Cypress CY7C0430V 3.3v 64k x 18 synchronous quadportâ ¢ static ram Datasheet

30V
CY7C0430V
PRELIMINARY
3.3V 64K x 18
Synchronous QuadPort™ Static RAM
Features
• True four-ported memory cells which allow simultaneous access of the same memory location
• Synchronous Pipelined device
— 64K x 18 organization
• Pipelined output mode allows fast 133-MHz operation
• High Bandwidth up to 10 Gbps (133 MHz x 18 bits wide
x 4 ports)
• 0.25-micron CMOS for optimum speed/power
• High-speed clock to data access 4.7 ns (max.)
• 3.3V Low operating power
— Active = 750mA (maximum)
— Standby = 1mA (maximum)
• Counter wrap-around control
— Internal mask register controls counter wrap-around
•
•
•
•
•
•
•
•
•
•
•
— Counter-Interrupt flags to indicate wrap-around
Counter readback on address lines
Mask register readback on address lines
Interrupt flags for message passing
Master reset for all ports
Width and depth expansion capabilities
Dual Chip Enables on all ports for easy depth expansion
Separate upper-byte and lower-byte controls on all
ports
272-BGA package (27 mm x 27 mm 1.27 mm ball pitch)
Commercial and Industrial temperature ranges
IEEE 1149.1 JTAG boundary scan
BIST (Built In Self Test) controller
Top Level Logic Block Diagram
Port 1 Operation-Control Logic Blocks[1]
Reset
Logic
MRST
UBP1
LBP1
Port-1
Control
Logic
R/WP1
OEP1
CE0P1
TMS
JTAG
Controller
TCK
TDI
CE1P1
CLKBIST
TDO
BIST
CLKP1
18
Port 1
I/O
I/O0P1- I/O17P1
CLKP1
A0P1–A15P1
Port 4 Logic Blocks[2]
16
MKLDP1
CNTLDP1
CNTINCP1
CNTRDP1
MKRDP1
Port 1
Counter/
Mask Reg/
Address
Decode
CNTRSTP1
INTP1
CNTINTP1
Port 1
Port 4
RAM
Array
Port 2
Port 3
Port 2 Logic Blocks[2]
Port 3 Logic Blocks[2]
Notes:
1. Port 1 Control Logic Block is detailed on page 2.
2. Port 2, Port 3, and Port 4 Logic Blocks are similar to Port 1 Logic Blocks.
For the most recent information, visit the Cypress web site at www.cypress.com
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
• 408-943-2600
November 18, 1999
PRELIMINARY
CY7C0430V
Port 1 Operation-Control Logic Block Diagram:
(Address Readback is independent of CEs)
R/WP1
W
R
UBP1
CE0P1
CE1P1
LBP1
OEP1
I/O9P1–I/O17P1
I/O0P1–I/O8P1
9
Port-1
I/O
Control
9
Addr.
Read
Back
Port 1
Readback
Register
MRST
16
MKLDP1
Decision
MRST
CNTINTP1
1
RAM
Array
Decode
LBP1
UBP1
R/WP1
CE0P1
CE1P1
OEP1
CLKP1
MRST
2
2
CLKP1
Port 1
Counter/
Address
Register
rt
Po
CNTLDP1
CNTRSTP1
Logic
Port 1
Address
Port 1
Interrupt
Logic
INTP1
3
Priority
Po
rt
MKRDP1
t4
CNTRDP1
CNTINCP1
r
Po
Port 1
Mask Register
Po
rt
A0P1–A15P1
PRELIMINARY
Functional Description
CY7C0430V
internal counter for fast interleaved memory applications. A
port's burst counter is loaded with an external address when
the port's Counter Load pin (CNTLD) is asserted LOW. When
the port's Counter Increment pin (CNTINC) is asserted, the
address counter will increment on each subsequent LOW-toHIGH transition of that port's clock signal. This will read/write
one word from/into each successive address location until
CNTINC is deasserted. The counter can address the entire
memory array and will loop back to the start. Counter Reset
(CNTRST) is used to reset the burst counter. A counter-mask
register is used to control the counter wrap. The counter and
mask register operations are described in more details in the
following sections.
The CY7C0430V is a 1-Mb synchronous true four-port Static
RAM. This is a high-speed, low-power 3.3V CMOS dual-port
static RAM. Four ports are provided, permitting independent,
simultaneous access for reads from any location in memory. A
particular port can write to a certain location while other ports
are reading that location simultaneously. The result of writing
to the same location by more than one port at the same time
is undefined. Registers on control, address and data lines allow for minimal set-up and hold time.
Data is registered for decreased cycle time. Clock to data valid
tCD2 = 4.7 ns. Each port contains a burst counter on the input
address register. After externally loading the counter with the
initial address the counter will self-increment the address internally (more details to follow). The internal write pulse width
is independent of the duration of the R/W input signal. The
internal write pulse is self-timed to allow the shortest possible
cycle times.
The counter or mask register values can be read back on the
bidirectional address lines by activating MKRD or CNTRD respectively.
The new features added to the QuadPort™ as compared to
standard synchronous dual-ports include: readback of
burst-counter internal address value on address lines,
counter-mask registers to control the counter wrap-around,
readback of mask register value on address lines, interrupt
flags for message passing, BIST, JTAG for boundary scan, and
asynchronous Master Reset.
A HIGH on CE0 or LOW on CE1 for one clock cycle will power
down the internal circuitry to reduce the static power consumption. One cycle is required with chip enables asserted to reactivate the outputs.
Counter enable inputs are provided to stall the operation of the
address input and utilize the internal address generated by the
3
PRELIMINARY
CY7C0430V
Pin Configuration
272-Ball Grid Array (BGA)
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A
LB
P1
I/O17
P2
I/O15
P2
I/O13
P2
I/O11
P2
I/O9
P2
I/O16
P1
I/O14
P1
I/O12
P1
I/O10
P1
I/O10
P4
I/O12
P4
I/O14
P4
I/O16
P4
I/O9
P3
I/O11
P3
I/O13
P3
I/O15
P3
I/O17
P3
LB
P4
B
VDD1
UB
P1
I/O16
P2
I/O14
P2
I/O12
P2
I/O10
P2
I/O17
P1
I/O13
P1
I/O11
P1
TMS
TDI
I/O11
P4
I/O13
P4
I/O17
P4
I/O10
P3
I/O12
P3
I/O14
P3
I/O16
P3
UB
P4
VDD1
C
A14
P1
A15
P1
CE1
P1
CE0
P1
R/W
P1
I/O15
P1
VSS2
VSS2
I/O9
P1
TCK
TDO
I/O9
P4
VSS2
VSS2
I/O15
P4
R/W
P4
CE0
P4
CE1
P4
A15
P4
A14
P4
D
VSS1
A12
P1
A13
P1
OE
P1
VDD2
VSS2
VSS2
VDD2
VDD
VSS
VSS
VDD
VDD2
VSS2
VSS2
VDD2
OE
P4
A13
P4
A12
P4
VSS1
E
A10
P1
A11
P1
MKRD
P1
CNTRD
P1
CNTRD
P4
MKRD
P4
A11
P4
A10
P4
F
A7
P1
A8
P1
A9
P1
CNTINT
P1
CNTINT
P4
A9
P4
A8
P4
A7
P4
G
VSS1
A5
P1
A6
P1
CNTINC
P1
CNTINC
P4
A6
P4
A5
P4
VSS1
H
A3
P1
A4
P1
MKLD
P1
CNTLD
P1
CNTLD
P4
MKLD
P4
A4
P4
A3
P4
J
VDD1
A1
P1
A2
P1
VDD
GND[3]
GND[3]
GND[3]
GND[3]
VDD
A2
P4
A1
P4
VDD1
K
A0
P1
INT
P1
CNTRST
P1
CLK
P1
GND[3]
GND[3]
GND[3]
GND[3]
CLK
P4
CNTRST
P4
INT
P4
A0
P4
L
A0
P2
INT
P2
CNTRST
P2
VSS
GND[3]
GND[3]
GND[3]
GND[3]
VSS
CNTRST
P3
INT
P3
A0
P3
M
VDD1
A1
P2
A2
P2
CLK
P2
GND[3]
GND[3]
GND[3]
GND[3]
CLK
P3
A2
P3
A1
P3
VDD1
N
A3
P2
A4
P2
MKLD
P2
CNTLD
P2
CNTLD
P3
MKLD
P3
A4
P3
A3
P3
P
VSS1
A5
P2
A6
P2
CNTINC
P2
CNTINC
P3
A6
P3
A5
P3
VSS1
R
A7
P2
A8
P2
A9
P2
CNTINT
P2
CNTINT
P3
A9
P3
A8
P3
A7
P3
T
A10
P2
A11
P2
MKRD
P2
CNTRD
P2
CNTRD
P3
MKRD
P3
A11
P3
A10
P3
U
VSS1
A12
P2
A13
P2
OE
P2
VDD2
VSS2
VSS2
VDD2
VDD
VSS
VSS
VDD
VDD2
VSS2
VSS2
VDD2
OE
P3
A13
P3
A12
P3
VSS1
V
A14
P2
A15
P2
CE1
P2
CE0
P2
R/W
P2
I/O6
P2
VSS2
VSS2
I/O0
P2
NC
NC
I/O0
P3
VSS2
VSS2
I/O6
P3
R/W
P3
CE0
P3
CE1
P3
A15
P3
A14
P3
W
VDD1
UB
P2
I/O7
P1
I/O5
P1
I/O3
P1
I/O1
P1
I/O8
P2
I/O4
P2
I/O2
P2
MRST
CLKBIST
I/O2
P3
I/O4
P3
I/O8
P3
I/O1
P4
I/O3
P4
I/O5
P4
I/O7
P4
UB
P3
VDD1
Y
LB
P2
I/O8
P1
I/O6
P1
I/O4
P1
I/O2
P1
I/O0
P1
1/O7
P2
I/O5
P2
I/O3
P2
I/O1
P2
I/O1
P3
I/O3
P3
I/O5
P3
I/O7
P3
I/O0
P4
I/O2
P4
I/O4
P4
I/O6
P4
I/O8
P4
LB
P3
Note:
