Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD6995FV
General Description
Key Specifications
BD6995FV is a 1chip driver for 12V single-phase
full-wave fan motor. This IC employs the Bi-CDMOS
process and soft switching drive, low power
consumption and quiet drive is provided.
Features
Input Voltage Range:
4.3V to 17V
Operating Temperature Range: -40°C to +105°C
Output Voltage
(High and Low Total):
0.6V(Typ) at 0.4A
Output Current:
1.2A(Max)
Package
SSOP Small Package
PWM Soft switching Drive
Standby Function
Speed Controllable by DC Input
Quick Start
OSC Select Function
(Triangle OSC or Saw OSC)
Signal Select Function
(Rotation Speed Pulse Signal: FG or Lock Alarm
Signal: AL)
Signal Output
Lock Protection and Automatic Restart
(Without External Capacitor)
Current Limit
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
SSOP-B16
SSOP-B16
Applications
Fan motors for general consumer equipment like
Desktop PC, Projector, etc.
Typical Application Circuit
M
＋
1
RNF
OUT1 16
2
OUT2
GND 15
3
VCC
SELO 14
4
MIN
SELS 13
5
TH
6
OSC
H– 11
7
OSCH
HB 10
8
SIG
H+
－
REF 12
PWM
SIG
〇Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
H
9
〇This product has no designed protection against radioactive rays
1/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Pin Configuration
Pin Description
P/No. P/Name
(TOP VIEW)
RNF
1
16
OUT1
OUT2
2
15
GND
VCC
3
14
SELO
MIN
4
13
SELS
TH
5
12
REF
OSC
6
11
H–
OSCH
7
10
HB
SIG
8
9
H+
Figure 1. Pin Configuration
Function
Output current detecting resistor connection
1
RNF
2
3
4
5
6
OUT2
VCC
MIN
TH
OSC
7
OSCH
8
SIG
9
10
11
12
H+
HB
H–
REF
13
SELS
14
SELO
15
16
GND
OUT1
terminal (motor ground)
Motor output 2 terminal
Power supply terminal
Minimum output duty setting terminal
Output duty control input terminal
Oscillating capacitor connection terminal
Resistor connection terminal for capacitor
charge (use only for Saw OSC)
Signal output terminal (Rotation speed pulse
signal: FG or Lock alarm signal: AL)
Hall + input terminal
Hall bias terminal
Hall – input terminal
Reference voltage output terminal
Signal select terminal (Rotation speed pulse
signal: FG or Lock alarm signal: AL)
OSC select terminal (Triangle OSC or Saw
OSC)
Ground terminal
Motor output 1 terminal
Block Diagram
1
2
OUT1
RNF
OUT2
GND
16
15
INTERNAL
REG
3
4
5
CURRENT
LIMITER
VCC
PRE
DRIVER
MIN
TH
FUNCTION
SELECTOR
SELO
FUNCTION
SELECTOR
SELS
REF
REF
14
13
12
CONTROL
LOGIC
6
7
8
OSCH
SIG
HALL
COMP
H–
OSC
OSC
QUICK
START
SIGNAL
OUTPUT
HALL
BIAS
LOCK
PROTECT
TSD
11
HB 10
H+
9
Figure 2. Block Diagram
I/O Truth Table
Hall Input
H+
H–
H
L
L
H
OUT1
L
H
Driver Output
OUT2
SIG(FG)
H
Hi-Z
L
L
H; High, L; Low, Hi-Z; High impedance
SIG output is open-drain type.
Motor State
OUT1/2
SIG(FG)
SIG(AL)
Rotating
Locking
Standby
Hi-Z
Hi-Z
L
Hi-Z
L
L; Low, Hi-Z; High impedance
SIG output is open-drain type.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VCC
20
V
Supply Voltage
Power Dissipation
0.88 (Note 1)
Pd
W
Operating Temperature Range
Topr
-40 to +105
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Output Voltage
VO
20
V
Output Current
IO
1.2 (Note 2)
A
VSIG
20
V
Signal Output Current
ISIG
10
mA
Reference Voltage(REF) Output Current
IREF
5
mA
Hall Bias(HB) Output Current 1
IHB1
10 (Note 3)
mA
Hall Bias(HB) Output Current 2
IHB2
5 (Note 4)
mA
Input Voltage(H+, H–, TH, MIN, SELO, SELS)
VIN
7
V
Junction Temperature
Tj
150
°C
Signal Output Voltage
(Note 1) Derate by 7.1mW/°C if operating over Ta=25°C.
(Note 2) Do not exceed Pd.
(Note 3) Ta=0°C or Higher.
