ON CAT24C64LI-T2 64 kb i2c cmos serial eeprom Datasheet

CAT24C64
64 kb I2C CMOS Serial
EEPROM
Description
The CAT24C64 is a 64 kb CMOS Serial EEPROM device,
internally organized as 8192 words of 8 bits each.
It features a 32−byte page write buffer and supports both the
Standard (100 kHz) as well as Fast (400 kHz) I2C protocol.
External address pins make it possible to address up to eight
CAT24C64 devices on the same bus.
Features
•
•
•
•
•
•
•
•
•
•
•
Supports Standard, Fast and Fast−Plus I2C Protocol
1.7 V to 5.5 V Supply Voltage Range
32−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs
(SCL and SDA)
Low Power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
PDIP, SOIC, TSSOP, MSOP 8−lead and TDFN/UDFN 8−pad
Packages
This Device is Pb−Free, Halogen Free/BFR Free, and RoHS
Compliant
http://onsemi.com
SOIC−8
X SUFFIX
CASE 751BE
SOIC−8
W SUFFIX
CASE 751BD
TDFN−8
VP2 SUFFIX
CASE 511AK
TSSOP−8
Y SUFFIX
CASE 948AL
PIN CONFIGURATION
A0
1
VCC
A1
WP
A2
SCL
VSS
SDA
PDIP (L), SOIC (W, X), TSSOP (Y),
MSOP (Z), TDFN (VP2), UDFN (HU4)
CAT24C64
A2, A1, A0
UDFN−8
HU4 SUFFIX
CASE 517AZ
PDIP−8
L SUFFIX
CASE 646AA
VCC
SCL
MSOP−8
Z SUFFIX
CASE 846AD
SDA
For the location of Pin 1, please consult the
corresponding package drawing.
WP
PIN FUNCTION
Pin Name
VSS
A0, A1, A2
Figure 1. Functional Symbol
Function
Device Address
SDA
Serial Data
SCL
Serial Clock
WP
Write Protect
VCC
Power Supply
VSS
Ground
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
July, 2010 − Rev. 14
1
Publication Order Number:
CAT24C64/D
CAT24C64
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Storage Temperature
–65 to +150
°C
Voltage on Any Pin with Respect to Ground (Note 1)
–0.5 to +6.5
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may
undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns.
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
Parameter
NEND (Note 3)
TDR
Endurance
Min
Units
1,000,000
Program/Erase Cycles
100
Years
Data Retention
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, VCC = 5 V, 25°C.
Table 3. D.C. OPERATING CHARACTERISTICS
(VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.)
Symbol
Max
Units
ICCR
Read Current
Read, fSCL = 400 kHz
1
mA
ICCW
Write Current
Write, fSCL = 400 kHz
2
mA
Standby Current
All I/O Pins at GND or VCC
TA = −40°C to +85°C
VCC ≤ 3.3 V
1
mA
TA = −40°C to +85°C
VCC > 3.3 V
3
TA = −40°C to +125°C
5
ISB
IL
Parameter
Test Conditions
I/O Pin Leakage
Min
Pin at GND or VCC
2
mA
VIL
Input Low Voltage
−0.5
VCC x 0.3
V
VIH
Input High Voltage
VCC x 0.7
VCC + 0.5
V
VOL1
Output Low Voltage
VCC < 2.5 V, IOL = 3.0 mA
0.4
V
VOL2
Output Low Voltage
VCC < 2.5 V, IOL = 1.0 mA
0.2
V
Table 4. PIN IMPEDANCE CHARACTERISTICS
(VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.)
Max
Units
CIN (Note 4)
SDA I/O Pin Capacitance
VIN = 0 V
8
pF
CIN (Note 4)
Input Capacitance (other pins)
VIN = 0 V
6
pF
IWP (Note 5)
WP Input Current
VIN < VIH, VCC = 5.5 V
130
mA
VIN < VIH, VCC = 3.3 V
120
VIN < VIH, VCC = 1.8 V
80
VIN > VIH
2
Symbol
Parameter
Conditions
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
5. When not driven, the WP pin is pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively strong;
therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power, as
the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.