3. Central Leads are for thermal dissipation only. They are connected to device VSS.
4
PRELIMINARY
CY7C0430V
Selection Guide
CY7C0430V
-133
CY7C0430V
-100
fMAX2 (MHz)
133
100
Max Access Time (ns) (Clock to Data)
4.7
5.0
Max Operating Current ICC (mA)
750
600
Max Standby Current for ISB1 (mA) (All ports TTL Level)
200
150
Max Standby Current for ISB3 (mA) (All ports CMOS Level)
1.0
1.0
Pin Definitions
Port 1
Port 2
Port 3
Port 4
Description
A0P1–A15P1
A0P2–A15P2
A0P3–A15P3
A0P4–A15P4
Address Input/Output.
I/O0P1–I/O17P1
I/O0P2–I/O17P2
I/O0P3–I/O17P3
I/O0P4–I/O17P4
Data Bus Input/Output.
CLKP1
CLKP2
CLKP3
CLKP4
Clock Input. This input can be free running or strobed.
Maximum clock input rate is fMAX.
LBP1
LBP2
LBP3
LBP4
Lower Byte Select Input. Asserting this signal LOW enables read and write operations to the lower byte. For
read operations both the LB and OE signals must be asserted to drive output data on the lower byte of the data
pins.
UBP1
UBP2
UBP3
UBP4
Upper Byte Select Input. Same function as LB, but to the
upper byte.
CE0P1,CE1P1
CE0P2,CE1P2
CE0P3,CE1P3
CE0P4,CE1P4
Chip Enable Input. To select any port, both CE0 AND CE1
must be asserted to their active states (CE0 ≤ VIL and
CE1 ≥ VIH).
OEP1
OEP2
OEP3
OEP4
Output Enable Input. This signal must be asserted LOW
to enable the I/O data lines during read operations. OE
is asynchronous input.
R/WP1
R/WP2
R/WP3
R/WP4
Read/Write Enable Input. This signal is asserted LOW to
write to the dual port memory array. For read operations,
assert this pin HIGH.
MRST
Master Reset Input. This is one signal for All Ports. MRST
is an asynchronous input. Asserting MRST LOW performs all of the reset functions as described in the text. A
MRST operation is required at power-up.
CNTRSTP1
CNTRSTP2
CNTRSTP3
CNTRSTP4
Counter Reset Input. Asserting this signal LOW resets
the burst address counter of its respective port to zero.
CNTRST is second to MRST in priority with respect to
counter and mask register operations.
MKLDP1
MKLDP2
MKLDP3
MKLDP4
Mask Register Load input. Asserting this signal LOW
loads the mask register with the external address available on the address lines. MKLD operation has higher
priority over CNTLD operation.
CNTLDP1
CNTLDP2
CNTLDP3
CNTLDP4
Counter Load Input. Asserting this signal LOW loads the
burst counter with the external address present on the
address pins.
CNTINCP1
CNTINCP2
CNTINCP3
CNTINCP4
Counter Increment Input. Asserting this signal LOW increments the burst address counter of its respective port
on each rising edge of CLK.
5
PRELIMINARY
CY7C0430V
Pin Definitions (continued)
Port 1
Port 2
Port 3
Port 4
CNTRDP1
CNTRDP2
CNTRDP3
CNTRDP4
Counter Readback Input. When asserted LOW, the internal address value of the counter will be read back on the
address lines. During CNTRD operation, both CNTLD
and CNTINC must be HIGH. Counter readback operation
has higher priority over mask register readback operation. Counter readback operation is independent of port
chip enables. If address readback operation occurs with
chip enables active (CE0 = LOW, CE1 = HIGH), the data
lines (I/Os) will be three-stated. The readback timing will
be valid after one no-operation cycle plus tCD2 from the
rising edge of the next cycle.
Description
MKRDP1
MKRDP2
MKRDP3
MKRDP4
Mask Register Readback Input. When asserted LOW, the
value of the mask register will be readback on address
lines. During mask register readback operation, all
counter and MKLD inputs must be HIGH (see Counter
and Mask Register Operations truth table). Mask register
readback operation is independent of port chip enables.
If address readback operation occurs with chip enables
active (CE0 = LOW, CE1 = HIGH), the data lines (I/Os)
will be three-stated. The readback will be valid after one
no-operation cycle plus tCD2 from the rising edge of the
next cycle.
CNTINTP1
CNTINTP2
CNTINTP3
CNTINTP4
Counter Interrupt flag output. Flag is asserted LOW for
one clock cycle when the counter wraps around to location zero.
INTP1
INTP2
INTP3
INTP4
Interrupt flag output. Interrupt permits communications
between all four ports. The upper four memory locations
can be used for message passing. Example of operation:
INTP4 is asserted LOW when another port writes to the
mailbox location of Port 4. Flag is cleared when Port 4
reads the contents of its mailbox. The same operation is
applicable to Ports 1, 2, and 3.
TMS
JTAG Test Mode Select Input. It controls the advance of
JTAG TAP state machine. State machine transitions occur on the rising edge of TCK.
TCK
JTAG Test Clock Input. This can be CLK of any port or an
external clock connected to the JTAG TAP.
TDI
JTAG Test Data Input. This is the only data input. TDI
inputs will shift data serially in to the selected register.
TDO
JTAG Test Data Output. This is the only data output. TDO
transitions occur on the falling edge of TCK. TDO normally three-stated except when captured data is shifted out
of the JTAG TAP.
CLKBIST
BIST Clock Input.
GND
Thermal ground for heat dissipation.
VSS
Ground Input.
VDD
Power Input.
VSS1
Address lines ground Input.
VDD1
Address lines power Input.
VSS2
Data lines ground Input.
VDD2
Data lines power Input.
6
PRELIMINARY
CY7C0430V
DC Input Voltage ..................................... –0.5V to VCC+0.5V
Maximum Ratings
Output Current into Outputs (LOW)............................. 20 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Static Discharge Voltage ........................................... >2001V
Storage Temperature ................................ –65°C to + 150°C
Latch-Up Current ..................................................... >200 mA
Ambient Temperature with
Power Applied ............................................–55°C to + 125°C
Operating Range
Range
Ambient
Temperature
VDD
Commercial
0°C to +70°C
3.3V ± 150 mV
–40°C to +85°C
3.3V ± 150 mV
Supply Voltage to Ground Potential .............. –0.5V to + 4.6V
DC Voltage Applied to
Outputs in High Z State............................–0.5V to VCC+0.5V
Industrial
Electrical Characteristics Over the Operating Range
CY7C0430V
-133
Description
Min.
VOH
Parameter
Output HIGH Voltage
(VCC = Min., IOH = –4.0 mA)
2.4
VOL
Output LOW Voltage
(VCC = Min., IOH = +4.0 mA)
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IOZ
Output Leakage Current
ICC
Operating Current (VCC = Max.,
IOUT = 0 mA) Outputs Disabled
Indust.
Standby Current (4 Ports toggling
at TTL Levels,0 active) CE1-4 ≥
VIH, f = fMAX
Indust.
Standby Current (4 Ports toggling
at TTL Levels, 1 active) CE1 | CE2
| CE3 | CE4 < VIH, f = fMAX
Indust.
Standby Current (4 Ports CMOS
Level, 0 active) CE1-4 ≥ VIH, f = 0
Indust.
