrupt flag
P2IFG
0x002B
Port P2 direction
P2DIR
0x002A
Port P2 output
P2OUT
0x0029
Port P2 input
P2IN
0x0028
Port P1 resistor enable
P1REN
0x0027
Port P1 selection
P1SEL
0x0026
Port P1 interrupt enable
P1IE
0x0025
Port P1 interrupt edge select
P1IES
0x0024
Port P1 interrupt flag
P1IFG
0x0023
Port P1 direction
P1DIR
0x0022
Port P1 output
P1OUT
0x0021
Port P1 input
P1IN
0x0020
SFR interrupt flag 2
IFG2
0x0003
SFR interrupt flag 1
IFG1
0x0002
SFR interrupt enable 2
IE2
0x0001
SFR interrupt enable 1
IE1
0x0000
Copyright © 2006–2011, Texas Instruments Incorporated
17
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Absolute Maximum Ratings (1)
Voltage applied at VCC to VSS
Voltage applied to any pin
-0.3 V to 4.1 V
(2)
-0.3 V to (VCC + 0.3 V)
±2 mA
Diode current at any device terminal
Storage temperature, Tstg
(1)
(3)
Unprogrammed device
-55°C to 150°C
Programmed device
-55°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
(2)
(3)
Recommended Operating Conditions (1)
VCC
Supply voltage (2), AVCC = DVCC = VCC
VSS
Supply voltage, AVSS = DVSS = VSS
TA
Operating free-air temperature
fSYSTEM
Processor frequency (maximum MCLK frequency) (1) (3)
(see Figure 1)
(1)
(2)
(3)
MIN
MAX
During program execution
1.8
3.6
During flash memory programming
2.2
3.6
0
0
I version
-40
85
T version
-40
105
VCC = 1.8 V, Duty cycle = 50% ±10%
dc
4.15
VCC = 2.7 V, Duty cycle = 50% ±10%
dc
12
VCC ≥ 3.3 V, Duty cycle = 50% ±10%
dc
16
UNIT
V
V
°C
MHz
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power-up.
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
Legend :
System Frequency − MHz
16 MHz
Supply voltage range
during flash memory
programming
12 MHz
Supply voltage range
during program execution
7.5 MHz
4.15 MHz
1.8 V
2.2 V
2.7 V
3.3 V 3.6 V
Supply Voltage − V
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC
of 2.2 V.
Figure 1. Operating Area
18
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Active Mode Supply Current (Into DVCC + AVCC ) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
PARAMETER
IAM,1MHz
IAM,1MHz
IAM,4kHz
IAM,100kHz
(1)
(2)
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
2.2 V
270
370
Active mode (AM)
current (1 MHz)
fDCO = fMCLK = fSMCLK = 1 MHz,
fACLK = 32768 Hz,
Program executes in flash,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 0, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
3V
390
550
2.2 V
226
Active mode (AM)
current (1 MHz)
fDCO = fMCLK = fSMCLK = 1 MHz,
fACLK = 32768 Hz,
Program executes in RAM,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 0, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
3V
318
-40°C to 85°C
Active mode (AM)
current (4 kHz)
fMCLK = fSMCLK = fACLK = 32768 Hz / 8
= 4096 Hz,
fDCO = 0 Hz,
Program executes in flash,
SELMx = 11, SELS = 1,
DIVMx = DIVSx = DIVAx = 11,
CPUOFF = 0, SCG0 = 1, SCG1 = 0,
OSCOFF = 0
fMCLK = fSMCLK = fDCO(0,0) ≈ 100 kHz,
fACLK = 0 Hz,
Program executes in flash,
RSELx = 0, DCOx = 0, CPUOFF = 0,
SCG0 = 0, SCG1 = 0, OSCOFF = 1
-40°C to 85°C
Active mode (AM)
current (100 kHz)
6
14
-40°C to 85°C
3
9
3V
105°C
-40°C to 85°C
60
85
95
72
3V
105°C
µA
17
2.2 V
105°C
µA
µA
2
2.2 V
105°C
UNIT
µA
95
105
All inputs are tied to 0 V or VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
Typical Characteristics - Active-Mode Supply Current (Into DVCC + AVCC)
ACTIVE-MODE CURRENT
vs
SUPPLY VOLTAGE
TA = 25°C
ACTIVE-MODE CURRENT
vs
DCO FREQUENCY
8.0
5.0
f DCO = 16 MHz
TA = 85 °C
7.0
6.0
f DCO = 12 MHz
5.0
4.0
f DCO = 8 MHz
3.0
2.0
Active Mode Current − mA
Active Mode Current − mA
4.0
TA = 25 °C
3.0
VCC = 3 V
TA = 85 °C
2.0
TA = 25 °C
1.0
1.0
0.0
1.5
VCC = 2.2 V
f DCO = 1 MHz
2.0
2.5
3.0
VCC − Supply Voltage − V
Figure 2.
Copyright © 2006–2011, Texas Instruments Incorporated
3.5
4.0
0.0
0.0
4.0
8.0
12.0
16.0
f DCO − DCO Frequency − MHz
Figure 3.
19
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Low-Power-Mode Supply Currents (Into VCC) Excluding External Current
(1) (2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
ILPM0, 1MHz
ILPM0, 100kHz
ILPM2
Low-power mode 0
(LPM0) current (3)
Low-power mode 0
(LPM0) current (3)
Low-power mode 2
(LPM2) current (4)
TEST CONDITIONS
TA
VCC
fMCLK = 0 MHz,
fSMCLK = fDCO = 1 MHz,
fACLK = 32768 Hz,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 1, SCG0 = 0, SCG1 = 0,
OSCOFF = 0
-40°C to 85°C
fMCLK = 0 MHz,
fSMCLK = fDCO(0, 0) ≈ 100 kHz,
fACLK = 0 Hz,
RSELx = 0, DCOx = 0,
CPUOFF = 1, SCG0 = 0, SCG1 = 0,
OSCOFF = 1
-40°C to 85°C
fMCLK = fSMCLK = 0 MHz,
fDCO = 1 MHz,
fACLK = 32768 Hz,
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
CPUOFF = 1, SCG0 = 0, SCG1 = 1,
OSCOFF = 0
-40°C to 85°C
105°C
2.2 V
-40°C to 85°C
Low-power mode 3
(LPM3) current (4)
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK = 32768 Hz,
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 0
TYP
MAX
68
84
88
110
105°C
2.2 V
-40°C to 85°C
105°C
36
-40°C to 85°C
85°C
20
0.7
Low-power mode 3
current, (LPM3) (4)
0.85
3V
ILPM4
Low-power mode 4
(LPM4) current (5)
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK = 0 Hz,
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 1
20
2.2 V
0.8
2.9
9
0.35
3V
1
11
-40°C
0.5
2.2 V
0.5
1.7
2.7
105°C
8.6
-40°C
0.5
25°C
3V
µA
3.5
105°C
105°C
(3)
(4)
(5)
0.25
-40°C to 25°C
85°C
µA
12
85°C
85°C
(1)
(2)
1.2
3.8
105°C
25°C
µA
1
10
85°C
85°C
32
3.3
105°C
-40°C to 25°C
ILPM3, VLO
28
37
2.2 V
-40°C to 25°C
µA
32
23
105°C
fDCO = fMCLK = fSMCLK = 0 MHz,
fACLK from internal LF oscillator
(VLO),
CPUOFF = 1, SCG0 = 1, SCG1 = 1,
OSCOFF = 0
50
54
3V
105°C
45
50
40
2.2 V
µA
115
3V
105°C
UNIT
90
3V
105°C
-40°C to 25°C
ILPM3, LFXT1
MIN
µA
0.5
1.9
3
9
All inputs are tied to 0 V or VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance is chosen to closely match the required 9 pF.