http://onsemi.com
2
CAT24C64
Table 5. A.C. CHARACTERISTICS
(VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C.) (Note 6)
Standard
VCC = 1.7 V − 5.5 V
Parameter
Symbol
FSCL
tHD:STA
Max
Clock Frequency
Min
100
START Condition Hold Time
Max
Fast−Plus (Note 9)
VCC = 2.5 V − 5.5 V
TA = −405C to +855C
Min
400
Max
Units
1,000
kHz
4
0.6
0.25
ms
tLOW
Low Period of SCL Clock
4.7
1.3
0.45
ms
tHIGH
High Period of SCL Clock
4
0.6
0.40
ms
4.7
0.6
0.25
ms
tSU:STA
START Condition Setup Time
tHD:DAT
Data In Hold Time
0
0
0
ms
tSU:DAT
Data In Setup Time
250
100
50
ns
tR (Note 7)
SDA and SCL Rise Time
tF (Note 7)
SDA and SCL Fall Time
tSU:STO
STOP Condition Setup Time
tBUF
Bus Free Time Between
STOP and START
tAA
SCL Low to Data Out Valid
tDH
Data Out Hold Time
Ti (Note 7)
1,000
300
300
300
100
ns
100
ns
4
0.6
0.25
ms
4.7
1.3
0.5
ms
3.5
100
0.9
100
Noise Pulse Filtered at SCL
and SDA Inputs
100
0.40
50
100
ms
ns
100
ns
tSU:WP
WP Setup Time
0
0
0
ms
tHD:WP
WP Hold Time
2.5
2.5
1
ms
tWR
tPU (Notes 7, 8)
6.
7.
8.
9.
Min
Fast
VCC = 1.7 V − 5.5 V
Write Cycle Time
5
5
Power-up to Ready Mode
1
1
0.1
5
ms
1
ms
Test conditions according to “A.C. Test Conditions” table.
Tested initially and after a design or process change that affects this parameter.
tPU is the delay between the time VCC is stable and the device is ready to accept commands.
Fast−Plus (1 MHz) speed class available for product revision “F”. The die revision “F” is identified by letter “F” or a dedicated marking code
on top of the package.
Table 6. A.C. TEST CONDITIONS
Input Levels
0.2 x VCC to 0.8 x VCC
Input Rise and Fall Times
≤ 50 ns
Input Reference Levels
0.3 x VCC, 0.7 x VCC
Output Reference Levels
0.5 x VCC
Output Load
Current Source: IOL = 3 mA (VCC ≥ 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF
http://onsemi.com
3
CAT24C64
I2C Bus Protocol
Power-On Reset (POR)
Each CAT24C64 incorporates Power-On Reset (POR)
circuitry which protects the internal logic against powering
up in the wrong state. The device will power up into Standby
mode after VCC exceeds the POR trigger level and will
power down into Reset mode when VCC drops below the
POR trigger level. This bi-directional POR behavior
protects the device against ‘brown-out’ failure following a
temporary loss of power.
The 2-wire I2C bus consists of two lines, SCL and SDA,
connected to the VCC supply via pull-up resistors. The
Master provides the clock to the SCL line, and either the
Master or the Slaves drive the SDA line. A ‘0’ is transmitted
by pulling a line LOW and a ‘1’ by letting it stay HIGH. Data
transfer may be initiated only when the bus is not busy (see
A.C. Characteristics). During data transfer, SDA must
remain stable while SCL is HIGH.
START/STOP Condition
Pin Description
SCL: The Serial Clock input pin accepts the clock signal
generated by the Master.
SDA: The Serial Data I/O pin accepts input data and delivers
output data. In transmit mode, this pin is open drain. Data is
acquired on the positive edge, and is delivered on the
negative edge of SCL.
A0, A1 and A2: The Address inputs set the device address
that must be matched by the corresponding Slave address
bits. The Address inputs are hard-wired HIGH or LOW
allowing for up to eight devices to be used (cascaded) on the
same bus. When left floating, these pins are pulled LOW
internally.
WP: When pulled HIGH, the Write Protect input pin
inhibits all write operations. When left floating, this pin is
pulled LOW internally.
An SDA transition while SCL is HIGH creates a START
or STOP condition (Figure 2). The START consists of a
HIGH to LOW SDA transition, while SCL is HIGH. Absent
the START, a Slave will not respond to the Master. The
STOP completes all commands, and consists of a LOW to
HIGH SDA transition, while SCL is HIGH.
