Renesas HD64338425 Renesas 8-bit single-chip microcomputer h8 family/h8/300l super low power sery Datasheet

REJ09B0144-0600
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
8
H8/3827R Group, H8/3827S Group,
H8/38327 Group, H8/38427 Group
Hardware Manual
Renesas 8-Bit Single-Chip Microcomputer
H8 Family/H8/300L Super Low Power Series
H8/3827R Group
H8/3827S Group
H8/3822R
H8/3823R
H8/3824R
H8/3825R
H8/3826R
H8/3827R
H8/3824S
H8/3825S
H8/3826S
H8/3827S
H8/38327 Group
H8/38427 Group
Rev. 6.00
Revision Date: Aug 04, 2006
H8/38322
H8/38323
H8/38324
H8/38325
H8/38326
H8/38327
H8/38422
H8/38423
H8/38424
H8/38425
H8/38426
H8/38427
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
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semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
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Technology Corp. product best suited to the customer's application; they do not convey any license
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a third party.
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circuit application examples contained in these materials.
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The information described here may contain technical inaccuracies or typographical errors.
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Rev. 6.00 Aug 04, 2006 page ii of xxxiv
Preface
The H8/3827R Group, H8/3827S Group, H8/38327 Group, and H8/38427 Group are highperformance single-chip microcomputers that integrate peripheral functions necessary for system
configuration with an H8/300L CPU core.
The on-chip peripheral functions include ROM, RAM, six timers, 14-bit PWM, a serial
communication interface (SCI), an A/D converter, LCD controller/driver, and I/O ports, providing
an ideal configuration as a microcomputer for embedding in sophisticated control systems. PROM
(ZTAT™*1), flash memory (F-ZTAT™*2), and mask ROM are available as on-chip ROM,
enabling users to respond quickly and flexibly to changing application specifications and the
demands of the transition from initial to full-fledged volume production.
Notes: 1. ZTAT is a trademark of Renesas Technology Corp.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group. Readers using this manual require a basic knowledge of
electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3827R Group, H8/3827S
Group, H8/38327 Group, and H8/38427 Group. Details of execution
instructions can be found in the H8/300L Series Programming Manual,
which should be read in conjunction with the present manual.
Using this Manual:
• For an overall understanding of the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
• For a detailed understanding of CPU functions
Refer to the separate publication H8/300L Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Rev. 6.00 Aug 04, 2006 page iii of xxxiv
Notes: The following limitations apply when using the on-chip emulator for program
development and debugging.
1. Pin P32 is reserved for use exclusively by the on-chip emulator and cannot be used for
other operations.
2. Pins P85, P86, and P87 cannot be used. In order to use these pins it is necessary to
install additional hardware on the user board.
3. The address area from H'E000 to H'EFFF is used by the on-chip emulator and therefore
cannot be accessed by the user.
4. The address area from H'F300 to H'F6FF must not be accessed under any
circumstances.
5. When the on-chip emulator is used, pin P32 functions as an I/O pin, pins P85 and P86
function as input pins, and pin P87 functions as an output pin.
6. It is necessary to change the user board for LCD display debugging. This item does not
apply if LCD display is not used or if the emulator is not operated in writer mode.
User Board Changes
The following changes are necessary.
• Connect pin V1 to the VCC power supply. Also connect capacitors and resistors to
pins V1, V2, and V3. Connect a capacitor and a resistor to pins V1, V2, and V3.
• No SEG signals are output from pins P85/SEG30, P86/SEG31, and P87/SEG32, so
the display is unstable. In addition, a DC voltage is applied. If damage to the LCD is
a concern, disconnect the above three pins from the LCD.
A connection example is shown below. Refer to the emulator user’s manual for
information on other settings.
LCD
LCD
Vcc
Disconnect
Connect
V0
V1
H8/38327
H8/38427
Disconnect
Vcc
Vcc
Connect
R = 240 Ω*
C = 0.1 µF*
P85/SEG30
H8/38327
H8/38427
P85/SEG30
V2
P86/SEG31
R V2
P86/SEG31
V3
P87/SEG32
R V3
P87/SEG32
Emulator
connectors
R
C C C
Normal Operation
Emulator
connectors
Debugging
Note: *
Rev. 6.00 Aug 04, 2006 page iv of xxxiv
Connect
Vcc
Disonnect
V0
R and C values are intended only as guidelines.
They may be adjusted based on the indications.
7. During a break, the watchdog timer continues to operate. Therefore, an internal reset is
generated if an overflow occurs during the break.
Related Material:
The latest information is available at our Web Site. Please make sure that you
have the most up-to-date information available. (http://www.renesas.com/)
User's Manuals on this LSI:
Manual Title
Document No.
H8/3827R Group, H8/3827S Group, H8/38327 Group, H8/38427 Group
Hardware Manual
This manual
H8/300L Series Programming Manual
REJ09B0214-0200
User's manuals for development tools:
Manual Title
Document No.
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual
REJ10B0161-0100
H8S, H8/300 Series Simulator/Debugger User’s Manual
REJ10B0211-0200
High-Performance Embedded Workshop User’s Manual
ADE-702-201
H8S, H8/300 Series High-Performance Embedded Workshop,
High-Performance Debugging Interface User’s Manual
ADE-702-231
Application Note:
Manual Title
Document No.
H8/300L Series Application Note
ADE-502-065
Rev. 6.00 Aug 04, 2006 page v of xxxiv
Rev. 6.00 Aug 04, 2006 page vi of xxxiv
Main Revisions for this Edition
Item
Page
Revision (See Manual for Details)
All

“Under development” indication deleted from H8/38427 Group
Preface
iv
Note 6. (User Board Changes) amended, and note 7. added
6. It is necessary to change the user board for LCD display
debugging. This item does not apply if LCD display is not used
or if the emulator is not operated in writer mode.
User Board Changes
The following changes are necessary.
• Connect pin V1 to the VCC power supply. Also connect
capacitors and resistors to pins V1, V2, and V3. Connect a
capacitor and a resistor to pins V1, V2, and V3.
LCD
LCD
Vcc
Disconnect
Connect
V0
V1
Disconnect
Vcc
H8/38327
H8/38427
Vcc
Connect
R = 240 Ω*
C = 0.1 µF*
P85/SEG30
H8/38327
H8/38427
P85/SEG30
V2
P86/SEG31
R V2
P86/SEG31
V3
P87/SEG32
R V3
P87/SEG32
Emulator
connectors
R
C C C
Normal Operation
Connect
Vcc
Disonnect
V0
Emulator
connectors
Debugging
Note: *
R and C values are intended only as guidelines.
They may be adjusted based on the indications.
7. During a break, the watchdog timer continues to operate.
Therefore, an internal reset is generated if an overflow occurs
during the break.
1.3.2 Pin Functions
28
Table 1.6 Pin
Functions
8.3.1 Overview
Table amended
Pin No.
203
Type
Symbol
FP-80A
TFP-80C FP-80B
System
control
TEST
8
10
I/O
Name and Functions
Input
Test pin: This pin is reserved and
cannot be used. It should be connected
to VSS.
Description amended
Port 3 is a 8-bit I/O port, configured as shown in figure 8.2.
In the F-ZTAT version, the on-chip pull-up MOS for pin P32 is on
during the reset period. It turns off and normal operation resumes
after the reset is cleared. This should be considered when making
connections to external circuitry. Note that in the mask ROM and
ZTAT versions P32 continues to operate normally.
Rev. 6.00 Aug 04, 2006 page vii of xxxiv
Item
Page
Revision (See Manual for Details)
8.3.4 Pin States
211
Table and notes amended
Table 8.7 Port 3 Pin
States
Pins
Reset
P37/AEVL
P36/AEVH
P35/TXD31
P34/RXD31
P33/SCK31
HighRetains
impedance previous
state
Sleep
P32/RESO*2
RESO
output
P32*4
Pull-up
MOS on
Subsleep
Standby
Retains
previous
state
HighRetains
impedance*1 previous
state
Watch
Subactive
Active
Functional
Functional
P32*3
Highimpedance
P31/UD*2
3*4
*
P31/UD/EXCL
P30/PWM
Notes: 1.
2.
3.
4.
8.12.1 The
Management of the
Un-Use Terminal
236
A high-level signal is output when the MOS pull-up is in the on state.
Applies to H8/3827R Group and H8/3827S Group.
Applies to the mask ROM version of the H8/38327 Group and H8/38427 Group.
Applies to the F-ZTAT version of the H8/38327 Group and H8/38427 Group.
Description amended
•
If an unused pin is an output pin, handle it in one of the
following ways:
 Set the output of the unused pin to high and pull it up to
VCC with an external resistor of approximately 100 kΩ.
 Set the output of the unused pin to low and pull it down to
Vss with an external resistor of approximately 100 kΩ.
C.2 Block Diagrams
of Port 3
593
Figure title amended
Figure C.2 (e-2)
Port 3 Block Diagram
(Pin P32 in the Mask
ROM Version of the
H8/38327 Group and
H8/38427 Group)
Figure C.2 (e-3)
594
Port 3 Block Diagram
(Pin P32 in the F-ZTAT
Version of the
H8/38327 Group and
H8/38427 Group)
Newly added
Rev. 6.00 Aug 04, 2006 page viii of xxxiv
Item
Page
Appendix D Port
608
States in the Different
Processing States
Table D.1 Port States
Overview
Revision (See Manual for Details)
Notes amended
Notes: 1. High level output when MOS pull-up is in on state.
2. Reset output from P32 pin only (H8/3827R Group and
H8/3827S Group).
On-chip pull-up MOS turns on for pin P32 only (FZTAT Version of the H8/38327 Group and H8/38427
Group).
Rev. 6.00 Aug 04, 2006 page ix of xxxiv
Rev. 6.00 Aug 04, 2006 page x of xxxiv
Contents
Section 1 Overview .............................................................................................................
1.1
1.2
1.3
1
Overview........................................................................................................................... 1
Internal Block Diagram..................................................................................................... 6
Pin Arrangement and Functions........................................................................................ 8
1.3.1 Pin Arrangement .................................................................................................. 8
1.3.2 Pin Functions ....................................................................................................... 27
Section 2 CPU ...................................................................................................................... 33
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Overview...........................................................................................................................
2.1.1 Features................................................................................................................
2.1.2 Address Space......................................................................................................
2.1.3 Register Configuration.........................................................................................
Register Descriptions ........................................................................................................
2.2.1 General Registers .................................................................................................
2.2.2 Control Registers .................................................................................................
2.2.3 Initial Register Values..........................................................................................
Data Formats .....................................................................................................................
2.3.1 Data Formats in General Registers ......................................................................
2.3.2 Memory Data Formats .........................................................................................
Addressing Modes.............................................................................................................
2.4.1 Addressing Modes ...............................................................................................
2.4.2 Effective Address Calculation..............................................................................
Instruction Set ...................................................................................................................
2.5.1 Data Transfer Instructions....................................................................................
2.5.2 Arithmetic Operations..........................................................................................
2.5.3 Logic Operations..................................................................................................
2.5.4 Shift Operations ...................................................................................................
2.5.5 Bit Manipulations.................................................................................................
2.5.6 Branching Instructions .........................................................................................
2.5.7 System Control Instructions.................................................................................
2.5.8 Block Data Transfer Instruction...........................................................................
Basic Operational Timing .................................................................................................
2.6.1 Access to On-Chip Memory (RAM, ROM).........................................................
2.6.2 Access to On-Chip Peripheral Modules...............................................................
CPU States ........................................................................................................................
2.7.1 Overview..............................................................................................................
2.7.2 Program Execution State......................................................................................
33
33
34
34
35
35
35
37
37
38
39
40
40
42
46
48
50
51
52
54
58
60
62
63
63
64
65
65
67
Rev. 6.00 Aug 04, 2006 page xi of xxxiv
2.8
2.9
2.7.3 Program Halt State...............................................................................................
2.7.4 Exception-Handling State ....................................................................................
Memory Map ....................................................................................................................
2.8.1 Memory Map .......................................................................................................
Application Notes .............................................................................................................
2.9.1 Notes on Data Access ..........................................................................................
2.9.2 Notes on Bit Manipulation...................................................................................
2.9.3 Notes on Use of the EEPMOV Instruction ..........................................................
67
67
68
68
74
74
76
82
Section 3 Exception Handling ......................................................................................... 83
3.1
3.2
3.3
3.4
Overview...........................................................................................................................
Reset..................................................................................................................................
3.2.1 Overview..............................................................................................................
3.2.2 Reset Sequence ....................................................................................................
3.2.3 Interrupt Immediately after Reset ........................................................................
Interrupts ...........................................................................................................................
3.3.1 Overview..............................................................................................................
3.3.2 Interrupt Control Registers...................................................................................
3.3.3 External Interrupts ...............................................................................................
3.3.4 Internal Interrupts.................................................................................................
3.3.5 Interrupt Operations .............................................................................................
3.3.6 Interrupt Response Time......................................................................................
Application Notes .............................................................................................................
3.4.1 Notes on Stack Area Use .....................................................................................
3.4.2 Notes on Rewriting Port Mode Registers.............................................................
3.4.3 Method for Clearing Interrupt Request Flags ......................................................
83
83
83
83
84
85
85
87
97
98
99
104
105
105
106
108
Section 4 Clock Pulse Generators ................................................................................... 109
4.1
4.2
4.3
4.4
4.5
Overview...........................................................................................................................
4.1.1 Block Diagram .....................................................................................................
4.1.2 System Clock and Subclock.................................................................................
System Clock Generator ...................................................................................................
Subclock Generator...........................................................................................................
Prescalers ..........................................................................................................................
Note on Oscillators............................................................................................................
4.5.1 Definition of Oscillation Stabilization Wait Time ...............................................
4.5.2 Notes on Use of Crystal Oscillator Element (Excluding Ceramic Oscillator
Element)...............................................................................................................
Rev. 6.00 Aug 04, 2006 page xii of xxxiv
109
109
109
110
112
115
116
117
119
Section 5 Power-Down Modes ........................................................................................ 121
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
Overview...........................................................................................................................
5.1.1 System Control Registers.....................................................................................
Sleep Mode .......................................................................................................................
5.2.1 Transition to Sleep Mode.....................................................................................
5.2.2 Clearing Sleep Mode............................................................................................
5.2.3 Clock Frequency in Sleep (Medium-Speed) Mode..............................................
Standby Mode ...................................................................................................................
5.3.1 Transition to Standby Mode.................................................................................
5.3.2 Clearing Standby Mode .......................................................................................
5.3.3 Oscillator Settling Time after Standby Mode is Cleared .....................................
5.3.4 Standby Mode Transition and Pin States .............................................................
5.3.5 Notes on External Input Signal Changes before/after Standby Mode..................
Watch Mode......................................................................................................................
5.4.1 Transition to Watch Mode ...................................................................................
5.4.2 Clearing Watch Mode ..........................................................................................
5.4.3 Oscillator Settling Time after Watch Mode is Cleared ........................................
5.4.4 Notes on External Input Signal Changes before/after Watch Mode ....................
Subsleep Mode..................................................................................................................
5.5.1 Transition to Subsleep Mode ...............................................................................
5.5.2 Clearing Subsleep Mode ......................................................................................
Subactive Mode ................................................................................................................
5.6.1 Transition to Subactive Mode ..............................................................................
5.6.2 Clearing Subactive Mode.....................................................................................
5.6.3 Operating Frequency in Subactive Mode.............................................................
Active (Medium-Speed) Mode .........................................................................................
5.7.1 Transition to Active (Medium-Speed) Mode .......................................................
5.7.2 Clearing Active (Medium-Speed) Mode..............................................................
5.7.3 Operating Frequency in Active (Medium-Speed) Mode......................................
Direct Transfer ..................................................................................................................
5.8.1 Overview of Direct Transfer ................................................................................
5.8.2 Direct Transition Times .......................................................................................
5.8.3 Notes on External Input Signal Changes before/after Direct Transition..............
Module Standby Mode......................................................................................................
5.9.1 Setting Module Standby Mode ............................................................................
5.9.2 Clearing Module Standby Mode ..........................................................................
5.9.3 Usage Note...........................................................................................................
121
124
128
128
129
129
129
129
130
131
131
132
134
134
134
134
135
135
135
135
136
136
136
136
137
137
137
137
138
138
139
141
142
142
142
144
Section 6 ROM ..................................................................................................................... 145
6.1
Overview........................................................................................................................... 145
Rev. 6.00 Aug 04, 2006 page xiii of xxxiv
6.1.1 Block Diagram .....................................................................................................
H8/3827R PROM Mode ...................................................................................................
6.2.1 Setting to PROM Mode .......................................................................................
6.2.2 Socket Adapter Pin Arrangement and Memory Map...........................................
6.3 H8/3827R Programming ...................................................................................................
6.3.1 Writing and Verifying..........................................................................................
6.3.2 Programming Precautions ....................................................................................
6.4 Reliability of Programmed Data .......................................................................................
6.5 Flash Memory Overview...................................................................................................
6.5.1 Features................................................................................................................
6.5.2 Block Diagram .....................................................................................................
6.5.3 Block Configuration.............................................................................................
6.5.4 Register Configuration.........................................................................................
6.6 Descriptions of Registers of the Flash Memory................................................................
6.6.1 Flash Memory Control Register 1 (FLMCR1).....................................................
6.6.2 Flash Memory Control Register 2 (FLMCR2).....................................................
6.6.3 Erase Block Register (EBR) ................................................................................
6.6.4 Flash Memory Power Control Register (FLPWCR) ............................................
6.6.5 Flash Memory Enable Register (FENR) ..............................................................
6.7 On-Board Programming Modes ........................................................................................
6.7.1 Boot Mode ...........................................................................................................
6.7.2 Programming/Erasing in User Program Mode.....................................................
6.8 Flash Memory Programming/Erasing ...............................................................................
6.8.1 Program/Program-Verify .....................................................................................
6.8.2 Erase/Erase-Verify...............................................................................................
6.8.3 Interrupt Handling when Programming/Erasing Flash Memory..........................
6.9 Program/Erase Protection..................................................................................................
6.9.1 Hardware Protection ............................................................................................
6.9.2 Software Protection..............................................................................................
6.9.3 Error Protection....................................................................................................
6.10 Programmer Mode ............................................................................................................
6.10.1 Socket Adapter.....................................................................................................
6.10.2 Programmer Mode Commands ............................................................................
6.10.3 Memory Read Mode ............................................................................................
6.10.4 Auto-Program Mode ............................................................................................
6.10.5 Auto-Erase Mode .................................................................................................
6.10.6 Status Read Mode ................................................................................................
6.10.7 Status Polling .......................................................................................................
6.10.8 Programmer Mode Transition Time.....................................................................
6.10.9 Notes on Memory Programming..........................................................................
6.2
Rev. 6.00 Aug 04, 2006 page xiv of xxxiv
145
146
146
146
149
149
154
155
156
156
157
157
159
160
160
162
163
164
165
166
166
169
169
170
173
173
175
175
175
175
176
176
176
179
182
184
185
187
188
188
6.11 Power-Down States for Flash Memory............................................................................. 189
Section 7 RAM ..................................................................................................................... 191
7.1
Overview........................................................................................................................... 191
7.1.1 Block Diagram ..................................................................................................... 191
Section 8 I/O Ports .............................................................................................................. 193
8.1
8.2
8.3
8.4
8.5
8.6
8.7
Overview...........................................................................................................................
Port 1.................................................................................................................................
8.2.1 Overview..............................................................................................................
8.2.2 Register Configuration and Description...............................................................
8.2.3 Pin Functions .......................................................................................................
8.2.4 Pin States..............................................................................................................
8.2.5 MOS Input Pull-Up..............................................................................................
Port 3.................................................................................................................................
8.3.1 Overview..............................................................................................................
8.3.2 Register Configuration and Description...............................................................
8.3.3 Pin Functions .......................................................................................................
8.3.4 Pin States..............................................................................................................
8.3.5 MOS Input Pull-Up..............................................................................................
Port 4.................................................................................................................................
8.4.1 Overview..............................................................................................................
8.4.2 Register Configuration and Description...............................................................
8.4.3 Pin Functions .......................................................................................................
8.4.4 Pin States..............................................................................................................
Port 5.................................................................................................................................
8.5.1 Overview..............................................................................................................
8.5.2 Register Configuration and Description...............................................................
8.5.3 Pin Functions .......................................................................................................
8.5.4 Pin States..............................................................................................................
8.5.5 MOS Input Pull-Up..............................................................................................
Port 6.................................................................................................................................
8.6.1 Overview..............................................................................................................
8.6.2 Register Configuration and Description...............................................................
8.6.3 Pin Functions .......................................................................................................
8.6.4 Pin States..............................................................................................................
8.6.5 MOS Input Pull-Up..............................................................................................
Port 7.................................................................................................................................
8.7.1 Overview..............................................................................................................
8.7.2 Register Configuration and Description...............................................................
193
195
195
195
200
202
202
203
203
203
209
211
211
212
212
212
214
215
215
215
216
218
218
219
219
219
220
221
222
222
223
223
223
Rev. 6.00 Aug 04, 2006 page xv of xxxiv
8.7.3 Pin Functions .......................................................................................................
8.7.4 Pin States..............................................................................................................
8.8 Port 8.................................................................................................................................
8.8.1 Overview..............................................................................................................
8.8.2 Register Configuration and Description...............................................................
8.8.3 Pin Functions .......................................................................................................
8.8.4 Pin States..............................................................................................................
8.9 Port A................................................................................................................................
8.9.1 Overview..............................................................................................................
8.9.2 Register Configuration and Description...............................................................
8.9.3 Pin Functions .......................................................................................................
8.9.4 Pin States..............................................................................................................
8.10 Port B ................................................................................................................................
8.10.1 Overview..............................................................................................................
8.10.2 Register Configuration and Description...............................................................
8.11 Input/Output Data Inversion Function ..............................................................................
8.11.1 Overview..............................................................................................................
8.11.2 Register Configuration and Descriptions .............................................................
8.11.3 Note on Modification of Serial Port Control Register .........................................
8.12 Application Note ...............................................................................................................
8.12.1 The Management of the Un-Use Terminal ..........................................................
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230
231
232
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232
233
233
233
234
236
236
236
Section 9 Timers .................................................................................................................. 237
9.1
9.2
9.3
9.4
Overview...........................................................................................................................
Timer A.............................................................................................................................
9.2.1 Overview..............................................................................................................
9.2.2 Register Descriptions ...........................................................................................
9.2.3 Timer Operation...................................................................................................
9.2.4 Timer A Operation States ....................................................................................
9.2.5 Application Note..................................................................................................
Timer C .............................................................................................................................
9.3.1 Overview..............................................................................................................
9.3.2 Register Descriptions ...........................................................................................
9.3.3 Timer Operation...................................................................................................
9.3.4 Timer C Operation States.....................................................................................
9.3.5 Usage Note...........................................................................................................
Timer F..............................................................................................................................
9.4.1 Overview..............................................................................................................
9.4.2 Register Descriptions ...........................................................................................
9.4.3 CPU Interface.......................................................................................................
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246
246
247
247
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252
254
255
256
256
259
266
9.5
9.6
9.7
9.4.4 Operation .............................................................................................................
9.4.5 Application Notes ................................................................................................
Timer G.............................................................................................................................
9.5.1 Overview..............................................................................................................
9.5.2 Register Descriptions ...........................................................................................
9.5.3 Noise Canceler .....................................................................................................
9.5.4 Operation .............................................................................................................
9.5.5 Application Notes ................................................................................................
9.5.6 Timer G Application Example .............................................................................
Watchdog Timer ...............................................................................................................
9.6.1 Overview..............................................................................................................
9.6.2 Register Descriptions ...........................................................................................
9.6.3 Timer Operation...................................................................................................
9.6.4 Watchdog Timer Operation States .......................................................................
Asynchronous Event Counter (AEC) ................................................................................
9.7.1 Overview..............................................................................................................
9.7.2 Register Descriptions ...........................................................................................
9.7.3 Operation .............................................................................................................
9.7.4 Asynchronous Event Counter Operation Modes..................................................
9.7.5 Application Notes ................................................................................................
269
272
276
276
279
284
286
291
295
296
296
297
301
302
303
303
305
310
311
312
Section 10 Serial Communication Interface ................................................................ 315
10.1 Overview...........................................................................................................................
10.1.1 Features................................................................................................................
10.1.2 Block Diagram .....................................................................................................
10.1.3 Pin Configuration.................................................................................................
10.1.4 Register Configuration.........................................................................................
10.2 Register Descriptions ........................................................................................................
10.2.1 Receive Shift Register (RSR) ..............................................................................
10.2.2 Receive Data Register (RDR) ..............................................................................
10.2.3 Transmit Shift Register (TSR) .............................................................................
10.2.4 Transmit Data Register (TDR).............................................................................
10.2.5 Serial Mode Register (SMR)................................................................................
10.2.6 Serial Control Register 3 (SCR3).........................................................................
10.2.7 Serial Status Register (SSR) ................................................................................
10.2.8 Bit Rate Register (BRR) ......................................................................................
10.2.9 Clock Stop Register 1 (CKSTPR1)......................................................................
10.2.10 Serial Port Control Register (SPCR)....................................................................
10.3 Operation...........................................................................................................................
10.3.1 Overview..............................................................................................................
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318
319
319
319
320
320
321
324
328
332
337
338
340
340
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10.3.2 Operation in Asynchronous Mode .......................................................................
10.3.3 Operation in Synchronous Mode .........................................................................
10.3.4 Multiprocessor Communication Function............................................................
10.4 Interrupts ...........................................................................................................................
10.5 Application Notes .............................................................................................................
345
354
361
368
369
Section 11 14-Bit PWM.....................................................................................................
11.1 Overview...........................................................................................................................
11.1.1 Features................................................................................................................
11.1.2 Block Diagram .....................................................................................................
11.1.3 Pin Configuration.................................................................................................
11.1.4 Register Configuration.........................................................................................
11.2 Register Descriptions ........................................................................................................
11.2.1 PWM Control Register (PWCR)..........................................................................
11.2.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................
11.2.3 Clock Stop Register 2 (CKSTPR2)......................................................................
11.3 Operation...........................................................................................................................
11.3.1 Operation .............................................................................................................
11.3.2 PWM Operation Modes .......................................................................................
375
375
375
376
376
377
377
377
378
379
380
380
381
Section 12 A/D Converter ................................................................................................. 383
12.1 Overview...........................................................................................................................
12.1.1 Features................................................................................................................
12.1.2 Block Diagram .....................................................................................................
12.1.3 Pin Configuration.................................................................................................
12.1.4 Register Configuration.........................................................................................
12.2 Register Descriptions ........................................................................................................
12.2.1 A/D Result Registers (ADRRH, ADRRL)...........................................................
12.2.2 A/D Mode Register (AMR) .................................................................................
12.2.3 A/D Start Register (ADSR)..................................................................................
12.2.4 Clock Stop Register 1 (CKSTPR1)......................................................................
12.3 Operation...........................................................................................................................
12.3.1 A/D Conversion Operation ..................................................................................
12.3.2 Start of A/D Conversion by External Trigger Input.............................................
12.3.3 A/D Converter Operation Modes .........................................................................
12.4 Interrupts ...........................................................................................................................
12.5 Typical Use .......................................................................................................................
12.6 Application Notes .............................................................................................................
12.6.1 Application Notes ................................................................................................
12.6.2 Permissible Signal Source Impedance .................................................................
Rev. 6.00 Aug 04, 2006 page xviii of xxxiv
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384
385
385
386
386
386
388
389
390
390
390
391
391
392
396
396
396
12.6.3 Influences on Absolute Precision......................................................................... 397
Section 13 LCD Controller/Driver .................................................................................
13.1 Overview...........................................................................................................................
13.1.1 Features................................................................................................................
13.1.2 Block Diagram .....................................................................................................
13.1.3 Pin Configuration.................................................................................................
13.1.4 Register Configuration.........................................................................................
13.2 Register Descriptions ........................................................................................................
13.2.1 LCD Port Control Register (LPCR).....................................................................
13.2.2 LCD Control Register (LCR)...............................................................................
13.2.3 LCD Control Register 2 (LCR2)..........................................................................
13.2.4 Clock Stop Register 2 (CKSTPR2)......................................................................
13.3 Operation...........................................................................................................................
13.3.1 Settings Up to LCD Display ................................................................................
13.3.2 Relationship between LCD RAM and Display ....................................................
13.3.3 Luminance Adjustment Function (V0 Pin)...........................................................
13.3.4 Low-Power-Consumption LCD Drive System ....................................................
13.3.5 Operation in Power-Down Modes .......................................................................
13.3.6 Boosting the LCD Drive Power Supply...............................................................
13.3.7 Connection to HD66100 ......................................................................................
399
399
399
400
401
401
402
402
404
406
408
409
409
412
419
420
424
425
426
Section 14 Power Supply Circuit .................................................................................... 429
14.1
14.2
14.3
14.4
14.5
Overview...........................................................................................................................
When Using Internal Power Supply Step-Down Circuit...................................................
When Not Using Internal Power Supply Step-Down Circuit............................................
H8/3827S Group ...............................................................................................................
Notes on Switching from the H8/3827R to the H8/38327 or H8/38427 ...........................
429
429
430
430
430
Section 15 Electrical Characteristics.............................................................................. 431
15.1 H8/3827R Group Absolute Maximum Ratings (Regular Specifications) .........................
15.2 H8/3827R Group Electrical Characteristics (Regular Specifications) ..............................
15.2.1 Power Supply Voltage and Operating Range.......................................................
15.2.2 DC Characteristics ...............................................................................................
15.2.3 AC Characteristics ...............................................................................................
15.2.4 A/D Converter Characteristics .............................................................................
15.2.5 LCD Characteristics.............................................................................................
15.3 H8/3827R Group Absolute Maximum Ratings (Wide-Range Specification) ...................
15.4 H8/3827R Group Electrical Characteristics (Wide-Range Specification) ........................
15.4.1 Power Supply Voltage and Operating Range.......................................................
431
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441
444
446
448
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Rev. 6.00 Aug 04, 2006 page xix of xxxiv
15.5
15.6
15.7
15.8
15.9
15.10
15.11
15.12
15.4.2 DC Characteristics ...............................................................................................
15.4.3 AC Characteristics ...............................................................................................
15.4.4 A/D Converter Characteristics .............................................................................
15.4.5 LCD Characteristics.............................................................................................
H8/3827S Group Absolute Maximum Ratings .................................................................
H8/3827S Group Electrical Characteristics ......................................................................
15.6.1 Power Supply Voltage and Operating Range.......................................................
15.6.2 DC Characteristics ...............................................................................................
15.6.3 AC Characteristics ...............................................................................................
15.6.4 A/D Converter Characteristics .............................................................................
15.6.5 LCD Characteristics.............................................................................................
Absolute Maximum Ratings of H8/38327 Group and H8/38427 Group ..........................
Electrical Characteristics of H8/38327 Group and H8/38427 Group................................
15.8.1 Power Supply Voltage and Operating Ranges .....................................................
15.8.2 DC Characteristics ...............................................................................................
15.8.3 AC Characteristics ...............................................................................................
15.8.4 A/D Converter Characteristics .............................................................................
15.8.5 LCD Characteristics.............................................................................................
15.8.6 Flash Memory Characteristics..............................................................................
Operation Timing..............................................................................................................
Output Load Circuit ..........................................................................................................
Resonator ..........................................................................................................................
Usage Note........................................................................................................................
452
458
461
463
465
466
466
468
474
477
479
480
481
481
484
492
495
496
497
499
503
503
504
Appendix A CPU Instruction Set .................................................................................... 505
A.1
A.2
A.3
Instructions........................................................................................................................ 505
Operation Code Map......................................................................................................... 513
Number of Execution States.............................................................................................. 515
Appendix B Internal I/O Registers ................................................................................. 520
B.1
B.2
Addresses .......................................................................................................................... 520
Functions........................................................................................................................... 525
Appendix C I/O Port Block Diagrams........................................................................... 584
C.1
C.2
C.3
C.4
C.5
C.6
Block Diagrams of Port 1..................................................................................................
Block Diagrams of Port 3..................................................................................................
Block Diagrams of Port 4..................................................................................................
Block Diagram of Port 5 ...................................................................................................
Block Diagram of Port 6 ...................................................................................................
Block Diagram of Port 7 ...................................................................................................
Rev. 6.00 Aug 04, 2006 page xx of xxxiv
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588
598
602
603
604
C.7
C.8
C.9
Block Diagrams of Port 8.................................................................................................. 605
Block Diagram of Port A .................................................................................................. 606
Block Diagram of Port B .................................................................................................. 607
Appendix D Port States in the Different Processing States ..................................... 608
Appendix E List of Product Codes................................................................................. 609
Appendix F Package Dimensions .................................................................................. 614
Appendix G Specifications of Chip Form .................................................................... 617
Appendix H Form of Bonding Pads ............................................................................... 619
Appendix I
Specifications of Chip Tray...................................................................... 622
Rev. 6.00 Aug 04, 2006 page xxi of xxxiv
Figures
Section 1 Overview
Figure 1.1 (1) Block Diagram (H8/3827R Group and H8/3827S Group).................................
Figure 1.1 (2) Block Diagram (H8/38327 Group and H8/38427 Group)..................................
Figure 1.2
Pin Arrangement (FP-80A, TFP-80C: Top View) .............................................
Figure 1.3
Pin Arrangement (FP-80B: Top View) ..............................................................
Figure 1.4
Bonding Pad Location Diagram of H8/3827R Group (Mask ROM Version)
(Top View).........................................................................................................
Figure 1.5
Bonding Pad Location Diagram of H8/3827S Group (Mask ROM Version)
(Top View).........................................................................................................
Figure 1.6
Bonding Pad Location Diagram of HCD64F38327 and HCD64F38427
(Top View).........................................................................................................
Figure 1.7
Bonding Pad Location Diagram of H8/38327 Group (Mask ROM Version)
and H8/38427 Group (Mask ROM Version) (Top View) ..................................
Section 2 CPU
Figure 2.1
CPU Registers....................................................................................................
Figure 2.2
Stack Pointer ......................................................................................................
Figure 2.3
Register Data Formats........................................................................................
Figure 2.4
Memory Data Formats .......................................................................................
Figure 2.5
Data Transfer Instruction Codes ........................................................................
Figure 2.6
Arithmetic, Logic, and Shift Instruction Codes .................................................
Figure 2.7
Bit Manipulation Instruction Codes ...................................................................
Figure 2.8
Branching Instruction Codes..............................................................................
Figure 2.9
System Control Instruction Codes .....................................................................
Figure 2.10
Block Data Transfer Instruction Code ...............................................................
Figure 2.11
On-Chip Memory Access Cycle ........................................................................
Figure 2.12
On-Chip Peripheral Module Access Cycle (2-State Access) .............................
Figure 2.13
On-Chip Peripheral Module Access Cycle (3-State Access) .............................
Figure 2.14
CPU Operation States ........................................................................................
Figure 2.15
State Transitions.................................................................................................
Figure 2.16(1) H8/3822R, H8/38322, and H8/38422 Memory Map .........................................
Figure 2.16(2) H8/3823R, H8/38323, and H8/38423 Memory Map .........................................
Figure 2.16(3) H8/3824R, H8/3824S, H8/38324, and H8/38424 Memory Map .......................
Figure 2.16(4) H8/3825R, H8/3825S, H8/38325, and H8/38425 Memory Map .......................
Figure 2.16(5) H8/3826R, H8/3826S, H8/38326, and H8/38426 Memory Map .......................
Figure 2.16(6) H8/3827R, H8/3827S, H8/38327, and H8/38427 Memory Map .......................
Rev. 6.00 Aug 04, 2006 page xxii of xxxiv
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7
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35
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39
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53
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61
62
63
64
65
66
67
68
69
70
71
72
73
Figure 2.17
Figure 2.18
Data Size and Number of States for Access to and from On-Chip Peripheral
Modules ............................................................................................................. 75
Timer Configuration Example ........................................................................... 76
Section 3 Exception Handling
Figure 3.1
Reset Sequence .................................................................................................. 84
Figure 3.2
Block Diagram of Interrupt Controller .............................................................. 99
Figure 3.3
Flow Up to Interrupt Acceptance....................................................................... 101
Figure 3.4
Stack State after Completion of Interrupt Exception Handling.......................... 102
Figure 3.5
Interrupt Sequence ............................................................................................. 103
Figure 3.6
Operation when Odd Address is Set in SP......................................................... 105
Figure 3.7
Port Mode Register Setting and Interrupt Request Flag Clearing Procedure..... 107
Section 4 Clock Pulse Generators
Figure 4.1
Block Diagram of Clock Pulse Generators ........................................................
Figure 4.2
Typical Connection to Crystal Oscillator...........................................................
Figure 4.3
Typical Connection to Ceramic Oscillator.........................................................
Figure 4.4
Board Design of Oscillator Circuit ....................................................................
Figure 4.5
External Clock Input (Example) ........................................................................
Figure 4.6
Typical Connection to 32.768 kHz/38.4 kHz Crystal Oscillator (Subclock) .....
Figure 4.7
Equivalent Circuit of 32.768 kHz/38.4 kHz Crystal Oscillator..........................
Figure 4.8
Pin Connection when not Using Subclock.........................................................
Figure 4.9 (a) Pin Connection when Inputting External Clock.................................................
Figure 4.9 (b) Pin Connection when Inputting External Clock
(H8/38327 Group and H8/38427 Group)...........................................................
Figure 4.10
Example of Crystal and Ceramic Oscillator Element Arrangement...................
Figure 4.11
Negative Resistance Measurement and Circuit Modification Suggestions........
Figure 4.12
Oscillation Stabilization Wait Time...................................................................
109
110
110
111
111
112
112
113
113
114
116
117
118
Section 5 Power-Down Modes
Figure 5.1
Mode Transition Diagram.................................................................................. 122
Figure 5.2
Standby Mode Transition and Pin States ........................................................... 132
Figure 5.3
External Input Signal Capture when Signal Changes before/after
Standby Mode or Watch Mode .......................................................................... 133
Section 6 ROM
Figure 6.1
ROM Block Diagram (H8/3824R, H8/3824S, H8/38324, and H8/38424) ........
Figure 6.2
Socket Adapter Pin Correspondence (with HN27C101)....................................
Figure 6.3
H8/3827R Memory Map in PROM Mode .........................................................
Figure 6.4
High-Speed, High-Reliability Programming Flow Chart...................................
145
147
148
150
Rev. 6.00 Aug 04, 2006 page xxiii of xxxiv
Figure 6.5
Figure 6.6
Figure 6.7
Figure 6.8
Figure 6.9
Figure 6.10
Figure 6.11
Figure 6.12
Figure 6.13
Figure 6.14
Figure 6.15
Figure 6.16
Figure 6.17
Figure 6.18
Figure 6.19
Figure 6.20
PROM Write/Verify Timing..............................................................................
Recommended Screening Procedure..................................................................
Block Diagram of Flash Memory ......................................................................
Flash Memory Block Configuration ..................................................................
Programming/Erasing Flowchart Example in User Program Mode...................
Program/Program-Verify Flowchart ..................................................................
Erase/Erase-Verify Flowchart............................................................................
Socket Adapter Pin Correspondence Diagram...................................................
Timing Waveforms for Memory Read after Memory Write..............................
Timing Waveforms in Transition from Memory Read Mode to Another Mode
CE and OE Enable State Read Timing Waveforms ...........................................
CE and OE Clock System Read Timing Waveforms.........................................
Auto-Program Mode Timing Waveforms ..........................................................
Auto-Erase Mode Timing Waveforms...............................................................
Status Read Mode Timing Waveforms ..............................................................
Oscillation Stabilization Time, Boot Program Transfer Time,
and Power-Down Sequence ...............................................................................
153
155
157
158
169
171
174
178
179
180
181
181
183
185
186
188
Section 7 RAM
Figure 7.1
RAM Block Diagram (H8/3824R, H8/3824S, H8/38324, and H8/38424) ........ 191
Section 8 I/O Ports
Figure 8.1
Port 1 Pin Configuration ....................................................................................
Figure 8.2
Port 3 Pin Configuration ....................................................................................
Figure 8.3
Port 4 Pin Configuration ....................................................................................
Figure 8.4
Port 5 Pin Configuration ....................................................................................
Figure 8.5
Port 6 Pin Configuration ....................................................................................
Figure 8.6
Port 7 Pin Configuration ....................................................................................
Figure 8.7
Port 8 Pin Configuration ....................................................................................
Figure 8.8
Port A Pin Configuration ...................................................................................
Figure 8.9
Port B Pin Configuration....................................................................................
Figure 8.10
Input/Output Data Inversion Function ...............................................................
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203
212
215
219
223
226
229
232
233
Section 9 Timers
Figure 9.1
Block Diagram of Timer A ................................................................................
Figure 9.2
Block Diagram of Timer C ................................................................................
Figure 9.3
Block Diagram of Timer F.................................................................................
Figure 9.4
Write Access to TCR (CPU → TCF).................................................................
Figure 9.5
Read Access to TCF (TCF → CPU) ..................................................................
Figure 9.6
TMOFH/TMOFL Output Timing ......................................................................
239
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257
267
268
270
Rev. 6.00 Aug 04, 2006 page xxiv of xxxiv
Figure 9.7
Figure 9.8
Figure 9.9
Figure 9.10
Figure 9.11
Figure 9.12
Figure 9.13
Figure 9.14
Figure 9.15
Figure 9.16
Figure 9.17
Figure 9.18
Figure 9.19
Figure 9.20
Figure 9.21
Clear Interrupt Request Flag when Interrupt Factor Generation Signal is
Valid ..................................................................................................................
Block Diagram of Timer G ................................................................................
Noise Canceler Block Diagram..........................................................................
Noise Canceler Timing (Example).....................................................................
Input Capture Input Timing (without Noise Cancellation Function) .................
Input Capture Input Timing (with Noise Cancellation Function) ......................
Timing of Input Capture by Input Capture Input ...............................................
TCG Clear Timing .............................................................................................
Port Mode Register Manipulation and Interrupt Enable Flag Clearing
Procedure ...........................................................................................................
Timer G Application Example ...........................................................................
Block Diagram of Watchdog Timer...................................................................
Typical Watchdog Timer Operations (Example) ...............................................
Block Diagram of Asynchronous Event Counter...............................................
Example of Software Processing when Using ECH and ECL as 16-Bit Event
Counter...............................................................................................................
Example of Software Processing when Using ECH and ECL as 8-Bit Event
Counters .............................................................................................................
Section 10 Serial Communication Interface
Figure 10.1
SCI3 Block Diagram..........................................................................................
Figure 10.2 (a) RDRF Setting and RXI Interrupt .......................................................................
Figure 10.2 (b) TDRE Setting and TXI Interrupt .......................................................................
Figure 10.2 (c) TEND Setting and TEI Interrupt........................................................................
Figure 10.3
Data Format in Asynchronous Communication.................................................
Figure 10.4
Phase Relationship between Output Clock and Transfer Data
(Asynchronous Mode) (8-bit data, parity, 2 stop bits) .......................................
Figure 10.5
Example of SCI3 Initialization Flowchart .........................................................
Figure 10.6
Example of Data Transmission Flowchart (Asynchronous Mode) ....................
Figure 10.7
Example of Operation when Transmitting in Asynchronous Mode
(8-bit data, parity, 1 stop bit)..............................................................................
Figure 10.8
Example of Data Reception Flowchart (Asynchronous Mode) .........................
Figure 10.9
Example of Operation when Receiving in Asynchronous Mode
(8-bit data, parity, 1 stop bit)..............................................................................
Figure 10.10 Data Format in Synchronous Communication ...................................................
Figure 10.11 Example of Data Transmission Flowchart (Synchronous Mode) ......................
Figure 10.12 Example of Operation when Transmitting in Synchronous Mode.....................
Figure 10.13 Example of Data Reception Flowchart (Synchronous Mode)............................
Figure 10.14 Example of Operation when Receiving in Synchronous Mode .........................
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277
284
285
287
288
288
289
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296
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304
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311
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359
Rev. 6.00 Aug 04, 2006 page xxv of xxxiv
Figure 10.15
Figure 10.16
Figure 10.17
Figure 10.18
Figure 10.19
Figure 10.20
Figure 10.21
Figure 10.22
Example of Simultaneous Data Transmission/Reception Flowchart
(Synchronous Mode)..........................................................................................
Example of Inter-Processor Communication Using Multiprocessor Format
(Sending Data H'AA to Receiver A)..................................................................
Example of Multiprocessor Data Transmission Flowchart ................................
Example of Operation when Transmitting Using Multiprocessor Format
(8-bit data, multiprocessor bit, 1 stop bit) ..........................................................
Example of Multiprocessor Data Reception Flowchart .....................................
Example of Operation when Receiving Using Multiprocessor Format
(8-bit data, multiprocessor bit, 1 stop bit) ..........................................................
Receive Data Sampling Timing in Asynchronous Mode...................................
Relation between RDR Read Timing and Data .................................................
360
362
363
364
365
367
371
372
Section 11 14-Bit PWM
Figure 11.1
Block Diagram of the 14 Bit PWM ................................................................... 376
Figure 11.2
PWM Output Waveform.................................................................................... 381
Section 12 A/D Converter
Figure 12.1
Block Diagram of the A/D Converter ................................................................
Figure 12.2
External Trigger Input Timing ...........................................................................
Figure 12.3
Typical A/D Converter Operation Timing .........................................................
Figure 12.4
Flow Chart of Procedure for Using A/D Converter (Polling by Software)........
Figure 12.5
Flow Chart of Procedure for Using A/D Converter (Interrupts Used) ...............
Figure 12.6
Analog Input Circuit Example ...........................................................................
Section 13 LCD Controller/Driver
Figure 13.1
Block Diagram of LCD Controller/Driver .........................................................
Figure 13.2
Example of A Waveform with 1/2 Duty and 1/2 Bias .......................................
Figure 13.3
Handling of LCD Drive Power Supply when Using 1/2 Duty...........................
Figure 13.4
Examples of LCD Power Supply Pin Connections ............................................
Figure 13.5
LCD RAM Map when Not Using Segment External Expansion (1/4 Duty) .....
Figure 13.6
LCD RAM Map when Not Using Segment External Expansion (1/3 Duty) .....
Figure 13.7
LCD RAM Map when Not Using Segment External Expansion (1/2 Duty) .....
Figure 13.8
LCD RAM Map when Not Using Segment External Expansion (Static Mode)
Figure 13.9
LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/4 Duty)...............................................
Figure 13.10 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/3 Duty)...............................................
Figure 13.11 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/2 Duty)...............................................
Rev. 6.00 Aug 04, 2006 page xxvi of xxxiv
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393
394
395
397
400
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414
414
415
416
417
Figure 13.12
Figure 13.13
Figure 13.14
Figure 13.15
Figure 13.16
Figure 13.17
Figure 13.18
LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” Static)....................................................
LCD Drive Power Supply Unit ..........................................................................
Example of Low-Power-Consumption LCD Drive Operation...........................
Output Waveforms for Each Duty Cycle (A Waveform)...................................
Output Waveforms for Each Duty Cycle (B Waveform)...................................
Connection of External Split-Resistance............................................................
Connection to HD66100 ....................................................................................
418
419
421
422
423
425
427
Section 14 Power Supply Circuit
Figure 14.1
Power Supply Connection when Internal Step-Down Circuit is Used............... 429
Figure 14.2
Power Supply Connection when Internal Step-Down Circuit is Not Used ........ 430
Section 15 Electrical Characteristics
Figure 15.1
Clock Input Timing............................................................................................
Figure 15.2
RES Low Width.................................................................................................
Figure 15.3
Input Timing ......................................................................................................
Figure 15.4
UD Pin Minimum Modulation Width Timing ...................................................
Figure 15.5
SCK3 Input Clock Timing .................................................................................
Figure 15.6
SCI3 Synchronous Mode Input/Output Timing .................................................
Figure 15.7
Segment Expansion Signal Timing....................................................................
Figure 15.8
Output Load Condition ......................................................................................
Figure 15.9
Resonator Equivalent Circuit .............................................................................
Figure 15.10 Resonator Equivalent Circuit .............................................................................
499
499
499
500
500
501
502
503
503
504
Appendix C I/O Port Block Diagrams
Figure C.1 (a) Port 1 Block Diagram (Pins P17 to P14)............................................................. 584
Figure C.1 (b) Port 1 Block Diagram (Pin P13) ......................................................................... 585
Figure C.1 (c) Port 1 Block Diagram (Pin P12, P11) ................................................................. 586
Figure C.1 (d) Port 1 Block Diagram (Pin P10) ......................................................................... 587
Figure C.2 (a) Port 3 Block Diagram (Pin P37 to P36) .............................................................. 588
Figure C.2 (b) Port 3 Block Diagram (Pin P35) ......................................................................... 589
Figure C.2 (c) Port 3 Block Diagram (Pin P34) ......................................................................... 590
Figure C.2 (d) Port 3 Block Diagram (Pin P33) ......................................................................... 591
Figure C.2 (e-1)Port 3 Block Diagram (Pin P32, H8/3827R Group and H8/3827S Group) ........ 592
Figure C.2 (e-2)Port 3 Block Diagram (Pin P32 in the Mask ROM Version of the H8/38327 Group
and H8/38427 Group) ........................................................................................ 593
Figure C.2 (e-3)Port 3 Block Diagram (Pin P32 in the F-ZTAT Version of the H8/38327 Group
and H8/38427 Group) ........................................................................................ 594
Figure C.2 (f-1) Port 3 Block Diagram (Pin P31, H8/3827R Group and H8/3827S Group) ........ 595
Rev. 6.00 Aug 04, 2006 page xxvii of xxxiv
Figure C.2 (f-2) Port 3 Block Diagram (Pin P31, H8/38327 Group and H8/38427 Group) .........
Figure C.2 (g) Port 3 Block Diagram (Pin P30) .........................................................................
Figure C.3 (a) Port 4 Block Diagram (Pin P43) .........................................................................
Figure C.3 (b) Port 4 Block Diagram (Pin P42) .........................................................................
Figure C.3 (c) Port 4 Block Diagram (Pin P41) .........................................................................
Figure C.3 (d) Port 4 Block Diagram (Pin P40) .........................................................................
Figure C.4
Port 5 Block Diagram ........................................................................................
Figure C.5
Port 6 Block Diagram ........................................................................................
Figure C.6
Port 7 Block Diagram ........................................................................................
Figure C.7
Port 8 Block Diagram ........................................................................................
Figure C.8
Port A Block Diagram........................................................................................
Figure C.9
Port B Block Diagram........................................................................................
596
597
598
599
600
601
602
603
604
605
606
607
Appendix F Package Dimensions
Figure F.1
FP-80A Package Dimensions............................................................................. 614
Figure F.2
FP-80B Package Dimensions............................................................................. 615
Figure F.3
TFP-80C Package Dimensions .......................................................................... 616
Appendix G Specifications of Chip Form
Figure G.1
Chip Sectional Figure ........................................................................................ 617
Figure G.2
Chip Sectional Figure ........................................................................................ 617
Figure G.3
Chip Sectional Figure ........................................................................................ 618
Figure G.4
Chip Sectional Figure ........................................................................................ 618
Appendix H Form of Bonding Pads
Figure H.1
Bonding Pad Form ............................................................................................. 619
Figure H.2
Bonding Pad Form ............................................................................................. 620
Figure H.3
Bonding Pad Form ............................................................................................. 621
Appendix I Specifications of Chip Tray
Figure I.1
Specifications of Chip Tray ...............................................................................
Figure I.2
Specifications of Chip Tray ...............................................................................
Figure I.3
Specifications of Chip Tray ...............................................................................
Figure I.4
Specifications of Chip Tray ...............................................................................
Rev. 6.00 Aug 04, 2006 page xxviii of xxxiv
622
623
624
625
Tables
Section 1 Overview
Table 1.1
Features .................................................................................................................. 2
Table 1.2
Bonding Pad Coordinates of H8/3827R Group (Mask ROM Version) .................. 12
Table 1.3
Bonding Pad Coordinates of H8/3827S Group (Mask ROM Version) .................. 16
Table 1.4
Bonding Pad Coordinates of HCD64F38327 and HCD64F38427......................... 20
Table 1.5
Bonding Pad Coordinates of H8/38327 Group (Mask ROM Version) and
H8/38427 Group (Mask ROM Version)................................................................. 24
Table 1.6
Pin Functions.......................................................................................................... 27
Section 2 CPU
Table 2.1
Addressing Modes..................................................................................................
Table 2.2
Effective Address Calculation................................................................................
Table 2.3
Instruction Set ........................................................................................................
Table 2.4
Data Transfer Instructions ......................................................................................
Table 2.5
Arithmetic Instructions...........................................................................................
Table 2.6
Logic Operation Instructions..................................................................................
Table 2.7
Shift Instructions ....................................................................................................
Table 2.8
Bit-Manipulation Instructions ................................................................................
Table 2.9
Branching Instructions ...........................................................................................
Table 2.10 System Control Instructions ...................................................................................
Table 2.11 Block Data Transfer Instruction .............................................................................
Table 2.12 Registers with Shared Addresses............................................................................
Table 2.13 Registers with Write-Only Bits ..............................................................................
40
43
46
48
50
51
52
54
58
60
62
81
81
Section 3 Exception Handling
Table 3.1
Exception Handling Types and Priorities...............................................................
Table 3.2
Interrupt Sources and Their Priorities ....................................................................
Table 3.3
Interrupt Control Registers .....................................................................................
Table 3.4
Interrupt Wait States...............................................................................................
Table 3.5
Conditions Under which Interrupt Request Flag is Set to 1 ...................................
83
86
87
104
106
Section 5 Power-Down Modes
Table 5.1
Operating Modes ....................................................................................................
Table 5.2
Internal State in Each Operating Mode ..................................................................
Table 5.3
System Control Registers .......................................................................................
Table 5.4
Clock Frequency and Settling Time (Times are in ms) ..........................................
Table 5.5
Setting and Clearing Module Standby Mode by Clock Stop Register....................
121
123
124
131
143
Rev. 6.00 Aug 04, 2006 page xxix of xxxiv
Section 6 ROM
Table 6.1
Setting to PROM Mode..........................................................................................
Table 6.2
Socket Adapter .......................................................................................................
Table 6.3
Mode Selection in PROM Mode (H8/3827R)........................................................
Table 6.4
DC Characteristics..................................................................................................
Table 6.5
AC Characteristics..................................................................................................
Table 6.6
Register Configuration ...........................................................................................
Table 6.7
Division of Blocks to Be Erased ............................................................................
Table 6.8
Setting Programming Modes..................................................................................
Table 6.9
Boot Mode Operation.............................................................................................
Table 6.10 Oscillating Frequencies (fOSC) for which Automatic Adjustment of LSI Bit Rate
Is Possible...............................................................................................................
Table 6.11 Reprogram Data Computation Table......................................................................
Table 6.12 Additional-Program Data Computation Table .......................................................
Table 6.13 Programming Time.................................................................................................
Table 6.14 Command Sequence in Programmer Mode............................................................
Table 6.15 AC Characteristics in Transition to Memory Read Mode ......................................
Table 6.16 AC Characteristics in Transition from Memory Read Mode to Another Mode .....
Table 6.17 AC Characteristics in Memory Read Mode ...........................................................
Table 6.18 AC Characteristics in Auto-Program Mode ...........................................................
Table 6.19 AC Characteristics in Auto-Erase Mode ................................................................
Table 6.20 AC Characteristics in Status Read Mode ...............................................................
Table 6.21 Status Read Mode Return Codes............................................................................
Table 6.22 Status Polling Output Truth Table..........................................................................
Table 6.23 Stipulated Transition Times to Command Wait State ............................................
Table 6.24 Flash Memory Operating States .............................................................................
Section 8 I/O Ports
Table 8.1
Port Functions ........................................................................................................
Table 8.2
Port 1 Registers ......................................................................................................
Table 8.3
Port 1 Pin Functions ...............................................................................................
Table 8.4
Port 1 Pin States .....................................................................................................
Table 8.5
Port 3 Registers ......................................................................................................
Table 8.6
Port 3 Pin Functions ...............................................................................................
Table 8.7
Port 3 Pin States .....................................................................................................
Table 8.8
Port 4 Registers ......................................................................................................
Table 8.9
Port 4 Pin Functions ...............................................................................................
Table 8.10 Port 4 Pin States .....................................................................................................
Table 8.11 Port 5 Registers ......................................................................................................
Table 8.12 Port 5 Pin Functions ...............................................................................................
Rev. 6.00 Aug 04, 2006 page xxx of xxxiv
146
146
149
151
152
159
163
166
168
168
172
172
172
177
179
180
181
183
184
186
187
187
188
189
193
195
200
202
203
209
211
212
214
215
216
218
Table 8.13
Table 8.14
Table 8.15
Table 8.16
Table 8.17
Table 8.18
Table 8.19
Table 8.20
Table 8.21
Table 8.22
Table 8.23
Table 8.24
Table 8.25
Table 8.26
Table 8.27
Port 5 Pin States .....................................................................................................
Port 6 Registers ......................................................................................................
Port 6 Pin Functions ...............................................................................................
Port 6 Pin States .....................................................................................................
Port 7 Registers ......................................................................................................
Port 7 Pin Functions ...............................................................................................
Port 7 Pin States .....................................................................................................
Port 8 Registers ......................................................................................................
Port 8 Pin Functions ...............................................................................................
Port 8 Pin States .....................................................................................................
Port A Registers .....................................................................................................
Port A Pin Functions ..............................................................................................
Port A Pin States ....................................................................................................
Port B Register .......................................................................................................
Register Configuration ...........................................................................................
218
220
221
222
223
225
225
226
228
229
230
231
232
233
234
Section 9 Timers
Table 9.1
Timer Functions ..................................................................................................... 237
Table 9.2
Pin Configuration ................................................................................................... 239
Table 9.3
Timer A Registers .................................................................................................. 240
Table 9.4
Timer A Operation States....................................................................................... 246
Table 9.5
Pin Configuration ................................................................................................... 248
Table 9.6
Timer C Registers................................................................................................... 249
Table 9.7
Timer C Operation States ....................................................................................... 254
Table 9.8
Pin Configuration ................................................................................................... 258
Table 9.9
Timer F Registers ................................................................................................... 258
Table 9.10 Timer F Operation Modes ...................................................................................... 271
Table 9.11 Pin Configuration ................................................................................................... 278
Table 9.12 Timer G Registers .................................................................................................. 278
Table 9.13 Timer G Operation Modes ..................................................................................... 290
Table 9.14 Internal Clock Switching and TCG Operation ....................................................... 291
Table 9.15 Input Capture Input Signal Input Edges Due to Input Capture Input Pin
Switching, and Conditions for Their Occurrence ................................................... 293
Table 9.16 Input Capture Input Signal Input Edges Due to Noise Canceler Function
Switching, and Conditions for Their Occurrence ................................................... 294
Table 9.17 Watchdog Timer Registers ..................................................................................... 297
Table 9.18 Watchdog Timer Operation States ......................................................................... 302
Table 9.19 Pin Configuration ................................................................................................... 304
Table 9.20 Asynchronous Event Counter Registers ................................................................. 305
Table 9.21 Asynchronous Event Counter Operation Modes .................................................... 311
Rev. 6.00 Aug 04, 2006 page xxxi of xxxiv
Section 10
Table 10.1
Table 10.2
Table 10.3
Table 10.3
Table 10.4
Table 10.5
Table 10.6
Table 10.7
Table 10.8
Table 10.9
Table 10.10
Table 10.11
Table 10.12
Table 10.13
Table 10.14
Serial Communication Interface
Pin Configuration ...................................................................................................
Registers .................................................................................................................
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)........
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)........
Relation between n and Clock................................................................................
Maximum Bit Rate for Each Frequency (Asynchronous Mode) ............................
Examples of BRR Settings for Various Bit Rates (Synchronous Mode)................
Relation between n and Clock................................................................................
SMR Settings and Corresponding Data Transfer Formats .....................................
SMR and SCR3 Settings and Clock Source Selection ...........................................
Transmit/Receive Interrupts ...................................................................................
Data Transfer Formats (Asynchronous Mode) .......................................................
Receive Error Detection Conditions and Receive Data Processing........................
SCI3 Interrupt Requests .........................................................................................
SSR Status Flag States and Receive Data Transfer ................................................
318
318
333
334
335
335
336
337
341
342
343
346
353
368
369
Section 11 14-Bit PWM
Table 11.1 Pin Configuration ................................................................................................... 376
Table 11.2 Register Configuration ........................................................................................... 377
Table 11.3 PWM Operation Modes.......................................................................................... 381
Section 12 A/D Converter
Table 12.1 Pin Configuration ................................................................................................... 385
Table 12.2 Register Configuration ........................................................................................... 385
Table 12.3 A/D Converter Operation Modes ........................................................................... 391
Section 13 LCD Controller/Driver
Table 13.1 Pin Configuration ...................................................................................................
Table 13.2 LCD Controller/Driver Registers ...........................................................................
Table 13.3 Output Levels .........................................................................................................
Table 13.4 Power-Down Modes and Display Operation..........................................................
401
401
424
425
Section 15 Electrical Characteristics
Table 15.1 Absolute Maximum Ratings...................................................................................
Table 15.2 DC Characteristics..................................................................................................
Table 15.3 Control Signal Timing............................................................................................
Table 15.4 Serial Interface (SCI3-1, SCI3-2) Timing ..............................................................
Table 15.5 A/D Converter Characteristics ...............................................................................
Table 15.6 LCD Characteristics ...............................................................................................
431
435
441
443
444
446
Rev. 6.00 Aug 04, 2006 page xxxii of xxxiv
Table 15.7
Table 15.8
Table 15.9
Table 15.10
Table 15.11
Table 15.12
Table 15.13
Table 15.14
Table 15.15
Table 15.16
Table 15.17
Table 15.18
Table 15.19
Table 15.20
Table 15.21
Table 15.22
Table 15.23
Table 15.24
Table 15.25
Table 15.26
Table 15.27
Table 15.28
AC Characteristics for External Segment Expansion .............................................
Absolute Maximum Ratings...................................................................................
DC Characteristics..................................................................................................
Control Signal Timing............................................................................................
Serial Interface (SCI3-1, SCI3-2) Timing ..............................................................
A/D Converter Characteristics ...............................................................................
LCD Characteristics ...............................................................................................
AC Characteristics for External Segment Expansion .............................................
Absolute Maximum Ratings...................................................................................
DC Characteristics..................................................................................................
Control Signal Timing............................................................................................
Serial Interface (SCI3-1, SCI3-2) Timing ..............................................................
A/D Converter Characteristics ...............................................................................
LCD Characteristics ...............................................................................................
AC Characteristics for External Segment Expansion .............................................
Absolute Maximum Ratings...................................................................................
DC Characteristics..................................................................................................
Control Signal Timing............................................................................................
Serial Interface (SCI3) Timing...............................................................................
A/D Converter Characteristics ...............................................................................
LCD Characteristics ...............................................................................................
Flash Memory Characteristics................................................................................
447
448
452
458
460
461
463
464
465
468
474
476
477
479
479
480
484
492
494
495
496
497
Appendix A CPU Instruction Set
Table A.1 Instruction Set ........................................................................................................
Table A.2 Operation Code Map ..............................................................................................
Table A.3 Number of Cycles in Each Instruction ...................................................................
Table A.4 Number of Cycles in Each Instruction ...................................................................
506
514
515
516
Appendix D Port States in the Different Processing States
Table D.1 Port States Overview .............................................................................................. 608
Appendix E List of Product Codes
Table E.1
H8/3827R Group, H8/3827S Group, and H8/38327 Group Product Code
Lineup .................................................................................................................. 609
Rev. 6.00 Aug 04, 2006 page xxxiii of xxxiv
Rev. 6.00 Aug 04, 2006 page xxxiv of xxxiv
Section 1 Overview
Section 1 Overview
1.1
Overview
The H8/300L Series is a series of single-chip microcomputers (MCU: microcomputer unit), built
around the high-speed H8/300L CPU and equipped with peripheral system functions on-chip.
Within the H8/300L Series, the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group comprise single-chip microcomputers equipped with an LCD (liquid crystal
display) controller/driver. Other on-chip peripheral functions include six timers, a 14-bit pulse
width modulator (PWM), two serial communication interface channels, and an A/D converter.
Together, these functions make the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group ideally suited for embedded applications in systems requiring low power
consumption and LCD display. Also available are models incorporating 16 Kbytes to 60 Kbytes of
ROM and 1 Kbyte to 2 Kbytes of RAM on-chip.
The H8/3827R is also available in a ZTAT™*1 version with on-chip PROM which can be
programmed as required by the user.
The H8/38327 and H8/38427 are available in a F-ZTAT™*2 version with on-chip flash memory
that can be programmed on-board.
Table 1.1 summarizes the features of the H8/3827R Group, H8/3827S Group, H8/38327 Group,
and H8/38427 Group.
Notes: 1. ZTAT (Zero Turn Around Time) is a trademark of Renesas Technology Corp.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Rev. 6.00 Aug 04, 2006 page 1 of 626
REJ09B0144-0600
Section 1 Overview
Table 1.1
Features
Item
Description
CPU
High-speed H8/300L CPU
•
General-register architecture
General registers: Sixteen 8-bit registers (can be used as eight 16-bit
registers)
•
Operating speed
 Max. operating speed: 8 MHz
 Add/subtract: 0.25 µs (operating at 8 MHz)
 Multiply/divide: 1.75 µs (operating at 8 MHz)
 Can run on 32.768 kHz or 38.4 kHz subclock
•
Instruction set compatible with H8/300 CPU
 Instruction length of 2 bytes or 4 bytes
 Basic arithmetic operations between registers
 MOV instruction for data transfer between memory and registers
•
Typical instructions
 Multiply (8 bits × 8 bits)
 Divide (16 bits ÷ 8 bits)
 Bit accumulator
 Register-indirect designation of bit position
Interrupts
36 interrupt sources
•
13 external interrupt sources (IRQ4 to IRQ0, WKP7 to WKP0)
•
23 internal interrupt sources
Clock pulse generators Two on-chip clock pulse generators
•
System clock pulse generator:
 Maximum 16 MHz (H8/3827R, H8/38327, H8/38427 Group)
 Maximum 10 MHz (H8/3827S Group)
•
Subclock pulse generator: 32.768 kHz, 38.4 kHz
Rev. 6.00 Aug 04, 2006 page 2 of 626
REJ09B0144-0600
Section 1 Overview
Item
Description
Power-down modes
Seven power-down modes
Memory
I/O ports
•
Sleep (high-speed) mode
•
Sleep (medium-speed) mode
•
Standby mode
•
Watch mode
•
Subsleep mode
•
Subactive mode
•
Active (medium-speed) mode
Large on-chip memory
•
H8/3822R, H8/38322, H8/38422:
16-Kbyte ROM, 1-Kbyte RAM
•
H8/3823R, H8/38323, H8/38423:
24-Kbyte ROM, 1-Kbyte RAM
•
H8/3824R, H8/3824S, H8/38324, H8/38424:
32-Kbyte ROM, 2-Kbyte RAM
•
H8/3825R, H8/3825S, H8/38325, H8/38425:
40-Kbyte ROM, 2-Kbyte RAM
•
H8/3826R, H8/3826S, H8/38326, H8/38426:
48-Kbyte ROM, 2-Kbyte RAM
•
H8/3827R, H8/3827S, H8/38327, H8/38427:
60-Kbyte ROM, 2-Kbyte RAM
64 pins
•
55 I/O pins
•
9 input pins
Rev. 6.00 Aug 04, 2006 page 3 of 626
REJ09B0144-0600
Section 1 Overview
Item
Description
Timers
Six on-chip timers
•
Timer A: 8-bit timer
Count-up timer with selection of eight internal clock signals divided
from the system clock (φ)* and four clock signals divided from the
watch clock (φW )*
•
Asynchronous event counter: 16-bit timer
 Count-up timer able to count asynchronous external events
independently of the MCU's internal clocks
•
Timer C: 8-bit timer
 Count-up/down timer with selection of seven internal clock signals
or event input from external pin
 Auto-reloading
•
Timer F: 16-bit timer
 Can be used as two independent 8-bit timers
 Count-up timer with selection of four internal clock signals or event
input from external pin
 Provision for toggle output by means of compare-match function
•
Timer G: 8-bit timer
 Count-up timer with selection of four internal clock signals
 Incorporates input capture function (built-in noise canceler)
•
Watchdog timer
 Reset signal generated by overflow of 8-bit counter
Serial communication
interface
Two serial communication interface channels on chip
•
SCI3-1: 8-bit synchronous/asynchronous serial interface
Incorporates multiprocessor communication function
•
SCI3-2: 8-bit synchronous/asynchronous serial interface
Incorporates multiprocessor communication function
14-bit PWM
Pulse-division PWM output for reduced ripple
•
A/D converter
Can be used as a 14-bit D/A converter by connecting to an external
low-pass filter.