Standby Current (3 Ports CMOS
Level, 1 Port TTL active) CE1 |
CE2 | CE3 | CE4 < VIH, f = fMAX
Indust.
ISB1
ISB2
ISB3
ISB4
Typ
-100
Max
Min.
Typ
Max
Unit
2.4
V
0.4
2.0
0.4
V
2.0
V
0.8
–10
10
413
–10
750
330
0.8
V
10
µA
600
mA
Com’l.
mA
80
200
60
150
mA
Com’l.
mA
170
349
128
263
mA
Com’l.
mA
0.5
1
0.5
1
mA
µA
Com’l.
110
200
83
151
mA
Com’l.
mA
JTAG TAP Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
VOH1
Output HIGH Voltage
IOH = −4.0 mA
VOL1
Output LOW Voltage
IOL = 4.0 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IX
Input Leakage Current
Min.
Max.
Unit
2.4
V
0.4
V
2.0
GND ≤ VI ≤ VDD
–100
V
0.8
V
100
µA
Capacitance
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 3.3V
7
Max.
Unit
8
pF
8
pF
PRELIMINARY
CY7C0430V
AC Test Load
Z0 = 50Ω
R = 50Ω
Z0 = 50Ω
OUTPUT
R = 50Ω
OUTPUT
C
[4]
5 pF
VTH = 1.5V
VTH = 1.5V
(b) Three-State Delay
(a) Normal Load
1.5V
50Ω
TDO
Z0 =50Ω
C = 10 pF
3.0V
GND
10%
90%
90%
10%
GND
tF
tR
(c) TAP Load
ALL INPUT PULSES
Note:
4. Test Conditions: C = 10 pF.
8
PRELIMINARY
CY7C0430V
Switching Characteristics Over the Industrial Operating Range
CY7C0430V
–133
Parameter
Description
Min.
–100
Max.
Min.
133
Max.
Unit
100
MHz
fMAX2
Maximum Frequency
tCYC2
Clock Cycle Time
tCH2
Clock HIGH Time
3
4
ns
tCL2
Clock LOW Time
3
4
ns
tR
Clock Rise Time
2
3
ns
tF
Clock Fall Time
2
3
ns
tSA
Address Set-up Time
2.5
3
ns
tHA
Address Hold Time
0.5
0.5
ns
tSC
Chip Enable Set-up Time
2.5
3
ns
tHC
Chip Enable Hold Time
0.5
0.5
ns
tSW
R/W Set-up Time
2.5
3
ns
tHW
R/W Hold Time
0.5
0.5
ns
7.5
10
ns
tSD
Input Data Set-up Time
2.5
3
ns
tHD
Input Data Hold Time
0.5
0.5
ns
tSB
Byte Set-up Time
2.5
3
ns
tHB
Byte Hold Time
0.5
0.5
ns
tSCLD
CNTLD Set-up Time
2.5
3
ns
tHCLD
CNTLD Hold Time
0.5
0.5
ns
tSCINC
CNTINC Set-up Time
2.5
3
ns
tHCINC
CNTINC Hold Time
0.5
0.5
ns
tSCRST
CNTRST Set-up Time
2.5
3
ns
tHCRST
CNTRST Hold Time
0.5
0.5
ns
tSCRD
CNTRD Set-up Time
2.5
3
ns
tHCRD
CNTRD Hold Time
0.5
0.5
ns
tSMLD
MKLD Set-up Time
2.5
3
ns
tHMLD
MKLD Hold Time
0.5
0.5
ns
tSMRD
MKRD Set-up Time
2.5
3
ns
tHMRD
MKRD Hold Time
0.5
0.5
ns
tOE
Output Enable to Data Valid
tOLZ[5]
OE to LOW Z
1
6.5
8
tOHZ[5]
OE to HIGH Z
1
tCD2
Clock to Data Valid
tCA2
Clock to Counter Address Readback Valid
4.7
5
ns
tCM2
Clock to Mask Register readback Valid
4.7
5
ns
tDC
Data Output Hold After Clock HIGH
1
tCKHZ[6]
Clock HIGH to Output High Z
1
6.8
ns
tCKLZ[6]
Clock HIGH to Output LOW Z
1
tSINT
Clock to INT Set Time
1
tRINT
Clock to INT Reset Time
1
6.5
1
8
ns
tSCINT
Clock to CNTINT Set Time
1
6.5
1
8
ns
tRCINT
Clock to CNTINT Reset Time
1
6.5
1
8
ns
1
6
1
4.7
9
ns
7
ns
5
ns
1
4.8
1
ns
1
6.5
1
ns
ns
8
ns
PRELIMINARY
CY7C0430V
Switching Characteristics Over the Industrial Operating Range (continued)
CY7C0430V
–133
Parameter
Description
Min.
–100
Max.
Min.
Max.
Unit
Master Reset Timing
tRS
Master Reset Pulse Width
7.5
10
ns
tRSS
Master Reset Set-up Time
6.0
8.5
ns
tRSR
Master Reset Recovery Time
7.5
tRSF
Master Reset to Interrupt Flag Reset Time
6.5
8
tRScntint
Master Reset to Counter Interrupt Flag Reset Time
6.5
8
10
ns
ns
Port to Port Delays
tCCS
Clock to Clock Set-up Time
6.5
Notes:
5. This parameter is guaranteed by design, but it is not production tested.
6. Valid for both address and data outputs.
10
9
ns
PRELIMINARY
CY7C0430V
JTAG Timing and Switching Waveforms
CY7C0430V
–133
Parameter
Description
Min.
–100
Max.
Min.
10
Max.
Unit
10
MHz
fJTAG
Maximum JTAG TAP Controller Frequency
tTCYC
TCK Clock Cycle Time
tTH
TCK Clock High Time
40
40
ns
tTL
TCK Clock Low Time
40
40
ns
tTMSS
TMS Setup to TCK Clock Rise
10
10
ns
tTMSH
TMS Hold After TCK Clock Rise
10
10
ns
tTDIS
TDI Setup to TCK Clock Rise
10
10
ns
tTDIH
TDI Hold after TCK Clock Rise
10
10
ns
tTDOV
TCK Clock Low to TDO Valid
tTDOX
TCK Clock Low to TDO Invalid
100
100
20
0
tTH
Test Clock
TCK
tTCYC
tTMSS
tTMSH
Test Mode Select
TMS
tTDIS
tTDIH
Test Data-In
TDI
Test Data-Out
TDO
tTDOX
11
20
0
tTL
tTDOV
ns
ns
ns
PRELIMINARY
CY7C0430V
Switching Waveforms
Master Reset
tRS
MRST
tRSF
ALL
ADDRESS/
DATA
LINES
tRSR
tRSS
ALL
OTHER
INPUTS
INACTIVE
ACTIVE
TMS
CNTINT
INT
TDO
Read Cycle[7, 8, 9, 10, 11]
tCH2
tCYC2
tCL2
CLK
CE
tSC
tHC
tSB
tHB
tSW
tSA
tHW
tHA
tSC
tHC
LB
UB
R/W
ADDRESS
DATAOUT
An
An+1
1 Latency
An+2
An+3
tDC
tCD2
Qn
Qn+1
tOHZ
tCKLZ
Qn+2
tOLZ
OE
tOE
Notes:
7. OE is asynchronously controlled; all other inputs (excluding MRST) are synchronous to the rising clock edge.
8. CNTLD= VIL, MKLD= VIH, CNTINC = x, and MRST=CNTRST = VIH.
9. The output is disabled (high-impedance state) by CE=VIH following the next rising edge of the clock.
10. Addresses do not have to be accessed sequentially. Note 8 indicates that address is constantly loaded on the rising edge of the CLK. Numbers are for reference
only.
11. CE is internal signal. CE = VIL if CE0 = VIL and CE1 = VIH.
12
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Bank Select Read[12, 13]
tCH2
tCYC2
tCL2
CLK
tHA
tSA
ADDRESS(B1)
A0
A1
A3
A2
A4
A5
tHC
tSC
CE(B1)
tCD2
tHC
tSC
tCD2
tHA
tSA
ADDRESS(B2)
A0
tDC
A1
tCKHZ
Q3
Q1
Q0
DATAOUT(B1)
tCD2
tCKHZ
tDC
tCKLZ
A3
A2
A4
A5
tHC
tSC
CE(B2)
tSC
tCD2
tHC
DATAOUT(B2)
tCKHZ
tCD2
Q4
Q2
tCKLZ
tCKLZ
Read-to-Write-to-Read (OE = VIL)[14, 15, 16, 17]
tCH2
tCYC2
tCL2
CLK
CE
tSC
tHC
tSW
tHW
R/W
tSW
An
ADDRESS
tSA
DATAIN
tHW
An+1
An+2
An+2
An+3
An+4
tSD tHD
tHA
tCD2
tCKHZ
Dn+2
tCD2
Qn
DATAOUT
Qn+3
tCKLZ
READ
NO OPERATION
WRITE
READ
Notes:
12. In this depth expansion example, B1 represents Bank #1 and B2 is Bank #2; Each Bank consists of one Cypress Quadport device from this data sheet.
