Standard Product Reference Sheet FHY3C64X-H Features Package φ3 flush mount through-hole type Lens color : Pale Yellow, Clear Product features ・Blowhole-free structure Blowhole is a type of defect which mostly occurs in direct mounting LED. Moisture absorbed by PCB during soldering, might get vaporization and puncture holes in solder. Blowhole-free is a new structure which can prevent the occurrence of blowhole. ・Lead–free soldering compatible ・RoHS compliant Recommended Applications ・Communication Machine, Electric Household Appliances, OA/FA, Other General Applications 2013.09.10 Page : 1 Outline Dimensions FHY3C64X-H Unit Weight :mm :160mg Notes: 1. The lead should be bent 2mm away from the root. 2. Iron material is exposed at the tie-bar cutting part. 3. The minimum packing unit is 200 pieces. 2013.09.10 NO. PART NAME MATERIALS ① Lead Iron （Pb free dip soldering） ② Encapsulant Epoxy resin Page : 2 FHY3C64X-H Specifications 【 Product Overview 】 Die Material AlGaInP Emitting Colpr Yellow Resin Color Pale Yellow, Clear 【 Absolute Maximum Ratings 】 (Ta=25℃) ITEM SYMBOL MAXIMUM RATINGS UNITS Power Dissipation Pd 50 mW Forward Current IF 20 mA Repetitive Peak Forward Current IFRM 60 mA IF Derate Linearly from "25℃" ΔIF 0.27 mA/℃ IFRM Derate Linearly from "25℃" ΔIFRM 0.80 mA/℃ Reverse Voltage VR 4 V Operating Temperature Topr -30 ～ +85 ℃ Storage Temperature Tstg -30 ～ +100 ℃ Electrostatic Discharge Threshold "HBM" ESD 1,000 V Note2 Soldering Temperature "Dip Soldering" Tsld 260 ℃ Note3 Note 1 IFRM Conditions ： Pulse Width ≦ 1ms , Duty ≦ 1/20 Note 2 ESD testing method : EIAJ4071/300(304) Human Body Model(HBM) 1.5kΩ,100pF Note 3 Please refer to Page 9, Handling precaution of Flush mount LED Lamp,Soldering precaution for details. 2013.09.10 Note1 Page : 3 FHY3C64X-H Specifications 【 Electro and Optical Characteristics 】 (Ta=25℃) ITEM SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Forward Voltage VF IF = 10mA - 1.9 2.5 V Reverse Current IR VR = 4V - - 100 μA Luminous Intensity IV IF = 10mA 125 350 - mcd Peak Wavelength λp IF = 10mA - 592 - nm Dominant Wavelength λd IF = 10mA - 588 - nm Spectral Line Half Width Δλ IF = 10mA - 15 - nm Note 4 Note 4 Please refer to each sorting chart below. 【Rank Marking 】 Luminous Intensity rank is indicated by lot number on the product label. 【 Sorting chart For Luminous Intensity】 LEDs shall be sorted out into the following ranks of Luminous Intensity and Dominant Wavelength. （Ta=25℃） Rank IV (mcd) MIN. MAX. A 125 250 B 175 350 C 250 500 D 350 700 E 500 1,000 F 700 - Condiiton IF = 10mA 2013.09.10 Page : 4 FHY3C64X-H Technical Data Spectral Distribution Condition: Ta = 25℃, IF =10mA 1.2 Relative Intensity 1.0 0.8 0.6 0.4 0.2 0.0 380 430 480 530 580 630 680 730 780 Wavelength: (nm) Spatial Distribution Condition: Ta = 25℃, IF=constant Relative Intensity: (%) 2013.09.10 Page : 5 FHY3C64X-H Technical Data Forward Voltage vs. Forward Current Ambient Temperature vs. Forward Voltage Condition : Ta = 25℃ Forward Voltage: VF (V) Forward Current: I F (mA) 2.5 5 2.0 IF=10mA IF=5mA IF=2mA 1 1.5 2.0 Forward Voltage: VF(V) 2.5 -30 -10 10 30 50 Ambient Temperature: Ta (℃) 70 90 Forward Current vs. Relative Intensity Ambient Temperature vs. Relative Intensity Condition: Ta = 25℃ Condition: IF = 10mA 2.0 2.0 1.5 1.5 Relative Intensity Relative Intensity 1.5 1.0 0.5 0.5 0.0 0.0 0 5 10 Forward Current: IF (mA) 2013.09.10 1.0 15 20 -30 -10 10 30 50 70 90 Ambient Temperature: Ta (℃) Page : 6 FHY3C64X-H Forward Current vs. Dominant Wavelength Ambient Temperature vs. Dominant Wavelength Condition: Ta = 25℃ Condition: IF = 10mA 600 600 595 595 Dominant Wavelength : λd (nm) Dominant Wavelength : λd (nm) Technical Data 590 585 580 590 585 580 575 575 0 5 10 Forward Current: IF (mA) 15 -30 20 -10 10 30 50 CIE Maximum Forward Current : IFMAX. (mA) 60 Duty=10% 40 Duty=20% 30 Duty=50% 20 DC 10 0 -30 -10 10 30 50 Ambient Temperature: Ta (℃) 2013.09.10 Condition: Ta = 25℃ 100 Duty=5% Maximum Forward Current : IFMAX. (mA) Max. Forward Current vs. Duty Cycle Repetition Frequency: f ≧ 50Hz 50 90 CIE Max. Forward Current vs. Ambient Temperature 70 70 Ambient