REVISION H ANY REV MADE TO THIS PRINT MUST HAVE AN UPDATED MKT PRINT NOTES: 1. USE LEAD FREE SOLDER BALLS & ASP-103597-01-B BODY FOR NON-STANDARD 19 POSITION. 2. C REPRESENTS A CRITICAL DIMENSION. 3. BURR ALLOWANCE: .0005[0.013] MAX. 4. MINIMUM PUSHOUT FORCE: .5 LB. 5. MAXIMUM ALLOWABLE BOW: .002[0.05] INCH/INCH AFTER ASSEMBLY. 6. NOTE DELETED. 7. ONE REEL MINIMUM PLATING REQUIREMENT (85,000 CONTACTS PER REEL). 8. ALL DIMS TO BE SYMMETRICAL ABOUT THE CENTERLINE WITHIN ±.001[0.03]. 9. MAXIMUM VARIATION BETWEEN SOLDERBALLS: .0025[0.064] 10. REFER TO VISUAL INSPECTION BOARD FOR SOLDERBALL APPEARANCE CHECKS. 11. THE DISTANCE FROM THE CENTER OF ANY SOLDERBALL TO THE CENTER OF ANY ADJACENT INNER PEG SHALL BE .025±.005[0.64±0.13]. 12. PARTS TO BE PACKAGED IN TAPE & REEL. 13. CONTACT TO BE FLUSH: .002 [0.05]. 14. NO FLASH ALLOWED ON THE PIN TIPS. DO NOT SCALE FROM THIS PRINT 1.732 44.00 REF 1.070 27.18 REF .970 24.64 REF C1 .900±.002 22.86±0.05 (19 POS - 1) X .050[1.27]) .320 8.13 REF .630 16.00 REF 01 19 A B C .145 3.68 REF D E .095 2.41 REF USER DIRECTION OF UN-REELING POCKET NOT DETAILED .250 6.35 5 F PACKAGING VIEW .035 0.89 REF .354 8.99 .017±.010 0.43±0.25 .308±.020 7.82±0.51 IN-PROCESS WITHOUT SOLDERBALLS 4 'B' 2 "A" SEE NOTE 13 .104 2.64 REF .134±.003 3.41±0.08 1 DETAIL 'B' SCALESEE 4 NOTE : 1 14 .139 3.54 "A" .012 0.31 (SEE NOTE 9) SECTION "A"-"A" UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. TOLERANCES ARE: ITEM NO. PART NUMBER QUANTITY MATERIAL 1 ASP-103597-01-B 1.0000 UL 94 V0, COLOR: BLACK 2 C-226-03-H 114.00 PHOS BRONZE, 521 HARD TEMPER 3 SDB-030-9653 114.00 96.5% Sn/3% Ag/.5% Cu 4 K-850-650 1.0000 POLYIMIDE FILM 5 CT-ASP1132MS .0015 CONDUCTIVE POLYMER DECIMALS .XX: .01 .XXX: .005 .XXXX: .0020 ANGLES 2 3 PROPRIETARY NOTE THIS DOCUMENT CONTAINS INFORMATION CONFIDENTIAL AND PROPRIETARY TO SAMTEC, INC. AND SHALL NOT BE REPRODUCED OR TRANSFERRED TO OTHER DOCUMENTS OR DISCLOSED TO OTHERS OR USED FOR ANY PURPOSE OTHER THAN THAT WHICH IT WAS OBTAINED WITHOUT THE EXPRESSED WRITTEN CONSENT OF SAMTEC, INC. DO NOT SCALE DRAWING SHEET SCALE: 3:1 520 PARK EAST BLVD, NEW ALBANY, IN 47150 PHONE: 812-944-6733 FAX: 812-948-5047 e-Mail [email protected] code 55322 DESCRIPTION: VITA 42 lif (LEAD FREE) SOCKET ASSEMBLY PLATING: CONTACT AREA: .000030 GOLD OVER .000050 NICKEL REMAINDER: .000003 FLASH GOLD OVER .000050 NICKEL DWG. NO. F:\DWG\MISC\MKTG\ASP-103612-04-MKT.SLDDRW BY: RRC ASP-103612-04 10/13/06 SHEET 1 OF 2 REVISION H RECOMMENDED BOARD LAYOUT .9000 22.860 19 01 A B C .2500 6.350 D E RECOMMENDED STENCIL LAYOUT F STENCIL TO BE .0060[0.152] THICK 'C' .900 22.86 NOTE: OUTER ROWS MAY NOT NEED VIAS - THIS IS LEFT TO THE DISCRETION OF THE BOARD DESIGNER. 19 .050 1.27 (TYP) 01 A B C D .250 6.35 E F .0250 0.635 .050 1.27 (TYP) .0250 0.635 (TYP) .0100 0.254 TRACE .0310 0.787 FREE OF SOLDER MASK 45° .0250 0.635 PAD PROPRIETARY NOTE .0100 0.254 VIA (PLATED) DETAIL 'C' SCALE 12 : 1 .0200 0.508 PAD THIS DOCUMENT CONTAINS INFORMATION CONFIDENTIAL AND PROPRIETARY TO SAMTEC, INC. AND SHALL NOT BE REPRODUCED OR TRANSFERRED TO OTHER DOCUMENTS OR DISCLOSED TO OTHERS OR USED FOR ANY PURPOSE OTHER THAN THAT WHICH IT WAS OBTAINED WITHOUT THE EXPRESSED WRITTEN CONSENT OF SAMTEC, INC. SHEET SCALE: 4:1 520 PARK EAST BLVD, NEW ALBANY, IN 47150 PHONE: 812-944-6733 FAX: 812-948-5047 e-Mail [email protected] code 55322 DESCRIPTION: VITA 42 lif (LEAD FREE) SOCKET ASSEMBLY DWG. NO. F:\DWG\MISC\MKTG\ASP-103612-04-MKT.SLDDRW BY: RRC ASP-103612-04 10/13/06 SHEET 2 OF 2