ADDRESS(B1) = ADDRESS(B2).
13. LB = UB = OE = CNTLD = VIL; MRST= CNTRST= MKLD = VIH.
14. Output state (HIGH, LOW, or High-Impedance) is determined by the previous cycle control signals.
15. LB = UB = CNTLD = VIL; MRST= CNTRST= MKLD =VIH.
16. Addresses do not have to be accessed sequentially since CNTLD= VIL constantly loads the address on the rising edge of the CLK; numbers are for reference only.
17. During “No operation,” data in memory at the selected address may be corrupted and should be rewritten to ensure data integrity.
13
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Read-to-Write-to-Read (OE Controlled)[14, 15, 16, 17]
tCH2
tCYC2
tCL2
CLK
CE
tSC
tHC
tSW tHW
R/W
tSW
tHW
An
An+1
An+2
An+3
An+4
An+5
ADDRESS
tSA
tHA
tSD tHD
Dn+2
DATAIN
Dn+3
tCD2
DATAOUT
tCD2
Qn
Qn+4
tOHZ
tCKLZ
OE
READ
Read with Address Counter Advance
tCH2
WRITE
READ
[18, 19]
tCYC2
tCL2
CLK
tSA
ADDRESS
tHA
An
tSCLD
tHCLD
CNTLD
tSCINC
tHCINC
CNTINC
tCD2
DATAOUT
Qx–1
READ
EXTERNAL
ADDRESS
Qx
Qn
Qn+1
tDC
READ WITH COUNTER
COUNTER HOLD
Notes:
18. CE0 = OE = LB = UB = VIL; CE1 = R/W = CNTRST = MRST = MKLD = MKRD = CNTRD = VIH.
19. The “Internal Address” is equal to the “External Address” when CNTLD= VIL.
14
Qn+2
Qn+3
READ WITH COUNTER
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Write with Address Counter Advance [19, 20]
tCH2
tCYC2
tCL2
CLK
tSA
tHA
An
ADDRESS
INTERNAL
ADDRESS
An
tSAD
tHAD
tSCN
tHCN
An+1
An+2
An+3
An+4
CNTLD
CNTINC
Dn
DATAIN
tSD
tHD
WRITE EXTERNAL
ADDRESS
Dn+1
Dn+1
WRITE WITH
COUNTER
Dn+2
WRITE COUNTER
HOLD
Note:
20. CE0 = LB = UB = R/W = VIL; CE1 = CNTRST = MRST = MKLD = MKRD = CNTRD = VIH.
15
Dn+3
Dn+4
WRITE WITH COUNTER
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Counter Reset [16, 21, 22]
tCH2
tCYC2
tCL2
CLK
tSA
An
ADDRESS
INTERNAL
ADDRESS
tHA
AX
A0
tSW
An+1
A1
An
An+1
tHW
R/W
tHCLD
tSCLD
CNTLD
CNTINC
tSCRST
CNTRST
tHCRST
tSD
DATAIN
tHD
D0
DATAOUT
Q0
COUNTER
RESET
WRITE
ADDRESS 0
READ
ADDRESS 0
READ
ADDRESS 1
Notes:
21. CE0 = LB = UB = VIL; CE1 = MRST = MKLD = MKRD = CNTRD = VIH.
22. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset.
16
Q1
READ
ADDRESS n
Qn
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Load and Read Address Counter[23]
tCH2
tCYC2
tCL2
Note 24
Note 25
CLK
tHA
tSA
A0-A15
tCKLZ
tCA2
tCKHZ
[26]
An
tSCLD
An+2
tHCLD
CNTLD
CNTINC
tSCINC
tHCINC
tSCRD
tHCRD
CNTRD
INTERNAL
ADDRESS
An
An+1
Qx–1
Qx
LOAD
EXTERNAL
ADDRESS
An+2
An+2
tDC
tCD2
DATAOUT
An+2
tCKHZ
Qn
Qn+1
READ DATA WITH COUNTER
Notes:
23. CE0 = OE = LB = UB = VIL; CE1 = R/W = CNTRST = MRST = MKLD = MKRD = VIH.
24. Address in output mode. Host must not be driving address bus after time tCKLZ in next clock cycle.
25. Address in input mode. Host can drive address bus after tCKHZ.
26. This is the value of the address counter being read out on the address lines.
17
Qn+2
tCKLZ
Qn+2
READ
INTERNAL
ADDRESS
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Load and Read Mask Register [27]
tCH2
tCYC2
tCL2
Note 24
Note 25
CLK
tHA
tSA
A0-A15
tCKLZ
tCA2
tCKHZ
An [28]
An
tSMLD
tHMLD
MKLD
tSMRD
tHMRD
MKRD
MASK
INTERNAL
VALUE
An
An
An
An
An
READ
MASK-REGISTER
VALUE
LOAD
MASK REGISTER
VALUE
Notes:
27. CE0 = OE = LB = UB = VIL; CE1 = R/W = CNTRST = MRST = CNTLD = CNTRD = CNTINC =VIH.
28. This is the value of the Mask Register read out on the address lines.
18
An+2
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Port 1 Write to Port 2 Read[29, 30, 31]
tCH2
tCYC2
tCL2
CLKP1
tHA
tSA
PORT-1
ADDRESS
An
tSW
tHW
R/WP1
tCKHZ
tSD
PORT-1
DATAIN
CLKP2
tHD
tCKLZ
Dn
tCYC2
tCL2
tCCS
tCH2
tSA
PORT-2
ADDRESS
tHA
An
R/WP2
tCD2
PORT-2
Qn
DATAOUT
tDC
Notes:
29. CE0 = OE = LB = UB = CNTLD =VIL; CE1 = CNTRST = MRST = MKLD = MKRD = CNTRD = CNTINC =VIH.
30. This timing is valid when one port is writing, and one or more of the three other ports is reading the same location at the same time. If tCCS is violated, indeterminate
data will be read out.
31. If tCCS< minimum specified value, then Port 2 will read the most recent data (written by Port 1) only (2*tCYC2 + tCD2) after the rising edge of Port 2's clock. If tCCS
> minimum specified value, then Port 2 will read the most recent data (written by Port 1) (tCYC2 + tCD2) after the rising edge of Port 2's clock.
19
PRELIMINARY
CY7C0430V
Switching Waveforms (continued)
Counter Interrupt [32, 33, 34]
tCH2
tCYC2
tCL2
CLK
EXTERNAL
ADDRESS
007Fh
xx7Dh
tSMLD
tHMLD
MKLD
tSCLD
tHCLD
CNTLD
tHCINC
tSCINC
CNTINC
COUNTER
INTERNAL
ADDRESS
xx7Dh
An
xx7Eh
xx7Fh
xx00h
xx00h
tSCINT
CNTINT
tRCINT
Mailbox Interrupt Timing[35, 36, 37, 38, 39]
tCH2
tCYC2
tCL2
CLK P1
tSA
PORT-1
ADDRESS
tHA
An+1
An
FFFE
An+2
An+3
tSINT
tRINT
INTP2
tCH2
tCYC2
tCL2
CLKP2
tSA
PORT-2
ADDRESS
Am
tHA
FFFE
Am+1
Am+3
Notes:
32. CE0 = OE = LB = UB = VIL; CE1 = R/W = CNTRST = MRST = CNTRD = MKRD = VIH.
33. CNTINT is always driven.
34. CNTINC goes LOW as the counter address masked portion is incremented from xx7Fh to xx00h. The “x” is “don’t care.”
35. CE0 = OE = LB = UB = CNTLD =VIL; CE1 = CNTRST = MRST = CNTRD = CNTINC = MKRD = MKLD =VIH.
36. Address “FFFE” is the mailbox location for Port 2.
37. Port 1 is configured for Write operation, and Port 2 is configured for Read operation.
38. Port 1 and Port 2 are used for simplicity. All four ports can write to or read from any mailbox.
39. Interrupt flag is set with respect to the rising edge of the write clock, and is reset with respect to the rising edge of the read clock.
