SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. ABC'S DWG NO. M□□□□□□□□□L□-□□□ MULTILAYER CHIP BEAD NAME ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： A D H D C I G I ( PCB Pattern ) B Unit : m/m Series A B C D G H I M□1608 1.6±0.2 0.8±0.2 0.8±0.2 0.30±0.2 0.7 0.7 0.7 M□2029 2.0±0.2 1.2±0.2 0.9±0.2 0.50±0.3 1.0 1.0 1.0 M□3261 3.2±0.2 1.6±0.2 1.1±0.2 0.60±0.4 2.2 1.4 1.1 Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒MATERIALS： a b c Reflow Area +2.0 ~ 4.0℃ / sec max. -(1.0 ~ 5.0)℃ / sec max. a﹒Body：Ferrite b﹒Internal conductor：Silver or Ag / Pd c﹒Terminal electrode：Ag/Ni/Sn d﹒Remark：Products comply with RoHS' requirements Ⅳ﹒GENERAL SPECIFICATION： a﹒Storage temp.：-40 ---- +105℃ b﹒Operating temp.：-55 ---- +125℃ Peak Temp：260℃ max. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. c﹒Terminal strength： F M□1608 M□2029 M□3261 F ( kgf ) 0.5 0.6 1.0 Time ( sec ) 30±5 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A Preheat Area +4.0℃ / sec max. 150 ~ 200 ℃ / 60 ~ 120sec Forced Cooling Area P eak Temperature: 260℃ 250 50s ec max. Temperature ( ℃ ) Type Temperature Rising Area 230℃ 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : PAGE: 2-1 PROD. NAME MULTILAYER CHIP BEAD M□□□□□□□□□L□-□□□ ABC'S DWG NO. ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISITCS： MD1608400YL□ -□□□ Impedance (Ω) at 100MHz 40±25% RDC (Ω) max. 0.30 IDC (mA) max. 300 MG1608800YL□ -□□□ 80±25% 0.30 300 MG1608121YL□ -□□□ 120±25% 0.30 200 MU1608221YL□ -□□□ 220±25% 0.30 200 MU1608301YL□ -□□□ 300±25% 0.35 150 MZ1608601YL□ -□□□ 600±25% 0.45 100 MZ1608102YL□ -□□□ 1000±25% 0.60 100 MG1608152YL□ -□□□ 1500±25% 0.70 50 MG1608202YL□ -□□□ 2000±25% 0.80 50 DWG No. 1). □：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ AR-001A MD1608400YL□ MG1608800YL□ MG1608121YL□ MU1608221YL□ MU1608301YL□ MZ1608601YL□ MZ1608102YL□ MG1608152YL□ MG1608202YL□ SPECIFICATION FOR APPROVAL REF : PAGE: 2-2 PROD. NAME MULTILAYER CHIP BEAD ABC'S DWG NO. M□□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISITCS： MD2029400YL□ -□□□ Impedance (Ω) at 100MHz 40±25% RDC (Ω) max. 0.20 IDC (mA) max. 300 MG2029800YL□ -□□□ 80±25% 0.20 300 MG2029121YL□ -□□□ 120±25% 0.25 300 MU2029221YL□ -□□□ 220±25% 0.30 200 MU2029301YL□ -□□□ 300±25% 0.30 200 MZ2029601YL□ -□□□ 600±25% 0.40 100 MZ2029102YL□ -□□□ 1000±25% 0.45 100 MG2029152YL□ -□□□ 1500±25% 0.55 100 MG2029202YL□ -□□□ 2000±25% 0.60 50 DWG No. 1). □：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ MD2029400YL□ AR-001A MG2029800YL□ MG2029121YL□ MU2029221YL□ MU2029301YL□ MZ2029601YL□ MZ2029102YL□ MG2029152YL□ MG2029202YL□ SPECIFICATION FOR APPROVAL REF : PAGE: 2-3 