Successive approximations using a resistance ladder
•
8-channel analog input pins
•
Conversion time: 31/φ or 62/φ per channel
Rev. 6.00 Aug 04, 2006 page 4 of 626
REJ09B0144-0600
Section 1 Overview
Item
Description
LCD controller/driver
LCD controller/driver equipped with a maximum of 32 segment pins and
four common pins
Product lineup
•
Choice of four duty cycles (static, 1/2, 1/3, or 1/4)
•
Segment pins can be switched to general-purpose port function in 8bit units
Mask ROM
Version
ZTAT
Version
F-ZTAT
Version
HD6433827R
HD6433827S
HD64338327
HD64338427
HD6473827R
HD64F38327
HD64F38427
FP-80B
(H8/3827R only)
FP-80A
TFP-80C
Die
60 K/2 K
HD6433826R
HD6433826S
HD64338326
HD64338426
—
—
FP-80B
(H8/3826R only)
FP-80A
TFP-80C
Die
48 K/2 K
HD6433825R
HD6433825S
HD64338325
HD64338425
—
—
FP-80B
(H8/3825R only)
FP-80A
TFP-80C
Die
40 K/2 K
HD6433824R
HD6433824S
HD64338324
HD64338424
—
HD64F38324
HD64F38424
FP-80B
(H8/3824R only)
FP-80A
TFP-80C
Die (Mask ROM
version only)
32 K/2 K
HD6433823R
HD64338323
HD64338423
—
—
FP-80B
(H8/3823R only)
FP-80A
TFP-80C
Die
24 K/1 K
HD6433822R
HD64338322
HD64338422
—
—
FP-80B
(H8/3822R only)
FP-80A
TFP-80C
Die
16 K/1 K
Package
ROM/RAM
Size (Byte)
See appendix E for a list of product codes.
Note:
*
See section 4, Clock Pulse Generators, for the definition of φ and φW .
Rev. 6.00 Aug 04, 2006 page 5 of 626
REJ09B0144-0600
Section 1 Overview
1.2
Internal Block Diagram
Figure 1.1(1) shows a block diagram of the H8/3827R Group and H8/3827S Group.
Port A
Timer C
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
Port 8
Timer A
Serial
communication
interface 3-1
P87/SEG32/CL1
P86/SEG31/CL2
P85/SEG30/DO
P84/SEG29/M
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
P67/SEG16
P66/SEG15
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
Serial
communication
interface 3-2
Timer F
14-bit
PWM
Timer G
Asynchronous
counter
WDT
A/D
(10bit)
LCD
Controller
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
AVSS
AVCC
Port B
V0
V1
V2
V3
Port 7
RAM
(2K/1K)
LCD Power
Supply
RES
TEST
VSS
VSS
VCC
CVCC*
X1
X2
ROM
(60K/48K/40K/32K
24K/16K)
Port 5
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
H8/300L
CPU
Port 6
Port 3
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
Sub Clock
OSC
Port 1
P30/PWM
P31/UD
P32/RESO
P33/SCK31
P34/RXD31
P35/TXD31
P36/AEVH
P37/AEVL
System Clock
OSC
P10/TMOW
P11/TMOFL
P12/TMOFH
P13/TMIG
P14/IRQ4/ADTRG
P15/IRQ1/TMIC
P16/IRQ2
P17/IRQ3/TMIF
Port 4
OSC1
OSC2
Figure 1.1(2) shows a block diagram of the H8/38327 Group and H8/38427 Group.
Note: * VCC in the H8/3827S
Figure 1.1(1) Block Diagram (H8/3827R Group and H8/3827S Group)
Rev. 6.00 Aug 04, 2006 page 6 of 626
REJ09B0144-0600
Port A
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
Port 8
Timer A
Serial
communication
interface 3-1
P87/SEG32
P86/SEG31
P85/SEG30
P84/SEG29
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
P67/SEG16
P66/SEG15
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
Serial
communication
interface 3-2
Timer F
14-bit
PWM
Timer G
Asynchronous
counter
WDT
A/D
(10bit)
LCD
Controller
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
AVSS
AVCC
Port B
V0
V1
V2
V3
Port 7
RAM
(2K/1K)
LCD Power
Supply
RES
TEST
VSS
VSS
VCC
CVCC
X1
X2
ROM
(60K/48K/40K/32K
24K/16K)
Timer C
Port 5
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
H8/300L
CPU
Port 6
Port 3
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
Sub Clock
OSC
Port 1
P30/PWM
P31/UD/EXCL
P32
P33/SCK31
P34/RXD31
P35/TXD31
P36/AEVH
P37/AEVL
System Clock
OSC
P10/TMOW
P11/TMOFL
P12/TMOFH
P13/TMIG
P14/IRQ4/ADTRG
P15/IRQ1/TMIC
P16/IRQ2
P17/IRQ3/TMIF
Port 4
OSC1
OSC2
Section 1 Overview
Note: When the on-chip emulator is used, pins P32, P85, P86, and P87 are reserved for use exclusively
by the emulator and therefore cannot be accessed by the user.
Figure 1.1(2) Block Diagram (H8/38327 Group and H8/38427 Group)
Rev. 6.00 Aug 04, 2006 page 7 of 626
REJ09B0144-0600
Section 1 Overview
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
The pin arrangements of the H8/3827R Group, H8/3827S Group, H8/38327 Group, and H8/38427
Group are shown in figures 1.2 and 1.3 (figure 1.3 only applies to the H8/3827R Group). The
bonding pad location diagram of the H8/3827R Group (mask ROM version) is shown in figure
1.4, and the bonding pad coordinates are given in table 1.2. The bonding pad location diagram of
the H8/3827S Group (mask ROM version) is shown in figure 1.5, and the bonding pad coordinates
are given in table 1.3. The bonding pad location diagram of the HCD64F38327 and
HCD64F38427 is shown in figure 1.6, and the bonding pad coordinates are given in table 1.4. The
bonding pad location diagram of the H8/38327 Group (mask ROM version) and H8/38427 Group
(mask ROM version) is shown in figure 1.7, and the bonding pad coordinates are given in table
1.5.
Rev. 6.00 Aug 04, 2006 page 8 of 626
REJ09B0144-0600
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
Section 1 Overview
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
34
PA2/COM3
68
33
PA3/COM4
P40/SCK32
69
32
VCC
P41/RXD32
70
31
V0
P42/TXD32
71
30
V1
P43/IRQ0
72
29
V2
AVCC
73
28
V3
PB0/AN0
74
27
VSS
PB1/AN1
75
26
CVCC (VCC in the H8/3827S)
PB2/AN2
76
25
P37/AEVL
PB3/AN3
77
24
P36/AEVH
PB4/AN4
78
23
P35/TXD31
PB5/AN5
79
22
P34/RXD31
PB6/AN6
80
21
9 10 11 12 13 14 15 16 17 18 19 20
P33/SCK31
1
2
3
4
5
6
7
8
P32/RESO (P32*)
67
P87/SEG32/CL1 (P87/SEG32*)
P31/UD (P31/UD/EXCL*)
P86/SEG31/CL2 (P86/SEG31*)
P30/PWM
PA1/COM2
P17/IRQ3/TMIF
35
P16/IRQ2
66
P15/IRQ1/TMIC
PA0/COM1
P85/SEG30/DO (P85/SEG30*)
P14/IRQ4/ADTRG
36
P13/TMIG
65
P12/TMOFH
P50/WKP0/SEG1
P84/SEG29/M (P84/SEG29*)
P11/TMOFL
37
P10/TMOW
64
RES
P51/WKP1/SEG2
P83/SEG28
TEST
38
OSC1
63
OSC2
P52/WKP2/SEG3
P82/SEG27
VSS
39
X2
P53/WKP3/SEG4
62
X1
40
P81/SEG26
AVSS
61
PB7/AN7
P80/SEG25
Notes: When the on-chip emulator is used, pins P32, P85, P86, and P87 are reserved for use exclusively by the emulator and
therefore cannot be accessed by the user.
* H8/38327, H8/38427
Figure 1.2 Pin Arrangement (FP-80A, TFP-80C: Top View)
Rev. 6.00 Aug 04, 2006 page 9 of 626
REJ09B0144-0600
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
P80/SEG25
P81/SEG26
Section 1 Overview
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
37
PA1/COM2
P86/SEG31/CL2
69
36
PA2/COM3
P87/SEG32/CL1
70
35
PA3/COM4
P40/SCK32
71
34
VCC
P41/RXD32
72
33
V0
P42/TXD32
73
32
V1
P43/IRQ0
74
31
V2
AVCC
75
30
V3
PB0/AN0
76
29
VSS
PB1/AN1
77
28
CVCC
PB2/AN2
78
27
P37/AEVL
PB3/AN3
79
26
P36/AEVH
PB4/AN4
80
25
P35/TXD31
Figure 1.3 Pin Arrangement (FP-80B: Top View)
Rev. 6.00 Aug 04, 2006 page 10 of 626
REJ09B0144-0600
P34/RXD31
P33/SCK31
P32/RESO
P31/UD
P30/PWM
P17/IRQ3/TMIF
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
P16/IRQ2
9
P15/IRQ1/TMIC
8
P14/IRQ4/ADTRG
7
P13/TMIG
6
P12/TMOFH
5
P11/TMOFL
4
P10/TMOW
3
RES
2
TEST
1
OSC1
68
OSC2
PA0/COM1
P85/SEG30/DO
VSS
38
X2
67
X1
P50/WKP0/SEG1
P84/SEG29/M
AVSS
P51/WKP1/SEG2
39
PB7/AN7
40
66
PB6/AN6
65
P83/SEG28
PB5/AN5
P82/SEG27
Section 1 Overview
80
79
78
77
76 75 74 73 72 7170 69
68 67 66 65 64 63
62 61
1
2
60
3
4
58
57
56
59
5
Y
6
7
55
54
53
8
9
10
11
12
52
51
50
49
X
(0, 0)
13
14
15
16
48
47
46
45
17
18
44
43
19
20
21
Type code
22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
37 38
42
41
39
40
: NC Pad
Chip size : 6.10mm × 6.23mm
Voltage level on the back of the chip : GND
Figure 1.4 Bonding Pad Location Diagram of H8/3827R Group (Mask ROM Version)
(Top View)
Rev. 6.00 Aug 04, 2006 page 11 of 626
REJ09B0144-0600
Section 1 Overview
Table 1.2
Bonding Pad Coordinates of H8/3827R Group (Mask ROM Version)
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
1
PB7/AN7
-2866
2382
2
AVss
-2866
2193
3
X1
-2866
1694
4
X2
-2866
1500
5
Vss
-2866
1156
6
OSC2
-2866
810
7
OSC1
-2866
636
8
TEST
-2866
288
9
RES
-2866
116
10
P10/TMOW
-2866
-228
11
P11/TMOFL
-2866
-402
12
P12/TMOFH
-2866
-576
13
P13/TMIG
-2866
-920
14
P14/IRQ4/ADTRG
-2866
-1094
15
P15/IRQ1/TMIC
-2866
-1266
16
P16/IRQ2
-2866
-1440
17
P17/IRQ3/TMIF
-2866
-1785
18
P30/PWM
-2866
-1969
19
P31/UD
-2866
-2327
20
P32/RESO
-2866
-2503
21
P33/SCK31
-2669
-2931
22
P34/RXD31
-2142
-2931
23
P35/TXD31
-1971
-2931
24
P36/AEVH
-1798
-2931
25
P37/AEVL
-1624
-2931
26
CVcc
-1413
-2931
27
Vss
-1213
-2931
28
V3
-1017
-2931
29
V2
-844
-2931
Rev. 6.00 Aug 04, 2006 page 12 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
30
V1
-672
-2931
31
V0
-496
-2931
32
Vcc
-320
-2931
33
PA3/COM4
-112
-2931
34
PA2/COM3
76
-2931
35
PA1/COM2
320
-2931
36
PA0/COM1
544
-2931
37
P50/WKP0/SEG1
842
-2931
38
P51/WKP1/SEG2
1069
-2931
39
P52/WKP2/SEG3
2017
-2931
40
P53/WKP3/SEG4
2648
-2931
41
P54/WKP4/SEG5
2866
-2484
42
P55/WKP5/SEG6
2866
-2296
43
P56/WKP6/SEG7
2866
-2061
44
P57/WKP7/SEG8
2866
-1846
45
P60/SEG9
2866
-1430
46
P61/SEG10
2866
-1244
47
P62/SEG11
2866
-1056
48
P63/SEG12
2866
-828
49
P64/SEG13
2866
-452
50
P65/SEG14
2866
-264
51
P66/SEG15
2866
-76
52
P67/SEG16
2866
112
53
P70/SEG17
2866
528
54
P71/SEG18
2866
756
55
P72/SEG19
2866
944
56
P73/SEG20
2866
1318
57
P74/SEG21
2866
1506
58
P75/SEG22
2866
1694
59
P76/SEG23
2866
2070
60
P77/SEG24
2866
2367
Rev. 6.00 Aug 04, 2006 page 13 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
61
P80/SEG25
2866
2931
62
P81/SEG26
2654
2931
63
P82/SEG27
1998
2931
64
P83/SEG28
1803
2931
65
P84/SEG29/M
1585
2931
66
P85/SEG30/DO
1396
2931
67
P86/SEG31/CL2
1209
2931
68
P87/SEG32/CL1
977
2931
69
P40/SCK32
631
2931
70
P41/RXD32
456
2931
71
P42/TXD32
284
2931
72
P43/IRQ0
109
2931
73
AVcc
-64
2931
74
PB0/AN0
-236
2931
75
PB1/AN1
-409
2931
76
PB2/AN2
-581
2931
77
PB3/AN3
-925
2931
78
PB4/AN4
-1268
2931
79
PB5/AN5
-2048
2931
80
PB6/AN6
-2658
2931
Note:
*
These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The
home-point position is the chip’s center and the center is located at half the distance
between the upper and lower pads and left and right pads.
Rev. 6.00 Aug 04, 2006 page 14 of 626
REJ09B0144-0600
Section 1 Overview
80
1
79
78
77
76 75 74 73 72 71 70 69 68 67 66 65 64 63 62
61 60
2
59
3
58
57
56
4
5
Type code
Y
55
54
53
6
7
8
9
(0, 0)
52
51
50
49
X
10
11
12
48
47
46
45
13
14
15
16
17
18
19
20
44
43
42
Base type code
21
22 23 24 25 26 27 28 29 30 31 32 33 34
35 36
37 38
39
40
41
: NC Pad
Chip size : 3.55mm × 3.45mm
Voltage level on the back of the chip : GND
Figure 1.5 Bonding Pad Location Diagram of H8/3827S Group (Mask ROM Version)
(Top View)
Rev. 6.00 Aug 04, 2006 page 15 of 626
REJ09B0144-0600
Section 1 Overview
Table 1.3
Bonding Pad Coordinates of H8/3827S Group (Mask ROM Version)
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
1
PB7/AN7
-1655
1516
2
AVss
-1655
1345
3
X1
-1655
999
4
X2
-1655
799
5
Vss
-1655
536
6
OSC2
-1655
334
7
OSC1
-1655
226
8
TEST
-1655
37
9
RES
-1655
-48
10
P10/TMOW
-1655
-223
11
P11/TMOFL
-1655
-308
12
P12/TMOFH
-1655
-393
13
P13/TMIG
-1655
-563
14
P14/IRQ4/ADTRG
-1655
-648
15
P15/IRQ1/TMIC
-1655
-733
16
P16/IRQ2
-1655
-818
17
P17/IRQ3/TMIF
-1655
-988
18
P30/PWM
-1655
-1073
19
P31/UD
-1655
-1243
20
P32/RESO
-1655
-1480
21
P33/SCK31
-1357
-1605
22
P34/RXD31
-1178
-1605
23
P35/TXD31
-1093
-1605
24
P36/AEVH
-992
-1605
25
P37/AEVL
-906
-1605
26
Vcc
-821
-1605
27
Vss
-736
-1605
28
V3
-651
-1605
29
V2
-566
-1605
Rev. 6.00 Aug 04, 2006 page 16 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
30
V1
-481
-1605
31
V0
-396
-1605
32
Vcc
-310
-1605
33
PA3/COM4
-215
-1605
34
PA2/COM3
-85
-1605
35
PA1/COM2
64
-1605
36
PA0/COM1
197
-1605
37
P50/WKP0/SEG1
421
-1605
38
P51/WKP1/SEG2
528
-1605
39
P52/WKP2/SEG3
957
-1605
40
P53/WKP3/SEG4
1154
-1605
41
P54/WKP4/SEG5
1655
-1527
42
P55/WKP5/SEG6
1655
-1294
43
P56/WKP6/SEG7
1655
-1209
44
P57/WKP7/SEG8
1655
-1117
45
P60/SEG9
1655
-903
46
P61/SEG10
1655
-796
47
P62/SEG11
1655
-689
48
P63/SEG12
1655
-559
49
P64/SEG13
1655
-345
50
P65/SEG14
1655
-237
51
P66/SEG15
1655
-130
52
P67/SEG16
1655
-23
53
P70/SEG17
1655
191
54
P71/SEG18
1655
317
55
P72/SEG19
1655
424
56
P73/SEG20
1655
639
57
P74/SEG21
1655
746
58
P75/SEG22
1655
853
59
P76/SEG23
1655
1067
60
P77/SEG24
1655
1527
Rev. 6.00 Aug 04, 2006 page 17 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
61
P80/SEG25
1466
1605
62
P81/SEG26
1230
1605
63
P82/SEG27
1145
1605
64
P83/SEG28
1060
1605
65
P84/SEG29/M
961
1605
66
P85/SEG30/DO
854
1605
67
P86/SEG31/CL2
747
1605
68
P87/SEG32/CL1
640
1605
69
P40/SLK32
524
1605
70
P41/RXD32
439
1605
71
P42/TXD32
354
1605
72
P43/IRQ0
269
1605
73
AVcc
101
1605
74
PB0/AN0
16
1605
75
PB1/AN1
-92
1605
76
PB2/AN2
-207
1605
77
PB3/AN3
-431
1605
78
PB4/AN4
-655
1605
79
PB5/AN5
-1103
1605
80
PB6/AN6
-1290
1605
Note:
*
These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The
home-point position is the chip’s center and the center is located at half the distance
between the upper and lower pads and left and right pads.
Rev. 6.00 Aug 04, 2006 page 18 of 626
REJ09B0144-0600
Section 1 Overview
81 80
79
78 77
76 75 74
73 72 71 70 69 68 67 66 65 64
63
62
Type code
1
61
2
3
60
4
59
5
6
58
57
56
55
7
8
9
10
11
54
Y
(0, 0)
53
52
51
50
X
12
49
13
48
14
15
47
16
46
17
18
19
20
45
21
43
42
44
22 23 24 25 26 27 28 29 30 31 32 33 34
35 36 37
38 39
40
41
: NC Pad
Chip size : 4.35mm × 4.83mm
Voltage level on the back of the chip : GND
Figure 1.6 Bonding Pad Location Diagram of HCD64F38327 and HCD64F38427
(Top View)
Rev. 6.00 Aug 04, 2006 page 19 of 626
REJ09B0144-0600
Section 1 Overview
Table 1.4
Bonding Pad Coordinates of HCD64F38327 and HCD64F38427
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
1
PB7/AN7
-2056
1943
2
AVss
-2056
1656
3
X1
-2056
1570
4
X2
-2056
1360
5
Vss
-2056
1158
6
Vss
-2056
1062
7
OSC2
-2056
533
8
OSC1
-2056
431
9
TEST
-2056
329
10
RES
-2056
-66
11
P10/TMOW
-2056
-244
12
P11/TMOFL
-2056
-402
13
P12/TMOFH
-2056
-574
14
P13/TMIG
-2056
-747
15
P14/IRQ4/ADTRG
-2056
-919
16
P15/IRQ1/TMIC
-2056
-1091
17
P16/IRQ2
-2056
-1263
18
P17/IRQ3/TMIF
-2056
-1349
19
P30/PWM
-2056
-1521
20
P31/UD/EXCL
-2056
-1607
21
P32
-2056
-1779
22
P33/SCK31
-1530
-2295
23
P34/RXD31
-1382
-2295
24
P35/TXD31
-1280
-2295
25
P36/AEVH
-1178
-2295
26
P37/AEVL
-1076
-2295
27
CVcc
-896
-2295
28
Vss
-710
-2295
29
V3
-584
-2295
30
V2
-483
-2295
Rev. 6.00 Aug 04, 2006 page 20 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
31
V1
-382
-2295
32
V0
-281
-2295
33
Vcc
-145
-2295
34
PA3/COM4
51
-2295
35
PA2/COM3
301
-2295
36
PA1/COM2
441
-2295
37
PA0/COM1
604
-2295
38
P50/WKP0/SEG1
883
-2295
39
P51/WKP1/SEG2
1022
-2295
40
P52/WKP2/SEG3
1302
-2295
41
P53/WKP3/SEG4
1530
-2295
42
P54/WKP4/SEG5
2056
-1955
43
P55/WKP5/SEG6
2056
-1830
44
P56/WKP6/SEG7
2056
-1651
45
P57/WKP7/SEG8
2056
-1481
46
P60/SEG9
2056
-1111
47
P61/SEG10
2056
-879
48
P62/SEG11
2056
-671
49
P63/SEG12
2056
-505
50
P64/SEG13
2056
-255
51
P65/SEG14
2056
-130
52
P66/SEG15
2056
-6
53
P67/SEG16
2056
119
54
P70/SEG17
2056
457
55
P71/SEG18
2056
660
56
P72/SEG19
2056
784
57
P73/SEG20
2056
1034
58
P74/SEG21
2056
1159
59
P75/SEG22
2056
1378
60
P76/SEG23
2056
1627
61
P77/SEG24
2056
1840
Rev. 6.00 Aug 04, 2006 page 21 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
62
P80/SEG25
1777
2295
63
P81/SEG26
1530
2295
64
P82/SEG27
1302
2295
65
P83/SEG28
1147
2295
66
P84/SEG29
1022
2295
67
P85/SEG30
901
2295
68
P86/SEG31
728
2295
69
P87/SEG32
603
2295
70
P40/SCK32
451
2295
71
P41/RXD32
350
2295
72
P42/TXD32
175
2295
73
P43/IRQ0
73
2295
74
AVcc
-155
2295
75
PB0/AN0
-290
2295
76
PB1/AN1
-440
2295
77
PB2/AN2
-695
2295
78
PB3/AN3
-801
2295
79
PB4/AN4
-996
2295
80
PB5/AN5
-1419
2295
81
PB6/AN6
-1530
2295
Note:
*
These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The
home-point position is the chip’s center and the center is located at half the distance
between the upper and lower pads and left and right pads. Pad numbers 5, 6, and 28
are power supply (Vss) pads and must be connected. They should not be left open. Pad
number 9 (TEST) must be connected to the Vss position. The device will not operate
properly if the pads are not connected as indicated.
Rev. 6.00 Aug 04, 2006 page 22 of 626
REJ09B0144-0600
Section 1 Overview
80 79 78 77 76 75 74
73
72 71 70 69
68 67 66 65 64 63 62 61
1
60
2
3
4
59
58
57
56
5
55
6
7
8
9
Y
54
53
52
51
(0, 0)
10
50
X
49
11
12
13
14
15
16
17
18
48
47
46
45
44
43
19
20
42
41
21 22 23 24 25
26
27 28 29 30 31
32 33 34 35 36
37 38 39 40
Base type code
Type code
Chip size : 3.45mm × 3.39mm
Voltage level on the back of the chip : GND
Figure 1.7 Bonding Pad Location Diagram of H8/38327 Group (Mask ROM Version) and
H8/38427 Group (Mask ROM Version) (Top View)
Rev. 6.00 Aug 04, 2006 page 23 of 626
REJ09B0144-0600
Section 1 Overview
Table 1.5
Bonding Pad Coordinates of H8/38327 Group (Mask ROM Version) and
H8/38427 Group (Mask ROM Version)
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
1
PB7/AN7
-1605
1227
2
AVss
-1605
1057
3
X1
-1605
941
4
X2
-1605
843
5
Vss
-1605
619
6
OSC2
-1605
503
7
OSC1
-1605
405
8
TEST
-1605
299
9
RES
-1605
201
10
P10/TMOW
-1605
-185
11
P11/TMOFL
-1605
-283
12
P12/TMOFH
-1605
-382
13
P13/TMIG
-1605
-480
14
P14/IRQ4/ADTRG
-1605
-578
15
P15/IRQ1/TMIC
-1605
-676
16
P16/IRQ2
-1605
-775
17
P17/IRQ3/TMIF
-1605
-873
18
P30/PWM
-1605
-971
19
P31/UD/EXCL
-1605
-1070
20
P32
-1605
-1168
21
P33/SCK31
-1262
-1577
22
P34/RXD31
-1164
-1577
23
P35/TXD31
-1066
-1577
24
P36/AEVH
-967
-1577
25
P37/AEVL
-869
-1577
26
CVcc
-704
-1577
27
Vss
-518
-1577
28
V3
-368
-1577
29
V2
-276
-1577
30
V1
-184
-1577
Rev. 6.00 Aug 04, 2006 page 24 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
31
V0
-67
-1577
32
Vcc
109
-1577
33
PA3/COM4
237
-1577
34
PA2/COM3
361
-1577
35
PA1/COM2
486
-1577
36
PA0/COM1
611
-1577
37
P50/WKP0/SEG1
767
-1577
38
P51/WKP1/SEG2
892
-1577
39
P52/WKP2/SEG3
1017
-1577
40
P53/WKP3/SEG4
1141
-1577
41
P54/WKP4/SEG5
1605
-1224
42
P55/WKP5/SEG6
1605
-1100
43
P56/WKP6/SEG7
1605
-975
44
P57/WKP7/SEG8
1605
-850
45
P60/SEG9
1605
-723
46
P61/SEG10
1605
-598
47
P62/SEG11
1605
-473
48
P63/SEG12
1605
-349
49
P64/SEG13
1605
-195
50
P65/SEG14
1605
-70
51
P66/SEG15
1605
55
52
P67/SEG16
1605
179
53
P70/SEG17
1605
336
54
P71/SEG18
1605
460
55
P72/SEG19
1605
585
56
P73/SEG20
1605
710
57
P74/SEG21
1605
835
58
P75/SEG22
1605
959
59
P76/SEG23
1605
1084
60
P77/SEG24
1605
1209
61
P80/SEG25
1130
1577
Rev. 6.00 Aug 04, 2006 page 25 of 626
REJ09B0144-0600
Section 1 Overview
Coordinates*
Pad No.
Pad Name
X (µm)
Y (µm)
62
P81/SEG26
1006
1577
63
P82/SEG27
881
1577
64
P83/SEG28
756
1577
65
P84/SEG29
631
1577
66
P85/SEG30
507
1577
67
P86/SEG31
382
1577
68
P87/SEG32
257
1577
69
P40/SCK32
-4
1577
70
P41/RXD32
-97
1577
71
P42/TXD32
-196
1577
72
P43/IRQ0
-294
1577
73
AVcc
-470
1577
74
PB0/AN0
-598
1577
75
PB1/AN1
-704
1577
76
PB2/AN2
-810
1577
77
PB3/AN3
-916
1577
78
PB4/AN4
-1022
1577
79
PB5/AN5
-1128
1577
PB6/AN6
-1233
1577
80
Note:
*
These values show the coordinates of the centers of pads. The accuracy is ±5 µm. The
home-point position is the chip’s center and the center is located at half the distance
between the upper and lower pads and left and right pads. Pad numbers 2, 5, and 27
are power supply (VSS) pads and must be connected. They should not be left open. Pad
number 8 (TEST) must be connected to the Vss position. The device will not operate
properly if the pads are not connected as indicated.
Rev. 6.00 Aug 04, 2006 page 26 of 626
REJ09B0144-0600
Section 1 Overview
1.3.2
Pin Functions
Table 1.6 outlines the pin functions of this LSI.
Table 1.6
Pin Functions
Pin No.
Type
Symbol
Power
VCC
source pins CVCC
FP-80A
TFP-80C FP-80B
I/O
Name and Functions
32
26
34
28
Input
Power supply: All VCC pins should be
connected to the system power supply.
See section 14, Power Supply Circuit, for
a CVCC pin (VCC pin in the H8/3827S
Group).
VSS
5
27
7
29
Input
Ground: All VSS pins should be
connected to the system power supply
(0 V).
AVCC
73
75
Input
Analog power supply: This is the
power supply pin for the A/D converter.
When the A/D converter is not used,
connect this pin to the system power
supply.
AVSS
2
4
Input
Analog ground: This is the A/D
converter ground pin. It should be
connected to the system power supply
(0V).
V0
31
33
V1
V2
V3
30
29
28
32
31
30
Output LCD power supply: These are the
power supply pins for the LCD
Input
controller/driver. They incorporate a
power supply split-resistance, and are
normally used with V0 and V1 shorted.
Rev. 6.00 Aug 04, 2006 page 27 of 626
REJ09B0144-0600
Section 1 Overview
Pin No.
Type
Symbol
FP-80A
TFP-80C FP-80B
I/O
Clock pins
OSC1
7
9
Input
OSC2
6
8
X1
3
5
X2
4
6
EXCL
19
—
Input
This pin connects to a 32.768-kHz or
38.4-kHz external clock. See section 4,
Clock Pulse Generators, for typical
connection diagram. This function is only
available on the H8/38327 Group and
H8/38427 Group.
RES
9
11
Input
Reset: When this pin is driven low, the
chip is reset
RESO
20
22
Output Reset output: Outputs the CPU internal
reset signal. This function is not
implemented in the H8/38327 Group and
H8/38427 Group.
TEST
8
10
Input
Test pin: This pin is reserved and
cannot be used. It should be connected
to VSS.
IRQ0
IRQ1
IRQ2
IRQ3
IRQ4
72
15
16
17
14
74
17
18
19
16
Input
IRQ interrupt request 0 to 4: These are
input pins for edge-sensitive external
interrupts, with a selection of rising or
falling edge
WKP7 to
WKP0
44 to 37
46 to 39
Input
Wakeup interrupt request 0 to 7:
These are input pins for rising or fallingedge-sensitive external interrupts.
TMOW
10
12
Output Clock output: This is an output pin for
waveforms generated by the timer A
output circuit.
AEVL
AEVH
25
24
27
26
Input
System
control
Interrupt
pins
Timer pins
Rev. 6.00 Aug 04, 2006 page 28 of 626
REJ09B0144-0600
Name and Functions
These pins connect to a crystal or
Output ceramic oscillator, or can be used to
input an external clock. See section 4,
Clock Pulse Generators, for a typical
connection diagram.
Input
These pins connect to a 32.768-kHz or
Output 38.4-kHz crystal oscillator.
See section 4, Clock Pulse
Generators, for a typical connection
diagram.
Asynchronous event counter event
input: This is an event input pin for input
to the asynchronous event counter.
Section 1 Overview
Pin No.
Type
Symbol
FP-80A
TFP-80C FP-80B
I/O
Name and Functions
Timer pins
TMIC
15
17
Input
Timer C event input: This is an event
input pin for input to the timer C counter.
UD
19
21
Input
Timer C up/down select: This pin
selects up- or down-counting for the
timer C counter. The counter operates
as a down-counter when this pin is high,
and as an up-counter when low.
TMIF
17
19
Input
Timer F event input: This is an event
input pin for input to the timer F counter.
TMOFL
11
13
Output Timer FL output: This is an output pin
for waveforms generated by the timer FL
output compare function.
TMOFH
12
14
Output Timer FH output: This is an output pin
for waveforms generated by the timer FH
output compare function.
TMIG
13
15
Input
14-bit
PWM pin
PWM
18
20
Output 14-bit PWM output: This is an output
pin for waveforms generated by the 14bit PWM
I/O ports
PB7 to PB0 1, 80 to
74
3 to 1,
80 to 76
Input
Port B: This is an 8-bit input port.
Timer G capture input: This is an input
pin for timer G input capture.
P43
72
74
Input
Port 4 (bit 3): This is a 1-bit input port.
P42 to P40
71 to 69
73 to 71
I/O
Port 4 (bits 2 to 0): This is a 3-bit I/O
port. Input or output can be designated
for each bit by means of port control
register 4 (PCR4).
PA3 to PA0 33 to 36
35 to 38
I/O
Port A: This is a 4-bit I/O port. Input or
output can be designated for each bit by
means of port control register A (PCRA).
P17 to P10
19 to 12
I/O
Port 1: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 1 (PCR1).
17 to 10
Rev. 6.00 Aug 04, 2006 page 29 of 626
REJ09B0144-0600
Section 1 Overview
Pin No.
Type
Symbol
FP-80A
TFP-80C FP-80B
I/O
Name and Functions
I/O ports
P37 to P30
25 to 18
27 to 20
I/O
Port 3: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 3 (PCR3).
When the on-chip emulator is used, pin
P32 is reserved for use exclusively by the
emulator and therefore cannot be
accessed by the user. With the F-ZTAT
version, pull up pin P32 to high level to
cancel a reset in the in the user mode.
P57 to P50
44 to 37
46 to 39
I/O
Port 5: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 5 (PCR5).
P67 to P60
52 to 45
54 to 47
I/O
Port 6: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 6 (PCR6).
P77 to P70
60 to 53
62 to 55
I/O
Port 7: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 7 (PCR7).
P87 to P80
68 to 61
70 to 63
I/O
Port 8: This is an 8-bit I/O port. Input or
output can be designated for each bit by
means of port control register 8 (PCR8).
When the on-chip emulator is used, pins
P85, P86, and P87 are reserved for use
exclusively by the emulator and therefore
cannot be accessed by the user.
RXD31
22
24
Input
SCI3-1 receive data input:
This is the SCI31 data input pin.
TXD31
23
25
Output SCI3-1 transmit data output:
This is the SCI31 data output pin.
SCK31
21
23
I/O
SCI3-1 clock I/O:
This is the SCI31 clock I/O pin.
RXD32
70
72
Input
SCI3-2 receive data input:
This is the SCI32 data input pin.
TXD32
71
73
Output SCI3-2 transmit data output:
This is the SCI32 data output pin.
SCK32
69
71
I/O
Serial
communication
interface
(SCI)
Rev. 6.00 Aug 04, 2006 page 30 of 626
REJ09B0144-0600
SCI3-2 clock I/O:
This is the SCI32 clock I/O pin.
Section 1 Overview
Pin No.
FP-80A
TFP-80C FP-80B
Type
Symbol
A/D
converter
AN7 to An0 1
80 to 74
ADTRG
LCD
controller/
driver
I/O
Name and Functions
3 to 1
80 to 76
Input
Analog input channels 7 to 0:
These are analog data input channels to
the A/D converter
14
16
Input
A/D converter trigger input:
This is the external trigger input pin to
the A/D converter
COM4 to
COM1
33 to 36
35 to 38
Output LCD common output: These are the
LCD common output pins.
SEG32 to
SEG1
68 to 37
70 to 39
Output LCD segment output: These are the
LCD segment output pins.
CL1
68
70
Output LCD latch clock: This is the output pin
for the segment external expansion
display data latch clock. This function is
not implemented in the H8/38327 Group
and H8/38427 Group.
CL2
67
69
Output LCD shift clock: This is the output pin
for the segment external expansion
display data shift clock. This function is
not implemented in the H8/38327 Group
and H8/38427 Group.
DO
66
68
Output LCD serial data output: This is the
output pin for segment external
expansion serial display data. This
function is not implemented in the
H8/38327 Group and H8/38427 Group.
M
65
67
Output LCD alternation signal: This is the
output pin for the segment external
expansion LCD alternation signal. This
function is not implemented in the
H8/38327 Group and H8/38427 Group.
Rev. 6.00 Aug 04, 2006 page 31 of 626
REJ09B0144-0600
Section 1 Overview
Rev. 6.00 Aug 04, 2006 page 32 of 626
REJ09B0144-0600
Section 2 CPU
Section 2 CPU
2.1
Overview
The H8/300L CPU has sixteen 8-bit general registers, which can also be paired as eight 16-bit
registers. Its concise instruction set is designed for high-speed operation.
2.1.1
Features
Features of the H8/300L CPU are listed below.
• General-register architecture
Sixteen 8-bit general registers, also usable as eight 16-bit general registers
• Instruction set with 55 basic instructions, including:
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct
 Register indirect
 Register indirect with displacement
 Register indirect with post-increment or pre-decrement
 Absolute address
 Immediate
 Program-counter relative
 Memory indirect
• 64-Kbyte address space
• High-speed operation
 All frequently used instructions are executed in two to four states
 High-speed arithmetic and logic operations
 8- or 16-bit register-register add or subtract: 0.25 µs*
 8 × 8-bit multiply:
1.75 µs*
 16 ÷ 8-bit divide:
Note: *
1.75 µs*
These values are at φ = 8 MHz.
• Low-power operation modes
SLEEP instruction for transfer to low-power operation
Rev. 6.00 Aug 04, 2006 page 33 of 626
REJ09B0144-0600
Section 2 CPU
2.1.2
Address Space
The H8/300L CPU supports an address space of up to 64 Kbytes for storing program code and
data.
See section 2.8, Memory Map, for details of the memory map.
2.1.3
Register Configuration
Figure 2.1 shows the register structure of the H8/300L CPU. There are two groups of registers: the
general registers and control registers.
General registers (Rn)
7
0 7
0
R0H
R0L
R1H
R1L
R2H
R2L
R3H
R3L
R4H
R4L
R5H
R5L
R6H
R7H
R6L
(SP)
SP: Stack pointer
R7L
Control registers (CR)
15
0
PC
CCR
7 6 5 4 3 2 1 0
I UHUNZ VC
PC: Program counter
CCR: Condition code register
Carry flag
Overflow flag
Zero flag
Negative flag
Half-carry flag
Interrupt mask bit
User bit
User bit
Figure 2.1 CPU Registers
Rev. 6.00 Aug 04, 2006 page 34 of 626
REJ09B0144-0600
Section 2 CPU
2.2
Register Descriptions
2.2.1
General Registers
All the general registers can be used as both data registers and address registers.
When used as data registers, they can be accessed as 16-bit registers (R0 to R7), or the high bytes
(R0H to R7H) and low bytes (R0L to R7L) can be accessed separately as 8-bit registers.
When used as address registers, the general registers are accessed as 16-bit registers (R0 to R7).
R7 also functions as the stack pointer (SP), used implicitly by hardware in exception processing
and subroutine calls. When it functions as the stack pointer, as indicated in figure 2.2, SP (R7)
points to the top of the stack.
Lower address side [H'0000]
Unused area
SP (R7)
Stack area
Upper address side [H'FFFF]
Figure 2.2 Stack Pointer
2.2.2
Control Registers
The CPU control registers include a 16-bit program counter (PC) and an 8-bit condition code
register (CCR).
Program Counter (PC)
This 16-bit register indicates the address of the next instruction the CPU will execute. All
instructions are fetched 16 bits (1 word) at a time, so the least significant bit of the PC is ignored
(always regarded as 0).
Rev. 6.00 Aug 04, 2006 page 35 of 626
REJ09B0144-0600
Section 2 CPU
Condition Code Register (CCR)
This 8-bit register contains internal status information, including the interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. These bits can be read
and written by software (using the LDC, STC, ANDC, ORC, and XORC instructions). The N, Z,
V, and C flags are used as branching conditions for conditional branching (Bcc) instructions.
Bit 7—Interrupt Mask Bit (I): When this bit is set to 1, interrupts are masked. This bit is set to 1
automatically at the start of exception handling. The interrupt mask bit may be read and written
by software. For further details, see section 3.3, Interrupts.
Bit 6—User Bit (U): Can be used freely by the user.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and is cleared to 0
otherwise.
The H flag is used implicitly by the DAA and DAS instructions.
When the ADD.W, SUB.W, or CMP.W instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 11, and is cleared to 0 otherwise.
Bit 4—User Bit (U): Can be used freely by the user.
Bit 3—Negative Flag (N): Indicates the most significant bit (sign bit) of the result of an
instruction.
Bit 2—Zero Flag (Z): Set to 1 to indicate a zero result, and cleared to 0 to indicate a non-zero
result.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions, to store the value shifted out of the end bit
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged.
Rev. 6.00 Aug 04, 2006 page 36 of 626
REJ09B0144-0600
Section 2 CPU
Refer to the H8/300L Series Programming Manual for the action of each instruction on the flag
bits.
2.2.3
Initial Register Values
When the CPU is reset, the program counter (PC) is initialized to the value stored at address
H'0000 in the vector table, and the I bit in the CCR is set to 1. The other CCR bits and the general
registers are not initialized. In particular, the stack pointer (R7) is not initialized. The stack pointer
should be initialized by software, by the first instruction executed after a reset.
2.3
Data Formats
The H8/300L CPU can process 1-bit data, 4-bit (BCD) data, 8-bit (byte) data, and 16-bit (word)
data.
• Bit manipulation instructions operate on 1-bit data specified as bit n in a byte operand
(n = 0, 1, 2, ..., 7).
• All arithmetic and logic instructions except ADDS and SUBS can operate on byte data.
• The MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions operate on word data.
• The DAA and DAS instructions perform decimal arithmetic adjustments on byte data in
packed BCD form. Each nibble of the byte is treated as a decimal digit.
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2.3.1
Data Formats in General Registers
Data of all the sizes above can be stored in general registers as shown in figure 2.3.
Data Type
Register No.
Data Format
7
1-bit data
RnH
1-bit data
RnL
Byte data
RnH
Byte data
RnL
Word data
Rn
7
0
6
5
4
3
2
1
0
Don’t care
7
Don’t care
7
0
MSB
LSB
Don’t care
RnH
4-bit BCD data
RnL
0
6
5
4
3
2
1
0
Don’t care
7
0
MSB
LSB
15
0
MSB
LSB
7
4-bit BCD data
7
4
3
Upper digit
0
Lower digit
Don’t care
7
Don’t care
4
Upper digit
Legend:
RnH: Upper byte of general register
RnL: Lower byte of general register
MSB: Most significant bit
LSB: Least significant bit
Figure 2.3 Register Data Formats
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0
3
Lower digit
Section 2 CPU
2.3.2
Memory Data Formats
Figure 2.4 indicates the data formats in memory. The H8/300L CPU can access word data stored
in memory (MOV.W instruction), but the word data must always begin at an even address. If word
data starting at an odd address is accessed, the least significant bit of the address is regarded as 0,
and the word data starting at the preceding address is accessed. The same applies to instruction
codes.
Data Type
Address
Data Format
7
0
1-bit data
Address n
7
Byte data
Address n
MSB
Even address
MSB
Word data
6
Odd address
Byte data (CCR) on stack
Word data on stack
5
4
3
2
1
0
LSB
Upper 8 bits
Lower 8 bits
LSB
Even address
MSB
CCR
LSB
Odd address
MSB
CCR*
LSB
Even address
MSB
Odd address
LSB
CCR: Condition code register
Note: * Ignored on return
Figure 2.4 Memory Data Formats
When the stack is accessed using R7 as an address register, word access should always be
performed. When the CCR is pushed on the stack, two identical copies of the CCR are pushed to
make a complete word. When they are restored, the lower byte is ignored.
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Section 2 CPU
2.4
Addressing Modes
2.4.1
Addressing Modes
The H8/300L CPU supports the eight addressing modes listed in table 2.1. Each instruction uses a
subset of these addressing modes.
Table 2.1
Addressing Modes
No.
Address Modes
Symbol
1
Register direct
Rn
2
Register indirect
@Rn
3
Register indirect with displacement
@(d:16, Rn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@Rn+
@–Rn
5
Absolute address
@aa:8 or @aa:16
6
Immediate
#xx:8 or #xx:16
7
Program-counter relative
@(d:8, PC)
8
Memory indirect
@@aa:8
1. Register Direct—Rn: The register field of the instruction specifies an 8- or 16-bit general
register containing the operand.
Only the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions have 16-bit operands.
2. Register Indirect—@Rn: The register field of the instruction specifies a 16-bit general
register containing the address of the operand in memory.
3. Register Indirect with Displacement—@(d:16, Rn): The instruction has a second word
(bytes 3 and 4) containing a displacement which is added to the contents of the specified
general register to obtain the operand address in memory.
This mode is used only in MOV instructions. For the MOV.W instruction, the resulting
address must be even.
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Section 2 CPU
4. Register Indirect with Post-Increment or Pre-Decrement—@Rn+ or @–Rn:
 Register indirect with post-increment—@Rn+
The @Rn+ mode is used with MOV instructions that load registers from memory.
The register field of the instruction specifies a 16-bit general register containing the address
of the operand. After the operand is accessed, the register is incremented by 1 for MOV.B
or 2 for MOV.W. For MOV.W, the original contents of the 16-bit general register must be
even.
 Register indirect with pre-decrement—@–Rn
The @–Rn mode is used with MOV instructions that store register contents to memory.
The register field of the instruction specifies a 16-bit general register which is decremented
by 1 or 2 to obtain the address of the operand in memory. The register retains the
decremented value. The size of the decrement is 1 for MOV.B or 2 for MOV.W. For
MOV.W, the original contents of the register must be even.
5. Absolute Address—@aa:8 or @aa:16: The instruction specifies the absolute address of the
operand in memory.
The absolute address may be 8 bits long (@aa:8) or 16 bits long (@aa:16). The MOV.B and bit
manipulation instructions can use 8-bit absolute addresses. The MOV.B, MOV.W, JMP, and
JSR instructions can use 16-bit absolute addresses.
For an 8-bit absolute address, the upper 8 bits are assumed to be 1 (H'FF). The address range is
H'FF00 to H'FFFF (65280 to 65535).
6. Immediate—#xx:8 or #xx:16: The instruction contains an 8-bit operand (#xx:8) in its second
byte, or a 16-bit operand (#xx:16) in its third and fourth bytes. Only MOV.W instructions can
contain 16-bit immediate values.
The ADDS and SUBS instructions implicitly contain the value 1 or 2 as immediate data. Some
bit manipulation instructions contain 3-bit immediate data in the second or fourth byte of the
instruction, specifying a bit number.
7. Program-Counter Relative—@(d:8, PC): This mode is used in the Bcc and BSR
instructions. An 8-bit displacement in byte 2 of the instruction code is sign-extended to 16 bits
and added to the program counter contents to generate a branch destination address. The
possible branching range is –126 to +128 bytes (–63 to +64 words) from the current address.
The displacement should be an even number.
8. Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The
second byte of the instruction code specifies an 8-bit absolute address. The word located at this
address contains the branch destination address.
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Section 2 CPU
The upper 8 bits of the absolute address are assumed to be 0 (H'00), so the address range is
from H'0000 to H'00FF (0 to 255). Note that with the H8/300L Series, the lower end of the
address area is also used as a vector area. See section 3.3, Interrupts, for details on the vector
area.
If an odd address is specified as a branch destination or as the operand address of a MOV.W
instruction, the least significant bit is regarded as 0, causing word access to be performed at the
address preceding the specified address. See section 2.3.2, Memory Data Formats, for further
information.
2.4.2
Effective Address Calculation
Table 2.2 shows how effective addresses are calculated in each of the addressing modes.
Arithmetic and logic instructions use register direct addressing (1). The ADD.B, ADDX, SUBX,
CMP.B, AND, OR, and XOR instructions can also use immediate addressing (6).
Data transfer instructions can use all addressing modes except program-counter relative (7) and
memory indirect (8).
Bit manipulation instructions can use register direct (1), register indirect (2), or 8-bit absolute
addressing (5) to specify the operand. Register indirect (1) (BSET, BCLR, BNOT, and BTST
instructions) or 3-bit immediate addressing (6) can be used independently to specify a bit position
in the operand.
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4
3
rm
op
7 6
rm
4 3
4 3
rn
0
0
op
disp
7 6
rm
op
7 6
rm
4 3
4 3
0
0
15
op
7 6
rm
4 3
0
Register indirect with pre-decrement,
@–Rn
15
Register indirect with
post-increment, @Rn+
15
Register indirect with displacement,
@(d:16, Rn)
15
Register indirect, @Rn
8 7
0
0
0
Contents (16 bits) of register
indicated by rm
0
1 or 2
Contents (16 bits) of register
indicated by rm
disp
Contents (16 bits) of register
indicated by rm
Contents (16 bits) of register
indicated by rm
3
rm
0
3
rn
Effective Address (EA)
0
15
15
15
15
0
0
0
0
Operand is contents of registers indicated by rm/rn
Incremented or decremented
by 1 if operand is byte size,
1 or 2
and by 2 if word size
15
15
15
15
Effective Address Calculation Method
Table 2.2
2
op
Register direct, Rn
1
15
Addressing Mode and
Instruction Format
No.
Section 2 CPU
Effective Address Calculation
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7
6
5
No.
op
op
IMM
op
8 7
abs
op
8 7
IMM
abs
15
op
8 7
disp
Program-counter relative
@(d:8, PC)
15
#xx:16
15
Immediate
#xx:8
15
@aa:16
15
Absolute address
@aa:8
Addressing Mode and
Instruction Format
0
0
0
0
0
PC contents
Sign extension
15
disp
0
Effective Address Calculation Method
H'FF
8 7
0
0
15
0
Operand is 1- or 2-byte immediate data
15
15
Effective Address (EA)
Section 2 CPU
8 7
Legend:
rm, rn: Register field
Operation field
op:
disp: Displacement
IMM: Immediate data
abs: Absolute address
op
abs
Memory indirect, @@aa:8
8
15
Addressing Mode and
Instruction Format
No.
0
15
8 7
abs
Memory contents (16 bits)
H'00
0
Effective Address Calculation Method
15
Effective Address (EA)
0
Section 2 CPU
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Section 2 CPU
2.5
Instruction Set
The H8/300L Series can use a total of 55 instructions, which are grouped by function in table 2.3.
Table 2.3
Instruction Set
Function
Instructions
Number
Data transfer
1
1
MOV, PUSH* , POP*
1
Arithmetic operations
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA,
DAS, MULXU, DIVXU, CMP, NEG
14
Logic operations
AND, OR, XOR, NOT
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR
8
Bit manipulation
14
Branch
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR,
BXOR, BIXOR, BLD, BILD, BST, BIST
2
Bcc* , JMP, BSR, JSR, RTS
System control
RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
8
Block data transfer
EEPMOV
1
5
Total: 55
Notes: 1. PUSH Rn is equivalent to MOV.W Rn, @–SP.
POP Rn is equivalent to MOV.W @SP+, Rn. The same applies to the machine
language.
2. Bcc is a conditional branch instruction in which cc represents a condition code.
The following sections give a concise summary of the instructions in each category, and indicate
the bit patterns of their object code. The notation used is defined next.
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Section 2 CPU
Notation
Rd
General register (destination)
Rs
General register (source)
Rn
General register
(EAd), <Ead>
Destination operand
(EAs), <Eas>
Source operand
CCR
Condition code register
N
N (negative) flag of CCR
Z
Z (zero) flag of CCR
V
V (overflow) flag of CCR
C
C (carry) flag of CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
AND logical
∨
OR logical
⊕
Exclusive OR logical
→
Move
~
Logical negation (logical complement)
:3
3-bit length
:8
8-bit length
:16
16-bit length
( ), < >
Contents of operand indicated by effective address
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Section 2 CPU
2.5.1
Data Transfer Instructions
Table 2.4 describes the data transfer instructions. Figure 2.5 shows their object code formats.
Table 2.4
Data Transfer Instructions
Instruction
Size*
MOV
B/W
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general
register.
The Rn, @Rn, @(d:16, Rn), @aa:16, #xx:16, @–Rn, and @Rn+
addressing modes are available for word data. The @aa:8
addressing mode is available for byte data only.
The @–R7 and @R7+ modes require word operands. Do not
specify byte size for these two modes.
POP
W
@SP+ → Rn
Pops a 16-bit general register from the stack. Equivalent to
MOV.W @SP+, Rn.
PUSH
W
Rn → @–SP
Pushes a 16-bit general register onto the stack. Equivalent to
MOV.W Rn, @–SP.
Note:
* Size: Operand size
B: Byte
W: Word
Certain precautions are required in data access. See section 2.9.1, Notes on Data Access, for
details.
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Section 2 CPU
15
8
7
0
op
rm
15
8
rn
0
rm
8
Rm→Rn
7
op
15
MOV
rn
@Rm←→Rn
7
0
op
rm
rn
@(d:16, Rm)←→Rn
disp
15
8
7
0
op
rm
15
8
op
7
0
rn
15
@Rm+→Rn, or
Rn →@–Rm
rn
abs
8
@aa:8←→Rn
7
0
op
rn
@aa:16←→Rn
abs
15
8
op
7
0
rn
15
IMM
8
#xx:8→Rn
7
0
op
rn
#xx:16→Rn
IMM
15
8
op
7
0
1
1
1
rn
PUSH, POP
@SP+ → Rn, or
Rn → @–SP
Legend:
op:
Operation field
rm, rn: Register field
disp: Displacement
abs:
Absolute address
IMM: Immediate data
Figure 2.5 Data Transfer Instruction Codes
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Section 2 CPU
2.5.2
Arithmetic Operations
Table 2.5 describes the arithmetic instructions.
Table 2.5
Arithmetic Instructions
Instruction
Size*
Function
ADD SUB
B/W
Rd ± Rs → Rd, Rd + #IMM → Rd
Performs addition or subtraction on data in two general registers,
or addition on immediate data and data in a general register.
Immediate data cannot be subtracted from data in a general
register. Word data can be added or subtracted only when both
words are in general registers.
ADDX SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry or borrow on byte data
in two general registers, or addition or subtraction on immediate
data and data in a general register.
INC DEC
B
Rd ± 1 → Rd
Increments or decrements a general register by 1.
ADDS SUBS
W
Rd ± 1 → Rd, Rd ± 2 → Rd
Adds or subtracts 1 or 2 to or from a general register
DAA DAS
B
Rd decimal adjust → Rd
Decimal-adjusts (adjusts to 4-bit BCD) an addition or subtraction
result in a general register by referring to the CCR
MULXU
B
Rd × Rs → Rd
Performs 8-bit × 8-bit unsigned multiplication on data in two
general registers, providing a 16-bit result
DIVXU
B
Rd ÷ Rs → Rd
Performs 16-bit ÷ 8-bit unsigned division on data in two general
registers, providing an 8-bit quotient and 8-bit remainder
CMP
B/W
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and indicates the result in the
CCR. Word data can be compared only between two general
registers.
NEG
B
0 – Rd → Rd
Obtains the two’s complement (arithmetic complement) of data in a
general register
Note:
* Size: Operand size
B:
Byte
W:
Word
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Section 2 CPU
2.5.3
Logic Operations
Table 2.6 describes the four instructions that perform logic operations.
Table 2.6
Logic Operation Instructions
Instruction
Size*
Function
AND
B
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and
another general register or immediate data
OR
B
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data
XOR
B
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register
and another general register or immediate data
NOT
B
~ Rd → Rd
Obtains the one’s complement (logical complement) of general
register contents
Note:
* Size: Operand size
B: Byte
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Section 2 CPU
2.5.4
Shift Operations
Table 2.7 describes the eight shift instructions.
Table 2.7
Shift Instructions
Instruction
Size*
SHAL
SHAR
B
SHLL
SHLR
B
ROTL
ROTR
B
ROTXL
ROTXR
B
Note:
Function
Rd shift → Rd
Performs an arithmetic shift operation on general register contents
Rd shift → Rd
Performs a logical shift operation on general register contents
Rd rotate → Rd
Rotates general register contents
Rd rotate through carry → Rd
Rotates general register contents through the C (carry) bit
* Size: Operand size
B: Byte
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Section 2 CPU
Figure 2.6 shows the instruction code format of arithmetic, logic, and shift instructions.
15
8
7
op
0
rm
15
8
7
0
op
15
7
op
0
rm
8
op
0
0
rm
8
AND, OR, XOR (Rm)
0
IMM
8
op
rn
7
rn
15
ADD, ADDX, SUBX,
CMP (#XX:8)
7
op
15
MULXU, DIVXU
IMM
8
op
rn
7
rn
15
ADDS, SUBS, INC, DEC,
DAA, DAS, NEG, NOT
rn
8
15
ADD, SUB, CMP,
ADDX, SUBX (Rm)
rn
AND, OR, XOR (#xx:8)
7
0
rn
SHAL, SHAR, SHLL, SHLR,
ROTL, ROTR, ROTXL, ROTXR
Legend:
op:
Operation field
rm, rn: Register field
IMM: Immediate data
Figure 2.6 Arithmetic, Logic, and Shift Instruction Codes
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Section 2 CPU
2.5.5
Bit Manipulations
Table 2.8 describes the bit-manipulation instructions. Figure 2.7 shows their object code formats.
Table 2.8
Bit-Manipulation Instructions
Instruction
Size*
BSET
B
Function
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory to 1. The bit
number is specified by 3-bit immediate data or the lower three bits
of a general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory to 0. The bit
number is specified by 3-bit immediate data or the lower three bits
of a general register.
BNOT
B
~ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory. The bit
number is specified by 3-bit immediate data or the lower three bits
of a general register.
BTST
B
~ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the C flag with a specified bit in a general register or
memory, and stores the result in the C flag.
BIAND
B
C ∧ [~ (<bit-No.> of <EAd>)] → C
ANDs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the C flag with a specified bit in a general register or memory,
and stores the result in the C flag.
BIOR
B
C ∨ [~ (<bit-No.> of <EAd>)] → C
ORs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
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Section 2 CPU
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the C flag with a specified bit in a general register or
memory, and stores the result in the C flag.
BIXOR
B
C ⊕ [~(<bit-No.> of <EAd>)] → C
XORs the C flag with the inverse of a specified bit in a general
register or memory, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Copies a specified bit in a general register or memory to the C flag.
BILD
B
~ (<bit-No.> of <EAd>) → C
Copies the inverse of a specified bit in a general register or
memory to the C flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
BIST
B
~ C → (<bit-No.> of <EAd>)
Copies the C flag to a specified bit in a general register or memory.
Copies the inverse of the C flag to a specified bit in a general
register or memory.
The bit number is specified by 3-bit immediate data.
Note:
* Size: Operand size
B: Byte
Certain precautions are required in bit manipulation. See section 2.9.2, Notes on Bit
Manipulation, for details.
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BSET, BCLR, BNOT, BTST
15
8
7
0
op
IMM
15
8
7
op
0
rm
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
Operand: register direct (Rn)
Bit No.: register direct (Rm)
rn
7
op
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
op
rn
0
0
0
0 Operand: register indirect (@Rn)
op
rm
0
0
0
0 Bit No.:
op
15
8
15
8
7
0
7
abs
op
IMM
8
0
Operand: absolute (@aa:8)
0
0
7
0 Bit No.:
immediate (#xx:3)
0
op
abs
op
register direct (Rm)
0
op
15
immediate (#xx:3)
rm
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
register direct (Rm)
BAND, BOR, BXOR, BLD, BST
15
8
7
0
op
IMM
15
8
7
op
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Legend:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes
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BIAND, BIOR, BIXOR, BILD, BIST
15
8
7
op
0
IMM
15
8
7
op
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Legend:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes (cont)
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Section 2 CPU
2.5.6
Branching Instructions
Table 2.9 describes the branching instructions. Figure 2.8 shows their object code formats.
Table 2.9
Branching Instructions
Instruction
Size
Function
Bcc
—
Branches to the designated address if condition cc is true. The
branching conditions are given below.
JMP
—
Mnemonic
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC (BHS)
Carry clear (high or same)
C=0
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
Branches unconditionally to a specified address
BSR
—
Branches to a subroutine at a specified address
JSR
—
Branches to a subroutine at a specified address
RTS
—
Returns from a subroutine
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Section 2 CPU
15
8
op
7
0
cc
15
disp
8
7
op
0
rm
15
Bcc
8
0
0
0
7
0
JMP (@Rm)
0
op
JMP (@aa:16)
abs
15
8
7
0
op
abs
15
8
JMP (@@aa:8)
7
0
op
disp
15
8
7
op
0
rm
15
BSR
8
0
0
0
7
0
JSR (@Rm)
0
op
JSR (@aa:16)
abs
15
8
7
op
0
abs
15
8
7
JSR (@@aa:8)
0
op
RTS
Legend:
op: Operation field
cc: Condition field
rm: Register field
disp: Displacement
abs: Absolute address
Figure 2.8 Branching Instruction Codes
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Section 2 CPU
2.5.7
System Control Instructions
Table 2.10 describes the system control instructions. Figure 2.9 shows their object code formats.
Table 2.10 System Control Instructions
Instruction
Size*
Function
RTE
—
Returns from an exception-handling routine
SLEEP
—
Causes a transition from active mode to a power-down mode. See
section 5, Power-Down Modes, for details.
LDC
B
Rs → CCR, #IMM → CCR
Moves immediate data or general register contents to the condition
code register
STC
B
CCR → Rd
Copies the condition code register to a specified general register
ANDC
B
CCR ∧ #IMM → CCR
Logically ANDs the condition code register with immediate data
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the condition code register with immediate data
XORC
B
CCR ⊕ #IMM → CCR
Logically exclusive-ORs the condition code register with immediate
data
NOP
—
PC + 2 → PC
Only increments the program counter
Note:
* Size: Operand size
B: Byte
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Section 2 CPU
15
8
7
0
op
15
8
RTE, SLEEP, NOP
7
0
op
15
rn
8
op
7
LDC, STC (Rn)
0
ANDC, ORC,
XORC, LDC (#xx:8)
IMM
Legend:
op: Operation field
rn: Register field
IMM: Immediate data
Figure 2.9 System Control Instruction Codes
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Section 2 CPU
2.5.8
Block Data Transfer Instruction
Table 2.11 describes the block data transfer instruction. Figure 2.10 shows its object code format.
Table 2.11 Block Data Transfer Instruction
Instruction
Size
Function
EEPMOV
—
If R4L ≠ 0 then
repeat
until
@R5+ → @R6+
R4L –1 → R4L
R4L = 0
else next;
Block transfer instruction. Transfers the number of data bytes
specified by R4L from locations starting at the address indicated by
R5 to locations starting at the address indicated by R6. After the
transfer, the next instruction is executed.
Certain precautions are required in using the EEPMOV instruction. See section 2.9.3, Notes on
Use of the EEPMOV Instruction, for details.
15
8
7
op
op
Legend:
op: Operation field
Figure 2.10 Block Data Transfer Instruction Code
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0
Section 2 CPU
2.6
Basic Operational Timing
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). For details on these
clock signals see section 4, Clock Pulse Generators. The period from a rising edge of φ or φSUB to
the next rising edge is called one state. A bus cycle consists of two states or three states. The
cycle differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing
access in byte or word size. Figure 2.11 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
φ or φSUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.11 On-Chip Memory Access Cycle
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Section 2 CPU
2.6.2
Access to On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits,
so access is by byte size only. This means that for accessing word data, two instructions must be
used. Figures 2.12 and 2.13 show the on-chip peripheral module access cycle.
Two-state access to on-chip peripheral modules
Bus cycle
T2 state
T1 state
φ or φSUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.12 On-Chip Peripheral Module Access Cycle (2-State Access)
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Section 2 CPU
Three-state access to on-chip peripheral modules
Bus cycle
T1 state
T2 state
T3 state
φ or φ SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.13 On-Chip Peripheral Module Access Cycle (3-State Access)
2.7
CPU States
2.7.1
Overview
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active (high-speed or mediumspeed) mode and subactive mode. In the program halt state there are a sleep (high-speed or
medium-speed) mode, standby mode, watch mode, and sub-sleep mode. These states are shown in
figure 2.14. Figure 2.15 shows the state transitions.
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Section 2 CPU
CPU state
Reset state
The CPU is initialized
Program
execution state
Active
(high speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Active
(medium speed) mode
The CPU executes successive
program instructions at
reduced speed, synchronized
by the system clock
Subactive mode
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
Program halt state
A state in which some
or all of the chip
functions are stopped
to conserve power
Low-power
modes
Sleep (high-speed)
mode
Sleep (medium-speed)
mode
Standby mode
Watch mode
Subsleep mode
Exceptionhandling state
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
Note: See section 5, Power-Down Modes, for details on the modes and their transitions.
Figure 2.14 CPU Operation States
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Section 2 CPU
Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
occurs
Program halt state
Interrupt
source
occurs
Exceptionhandling
complete
Program execution state
SLEEP instruction executed
Figure 2.15 State Transitions
2.7.2
Program Execution State
In the program execution state the CPU executes program instructions in sequence.
There are three modes in this state, two active modes (high speed and medium speed) and one
subactive mode. Operation is synchronized with the system clock in active mode (high speed and
medium speed), and with the subclock in subactive mode. See section 5, Power-Down Modes for
details on these modes.
2.7.3
Program Halt State
In the program halt state there are five modes: two sleep modes (high speed and medium speed),
standby mode, watch mode, and subsleep mode. See section 5, Power-Down Modes for details on
these modes.
2.7.4
Exception-Handling State
The exception-handling state is a transient state occurring when exception handling is started by a
reset or interrupt and the CPU changes its normal processing flow. In exception handling caused
by an interrupt, SP (R7) is referenced and the PC and CCR values are saved on the stack.
For details on interrupt handling, see section 3.3, Interrupts.
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Section 2 CPU
2.8
Memory Map
2.8.1
Memory Map
The memory map of the H8/3822R, H8/38322, and H8/38422 is shown in figure 2.16 (1), that of
the H8/3823R, H8/38323, and H8/38423 in figure 2.16 (2), that of the H8/3824R, H8/3824S,
H8/38324, and H8/38424 in figure 2.16 (3), that of the H8/3825R, H8/3825S, H8/38325, and
H8/38425 in figure 2.16 (4), that of the H8/3826R, H8/3826S, H8/38326, and H8/38426 in figure
2.16 (5), and that of the H8/3827R, H8/3827S, H8/38327, and H8/38427 in figure 2.16 (6).
H'0000
Interrupt vector area
H'0029
H'002A
16 Kbytes
On-chip ROM
(16384 bytes)
H'3FFF
Not used
H'F740
LCD RAM
(32 bytes)
H'F75F
Not used
H'F780
On-chip RAM
1024 bytes
H'FB7F
Not used
H'FF90
Internal I/O registers
(112 bytes)
H'FFFF
Figure 2.16 (1) H8/3822R, H8/38322, and H8/38422 Memory Map
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Section 2 CPU
H'0000
Interrupt vector area
H'0029
H'002A
24 Kbytes
On-chip ROM
(24576 bytes)
H'5FFF
Not used
H'F740
LCD RAM
(32 bytes)
H'F75F
Not used
H'F780
On-chip RAM
1024 bytes
H'FB7F
Not used
H'FF90
Internal I/O registers
(112 bytes)
H'FFFF
Figure 2.16 (2) H8/3823R, H8/38323, and H8/38423 Memory Map
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Section 2 CPU
HD6433824R (Mask ROM version)
HD6433824S (Mask ROM version)
HD64338324 (Mask ROM version)
HD64338424 (Mask ROM version)
HD64F38324
HD64F38424
(Flash memory version)
H'0000
H'0029
H'002A
H'0000
Interrupt vector area
On-chip ROM
H'0029
H'002A
32 Kbytes
(32768 bytes)
H'7FFF
Interrupt vector area
On-chip ROM
32 Kbytes
(32768 bytes)
H'7FFF
Not used
H'E000
Firmware for on-chip
emulator*1
Not used
H'EFFF
Not used
H'F020
H'F02B
Internal I/O registers
Not used
H'F300
H'F6FF
(Work area for programming
flash memory: 1 Kbyte)*2
Not used
H'F740
H'F75F
H'F740
H'F75F
LCD RAM (32 bytes)
Not used
Not used
H'F780
H'F780
On-chip RAM
On-chip RAM
2048 bytes
2048 bytes
H'FF7F
H'FF7F
Not used
H'FF90
H'FFFF
LCD RAM (32 bytes)
Internal I/O registers
(112 bytes)
Not used
H'FF90
H'FFFF
Internal I/O registers
(112 bytes)
Notes: 1. Not accessible by the user when the on-chip emulator is used.
2. A programming control program is used to program flash memory. Do not use a user program to perform
programming when the on-chip emulator is used. This area is not used in the mask ROM version.