Temperature: Ta (℃) 70 90 10 1 1 10 100 Duty cycle: (%) Page : 7 FHY3C64X-H Technical Data Ambient Temperature vs. Power Dissipation Pulse Width vs. Maximum Tolerable Peak Current Condition: Ta = 25℃ 60 10kHz 1kHz Power Dissipation : Pd (mW) Maximum Tolerable Peak Current.: IF DC Max. 10 100Hz 50Hz 50 40 30 20 10 0 1 1 10 100 1,000 Pulse Width : tw (μs) 2013.09.10 10,000 100,000 -30 -10 10 30 50 70 90 Ambient Temperature: Ta (℃) Page : 8 FHY3C64X-H Soldering Conditions 1 Soldering Precaution 1） Please avoid dipping the resin directly into the solder bath. 2） Please do not apply the heat of 100 ℃ or more to the resin. 3） Any shock or vibration to the LED resin body should be avoided after soldering for the resin is soft and easily to be damaged until it return to room temperature. 4） Heating up for temporarily fix of other surface-mounting device should be done under 100℃. Avoid any pressure to the frame and resin part of LED. 5） The tie-bar cutting part might get oxidized because iron has been exposed. Please avoid soldering on the tie-bar part, because the solderability decreases when oxidization occurs. When the soldering part and die-bar cutting part overlaps, please confirm the solderability before using. 2 Recommendation Condition of Soldering 1） Soldering iron Temperature at tip of iron ： 360℃ MAX. Soldering time ： 3s MAX. ※ Position ： At least 1.6mm away from the root of lead The number of manual soldering process shall be 2 times Max. Cooling process to room temp. is required between first and second manual soldering process. 2） Dip Soldering Pre-heating ： Resin surface temperature should be set under 100℃. Bath temperature ： 265℃ MAX. Dipping time ： 5s MAX. ※ Position ： At least 1.6mm away from the root of lead. The number of dip soldering process shall be 2 times Max. Cooling process to room temp. is required between first and second dip soldering process. ※ Soldering positioning Note Through hole board is not recommended because soldering position will become 0 mm. 2013.09.10 Both sides through hole board One side board Page : 9 Soldering conditions FHY3C64X-H 3） Reflow Soldering Not recommended (However, if LED lamp and other electronic components are soldered together and the temperature of resin can be controlled within 100℃, reflow soldering is acceptable.) 2013.09.10 Page : 10 Handling precaution FHY3C64X-H 【 1. Cleaning 】 1） Some chemicals could corrode, oxidize cloud or crack the optical characteristics of the lens. Please review the reference chat below carefully before cleaning. NOTE Solvent Adaptability Isopropyl alcohol ○ Pure water ○ Acetone × Thinner × ・Dipping time: 3 minutes MAX.(at room temperature) ・If pure water is used, please refer to 4). 2） Effect of ultrasonic cleaning on the LED will vary on such factors as the oscillator output, capacity ,size of P.C.B and LED mounting method, etc. Cleaning should be done after confirming that there is no problem during actual usage with ultrasonic cleaning . 3） Freon substitute detergent could corrode, oxidize, cloud or crack the resin of LED, please ensure that there is no problem before using it. Freon substitute detergent ・Clean through-750H ・Pine alpha ST-100S 4） 2013.09.10 If water needs to be used for cleaning, please use pure water(not tap water), and completely dry the component. Page : 11 Handling precaution FHY3C64X-H 【 2. Lead Forming 】 1） The lead frame should be bent at a point 2mm away from the root of lead. Please perform at room temperature. 2） During forming, a jig or radio pliers should be firmly fixed to the root of lead, to which no mechanical stress should be applied. 3） All forming must be performed prior to soldering. 4） Forming pitch should be adjusted to the device insertion hole-pitch on the PCB. 5） Please avoid bending at the tie-bar part of lead during foaming because there is possibility that the stable forming shape can not be formed. Tie-bar portion 【 3. LED Mounting method 】 1） Please avoid excessive stress to lead frames during mounting. Mounting should be performed at room temperature. 