Current for brownout and WDT clocked by SMCLK included.
Current for brownout and WDT clocked by ACLK included.
Current for brownout included.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Schmitt-Trigger Inputs (Ports P1, P2, P3, P4, JTAG, RST/NMI, XIN (1))
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VIT+
TEST CONDITIONS
Positive-going input threshold voltage
VCC
MIN
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ - VIT- )
RPull
Pullup/pulldown resistor
For pullup: VIN = VSS,
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
XIN only in bypass mode
MAX
0.45 VCC
0.75 VCC
1
1.65
1.35
2.25
0.25 VCC
0.55 VCC
2.2 V
0.55
1.20
3V
0.75
1.65
2.2 V
0.2
1
3V
0.3
1
2.2 V
3V
VIT-
TYP
20
35
UNIT
V
V
V
50
kΩ
5
pF
Inputs (Ports P1, P2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
t(int)
(1)
External interrupt timing
TEST CONDITIONS
Port P1, P2: P1.x to P2.x, External trigger
pulse width to set interrupt flag (1)
VCC
2.2 V/3 V
MIN
TYP
MAX
UNIT
20
ns
An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set with trigger signals
shorter than t(int).
Leakage Current (Ports P1, P2, P3, P4)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.y)
(1)
(2)
High-impedance leakage current
TEST CONDITIONS
(1) (2)
VCC
2.2 V/3 V
MIN
TYP
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
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Outputs (Ports P1, P2, P3, P4)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH(max) = -1.5 mA
VOH
High-level output voltage
IOH(max) = -6 mA
(2)
IOH(max) = -1.5 mA (1)
IOH(max) = -6 mA (2)
IOL(max) = 1.5 mA
VOL
Low-level output voltage
(2)
2.2 V
3V
(1)
2.2 V
IOL(max) = 6 mA (2)
IOL(max) = 1.5 mA (1)
IOL(max) = 6 mA (2)
(1)
VCC
(1)
3V
MIN
MAX
VCC - 0.25
VCC
VCC - 0.6
VCC
VCC - 0.25
VCC
VCC - 0.6
VCC
VSS
VSS + 0.25
VSS
VSS + 0.6
VSS
VSS + 0.25
VSS
VSS + 0.6
UNIT
V
V
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±12 mA to hold the maximum voltage drop
specified.
The maximum total current, IOH(max) and IOL(max), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
Output Frequency (Ports P1, P2, P3, P4)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fPx.y
Port output frequency (with load)
P1.4/SMCLK, CL = 20 pF, RL = 1 kΩ (1) (2)
fPort°CLK
Clock output frequency
P2.0/ACLK, P1.4/SMCLK, CL = 20 pF (2)
(1)
(2)
22
VCC
MIN
TYP
MAX
2.2 V
7.5
3V
12
2.2 V
7.5
3V
16
UNIT
MHz
MHz
A resistive divider with two 0.5-kΩ resistors between VCC and VSS is used as load. The output is connected to the center tap of the
divider.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Typical Characteristics - Outputs
One output loaded at a time.
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
50.0
VCC = 2.2 V
P2.4
TA = 25°C
20.0
I OL − Typical Low-Level Output Current − mA
I OL − Typical Low-Level Output Current − mA
25.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
VCC = 3 V
P2.4
40.0
TA = 85°C
30.0
20.0
10.0
0.0
0.0
2.5
0.5
VOL − Low-Level Output Voltage − V
1.5
2.0
2.5
3.0
Figure 4.
Figure 5.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
3.5
0.0
VCC = 2.2 V
P2.4
I OH − Typical High-Level Output Current − mA
I OH − Typical High-Level Output Current − mA
1.0
VOL − Low-Level Output Voltage − V
0.0
−5.0
−10.0
−15.0
−20.0
TA = 85°C
−25.0
0.0
TA = 25°C
TA = 25°C
0.5
1.0
1.5
2.0
VOH − High-Level Output Voltage − V
Figure 6.
Copyright © 2006–2011, Texas Instruments Incorporated
2.5
VCC = 3 V
P2.4
−10.0
−20.0
−30.0
−40.0
−50.0
0.0
TA = 85°C
TA = 25°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH − High-Level Output Voltage − V
Figure 7.
23
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
POR/Brownout Reset (BOR) (1) (2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC(start)
See Figure 8
dVCC /dt ≤ 3 V/s
V(B_IT-)
See Figure 8 through Figure 10
dVCC /dt ≤ 3 V/s
Vhys(B_IT-)
See Figure 8
dVCC /dt ≤ 3 V/s
td(BOR)
See Figure 8
t(reset)
Pulse length needed at RST/NMI pin
to accepted reset internally
(1)
(2)
VCC
MIN
TYP
MAX
0.7 ×
V(B_IT-)
70
2.2 V/3 V
2
130
UNIT
V
1.71
V
210
mV
2000
µs
µs
The current consumption of the brownout module is already included in the ICC current consumption data. The voltage level
V(B_IT-) + Vhys(B_IT-) is ≤ 1.8 V.
During power up, the CPU begins code execution following a period of td(BOR) after VCC = V(B_IT-) + Vhys(B_IT-). The default DCO settings
must not be changed until VCC ≥ VCC(min), where VCC(min) is the minimum supply voltage for the desired operating frequency.
VCC
Vhys(B_IT−)
V(B_IT−)
VCC(start)
1
0
t d(BOR)
Figure 8. POR/Brownout Reset (BOR) vs Supply Voltage
24
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Typical Characteristics - POR/Brownout Reset (BOR)
VCC
3V
2
VCC(drop) − V
VCC = 3 V
Typical Conditions
t pw
1.5
1
VCC(drop)
0.5
0
0.001
1
1000
1 ns
t pw − Pulse Width − µs
1 ns
t pw − Pulse Width − µs
Figure 9. VCC(drop) Level With a Square Voltage Drop to Generate a POR/Brownout Signal
VCC
2
t pw
3V
VCC(drop) − V
VCC = 3 V
1.5
Typical Conditions
1
VCC(drop)
0.5
0
0.001
tf = tr
1
t pw − Pulse Width − µs
1000
tf
tr
t pw − Pulse Width − µs
Figure 10. VCC(drop) Level With a Triangle Voltage Drop to Generate a POR/Brownout Signal
Copyright © 2006–2011, Texas Instruments Incorporated
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MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Main DCO Characteristics
•
•
•
All ranges selected by RSELx overlap with RSELx + 1: RSELx = 0 overlaps RSELx = 1, ... RSELx = 14
overlaps RSELx = 15.
DCO control bits DCOx have a step size as defined by parameter SDCO.
