Material Content Data Sheet Sales Product Name BSC030P03NS3 G MA# MA001321030 Package PG-TDSON-8-1 Issued 5. February 2015 Weight* 122.79 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead silver iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7440-22-4 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 5.418 4.41 0.038 0.03 wire encapsulation leadfinish plating solder CLIP plating heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 4.41 44120 44120 308 0.011 0.01 37.762 30.76 30.80 307521 92 307921 0.023 0.02 0.02 185 185 0.078 0.06 634 5.528 4.50 33.324 27.14 31.70 271384 317037 1.452 1.18 1.18 11822 11822 0.166 0.13 0.13 1348 1348 0.101 0.08 0.081 0.07 3.868 3.15 3.30 31500 32985 1.289 1.05 1.05 10501 10501 0.011 0.01 0.003 0.00 11.320 9.22 0.022 0.02 0.007 0.01 22.292 18.15 45019 825 660 92 28 9.23 92187 55 18.18 181537 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 92307 182 181774 1000000