(Note 4) Less than Ta=0°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
Unit
SSOP-B16
Junction to Ambient
θJA
140.9
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
6
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Recommended Operating Conditions
Parameter
Supply Voltage Range
Input Voltage Range 1 (H+, H–)
(VCC≥9V)
Input Voltage Range 1 (H+, H–)
(VCC<9V)
Input Voltage Range 2 (TH, MIN)
Input Frequency Range (H+, H–)
OSC Frequency Range
Symbol
VCC
Min
Typ
Max
4.3
12
17
Unit
V
0
-
3.0
V
0
-
VCC/3
V
0
0
18
-
VREF
400
50
V
Hz
kHz
VIN1
VIN2
fIN
fOSCR
(Note) Recommended motor: Single phase fan motor of 4 poles
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Electrical Characteristics (Unless otherwise specified VCC=12V Ta=25°C)
Parameter
Circuit Current
Symbol
Min
Typ
Max
Unit
ICC
-
5.0
9.0
mA
3.0
4.8
mA
Conditions
Circuit Current (Stand-by)
ISTBY
Hall Bias Voltage
VHB
1.05
1.25
1.45
V
IHB=-2mA
Output Voltage
VO
-
0.6
0.9
V
IO=±400mA, High and Low total
Lock Detection ON Time
tON
0.3
0.5
0.7
s
Lock Detection OFF Time
tOFF
3.0
5.0
7.0
s
Lock Detection OFF/ON Ratio
RLCK
8.5
10.0
11.5
-
Hall Input Hysteresis Voltage
VHYS
±6
±12
±18
mV
SIG Output Low Voltage
VSIGL
-
0.2
0.3
V
ISIG=5mA
SIG Output Leak Current
ISIGL
-
-
10
μA
VSIG=17V
OSC Frequency
(Reference Data)
fOSC
-
28
-
kHz
SELO=H(OPEN),
COSC=100pF(Note1)
OSC Charge Current
ICOSC
-16
-11
-6
μA
VOSC=2.0V
VOSC=2.0V
OSC Discharge Current
IDOSC
6
11
16
μA
OSC High Voltage
VOSCH
2.80
3.00
3.20
V
OSC Low Voltage
VOSCL
0.85
1.05
1.25
V
RLCK=tOFF / tON
Output ON Duty
DOH
38
48
58
%
VTH=0.4 x VREF
Output 1kΩ Load
SELO=H(OPEN)
COSC=100pF(Note1)
Reference Voltage
VREF
4.7
5.0
5.3
V
IREF=-2mA
MIN Input Bias Current
IMIN
-0.6
-
-
μA
VMIN=0V
VTH=0V
TH Input Bias Current
ITH
-0.6
-
-
μA
SELS Input Open Voltage
VSELSO
3.2
3.5
3.8
V
SELS Input Low Level
VSELSL
-0.2
-
0.7
V
SELS Input Bias Current
ISELS
-35
-25
-15
μA
SELO Input Open Voltage
VSELOO
3.2
3.5
3.8
V
SELO Input Low Level
VSELOL
-0.2
-
0.7
V
SELO Input Bias Current
ISELO
-35
-25
-15
μA
Current Limit Voltage
VCL
235
265
295
mV
VSELS=0V
VSELO=0V
(Note1) 100pF includes parasitic capacitance of substrate and other.
For parameters involving current, positive notation means inflow of current to IC while negative notation means outflow of current from IC.