20
Am+4
PRELIMINARY
CY7C0430V
Table 1. Read/Write and Enable Operation (Any Port)[40, 41, 42]
Inputs
Outputs
CE0
CE1
R/W
I/O0–I/O17
X
H
X
X
High-Z
Deselected
X
X
L
X
High-Z
Deselected
X
L
H
L
DIN
Write
L
L
H
H
DOUT
Read
L
H
X
High-Z
OE
CLK
H
X
Operation
Outputs Disabled
Table 2. Address Counter and Counter-Mask Register Control Operation (Any Port)[40, 43, 44]
CLK MRST CNTRST MKLD CNTLD CNTINC CNTRD MKRD
X
Mode
Operation
Counter/Address Register Reset and Mask
Register Set (resets entire chip as per reset
state table)
L
X
X
X
X
X
X
MasterReset
H
L
X
X
X
X
X
Reset
Counter/Address Register Reset
H
H
L
X
X
X
X
Load
Load of Address Lines into Mask Register
H
H
H
L
X
X
X
Load
Load of Address Lines into Counter/Address
Register
H
H
H
H
L
X
X
Increment
Counter Increment
H
H
H
H
H
L
X
Readback
Readback Counter on Address Lines
H
H
H
H
H
H
L
Readback
Readback Mask Register on Address Lines
H
H
H
H
H
H
H
Hold
Notes:
40. “X” = “don’t care,” “H” = VIH, “L” = VIL.
41. OE is an asynchronous input signal.
42. When CE changes state, deselection and read happen after one cycle of latency.
43. CE0 = OE = VIL; CE1 = R/W = VIH.
44. Counter operation and mask register operation is independent of Chip Enables.
21
Counter Hold
PRELIMINARY
CY7C0430V
for Port 1, FFFE is the mailbox for Port 2, FFFD is the mailbox
for Port 3, and FFFC is the mailbox for Port 4. Table 3 shows
that in order to set Port 1 INTP1 flag, a write by any other port
to address FFFF will assert INTP1 LOW. A read of FFFF location by Port 1 will reset INTP1 HIGH. When one port writes to
the other port’s mailbox, the Interrupt flag (INT) of the port that
the mailbox belongs to is asserted LOW. The Interrupt is reset
when the owner (port) of the mailbox reads the contents of the
mailbox. The interrupt flag is set in a flow-through mode (i.e.,
it follows the clock edge of the writing port). Also, the flag is
reset in a flow-through mode (i.e., it follows the clock edge of
the reading port).
Master Reset
The QuadPort undergoes a complete reset by taking its Master Reset (MRST) input LOW. The Master Reset input can
switch asynchronously to the clocks. A Master Reset initializes
the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). A Master Reset also
forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH, resets the BIST controller, and
takes all registered control signals to a deselected read
state[45]. A Master Reset must be performed on the QuadPort
after power-up.
Each port can read the other port’s mailbox without resetting
the interrupt. If an application does not require message passing, INT pins should be treated as no-connect and should be
left floating. When two ports or more write to the same mailbox
at the same time INT will be asserted but the contents of the
mailbox are not guaranteed to be valid.
Interrupts
The upper four memory locations may be used for message
passing and permit communications between ports. Table 3
shows the interrupt operation for all ports. For the 1-Meg
QuadPort, the highest memory location FFFF is the mailbox
Table 3. Interrupt Operation Example
Port 1
Function
Port 2
Port 3
Port 4
A0P1–15P1
INTP1
A0P2–15P2
INTP2
A0P3–15P3
INTP3
A0P4–15P4
INTP4
X
L
FFFF
X
FFFF
X
FFFF
X
Reset Port 1 INTP1 Flag
FFFF
H
X
X
X
X
X
X
Set Port 2 INTP2 Flag
FFFE
X
X
L
FFFE
X
FFFE
X
X
X
FFFE
H
X
X
X
X
FFFD
X
FFFD
X
X
L
FFFD
X
X
X
X
X
FFFD
H
X
X
FFFC
X
FFFC
X
FFFC
X
X
L
X
X
X
X
X
X
FFFC
H
Set Port 1 INTP1 Flag
Reset Port 2 INTP2 Flag
Set Port 3 INTP3 Flag
Reset Port 3 INTP3 Flag
Set Port 4 INTP4 Flag
Reset Port 4 INTP4 Flag
Note:
45. During Master Reset the control signals will be set to a deselected read state: CE0I = LBI = UBI = R/WI = MKLDI = MKRDI = CNTRDI = CNTRSTI = CNTLDI =
CNTINCI = VIH; CE1I = VIL. The “I” suffix on all these signals denotes that these are the internal registered equivalent of the associated pin signals.
22
PRELIMINARY
vides a block diagram of the readback operation. Table 2 lists
control signals required for counter operations. The signals are
listed based on their priority. For example, master reset takes
precedence over counter reset, and counter load has lower
priority than mask register load (described below). All counter
operations are independent of Chip Enables (CE0 and CE1).
When the address readback operation is performed the data
I/Os are three-stated (if CEs are active) and one-clock cycle
(no-operation cycle) latency is experienced. The address will
be read at time tCA2 from the rising edge of the clock following
the no-operation cycle. The read back address can be either
of the burst counter or the mask register based on the levels
of Counter Read signal (CNTRD) and Mask Register Read
signal (MKRD). Both signals are synchronized to the port's
clock as shown in Table 2. Counter read has a higher priority
than mask read.
Address Counter Control Operations
Counter enable inputs are provided to stall the operation of the
address input and utilize the internal address generated by the
internal counter for the fast interleaved memory applications.
A port’s burst counter is loaded with the port’s Counter Load
pin (CNTLD). When the port’s Counter Increment (CNTINC) is
asserted, the address counter will increment on each LOW to
HIGH transition of that port’s clock signal. This will read/write
one word from/into each successive address location until
CNTINC is deasserted. Depending on the mask register state,
the counter can address the entire memory array and will loop
back to start. Counter Reset (CNTRST) is used to reset the
Burst Counter (the Mask Register value is unaffected). When
using the counter in readback mode, the internal address value of the counter will be read back on the address lines when
Counter Readback Signal (CNTRD) is asserted. Figure 1 pro-
Read back
Register
CNTRD
MKRD
CY7C0430V
Addr.
Read
Back
MKLD = 1
Mask
Register
Bidirectional
Address Lines
CNTINC = 1
Counter/
Address
Register
CNTLD = 1
CNTRST = 1
CLK
Figure 1. Counter and Mask Register Read Back on Address Lines
23
Memory
Array
PRELIMINARY
CY7C0430V
Counter-Mask Register
Example:
Load
Counter-Mask
Register = 3F
CNTINT
H
0
0
0’s
215 214
H
X X
X’s
215 214
Max
Address
Register
H
X X
L
1
1
1
1
Mask
Register
bit-0
Counter Address
X 0
0
1
0
0
0
26 25 24 23 22 21 20
X’s
215 214
Max + 1
Address
Register
1
26 25 24 23 22 21 20
Blocked Address
Load
Address
Counter = 8
0 1
X 1 1
1
1
1
Address
Counter
bit-0
1
26 25 24 23 22 21 20
X X
X’s
215 214
X 0
0
0
0 0
0
26 25 24 23 22 21 20
Figure 2. Programmable Counter-Mask Register Operation[46]
Note:
46. The “X” in this diagram represents the counter upper-bits.
The burst counter has a mask register that controls when and
where the counter wraps. An interrupt flag (CNTINT) is asserted for one clock cycle when the unmasked portion of the
counter address wraps around from all ones (CNTINC must be
asserted) to all zeros. The example in Figure 2 shows the
counter mask register loaded with a mask value of 003F unmasking the first 6 bits with bit “0” as the LSB and bit “15” as
the MSB. The maximum value the mask register can be loaded
with is FFFF. Setting the mask register to this value allows the
counter to access the entire memory space. The address
counter is then loaded with an initial value of XXX8. The
“blocked” addresses (in this case, the 6th address through the
15th address) are loaded with an address but do not increment
once loaded. The counter address will start at address XXX8.
With CNTINC asserted LOW, the counter will increment its
internal address value till it reaches the mask register value of
3F and wraps around the memory block to location XXX0.
Therefore, the counter uses the mask-register to define
wrap-around point. The mask register of every port is loaded
when MKLD (mask register load) for that port is LOW. When
MKRD is LOW, the value of the mask register can be read out
on address lines in a manner similar to counter read back operation (see Table 2 for required conditions).
will increment by two and the address values are even. If the
loaded value for address counter bit 0 is “1,” the counter will
increment by two and the address values are odd. This operations allows the user to achieve a 36-bit interface using any
two ports, where the counter of one port counts even addresses and the counter of the other port counts odd addresses.
This even-odd address scheme stores one half of the 36-bit
word in even memory locations, and the other half in odd memory locations. CNTINT will be asserted when the unmasked
portion of the counter wraps to all zeros. Loading mask register bit 0 with “1” allows the counter to increment the address
value sequentially.