Figure 2.16 (3) H8/3824R, H8/3824S, H8/38324, and H8/38424 Memory Map
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Section 2 CPU
H'0000
H'0029
Interrupt
vector area
H'002A
40 Kbytes
On-chip ROM
(40960 bytes)
H'9FFF
Not used
H'F740
H'F75F
LCD RAM
(32 bytes)
Not used
H'F780
On-chip RAM
2048 bytes
H'FF7F
Not used
H'FF90
Internal I/O registers
(112 bytes)
H'FFFF
Figure 2.16 (4) H8/3825R, H8/3825S, H8/38325, and H8/38425 Memory Map
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Section 2 CPU
H'0000
Interrupt vector area
H'0029
H'002A
48 Kbytes
On-chip ROM
(49152 bytes)
H'BFFF
Not used
H'F740
LCD RAM
(32 bytes)
H'F75F
Not used
H'F780
On-chip RAM
2048 bytes
H'FF7F
Not used
H'FF90
Internal I/O registers
(112 bytes)
H'FFFF
Figure 2.16 (5) H8/3826R, H8/3826S, H8/38326, and H8/38426 Memory Map
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Section 2 CPU
HD64F38327 (Flash memory version)
HD64F38427 (Flash memory version)
H'0000
H'0029
H'002A
H'0000
Interrupt vector area
On-chip ROM
HD6433827R (Mask ROM version)
HD6433827S (Mask ROM version)
HD64338327 (Mask ROM version)
HD64338427 (Mask ROM version)
HD6473827R (PROM version)
H'0029
H'002A
Interrupt vector area
On-chip ROM
61440 bytes
60928 bytes
H'E000
Firmware for on-chip
emulator*1
H'EDFF
H'EFFF
Not used
H'F020
H'F02B
Internal I/O registers
Not used
Not used
H'F300
H'F6FF
(Work area for programming
flash memory: 1 Kbyte)*2
Not used
H'F740
H'F75F
H'F740
H'F75F
LCD RAM (32 bytes)
Not used
Not used
H'F780
H'F780
On-chip RAM
On-chip RAM
2048 bytes
2048 bytes
H'FF7F
H'FF7F
Not used
H'FF90
H'FFFF
LCD RAM (32 bytes)
Internal I/O registers
(112 bytes)
Not used
H'FF90
H'FFFF
Internal I/O registers
(112 bytes)
Notes: 1. Not accessible by the user when the on-chip emulator is used.
2. A programming control program is used to program flash memory. Do not use a user program to perform
programming when the on-chip emulator is used. This area is not used in the mask ROM version.
Figure 2.16 (6) H8/3827R, H8/3827S, H8/38327, and H8/38427 Memory Map
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Section 2 CPU
2.9
Application Notes
2.9.1
Notes on Data Access
1. Access to Empty Areas:
The address space of the H8/300L CPU includes empty areas in addition to the RAM,
registers, and ROM areas available to the user. If these empty areas are mistakenly accessed
by an application program, the following results will occur.
Data transfer from CPU to empty area:
The transferred data will be lost. This action may also cause the CPU to misoperate.
Data transfer from empty area to CPU:
Unpredictable data is transferred.
2. Access to Internal I/O Registers:
Internal data transfer to or from on-chip modules other than the ROM and RAM areas makes
use of an 8-bit data width. If word access is attempted to these areas, the following results will
occur.
Word access from CPU to I/O register area:
Upper byte: Will be written to I/O register.
Lower byte: Transferred data will be lost.
Word access from I/O register to CPU:
Upper byte: Will be written to upper part of CPU register.
Lower byte: Unpredictable data will be written to lower part of CPU register.
Byte size instructions should therefore be used when transferring data to or from I/O registers
other than the on-chip ROM and RAM areas. Figure 2.17 shows the data size and number of
states in which on-chip peripheral modules can be accessed.
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Section 2 CPU
Access
Word
States
Byte
H'0000
Interrupt vector area
(42 bytes)
H'0029
H'002A
32Kbytes*1
2
On-chip ROM
H'7FFF*1
Not used
—
—
—
H'F740
LCD RAM
(32 bytes)
2
H'F75F
Not used
—
—
—
H'F780
On-chip RAM
2
2048 bytes
H'FF7F*2
Not used
—
H'FF90
Internal I/O registers
(112 bytes)
H'FFFF
H'FF98 to H'FF9F
H'FFA8 to H'FFAF
×
×
×
×
×
—
—
2
3
2
3
2
Notes: The example of the H8/3824R and H8/3824S is shown here.
1. This address is H'3FFF in the H8/3822R (16-Kbyte on-chip ROM), H'5FFF in the
H8/3823R (24-Kbyte on-chip ROM), H'9FFF in the H8/3825R and H8/3825S (40Kbyte on-chip ROM), H'BFFF in the H8/3826R and H8/3826S (48-Kbyte on-chip
ROM), and H'EDFF in the H8/3827R and H8/3827S (60-Kbyte on-chip ROM).
2. This address is H'FB7F in the H8/3822R, and H8/3823R (1024 bytes of on-chip
RAM).
Figure 2.17 Data Size and Number of States for Access to and
from On-Chip Peripheral Modules
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Section 2 CPU
2.9.2
Notes on Bit Manipulation
The BSET, BCLR, BNOT, BST, and BIST instructions read one byte of data, modify the data,
then write the data byte again. Special care is required when using these instructions in cases
where two registers are assigned to the same address, in the case of registers that include writeonly bits, and when the instruction accesses an I/O port.
Order of Operation
Operation
1
Read
Read byte data at the designated address
2
Modify
Modify a designated bit in the read data
3
Write
Write the altered byte data to the designated address
1. Bit Manipulation in Two Registers Assigned to the Same Address
Example 1: timer load register and timer counter
Figure 2.18 shows an example in which two timer registers share the same address. When a bit
manipulation instruction accesses the timer load register and timer counter of a reloadable timer,
since these two registers share the same address, the following operations take place.
Order of Operation
Operation
1
Read
Timer counter data is read (one byte)
2
Modify
The CPU modifies (sets or resets) the bit designated in the instruction
3
Write
The altered byte data is written to the timer load register
The timer counter is counting, so the value read is not necessarily the same as the value in the
timer load register. As a result, bits other than the intended bit in the timer load register may be
modified to the timer counter value.
Read
Count clock
Timer counter
Reload
Write
Timer load register
Internal bus
Figure 2.18 Timer Configuration Example
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Section 2 CPU
Example 2: BSET instruction executed designating port 3
P37 and P36 are designated as input pins, with a low-level signal input at P37 and a high-level
signal at P36. The remaining pins, P35 to P30, are output pins and output low-level signals. In this
example, the BSET instruction is used to change pin P30 to high-level output.
[A: Prior to executing BSET]
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level Low level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
The BSET instruction is executed designating port 3.
@PDR3
[C: After executing BSET]
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level High level
PCR3
0
0
1
1
1
1
1
1
PDR3
0
1
0
0
0
0
0
1
[D: Explanation of how BSET operates]
When the BSET instruction is executed, first the CPU reads port 3.
Since P37 and P36 are input pins, the CPU reads the pin states (low-level and high-level input).
P35 to P30 are output pins, so the CPU reads the value in PDR3. In this example PDR3 has a value
of H'80, but the value read by the CPU is H'40.
Next, the CPU sets bit 0 of the read data to 1, changing the PDR3 data to H'41. Finally, the CPU
writes this value (H'41) to PDR3, completing execution of BSET.
As a result of this operation, bit 0 in PDR3 becomes 1, and P30 outputs a high-level signal.
However, bits 7 and 6 of PDR3 end up with different values.
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Section 2 CPU
To avoid this problem, store a copy of the PDR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PDR3.
[A: Prior to executing BSET]
MOV. B
MOV. B
MOV. B
The PDR3 value (H'80) is written to a work area in memory
(RAM0) as well as to PDR3
#H'80, R0L
R0L,
@RAM0
R0L,
@PDR3
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level Low level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
The BSET instruction is executed designating the PDR3 work
area (RAM0).
@RAM0
[C: After executing BSET]
MOV. B
MOV. B
The work area (RAM0) value is written to PDR3.
@RAM0, R0L
R0L, @PDR3
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level High level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
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Section 2 CPU
2. Bit Manipulation in a Register Containing a Write-only Bit
Example 3: BCLR instruction executed designating port 3 control register PCR3
As in the examples above, P37 and P36 are input pins, with a low-level signal input at P37 and a
high-level signal at P36. The remaining pins, P35 to P30, are output pins that output low-level
signals. In this example, the BCLR instruction is used to change pin P30 to an input port. It is
assumed that a high-level signal will be input to this input pin.
[A: Prior to executing BCLR]
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level Low level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BCLR instruction executed]
BCLR
#0
,
The BCLR instruction is executed designating PCR3.
@PCR3
[C: After executing BCLR]
P37
Input/output Output
P36
P35
P34
P33
P32
P31
P30
Output
Output
Output
Output
Output
Output
Input
Pin state
Low level High level Low level Low level Low level Low level Low level High level
PCR3
1
1
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
[D: Explanation of how BCLR operates]
When the BCLR instruction is executed, first the CPU reads PCR3. Since PCR3 is a write-only
register, the CPU reads a value of H'FF, even though the PCR3 value is actually H'3F.
Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. Finally, this value
(H'FE) is written to PCR3 and BCLR instruction execution ends.
As a result of this operation, bit 0 in PCR3 becomes 0, making P30 an input port. However, bits 7
and 6 in PCR3 change to 1, so that P37 and P36 change from input pins to output pins.
Rev. 6.00 Aug 04, 2006 page 79 of 626
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Section 2 CPU
To avoid this problem, store a copy of the PCR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PCR3.
[A: Prior to executing BCLR]
MOV. B
MOV. B
MOV. B
The PCR3 value (H'3F) is written to a work area in memory
(RAM0) as well as to PCR3.
#H'3F, R0L
R0L,
@RAM0
R0L,
@PCR3
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level Low level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
[B: BCLR instruction executed]
BCLR
#0
,
The BCLR instruction is executed designating the PCR3
work area (RAM0).
@RAM0
[C: After executing BCLR]
MOV. B
MOV. B
The work area (RAM0) value is written to PCR3.
@RAM0, R0L
R0L, @PCR3
P37
Input/output Input
P36
P35
P34
P33
P32
P31
P30
Input
Output
Output
Output
Output
Output
Output
Pin state
Low level High level Low level Low level Low level Low level Low level High level
PCR3
0
0
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
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Section 2 CPU
Table 2.12 lists the pairs of registers that share identical addresses. Table 2.13 lists the registers
that contain write-only bits.
Table 2.12 Registers with Shared Addresses
Register Name
Abbr.
Address
Timer counter and timer load register C
Port data register 1*
TCC/TLC
H'FFB5
PDR1
H'FFD4
Port data register 3*
PDR3
H'FFD6
Port data register 4*
PDR4
H'FFD7
Port data register 5*
Port data register 6*
PDR5
H'FFD8
PDR6
H'FFD9
Port data register 7*
Port data register 8*
PDR7
H'FFDA
PDR8
H'FFDB
Port data register A*
PDRA
H'FFDD
Note:
*
Port data registers have the same addresses as input pins.
Table 2.13 Registers with Write-Only Bits
Register Name
Abbr.
Address
Port control register 1
PCR1
H'FFE4
Port control register 3
PCR3
H'FFE6
Port control register 4
PCR4
H'FFE7
Port control register 5
PCR5
H'FFE8
Port control register 6
PCR6
H'FFE9
Port control register 7
PCR7
H'FFEA
Port control register 8
PCR8
H'FFEB
Port control register A
PCRA
H'FFED
Timer control register F
TCRF
H'FFB6
PWM control register
PWCR
H'FFD0
PWM data register U
PWDRU
H'FFD1
PWM data register L
PWDRL
H'FFD2
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Section 2 CPU
2.9.3
Notes on Use of the EEPMOV Instruction
• The EEPMOV instruction is a block data transfer instruction. It moves the number of bytes
specified by R4L from the address specified by R5 to the address specified by R6.
R5 →
← R6
R5 + R4L →
← R6 + R4L
• When setting R4L and R6, make sure that the final destination address (R6 + R4L) does not
exceed H'FFFF. The value in R6 must not change from H'FFFF to H'0000 during execution of
the instruction.
R5 →
R5 + R4L →
← R6
H'FFFF
Not allowed
Rev. 6.00 Aug 04, 2006 page 82 of 626
REJ09B0144-0600
← R6 + R4L
Section 3 Exception Handling
Section 3 Exception Handling
3.1
Overview
Exception handling is performed in this LSI when a reset or interrupt occurs. Table 3.1 shows the
priorities of these two types of exception handling.
Table 3.1
Exception Handling Types and Priorities
Priority
Exception Source
Time of Start of Exception Handling
High
Reset
Exception handling starts as soon as the reset state is cleared
Interrupt
When an interrupt is requested, exception handling starts after
execution of the present instruction or the exception handling in
progress is completed
Low
3.2
Reset
3.2.1
Overview
A reset is the highest-priority exception. The internal state of the CPU and the registers of the onchip peripheral modules are initialized.
3.2.2
Reset Sequence
As soon as the RES pin goes low, all processing is stopped and the chip enters the reset state.
To make sure the chip is reset properly, observe the following precautions.
• At power on: Hold the RES pin low until the clock pulse generator output stabilizes.
• Resetting during operation: Hold the RES pin low for at least 10 system clock cycles.
Reset exception handling takes place as follows.
• The CPU internal state and the registers of on-chip peripheral modules are initialized, with the
I bit of the condition code register (CCR) set to 1.
• The PC is loaded from the reset exception handling vector address (H'0000 to H'0001), after
which the program starts executing from the address indicated in PC.
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Section 3 Exception Handling
When system power is turned on or off, the RES pin should be held low.
Figure 3.1 shows the reset sequence starting from RES input.
Reset cleared
Program initial
instruction prefetch
Vector fetch Internal
processing
RES
φ
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16-bit)
(2)
(3)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) First instruction of program
Figure 3.1 Reset Sequence
3.2.3
Interrupt Immediately after Reset
After a reset, if an interrupt were to be accepted before the stack pointer (SP: R7) was initialized,
PC and CCR would not be pushed onto the stack correctly, resulting in program runaway. To
prevent this, immediately after reset exception handling all interrupts are masked. For this reason,
the initial program instruction is always executed immediately after a reset. This instruction
should initialize the stack pointer (e.g. MOV.W #xx: 16, SP).
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Section 3 Exception Handling
3.3
Interrupts
3.3.1
Overview
The interrupt sources include 13 external interrupts (IRQ4 to IRQ0, WKP7 to WKP0) and 23
internal interrupts from on-chip peripheral modules. Table 3.2 shows the interrupt sources, their
priorities, and their vector addresses. When more than one interrupt is requested, the interrupt with
the highest priority is processed.
The interrupts have the following features:
• Internal and external interrupts can be masked by the I bit in CCR. When the I bit is set to 1,
interrupt request flags can be set but the interrupts are not accepted.
• IRQ4 to IRQ0 and WKP7 to WKP0 can be set to either rising edge sensing or falling edge
sensing.
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Section 3 Exception Handling
Table 3.2
Interrupt Sources and Their Priorities
Interrupt Source
Interrupt
Vector Number
Vector Address
Priority
RES
Watchdog timer
IRQ0
IRQ1
IRQ2
IRQ3
IRQ4
WKP0
WKP1
WKP2
WKP3
WKP4
WKP5
WKP6
WKP7
Timer A
Asynchronous
counter
Timer C
Reset
0
H'0000 to H'0001
High
IRQ0
IRQ1
IRQ2
IRQ3
IRQ4
WKP0
WKP1
WKP2
WKP3
WKP4
WKP5
WKP6
WKP7
Timer A overflow
Asynchronous counter
overflow
Timer C overflow or
underflow
Timer FL compare match
Timer FL overflow
Timer FH compare match
Timer FH overflow
Timer G input capture
Timer G overflow
SCI3-1 transmit end
SCI3-1 transmit data empty
SCI3-1 receive data full
SCI3-1 overrrun error
SCI3-1 framing error
SCI3-1 parity error
SCI3-2 transmit end
SCI3-2 transmit data empty
SCI3-2 receive data full
SCI3-2 overrun error
SCI3-2 framing error
SCI3-2 parity error
A/D conversion end
Direct transfer
4
5
6
7
8
9
H'0008 to H'0009
H'000A to H'000B
H'000C to H'000D
H'000E to H'000F
H'0010 to H'0011
H'0012 to H'0013
11
12
H'0016 to H'0017
H'0018 to H'0019
13
H'001A to H'001B
14
H'001C to H'001D
15
H'001E to H'001F
16
H'0020 to H'0021
17
H'0022 to H'0023
18
H'0024 to H'0025
Timer FL
Timer FH
Timer G
SCI3-1
SCI3-2
A/D
19
H'0026 to H'0027
(SLEEP instruction
20
H'0028 to H'0029 Low
executed)
Note: Vector addresses H'0002 to H'0007 and H'0014 to H'0015 are reserved and cannot be
used.
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Section 3 Exception Handling
3.3.2
Interrupt Control Registers
Table 3.3 lists the registers that control interrupts.
Table 3.3
Interrupt Control Registers
Name
Abbreviation
R/W
Initial Value
Address
IRQ edge select register
IEGR
R/W
H'E0
H'FFF2
Interrupt enable register 1
IENR1
R/W
H'00
H'FFF3
Interrupt enable register 2
IENR2
R/W
H'00
H'FFF4
Interrupt request register 1
IRR1
R/W *
H'20
H'FFF6
Interrupt request register 2
IRR2
H'00
H'FFF7
Wakeup interrupt request register
IWPR
R/W *
R/W *
H'00
H'FFF9
Wakeup edge select register
WEGR
R/W
H'00
H'FF90
Note:
*
Write is enabled only for writing of 0 to clear a flag.
1. IRQ Edge Select Register (IEGR)
Bit
7
6
5
4
3
2
1
0
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
IEGR is an 8-bit read/write register used to designate whether pins IRQ4 to IRQ0 are set to rising
edge sensing or falling edge sensing.
Bits 7 to 5: Reserved bits
Bits 7 to 5 are reserved: they are always read as 1 and cannot be modified.
Bit 4: IRQ4 edge select (IEG4)
Bit 4 selects the input sensing of the IRQ4 pin and ADTRG pin.
Bit 4
IEG4
Description
0
Falling edge of IRQ4 and ADTRG pin input is detected
1
Rising edge of IRQ4 and ADTRG pin input is detected
(initial value)
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Section 3 Exception Handling
Bit 3: IRQ3 edge select (IEG3)
Bit 3 selects the input sensing of the IRQ3 pin and TMIF pin.
Bit 3
IEG3
Description
0
Falling edge of IRQ3 and TMIF pin input is detected
1
Rising edge of IRQ3 and TMIF pin input is detected
(initial value)
Bit 2: IRQ2 edge select (IEG2)
Bit 2 selects the input sensing of pin IRQ2.
Bit 2
IEG2
Description
0
Falling edge of IRQ2 pin input is detected
1
Rising edge of IRQ2 pin input is detected
(initial value)
Bit 1: IRQ1 edge select (IEG1)
Bit 3 selects the input sensing of the IRQ1 pin and TMIC pin.
Bit 1
IEG1
Description
0
Falling edge of IRQ1 and TMIC pin input is detected
1
Rising edge of IRQ1 and TMIC pin input is detected
(initial value)
Bit 0: IRQ0 edge select (IEG0)
Bit 0 selects the input sensing of pin IRQ0.
Bit 0
IEG0
Description
0
Falling edge of IRQ0 pin input is detected
1
Rising edge of IRQ0 pin input is detected
Rev. 6.00 Aug 04, 2006 page 88 of 626
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(initial value)
Section 3 Exception Handling
2. Interrupt Enable Register 1 (IENR1)
Bit
7
6
5
4
3
2
1
0
IENTA
—
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IENR1 is an 8-bit read/write register that enables or disables interrupt requests.
Bit 7: Timer A interrupt enable (IENTA)
Bit 7 enables or disables timer A overflow interrupt requests.
Bit 7
IENTA
Description
0
Disables timer A interrupt requests
1
Enables timer A interrupt requests
(initial value)
Bit 6: Reserved bit
Bit 6 is a readable/writable reserved bit. It is initialized to 0 by a reset.
Bit 5: Wakeup interrupt enable (IENWP)
Bit 5 enables or disables WKP7 to WKP0 interrupt requests.
Bit 5
IENWP
Description
0
Disables WKP7 to WKP0 interrupt requests
1
Enables WKP7 to WKP0 interrupt requests
(initial value)
Bits 4 to 0: IRQ4 to IRQ0 interrupt enable (IEN4 to IEN0)
Bits 4 to 0 enable or disable IRQ4 to IRQ0 interrupt requests.
Bit n
IENn
Description
0
Disables interrupt requests from pin IRQn
1
Enables interrupt requests from pin IRQn
(initial value)
(n = 4 to 0)
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Section 3 Exception Handling
3. Interrupt Enable Register 2 (IENR2)
Bit
7
6
5
4
IENDT
IENAD
—
IENTG
Initial value
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
3
1
0
IENTC
IENEC
0
0
0
R/W
R/W
R/W
2
IENTFH IENTFL
IENR2 is an 8-bit read/write register that enables or disables interrupt requests.
Bit 7: Direct transfer interrupt enable (IENDT)
Bit 7 enables or disables direct transfer interrupt requests.
Bit 7
IENDT
Description
0
Disables direct transfer interrupt requests
1
Enables direct transfer interrupt requests
(initial value)
Bit 6: A/D converter interrupt enable (IENAD)
Bit 6 enables or disables A/D converter interrupt requests.
Bit 6
IENAD
Description
0
Disables A/D converter interrupt requests
1
Enables A/D converter interrupt requests
(initial value)
Bit 5: Reserved bit
Bit 5 is a readable/writable reserved bit. It is initialized to 0 by a reset.
Bit 4: Timer G interrupt enable (IENTG)
Bit 4 enables or disables timer G input capture or overflow interrupt requests.
Bit 4
IENTG
Description
0
Disables timer G interrupt requests
1
Enables timer G interrupt requests
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(initial value)
Section 3 Exception Handling
Bit 3: Timer FH interrupt enable (IENTFH)
Bit 3 enables or disables timer FH compare match and overflow interrupt requests.
Bit 3
IENTFH
Description
0
Disables timer FH interrupt requests
1
Enables timer FH interrupt requests
(initial value)
Bit 2: Timer FL interrupt enable (IENTFL)
Bit 2 enables or disables timer FL compare match and overflow interrupt requests.
Bit 2
IENTFL
Description
0
Disables timer FL interrupt requests
1
Enables timer FL interrupt requests
(initial value)
Bit 1: Timer C interrupt enable (IENTC)
Bit 1 enables or disables timer C overflow and underflow interrupt requests.
Bit 1
IENTC
Description
0
Disables timer C interrupt requests
1
Enables timer C interrupt requests
(initial value)
Bit 0: Asynchronous event counter interrupt enable (IENEC)
Bit 0 enables or disables asynchronous event counter interrupt requests.
Bit 0
IENEC
Description
0
Disables asynchronous event counter interrupt requests
1
Enables asynchronous event counter interrupt requests
(initial value)
For details of SCI3-1 and SCI3-2 interrupt control, see section 10.2.6, Serial Control Register 3
(SCR3).
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Section 3 Exception Handling
4. Interrupt Request Register 1 (IRR1)
Bit
7
6
5
4
3
2
1
0
IRRTA
—
—
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
0
0
1
0
0
0
0
0
R/W *
R/W *
Initial value
R/W *
Read/Write
R/W *
—
R/W *
R/W *
R/W *
Note: * Only a write of 0 for flag clearing is possible
IRR1 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a timer A or
IRQ4 to IRQ0 interrupt is requested. The flags are not cleared automatically when an interrupt is
accepted. It is necessary to write 0 to clear each flag.
Bit 7: Timer A interrupt request flag (IRRTA)
Bit 7
IRRTA
Description
0
Clearing condition:
1
Setting condition:
When IRRTA = 1, it is cleared by writing 0
When the timer A counter value overflows from H'FF to H'00
Bit 6: Reserved bit
Bit 6 is a readable/writable reserved bit. It is initialized to 0 by a reset.
Bit 5: Reserved bit
Bit 5 is reserved; it is always read as 1 and cannot be modified.
Rev. 6.00 Aug 04, 2006 page 92 of 626
REJ09B0144-0600
(initial value)
Section 3 Exception Handling
Bits 4 to 0: IRQ4 to IRQ0 interrupt request flags (IRRI4 to IRRI0)
Bit n
IRRIn
Description
0
Clearing condition:
(initial value)
When IRRIn = 1, it is cleared by writing 0
1
Setting condition:
When pin IRQn is designated for interrupt input and the designated signal edge is
input
(n = 4 to 0)
5. Interrupt Request Register 2 (IRR2)
Bit
Initial value
Read/Write
7
6
5
4
IRRDT
IRRAD
—
IRRTG
0
0
0
0
R/W *
R/W *
R/W
R/W *
3
2
IRRTFH IRRTFL
0
R/W *
0
R/W *
1
0
IRRTC
IRREC
0
0
R/W *
R/W *
Note: * Only a write of 0 for flag clearing is possible
IRR2 is an 8-bit read/write register, in which a corresponding flag is set to 1 when a direct
transfer, A/D converter, Timer G, Timer FH, Timer FC, or Timer C interrupt is requested. The
flags are not cleared automatically when an interrupt is accepted. It is necessary to write 0 to clear
each flag.
Bit 7: Direct transfer interrupt request flag (IRRDT)
Bit 7
IRRDT
Description
0
Clearing condition:
(initial value)
When IRRDT = 1, it is cleared by writing 0
1
Setting condition:
When a direct transfer is made by executing a SLEEP instruction while DTON = 1 in
SYSCR2
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REJ09B0144-0600
Section 3 Exception Handling
Bit 6: A/D converter interrupt request flag (IRRAD)
Bit 6
IRRAD
Description
0
Clearing condition:
(initial value)
When IRRAD = 1, it is cleared by writing 0
1
Setting condition:
When A/D conversion is completed and ADSF is cleared to 0 in ADSR
Bit 5: Reserved bit
Bit 5 is a readable/writable reserved bit. It is initialized to 0 by a reset.
Bit 4: Timer G interrupt request flag (IRRTG)
Bit 4
IRRTG
Description
0
Clearing condition:
(initial value)
When IRRTG = 1, it is cleared by writing 0
1
Setting condition:
When the TMIG pin is designated for TMIG input and the designated signal edge is
input, or when TCG overflows while OVIE is set to 1 in TMG
Bit 3: Timer FH interrupt request flag (IRRTFH)
Bit 3
IRRTFH
Description
0
Clearing condition:
(initial value)
When IRRTFH = 1, it is cleared by writing 0
1
Setting condition:
When TCFH and OCRFH match in 8-bit timer mode, or when TCF (TCFL, TCFH)
and OCRF (OCRFL, OCRFH) match in 16-bit timer mode
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Section 3 Exception Handling
Bit 2: Timer FL interrupt request flag (IRRTFL)
Bit 2
IRRTFL
Description
0
Clearing condition:
(initial value)
When IRRTFL= 1, it is cleared by writing 0
1
Setting condition:
When TCFL and OCRFL match in 8-bit timer mode
Bit 1: Timer C interrupt request flag (IRRTC)
Bit 1
IRRTC
Description
0
Clearing condition:
1
Setting condition:
(initial value)
When IRRTC= 1, it is cleared by writing 0
When the timer C counter value overflows (from H'FF to H'00) or underflows
(from H'00 to H'FF)
Bit 0: Asynchronous event counter interrupt request flag (IRREC)
Bit 0
IRREC
Description
0
Clearing condition:
(initial value)
When IRREC = 1, it is cleared by writing 0
1
Setting condition:
When ECH overflows in 16-bit counter mode, or ECH or ECL overflows in 8-bit
counter mode
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Section 3 Exception Handling
6. Wakeup Interrupt Request Register (IWPR)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
0
R/W *
0
R/W *
0
R/W *
0
R/W *
0
R/W *
0
R/W *
0
0
R/W *
R/W *
Note: * Only a write of 0 for flag clearing is possible
IWPR is an 8-bit read/write register containing wakeup interrupt request flags. When one of pins
WKP7 to WKP0 is designated for wakeup input and a rising or falling edge is input at that pin, the
corresponding flag in IWPR is set to 1. A flag is not cleared automatically when the
corresponding interrupt is accepted. Flags must be cleared by writing 0.
Bits 7 to 0: Wakeup interrupt request flags (IWPF7 to IWPF0)
Bit n
IWPFn
Description
0
Clearing condition:
(initial value)
When IWPFn= 1, it is cleared by writing 0
1
Setting condition:
When pin WKPn is designated for wakeup input and a rising or falling edge is input at
that pin
(n = 7 to 0)
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Section 3 Exception Handling
7. Wakeup Edge Select Register (WEGR)
Bit
7
6
5
4
3
2
1
0
WKEGS7 WKEGS6 WKEGS5 WKEGS4 WKEGS3 WKEGS2 WKEGS1 WKEGS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
WEGR is an 8-bit read/write register that specifies rising or falling edge sensing for pins WKPn.
WEGR is initialized to H'00 by a reset.
Bit n: WKPn edge select (WKEGSn)
Bit n selects WKPn pin input sensing.
Bit n
WKEGSn
Description
0
WKPn pin falling edge detected
1
WKPn pin rising edge detected
(initial value)
(n = 7 to 0)
3.3.3
External Interrupts
There are 13 external interrupts: IRQ4 to IRQ0 and WKP7 to WKP0.
1. Interrupts WKP7 to WKP0
Interrupts WKP7 to WKP0 are requested by either rising or falling edge input to pins WKP7 to
WKP0. When these pins are designated as pins WKP7 to WKP0 in port mode register 5 and a
rising or falling edge is input, the corresponding bit in IWPR is set to 1, requesting an interrupt.
Recognition of wakeup interrupt requests can be disabled by clearing the IENWP bit to 0 in
IENR1. These interrupts can all be masked by setting the I bit to 1 in CCR.
When WKP7 to WKP0 interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector
number 9 is assigned to interrupts WKP7 to WKP0. All eight interrupt sources have the same
vector number, so the interrupt-handling routine must discriminate the interrupt source.
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Section 3 Exception Handling
2. Interrupts IRQ4 to IRQ0
Interrupts IRQ4 to IRQ0 are requested by input signals to pins IRQ4 to IRQ0. These interrupts are
detected by either rising edge sensing or falling edge sensing, depending on the settings of bits
IEG4 to IEG0 in IEGR.
When these pins are designated as pins IRQ4 to IRQ0 in port mode register 3 and 1 and the
designated edge is input, the corresponding bit in IRR1 is set to 1, requesting an interrupt.
Recognition of these interrupt requests can be disabled individually by clearing bits IEN4 to IEN0
to 0 in IENR1. These interrupts can all be masked by setting the I bit to 1 in CCR.
When IRQ4 to IRQ0 interrupt exception handling is initiated, the I bit is set to 1 in CCR. Vector
numbers 8 to 4 are assigned to interrupts IRQ4 to IRQ0. The order of priority is from IRQ0 (high)
to IRQ4 (low). Table 3.2 gives details.
3.3.4
Internal Interrupts
There are 23 internal interrupts that can be requested by the on-chip peripheral modules. When a
peripheral module requests an interrupt, the corresponding bit in IRR1 or IRR2 is set to 1.
Recognition of individual interrupt requests can be disabled by clearing the corresponding bit in
IENR1 or IENR2. All these interrupts can be masked by setting the I bit to 1 in CCR. When
internal interrupt handling is initiated, the I bit is set to 1 in CCR. Vector numbers from 20 to 11
are assigned to these interrupts. Table 3.2 shows the order of priority of interrupts from on-chip
peripheral modules.
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Section 3 Exception Handling
3.3.5
Interrupt Operations
Interrupts are controlled by an interrupt controller. Figure 3.2 shows a block diagram of the
interrupt controller. Figure 3.3 shows the flow up to interrupt acceptance.
Priority decision logic
Interrupt controller
External or
internal
interrupts
Interrupt
request
External
interrupts or
internal
interrupt
enable
signals
I
CCR (CPU)
Figure 3.2 Block Diagram of Interrupt Controller
Interrupt operation is described as follows.
• When an interrupt condition is met while the interrupt enable register bit is set to 1, an
interrupt request signal is sent to the interrupt controller.
• When the interrupt controller receives an interrupt request, it sets the interrupt request flag.
• From among the interrupts with interrupt request flags set to 1, the interrupt controller selects
the interrupt request with the highest priority and holds the others pending. (Refer to table 3.2
for a list of interrupt priorities.)
• The interrupt controller checks the I bit of CCR. If the I bit is 0, the selected interrupt request
is accepted; if the I bit is 1, the interrupt request is held pending.
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Section 3 Exception Handling
• If the interrupt is accepted, after processing of the current instruction is completed, both PC
and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.4.
The PC value pushed onto the stack is the address of the first instruction to be executed upon
return from interrupt handling.
• The I bit of CCR is set to 1, masking further interrupts.
• The vector address corresponding to the accepted interrupt is generated, and the interrupt
handling routine located at the address indicated by the contents of the vector address is
executed.
Notes: 1. When disabling interrupts by clearing bits in an interrupt enable register, or when
clearing bits in an interrupt request register, always do so while interrupts are masked
(I = 1).
2. If the above clear operations are performed while I = 0, and as a result a conflict arises
between the clear instruction and an interrupt request, exception processing for the
interrupt will be executed after the clear instruction has been executed.
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Section 3 Exception Handling
Program execution state
IRRI0 = 1
No
Yes
IEN0 = 1
No
Yes
IRRI1 = 1
No
Yes
IEN1 = 1
Yes
No
IRRI2 = 1
No
Yes
IEN2 = 1
No
Yes
IRRDT = 1
No
Yes
IENDT = 1
No
Yes
No
I=0
Yes
PC contents saved
CCR contents saved
I←1
Branch to interrupt
handling routine
Legend:
PC: Program counter
CCR: Condition code register
I:
I bit of CCR
Figure 3.3 Flow Up to Interrupt Acceptance
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Section 3 Exception Handling
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR *
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
Legend:
PCH: Upper 8 bits of program counter (PC)
Lower 8 bits of program counter (PC)
PCL:
CCR: Condition code register
Stack pointer
SP:
Notes: 1. PC shows the address of the first instruction to be executed upon
return from the interrupt handling routine.
2. Register contents must always be saved and restored by word access,
starting from an even-numbered address.
* Ignored on return.
Figure 3.4 Stack State after Completion of Interrupt Exception Handling
Figure 3.5 shows a typical interrupt sequence.
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Internal data bus
(16 bits)
Internal write
signal
Internal read
signal
Internal
address bus
φ
Interrupt
request signal
(4)
Instruction
prefetch
(3)
Internal
processing
(5)
(1)
Stack access
(6)
(7)
(9)
Vector fetch
(8)
(10)
(9)
Prefetch instruction of
Internal
interrupt-handling routine
processing
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector)
(10) First instruction of interrupt-handling routine
(2)
(1)
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
Section 3 Exception Handling
Figure 3.5 Interrupt Sequence
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Section 3 Exception Handling
3.3.6
Interrupt Response Time
Table 3.4 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handler is executed.
Table 3.4
Interrupt Wait States
Item
States
Total
Waiting time for completion of executing instruction*
1 to 13
15 to 27
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Note:
*
Not including EEPMOV instruction.
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Section 3 Exception Handling
3.4
Application Notes
3.4.1
Notes on Stack Area Use
When word data is accessed in the H8/3864 Group, the least significant bit of the address is
regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7)
should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W
@SP+, Rn) to save or restore register values.
Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.6.
SP →
SP →
PCH
PC L
R1L
PC L
SP →
H'FEFC
H'FEFD
H'FEFF
BSR instruction
SP set to H'FEFF
MOV. B R1L, @–R7
Stack accessed beyond SP
Contents of PCH are lost
Legend:
PCH: Upper byte of program counter
PCL: Lower byte of program counter
R1L: General register R1L
SP: Stack pointer
Figure 3.6 Operation when Odd Address is Set in SP
When CCR contents are saved to the stack during interrupt exception handling or restored when
RTE is executed, this also takes place in word size. Both the upper and lower bytes of word data
are saved to the stack; on return, the even address contents are restored to CCR while the odd
address contents are ignored.
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Section 3 Exception Handling
3.4.2
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, the
following points should be observed.
When an external interrupt pin function is switched by rewriting the port mode register that
controls pins IRQ4 to IRQ0, WKP7 to WKP0, the interrupt request flag may be set to 1 at the time
the pin function is switched, even if no valid interrupt is input at the pin. Be sure to clear the
interrupt request flag to 0 after switching pin functions. Table 3.5 shows the conditions under
which interrupt request flags are set to 1 in this way.
Table 3.5
Conditions Under which Interrupt Request Flag is Set to 1
Interrupt Request
Flags Set to 1
IRR1
IRRI4
Conditions
When PMR1 bit IRQ4 is changed from 0 to 1 while pin IRQ4 is low and IEGR bit IEG4
= 0.
When PMR1 bit IRQ4 is changed from 1 to 0 while pin IRQ4 is low and IEGR bit IEG4
= 1.
IRRI3
When PMR1 bit IRQ3 is changed from 0 to 1 while pin IRQ3 is low and IEGR bit IEG3
= 0.
When PMR1 bit IRQ3 is changed from 1 to 0 while pin IRQ3 is low and IEGR bit IEG3
= 1.
IRRI2
When PMR1 bit IRQ2 is changed from 0 to 1 while pin IRQ2 is low and IEGR bit IEG2
= 0.
When PMR1 bit IRQ2 is changed from 1 to 0 while pin IRQ2 is low and IEGR bit IEG2
= 1.
IRRI1
When PMR1 bit IRQ1 is changed from 0 to 1 while pin IRQ1 is low and IEGR bit IEG1
= 0.
When PMR1 bit IRQ1 is changed from 1 to 0 while pin IRQ1 is low and IEGR bit IEG1
= 1.
IRRI0
When PMR3 bit IRQ0 is changed from 0 to 1 while pin IRQ0 is low and IEGR bit IEG0
= 0.
When PMR3 bit IRQ0 is changed from 1 to 0 while pin IRQ0 is low and IEGR bit IEG0
= 1.
IWPR
IWPF7
When PMR5 bit WKP7 is changed from 0 to 1 while pin WKP7 is low.
IWPF6
When PMR5 bit WKP6 is changed from 0 to 1 while pin WKP6 is low.
IWPF5
When PMR5 bit WKP5 is changed from 0 to 1 while pin WKP5 is low.
IWPF4
When PMR5 bit WKP4 is changed from 0 to 1 while pin WKP4 is low.
IWPF3
When PMR5 bit WKP3 is changed from 0 to 1 while pin WKP3 is low.
IWPF2
When PMR5 bit WKP2 is changed from 0 to 1 while pin WKP2 is low.
IWPF1
When PMR5 bit WKP1 is changed from 0 to 1 while pin WKP1 is low.
IWPF0
When PMR5 bit WKP0 is changed from 0 to 1 while pin WKP0 is low.
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Section 3 Exception Handling
Figure 3.7 shows the procedure for setting a bit in a port mode register and clearing the interrupt
request flag.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0. If the instruction to clear the flag is executed immediately after
the port mode register access without executing an intervening instruction, the flag will not be
cleared.
An alternative method is to avoid the setting of interrupt request flags when pin functions are
switched by keeping the pins at the high level so that the conditions in table 3.5 do not occur.
CCR I bit ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
Set port mode register bit
Execute NOP instruction
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0
Clear interrupt request flag to 0
CCR I bit ← 0
Interrupt mask cleared
Figure 3.7 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure
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Section 3 Exception Handling
3.4.3
Method for Clearing Interrupt Request Flags
Use the recommended method, given below when clearing the flags of interrupt request registers
(IRR1, IRR2, IWPR).
• Recommended method
Use a single instruction to clear flags. The bit control instruction and byte-size data transfer
instruction can be used. Two examples of program code for clearing IRRI1 (bit 1 of IRR1) are
given below.
BCLR
#1,
@IRR1:8
MOV.B R1L, @IRR1:8 (set the value of R1L to B'11111101)
• Example of a malfunction
When flags are cleared with multiple instructions, other flags might be cleared during
execution of the instructions, even though they are currently set, and this will cause a
malfunction.
Here is an example in which IRRI0 is cleared and disabled in the process of clearing IRRI1
(bit 1 of IRR1).
MOV.B @IRR1:8,R1L ......... IRRI0 = 0 at this time
AND.B #B'11111101,R1L ..... Here, IRRI0 = 1
MOV.B R1L,@IRR1:8 ......... IRRI0 is cleared to 0
In the above example, it is assumed that an IRQ0 interrupt is generated while the AND.B
instruction is executing.
The IRQ0 interrupt is disabled because, although the original objective is clearing IRRI1,
IRRI0 is also cleared.
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Section 4 Clock Pulse Generators
Section 4 Clock Pulse Generators
4.1
Overview
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator and system clock dividers. The subclock pulse generator
consists of a subclock oscillator circuit and a subclock divider.
4.1.1
Block Diagram
Figure 4.1 shows a block diagram of the clock pulse generators.
OSC 1
OSC 2
System clock
oscillator
φ OSC
(f OSC)
φ OSC/2
System clock
divider (1/2)
System
clock
divider
φOSC/128
φOSC/64
φOSC/32
φOSC/16
φ
Prescaler S
(13 bits)
System clock pulse generator
EXCL*
X1
X2
Subclock
oscillator
φW
(f W )
Subclock
divider
(1/2, 1/4, 1/8)
φ W /2
φ W /4
φ W /8
Subclock pulse generator
φ/2
to
φ/8192
φW
φ SUB
Prescaler W
(5 bits)
φW /2
φW /4
φW /8
to
φW /128
Note: * H8/38327 Group and H8/38427 Group only
Figure 4.1 Block Diagram of Clock Pulse Generators
4.1.2
System Clock and Subclock
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φSUB. Four
of the clock signals have names: φ is the system clock, φSUB is the subclock, φOSC is the oscillator
clock, and φW is the watch clock.
The clock signals available for use by peripheral modules are φ/2, φ/4, φ/8, φ/16, φ/32, φ/64,
φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, φ/8192, φW, φW/2, φW/4, φW/8, φW/16, φW/32, φW/64,
and φW/128. The clock requirements differ from one module to another.
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Section 4 Clock Pulse Generators
4.2
System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
oscillator, or by providing external clock input.
1. Connecting a Crystal Oscillator
Figure 4.2 shows a typical method of connecting a crystal oscillator. For information on
recommended resonators, see the product AC characteristics listed in section 15, Electrical
Characteristics. Please consult with the resonator manufacturer when selecting a resonator model.
C1
R f = 1 MΩ ±20%
OSC 1
Rf
OSC 2
C2
Figure 4.2 Typical Connection to Crystal Oscillator
2. Connecting a Ceramic Oscillator
Figure 4.3 shows a typical method of connecting a ceramic oscillator. For information on
recommended resonators, see the product AC characteristics listed in section 15, Electrical
Characteristics. Please consult with the resonator manufacturer when selecting a resonator model.
C1
R f = 1 MΩ ±20%
OSC 1
Rf
OSC 2
C2
Figure 4.3 Typical Connection to Ceramic Oscillator
3. Notes on Board Design
When generating clock pulses by connecting a crystal or ceramic oscillator, pay careful attention
to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.4.)
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Section 4 Clock Pulse Generators
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC1 and OSC2.
To be avoided
Signal A Signal B
C1
OSC 1
OSC 2
C2
Figure 4.4 Board Design of Oscillator Circuit
4. External Clock Input Method
Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 4.5 shows a
typical connection.
OSC 1
OSC 2
External clock input
Open
Figure 4.5 External Clock Input (Example)
Frequency
Oscillator Clock (φ
φOSC)
Duty cycle
45% to 55%
Note: The circuit parameters above are recommended by the crystal or ceramic oscillator
manufacturer.
The circuit parameters are affected by the crystal or ceramic oscillator and floating
capacitance when designing the board. When using the oscillator, consult with the crystal
or ceramic oscillator manufacturer to determine the circuit parameters.
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Section 4 Clock Pulse Generators
4.3
Subclock Generator
1. Connecting a 32.768 kHz/38.4 kHz Crystal Oscillator
Clock pulses can be supplied to the subclock divider by connecting a 32.768 kHz/38.4 kHz crystal
oscillator, as shown in figure 4.6. Follow the same precautions as noted under 3. notes on board
design for the system clock in 4.2.
C1
X1
X2
C1 = C 2 = 15 pF (typ.)
C2
Note: Circuit constants should be determined in consultation
with the resonator manufacturer.
Oscillation frequency
Manufacturer
Products Name
38.4 kHz
Seiko Instrument Inc.
VTC-200
32.768 kHz
Nihon Denpa Kogyo
MX73P
Figure 4.6 Typical Connection to 32.768 kHz/38.4 kHz Crystal Oscillator (Subclock)
Figure 4.7 shows the equivalent circuit of the 32.768 kHz/38.4 kHz crystal oscillator.
CS
LS
RS
X1
X2
C0
C0 = 1.5 pF typ
RS = 14 k Ω typ
f W = 32.768 kHz/38.4kHz
Figure 4.7 Equivalent Circuit of 32.768 kHz/38.4 kHz Crystal Oscillator
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Section 4 Clock Pulse Generators
2. Pin Connection when Not Using Subclock
When the subclock is not used, connect pin X1 to GND and leave pin X2 open, as shown in
figure 4.8.
X1
GND
X2
Open
Figure 4.8 Pin Connection when not Using Subclock
3. External Clock Input
• H8/3827R Group and H8/3827S Group
Connect the external clock to the X1 pin and leave the X2 pin open, as shown in figure 4.9 (a).
X1
X2
External clock input
Open
Figure 4.9 (a) Pin Connection when Inputting External Clock
Frequency
Subclock (φ
φw)
Duty
45% to 55%
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Section 4 Clock Pulse Generators
• H8/38327 Group and H8/38427 Group
Connect pin X1 to GND and leave pin X2 open. Input an external clock to pin EXCL. Set bit
EXCL in register PMR2 to 1 to supply the external clock to the internal components of the
device. A connection example is shown in figure 4.9 (b).
X1
GND
X2
Open
External clock input
P31/UD/EXCL
Figure 4.9 (b) Pin Connection when Inputting External Clock
(H8/38327 Group and H8/38427 Group)
Frequency
Subclock (φ
φw)
Duty
45% to 55%
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Section 4 Clock Pulse Generators
4.4
Prescalers
The H8/3864 Group is equipped with two on-chip prescalers having different input clocks
(prescaler S and prescaler W). Prescaler S is a 13-bit counter using the system clock (φ) as its
input clock. Its prescaled outputs provide internal clock signals for on-chip peripheral modules.
Prescaler W is a 5-bit counter using a 32.768 kHz or 38.4 kHz signal divided by 4 (φW/4) as its
input clock. Its prescaled outputs are used by timer A as a time base for timekeeping.
1. Prescaler S (PSS)
Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. It is incremented once
per clock period.
Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from the reset state.
In standby mode, watch mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000.
The CPU cannot read or write prescaler S.
The output from prescaler S is shared by timer A, timer C, timer F, timer G, SCI3-1, SC3-2, the
A/D converter, the LCD controller, the watchdog timer, and the 14-bit PWM. The divider ratio
can be set separately for each on-chip peripheral function.
In active (medium-speed) mode the clock input to prescaler S is φosc/16, φosc/32, φosc/64, or
φosc/128.
2. Prescaler W (PSW)
Prescaler W is a 5-bit counter using a 32.768 kHz/38.4 kHz signal divided by 4 (φW/4) as its input
clock.
Prescaler W is initialized to H'00 by a reset, and starts counting on exit from the reset state.
Even in standby mode, watch mode, subactive mode, or subsleep mode, prescaler W continues
functioning so long as clock signals are supplied to pins X1 and X2.
Prescaler W can be reset by setting 1s in bits TMA3 and TMA2 of timer mode register A (TMA).
Output from prescaler W can be used to drive timer A, in which case timer A functions as a time
base for timekeeping.
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Section 4 Clock Pulse Generators
4.5
Note on Oscillators
Oscillator characteristics are closely related to board design and should be carefully evaluated by
the user in mask ROM, ZTAT™, and F-ZTAT™ versions, referring to the examples shown in this
section. Oscillator circuit constants will differ depending on the oscillator element, stray
capacitance in its interconnecting circuit, and other factors. Suitable constants should be
determined in consultation with the oscillator element manufacturer. Design the circuit so that the
oscillator element never receives voltages exceeding its maximum rating.
TEST
OSC1
OSC2
Vss
X2
X1
P17
(Vss)
Figure 4.10 Example of Crystal and Ceramic Oscillator Element Arrangement
Figure 4.11 (1) shows an example measuring circuit with the negative resistance suggested by the
oscillator manufacturer. Note that if the negative resistance of the circuit is less than that suggested
by the oscillator manufacturer, it may be difficult to start the main oscillator.
If it is determined that oscillation is not occurring because the negative resistance is lower than the
level suggested by the oscillator manufacturer, the circuit may be modified as shown in figure 4.11
(2) through (4). Which of the modification suggestions to use and the capacitor capacitance should
be decided based upon an evaluation of factors such as the negative resistance and the frequency
deviation.
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Section 4 Clock Pulse Generators
Modification
point
OSC1
OSC1
C1
C1
Rf
Rf
OSC2
OSC2
C2
C2
Negative resistance,
addition of −R
(1) Negative Resistance Measuring Circuit
(2) Oscillator Circuit Modification Suggestion 1
Modification
point
Modification
point
C3
OSC1
C1
OSC1
C1
Rf
C2
Rf
OSC2
OSC2
(3) Oscillator Circuit Modification Suggestion 2
C2
(4) Oscillator Circuit Modification Suggestion 3
Figure 4.11 Negative Resistance Measurement and Circuit Modification Suggestions
4.5.1
Definition of Oscillation Stabilization Wait Time
Figure 4.12 shows the oscillation waveform (OSC2), system clock (φ), and microcomputer
operating mode when a transition is made from standby mode, watch mode, or subactive mode, to
active (high-speed/medium-speed) mode, with an oscillator element connected to the system clock
oscillator.
As shown in figure 4.12, as the system clock oscillator is halted in standby mode, watch mode,
and subactive mode, when a transition is made to active (high-speed/medium-speed) mode, the
sum of the following two times (oscillation stabilization time and wait time) is required.
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Section 4 Clock Pulse Generators
1. Oscillation Stabilization Time (trc)
The time from the point at which the system clock oscillator oscillation waveform starts to change
when an interrupt is generated, until the amplitude of the oscillation waveform increases and the
oscillation frequency stabilizes.
2. Wait Time
The time required for the CPU and peripheral functions to begin operating after the oscillation
waveform frequency and system clock have stabilized.
The wait time setting is selected with standby timer select bits 2 to 0 (STS2 to STS0) (bits 6 to 4 in
system control register 1 (SYSCR1)).
Oscillation
waveform
(OSC2)
System clock
(φ)
Oscillation
stabilization
time
Wait time
Operating
mode
Standby mode,
watch mode,
or subactive
mode
Oscillation stabilization wait time
Active (high-speed) mode or
active (medium-speed) mode
Interrupt accepted
Figure 4.12 Oscillation Stabilization Wait Time
When standby mode, watch mode, or subactive mode is cleared by an interrupt or reset, and a
transition is made to active (high-speed/medium-speed) mode, the oscillation waveform begins to
change at the point at which the interrupt is accepted. Therefore, when an oscillator element is
connected in standby mode, watch mode, or subactive mode, since the system clock oscillator is
halted, the time from the point at which this oscillation waveform starts to change until the
amplitude of the oscillation waveform increases and the oscillation frequency stabilizes—that is,
the oscillation stabilization time—is required.
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Section 4 Clock Pulse Generators
The oscillation stabilization time in the case of these state transitions is the same as the oscillation
stabilization time at power-on (the time from the point at which the power supply voltage reaches
the prescribed level until the oscillation stabilizes), specified by "oscillation stabilization time trc"
in the AC characteristics.
Meanwhile, once the system clock has halted, a wait time of at least 8 states is necessary in order
for the CPU and peripheral functions to operate normally.
Thus, the time required from interrupt generation until operation of the CPU and peripheral
functions is the sum of the above described oscillation stabilization time and wait time. This total
time is called the oscillation stabilization wait time, and is expressed by equation (1) below.
Oscillation stabilization wait time = oscillation stabilization time + wait time
= trc + (8 to 131,072 states)
................. (1)
Therefore, when a transition is made from standby mode, watch mode, or subactive mode, to
active (high-speed/medium-speed) mode, with an oscillator element connected to the system clock
oscillator, careful evaluation must be carried out on the installation circuit before deciding on the
oscillation stabilization wait time. In particular, since the oscillation stabilization time is affected
by installation circuit constants, stray capacitance, and so forth, suitable constants should be
determined in consultation with the oscillator element manufacturer.
4.5.2
Notes on Use of Crystal Oscillator Element (Excluding Ceramic Oscillator
Element)
When a microcomputer operates, the internal power supply potential fluctuates slightly in
synchronization with the system clock. Depending on the individual crystal oscillator element
characteristics, the oscillation waveform amplitude may not be sufficiently large immediately after
the oscillation stabilization wait time, making the oscillation waveform susceptible to influence by
fluctuations in the power supply potential. In this state, the oscillation waveform may be
disrupted, leading to an unstable system clock and erroneous operation of the microcomputer.
If erroneous operation occurs, change the setting of standby timer select bits 2 to 0 (STS2 to
STS0) (bits 6 to 4 in system control register 1 (SYSCR1)) to give a longer wait time.
For example, if erroneous operation occurs with a wait time setting of 16 states, check the
operation with a wait time setting of 8,192 states or more.
If the same kind of erroneous operation occurs after a reset as after a state transition, hold the RES
pin low for a longer period.
Rev. 6.00 Aug 04, 2006 page 119 of 626
REJ09B0144-0600
Section 4 Clock Pulse Generators
Rev. 6.00 Aug 04, 2006 page 120 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Section 5 Power-Down Modes
5.1
Overview
The H8/3827R Group has nine modes of operation after a reset. These include eight power-down
modes, in which power dissipation is significantly reduced. Table 5.1 gives a summary of the nine
operating modes.
Table 5.1
Operating Modes
Operating Mode
Description
Active (high-speed) mode
The CPU and all on-chip peripheral functions are operable on
the system clock in high-speed operation
Active (medium-speed) mode
The CPU and all on-chip peripheral functions are operable on
the system clock in low-speed operation
Subactive mode
The CPU is operable on the subclock in low-speed operation
Sleep (high-speed) mode
The CPU halts. On-chip peripheral functions are operable on
the system clock
Sleep (medium-speed) mode
The CPU halts. On-chip peripheral functions operate at a
frequency of 1/64, 1/32, 1/16, or 1/8 of the system clock
frequency
Subsleep mode
The CPU halts. The time-base function of timer A, timer C,
timer G, timer F,WDT, SCI3-1, SCI3-2, AEC, and LCD
controller/driver are operable on the subclock
Watch mode
The CPU halts. The time-base function of timer A, timer F,
timer G, AEC, and LCD controller/driver are operable on the
subclock
Standby mode
The CPU and all on-chip peripheral functions halt
Module standby mode
Individual on-chip peripheral functions specified by software
enter standby mode and halt
Of these nine operating modes, all but the active (high-speed) mode are power-down modes. In
this section the two active modes (high-speed and medium speed) will be referred to collectively
as active mode.
Figure 5.1 shows the transitions among these operation modes. Table 5.2 indicates the internal
states in each mode.
Rev. 6.00 Aug 04, 2006 page 121 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Program
execution state
Reset state
SLEEP
instruction(a)
Active
(high-speed)
mode
(d)
P
EE
SL uction
r
t
s
in
Program
halt state
Program
halt state
)
P (a
EE tion
SL ruc
st
inin SL
st E
ru E
ct P
io
n (b
SLEEP
instruction(f)
SL
instr EEP
uctio (d
n )
(4)
)
(1)
SLEEP
instruction(e)
(1)
SLEEP
instruction(i)
i
SLEEP
instruction(h)
)
P (e
EE ion
SL ruct
t
ns
Subactive
mode
SLEEP
instruction(b)
(3)
Sleep
(medium-speed)
mode
ins SLE
tru EP
cti
on (j)
ins SLE
tru EP
ctio
n (i)
ins SLEE
tru
ctio P
n (e)
Active
(medium-speed)
mode
(1)
Watch
mode
SLEEP
instruction(g)
(4)
Standby
mode
Sleep
(high-speed)
mode
(3)
SLEEP
instruction(c)
(2)
Subsleep
mode
Power-down modes
Mode Transition Conditions (1)
Mode Transition Conditions (2)
LSON MSON SSBY TMA3 DTON
(a)
(b)
(c)
(d)
(e)
(f)
(g)
(h)
(i)
(J)
0
0
1
0
*
0
0
0
1
0
0
1
*
*
*
0
1
1
*
0
0
0
0
1
1
0
0
1
1
1
*
*
1
0
1
*
*
1
1
1
0
0
0
0
0
1
1
1
1
1
Interrupt Sources
(1)
(2)
Timer A, Timer F, Timer G interrupt, IRQ0 interrupt,
WKP7 to WKP0 interrupts
Timer A, Timer C, Timer F, Timer G, SCI3-1,
SCI3-2 interrupt, IRQ4 to IRQ0 interrupts,
WKP7 to WKP0 interrupts, AEC
(3)
All interrupts
(4)
IRQ1 or IRQ0 interrupt, WKP7 to WKP0 interrupts
* : Don’t care
Notes: 1. A transition between different modes cannot be made to occur simply because an interrupt
request is generated. Make sure that interrupt handling is performed after the interrupt is
accepted.
2. Details on the mode transition conditions are given in the explanations of each mode,
in sections 5.2 to 5.9.
Figure 5.1 Mode Transition Diagram
Rev. 6.00 Aug 04, 2006 page 122 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Table 5.2
Internal State in Each Operating Mode
Active Mode
Function
HighSpeed
System clock oscillator
Subclock oscillator
CPU
Instructions
operations RAM
MediumSpeed
Sleep Mode
HighSpeed
Subactive
Mode
Subsleep
Mode
Standby
Mode
Functions Functions Functions Functions Halted
Halted
Halted
Halted
Functions Functions Functions Functions Functions
Functions
Functions
Functions
Functions Functions Halted
Functions
Halted
Halted
Retained
Retained
Retained
MediumSpeed
Watch
Mode
Halted
Halted
Retained
Retained
Registers
Retained*
1
I/O ports
External
interrupts
IRQ0
IRQ1
Functions Functions Functions Functions Functions
6
Retained*
Functions
Functions
Functions
Retained*
6
IRQ2
IRQ3
IRQ4
WKP0
Functions Functions Functions Functions Functions
Functions
Functions
Functions
WKP1
WKP2
WKP3
WKP4
WKP5
WKP6
WKP7
Functions Functions Functions Functions Functions*5 Functions*5 Functions*5 Retained
8
Functions
Functions*8
Asynchronous
Functions* Functions
counter
Peripheral
functions
Timer A
Timer C
Retained
WDT
1.
2.
3.
4.
5.
6.
7.
8.
9.
Functions/
Retained*2
Functions/
Retained*7
Retained
Timer G,
Timer F
Functions/
Retained*9
Functions/
Retained*2
Functions/
Retained*2
SCI3-1
Reset
Functions/
Retained*3
Functions/
Retained*3
SCI3-2
Notes:
Functions/
Retained*2
Retained
Reset
PWM
Retained
Retained
Retained
Retained
A/D converter
Retained
Retained
Retained
Retained
LCD
Functions/
Retained*4
Functions/
Retained*4
Functions/
Retained*4
Retained
Register contents are retained, but output is high-impedance state.
Functions if an external clock or the φW /4 internal clock is selected; otherwise halted and retained.
Functions if φW /2 is selected as the internal clock; otherwise halted and retained.
Functions if φW , φW /2 or φW /4 is selected as the operating clock; otherwise halted and retained.
Functions if the timekeeping time-base function is selected.
External interrupt requests are ignored. Interrupt request register contents are not altered.
Functions if φW /32 is selected as the internal clock; otherwise halted and retained.
Incrementing is possible, but interrupt generation is not.
Functions if the φW /4 internal clock is selected; otherwise halted and retained.
Rev. 6.00 Aug 04, 2006 page 123 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
5.1.1
System Control Registers
The operation mode is selected using the system control registers described in table 5.3.
Table 5.3
System Control Registers
Name
Abbr.
R/W
Initial Value
Address
System control register 1
SYSCR1
R/W
H'07
H'FFF0
System control register 2
SYSCR2
R/W
H'F0
H'FFF1
1. System Control Register 1 (SYSCR1)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
—
MA1
MA0
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
—
R/W
R/W
SYSCR1 is an 8-bit read/write register for control of the power-down modes.
Upon reset, SYSCR1 is initialized to H'07.
Bit 7: Software standby (SSBY)
This bit designates transition to standby mode or watch mode.
Bit 7
SSBY
Description
0
•
When a SLEEP instruction is executed in active mode,
a transition is made to sleep mode
•
When a SLEEP instruction is executed in subactive mode, a transition is made to
subsleep mode
•
When a SLEEP instruction is executed in active mode, a transition is made to
standby mode or watch mode
•
When a SLEEP instruction is executed in subactive mode, a transition is made to
watch mode
1
Rev. 6.00 Aug 04, 2006 page 124 of 626
REJ09B0144-0600
(initial value)
Section 5 Power-Down Modes
Bits 6 to 4: Standby timer select 2 to 0 (STS2 to STS0)
These bits designate the time the CPU and peripheral modules wait for stable clock operation after
exiting from standby mode or watch mode to active mode due to an interrupt. The designation
should be made according to the operating frequency so that the waiting time is at least equal to
the oscillation settling time.
Bit 6
STS2
Bit 5
STS1
Bit 4
STS0
Description
0
0
0
Wait time = 8,192 states
0
0
1
Wait time = 16,384 states
0
1
0
Wait time = 32,768 states
0
1
1
Wait time = 65,536 states
1
0
0
Wait time = 131,072 states
1
0
1
Wait time = 2 states
1
1
0
Wait time = 8 states
1
1
1
Wait time = 16 states
(initial value)
(External clock mode)
Note: In the case that external clock is input, set up the “Standby timer select” selection to
External clock mode before Mode Transition. Also, do not set up to external clock mode, in
the case that it does not use external clock.
Bit 3: Low speed on flag (LSON)
This bit chooses the system clock (φ) or subclock (φSUB) as the CPU operating clock when watch
mode is cleared. The resulting operation mode depends on the combination of other control bits
and interrupt input.
Bit 3
LSON
Description
0
The CPU operates on the system clock (φ)
1
The CPU operates on the subclock (φSUB)
(initial value)
Bits 2: Reserved bits
Bit 2 is reserved: it is always read as 1 and cannot be modified.
Rev. 6.00 Aug 04, 2006 page 125 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Bits 1 and 0: Active (medium-speed) mode clock select (MA1, MA0)
Bits 1 and 0 choose φOSC/128, φOSC/64, φOSC/32, or φOSC/16 as the operating clock in active
(medium-speed) mode and sleep (medium-speed) mode. MA1 and MA0 should be written in
active (high-speed) mode or subactive mode.
Bit 1
MA1
Bit 0
MA0
Description
0
0
φOSC/16
0
1
φOSC/32
1
0
φOSC/64
1
1
φOSC/128
(initial value)
2. System Control Register 2 (SYSCR2)
Bit
7
6
5
4
3
2
1
0
—
—
—
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
SYSCR2 is an 8-bit read/write register for power-down mode control.
Bits 7 to 5: Reserved bits
These bits are reserved; they are always read as 1, and cannot be modified.
Bit 4: Noise elimination sampling frequency select (NESEL)
This bit selects the frequency at which the watch clock signal (φW) generated by the subclock
pulse generator is sampled, in relation to the oscillator clock (φOSC) generated by the system clock
pulse generator. When φOSC = 2 to 16 MHz, clear NESEL to 0.
Bit 4
NESEL
Description
0
Sampling rate is φOSC/16
1
Sampling rate is φOSC/4
Rev. 6.00 Aug 04, 2006 page 126 of 626
REJ09B0144-0600
(initial value)
Section 5 Power-Down Modes
Bit 3: Direct transfer on flag (DTON)
This bit designates whether or not to make direct transitions among active (high-speed), active
(medium-speed) and subactive mode when a SLEEP instruction is executed. The mode to which
the transition is made after the SLEEP instruction is executed depends on a combination of this
and other control bits.
Bit 3
DTON
Description
0
•
When a SLEEP instruction is executed in active mode,
a transition is made to standby mode, watch mode, or sleep mode
•
When a SLEEP instruction is executed in subactive mode, a transition is made to
watch mode or subsleep mode
•
When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
•
When a SLEEP instruction is executed in active (medium-speed) mode, a direct
transition is made to active (high-speed) mode if SSBY = 0, MSON = 0, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
•
When a SLEEP instruction is executed in subactive mode, a direct transition is
made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0, and MSON
= 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0, and
MSON = 1
1
(initial value)
Bit 2: Medium speed on flag (MSON)
After standby, watch, or sleep mode is cleared, this bit selects active (high-speed) or active
(medium-speed) mode.
Bit 2
MSON
Description
0
Operation in active (high-speed) mode
1
Operation in active (medium-speed) mode
(initial value)
Rev. 6.00 Aug 04, 2006 page 127 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Bits 1 and 0: Subactive mode clock select (SA1 and SA0)
These bits select the CPU clock rate (φW/2, φW/4, or φW/8) in subactive mode. SA1 and SA0
cannot be modified in subactive mode.
Bit 1
SA1
Bit 0
SA0
Description
0
0
φW /8
0
1
φW /4
1
*
φw/2
(initial value)
* : Don’t care
5.2
Sleep Mode
5.2.1
Transition to Sleep Mode
1. Transition to Sleep (High-Speed) Mode
The system goes from active mode to sleep (high-speed) mode when a SLEEP instruction is
executed while the SSBY and LSON bits in SYSCR1 are cleared to 0, the MSON and DTON bits
in SYSCR2 are cleared to 0. In sleep mode CPU operation is halted but the on-chip peripheral
functions. CPU register contents are retained.
2. Transition to Sleep (Medium-Speed) Mode
The system goes from active mode to sleep (medium-speed) mode when a SLEEP instruction is
executed while the SSBY and LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2
is set to 1, and the DTON bit in SYSCR2 is cleared to 0. In sleep (medium-speed) mode, as in
sleep (high-speed) mode, CPU operation is halted but the on-chip peripheral functions are
operational. The clock frequency in sleep (medium-speed) mode is determined by the MA1 and
MA0 bits in SYSCR1. CPU register contents are retained.
Furthermore, it sometimes acts with half state early timing at the time of transition to sleep
(medium-speed) mode.
Rev. 6.00 Aug 04, 2006 page 128 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
5.2.2
Clearing Sleep Mode
Sleep mode is cleared by any interrupt (timer A, timer C, timer F, timer G, asynchronous counter,
IRQ4 to IRQ0, WKP7 to WKP0, SCI3-1, SCI3-2, A/D converter, or), or by input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, sleep mode is cleared and interrupt exception handling starts.
A transition is made from sleep (high-speed) mode to active (high-speed) mode, or from sleep
(medium-speed) mode to active (medium-speed) mode. Sleep mode is not cleared if the I bit of
the condition code register (CCR) is set to 1 or the particular interrupt is disabled in the
interrupt enable register.
Interrupt signal and system clock are mutually asynchronous. Synchronization error time in a
maximum is 2/φ (s).
• Clearing by RES input
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared.
5.2.3
Clock Frequency in Sleep (Medium-Speed) Mode
Operation in sleep (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
5.3
Standby Mode
5.3.1
Transition to Standby Mode
The system goes from active mode to standby mode when a SLEEP instruction is executed while
the SSBY bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and bit TMA3 in
TMA is cleared to 0. In standby mode the clock pulse generator stops, so the CPU and on-chip
peripheral modules stop functioning, but as long as the rated voltage is supplied, the contents of
CPU registers, on-chip RAM, and some on-chip peripheral module registers are retained. On-chip
RAM contents will be further retained down to a minimum RAM data retention voltage. The I/O
ports go to the high-impedance state.
Rev. 6.00 Aug 04, 2006 page 129 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
5.3.2
Clearing Standby Mode
Standby mode is cleared by an interrupt (IRQ1 or IRQ0), WKP7 to WKP0 or by input at the RES
pin.
• Clearing by interrupt
When an interrupt is requested, the system clock pulse generator starts. After the time set in
bits STS2 to STS0 in SYSCR1 has elapsed, a stable system clock signal is supplied to the
entire chip, standby mode is cleared, and interrupt exception handling starts. Operation
resumes in active (high-speed) mode if MSON = 0 in SYSCR2, or active (medium-speed)
mode if MSON = 1. Standby mode is not cleared if the I bit of CCR is set to 1 or the particular
interrupt is disabled in the interrupt enable register.