Modulation control bits MODx select how often fDCO(RSEL,DCO+1) is used within the period of 32 DCOCLK
cycles. The frequency fDCO(RSEL,DCO) is used for the remaining cycles. The frequency is an average equal to:
faverage =
32 × fDCO(RSEL,DCO) × fDCO(RSEL,DCO+1)
MOD × fDCO(RSEL,DCO) + (32 – MOD) × fDCO(RSEL,DCO+1)
DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
RSELx < 14
1.8
3.6
RSELx = 14
2.2
3.6
UNIT
VCC
Supply voltage range
3.0
3.6
fDCO(0,0)
DCO frequency (0, 0)
RSELx = 0, DCOx = 0, MODx = 0
2.2 V/3 V
0.06
0.14
MHz
fDCO(0,3)
DCO frequency (0, 3)
RSELx = 0, DCOx = 3, MODx = 0
2.2 V/3 V
0.07
0.17
MHz
fDCO(1,3)
DCO frequency (1, 3)
RSELx = 1, DCOx = 3, MODx = 0
2.2 V/3 V
0.10
0.20
MHz
fDCO(2,3)
DCO frequency (2, 3)
RSELx = 2, DCOx = 3, MODx = 0
2.2 V/3 V
0.14
0.28
MHz
fDCO(3,3)
DCO frequency (3, 3)
RSELx = 3, DCOx = 3, MODx = 0
2.2 V/3 V
0.20
0.40
MHz
fDCO(4,3)
DCO frequency (4, 3)
RSELx = 4, DCOx = 3, MODx = 0
2.2 V/3 V
0.28
0.54
MHz
fDCO(5,3)
DCO frequency (5, 3)
RSELx = 5, DCOx = 3, MODx = 0
2.2 V/3 V
0.39
0.77
MHz
fDCO(6,3)
DCO frequency (6, 3)
RSELx = 6, DCOx = 3, MODx = 0
2.2 V/3 V
0.54
1.06
MHz
fDCO(7,3)
DCO frequency (7, 3)
RSELx = 7, DCOx = 3, MODx = 0
2.2 V/3 V
0.80
1.50
MHz
fDCO(8,3)
DCO frequency (8, 3)
RSELx = 8, DCOx = 3, MODx = 0
2.2 V/3 V
1.10
2.10
MHz
fDCO(9,3)
DCO frequency (9, 3)
RSELx = 9, DCOx = 3, MODx = 0
2.2 V/3 V
1.60
3.00
MHz
fDCO(10,3)
DCO frequency (10, 3)
RSELx = 10, DCOx = 3, MODx = 0
2.2 V/3 V
2.50
4.30
MHz
fDCO(11,3)
DCO frequency (11, 3)
RSELx = 11, DCOx = 3, MODx = 0
2.2 V/3 V
3.00
5.50
MHz
fDCO(12,3)
DCO frequency (12, 3)
RSELx = 12, DCOx = 3, MODx = 0
2.2 V/3 V
4.30
7.30
MHz
fDCO(13,3)
DCO frequency (13, 3)
RSELx = 13, DCOx = 3, MODx = 0
2.2 V/3 V
6.00
9.60
MHz
fDCO(14,3)
DCO frequency (14, 3)
RSELx = 14, DCOx = 3, MODx = 0
2.2 V/3 V
8.60
13.9
MHz
fDCO(15,3)
DCO frequency (15, 3)
RSELx = 15, DCOx = 3, MODx = 0
3V
12.0
18.5
MHz
fDCO(15,7)
DCO frequency (15, 7)
RSELx = 15, DCOx = 7, MODx = 0
3V
16.0
26.0
MHz
SRSEL
Frequency step between
range RSEL and RSEL+1
SRSEL = fDCO(RSEL+1,DCO) /fDCO(RSEL,DCO)
2.2 V/3 V
1.55
ratio
SDCO
Frequency step between tap
DCO and DCO+1
SDCO = fDCO(RSEL,DCO+1) /fDCO(RSEL,DCO)
2.2 V/3 V
1.05
1.08
1.12
ratio
Duty cycle
Measured at P1.4/SMCLK
2.2 V/3 V
40
50
60
RSELx = 15
26
V
%
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Calibrated DCO Frequencies - Tolerance at Calibration
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Frequency tolerance at calibration
TA
VCC
MIN
TYP
MAX
UNIT
25°C
3V
-1
±0.2
+1
25°C
3V
0.990
1
1.010
MHz
%
fCAL(1MHz)
1-MHz calibration value
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
Gating time: 5 ms
fCAL(8MHz)
8-MHz calibration value
BCSCTL1 = CALBC1_8MHZ,
DCOCTL = CALDCO_8MHZ,
Gating time: 5 ms
25°C
3V
7.920
8
8.080
MHz
fCAL(12MHz)
12-MHz calibration value
BCSCTL1 = CALBC1_12MHZ,
DCOCTL = CALDCO_12MHZ,
Gating time: 5 ms
25°C
3V
11.88
12
12.12
MHz
fCAL(16MHz)
16-MHz calibration value
BCSCTL1 = CALBC1_16MHZ,
DCOCTL = CALDCO_16MHZ,
Gating time: 2 ms
25°C
3V
15.84
16
16.16
MHz
MAX
UNIT
Calibrated DCO Frequencies - Tolerance Over Temperature 0°C to 85°C
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fCAL(1MHz)
fCAL(8MHz)
fCAL(12MHz)
fCAL(16MHz)
TA
VCC
1-MHz tolerance over
temperature
0°C to 85°C
3V
-2.5
±0.5
+2.5
%
8-MHz tolerance over
temperature
0°C to 85°C
3V
-2.5
±1
+2.5
%
12-MHz tolerance over
temperature
0°C to 85°C
3V
-2.5
±1
+2.5
%
16-MHz tolerance over
temperature
0°C to 85°C
3V
-3
±2
+3
%
2.2 V
0.97
1
1.03
3V
0.975
1
1.025
3.6 V
0.97
1
1.03
2.2 V
7.76
8
8.4
3V
7.8
8
8.2
3.6 V
7.6
8
8.24
2.2 V
11.64
12
12.36
3V
11.64
12
12.36
3.6 V
11.64
12
12.36
3V
15.52
16
16.48
15
16
16.48
1-MHz calibration value
8-MHz calibration value
12-MHz calibration value
16-MHz calibration value
TEST CONDITIONS
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
Gating time: 5 ms
0°C to 85°C
BCSCTL1 = CALBC1_8MHZ,
DCOCTL = CALDCO_8MHZ,
Gating time: 5 ms
0°C to 85°C
BCSCTL1 = CALBC1_12MHZ,
DCOCTL = CALDCO_12MHZ,
Gating time: 5 ms
0°C to 85°C
BCSCTL1 = CALBC1_16MHZ,
DCOCTL = CALDCO_16MHZ,
Gating time: 2 ms
0°C to 85°C
Copyright © 2006–2011, Texas Instruments Incorporated
3.6 V
MIN
TYP
MHz
MHz
MHz
MHz
27
MSP430F23x0
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Calibrated DCO Frequencies - Tolerance Over Supply Voltage VCC
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX
1-MHz tolerance over VCC
25°C
8-MHz tolerance over VCC
25°C
12-MHz tolerance over VCC
16-MHz tolerance over VCC
UNIT
1.8 V to 3.6 V
-3
±2
+3
%
1.8 V to 3.6 V