Device Addressing
The Master addresses a Slave by creating a START
condition and then broadcasting an 8-bit Slave address. For
the CAT24C64, the first four bits of the Slave address are set
to 1010 (Ah); the next three bits, A2, A1 and A0, must match
the logic state of the similarly named input pins. The R/W
bit tells the Slave whether the Master intends to read (1) or
write (0) data (Figure 3).
Acknowledge
During the 9th clock cycle following every byte sent to the
bus, the transmitter releases the SDA line, allowing the
receiver to respond. The receiver then either acknowledges
(ACK) by pulling SDA LOW, or does not acknowledge
(NoACK) by letting SDA stay HIGH (Figure 4). Bus timing
is illustrated in Figure 5.
Functional Description
The CAT24C64 supports the Inter-Integrated Circuit
(I2C) Bus protocol. The protocol relies on the use of a Master
device, which provides the clock and directs bus traffic, and
Slave devices which execute requests. The CAT24C64
operates as a Slave device. Both Master and Slave can
transmit or receive, but only the Master can assign those
roles.
SCL
SDA
START
CONDITION
STOP
CONDITION
Figure 2. Start/Stop Timing
1
0
1
0
A2
A1
A0
DEVICE ADDRESS
Figure 3. Slave Address Bits
http://onsemi.com
4
R/W
CAT24C64
BUS RELEASE DELAY (TRANSMITTER)
SCL FROM
MASTER
1
BUS RELEASE DELAY (RECEIVER)
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
START
ACK SETUP (≥ tSU:DAT)
ACK DELAY (≤ tAA)
Figure 4. Acknowledge Timing
tHIGH
tF
tLOW
tR
tLOW
SCL
tSU:STA
tHD:DAT
tHD:STA
tSU:DAT
tSU:STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Figure 5. Bus Timing
WRITE OPERATIONS
Byte Write
Acknowledge Polling
To write data to memory, the Master creates a START
condition on the bus and then broadcasts a Slave address
with the R/W bit set to ‘0’. The Master then sends two
address bytes and a data byte and concludes the session by
creating a STOP condition on the bus. The Slave responds
with ACK after every byte sent by the Master (Figure 6). The
STOP starts the internal Write cycle, and while this
operation is in progress (tWR), the SDA output is tri-stated
and the Slave does not acknowledge the Master (Figure 7).
As soon (and as long) as internal Write is in progress, the
Slave will not acknowledge the Master. This feature enables
the Master to immediately follow-up with a new Read or
Write request, rather than wait for the maximum specified
Write time (tWR) to elapse. Upon receiving a NoACK
response from the Slave, the Master simply repeats the
request until the Slave responds with ACK.
Hardware Write Protection
With the WP pin held HIGH, the entire memory is
protected against Write operations. If the WP pin is left
floating or is grounded, it has no impact on the Write
operation. The state of the WP pin is strobed on the last
falling edge of SCL immediately preceding the 1st data byte
(Figure 9). If the WP pin is HIGH during the strobe interval,
the Slave will not acknowledge the data byte and the Write
request will be rejected.
Page Write
The Byte Write operation can be expanded to Page Write,
by sending more than one data byte to the Slave before
issuing the STOP condition (Figure 8). Up to 32 (Note 10)
distinct data bytes can be loaded into the internal Page Write
Buffer starting at the address provided by the Master. The
page address is latched, and as long as the Master keeps
sending data, the internal byte address is incremented up to
the end of page, where it then wraps around (within the
page). New data can therefore replace data loaded earlier.
Following the STOP, data loaded during the Page Write
session will be written to memory in a single internal Write
cycle (tWR).
Delivery State
The CAT24C64 is shipped erased, i.e., all bytes are FFh.
10. CAT24C64 Rev. D (Not Recommended for New Designs)
has 64−Byte Page Write Buffer.
http://onsemi.com
5
CAT24C64
BUS ACTIVITY: S
T
A
MASTER R
T
ADDRESS
BYTE
SLAVE
ADDRESS
ADDRESS
BYTE
DATA
BYTE
a7 − a0
d7 − d0
a15 − a8
S
S
T
O
P
P
* * *
A
C
K
A
C
K
SLAVE
*a15 − a13 are don’t care bits.