The reference data is a design guaranteed value and the numerical all shipment inspection off the subject item.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data)
8
105°C
6
Circuit Current: ISTBY[mA]
Circuit Current: Icc[mA]
8
25°C
-40°C
4
2
6
4
105°C
25°C
-40°C
2
Operating Voltage Range
Operating Voltage Range
0
0
0
5
10
15
20
0
5
Supply Voltage: Vcc[V]
15
20
Supply Voltage: VCC [V]
Figure 3. Circuit Current vs Supply Voltage
(In Operation)
Figure 4. Circuit Current vs Supply Voltage
(In Standby)
1.45
1.45
1.35
1.35
Hall Bias Voltage: VHB[V]
Hall Bias Voltage: VHB[V]
10
105°C
25°C
-40°C
1.25
1.15
105°C
1.25
25°C
-40°C
1.15
Operating Voltage Range
1.05
1.05
0
5
10
15
20
0
Supply Voltage: VCC [V]
4
6
8
10
HB Source Current: IHB[mA]
Figure 5. Hall Bias Voltage vs Supply Voltage
(IHB=-2mA)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2
Figure 6. Hall Bias Voltage vs HB Source Current
(VCC=12V)
5/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data) - continued
0.0
Output High Voltage: VOH [V]
Output High Voltage: VOH [V]
0.0
-0.4
-0.8
105°C
25°C
-0.4
-0.8
-40°C
4.3V
-1.2
12V
17V
-1.2
0.0
0.4
0.8
1.2
0.0
Output Source Current: IO[A]
0.4
0.8
1.2
Output Source Current: IO[A]
Figure 7. Output High Voltage vs Output Source Current
(VCC=12V)
Figure 8. Output High Voltage vs Output Source Current
(Ta=25°C)
1.0
1.0
Output Low Voltage: VOL[V]
Output Low Voltage: VOL[V]
105°C
0.8
25°C
0.6
-40°C
0.4
0.2
0.8
4.3V
0.6
V
12V
17V
0.4
0.2
0.0
0.0
0.0
0.4
0.8
0.0
1.2
0.8
1.2
Output Sink Current: IO[A]
Output Sink Current: IO[A]
Figure 9. Output Low Voltage vs Output Sink Current
(VCC=12V)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
0.4
Figure 10. Output Low Voltage vs Output Sink Current
(Ta=25°C)
6/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
0.8
8.0
0.7
7.0
Lock Detection OFF Time: t OFF [s]
Lock Detection ON Time: t ON [s]
Typical Performance Curves (Reference data) - continued
0.6
105°C
0.5
25°C
-40°C
0.4
0.3
6.0
105°C
25°C
-40°C
5.0
4.0
3.0
Operating Voltage Range
Operating Voltage Range
2.0
0.2
0
5
10
15
0
20
10
15
20
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 11. Lock Detection ON Time vs Supply Voltage
Figure 12. Lock Detection OFF Time vs Supply Voltage
13.0
40
Hall Input Hystresis voltage: VHYS [V]
Lock Detection OFF/ON Ratio: R LCK
5
12.0
11.0
25°C
-40°C
105°C
10.0
9.0
8.0
Operating Voltage Range
20
105°C
25°C
-40°C
0
-40°C
25°C
105°C
-20
Operating Voltage Range
-40
7.0
0
5
10
15
0
20
10
15
20
Supply Voltage: VCC [V]
Supply Voltage: VCC [V]
Figure 13. Lock Detection OFF/ON Ratio vs Supply Voltage
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5
Figure 14. Hall Input Hysteresis Voltage vs Supply Voltage
7/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data) - continued
0.8
0.6
105°C
0.4
25°C
-40°C
0.2
SIG Output Low Voltage: VSIGL[V]
SIG Output Low Voltage: VSIGL[V]
0.8
0.6
0.4
4.3V
V
12V
17V
0.2
0.0
0.0
0
2
4
6
8
10
0
SIG Sink Current: ISIG[mA]
4
6
8
10
SIG Sink Current: ISIG[mA]
Figure 15. SIG Output Low Voltage vs SIG Sink Current
(VCC=12V)
Figure 16. SIG Output Low Voltage vs SIG Sink Current
(Ta=25°C)
30
OSC Charge/Discharge Current: ICOSC/IDOSC[μA]
1.00
SIG Output Leak Current: ISIGL[μA]
2
0.75
0.50
Operating Voltage Range
0.25
105°C
25°C
-40°C
0.00
0
5
10
15
10
0
-40°C
25°C
105°C
-10
-20
Operating Voltage Range
0
5
10
15
20
Supply Voltage: Vcc[V]
Supply Voltage: VCC [V]
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
105°C
25°C
-40°C
-30
20
Figure 17. SIG Output Leak Current vs Supply Voltage
(VSIG=17V)
20
Figure 18. OSC Charge/Discharge Current vs Supply Voltage
8/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data) - continued
6.0
105°C
25°C
-40°C
3
Reference Voltage: VREF [V]
OSC High/Low Voltage: VOSCH /VOSCL[V]
4
2
105°C
25°C
-40°C
1
105°C
25°C
-40°C
5.0
4.0
3.0
Operating Voltage Range
Operating Voltage Range
0
2.0
0
5
10
15
20
0
Supply Voltage: Vcc[V]
10
15
20
Supply Voltage: VCC [V]
Figure 19. OSC High/Low Voltage vs Supply Voltage