• Clearing by RES input
When the RES pin goes low, the system clock pulse generator starts. After the pulse generator
output has stabilized, if the RES pin is driven high, the CPU starts reset exception handling.
Since system clock signals are supplied to the entire chip as soon as the system clock pulse
generator starts functioning, the RES pin should be kept at the low level until the pulse
generator output stabilizes.
Rev. 6.00 Aug 04, 2006 page 130 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
5.3.3
Oscillator Settling Time after Standby Mode is Cleared
Bits STS2 to STS0 in SYSCR1 should be set as follows.
• When a crystal oscillator is used
The table below gives settings for various operating frequencies. Set bits STS2 to STS0 for a
waiting time at least as long as the oscillation settling time.
Table 5.4
Clock Frequency and Settling Time (Times are in ms)
STS2
STS1
STS0
Waiting Time
2 MHz
1 MHz
0
0
0
8,192 states
4.1
8.2
0
0
1
16,384 states
8.2
16.4
0
1
0
32,768 states
16.4
32.8
0
1
1
65,536 states
32.8
65.5
1
0
0
131,072 states
65.5
131.1
1
0
1
2 states (Use prohibited)
0.001
0.002
1
1
0
8 states
0.004
0.008
1
1
1
16 states
0.008
0.016
• When an external clock is used
STS2 = 1, STS1 = 0, and STS0 = 1 should be set. Other values possible use, but CPU
sometimes will start operation before waiting time completion.
5.3.4
Standby Mode Transition and Pin States
When a SLEEP instruction is executed in active (high-speed) mode or active (medium-speed)
mode while bit SSBY is set to 1 and bit LSON is cleared to 0 in SYSCR1, and bit TMA3 is
cleared to 0 in TMA, a transition is made to standby mode. At the same time, pins go to the highimpedance state (except pins for which the pull-up MOS is designated as on). Figure 5.2 shows
the timing in this case.
Rev. 6.00 Aug 04, 2006 page 131 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
φ
Internal data bus
SLEEP instruction fetch
Fetch of next instruction
SLEEP instruction execution
Pins
Internal processing
Port output
Active (high-speed) mode or active (medium-speed) mode
High-impedance
Standby mode
Figure 5.2 Standby Mode Transition and Pin States
5.3.5
Notes on External Input Signal Changes before/after Standby Mode
1. When external input signal changes before/after standby mode or watch mode
When an external input signal such as IRQ or WKP is input, both the high- and low-level
widths of the signal must be at least two cycles of system clock φ or subclock φSUB (referred
to together in this section as the internal clock). As the internal clock stops in standby mode
and watch mode, the width of external input signals requires careful attention when a transition
is made via these operating modes. Ensure that external input signals conform to the conditions
stated in 3, Recommended timing of external input signals, below
2. When external input signals cannot be captured because internal clock stops
The case of falling edge capture is illustrated in figure 5.3
As shown in the case marked "Capture not possible," when an external input signal falls
immediately after a transition to active (high-speed or medium-speed) mode or subactive
mode, after oscillation is started by an interrupt via a different signal, the external input signal
cannot be captured if the high-level width at that point is less than 2 tcyc or 2 tsubcyc.
3. Recommended timing of external input signals
To ensure dependable capture of an external input signal, high- and low-level signal widths of
at least 2 tcyc or 2 tsubcyc are necessary before a transition is made to standby mode or watch
mode, as shown in "Capture possible: case 1."
External input signal capture is also possible with the timing shown in "Capture possible: case
2" and "Capture possible: case 3," in which a 2 tcyc or 2 tsubcyc level width is secured.
Rev. 6.00 Aug 04, 2006 page 132 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
Operating
mode
Active (high-speed,
medium-speed) mode
or subactive mode
tcyc
tsubcyc
tcyc
tsubcyc
Wait for Active (high-speed,
Standby mode oscillation medium-speed) mode
or watch mode to settle or subactive mode
tcyc
tsubcyc
tcyc
tsubcyc
φ or φSUB
External input signal
Capture possible:
case 1
Capture possible:
case 2
Capture possible:
case 3
Capture not
possible
Interrupt by different
signall
Figure 5.3 External Input Signal Capture when Signal Changes before/after
Standby Mode or Watch Mode
4. Input pins to which these notes apply:
IRQ4 to IRQ0, WKP7 to WKP0, ADTRG, TMIC, TMIF, TMIG
Rev. 6.00 Aug 04, 2006 page 133 of 626
REJ09B0144-0600
Section 5 Power-Down Modes
5.4
Watch Mode
5.4.1
Transition to Watch Mode
The system goes from active or subactive mode to watch mode when a SLEEP instruction is
executed while the SSBY bit in SYSCR1 is set to 1 and bit TMA3 in TMA is set to 1.
In watch mode, operation of on-chip peripheral modules is halted except for timer A, timer F,
timer G, AEC and the LCD controller/driver (for which operation or halting can be set) is halted.
As long as a minimum required voltage is applied, the contents of CPU registers, the on-chip
RAM and some registers of the on-chip peripheral modules, are retained. I/O ports keep the same
states as before the transition.
5.4.2
Clearing Watch Mode
Watch mode is cleared by an interrupt (timer A, timer F, timer G, IRQ0, or WKP7 to WKP0) or by
input at the RES pin.
• Clearing by interrupt
When watch mode is cleared by interrupt, the mode to which a transition is made depends on
the settings of LSON in SYSCR1 and MSON in SYSCR2. If both LSON and MSON are
cleared to 0, transition is to active (high-speed) mode; if LSON = 0 and MSON = 1, transition
is to active (medium-speed) mode; if LSON = 1, transition is to subactive mode. When the
transition is to active mode, after the time set in SYSCR1 bits STS2 to STS0 has elapsed, a
stable clock signal is supplied to the entire chip, watch mode is cleared, and interrupt exception
handling starts. Watch mode is not cleared if the I bit of CCR is set to 1 or the particular
interrupt is disabled in the interrupt enable register.
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see 2. Clearing by RES pin in section
5.3.2, Clearing Standby Mode.
5.4.3
Oscillator Settling Time after Watch Mode is Cleared
The waiting time is the same as for standby mode; see section 5.3.3, Oscillator Settling Time after
Standby Mode is Cleared.
Rev. 6.00 Aug 04, 2006 page 134 of 626
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Section 5 Power-Down Modes
5.4.4
Notes on External Input Signal Changes before/after Watch Mode
See section 5.3.5, Notes on External Input Signal Changes before/after Standby Mode.
5.5
Subsleep Mode
5.5.1
Transition to Subsleep Mode
The system goes from subactive mode to subsleep mode when a SLEEP instruction is executed
while the SSBY bit in SYSCR1 is cleared to 0, LSON bit in SYSCR1 is set to 1, and TMA3 bit in
TMA is set to 1. In subsleep mode, operation of on-chip peripheral modules other than the A/D
converter WDT and PWM is halted. As long as a minimum required voltage is applied, the
contents of CPU registers, the on-chip RAM and some registers of the on-chip peripheral modules
are retained. I/O ports keep the same states as before the transition.
5.5.2
Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (timer A, timer C, timer F, timer G, asynchronous
counter, SCI3-2, SCI3-1, IRQ4 to IRQ0, WKP7 to WKP0) or by a low input at the RES pin.
• Clearing by interrupt
When an interrupt is requested, subsleep mode is cleared and interrupt exception handling
starts. Subsleep mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is
disabled in the interrupt enable register.
Interrupt signal and system clock are mutually asynchronous. Synchronization error time in a
maximum is 2/φSUB (s).
• Clearing by RES input
Clearing by RES pin is the same as for standby mode; see 2. Clearing by RES pin in section
5.3.2, Clearing Standby Mode.
Rev. 6.00 Aug 04, 2006 page 135 of 626
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Section 5 Power-Down Modes
5.6
Subactive Mode
5.6.1
Transition to Subactive Mode
Subactive mode is entered from watch mode if a timer A, timer F, timer G, IRQ0, or WKP7 to
WKP0 interrupt is requested while the LSON bit in SYSCR1 is set to 1. From subsleep mode,
subactive mode is entered if a timer A, timer C, timer F, timer G, asynchronous counter, SCI3-1,
SCI3-2, IRQ4 to IRQ0, or WKP7 to WKP0 interrupt is requested. A transition to subactive mode
does not take place if the I bit of CCR is set to 1 or the particular interrupt is disabled in the
interrupt enable register.
5.6.2
Clearing Subactive Mode
Subactive mode is cleared by a SLEEP instruction or by a low input at the RES pin.
• Clearing by SLEEP instruction
If a SLEEP instruction is executed while the SSBY bit in SYSCR1 is set to 1 and TMA3 bit in
TMA is set to 1, subactive mode is cleared and watch mode is entered. If a SLEEP instruction
is executed while SSBY = 0 and LSON = 1 in SYSCR1 and TMA3 = 1 in TMA, subsleep
mode is entered. Direct transfer to active mode is also possible; see section 5.8, Direct
Transfer, below.
• Clearing by RES pin
Clearing by RES pin is the same as for standby mode; see 2. Clearing by RES pin in section
5.3.2.
5.6.3
Operating Frequency in Subactive Mode
The operating frequency in subactive mode is set in bits SA1 and SA0 in SYSCR2. The choices
are φW/2, φW/4, and φW/8.
Rev. 6.00 Aug 04, 2006 page 136 of 626
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Section 5 Power-Down Modes
5.7
Active (Medium-Speed) Mode
5.7.1
Transition to Active (Medium-Speed) Mode
If the RES pin is driven low, active (medium-speed) mode is entered. If the LSON bit in SYSCR2
is set to 1 while the LSON bit in SYSCR1 is cleared to 0, a transition to active (medium-speed)
mode results from IRQ0, IRQ1, or WKP7 to WKP0 interrupts in standby mode, timer A, timer F,
timer G, IRQ0, or WKP7 to WKP0 interrupts in watch mode, or any interrupt in sleep mode. A
transition to active (medium-speed) mode does not take place if the I bit of CCR is set to 1 or the
particular interrupt is disabled in the interrupt enable register.
Furthermore, it sometimes acts with half state early timing at the time of transition to active
(medium-speed) mode.
5.7.2
Clearing Active (Medium-Speed) Mode
Active (medium-speed) mode is cleared by a SLEEP instruction.
• Clearing by SLEEP instruction
A transition to standby mode takes place if the SLEEP instruction is executed while the SSBY
bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is cleared to 0, and the TMA3 bit in TMA
is cleared to 0. The system goes to watch mode if the SSBY bit in SYSCR1 is set to 1 and bit
TMA3 in TMA is set to 1 when a SLEEP instruction is executed.
When both SSBY and LSON are cleared to 0 in SYSCR1 and a SLEEP instruction is executed,
sleep mode is entered. Direct transfer to active (high-speed) mode or to subactive mode is also
possible. See section 5.8, Direct Transfer, below for details.
• Clearing by RES pin
When the RES pin is driven low, a transition is made to the reset state and active (mediumspeed) mode is cleared.
5.7.3
Operating Frequency in Active (Medium-Speed) Mode
Operation in active (medium-speed) mode is clocked at the frequency designated by the MA1 and
MA0 bits in SYSCR1.
Rev. 6.00 Aug 04, 2006 page 137 of 626
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Section 5 Power-Down Modes
5.8
Direct Transfer
5.8.1
Overview of Direct Transfer
The CPU can execute programs in three modes: active (high-speed) mode, active (medium-speed)
mode, and subactive mode. A direct transfer is a transition among these three modes without the
stopping of program execution. A direct transfer can be made by executing a SLEEP instruction
while the DTON bit in SYSCR2 is set to 1. After the mode transition, direct transfer interrupt
exception handling starts.
If the direct transfer interrupt is disabled in interrupt enable register 2, a transition is made instead
to sleep mode or watch mode. Note that if a direct transition is attempted while the I bit in CCR is
set to 1, sleep mode or watch mode will be entered, and it will be impossible to clear the resulting
mode by means of an interrupt.
• Direct transfer from active (high-speed) mode to active (medium-speed) mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON
bit in SYSCR2 is set to 1, a transition is made to active (medium-speed) mode via sleep mode.
• Direct transfer from active (medium-speed) mode to active (high-speed) mode
When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the
DTON bit in SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep
mode.
• Direct transfer from active (high-speed) mode to subactive mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in
TMA is set to 1, a transition is made to subactive mode via watch mode.
• Direct transfer from subactive mode to active (high-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0,
the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (high-speed) mode via watch mode after the waiting time set in SYSCR1 bits
STS2 to STS0 has elapsed.
Rev. 6.00 Aug 04, 2006 page 138 of 626
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Section 5 Power-Down Modes
• Direct transfer from active (medium-speed) mode to subactive mode
When a SLEEP instruction is executed in active (medium-speed) while the SSBY and LSON
bits in SYSCR1 are set to 1, the DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA
is set to 1, a transition is made to subactive mode via watch mode.
• Direct transfer from subactive mode to active (medium-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is
set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is set to 1, the
DTON bit in SYSCR2 is set to 1, and the TMA3 bit in TMA is set to 1, a transition is made
directly to active (medium-speed) mode via watch mode after the waiting time set in SYSCR1
bits STS2 to STS0 has elapsed.
5.8.2
Direct Transition Times
1. Time for Direct Transition from Active (High-Speed) Mode
to Active (Medium-Speed) Mode
A direct transition from active (high-speed) mode to active (medium-speed) mode is performed by
executing a SLEEP instruction in active (high-speed) mode while bits SSBY and LSON are both
cleared to 0 in SYSCR1, and bits MSON and DTON are both set to 1 in SYSCR2. The time from
execution of the SLEEP instruction to the end of interrupt exception handling (the direct transition
time) is given by equation (1) below.
Direct transition time = { (Number of SLEEP instruction execution states) + (number of internal
processing states) } × (tcyc before transition) + (number of interrupt
exception handling execution states) × (tcyc after transition)
.................................. (1)
Example: Direct transition time = (2 + 1) × 2tosc + 14 × 16tosc = 230tosc (when φ/8 is selected
as the CPU operating clock)
Notation:
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
Rev. 6.00 Aug 04, 2006 page 139 of 626
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Section 5 Power-Down Modes
2. Time for Direct Transition from Active (Medium-Speed) Mode
to Active (High-Speed) Mode
A direct transition from active (medium-speed) mode to active (high-speed) mode is performed by
executing a SLEEP instruction in active (medium-speed) mode while bits SSBY and LSON are
both cleared to 0 in SYSCR1, and bit MSON is cleared to 0 and bit DTON is set to 1 in SYSCR2.
The time from execution of the SLEEP instruction to the end of interrupt exception handling (the
direct transition time) is given by equation (2) below.
Direct transition time = { (Number of SLEEP instruction execution states) + (number of internal
processing states) } × (tcyc before transition) + (number of interrupt
exception handling execution states) × (tcyc after transition)
.................................. (2)
Example: Direct transition time = (2 + 1) × 16tosc + 14 × 2tosc = 76tosc (when φ/8 is selected as
the CPU operating clock)
Notation:
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
3. Time for Direct Transition from Subactive Mode to Active (High-Speed) Mode
A direct transition from subactive mode to active (high-speed) mode is performed by executing a
SLEEP instruction in subactive mode while bit SSBY is set to 1 and bit LSON is cleared to 0 in
SYSCR1, bit MSON is cleared to 0 and bit DTON is set to 1 in SYSCR2, and bit TMA3 is set to 1
in TMA. The time from execution of the SLEEP instruction to the end of interrupt exception
handling (the direct transition time) is given by equation (3) below.
Direct transition time = { (Number of SLEEP instruction execution states) + (number of internal
processing states) } × (tsubcyc before transition) + { (wait time set in
STS2 to STS0) + (number of interrupt exception handling execution
states) } × (tcyc after transition)
........................ (3)
Example: Direct transition time = (2 + 1) × 8tw + (8192 + 14) × 2tosc = 24tw + 16412tosc (when
φw/8 is selected as the CPU operating clock, and wait time = 8192 states)
Notation:
tosc:
OSC clock cycle time
tw:
Watch clock cycle time
tcyc:
System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
Rev. 6.00 Aug 04, 2006 page 140 of 626
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Section 5 Power-Down Modes
4. Time for Direct Transition from Subactive Mode to Active (Medium-Speed) Mode
A direct transition from subactive mode to active (medium-speed) mode is performed by
executing a SLEEP instruction in subactive mode while bit SSBY is set to 1 and bit LSON is
cleared to 0 in SYSCR1, bits MSON and DTON are both set to 1 in SYSCR2, and bit TMA3 is set
to 1 in TMA. The time from execution of the SLEEP instruction to the end of interrupt exception
handling (the direct transition time) is given by equation (4) below.
Direct transition time = { (Number of SLEEP instruction execution states) + (number of internal
processing states) } × (tsubcyc before transition) + { (wait time set in
STS2 to STS0) + (number of interrupt exception handling execution
states) } × (tcyc after transition)
........................ (4)
Example: Direct transition time = (2 + 1) × 8tw + (8192 + 14) × 16tosc = 24tw + 131296tosc
(when φw/8 or φ8 is selected as the CPU operating clock, and wait time = 8192 states)
Notation:
tosc:
OSC clock cycle time
tw:
Watch clock cycle time
tcyc:
System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
5.8.3
Notes on External Input Signal Changes before/after Direct Transition
1. Direct transition from active (high-speed) mode to subactive mode
Since the mode transition is performed via watch mode, see section 5.3.5, Notes on External
Input Signal Changes before/after Standby Mode.
2. Direct transition from active (medium-speed) mode to subactive mode
Since the mode transition is performed via watch mode, see section 5.3.5, Notes on External
Input Signal Changes before/after Standby Mode.
3. Direct transition from subactive mode to active (high-speed) mode
Since the mode transition is performed via watch mode, see section 5.3.5, Notes on External
Input Signal Changes before/after Standby Mode.
4. Direct transition from subactive mode to active (medium-speed) mode
Since the mode transition is performed via watch mode, see section 5.3.5, Notes on External
Input Signal Changes before/after Standby Mode.
Rev. 6.00 Aug 04, 2006 page 141 of 626
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Section 5 Power-Down Modes
5.9
Module Standby Mode
5.9.1
Setting Module Standby Mode
Module standby mode is set for individual peripheral functions. All the on-chip peripheral
modules can be placed in module standby mode. When a module enters module standby mode,
the system clock supply to the module is stopped and operation of the module halts. This state is
identical to standby mode.
Module standby mode is set for a particular module by setting the corresponding bit to 0 in clock
stop register 1 (CKSTPR1) or clock stop register 2 (CKSTPR2). (See table 5.5.)
5.9.2
Clearing Module Standby Mode
Module standby mode is cleared for a particular module by setting the corresponding bit to 1 in
clock stop register 1 (CKSTPR1) or clock stop register 2 (CKSTPR2). (See table 5.5.)
Following a reset, clock stop register 1 (CKSTPR1) and clock stop register 2 (CKSTPR2) are both
initialized to H'FF.
Rev. 6.00 Aug 04, 2006 page 142 of 626
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Section 5 Power-Down Modes
Table 5.5
Setting and Clearing Module Standby Mode by Clock Stop Register
Register Name
Bit Name
CKSTPR1
TACKSTP
TCCKSTP
TFCKSTP
TGCKSTP
ADCKSTP
S32CKSTP
S31CKSTP
CKSTPR2
LDCKSTP
PWCKSTP
WDCKSTP
AECKSTP
Operation
1
Timer A module standby mode is cleared
0
Timer A is set to module standby mode
1
Timer C module standby mode is cleared
0
Timer C is set to module standby mode
1
Timer F module standby mode is cleared
0
Timer F is set to module standby mode
1
Timer G module standby mode is cleared
0
Timer G is set to module standby mode
1
A/D converter module standby mode is cleared
0
A/D converter is set to module standby mode
1
SCI3-2 module standby mode is cleared
0
SCI3-2 is set to module standby mode
1
SCI3-1 module standby mode is cleared
0
SCI3-1 is set to module standby mode
1
LCD module standby mode is cleared
0
LCD is set to module standby mode
1
PWM module standby mode is cleared
0
PWM is set to module standby mode
1
Watchdog timer module standby mode is cleared
0
Watchdog timer is set to module standby mode
1
Asynchronous event counter module standby mode
is cleared
0
Asynchronous event counter is set to module standby
mode
Note: For details of module operation, see the sections on the individual modules.
Rev. 6.00 Aug 04, 2006 page 143 of 626
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Section 5 Power-Down Modes
5.9.3
Usage Note
If, due to the timing with which a peripheral module issues interrupt requests, the module in
question is set to module standby mode before an interrupt is processed, the module will stop with
the interrupt request still pending. In this situation, interrupt processing will be repeated
indefinitely unless interrupts are prohibited.
It is therefore necessary to ensure that no interrupts are generated when a module is set to module
standby mode. The surest way to do this is to specify the module standby mode setting only when
interrupts are prohibited (interrupts prohibited using the interrupt enable register or interrupts
masked using bit CCR-I).
Rev. 6.00 Aug 04, 2006 page 144 of 626
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Section 6 ROM
Section 6 ROM
6.1
Overview
The H8/3822R, H8/38322, and H8/38422 have 16 Kbytes of on-chip mask ROM, the H8/3823R,
H8/38323, and H8/38423 have 24 Kbytes, the H8/3824R, H8/3824S, H8/38324, and H8/38424
have 32 Kbytes, the H8/3825R, H8/3825S, H8/38325, and H8/38425 have 40 Kbytes, the
H8/3826R, H8/3826S, H8/38326, and H8/38426 have 48 Kbytes, and the H8/3827R, H8/3827S,
H8/38327, and H8/38427 have 60 Kbytes. The ROM is connected to the CPU by a 16-bit data
bus, allowing high-speed two-state access for both byte data and word data. The H8/3827R has a
ZTAT™ version with 60-Kbyte PROM.
The H8/3827S Group does not have a ZTAT™ version. The H8/3827R ZTAT™ version must be
used.
The F-ZTAT™ versions of the H8/38327 and H8/38427 are equipped with 60 Kbytes of flash
memory. The F-ZTAT™ versions of the H8/38324 and H8/38424 are equipped with 32 Kbytes of
flash memory.
6.1.1
Block Diagram
Figure 6.1 shows a block diagram of the on-chip ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'0000
H'0000
H'0001
H'0002
H'0002
H'0003
On-chip ROM
H'7FFE
H'7FFE
H'7FFF
Even-numbered
address
Odd-numbered
address
Figure 6.1 ROM Block Diagram (H8/3824R, H8/3824S, H8/38324, and H8/38424)
Rev. 6.00 Aug 04, 2006 page 145 of 626
REJ09B0144-0600
Section 6 ROM
6.2
H8/3827R PROM Mode
6.2.1
Setting to PROM Mode
If the on-chip ROM is PROM, setting the chip to PROM mode stops operation as a
microcontroller and allows the PROM to be programmed in the same way as the standard
HN27C101 EPROM. However, page programming is not supported. Table 6.1 shows how to set
the chip to PROM mode.
Table 6.1
Setting to PROM Mode
Pin Name
Setting
TEST
High level
PB4/AN4
Low level
PB5/AN5
PB6/AN6
6.2.2
High level
Socket Adapter Pin Arrangement and Memory Map
A standard PROM programmer can be used to program the PROM. A socket adapter is required
for conversion to 32 pins, as listed in table 6.2.
Figure 6.2 shows the pin-to-pin wiring of the socket adapter. Figure 6.3 shows a memory map.
Table 6.2
Socket Adapter
Package
Socket Adapters (Manufacturer)
80-pin (FP-80B)
ME3867ESFS1H (MINATO)
H7386BQ080D3201 (DATA-I/O)
80-pin (FP-80A)
ME3867ESHS1H (MINATO)
H7386AQ080D3201 (DATA-I/O)
80-pin (TFP-80C)
ME3867ESNS1H (MINATO)
H7386CT080D3201 (DATA-I/O)
Rev. 6.00 Aug 04, 2006 page 146 of 626
REJ09B0144-0600
Section 6 ROM
H8/3827R
FP-80A, TFP-80C
EPROM socket
FP-80B
Pin
Pin
9
11
RES
VPP
HN27C101 (32-pin)
1
45
47
P60
EO0
13
46
48
P61
EO1
14
47
49
P62
EO2
15
48
50
P63
EO3
17
49
51
P64
EO4
18
50
52
P65
EO5
19
51
53
P66
EO6
20
52
54
P67
EO7
21
68
70
P87
EA0
12
67
69
P86
EA1
11
66
68
P85
EA2
10
65
67
P84
EA3
9
64
66
P83
EA4
8
63
65
P82
EA5
7
62
64
P81
EA6
6
61
63
P80
EA7
5
53
55
P70
EA8
27
72
74
P43
EA9
26
55
57
P72
EA10
23
56
58
P73
EA11
25
57
59
P74
EA12
4
58
60
P75
EA13
28
59
61
P76
EA14
29
14
16
P14
EA15
3
15
17
P15
EA16
60
62
P77
CE
22
54
56
P71
OE
24
13
15
P13
PGM
31
32, 26
34, 28
VCC, CVCC
VCC
32
73
75
AVCC
8
10
TEST
3
5
X1
80
2
PB6
11
13
P11
12
14
P12
16
18
P16
5, 27
7, 29
VSS
VSS
16
2
4
AVSS
78
80
PB4
79
1
PB5
2
Note: Pins not indicated in the figure should be left open.
Figure 6.2 Socket Adapter Pin Correspondence (with HN27C101)
Rev. 6.00 Aug 04, 2006 page 147 of 626
REJ09B0144-0600
Section 6 ROM
Address in
MCU mode
Address in
PROM mode
H'0000
H'0000
On-chip PROM
H'EDFF
H'EDFF
Uninstalled area*
H'1FFFF
Note: * The output data is not guaranteed if this address area is read in PROM mode. Therefore,
when programming with a PROM programmer, be sure to specify addresses from H'0000
to H'EDFF. If programming is inadvertently performed from H'EE00 onward, it may not
be possible to continue PROM programming and verification.
When programming, H'FF should be set as the data in this address area (H'EE00 to
H'1FFFF).
Figure 6.3 H8/3827R Memory Map in PROM Mode
Rev. 6.00 Aug 04, 2006 page 148 of 626
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Section 6 ROM
6.3
H8/3827R Programming
The write, verify, and other modes are selected as shown in table 6.3 in H8/3827R PROM mode.
Table 6.3
Mode Selection in PROM Mode (H8/3827R)
Pins
CE
Mode
OE
PGM
VPP
VCC
EO7 to EO0
EA16 to EA0
Write
L
H
L
VPP
VCC
Data input
Address input
Verify
L
L
H
VPP
VCC
Data output
Address input
Programming
L
L
L
VPP
VCC
High impedance
Address input
disabled
L
H
H
H
L
L
H
H
H
Notation
L:
Low level
H:
High level
VPP:
VPP level
VCC: VCC level
The specifications for writing and reading are identical to those for the standard HN27C101
EPROM. However, page programming is not supported, and so page programming mode must not
be set. A PROM programmer that only supports page programming mode cannot be used. When
selecting a PROM programmer, ensure that it supports high-speed, high-reliability byte-by-byte
programming. Also, be sure to specify addresses from H'0000 to H'EDFF.
6.3.1
Writing and Verifying
An efficient, high-speed, high-reliability method is available for writing and verifying the PROM
data. This method achieves high speed without voltage stress on the device and without lowering
the reliability of written data. The basic flow of this high-speed, high-reliability programming
method is shown in figure 6.4.
Rev. 6.00 Aug 04, 2006 page 149 of 626
REJ09B0144-0600
Section 6 ROM
Start
Set write/verify mode
VCC = 6.0 V ± 0.25 V, VPP = 12.5 V ± 0.3 V
Address = 0
n=0
n+1 →n
No
Yes
n < 25
Write time t PW = 0.2 ms ± 5%
No Go
Address + 1 → address
Verify
Go
Write time t OPW = 0.2n ms
Last address?
No
Yes
Set read mode
VCC = 5.0 V ± 0.25 V, VPP = VCC
No Go
Error
Read all
addresses?
Go
End
Figure 6.4 High-Speed, High-Reliability Programming Flow Chart
Rev. 6.00 Aug 04, 2006 page 150 of 626
REJ09B0144-0600
Section 6 ROM
Tables 6.4 and 6.5 give the electrical characteristics in programming mode.
Table 6.4
DC Characteristics
Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol Min
Test
Unit Condition
Typ
Max
—
VCC + 0.3 V
Input highlevel voltage
EO7 to EO0, EA16 to EA0
OE, CE, PGM
VIH
2.4
Input lowlevel voltage
EO7 to EO0, EA16 to EA0
OE, CE, PGM
VIL
–0.3 —
0.8
V
Output highlevel voltage
EO7 to EO0
VOH
2.4
—
—
V
IOH = –200 µA
Output lowlevel voltage
EO7 to EO0
VOL
—
—
0.45
V
IOL = 0.8 mA
Input leakage EO7 to EO0, EA16 to EA0
OE, CE, PGM
current
|ILI|
—
—
2
µA
Vin = 5.25 V/
0.5 V
VCC current
ICC
—
—
40
mA
VPP current
IPP
—
—
40
mA
Rev. 6.00 Aug 04, 2006 page 151 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.5
AC Characteristics
Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, Ta = 25°C ±5°C
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Address setup time
tAS
2
—
—
µs
Figure 6.5*
OE setup time
tOES
2
—
—
µs
Data setup time
tDS
2
—
—
µs
Address hold time
tAH
0
—
—
µs
Data hold time
2
—
—
µs
Data output disable time
tDH
2
tDF*
—
—
130
ns
VPP setup time
tVPS
2
—
—
µs
Programming pulse width
tPW
0.19
0.20
0.21
ms
PGM pulse width for overwrite
programming
tOPW *
0.19
—
5.25
ms
CE setup time
tCES
2
—
—
µs
VCC setup time
tVCS
2
—
—
µs
Data output delay time
tOE
0
—
200
ns
3
1
Notes: 1. Input pulse level: 0.45 V to 2.2 V
Input rise time/fall time ≤ 20 ns
Timingreference levels Input: 0.8 V, 2.0 V
Output: 0.8 V, 2.0 V
2. tDF is defined at the point at which the output is floating and the output level cannot be
read.
3. tOPW is defined by the value given in figure 6.4, High-Speed, High-Reliability
Programming Flow Chart.
Rev. 6.00 Aug 04, 2006 page 152 of 626
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Section 6 ROM
Figure 6.5 shows a PROM write/verify timing diagram.
Write
Verify
Address
tAS
Data
tAH
Input data
tDS
VPP
tDH
tDF
VPP
VCC
VCC
Output data
tVPS
VCC+1
VCC
tVCS
CE
tCES
PGM
tPW
tOES
tOE
OE
tOPW*
Note: * topw is defined by the value shown in figure 6.4, High-Speed, High-Reliability Programming Flowchart.
Figure 6.5 PROM Write/Verify Timing
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Section 6 ROM
6.3.2
Programming Precautions
• Use the specified programming voltage and timing.
The programming voltage in PROM mode (VPP) is 12.5 V. Use of a higher voltage can
permanently damage the chip. Be especially careful with respect to PROM programmer
overshoot.
Setting the PROM programmer to Renesas specifications for the HN27C101 will result in
correct VPP of 12.5 V.
• Make sure the index marks on the PROM programmer socket, socket adapter, and chip are
properly aligned. If they are not, the chip may be destroyed by excessive current flow. Before
programming, be sure that the chip is properly mounted in the PROM programmer.
• Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
• Take care when setting the programming mode, as page programming is not supported.
• When programming with a PROM programmer, be sure to specify addresses from H'0000 to
H'EDFF. If programming is inadvertently performed from H'EE00 onward, it may not be
possible to continue PROM programming and verification. When programming, H'FF should
be set as the data in address area H'EE00 to H'1FFFF.
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Section 6 ROM
6.4
Reliability of Programmed Data
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 6.6 Shows the recommended screening procedure.
Program chip and verify
programmed data
Bake chip for 24 to 48 hours at
125°C to 150°C with power off
Read and check program
Install
Figure 6.6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects. Please inform
Renesas Technology of any abnormal conditions noted during or after programming or in
screening of program data after high-temperature baking.
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Section 6 ROM
6.5
Flash Memory Overview
6.5.1
Features
The features of the 60 Kbytes or 32 Kbytes of flash memory built into the F-ZTAT versions are
summarized below.
• Programming/erase methods
 The 60-Kbyte flash memory is programmed 128 bytes at a time. Erase is performed in
single-block units. The flash memory is configured as follows: 1 Kbyte × 4 blocks,
28 Kbytes × 1 block, 16 Kbytes × 1 block, 8 Kbytes × 1 block, 4 Kbytes × 1 block.
The 32-Kbyte flash memory is configured as follows: 1 Kbyte × 4 blocks, 28 Kbytes × 1
block. To erase the entire flash memory, each block must be erased in turn.
• Reprogramming capability
 The flash memory can be reprogrammed up to 1,000 times.
• On-board programming
 On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user
program mode, individual blocks can be erased or programmed.
• Programmer mode
 Flash memory can be programmed/erased in programmer mode using a PROM
programmer, as well as in on-board programming mode.
• Automatic bit rate adjustment
 For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match
the transfer bit rate of the host.
• Programming/erasing protection
 Sets software protection against flash memory programming/erasing.
• Power-down mode
 The power supply circuit is partly halted in the subactive mode and can be read in the
power-down mode.
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Section 6 ROM
6.5.2
Block Diagram
Internal address bus
Internal data bus (16 bits)
Module bus
FLMCR1
FLMCR2
Bus interface/controller
EBR
Operating
mode
TES pin
P32 pin
P86 pin
FLPWCR
FENR
Flash memory
Legend:
FLMCR1:
FLMCR2:
EBR:
FLPWCR:
FENR:
Flash memory control register 1
Flash memory control register 2
Erase block register
Flash memory power control register
Flash memory enable register
Figure 6.7 Block Diagram of Flash Memory
6.5.3
Block Configuration
Figure 6.8 shows the block configuration of flash memory. The thick lines indicate erasing units,
the narrow lines indicate programming units, and the values are addresses. The flash memory is
divided into 1 Kbyte × 4 blocks, 28 Kbytes × 1 block, 16 Kbytes × 1 block, 8 Kbytes × 1 block,
and 4 Kbytes × 1 block. Erasing is performed in these units. Programming is performed in
128-byte units starting from an address with lower eight bits H'00 or H'80.
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Section 6 ROM
H'0000
H'0001
H'0002
H'0080
H'0081
H'0082
H'0380
H'0381
H'0382
H'0400
H'0401
H'0402
H'0480
H'0481
H'0482
H'0780
H'0781
H'0782
H'0800
H'0801
H'0802
H'0880
H'0881
H'0882
H'0B80
H'0B81
H'0B82
H'0C00
H'0C01
H'0C02
H'0C80
H'0C81
H'0C82
Programming unit: 128 bytes
H'007F
H'00FF
Erase unit
1 Kbyte
H'03FF
Programming unit: 128 bytes
H'047F
H'04FF
Erase unit
1 Kbyte
H'07FF
Programming unit: 128 bytes
H'087F
H'080F
Erase unit
1 Kbyte
H'0BFF
Programming unit: 128 bytes
H'0C7F
H'0CFF
Erase unit
1 Kbyte
H'0F80
H'0F81
H'0F82
H'1000
H'1001
H'1002
H'1080
H'1081
H'1082
H'0FFF
Programming unit: 128 bytes
H'107F
H'10FF
Erase unit
28 Kbytes
H'7F80
H'7F81
H'7F82
H'8000
H'8001
H'8002
H'8080
H'8081
H'8082
H'7FFF
Programming unit: 128 bytes
H'807F
H'8CFF
Erase unit
16 Kbytes
H'BF80
H'BF81
H'BF82
H'C000
H'C001
H'C002
H'BFFF
H'C080
H'C081
H'C082
H'CCFF
H'DF80
H'DF81
H'DF82
H'DFFF
H'E000
H'E001
H'E002
H'E080
H'E081
H'E082
H'ECFF
H'EF80
H'EF81
H'EF82
H'EFFF
Programming unit: 128 bytes
H'C07F
Erase unit
8 Kbytes
Programming unit: 128 bytes
H'E07F
Erase unit
4 Kbytes
Figure 6.8 Flash Memory Block Configuration
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Section 6 ROM
6.5.4
Register Configuration
Table 6.6 lists the register configuration to control the flash memory when the built in flash
memory is effective.
Table 6.6
Register Configuration
Register Name
Abbreviation
R/W
Initial Value
Address
Flash memory control register 1
FLMCR1
R/W
H'00
H'F020
Flash memory control register 2
FLMCR2
R
H'00
H'F021
Flash memory power control register
FLPWCR
R/W
H'00
H'F022
Erase block register
EBR
R/W
H'00
H'F023
Flash memory enable register
FENR
R/W
H'00
H'F02B
Note: FLMCR1, FLMCR2, FLPWCR, EBR, and FENR are 8 bit registers. Only byte access is
enabled which are two-state access. These registers are dedicated to the product in which
flash memory is included. The product in which PROM or ROM is included does not have
these registers. When the corresponding address is read in these products, the value is
undefined. A write is disabled.
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Section 6 ROM
6.6
Descriptions of Registers of the Flash Memory
6.6.1
Flash Memory Control Register 1 (FLMCR1)
Bit
7
6
5
4
3
2
1
0
—
SWE
ESU
PSU
EV
PV
E
P
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 6.8, Flash
Memory Programming/Erasing. By setting this register, the flash memory enters program mode,
erase mode, program-verify mode, or erase-verify mode. Read the data in the state that bits 6 to 0
of this register are cleared when using flash memory as normal built-in ROM.
Bit 7—Reserved
This bit is always read as 0 and cannot be modified.
Bit 6—Software Write Enable (SWE)
This bit is to set enabling/disabling of programming/enabling of flash memory (set when bits 5 to
0 and the EBR register are to be set).
Bit 6
SWE
Description
0
Programming/erasing is disabled. Other FLMCR1 register bits and all EBR bits
cannot be set.
(initial value)
1
Flash memory programming/erasing is enabled.
Bit 5—Erase Setup (ESU)
This bit is to prepare for changing to erase mode. Set this bit to 1 before setting the E bit to 1 in
FLMCR1 (do not set SWE, PSU, EV, PV, E, and P bits at the same time).
Bit 5
ESU
Description
0
The erase setup state is cancelled
1
The flash memory changes to the erase setup state. Set this bit to 1 before setting
the E bit to 1 in FLMCR1.
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(initial value)
Section 6 ROM
Bit 4—Program Setup (PSU)
This bit is to prepare for changing to program mode. Set this bit to 1 before setting the P bit to 1
in FLMCR1 (do not set SWE, ESU, EV, PV, E, and P bits at the same time).
Bit 4
PSU
Description
0
The program setup state is cancelled
1
The flash memory changes to the program setup state. Set this bit to 1 before
setting the P bit to 1 in FLMCR1.
(initial value)
Bit 3—Erase-Verify (EV)
This bit is to set changing to or cancelling erase-verify mode (do not set SWE, ESU, PSU, PV, E,
and P bits at the same time).
Bit 3
EV
Description
0
Erase-verify mode is cancelled
1
The flash memory changes to erase-verify mode
(initial value)
Bit 2—Program-Verify (PV)
This bit is to set changing to or cancelling program-verify mode (do not set SWE, ESU, PSU, EV,
E, and P bits at the same time).
Bit 2
PV
Description
0
Program-verify mode is cancelled
1
The flash memory changes to program-verify mode
(initial value)
Bit 1—Erase (E)
This bit is to set changing to or cancelling erase mode (do not set SWE, ESU, PSU, EV, PV, and P
bits at the same time).
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Section 6 ROM
Bit 1
E
Description
0
Erase mode is cancelled
1
When this bit is set to 1, while the SWE = 1 and ESU = 1, the flash memory
changes to erase mode.
(initial value)
Bit 0—Program (P)
This bit is to set changing to or cancelling program mode (do not set SWE, ESU, PSU, EV, PV,
and E bits at the same time).
Bit 0
P
Description
0
Program mode is cancelled
1
When this bit is set to 1, while the SWE = 1 and PSU = 1, the flash memory
changes to program mode.
6.6.2
(initial value)
Flash Memory Control Register 2 (FLMCR2)
Bit
7
6
5
4
3
2
1
0
FLER
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
—
—
—
—
—
—
—
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit 7—Flash Memory Error (FLER)
This bit is set when the flash memory detects an error and goes to the error-protection state during
programming or erasing to the flash memory. See section 6.9.3, Error Protection, for details.
Bit 7
FLER
Description
0
The flash memory operates normally.
1
Indicates that an error has occurred during an operation on flash memory
(programming or erasing).
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(initial value)
Section 6 ROM
Bits 6 to 0—Reserved
These bits are always read as 0 and cannot be modified.
6.6.3
Erase Block Register (EBR)
Bit
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
EBR specifies the flash memory erase area block. EBR is initialized to H'00 when the SWE bit in
FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR to be
automatically cleared to 0. When each bit is set to 1 in EBR, the corresponding block can be
erased. Other blocks change to the erase-protection state. See table 6.7 for the method of dividing
blocks of the flash memory. When the whole bits are to be erased, erase them in turn in unit of a
block.
Table 6.7
Division of Blocks to Be Erased
EBR
Bit Name
Block (Size)
Address
0
EB0
EB0 (1 Kbyte)
H'0000 to H'03FF
1
EB1
EB1 (1 Kbyte)
H'0400 to H'07FF
2
EB2
EB2 (1 Kbyte)
H'0800 to H'0BFF
3
EB3
EB3 (1 Kbyte)
H'0C00 to H'0FFF
4
EB4
EB4 (28 Kbytes)
H'1000 to H'7FFF
5
EB5
EB5 (16 Kbytes)
H'8000 to H'BFFF
6
EB6
EB6 (8 Kbytes)
H'C000 to H'DFFF
7
EB7
EB7 (4 Kbytes)
H'E000 to H'EFFF
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Section 6 ROM
6.6.4
Flash Memory Power Control Register (FLPWCR)
Bit
7
6
5
4
3
2
1
0
PDWND
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
—
—
—
—
—
—
—
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI
switches to subactive mode. The power supply circuit can be read in the subactive mode, although
it is partly halted in the power-down mode.
Bit 7—Power-down Disable (PDWND)
This bit selects the power-down mode of the flash memory when a transition to the subactive
mode is made.
Bit 7
PDWND
Description
0
When this bit is 0 and a transition is made to the subactive mode, the flash memory
enters the power-down mode.
(initial value)
1
When this bit is 1, the flash memory remains in the normal mode even after a
transition is made to the subactive mode.
Bits 6 to 0—Reserved
These bits are always read as 0 and cannot be modified.
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Section 6 ROM
6.6.5
Flash Memory Enable Register (FENR)
Bit
7
6
5
4
3
2
1
0
FLSHE
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
—
—
—
—
—
—
—
FENR controls CPU access to the flash memory control registers, FLMCR1, FLMCR2, EBR, and
FLPWCR.
Bit 7—Flash Memory Control Register Enable (FLSHE)
This bit controls access to the flash memory control registers.
Bit 7
FLSHE
Description
0
Flash memory control registers cannot be accessed
1
Flash memory control registers can be accessed
(initial value)
Bits 6 to 0—Reserved
These bits are always read as 0 and cannot be modified.
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Section 6 ROM
6.7
On-Board Programming Modes
There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed
with a PROM programmer. On-board programming/erasing can also be performed in user
program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST
pin settings, P32 pin settings, and input level of each port, as shown in table 6.8. The input level of
each pin must be defined four states before the reset ends.
When changing to boot mode, the boot program built into this LSI is initiated. The boot program
transfers the programming control program from the externally-connected host to on-chip RAM
via SCI32. After erasing the entire flash memory, the programming control program is executed.
This can be used for programming initial values in the on-board state or for a forcible return when
programming/erasing can no longer be done in user program mode. In user program mode,
individual blocks can be erased and programmed by branching to the user program/erase control
program prepared by the user.
Table 6.8
Setting Programming Modes
TEST
P32
P86
PB0
PB1
PB2
LSI State after Reset End
0
1
X
X
X
X
User Mode
0
0
1
X
X
X
Boot Mode
1
X
X
0
0
0
Programmer Mode
X: Don’t care
6.7.1
Boot Mode
Table 6.9 shows the boot mode operations between reset end and branching to the programming
control program. The device uses SCI32 in the boot mode.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 6.8, Flash Memory Programming/Erasing.
2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop
bit, and no parity. The inversion function of TXD and RXD pins by the SPCR register is set to
“Not to be inverted,” so do not put the circuit for inverting a value between the host and this
LSI.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
Rev. 6.00 Aug 04, 2006 page 166 of 626
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Section 6 ROM
calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that
of the host. The reset should end with the RXD pin high. The RXD and TXD pins should be
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit
rate and system clock frequency of this LSI within the ranges listed in table 6.10.
5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to
H'FEEF is the area to which the programming control program is transferred from the host.
The boot program area cannot be used until the execution state in boot mode switches to the
programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer
of write data or verify data with the host. The TXD pin is high (PCR42 = 1, P42 = 1). The
contents of the CPU general registers are undefined immediately after branching to the
programming control program. These registers must be initialized at the beginning of the
programming control program, as the stack pointer (SP), in particular, is used implicitly in
subroutine calls, etc.
7. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at
least 20 states, and then setting the TEST pin and P32 pin. Boot mode is also cleared when a
WDT overflow occurs.
8. Do not change the TEST pin and P32 pin input levels in boot mode.
Rev. 6.00 Aug 04, 2006 page 167 of 626
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Section 6 ROM
Table 6.9
Boot Mode Operation
Item
Host Operation
LSI Operation
Processing Contents
Processing Contents
Branches to boot program at reset-start.
Bit rate
adjustment
Continuously transmits data H'00 at
specified bit rate.
Flash memory erase
Transmits data H'55 when data H'00
is received and no error occurs.
• Measures low-level period of receive data H'00.
• Calculates bit rate and sets it in BRR of SCI3.
• Transmits data H'00 to the host to indicate that the
adjustment has ended.
Checks flash memory data, erases all flash memory
blocks in case of written data existing, and transmits
data H'AA to host. (If erase could not be done,
transmits data H'FF to host and aborts operation.)
Transfer of
programming control
program
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data (low-order
byte following high-order byte)
Transfer of
programming control
program (repeated for
N times)
Transmits 1-byte of programming
control program
Echobacks the 2-byte received data to host.
Echobacks received data to host and also
transfers it to RAM.
Transmits 1-byte data H'AA to host.
Execution of
Programming
control program
Branches to programming control program
transferred to on-chip RAM and starts execution.
Table 6.10 Oscillating Frequencies (fOSC) for which Automatic Adjustment of LSI Bit Rate
Is Possible
Product Group
Host Bit Rate
Oscillating Frequencies (fOSC) Range of LSI
H8/38327F-ZTAT
19,200 bps
16 MHz
H8/38324F-ZTAT
9,600 bps
8 to 16 MHz
H8/38427F-ZTAT
4,800 bps
6 to 16 MHz
H8/38424F-ZTAT
2,400 bps
2 to 16 MHz
1,200 bps
2 to 16 MHz
Rev. 6.00 Aug 04, 2006 page 168 of 626
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Section 6 ROM
6.7.2
Programming/Erasing in User Program Mode
The term user mode refers to the status when a user program is being executed. On-board
programming/erasing of an individual flash memory block can also be performed in user program
mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the user program/erase control program or a program that provides the user program/erase
control program from external memory. As the flash memory itself cannot be read during
programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot
mode. Figure 6.9 shows a sample procedure for programming/erasing in user program mode.
Prepare a user program/erase control program in accordance with the description in section 6.8,
Flash Memory Programming/Erasing.
Reset-start
No
Program/erase?
Yes
Transfer user program/erase control
program to RAM
Branch to flash memory application
program
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Figure 6.9 Programming/Erasing Flowchart Example in User Program Mode
6.8
Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
Rev. 6.00 Aug 04, 2006 page 169 of 626
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Section 6 ROM
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 6.8.1, Program/Program-Verify and section 6.8.2,
Erase/Erase-Verify, respectively.
6.8.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 6.10 should be followed. Performing programming operations according to this
flowchart will enable data or programs to be written to the flash memory without subjecting the
chip to voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation according to table 6.11, and additional programming data
computation according to table 6.12.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P bit is set to 1 is the programming time. Figure 6.12 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately 6.6 ms is allowed.
7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is b'0. Verify data can be read in word size from the address to which a dummy write was
performed.
8. The maximum number of repetitions of the program/program-verify sequence of the same bit
is 1,000.
Rev. 6.00 Aug 04, 2006 page 170 of 626
REJ09B0144-0600
Section 6 ROM
Write pulse application subroutine
Apply Write Pulse
START
Set SWE bit in FLMCR1
WDT enable
Wait 1 µs
Set PSU bit in FLMCR1
Store 128-byte program data in program
data area and reprogram data area
Wait 50 µs
n=1
Set P bit in FLMCR1
m=0
Wait (Wait time = programming time)
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Clear P bit in FLMCR1
Apply Write pulse
Wait 5 µs
Set PV bit in FLMCR1
Clear PSU bit in FLMCR1
Wait 4 µs
Wait 5 µs
Set block start address as
verify address
Disable WDT
n←n+1
H'FF dummy write to verify address
End Sub
Wait 2 µs
Read verify data
No
Verify data =
write data?
Increment address
m=1
Yes
No
n≤6?
Yes
Additional-programming data
computation
Reprogram data computation
No
128-byte
data verification
completed?
Yes
Clear PV bit in FLMCR1
Wait 2 µs
No
n ≤ 6?
Yes
Successively write 128-byte data from
additional-programming data area
in RAM to flash memory
Sub-Routine-Call
Apply Write Pulse
No
m=0?
n ≤ 1000 ?
Clear SWE bit in FLMCR1
Clear SWE bit in FLMCR1
Wait 100 µs
Wait 100 µs
End of programming
Yes
No
Yes
Programming failure
Figure 6.10 Program/Program-Verify Flowchart
Rev. 6.00 Aug 04, 2006 page 171 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.11 Reprogram Data Computation Table
Program Data
Verify Data
Reprogram Data
Comments
0
0
1
Programming completed
0
1
0
Reprogram bit
1
0
1
—
1
1
1
Remains in erased state
Table 6.12 Additional-Program Data Computation Table
Reprogram Data
Verify Data
Additional-Program
Data
Comments
0
0
0
Additional-program bit
0
1
1
No additional programming
1
0
1
No additional programming
1
1
1
No additional programming
In Additional
Programming
Comments
Table 6.13 Programming Time
n
Programming
(Number of Writes) Time
1 to 6
30
10
7 to 1,000
200
—
Note: Time shown in µs.
Rev. 6.00 Aug 04, 2006 page 172 of 626
REJ09B0144-0600
Section 6 ROM
6.8.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 6.11 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register (EBR). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An
overflow cycle of approximately 19.8 ms is allowed.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is b'0. Verify data can be read in word size from the address to which a dummy write was
performed.
6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is 100.
6.8.3
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, are disabled while flash memory is being programmed or erased, or while the boot
program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
Rev. 6.00 Aug 04, 2006 page 173 of 626
REJ09B0144-0600
Section 6 ROM
Erase start
SWE bit ← 1
Wait 1 µs
n←1
Set EBR
Enable WDT
ESU bit ← 1
Wait 100 µs
E bit ← 1
Wait 10 ms
E bit ← 0
Wait 10 µs
ESU bit ← 0
Wait 10 µs
Disable WDT
EV bit ← 1
Wait 20 µs
Set block start address as verify address
H'FF dummy write to verify address
Wait 2 µs
n←n+1
Read verify data
No
Verify data = all 1s ?
Increment address
Yes
No
Last address of block ?
Yes
No
EV bit ← 0
EV bit ← 0
Wait 4 µs
Wait 4µs
All erase block erased ?
n ≤100 ?
No
Yes
SWE bit ← 0
SWE bit ← 0
Wait 100 µs
Wait 100 µs
End of erasing
Erase failure
Figure 6.11 Erase/Erase-Verify Flowchart
Rev. 6.00 Aug 04, 2006 page 174 of 626
REJ09B0144-0600
Yes
Section 6 ROM
6.9
Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
6.9.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset, subactive mode, subsleep mode, watch mode,
or standby mode. Flash memory control register 1 (FLMCR1), flash memory control register 2
(FLMCR2), and erase block register (EBR) are initialized. In a reset via the RES pin, the reset
state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In
the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the
AC Characteristics section.
6.9.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit
in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register (EBR), erase protection can be set for individual blocks. When EBR is set to H'00,
erase protection is set for all blocks.
6.9.3
Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling excluding a reset during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
The FLMCR1, FLMCR2, and EBR settings are retained, however program mode or erase mode is
aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered
Rev. 6.00 Aug 04, 2006 page 175 of 626
REJ09B0144-0600
Section 6 ROM
by re-setting the P or E bit. However, PV and EV bit setting is enabled, and a transition can be
made to verify mode. Error protection can be cleared only by a power-on reset.
6.10
Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a
socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU
device type with the on-chip Renesas Technology (former Hitachi Ltd.) 64-Kbyte flash memory
(F-ZTAT64V3). A 10-MHz input clock is required. For the conditions for transition to
programmer mode, see table 6.8.
6.10.1
Socket Adapter
The socket adapter converts the pin allocation of the F-ZTAT device to that of the discrete flash
memory HN28F101. The address of the on-chip flash memory is H'0000 to H'EFFF. Figure 6.12
shows a socket-adapter-pin correspondence diagram.
6.10.2
Programmer Mode Commands
The following commands are supported in programmer mode.
• Memory Read Mode
• Auto-Program Mode
• Auto-Erase Mode
• Status Read Mode
Status polling is used for auto-programming, auto-erasing, and status read modes. In status read
mode, detailed internal information is output after the execution of auto-programming or autoerasing. Table 6.14 shows the sequence of each command. In auto-programming mode, 129 cycles
are required since 128 bytes are written at the same time. In memory read mode, the number of
cycles depends on the number of address write cycles (n).
Rev. 6.00 Aug 04, 2006 page 176 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.14 Command Sequence in Programmer Mode
1st Cycle
2nd Cycle
Command Name
Number
of Cycles
Mode
Address
Data
Mode
Address
Data
Memory read
1+n
Write
X
H'00
Read
RA
Dout
Auto-program
129
Write
X
H'40
Write
WA
Din
Auto-erase
2
Write
X
H'20
Write
X
H'20
Status read
2
Write
X
H'71
Write
X
H'71
n: the number of address write cycles
Rev. 6.00 Aug 04, 2006 page 177 of 626
REJ09B0144-0600
Section 6 ROM
F-ZTAT Device
Pin No.
Socket Adapter
(Conversion to
32-Pin
Arrangement)
HN28F101 (32 Pins)
FP-80A
TFP-80C
Pin Name
54
P71
60
P77
A15
3
12
P12
WE
31
45
P60
I/O0
13
46
P61
I/O1
14
47
P62
I/O2
15
48
P63
I/O3
17
49
P64
I/O4
18
50
P65
I/O5
19
51
P66
I/O6
20
52
P67
I/O7
21
68
P87
A0
12
67
P86
A1
11
66
P85
A2
10
65
P84
A3
9
64
P83
A4
8
63
P82
A5
7
62
P81
A6
6
61
P80
A7
5
53
P70
A8
27
71
P42
OE
24
55
P72
A10
23
56
P73
A11
25
57
P74
A12
4
58
P75
A13
28
59
P76
A14
29
72
P43
CE
22
26, 32
CVcc, Vcc
Vcc
32
73
AVcc
Vss
16
3
X1
8
TEST
30
V1
14
P14
2, 5
AVss, Vss
Pin Name
FWE
1
A9
26
A16
2
Legend:
FWE:
I/O7 to I/O0:
A16 to A0:
CE:
OE:
WE:
27
Vss
74
PB0
75
PB1
76
PB2
7, 6
OSC1,OSC2
Oscillator circuit
9
RES
Other than the above
(OPEN)
Power-on
reset circuit
Pin No.
Flash-write enable
Data input/output
Address input
Chip enable
Output enable
Write enable
Note: The oscillation frequency
of the oscillator circuit
should be 10 MHz.
Figure 6.12 Socket Adapter Pin Correspondence Diagram
Rev. 6.00 Aug 04, 2006 page 178 of 626
REJ09B0144-0600
Section 6 ROM
6.10.3
Memory Read Mode
1. After completion of auto-program/auto-erase/status read operations, a transition is made to the
command wait state. When reading memory contents, a transition to memory read mode must
first be made with a command write, after which the memory contents are read. Once memory
read mode has been entered, consecutive reads can be performed.
2. In memory read mode, command writes can be performed in the same way as in the command
wait state.
3. After powering on, memory read mode is entered.
4. Tables 6.15 to 6.17 show the AC characteristics.
Table 6.15 AC Characteristics in Transition to Memory Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Command write cycle
tnxtc
20
—
µs
Figure 6.13
CE hold time
tceh
0
—
ns
CE setup time
tces
0
—
ns
Data hold time
tdh
50
—
ns
Data setup time
tds
50
—
ns
Write pulse width
twep
70
—
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Command write
Memory read mode
Address stable
A15−A0
tces
tceh
tnxtc
CE
OE
twep
tf
tr
WE
tds
tdh
I/O7−I/O0
Note: Data is latched on the rising edge of WE.
Figure 6.13 Timing Waveforms for Memory Read after Memory Write
Rev. 6.00 Aug 04, 2006 page 179 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.16 AC Characteristics in Transition from Memory Read Mode to Another Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Command write cycle
tnxtc
20
—
µs
Figure 6.14
CE hold time
tceh
0
—
ns
CE setup time
tces
0
—
ns
Data hold time
tdh
50
—
ns
Data setup time
tds
50
—
ns
Write pulse width
twep
70
—
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Memory read mode
A15−A0
Other mode command write
Address stable
tnxtc
tces
tceh
CE
OE
twep
tf
tr
WE
tds
tdh
I/O7−I/O0
Note: Do not enable WE and OE at the same time.
Figure 6.14 Timing Waveforms in Transition from Memory Read Mode to Another Mode
Rev. 6.00 Aug 04, 2006 page 180 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.17 AC Characteristics in Memory Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Access time
tacc
—
20
µs
Figure 6.15
CE output delay time
tce
—
150
ns
Figure 6.16
OE output delay time
toe
—
150
ns
Output disable delay time
tdf
—
100
ns
Data output hold time
toh
5
—
ns
A15−A0
Address stable
Address stable
CE
OE
WE
tacc
tacc
toh
toh
I/O7−I/O0
Figure 6.15 CE and OE Enable State Read Timing Waveforms
A15−A0
Address stable
Address stable
tce
tce
CE
toe
toe
OE
WE
tacc
tacc
toh
tdf
toh
tdf
I/O7−I/O0
Figure 6.16 CE and OE Clock System Read Timing Waveforms
Rev. 6.00 Aug 04, 2006 page 181 of 626
REJ09B0144-0600
Section 6 ROM
6.10.4
Auto-Program Mode
1. When reprogramming previously programmed addresses, perform auto-erasing before autoprogramming.
2. Perform auto-programming once only on the same address block. It is not possible to program
an address block that has already been programmed.
3. In auto-program mode, 128 bytes are programmed simultaneously. This should be carried out
by executing 128 consecutive byte transfers. A 128-byte data transfer is necessary even when
programming fewer than 128 bytes. In this case, H'FF data must be written to the extra
addresses.
4. The lower 7 bits of the transfer address must be low. If a value other than an effective address
is input, processing will switch to a memory write operation but a write error will be flagged.
5. Memory address transfer is performed in the second cycle (figure 6.17). Do not perform
transfer after the third cycle.
6. Do not perform a command write during a programming operation.
7. Perform one auto-program operation for a 128-byte block for each address. Two or more
additional programming operations cannot be performed on a previously programmed address
block.
8. Confirm normal end of auto-programming by checking I/O6. Alternatively, status read mode
can also be used for this purpose (I/O7 status polling uses the auto-program operation end
decision pin).
9. Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
as the next command write has not been performed, reading is possible by enabling CE and
OE.
10. Table 6.18 shows the AC characteristics.
Rev. 6.00 Aug 04, 2006 page 182 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.18 AC Characteristics in Auto-Program Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Command write cycle
tnxtc
20
—
µs
Figure 6.17
CE hold time
tceh
0
—
ns
CE setup time
tces
0
—
ns
Data hold time
tdh
50
—
ns
Data setup time
tds
50
—
ns
Write pulse width
twep
70
—
ns
Status polling start time
twsts
1
—
ms
Status polling access time
tspa
—
150
ns
Address setup time
tas
0
—
ns
Address hold time
tah
60
—
ns
Memory write time
twrite
1
3000
ms
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Address
stable
A15−A0
tces
tceh
tnxtc
tnxtc
CE
OE
tf
twep
tr
tas
tah
twsts
tspa
WE
tds
tdh
I/O7
twrite
Write operation end decision signal
I/O6
I/O5−I/O0
Data transfer
1 to 128 bytes
Write normal end decision signal
H'40
H'00
Figure 6.17 Auto-Program Mode Timing Waveforms
Rev. 6.00 Aug 04, 2006 page 183 of 626
REJ09B0144-0600
Section 6 ROM
6.10.5
Auto-Erase Mode
1. Auto-erase mode supports only entire memory erasing.
2. Do not perform a command write during auto-erasing.
3. Confirm normal end of auto-erasing by checking I/O6. Alternatively, status read mode can also
be used for this purpose (I/O7 status polling uses the auto-erase operation end decision pin).
4. Status polling I/O6 and I/O7 pin information is retained until the next command write. As long
as the next command write has not been performed, reading is possible by enabling CE and
OE.
5. Table 6.19 shows the AC characteristics.
Table 6.19 AC Characteristics in Auto-Erase Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Command write cycle
tnxtc
20
—
µs
Figure 6.18
CE hold time
tceh
0
—
ns
CE setup time
tces
0
—
ns
Data hold time
tdh
50
—
ns
Data setup time
tds
50
—
ns
Write pulse width
twep
70
—
ns
Status polling start time
tests
1
—
ms
Status polling access time
tspa
—
150
ns
Memory erase time
terase
100
40000
ms
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
Rev. 6.00 Aug 04, 2006 page 184 of 626
REJ09B0144-0600
Section 6 ROM
A15−A0
tces
tceh
tnxtc
tnxtc
CE
OE
tf
twep
tr
tests
tspa
WE
tds
terase
tdh
I/O7
Erase end
decision signal
I/O6
Erase normal
end
decision signal
I/O5−I/O0
H'20
H'20
H'00
Figure 6.18 Auto-Erase Mode Timing Waveforms
6.10.6
Status Read Mode
1. Status read mode is provided to identify the kind of abnormal end. Use this mode when an
abnormal end occurs in auto-program mode or auto-erase mode.
2. The return code is retained until a command write other than a status read mode command
write is executed.
3. Table 6.20 shows the AC characteristics and 6.21 shows the return codes.
Rev. 6.00 Aug 04, 2006 page 185 of 626
REJ09B0144-0600
Section 6 ROM
Table 6.20 AC Characteristics in Status Read Mode
Conditions: VCC = 3.3 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C
Item
Symbol
Min
Max
Unit
Notes
Read time after command write
tnxtc
20
—
µs
Figure 6.19
CE hold time
tceh
0
—
ns
CE setup time
tces
0
—
ns
Data hold time
tdh
50
—
ns
Data setup time
tds
50
—
ns
Write pulse width
twep
70
—
ns
OE output delay time
toe
—
150
ns
Disable delay time
tdf
—
100
ns
CE output delay time
tce
—
150
ns
WE rise time
tr
—
30
ns
WE fall time
tf
—
30
ns
A15−A0
tces
tceh
tnxtc tces
tceh
tnxtc
tnxtc
CE
tce
OE
twep
tf
tr
twep
tf
tr
toe
WE
tds
I/O7−/O0
tdh
H'71
tds
tdh
H'71
Note: I/O2 and I/O3 are undefined.
Figure 6.19 Status Read Mode Timing Waveforms
Rev. 6.00 Aug 04, 2006 page 186 of 626
REJ09B0144-0600
tdf
Section 6 ROM
Table 6.21 Status Read Mode Return Codes
Pin Name
Initial Value
Indications
I/O7
0
1: Abnormal end
0: Normal end
I/O6
0
I/O5
0
1: Command error
0: Otherwise
1: Programming error
0: Otherwise
I/O4
0
1: Erasing error
0: Otherwise
I/O3
0

I/O2
0

I/O1
0
1: Over counting of writing or erasing
0: Otherwise
I/O0
0
1: Effective address error
0: Otherwise
6.10.7
Status Polling
1. The I/O7 status polling flag indicates the operating status in auto-program/auto-erase mode.
2. The I/O6 status polling flag indicates a normal or abnormal end in auto-program/auto-erase
mode.
Table 6.22 Status Polling Output Truth Table
I/O7
I/O6
I/O0 to 5
Status
0
0
0
During internal operation
1
0
0
Abnormal end
1
1
0
Normal end
0
1
0
—
Rev. 6.00 Aug 04, 2006 page 187 of 626
REJ09B0144-0600
Section 6 ROM
6.10.8
Programmer Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the programmer mode
setup period. After the programmer mode setup time, a transition is made to memory read mode.
Table 6.23 Stipulated Transition Times to Command Wait State
Item
Symbol
Min
Max
Unit
Notes
Oscillation stabilization time(crystal oscillator)
Tosc1
10
—
ms
Figure 6.20
Oscillation stabilization time(ceramic oscillator)
Tosc1
5
—
ms
Programmer mode setup time
Tbmv
10
—
ms
Vcc hold time
Tdwn
0
—
ms
tosc1
tbmv
Auto-program mode
Auto-erase mode
tdwn
Vcc
RES
Figure 6.20 Oscillation Stabilization Time, Boot Program Transfer Time,
and Power-Down Sequence
6.10.9
Notes on Memory Programming
1. When performing programming using programmer mode on a chip that has been
programmed/erased in an on-board programming mode, auto-erasing is recommended before
carrying out auto-programming.
2. The flash memory is initially in the erased state when the device is shipped by Renesas
Technology. For other chips for which the erasure history is unknown, it is recommended that
auto-erasing be executed to check and supplement the initialization (erase) level.
Rev. 6.00 Aug 04, 2006 page 188 of 626
REJ09B0144-0600
Section 6 ROM
6.11
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to at high speed.
• Power-down operating mode
The power supply circuit of the flash memory is partly halted and can be read under low power
consumption.
• Standby mode
All flash memory circuits are halted.
Table 6.24 shows the correspondence between the operating modes of this LSI and the flash
memory. In subactive mode, the flash memory can be set to operate in power-down mode with the
PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from
power-down mode or standby mode, a period to stabilize the power supply circuits that were
stopped is needed. When the flash memory returns to its normal operating state, bits STS2 to
STS0 in SYSCR1 must be set to provide a wait time of at least 20 µs, even when the external
clock is being used.
Table 6.24 Flash Memory Operating States
Flash Memory Operating State
LSI Operating State
PDWND = 0 (Initial value)
PDWND = 1
Active mode
Normal operating mode
Normal operating mode
Subactive mode
Power-down mode
Normal operating mode
Sleep mode
Normal operating mode
Normal operating mode
Subsleep mode
Standby mode
Standby mode
Standby mode
Standby mode
Standby mode
Watch mode
Standby mode
Standby mode
Rev. 6.00 Aug 04, 2006 page 189 of 626
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Section 6 ROM
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Section 7 RAM
Section 7 RAM
7.1
Overview
The H8/3822R, H8/3823R, H8/38322, H8/38323, H8/38422, and H8/38423 have 1 Kbyte of highspeed static RAM on-chip, and the H8/3824R, H8/3824S, H8/38324, H8/38424, H8/3825R,
H8/3825S, H8/38325, H8/38425, H8/3826R, H8/3826S, H8/38326, H8/38426, H8/3827R,
H8/3827S, H8/38327, and H8/38427 have 2 Kbytes. The RAM is connected to the CPU by a 16bit data bus, allowing high-speed 2-state access for both byte data and word data.
7.1.1
Block Diagram
Figure 7.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'F780
H'F780
H'F781
H'F782
H'F782
H'F783
On-chip RAM
H'FF7E
H'FF7E
H'FF7F
Even-numbered
address
Odd-numbered
address
Figure 7.1 RAM Block Diagram (H8/3824R, H8/3824S, H8/38324, and H8/38424)
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Section 7 RAM
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Section 8 I/O Ports
Section 8 I/O Ports
8.1
Overview
The H8/3827R Group, H8/3827S Group, and H8/38327 Group is provided with six 8-bit I/O ports,
one 4-bit I/O port, one 3-bit I/O port, one 8-bit input-only port, and one 1-bit input-only port.