-3
±2
+3
%
25°C
2.2 V to 3.6 V
-3
±2
+3
%
25°C
3 V to 3.6 V
-6
±2
+3
%
fCAL(1MHz)
1-MHz calibration value
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
Gating time: 5 ms
25°C
1.8 V to 3.6 V
0.97
1
1.03
MHz
fCAL(8MHz)
8-MHz calibration value
BCSCTL1 = CALBC1_8MHZ,
DCOCTL = CALDCO_8MHZ,
Gating time: 5 ms
25°C
1.8 V to 3.6 V
7.76
8
8.24
MHz
fCAL(12MHz)
12-MHz calibration value
BCSCTL1 = CALBC1_12MHZ,
DCOCTL = CALDCO_12MHZ,
Gating time: 5 ms
25°C
2.2 V to 3.6 V
11.64
12
12.36
MHz
fCAL(16MHz)
16-MHz calibration value
BCSCTL1 = CALBC1_16MHZ,
DCOCTL = CALDCO_16MHZ,
Gating time: 2 ms
25°C
3 V to 3.6 V
15
16
16.48
MHz
MIN
TYP
MAX
UNIT
Calibrated DCO Frequencies - Overall Tolerance
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
VCC
1-MHz tolerance
overall
-40°C to 105°C
1.8 V to 3.6 V
-5
±2
+5
%
8-MHz tolerance
overall
-40°C to 105°C
1.8 V to 3.6 V
-5
±2
+5
%
12-MHz tolerance
overall
-40°C to 105°C
2.2 V to 3.6 V
-5
±2
+5
%
16-MHz tolerance
overall
-40°C to 105°C
3 V to 3.6 V
-6
±3
+6
%
fCAL(1MHz)
1-MHz calibration
value
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ,
Gating time: 5 ms
-40°C to 105°C
1.8 V to 3.6 V
0.95
1
1.05
MHz
fCAL(8MHz)
8-MHz calibration
value
BCSCTL1 = CALBC1_8MHZ,
DCOCTL = CALDCO_8MHZ,
Gating time: 5 ms
-40°C to 105°C
1.8 V to 3.6 V
7.6
8
8.4
MHz
fCAL(12MHz)
12-MHz calibration
value
BCSCTL1 = CALBC1_12MHZ,
DCOCTL = CALDCO_12MHZ,
Gating time: 5 ms
-40°C to 105°C
2.2 V to 3.6 V
11.4
12
12.6
MHz
fCAL(16MHz)
16-MHz calibration
value
BCSCTL1 = CALBC1_16MHZ,
DCOCTL = CALDCO_16MHZ,
Gating time: 2 ms
-40°C to 105°C
3 V to 3.6 V
15
16
17
MHz
28
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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Typical Characteristics - Calibrated 1-MHz DCO Frequency
CALIBRATED 1-MHz FREQUENCY
vs
SUPPLY VOLTAGE
1.03
Frequency − MHz
1.02
TA = 105 °C
1.01
TA = 85 °C
1.00
TA = 25 °C
0.99
TA = −40 °C
0.98
0.97
1.5
2.0
2.5
3.0
3.5
4.0
VCC − Supply Voltage − V
Figure 11.
Copyright © 2006–2011, Texas Instruments Incorporated
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MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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Wake-Up From Lower-Power Modes (LPM3/4)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
BCSCTL1 = CALBC1_1MHZ,
DCOCTL = CALDCO_1MHZ
tDCO,LPM3/4
BCSCTL1 = CALBC1_8MHZ,
DCO clock wake-up time DCOCTL = CALDCO_8MHZ
from LPM3/4 (1)
BCSCTL1 = CALBC1_12MHZ,
DCOCTL = CALDCO_12MHZ
(1)
(2)
UNIT
2
2.2 V/3 V
1.5
µs
1
BCSCTL1 = CALBC1_16MHZ,
DCOCTL = CALDCO_16MHZ
tCPU,LPM3/4
MAX
3V
CPU wake-up time from
LPM3/4 (2)
1
1 / fMCLK +
tClock,LPM3/4
The DCO clock wake-up time is measured from the edge of an external wake-up signal (for example, a port interrupt) to the first clock
edge observable externally on a clock pin (MCLK or SMCLK).
Parameter applicable only if DCOCLK is used for MCLK.
Typical Characteristics - DCO Clock Wake-Up Time From LPM3/4
CLOCK WAKE-UP TIME FROM LPM3
vs
DCO FREQUENCY
DCO Wake Time − µs
10.00
RSELx = 0 to 11
RSELx = 12 to 15
1.00
0.10
0.10
1.00
10.00
DCO Frequency − MHz
Figure 12.
30
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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DCO With External Resistor ROSC (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fDCO,ROSC
DCO output frequency with ROSC
DCOR = 1,
RSELx = 4, DCOx = 3, MODx = 0,
TA = 25°C
DT
Temperature drift
DV
Drift with VCC
(1)
VCC
MIN
TYP
MAX
UNIT
2.2 V
1.8
3V
1.95
DCOR = 1,
RSELx = 4, DCOx = 3, MODx = 0
2.2 V/3 V
±0.1
%/°C
DCOR = 1,
RSELx = 4, DCOx = 3, MODx = 0
2.2 V/3 V
10
%/V
MHz
ROSC = 100 kΩ. Metal film resistor, type 0257, 0.6 W with 1% tolerance and TK = ±50 ppm/°C.
Typical Characteristics - DCO With External Resistor ROSC
DCO FREQUENCY
vs
ROSC
VCC = 2.2 V, TA = 25°C
DCO FREQUENCY
vs
ROSC
VCC = 3 V, TA = 25°C
10.00
DCO Frequency − MHz
DCO Frequency − MHz
10.00
1.00
RSELx = 4
0.10
0.01
10.00
100.00
1000.00
0.10
100.00
1000.00
10000.00
ROSC − External Resistor − kW
ROSC − External Resistor − kW
Figure 13.
Figure 14.
DCO FREQUENCY
vs
TEMPERATURE
VCC = 3 V
DCO FREQUENCY
vs
SUPPLY VOLTAGE
TA = 25°C
2.50
2.25
2.25
ROSC = 100k
1.75
1.50
1.25
1.00
ROSC = 270k
0.75
0.50
−25
0
25
50
TA − Temperature − °C
Figure 15.
Copyright © 2006–2011, Texas Instruments Incorporated
75
1.75
1.50
1.25
1.00
ROSC = 270k
0.75
0.50
ROSC = 1M
0.25
ROSC = 100k
2.00
DCO Frequency − MHz
2.00
DCO Frequency − MHz
RSELx = 4
0.01
10.00
10000.00
2.50
0.00
−50
1.00
ROSC = 1M
0.25
100
0.00
2.0
2.5
3.0
3.5
4.0
VCC − Supply Voltage − V
Figure 16.