2） To determine mount positions of LEDs using a case, please take into account the dimensions of the casing, board , device to avoid excessive stress on the lead. 3） Please fix the LED within the casing using the lead, and do not use adhesives, resin, or any other materials to fix the LED position. 4） With regard to using an inserter (automation), please adjust the insertion pressure to the lowest possible setting, and minimize the clinch angel as for as it can hold the component. <ex.> Clinch angle ： Cathode 15°MIN. Anode 45°MIN. Pusher pressure ： 0.2MPa MAX. 2013.09.10 Lead width Holes between pitches on board 0.4mm φ0.7～1.0mm Page : 12 Handling precaution FHY3C64X-H 【 Basic design 】 1.1 Designing for Safety All LED Lamps are designed to operate without failure in recommended usage conditions. However, all semiconductor components are prone to unexpected malfunctions and failures. Please take the necessary precautions to prevent fire, injury and other damage should any malfunction or failure arise. 1.2 Absolute Maximum Rating Absolute Maximum Ratings are set to prevent LED Lamps from failing due to excess stress (temperature, current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one items of Absolute Maximum Rating simultaneously. 1.3 Actual Usage Design 1） In order to ensure high reliability from LED lamps, variable factors that arise in actual usage conditions should be taken in account for designing.( Derating of TYP., MAX Forward Voltage, etc.) 2） Please insert straight protective resistors into the circuit in order to stabilize LED lamp operation and also to prevent the device from igniting due to excess current. If LEDs need to be used in a matrix circuit, a fully understanding of LEDs’ characteristics is required for designing.. 3） This LED lamps should be used with current of 2mA or more. If using LED lamps with current over 2 mA, it might vary considerably in chromaticity, luminous intensity, forward current. So current of 2mA or more is recommended considering the optimization of product selection and protective resistors. 【 The others 】 1） Once the package is open, please use as soon as possible, as keeping an opened package for a long time could cause the lead frame to oxidize. For storage, please avoid wetness and humidity, while taking care to avoid condensation caused by rapid temperature changes. 2） In case of product failures, the lot number on the product package label will be helpful in speeding up our response action. 3） Please refrain from looking directly at the light sauce of LED Lamp at high output, as it may harm your vision. 4） Stanley LED Lamps have semiconductor characteristics and are designed to ensure high reliability. However, the performance may vary depending on usage conditions 5） Please check the actual performance in the assembly because the Specification Sheets are described for single LED. 6） The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). 7） If the actual using condition is different from Stanley’s recommended conditions on this specification, please verify LED lamp’s performance under actual conditions to ensure there is no problem before actual use. 8） The formal specification sheets shall be valid only by exchange of documents signed by both parties. 9） Any information not listed on this specification shall be separately discussed and determined by both parties. 2013.09.10 Page : 13 Packaging Specifications 【 Package 】 FHY3C64X-H Label The front The back 【 Label Specification】 [acc.to JIS-X0503(Code-39)] Product label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (refer to Lot Number Notational System for details ) G. QR-Code for internal management ★ H. Customer Parts number Note 2013.09.10 "★" only appears when customer parts number is different form Stanley parts number. Page : 14 Packaging Specifications FHY3C64X-H Package 1． Package conditions: Clear plastic bag , 200pcs. / bag. 2． Warranty period: Within 12 months under following conditions. Un-opened, at normal temperature / Normal relative humidity ( +5～+30℃ / 70%Rh.max. ). Note1 The solderability of terminals of LED might decrease if above warranty period expired. Note2 Terminals of LED might get oxidized which will decrease the solderability of terminals if the products are stored with cardboard and rubber. The products should be isolated from these in keeping. Note3 Due to convenience of shipping and transportation, Stanley use cardboard box to shipping products during transportation. Cardboard contains sulfur element which will corrode silver plating. Please take the products out of the cardboard box for long term storage. Note4 Excess press to the package bag which might deform the lead part of LEDs should be avoided. 