Table 8.1 indicates the functions of each port.
Each port has of a port control register (PCR) that controls input and output, and a port data
register (PDR) for storing output data. Input or output can be assigned to individual bits.
See section 2.9.2, Notes on Bit Manipulation, for information on executing bit-manipulation
instructions to write data in PCR or PDR.
Ports 5, 6, 7, 8, and A are also used as liquid crystal display segment and common pins, selectable
in 8-bit units.
Block diagrams of each port are given in Appendix C, I/O Port Block Diagrams.
Table 8.1
Port Functions
Port
Description
Pins
Other Functions
Function
Switching
Registers
Port 1
• 8-bit I/O port
P17 to P15/
IRQ3 to IRQ1/
TMIF, TMIC
External interrupts 3 to 1
Timer event interrupts
TMIF, TMIC
PMR1
TCRF,
TMC
P14/IRQ4/ADTRG
External interrupt 4 and A/D
converter external trigger
PMR1, AMR
P13/TMIG
Timer G input capture input
PMR1
P12, P11/
TMOFH, TMOFL
Timer F output compare
output
PMR1
P10/TMOW
Timer A clock output
PMR1
• MOS input pull-up
option
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Section 8 I/O Ports
Port
Description
Pins
Other Functions
Port 3
• 8-bit I/O port
P37/AEVL
P36/AEVH
P35/TXD31
P34/RXD31
P33/SCK31
SCI3-1 data output (TXD31),
data input (RXD31), clock
input/output (SCK31), and
asynchronous counter event
inputs AEVL, AEVH
1
Reset output* , timer C
count-up/down select input,
14-bit PWM output, and
2
external subclock input*
• MOS input pull-up
option
• Large-current port
(H8/3827R Group,
*1
H8/38327 Group and P32/RESO
2
P31/UD/EXCL*
H8/38427 Group)
P30/PWM
Port 4
Port 5
PMR3
SCR31
SMR31
PMR2
PMR3
• 1-bit input port
P43/IRQ0
External interrupt 0
PMR3
• 3-bit I/O port
P42/TXD32
P41/RXD32
P40/SCK32
SCI3-2 data output (TXD32),
data input (RXD32), clock
input/output (SCK32)
SCR32
SMR32
• 8-bit I/O port
P57 to P50/
WKP7 to WKP0/
SEG8 to SEG1
Wakeup input (WKP7 to
WKP0), segment output
(SEG8 to SEG1)
PMR5
LPCR
P67 to P60/
SEG16 to SEG9
Segment output (SEG16 to
SEG9)
LPCR
P77 to P70/
SEG24 to SEG17
3
P87/SEG32/CL1*
3
P86/SEG31/CL2*
3
P85/SEG30/DO*
3
P84/SEG29/M*
P83 to P80/
SEG28 to SEG25
Segment output (SEG24 to
SEG17)
LPCR
• MOS input pull-up
option
Port 6
Function
Switching
Registers
• 8-bit I/O port
• MOS input pull-up
option
Port 7
• 8-bit I/O port
Port 8
• 8-bit I/O port
Port A
4-bit I/O port
PA3 to PA0/
COM4 to COM1
Common output (COM4 to
COM1)
LPCR
Port B
8-bit input port
PB7 to PB0/
AN7 to AN0
A/D converter analog input
AMR
Segment output
LPCR
(SEG32 to SEG25)
Segment external expansion
3
latch clock (CL1)* ,
3
*
shift clock (CL2) ,
3
display data (DO)* ,
3
alternation signal (M)*
Notes: 1. The RESO function is not implemented in the H8/38327 Group and H8/38427 Group.
2. The EXCL function is only implemented in the H8/38327 Group and H8/38427 Group.
3. The external expansion function for LCD segments is not implemented in the H8/38327
Group and H8/38427 Group.
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Section 8 I/O Ports
8.2
Port 1
8.2.1
Overview
Port 1 is a 8-bit I/O port. Figure 8.1 shows its pin configuration.
P1 7 /IRQ 3 /TMIF
P1 6 /IRQ 2
P1 5 /IRQ 1 /TMIC
P1 4 /IRQ 4 /ADTRG
Port 1
P1 3 /TMIG
P1 2 /TMOFH
P1 1 /TMOFL
P1 0 /TMOW
Figure 8.1 Port 1 Pin Configuration
8.2.2
Register Configuration and Description
Table 8.2 shows the port 1 register configuration.
Table 8.2
Port 1 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 1
PDR1
R/W
H'00
H'FFD4
Port control register 1
PCR1
W
H'00
H'FFE4
Port pull-up control register 1
PUCR1
R/W
H'00
H'FFE0
Port mode register 1
PMR1
R/W
H'00
H'FFC8
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Section 8 I/O Ports
1. Port Data Register 1 (PDR1)
Bit
7
6
5
4
3
2
1
0
P1 7
P1 6
P1 5
P1 4
P1 3
P1 2
P1 1
P1 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR1 is an 8-bit register that stores data for port 1 pins P17 to P10. If port 1 is read while PCR1
bits are set to 1, the values stored in PDR1 are read, regardless of the actual pin states. If port 1 is
read while PCR1 bits are cleared to 0, the pin states are read.
Upon reset, PDR1 is initialized to H'00.
2. Port Control Register 1 (PCR1)
Bit
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
PCR13
PCR1 2
PCR11
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR1 is an 8-bit register for controlling whether each of the port 1 pins P17 to P10 functions as an
input pin or output pin. Setting a PCR1 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR1 and in PDR1 are valid only
when the corresponding pin is designated in PMR1 as a general I/O pin.
Upon reset, PCR1 is initialized to H'00.
PCR1 is a write-only register, which is always read as all 1s.
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Section 8 I/O Ports
3. Port Pull-Up Control Register 1 (PUCR1)
Bit
7
6
5
4
3
2
0
1
PUCR17 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR1 controls whether the MOS pull-up of each of the port 1 pins P17 to P10 is on or off. When
a PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR1 is initialized to H'00.
4. Port Mode Register 1 (PMR1)
Bit
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
IRQ4
TMIG
TMOFH
TMOFL
TMOW
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR1 is an 8-bit read/write register, controlling the selection of pin functions for port 1 pins.
Upon reset, PMR1 is initialized to H'00.
Bit 7: P17/IRQ3/TMIF pin function switch (IRQ3)
This bit selects whether pin P17/IRQ3/TMIF is used as P17 or as IRQ3/TMIF.
Bit 7
IRQ3
Description
0
Functions as P17 I/O pin
1
Functions as IRQ3/TMIF input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ3, TMIF. For details on TMIF
settings, see 3. Timer Control Register F (TCRF) in section 9.4.2.
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Section 8 I/O Ports
Bit 6: P16/IRQ2 pin function switch (IRQ2)
This bit selects whether pin P16/IRQ2 is used as P16 or as IRQ2.
Bit 6
IRQ2
Description
0
Functions as P16 I/O pin
1
Functions as IRQ2 input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ2.
Bit 5: P15/IRQ1/TMIC pin function switch (IRQ1)
This bit selects whether pin P15/IRQ1/TMIC is used as P15 or as IRQ1/TMIC.
Bit 5
IRQ1
Description
0
Functions as P15 I/O pin
1
Functions as IRQ1/TMIC input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ1/TMIC.
For details of TMIC pin setting, see 1. Timer mode register C (TMC) in section 9.3.2.
Bit 4: P14/IRQ4/ADTRG pin function switch (IRQ4)
This bit selects whether pin P14/IRQ4/ADTRG is used as P14 or as IRQ4/ADTRG.
Bit 4
IRQ4
Description
0
Functions as P14 I/O pin
1
Functions as IRQ4/ADTRG input pin
(initial value)
Note: For details of ADTRG pin setting, see section 12.3.2, Start of A/D Conversion by External
Trigger Input.
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Section 8 I/O Ports
Bit 3: P13/TMIG pin function switch (TMIG)
This bit selects whether pin P13/TMIG is used as P13 or as TMIG.
Bit 3
TMIG
Description
0
Functions as P13 I/O pin
1
Functions as TMIG input pin
(initial value)
Bit 2: P12/TMOFH pin function switch (TMOFH)
This bit selects whether pin P12/TMOFH is used as P12 or as TMOFH.
Bit 2
TMOFH
Description
0
Functions as P12 I/O pin
1
Functions as TMOFH output pin
(initial value)
Bit 1: P11/TMOFL pin function switch (TMOFL)
This bit selects whether pin P11/TMOFL is used as P11 or as TMOFL.
Bit 1
TMOFL
Description
0
Functions as P11 I/O pin
1
Functions as TMOFL output pin
(initial value)
Bit 0: P10/TMOW pin function switch (TMOW)
This bit selects whether pin P10/TMOW is used as P10 or as TMOW.
Bit 0
TMOW
Description
0
Functions as P10 I/O pin
1
Functions as TMOW output pin
(initial value)
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Section 8 I/O Ports
8.2.3
Pin Functions
Table 8.3 shows the port 1 pin functions.
Table 8.3
Port 1 Pin Functions
Pin
Pin Functions and Selection Method
P17/IRQ3/TMIF
The pin function depends on bit IRQ3 in PMR1, bits CKSL2 to CKSL0 in TCRF,
and bit PCR17 in PCR1.
IRQ3
0
PCR17
0
CKSL2 to CKSL0
Pin function
1
1
*
Not 0**
*
0**
P17 input pin P17 output pin IRQ3 input pin
IRQ3/TMIF
input pin
Note: When this pin is used as the TMIF input pin, clear bit IEN3 to 0 in IENR1
to disable the IRQ3 interrupt.
P16/IRQ2
The pin function depends on bits IRQ2 in PMR1 and bit PCR16 in PCR1.
IRQ2
0
PCR16
Pin function
P15/IRQ1
TMIC
0
1
1
P16 input pin P16 output pin
*
IRQ2 input pin
The pin function depends on bit IRQ1 in PMR1, bits TMC2 to TMC0 in TMC, and
bit PCR15 in PCR1.
IRQ1
0
PCR15
0
TMC2 to TMC0
Pin function
1
1
*
*
Not 111
P15 input pin P15 output pin IRQ1 input pin
111
IRQ1/TMIC
input pin
Note: When this pin is used as the TMIC input pin, clear bit IEN1 to 0 in IENR1
to disable the IRQ1 interrupt.
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Section 8 I/O Ports
Pin
Pin Functions and Selection Method
P14/IRQ4
ADTRG
The pin function depends on bit IRQ4 in PMR1, bit TRGE in AMR, and bit PCR14
in PCR1.
IRQ4
PCR14
0
0
TRGE
Pin function
1
1
*
0
*
1
P14 input pin P14 output pin IRQ4 input pin IRQ4/ADTRG
input pin
Note: When this pin is used as the ADTRG input pin, clear bit IEN4 to 0 in
IENR1 to disable the IRQ4 interrupt.
P13/TMIG
The pin function depends on bit TMIG in PMR1 and bit PCR13 in PCR1.
TMIG
PCR13
Pin function
P12/TMOFH
0
0
*
TMIG input pin
The pin function depends on bit TMOFH in PMR1 and bit PCR12 in PCR1.
PCR12
Pin function
0
0
1
1
P12 input pin P12 output pin
*
TMOFH output pin
The pin function depends on bit TMOFL in PMR1 and bit PCR11 in PCR1.
TMOFL
PCR11
Pin function
P10/TMOW
1
P13 input pin P13 output pin
TMOFH
P11/TMOFL
1
0
0
1
1
P11 input pin P11 output pin
*
TMOFL output pin
The pin function depends on bit TMOW in PMR1 and bit PCR10 in PCR1.
TMOW
PCR10
Pin function
0
0
1
1
P10 input pin P10 output pin
*
TMOW output pin
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 201 of 626
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Section 8 I/O Ports
8.2.4
Pin States
Table 8.4 shows the port 1 pin states in each operating mode.
Table 8.4
Port 1 Pin States
Pins
Reset
Sleep
Subsleep Standby
HighRetains Retains
P17/IRQ3/TMIF
impedance previous previous
P16/IRQ2
state
state
P15/IRQ1/TMIC
P14/IRQ4/ADTRG
P13/TMIG
P12/TMOFH
P11/TMOFL
P10/TMOW
Note:
*
8.2.5
Watch
Subactive Active
Retains Functional Functional
Highimpedance* previous
state
A high-level signal is output when the MOS pull-up is in the on state.
MOS Input Pull-Up
Port 1 has a built-in MOS input pull-up function that can be controlled by software. When a
PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS input pull-up
for that pin. The MOS input pull-up function is in the off state after a reset.
PCR1n
0
0
1
PUCR1n
0
1
*
MOS input pull-up
Off
On
Off
(n = 7 to 0)
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 202 of 626
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Section 8 I/O Ports
8.3
Port 3
8.3.1
Overview
Port 3 is a 8-bit I/O port, configured as shown in figure 8.2.
In the F-ZTAT version, the on-chip pull-up MOS for pin P32 is on during the reset period. It turns
off and normal operation resumes after the reset is cleared. This should be considered when
making connections to external circuitry. Note that in the mask ROM and ZTAT versions P32
continues to operate normally.
P3 7 /AEVL
P3 6 /AEVH
P3 5 /TXD31
P3 4 /RXD31
Port 3
P3 3 /SCK 31
P3 2 /RESO*1
P3 1 /UD/EXCL*2
P3 0 /PWM
Notes: 1. The RESO function is not implemented in the H8/38327 Group and H8/38427 Group.
2. The EXCL function only applies to the H8/38327 Group and H8/38427 Group.
Figure 8.2 Port 3 Pin Configuration
8.3.2
Register Configuration and Description
Table 8.5 shows the port 3 register configuration.
Table 8.5
Port 3 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 3
PDR3
R/W
H'00
H'FFD6
Port control register 3
PCR3
W
H'00
H'FFE6
Port pull-up control register 3
PUCR3
R/W
H'00
H'FFE1
Port mode register 2
PMR2
R/W
H'58
H'FFC9
Port mode register 3
PMR3
R/W
H'04
H'FFCA
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Section 8 I/O Ports
1. Port Data Register 3 (PDR3)
Bit
7
6
5
4
3
2
1
0
P3 7
P36
P35
P34
P3 3
P32
P31
P3 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR3 is an 8-bit register that stores data for port 3 pins P37 to P30. If port 3 is read while PCR3
bits are set to 1, the values stored in PDR3 are read, regardless of the actual pin states. If port 3 is
read while PCR3 bits are cleared to 0, the pin states are read.
Upon reset, PDR3 is initialized to H'00.
2. Port Control Register 3 (PCR3)
Bit
7
6
5
4
3
2
1
0
PCR3 7
PCR3 6
PCR3 5
PCR34
PCR3 3
PCR3 2
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR3 is an 8-bit register for controlling whether each of the port 3 pins P37 to P30 functions as an
input pin or output pin. Setting a PCR3 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR3 and in PDR3 are valid only
when the corresponding pin is designated in PMR3 as a general I/O pin.
Upon reset, PCR3 is initialized to H'00.
PCR3 is a write-only register, which is always read as all 1s.
Rev. 6.00 Aug 04, 2006 page 204 of 626
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Section 8 I/O Ports
3. Port Pull-Up Control Register 3 (PUCR3)
Bit
7
6
5
4
3
2
0
1
PUCR37 PUCR36 PUCR3 5 PUCR34 PUCR3 3 PUCR3 2 PUCR31 PUCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR3 controls whether the MOS pull-up of each of the port 3 pins P37 to P30 is on or off. When
a PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR3 is initialized to H'00.
4. Port Mode Register 3 (PMR3)
Bit
7
6
5
4
3
2
1
0
AEVL
AEVH
WDCKS
NCS
IRQ0
RESO*
UD
PWM
Initial value
0
0
0
0
0
1
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: * The RESO bit is not implemented in the H8/38327 Group and H8/38427 Group.
PMR3 is an 8-bit read/write register, controlling the selection of pin functions for port 3 pins.
Upon reset, PMR3 is initialized to H'04.
Bit 7: P37/AEVL pin function switch (AEVL)
This bit selects whether pin P37/AEVL is used as P37 or as AEVL.
Bit 7
AEVL
Description
0
Functions as P37 I/O pin
1
Functions as AEVL input pin
(initial value)
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Section 8 I/O Ports
Bit 6: P36/AEVH pin function switch (AEVH)
This bit selects whether pin P36/AEVH is used as P36 or as AEVH.
Bit 6
AEVH
Description
0
Functions as P36 I/O pin
1
Functions as AEVH input pin
(initial value)
Bit 5: Watchdog timer source clock select (WDCKS)
This bit selects the watchdog timer source clock.
Bit 5
WDCKS
Description
0
φ/8192 selected
1
φw/32 selected
(initial value)
Bit 4: TMIG noise canceler select (NCS)
This bit controls the noise canceler for the input capture input signal (TMIG).
Bit 4
NCS
Description
0
Noise cancellation function not used
1
Noise cancellation function used
(initial value)
Bit 3: P43/IRQ0 pin function switch (IRQ0)
This bit selects whether pin P43/IRQ0 is used as P43 or as IRQ0.
Bit 3
IRQ0
Description
0
Functions as P43 input pin
1
Functions as IRQ0 input pin
Rev. 6.00 Aug 04, 2006 page 206 of 626
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(initial value)
Section 8 I/O Ports
Bit 2: P32/RESO pin function switch (RESO)
This bit selects whether pin P32/RESO is used as P32 or as RESO.
In the H8/38327 Group and H8/38427 Group these bits are reserved and cannot be written to.
Bit 2
RESO
Description
0
Functions as P32 I/O pin
1
Functions as RESO output pin
(initial value)
Bit 1: P31/UD pin function switch (SI1)
This bit selects whether pin P31/UD is used as P31 or as UD.
Bit 1
UD
Description
0
Functions as P31 I/O pin
1
Functions as UD input pin
(initial value)
Bit 0: P30/PWM pin function switch (PWM)
This bit selects whether pin P30/PWM is used as P30 or as PWM.
Bit 0
PWM
Description
0
Functions as P30 I/O pin
1
Functions as PWM output pin
(initial value)
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Section 8 I/O Ports
5. Port Mode Register 2 (PMR2)
Bit
7
6
5
4
3
2
1
0
EXCL
—
—
—
—
—
—
—
Initial value
0
1
0
1
1
0
0
0
Read/Write
R/W
R
R/W
R
R
R/W
R/W
R/W
PMR2 is an 8-bit read/write register that controls external clock input to pin P31.
Upon reset, PMR2 is initialized to H'58. The information on this register applies to the H8/38327
Group and H8/38427 Group.
Bit 7: P31/UD/EXCL pin function switch (EXCL)
This bit selects whether pin P31/UD/EXCL is used as P31/UD or as EXCL. When the pin is used
as EXCL an external clock should be input to it. See section 4, Clock Pulse Generators, for a
connection example.
Bit 7
EXCL
Description
0
Functions as P31/UD I/O pin
1
Functions as EXCL input pin
Bit 6: Reserved bit
Bit 6 is a reserved bit. It is always read as 1 and cannot be modified.
Bit 5: Reserved bit
Bit 5 is a readable/writable reserved bit.
Bits 4 and 3: Reserved bits
Bits 4 and 3 are reserved bits. They are always read as 1 and cannot be modified.
Bits 2 to 0: Reserved bits
Bits 2 to 0 are readable/writable reserved bits.
Rev. 6.00 Aug 04, 2006 page 208 of 626
REJ09B0144-0600
(initial value)
Section 8 I/O Ports
8.3.3
Pin Functions
Table 8.6 shows the port 3 pin functions.
Table 8.6
Port 3 Pin Functions
Pin
Pin Functions and Selection Method
P37/AEVL
The pin function depends on bit SO1 in PMR3 and bit PCR37 in PCR3.
AEVL
P36/AEVH
0
0
1
*
Pin function
P37 input pin
P37 output pin
AEVL input pin
The pin function depends on bit AEVH in PMR3 and bit PCR36 in PCR3.
AEVH
P35/TXD31
P34/RXD31
0
1
PCR36
0
1
*
Pin function
P36 input pin
P36 output pin
AEVH input pin
The pin function depends on bit TE31 in SCR3-1, bit SPC31 in SPCR, and bit
PCR35 in PCR3.
SPC31
0
1
TE31
0
1
PCR35
0
1
*
Pin function
P35 input pin
P35 output pin
TXD31 output pin
The pin function depends on bit RE31 in SCR3-1 and bit PCR34 in PCR3.
RE31
P33/SCK31
1
PCR37
0
1
PCR34
0
1
*
Pin function
P34 input pin
P34 output pin
RXD31 input pin
The pin function depends on bits CKE311, CKE310, and SMR31 in SCR3-1 and
bit PCR33 in PCR3.
CKE311
0
CKE310
0
COM31
PCR33
Pin function
1
0
0
1
1
1
*
*
*
*
P33 input pin P33 output pin SCK31 output
pin
*
SCK31 input
pin
Rev. 6.00 Aug 04, 2006 page 209 of 626
REJ09B0144-0600
Section 8 I/O Ports
Pin
Pin Functions and Selection Method
P32/RESO
(H8/3827R,
H8/3827S)
•
P32 (H8/38327,
H8/38427)
P31/UD
(H8/3827R,
H8/3827S)
H8/3827R Group and H8/3827S Group
The pin function depends on bit RESO in PMR3 and bit PCR32 in PCR3.
RESO
•
0
PCR32
0
1
*
Pin function
P32 input pin
P32 output pin
RESO output pin
H8/38327 Group and H8/38427 Group
The pin function depends on bit PCR32 in PCR3.
•
PCR32
0
1
Pin function
P32 input pin
P32 output pin
H8/3827R Group and H8/3827S Group
The pin function depends on bit UD in PMR3 and bit PCR31 in PCR3.
UD
0
Pin function
•
1
0
PCR31
P31/UD/EXCL
(H8/38327,
H8/38427)
1
*
P31 input pin P31 output pin UD input pin
H8/38327 Group and H8/38427 Group
The pin function depends on bit EXCL in PMR2, bit UD in PMR3, and bit
PCR31 in PCR3.
EXCL
0
UD
Pin function
1
0
PCR31
P30/PWM
1
1
0
1
*
*
*
P31 input pin P31 output pin UD input pin EXCL input pin
The pin function depends on bit PWM in PMR3 and bit PCR30 in PCR3.
PWM
0
1
PCR30
0
1
*
Pin function
P30 input pin
P30 output pin
PWM output pin
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 210 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.3.4
Pin States
Table 8.7 shows the port 3 pin states in each operating mode.
Table 8.7
Port 3 Pin States
Pins
Reset
Sleep
P37/AEVL
P36/AEVH
P35/TXD31
P34/RXD31
P33/SCK31
HighRetains
impedance previous
state
P32/RESO*2
RESO
output
P32*4
Pull-up
MOS on
Subsleep
Standby
Watch
Retains
previous
state
HighRetains
impedance*1 previous
state
Subactive
Active
Functional
Functional
HighP32*3
impedance
P31/UD*2
P31/UD/EXCL*3*4
P30/PWM
Notes: 1.
2.
3.
4.
8.3.5
A high-level signal is output when the MOS pull-up is in the on state.
Applies to H8/3827R Group and H8/3827S Group.
Applies to the mask ROM version of the H8/38327 Group and H8/38427 Group.
Applies to the F-ZTAT version of the H8/38327 Group and H8/38427 Group.
MOS Input Pull-Up
Port 3 has a built-in MOS input pull-up function that can be controlled by software. When a
PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for
that pin. The MOS pull-up function is in the off state after a reset.
PCR3n
0
0
1
PUCR3n
0
1
*
MOS input pull-up
Off
On
Off
(n = 7 to 0)
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 211 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.4
Port 4
8.4.1
Overview
Port 4 is a 3-bit I/O port and 1-bit input port, configured as shown in figure 8.3.
P4 3 /IRQ0
P4 2 /TXD32
Port 4
P4 1 /RXD32
P4 0 /SCK32
Figure 8.3 Port 4 Pin Configuration
8.4.2
Register Configuration and Description
Table 8.8 shows the port 4 register configuration.
Table 8.8
Port 4 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 4
PDR4
R/W
H'F8
H'FFD7
Port control register 4
PCR4
W
H'F8
H'FFE7
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Section 8 I/O Ports
1. Port Data Register 4 (PDR4)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
P43
P4 2
P4 1
P4 0
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
R
R/W
R/W
R/W
PDR4 is an 8-bit register that stores data for port 4 pins P42 to P40. If port 4 is read while PCR4
bits are set to 1, the values stored in PDR4 are read, regardless of the actual pin states. If port 4 is
read while PCR4 bits are cleared to 0, the pin states are read.
Upon reset, PDR4 is initialized to H'F8.
2. Port Control Register 4 (PCR4)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR42
PCR4 1
PCR4 0
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
PCR4 is an 8-bit register for controlling whether each of port 4 pins P42 to P40 functions as an
input pin or output pin. Setting a PCR4 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. PCR4 and PDR4 settings are valid when the
corresponding pins are designated for general-purpose input/output by SCR3-2.
Upon reset, PCR4 is initialized to H'F8.
PCR4 is a write-only register, which always reads all 1s.
Rev. 6.00 Aug 04, 2006 page 213 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.4.3
Pin Functions
Table 8.9 shows the port 4 pin functions.
Table 8.9
Port 4 Pin Functions
Pin
Pin Functions and Selection Method
P43/IRQ0
The pin function depends on bit IRQ0 in PMR3.
P42/TXD32
IRQ0
0
1
Pin function
P43 input pin
IRQ0 input pin
The pin function depends on bit TE32 in SCR3-2, bit SPC32 in SPCR, and bit
PCR42 in PCR4.
SPC32
0
TE32
P41/RXD32
0
1
PCR42
0
1
*
Pin function
P42 input pin
P42 output pin
TXD32 output pin
The pin function depends on bit RE32 in SCR3-2 and bit PCR41 in PCR4.
RE32
P40/SCK32
1
0
1
PCR41
0
1
*
Pin function
P41 input pin
P41 output pin
RXD32 input pin
The pin function depends on bit CKE321 and CKE320 in SCR3-2, bit COM32 in
SMR32, and bit PCR40 in PCR4.
CKE321
0
CKE320
0
COM32
1
0
PCR40
Pin function
1
0
1
1
*
*
P40 input pin P40 output pin SCK32 output
pin
*
*
*
SCK32 input
pin
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 214 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.4.4
Pin States
Table 8.10 shows the port 4 pin states in each operating mode.
Table 8.10 Port 4 Pin States
Pins
Reset
P43/IRQ0
P42/TXD32
P41/RXD32
P40/SCK32
HighRetains Retains
impedance previous previous
state
state
8.5
Port 5
8.5.1
Overview
Sleep
Subsleep Standby
Watch
Subactive Active
HighRetains Functional Functional
impedance previous
state
Port 5 is an 8-bit I/O port, configured as shown in figure 8.4.
P57/WKP7/SEG8
P56/WKP6/SEG7
P55/WKP5/SEG6
Port 5
P54/WKP4/SEG5
P53/WKP3/SEG4
P52/WKP2/SEG3
P51/WKP1/SEG2
P50/WKP0/SEG1
Figure 8.4 Port 5 Pin Configuration
Rev. 6.00 Aug 04, 2006 page 215 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.5.2
Register Configuration and Description
Table 8.11 shows the port 5 register configuration.
Table 8.11 Port 5 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 5
PDR5
R/W
H'00
H'FFD8
Port control register 5
PCR5
W
H'00
H'FFE8
Port pull-up control register 5
PUCR5
R/W
H'00
H'FFE2
Port mode register 5
PMR5
R/W
H'00
H'FFCC
1. Port Data Register 5 (PDR5)
Bit
7
6
5
4
3
2
1
0
P5 7
P5 6
P55
P5 4
P53
P52
P51
P5 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR5 is an 8-bit register that stores data for port 5 pins P57 to P50. If port 5 is read while PCR5
bits are set to 1, the values stored in PDR5 are read, regardless of the actual pin states. If port 5 is
read while PCR5 bits are cleared to 0, the pin states are read.
Upon reset, PDR5 is initialized to H'00.
2. Port Control Register 5 (PCR5)
Bit
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR5 is an 8-bit register for controlling whether each of the port 5 pins P57 to P50 functions as an
input pin or output pin. Setting a PCR5 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. PCR5 and PDR5 settings are valid when the
corresponding pins are designated for general-purpose input/output by PMR5 and bits SGS3 to
SGS0 in LPCR.
Upon reset, PCR5 is initialized to H'00.
Rev. 6.00 Aug 04, 2006 page 216 of 626
REJ09B0144-0600
Section 8 I/O Ports
PCR5 is a write-only register, which is always read as all 1s.
3. Port Pull-Up Control Register 5 (PUCR5)
Bit
7
6
5
4
3
2
1
0
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR5 controls whether the MOS pull-up of each of port 5 pins P57 to P50 is on or off. When a
PCR5 bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR5 is initialized to H'00.
4. Port Mode Register 5 (PMR5)
Bit
7
6
5
4
3
2
1
0
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR5 is an 8-bit read/write register, controlling the selection of pin functions for port 5 pins.
Upon reset, PMR5 is initialized to H'00.
Bit n: P5n/WKPn/SEGn+1 pin function switch (WKPn)
When pin P5n/WKPn/SEGn+1 is not used as SEGn+1, these bits select whether the pin is used as
P5n or WKPn.
Bit n
WKPn
Description
0
Functions as P5n I/O pin
1
Functions as WKPn input pin
(initial value)
(n = 7 to 0)
Note: For use as SEGn+1, see section 13.2.1, LCD Port Control Register (LPCR).
Rev. 6.00 Aug 04, 2006 page 217 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.5.3
Pin Functions
Table 8.12 shows the port 5 pin functions.
Table 8.12 Port 5 Pin Functions
Pin
Pin Functions and Selection Method
P57/WKP7/SEG8 The pin function depends on bit WKPn in PMR5, bit PCR5n in PCR5, and bits
SGS3 to SGS0 in LPCR.
to
P50/WKP0/SEG1
(n = 7 to 0)
SGS3 to SGS0
0***
WKPn
1***
0
PCR5n
Pin function
0
1
1
P5n input pin P5n output pin
*
*
*
WKPn input
pin
SEGn+1
output pin
*: Don’t care
8.5.4
Pin States
Table 8.13 shows the port 5 pin states in each operating mode.
Table 8.13 Port 5 Pin States
Pins
Reset
P57/WKP7/
SEG8 to P50/
WKP0/SEG1
HighRetains Retains
impedance previous previous
state
state
Note:
*
Sleep
Subsleep Standby
Watch
Subactive Active
HighRetains Functional Functional
impedance* previous
state
A high-level signal is output when the MOS pull-up is in the on state.
Rev. 6.00 Aug 04, 2006 page 218 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.5.5
MOS Input Pull-Up
Port 5 has a built-in MOS input pull-up function that can be controlled by software. When a
PCR5 bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for
that pin. The MOS pull-up function is in the off state after a reset.
PCR5n
0
0
1
PUCR5n
0
1
*
MOS input pull-up
Off
On
Off
(n = 7 to 0)
*: Don’t care
8.6
Port 6
8.6.1
Overview
Port 6 is an 8-bit I/O port. The port 6 pin configuration is shown in figure 8.5.
P67/SEG16
P66/SEG15
P65/SEG14
Port 6
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
Figure 8.5 Port 6 Pin Configuration
Rev. 6.00 Aug 04, 2006 page 219 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.6.2
Register Configuration and Description
Table 8.14 shows the port 6 register configuration.
Table 8.14 Port 6 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 6
PDR6
R/W
H'00
H'FFD9
Port control register 6
PCR6
W
H'00
H'FFE9
Port pull-up control register 6
PUCR6
R/W
H'00
H'FFE3
1. Port Data Register 6 (PDR6)
Bit
7
6
5
4
3
2
1
0
P6 7
P66
P65
P64
P6 3
P62
P61
P6 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR6 is an 8-bit register that stores data for port 6 pins P67 to P60.
If port 6 is read while PCR6 bits are set to 1, the values stored in PDR6 are read, regardless of the
actual pin states. If port 6 is read while PCR6 bits are cleared to 0, the pin states are read.
Upon reset, PDR6 is initialized to H'00.
2. Port Control Register 6 (PCR6)
Bit
7
6
5
4
3
2
1
0
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR6 is an 8-bit register for controlling whether each of the port 6 pins P67 to P60 functions as an
input pin or output pin.
Setting a PCR6 bit to 1 makes the corresponding pin (P67 to P60) an output pin, while clearing the
bit to 0 makes the pin an input pin. PCR6 and PDR6 settings are valid when the corresponding
pins are designated for general-purpose input/output by bits SGS3 to SGS0 in LPCR.
Upon reset, PCR6 is initialized to H'00.
Rev. 6.00 Aug 04, 2006 page 220 of 626
REJ09B0144-0600
Section 8 I/O Ports
PCR6 is a write-only register, which always reads all 1s.
3. Port Pull-Up Control Register 6 (PUCR6)
Bit
7
6
5
4
3
2
0
1
PUCR67 PUCR66 PUCR6 5 PUCR64 PUCR6 3 PUCR6 2 PUCR61 PUCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR6 controls whether the MOS pull-up of each of the port 6 pins P67 to P60 is on or off. When
a PCR6 bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the MOS pull-up for
the corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR6 is initialized to H'00.
8.6.3
Pin Functions
Table 8.15 shows the port 6 pin functions.
Table 8.15 Port 6 Pin Functions
Pin
Pin Functions and Selection Method
P67/SEG16 to
P60/SEG9
The pin function depends on bit PCR6n in PCR6 and bits SGS3 to SGS0 in
LPCR.
(n = 7 to 0)
SEG3 to SEGS0
00**, 010*
011**, 1***
PCR6n
0
1
*
Pin function
P6n input pin
P6n output pin
SEGn+9 output pin
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 221 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.6.4
Pin States
Table 8.16 shows the port 6 pin states in each operating mode.
Table 8.16 Port 6 Pin States
Pin
Reset
P67/SEG16 to
P60/SEG9
HighRetains Retains
impedance previous previous
state
state
Note:
*
8.6.5
Sleep
Subsleep Standby
Watch
Subactive Active
Retains Functional Functional
Highimpedance* previous
state
A high-level signal is output when the MOS pull-up is in the on state.
MOS Input Pull-Up
Port 6 has a built-in MOS pull-up function that can be controlled by software. When a PCR6 bit is
cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the MOS pull-up for that pin. The
MOS pull-up function is in the off state after a reset.
PCR6n
0
0
1
PUCR6n
0
1
*
MOS input pull-up
Off
On
Off
(n = 7 to 0)
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 222 of 626
REJ09B0144-0600
Section 8 I/O Ports
8.7
Port 7
8.7.1
Overview
Port 7 is a 8-bit I/O port, configured as shown in figure 8.6.
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
Port 7
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
Figure 8.6 Port 7 Pin Configuration
8.7.2
Register Configuration and Description
Table 8.17 shows the port 7 register configuration.
Table 8.17 Port 7 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 7
PDR7
R/W
H'00
H'FFDA
Port control register 7
PCR7
W
H'00
H'FFEA
Rev. 6.00 Aug 04, 2006 page 223 of 626
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Section 8 I/O Ports
1. Port Data Register 7 (PDR7)
Bit
7
6
5
4
3
2
1
0
P7 7
P7 6
P75
P7 4
P73
P72
P71
P70
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR7 is an 8-bit register that stores data for port 7 pins P77 to P70. If port 7 is read while PCR7
bits are set to 1, the values stored in PDR7 are read, regardless of the actual pin states. If port 7 is
read while PCR7 bits are cleared to 0, the pin states are read.
Upon reset, PDR7 is initialized to H'00.
2. Port Control Register 7 (PCR7)
Bit
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR7 is an 8-bit register for controlling whether each of the port 7 pins P77 to P70 functions as an
input pin or output pin. Setting a PCR7 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. PCR7 and PDR7 settings are valid when the
corresponding pins are designated for general-purpose input/output by bits SGS3 to SGS0 in
LPCR.
Upon reset, PCR7 is initialized to H'00.
PCR7 is a write-only register, which always reads as all 1s.
Rev. 6.00 Aug 04, 2006 page 224 of 626
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Section 8 I/O Ports
8.7.3
Pin Functions
Table 8.18 shows the port 7 pin functions.
Table 8.18 Port 7 Pin Functions
Pin
Pin Functions and Selection Method
P77/SEG24 to
P70/SEG17
The pin function depends on bit PCR7n in PCR7 and bits SGS3 to SGS0 in
LPCR.
(n = 7 to 0)
SEGS3 to SEGS0
00**
01**, 1***
PCR7n
0
1
*
Pin function
P7n input pin
P7n output pin
SEGn+17 output pin
*: Don’t care
8.7.4
Pin States
Table 8.19 shows the port 7 pin states in each operating mode.
Table 8.19 Port 7 Pin States
Pins
Reset
Sleep
Subsleep Standby
P77/SEG24 to
P70/SEG17
HighRetains Retains
impedance previous previous
state
state
Watch
Subactive Active
HighRetains Functional Functional
impedance previous
state
Rev. 6.00 Aug 04, 2006 page 225 of 626
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Section 8 I/O Ports
8.8
Port 8
8.8.1
Overview
Port 8 is an 8-bit I/O port configured as shown in figure 8.7.
P87/SEG32/CL1*
P86/SEG31/CL2*
P85/SEG30/DO*
P84/SEG29/M*
Port 8
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
Note: * The CL1, CL2, DO, and M functions are not implemented on the H8/38327 Group and
H8/38427 Group.
Figure 8.7 Port 8 Pin Configuration
8.8.2
Register Configuration and Description
Table 8.20 shows the port 8 register configuration.
Table 8.20 Port 8 Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register 8
PDR8
R/W
H'00
H'FFDB
Port control register 8
PCR8
W
H'00
H'FFEB
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Section 8 I/O Ports
1. Port Data Register 8 (PDR8)
Bit
7
6
5
4
3
2
1
0
P8 7
P8 6
P85
P8 4
P83
P82
P81
P8 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR8 is an 8-bit register that stores data for port 8 pins P87 to P80. If port 8 is read while PCR8
bits are set to 1, the values stored in PDR8 are read, regardless of the actual pin states. If port 8 is
read while PCR8 bits are cleared to 0, the pin states are read.
Upon reset, PDR8 is initialized to H'00.
2. Port Control Register 8 (PCR8)
Bit
7
6
5
4
3
2
1
0
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR8 is an 8-bit register for controlling whether each of the port 8 pins P87 to P80 functions as an
input or output pin. Setting a PCR8 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. PCR8 and PDR8 settings are valid when the
corresponding pins are designated for general-purpose input/output by bits SGS3 to SGS0 in
LPCR.
Upon reset, PCR8 is initialized to H'00.
PCR8 is a write-only register, which is always read as all 1s.
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Section 8 I/O Ports
8.8.3
Pin Functions
Table 8.21 shows the port 8 pin functions. The SGX = 0 setting also functions on the H8/38327
and H8/38427.
Table 8.21 Port 8 Pin Functions
Pin
Pin Functions and Selection Method
P87/SEG32/
CL1
The pin function depends on bit PCR87 in PCR8 and bits SGX and SGS3 to SGS0
in LPCR.
SEGS3 to SEGS0
000*
001*, 01**, 1***
0000
SGX
0
0
1
PCR87
0
1
*
*
Pin function
P87 input pin P87 output pin SEG32 output pin CL1 output pin
P86/SEG31/
CL2
The pin function depends on bit PCR86 in PCR8 and bits SGX and SGS3 to SGS0
in LPCR.
SEGS3 to SEGS0
000*
001*, 01**, 1***
0000
SGX
0
0
1
PCR86
0
1
*
*
Pin function
P86 input pin P86 output pin SEG31 output pin CL2 output pin
P85/SEG30/
DO
The pin function depends on bit PCR85 in PCR8 and bits SGX and SGS3 to SGS0
in LPCR.
SEGS3 to SEGS0
000*
001*, 01**, 1***
0000
SGX
0
0
1
PCR85
0
1
*
*
Pin function
P85 input pin P85 output pin SEG30 output pin D0 output pin
P84/SEG29/
M
The pin function depends on bit PCR84 in PCR8 and bits SGX and SGS3 to SGS0
in LPCR.
SEGS3 to SEGS0
000*
001*, 01**, 1***
0000
SGX
0
0
1
PCR84
0
1
*
*
Pin function
P84 input pin P84 output pin SEG29 output pin M output pin
P83/SEG28 to The pin function depends on bit PCR8n in PCR8 and bits SGS3 to SGS0 in LPCR.
P80/SEG25
(n = 3 to 0)
SEGS3 to SEGS0
000*
001*, 01**, 1***
PCR8n
0
1
*
Pin function
P8n input pin
P8n output pin
SEGn+25 output pin
*: Don’t care
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Section 8 I/O Ports
8.8.4
Pin States
Table 8.22 shows the port 8 pin states in each operating mode.
Table 8.22 Port 8 Pin States
Pins
Reset
P87/SEG32/CL1
P86/SEG31/CL2
P85/SEG30/DO
P84/SEG29/M
P83/SEG28 to
P80/SEG25
HighRetains Retains
impedance previous previous
state
state
8.9
Port A
8.9.1
Overview
Sleep
Subsleep Standby
Watch
Subactive Active
HighRetains Functional Functional
impedance previous
state
Port A is a 4-bit I/O port, configured as shown in figure 8.8.
PA3/COM4
Port A
PA2/COM3
PA1/COM2
PA0/COM1
Figure 8.8 Port A Pin Configuration
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Section 8 I/O Ports
8.9.2
Register Configuration and Description
Table 8.23 shows the port A register configuration.
Table 8.23 Port A Registers
Name
Abbr.
R/W
Initial Value
Address
Port data register A
PDRA
R/W
H'F0
H'FFDD
Port control register A
PCRA
W
H'F0
H'FFED
1. Port Data Register A (PDRA)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
PA 2
PA 1
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
PA 3
PA 0
PDRA is an 8-bit register that stores data for port A pins PA3 to PA0. If port A is read while
PCRA bits are set to 1, the values stored in PDRA are read, regardless of the actual pin states. If
port A is read while PCRA bits are cleared to 0, the pin states are read.
Upon reset, PDRA is initialized to H'F0.
2. Port Control Register A (PCRA)
Bit
7
6
5
4
—
—
—
—
3
PCRA 3
2
1
PCRA 2
PCRA 1
0
PCRA 0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
PCRA controls whether each of port A pins PA3 to PA0 functions as an input pin or output pin.
Setting a PCRA bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0
makes the pin an input pin. PCRA and PDRA settings are valid when the corresponding pins are
designated for general-purpose input/output by LPCR.
Upon reset, PCRA is initialized to H'F0.
PCRA is a write-only register, which always reads all 1s.
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Section 8 I/O Ports
8.9.3
Pin Functions
Table 8.24 shows the port A pin functions.
Table 8.24 Port A Pin Functions
Pin
Pin Functions and Selection Method
PA3/COM4
The pin function depends on bit PCRA3 in PCRA and bits SGS3 to SGS0.
PA2/COM3
SEGS3 to SEGS0
0000
0000
Not 0000
PCRA3
0
1
*
Pin function
PA3 input pin
PA3 output pin
COM4 output pin
The pin function depends on bit PCRA2 in PCRA and bits SGS3 to SGS0.
SEGS3 to SEGS0
PA1/COM2
PA0/COM1
0000
0000
Not 0000
PCRA2
0
1
*
Pin function
PA2 input pin
PA2 output pin
COM3 output pin
The pin function depends on bit PCRA1 in PCRA and bits SGS3 to SGS0.
SEGS3 to SEGS0
0000
0000
Not 0000
PCRA1
0
1
*
Pin function
PA1 input pin
PA1 output pin
COM2 output pin
The pin function depends on bit PCRA0 in PCRA and bits SGS3 to SGS0.
SEGS3 to SEGS0
0000
Not 0000
PCRA0
0
1
*
Pin function
PA0 input pin
PA0 output pin
COM1 output pin
*: Don’t care
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Section 8 I/O Ports
8.9.4
Pin States
Table 8.25 shows the port A pin states in each operating mode.
Table 8.25 Port A Pin States
Pins
Reset
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
HighRetains Retains
impedance previous previous
state
state
8.10
Port B
8.10.1
Overview
Sleep
Subsleep Standby
Watch
HighRetains Functional Functional
impedance previous
state
Port B is an 8-bit input-only port, configured as shown in figure 8.9.
PB7/AN7
PB6/AN6
PB5/AN5
Port B
PB4/AN4
PB3/AN3
PB2/AN2
PB1/AN1
PB0/AN0
Figure 8.9 Port B Pin Configuration
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Subactive Active
Section 8 I/O Ports
8.10.2
Register Configuration and Description
Table 8.26 shows the port B register configuration.
Table 8.26 Port B Register
Name
Abbr.
R/W
Address
Port data register B
PDRB
R
H'FFDE
Port Data Register B (PDRB)
Bit
7
6
5
4
3
2
1
0
PB 7
PB6
PB5
PB 4
PB3
PB2
PB1
PB 0
R
R
R
R
R
R
R
R
Read/Write
Reading PDRB always gives the pin states. However, if a port B pin is selected as an analog input
channel for the A/D converter by AMR bits CH3 to CH0, that pin reads 0 regardless of the input
voltage.
8.11
Input/Output Data Inversion Function
8.11.1
Overview
With input pins WKP0 to WKP7, RXD31, and RXD32, and output pins TXD31 and TXD32, the data
can be handled in inverted form.
SCINV0
SCINV2
RXD31
RXD32
P34/RXD31
P41/RXD32
SCINV1
SCINV3
P35/TXD31
P42/TXD32
TXD31
TXD32
Figure 8.10 Input/Output Data Inversion Function
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Section 8 I/O Ports
8.11.2
Register Configuration and Descriptions
Table 8.27 shows the registers used by the input/output data inversion function.
Table 8.27 Register Configuration
Name
Abbr.
R/W
Address
Serial port control register
SPCR
R/W
H'FF91
Serial Port Control Register (SPCR)
Bit
7
6
5
4
3
2
1
0
—
—
SPC32
SPC31
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
SCINV3 SCINV2 SCINV1 SCINV0
SPCR is an 8-bit readable/writable register that performs RXD31, RXD32, TXD31, and TXD32 pin
input/output data inversion switching. SPCR is initialized to H'C0 by a reset.
Bits 7 and 6: Reserved bits
Bits 7 and 6 are reserved; they are always read as 1 and cannot be modified.
Bit 5: P42/TXD32 pin function switch (SPC32)
This bit selects whether pin P42/TXD32 is used as P42 or as TXD32.
Bit 5
SPC32
Description
0
Functions as P42 I/O pin
1
Functions as TXD32 output pin*
Note:
*
Set the TE bit in SCR3 after setting this bit to 1.
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(initial value)
Section 8 I/O Ports
Bit 4: P35/TXD31 pin function switch (SPC31)
This bit selects whether pin P35/TXD31 is used as P35 or as TXD31.
Bit 4
SPC31
Description
0
Functions as P35 I/O pin
1
Functions as TXD31 output pin*
Note:
*
(initial value)
Set the TE bit in SCR3 after setting this bit to 1.
Bit 3: TXD32 pin output data inversion switch
Bit 3 specifies whether or not TXD32 pin output data is to be inverted.
Bit 3
SCINV3
Description
0
TXD32 output data is not inverted
1
TXD32 output data is inverted
(initial value)
Bit 2: RXD32 pin input data inversion switch
Bit 2 specifies whether or not RXD32 pin input data is to be inverted.
Bit 2
SCINV2
Description
0
RXD32 input data is not inverted
1
RXD32 input data is inverted
(initial value)
Bit 1: TXD31 pin output data inversion switch
Bit 1 specifies whether or not TXD31 pin output data is to be inverted.
Bit 1
SCINV1
Description
0
TXD31 output data is not inverted
1
TXD31 output data is inverted
(initial value)
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Section 8 I/O Ports
Bit 0: RXD31 pin input data inversion switch
Bit 0 specifies whether or not RXD31 pin input data is to be inverted.
Bit 0
SCINV0
Description
0
RXD31 input data is not inverted
1
RXD31 input data is inverted
8.11.3
(initial value)
Note on Modification of Serial Port Control Register
When a serial port control register is modified, the data being input or output up to that point is
inverted immediately after the modification, and an invalid data change is input or output. When
modifying a serial port control register, do so in a state in which data changes are invalidated.
8.12
Application Note
8.12.1
The Management of the Un-Use Terminal
If an I/O pin not used by the user system is floating, pull it up or down.
• If an unused pin is an input pin, handle it in one of the following ways:
 Pull it up to VCC with an on-chip pull-up MOS.
 Pull it up to VCC with an external resistor of approximately 100 kΩ.
 Pull it down to VSS with an external resistor of approximately 100 kΩ.
 For a pin also used by the A/D converter, pull it up to AVCC.
• If an unused pin is an output pin, handle it in one of the following ways:
 Set the output of the unused pin to high and pull it up to VCC with an external resistor of
approximately 100 kΩ.
 Set the output of the unused pin to low and pull it down to VSS with an external resistor of
approximately 100 kΩ.
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Section 9 Timers
Section 9 Timers
9.1
Overview
This LSI provides six timers: timers A, C, F, G, and a watchdog timer, and an asynchronous event
counter. The functions of these timers are outlined in table 9.1.
Table 9.1
Timer Functions
Name
Functions
Internal Clock
Timer A
• 8-bit interval timer
φ/8 to φ/8192
(8 choices)
• Interval function
Timer C
Event
Input Pin
Waveform
Output Pin Remarks
—
—
• Time base
φW /128 (choice of 4
overflow periods)
• Clock output
φ/4 to φ/32
φW , φW /4 to φW /32
(9 choices)
—
TMOW
• 8-bit timer
φ/4 to φ/8192, φW/4
(7 choices)
TMIC
—
φ/4 to φ/32, φW /4
(4 choices)
TMIF
TMOFL
TMOFH
φ/2 to φ/64, φW /4
(4 choices)
TMIG
—
• Interval function
• Event counting
function
Up-count/downcount
controllable by
software or
hardware
• Up-count/downcount selectable
Timer F
16-bit timer
Event counting
function Also usable
as two independent8bit timers Output
compare output
function
Timer G
• 8-bit timer
• Input capture
function
• Interval function
• Counter
clearing option
• Built-in capture
input signal
noise canceler
Rev. 6.00 Aug 04, 2006 page 237 of 626
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Section 9 Timers
Event
Input Pin
Waveform
Output Pin Remarks
Watchdog • Reset signal
φ/8192
timer
generated when8-bit φW /32
counter overflows
—
—
Asynchro- • 16-bit counter
nous
• Also usable as two
event
independent 8-bit
counter
counters
AEVL
AEVH
—
Name
Functions
Internal Clock
—
• Counts events
asynchronous to φ
and φw
9.2
Timer A
9.2.1
Overview
Timer A is an 8-bit timer with interval timing and real-time clock time-base functions. The clock
time-base function is available when a 32.768-kHz crystal oscillator is connected. A clock signal
divided from 32.768 kHz, from 38.4 kHz (if a 38.4 kHz crystal oscillator is connected), or from
the system clock, can be output at the TMOW pin.
1. Features
Features of timer A are given below.
• Choice of eight internal clock sources (φ/8192, φ/4096, φ/2048, φ/512, φ/256, φ/128, φ/32,
φ/8).
• Choice of four overflow periods (1 s, 0.5 s, 0.25 s, 31.25 ms) when timer A is used as a clock
time base (using a 32.768 kHz crystal oscillator).
• An interrupt is requested when the counter overflows.
• Any of nine clock signals can be output at the TMOW pin: 32.768 kHz divided by 32, 16, 8, or
4 (1 kHz, 2 kHz, 4 kHz, 8 kHz, 32,768 kHz) or 38.4 kHz divided by 32, 16, 8, or 4 (1.2 kHz,
2.4 kHz, 4.8 kHz, 9.6 kHz, 38.4 kHz), and the system clock divided by 32, 16, 8, or 4.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 9 Timers
2. Block Diagram
Figure 9.1 shows a block diagram of timer A.
CWORS
PSW
φ W/4
φW/32
φW/16
φW/8
φW/4
TMA
Internal data bus
1/4
φ W/128
φ
÷64*
φ/8192, φ/4096, φ/2048,
φ/512, φ/256, φ/128,
φ/32, φ/8
÷8*
φ/32
φ/16
φ/8
φ/4
÷256*
TCA
TMOW
÷128*
φW
PSS
IRRTA
Legend:
TMA:
TCA:
IRRTA:
PSW:
PSS:
CWOSR:
Timer mode register A
Timer counter A
Timer A overflow interrupt request flag
Prescaler W
Prescaler S
Subclock output select register
Note: * Can be selected only when the prescaler W output (φW/128) is used as the TCA input clock.
Figure 9.1 Block Diagram of Timer A
3. Pin Configuration
Table 9.2 shows the timer A pin configuration.
Table 9.2
Pin Configuration
Name
Abbr.
I/O
Function
Clock output
TMOW
Output
Output of waveform generated by timer A output circuit
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Section 9 Timers
4. Register Configuration
Table 9.3 shows the register configuration of timer A.
Table 9.3
Timer A Registers
Name
Abbr.
R/W
Initial Value
Address
Timer mode register A
TMA
R/W
H'10
H'FFB0
Timer counter A
TCA
R
H'00
H'FFB1
Clock stop register 1
CKSTPR1
R/W
H'FF
H'FFFA
Subclock output select register
CWOSR
R/W
H'FE
H'FF92
9.2.2
Register Descriptions
1. Timer Mode Register A (TMA)
Bit
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
TMA is an 8-bit read/write register for selecting the prescaler, input clock, and output clock.
Upon reset, TMA is initialized to H'10.
Rev. 6.00 Aug 04, 2006 page 240 of 626
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Section 9 Timers
Bits 7 to 5: Clock output select (TMA7 to TMA5)
Bits 7 to 5 choose which of eight clock signals is output at the TMOW pin. The system clock
divided by 32, 16, 8, or 4 can be output in active mode and sleep mode. A 32.768 kHz or 38.4
kHz signal divided by 32, 16, 8, or 4 can be output in active mode, sleep mode, and subactive
mode. φw is output in all modes except the reset state.
CWOSR
TMA
CWOS
Bit 7
TMA7
Bit 6
TMA6
Bit 5
TMA5
Clock Output
0
0
0
0
φ/32
1
φ/16
0
φ/8
1
φ/4
0
φw/32
1
φw/16
0
φw/8
1
φw/4
*
φw
1
1
0
1
1
*
*
(initial value)
*: Don’t care
Bit 4: Reserved bit
Bit 4 is reserved; it is always read as 1, and cannot be modified.
Rev. 6.00 Aug 04, 2006 page 241 of 626
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Section 9 Timers
Bits 3 to 0: Internal clock select (TMA3 to TMA0)
Bits 3 to 0 select the clock input to TCA. The selection is made as follows.
Description
Bit 3
TMA3
Bit 2
TMA2
Bit 1
TMA1
Bit 0
TMA0
Prescaler and Divider Ratio
or Overflow Period
0
0
0
0
PSS, φ/8192
1
PSS, φ/4096
1
0
PSS, φ/2048
1
PSS, φ/512
0
0
PSS, φ/256
1
PSS, φ/128
0
PSS, φ/32
1
PSS, φ/8
0
PSW, 1 s
1
PSW, 0.5 s
0
PSW, 0.25 s
1
PSW, 0.03125 s
0
PSW and TCA are reset
1
1
1
0
0
1
1
0
1
1
0
1
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Function
(initial value) Interval timer
Clock time base
(when using
32.768 kHz)
Section 9 Timers
2. Timer Counter A (TCA)
Bit
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCA is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMA3 to TMA0 in timer mode register A
(TMA). TCA values can be read by the CPU in active mode, but cannot be read in subactive
mode. When TCA overflows, the IRRTA bit in interrupt request register 1 (IRR1) is set to 1.
TCA is cleared by setting bits TMA3 and TMA2 of TMA to 11.
Upon reset, TCA is initialized to H'00.
3. Clock Stop Register 1 (CKSTPR1)
Bit
7
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to timer A is described here. For details of the other bits, see the
sections on the relevant modules.
Bit 0: Timer A module standby mode control (TACKSTP)
Bit 0 controls setting and clearing of module standby mode for timer A.
TACKSTP
Description
0
Timer A is set to module standby mode
1
Timer A module standby mode is cleared
(initial value)
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Section 9 Timers
4. Subclock Output Select Register (CWOSR)
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
CWOS
Initial value
1
1
1
1
1
1
1
0
Read/Write
R
R
R
R
R
R
R
R/W
Bit
CWOSR is an 8-bit read/write register that selects the clock to be output from the TMOW pin.
CWOSR is initialized to H'FE by a reset.
Bits 7 to 1: Reserved bits
Bits 7 to 1 are reserved; they are always read as 1 and cannot be modified.
Bit 0: TMOW pin clock select (CWOS)
Bit 0 selects the clock to be output from the TMOW pin.
Bit 0
CWOS
Description
0
Clock output from timer A is output (see TMA)
1
φw is output
Rev. 6.00 Aug 04, 2006 page 244 of 626
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(initial value)
Section 9 Timers
9.2.3
Timer Operation
1. Interval Timer Operation
When bit TMA3 in timer mode register A (TMA) is cleared to 0, timer A functions as an 8-bit
interval timer.
Upon reset, TCA is cleared to H'00 and bit TMA3 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer A is selected by bits TMA2 to TMA0 in
TMA; any of eight internal clock signals output by prescaler S can be selected.
After the count value in TCA reaches H'FF, the next clock signal input causes timer A to
overflow, setting bit IRRTA to 1 in interrupt request register 1 (IRR1). If IENTA = 1 in interrupt
enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCA returns to H'00 and starts counting up again. In this mode timer A functions as
an interval timer that generates an overflow output at intervals of 256 input clock pulses.
Note: * For details on interrupts, see section 3.3, Interrupts.
2. Real-Time Clock Time Base Operation
When bit TMA3 in TMA is set to 1, timer A functions as a real-time clock time base by counting
clock signals output by prescaler W. The overflow period of timer A is set by bits TMA1 and
TMA0 in TMA. A choice of four periods is available. In time base operation (TMA3 = 1), setting
bit TMA2 to 1 clears both TCA and prescaler W to their initial values of H'00.
3. Clock Output
Setting bit TMOW in port mode register 1 (PMR1) to 1 causes a clock signal to be output at pin
TMOW. Nine different clock output signals can be selected by means of bits TMA7 to TMA5 in
TMA and bit CWOS in CWOSR. The system clock divided by 32, 16, 8, or 4 can be output in
active mode and sleep mode. A 32.768 kHz or 38.4 kHz signal divided by 32, 16, 8, or 4 can be
output in active mode, sleep mode, watch mode, subactive mode, and subsleep mode. The 32.768
kHz or 38.4 kHz clock is output in all modes except the reset state.
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Section 9 Timers
9.2.4
Timer A Operation States
Table 9.4 summarizes the timer A operation states.
Table 9.4
Timer A Operation States
Watch
Subactive
Subsleep
Standby
Module
Standby
Functions Functions Halted
Halted
Halted
Halted
Halted
Functions Functions Functions Functions Functions Halted
Halted
Functions Retained
Retained
Operation Mode
Reset Active
TCA Interval
Reset
Clock time base Reset
TMA CWOSR
Reset
Sleep
Retained
Functions Retained
Retained
Note: When the real-time clock time base function is selected as the internal clock of TCA in
active mode or sleep mode, the internal clock is not synchronous with the system clock, so
it is synchronized by a synchronizing circuit. This may result in a maximum error of 1/φ (s) in
the count cycle.
9.2.5
Application Note
When bit 0 (TACKSTP) of the clock stop register 1 (CKSTPR1) is cleared to 0, bit 3 (TMA3) of
the timer mode register A (TMA) cannot be rewritten.
Set bit 0 (TACKSTP) of the clock stop register 1 (CKSTPR1) to 1 before rewriting bit 3 (TMA3)
of the timer mode register A (TMA).
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Section 9 Timers
9.3
Timer C
9.3.1
Overview
Timer C is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operation modes, interval and auto reload.
1. Features
Features of timer C are given below.
• Choice of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/64, φ/16, φ/4, φw/4) or an
external clock (can be used to count external events).
• An interrupt is requested when the counter overflows.
• Up/down-counter switching is possible by hardware or software.
• Subactive mode and subsleep mode operation is possible when φw/4 is selected as the internal
clock, or when an external clock is selected.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 9 Timers
2. Block Diagram
Figure 9.2 shows a block diagram of timer C.
UD
φ
TCC
PSS
Internal data bus
TMC
TMIC
TLC
φW/4
IRRTC
Legend:
TMC: Timer mode register C
TCC: Timer counter C
Timer load register C
TLC:
IRRTC: Timer C overflow interrupt request flag
PSS: Prescaler S
Figure 9.2 Block Diagram of Timer C
3. Pin Configuration
Table 9.5 shows the timer C pin configuration.
Table 9.5
Pin Configuration
Name
Abbr.
I/O
Function
Timer C event input
TMIC
Input
Input pin for event input to TCC
Timer C up/down-count selection
UD
Input
Timer C up/down select
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Section 9 Timers
4. Register Configuration
Table 9.6 shows the register configuration of timer C.
Table 9.6
Timer C Registers
Name
Abbr.
R/W
Initial Value
Address
Timer mode register C
TMC
R/W
H'18
H'FFB4
Timer counter C
TCC
R
H'00
H'FFB5
Timer load register C
TLC
W
H'00
H'FFB5
Clock stop register 1
CKSTPR1
R/W
H'FF
H'FFFA
9.3.2
Register Descriptions
1. Timer Mode Register C (TMC)
Bit
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
TMC is an 8-bit read/write register for selecting the auto-reload function and input clock, and
performing up/down-counter control.
Upon reset, TMC is initialized to H'18.
Bit 7: Auto-reload function select (TMC7)
Bit 7 selects whether timer C is used as an interval timer or auto-reload timer.
Bit 7
TMC7
Description
0
Interval timer function selected
1
Auto-reload function selected
(initial value)
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Section 9 Timers
Bits 6 and 5: Counter up/down control (TMC6, TMC5)
Selects whether TCC up/down control is performed by hardware using UD pin input, or whether
TCC functions as an up-counter or a down-counter.
Bit 6
TMC6
Bit 5
TMC5
Description
0
0
TCC is an up-counter
0
1
TCC is a down-counter
1
*
Hardware control by UD pin input
UD pin input high: Down-counter
UD pin input low: Up-counter
(initial value)
*: Don’t care
Bits 4 and 3: Reserved bits
Bits 4 and 3 are reserved; they are always read as 1 and cannot be modified.
Bits 2 to 0: Clock select (TMC2 to TMC0)
Bits 2 to 0 select the clock input to TCC. For external event counting, either the rising or falling
edge can be selected.
Bit 2
TMC2
Bit 1
TMC1
Bit 0
TMC0
Description
0
0
0
Internal clock: φ/8192
0
0
1
Internal clock: φ/2048
0
1
0
Internal clock: φ/512
0
1
1
Internal clock: φ/64
1
0
0
Internal clock: φ/16
1
0
1
Internal clock: φ/4
1
1
0
Internal clock: φw/4
1
1
1
External event (TMIC): rising or falling edge*
Note:
*
(initial value)
The edge of the external event signal is selected by bit IEG1 in the IRQ edge select
register (IEGR). See 1. IRQ edge select register (IEGR) in 3.3.2 for details. IRQ1 must
be set to 1 in port mode register 1 (PMR1) before setting 111 in bits TMC2 to TMC0.
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Section 9 Timers
2. Timer Counter C (TCC)
Bit
7
6
5
4
3
2
1
0
TCC7
TCC6
TCC5
TCC4
TCC3
TCC2
TCC1
TCC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCC is an 8-bit read-only up-counter, which is incremented by internal clock or external event
input. The clock source for input to this counter is selected by bits TMC2 to TMC0 in timer mode
register C (TMC). TCC values can be read by the CPU at any time.
When TCC overflows from H'FF to H'00 or to the value set in TLC, or underflows from H'00 to
H'FF or to the value set in TLC, the IRRTC bit in IRR2 is set to 1.
TCC is allocated to the same address as TLC.
Upon reset, TCC is initialized to H'00.
3. Timer Load Register C (TLC)
Bit
7
6
5
4
3
2
1
0
TLC7
TLC6
TLC5
TLC4
TLC3
TLC2
TLC1
TLC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
TLC is an 8-bit write-only register for setting the reload value of timer counter C (TCC).
When a reload value is set in TLC, the same value is loaded into timer counter C as well, and TCC
starts counting up from that value. When TCC overflows or underflows during operation in autoreload mode, the TLC value is loaded into TCC. Accordingly, overflow/underflow periods can be
set within the range of 1 to 256 input clocks.
The same address is allocated to TLC as to TCC.
Upon reset, TLC is initialized to H'00.
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Section 9 Timers
4. Clock Stop Register 1 (CKSTPR1)
7
Bit
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to timer C is described here. For details of the other bits, see the
sections on the relevant modules.
Bit 1: Timer C module standby mode control (TCCKSTP)
Bit 1 controls setting and clearing of module standby mode for timer C.
TCCKSTP
Description
0
Timer C is set to module standby mode
1
Timer C module standby mode is cleared
9.3.3
(initial value)
Timer Operation
1. Interval Timer Operation
When bit TMC7 in timer mode register C (TMC) is cleared to 0, timer C functions as an 8-bit
interval timer.
Upon reset, TCC is initialized to H'00 and TMC to H'18, so TCC continues up-counting as an
interval up-counter without halting immediately after a reset. The timer C operating clock is
selected from seven internal clock signals output by prescalers S and W, or an external clock input
at pin TMIC. The selection is made by bits TMC2 to TMC0 in TMC.
TCC up/down-count control can be performed either by software or hardware. The selection is
made by bits TMC6 and TMC5 in TMC.
After the count value in TCC reaches H'FF (H'00), the next clock input causes timer C to overflow
(underflow), setting bit IRRTC to 1 in IRR2. If IENTC = 1 in interrupt enable register 2 (IENR2),
a CPU interrupt is requested.
At overflow (underflow), TCC returns to H'00 (H'FF) and starts counting up (down) again.
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Section 9 Timers
During interval timer operation (TMC7 = 0), when a value is set in timer load register C (TLC),
the same value is set in TCC.
Note: For details on interrupts, see section 3.3, Interrupts.
2. Auto-Reload Timer Operation
Setting bit TMC7 in TMC to 1 causes timer C to function as an 8-bit auto-reload timer. When a
reload value is set in TLC, the same value is loaded into TCC, becoming the value from which
TCC starts its count.
After the count value in TCC reaches H'FF (H'00), the next clock signal input causes timer C to
overflow/underflow. The TLC value is then loaded into TCC, and the count continues from that
value. The overflow/underflow period can be set within a range from 1 to 256 input clocks,
depending on the TLC value.
The clock sources, up/down control, and interrupts in auto-reload mode are the same as in interval
mode.
In auto-reload mode (TMC7 = 1), when a new value is set in TLC, the TLC value is also set in
TCC.
3. Event Counter Operation
Timer C can operate as an event counter, counting rising or falling edges of an external event
signal input at pin TMIC. External event counting is selected by setting bits TMC2 to TMC0 in
timer mode register C to all 1s (111).
When timer C is used to count external event input, bit IRQ1 in PMR1 should be set to 1 and bit
IEN1 in IENR1 cleared to 0 to disable interrupt IRQ1 requests.
4. TCC Up/Down Control by Hardware
With timer C, TCC up/down control can be performed by UD pin input. When bit TMC6 is set to
1 in TMC, TCC functions as an up-counter when UD pin input is high, and as a down-counter
when low.
When using UD pin input, set bit UD to 1 in PMR3.
Rev. 6.00 Aug 04, 2006 page 253 of 626
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Section 9 Timers
9.3.4
Timer C Operation States
Table 9.7 summarizes the timer C operation states.
Table 9.7
Timer C Operation States
TCC Interval
Reset
Functions Functions Halted
Functions/ Functions/ Halted
Halted*
Halted*
Halted
Reset
Functions Functions Halted
Functions/ Functions/ Halted
Halted*
Halted*
Halted
Reset
Functions Retained
Functions Retained
Retained
Note:
*
Retained
Standby
Module
Standby
Active
TMC
Watch
Sub-sleep
Reset
Auto reload
Sleep
Subactive
Operation Mode
Retained
When φw/4 is selected as the TCC internal clock in active mode or sleep mode, since
the system clock and internal clock are mutually asynchronous, synchronization is
maintained by a synchronization circuit. This results in a maximum count cycle error of
1/φ (s). When the counter is operated in subactive mode or subsleep mode, either
select φw/4 as the internal clock or select an external clock. The counter will not
operate on any other internal clock. If φw/4 is selected as the internal clock for the
counter when φw/8 has been selected as subclock φSUB, the lower 2 bits of the counter
operate on the same cycle, and the operation of the least significant bit is unrelated to
the operation of the counter.