Figure 20. Reference Voltage vs Supply Voltage
(IREF=-2mA)
6.0
0.0
5.5
TH Bias Current: I TH[μA]
Reference Voltage: VREF [V]
5
105°C
25°C
5.0
-40°C
4.5
105°C
25°C
-40°C
-0.2
-0.4
Operating Voltage Range
4.0
-0.6
0
1
2
3
4
5
0
Source Current: IREF [mA]
10
15
20
Supply Voltage: VCC [V]
Figure 21. Reference Voltage vs Source Current
(VCC=12V)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5
Figure 22. TH Bias Current vs Supply Voltage
(VTH=0V)
9/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data) - continued
105°C
25°C
-40°C
-0.2
-0.4
Operating Voltage Range
4.0
SELS Input Open Voltage: VSELSO[V]
MIN Bias Current: IMIN[μA]
0.0
-0.6
105°C
25°C
-40°C
3.5
3.0
2.5
Operating Voltage Range
2.0
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 24. SELS Input Open Voltage vs Supply Voltage
Figure 23. MIN Bias Current vs Supply Voltage
(VMIN=0V)
4.0
-10
-20
-40°C
25°C
105°C
-30
Operating Voltage Range
SELO Input Open Voltage: VSELOO[V]
0
SELS Input Bias Current: I SELS[μA]
5
-40
105°C
25°C
-40°C
3.5
3.0
2.5
Operating Voltage Range
2.0
0
5
10
15
20
0
Supply Voltage: VCC [V]
10
15
20
Supply Voltage: VCC [V]
Figure 25. SELS Input Bias Current vs Supply Voltage
(VSELS=0V)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5
Figure 26. SELO Input Open Voltage vs Supply Voltage
10/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Typical Performance Curves (Reference data) - continued
300
-10
-20
-40°C
25°C
105°C
-30
Current Limit Voltage: VCL[mV]
SELO Input Bias Current: I SELO[μA]
0
275
105°C
25°C
-40°C
250
225
Operating Voltage Range
Operating Voltage Range
200
-40
0
5
10
15
0
20
10
15
20
Supply Voltage: Vcc[V]
Supply Voltage: VCC [V]
Figure 28. Current Limit Voltage vs Supply Voltage
Figure 27. SELO Input Bias Current vs Supply Voltage
(VSELO=0V)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5
11/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Application Example (Constant Values are for Reference)
1.
Triangle OSC Application
Triangle OSC for controlling the speed is generated using the OSC circuit in the IC. Triangle OSC is compared with the
external PWM signal converted into the DC voltage, and controlling the rotational speed.
Resistor for motor current
detection
Take note the power
consumption of this resistor.
M
Bypass capacitor, must be
connected near to VCC
terminal as much as possible
1
2
Reverse polarity protection
Maximum output voltage: 20V
Maximum output current: 1.2A
OUT1
RNF
OUT2
GND
16
OSC select
SELO-GND: OPEN
Triangle OSC
15
INTERNAL
REG
＋
3
VCC
CURRENT
LIMITER
PRE
DRIVER
FUNCTION
SELECTOR
SELO
FUNCTION
SELECTOR
SELS
1μF to
－
4
The circuit that converts
PWM duty into DC voltage
5
PWM
MIN
TH
PWM
CONTROL
to 10kΩ
12
For Stability of REF
H–
Hall element input current
adjustment.
11
100pF
Output PWM frequency
setting for Triangle OSC
7
0Ω to
SIG
8
Protection for SIG open-drain
output
2.
OSCH
SIG
QUICK
START
SIGNAL
OUTPUT
HB
HALL
BIAS
LOCK
PROTECT
FG / AL select (SIG output)
SELS-GND: OPEN -- FG
SELS-GND: Pull-down -- AL
During IC power supply is
applied, it must not be
changed.
0.1μF to
HALL
COMP
OSC
OSC
13
CONTROL
LOGIC
6
REF
REF
14
H+
TSD
0Ω to
10
H
Input by-pass capacitor for
noise reduction.
9
Figure 29. Triangle OSC Application
Saw OSC Application
Saw OSC for controlling the speed is generated using an external capacitor and resistor. Saw OSC is compared with
the external PWM signal converted into the DC voltage, and controlling the rotational speed.
M
1
Minimum output duty
setting
2
OUT1
RNF
OUT2
GND
16
15
INTERNAL
REG
＋
3
VCC
CURRENT
LIMITER
PRE
DRIVER
FUNCTION
SELECTOR
SELO
FUNCTION
SELECTOR
SELS
1μF to
－
4
PWM input open:
High speed setting
5
PWM
PWM input open:
Min speed (stop) setting
Output PWM frequency
setting for Saw OSC
Refer to P.14
MIN
TH
PWM
CONTROL
REF
100kΩ
HALL
COMP
13
to 10kΩ
12
0.1μF to
H–
OSC
OSC
to 10kΩ
11
20kΩ
330pF
7
0Ω to
SIG
8
OSCH
SIG
QUICK
START
SIGNAL
OUTPUT
OSC select
SELO-GND: Pull-down
Saw OSC
During IC power supply is
applied, it must not be
changed.
