Rohm BA6406F Silicon monolithic integrated circuit Datasheet

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
2-Phase Half-Wave Pre Driver for Fan Motor
TYPE
BA6406F
FEATURES
Lock detection, Automatic restart circuit
〇ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Limit
Unit
Supply voltage
Vcc
30
V
Power dissipation
Pd
624*
mW
Operating temperature
Topr
-40~+100
℃
Storage temperature
Tstg
-55~+125
℃
Iomax
70
mA
IAL
8
mA
30
V
125
℃
Vcc
Limit
4.0~28.0
Unit
V
VH
1.0~Vcc-0.5
V
Output current
AL signal output current
VAL
AL signal output voltage
Tjmax
Junction temperature
*Reduce by 6.24mW/℃ over Ta=25℃
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
〇OPERATING CONDITIONS
Parameter
Operating supply voltage range
Hall input voltage range
Symbol
*This product is not designed for production against radioactive rays.
REV. G
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=12V)
Parameter
Symbol
Min.
Limit
Typ.
Max.
Unit
Conditions
Icc
-
3.2
5.0
mA
Hall input hysteresis
Vhys
±3
-
±15
mV
AL output L voltage
VAL
-
-
0.5
V
IAL=5mA
AL current capacity
IAL
8.0
-
-
mA
VAL=2V
Charge current of capacitor for
lock detection
ILDC
2.0
3.45
5.25
μA
VLD=1.5V
Discharge current of capacitor
for lock detection
ILDD
0.35
0.80
1.45
μA
VLD=1.5V
Charge-discharge current ratio of
capacitor for lock detection
rCD
3
4.5
8
-
Clamp voltage of capacitor for
lock detection
VLDCL
2.2
2.6
3.0
V
Comparison voltage of capacitor
for lock detection
VLDCP
0.4
0.6
0.8
V
VOH
10
10.5
-
V
Circuit current
Output H voltage
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At output OFF
rCD=ILDC/ILDD
Io=10mA
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〇PACKAGE OUTLINES
5.0±0.2
5
6406
1
1.5±0.1
0.11
0.3Min.
6.2±0.3
4.4±0.2
8
4
Lot No.
0.15±0.1
0.1
1.27
0.4±0.1
〇BLOCK DIAGRAM
〇Terminal name
Pin No.
Vcc
1
A2
8
REG
H+
2
A1
HALL
AMP
+
-
7
LOGIC
AL
3
H4
1
2
3
4
5
6
7
8
LD
6
Lock
Detect
Auto
Restart
+
+
GND
5
-
REV. G
Terminal
name
Vcc
H+
AL
HGND
LD
A1
A2
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〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)
4) GND potential
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal
do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect
below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition,
environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error
or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a
jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution
when transporting or storing the IC.
10) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large
currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external
components, either.
11) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that
the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND
below 100uF.
12) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is
applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.
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Notice
Notes
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R1120A
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