Fairchild FSA2257L10X Low ron low-voltage dual spdt bi-directional analog switch Datasheet

FSA2257 Low RON Low-Voltage Dual SPDT
Bi-Directional Analog Switch
Features
Description
■ Maximum 1.15Ω On Resistance (RON) for 4.5V Supply
The FSA2257 is a high-performance bi-directional dual
Single-Pole/Double-Throw (SPDT) analog switch. This
switch can be configured as either a multiplexer or a demultiplexer by select pins. The device features ultra-low
RON of 1.3Ω maximum at 4.5V VCC and operates over
the wide VCC range of 1.65V to 5.5V. The device is fabricated with submicron CMOS technology to achieve fast
switching speeds and is designed for break-before-make
operation. The select input is TTL-level compatible.
■ 0.3Ω Maximum RON Flatness for +5V Supply
■ Space-Saving Pb-Free MicroPak™ Packaging
■ Broad VCC Operating Range: 1.65V to 5.5V
■ Fast Turn-on / Turn-off Time
■ Break-Before-Make Enable Circuitry
■ Over-Voltage Tolerant TTL-Compatible Control Input
Applications
■ Cell Phone
■ PDA
■ Ultra-Portable
Ordering Information
Order Number
FSA2257L10X(1)
FSA2257MTCX
(1)
FSA2257MUX(1)
Package
Product Code
Number Pb-Free
Top Mark
MAC010A
Yes
Package Description
Packing
Method
EP
10-Lead MicroPak™,
1.6 x 2.1mm
5000 Units on
Tape and Reel
2500 Units on
Tape and Reel
4000 Units on
Tape and Reel
MTC14
Yes
FSA2257
14-Lead Thin Shrink Small
Outline Package (TSSOP),
JEDEC MO-153,
4.4mm Wide
MUA101A
Yes
FSA
2257
10-Lead Molded Small
Outline Package (MSOP),
JEDEC MO-187, 3.0mm
Note:
1. Lead-free package per JEDEC J-STD-020B. Device available in tape and reel only.
32Ω Earpiece
Base Band
Voice/Bell Ring
Base Band
Processors
with Melody
Ring
Generation
Amp
8Ω Loud Speaker
Select Pin
FSA2257
Figure 1. Block Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
January 2007
1A
GND
1B0
2A
GND
2B0
NC
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
1B0
1S
1A
1B1
1S
9
8
7
6
1B1
VCC
10
GND
5
VCC
2S
2B1
NC
Figure 2. Pin Assignments for TSSOP (Top View)
1
2
3
4
2B0
2S
2A
2B1
Figure 3. Pad Assignments for MicroPak (Top View)
2B1
1
10
2B0
2S
2
9
2A
VCC
3
8
GND
1A
4
7
1S
1B0
5
6
1B1
Figure 4. Pin Assignments for MSOP (Top View)
Analog Symbols
Truth Table
GND
2B0
1
2S
2A
2B1
10
9
1B0
2
8
1S
3
7
1A
6
4
Control Input(s)
Function
LOW Logic Level
B0 Connected to A
HIGH Logic Level
B1 Connected to A
Pin Descriptions
1B1
5
Pin Names
Function
A, B0, B1
Data Ports
S
Control Input
VCC
(Top Through View)
Figure 5. Analog Symbols (Top View)
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
2
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Connection Diagrams
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol
VCC
VSW
VIN
IIK
Parameter
Supply Voltage
DC Switch Voltage
(2)
Min.
Max.
Unit
–0.5
+6.0
V
–0.5
VCC +0.5
V
(2)
–0.5
+6.0
V
Input Diode Current
–50
Switch Current
200
mA
Peak Switch Current (pulsed at 1ms duration, <10% duty cycle)
400
DC Input Voltage
+150
°C
TJ
Maximum Junction Temperature
+150
°C
TL
Lead Temperature (soldering, 10 seconds)
+260
°C
Human Body Model
8000
V
TSTG
ESD
Storage Temperature Range
–65
Note:
2. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
VCC
Parameter
Supply Voltage
Voltage(3)
VIN
Control Input
VSW
Switch Input Voltage
TA
Operating Temperature
Min.
Max.
Unit
1.65
5.5
V
0
VCC
V
0
VCC
V
−40
+85
°C
Note:
3. Unused control inputs must be held HIGH or LOW. They may not float.
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
3
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Absolute Maximum Ratings
All typical values are at 25°C unless otherwise specified.