PROD. MULTILAYER CHIP BEAD NAME ABC'S DWG NO. M□□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅴ﹒ELECTRICAL CHARACTERISITCS： MG3261151YL□ -□□□ Impedance (Ω) at 100MHz 150±25% RDC (Ω) max. 0.30 IDC (mA) max. 300 MG3261301YL□ -□□□ 300±25% 0.30 300 MU3261301YL□ -□□□ 300±25% 0.30 300 MU3261601YL□ -□□□ 600±25% 0.30 200 MZ3261601YL□ -□□□ 600±25% 0.30 200 DWG No. MZ3261122YL□ -□□□ 1200±25% (at 50MHz) 0.50 100 MU3261122YL□ -□□□ 1200±25% (at 50MHz) 0.50 100 MZ3261202YL□ -□□□ 2000±25% (at 30MHz) 0.60 100 MU3261202YL□ -□□□ 2000±25% (at 30MHz) 0.60 100 1). □：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ AR-001A MZ3261151YL□ MG3261301YL□ MU3261301YL□ MU3261601YL□ MZ3261601YL□ MZ3261122YL□ MU3261122YL□ MZ3261202YL□ MU3261202YL□ SPECIFICATION FOR APPROVAL PAGE: 3 REF : PROD. ABC'S DWG NO. MULTILAYER CHIP BEAD NAME M□□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅵ﹒PACKAGING INFORMATION： ( 1 ) Configuration T Cover Tape N B A 2.0±0.5 ∮C ∮C D G Embossed Carrier ※ Carrier tape width : D P:4 m/m 4 m/m End Start Leader no component 200 m/m min. Trailer no comppnent 400 m/m min. Components User direction of feed Unit:m/m ( 2 ) Dimensions Style 07 - 08 A 178 B 21±0.8 C 13 D G N T 8 10 +0 50 -0 12.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series AR-001A Outer : Carton Q'TY (pcs) G.W. (gw) Style Q'TY(kpcs) G.W. (Kg) Size (cm) M□1608 4,000 90 07 - 08 200 7.0 41 x 39 x 22 M□2029 4,000 120 07 - 08 200 8.5 41 x 39 x 22 M□3261 3,000 150 07 - 08 120 8.5 41 x 39 x 22 SPECIFICATION FOR APPROVAL PAGE: 4 REF : PROD. MULTILAYER CHIP BEAD NAME ABC'S DWG NO. M□□□□□□□□□L□-□□□ ABC'S ITEM NO. ( 4 ) TYPE DIMENSIONS φ1.55±0.05 2±0.05 4±0.1 (0.157±0.004) (0.079±0.002) (0.061±0.002) P±0.1 (0.004) A±0.1 (0.004) φ1.55±0.05 4±0.1 2±0.05 (0.157±0.004) (0.079±0.002) (0.061±0.002) 0.23±0.1(0.004) B±0.1(0.004) F±0.05 (0.002) W±0.2 (0.008) 1.75±0.1 (0.069±0.004) Fig 2. T max. B±0.1(0.004) F±0.05 (0.002) W±0.2 (0.008) 1.75±0.1 (0.069±0.004) Fig 1. P±0.1 (0.004) T±0.1(0.004) A±0.1 (0.004) Unit:m/m AR-001A Type A B F P T W Fig M□1608 1.05 1.85 3.50 4.0 1.10 8.0 1 M□2029 1.50 2.30 3.50 4.0 1.10 8.0 1 M□3261 1.88 3.50 3.50 4.0 1.27 8.0 2 SPECIFICATION FOR APPROVAL REF : PAGE: 5 PROD. NAME MULTILAYER CHIP BEAD ABC'S DWG NO. M□□□□□□□□□L□-□□□ ABC'S ITEM NO. Ⅶ﹒DWGING NUMBER EXPRESSION： M Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1：Product Classification L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information Code A B AR-001A Inner package T.B.D. Inner package Q'TY Remark T.B.D. T / R ( Reel package ) 4000 pcs M□1608 T / R ( Reel package ) 4000 pcs M□2029 T / R ( Reel package ) 3000 pcs M□3261