2013.09.10 Page : 15 Packaging Specifications FHY3C64X-H 3．Inner Packing Box. Box Type Outline dimension Outline dimension Box Type L × W × H ( mm ) L × W × H ( mm ) A1 195 × 117 × 38 B2 310 × 225 × 105 A4 304 × 224 × 46 B3 495 × 230 × 150 HEAD 390 × 210 × 65 Note ・The above measures are all reference values. ・The box is selected out of the above table by shipping quantity and product size. ・ Package materials are filled into the box to keep products form moving. OPTO DEVICES /Seal Adhesive tape A.Customer Name B.Parts Type C.Parts Code D.Parts Number E.Packed Parts Quantity F.Carton Number G.Shipping Date H.Bar-Code for In-house identification Number ★ I.Customer Parts number Notes a． The above figure is a representative example. The way that how adhesive tape is applied differs by the box type. b． "★" only appears when customer parts number is different form Stanley parts number. 2013.09.10 Page : 16 Packaging Specifications FHY3C64X-H 4．Outer packing box. Box Type Outline dimension Box Type L × W × H ( mm ) Note Outline dimension L × W × H ( mm ) HEAD 390 × 210 × 65 G1 480 × 340 × 225 G4 320 × 230 × 150 LED-C 505 × 255 × 315 2P 410 × 150 × 230 G2 480 × 340 × 320 SH-1 510 × 255 × 165 10P 400 × 335 × 450 5P 400 × 335 × 225 ・The above measure are all reference value. ・The box is selected out of the above table by shipping quantity and product size. ・ Package materials are filled into the box to keep products form moving Adhesive tape Note 2013.09.10 a．The above figure is a representative example. The way that how adhesive tape is applied on the box differs by the box type. Page : 17 Lot Number Notational System ① ② ③ ④ FHY3C64X-H ⑤ ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of Production Year 2009→9,2010→0,2011→1,･･･) ③ - 2digit ： Production Month (Jan. to Sep. , should be 01,02,03,･････) ④ - 2digit ： Production Date ⑤ - 3digit ： Serial Number ⑥ - 2digit ： Tape and Reel following Number ⑦ - 2digit ： Luminous Intensity Rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digit ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2013.09.10 Page : 18 FHY3C64X-H Correspondence to RoHS・ELV instruction This product is in compliance with RoHS・ELV. Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). Substance Group Name 2013.09.10 Criteria Value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max Page : 19 Reliability Testing Result FHY3C64X-H 1.Reliability Testing Result Testing Items Applicable Standard Room Temp. Operating Life Resistance to Soldering Heat EIAJ ED4701/100(101) EIAJ ED4701/300(302) Temperature Cycling EIAJ ED4701/100(105) Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(401) EIAJ ED4701/400(403) Testing Conditions Duration Ta = 25℃, IF = Maxium Rated Current Failure 1,000 h 0/25 10±1s 0/25 5 cycles 0/25 Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Ta = Minimum Rated Storage Temperature 1,000 h 0/25 10N,1time 10s 0/10 98.1m/s 2 (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction 2h 0/10 260±2℃, 3mm from package base Minimum Rated Storage Temperature(30min) ～ Normal Temperature(15min) ～ Maximum Rated Storage Temperature(30min) ～ Normal Temperature(15min) 2.Failure Criteria Items Symbol Conditions Failure criteria Luminous Intensity Iv Ta=25℃ IF=10mA Testing M in. Value ＜ Spec. M in. Value x 0.5 Forward Voltage VF Ta=25℃ IF=10mA Testing M ax. Value ≧ Spec. M ax. Value x 1.2 Reverse Current IR Ta=25℃ VR=4V Testing M ax. Value ≧ Spec. M ax. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking 2013.09.10 Page : 20 FHY3C64X-H Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en/ 2013.09.10 Page : 21