TA= −40°C to
+85°C
TA=+25°C
Symbol
Parameter
VCC (V) Min. Typ. Max. Min. Max. Units
Conditions
2.7 to 3.6
2.0
4.5 to 5.5
2.4
VIH
Input Voltage High
VIL
Input Voltage Low
IIN
Control Input Leakage
INO(OFF),
INC(OFF)
OFF-Leakage Current
of Port B0 and B1
A = 1V, 4.5V,
B0 or B1 = 1V, 4.5V
5.5
–2.0
IA(ON)
ON Leakage Current
of Port A
A = 1V, 4.5V,
B0 or B1 = 1V, 4.5V or Floating
5.5
−4.0
RON
ΔRON
RFLAT(ON)
ICC
VIN = 0V to VCC
V
2.7 to 3.6
0.6
4.5 to 5.5
0.8
2.7 to 3.6
−1.0
1.0
4.5 to 5.5
−1.0
1.0
2.0
−20.0
20.0
nA
4.0
−40.0
40.0
nA
Switch ON Resistance IOUT = 100mA, B0 or B1 = 1.5V
MicroPak(4)
IOUT = 100mA, B0 or B1 = 3.5V
2.7
2.6
4.0
4.3
4.5
0.95
1.15
1.3
Switch ON Resistance IOUT = 100mA, B0 or B1 = 1.5V
2.7
2.8
4.5
MSOP / TSSOP(4)
4.5
1.5
2.3
4.5
0.06
IOUT = 100mA, B0 or B1 = 3.5V
ON Resistance
Matching 5etween
Channels(4)
MicroPak
IOUT = 100mA, B0 or B1 = 3.5V
ON Resistance
Matching Between
Channels(5)
MSOP / TSSOP
IOUT = 100mA, B0 or B1 = 3.5V
ON Resistance
Flatness(6)
Quiescent Supply
Current
V
0.12
μA
Ω
0.15
Ω
4.5
0.7
0.3
IOUT = 100mA, B0 or B1 = 0V,
0.75V, 1.5V
2.7
1.4
IOUT = 100mA, B0 or B1 = 0V, 1V,
2V
4.5
0.2
0.3
VIN = 0V or VCC, IOUT = 0V
3.6
0.1
0.5
1.0
5.5
0.1
0.5
1.0
Ω
0.4
μA
Notes:
4. On resistance is determined by the voltage drop between A and B pins at the indicated current through the switch.
5. ΔRON = RONmax – RONmin measured at identical VCC, temperature, and voltage.
6. Flatness is defined as the difference between the maximum and minimum value of on resistance over the specified
range of conditions.
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
4
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
TA =−40°C to +85°C
TA =+25°C
Symbol
tON
tOFF
tB-M
Parameter
Turn-On Time
Turn-Off Time
Break-BeforeMake Time
Conditions
B0 or B1 = 1.5V,
RL = 50Ω, CL = 35pF
2.7 to 3.6
50.0
60.0
B0 or B1 = 3.0V,
RL = 50Ω, CL = 35pF
4.5 to 5.5
35.0
40.0
B0 or B1 = 1.5V,
RL = 50Ω, CL = 35pF
2.7 to 3.6
20.0
30.0
B0 or B1 = 3.0V,
RL = 50Ω, CL = 35pF
4.5 to 5.5
15.0
20.0
B0 or B1 = 1.5V,
RL = 50Ω, CL = 35pF
2.7 to 3.6
B0 or B1 = 3.0V,
RL = 50Ω, CL = 35pF
4.5 to 5.5
20.0
2.7 to 3.6
20.0
4.5 to 5.5
10.0
Charge Injection
CL = 1.0nF, VGEN = 0V,
RGEN = 0Ω
OIRR
Off Isolation
f = 1MHz, RL = 50Ω
Xtalk
Crosstalk
f = 1MHz, RL = 50Ω
BW
−3db Bandwidth
RL = 50Ω
THD
Total Harmonic
Distortion
RL = 600Ω, VIN = 0.5V P.P,
f = 20Hz to 20kHz
Q
VCC (V) Min. Typ. Max. Min. Max. Units
Figure
Number
ns
Figure 6.
ns
Figure 6.
ns
Figure 7.
pC
Figure 9.
dB
Figure 8.
dB
Figure 8.
MHz
Figure 11.
%
Figure 12.