CONTROL
LOGIC
6
REF
14
HALL
BIAS
LOCK
PROTECT
TSD
HB 10
H+
0Ω to
H
9
Figure 30. Saw OSC application
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Substrate Design Note
1.
IC power, Motor outputs, and Motor ground lines should be made as wide as possible.
2.
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
capacitor or zener diode between VCC and GND. If necessary, add both.
The bypass capacitor and/or zener diode must be connected near to VCC terminal as much as possible.
3.
H+ and H- lines are arranged side by side and connected from the hall element to the IC as short as possible, because
it is easy for noise to affect the hall lines.
HALL
BIAS
Functional Descriptions
1.
Variable speed operation
The rotational speed is changed by PWM duty on the motor outputs (OUT1, OUT2 terminals).
(1) PWM Operation by DC input
As shown in Figure 32, to change the motor output PWM duty, a DC voltage input from TH terminal is compared
with triangle (saw) wave produced by internal OSC circuit. MIN terminal is used to set the minimum PWM duty.
The PWM duty is determined by the lower voltage between the TH voltage and the MIN voltage.
OSC
OSC
High
H+
Low
REF
5.0V
TH
MIN
OSC
REF
PWM
TH
LPF
H–
3.0V
1.05V
REF
GND
0.0V
High
MIN
OUT1
Low
Motor Output
ON
High
OUT2
Figure 31. DC input application
Low
Full
Motor
Torque
Min.
Zero
Figure 32. DC Input Operation Timing Chart
Dividing resistor of REF generates OSC high level (Typ.3.0V) and OSC low level (Typ.1.05V) voltage, and the ratio
of those voltages is designed to be hard to fluctuate. For an application that requires strict precision, determine a
value with sufficient margin after taking full consideration of external constants.
(Note) In BD6995FV, the speed control with the direct PWM input is impossible.
(2) Setting of TH and MIN Terminals
The voltage of the TH terminal or MIN terminal becomes irregular when it is open. Please apply voltages to both
terminals when turning on IC power supply.
Setting less than OSC High level
(Torque ON setting)
OK
REF
TH
MIN
Pull up setting
(Torque OFF setting)
OK
REF
Pull down setting
(Full speed setting)
OK
TH
MIN
REF
TH
MIN
Open setting
(Prohibit input)
NG
REF
TH
MIN
Figure 33. Setting of the Variable Speed Function
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
(3)-1 Output Oscillatory Frequency Setting (Triangle OSC: SELO=H or OPEN, OSCH=OPEN)
Frequency (fosc) in which the motor outputs are operated PWM by DC voltage input is set according to capacity
value (Cosc) of the capacitor connected with OSC terminal.
fOSC = |IDOSC x ICOSC| / (COSC x (|IDOSC| + |ICOSC|) x (VOSCH - VOSCL)) [Hz]
fOSC: OSC frequency [Hz]
COSC: Capacitance between OSC and GND [F]
IDOSC: OSC discharge current [A] (Typ: 11μA)
ICOSC: OSC charge current [A] (Typ: -11μA)
VOSCH: OSC high voltage [V] (Typ: 3.0V)
VOSCL: OSC low voltage [V] (Typ: 1.05V)
OSC
COSC
OSC
OSCH
Figure 34. Triangle OSC Application
(Example.) The frequency when motor output PWM operates becomes about 28.2 kHz when assuming that Cosc
is 100pF.
fOSC = |11μ x -11μ| / (100p x (|11μ| + |-11μ|) x (3.0 - 1.05)) = 28.2 [kHz]
When this application is used in a wide temperature range, fluctuation range of the frequency becomes large by
individual difference and temperature characteristics of the IC. For an application that requires quiet, determine a
value with sufficient margin that frequency becomes outside of audible range. When the triangle OSC is used,
please set OSCH terminal open.
(3)-2 Output Oscillatory Frequency Setting (Saw OSC: SELO=L)
Frequency (fosc) in which the motor outputs are operated PWM by DC voltage input is set according to R1 and R2
and COSC.
TRISE = - {RH x R2 x C / (RH + R2)} x ln {(VOSCH - (R2 x VREF) / (RH + R2)) / (VOSCL - (R2 x VREF) / (RH + R2))} [s]
RH = R1 + ROSCH [Ω]
TFALL = - R2 x C x ln (VOSCL / VOSCH) [s]
fOSC = 1 / (TRISE + TFALL) [Hz]
INTERNAL REG
ROSCH: Internal resistor (Typ: 5kΩ)
R2
OSC
OSC
TRISE: OSC rise time [s]
R1
TFALL: OSC fall time [s]
fOSC: OSC frequency [Hz]
COSC
OSCH
COSC: Capacitance between OSC and GND [F]
VREF: REF voltage [V] (Typ: 5.0V)
VOSCH: OSC high voltage [V] (Typ: 3.0V)
Figure 35. Saw OSC Application
VOSCL: OSC low voltage [V] (Typ: 1.05V)
ROSCH=5k
Ω
OSCH
Figure 36. OSCH Circuit
(Example.) The frequency when motor output PWM operates becomes about 23.9 kHz when assuming that ROSCH
is 5kΩ and R1 is 20kΩ, R2=100kΩ and COSC is 330pF.