Table 2 groups the operations of the mask register with the
operations of the address counter. Address counter and mask
register signals are all synchronized to the port's clock CLK.
Master reset (MRST) is the only asynchronous signal listed on
Table 2. Signals are listed based on their priority going from
left column to right column with MRST being the highest. A
LOW on MRST will reset both counter register to all zeros and
mask register to all ones. On the other hand, a LOW on
CNTRST will only clear the address counter register to zeros
and the mask register will remain intact.
There are four operations for the counter and mask register:
When the burst counter is loaded with an address higher than
the mask register value, the higher addresses will form the
masked portion of the counter address and are called blocked
addresses. The blocked addresses will not be changed or affected by the counter increment operation. The only exception
is mask register bit 0. It can be masked to allow the address
counter to increment by two. If the mask register bit 0 is loaded
with a logic value of “0,” then address counter bit 0 is masked
and can not be changed during counter increment operation.
If the loaded value for address counter bit 0 is “0,” the counter
1. Load operation: When CNTLD or MKLD is LOW, the address counter or the mask register is loaded with the address value presented at the address lines. This value ranges from 0 to FFFF (64K). The mask register load operation
has a higher priority over the address counter load operation.
2. Increment: Once the address counter is loaded with an external address, the counter can internally increment the address value by asserting CNTINC LOW. The counter can
24
PRELIMINARY
address the entire memory array (depend on the value of
the mask register) and loop back to location 0. The increment operation is second in priority to load operation.
CY7C0430V
Test Data-In (TDI)
The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers.
The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
3. Readback: the internal value of either the burst counter or
the mask register can be read out on the address lines when
CNTRD or MKRD is LOW. Counter readback has higher
priority over mask register readback. A no-operation delay
cycle is experienced when readback operation is performed. The address will be valid after tCA2 (for counter
readback) or tCM2 (for mask readback) from the following
port's clock rising edge. Address readback operation is independent of the port's chip enables (CE0 and CE1). If address readback occurs while the port is enabled (chip enables active), the data lines (I/Os) will be three-stated.
Test Data Out (TDO)
The TDO output pin is used to serially clock data-out from the
registers. The output is active depending upon the current
state of the TAP state machine (see TAP Controller State Diagram (FSM)). The output changes on the falling edge of TCK.
TDO is connected to the least significant bit (LSB) of any register.
4. Hold operation: In order to hold the value of the address
counter at certain address, all signals in Table 2 have to be
HIGH. This operation has the least priority. This operation
is useful in many applications where wait states are needed
or when address is available few cycles ahead of data.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
QuadPort and may be performed while the device is operating.
At power-up, the TAP is reset internally to ensure that TDO
comes up in a high-Z state.
The counter and mask register operations are totally independent of port chip enables.
IEEE 1149.1 Serial Boundary Scan (JTAG) and
Memory Built-In-Self-Test (MBIST)
TAP Registers
The CY7C0430V incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE
Standard 1149.1-1900. Note that the TAP controller functions
in a manner that does not conflict with the operation of other
devices using 1149.1 fully compliant TAPs. The TAP operates
using JEDEC standard 3.3V I/O logic levels. It is composed of
three input connections and one output connection required by
the test logic defined by the standard. Memory BIST circuitry
will also be controlled through the TAP interface. All MBIST
instructions are compliant to the JTAG standard. An external
clock (CLKBIST) is provided to allow the user to run BIST at
speeds higher than 100 MHz. CLKBIST is multiplexed internally with the ports clocks during BIST operation.
Registers are connected between the TDI and TDO pins and
allow data to be scanned into and out of the QuadPort test
circuitry. Only one register can be selected at a time through
the instruction registers. Data is serially loaded into the TDI pin
on the rising edge of TCK. Data is output on the TDO pin on
the falling edge of TCK.
Instruction Register
Four-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the
TDI and TDO pins as shown in the following JTAG/BIST Controller diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the
IDCODE instruction if the controller is placed in a reset state
as described in the previous section.
Disabling the JTAG Feature
It is possible to operate the QuadPort without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO
should be left unconnected. CLKBIST must be tied LOW to
disable the MBIST. Upon power-up, the device will come up in
a reset state which will not interfere with the operation of the
device.
When the TAP controller is in the CaptureIR state, the two least
significant bits are loaded with a binary “01” pattern to allow for
fault isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain devices. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This allows data to be shifted through the
QuadPort with minimal delay. The bypass register is set LOW
(VSS) when the BYPASS instruction is executed.
Test Access Port (TAP) - Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs
are captured on the rising edge of TCK. All outputs are driven
from the falling edge of TCK.
Boundary Scan Register
The boundary scan register is connected to all the input and
output pins on the QuadPort. The boundary scan register is
loaded with the contents of the QP Input and Output ring when
the TAP controller is in the Capture-DR state and is then
placed between the TDI and TDO pins when the controller is
moved to the Shift-DR state. The EXTEST, and SAMPLE/PRELOAD instructions can be used to capture the contents of the Input and Output ring.
Test Mode Select
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to
leave this pin unconnected if the TAP is not used. The pin is
pulled up internally, resulting in a logic HIGH level.
25
PRELIMINARY
CY7C0430V
but there is no guarantee as to the value that will be captured.
Repeatable results may not be possible.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired
into the QuadPort and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor
code and other information described in the Identification Register Definitions table.
To guarantee that the boundary scan register will capture the
correct value of a signal, the QuadPort signal must be stabilized long enough to meet the TAP controller's capture set-up
plus hold times. Once the data is captured, it is possible to shift
out the data by putting the TAP into the Shift-DR state. This
places the boundary scan register between the TDI and TDO
pins. If the TAP controller goes into the Update-DR state, the
sampled data will be updated.
TAP Instruction Set
Sixteen different instructions are possible with the 4-bit instruction register. All combinations are listed in Table 6, Instruction
Codes. Seven of these instructions (codes) are listed as RESERVED and should not be used. The other nine instructions
are described in detail below.
BYPASS
When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary
scan path when multiple devices are connected together on a
board.
The TAP controller used in this QuadPort is fully compliant to
the 1149.1 convention. The TAP controller can be used to load
address, data or control signals into the QuadPort and can
preload the Input or output buffers. The QuadPort implements
all of the 1149.1 instructions except INTEST. Table 6 lists all
instructions.
CLAMP
The optional CLAMP instruction allows the state of the signals
driven from QuadPort pins to be determined from the boundary-scan register while the BYPASS register is selected as the
serial path between TDI and TDO. CLAMP controls boundary
cells to 1 or 0.
Instructions are loaded into the TAP controller during the
Shift-IR state when the instruction register is placed between
TDI and TDO. During this state, instructions are shifted
through the instruction register through the TDI and TDO pins.
To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state.
RUNBIST
RUNBIST instruction provides the user with a means of running a user-accessible self-test function within the QuadPort
as a result of a single instruction. This permits all components
on a board that offer the RUNBIST instruction to execute their
self-tests concurrently, providing a quick check for the board.
The QuadPort MBIST provides two modes of operation once
the TAP controller is loaded with the RUNBIST instruction:
EXTEST
EXTEST is a mandatory 1149.1 instruction which is to be executed whenever the instruction register is loaded with all 0s. EXTEST allows circuitry external to the QuadPort package to be
tested. Boundary-scan register cells at output pins are used to
apply test stimuli, while those at input pins capture test results.
Non-Debug Mode (Go-NoGo)
IDCODE
The non-debug mode is a go-nogo test used simply to run
BIST and obtain pass-fail information after the test is run. In
addition to that, the total number of failures encountered can
be obtained. This information is used to aid the debug mode
(explained next) of operation. The pass-fail information and
failure count is scanned out using the JTAG interface. An
MBIST Result Register (MRR) will be used to store the
pass-fail results. The MRR is a 25-bit register that will be connected between TDI and TDO during the internal scan
(INT_SCAN) operation. The MRR will contain the total number
of fail read cycles of the entire MBIST sequence. MRR[0] (bit
0) is the Pass/Fail bit. A “1” indicates some type of failure occurred, and a “0” indicates entire memory pass.
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO pins and allows
the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is
loaded into the instruction register upon power-up or whenever
the TAP controller is given a test logic reset state.
High-Z
The High-Z instruction causes the boundary scan register to
be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. It also places all QuadPort
outputs into a High-Z state.
In order to run BIST in non-debug mode, the 2-bit MBIST Control Register (MCR) is loaded with the default value “00”, and
the TAP controller’s finite state machine (FSM), which is synchronous to TCK, transitions to Run Test/Idle state. The entire
MBIST test will be performed with a deterministic number of
TCK cycles depending on the TCK and CLKBIST frequency.
SAMPLE / PRELOAD
SAMPLE / PRELOAD is a 1149.1 mandatory instruction.