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Section 9 Timers
9.3.5
Usage Note
Note the following regarding the operation of timer C.
(1) Counting errors caused by external event input
Timer counter errors may occur under the following conditions.
Conditions
•
An external event (TMIC) is used in subsleep mode.
Symptom
•
The counter increments or decrements twice for a single external event input.
Approximate rate of occurrence
The approximate rate of occurrence in cases where the external event input is not
synchronized with internal operation is defined by the following equation.
Approximate rate of occurrence P = 30 ns / tsubcyc
For example, if tsubcyc = 61.06 µs (subclock φw/2), P = 0.0005 (0.05%). If 2,000 external
event inputs occur, there is a likelihood that one of them will cause the counter to
increment or decrement twice (+2 or –2).
The symptom described is caused by the internal circuit configuration of the device and
therefore difficult to avoid. Therefore, it is not advisable to use the clock counter for
applications requiring a high degree of accuracy.
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Section 9 Timers
9.4
Timer F
9.4.1
Overview
Timer F is a 16-bit timer with a built-in output compare function. As well as counting external
events, timer F also provides for counter resetting, interrupt request generation, toggle output, etc.,
using compare match signals. Timer F can also be used as two independent 8-bit timers (timer FH
and timer FL).
1. Features
Features of timer F are given below.
• Choice of four internal clock sources (φ/32, φ/16, φ/4, φw/4) or an external clock (can be used
as an external event counter)
• TMOFH pin (TMOFL pin) toggle output provided using a single compare match signal (toggle
output initial value can be set)
• Counter resetting by a compare match signal
• Two interrupt sources: one compare match, one overflow
• Can operate as two independent 8-bit timers (timer FH and timer FL) (in 8-bit mode).
Timer FH 8-Bit Timer*
Timer FL
8-Bit Timer/Event Counter
Internal clock
Choice of 4 (φ/32, φ/16, φ/4, φw/4)
Event input
—
TMIF pin
Toggle output
One compare match signal, output to
TMOFH pin(initial value settable)
One compare match signal, output to
TMOFL pin (initial value settable)
Counter reset
Counter can be reset by compare match signal
Interrupt sources
One compare match
One overflow
Note:
*
When timer F operates as a 16-bit timer, it operates on the timer FL overflow signal.
• Operation in watch mode, subactive mode, and subsleep mode
When φw/4 is selected as the internal clock, timer F can operate in watch mode, subactive
mode, and subsleep mode.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 9 Timers
2. Block Diagram
Figure 9.3 shows a block diagram of timer F.
φ
PSS
IRRTFL
TCRF
φw/4
TMIF
TCFL
Toggle
circuit
Comparator
Internal data bus
TMOFL
OCRFL
TCFH
TMOFH
Toggle
circuit
Comparator
Match
OCRFH
TCSRF
Legend:
TCRF:
TCSRF:
TCFH:
TCFL:
OCRFH:
OCRFL:
IRRTFH:
IRRTFL:
PSS:
IRRTFH
Timer control register F
Timer control/status register F
8-bit timer counter FH
8-bit timer counter FL
Output compare register FH
Output compare register FL
Timer FH interrupt request flag
Timer FL interrupt request flag
Prescaler S
Figure 9.3 Block Diagram of Timer F
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Section 9 Timers
3. Pin Configuration
Table 9.8 shows the timer F pin configuration.
Table 9.8
Pin Configuration
Name
Abbr.
I/O
Function
Timer F event input
TMIF
Input
Event input pin for input to TCFL
Timer FH output
TMOFH
Output
Timer FH toggle output pin
Timer FL output
TMOFL
Output
Timer FL toggle output pin
4. Register Configuration
Table 9.9 shows the register configuration of timer F.
Table 9.9
Timer F Registers
Name
Abbr.
R/W
Initial Value
Address
Timer control register F
TCRF
W
H'00
H'FFB6
Timer control/status register F
TCSRF
R/W
H'00
H'FFB7
8-bit timer counter FH
TCFH
R/W
H'00
H'FFB8
8-bit timer counter FL
TCFL
R/W
H'00
H'FFB9
Output compare register FH
OCRFH
R/W
H'FF
H'FFBA
Output compare register FL
OCRFL
R/W
H'FF
H'FFBB
Clock stop register 1
CKSTPR1
R/W
H'FF
H'FFFA
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Section 9 Timers
9.4.2
Register Descriptions
1. 16-bit Timer Counter (TCF)
8-bit Timer Counter (TCFH)
8-bit Timer Counter (TCFL)
TCF
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCFH
TCFL
TCF is a 16-bit read/write up-counter configured by cascaded connection of 8-bit timer counters
TCFH and TCFL. In addition to the use of TCF as a 16-bit counter with TCFH as the upper 8 bits
and TCFL as the lower 8 bits, TCFH and TCFL can also be used as independent 8-bit counters.
TCFH and TCFL can be read and written by the CPU, but when they are used in 16-bit mode, data
transfer to and from the CPU is performed via a temporary register (TEMP). For details of TEMP,
see section 9.4.3, CPU Interface.
TCFH and TCFL are each initialized to H'00 upon reset.
a. 16-bit mode (TCF)
When CKSH2 is cleared to 0 in TCRF, TCF operates as a 16-bit counter. The TCF input clock
is selected by bits CKSL2 to CKSL0 in TCRF.
TCF can be cleared in the event of a compare match by means of CCLRH in TCSRF.
When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in
TCSRF is 1 at this time, IRRTFH is set to 1 in IRR2, and if IENTFH in IENR2 is 1, an
interrupt request is sent to the CPU.
b. 8-bit mode (TCFL/TCFH)
When CKSH2 is set to 1 in TCRF, TCFH and TCFL operate as two independent 8-bit
counters. The TCFH (TCFL) input clock is selected by bits CKSH2 to CKSH0 (CKSL2 to
CKSL0) in TCRF.
TCFH (TCFL) can be cleared in the event of a compare match by means of CCLRH (CCLRL)
in TCSRF.
When TCFH (TCFL) overflows from H'FF to H'00, OVFH (OVFL) is set to 1 in TCSRF. If
OVIEH (OVIEL) in TCSRF is 1 at this time, IRRTFH (IRRTFL) is set to 1 in IRR2, and if
IENTFH (IENTFL) in IENR2 is 1, an interrupt request is sent to the CPU.
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Section 9 Timers
2. 16-bit Output Compare Register (OCRF)
8-bit Output Compare Register (OCRFH)
8-bit Output Compare Register (OCRFL)
OCRF
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
OCRFH
OCRFL
OCRF is a 16-bit read/write register composed of the two registers OCRFH and OCRFL. In
addition to the use of OCRF as a 16-bit register with OCRFH as the upper 8 bits and OCRFL as
the lower 8 bits, OCRFH and OCRFL can also be used as independent 8-bit registers.
OCRFH and OCRFL can be read and written by the CPU, but when they are used in 16-bit mode,
data transfer to and from the CPU is performed via a temporary register (TEMP). For details of
TEMP, see section 9.4.3, CPU Interface.
OCRFH and OCRFL are each initialized to H'FF upon reset.
a. 16-bit mode (OCRF)
When CKSH2 is cleared to 0 in TCRF, OCRF operates as a 16-bit register. OCRF contents
are constantly compared with TCF, and when both values match, CMFH is set to 1 in TCSRF.
At the same time, IRRTFH is set to 1 in IRR2. If IENTFH in IENR2 is 1 at this time, an
interrupt request is sent to the CPU.
Toggle output can be provided from the TMOFH pin by means of compare matches, and the
output level can be set (high or low) by means of TOLH in TCRF.
b. 8-bit mode (OCRFH/OCRFL)
When CKSH2 is set to 1 in TCRF, OCRFH and OCRFL operate as two independent 8-bit
registers. OCRFH contents are compared with TCFH, and OCRFL contents are with TCFL.
When the OCRFH (OCRFL) and TCFH (TCFL) values match, CMFH (CMFL) is set to 1 in
TCSRF. At the same time, IRRTFH (IRRTFL) is set to 1 in IRR2. If IENTFH (IENTFL) in
IENR2 is 1 at this time, an interrupt request is sent to the CPU.
Toggle output can be provided from the TMOFH pin (TMOFL pin) by means of compare
matches, and the output level can be set (high or low) by means of TOLH (TOLL) in TCRF.
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Section 9 Timers
3. Timer Control Register F (TCRF)
Bit
7
6
5
4
3
2
1
0
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
TCRF is an 8-bit write-only register that switches between 16-bit mode and 8-bit mode, selects the
input clock from among four internal clock sources or external event input, and sets the output
level of the TMOFH and TMOFL pins.
TCRF is initialized to H'00 upon reset.
Bit 7: Toggle output level H (TOLH)
Bit 7 sets the TMOFH pin output level. The output level is effective immediately after this bit is
written.
Bit 7
TOLH
Description
0
Low level
1
High level
(initial value)
Bits 6 to 4: Clock select H (CKSH2 to CKSH0)
Bits 6 to 4 select the clock input to TCFH from among four internal clock sources or TCFL
overflow.
Bit 6
CKSH2
Bit 5
CKSH1
Bit 4
CKSH0
Description
0
0
0
16-bit mode, counting on TCFL overflow signal
0
0
1
0
1
0
0
1
1
Use prohibited
1
0
0
Internal clock: Counting on φ/32
1
0
1
Internal clock: Counting on φ/16
1
1
0
Internal clock: Counting on φ/4
1
1
1
Internal clock: Counting on φw/4
(initial value)
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Section 9 Timers
Bit 3: Toggle output level L (TOLL)
Bit 3 sets the TMOFL pin output level. The output level is effective immediately after this bit is
written.
Bit 3
TOLL
Description
0
Low level
1
High level
(initial value)
Bits 2 to 0: Clock select L (CKSL2 to CKSL0)
Bits 2 to 0 select the clock input to TCFL from among four internal clock sources or external
event input.
Bit 2
CKSL2
Bit 1
CKSL1
Bit 0
CKSL0
0
0
0
0
0
1
0
1
0
0
1
1
Use prohibited
1
0
0
Internal clock: Counting on φ/32
1
0
1
Internal clock: Counting on φ/16
1
1
0
Internal clock: Counting on φ/4
1
1
1
Internal clock: Counting on φw/4
Note:
*
Description
Counting on external event (TMIF) rising/falling edge*
(initial value)
External event edge selection is set by IEG3 in the IRQ edge select register (IEGR).
For details, see 1. IRQ edge select register (IEGR) in section 3.3.2.
Note that the timer F counter may increment if the setting of IRQ3 in port mode register
1 (PMR1) is changed from 0 to 1 while the TMIF pin is low in order to change the TMIF
pin function.
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Section 9 Timers
4. Timer Control/Status Register F (TCSRF)
Bit
Initial value
Read/Write
Note: *
7
6
5
4
3
2
1
0
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
0
R/W*
0
R/W*
0
0
0
R/W*
0
R/W
0
R/W*
0
R/W
R/W
R/W
Bits 7, 6, 3, and 2 can only be written with 0, for flag clearing.
TCSRF is an 8-bit read/write register that performs counter clear selection, overflow flag setting,
and compare match flag setting, and controls enabling of overflow interrupt requests.
TCSRF is initialized to H'00 upon reset.
Bit 7: Timer overflow flag H (OVFH)
Bit 7 is a status flag indicating that TCFH has overflowed from H'FF to H'00. This flag is set by
hardware and cleared by software. It cannot be set by software.
Bit 7
OVFH
Description
0
Clearing condition:
After reading OVFH = 1, cleared by writing 0 to OVFH
1
Setting condition:
Set when TCFH overflows from H’FF to H’00
(initial value)
Bit 6: Compare match flag H (CMFH)
Bit 6 is a status flag indicating that TCFH has matched OCRFH. This flag is set by hardware and
cleared by software. It cannot be set by software.
Bit 6
CMFH
Description
0
Clearing condition:
After reading CMFH = 1, cleared by writing 0 to CMFH
1
Setting condition:
Set when the TCFH value matches the OCRFH value
(initial value)
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Section 9 Timers
Bit 5: Timer overflow interrupt enable H (OVIEH)
Bit 5 selects enabling or disabling of interrupt generation when TCFH overflows.
Bit 5
OVIEH
Description
0
TCFH overflow interrupt request is disabled
1
TCFH overflow interrupt request is enabled
(initial value)
Bit 4: Counter clear H (CCLRH)
In 16-bit mode, bit 4 selects whether TCF is cleared when TCF and OCRF match.
In 8-bit mode, bit 4 selects whether TCFH is cleared when TCFH and OCRFH match.
Bit 4
CCLRH
Description
0
16-bit mode: TCF clearing by compare match is disabled
8-bit mode: TCFH clearing by compare match is disabled
1
(initial value)
16-bit mode: TCF clearing by compare match is enabled
8-bit mode: TCFH clearing by compare match is enabled
Bit 3: Timer overflow flag L (OVFL)
Bit 3 is a status flag indicating that TCFL has overflowed from H'FF to H'00. This flag is set by
hardware and cleared by software. It cannot be set by software.
Bit 3
OVFL
Description
0
Clearing condition:
After reading OVFL = 1, cleared by writing 0 to OVFL
1
Setting condition:
Set when TCFL overflows from H’FF to H’00
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(initial value)
Section 9 Timers
Bit 2: Compare match flag L (CMFL)
Bit 2 is a status flag indicating that TCFL has matched OCRFL. This flag is set by hardware and
cleared by software. It cannot be set by software.
Bit 2
CMFL
Description
0
Clearing condition:
(initial value)
After reading CMFL = 1, cleared by writing 0 to CMFL
1
Setting condition:
Set when the TCFL value matches the OCRFL value
Bit 1: Timer overflow interrupt enable L (OVIEL)
Bit 1 selects enabling or disabling of interrupt generation when TCFL overflows.
Bit 1
OVIEL
Description
0
TCFL overflow interrupt request is disabled
1
TCFL overflow interrupt request is enabled
(initial value)
Bit 0: Counter clear L (CCLRL)
Bit 0 selects whether TCFL is cleared when TCFL and OCRFL match.
Bit 0
CCLRL
Description
0
TCFL clearing by compare match is disabled
1
TCFL clearing by compare match is enabled
(initial value)
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Section 9 Timers
5. Clock Stop Register 1 (CKSTPR1)
7
Bit
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to timer F is described here. For details of the other bits, see the
sections on the relevant modules.
Bit 2: Timer F module standby mode control (TFCKSTP)
Bit 2 controls setting and clearing of module standby mode for timer F.
TFCKSTP
Description
0
Timer F is set to module standby mode
1
Timer F module standby mode is cleared
9.4.3
(initial value)
CPU Interface
TCF and OCRF are 16-bit read/write registers, but the CPU is connected to the on-chip peripheral
modules by an 8-bit data bus. When the CPU accesses these registers, it therefore uses an 8-bit
temporary register (TEMP).
In 16-bit mode, TCF read/write access and OCRF write access must be performed 16 bits at a time
(using two consecutive byte-size MOV instructions), and the upper byte must be accessed before
the lower byte. Data will not be transferred correctly if only the upper byte or only the lower byte
is accessed.
In 8-bit mode, there are no restrictions on the order of access.
1. Write Access
Write access to the upper byte results in transfer of the upper-byte write data to TEMP. Next,
write access to the lower byte results in transfer of the data in TEMP to the upper register byte,
and direct transfer of the lower-byte write data to the lower register byte.
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Section 9 Timers
Figure 9.4 shows an example in which H'AA55 is written to TCF.
Write to upper byte
CPU
(H'AA)
Module data bus
Bus
interface
TEMP
(H'AA)
TCFH
(
)
TCFL
(
)
Write to lower byte
CPU
(H'55)
Module data bus
Bus
interface
TEMP
(H'AA)
TCFH
(H'AA)
TCFL
(H'55)
Figure 9.4 Write Access to TCR (CPU → TCF)
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Section 9 Timers
2. Read Access
In access to TCF, when the upper byte is read the upper-byte data is transferred directly to the
CPU and the lower-byte data is transferred to TEMP. Next, when the lower byte is read, the
lower-byte data in TEMP is transferred to the CPU.
In access to OCRF, when the upper byte is read the upper-byte data is transferred directly to the
CPU. When the lower byte is read, the lower-byte data is transferred directly to the CPU.
Figure 9.5 shows an example in which TCF is read when it contains H'AAFF.
Read upper byte
CPU
(H'AA)
Module data bus
Bus
interface
TEMP
(H'FF)
TCFH
(H'AA)
TCFL
(H'FF)
Read lower byte
CPU
(H'FF)
Module data bus
Bus
interface
TEMP
(H'FF)
TCFH
(AB)*
TCFL
(00)*
Note: * H'AB00 if counter has been updated once.
Figure 9.5 Read Access to TCF (TCF → CPU)
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Section 9 Timers
9.4.4
Operation
Timer F is a 16-bit counter that increments on each input clock pulse. The timer F value is
constantly compared with the value set in output compare register F, and the counter can be
cleared, an interrupt requested, or port output toggled, when the two values match. Timer F can
also function as two independent 8-bit timers.
1. Timer F Operation
Timer F has two operating modes, 16-bit timer mode and 8-bit timer mode. The operation in each
of these modes is described below.
a. Operation in 16-bit timer mode
When CKSH2 is cleared to 0 in timer control register F (TCRF), timer F operates as a 16-bit
timer.
Following a reset, timer counter F (TCF) is initialized to H'0000, output compare register F
(OCRF) to H'FFFF, and timer control register F (TCRF) and timer control/status register F
(TCSRF) to H'00. The counter starts incrementing on external event (TMIF) input. The
external event edge selection is set by IEG3 in the IRQ edge select register (IEGR).
The timer F operating clock can be selected from four internal clocks or an external clock by
means of bits CKSL2 to CKSL0 in TCRF.
OCRF contents are constantly compared with TCF, and when both values match, CMFH is set
to 1 in TCSRF. If IENTFH in IENR2 is 1 at this time, an interrupt request is sent to the CPU,
and at the same time, TMOFH pin output is toggled. If CCLRH in TCSRF is 1, TCF is
cleared. TMOFH pin output can also be set by TOLH in TCRF.
When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in
TCSRF and IENTFH in IENR2 are both 1, an interrupt request is sent to the CPU.
b. Operation in 8-bit timer mode
When CKSH2 is set to 1 in TCRF, TCF operates as two independent 8-bit timers, TCFH and
TCFL. The TCFH/TCFL input clock is selected by CKSH2 to CKSH0/CKSL2 to CKSL0 in
TCRF.
When the OCRFH/OCRFL and TCFH/TCFL values match, CMFH/CMFL is set to 1 in
TCSRF. If IENTFH/IENTFL in IENR2 is 1, an interrupt request is sent to the CPU, and at the
same time, TMOFH pin/TMOFL pin output is toggled. If CCLRH/CCLRL in TCSRF is 1,
TCFH/TCFL is cleared. TMOFH pin/TMOFL pin output can also be set by TOLH/TOLL in
TCRF.
When TCFH/TCFL overflows from H'FF to H'00, OVFH/OVFL is set to 1 in TCSRF. If
OVIEH/OVIEL in TCSRF and IENTFH/IENTFL in IENR2 are both 1, an interrupt request is
sent to the CPU.
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Section 9 Timers
2. TCF Increment Timing
TCF is incremented by clock input (internal clock or external event input).
a. Internal clock operation
Bits CKSH2 to CKSH0 or CKSL2 to CKSL0 in TCRF select one of four internal clock
sources (φ/32, φ/16, φ/4, or φw/4) created by dividing the system clock (φ or φw).
b. External event operation
External event input is selected by clearing CKSL2 to 0 in TCRF. TCF can increment on
either the rising or falling edge of external event input. External event edge selection is set by
IEG3 in the interrupt controller’s IEGR register. An external event pulse width of at least 2
system clocks (φ) is necessary. Shorter pulses will not be counted correctly.
3. TMOFH/TMOFL Output Timing
In TMOFH/TMOFL output, the value set in TOLH/TOLL in TCRF is output. The output is
toggled by the occurrence of a compare match. Figure 9.6 shows the output timing.
φ
TMIF
(when IEG3 = 1)
Count input
clock
TCF
OCRF
N
N+1
N
Compare match
signal
TMOFH TMOFL
Figure 9.6 TMOFH/TMOFL Output Timing
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N
N
N+1
Section 9 Timers
4. TCF Clear Timing
TCF can be cleared by a compare match with OCRF.
5. Timer Overflow Flag (OVF) Set Timing
OVF is set to 1 when TCF overflows from H'FFFF to H'0000.
6. Compare Match Flag set Timing
The compare match flag (CMFH or CMFL) is set to 1 when the TCF and OCRF values match.
The compare match signal is generated in the last state during which the values match (when TCF
is updated from the matching value to a new value). When TCF matches OCRF, the compare
match signal is not generated until the next counter clock.
7. Timer F Operation Modes
Timer F operation modes are shown in table 9.10.
Table 9.10 Timer F Operation Modes
Subsleep
Active
Sleep
TCF
Reset
Functions
Functions Functions/ Functions/ Functions/ Halted
Halted*
Halted*
Halted*
Halted
OCRF
Reset
Functions
Held
Held
Functions
Held
Held
Held
TCRF
Reset
Functions
Held
Held
Functions
Held
Held
Held
TCSRF
Reset
Functions
Held
Held
Functions
Held
Held
Held
*
Standby
Module
Standby
Reset
Note:
Watch
Subactive
Operation Mode
When φw/4 is selected as the TCF internal clock in active mode or sleep mode, since
the system clock and internal clock are mutually asynchronous, synchronization is
maintained by a synchronization circuit. This results in a maximum count cycle error of
1/φ (s). When the counter is operated in subactive mode, watch mode, or subsleep
mode, φw/4 must be selected as the internal clock. The counter will not operate if any
other internal clock is selected.
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Section 9 Timers
9.4.5
Application Notes
The following types of contention and operation can occur when timer F is used.
1. 16-bit Timer Mode
In toggle output, TMOFH pin output is toggled when all 16 bits match and a compare match
signal is generated. If a TCRF write by a MOV instruction and generation of the compare match
signal occur simultaneously, TOLH data is output to the TMOFH pin as a result of the TCRF
write. TMOFL pin output is unstable in 16-bit mode, and should not be used; the TMOFL pin
should be used as a port pin.
If an OCRFL write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, if the written data and the counter value match, a compare
match signal will be generated at that point. As the compare match signal is output in
synchronization with the TCFL clock, a compare match will not result in compare match signal
generation if the clock is stopped.
Compare match flag CMFH is set when all 16 bits match and a compare match signal is generated.
Compare match flag CMFL is set if the setting conditions for the lower 8 bits are satisfied.
When TCF overflows, OVFH is set. OVFL is set if the setting conditions are satisfied when the
lower 8 bits overflow. If a TCFL write and overflow signal output occur simultaneously, the
overflow signal is not output.
2. 8-bit Timer Mode
a. TCFH, OCRFH
In toggle output, TMOFH pin output is toggled when a compare match occurs. If a TCRF
write by a MOV instruction and generation of the compare match signal occur simultaneously,
TOLH data is output to the TMOFH pin as a result of the TCRF write.
If an OCRFH write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, if the written data and the counter value match, a compare
match signal will be generated at that point. The compare match signal is output in
synchronization with the TCFH clock.
If a TCFH write and overflow signal output occur simultaneously, the overflow signal is not
output.
b. TCFL, OCRFL
In toggle output, TMOFL pin output is toggled when a compare match occurs. If a TCRF
write by a MOV instruction and generation of the compare match signal occur simultaneously,
TOLL data is output to the TMOFL pin as a result of the TCRF write.
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Section 9 Timers
If an OCRFL write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, if the written data and the counter value match, a compare
match signal will be generated at that point. As the compare match signal is output in
synchronization with the TCFL clock, a compare match will not result in compare match
signal generation if the clock is stopped.
If a TCFL write and overflow signal output occur simultaneously, the overflow signal is not
output.
3. Clear Timer FH, Timer FL Interrupt Request Flags (IRRTFH, IRRTFL),
Timer Overflow Flags H, L (OVFH, OVFL) and Compare Match Flags H, L
(CMFH, CMFL)
When φw/4 is selected as the internal clock, “Interrupt factor generation signal” will be operated
with φw and the signal will be outputted with φw width. And, “Overflow signal” and “Compare
match signal” are controlled with 2 cycles of φw signals. Those signals are outputted with 2 cycles
width of φw (figure 9.7)
In active (high-speed, medium-speed) mode, even if you cleared interrupt request flag during the
term of validity of “Interrupt factor generation signal”, same interrupt request flag is set. (figure
9.7 (1)) And, you cannot be cleared timer overflow flag and compare match flag during the term
of validity of “Overflow signal” and “Compare match signal”.
For interrupt request flag is set right after interrupt request is cleared, interrupt process to one time
timer FH, timer FL interrupt might be repeated. (figure 9.7 (2)) Therefore, to definitely clear
interrupt request flag in active (high-speed, medium-speed) mode, clear should be processed after
the time that calculated with below (1) formula. And, to definitely clear timer overflow flag and
compare match flag, clear should be processed after read timer control status register F (TCSRF)
after the time that calculated with below (1) formula. For ST of (1) formula, please substitute the
longest number of execution states in used instruction. (10 states of RTE instruction when
MULXU, DIVXU instruction is not used, 14 states when MULXU, DIVXU instruction is used) In
subactive mode, there are not limitation for interrupt request flag, timer overflow flag, and
compare match flag clear.
The term of validity of “Interrupt factor generation signal”
= 1 cycle of φw + waiting time for completion of executing instruction
+ interrupt time synchronized with φ = 1/φw + ST × (1/φ) + (2/φ) (second).....(1)
ST: Executing number of execution states
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Section 9 Timers
Method 1 is recommended to operate for time efficiency.
Method 1
1. Prohibit interrupt in interrupt handling routine (set IENFH, IENFL to 0).
2. After program process returned normal handling, clear interrupt request flags (IRRTFH,
IRRTFL) after more than that calculated with (1) formula.
3. After read timer control status register F (TCSRF), clear timer overflow flags (OVFH,
OVFL) and compare match flags (CMFH, CMFL).
4. Operate interrupt permission (set IENFH, IENFL to 1).
Method 2
1. Set interrupt handling routine time to more than time that calculated with (1) formula.
2. Clear interrupt request flags (IRRTFH, IRRTFL) at the end of interrupt handling routine.
3. After read timer control status register F (TCSRF), clear timer overflow flags (OVFH,
OVFL) and compare match flags (CMFH, CMFL).
All above attentions are also applied in 16-bit mode and 8-bit mode.
Interrupt request
flag clear
Interrupt request
flag clear
(2)
Program process
Interrupt
Interrupt
Normal
φw
Interrupt factor
generation signal
(Internal signal,
nega-active)
Overflow signal,
Compare match signal
(Internal signal,
nega-active)
Interrupt request flag
(IRRTFH, IRRTFL)
(1)
Figure 9.7 Clear Interrupt Request Flag when Interrupt Factor Generation Signal is Valid
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Section 9 Timers
4. Timer Counter (TCF) Read/Write
When φw/4 is selected as the internal clock in active (high-speed, medium-speed) mode, write on
TCF is impossible. And, when read TCF, as the system clock and internal clock are mutually
asynchronous, TCF synchronizes with synchronization circuit. This results in a maximum TCF
read value error of ±1.
When read/write TCF in active (high-speed, medium-speed) mode is needed, please select internal
clock except for φw/4 before read/write.
In subactive mode, even φw/4 is selected as the internal clock, normal read/write TCF is possible.
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Section 9 Timers
9.5
Timer G
9.5.1
Overview
Timer G is an 8-bit timer with dedicated input capture functions for the rising/falling edges of
pulses input from the input capture input pin (input capture input signal). High-frequency
component noise in the input capture input signal can be eliminated by a noise canceler, enabling
accurate measurement of the input capture input signal duty cycle. If input capture input is not set,
timer G functions as an 8-bit interval timer.
1. Features
Features of timer G are given below.
• Choice of four internal clock sources (φ/64, φ/32, φ/2, φw/4)
• Dedicated input capture functions for rising and falling edges
• Level detection at counter overflow
It is possible to detect whether overflow occurred when the input capture input signal was high
or when it was low.
• Selection of whether or not the counter value is to be cleared at the input capture input signal
rising edge, falling edge, or both edges
• Two interrupt sources: one input capture, one overflow. The input capture input signal rising
or falling edge can be selected as the interrupt source.
• A built-in noise canceler eliminates high-frequency component noise in the input capture input
signal.
• Watch mode, subactive mode and subsleep mode operation is possible when φw/4 is selected
as the internal clock.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 9 Timers
2. Block Diagram
Figure 9.8 shows a block diagram of timer G.
φ
PSS
Level
detector
φw/4
ICRGF
TMIG
Noise
canceler
Edge
detector
NCS
Internal data bus
TMG
TCG
ICRGR
IRRTG
Legend:
TMG:
TCG:
ICRGF:
ICRGR:
IRRTG:
NCS:
PSS:
Timer mode register G
Timer counter G
Input capture register GF
Input capture register GR
Timer G interrupt request flag
Noise canceler select
Prescaler S
Figure 9.8 Block Diagram of Timer G
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Section 9 Timers
3. Pin Configuration
Table 9.11 shows the timer G pin configuration.
Table 9.11 Pin Configuration
Name
Abbr.
I/O
Function
Input capture input
TMIG
Input
Input capture input pin
4. Register Configuration
Table 9.12 shows the register configuration of timer G.
Table 9.12 Timer G Registers
Name
Abbr.
R/W
Initial Value
Address
Timer control register G
TMG
R/W
H'00
H'FFBC
Timer counter G
TCG
—
H'00
—
Input capture register GF
ICRGF
R
H'00
H'FFBD
Input capture register GR
ICRGR
R
H'00
H'FFBE
Clock stop register 1
CKSTPR1
R/W
H'FF
H'FFFA
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Section 9 Timers
9.5.2
Register Descriptions
1. Timer Counter (TCG)
7
6
5
4
3
2
1
0
TCG7
TCG6
TCG5
TCG4
TCG3
TCG2
TCG1
TCG0
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
—
—
Bit
TCG is an 8-bit up-counter which is incremented by clock input. The input clock is selected by
bits CKS1 and CKS0 in TMG.
TMIG in PMR1 is set to 1 to operate TCG as an input capture timer, or cleared to 0 to operate
TCG as an interval timer*. In input capture timer operation, the TCG value can be cleared by the
rising edge, falling edge, or both edges of the input capture input signal, according to the setting
made in TMG.
When TCG overflows from H'FF to H'00, if OVIE in TMG is 1, IRRTG is set to 1 in IRR2, and if
IENTG in IENR2 is 1, an interrupt request is sent to the CPU.
For details of the interrupt, see section 3.3, Interrupts.
TCG cannot be read or written by the CPU. It is initialized to H'00 upon reset.
Note: * An input capture signal may be generated when TMIG is modified.
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Section 9 Timers
2. Input Capture Register GF (ICRGF)
7
6
5
4
3
2
1
0
ICRGF7
ICRGF6
ICRGF5
ICRGF4
ICRGF3
ICRGF2
ICRGF1
ICRGF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Bit
ICRGF is an 8-bit read-only register. When a falling edge of the input capture input signal is
detected, the current TCG value is transferred to ICRGF. If IIEGS in TMG is 1 at this time,
IRRTG is set to 1 in IRR2, and if IENTG in IENR2 is 1, an interrupt request is sent to the CPU.
For details of the interrupt, see section 3.3, Interrupts.
To ensure dependable input capture operation, the pulse width of the input capture input signal
must be at least 2φ or 2φSUB (when the noise canceler is not used).
ICRGF is initialized to H'00 upon reset.
3. Input Capture Register GR (ICRGR)
Bit
7
6
5
4
3
2
1
0
ICRGR7
ICRGR6
ICRGR5
ICRGR4
ICRGR3
ICRGR2
ICRGR1
ICRGR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRGR is an 8-bit read-only register. When a rising edge of the input capture input signal is
detected, the current TCG value is transferred to ICRGR. If IIEGS in TMG is 1 at this time,
IRRTG is set to 1 in IRR2, and if IENTG in IENR2 is 1, an interrupt request is sent to the CPU.
For details of the interrupt, see section 3.3, Interrupts.
To ensure dependable input capture operation, the pulse width of the input capture input signal
must be at least 2φ or 2φSUB (when the noise canceler is not used).
ICRGR is initialized to H'00 upon reset.
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Section 9 Timers
4. Timer Mode Register G (TMG)
7
6
5
4
3
2
1
0
OVFH
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
CKS0
Initial value:
0
0
0
0
0
0
0
0
Read/Write:
R/W*
R/W*
R/W
R/W
R/W
R/W
R/W
R/W
Bit:
Note: * Bits 7 and 6 can only be written with 0, for flag clearing.
TMG is an 8-bit read/write register that performs TCG clock selection from four internal clock
sources, counter clear selection, and edge selection for the input capture input signal interrupt
request, controls enabling of overflow interrupt requests, and also contains the overflow flags.
TMG is initialized to H'00 upon reset.
Bit 7: Timer overflow flag H (OVFH)
Bit 7 is a status flag indicating that TCG has overflowed from H'FF to H'00 when the input capture
input signal is high. This flag is set by hardware and cleared by software. It cannot be set by
software.
Bit 7
OVFH
Description
0
Clearing condition:
(initial value)
After reading OVFH = 1, cleared by writing 0 to OVFH
1
Setting condition:
Set when TCG overflows from H'FF to H'00
Bit 6: Timer overflow flag L (OVFL)
Bit 6 is a status flag indicating that TCG has overflowed from H'FF to H'00 when the input capture
input signal is low, or in interval operation. This flag is set by hardware and cleared by software.
It cannot be set by software.
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Section 9 Timers
Bit 6
OVFL
Description
0
Clearing condition:
(initial value)
After reading OVFL = 1, cleared by writing 0 to OVFL
1
Setting condition:
Set when TCG overflows from H'FF to H'00
Bit 5: Timer overflow interrupt enable (OVIE)
Bit 5 selects enabling or disabling of interrupt generation when TCG overflows.
Bit 5
OVIE
Description
0
TCG overflow interrupt request is disabled
1
TCG overflow interrupt request is enabled
(initial value)
Bit 4: Input capture interrupt edge select (IIEGS)
Bit 4 selects the input capture input signal edge that generates an interrupt request.
Bit 4
IIEGS
Description
0
Interrupt generated on rising edge of input capture input signal
1
Interrupt generated on falling edge of input capture input signal
(initial value)
Bits 3 and 2: Counter clear 1 and 0 (CCLR1, CCLR0)
Bits 3 and 2 specify whether or not TCG is cleared by the rising edge, falling edge, or both edges
of the input capture input signal.
Bit 3
CCLR1
Bit 2
CCLR0
Description
0
0
TCG clearing is disabled
0
1
TCG cleared by falling edge of input capture input signal
1
0
TCG cleared by rising edge of input capture input signal
1
1
TCG cleared by both edges of input capture input signal
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(initial value)
Section 9 Timers
Bits 1 and 0: Clock select (CKS1, CKS0)
Bits 1 and 0 select the clock input to TCG from among four internal clock sources.
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
Internal clock: Counting on φ/64
0
1
Internal clock: Counting on φ/32
1
0
Internal clock: Counting on φ/2
1
1
Internal clock: Counting on φw/4
(initial value)
5. Clock Stop Register 1 (CKSTPR1)
Bit
7
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to timer G is described here. For details of the other bits, see the
sections on the relevant modules.
Bit 3: Timer G module standby mode control (TGCKSTP)
Bit 3 controls setting and clearing of module standby mode for timer G.
TGCKSTP
Description
0
Timer G is set to module standby mode
1
Timer G module standby mode is cleared
(initial value)
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Section 9 Timers
9.5.3
Noise Canceler
The noise canceler consists of a digital low-pass filter that eliminates high-frequency component
noise from the pulses input from the input capture input pin. The noise canceler is set by NCS* in
PMR3.
Figure 9.9 shows a block diagram of the noise canceler.
Sampling
clock
C
Input capture
input signal
C
D
Q
D
Latch
Q
Latch
C
D
C
Q
Latch
D
C
Q
Latch
D
Q
Latch
Match
detector
Noise
canceler
output
t
Sampling clock
∆t: Set by CKS1 and CKS0
Figure 9.9 Noise Canceler Block Diagram
The noise canceler consists of five latch circuits connected in series and a match detector circuit.
When the noise cancellation function is not used (NCS = 0), the system clock is selected as the
sampling clock. When the noise cancellation function is used (NCS = 1), the sampling clock is the
internal clock selected by CKS1 and CKS0 in TMG, the input capture input is sampled on the
rising edge of this clock, and the data is judged to be correct when all the latch outputs match. If
all the outputs do not match, the previous value is retained. After a reset, the noise canceler output
is initialized when the falling edge of the input capture input signal has been sampled five times.
Therefore, after making a setting for use of the noise cancellation function, a pulse with at least
five times the width of the sampling clock is a dependable input capture signal. Even if noise
cancellation is not used, an input capture input signal pulse width of at least 2φ or 2φSUB is
necessary to ensure that input capture operations are performed properly
Note: * An input capture signal may be generated when the NCS bit is modified.
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Section 9 Timers
Figure 9.10 shows an example of noise canceler timing.
In this example, high-level input of less than five times the width of the sampling clock at the
input capture input pin is eliminated as noise.
Input capture
input signal
Sampling clock
Noise canceler
output
Eliminated as noise
Figure 9.10 Noise Canceler Timing (Example)
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Section 9 Timers
9.5.4
Operation
Timer G is an 8-bit timer with built-in input capture and interval functions.
1. Timer G Functions
Timer G is an 8-bit up-counter with two functions, an input capture timer function and an interval
timer function.
The operation of these two functions is described below.
a. Input capture timer operation
When the TMIG bit is set to 1 in port mode register 1 (PMR1), timer G functions as an input
capture timer*.
In a reset, timer mode register G (TMG), timer counter G (TCG), input capture register GF
(ICRGF), and input capture register GR (ICRGR) are all initialized to H’00.
Following a reset, TCG starts incrementing on the φ/64 internal clock.
The input clock can be selected from four internal clock sources by bits CKS1 and CKS0 in
TMG.
When a rising edge/falling edge is detected in the input capture signal input from the TMIG
pin, the TCG value at that time is transferred to ICRGR/ICRGF. When the edge selected by
IIEGS in TMG is input, IRRTG is set to 1 in IRR2, and if the IENTG bit in IENR2 is 1 at this
time, an interrupt request is sent to the CPU. For details of the interrupt, see section 3.3,
Interrupts.
TCG can be cleared by a rising edge, falling edge, or both edges of the input capture signal,
according to the setting of bits CCLR1 and CCLR0 in TMG. If TCG overflows when the
input capture signal is high, the OVFH bit is set in TMG; if TCG overflows when the input
capture signal is low, the OVFL bit is set in TMG. If the OVIE bit in TMG is 1 when these
bits are set, IRRTG is set to 1 in IRR2, and if the IENTG bit in IENR2 is 1, timer G sends an
interrupt request to the CPU. For details of the interrupt, see section 3.3, Interrupts.
Timer G has a built-in noise canceler that enables high-frequency component noise to be
eliminated from pulses input from the TMIG pin. For details, see section 9.5.3, Noise
Canceler.
Note: * An input capture signal may be generated when TMIG is modified.
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Section 9 Timers
b. Interval timer operation
When the TMIG bit is cleared to 0 in PMR1, timer G functions as an interval timer. Following
a reset, TCG starts incrementing on the φ/64 internal clock. The input clock can be selected
from four internal clock sources by bits CKS1 and CKS0 in TMG. TCG increments on the
selected clock, and when it overflows from H’FF to H’00, the OVFL bit is set to 1 in TMG. If
the OVIE bit in TMG is 1 at this time, IRRTG is set to 1 in IRR2, and if the IENTG bit in
IENR2 is 1, timer G sends an interrupt request to the CPU. For details of the interrupt, see
section 3.3, Interrupts.
2. Increment Timing
TCG is incremented by internal clock input. Bits CKS1 and CKS0 in TMG select one of four
internal clock sources (φ/64, φ/32, φ/2, or φw/4) created by dividing the system clock (φ) or watch
clock (φw).
3. Input Capture Input Timing
a. Without noise cancellation function
For input capture input, dedicated input capture functions are provided for rising and falling
edges.
Figure 9.11 shows the timing for rising/falling edge input capture input.
Input capture
input signal
Input capture
signal F
Input capture
signal R
Figure 9.11 Input Capture Input Timing (without Noise Cancellation Function)
b. With noise cancellation function
When noise cancellation is performed on the input capture input, the passage of the input
capture signal through the noise canceler results in a delay of five sampling clock cycles from
the input capture input signal edge.
Figure 9.12 shows the timing in this case.
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Section 9 Timers
Input capture
input signal
Sampling clock
Noise canceler
output
Input capture
signal R
Figure 9.12 Input Capture Input Timing (with Noise Cancellation Function)
4. Timing of Input Capture by Input Capture Input
Figure 9.13 shows the timing of input capture by input capture input
Input capture
signal
TCG
Input capture
register
N-1
N
H'XX
N+1
N
Figure 9.13 Timing of Input Capture by Input Capture Input
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Section 9 Timers
5. TGC Clear Timing
TCG can be cleared by the rising edge, falling edge, or both edges of the input capture input
signal.
Figure 9.14 shows the timing for clearing by both edges.
Input capture
input signal
Input capture
signal F
Input capture
signal R
TCG
N
H'00
N
H'00
Figure 9.14 TCG Clear Timing
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Section 9 Timers
6. Timer G Operation Modes
Timer G operation modes are shown in table 9.13.
Table 9.13 Timer G Operation Modes
Module
Standby Standby
TCG Input capture
Reset
Functions* Functions* Functions/ Functions/ Functions/ Halted
halted*
halted*
halted*
Halted
Interval
Reset
Functions* Functions* Functions/ Functions/ Functions/ Halted
halted*
halted*
halted*
Halted
ICRGF
Reset
Functions* Functions* Functions/ Functions/ Functions/ Held
halted*
halted*
halted*
Held
ICRGR
Reset
Functions* Functions* Functions Functions/ Functions/ Held
halted*
halted*
halted*
Held
Reset
Functions Held
Held
Note:
*
Watch
Subsleep
Reset Active
TMG
Sleep
Subactive
Operation Mode
Held
Functions Held
Held
When φw/4 is selected as the TCG internal clock in active mode or sleep mode, since
the system clock and internal clock are mutually asynchronous, synchronization is
maintained by a synchronization circuit. This results in a maximum count cycle error of
1/φ (s). When φw/4 is selected as the TCG internal clock in watch mode, TCG and the
noise canceler operate on the φw/4 internal clock without regard to the φSUB subclock
(φw/8, φw/4, φw/2). Note that when another internal clock is selected, TCG and the
noise canceler do not operate, and input of the input capture input signal does not result
in input capture.
To be operated Timer G in subactive mode or subsleep mode, select φw/4 for internal
clock of TCG and also select φw/2 for sub clock φSUB. When another internal clock is
selected and when another sub clock (φw/8, φw/4) is selected, TCG and noise canceler
do not operate.
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Section 9 Timers
9.5.5
Application Notes
1. Internal Clock Switching and TCG Operation
Depending on the timing, TCG may be incremented by a switch between difference internal clock
sources. Table 9.14 shows the relation between internal clock switchover timing (by write to bits
CKS1 and CKS0) and TCG operation.
When TCG is internally clocked, an increment pulse is generated on detection of the falling edge
of an internal clock signal, which is divided from the system clock (φ) or subclock (φw). For this
reason, in a case like No. 3 in table 9.14 where the switch is from a high clock signal to a low
clock signal, the switchover is seen as a falling edge, causing TCG to increment.
Table 9.14 Internal Clock Switching and TCG Operation
No.
Clock Levels Before and
After Modifying Bits CKS1
and CKS0
1
Goes from low level to low level
TCG Operation
Clock before
switching
Clock after
switching
Count
clock
TCG
N
N+1
Write to CKS1 and CKS0
2
Goes from low level to high level
Clock before
switching
Clock before
switching
Count
clock
TCG
N
N+1
N+2
Write to CKS1 and CKS0
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Section 9 Timers
No.
Clock Levels Before and
After Modifying Bits CKS1
and CKS0
3
Goes from high level to low level
TCG Operation
Clock before
switching
Clock before
switching
*
Count
clock
TCG
N
N+1
N+2
Write to CKS1 and CKS0
4
Goes from high level to high level
Clock before
switching
Clock before
switching
Count
clock
TCG
N
N+1
N+2
Write to CKS1 and CKS0
Note:
*
The switchover is seen as a falling edge, and TCG is incremented.
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Section 9 Timers
2. Notes on Port Mode Register Modification
The following points should be noted when a port mode register is modified to switch the input
capture function or the input capture input noise canceler function.
• Switching input capture input pin function
Note that when the pin function is switched by modifying TMIG in port mode register 1
(PMR1), which performs input capture input pin control, an edge will be regarded as having
been input at the pin even though no valid edge has actually been input. Input capture input
signal input edges, and the conditions for their occurrence, are summarized in table 9.15.
Table 9.15 Input Capture Input Signal Input Edges Due to Input Capture Input Pin
Switching, and Conditions for Their Occurrence
Input Capture Input Signal
Input Edge
Conditions
Generation of rising edge
When TMIG is modified from 0 to 1 while the TMIG pin is high
When NCS is modified from 0 to 1 while the TMIG pin is high,
then TMIG is modified from 0 to 1 before the signal is sampled
five times by the noise canceler
Generation of falling edge
When TMIG is modified from 1 to 0 while the TMIG pin is high
When NCS is modified from 0 to 1 while the TMIG pin is low,
then TMIG is modified from 0 to 1 before the signal is sampled
five times by the noise canceler
When NCS is modified from 0 to 1 while the TMIG pin is high,
then TMIG is modified from 1 to 0 after the signal is sampled five
times by the noise canceler
Note: When the P13 pin is not set as an input capture input pin, the timer G input capture input
signal is low.
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Section 9 Timers
• Switching input capture input noise canceler function
When performing noise canceler function switching by modifying NCS in port mode register 3
(PMR3), which controls the input capture input noise canceler, TMIG should first be cleared to
0. Note that if NCS is modified without first clearing TMIG, an edge will be regarded as
having been input at the pin even though no valid edge has actually been input. Input capture
input signal input edges, and the conditions for their occurrence, are summarized in table 9.16.
Table 9.16 Input Capture Input Signal Input Edges Due to Noise Canceler Function
Switching, and Conditions for Their Occurrence
Input Capture Input Signal
Input Edge
Conditions
Generation of rising edge
When the TMIG pin level is switched from low to high while
TMIG is set to 1, then NCS is modified from 0 to 1 before the
signal is sampled five times by the noise canceler
Generation of falling edge
When the TMIG pin level is switched from high to low while
TMIG is set to 1, then NCS is modified from 1 to 0 before the
signal is sampled five times by the noise canceler
When the pin function is switched and an edge is generated in the input capture input signal, if
this edge matches the edge selected by the input capture interrupt select (IIEGS) bit, the
interrupt request flag will be set to 1. The interrupt request flag should therefore be cleared to
0 before use. Figure 9.15 shows the procedure for port mode register manipulation and
interrupt request flag clearing. When switching the pin function, set the interrupt-disabled
state before manipulating the port mode register, then, after the port mode register operation
has been performed, wait for the time required to confirm the input capture input signal as an
input capture signal (at least two system clocks when the noise canceler is not used; at least
five sampling clocks when the noise canceler is used), before clearing the interrupt enable flag
to 0. There are two ways of preventing interrupt request flag setting when the pin function is
switched: by controlling the pin level so that the conditions shown in tables 9.15 and 9.16 are
not satisfied, or by setting the opposite of the generated edge in the IIEGS bit in TMG.
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Section 9 Timers
Set I bit to 1 in CCR
Manipulate port mode register
TMIG confirmation time
Clear interrupt request flag to 0
Clear I bit to 0 in CCR
Disable interrupts. (Interrupts can also be disabled by
manipulating the interrupt enable bit in interrupt enable
register 2.)
After manipulating he port mode register, wait for the
TMIG confirmation time (at least two system clocks when
the noise canceler is not used; at least five sampling
clocks when the noise canceler is used), then clear the
interrupt enable flag to 0.
Enable interrupts
Figure 9.15 Port Mode Register Manipulation and Interrupt Enable Flag Clearing
Procedure
9.5.6
Timer G Application Example
Using timer G, it is possible to measure the high and low widths of the input capture input signal
as absolute values. For this purpose, CCLR1 and CCLR0 should both be set to 1 in TMG.
Figure 9.16 shows an example of the operation in this case.
Input capture
input signal
H'FF
Input capture
register GF
Input capture
register GR
H'00
TCG
Counter cleared
Figure 9.16 Timer G Application Example
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Section 9 Timers
9.6
Watchdog Timer
9.6.1
Overview
The watchdog timer has an 8-bit counter that is incremented by an input clock. If a system
runaway allows the counter value to overflow before being rewritten, the watchdog timer can reset
the chip internally.
1. Features
Features of the watchdog timer are given below.
• Incremented by internal clock source (φ/8192 or φw/32).
• A reset signal is generated when the counter overflows. The overflow period can be set from
from 1 to 256 times 8192/φ or 32/φw (from approximately 4 ms to 1000 ms when φ = 2.00
MHz).
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
2. Block Diagram
Figure 9.17 shows a block diagram of the watchdog timer.
φw/32
PSS
φ/8192
TCW
Notation:
TCSRW: Timer control/status register W
Timer counter W
TCW:
Prescaler S
PSS:
Figure 9.17 Block Diagram of Watchdog Timer
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Internal data bus
φ
TCSRW
Reset signal
Section 9 Timers
3. Register Configuration
Table 9.17 shows the register configuration of the watchdog timer.
Table 9.17 Watchdog Timer Registers
Name
Abbr.
R/W
Initial Value
Address
Timer control/status register W
TCSRW
R/W
H'AA
H'FFB2
Timer counter W
TCW
R/W
H'00
H'FFB3
Clock stop register 2
CKSTP2
R/W
H'FF
H'FFFB
Port mode register 3
PMR3
R/W
H'00
H'FFCA
9.6.2
Register Descriptions
1. Timer Control/Status Register W (TCSRW)
Bit
7
6
5
4
3
2
1
0
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
Initial value
1
0
1
0
1
0
R
0
R/(W)*
1
Read/Write
R
R/(W)*
R
R/(W)*
R
R/(W)*
Note: * Write is permitted only under certain conditions, which are given in the descriptions of
the individual bits.
TCSRW is an 8-bit read/write register that controls write access to TCW and TCSRW itself,
controls watchdog timer operations, and indicates operating status.
Bit 7: Bit 6 write inhibit (B6WI)
Bit 7 controls the writing of data to bit 6 in TCSRW.
Bit 7
B6WI
Description
0
Bit 6 is write-enabled
1
Bit 6 is write-protected
(initial value)
This bit is always read as 1. Data written to this bit is not stored.
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Section 9 Timers
Bit 6: Timer counter W write enable (TCWE)
Bit 6 controls the writing of data to TCW.
Bit 6
TCWE
Description
0
Data cannot be written to TCW
1
Data can be written to TCW
(initial value)
Bit 5: Bit 4 write inhibit (B4WI)
Bit 5 controls the writing of data to bit 4 in TCSRW.
Bit 5
B4WI
Description
0
Bit 4 is write-enabled
1
Bit 4 is write-protected
(initial value)
This bit is always read as 1. Data written to this bit is not stored.
Bit 4: Timer control/status register W write enable (TCSRWE)
Bit 4 controls the writing of data to TCSRW bits 2 and 0.
Bit 4
TCSRWE
Description
0
Data cannot be written to bits 2 and 0
1
Data can be written to bits 2 and 0
(initial value)
Bit 3: Bit 2 write inhibit (B2WI)
Bit 3 controls the writing of data to bit 2 in TCSRW.
Bit 3
B2WI
Description
0
Bit 2 is write-enabled
1
Bit 2 is write-protected
This bit is always read as 1. Data written to this bit is not stored.
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(initial value)
Section 9 Timers
Bit 2: Watchdog timer on (WDON)
Bit 2 enables watchdog timer operation.
Bit 2
WDON
Description
0
Watchdog timer operation is disabled
(initial value)
Clearing condition:
Reset, or when TCSRWE = 1 and 0 is written in both B2WI and WDON
1
Watchdog timer operation is enabled
Setting condition:
When TCSRWE = 1 and 0 is written in B2WI and 1 is written in WDON
Counting starts when this bit is set to 1, and stops when this bit is cleared to 0.
Bit 1: Bit 0 write inhibit (B0WI)
Bit 1 controls the writing of data to bit 0 in TCSRW.
Bit 1
B0WI
Description
0
Bit 0 is write-enabled
1
Bit 0 is write-protected
(initial value)
This bit is always read as 1. Data written to this bit is not stored.
Bit 0: Watchdog timer reset (WRST)
Bit 0 indicates that TCW has overflowed, generating an internal reset signal. The internal reset
signal generated by the overflow resets the entire chip. WRST is cleared to 0 by a reset from the
RES pin, or when software writes 0.
Bit 0
WRST
Description
0
Clearing condition:
Reset by RES pin
When TCSRWE = 1, and 0 is written in both B0WI and WRST
1
Setting condition:
When TCW overflows and an internal reset signal is generated
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Section 9 Timers
2. Timer Counter W (TCW)
Bit
7
6
5
4
3
2
1
0
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TCW is an 8-bit read/write up-counter, which is incremented by internal clock input. The input
clock is φ/8192 or φw/32. The TCW value can always be written or read by the CPU.
When TCW overflows from H'FF to H'00, an internal reset signal is generated and WRST is set to
1 in TCSRW. Upon reset, TCW is initialized to H'00.
3. Clock Stop Register 2 (CKSTPR2)
Bit
7
6
5
4
—
—
—
—
3
2
1
0
AECKSTP WDCKSTP PWCKSTP LDCKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
CKSTPR2 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to the watchdog timer is described here. For details of the other
bits, see the sections on the relevant modules.
Bit 2: Watchdog timer module standby mode control (WDCKSTP)
Bit 2 controls setting and clearing of module standby mode for the watchdog timer.
WDCKSTP
Description
0
Watchdog timer is set to module standby mode
1
Watchdog timer module standby mode is cleared
(initial value)
Note: WDCKSTP is valid when the WDON bit is cleared to 0 in timer control/status register W
(TCSRW). If WDCKSTP is set to 0 while WDON is set to 1 (during watchdog timer
operation), 0 will be set in WDCKSTP but the watchdog timer will continue its watchdog
function and will not enter module standby mode. When the watchdog function ends and
WDON is cleared to 0 by software, the WDCKSTP setting will become valid and the
watchdog timer will enter module standby mode.
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Section 9 Timers
4. Port Mode Register 3 (PMR3)
Bit
7
6
5
4
3
2
1
0
AEVL
AEVH
WDCKS
NCS
IRQ0
RESO
UD
PWM
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR3 is an 8-bit read/write register, mainly controlling the selection of pin functions for port 3
pins. Only the bit relating to the watchdog timer is described here. For details of the other bits,
see section 8, I/O Ports.
Bit 5: Watchdog timer source clock select (WDCKS)
WDCKS
Description
0
φ/8192 selected
1
φw/32 selected
9.6.3
(initial value)
Timer Operation
The watchdog timer has an 8-bit counter (TCW) that is incremented by clock input (φ/8192 or
φw/32). The input clock is selected by bit WDCKS in port mode register 3 (PMR3): φ/8192 is
selected when WDCKS is cleared to 0, and φw/32 when set to 1. When TCSRWE = 1 in TCSRW,
if 0 is written in B2WI and 1 is simultaneously written in WDON, TCW starts counting up. When
the TCW count reaches H'FF, the next clock input causes the watchdog timer to overflow, and an
internal reset signal is generated one reference clock (φ or φSUB) cycle later. The internal reset
signal is output for 512 clock cycles of the φOSC clock. It is possible to write to TCW, causing
TCW to count up from the written value. The overflow period can be set in the range from 1 to
256 input clocks, depending on the value written in TCW.
Figure 9.18 shows an example of watchdog timer operations.
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Section 9 Timers
Example: φ = 2 MHz and the desired overflow period is 30 ms.
2 × 106 × 30 × 10–3 = 7.3
8192
The value set in TCW should therefore be 256 − 8 = 248 (H'F8).
TCW overflow
H'FF
H'F8
TCW count
value
H'00
Start
H'F8 written
in TCW
Reset
H'F8 written in TCW
Internal reset
signal
512 φOSC clock cycles
Figure 9.18 Typical Watchdog Timer Operations (Example)
9.6.4
Watchdog Timer Operation States
Table 9.18 summarizes the watchdog timer operation states.
Table 9.18 Watchdog Timer Operation States
Operation Mode
Reset Active
TCW
Reset
Functions Functions Halted
TCSRW
Reset
Functions Functions Retained
Note:
*
Sleep
Watch
Subactive
Standby
Module
Standby
Functions/ Halted
Halted*
Halted
Halted
Functions/ Retained
Halted*
Retained
Retained
Functions when φw/32 is selected as the input clock.
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Subsleep
Section 9 Timers
9.7
Asynchronous Event Counter (AEC)
9.7.1
Overview
The asynchronous event counter is incremented by external event clock input.
1. Features
Features of the asynchronous event counter are given below.
• Can count asynchronous events
Can count external events input asynchronously without regard to the operation of base clocks
φ and φSUB.
The counter has a 16-bit configuration, enabling it to count up to 65536 (216) events.
 Can also be used as two independent 8-bit event counter channels.
 Counter resetting and halting of the count-up function controllable by software
 Automatic interrupt generation on detection of event counter overflow
 Use of module standby mode enables this module to be placed in standby mode
independently when not used.
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Section 9 Timers
2. Block Diagram
Figure 9.19 shows a block diagram of the asynchronous event counter.
IRREC
OVH
ECH
CK
ECL
CK
AEVH
Internal data bus
ECCSR
OVL
AEVL
Legend:
ECCSR:
ECH:
ECL:
AEVH:
AEVL:
IRREC:
Event counter control/status register
Event counter H
Event counter L
Asynchronous event input H
Asynchronous event input L
Event counter overflow interrupt request flag
Figure 9.19 Block Diagram of Asynchronous Event Counter
3. Pin Configuration
Table 9.19 shows the asynchronous event counter pin configuration.
Table 9.19 Pin Configuration
Name
Abbr.
Asynchronous event input H
AEVH
Input
Event input pin for input to event counter H
Asynchronous event input L
AEVL
Input
Event input pin for input to event counter L
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I/O
Function
Section 9 Timers
4. Register Configuration
Table 9.20 shows the register configuration of the asynchronous event counter.
Table 9.20 Asynchronous Event Counter Registers
Name
Abbr.
R/W
Initial Value
Address
Event counter control/status register
ECCSR
R/W
H'00
H'FF95
Event counter H
ECH
R
H'00
H'FF96
Event counter L
ECL
R
H'00
H'FF97
Clock stop register 2
CKSTP2
R/W
H'FF
H'FFFB
9.7.2
Register Descriptions
1. Event Counter Control/Status Register (ECCSR)
Bit
7
6
5
4
3
2
1
0
OVH
OVL
—
CH2
CUEH
CUEL
CRCH
CRCL
Initial Value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W*
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Bits 7 and 6 can only be written with 0, for flag clearing.
ECCSR is an 8-bit read/write register that controls counter overflow detection, counter resetting,
and halting of the count-up function.
ECCSR is initialized to H'00 upon reset.
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Bit 7: Counter overflow flag H (OVH)
Bit 7 is a status flag indicating that ECH has overflowed from H'FF to H'00. This flag is set when
ECH overflows. It is cleared by software but cannot be set by software. OVH is cleared by
reading it when set to 1, then writing 0.
When ECH and ECL are used as a 16-bit event counter with CH2 cleared to 0, OVH functions as a
status flag indicating that the 16-bit event counter has overflowed from H'FFFF to H'0000.
Bit 7
OVH
Description
0
ECH has not overflowed
(initial value)
Clearing condition:
After reading OVH = 1, cleared by writing 0 to OVH
1
ECH has overflowed
Setting condition:
Set when ECH overflows from H’FF to H’00
Bit 6: Counter overflow flag L (OVL)
Bit 6 is a status flag indicating that ECL has overflowed from H'FF to H'00. This flag is set when
ECL overflows. It is cleared by software but cannot be set by software. OVL is cleared by
reading it when set to 1, then writing 0.
Bit 6
OVL
Description
0
ECL has not overflowed
Clearing condition:
After reading OVL = 1, cleared by writing 0 to OVL
1
ECL has overflowed
Setting condition:
Set when ECL overflows from H'FF to H'00 while CH2 is set to 1
Bit 5: Reserved bit
Bit 5 is reserved; it can be read and written, and is initialized to 0 upon reset.
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(initial value)
Section 9 Timers
Bit 4: Channel select (CH2)
Bit 4 selects whether ECH and ECL are used as a single-channel 16-bit event counter or as two
independent 8-bit event counter channels. When CH2 is cleared to 0, ECH and ECL function as a
16-bit event counter which is incremented each time an event clock is input to the AEVL pin as
asynchronous event input. In this case, the overflow signal from ECL is selected as the ECH input
clock. When CH2 is set to 1, ECH and ECL function as independent 8-bit event counters which
are incremented each time an event clock is input to the AEVH or AEVL pin, respectively, as
asynchronous event input.
Bit 4
CH2
Description
0
ECH and ECL are used together as a single-channel 16-bit event counter
(initial value)
1
ECH and ECL are used as two independent 8-bit event counter channels
Bit 3: Count-up enable H (CUEH)
Bit 3 enables event clock input to ECH. When 1 is written to this bit, event clock input is enabled
and increments the counter. When 0 is written to this bit, event clock input is disabled and the
ECH value is held. The AEVH pin or the ECL overflow signal can be selected as the event clock
source by bit CH2.
Bit 3
CUEH
Description
0
ECH event clock input is disabled
1
ECH event clock input is enabled
(initial value)
ECH value is held
Bit 2: Count-up enable L (CUEL)
Bit 3 enables event clock input to ECL. When 1 is written to this bit, event clock input is enabled
and increments the counter. When 0 is written to this bit, event clock input is disabled and the
ECL value is held.
Bit 2
CUEL
Description
0
ECL event clock input is disabled
ECL value is held
1
ECL event clock input is enabled
(initial value)
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Bit 1: Counter reset control H (CRCH)
Bit 1 controls resetting of ECH. When this bit is cleared to 0, ECH is reset. When 1 is written to
this bit, the counter reset is cleared and the ECH count-up function is enabled.
Bit 1
CRCH
Description
0
ECH is reset
1
ECH reset is cleared and count-up function is enabled
(initial value)
Bit 0: Counter reset control L (CRCL)
Bit 0 controls resetting of ECL. When this bit is cleared to 0, ECL is reset. When 1 is written to
this bit, the counter reset is cleared and the ECL count-up function is enabled.
Bit 0
CRCL
Description
0
ECL is reset
1
ECL reset is cleared and count-up function is enabled
(initial value)
2. Event Counter H (ECH)
Bit
7
6
5
4
3
2
1
0
ECH7
ECH6
ECH5
ECH4
ECH3
ECH2
ECH1
ECH0
Initial Value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ECH is an 8-bit read-only up-counter that operates either as an independent 8-bit event counter or
as the upper 8-bit up-counter of a 16-bit event counter configured in combination with ECL.
Either the external asynchronous event AEVH pin or the overflow signal from lower 8-bit counter
ECL can be selected as the input clock source by bit CH2. ECH can be cleared to H'00 by
software, and is also initialized to H'00 upon reset.
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Section 9 Timers
3. Event Counter L (ECL)
ECL is an 8-bit read-only up-counter that operates either as an independent 8-bit event counter or
as the lower 8-bit up-counter of a 16-bit event counter configured in combination with ECH. The
event clock from the external asynchronous event AEVL pin is used as the input clock source.
ECL can be cleared to H'00 by software, and is also initialized to H'00 upon reset.
Bit
7
6
5
4
3
2
1
0
ECL7
ECL6
ECL5
ECL4
ECL3
ECL2
ECL1
ECL0
Initial Value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
1
0
4. Clock Stop Register 2 (CKSTPR2)
Bit
7
6
5
4
—
—
—
—
3
2
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
AECKSTP WDCKSTP PWCKSTP LDCKSTP
CKSTPR2 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to the asynchronous event counter is described here. For details of
the other bits, see the sections on the relevant modules.
Bit 3: Asynchronous event counter module standby mode control (AECKSTP)
Bit 3 controls setting and clearing of module standby mode for the asynchronous event counter.
AECKSTP
Description
0
Asynchronous event counter is set to module standby mode
1
Asynchronous event counter module standby mode is cleared
(initial value)
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Section 9 Timers
9.7.3
Operation
1. 16-bit Event Counter Operation
When bit CH2 is cleared to 0 in ECCSR, ECH and ECL operate as a 16-bit event counter. Figure
9.20 shows an example of the software processing when ECH and ECL are used as a 16-bit event
counter.
Start
Clear CH2 to 0
Clear CUEH, CUEL, CRCH, and CRCL to 0
Clear OVH and OVL to 0
Set CUEH, CUEL, CRCH, and CRCL to 1
End
Figure 9.20 Example of Software Processing when Using ECH and ECL as 16-Bit Event
Counter
As CH2 is cleared to 0 by a reset, ECH and ECL operate as a 16-bit event counter after a reset.
They can also be used as a 16-bit event counter by carrying out the software processing shown in
the example in figure 9.20. The operating clock source is asynchronous event input from the
AEVL pin. When the next clock is input after the count value reaches H'FF in both ECH and
ECL, ECH and ECL overflow from H'FFFF to H'0000, the OVH flag is set to 1 in ECCSR, the
ECH and ECL count values each return to H'00, and counting up is restarted. When overflow
occurs, the IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2 is 1 at this time, an interrupt
request is sent to the CPU.
2. 8-bit Event Counter Operation
When bit CH2 is set to 1 in ECCSR, ECH and ECL operate as independent 8-bit event counters.
Figure 9.21 shows an example of the software processing when ECH and ECL are used as 8-bit
event counters.
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Section 9 Timers
Start
Set CH2 to 1
Clear CUEH, CUEL, CRCH, and CRCL to 0
Clear OVH, OVL to 0
Set CUEH, CUEL, CRCH, and CRCL to 1
End
Figure 9.21 Example of Software Processing when Using ECH and ECL as 8-Bit Event
Counters
ECH and ECL can be used as 8-bit event counters by carrying out the software processing shown
in the example in figure 9.20. The 8-bit event counter operating clock source is asynchronous
event input from the AEVH pin for ECH, and asynchronous event input from the AEVL pin for
ECL. When the next clock is input after the ECH count value reaches H'FF, ECH overflows, the
OVH flag is set to 1 in ECCSR, the ECH count value returns to H'00, and counting up is restarted.
Similarly, when the next clock is input after the ECL count value reaches H'FF, ECL overflows,
the OVL flag is set to 1 in ECCSR, the ECL count value returns to H'00, and counting up is
restarted. When overflow occurs, the IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2 is
1 at this time, an interrupt request is sent to the CPU.
9.7.4
Asynchronous Event Counter Operation Modes
Asynchronous event counter operation modes are shown in table 9.21.
Table 9.21 Asynchronous Event Counter Operation Modes
Standby
Module
Standby
ECCSR
Reset
Functions Functions Held*
ECH
Reset
Functions Functions Functions* Functions Functions Functions* Halted
ECL
Reset
Functions Functions Functions* Functions Functions Functions* Halted
*
Watch
Subsleep
Reset Active
Note:
Sleep
Subactive
Operation Mode
Functions Functions Held*
Held
When an asynchronous external event is input, the counter increments but the counter
overflow H/L flags are not affected.
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Section 9 Timers
9.7.5
Application Notes
1. When reading the values in ECH and ECL, the correct value will not be returned if the event
counter increments during the read operation. Therefore, if the counter is being used in the 8bit mode, clear bits CUEH and CUEL in ECCSR to 0 before reading ECH or ECL. If the
counter is being used in the 16-bit mode, clear CUEL only to 0 before reading ECH or ECL.
