MC10H330 Quad Bus Driver/Receiver with 2−to−1 Output Multiplexers Description http://onsemi.com The MC10H330 is a Quad Bus Driver/Receiver with two−to−one output multiplexers. These multiplexers have a common select and output enable. When disabled, (OE = high) the bus outputs go to −2.0 V. Their output can be brought to a low state (VOL) by applying a high level to the receiver enable (RE = High). The parameters specified are with 25 W loading on the bus drivers and 50 W loads on the receivers. MARKING DIAGRAMS* 24 MC10H330L AWLYYWW Features • Propagation Delay, 1.5 ns Typical Data−to−Output • Improved Noise Margin 150 mV (Over Operating Voltage and • • • Temperature Range) Voltage Compensated MECL 10K™ Compatible Pb−Free Packages are Available* CDIP−24 L SUFFIX CASE 758 1 24 MC10H330P AWLYYWWG DIP PIN ASSIGNMENT PDIP−24 P SUFFIX CASE 724 VCC 1 24 VCC0 XBUS 2 23 YBUS WBUS 3 22 ZBUS VCC0 4 21 OE X1 5 20 Y0 X0 6 19 Y1 W1 7 18 Z0 W0 8 17 Z1 S 9 16 RE WIN 10 15 ZIN XIN 11 14 YIN VEE 12 13 VCC0 1 1 10H330G AWLYYWW PLCC−28 P SUFFIX CASE 776 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H330/D MC10H330 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol IE IinH Characteristic 25° 75° Min Max Min Max Min Max Unit Power Supply Current − 157 − 143 − 157 mA Input Current High Pins 5−8, 17−20 Pins 16, 21 Pin 9 − − − 667 514 475 − − − 417 321 297 − − − 417 321 297 0.5 − 0.5 − 0.3 − mA mA IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Receiver outputs are terminated through a 50 W resistor to −2.0 Vdc. Bus outputs are terminated through a 25 W resistor to −2.0 Vdc. Table 3. AC PARAMETERS 0° Symbol tpd Characteristic Propagation Delay Select−to−Input Data−to−Bus Output Select−to−Bus Output OE−to−Bus Output Bus−to−Input RE−to−Input Data−to−Receiver Input 25° 75° Min Max Min Max Min Max 1.8 0.5 5.3 2.0 1.8 0.5 5.3 2.0 1.8 0.5 5.3 2.0 1.0 0.8 0.8 0.5 3.2 2.2 2.1 2.2 1.0 0.8 0.8 0.5 3.2 2.2 2.1 2.2 1.0 0.8 0.8 0.5 3.2 2.2 2.4 2.2 Unit ns 1.3 4.0 1.3 4.0 1.3 4.0 tr Rise Time 0.5 2.0 0.5 2.0 0.5 2.0 ns tf Fall Time 0.5 2.0 0.5 2.0 0.5 2.0 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H330 LOGIC DIAGRAM OE 21 S 9 W0 8 W1 7 WIN 10 X0 6 X1 XIN 5 11 Y0 20 Y1 19 YIN 14 Z0 18 Z1 17 ZIN 15 RE 16 VCC0 VCC VCC0 VCC0 VEE MULTIPLEXER TRUTH TABLE OE S WBus XBus YBus H L L X L H −2.0 V −2.0 V −2.0 V −2.0 V W0 X0 Y0 Z0 W1 X1 Y1 Z1 = = = = = PIN 24 PIN 1 PIN 13 PIN 4 PIN 12 3 WBUS 2 XBUS 23 YBUS 22 ZBUS RECEIVER TRUTH TABLE ZBus RE Win Xin Yin Zin H L L WBus L XBus L YBus L ZBus ORDERING INFORMATION Package Shipping † MC10H330FN PLCC−28 37 Units / Rail MC10H330FNG PLCC−28 (Pb−Free) 37 Units / Rail MC10H330FNR2 PLCC−28 500 / Tape & Reel MC10H330FNR2G PLCC−28 (Pb−Free) 500 / Tape & Reel MC10H330L CDIP−24 15 Unit / Rail MC10H330P PDIP−24 15 Unit / Rail MC10H330PG PDIP−24 (Pb−Free) 15 Unit / Rail Device http://onsemi.com 3 MC10H330 PACKAGE DIMENSIONS PLCC−28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776−02 ISSUE D −N− 0.007 (0.180) B Y BRK T L−M M 0.007 (0.180) U M N S T L−M S S N S D Z −M− −L− W 28 D X V 1 G1 A 0.007 (0.180) R 0.007 (0.180) C M M T L−M T L−M S S N N S 0.007 (0.180) H G J S S N M T L−M S N S K1 0.004 (0.100) −T− SEATING K PLANE F VIEW S G1 T L−M N S S E S T L−M S VIEW D−D Z 0.010 (0.250) 0.010 (0.250) 0.007 (0.180) VIEW S S NOTES: 1. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM A B C E F G H J K R U V W X Y Z G1 K1 http://onsemi.com 4 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10_ 0.410 0.430 0.040 −−− MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10_ 10.42 10.92 1.02 −−− M T L−M S N S MC10H330 PACKAGE DIMENSIONS CDIP−24 L SUFFIX CERAMIC DIP PACKAGE CASE 758−02 ISSUE A L B 24 13 1 12 P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. J −A− DIM A B C D F G J K L N P N C SEATING PLANE −T− K G D 24 PL 0.25 (0.010) F M T A PDIP−24 P SUFFIX PLASTIC DIP PACKAGE CASE 724−03 ISSUE D 24 13 1 12 NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. −B− L C −T− NOTE 1 K M N E G MILLIMETERS MIN MAX 31.50 32.64 7.24 7.75 4.07 5.08 0.38 0.53 1.14 1.57 2.54 BSC 0.20 0.33 2.54 4.19 7.62 7.87 0.51 1.27 9.14 10.16 M −A− SEATING PLANE INCHES MIN MAX 1.240 1.285 0.285 0.305 0.160 0.200 0.015 0.021 0.045 0.062 0.100 BSC 0.008 0.013 0.100 0.165 0.300 0.310 0.020 0.050 0.360 0.400 J F D 24 PL 0.25 (0.010) M T B M 24 PL 0.25 (0.010) M T A M DIM A B C D E F G J K L M N INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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