31
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Crystal Oscillator LFXT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fLFXT1,LF
LFXT1 oscillator crystal
frequency, LF mode 0, 1
fLFXT1,LF,logic
LFXT1 oscillator logic level
square wave input frequency, XTS = 0, XCAPx = 0, LFXT1Sx = 3
LF mode
OALF
Oscillation allowance for
LF crystals
CL,eff
fFault,LF
(1)
(2)
(3)
(4)
Integrated effective load
capacitance, LF mode (2)
XTS = 0, LFXT1Sx = 0 or 1
VCC
MIN
TYP
1.8 V to 3.6 V
1.8 V to 3.6 V
MAX
32768
10000
32768
XTS = 0, LFXT1Sx = 0,
fLFXT1,LF = 32768 Hz, CL,eff = 6 pF
500
XTS = 0, LFXT1Sx = 0,
fLFXT1,LF = 32768 Hz, CL,eff = 12 pF
200
UNIT
Hz
50000
Hz
kΩ
XTS = 0, XCAPx = 0
1
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
11
Duty cycle, LF mode
XTS = 0, Measured at P2.0/ACLK,
fLFXT1,LF = 32768 Hz
2.2 V/3 V
30
Oscillator fault frequency,
LF mode (3)
XTS = 0, XCAPx = 0, LFXT1Sx = 3 (4)
2.2 V/3 V
10
50
pF
70
%
10000
Hz
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the crystal that is used.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
fVLO
VLO frequency
2.2 V/3 V
dfVLO/dT
VLO frequency temperature drift (1)
2.2 V/3 V
dfVLO/dVCC
VLO frequency supply voltage drift (2)
(1)
(2)
32
1.8 V to 3.6 V
MIN
TYP
MAX
4
12
20
UNIT
kHz
0.5
%/°C
4
%/V
Calculated using the box method:
I version: [MAX(-40...85°C) - MIN(-40...85°C)]/MIN(-40...85°C)/[85°C - (-40°C)]
T version: [MAX(-40...105°C) - MIN(-40...105°C)]/MIN(-40...105°C)/[105°C - (-40°C)]
Calculated using the box method: [MAX(1.8...3.6 V) - MIN(1.8...3.6 V)]/MIN(1.8...3.6 V)/(3.6 V - 1.8 V)
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Crystal Oscillator LFXT1, High-Frequency Mode (1)
PARAMETER
VCC
MIN
XTS = 1, XCAPx = 0, LFXT1Sx = 0
1.8 V to 3.6 V
LFXT1 oscillator crystal
frequency, HF mode 1
XTS = 1, XCAPx = 0, LFXT1Sx = 1
LFXT1 oscillator crystal
frequency, HF mode 2
XTS = 1, XCAPx = 0, LFXT1Sx = 2
fLFXT1,HF0
LFXT1 oscillator crystal
frequency, HF mode 0
fLFXT1,HF1
fLFXT1,HF2
TEST CONDITIONS
MAX
UNIT
0.4
1
MHz
1.8 V to 3.6 V
1
4
MHz
1.8 V to 3.6 V
2
10
2.2 V to 3.6 V
2
12
3 V to 3.6 V
fLFXT1,HF,logic
OAHF
CL,eff
LFXT1 oscillator logic-level
square-wave input
frequency, HF mode
Oscillation allowance for HF
crystals (see Figure 17 and
Figure 18)
Integrated effective load
capacitance, HF mode (2)
(1)
(2)
(3)
(4)
(5)
Oscillator fault frequency
2
16
1.8 V to 3.6 V
0.4
10
2.2 V to 3.6 V
0.4
12
3 V to 3.6 V
0.4
16
XTS = 1, XCAPx = 0, LFXT1Sx = 0,
fLFXT1,HF = 1 MHz, CL,eff = 15 pF
2700
XTS = 1, XCAPx = 0, LFXT1Sx = 1,
fLFXT1,HF = 4 MHz, CL,eff = 15 pF
800
XTS = 1, XCAPx = 0, LFXT1Sx = 2,
fLFXT1,HF = 16 MHz, CL,eff = 15 pF
300
XTS = 1, XCAPx = 0 (3)
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 10 MHz
Duty cycle, HF mode
fFault,HF
XTS = 1, XCAPx = 0, LFXT1Sx = 3
XTS = 1, XCAPx = 0,
Measured at P2.0/ACLK,
fLFXT1,HF = 16 MHz
(4)
TYP
XTS = 1, XCAPx = 0, LFXT1Sx = 3 (5)
50
pF
60
2.2 V/3 V
%
40
2.2 V/3 V
MHz
Ω
1
40
MHz
30
50
60
300
kHz
To improve EMI on the XT2 oscillator the following guidelines should be observed:
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is
recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should
always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and
frequencies in between might set the flag.
Measured with logic-level input frequency, but also applies to operation with crystals.
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Typical Characteristics - LFXT1 Oscillator in HF Mode (XTS = 1)
OSCILLATION ALLOWANCE
vs
CRYSTAL FREQUENCY
CL,eff = 15 pF, TA = 25°C
OSCILLATOR SUPPLY CURRENT
vs
CRYSTAL FREQUENCY
CL,eff = 15 pF, TA = 25°C
800
100000
LFXT1Sx = 2
XT Oscillator Supply Current – µA
Oscillation Allowance – W
700
10000
1000
LFXT1Sx = 2
100
LFXT1Sx = 0
LFXT1Sx = 1
600
500
400
300
LFXT1Sx = 1
200
100
LFXT1Sx = 0
10
0.1
1
10
Crystal Frequency – MHz
Figure 17.
34
100
0
0
4
8
12
16
20
Crystal Frequency – MHz
Figure 18.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTA
Timer_A clock frequency
Internal: SMCLK, ACLK
External: TACLK, INCLK
Duty cycle = 50% ± 10%
tTA,cap
Timer_A capture timing
TA0, TA1, TA2
VCC
MIN
MAX
2.2 V
10
3V
16
2.2 V/3 V
20
UNIT
MHz
ns
Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTB
Timer_B clock frequency
Internal: SMCLK, ACLK
External: TACLK, INCLK
Duty cycle = 50% ± 10%
tTB,cap
Timer_B capture timing
TB0, TB1, TB2
Copyright © 2006–2011, Texas Instruments Incorporated
VCC
MIN
MAX
2.2 V
10
3V
16
2.2 V/3 V
20
UNIT
MHz
ns
35
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SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fUSCI
USCI input clock frequency
fmax,BITCLK
Maximum BITCLK clock frequency
(equals baud rate in MBaud) (1)
tτ
UART receive deglitch time (2)
(1)
(2)
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
2.2 V/3 V
2
2.2 V
50
150
3V
50
100
MAX
UNIT
fSYSTEM
MHz
MHz
ns
The DCO wake-up time must be considered in LPM3/4 for baudrates above 1 MHz.