TRISE = - {25k x 100k x 330p / (25k + 100k)} x ln {(3 - (100k x 5) / (25k+100k)) / (1.05 - (100k x 5) / (25k+100k))}
= 7.14 [µs]
TFALL = - 100k x 330p x ln (1.05 / 3)
= 34.64 [µs]
fOSC = 1 / (7.14µ + 34.64µ)
= 23.9 [kHz]
When this application is comprised of external parts of good temperature characteristics, there is less frequency
fluctuation compared to triangle OSC. When the frequency fluctuation needs to be suppressed, saw OSC is
recommended.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
14/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
2.
Lock Protection and Automatic Restart
Motor rotation is detected by hall signal and the IC internal counter set lock detection ON time (tON) and OFF time (tOFF).
Timing chart is shown in Figure 37. The soft switching of OUT1 and OUT2 is not included in this timing chart.
Motor idling
H–
High
H+
Low
tON (Typ 0.5s)
tOFF (Typ 5.0s)
tOFF
tON
tOFF
tON
High
OUT1
Low
High
OUT2
Low
High
SIG(FG)
Low
High
SIG(AL)
Low
Motor lock Lock detection
Lock release
: High impedance
Figure 37. Timing chart of Lock Protection
3.
Quick Start and Standby
When the motor stopped by torque OFF voltage (VTH>VOSCH) restarts by torque ON voltage (VTH<VOSCH), the motor is
not affected by the lock protection function. The motor can restart immediately anytime.
In the case of minimum PWM duty OFF setting (VMIN>VOSCH), this function is enable.
(1) When torque OFF voltage is input during motor rotation:
The lock protection function is disabled. Restart failure is prevented.
(2) When torque OFF voltage is input during motor rotation and 0.5 second (Typ) passed from the last hall input signal
change:
IC goes to standby mode. (Lock protection function remains disabled.)
In standby mode, OUT1 and OUT2 and SIG (FG) become Hi-Z logic and SIG (AL) becomes L logic.
When torque ON voltage is inputted at the standby mode, the motor can restart (AL logic is L).
Timing chart is shown in Figure 38.
(3) When torque OFF voltage is input during lock protection:
Since 0.5 second (Typ) passed from the last hall input signal change, IC goes to standby mode immediately.
(Note)
When torque OFF voltage is input in a timing same as lock protection, IC goes to standby mode immediately.
Because OUT1 and OUT2 become Hi-Z logic, when coil current is left, current returns to power supply. When the
above mentioned timing is assumed, please take measures of item2 of safety measures or please increase the
value of the filter of TH terminal in an application circuit. (More than 20kΩ, 1μF)
Motor restart
Motor idling
High
SIG(FG)
Low
TH
OSCH
Typ 500μs
Enable
Quick Start
Lock Protection
Function
Standby
Disable
Enable
Typ 0.5s
Standby
Internal signal
Typ 5ms
Torque OFF
Stand by
Disable
Torque ON
Stand by release
: High impedance
Figure 38. Timing chart of Quick start and Standby
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
4.
Hall Input Setting
(1) Hall Input Setting
Hall input voltage range is shown in operating conditions. The input voltage of a hall comparator is input in "hall input
voltage range" including signal amplitude. The input current to Hall element can be adjusted with R1 resistor.
Hall input upper limit
H–
Hall bias current
IH[A] = VHB[V] / (RH+R1)[Ω]
IH
3V (Vcc>9V)
Vcc/3V (Vcc<9V)
HALL
BIAS
HB
C1
H+
Hall
Operating hall input
voltage range
H–
H–
HALL
COMP
H+
Hall input lower limit
RH
H+
0V
C2
R1
Figure 39. Hall Input Voltage Range
Figure 40. Hall input application
(2) Reducing the Noise of Hall Signal
VCC noise or the like depending on the wiring pattern of board may affect Hall element. In this case, place a
capacitor C1 as shown Figure 40. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, insert a capacitor C2.
5.
Current Limit
The current limit circuit turns off the upper side output, when the current that flows to the motor coil is detected
exceeding a set value. The current limit value is controlled by internal setting voltage (Typ: 265mV) and current sense
resistor. In Figure 41, IO is the current flowing to the motor coil, RNF is the resistance detecting the current, and PRMAX is
the power consumption of RNF.