Units
Figure
Number
1.0
2.7 to 3.6
–70.0
4.5 to 5.5
–70.0
2.7 to 3.6
–75.0
4.5 to 5.5
–75.0
2.7 to 3.6
350
4.5 to 5.5
350
2.7 to 3.6
0.002
4.5 to 5.5
0.002
1.0
Capacitance
TA =+25°C
Symbol
CIN
Parameter
Conditions
VCC (V) Min. Typ. Max.
TA= 40 to +85°C
Min.
Max.
Control Pin Input Capacitance f = 1MHz
0.0
3.5
pF
Figure 10.
COFF
B Port Off Capacitance
f = 1MHz
4.5
12.0
pF
Figure 10.
CON
A Port On Capacitance
f = 1MHz
4.5
40.0
pF
Figure 10.
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
5
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
AC Electrical Characteristics
VCC
VB
B0 or B1
VCC
A
Control
Input
VOUT
RL
50Ω
S
tR = tF = 2.5ns
3V
50%
0V
CL
35pF
tOFF
VOUT
GND
Switch
Output
CL Includes Fixture and Stray Capacitance
0.9 x VOUT
0
0.9 x VOUT
tON
Logic Input Waveforms Inverted for Switches
that have the Opposite Logic Sense
Figure 6. Turn-On / Turn-Off Timing
VCC
VBn
Control
Input
VCC
B0
VOUT
A
3V
50%
tR = tF = 2.5ns
0V
B1
RL
50Ω
S
Control
Input
CL
35pF
VOUT
0.9 x VOUT
GND
TD
CL Includes Fixture and Stray Capacitance
Figure 7. Break-Before-Make Timing
VCC
0 or VCC
S
VCC
10nF
A
VIN
Network
Analyzer
50Ω
50Ω
0dBm
OFF-ISOLATION = 20log
ON-LOSS = 20log
VOUT
VIN
CROSSTALK = 20log
BO
B1
50Ω
GND
VOUT
MEAS
REF
50Ω
VOUT
VIN
VOUT
VIN
50Ω
Figure 8. Off Isolation and Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
6
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
AC Loading and Waveforms
+
VGEN
A
VOUT
B0 or B1
GND
ΔVOUT
VOUT
VCC
RGEN
IN
OFF
CL
ON
OFF
S
Control
Input
ON
OFF
IN
OFF
Q = (ΔVOUT)(CL)
Figure 9. Charge Injection
10nF
V+
A
S
Capacitance
Meter
0V
or
VCC
B0 or B1
f = 1MHz
GND
Figure 10. On / Off Capacitance Measurement Setup
10nF
Signal
Generator
0dBm
VCC
BN
A
Analyzer
50Ω
S
Logic Input
0V or VCC
GND
Figure 11. Bandwidth
10nF
VIN
BN
Signal
Generator
VCC
A
Analyzer
RL
S
Logic Input
0V or VCC
GND
Figure 12. Harmonic Distortion
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
7
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
AC Loading and Waveform (continued)
Tape Dimensions for MicroPak 10
Package Designator
Tape Section
Number Cavities
Cavity Status
Leader (Start End)
125 (typ)
Empty
Sealed
Carrier
5000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
L10X
Cover Tape Status
Dimensions are in millimeters unless otherwise specified.
Reel Dimensions for MicroPak 10
Dimensions are in inches (millimeters) unless otherwise noted.
Tape Size
A
B
C
D
N
W1
W2
W3
(8mm)
7.0
(177.8)
0.059
(1.50)
0.512
(13.00)
0.795
(20.20)
2.165
(55.00)
0.331 +0.059 / –0.000
(8.40 +1.50 / −0.00)
0.567
(14.40)
W1 +0.078 / −0.039
(W1 +2.00 / −1.00)
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
8
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Package Specifications
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Tape Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified.
Reel Dimensions for MSOP
Dimensions are in inches (millimeters) unless otherwise specified
Tape Size
A
B
C
D
N
W1
W2
W3
(12mm)
13
(330)
0.059
(1.5)
0.512
(13)
0.795
(20.2)
7.008
(178)
0.448
(12.4)
0.724
(18.4)
0.468-0.606
(11.9 -15.4)
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
9
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 13. 10-Lead MicroPak, 1.6 x 2.1mm
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
10
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 14. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
11
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 15. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
12
FSA2257 Low RON Low-Voltage Dual SPDT Bi-Directional Analog Switch
© 2006 Fairchild Semiconductor Corporation
FSA2257 Rev. 1.0.3
www.fairchildsemi.com
13
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