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
USCI (SPI Master Mode) (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Figure 19 and Figure 20)
PARAMETER
fUSCI
USCI input clock frequency
tSU,MI
SOMI input data setup time
tHD,MI
SOMI input data hold time
tVALID,MO
SIMO output data valid time
(1)
TEST CONDITIONS
VCC
MIN
TYP
SMCLK, ACLK
Duty cycle = 50% ± 10%
UCLK edge to SIMO valid,
CL = 20 pF
2.2 V
110
3V
75
2.2 V
0
3V
0
MAX
UNIT
fSYSTEM
MHz
ns
ns
2.2 V
30
3V
20
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
USCI (SPI Slave Mode) (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Figure 21 and Figure 22)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
tSTE,LEAD
STE lead time, STE low to clock
2.2 V/3 V
tSTE,LAG
STE lag time, Last clock to STE high
2.2 V/3 V
tSTE,ACC
STE access time, STE low to SOMI data out
2.2 V/3 V
50
ns
tSTE,DIS
STE disable time, STE high to SOMI high
impedance
2.2 V/3 V
50
ns
tSU,SI
SIMO input data setup time
tHD,SI
SIMO input data hold time
tVALID,SO
SOMI output data valid time
(1)
36
UCLK edge to SOMI valid,
CL = 20 pF
50
UNIT
ns
10
2.2 V
20
3V
15
2.2 V
10
3V
10
ns
ns
ns
2.2 V
75
110
3V
50
75
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master) refer to the SPI parameters of the attached slave.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
1/fUCxCLK
CKPL=0
UCLK
CKPL=1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tVALID,MO
SIMO
Figure 19. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL=0
UCLK
CKPL=1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tVALID,MO
SIMO
Figure 20. SPI Master Mode, CKPH = 1
Copyright © 2006–2011, Texas Instruments Incorporated
37
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL=0
UCLK
CKPL=1
tLO/HI
tLO/HI
tSU,SI
tHD,SI
SIMO
tSTE,ACC
tVALID,SO
tSTE,DIS
SOMI
Figure 21. SPI Slave Mode, CKPH = 0
tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL=0
UCLK
CKPL=1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tVALID,SO
tSTE,DIS
SOMI
Figure 22. SPI Slave Mode, CKPH = 1
38
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 23)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V/3 V
0
tSU,DAT
Data setup time
2.2 V/3 V
250
ns
tSU,STO
Setup time for STOP
2.2 V/3 V
4
µs
tSP
Pulse width of spikes suppressed by input filter
2.2 V
50
150
600
3V
50
100
600
2.2 V/3 V
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
tHD,STA
2.2 V/3 V
2.2 V/3 V
0
4
µs
0.6
4.7
µs
0.6
ns
ns
tSU,STA tHD,STA
SDA
1/fSCL
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 23. I2C Mode Timing
Copyright © 2006–2011, Texas Instruments Incorporated
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MSP430F23x0
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Comparator_A+ (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(DD)
CAON = 1, CARSEL = 0, CAREF = 0
I(Refladder/RefDiode)
CAON = 1, CARSEL = 0, CAREF = 1/2/3,
No load at P2.3/CA0 and P2.4/CA1
VCC
MIN
TYP
MAX
2.2 V
25
40
3V
45
60
2.2 V
30
50
3V
45
71
UNIT
µA
µA
VIC
Common-mode input voltage
range
CAON = 1
2.2 V/3 V
0
V(Ref025)
Voltage at 0.25 VCC node /
VCC
PCA0 = 1, CARSEL = 1, CAREF = 1,
No load at P2.3/CA0 and P2.4/CA1
2.2 V/3 V
0.23
0.24
0.25
V(Ref050)
Voltage at 0.5 VCC node /
VCC
PCA0 = 1, CARSEL = 1, CAREF = 2,
No load at P2.3/CA0 and P2.4/CA1
2.2 V/3 V
0.47
0.48
0.5
390
480
540
See Figure 27 and Figure 28
PCA0 = 1, CARSEL = 1, CAREF = 3,
No load at P2.3/CA0 and P2.4/CA1,
TA = 85°C
2.2 V
V(RefVT)
3V
400
490
550
V(offset)
Offset voltage (2)
2.2 V/3 V
-30
30
mV
Vhys
Input hysteresis
2.2 V/3 V
0
0.7
1.4
mV
TA = 25°C, Overdrive 10 mV,
Without filter: CAF = 0 (3)
(see Figure 24 and Figure 25)
2.2 V
80
165
300
3V
70
120
240
TA = 25°C, Overdrive 10 mV,
With filter: CAF = 1 (3)
(see Figure 24 and Figure 25)
2.2 V
1.4
1.9
2.8
3V
0.9
1.5
2.2
t(response)
(1)
(2)
(3)
40
Response time
(low-high and high-low)
CAON = 1
VCC - 1
V
mV
ns
µs
The leakage current for the Comparator_A+ terminals is identical to Ilkg(Px.y) specification.
The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A+ inputs on successive measurements. The
two successive measurements are then summed together.
Response time measured at P2.2/CAOUT/TA0/CA4.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
0V
VCC
0
1
CAF
CAON
To Internal
Modules
Low-Pass Filter
+
_
V+
V−
0
0
1
1
CAOUT
Set CAIFG
Flag
τ ≈ 2.0 µs
Figure 24. Comparator_A+ Module Block Diagram
VCAOUT
Overdrive
V−
400 mV
t (response)
V+
Figure 25. Overdrive Definition
CASHORT
CA0
CA1
1
VIN
+
−
Comparator_A+
CASHORT = 1
IOUT = 10µA
Figure 26. Comparator_A+ Short Resistance Test Condition
Copyright © 2006–2011, Texas Instruments Incorporated
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Typical Characteristics - Comparator_A+
V(RefVT)
vs
TEMPERATURE
VCC = 2.2 V
V(RefVT)
vs
TEMPERATURE
VCC = 2.2 V
650
650
VCC = 2.2 V
600
V(REFVT) – Reference Volts – mV
V(REFVT) – Reference Volts – mV
VCC = 3 V
Typical
550
500
450
400
-45
-25
15
55
75
35
-5
TA – Free-Air Temperature – °C
600
Typical
550
500
450
400
-45
95
-25
15
55
75
35
-5
TA – Free-Air Temperature – °C
Figure 27.
Figure 28.
SHORT RESISTANCE
vs
VIN/VCC
100
Short Resistance – kW
95
VCC = 1.8 V
VCC = 2.2 V
VCC = 3 V
10
VCC = 3.6 V
1
0
0.2
0.4
0.6
0.8
1.0
VIN/VCC – Normalized Input Voltage – V/V
Figure 29.
42
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
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Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VCC (PGM/ERASE)
Program and erase supply voltage
2.2
3.6
V
fFTG
Flash timing generator frequency
257
476
kHz
IPGM
Supply current from VCC during program
2.2 V/3.6 V
1
5
mA
IERASE
Supply current from VCC during erase
2.2 V/3.6 V
1
7
mA
10
ms
(1)
tCPT
Cumulative program time
tCMErase
Cumulative mass erase time
2.2 V/3.6 V
2.2 V/3.6 V
20
ms
104
Program/erase endurance
105
cycles
tRetention
Data retention duration
TJ = 25°C
tWord
Word or byte program time
See
(2)
30
tFTG
tBlock,
0
Block program time for first byte or word
See
(2)
25
tFTG
tBlock,
1-63
Block program time for each additional
byte or word
See
(2)
18
tFTG
Block program end-sequence wait time
See
(2)
6
tFTG
Mass erase time
See
(2)
10593
tFTG
See
(2)
4819
tFTG
tBlock,
End
tMass Erase
tSeg Erase
(1)
(2)
Segment erase time
100
years
The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
These values are hardwired into the flash controller's state machine (tFTG = 1/fFTG).
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
V(RAMh)
(1)
RAM retention supply voltage
(1)
TEST CONDITIONS
MIN
CPU halted
MAX
UNIT
1.6
V
This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fTCK
TCK input frequency (1)
RInternal
Internal pulldown resistance on TEST (2)
(1)
(2)
VCC
MIN
TYP
MAX
UNIT
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V/3 V
25
35
55
kΩ
MIN
MAX
fTCK may be restricted to meet the timing requirements of the module selected.
TMS, TDI/TCLK, and TCK pullup resistors are implemented in all versions.
JTAG Fuse (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
VFB
Voltage level on TEST for fuse blow
IFB
Supply current into TEST during fuse blow
tFB
Time to blow fuse
(1)
TEST CONDITIONS
TA = 25°C
2.5
6
UNIT
V
7
V
100
mA
1
ms
After the fuse is blown, no further access to the JTAG/Test and emulation features is possible, and the JTAG block is switched to
bypass mode.