2. In the H8/3827R Group, if the internal power supply step-down circuit is not used, the
maximum clock frequency to be input to the AEVH and AEVL pins is 16 MHz when Vcc =
4.5 to 5.5 V, 10 MHz when Vcc = 2.7 to 5.5 V, and 4 MHz when Vcc = 1.8 to 5.5 V. If the
internal power step-down circuit is used, the maximum clock frequency to be input is 10 MHz
when Vcc = 2.7 to 5.5 V, and 4 MHz when Vcc = 1.8 to 5.5 V. In the H8/3827S Group, the
maximum clock frequency to be input is 10 MHz when Vcc = 2.7 to 3.6 V, and 4 MHz when
Vcc = 1.8 to 3.6 V. In the H8/38327 Group and H8/38427 Group, the maximum clock
frequency to be input is 16 MHz. In addition, ensure that the high and low widths of the clock
are at least 32 ns. The duty cycle is immaterial.
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Section 9 Timers
Maximum AEVH/AEVL Pin
Input Clock Frequency
Mode
H8/3827R Group
• Internal step-down circuit
not used
VCC = 4.5 to 5.5 V/16 MHz
VCC = 2.7 to 5.5 V/10 MHz
VCC = 1.8 to 5.5 V/4 MHz
• Internal step-down circuit
used
VCC = 2.7 to 5.5 V/10 MHz
VCC = 1.8 to 5.5 V/4 MHz
16-bit mode
8-bit mode
Active (high-speed), sleep (high-speed)
H8/3827S Group
VCC = 2.7 to 3.6 V/10 MHz
VCC = 1.8 to 3.6 V/4 MHz
H8/38327 Group
VCC = 2.7 to 5.5 V/16 MHz
H8/38427 Group
VCC = 4.5 to 5.5 V/16 MHz
VCC = 2.7 to 5.5 V/10 MHz
8-bit mode
8-bit mode
Active (medium-speed), sleep (medium-speed) (φ/16)
2 · fOSC
(φ/32)
fOSC
(φ/64)
1/2 · fOSC
fOSC = 1 MHz to 16 MHz
(φ/128) 1/4 · fOSC
Watch, subactive, subsleep, standby
(φw/2)
1000 kHz
(φw/4)
500 kHz
(φw/8)
250 kHz
φW = 32.768 kHz or 38.4 kHz
3. When AEC uses with 16-bit mode, set CUEH in ECCSR to “1” first, set CRCH in ECCSR to
“1” second, or set both CUEH and CRCH to “1” at same time before clock entry. While AEC
is operating on 16-bit mode, do not change CUEH. Otherwise, ECH will be miscounted up.
Also, to reset the counter, clear CRCH and CRCL to 0 simultaneously or clear CRCL and
CRCH to 0 sequentially, in that order.
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Section 9 Timers
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Section 10 Serial Communication Interface
Section 10 Serial Communication Interface
10.1
Overview
This LSI is provided with two serial communication interfaces, SCI3-1 and SCI3-2. These two
SCIs have identical functions. In this manual, the generic term SCI3 is used to refer to both SCIs.
Serial communication interface 3 (SCI3) can carry out serial data communication in either
asynchronous or synchronous mode. It is also provided with a multiprocessor communication
function that enables serial data to be transferred among processors.
10.1.1
Features
Features of SCI3 are listed below.
• Choice of asynchronous or synchronous mode for serial data communication
 Asynchronous mode
Serial data communication is performed asynchronously, with synchronization provided
character by character. In this mode, serial data can be exchanged with standard
asynchronous communication LSIs such as a Universal Asynchronous
Receiver/Transmitter (UART) or Asynchronous Communication Interface Adapter
(ACIA). A multiprocessor communication function is also provided, enabling serial data
communication among processors.
There is a choice of 16 data transfer formats.
Data length
7, 8, 5 bits
Stop bit length
1 or 2 bits
Parity
Even, odd, or none
Multiprocessor bit
“1” or “0”
Receive error detection
Parity, overrun, and framing errors
Break detection
Break detected by reading the RXD3x pin level directly when a
framing error occurs
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Section 10 Serial Communication Interface
 Synchronous mode
Serial data communication is synchronized with a clock. In his mode, serial data can be
exchanged with another LSI that has a synchronous communication function.
Data length
8 bits
Receive error detection
Overrun errors
• Full-duplex communication
Separate transmission and reception units are provided, enabling transmission and reception to
be carried out simultaneously. The transmission and reception units are both double-buffered,
allowing continuous transmission and reception.
• On-chip baud rate generator, allowing any desired bit rate to be selected
• Choice of an internal or external clock as the transmit/receive clock source
• Six interrupt sources: transmit end, transmit data empty, receive data full, overrun error,
framing error, and parity error
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Section 10 Serial Communication Interface
10.1.2
Block Diagram
Figure 10.1 shows a block diagram of SCI3.
SCK 3x
External
clock
Internal clock (φ/64, φ/16, φw/2, φ)
Baud rate generator
BRC
BRR
SMR
Transmit/receive
control circuit
SCR3
SSR
TXD
TSR
TDR
RSR
RDR
Internal data bus
Clock
SPCR
RXD
Interrupt request
(TEI, TXI, RXI, ERI)
Legend:
RSR:
RDR:
TSR:
TDR:
SMR:
SCR3:
SSR:
BRR:
BRC:
SPCR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register 3
Serial status register
Bit rate register
Bit rate counter
Serial port control register
Figure 10.1 SCI3 Block Diagram
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Section 10 Serial Communication Interface
10.1.3
Pin Configuration
Table 10.1 shows the SCI3 pin configuration.
Table 10.1 Pin Configuration
Name
Abbr.
I/O
Function
SCI3 clock
SCK3x
I/O
SCI3 clock input/output
SCI3 receive data input
RXD3x
Input
SCI3 receive data input
SCI3 transmit data output
TXD3x
Output
SCI3 transmit data output
10.1.4
Register Configuration
Table 10.2 shows the SCI3 register configuration.
Table 10.2 Registers
Name
Abbr.
R/W
Initial Value
Address
Serial mode register
SMR
R/W
H'00
H'FFA8/FF98
Bit rate register
BRR
R/W
H'FF
H'FFA9/FF99
Serial control register 3
SCR3
R/W
H'00
H'FFAA/FF9A
Transmit data register
TDR
R/W
H'FF
H'FFAB/FF9B
Serial data register
SSR
R/W
H'84
H'FFAC/FF9C
Receive data register
RDR
R
H'00
H'FFAD/FF9D
Transmit shift register
TSR
Protected
—
—
Receive shift register
RSR
Protected
—
—
Bit rate counter
BRC
Protected
—
—
Clock stop register 1
CKSTPR1
R/W
H'FF
H'FFFA
Serial port control register
SPCR
R/W
H'C0
H'FF91
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Section 10 Serial Communication Interface
10.2
Register Descriptions
10.2.1
Receive Shift Register (RSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
RSR is a register used to receive serial data. Serial data input to RSR from the RXD3x pin is set in
the order in which it is received, starting from the LSB (bit 0), and converted to parallel data.
When one byte of data is received, it is transferred to RDR automatically.
RSR cannot be read or written directly by the CPU.
10.2.2
Receive Data Register (RDR)
Bit
7
6
5
4
3
2
1
0
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
RDR is an 8-bit register that stores received serial data.
When reception of one byte of data is finished, the received data is transferred from RSR to RDR,
and the receive operation is completed. RSR is then able to receive data. RSR and RDR are
double-buffered, allowing consecutive receive operations.
RDR is a read-only register, and cannot be written by the CPU.
RDR is initialized to H'00 upon reset, and in standby, module standby or watch mode.
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Section 10 Serial Communication Interface
10.2.3
Transmit Shift Register (TSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
TSR is a register used to transmit serial data. Transmit data is first transferred from TDR to TSR,
and serial data transmission is carried out by sending the data to the TXD3x pin in order, starting
from the LSB (bit 0). When one byte of data is transmitted, the next byte of transmit data is
transferred to TDR, and transmission started, automatically. Data transfer from TDR to TSR is
not performed if no data has been written to TDR (if bit TDRE is set to 1 in the serial status
register (SSR)).
TSR cannot be read or written directly by the CPU.
10.2.4
Transmit Data Register (TDR)
Bit
7
6
5
4
3
2
1
0
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
TDR is an 8-bit register that stores transmit data. When TSR is found to be empty, the transmit
data written in TDR is transferred to TSR, and serial data transmission is started. Continuous
transmission is possible by writing the next transmit data to TDR during TSR serial data
transmission.
TDR can be read or written by the CPU at any time.
TDR is initialized to H'FF upon reset, and in standby, module standby, or watch mode.
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Section 10 Serial Communication Interface
10.2.5
Serial Mode Register (SMR)
Bit
7
6
5
4
3
2
1
0
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SMR is an 8-bit register used to set the serial data transfer format and to select the clock source for
the baud rate generator.
SMR can be read or written by the CPU at any time.
SMR is initialized to H'00 upon reset, and in standby, module standby, or watch mode.
Bit 7: Communication mode (COM)
Bit 7 selects whether SCI3 operates in asynchronous mode or synchronous mode.
Bit 7
COM
Description
0
Asynchronous mode
1
Synchronous mode
(initial value)
Bit 6: Character length (CHR)
Bit 6 selects either 7 or 8 bits as the data length to be used in asynchronous mode. In synchronous
mode the data length is always 8 bits, irrespective of the bit 6 setting.
Bit 6
CHR
0
1
Description
8-bit data/5-bit data*
1
2
7-bit data* /5-bit data*
2
(initial value)
Notes: 1. When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted.
2. When 5-bit data is selected, set both PE and MP to 1. The three most significant bits
(bits 7, 6, and 5) of TDR are not transmitted.
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Section 10 Serial Communication Interface
Bit 5: Parity enable (PE)
Bit 5 selects whether a parity bit is to be added during transmission and checked during reception
in asynchronous mode. In synchronous mode parity bit addition and checking is not performed,
irrespective of the bit 5 setting.
Bit 5
PE
0
1
Description
Parity bit addition and checking disabled*
1 2
Parity bit addition and checking enabled* *
2
(initial value)
Notes: 1. When PE is set to 1, even or odd parity, as designated by bit PM, is added to transmit
data before it is sent, and the received parity bit is checked against the parity
designated by bit PM.
2. For the case where 5-bit data is selected, see table 10.11.
Bit 4: Parity mode (PM)
Bit 4 selects whether even or odd parity is to be used for parity addition and checking. The PM bit
setting is only valid in asynchronous mode when bit PE is set to 1, enabling parity bit addition and
checking. The PM bit setting is invalid in synchronous mode, and in asynchronous mode if parity
bit addition and checking is disabled.
Bit 4
PM
0
1
Description
Even parity*
2
Odd parity*
1
(initial value)
Notes: 1. When even parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an even number; in reception,
a check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an even number.
2. When odd parity is selected, a parity bit is added in transmission so that the total
number of 1 bits in the transmit data plus the parity bit is an odd number; in reception, a
check is carried out to confirm that the number of 1 bits in the receive data plus the
parity bit is an odd number.
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Section 10 Serial Communication Interface
Bit 3: Stop bit length (STOP)
Bit 3 selects 1 bit or 2 bits as the stop bit length is asynchronous mode. The STOP bit setting is
only valid in asynchronous mode. When synchronous mode is selected the STOP bit setting is
invalid since stop bits are not added.
Bit 3
STOP
Description
1 stop bit*
2
2 stop bits*
1
0
1
(initial value)
Notes: 1. In transmission, a single 1 bit (stop bit) is added at the end of a transmit character.
2. In transmission, two 1 bits (stop bits) are added at the end of a transmit character.
In reception, only the first of the received stop bits is checked, irrespective of the STOP bit setting.
If the second stop bit is 1 it is treated as a stop bit, but if 0, it is treated as the start bit of the next
transmit character.
Bit 2: Multiprocessor mode (MP)
Bit 2 enables or disables the multiprocessor communication function. When the multiprocessor
communication function is disabled, the parity settings in the PE and PM bits are invalid. The MP
bit setting is only valid in asynchronous mode. When synchronous mode is selected the MP bit
should be set to 0. For details on the multiprocessor communication function, see section 10.3.4,
Multiprocessor Communication Function.
Bit 2
MP
Description
Multiprocessor communication function disabled*
Multiprocessor communication function enabled*
0
1
Note:
*
(initial value)
For the case where 5-bit data is selected, see table 10.11.
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Section 10 Serial Communication Interface
Bits 1 and 0: Clock select 1, 0 (CKS1, CKS0)
Bits 1 and 0 choose φ/64, φ/16, φw/2, or φ as the clock source for the baud rate generator.
For the relation between the clock source, bit rate register setting, and baud rate, see section
10.2.8, Bit rate register (BRR).
Bit 1
CKS1
Bit 0
CKS0
Description
0
0
φ clock
(initial value)
*1
0
1
φ w/2 clock /φ w clock
1
0
φ/16 clock
1
1
φ/64 clock
*2
Notes: 1. φ w/2 clock in active (medium-speed/high-speed) mode and sleep mode
2. φ w clock in subactive mode and subsleep mode
In subactive or subsleep mode, SCI3 can be operated when CPU clock is φw/2 only.
10.2.6
Serial Control Register 3 (SCR3)
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR3 is an 8-bit register for selecting transmit or receive operation, the asynchronous mode clock
output, interrupt request enabling or disabling, and the transmit/receive clock source.
SCR3 can be read or written by the CPU at any time.
SCR3 is initialized to H'00 upon reset, and in standby, module standby or watch mode.
Bit 7: Transmit interrupt enable (TIE)
Bit 7 selects enabling or disabling of the transmit data empty interrupt request (TXI) when
transmit data is transferred from the transmit data register (TDR) to the transmit shift register
(TSR), and bit TDRE in the serial status register (SSR) is set to 1.
TXI can be released by clearing bit TDRE or bit TIE to 0.
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Section 10 Serial Communication Interface
Bit 7
TIE
Description
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
(initial value)
Bit 6: Receive interrupt enable (RIE)
Bit 6 selects enabling or disabling of the receive data full interrupt request (RXI) and the receive
error interrupt request (ERI) when receive data is transferred from the receive shift register (RSR)
to the receive data register (RDR), and bit RDRF in the serial status register (SSR) is set to 1.
There are three kinds of receive error: overrun, framing, and parity.
RXI can be released by clearing bit RDRF or the FER, PER, or OER error flag to 0, or by clearing
bit RIE to 0.
Bit 6
RIE
Description
0
Receive data full interrupt request (RXI) and receive error interrupt
request (ERI) disabled
1
Receive data full interrupt request (RXI) and receive error interrupt
request (ERI) enabled
(initial value)
Bit 5: Transmit enable (TE)
Bit 5 selects enabling or disabling of the start of transmit operation.
Bit 5
TE
0
1
Description
Transmit operation disabled* (TXD pin is I/O port)
2
Transmit operation enabled* (TXD pin is transmit data pin)
1
(initial value)
Notes: 1. Bit TDRE in SSR is fixed at 1.
2. When transmit data is written to TDR in this state, bit TDR in SSR is cleared to 0 and
serial data transmission is started. Be sure to carry out serial mode register (SMR)
settings, and setting of bit SPC31 or SPC32 in SPCR, to decide the transmission format
before setting bit TE to 1.
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Section 10 Serial Communication Interface
Bit 4: Receive enable (RE)
Bit 4 selects enabling or disabling of the start of receive operation.
Bit 4
RE
Description
Receive operation disabled* (RXD pin is I/O port)
2
Receive operation enabled* (RXD pin is receive data pin)
1
0
1
(initial value)
Notes: 1. Note that the RDRF, FER, PER, and OER flags in SSR are not affected when bit RE is
cleared to 0, and retain their previous state.
2. In this state, serial data reception is started when a start bit is detected in asynchronous
mode or serial clock input is detected in synchronous mode. Be sure to carry out serial
mode register (SMR) settings to decide the reception format before setting bit RE to 1.
Bit 3: Multiprocessor interrupt enable (MPIE)
Bit 3 selects enabling or disabling of the multiprocessor interrupt request. The MPIE bit setting is
only valid when asynchronous mode is selected and reception is carried out with bit MP in SMR
set to 1. The MPIE bit setting is invalid when bit COM is set to 1 or bit MP is cleared to 0.
Bit 3
MPIE
Description
0
Multiprocessor interrupt request disabled (normal receive operation)
Clearing condition:
When data is received in which the multiprocessor bit is set to 1
Multiprocessor interrupt request enabled*
1
Note:
*
(initial value)
Receive data transfer from RSR to RDR, receive error detection, and setting of the
RDRF, FER, and OER status flags in SSR is not performed. RXI, ERI, and setting of
the RDRF, FER, and OER flags in SSR, are disabled until data with the multiprocessor
bit set to 1 is received. When a receive character with the multiprocessor bit set to 1 is
received, bit MPBR in SSR is set to 1, bit MPIE is automatically cleared to 0, and RXI
and ERI requests (when bits TIE and RIE in serial control register 3 (SCR3) are set to
1) and setting of the RDRF, FER, and OER flags are enabled.
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Section 10 Serial Communication Interface
Bit 2: Transmit end interrupt enable (TEIE)
Bit 2 selects enabling or disabling of the transmit end interrupt request (TEI) if there is no valid
transmit data in TDR when MSB data is to be sent.
Bit 2
TEIE
Description
0
Transmit end interrupt request (TEI) disabled
Transmit end interrupt request (TEI) enabled*
1
Note:
*
(initial value)
TEI can be released by clearing bit TDRE to 0 and clearing bit TEND to 0 in SSR, or by
clearing bit TEIE to 0.
Bits 1 and 0: Clock enable 1 and 0 (CKE1, CKE0)
Bits 1 and 0 select the clock source and enabling or disabling of clock output from the SCK3x pin.
The combination of CKE1 and CKE0 determines whether the SCK3x pin functions as an I/O port,
a clock output pin, or a clock input pin.
The CKE0 bit setting is only valid in case of internal clock operation (CKE1 = 0) in asynchronous
mode. In synchronous mode, or when external clock operation is used (CKE1 = 1), bit CKE0
should be cleared to 0.
After setting bits CKE1 and CKE0, set the operating mode in the serial mode register (SMR).
For details on clock source selection, see table 10.9 in 10.3.1, Overview.
Description
Bit 1
CKE1
Bit 0
CKE0
Communication Mode
Clock Source
SCK3x Pin Function
0
0
Asynchronous
Internal clock
I/O port*
Synchronous
Internal clock
Asynchronous
Internal clock
Serial clock output*
2
Clock output*
Synchronous
Reserved
External clock
Clock input*
Serial clock input
0
1
1
0
Asynchronous
Synchronous
External clock
1
1
Asynchronous
Reserved
Synchronous
Reserved
1
1
3
Notes: 1. Initial value
2. A clock with the same frequency as the bit rate is output.
3. Input a clock with a frequency 16 times the bit rate.
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Section 10 Serial Communication Interface
10.2.7
Serial Status Register (SSR)
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
Initial value
1
0
R/(W)*
0
R/(W)*
0
R/(W)*
0
0
R/(W)*
0
R/(W)*
1
Read/Write
R
R
R/W
Note: * Only a write of 0 for flag clearing is possible.
SSR is an 8-bit register containing status flags that indicate the operational status of SCI3, and
multiprocessor bits.
SSR can be read or written by the CPU at any time, but only a write of 1 is possible to bits TDRE,
RDRF, OER, PER, and FER. In order to clear these bits by writing 0, 1 must first be read.
Bits TEND and MPBR are read-only bits, and cannot be modified.
SSR is initialized to H'84 upon reset, and in standby, module standby, or watch mode.
Bit 7: Transmit data register empty (TDRE)
Bit 7 indicates that transmit data has been transferred from TDR to TSR.
Bit 7
TDRE
Description
0
Transmit data written in TDR has not been transferred to TSR
Clearing conditions:
After reading TDRE = 1, cleared by writing 0 to TDRE
When data is written to TDR by an instruction
1
Transmit data has not been written to TDR, or transmit data written in TDR has been
transferred to TSR
Setting conditions:
When bit TE in SCR3 is cleared to 0
When data is transferred from TDR to TSR
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(initial value)
Section 10 Serial Communication Interface
Bit 6: Receive data register full (RDRF)
Bit 6 indicates that received data is stored in RDR.
Bit 6
RDRF
Description
0
There is no receive data in RDR
(initial value)
Clearing conditions:
After reading RDRF = 1, cleared by writing 0 to RDRF
When RDR data is read by an instruction
1
There is receive data in RDR
Setting condition:
When reception ends normally and receive data is transferred from RSR to RDR
Note: If an error is detected in the receive data, or if the RE bit in SCR3 has been cleared to 0,
RDR and bit RDRF are not affected and retain their previous state.
Note that if data reception is completed while bit RDRF is still set to 1, an overrun error
(OER) will result and the receive data will be lost.
Bit 5: Overrun error (OER)
Bit 5 indicates that an overrun error has occurred during reception.
Bit 5
OER
Description
0
Reception in progress or completed*
1
(initial value)
Clearing condition:
After reading OER = 1, cleared by writing 0 to OER
1
An overrun error has occurred during reception*
2
Setting condition:
When reception is completed with RDRF set to 1
Notes: 1. When bit RE in SCR3 is cleared to 0, bit OER is not affected and retains its previous
state.
2. RDR retains the receive data it held before the overrun error occurred, and data
received after the error is lost. Reception cannot be continued with bit OER set to 1,
and in synchronous mode, transmission cannot be continued either.
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Section 10 Serial Communication Interface
Bit 4: Framing error (FER)
Bit 4 indicates that a framing error has occurred during reception in asynchronous mode.
Bit 4
FER
Description
0
Reception in progress or completed*
1
(initial value)
Clearing condition:
After reading FER = 1, cleared by writing 0 to FER
1
A framing error has occurred during reception
Setting condition:
When the stop bit at the end of the receive data is checked for a value of 1 at the end
2
of reception, and the stop bit is 0*
Notes: 1. When bit RE in SCR3 is cleared to 0, bit FER is not affected and retains its previous
state.
2. Note that, in 2-stop-bit mode, only the first stop bit is checked for a value of 1, and the
second stop bit is not checked. When a framing error occurs the receive data is
transferred to RDR but bit RDRF is not set. Reception cannot be continued with bit
FER set to 1. In synchronous mode, neither transmission nor reception is possible
when bit FER is set to 1.
Bit 3: Parity error (PER)
Bit 3 indicates that a parity error has occurred during reception with parity added in asynchronous
mode.
Bit 3
PER
Description
0
Reception in progress or completed*
1
(initial value)
Clearing condition:
After reading PER = 1, cleared by writing 0 to PER
1
A parity error has occurred during reception*
2
Setting condition:
When the number of 1 bits in the receive data plus parity bit does not match the
parity designated by bit PM in the serial mode register (SMR)
Notes: 1. When bit RE in SCR3 is cleared to 0, bit PER is not affected and retains its previous
state.
2. Receive data in which it a parity error has occurred is still transferred to RDR, but bit
RDRF is not set. Reception cannot be continued with bit PER set to 1. In synchronous
mode, neither transmission nor reception is possible when bit FER is set to 1.
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Section 10 Serial Communication Interface
Bit 2: Transmit end (TEND)
Bit 2 indicates that bit TDRE is set to 1 when the last bit of a transmit character is sent.
Bit 2 is a read-only bit and cannot be modified.
Bit 2
TEND
Description
0
Transmission in progress
Clearing conditions:
After reading TDRE = 1, cleared by writing 0 to TDRE
When data is written to TDR by an instruction
1
Transmission ended
(initial value)
Setting conditions:
When bit TE in SCR3 is cleared to 0
When bit TDRE is set to 1 when the last bit of a transmit character is sent
Bit 1: Multiprocessor bit receive (MPBR)
Bit 1 stores the multiprocessor bit in a receive character during multiprocessor format reception in
asynchronous mode.
Bit 1 is a read-only bit and cannot be modified.
Bit 1
MPBR
Description
0
Data in which the multiprocessor bit is 0 has been received*
1
Data in which the multiprocessor bit is 1 has been received
Note:
*
(initial value)
When bit RE is cleared to 0 in SCR3 with the multiprocessor format, bit MPBR is not
affected and retains its previous state.
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Section 10 Serial Communication Interface
Bit 0: Multiprocessor bit transfer (MPBT)
Bit 0 stores the multiprocessor bit added to transmit data when transmitting in asynchronous
mode. The bit MPBT setting is invalid when synchronous mode is selected, when the
multiprocessor communication function is disabled, and when not transmitting.
Bit 0
MPBT
Description
0
A 0 multiprocessor bit is transmitted
1
A 1 multiprocessor bit is transmitted
10.2.8
(initial value)
Bit Rate Register (BRR)
Bit
7
6
5
4
3
2
1
0
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
BRR is an 8-bit register that designates the transmit/receive bit rate in accordance with the baud
rate generator operating clock selected by bits CKS1 and CKS0 of the serial mode register (SMR).
BRR can be read or written by the CPU at any time.
BRR is initialized to H'FF upon reset, and in standby, module standby, or watch mode.
Table 10.3 shows examples of BRR settings in asynchronous mode. The values shown are for
active (high-speed) mode.
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Section 10 Serial Communication Interface
Table 10.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)
OSC
38.4 kHz
32.8 kHz
Bit Rate
(bit/s)
n
N
Error
(%) n
200
Cannot be used, —
as error
0
exceeds 3%
0
250
110
150
2 MHz
2.4576 MHz
4 MHz
N
Error
(%) n
N
Error
(%) n
N
Error
(%) n
N
Error
(%)
—
—
—
—
2
21
–0.83 —
—
—
—
3
0
2
12
0.16
3
3
0
2
25
0.16
2
0
0
155 0.16
3
2
0
—
—
—
—
—
—
0
124 0
0
153 –0.26 0
249 0
300
0
1
0
0
103 0.16
3
1
0
2
12
600
0
0
0
0
51
0.16
3
0
0
0
103 0.16
1200
—
—
—
0
25
0.16
2
1
0
0
51
0.16
2400
—
—
—
0
12
0.16
2
0
0
0
25
0.16
4800
—
—
—
—
—
—
0
7
0
0
12
0.16
9600
—
—
—
—
—
—
0
3
0
—
—
—
19200
—
—
—
—
—
—
0
1
0
—
—
—
31250
—
—
—
0
0
0
—
—
—
0
1
0
38400
—
—
—
—
—
—
0
0
0
—
—
—
0.16
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Section 10 Serial Communication Interface
Table 10.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)
OSC
16 MHz
10 MHz
Bit Rate
(bit/s)
n
N
Error
(%) n
N
110
2
88
-0.25 2
141 0.03
2
Error
(%)
150
2
64
0.16
200
2
48
-0.35 2
77
103 0.16
0.16
250
2
38
0.16
2
62
-0.79
300
—
—
—
2
51
0.16
600
—
—
—
2
25
0.16
1200
0
129 0.16
0
207 0.16
2400
0
64
0.16
0
103 0.16
4800
—
—
—
0
51
0.16
9600
—
—
—
0
25
0.16
19200
—
—
—
0
12
0.16
31250
0
4
0
0
7
0
38400
—
—
—
—
—
—
Notes: 1. The setting should be made so that the error is not more than 1%.
2. The value set in BRR is given by the following equation:
N=
where B:
N:
OSC
(64 × 22n × B)
–1
Bit rate (bit/s)
Baud rate generator BRR setting (0 ≤ N ≤ 255)
OSC: Value of φOSC (Hz)
n:
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 10.4.)
3. The error in table 10.3 is the value obtained from the following equation, rounded to
two decimal places.
Error (%) =
B (rate obtained from n, N, OSC) — R(bit rate in left-hand column in table 10.3.)
R (bit rate in left-hand column in table 10.3.)
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× 100
Section 10 Serial Communication Interface
Table 10.4 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
0
1
2
φw/2* /φw*
0
1
2
φ/16
1
0
3
φ/64
1
1
Notes: 1. φ w/2 clock in active (medium-speed/high-speed) mode and sleep mode
2. φ w clock in subactive mode and subsleep mode
In subactive or subsleep mode, SCI3 can be operated when CPU clock is φw/2 only.
Table 10.5 shows the maximum bit rate for each frequency. The values shown are for active
(high-speed) mode.
Table 10.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
Setting
OSC (MHz)
Maximum Bit Rate (bit/s)
n
N
0.0384*
600
0
0
2
31250
0
0
2.4576
38400
0
0
4
62500
0
0
10
156250
0
0
16
250000
0
0
*: When SMR is set up to CKS1 = “0”, CKS0 = “1”.
Table 10.6 shows examples of BRR settings in synchronous mode. The values shown are for
active (high-speed) mode.
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Section 10 Serial Communication Interface
Table 10.6 Examples of BRR Settings for Various Bit Rates (Synchronous Mode)
OSC
2 MHz
4 MHz
Error n
N
Error n
N
Error n
N
Error n
N
Error
23
0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2
124 0
—
—
—
3
124 0
2
0
0
—
—
—
—
—
—
—
—
—
—
500
—
—
—
—
—
—
—
—
—
2
249 0
1k
0
249 0
—
—
—
—
—
—
2
124 0
2.5k
0
99
0
0
199 0
—
—
—
2
49
0
5k
0
49
0
0
99
0
0
249 0
2
24
0
10k
0
24
0
0
49
0
0
124 0
0
199 0
25k
0
9
0
0
19
0
0
49
0
0
79
0
50k
0
4
0
0
9
0
0
24
0
0
39
0
100k
—
—
—
0
4
0
—
—
—
0
19
0
250k
0
0
0
0
1
0
0
4
0
0
7
0
0
0
0
—
—
—
0
3
0
—
—
—
0
1
0
38.4 kHz
Bit Rate
(bit/s)
n
N
200
0
250
300
500k
1M
—
10 MHz
16 MHz
Blank: Cannot be set.
—:
A setting can be made, but an error will result.
Notes: The value set in BRR is given by the following equation:
N=
where B:
N:
OSC
(8 × 22n × B)
–1
Bit rate (bit/s)
Baud rate generator BRR setting (0 ≤ N ≤ 255)
OSC: Value of φOSC (Hz)
n:
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 10.7.)
Rev. 6.00 Aug 04, 2006 page 336 of 626
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—
Section 10 Serial Communication Interface
Table 10.7 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
0
1
2
φw/2* /φw*
0
1
2
φ/16
1
0
3
φ/64
1
1
Notes: 1. φw/2 clock in active (medium-speed/high-speed) mode and sleep mode
2. φw clock in subactive mode and subsleep mode
In subactive or subsleep mode, SCI3 can be operated when CPU clock is φw/2 only.
10.2.9
Clock Stop Register 1 (CKSTPR1)
Bit
7
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bits relating to SCI3 are described here. For details of the other bits, see the
sections on the relevant modules.
Bit 6: SCI3-1 module standby mode control (S31CKSTP)
Bit 6 controls setting and clearing of module standby mode for SCI31.
S31CKSTP
Description
0
SCI3-1 is set to module standby mode
1
SCI3-1 module standby mode is cleared
(initial value)
Note: All SCI31 register is initialized in module standby mode.
Bit 5: SCI3-2 module standby mode control (S32CKSTP)
Bit 5 controls setting and clearing of module standby mode for SCI32.
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Section 10 Serial Communication Interface
S32CKSTP
Description
0
SCI3-2 is set to module standby mode
1
SCI3-2 module standby mode is cleared
(initial value)
Note: All SCI32 register is initialized in module standby mode.
10.2.10
Serial Port Control Register (SPCR)
Bit
7
6
5
4
—
—
SPC32
SPC31
3
2
1
0
SCINV3 SCINV2 SCINV1 SCINV0
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
SPCR is an 8-bit readable/writable register that performs RXD31, RXD32, TXD31, and TXD32 pin
input/output data inversion switching. SPCR is initialized to H'C0 by a reset.
Bits 7 to 6: Reserved bits
Bits 7 to 6 are reserved; they are always read as 1 and cannot be modified.
Bit 5: P42/TXD32 pin function switch (SPC32)
This bit selects whether pin P42/TXD32 is used as P42 or as TXD32.
Bit 5
SPC32
Description
0
Functions as P42 I/O pin
1
Functions as TXD32 output pin*
Note:
*
(initial value)
Set the TE bit in SCR3 after setting this bit to 1.
Bit 4: P35/TXD31 pin function switch (SPC31)
This bit selects whether pin P35/TXD31 is used as P35 or as TXD31.
Bit 4
SPC31
Description
0
Functions as P35 I/O pin
1
Functions as TXD31 output pin*
Note:
*
Set the TE bit in SCR3 after setting this bit to 1.
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(initial value)
Section 10 Serial Communication Interface
Bit 3: TXD32 pin output data inversion switch
Bit 3 specifies whether or not TXD32 pin output data is to be inverted.
Bit 3
SCINV3
Description
0
TXD32 output data is not inverted
1
TXD32 output data is inverted
(initial value)
Bit 2: RXD32 pin input data inversion switch
Bit 2 specifies whether or not RXD32 pin input data is to be inverted.
Bit 2
SCINV2
Description
0
RXD32 input data is not inverted
1
RXD32 input data is inverted
(initial value)
Bit 1: TXD31 pin output data inversion switch
Bit 1 specifies whether or not TXD31 pin output data is to be inverted.
Bit 1
SCINV1
Description
0
TXD31 output data is not inverted
1
TXD31 output data is inverted
(initial value)
Bit 0: RXD31 pin input data inversion switch
Bit 0 specifies whether or not RXD31 pin input data is to be inverted.
Bit 0
SCINV0
Description
0
RXD31 input data is not inverted
1
RXD31 input data is inverted
(initial value)
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Section 10 Serial Communication Interface
10.3
Operation
10.3.1
Overview
SCI3 can perform serial communication in two modes: asynchronous mode in which
synchronization is provided character by character, and synchronous mode in which
synchronization is provided by clock pulses. The serial mode register (SMR) is used to select
asynchronous or synchronous mode and the data transfer format, as shown in table 10.8.
The clock source for SCI3 is determined by bit COM in SMR and bits CKE1 and CKE0 in SCR3,
as shown in table 10.9.
1. Synchronous Mode
• Choice of 5-, 7-, or 8-bit data length
• Choice of parity addition, multiprocessor bit addition, and addition of 1 or 2 stop bits. (The
combination of these parameters determines the data transfer format and the character length.)
• Framing error (FER), parity error (PER), overrun error (OER), and break detection during
reception
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a clock
with the same frequency as the bit rate can be output.
When external clock is selected: A clock with a frequency 16 times the bit rate must be input.
(The on-chip baud rate generator is not used.)
2. Synchronous Mode
• Data transfer format: Fixed 8-bit data length
• Overrun error (OER) detection during reception
• Choice of internal or external clock as the clock source
When internal clock is selected: SCI3 operates on the baud rate generator clock, and a serial
clock is output.
When external clock is selected: The on-chip baud rate generator is not used, and SCI3
operates on the input serial clock.
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Section 10 Serial Communication Interface
Table 10.8 SMR Settings and Corresponding Data Transfer Formats
SMR
Data Transfer Format
Bit 7 Bit 6
COM CHR
Bit 2
MP
Bit 5
PE
Bit 3
STOP Mode
0
0
0
0
0
1
1
Data
Length
Multiprocessor Parity Stop Bit
Bit
Bit
Length
Asynchronous 8-bit data No
mode
0
No
2 bits
Yes
1
1
0
7-bit data
No
1
0
1
0
0
Yes
1 bit
No
1 bit
2 bits
8-bit data Yes
1
1
2 bits
0
5-bit data No
1 bit
1
1
0
2 bits
0
7-bit data Yes
1 bit
1
1
2 bits
0
5-bit data No
Yes
1
1
*
0
*
*
1 bit
2 bits
1
0
1 bit
2 bits
0
1
1 bit
1 bit
2 bits
Synchronous
mode
8-bit data No
No
No
*: Don’t care
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Section 10 Serial Communication Interface
Table 10.9 SMR and SCR3 Settings and Clock Source Selection
SMR
SCR3
Bit 7 Bit 1
Bit 0
Transmit/Receive Clock
COM CKE1 CKE0 Mode
0
0
0
1
Clock Source SCK3x Pin Function
Asynchronous Internal
mode
Outputs clock with same frequency as bit rate
1
0
0
0
1
0
Synchronous
mode
0
1
1
Reserved (Do not specify these combinations)
1
0
1
1
1
1
1
External
I/O port (SCK3x pin not used)
Outputs clock with frequency 16 times bit rate
Internal
Outputs serial clock
External
Inputs serial clock
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Section 10 Serial Communication Interface
3. Interrupts and Continuous Transmission/Reception
SCI3 can carry out continuous reception using RXI and continuous transmission using TXI.
These interrupts are shown in table 10.10.
Table 10.10 Transmit/Receive Interrupts
Interrupt
Flags
Interrupt Request Conditions
Notes
RXI
RDRF
RIE
When serial reception is performed
normally and receive data is transferred
from RSR to RDR, bit RDRF is set to 1,
and if bit RIE is set to 1 at this time, RXI
is enabled and an interrupt is requested.
(See figure 10.2(a).)
The RXI interrupt routine reads the
receive data transferred to RDR and
clears bit RDRF to 0. Continuous
reception can be performed by
repeating the above operations until
reception of the next RSR data is
completed.
TXI
TDRE
TIE
When TSR is found to be empty (on
completion of the previous transmission)
and the transmit data placed in TDR is
transferred to TSR, bit TDRE is set to 1.
If bit TIE is set to 1 at this time, TXI is
enabled and an interrupt is requested.
(See figure 10.2(b).)
The TXI interrupt routine writes the
next transmit data to TDR and clears
bit TDRE to 0. Continuous
transmission can be performed by
repeating the above operations until
the data transferred to TSR has
been transmitted.
TEI
TEND
TEIE
When the last bit of the character in
TSR is transmitted, if bit TDRE is set to
1, bit TEND is set to 1. If bit TEIE is set
to 1 at this time, TEI is enabled and an
interrupt is requested. (See figure
10.2(c).)
TEI indicates that the next transmit
data has not been written to TDR
when the last bit of the transmit
character in TSR is sent.
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Section 10 Serial Communication Interface
RDR
RDR
RSR (reception in progress)
RSR↑ (reception completed, transfer)
RXD3x pin
RXD3x pin
RDRF ← 1
(RXI request when RIE = 1)
RDRF = 0
Figure 10.2 (a) RDRF Setting and RXI Interrupt
TDR (next transmit data)
TDR
TSR (transmission in progress)
TXD3x pin
TSR↓ (transmission completed, transfer)
TXD3x pin
TDRE ← 1
(TXI request when TIE = 1)
TDRE = 0
Figure 10.2 (b) TDRE Setting and TXI Interrupt
TDR
TDR
TSR (transmission in progress)
TXD3x pin
TSR (reception completed)
TXD3x pin
TEND = 0
TEND ← 1
(TEI request when TEIE = 1)
Figure 10.2 (c) TEND Setting and TEI Interrupt
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Section 10 Serial Communication Interface
10.3.2
Operation in Asynchronous Mode
In asynchronous mode, serial communication is performed with synchronization provided
character by character. A start bit indicating the start of communication and one or two stop bits
indicating the end of communication are added to each character before it is sent.
SCI3 has separate transmission and reception units, allowing full-duplex communication. As the
transmission and reception units are both double-buffered, data can be written during transmission
and read during reception, making possible continuous transmission and reception.
1. Data Transfer Format
The general data transfer format in asynchronous communication is shown in figure 10.3.
(LSB)
Serial
data
(MSB)
1
Start
bit
Transmit/receive data
Parity
bit
1 bit
5, 7, or 8 bits
1 bit
or none
Stop
bit(s)
Mark
state
1 or 2 bits
One transfer data unit (character or frame)
Figure 10.3 Data Format in Asynchronous Communication
In asynchronous communication, the communication line is normally in the mark state (high
level). SCI3 monitors the communication line and when it detects a space (low level), identifies
this as a start bit and begins serial data communication.
One transfer data character consists of a start bit (low level), followed by transmit/receive data
(LSB-first format, starting from the least significant bit), a parity bit (high or low level), and
finally one or two stop bits (high level).
In asynchronous mode, synchronization is performed by the falling edge of the start bit during
reception. The data is sampled on the 8th pulse of a clock with a frequency 16 times the bit
period, so that the transfer data is latched at the center of each bit.
Table 10.11 shows the 16 data transfer formats that can be set in asynchronous mode. The format
is selected by the settings in the serial mode register (SMR).
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Section 10 Serial Communication Interface
Table 10.11 Data Transfer Formats (Asynchronous Mode)
SMR
CHR PE
Serial Data Transfer Format and Frame Length
MP
STOP
1
2
3
4
5
6
7
8
9
10 11 12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
0
1
0
S
8-bit data
MPB STOP
S
8-bit data
MPB STOP STOP
S
8-bit data
P
STOP
S
8-bit data
P
STOP STOP
S
5-bit data
STOP
S
5-bit data
STOP STOP
S
7-bit data
STOP
S
7-bit data
STOP STOP
S
7-bit data
MPB STOP
S
7-bit data
MPB STOP STOP
S
7-bit data
P
STOP
P
STOP STOP
0
0
1
1
0
1
0
0
0
0
0
1
1
1
1
1
0
0
0
1
1
0
0
1
0
1
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
S
7-bit data
1
1
1
0
S
5-bit data
P
STOP
1
1
1
1
S
5-bit data
P
STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
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Section 10 Serial Communication Interface
2. Clock
Either an internal clock generated by the baud rate generator or an external clock input at the
SCK3x pin can be selected as the SCI3 transmit/receive clock. The selection is made by means of
bit COM in SMR and bits SCE1 and CKE0 in SCR3. See table 10.9 for details on clock source
selection.
When an external clock is input at the SCK3x pin, the clock frequency should be 16 times the bit
rate.
When SCI3 operates on an internal clock, the clock can be output at the SCK3x pin. In this case
the frequency of the output clock is the same as the bit rate, and the phase is such that the clock
rises at the center of each bit of transmit/receive data, as shown in figure 10.4.
Clock
Serial
data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (1 frame)
Figure 10.4 Phase Relationship between Output Clock and Transfer Data
(Asynchronous Mode) (8-bit data, parity, 2 stop bits)
3. Data Transfer Operations
SCI3 initialization: Before data is transferred on SCI3, bits TE and RE in SCR3 must first be
cleared to 0, and then SCI3 must be initialized as follows.
Note: If the operation mode or data transfer format is changed, bits TE and RE must first be
cleared to 0.
When bit TE is cleared to 0, bit TDRE is set to 1.
Note that the RDRF, PER, FER, and OER flags and the contents of RDR are retained
when RE is cleared to 0.
When an external clock is used in asynchronous mode, the clock should not be stopped
during operation, including initialization. When an external clock is used in synchronous
mode, the clock should not be supplied during operation, including initialization.
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Section 10 Serial Communication Interface
Figure 10.5 shows an example of a flowchart for initializing SCI3.
Start
Clear bits TE and
RE to 0 in SCR3
1
Set bits CKE1
and CKE0
2
Set data transfer
format in SMR
3
Set value in BRR
1. Set clock selection in SCR3. Be sure to
clear the other bits to 0. If clock output
is selected in asynchronous mode, the
clock is output immediately after setting
bits CKE1 and CKE0. If clock output is
selected for reception in synchronous
mode, the clock is output immediately
after bits CKE1, CKE0, and RE are
set to 1.
2. Set the data transfer format in the serial
mode register (SMR).
Wait
Has 1-bit period
elapsed?
No
Yes
Set bits SPC31 and
SPC32 to 1 in SPCR
4
Set bits TIE, RIE,
MPIE, and TEIE in
SCR3, and set bits
RE and TE to 1
in PMR7
3. Write the value corresponding to the
transfer rate in BRR. This operation is
not necessary when an external clock
is selected.
4. Wait for at least one bit period, then set
bits TIE, RIE, MPIE, and TEIE in SCR3,
and set bits RE and TE to 1 in PMR7.
Setting bits TE and RE enables the TXD3x
and RXD3x pins to be used. In asynchronous
mode the mark state is established when
transmitting, and the idle state waiting for
a start bit when receiving.
End
Figure 10.5 Example of SCI3 Initialization Flowchart
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Section 10 Serial Communication Interface
Transmitting: Figure 10.6 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
Start
Sets bits SPC31 and
SPC32 to 1 in SPCR
1
Read bit TDRE
in SSR
No
TDRE = 1?
Yes
Write transmit
data to TDR
2
Continue data
transmission?
Yes
2. When continuing data transmission,
be sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0
automatically.
3. If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TE in SCR3 to 0.
No
Read bit TEND
in SSR
TEND = 1?
1. Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then write transmit data to the transmit
data register (TDR). When data is
written to TDR, bit TDRE is cleared to 0
automatically.
(After the TE bit is set to 1, one frame of
1s is output, then transmission is possible.)
No
Yes
3
Break output?
No
Yes
Set PDR = 0,
PCR = 1
Clear bit TE to 0
in SCR3
End
Figure 10.6 Example of Data Transmission Flowchart (Asynchronous Mode)
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Section 10 Serial Communication Interface
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD3x pin using the relevant data transfer format in table
10.11. When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3
transfers data from TDR to TSR, and when the stop bit has been sent, starts transmission of the
next frame. If bit TDRE is set to 1, bit TEND in SSR bit is set to 1the mark state, in which 1s are
transmitted, is established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this
time, a TEI request is made.
Figure 10.12 shows an example of the operation when transmitting in asynchronous mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
Parity Stop Start
bit
bit bit
D7
0/1
1
0
Transmit
data
D0
D1
D7
Parity Stop
bit
bit
0/1
1
1 frame
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE
cleared to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.7 Example of Operation when Transmitting in Asynchronous Mode
(8-bit data, parity, 1 stop bit)
Rev. 6.00 Aug 04, 2006 page 350 of 626
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Mark
state
1
Section 10 Serial Communication Interface
Receiving: Figure 10.8 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
1
Read bits OER,
PER, FER in SSR
OER + PER
+ FER = 1?
1. Read bits OER, PER, and FER in the
serial status register (SSR) to determine
if there is an error. If a receive error has
occurred, execute receive error
processing.
Yes
2. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data
in RDR. When the RDR data is read,
bit RDRF is cleared to 0 automatically.
No
2
Read bit RDRF
in SSR
RDRF = 1?
3. When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the stop bit of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
No
Yes
Read receive
data in RDR
4
3
Continue data
reception?
Receive error
processing
Yes
No
(A)
Clear bit RE to
0 in SCR3
End
Figure 10.8 Example of Data Reception Flowchart (Asynchronous Mode)
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Section 10 Serial Communication Interface
4
Start receive
error processing
Overrun error
processing
OER = 1?
Yes
No
FER = 1?
Break?
Yes
No
No
PER = 1?
4. If a receive error has
occurred, read bits OER,
PER, and FER in SSR to
identify the error, and after
carrying out the necessary
error processing, ensure
that bits OER, PER, and
FER are all cleared to 0.
Yes
Reception cannot be
resumed if any of these
bits is set to 1. In the case
of a framing error, a break
can be detected by reading
the value of the RXD3x pin.
Framing error
processing
Yes
No
Clear bits OER, PER,
FER to 0 in SSR
Parity error
processing
(A)
End of receive
error processing
Figure 10.8 Example of Data Reception Flowchart (Asynchronous Mode) (cont)
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Section 10 Serial Communication Interface
SCI3 operates as follows when receiving data.
SCI3 monitors the communication line, and when it detects a 0 start bit, performs internal
synchronization and begins reception. Reception is carried out in accordance with the relevant
data transfer format in table 10.11. The received data is first placed in RSR in LSB-to-MSB order,
and then the parity bit and stop bit(s) are received. SCI3 then carries out the following checks.
• Parity check
SCI3 checks that the number of 1 bits in the receive data conforms to the parity (odd or even)
set in bit PM in the serial mode register (SMR).
• Stop bit check
SCI3 checks that the stop bit is 1. If two stop bits are used, only the first is checked.
• Status check
SCI3 checks that bit RDRF is set to 0, indicating that the receive data can be transferred from
RSR to RDR.
If no receive error is found in the above checks, bit RDRF is set to 1, and the receive data is stored
in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the error checks identify
a receive error, bit OER, PER, or FER is set to 1 depending on the kind of error. Bit RDRF retains
its state prior to receiving the data. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
Table 10.12 shows the conditions for detecting a receive error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER,
FER, PER, and RDRF must therefore be cleared to 0 before resuming reception.
Table 10.12 Receive Error Detection Conditions and Receive Data Processing
Receive Error
Abbr.
Detection Conditions
Receive Data Processing
Overrun error
OER
When the next date receive
operation is completed while bit
RDRF is still set to 1 in SSR
Receive data is not transferred
from RSR to RDR
Framing error
FER
When the stop bit is 0
Receive data is transferred
from RSR to RDR
Parity error
PER
When the parity (odd or even) set
in SMR is different from that of the
received data
Receive data is transferred
from RSR to RDR
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Section 10 Serial Communication Interface
Figure 10.9 shows an example of the operation when receiving in asynchronous mode.
Start
bit
Serial
data
1
0
Receive
data
D0
D1
D7
Parity Stop Start
bit
bit bit
0/1
1
0
1 frame
Receive
data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
Mark state
(idle state)
1
1 frame
RDRF
FER
RXI request
LSI
operation
User
processing
RDRF
cleared to 0
RDR data read
0 start bit
detected
ERI request in
response to
framing error
Framing error
processing
Figure 10.9 Example of Operation when Receiving in Asynchronous Mode
(8-bit data, parity, 1 stop bit)
10.3.3
Operation in Synchronous Mode
In synchronous mode, SCI3 transmits and receives data in synchronization with clock pulses.
This mode is suitable for high-speed serial communication.
SCI3 has separate transmission and reception units, allowing full-duplex communication with a
shared clock.
As the transmission and reception units are both double-buffered, data can be written during
transmission and read during reception, making possible continuous transmission and reception.
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Section 10 Serial Communication Interface
1. Data Transfer Format
The general data transfer format in asynchronous communication is shown in figure 10.10.
*
*
Serial
clock
LSB
Serial
data
Bit 0
Don't
care
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don't
care
8 bits
One transfer data unit (character or frame)
Note: * High level except in continuous transmission/reception
Figure 10.10 Data Format in Synchronous Communication
In synchronous communication, data on the communication line is output from one falling edge of
the serial clock until the next falling edge. Data confirmation is guaranteed at the rising edge of
the serial clock.
One transfer data character begins with the LSB and ends with the MSB. After output of the
MSB, the communication line retains the MSB state.
When receiving in synchronous mode, SCI3 latches receive data at the rising edge of the serial
clock.
The data transfer format uses a fixed 8-bit data length.
Parity and multiprocessor bits cannot be added.
2. Clock
Either an internal clock generated by the baud rate generator or an external clock input at the
SCK3x pin can be selected as the SCI3 serial clock. The selection is made by means of bit COM in
SMR and bits CKE1 and CKE0 in SCR3. See table 10.9 for details on clock source selection.
When SCI3 operates on an internal clock, the serial clock is output at the SCK3x pin. Eight pulses
of the serial clock are output in transmission or reception of one character, and when SCI3 is not
transmitting or receiving, the clock is fixed at the high level.
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Section 10 Serial Communication Interface
3. Data Transfer Operations
SCI3 initialization: Data transfer on SCI3 first of all requires that SCI3 be initialized as described
in 10.3.2.3. SCI3 initialization, and shown in figure 10.5.
Transmitting: Figure 10.11 shows an example of a flowchart for data transmission. This
procedure should be followed for data transmission after initializing SCI3.
Start
Sets bits SPC31 and
SPC32 to 1 in SPCR
1
Read bit TDRE
in SSR
No
TDRE = 1?
Yes
2. When continuing data transmission, be
sure to read TDRE = 1 to confirm that
a write can be performed before writing
data to TDR. When data is written to
TDR, bit TDRE is cleared to 0 automatically.
Write transmit
data to TDR
2
Continue data
transmission?
1. Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically, the
clock is output, and data transmission is
started. When clock output is selected,
the clock is output and data transmission
started when data is written to TDR.
Yes
No
Read bit TEND
in SSR
TEND = 1?
No
Yes
Clear bit TE to 0
in SCR3
End
Figure 10.11 Example of Data Transmission Flowchart (Synchronous Mode)
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Section 10 Serial Communication Interface
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
When clock output mode is selected, SCI3 outputs 8 serial clock pulses. When an external clock
is selected, data is output in synchronization with the input clock.
Serial data is transmitted from the TXD3x pin in order from the LSB (bit 0) to the MSB (bit 7).
When the MSB (bit 7) is sent, checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and starts transmission of the next frame. If bit TDRE is set to 1, SCI3 sets bit
TEND to 1 in SSR, and after sending the MSB (bit 7), retains the MSB state. If bit TEIE in SCR3
is set to 1 at this time, a TEI request is made.
After transmission ends, the SCK pin is fixed at the high level.
Note: Transmission is not possible if an error flag (OER, FER, or PER) that indicates the data
reception status is set to 1. Check that these error flags are all cleared to 0 before a
transmit operation.
Figure 10.12 shows an example of the operation when transmitting in synchronous mode.
Serial
clock
Serial
data
Bit 0
Bit 1
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE cleared
to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.12 Example of Operation when Transmitting in Synchronous Mode
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Section 10 Serial Communication Interface
Receiving: Figure 10.13 shows an example of a flowchart for data reception. This procedure
should be followed for data reception after initializing SCI3.
Start
1
Read bit OER
in SSR
1. Read bit OER in the serial status register
(SSR) to determine if there is an error.
If an overrun error has occurred, execute
overrun error processing.
Yes
OER = 1?
2. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR. When the RDR data is read, bit
RDRF is cleared to 0 automatically.
No
2
Read bit RDRF
in SSR
RDRF = 1?
3. When continuing data reception, finish
reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current
frame. When the data in RDR is read,
bit RDRF is cleared to 0 automatically.
No
4. If an overrun error has occurred, read bit
OER in SSR, and after carrying out the
necessary error processing, clear bit OER
to 0. Reception cannot be resumed if bit
OER is set to 1.
Yes
Read receive
data in RDR
4
3
Continue data
reception?
Overrun error
processing
Yes
No
Clear bit RE to
0 in SCR3
4
Start overrun
error processing
End
Overrun error
processing
Clear bit OER to
0 in SSR
End of overrun
error processing
Figure 10.13 Example of Data Reception Flowchart (Synchronous Mode)
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Section 10 Serial Communication Interface
SCI3 operates as follows when receiving data.
SCI3 performs internal synchronization and begins reception in synchronization with the serial
clock input or output.
The received data is placed in RSR in LSB-to-MSB order.
After the data has been received, SCI3 checks that bit RDRF is set to 0, indicating that the receive
data can be transferred from RSR to RDR.
If this check shows that there is no overrun error, bit RDRF is set to 1, and the receive data is
stored in RDR. If bit RIE is set to 1 in SCR3, an RXI interrupt is requested. If the check
identifies an overrun error, bit OER is set to 1.
Bit RDRF remains set to 1. If bit RIE is set to 1 in SCR3, an ERI interrupt is requested.
See table 10.12 for the conditions for detecting a receive error, and receive data processing.
Note: No further receive operations are possible while a receive error flag is set. Bits OER,
FER, PER, and RDRF must therefore be cleared to 0 before resuming reception.
Figure 10.14 shows an example of the operation when receiving in synchronous mode.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
1 frame
Bit 1
Bit 6
Bit 7
1 frame
RDRF
OER
LSI
operation
RXI request
User
processing
RDRE cleared
to 0
RDR data read
ERI request in
response to
overrun error
RXI request
RDR data has
not been read
(RDRF = 1)
Overrun error
processing
Figure 10.14 Example of Operation when Receiving in Synchronous Mode
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Section 10 Serial Communication Interface
Simultaneous transmit/receive: Figure 10.15 shows an example of a flowchart for a
simultaneous transmit/receive operation. This procedure should be followed for simultaneous
transmission/reception after initializing SCI3.
Start
Sets bits SPC31 and
SPC32 to 1 in SPCR
1
1. Read the serial status register (SSR) and
check that bit TDRE is set to 1, then write
transmit data to the transmit data register
(TDR). When data is written to TDR, bit
TDRE is cleared to 0 automatically.
Read bit TDRE
in SSR
No
TDRE = 1?
2. Read SSR and check that bit RDRF is set
to 1. If it is, read the receive data in RDR.
When the RDR data is read, bit RDRF is
cleared to 0 automatically.
Yes
Write transmit
data to TDR
3. When continuing data transmission/reception,
finish reading of bit RDRF and RDR before
receiving the MSB (bit 7) of the current frame.
Before receiving the MSB (bit 7) of the current
frame, also read TDRE = 1 to confirm that a
write can be performed, then write data to TDR.
When data is written to TDR, bit TDRE is cleared
to 0 automatically, and when the data in RDR is
read, bit RDRF is cleared to 0 automatically.
Read bit OER
in SSR
Yes
OER = 1?
4. If an overrun error has occurred, read bit OER
in SSR, and after carrying out the necessary
error processing, clear bit OER to 0. Transmission and reception cannot be resumed if bit
OER is set to 1.
See figure 10.13 for details on overrun error
processing.
No
2
Read bit RDRF
in SSR
No
RDRF = 1?
Yes
Read receive data
in RDR
4
3
Continue data
transmission/reception?
Overrun error
processing
Yes
No
Clear bits TE and
RE to 0 in SCR3
End
Figure 10.15 Example of Simultaneous Data Transmission/Reception Flowchart
(Synchronous Mode)
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Section 10 Serial Communication Interface
Notes: 1. When switching from transmission to simultaneous transmission/reception, check that
SCI3 has finished transmitting and that bits TDRE and TEND are set to 1, clear bit TE
to 0, and then set bits TE and RE to 1 simultaneously.
2. When switching from reception to simultaneous transmission/reception, check that
SCI3 has finished receiving, clear bit RE to 0, then check that bit RDRF and the error
flags (OER, FER, and PER) are cleared to 0, and finally set bits TE and RE to 1
simultaneously.
10.3.4
Multiprocessor Communication Function
The multiprocessor communication function enables data to be exchanged among a number of
processors on a shared communication line. Serial data communication is performed in
asynchronous mode using the multiprocessor format (in which a multiprocessor bit is added to the
transfer data).
In multiprocessor communication, each receiver is assigned its own ID code. The serial
communication cycle consists of two cycles, an ID transmission cycle in which the receiver is
specified, and a data transmission cycle in which the transfer data is sent to the specified receiver.
These two cycles are differentiated by means of the multiprocessor bit, 1 indicating an ID
transmission cycle, and 0, a data transmission cycle.
The sender first sends transfer data with a 1 multiprocessor bit added to the ID code of the receiver
it wants to communicate with, and then sends transfer data with a 0 multiprocessor bit added to the
transmit data. When a receiver receives transfer data with the multiprocessor bit set to 1, it
compares the ID code with its own ID code, and if they are the same, receives the transfer data
sent next. If the ID codes do not match, it skips the transfer data until data with the multiprocessor
bit set to 1 is sent again.
In this way, a number of processors can exchange data among themselves.
Figure 10.16 shows an example of communication between processors using the multiprocessor
format.
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Section 10 Serial Communication Interface
Sender
Communication line
Serial
data
Receiver A
Receiver B
Receiver C
Receiver D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
H'01
(MPB = 1)
ID transmission cycle
(specifying the receiver)
H'AA
(MPB = 0)
Data transmission cycle
(sending data to the receiver
specified buy the ID)
MPB: Multiprocessor bit
Figure 10.16 Example of Inter-Processor Communication Using Multiprocessor Format
(Sending Data H'AA to Receiver A)
There is a choice of four data transfer formats. If a multiprocessor format is specified, the parity
bit specification is invalid. See table 10.11 for details.
For details on the clock used in multiprocessor communication, see section 10.3.2, Operation in
Asynchronous Mode.
Multiprocessor transmitting: Figure 10.17 shows an example of a flowchart for multiprocessor
data transmission. This procedure should be followed for multiprocessor data transmission after
initializing SCI3.
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Section 10 Serial Communication Interface
Start
Sets bits SPC31 and
SPC32 to 1 in SPCR
1
Read bit TDRE
in SSR
TDRE = 1?
No
2. When continuing data transmission, be
sure to read TDRE = 1 to confirm that a
write can be performed before writing data
to TDR. When data is written to TDR, bit
TDRE is cleared to 0 automatically.
Yes
Set bit MPDT
in SSR
3. If a break is to be output when data
transmission ends, set the port PCR to 1
and clear the port PDR to 0, then clear bit
TE in SCR3 to 0.
Write transmit
data to TDR
2
Continue data
transmission?
1. Read the serial status register (SSR)
and check that bit TDRE is set to 1,
then set bit MPBT in SSR to 0 or 1 and
write transmit data to the transmit data
register (TDR). When data is written to
TDR, bit TDRE is cleared to 0 automatically.
Yes
No
Read bit TEND
in SSR
TEND = 1?
No
Yes
3
Break output?
No
Yes
Set PDR = 0,
PCR = 1
Clear bit TE to
0 in SCR3
End
Figure 10.17 Example of Multiprocessor Data Transmission Flowchart
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Section 10 Serial Communication Interface
SCI3 operates as follows when transmitting data.
SCI3 monitors bit TDRE in SSR, and when it is cleared to 0, recognizes that data has been written
to TDR and transfers data from TDR to TSR. It then sets bit TDRE to 1 and starts transmitting. If
bit TIE in SCR3 is set to 1 at this time, a TXI request is made.
Serial data is transmitted from the TXD pin using the relevant data transfer format in table 10.11.
When the stop bit is sent, SCI3 checks bit TDRE. If bit TDRE is cleared to 0, SCI3 transfers data
from TDR to TSR, and when the stop bit has been sent, starts transmission of the next frame. If
bit TDRE is set to 1 bit TEND in SSR bit is set to 1, the mark state, in which 1s are transmitted, is
established after the stop bit has been sent. If bit TEIE in SCR3 is set to 1 at this time, a TEI
request is made.
Figure 10.18 shows an example of the operation when transmitting using the multiprocessor
format.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
MPB
D7
0/1
Stop Start
bit bit
1
0
Transmit
data
D0
D1
MPB
D7
0/1
Stop
bit
Mark
state
1
1
1 frame
1 frame
TDRE
TEND
LSI
TXI request
operation
TDRE
cleared to 0
User
processing
Data written
to TDR
TXI request
TEI request
Figure 10.18 Example of Operation when Transmitting Using Multiprocessor Format
(8-bit data, multiprocessor bit, 1 stop bit)
Multiprocessor receiving: Figure 10.19 shows an example of a flowchart for multiprocessor data
reception. This procedure should be followed for multiprocessor data reception after initializing
SCI3.
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Section 10 Serial Communication Interface
Start
1
2
1. Set bit MPIE to 1 in SCR3.
Set bit MPIE to 1
in SCR3
2. Read bits OER and FER in the serial
status register (SSR) to determine if
there is an error. If a receive error has
occurred, execute receive error processing.
Read bits OER
and FER in SSR
OER + FER = 1?
3. Read SSR and check that bit RDRF is
set to 1. If it is, read the receive data in
RDR and compare it with this receiver's
own ID. If the ID is not this receiver's,
set bit MPIE to 1 again. When the RDR
data is read, bit RDRF is cleared to 0
automatically.
Yes
No
3
Read bit RDRF
in SSR
RDRF = 1?
4. Read SSR and check that bit RDRF is
set to 1, then read the data in RDR.
No
5. If a receive error has occurred, read bits
OER and FER in SSR to identify the error,
and after carrying out the necessary error
processing, ensure that bits OER and FER
are both cleared to 0. Reception cannot be
resumed if either of these bits is set to 1.
In the case of a framing error, a break can
be detected by reading the value of the
RXD3x pin.
Yes
Read receive
data in RDR
Own ID?
No
Yes
Read bits OER
and FER in SSR
OER + FER = 1?
Yes
No
4
Read bit RDRF
in SSR
RDRF = 1?
No
Yes
Read receive
data in RDR4
Continue data
reception?
No
5
Receive error
processing
Yes
(A)
Clear bit RE to
0 in SCR3
End
Figure 10.19 Example of Multiprocessor Data Reception Flowchart
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Section 10 Serial Communication Interface
Start receive
error processing
Overrun error
processing
OER = 1?
Yes
Yes
No
FER = 1?
Break?
Yes
No
No
Framing error
processing
Clear bits OER and
FER to 0 in SSR
End of receive
error processing
(A)
Figure 10.19 Example of Multiprocessor Data Reception Flowchart (cont)
Figure 10.20 shows an example of the operation when receiving using the multiprocessor format.
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Section 10 Serial Communication Interface
Start
bit
Serial
data
1
0
Receive
data (ID1)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data1)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
LSI
operation
RDRF cleared
to 0
RXI request
MPIE cleared
to 0
No RXI request
RDR retains
previous state
RDR data read
User
processing
When data is not
this receiver's ID,
bit MPIE is set to
1 again
(a) When data does not match this receiver's ID
Start
bit
Serial
data
1
0
Receive
data (ID2)
D0
D1
D7
MPB
1
Stop Start
bit bit
1
0
Receive data
(Data2)
D0
1 frame
D1
D7
MPB
Stop
bit
Mark state
(idle state)
0
1
1
1 frame
MPIE
RDRF
RDR
value
LSI
operation
User
processing
ID1
ID2
RXI request
MPIE cleared
to 0
RDRF cleared
to 0
RDR data read
Data2
RXI request
When data is
this receiver's
ID, reception
is continued
RDRF cleared
to 0
RDR data read
Bit MPIE set to
1 again
(b) When data matches this receiver's ID
Figure 10.20 Example of Operation when Receiving Using Multiprocessor Format
(8-bit data, multiprocessor bit, 1 stop bit)
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Section 10 Serial Communication Interface
10.4
Interrupts
SCI3 can generate six kinds of interrupts: transmit end, transmit data empty, receive data full, and
three receive error interrupts (overrun error, framing error, and parity error). These interrupts have
the same vector address.
The various interrupt requests are shown in table 10.13.
Table 10.13 SCI3 Interrupt Requests
Interrupt Abbr. Interrupt Request
Vector Address
RXI
Interrupt request initiated by receive data full flag (RDRF)
H'0022/H'0024
TXI
Interrupt request initiated by transmit data empty flag (TDRE)
TEI
Interrupt request initiated by transmit end flag (TEND)
ERI
Interrupt request initiated by receive error flag
(OER, FER, PER)
Each interrupt request can be enabled or disabled by means of bits TIE and RIE in SCR3.
When bit TDRE is set to 1 in SSR, a TXI interrupt is requested. When bit TEND is set to 1 in
SSR, a TEI interrupt is requested. These two interrupts are generated during transmission.
The initial value of bit TDRE in SSR is 1. Therefore, if the transmit data empty interrupt request
(TXI) is enabled by setting bit TIE to 1 in SCR3 before transmit data is transferred to TDR, a TXI
interrupt will be requested even if the transmit data is not ready.
Also, the initial value of bit TEND in SSR is 1. Therefore, if the transmit end interrupt request
(TEI) is enabled by setting bit TEIE to 1 in SCR3 before transmit data is transferred to TDR, a
TEI interrupt will be requested even if the transmit data has not been sent.
Effective use of these interrupt requests can be made by having processing that transfers transmit
data to TDR carried out in the interrupt service routine.
To prevent the generation of these interrupt requests (TXI and TEI), on the other hand, the enable
bits for these interrupt requests (bits TIE and TEIE) should be set to 1 after transmit data has been
transferred to TDR.
When bit RDRF is set to 1 in SSR, an RXI interrupt is requested, and if any of bits OER, PER, and
FER is set to 1, an ERI interrupt is requested. These two interrupt requests are generated during
reception.
For further details, see section 3.3, Interrupts.
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Section 10 Serial Communication Interface
10.5
Application Notes
The following points should be noted when using SCI3.
1. Relation between Writes to TDR and Bit TDRE
Bit TDRE in the serial status register (SSR) is a status flag that indicates that data for serial
transmission has not been prepared in TDR. When data is written to TDR, bit TDRE is cleared to
0 automatically. When SCI3 transfers data from TDR to TSR, bit TDRE is set to 1.
Data can be written to TDR irrespective of the state of bit TDRE, but if new data is written to
TDR while bit TDRE is cleared to 0, the data previously stored in TDR will be lost of it has not
yet been transferred to TSR. Accordingly, to ensure that serial transmission is performed
dependably, you should first check that bit TDRE is set to 1, then write the transmit data to TDR
once only (not two or more times).
2. Operation when a Number of Receive Errors Occur Simultaneously
If a number of receive errors are detected simultaneously, the status flags in SSR will be set to the
states shown in table 10.14. If an overrun error is detected, data transfer from RSR to RDR will
not be performed, and the receive data will be lost.