IO[A] = VCL[V] / RNF[Ω]
= 265[mV] / 0.33[Ω]
= 0.803[A]
OUT1
M
PRMAX[W] = VCL[V] x IO[A]
= 265[mV] x 0.803[A]
= 0.213[W]
OUT2
RNF
IO
VCL
GND
RNF
CURRENT
LIMIT COMP
IC Signal Ground Line
Motor Ground Line
－
Figure 41. Setting of current limit and ground lines
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
6.
HALL
SoftBIAS
Switching Period and Recirculating Period
BD6995FV has the soft switching period (Note1) and the recirculating period (Note2). The width of each period is set as
follows. The soft switching period is approximately 28 degrees (5 steps). The recirculating period is approximately 11
degrees. Timing chart is shown in Figure 42.
(Note1) The soft switching period is the period when a duty of the output changes to a target duty from 0% or 0% from
a target duty.
(Note2) The recirculating period is the period when coil current recirculates before phase switching of output.
H+
H–
One period of hall signal : 360°
HALL
BIAS
High
OUT1
Low
High
OUT2
Low
Current
0A
Soft switching period
Recirculating period
Figure 42. Timing Chart of Soft switching period and Recirculating period
I/O Equivalence Circuit (Resistance Values are Typical)
1. Power supply terminal,
Ground terminal
2. Hall+, Hall- terminals,
TH, MIN terminals
3. OUT1, OUT2 terminals,
RNF terminal
4. REF terminal
HB terminal
VCC
VCC
VCC
H+
H–
TH
MIN
GND
OUT1
REF
HB
OUT2
RNF
1kΩ
5. SELS, SELO terminals
INTERNAL REG INTERNAL REG
6. OSC terminal
7. OSCH terminal
8. SIG terminal
INTERNAL REG
VCC
150kΩ
SELS
SELO
10kΩ
1kΩ
1kΩ
5kΩ
OSCH
5Ω
SIG
OSC
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Safety Measure
1.
Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 43. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
After reverse connection
In normal energization
Reverse power connection
VCC
destruction prevention
VCC
I/O
Circuit
VCC
I/O
Circuit
Block
Circuit
Block
GND
GND
Internal circuit impedance is high
Amperage small
I/O
Block
GND
Large current flows
Thermal destruction
No destruction
Figure 43. Flow of Current When Power is Connected Reversely
HALL
BIAS
2.
Measure against VCC Voltage Rise by Back Electromotive Force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
Phase
Switching
ON
ON
ON
Figure 44. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A)
Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C).
(A) Capacitor
(B) Zenner diode
ON
ON
ON
3.
4.
(C) Capacitor & Zenner diode
ON
ON
ON
Figure 45. Measure against Vcc and Motor Driving Outputs Voltage
Rise at Regenerative Braking
Problem of GND line PWM Switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
Protection of SIG Open-Drain Output
SIG output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. When SIG terminal is
directly connected to power supply, it will exceed the absolute maximum rating that could damage the IC.
Motor Unit
VCC
Controller
Motor
Driver
Driver
M
SIG
Protection
Resistor
Pull-up
Resistor
Connector
GND
PWM Input
Prohibit
Figure 46. GND Line PWM Switching Prohibited
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
18/25
Figure 47. Protection of SIG Terminal
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Power Consumption
1. Current Pathway
The current pathways that is related to heat generation of driver IC are the following, and shown in Figure 48.
(1) Circuit Current (ICC)
(2) Motor Driving Current (IM)
(3) Reference Current (IREF)
(4) Hall Bias Current (IHB)
(5) SIG Output Sink Current (ISIG)
(6) Coil Current at the time of Phase Change (ICH)
(It is added only when coil current is left at the time of phase change like Figure 49.)