Copyright © 2006–2011, Texas Instruments Incorporated
43
MSP430F23x0
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www.ti.com
APPLICATION INFORMATION
Port P1 Pin Schematic: P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
P1DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P1OUT.x
DVSS
P1.0/TACLK
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK
P1.5/TA0
P1.6/TA1
P1.7/TA2
P1SEL.x
P1IN.x
EN
Module X IN
D
P1IE.x
P1IRQ.x
EN
Q
Set
P1IFG.x
P1SEL.x
P1IES.x
44
Interrupt
Edge Select
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 18. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
x
FUNCTION
P1.0 (I/O)
P1.0/TACLK
0
1
2
0
0
1
DVSS
1
1
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA0
1
1
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA0
1
1
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA0
1
1
I: 0, O: 1
0
1
1
P1.3 (I/O)
P1.3/TA2
3
P1.4/SMCLK
4
P1.5/TA0
5
P1.4 (I/O)
SMCLK
P1.5 (I/O)
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA0
1
1
P1.6 (I/O)
P1.6/TA1
6
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA1
1
1
P1.7 (I/O)
P1.7/TA2
7
P1SEL.x
I: 0, O: 1
P1.2 (I/O)
P1.2/TA1
P1DIR.x
Timer_A3.TACLK
P1.1 (I/O)
P1.1/TA0
CONTROL BITS / SIGNALS
I: 0, O: 1
0
Timer_A3.CCI0A
0
1
Timer_A3.TA2
1
1
Copyright © 2006–2011, Texas Instruments Incorporated
45
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P2 Pin Schematic: P2.0 to P2.4, Input/Output With Schmitt Trigger
Pad Logic
To
Comparator_A
From
Comparator_A
CAPD.x
P2REN.x
P2DIR.x
0
Module X OUT
0
DVCC
1
1
Direction
0: Input
1: Output
1
P2OUT.x
DVSS
0
1
Bus
Keeper
EN
P2SEL.x
P2IN.x
P2.0/ACLK/CA2
P2.1/TAINCLK/CA3
P2.2/CAOUT/TA0/CA4
P2.3/CA0/TA1
P2.4/CA1/TA2
EN
Module X IN
D
P2IE.x
P2IRQ.x
EN
Q
Set
P2IFG.x
P2SEL.x
P2IES.x
46
Interrupt
Edge Select
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 19. Port P2 (P2.0 to P2.4) Pin Functions
PIN NAME (P2.x)
P2.0/ACLK/CA2
P2.1/TAINCLK/CA3
P2.2/CAOUT/TA0/CA4
x
0
1
2
FUNCTION
CAPD.x
P2DIR.x
P2SEL.x
P2.0 (I/O)
0
I: 0, O: 1
0
ACLK
0
1
1
CA2 (2)
1
X
X
P2.1 (I/O)
0
I: 0, O: 1
0
Timer_A3.TAINCLK
0
0
1
DVSS
0
1
1
CA3 (2)
1
X
X
P2.2 (I/O)
0
I: 0, O: 1
0
CAOUT
0
1
1
TA0
0
0
1
X
CA4
P2.3/CA0/TA1
P2.4/CA1/TA2
(1)
(2)
3
4
CONTROL BITS / SIGNALS (1)
(2)
1
X
P2.3 (I/O)
0
I: 0, O: 1
0
CA0 (2)
1
X
X
Timer_A3.TA1
0
1
1
P2.4 (I/O)
0
I: 0, O: 1
0
CA1 (2)
1
X
X
Timer_A3.TA2
0
1
1
X = Don't care
Setting theCAPD.xbit disables the output driver as well as the input to prevent parasitic cross currentswhenapplying analog signals.
Selecting the CAx input to the comparator multiplexer with the P2CAx bits automatically disables the input buffer for that pin, regardless
of the state of the associated CAPD.x bit.
Copyright © 2006–2011, Texas Instruments Incorporated
47
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P2 Pin Schematic: P2.5, Input/Output With Schmitt Trigger
Pad Logic
To Comparator
From Comparator
CAPD.5
To DCO
DCOR
in DCO
P2REN.5
0
P2DIR.5
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P2OUT.5
DVSS
P2.5/ROSC/CA5
Bus
Keeper
EN
P2SEL.x
P2IN.5
EN
Module X IN
D
P2IE.5
P2IRQ.5
EN
Q
Set
P2IFG.5
P2SEL.5
P2IES.5
Interrupt
Edge Select
Table 20. Port P2 (P2.5) Pin Functions
PIN NAME (P2.x)
P2.5/ROSC/CA5
(1)
(2)
48
x
5
FUNCTION
CONTROL BITS / SIGNALS (1)
CAPD.5
DCOR
P2DIR.5
P2SEL.5
P2.5 (I/O)
0
0
I: 0, O: 1
0
ROSC
0
1
X
X
DVSS
0
0
1
1
CA5 (2)
1
0
X
X
X = Don't care
Setting theCAPD.xbit disables the output driver as well as the input to prevent parasitic cross currentswhenapplying analog signals.
Selecting the CAx input to the comparator multiplexer with the P2CAx bits automatically disables the input buffer for that pin, regardless
of the state of the associated CAPD.x bit.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P2 Pin Schematic: P2.6, Input/Output With Schmitt Trigger
BCSCTL3.LFXT1Sx = 11
P2.7/XOUT/CA7
LFXT1 off
0
LFXT1CLK
1
Pad Logic
To Comparator
From
Comparator
CAPD.6
P2SEL.7
P2REN.6
P2DIR.6
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P2OUT.6
DVSS
P2.6/XIN/CA6
Bus
Keeper
EN
P2SEL.6
P2IN.6
EN
Module X IN
D
P2IE.6
P2IRQ.6
EN
Q
Set
P2IFG.6
P2SEL.6
P2IES.6
Interrupt
Edge Select
Copyright © 2006–2011, Texas Instruments Incorporated
49
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 21. Port P2 (P2.6) Pin Functions
PIN NAME (P2.x)
P2.6/XIN/CA6
(1)
(2)
50
x
6
FUNCTION
CONTROL BITS / SIGNALS (1)
CAPD.6
P2DIR.6
P2SEL.6
P2.6 (I/O)
0
I: 0, O: 1
0
XIN (default)
X
1
1
CA6 (2)
1
X
0
X = Don't care
Setting theCAPD.xbit disables the output driver as well as the input to prevent parasitic cross currentswhenapplying analog signals.
Selecting the CAx input to the comparator multiplexer with the P2CAx bits automatically disables the input buffer for that pin, regardless
of the state of the associated CAPD.x bit.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P2 Pin Schematic: P2.7, Input/Output With Schmitt Trigger
BCSCTL3.LFXT1Sx = 11
P2.6/XIN/TA1
LFXT1 off
0
LFXT1CLK
From P2.6/XIN
1
Pad Logic
To Comparator
From
Comparator
CAPD.7
P2SEL.6
P2REN.7
P2DIR.7
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P2OUT.7
DVSS
P2.7/XOUT
Bus
Keeper
EN
P2SEL.7
P2IN.7
EN
Module X IN
D
P2IE.7
P2IRQ.7
EN
Q
Set
P2IFG.7
P2SEL.7
P2IES.7
Interrupt
Edge Select
Copyright © 2006–2011, Texas Instruments Incorporated
51
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Table 22. Port P2 (P2.7) Pin Functions
PIN NAME (P2.x)
P2.7/XOUT/CA7
(1)
(2)
52
x
7
FUNCTION
CONTROL BITS / SIGNALS (1)
CAPD.7
P2DIR.7
P2SEL.7
P2.7 (I/O)
0
I: 0, O: 1
0
XOUT (default)
X
1
1
CA7 (2)
1
X
0
X = Don't care
Setting theCAPD.xbit disables the output driver as well as the input to prevent parasitic cross currentswhenapplying analog signals.
Selecting the CAx input to the comparator multiplexer with the P2CAx bits automatically disables the input buffer for that pin, regardless
of the state of the associated CAPD.x bit.