When the SAMPLE / PRELOAD instructions loaded into the
instruction register and the TAP controller in the Capture-DR
state, a snapshot of data on the inputs and output pins is captured in the boundary scan register.
tCYC [ CLKBIST ]
t CYC = -------------------------------------------- × m + SPC
t CYC [ TCK ]
The user must be aware that the TAP controller clock can only
operate at a frequency up to 10 MHz, while the QuadPort clock
operates more than an order of magnitude faster. Because
there is a large difference in the clock frequencies, it is possible
that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while
in transition (metastable state). This will not harm the device,
tCYC is total number of TCK cycles required to run MBIST.
SPC is the Synchronization Padding Cycles (4–6 cycles)
m is a constant represents the number of read and write operations required to run MBIST algorithms (31,195,136).
26
PRELIMINARY
CY7C0430V
Once the entire MBIST sequence is completed, supplying extra TCK or CLKBIST cycles will have no effect on the MBIST
controller state or the pass-fail status.
be scanned out at the end of the BIST operations. If the value
is “0” then BIST must be repeated to capture the next failing
packet. If it is “1,” it means that the last failing packets have
been scanned out. A trailer similar to the header represents
the end of a packet.
Debug Mode
With the RUNBIST instruction loaded and the MCR loaded
with the value of “01”, and the FSM transitions to
RUN_TEST/IDLE state, the MBIST goes into RUNBIST-debug
mode. The debug mode will be used to provide complete failure analysis information at the board level. It is recommended
that the user runs the non-debug mode first and then the debug mode in order to save test time and to set an upper bound
on the number of scan outs that will be needed. The failure
data will be scanned out automatically once a failure occurs
using the JTAG TAP interface. The failure data will be represented by a 100-bit packet given below. The 100-bit Memory
debug Register (MDR) will be connected between TDI and
TDO, and will be shifted out on TDO, which is synchronized to
TCK.
MCR_SCAN
This instruction will connect the Memory BIST Control Register (MCR) between TDI and TDO. The default value (upon
master reset) is “00”. Shift_DR state will allow modifying the
MCR to extend the MBIST functionality.
MBIST Control States
Thirty-five states are listed in Table 7. Four data algorithms are
used in debug mode: moving inversion (MIA), march_2 (M2A),
checkerboard (CBA), and unique address algorithm (UAA).
Only Port 1 can write MIA, M2A, and CBA data to the memory.
All four ports can read any algorithm data from the QP memory. Ports 2, 3, and 4 will only write UAA data.
Figure 3 is a representation of the 100-bit MDR packet. The
packet follows a 2-bit header that has a logic “1” value, and
represents two TCK cycles. MDR[97:26] represent the BIST
comparator values of all four ports (each port has 18 data
lines). A value of “1” indicates a bit failure. The scanned out
data is from MSB to LSB. MDR[25:10] represent the failing
address (MSB to LSB). The state of the BIST controller is
scanned out using MDR[9:4]. Bit 2 is the Test Done bit. A “0”
in bit 2 means test not complete. The user has to monitor this
bit at every packet to determine if more failure packets need to
99
1
Boundary Scan Cells (BSC)
Table 9 lists all QuadPort I/Os with their associated BSC. Notice that the cells have even numbers. Every I/O has two
boundary scan cells. Bidirectional signals (address lines, datalines) require two cells so that one (the odd cell) is used to
control a three-state buffer. Input only and output only signals
have an extra dummy cell (odd cells) that are used to ease
device layout.
98
1
62
97
P4_IO(17-9)
P3_IO(17-9)
P2_IO(17-9)
P1_IO(17-9)
61
P4_IO(8-0)
P3_IO(8-0)
P2_IO(8-0)
P1_IO(8-0)
25
26
10
A(15-0)
9
MBIST_State
4
3
P/F
2
TD
1
0
1
1
Figure 3. MBIST Debug Register Packet
27
PRELIMINARY
CY7C0430V
TAP Controller State Diagram (FSM)[47]
1
TEST-LOGIC
RESET
0
0
RUN_TEST/
IDLE
1
1
1
SELECT
DR-SCAN
SELECT
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
0
SHIFT-DR
0
SHIFT-IR
1
1
1
EXIT1-DR
1
EXIT1-IR
0
0
PAUSE-DR
0
0
PAUSE-IR
1
1
0
0
EXIT2-DR
EXIT2-IR
1
1
UPDATE-DR
1
0
Note:
47. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
28
UPDATE-IR
1
0
PRELIMINARY
CY7C0430V
JTAG/BIST TAP Controller Block Diagram
0
Bypass Register (BYR)
1
0
MBIST Control Register (MCR)
3 2
1
0
Instruction Register (IR)
24 23
0
MBIST Result Register (MRR)
TDI
31 30 29
Selection
Circuitry
TDO
0
Identification Register (IDR)
99
(MUX)
0
MBIST Debug Register (MDR)
391
0
Boundary Scan Register (BSR)
BIST
CONTROLLER
TAP
CONTROLLER
CLKBIST
TCK
TMS
MRST
MEMORY
CELL
29
PRELIMINARY
CY7C0430V
JTAG Timing Waveform
tTH
tTL
Test Clock
TCK
tTCYC
tTMSS
tTMSH
Test Mode Select
TMS
tTDIS
tTDIH
Test Data-In
TDI
Test Data-Out
TDO
tTDOX
tTDOV
Table 4. Identification Register Definitions
Instruction Field
Value
Description
Revision Number
(31:28)
0h
Reserved for version number
Cypress Device ID
(27:12)
C000h
Defines Cypress part number
Cypress JEDEC ID
(11:1)
34h
Allows unique identification of QuadPort vendor
ID Register Presence
(0)
1
Indicate the presence of an ID register
30
PRELIMINARY
CY7C0430V
Table 5. Scan Registers Sizes
Register Name
Bit Size
Instruction (IR)
4
Bypass (BYR)
1
Identification (IDR)
32
MBIST Control (MCR)
2
MBIST Result (MRR)
25
MBIST Debug (MDR)
100
Boundary Scan (BSR)
392
Table 6. Instruction Identification Codes
Instruction
Code
Description
EXTEST
0000
Captures the Input/Output ring contents. Places the boundary scan register
(BSR) between the TDI and TDO.
BYPASS
1111
Places the bypass register (BYR) between TDI and TDO.
IDCODE
0111
Loads the ID register (IDR) with the vendor ID code and places the register
between TDI and TDO.
HIGHZ
0110
Places the boundary scan register between TDI and TDO. Forces all QuadPort output drivers to a High-Z state. Uses BYR.
CLAMP
0101
Controls boundary to 1/0. Uses BYR.
SAMPLE/PRELOAD
0001
Captures the Input/Output ring contents. Places the boundary scan register
(BSR) between TDI and TDO.
RUNBIST
1000
Invokes MBIST. Places the MBIST Debug register (MDR) between TDI and
TDO.
INT_SCAN
0010
Scans out pass-fail information. Places MBIST Result Register (MRR) between TDI and TDO.
MCR_SCAN
0011
Presets RUNBIST mode. Places MBIST Control Register (MCR) between
TDI and TDO.
RESERVED
All other codes
Seven combinations are reserved. Do not use other than the above.
Table 7. MBIST Control States
States Code
State Name
Description
000001
movi_zeros
Port 1 write all zeros to the QP memory using Moving Inversion Algorithm
(MIA).
000011
movi_1_upcnt
Up count from 0 to 64K (depth of QP). All ports read 0s, then Port 1 writes 1s
to all memory locations using MIA, then all ports read 1s. MIA
read0_write1_read1 (MIA_r0w1r1).
000010
movi_0_upcnt
Up count from 0 to 64K. All ports read 1s, then Port 1 writes 0s, then all ports
read 0s (MIA_r1w0r0).
000110
movi_1_downcnt
Down count from 64K to 0. MIA_r0w1r1.
000111
movi_0_downcnt
Down count MIA_r1w0r0.
000101
movi_read
Read all 0s.
000100
mar2_zeros
Port 1 write all zeros to memory using March2 Algorithm (M2A).
001100
mar2_1_upcnt
Up count M2A_r0w1r1.
31
PRELIMINARY
CY7C0430V
Table 7. MBIST Control States
States Code
State Name
Description
001101
mar2_0_upcnt
Up count M2A_r1w0r0.
001111
mar2_1_downcnt
Down count M2A_r0w1r1.
001110
mar2_0_downcnt
Down count M2A_r1w0r0.
001010
mar2_read
Read all 0s.
001011
chkr_w
Port 1 writes topological checkerboard data to memory.
001001
chkr_r
All ports read topological checkerboard data.
001000
n_chkr_w
Port 1 write inverse topological checkerboard data.