A
C
K
A
C
K
Figure 6. Byte Write Sequence
SCL
SDA
8th Bit
Byte n
ACK
tWR
STOP
CONDITION
START
CONDITION
ADDRESS
Figure 7. Write Cycle Timing
BUS
ACTIVITY: S
T
A
MASTER R
T
ADDRESS
BYTE
SLAVE
ADDRESS
DATA
BYTE
n
ADDRESS
BYTE
DATA
BYTE
n+1
S
T
O
P
DATA
BYTE
n+P
P
S
A
C
K
A
C
K
A
C
K
SLAVE
A
C
K
A
C
K
Figure 8. Page Write Sequence
ADDRESS
BYTE
DATA
BYTE
1
8
a7
a0
9
1
8
d7
d0
SCL
SDA
tSU:WP
WP
tHD:WP
Figure 9. WP Timing
http://onsemi.com
6
A
C
K
A
C
K
CAT24C64
READ OPERATIONS
Immediate Read
Write sequence by sending data, the Master then creates a
START condition and broadcasts a Slave address with the
R/W bit set to ‘1’. The Slave responds with ACK after every
byte sent by the Master and then sends out data residing at
the selected address. After receiving the data, the Master
responds with NoACK and then terminates the session by
creating a STOP condition on the bus (Figure 11).
To read data from memory, the Master creates a START
condition on the bus and then broadcasts a Slave address
with the R/W bit set to ‘1’. The Slave responds with ACK
and starts shifting out data residing at the current address.
After receiving the data, the Master responds with NoACK
and terminates the session by creating a STOP condition on
the bus (Figure 10). The Slave then returns to Standby mode.
Sequential Read
Selective Read
If, after receiving data sent by the Slave, the Master
responds with ACK, then the Slave will continue
transmitting until the Master responds with NoACK
followed by STOP (Figure 12). During Sequential Read the
internal byte address is automatically incremented up to the
end of memory, where it then wraps around to the beginning
of memory.
To read data residing at a specific address, the selected
address must first be loaded into the internal address register.
This is done by starting a Byte Write sequence, whereby the
Master creates a START condition, then broadcasts a Slave
address with the R/W bit set to ‘0’ and then sends two
address bytes to the Slave. Rather than completing the Byte
BUS ACTIVITY: S
T
A
MASTER R
T
N
O
S
A T
CO
K P
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
SCL
8
SDA
DATA
BYTE
9
8th Bit
DATA OUT
NO ACK
STOP
Figure 10. Immediate Read Sequence and Timing
BUS ACTIVITY: S
T
A
MASTER R
T
ADDRESS
BYTE
SLAVE
ADDRESS
S
T
A
R
T
ADDRESS
BYTE
S
N
O
A
C
K
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
A
C
K
A
C
K
A
C
K
DATA
BYTE
Figure 11. Selective Read Sequence
N
O
A
C
K
BUS ACTIVITY:
MASTER
A
C
K
SLAVE
ADDRESS
A
C
K
A
C
K
S
T
O
P
P
SLAVE
A
C
K
DATA
BYTE
n
DATA
BYTE
n+1
DATA
BYTE
n+2
Figure 12. Sequential Read Sequence
http://onsemi.com
7
S
T
O
P
DATA
BYTE
n+x
CAT24C64
PACKAGE DIMENSIONS
MSOP 8, 3x3
CASE 846AD−01
ISSUE O
SYMBOL
MIN
NOM
MAX
1.10
A
E
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.22
0.38
c
0.13
0.23
D
2.90
3.00
3.10
E
4.80
4.90
5.00
E1
2.90
3.00
3.10
E1
0.65 BSC
e
L
0.60
0.40
L1
0.25 BSC
L2
θ
0.80
0.95 REF
0º
6º
TOP VIEW
D
A
A2
A1
DETAIL A
e
b
c
SIDE VIEW
END VIEW
q
L2
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-187.