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P3 Pin Schematic: P3.0 to P3.5, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
Module
direction
1
P3OUT.x
0
Module X OUT
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
1
P3.0/UCB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
P3.2/UCB0SOMI/UCB0SCL
P3.3/UCB0CLK/UCA0STE
P3.4/UCA0TXD/UCA0SIMO
P3.5/UCA0RXD/UCA0SOMI
P3SEL.x
P3IN.x
EN
Module X IN
D
Table 23. Port P3 (P3.0 to P3.5) Pin Functions
PIN NAME (P3.x)
x
P3.0/UCB0STE/
UCA0CLK
0
P3.1/UCB0SIMO/
UCB0SDA
1
P3.2/UCB0SOMI/
UCB0SCL
P3.3/UCB0CLK/
UCA0STE
P3.4/UCA0TXD/
UCA0SIMO
P3.5/UCA0RXD/
UCA0SOMI
(1)
(2)
(3)
2
3
4
5
FUNCTION
P3.0 (I/O)
UCB0STE/UCA0CLK (2)
P3.1 (I/O)
UCB0SIMO/UCB0SDA (2) (3)
P3.2 (I/O)
UCB0SOMI/UCB0SCL
(2) (3)
P3.3 (I/O)
UCB0CLK/UCA0STE (2)
P3.4 (I/O)
UCA0TXD/UCA0SIMO
(2)
P3.5 (I/O)
UCA0RXD/UCA0SOMI (2)
CONTROL BITS / SIGNALS (1)
P3DIR.x
P3SEL.x
I: 0, O: 1
0
X
1
I: 0, O: 1
0
X
1
I: 0, O: 1
0
X
1
I: 0, O: 1
0
X
1
I: 0, O: 1
0
X
1
I: 0, O: 1
0
X
1
X = Don't care
The pin direction is controlled by the USCI module.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
Copyright © 2006–2011, Texas Instruments Incorporated
53
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P3 Pin Schematic: P3.6 and P3.7, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
0
1
P3OUT.x
0
Module X OUT
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
1
P3.6
P3.7
P3SEL.x
P3IN.x
EN
Module X IN
D
Table 24. Port P3 (P3.6 and P3.7) Pin Functions
PIN NAME (P3.x)
x
FUNCTION
CONTROL BITS / SIGNALS
P3DIR.x
P3SEL.x
P3.6
6
P3.6 (I/O)
I: 0, O: 1
0
P3.7
7
P3.7 (I/O)
I: 0, O: 1
0
54
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
Port P4 Pin Schematic: P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
P4DIR.x
0
0
Module X OUT
1
0
DVCC
1
1
Direction
0: Input
1: Output
1
P4OUT.x
DVSS
P4.0/TB0
P4.1/TB1
P4.2/TB2
P4.3/TB0
P4.4/TB1
P4.5/TB2
P4.6/TBOUTH/ACLK
P4.7/TBCLK/
TBINCLK
P4SEL.x
P4IN.x
EN
Module X IN
D
Table 25. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
x
FUNCTION
P4.0 (I/O)
P4.0/TB0
0
Timer_B3.CCI0A
Timer_B3.OUT0
P4.1 (I/O)
P4.1/TB1
1
Timer_B3.CCI1A
Timer_B3.OUT1
2
3
4
5
P4.7/TBCLK
6
7
1
1
I: 0, O: 1
0
0
1
0
0
1
Timer_B3.OUT2
1
1
I: 0, O: 1
0
Timer_B3.CCI0B
0
1
Timer_B3.OUT0
1
1
I: 0, O: 1
0
Timer_B3.CCI1B
0
1
Timer_B3.OUT1
1
1
I: 0, O: 1
0
N/A
0
1
Timer_B3.OUT2
1
1
I: 0, O: 1
0
Timer_B3.TBOUTH
0
1
ACLK
1
1
I: 0, O: 1
0
0
1
P4.6 (I/O)
P4.6/TBOUTH/ACLK
1
Timer_B3.CCI2A
P4.5 (I/O)
P4.5/TB2
0
0
1
P4.4 (I/O)
P4.4/TB1
P4SEL.x
1
P4.3 (I/O)
P4.3/TB0
P4DIR.x
I: 0, O: 1
I: 0, O: 1
P4.2 (I/O)
P4.2/TB2
CONTROL BITS / SIGNALS
P4.7 (I/O)
Timer_B3.TBCLK
Copyright © 2006–2011, Texas Instruments Incorporated
55
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
JTAG Pins TMS, TCK, TDI/TCLK, TDO/TDI, Input/Output With Schmitt Trigger
TDO
Controlled by JTAG
Controlled by JTAG
JTAG
TDO/TDI
Controlled
by JTAG
DVCC
DVCC
TDI
Fuse
Burn & T est
Fuse
Test
and
Emulation
Module
TDI/TCLK
DVCC
TMS
TMS
DVCC
During Programming Activity and
During Blowing of the Fuse, Pin
TDO/TDI Is Used to Apply the T est
Input Data for JT AG Circuitry
TCK
TCK
56
Copyright © 2006–2011, Texas Instruments Incorporated
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
JTAG Fuse Check Mode
MSP430 devices that have the fuse on the TEST terminal have a fuse check mode that tests the continuity of the
fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TEST pin to ground if the fuse is not burned. Care
must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if TMS is
being held low during power up. The second positive edge on the TMS pin deactivates the fuse check mode.
After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the fuse
check mode has the potential to be activated.
The fuse check current flows only when the fuse check mode is active and the TMS pin is in a low state (see
Figure 30). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition).
Time TMS Goes Low After POR
TMS
ITF
ITEST
Figure 30. Fuse Check Mode Current
Copyright © 2006–2011, Texas Instruments Incorporated
57
MSP430F23x0
SLAS518E – AUGUST 2006 – REVISED AUGUST 2011
www.ti.com
REVISION HISTORY
LITERATURE
NUMBER
SUMMARY
SLAS518
PRODUCT PREVIEW data sheet release
SLAS518A
PRODUCTION DATA data sheet release
The USCI parameter section was revised, pages 36 to 39.
Corrected the port schematics of port P2.6 and P2.7
Added in the DSBGA package version.
SLAS518B
Corrected WDTIFG description in IFG1 register.
Corrected labels in Figure 17 and 18.
Corrected test conditions of Comparator_A+ from P1.0, P1.1 to P2.3 and P2.4.
Corrected the UART parameters.
58
SLAS518C
Release of MSP430F2330IYFF and MSP430F2350IYFF
SLAS518D
Changed Tstg, Programmed device, to -40°C to 150°C in Absolute Maximum Ratings.
SLAS518E
Changed Tstg, Programmed device, to -55°C to 150°C in Absolute Maximum Ratings.
Copyright © 2006–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
2-Apr-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
MSP430F2330IRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2330IRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2330IYFFR
ACTIVE
DSBGA
YFF
49
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2330IYFFT
ACTIVE
DSBGA
YFF
49
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2330TRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2330TRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2350IRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2350IRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2350IYFFR
ACTIVE
DSBGA
YFF
49
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2350IYFFT
ACTIVE
DSBGA
YFF
49
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2350TRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2350TRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2370IRHA
OBSOLETE
VQFN
RHA
40
MSP430F2370IRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2370IRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2370IYFFR
ACTIVE
DSBGA
YFF
49
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2370IYFFT
ACTIVE
DSBGA
YFF
49
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
MSP430F2370TRHA
OBSOLETE
VQFN
RHA
40
TBD
Call TI
TBD
Addendum-Page 1
Call TI
Samples
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
2-Apr-2012
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
MSP430F2370TRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
MSP430F2370TRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MSP430F2370IRHAR
Package Package Pins
Type Drawing
VQFN
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.3
1.1
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F2370IRHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
Pack Materials-Page 2
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