011000
n_chkr_r
All ports read inverse topological checkerboard data.
011001
uaddr_zeros2
Port 2 write all zeros to memory using Unique Address Algorithm (UAA).
011011
uaddr_write2
Port 2 writes every address value into its memory location (UAA).
011010
uaddr_read2
All ports read UAA data.
011110
uaddr_ones2
Port 2 writes all ones to memory.
011111
n_uaddr_write2
Port 2 writes inverse address value into memory.
011101
n_uaddr_read2
All ports read inverse UAA data.
011001
uaddr_zeros3
Port 3 write all zeros to memory using Unique Address Algorithm (UAA).
011011
uaddr_write3
Port 3 writes every address value into its memory location (UAA).
011010
uaddr_read3
All ports read UAA data.
011110
uaddr_ones3
Port 3 writes all ones to memory.
011111
n_uaddr_write3
Port 3 writes inverse address value into memory.
011101
n_uaddr_read3
All ports read inverse UAA data.
011001
uaddr_zeros4
Port 4 write all zeros to memory using Unique Address Algorithm (UAA).
011011
uaddr_write4
Port 4 writes every address value into its memory location (UAA).
011010
uaddr_read4
All ports read UAA data.
011110
uaddr_ones4
Port 4 writes all ones to memory.
011111
n_uaddr_write4
Port 4 writes inverse address value into memory.
011101
n_uaddr_read4
All ports read inverse UAA data.
110010
complete
Test complete.
Table 8. MBIST Control Register (MCR)
MCR[1:0]
Mode
00
Non-Debug
01
Debug
10
Reserved
11
Reserved
32
PRELIMINARY
Table 9. Boundary Scan Order (continued)
Table 9. Boundary Scan Order
Cell #
CY7C0430V
Signal Name
Cell #
Bump (Ball) ID
Signal Name
Bump (Ball) ID
2
A0_P4
K20
84
A10_P3
T20
4
A1_P4
J19
86
A11_P3
T19
6
A2_P4
J18
88
A12_P3
U19
8
A3_P4
H20
90
A13_P3
U18
A14_P3
V20
10
A4_P4
H19
92
12
A5_P4
G19
94
A15_P3
V19
14
A6_P4
G18
96
CNTINT_P3
R17
16
A7_P4
F20
98
CNTRST_P3
L18
MKLD_P3
N18
18
A8_P4
F19
100
20
A9_P4
F18
102
CNTLD_P3
N17
22
A10_P4
E20
104
CNTINC_P3
P17
24
A11_P4
E19
106
CNTRD_P3
T17
MKRD_P3
T18
26
A12_P4
D19
108
28
A13_P4
D18
110
LB_P3
Y20
30
A14_P4
C20
112
UB_P3
W19
32
A15_P4
C19
114
OE_P3
U17
R/W_P3
V16
34
CNTINT_P4
F17
116
36
CNTRST_P4
K18
118
CE1_P3
V18
38
MKLD_P4
H18
120
CE0_P3
V17
40
CNTLD_P4
H17
122
INT_P3
L19
CLK_P3
M17
42
CNTINC_P4
G17
124
44
CNTRD_P4
E17
126
IO0_P4
Y15
46
MKRD_P4
E18
128
IO1_P4
W15
48
LB_P4
A20
130
IO2_P4
Y16
IO3_P4
W16
50
UB_P4
B19
132
52
OE_P4
D17
134
IO4_P4
Y17
54
R/W_P4
C16
136
IO5_P4
W17
56
CE1_P4
C18
138
IO6_P4
Y18
IO7_P4
W18
58
CE0_P4
C17
140
60
INT_P4
K19
142
IO8_P4
Y19
62
CLK_P4
K17
144
IO0_P3
V12
64
A0_P3
L20
146
IO1_P3
Y11
IO2_P3
W12
66
A1_P3
M19
148
68
A2_P3
M18
150
IO3_P3
Y12
70
A3_P3
N20
152
IO4_P3
W13
72
A4_P3
N19
154
IO5_P3
Y13
IO6_P3
V15
74
A5_P3
P19
156
76
A6_P3
P18
158
IO7_P3
Y14
78
A7_P3
R20
160
IO8_P3
W14
80
A8_P3
R19
162
IO0_P1
Y6
R18
164
IO1_P1
W6
82
A9_P3
33
PRELIMINARY
Table 9. Boundary Scan Order (continued)
Cell #
Signal Name
CY7C0430V
Table 9. Boundary Scan Order (continued)
Bump (Ball) ID
Cell #
Signal Name
Bump (Ball) ID
166
IO2_P1
Y5
248
OE_P2
U4
168
IO3_P1
W5
250
R/W_P2
V5
170
IO4_P1
Y4
252
CE1_P2
V3
172
IO5_P1
W4
254
CE0_P2
V4
174
IO6_P1
Y3
256
INT_P2
L2
176
IO7_P1
W3
258
CLK_P2
M4
178
IO8_P1
Y2
260
A0_P1
K1
180
IO0_P2
V9
262
A1_P1
J2
182
IO1_P2
Y10
264
A2_P1
J3
184
IO2_P2
W9
266
A3_P1
H1
186
IO3_P2
Y9
268
A4_P1
H2
188
IO4_P2
W8
270
A5_P1
G2
190
IO5_P2
Y8
272
A6_P1
G3
192
IO6_P2
V6
274
A7_P1
F1
194
IO7_P2
Y7
276
A8_P1
F2
196
IO8_P2
W7
278
A9_P1
F3
198
A0_P2
L1
280
A10_P1
E20
200
A1_P2
M2
282
A11_P1
E2
202
A2_P2
M3
284
A12_P1
D2
204
A3_P2
N1
286
A13_P1
D3
206
A4_P2
N2
288
A14_P1
C1
208
A5_P2
P2
290
A15_P1
C2
210
A6_P2
P3
292
CNTINT_P1
F4
212
A7_P2
R1
294
CNTRST_P1
K3
214
A8_P2
R2
296
MKLD_P1
H3
216
A9_P2
R3
298
CNTLD_P1
H4
218
A10_P2
T1
300
CNTINC_P1
G4
220
A11_P2
T2
302
CNTRD_P1
E4
222
A12_P2
U2
304
MKRD_P1
E3
224
A13_P2
U3
306
LB_P1
A1
226
A14_P2
V1
308
UB_P1
B2
228
A15_P2
V2
310
OE_P1
D4
230
CNTINT_P2
R4
312
R/W_P1
C5
232
CNTRST_P2
L3
314
CE1_P1
C3
234
MKLD_P2
N3
316
CE0_P1
C4
236
CNTLD_P2
N4
318
INT_P1
K2
238
CNTINC_P2
P2
320
CLK_P1
K4
240
CNTRD_P2
T4
322
IO9_P2
A6
242
MKRD_P2
T3
324
IO10_P2
B6
244
LB_P2
Y1
326
IO11_P2
A5
246
UB_P2
W2
328
IO12_P2
B5
34
PRELIMINARY
Table 9. Boundary Scan Order (continued)
Cell #
Signal Name
Bump (Ball) ID
330
IO13_P2
A4
332
IO14_P2
B4
334
IO15_P2
A3
336
IO16_P2
B3
338
IO17_P2
A2
340
IO9_P1
C9
342
IO10_P1
A10
344
IO11_P1
B9
346
IO12_P1
A9
348
IO13_P1
B8
350
IO14_P1
A8
352
IO15_P1
C6
354
IO16_P1
A7
356
IO17_P1
B7
358
IO9_P3
A15
360
IO10_P3
B15
362
IO11_P3
A16
364
IO12_P3
B16
366
IO13_P3
A17
368
IO14_P3
B17
370
IO15_P3
A18
372
IO16_P3
B18
374
IO17_P3
A19
376
IO9_P4
C12
378
IO10_P4
A11
380
IO11_P4
B12
382
IO12_P4
A12
384
IO13_P4
B13
386
IO14_P4
A13
388
IO15_P4
C15
390
IO16_P4
A14
392
IO17_P4
B14
35
CY7C0430V
PRELIMINARY
CY7C0430V
Ordering Information
64K x 18 3.3V Synchronous QuadPort SRAM
Speed
(MHz)
Ordering Code
Package
Name
Package Type
Operating
Range
BG272
272-Ball Grid Array (BGA)
Commercial
CY7C0430V-133BGI
BG272
272-Ball Grid Array (BGA)
Industrial
CY7C0430V-100BGC
BG272
272-Ball Grid Array (BGA)
Commercial
BG272
272-Ball Grid Array (BGA)
Industrial
133
CY7C0430V-133BGC
100
CY7C0430V-100BGI
Document #: 38-00882
Package Diagram
272-Ball Grid Array (27 x 27 x 2.33 mm) BG272
© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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