M
ICH
1
2
OUT1
RNF
OUT2
GND
3
1μF to
VCC
CURRENT
LIMITER
PRE
DRIVER
FUNCTION
SELECTOR
SELO
FUNCTION
SELECTOR
SELS
ICC
－
15
INTERNAL
REG
IM
＋
16
4
5
PWM
MIN
TH
PWM
CONTROL
REF
HALL
COMP
to 10kΩ
12
IREF
0.1μF to
H–
OSC
OSC
13
CONTROL
LOGIC
6
REF
14
11
IHB
100pF
7
0Ω to
SIG
8
QUICK
START
OSCH
SIG
HALL
BIAS
SIGNAL
OUTPUT
LOCK
PROTECT
TSD
HB
H+
0Ω to
H
10
9
ISIG
Figure 48. Current Pathway
2. Calculation of Power Consumption
(1) Circuit Current (ICC)
PW1 = VCC x ICC [W]
H+
(2) Motor Driving Current (IM)
PW2 = ((VOH+VOL) x IM) [W]
H–
High
OUT1
where:
VOH is the output high voltage [V]
VOL is the output low voltage [V]
IM is the motor driving average current [A]
(3) Reference Current (IREF)
PW3 = (VCC - VREF) x IREF [W]
T
Low
High
OUT2
Low
T1
ICH
Coil Current
0A
(4) Hall Bias Current (IHB)
PW4 = (VCC - VHB) x IHB [W]
(5) SIG Output Sink Current (ISIG)
PW5 = VSIG x ISIG [W]
Figure 49. Waveform example
(When coil current is left at the time of phase change)
(6) Coil Current at the time of Phase Change (ICH)
PW6 = VCC x ICH x 1/2 x T1/T [W]
where:
ICH is the coil current at the time of phase change [A]
Total power consumption of driver IC becomes the following by the above (1) to (6).
PW(ttl) = PW1 + PW2 + PW3 + PW4 + PW5 + (PW6) [W]
Refer to next page to calculate the chip surface temperature (Tj) from the power consumption value.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Power Dissipation
1. Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be allowed by IC chip into the package is the absolute maximum rating of the junction
temperature, and depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this
maximum junction temperature, the thermal resistance in the state of the substrate mounting, and the ambient
temperature. Therefore, when the power dissipation exceeds the absolute maximum rating, the operating temperature
range is not a guarantee. The maximum junction temperature is in general equal to the maximum value in the storage
temperature range.
2. Thermal Resistance
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter
which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of
the substrate mounting, thermal resistance from the chip junction to the ambient is shown in θJA [°C/W], and thermal
characterization parameter from junction to the top center of the outside surface of the component package is shown
in ΨJT [°C/W]. Thermal resistance is classified into the package part and the substrate part, and thermal resistance in
the package part depends on the composition materials such as the mold resins and the lead frames. On the other
hand, thermal resistance in the substrate part depends on the substrate heat dissipation capability of the material, the
size, and the copper foil area etc. Therefore, thermal resistance can be decreased by the heat radiation measures like
installing a heat sink etc. in the mounting substrate.
The thermal resistance model is shown in Figure 50, and Equation is shown below.
θJA = (Tj – Ta) / P [ºC/W]
ΨJT = (Tj – Tt) / P [ºC/W]
Ambient temperature: Ta[°C]
Package outside surface (top center)
temperature: Tt[°C]
θJA[°C/W]
where:
θJA is the thermal resistance from junction
to ambient [ºC/W]
ΨJT is the thermal characterization parameter from
junction to the top center of the outside surface of the
component package [ºC/W]
Tj is the junction temperature [ºC]
Ta is the ambient temperature [ºC]
Tt is the package outside surface (top center)
temperature [ºC]
P is the power consumption [W]
Junction temperature: Tj[°C]
ΨJT[°C/W]
Mounting Substrate
Figure 50. Thermal Resistance Model of Surface Mount
Even if it uses the same package, θJA and ΨJT are changed depending on the chip size, power consumption, and the
measurement environments of the ambient temperature, the mounting condition, and the wind velocity, etc.
3. Thermal De-rating Curve
Thermal de-rating curve indicates power that can be consumed by the IC with reference to ambient temperature.
Power that can be consumed by IC begins to attenuate at certain ambient temperature (25°C), and becomes 0W at the
maximum junction temperature (150°C). The inclination is reduced by the reciprocal of thermal resistance θja. The
thermal de-rating curve under a condition of thermal resistance (P.3) is shown in Figure 51.
Power Dissipation: Pd[W]
1.0
0.8
-1/θJA = -7.1mW/°C
0.6
0.4
Operating temperature range
0.2
0.0
-50
-25
0
25
50
75
100
125
150
Ambient Temperature: Ta[°C]
Figure 51. Power Dissipation vs Ambient Temperature
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
21/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 52. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
22/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Ordering Information
B D
6
9
9
5
Part Number
F
V
-
Package
FV: SSOP-B16
GE2
Packaging and forming specification
G: Halogen free
E2: Embossed tape and reel
Marking Diagrams
SSOP-B16
(TOP VIEW)
D 6 9 9 5
Part Number
LOT Number
1PIN Mark
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B16
24/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
BD6995FV
Revision History
Date
Revision
24.Jun.2016
001
Changes
New Release
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
25/25
TSZ02201-0H1H0B101580-1-2
24.Jun.2016 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD6995FV - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD6995FV
SSOP-B16
2500
2500
Taping
inquiry
Yes