L
L1
DETAIL A
http://onsemi.com
8
CAT24C64
PACKAGE DIMENSIONS
PDIP−8, 300 mils
CASE 646AA−01
ISSUE A
SYMBOL
MIN
NOM
A
E1
5.33
A1
0.38
A2
2.92
3.30
4.95
b
0.36
0.46
0.56
b2
1.14
1.52
1.78
c
0.20
0.25
0.36
D
9.02
9.27
10.16
E
7.62
7.87
8.25
E1
6.10
6.35
7.11
e
PIN # 1
IDENTIFICATION
MAX
2.54 BSC
eB
7.87
L
2.92
10.92
3.30
3.80
D
TOP VIEW
E
A2
A
A1
c
b2
L
e
eB
b
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MS-001.
http://onsemi.com
9
CAT24C64
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD−01
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
MAX
4.00
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
http://onsemi.com
10
CAT24C64
PACKAGE DIMENSIONS
SOIC−8, 208 mils
CASE 751BE−01
ISSUE O
SYMBOL
MIN
NOM
A
E1 E
MAX
2.03
A1
0.05
0.25
b
0.36
0.48
c
0.19
0.25
D
5.13
5.33
E
7.75
8.26
E1
5.13
5.38
e
1.27 BSC
L
0.51
0.76
θ
0º
8º
PIN#1 IDENTIFICATION
TOP VIEW
D
A
e
b
q
L
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with EIAJ EDR-7320.
http://onsemi.com
11
CAT24C64
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL−01
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.15
0.90
1.05
0.30
c
0.09
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
e
0.20
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
http://onsemi.com
12
CAT24C64
PACKAGE DIMENSIONS
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ−01
ISSUE O
D
b
A
e
L
DAP SIZE 1.8 x 1.8
E2
E
PIN #1
IDENTIFICATION
A1
PIN #1 INDEX AREA
D2
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.45
0.50
0.55
A1
0.00
0.02
0.05
A3
0.127 REF
b
0.20
0.25
0.30
D
1.95
2.00
2.05
D2
1.35
1.40
1.45
E
2.95
3.00
3.05
E2
1.25
1.30
1.35
e
L
BOTTOM VIEW
DETAIL A
0.065 REF
A3 A
FRONT VIEW
0.50 REF
0.25
0.30
0.35
A3
Notes:
(1) All dimensions are in millimeters.
(2) Refer JEDEC MO-236/MO-252.
0.0 - 0.05
DETAIL A
http://onsemi.com
13
0.065 REF
Copper Exposed
CAT24C64
PACKAGE DIMENSIONS
TDFN8, 2x3
CASE 511AK−01
ISSUE A
D
A
e
b
E2
E
PIN#1
IDENTIFICATION
A1
PIN#1 INDEX AREA
D2
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A2
0.45
0.55
0.65
A3
A2
A3
0.20
0.25
0.30
D
1.90
2.00
2.10
D2
1.30
1.40
1.50
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
L
BOTTOM VIEW
0.20 REF
b
e
FRONT VIEW
0.50 TYP
0.20
0.30
L
0.40
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
http://onsemi.com
14
CAT24C64
Example of Ordering Information
Prefix
Device #
Suffix
CAT
24C64
Y
Company ID
Product Number
24C64
I
−G
T3
Temperature Range
Lead Finish
I = Industrial (−40°C to +85°C)
E = Extended (−40°C to +125°C)
G: NiPdAu
Blank: Matte−Tin (Note 14)
Tape & Reel (Note 18)
T: Tape & Reel
2: 2,000 / Reel (Note 14)
3: 3,000 / Reel
Package
L: PDIP
W: SOIC, JEDEC
X: SOIC, EIAJ (Note 14)
Y: TSSOP
Z: MSOP (Note 15)
HU4: UDFN (2 x 3 mm)
VP2: TDFN (2 x 3 mm) (Note 16)
11. All packages are RoHS-compliant (Lead-free, Halogen-free).
12. The standard lead finish is NiPdAu on pre−plated (PPF) lead frames.
13. The device used in the above example is a CAT24C64YI−GT3 (TSSOP, Industrial Temperature, NiPdAu, Tape & Reel, 3,000/Reel).
14. For SOIC, EIAJ (X) package the standard lead finish is Matte−Tin. This package is available in 2,000/Reel, i.e., CAT24C64XI−T2.
15. For availability, please contact your nearest ON Semiconductor Sales office.
16. The TDFN 2 x 3 x 0.75 mm (VP2) package is not recommended for new designs. Please replace with UDFN 2 x 3 x 0.5 mm (HU4).
17. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office.
18. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT24C64/D