Table 10.14 SSR Status Flag States and Receive Data Transfer
SSR Status Flags
Receive Data Transfer
RDRF* OER
FER
PER
RSR → RDR
Receive Error Status
1
1
0
0
X
Overrun error
0
0
1
0
O
Framing error
0
0
0
1
O
Parity error
1
1
1
0
X
Overrun error + framing error
1
1
0
1
X
Overrun error + parity error
0
0
1
1
O
Framing error + parity error
1
1
1
1
X
Overrun error + framing error + parity error
O : Receive data is transferred from RSR to RDR.
X : Receive data is not transferred from RSR to RDR.
Note:
*
Bit RDRF retains its state prior to data reception. However, note that if RDR is read
after an overrun error has occurred in a frame because reading of the receive data in
the previous frame was delayed, RDRF will be cleared to 0.
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Section 10 Serial Communication Interface
3. Break Detection and Processing
When a framing error is detected, a break can be detected by reading the value of the RXD3x pin
directly. In a break, the input from the RXD3x pin becomes all 0s, with the result that bit FER is
set and bit PER may also be set.
SCI3 continues the receive operation even after receiving a break. Note, therefore, that even
though bit FER is cleared to 0 it will be set to 1 again.
4. Mark State and Break Detection
When bit TE is cleared to 0, the TXD3x pin functions as an I/O port whose input/output direction
and level are determined by PDR and PCR. This fact can be used to set the TXD3x pin to the mark
state, or to detect a break during transmission.
To keep the communication line in the mark state (1 state) until bit TE is set to 1, set PCR = 1 and
PDR = 1. Since bit TE is cleared to 0 at this time, the TXD3x pin functions as an I/O port and 1 is
output.
To detect a break, clear bit TE to 0 after setting PCR = 1 and PDR = 0.
When bit TE is cleared to 0, the transmission unit is initialized regardless of the current
transmission state, the TXD3x pin functions as an I/O port, and 0 is output from the TXD3x pin.
5. Receive Error Flags and Transmit Operation (Synchronous Mode Only)
When a receive error flag (OER, PER, or FER) is set to 1, transmission cannot be started even if
bit TDRE is cleared to 0. The receive error flags must be cleared to 0 before starting transmission.
Note also that receive error flags cannot be cleared to 0 even if bit RE is cleared to 0.
6. Receive Data Sampling Timing and Receive Margin in Asynchronous Mode
In asynchronous mode, SCI3 operates on a basic clock with a frequency 16 times the transfer rate.
When receiving, SCI3 performs internal synchronization by sampling the falling edge of the start
bit with the basic clock. Receive data is latched internally at the 8th rising edge of the basic clock.
This is illustrated in figure 10.21.
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Section 10 Serial Communication Interface
16 clock pulses
8 clock pulses
0
7
15 0
7
15 0
Internal
basic clock
Receive data
(RXD3x)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 10.21 Receive Data Sampling Timing in Asynchronous Mode
Consequently, the receive margin in asynchronous mode can be expressed as shown in equation
(1).
M ={(0.5 –
where
M:
N:
D:
L:
F:
1
D – 0.5
)–
– (L – 0.5) F} × 100 [%]
2N
N
..... Equation (1)
Receive margin (%)
Ratio of bit rate to clock (N = 16)
Clock duty (D = 0.5 to 1.0)
Frame length (L = 9 to 12)
Absolute value of clock frequency deviation
Substituting 0 for F (absolute value of clock frequency deviation) and 0.5 for D (clock duty) in
equation (1), a receive margin of 46.875% is given by equation (2).
When D = 0.5 and F = 0,
M = {0.5 — 1/(2 × 16)} × 100 [%]
= 46.875%
..... Equation (2)
However, this is only a computed value, and a margin of 20% to 30% should be allowed when
carrying out system design.
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Section 10 Serial Communication Interface
7. Relation between RDR Reads and Bit RDRF
In a receive operation, SCI3 continually checks the RDRF flag. If bit RDRF is cleared to 0 when
reception of one frame ends, normal data reception is completed. If bit RDRF is set to 1, this
indicates that an overrun error has occurred.
When the contents of RDR are read, bit RDRF is cleared to 0 automatically. Therefore, if bit
RDR is read more than once, the second and subsequent read operations will be performed while
bit RDRF is cleared to 0. Note that, when an RDR read is performed while bit RDRF is cleared to
0, if the read operation coincides with completion of reception of a frame, the next frame of data
may be read. This is illustrated in figure 10.22.
Communication
line
Frame 1
Frame 2
Frame 3
Data 1
Data 2
Data 3
Data 1
Data 2
RDRF
RDR
(A)
RDR read
(B)
RDR read
Data 1 is read at point (A)
Data 2 is read at point (B)
Figure 10.22 Relation between RDR Read Timing and Data
In this case, only a single RDR read operation (not two or more) should be performed after first
checking that bit RDRF is set to 1. If two or more reads are performed, the data read the first time
should be transferred to RAM, etc., and the RAM contents used. Also, ensure that there is
sufficient margin in an RDR read operation before reception of the next frame is completed. To
be precise in terms of timing, the RDR read should be completed before bit 7 is transferred in
synchronous mode, or before the STOP bit is transferred in asynchronous mode.
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Section 10 Serial Communication Interface
8. Transmit and Receive Operations when Making a State Transition
Make sure that transmit and receive operations have completely finished before carrying out state
transition processing.
9. Switching SCK3x Function
If pin SCK3x is used as a clock output pin by SCI3 in synchronous mode and is then switched to a
general input/output pin (a pin with a different function), the pin outputs a low level signal for half
a system clock (φ) cycle immediately after it is switched.
This can be prevented by either of the following methods according to the situation.
a. When an SCK3x function is switched from clock output to non clock-output
When stopping data transfer, issue one instruction to clear bits TE and RE to 0 and to set bits
CKE1 and CKE0 in SCR3 to 1 and 0, respectively. In this case, bit COM in SMR should be
left 1. The above prevents SCK3x from being used as a general input/output pin. To avoid an
intermediate level of voltage from being applied to SCK3x, the line connected to SCK3x should
be pulled up to the VCC level via a resistor, or supplied with output from an external device.
b. When an SCK3x function is switched from clock output to general input/output
When stopping data transfer,
(i)
Issue one instruction to clear bits TE and RE to 0 and to set bits CKE1 and CKE0 in
SCR3 to 1 and 0, respectively.
(ii) Clear bit COM in SMR to 0
(iii) Clear bits CKE1 and CKE0 in SCR3 to 0
Note that special care is also needed here to avoid an intermediate level of voltage from being
applied to SCK3x.
10. Setup at Subactive or Subsleep Mode
At subactive or subsleep mode, SCI3 becomes possible use only at CPU clock is φw/2.
Rev. 6.00 Aug 04, 2006 page 373 of 626
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Section 10 Serial Communication Interface
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REJ09B0144-0600
Section 11 14-Bit PWM
Section 11 14-Bit PWM
11.1
Overview
This LSI is provided with a 14-bit PWM (pulse width modulator) on-chip, which can be used as a
D/A converter by connecting a low-pass filter.
11.1.1
Features
Features of the 14-bit PWM are as follows.
• Choice of two conversion periods
Any of the following four conversion periods can be chosen:
 131,072/φ, with a minimum modulation width of 8/φ (PWCR1 = 1, PWCR0 = 1)
 65,536/φ, with a minimum modulation width of 4/φ (PWCR1 = 1, PWCR0 = 0)
 32,768/φ, with a minimum modulation width of 2/φ (PWCR1 = 0, PWCR0 = 1)
 16,384/φ, with a minimum modulation width of 1/φ (PWCR1 = 0, PWCR0 = 0)
• Pulse division method for less ripple
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 11 14-Bit PWM
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the 14-bit PWM.
PWDRU
φ/2
φ/4
φ/8
φ/16
PWM
waveform
generator
Internal data bus
PWDRL
PWCR
PWM
Legend:
PWDRL: PWM data register L
PWDRU: PWM data register U
PWCR: PWM control register
Figure 11.1 Block Diagram of the 14 Bit PWM
11.1.3
Pin Configuration
Table 11.1 shows the output pin assigned to the 14-bit PWM.
Table 11.1 Pin Configuration
Name
Abbr.
I/O
Function
PWM output pin
PWM
Output
Pulse-division PWM waveform output
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Section 11 14-Bit PWM
11.1.4
Register Configuration
Table 11.2 shows the register configuration of the 14-bit PWM.
Table 11.2 Register Configuration
Name
Abbr.
R/W
Initial Value
Address
PWM control register
PWCR
W
H'FC
H'FFD0
PWM data register U
PWDRU
W
H'C0
H'FFD1
PWM data register L
PWDRL
W
H'00
H'FFD2
Clock stop register 2
CKSTPR2
R/W
H'FF
H'FFFB
11.2
Register Descriptions
11.2.1
PWM Control Register (PWCR)
Bit
7
6
5
4
3
2
—
—
—
—
—
—
1
0
PWCR1 PWCR0
Initial value
1
1
1
1
1
1
0
0
Read/Write
—
—
—
—
—
—
W
W
PWCR is an 8-bit write-only register for input clock selection.
Upon reset, PWCR is initialized to H'FC.
Bits 7 to 2: Reserved bits
Bits 7 to 2 are reserved; they are always read as 1, and cannot be modified.
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Section 11 14-Bit PWM
Bits 1 and 0: Clock select 1 and 0 (PWCR1, PWCR0)
Bits 1 and 0 select the clock supplied to the 14-bit PWM. These bits are write-only bits; they are
always read as 1.
Bit 1
PWCR1
Bit 0
PWCR0
0
0
0
1
1
0
1
1
Note:
11.2.2
Description
The input clock is φ/2 (tφ* = 2/φ)
The conversion period is 16,384/φ, with a minimum
modulation width of 1/φ
The input clock is φ/4 (tφ* = 4/φ)
The conversion period is 32,768/φ, with a minimum
modulation width of 2/φ
The input clock is φ/8 (tφ* = 8/φ)
The conversion period is 65,536/φ, with a minimum
modulation width of 4/φ
The input clock is φ/16 (tφ* = 16/φ)
The conversion period is 131,072/φ, with a minimum
modulation width of 8/φ
(initial value)
Period of PWM input clock.
*
PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU
Bit
7
6
—
—
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
7
6
5
4
3
2
1
0
5
4
3
2
1
0
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0
PWDRL
Bit
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PWDRU and PWDRL form a 14-bit write-only register, with the upper 6 bits assigned to PWDRU
and the lower 8 bits to PWDRL. The value written to PWDRU and PWDRL gives the total highlevel width of one PWM waveform cycle.
Rev. 6.00 Aug 04, 2006 page 378 of 626
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Section 11 14-Bit PWM
When 14-bit data is written to PWDRU and PWDRL, the register contents are latched in the PWM
waveform generator, updating the PWM waveform generation data. The 14-bit data should
always be written in the following sequence:
1. Write the lower 8 bits to PWDRL.
2. Write the upper 6 bits to PWDRU.
PWDRU and PWDRL are write-only registers. If they are read, all bits are read as 1.
Upon reset, PWDRU and PWDRL are initialized to H'C000.
11.2.3
Clock Stop Register 2 (CKSTPR2)
Bit
7
6
5
4
—
—
—
—
3
2
1
0
AECKSTP WDCKSTP PWCKSTP LDCKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
CKSTPR2 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to the PWM is described here. For details of the other bits, see the
sections on the relevant modules.
Bit 1: PWM module standby mode control (PWCKSTP)
Bit 1 controls setting and clearing of module standby mode for the PWM.
PWCKSTP
Description
0
PWM is set to module standby mode
1
PWM module standby mode is cleared
(initial value)
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Section 11 14-Bit PWM
11.3
Operation
11.3.1
Operation
When using the 14-bit PWM, set the registers in the following sequence.
1. Set bit PWM in port mode register 3 (PMR3) to 1 so that pin P30/PWM is designated for PWM
output.
2. Set bits PWCR1 and PWCR0 in the PWM control register (PWCR) to select a conversion
period of 131,072/φ (PWCR1 = 1, PWCR0 = 1), 65,536/φ (PWCR1 = 1, PWCR0 = 0),
32,768/φ (PWCR1 = 0, PWCR0 = 1), or 16,384/φ (PWCR1 = 0, PWCR0 = 0).
3. Set the output waveform data in PWM data registers U and L (PWDRU/L). Be sure to write in
the correct sequence, first PWDRL then PWDRU. When data is written to PWDRU, the data
in these registers will be latched in the PWM waveform generator, updating the PWM
waveform generation in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 11.2. The total of the high-level
pulse widths during this period (TH) corresponds to the data in PWDRU and PWDRL. This
relation can be represented as follows.
TH = (data value in PWDRU and PWDRL + 64) × tφ/2
where tφ is the PWM input clock period: 2/φ (PWCR = H'0), 4/φ (PWCR = H'1), 8/φ (PWCR =
H'2), or 16/φ (PWCR = H'3).
Example: Settings in order to obtain a conversion period of 32,768 µs:
When PWCR1 = 0 and PWCR0 = 0, the conversion period is 16,384/φ, so φ must be
0.5 MHz. In this case, tfn = 512 µs, with 1/φ (resolution) = 2.0 µs.
When PWCR1 = 0 and PWCR0 = 1, the conversion period is 32,768/φ, so φ must be 1
MHz. In this case, tfn = 512 µs, with 2/φ (resolution) = 2.0 µs.
When PWCR1 = 1 and PWCR0 = 0, the conversion period is 65,536/φ , so φ must be 2
MHz. In this case, tfn = 512 µs, with 4/φ (resolution) = 2.0 µs.
Accordingly, for a conversion period of 32,768 µs, the system clock frequency (φ)
must be 0.5 MHz, 1 MHz, or 2 MHz.
Rev. 6.00 Aug 04, 2006 page 380 of 626
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Section 11 14-Bit PWM
1 conversion period
t f1
t H1
t f2
t H2
t f63
t H3
t H63
t f64
t H64
TH = t H1 + t H2 + t H3 + ..... t H64
t f1 = t f2 = t f3 ..... = t f64
Figure 11.2 PWM Output Waveform
11.3.2
PWM Operation Modes
PWM operation modes are shown in table 11.3.
Table 11.3 PWM Operation Modes
Operation
Mode
Reset
Active
Sleep
Module
Watch Subactive Subsleep Standby Standby
PWCR
Reset
Functions Functions Held
Held
Held
Held
Held
PWDRU
Reset
Functions Functions Held
Held
Held
Held
Held
PWDRL
Reset
Functions Functions Held
Held
Held
Held
Held
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Section 11 14-Bit PWM
Rev. 6.00 Aug 04, 2006 page 382 of 626
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Section 12 A/D Converter
Section 12 A/D Converter
12.1
Overview
This LSI includes on-chip a resistance-ladder-based successive-approximation analog-to-digital
converter, and can convert up to 8 channels of analog input.
12.1.1
Features
The A/D converter has the following features.
• 10-bit resolution
• Eight input channels
• Conversion time: approx. 12.4 µs per channel (at 5 MHz operation)
• Built-in sample-and-hold function
• Interrupt requested on completion of A/D conversion
• A/D conversion can be started by external trigger input
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
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Section 12 A/D Converter
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the A/D converter.
ADTRG
AMR
AN 0
AN 1
AN 3
AN 4
Multiplexer
ADSR
AN 5
AVCC
AN 6
AN 7
+
Comparator
–
AVCC
Reference
voltage
Control logic
AVSS
AVSS
ADRRH
ADRRL
Legend:
AMR: A/D mode register
ADSR: A/D start register
ADRR: A/D result register
IRRAD: A/D conversion end interrupt request flag
Figure 12.1 Block Diagram of the A/D Converter
Rev. 6.00 Aug 04, 2006 page 384 of 626
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Internal data bus
AN 2
IRRAD
Section 12 A/D Converter
12.1.3
Pin Configuration
Table 12.1 shows the A/D converter pin configuration.
Table 12.1 Pin Configuration
Name
Abbr.
I/O
Function
Analog power supply
AVCC
Input
Power supply and reference voltage of analog part
Analog ground
AVSS
Input
Ground and reference voltage of analog part
Analog input 0
AN0
Input
Analog input channel 0
Analog input 1
AN1
Input
Analog input channel 1
Analog input 2
AN2
Input
Analog input channel 2
Analog input 3
AN3
Input
Analog input channel 3
Analog input 4
AN4
Input
Analog input channel 4
Analog input 5
AN5
Input
Analog input channel 5
Analog input 6
AN6
Input
Analog input channel 6
Analog input 7
AN7
Input
Analog input channel 7
External trigger input
ADTRG
Input
External trigger input for starting A/D conversion
12.1.4
Register Configuration
Table 12.2 shows the A/D converter register configuration.
Table 12.2 Register Configuration
Name
Abbr.
R/W
Initial Value
Address
A/D mode register
AMR
R/W
H'30
H'FFC6
A/D start register
ADSR
R/W
H'7F
H'FFC7
A/D result register H
ADRRH
R
Not fixed
H'FFC4
A/D result register L
ADRRL
R
Not fixed
H'FFC5
Clock stop register 1
CKSTPRT1
R/W
H'FF
H'FFFA
Rev. 6.00 Aug 04, 2006 page 385 of 626
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Section 12 A/D Converter
12.2
Register Descriptions
12.2.1
A/D Result Registers (ADRRH, ADRRL)
Bit
5
4
3
2
1
0
ADR9 ADR8 ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0
7
—
—
—
—
—
—
Not
fixed
—
—
—
—
—
—
R
—
—
—
—
—
—
Initial value
Not
fixed
Read/Write
R
6
5
4
3
2
Not
Not
Not
Not
Not
fixed fixed fixed fixed fixed
R
R
R
R
R
1
0
7
Not
Not Not
fixed fixed fixed
R
R
R
6
ADRRH
ADRRL
ADRRH and ADRRL together comprise a 16-bit read-only register for holding the results of
analog-to-digital conversion. The upper 8 bits of the data are held in ADRRH, and the lower 2
bits in ADRRL.
ADRRH and ADRRL can be read by the CPU at any time, but the ADRRH and ADRRL values
during A/D conversion are not fixed. After A/D conversion is complete, the conversion result is
stored as 10-bit data, and this data is held until the next conversion operation starts.
ADRRH and ADRRL are not cleared on reset.
12.2.2
A/D Mode Register (AMR)
Bit
7
6
5
4
3
2
1
0
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
AMR is an 8-bit read/write register for specifying the A/D conversion speed, external trigger
option, and the analog input pins.
Upon reset, AMR is initialized to H'30.
Rev. 6.00 Aug 04, 2006 page 386 of 626
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Section 12 A/D Converter
Bit 7: Clock select (CKS)
Bit 7 sets the A/D conversion speed.
Bit 7
Conversion Time (Active (High-Speed) Mode)*
CKS
Conversion Period
φ = 1 MHz
φ = 5 MHz
0
62/φ (initial value)
62 µs
12.4 µs
1
31/φ
31 µs
—
Note:
*
For information on conversion time settings for which operation is guaranteed, see
section 15, Electrical Characteristics.
Bit 6: External trigger select (TRGE)
Bit 6 enables or disables the start of A/D conversion by external trigger input.
Bit 6
TRGE
Description
0
Disables start of A/D conversion by external trigger
1
Enables start of A/D conversion by rising or falling edge of external trigger at pin
ADTRG*
Note:
*
(initial value)
The external trigger (ADTRG) edge is selected by bit IEG4 of IEGR. See 1. IRQ edge
select register (IEGR) in section 3.3.2 for details.
Bits 5 and 4: Reserved bits
Bits 5 and 4 are reserved; they are always read as 1, and cannot be modified.
Bits 3 to 0: Channel select (CH3 to CH0)
Bits 3 to 0 select the analog input channel.
The channel selection should be made while bit ADSF is cleared to 0.
Rev. 6.00 Aug 04, 2006 page 387 of 626
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Section 12 A/D Converter
Bit 3
CH3
Bit 2
CH2
Bit 1
CH1
Bit 0
CH0
Analog Input Channel
0
0
*
*
No channel selected
0
1
0
0
AN0
0
1
0
1
AN1
0
1
1
0
AN2
0
1
1
1
AN3
1
0
0
0
AN4
1
0
0
1
AN5
1
0
1
0
AN6
1
0
1
1
AN7
1
1
*
*
Setting prohibited
Note:
12.2.3
*
(initial value)
Don’t care
A/D Start Register (ADSR)
Bit
7
6
5
4
3
2
1
0
ADSF
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
—
—
—
—
—
—
—
The A/D start register (ADSR) is an 8-bit read/write register for starting and stopping A/D
conversion.
A/D conversion is started by writing 1 to the A/D start flag (ADSF) or by input of the designated
edge of the external trigger signal, which also sets ADSF to 1. When conversion is complete, the
converted data is set in ADRRH and ADRRL, and at the same time ADSF is cleared to 0.
Rev. 6.00 Aug 04, 2006 page 388 of 626
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Section 12 A/D Converter
Bit 7: A/D start flag (ADSF)
Bit 7 controls and indicates the start and end of A/D conversion.
Bit 7
ADSF
Description
0
Read: Indicates the completion of A/D conversion
(initial value)
Write: Stops A/D conversion
1
Read: Indicates A/D conversion in progress
Write: Starts A/D conversion
Bits 6 to 0: Reserved bits
Bits 6 to 0 are reserved; they are always read as 1, and cannot be modified.
12.2.4
Clock Stop Register 1 (CKSTPR1)
Bit
7
—
6
5
4
3
2
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKSTPR1 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to the A/D converter is described here. For details of the other bits,
see the sections on the relevant modules.
Bit 4: A/D converter module standby mode control (ADCKSTP)
Bit 4 controls setting and clearing of module standby mode for the A/D converter.
ADCKSTP
Description
0
A/D converter is set to module standby mode
1
A/D converter module standby mode is cleared
(initial value)
Rev. 6.00 Aug 04, 2006 page 389 of 626
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Section 12 A/D Converter
12.3
Operation
12.3.1
A/D Conversion Operation
The A/D converter operates by successive approximations, and yields its conversion result as 10bit data.
A/D conversion begins when software sets the A/D start flag (bit ADSF) to 1. Bit ADSF keeps a
value of 1 during A/D conversion, and is cleared to 0 automatically when conversion is complete.
The completion of conversion also sets bit IRRAD in interrupt request register 2 (IRR2) to 1. An
A/D conversion end interrupt is requested if bit IENAD in interrupt enable register 2 (IENR2) is
set to 1.
If the conversion time or input channel needs to be changed in the A/D mode register (AMR)
during A/D conversion, bit ADSF should first be cleared to 0, stopping the conversion operation,
in order to avoid malfunction.
12.3.2
Start of A/D Conversion by External Trigger Input
The A/D converter can be made to start A/D conversion by input of an external trigger signal.
External trigger input is enabled at pin ADTRG when bit IRQ4 in PMR1 is set to 1 and bit TRGE
in AMR is set to 1. Then when the input signal edge designated in bit IEG4 of interrupt edge
select register (IEGR) is detected at pin ADTRG, bit ADSF in ADSR will be set to 1, starting A/D
conversion.
Figure 12.2 shows the timing.
φ
Pin ADTRG
(when bit
IEG4 = 0)
ADSF
A/D conversion
Figure 12.2 External Trigger Input Timing
Rev. 6.00 Aug 04, 2006 page 390 of 626
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Section 12 A/D Converter
12.3.3
A/D Converter Operation Modes
A/D converter operation modes are shown in table 12.3.
Table 12.3 A/D Converter Operation Modes
Operation
Mode
Reset
Active
AMR
Reset
Functions Functions Held
Held
Held
Held
Held
ADSR
Functions Functions Held
Held
Held
Held
Held
ADRRH
Reset
Held*
Functions Functions Held
Held
Held
Held
Held
ADRRL
Held*
Functions Functions Held
Held
Held
Held
Held
Note:
12.4
*
Sleep
Module
Watch Subactive Subsleep Standby Standby
Undefined in a power-on reset.
Interrupts
When A/D conversion ends (ADSF changes from 1 to 0), bit IRRAD in interrupt request register 2
(IRR2) is set to 1.
A/D conversion end interrupts can be enabled or disabled by means of bit IENAD in interrupt
enable register 2 (IENR2).
For further details see section 3.3, Interrupts.
Rev. 6.00 Aug 04, 2006 page 391 of 626
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Section 12 A/D Converter
12.5
Typical Use
An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as
the analog input channel. Figure 12.3 shows the operation timing.
1. Bits CH3 to CH0 of the A/D mode register (AMR) are set to 0101, making pin AN1 the analog
input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D conversion is
started by setting bit ADSF to 1.
2. When A/D conversion is complete, bit IRRAD is set to 1, and the A/D conversion result is
stored is stored in ADRRH and ADRRL. At the same time ADSF is cleared to 0, and the A/D
converter goes to the idle state.
3. Bit IENAD = 1, so an A/D conversion end interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The A/D conversion result is read and processed.
6. The A/D interrupt handling routine ends.
If ADSF is set to 1 again afterward, A/D conversion starts and steps 2 to 6 take place.
Figures 12.4 and 12.5 show flow charts of procedures for using the A/D converter.
Rev. 6.00 Aug 04, 2006 page 392 of 626
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Idle
A/D conversion starts
A/D conversion (1)
Set *
Set *
Note: * ( ) indicates instruction execution by software.
ADRRH
ADRRL
Channel 1 (AN1)
operation state
ADSF
IENAD
Interrupt
(IRRAD)
A/D conversion (2)
A/D conversion result (1)
Read conversion result
Idle
Set *
A/D conversion result (2)
Read conversion result
Idle
Section 12 A/D Converter
Figure 12.3 Typical A/D Converter Operation Timing
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Section 12 A/D Converter
Start
Set A/D conversion speed
and input channel
Disable A/D conversion
end interrupt
Start A/D conversion
Read ADSR
No
ADSF = 0?
Yes
Read ADRRH/ADRRL data
Yes
Perform A/D
conversion?
No
End
Figure 12.4 Flow Chart of Procedure for Using A/D Converter (Polling by Software)
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Section 12 A/D Converter
Start
Set A/D conversion speed
and input channels
Enable A/D conversion
end interrupt
Start A/D conversion
A/D conversion
end interrupt?
No
Yes
Clear bit IRRAD to
0 in IRR2
Read ADRRH/ADRRL data
Yes
Perform A/D
conversion?
No
End
Figure 12.5 Flow Chart of Procedure for Using A/D Converter (Interrupts Used)
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Section 12 A/D Converter
12.6
Application Notes
12.6.1
Application Notes
• Data in ADRRH and ADRRL should be read only when the A/D start flag (ADSF) in the A/D
start register (ADSR) is cleared to 0.
• Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
• When A/D conversion is started after clearing module standby mode, wait for 10 φ clock
cycles before starting.
• In active mode or sleep mode, analog power supply current (AISTOP1) flows into the ladder
resistance even when the A/D converter is not operating. Therefore, if the A/D converter is not
used, it is recommended that AVCC be connected to the system power supply and the
ADCKSTP(A/D converter module standby mode control) bit be cleared to 0 in clock stop
register 1 (CKSTPR1).
12.6.2
Permissible Signal Source Impedance
This LSI’s analog input is designed such that conversion precision is guaranteed for an input
signal for which the signal source impedance is 10 kΩ or less. This specification is provided to
enable the A/D converter’s sample-and-hold circuit input capacitance to be charged within the
sampling time; if the sensor output impedance exceeds 10 kΩ, charging may be insufficient and it
may not be possible to guarantee A/D conversion precision. However, a large capacitance
provided externally, the input load will essentially comprise only the internal input resistance of
10 kΩ, and the signal source impedance is ignored. However, as a low-pass filter effect is obtained
in this case, it may not be possible to follow an analog signal with a large differential coefficient
(e.g., 5 mV/µs or greater) (see figure 12.6). When converting a high-speed analog signal, a lowimpedance buffer should be inserted.
Rev. 6.00 Aug 04, 2006 page 396 of 626
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Section 12 A/D Converter
12.6.3
Influences on Absolute Precision
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute precision. Be sure to make the connection to an electrically stable GND.
Care is also required to ensure that filter circuits do not interfere with digital signals or act as
antennas on the mounting board.
This LSI
Sensor output
impedance
A/D converter
equivalent circuit
10 kΩ
Up to 10 kΩ
Sensor input
Low-pass
filter
C to 0.1 µF
Cin =
15 pF
20 pF
Figure 12.6 Analog Input Circuit Example
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Section 12 A/D Converter
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Section 13 LCD Controller/Driver
Section 13 LCD Controller/Driver
13.1
Overview
This LSI has an on-chip segment type LCD control circuit, LCD driver, and power supply circuit,
enabling it to directly drive an LCD panel.
13.1.1
Features
1. Features
Features of the LCD controller/driver are given below.
• Display capacity
Duty Cycle
Internal Driver
Segment External Expansion Driver
Static
32 seg
256 seg
1/2
32 seg
128 seg
1/3
32 seg
64 seg
1/4
32 seg
64 seg
• LCD RAM capacity
8 bits × 32 bytes (256 bits)
• Word access to LCD RAM
• All eight segment output pins can be used individually as port pins.
• Common output pins not used because of the duty cycle can be used for common doublebuffering (parallel connection).
• Display possible in operating modes other than standby mode
• Choice of 11 frame frequencies
• Built-in power supply split-resistance, supplying LCD drive power
• Use of module standby mode enables this module to be placed in standby mode independently
when not used.
• A or B waveform selectable by software
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Section 13 LCD Controller/Driver
13.1.2
Block Diagram
Figure 13.1 shows a block diagram of the LCD controller/driver.
LCD drive power supply
M
φ/2 to φ/256
CL2
Common
data latch
φw
Internal data bus
V0
V1
V2
V3
VSS
Common
driver
COM4
SEG32/CL1*
SEG31/CL2*
SEG30/DO*
SEG29/M*
SEG28
LPCR
LCR
LCR2
Display timing generator
COM1
32-bit shift
register
CL1
Segment
driver
LCD RAM
(32 bytes)
SEG1
SEGn, DO
Legend:
LPCR: LCD port control register
LCR: LCD control register
LCR2: LCD control register 2
Note: * The external expansion function for LCD segments is not implemented in the H8/38327 Group and
H8/38427 Group.
Figure 13.1 Block Diagram of LCD Controller/Driver
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Section 13 LCD Controller/Driver
13.1.3
Pin Configuration
Table 13.1 shows the LCD controller/driver pin configuration.
Table 13.1 Pin Configuration
Name
Abbr.
I/O
Function
Segment output pins
SEG32 to SEG1
Output
LCD segment drive pins
All pins are multiplexed as port pins
(setting programmable)
Common output pins
COM4 to COM1
Output
LCD common drive pins
Pins can be used in parallel with static or
1/2 duty
Segment external
expansion signal pins*
CL1
Output
Display data latch clock, multiplexed as
SEG32
CL2
Output
Display data shift clock, multiplexed as
SEG31
M
Output
LCD alternation signal, multiplexed as
SEG29
DO
Output
Serial display data, multiplexed as SEG30
V0, V1, V2, V3
—
Used when a bypass capacitor is
connected externally, and when an
external power supply circuit is used
LCD power supply pins
Note:
13.1.4
The external expansion function for LCD segments is not implemented in the H8/38327
Group and H8/38427 Group.
*
Register Configuration
Table 13.2 shows the register configuration of the LCD controller/driver.
Table 13.2 LCD Controller/Driver Registers
Name
Abbr.
R/W
Initial Value
Address
LCD port control register
LPCR
R/W
H'00
H'FFC0
LCD control register
LCR
R/W
H'80
H'FFC1
LCD control register 2
LCR2
R/W
H'60
H'FFC2
LCD RAM
—
R/W
Undefined
H'F740, H'F75F
Clock stop register 2
CKSTPR2
R/W
H'FF
H'FFFB
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Section 13 LCD Controller/Driver
13.2
Register Descriptions
13.2.1
LCD Port Control Register (LPCR)
Bit
7
6
5
4
3
2
1
0
DTS1
DTS0
CMX
SGX
SGS3
SGS2
SGS1
SGS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LPCR is an 8-bit read/write register which selects the duty cycle and LCD driver pin functions.
LPCR is initialized to H'00 upon reset.
Bits 7 to 5: Duty cycle select 1 and 0 (DTS1, DTS0), common function select (CMX)
The combination of DTS1 and DTS0 selects static, 1/2, 1/3, or 1/4 duty. CMX specifies whether
or not the same waveform is to be output from multiple pins to increase the common drive power
when not all common pins are used because of the duty setting.
Bit 7
DTS1
Bit 6
DTS0
Bit 5
CMX
Duty Cycle
Common Drivers
0
0
0
Static
COM1 (initial value) Do not use COM4, COM3, and
COM2.
1
0
1
0
1/2 duty
1
1
0
0
1/3 duty
1
1
1
0
1/4 duty
1
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Notes
COM4 to COM1
COM4, COM3, and COM2 output
the same waveform as COM1.
COM2 to COM1
Do not use COM4 and COM3.
COM4 to COM1
COM4 outputs the same waveform
as COM3, and COM2 outputs the
same waveform as COM1.
COM3 to COM1
Do not use COM4.
COM4 to COM1
Do not use COM4.
COM4 to COM1
—
Section 13 LCD Controller/Driver
Bit 4: Expansion signal select (SGX)
Bit 4 selects whether the SEG32/CL1, SEG31/CL2, SEG30/DO, and SEG29/M pins are used as
segment pins (SEG32 to SEG29) or as segment external expansion pins (CL1, CL2, DO, and M).
In the H8/38327 Group and H8/38427 Group this bit should be left at its initial value and not
written to. Changing the value of this bit may prevent the SEG/COM signal from operating
normally.
Bit 4
SGX
Description
0
Pins SEG32 to SEG29*
1
Note:
(initial value)
Pins CL1, CL2, DO, M
*
These pins function as ports when the setting of SGS3 to SGS0 is 0000 or 0001.
Bits 3 to 0: Segment driver select 3 to 0 (SGS3 to SGS0)
Bits 3 to 0 select the segment drivers to be used. The SGX = 0 setting is selected on the H8/38327
and H8/38427.
Function of Pins SEG32 to SEG1
Bit 4
SGX
Bit 3 Bit 2 Bit 1 Bit 0 SEG32 to SEG24 to SEG16 to SEG8 to
SGS3 SGS2 SGS1 SGS0 SEG25
SEG17
SEG9
SEG1
Notes
0
0
0
0
0
Port
Port
Port
(initial value)
0
0
0
1
Port
Port
Port
Port
0
0
1
*
SEG
Port
Port
Port
0
1
0
*
SEG
SEG
Port
Port
0
1
1
*
SEG
SEG
SEG
Port
1
*
*
*
SEG
SEG
SEG
0
0
0
0
SEG
1
Port*
Port
Port
Port
*
*
*
*
Setting prohibited
1
Port
*: Don’t care
Note:
1. SEG32 to SEG29 are external expansion pins.
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Section 13 LCD Controller/Driver
13.2.2
LCD Control Register (LCR)
Bit
7
6
5
4
3
2
1
0
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
LCR is an 8-bit read/write register which performs LCD drive power supply on/off control and
display data control, and selects the frame frequency.
LCR is initialized to H'80 upon reset.
Bit 7: Reserved bit
Bit 7 is reserved; it is always read as 1 and cannot be modified.
Bit 6: LCD drive power supply on/off control (PSW)
Bit 6 can be used to turn the LCD drive power supply off when LCD display is not required in a
power-down mode, or when an external power supply is used. When the ACT bit is cleared to 0,
or in standby mode, the LCD drive power supply is turned off regardless of the setting of this bit.
Bit 6
PSW
Description
0
LCD drive power supply off
1
LCD drive power supply on
(initial value)
Bit 5: Display function activate (ACT)
Bit 5 specifies whether or not the LCD controller/driver is used. Clearing this bit to 0 halts
operation of the LCD controller/driver. The LCD drive power supply is also turned off, regardless
of the setting of the PSW bit. However, register contents are retained.
Bit 5
ACT
Description
0
LCD controller/driver operation halted
1
LCD controller/driver operates
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(initial value)
Section 13 LCD Controller/Driver
Bit 4: Display data control (DISP)
Bit 4 specifies whether the LCD RAM contents are displayed or blank data is displayed regardless
of the LCD RAM contents.
Bit 4
DISP
Description
0
Blank data is displayed
1
LCD RAM data is display
(initial value)
Bits 3 to 0: Frame frequency select 3 to 0 (CKS3 to CKS0)
Bits 3 to 0 select the operating clock and the frame frequency. In subactive mode, watch mode,
and subsleep mode, the system clock (φ) is halted, and therefore display operations are not
performed if one of the clocks from φ/2 to φ/256 is selected. If LCD display is required in these
modes, φw, φw/2, or φw/4 must be selected as the operating clock.
Frame Frequency*
2
Bit 3
CKS3
Bit 2
CKS2
Bit 1
CKS1
Bit 0
CKS0
Operating Clock
0
*
0
0
φw
0
*
0
1
φw/2
0
*
1
*
φw/4
64 Hz*
3
32 Hz*
1
0
0
0
φ/2
—
244 Hz
1
0
0
1
φ/4
977 Hz
122 Hz
1
0
1
0
φ/8
488 Hz
61 Hz
1
0
1
1
φ/16
244 Hz
30.5 Hz
1
1
0
0
φ/32
122 Hz
—
1
1
0
1
φ/64
61 Hz
—
1
1
1
0
φ/128
30.5 Hz
—
1
1
1
1
φ/256
—
—
φ = 2 MHz
φ = 250 kHz*
3
128 Hz* (initial value)
1
3
*: Don’t care
Notes: 1. This is the frame frequency in active (medium-speed, φosc/16) mode when φ = 2 MHz.
2. When 1/3 duty is selected, the frame frequency is 4/3 times the value shown.
3. This is the frame frequency when φw = 32.768 kHz.
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Section 13 LCD Controller/Driver
13.2.3
LCD Control Register 2 (LCR2)
Bit
7
6
5
4
3
2
1
0
LCDAB
—
—
—
CDS3
CDS2
CDS1
CDS0
Initial value
0
1
1
0
0
0
0
0
Read/Write
R/W
—
—
R/W
R/W
R/W
R/W
R/W
LCR2 is an 8-bit read/write register which controls switching between the A waveform and B
waveform, and selects the duty cycle of the charge/discharge pulses which control disconnection
of the power supply split-resistance from the power supply circuit.
LCR2 is initialized to H'60 upon reset.
Bit 7: A waveform/B waveform switching control (LCDAB)
Bit 7 specifies whether the A waveform or B waveform is used as the LCD drive waveform.
Bit 7
LCDAB
Description
0
Drive using A waveform
1
Drive using B waveform
Bits 6 and 5: Reserved bits
Bits 6 and 5 are reserved; they are always read as 1 and cannot be modified.
Bit 4: Reserved bit
Bit 4 is reserved; it is always read as 0 and must not be written with 1.
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(initial value)
Section 13 LCD Controller/Driver
Bits 3 to 0: Charge/discharge pulse duty cycle select (CDS3 to CDS0)
Bit 3
CDS3
Bit 2
CDS2
Bit 1
CDS1
Bit 0
CDS0
Duty Cycle
Notes
0
0
0
0
1
Fixed high
0
0
0
1
1/8
0
0
1
0
2/8
0
0
1
1
3/8
0
1
0
0
4/8
0
1
0
1
5/8
0
1
1
0
6/8
0
1
1
1
0
1
0
*
*
1/16
1
1
*
*
1/32
(initial value)
Fixed low
*: Don’t care
Bits 3 to 0 select the duty cycle while the power supply split-resistance is connected to the power
supply circuit.
When a 0 duty cycle is selected, the power supply split-resistance is permanently disconnected
from the power supply circuit, so power should be supplied to pins V1, V2, and V3 by an external
circuit.
Figure 13.2 shows the waveform of the charge/discharge pulses. The duty cycle is Tc/Tw.
1 frame
TW
COM1
Tc
Charge/discharge
pulses
Tdc
Tc: Power supply split-resistance
connected
Tdc: Power supply split-resistance
disconnected
Figure 13.2 Example of A Waveform with 1/2 Duty and 1/2 Bias
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Section 13 LCD Controller/Driver
13.2.4
Clock Stop Register 2 (CKSTPR2)
Bit
7
6
5
4
—
—
—
—
3
2
1
0
AECKSTP WDCKSTP PWCKSTP LDCKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
CKSTPR2 is an 8-bit read/write register that performs module standby mode control for peripheral
modules. Only the bit relating to the LCD controller/driver is described here. For details of the
other bits, see the sections on the relevant modules.
Bit 0: LCD controller/driver module standby mode control (LDCKSTP)
Bit 0 controls setting and clearing of module standby mode for the LCD controller/driver.
Bit 0
LDCKSTP
Description
0
LCD controller/driver is set to module standby mode
1
LCD controller/driver module standby mode is cleared
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(initial value)
Section 13 LCD Controller/Driver
13.3
Operation
13.3.1
Settings Up to LCD Display
To perform LCD display, the hardware and software related items described below must first be
determined.
1. Hardware Settings
a. Using 1/2 duty
When 1/2 duty is used, interconnect pins V2 and V3 as shown in figure 13.3.
VCC
V0
V1
V2
V3
VSS
Figure 13.3 Handling of LCD Drive Power Supply when Using 1/2 Duty
b. Large-panel display
As the impedance of the built-in power supply split-resistance is large, it may not be suitable
for driving a large panel. If the display lacks sharpness when using a large panel, refer to
section 13.3.6, Boosting the LCD Drive Power Supply. When static or 1/2 duty is selected, the
common output drive capability can be increased. Set CMX to 1 when selecting the duty
cycle. In this mode, with a static duty cycle pins COM4 to COM1 output the same waveform,
and with 1/2 duty the COM1 waveform is output from pins COM2 and COM1, and the COM2
waveform is output from pins COM4 and COM3.
c. Luminance adjustment function (V0 pin)
Connecting a resistance between the V0 and V1 pins enables the luminance to be adjusted. For
details, see section 13.3.3, Luminance Adjustment Function (V0 Pin).
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Section 13 LCD Controller/Driver
d. LCD drive power supply setting
With the H8/3827R Group, there are two ways of providing LCD power: by using the on-chip
power supply circuit, or by using an external circuit.
When the on-chip power supply circuit is used for the LCD drive power supply, the V0 and V1
pins should be interconnected externally, as shown in figure 13.4 (a).
When an external power supply circuit is used for the LCD drive power supply, connect the
external power supply to the V1 pin, and short the V0 pin to VCC externally, as shown in figure
13.4 (b).
VCC
VCC
V0
V0
V1
V1
V2
V2
V3
V3
VSS
External power supply
VSS
(a) Using on-chip power supply circuit
(b) Using external power supply circuit
Figure 13.4 Examples of LCD Power Supply Pin Connections
e. Low-power-consumption LCD drive system
Use of a low-power-consumption LCD drive system enables the power consumption required
for LCD drive to be optimized. For details, see section 13.3.4, Low-Power-Consumption LCD
Drive System.
f. Segment external expansion
The number of segments can be increased by connecting an HD66100 externally. For details,
see section 13.3.7, Connection to HD66100.
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Section 13 LCD Controller/Driver
2. Software settings
a. Duty selection
Any of four duty cycles—static, 1/2 duty, 1/3 duty, or 1/4 duty—can be selected with bits
DTS1 and DTS0.
b. Segment selection
The segment drivers to be used can be selected with bits SGS3 to SGS0.
c. Frame frequency selection
The frame frequency can be selected by setting bits CKS3 to CKS0. The frame frequency
should be selected in accordance with the LCD panel specification. For the clock selection
method in watch mode, subactive mode, and subsleep mode, see section 13.3.5, Operation in
Power-Down Modes.
d. A or B waveform selection
Either the A or B waveform can be selected as the LCD waveform to be used by means of
LCDAB.
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Section 13 LCD Controller/Driver
13.3.2
Relationship between LCD RAM and Display
The relationship between the LCD RAM and the display segments differs according to the duty
cycle. LCD RAM maps for the different duty cycles when segment external expansion is not used
are shown in figures 13.5 to 13.8, and LCD RAM maps when segment external expansion is used
in figures 13.9 to 13.12.
After setting the registers required for display, data is written to the part corresponding to the duty
using the same kind of instruction as for ordinary RAM, and display is started automatically when
turned on. Word- or byte-access instructions can be used for RAM setting.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'F740
SEG2
SEG2
SEG2
SEG2
SEG1
SEG1
SEG1
SEG1
H'F74F
SEG32
SEG32
SEG32
SEG32
SEG31
SEG31
SEG31
SEG31
COM4
COM3
COM2
COM1
COM4
COM3
COM2
COM1
Figure 13.5 LCD RAM Map when Not Using Segment External Expansion (1/4 Duty)
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Section 13 LCD Controller/Driver
Bit 7
Bit 6
Bit 5
Bit 4
H'F740
SEG2
SEG2
H'F74F
SEG32
COM3
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG1
SEG1
SEG1
SEG32
SEG32
SEG31
SEG31
SEG31
COM2
COM1
COM3
COM2
COM1
Space not used for display
Figure 13.6 LCD RAM Map when Not Using Segment External Expansion (1/3 Duty)
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Section 13 LCD Controller/Driver
H'F740
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG4
SEG4
SEG3
SEG3
SEG2
SEG2
SEG1
SEG1
Display space
SEG32
SEG32
SEG31
SEG31
SEG30
SEG30
SEG29
SEG29
H'F747
Space not used for display
H'F74F
COM2
COM1
COM2
COM1
COM2
COM1
COM2
COM1
Figure 13.7 LCD RAM Map when Not Using Segment External Expansion (1/2 Duty)
H'F740
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
Display
space
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
H'F743
Space not
used for
display
H'F74F
COM1
COM1
COM1
COM1
COM1
COM1
COM1
COM1
Figure 13.8 LCD RAM Map when Not Using Segment External Expansion (Static Mode)
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REJ09B0144-0600
Section 13 LCD Controller/Driver
H'F740
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG2
SEG2
SEG2
SEG1
SEG1
SEG1
SEG1
Expansion
driver display
space
H'F75F
SEG64
SEG64
SEG64
SEG64
SEG63
SEG63
SEG63
SEG63
COM4
COM3
COM2
COM1
COM4
COM3
COM1
COM1
Figure 13.9 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/4 Duty)
Rev. 6.00 Aug 04, 2006 page 415 of 626
REJ09B0144-0600
Section 13 LCD Controller/Driver
Bit 7
H'F740
Bit 6
Bit 5
Bit 4
SEG2
SEG2
SEG2
Bit 3
Bit 2
Bit 1
Bit 0
SEG1
SEG1
SEG1
Expansion
driver display
space
H'F75F
SEG64
SEG64
SEG64
SEG63
SEG63
SEG63
COM3
COM2
COM1
COM3
COM1
COM1
Space not used for display
Figure 13.10 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/3 Duty)
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REJ09B0144-0600
Section 13 LCD Controller/Driver
H'F740
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG4
SEG4
SEG3
SEG3
SEG2
SEG2
SEG1
SEG1
Expansion
driver display
space
H'F75F
SEG128
SEG128
SEG127
SEG127
SEG126
SEG126
SEG125
SEG125
COM2
COM1
COM2
COM1
COM2
COM1
COM2
COM1
Figure 13.11 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” 1/2 Duty)
Rev. 6.00 Aug 04, 2006 page 417 of 626
REJ09B0144-0600
Section 13 LCD Controller/Driver
H'F740
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit0
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
Expansion
driver display
space
H'F75F
SEG256
SEG255
SEG254
SEG253
SEG252
SEG251
SEG250
SEG249
COM1
COM1
COM1
COM1
COM1
COM1
COM1
COM1
Figure 13.12 LCD RAM Map when Using Segment External Expansion
(SGX = “1”, SGS3 to SGS0 = “0000” Static)
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Section 13 LCD Controller/Driver
13.3.3
Luminance Adjustment Function (V0 Pin)
Figure 13.13 shows a detailed block diagram of the LCD drive power supply unit.
The voltage output to the V0 pin is VCC. When either of these voltages is used directly as the LCD
drive power supply, the V0 and V1 pins should be shorted. Also, connecting a variable resistance,
R, between the V0 and V1 pins makes it possible to adjust the voltage applied to the V1 pin, and so
to provide luminance adjustment for the LCD panel.
VCC
V0
R
V1
V2
V3
VSS
Figure 13.13 LCD Drive Power Supply Unit
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Section 13 LCD Controller/Driver
13.3.4
Low-Power-Consumption LCD Drive System
The use of the built-in split-resistance is normally the easiest method for implementing the LCD
power supply circuit, but since the built-in resistance is fixed, a certain direct current flows
constantly from the built-in resistance’s VCC to VSS. As this current does not depend on the
current dissipation of the LCD panel, if an LCD panel with a small current dissipation is used, a
wasteful amount of power will be consumed. The H8/3827 Group is equipped with a function to
minimize this waste of power. Use of this function makes it possible to achieve the optimum
power supply circuit for the LCD panel’s current dissipation.
1. Principles
a. Capacitors are connected as external circuits to LCD power supply pins V1, V2, and V3, as
shown in figure 13.14.
b. The capacitors connected to V1, V2, and V3 are repeatedly charged and discharged in the
cycle shown in figure 13.14, maintaining the potentials.
c. At this time, the charged potential is a potential corresponding to the V1, V2, and V3 pins,
respectively. (For example, with 1/3 bias drive, the charge for V2 is 2/3 that of V1, and that for
V3 is 1/3 that of V1.)
d. Power is supplied to the LCD panel by means of the charges accumulated in these capacitors.
e. The capacitances and charging/discharging periods of these capacitors are therefore
determined by the current dissipation of the LCD panel.
f. The charging and discharging periods can be selected by software.
2. Example of Operation (with 1/3 bias drive)
a. During charging period Tc in the figure, the potential is divided among pins V1, V2, and V3
by the built-in split-resistance (the potential of V2 being 2/3 that of V1, and that of V3 being
1/3 that of V1), as shown in figure 13.14, and external capacitors C1, C2, and C3 are charged.
The LCD panel is continues to be driven during this time.
b. In the following discharging period, Tdc, charging is halted and the charge accumulated in
each capacitor is discharged, driving the LCD panel.
c. At this time, a slight voltage drop occurs due to the discharging; optimum values must be
selected for the charging period and the capacitor capacitances to ensure that this does not
affect the driving of the LCD panel.
d. In this way, the capacitors connected to V1, V2, and V3 are repeatedly charged and
discharged in the cycle shown in figure 13.14, maintaining the potentials and continuously
driving the LCD panel.
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Section 13 LCD Controller/Driver
e. As can be seen from the above description, the capacitances and charging/discharging periods
of the capacitors are determined by the current dissipation of the LCD panel used. The
charging/discharging periods can be selected with bits CDS3 to CDS0.
f. The actual capacitor capacitances and charging/discharging periods must be determined
experimentally in accordance with the current dissipation requirements of the LCD panel. An
optimum current value can be selected, in contrast to the case in which a direct current flows
constantly in the built-in split-resistance.
Charging
period Tc
Discharging
period Tdc
Vd1
V1 potential
V0
V1
V2 potential
C1
V2
V1×2/3
Voltage drop
associated with
discharging due
to LCD panel
driving
Vd2
C2
V3 potential
V3
C3
V1×1/3
Vd3
Power supply voltage fluctuation in 1/3 bias system
Figure 13.14 Example of Low-Power-Consumption LCD Drive Operation
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REJ09B0144-0600
Section 13 LCD Controller/Driver
1 frame
1 frame
M
M
Data
Data
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
V1
V2
V3
VSS
COM2
COM3
V1
V2
V3
VSS
V1
V2
V3
VSS
COM4
SEGn
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
V1
V2
V3
VSS
COM2
COM3
V1
V2
V3
VSS
SEGn
(a) Waveform with 1/4 duty
(b) Waveform with 1/3 duty
1 frame
1 frame
M
M
Data
Data
COM1
V1
V2, V3
VSS
COM1
COM2
V1
V2, V3
VSS
SEGn
SEGn
V1
VSS
V1
VSS
(d) Waveform with static output
(c) Waveform with 1/2 duty
Figure 13.15 Output Waveforms for Each Duty Cycle (A Waveform)
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REJ09B0144-0600
Section 13 LCD Controller/Driver
1 frame
1 frame
1 frame
1 frame
1 frame
M
M
Data
Data
V1
V2
V3
VSS
V1
V2
V3
VSS
V1
V2
V3
VSS
V1
V2
V3
VSS
COM1
COM2
COM3
COM4
V1
V2
V3
VSS
SEGn
1 frame
1 frame
1 frame
1 frame
V1
V2
V3
VSS
V1
V2
V3
VSS
V1
V2
V3
VSS
COM1
COM2
COM3
V1
V2
V3
VSS
SEGn
(a) Waveform with 1/4 duty
1 frame
1 frame
(b) Waveform with 1/3 duty
1 frame
1 frame
1 frame
1 frame
1 frame
M
M
Data
Data
V1
COM1
V1
V2, V3
VSS
COM1
COM2
V1
V2, V3
VSS
SEGn
SEGn
V1
V2, V3
VSS
VSS
V1
VSS
(d) Waveform with static output
(c) Waveform with 1/2 duty
Figure 13.16 Output Waveforms for Each Duty Cycle (B Waveform)
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Section 13 LCD Controller/Driver
Table 13.3 Output Levels
Data
0
0
1
1
M
0
1
0
1
Common output
V1
VSS
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V2, V3
V2, V3
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Static
1/2 duty
1/3 duty
1/4 duty
13.3.5
Operation in Power-Down Modes
In this LSI, the LCD controller/driver can be operated even in the power-down modes. The
operating state of the LCD controller/driver in the power-down modes is summarized in table
13.4.
In subactive mode, watch mode, and subsleep mode, the system clock oscillator stops, and
therefore, unless φw, φw/2, or φw/4 has been selected by bits CKS3 to CKS0, the clock will not be
supplied and display will halt. Since there is a possibility that a direct current will be applied to
the LCD panel in this case, it is essential to ensure that φw, φw/2, or φw/4 is selected. In active
(medium-speed) mode, the system clock is switched, and therefore CKS3 to CKS0 must be
modified to ensure that the frame frequency does not change.
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Section 13 LCD Controller/Driver
Table 13.4 Power-Down Modes and Display Operation
Reset Active
Sleep
Watch
Subactive
Subsleep
Module
Standby Standby
φ
Runs
Runs
Runs
Stops
Stops
Stops
Stops
Stops*4
φw
Runs
Runs
Runs
Runs
Runs
Runs
Stops*1
Stops*4
Display
ACT =
operation “0”
Stops
Stops
Stops
Stops
Stops
Stops
Stops*2
Stops
ACT =
“1”
Stops
Functions Functions Functions
*3
Functions
*3
Functions
*3
Stops*2
Stops
Mode
Clock
Notes: 1. The subclock oscillator does not stop, but clock supply is halted.
2. The LCD drive power supply is turned off regardless of the setting of the PSW bit.
3. Display operation is performed only if φw, φw/2, or φw/4 is selected as the operating
clock.
4. The clock supplied to the LCD stops.
13.3.6
Boosting the LCD Drive Power Supply
When a large panel is driven, the on-chip power supply capacity may be insufficient. If the power
supply capacity is insufficient when VCC is used as the power supply, the power supply impedance
must be reduced. This can be done by connecting bypass capacitors of around 0.1 to 0.3 µF to
pins V1 to V3, as shown in figure 13.17, or by adding a split-resistance externally.
VCC
V0
V1
R
This LSI
R = several kΩ to
several MΩ
V2
R
C = 0.1 to 0.3 µF
V3
R
VSS
Figure 13.17 Connection of External Split-Resistance
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Section 13 LCD Controller/Driver
13.3.7
Connection to HD66100
If the segments are to be expanded externally, an HD66100 should be connected. Connecting one
HD66100 provides 80-segment expansion. When carrying out external expansion, select the
external expansion signal function of pins SEG32 to SEG29 with the SGX bit in LPCR, and set bits
SGS3 to SGS0 to 0000 or 0001. Data is output externally from SEG1 of the LCD RAM. SEG28 to
SEG1 function as ports.
Figure 13.18 shows examples of connection to an HD66100. The output level is determined by a
combination of the data and the M pin output, but these combinations differ from those in the
HD66100. Table 13.3 shows the output levels of the LCD drive power supply, and figures 13.15
and 13.16 show the common and segment waveforms for each duty cycle.
When ACT is cleared to 0, operation stops with CL2 = 0, CL1 = 0, M = 0, and DO at the data value
(1 or 0) being output at that instant. In standby mode, the expansion pins go to the highimpedance (floating) state.
When external expansion is implemented, the load in the LCD panel increases and the on-chip
power supply may not provide sufficient current capacity. In this case, measures should be taken
as described in section 13.3.6, Boosting the LCD Drive Power Supply.
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Section 13 LCD Controller/Driver
VCC
V0
V1
V2
V3
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
This LSI
VSS
SEG32/CL1
SEG31/CL2
SEG30/DO
SEG29/M
HD66100
(a) 1/3 bias, 1/4 or 1/3 duty
VCC
V0
V1
V2
V3
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
This LSI
VSS
SEG32/CL1
SEG31/CL2
SEG30/DO
SEG29/M
HD66100
(b) 1/2 duty
VCC
V0
V1
V2
V3
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
This LSI
VSS
SEG32/CL1
SEG31/CL2
SEG30/DO
SEG29/M
HD66100
(c) Static mode
Figure 13.18 Connection to HD66100
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Section 13 LCD Controller/Driver
Rev. 6.00 Aug 04, 2006 page 428 of 626
REJ09B0144-0600
Section 14 Power Supply Circuit
Section 14 Power Supply Circuit
14.1
Overview
H8/3827R Group, H8/38327 Group and H8/38427 Group incorporates an internal power supply
step-down circuit. Use of this circuit enables the internal power supply to be fixed at a constant
level of approximately 3.0 V to 3.2 V, independently of the voltage of the power supply connected
to the external VCC pin. As a result, the current consumed when an external power supply is used at
3.0 V or above can be held down to virtually the same low level as when used at approximately
3.0 V. If the external power supply is 3.0 V or below, the internal voltage will be practically the
same as the external voltage. It is, of course, also possible to use the same level of external power
supply voltage and internal power supply voltage without using the internal power supply stepdown circuit.
14.2
When Using Internal Power Supply Step-Down Circuit
Connect the external power supply to the VCC pin, and connect a capacitance of approximately
0.1 µF, in the case of the H8/3827R, or approximately 0.33 µF, in the case of the H8/38327 or
H8/38427, between CVCC and VSS, as shown in figure 14.1. The internal step-down circuit is made
effective simply by adding this external circuit. In the external circuit interface, the external power
supply voltage connected to VCC and the GND potential connected to VSS are the reference levels.
For example, for port input/output levels, the VCC level is the reference for the high level, and the
VSS level is that for the low level. The LCD power supply and A/D converter analog power supply
are not affected by the internal step-down current.
In the H8/3827R Group the operating range differs depending on whether or not the internal stepdown circuit is used. For details, see section 15, Electrical Characteristics.
VCC
Step-down circuit
Internal
logic
CVCC
Internal
power
supply
VSS
Stabilization capacitance
(approximately 0.1 µF, in the case of
the H8/3827R, or approximately 0.33 µF,
in the case of the H8/38327 or H8/38427)
Figure 14.1 Power Supply Connection when Internal Step-Down Circuit is Used
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REJ09B0144-0600
Section 14 Power Supply Circuit
14.3
When Not Using Internal Power Supply Step-Down Circuit
When the internal power supply step-down circuit is not used, connect the external power supply
to the CVCC pin and VCC pin, as shown in figure 14.2. The external power supply is then input
directly to the internal power supply. The permissible range for the power supply voltage is 1.8 V
to 5.5 V for the H8/3827R Group and 2.7 V to 3.6 V for the H8/38327 Group and H8/38427
Group. Normally, however, the internal power supply step-down circuit should be used. Operation
cannot be guaranteed if a voltage outside this range is input.
VCC
Step-down circuit
CVCC
Internal
logic
Internal
power
supply
VSS
Figure 14.2 Power Supply Connection when Internal Step-Down Circuit is Not Used
14.4
H8/3827S Group
The H8/3827S Group has two VCC pins, which should be interconnected externally.
14.5
Notes on Switching from the H8/3827R to the H8/38327 or H8/38427
Examine the following with regard to the power supply circuit.
(1) If the internal power supply step-down circuit was used on the H8/3827R
The stabilization capacitance value differs between the products. It is necessary to change the
value from 0.1 µF (H8/3827R) to 0.33 µF (H8/38327 or H8/38427). Note that these values are
rough guidelines and it is still necessary to confirm system operation.
(2) If the internal power supply step-down circuit was not used on the H8/3827R
Use of the internal power supply step-down circuit of the H8/38327 or H8/38427 is
recommended. Furthermore, operation at a VCC of 3.6 V or greater is not guaranteed if the
internal power supply step-down circuit is not used. It is therefore necessary to change the
CVCC connection to use the internal power supply step-down circuit.
Rev. 6.00 Aug 04, 2006 page 430 of 626
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Section 15 Electrical Characteristics
Section 15 Electrical Characteristics
15.1
H8/3827R Group Absolute Maximum Ratings
(Regular Specifications)
Table 15.1 lists the absolute maximum ratings.
Table 15.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Notes
*1
Power supply voltage
VCC, CVCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Programming voltage
VPP
–0.3 to +13.0
V
Input voltage
Ports other than Port B
Vin
–0.3 to VCC +0.3
V
Port B
AVin
V
°C
Operating temperature
Topr
–0.3 to AVCC +0.3
2
–20 to +75*
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. The operating temperature is the temperature range in which power (voltage VCC shown
in "Electrical Characteristics") can be applied to the chip.
Rev. 6.00 Aug 04, 2006 page 431 of 626
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Section 15 Electrical Characteristics
15.2
H8/3827R Group Electrical Characteristics (Regular Specifications)
15.2.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures.
1. Power Supply Voltage and Oscillator Frequency Range
38.4
fW (kHz)
fosc (MHz)
16.0
10.0
32.768
4.0
2.0
1.8
2.7
4.5
5.5
VCC (V)
1.8
• All operating modes
• Sleep (high-speed) mode
• Internal power supply step-down circuit not used
fosc (MHz)
Note: fosc is the oscillator frequency. When external
clocks are used, fosc=1MHz is the minimum.
10.0
4.0
2.0
2.7
4.5
5.5
VCC (V)
• Active (high-speed) mode
1.8
3.0
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
• Internal power supply step-down circuit used
Note: fosc is the oscillator frequency. When external
clocks are used, fosc=1MHz is the minimum.
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Section 15 Electrical Characteristics
2. Power Supply Voltage and Operating Frequency Range
φ (MHz)
8.0
5.0
19.2
2.0
16.384
1.0
(0.5)
4.5
5.5
VCC (V)
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=1MHz.
9.6
φSUB (kHz)
2.7
1.8
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
• Internal power supply step-down circuit not used
8.192
4.8
4.096
1000
φ (kHz)
1.8
3.6
5.5
625
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
250
15.625
(7.813)
1.8
2.7
4.5
5.5
VCC (V)
• Active (medium-speed) mode (except A/D converter)
• Sleep (medium-speed) mode (except A/D converter)
• Internal power supply step-down circuit not used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=15.625kHz.
φ (MHz)
5.0
2.0
1.0
(0.5)
1.8 2.7
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
• Internal power supply step-down circuit used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=1MHz.
φ (kHz)
625
250
15.625
(7.813)
1.8
2.7
5.5
VCC (V)
• Active (medium-speed) mode (except A/D converter)
• Sleep (medium-speed) mode (except A/D converter)
• Internal power supply step-down circuit used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=15.625kHz.
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Section 15 Electrical Characteristics
3. Analog Power Supply Voltage and A/D Converter Operating Range
1000
φ (kHz)
φ (MHz)
5.0
1.0
625
500
0.5
1.8
2.7
4.5
1.8
5.5
2.7
4.5
5.5
AVCC (V)
AVCC (V)
• Active (medium-speed) mode
• Sleep (high-speed) mode
• Sleep (medium-speed) mode
• Internal power supply step-down circuit
not used and used
• Internal power supply step-down circuit not used
φ (kHz)
• Active (high-speed) mode
625
500
1.8
2.7
4.5
5.5
AVCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode
• Internal power supply step-down circuit used
Rev. 6.00 Aug 04, 2006 page 434 of 626
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Section 15 Electrical Characteristics
15.2.2
DC Characteristics
Table 15.2 lists the DC characteristics.
Table 15.2 DC Characteristics
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C*4
(including subactive mode) unless otherwise indicated.
Values
Item
Symbol Applicable Pins Min
Input high
voltage
VIH
Typ
Max
Unit Test Condition
V
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
0.8 VCC
—
VCC + 0.3
0.9 VCC
—
VCC + 0.3
RXD31, RXD32,
UD
0.7 VCC
—
VCC + 0.3
0.8 VCC
—
VCC + 0.3
0.8 VCC
—
VCC + 0.3
0.9 VCC
—
VCC + 0.3
X1
0.9 VCC
—
VCC + 0.3
V
VCC = 1.8 V to 5.5 V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
0.7 VCC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 VCC
—
VCC + 0.3
Except the above
PB0 to PB7
0.7 VCC
—
AVCC + 0.3
VCC = 4.0 V to 5.5 V
0.8 VCC
—
AVCC + 0.3
Except the above
OSC1
Notes
VCC = 4.0 V to 5.5 V
Except the above
V
VCC = 4.0 V to 5.5 V
Except the above
V
VCC = 4.0 V to 5.5 V
Except the above
Note: Connect the TEST pin to VSS.
Rev. 6.00 Aug 04, 2006 page 435 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Input low
voltage
VIL
Max
Unit Test Condition
V
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
–0.3
—
0.2 VCC
–0.3
—
0.1 VCC
RXD31, RXD32,
UD
–0.3
—
0.3 VCC
–0.3
—
0.2 VCC
Except the above
–0.3
—
0.2
When internal stepdown circuit is
used.
–0.3
—
0.2 VCC
–0.3
—
0.1 VCC
X1
–0.3
—
0.1 VCC
V
VCC = 1.8 V to 5.5 V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3,
PB0 to PB7
–0.3
—
0.3 VCC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 VCC
P10 to P17,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
VCC – 1.0 —
—
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–IOH = 0.5 mA
VCC – 0.3 —
—
–IOH = 0.1 mA
OSC1
Output high VOH
voltage
Typ
Rev. 6.00 Aug 04, 2006 page 436 of 626
REJ09B0144-0600
VCC = 4.0 V to 5.5 V
Except the above
V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
Except the above
Except the above
V
VCC = 4.0 V to 5.5 V
–IOH = 1.0 mA
Notes
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit Test Condition
Output low
voltage
VOL
—
—
0.6
V
—
—
0.5
IOL = 0.4 mA
P50 to P57, P60
to P67, P70 to
P77, P80 to P87,
PA0 to PA3
—
—
0.5
IOL = 0.4 mA
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
—
—
20.0
—
—
1.0
OSC1, X1,
P10 to P17,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
—
—
1.0
PB0 to PB7
—
—
1.0
P10 to P17,
P30 to P37,
P50 to P57,
P60 to P67
50.0
—
300.0
—
35.0
—
Input/output | IIL |
leakage
current
Pull-up
MOS
current
–Ip
P10 to P17,
P40 to P42
RES, P43
µA
µA
Notes
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
VIN = 0.5 V to
VCC – 0.5 V
*2
*1
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AVCC – 0.5 V
µA
VCC = 5 V,
VIN = 0 V
VCC = 2.7 V,
VIN = 0 V
Reference
value
Rev. 6.00 Aug 04, 2006 page 437 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Input
CIN
capacitance
Subsleep
mode
current
dissipation
Unit Test Condition
pF
Notes
—
—
15.0
RES
—
—
80.0
*2
—
—
15.0
*1
—
—
50.0
*2
—
—
15.0
*1
PB0 to PB7
—
—
15.0
IOPE1
VCC
—
4.5
6.5
mA
Active (high-speed) *3
*5
mode VCC = 5 V,
*6
fOSC = 10MHz
IOPE2
VCC
—
1.3
2.0
mA
Active (mediumspeed) mode
VCC = 5 V,
fOSC = 10MHz
Divided by 128
*3
*5
*6
VCC
—
2.5
4.0
mA
VCC=5 V,
fOSC=10MHz
*3
*5
*6
VCC
—
15
30
µA
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/2)
*3
*5
*6
—
8
—
µA
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/8)
*3
*5
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/2)
*3
*5
*6
Sleep mode ISLEEP
current
dissipation
Subactive
mode
current
dissipation
Max
All input pins
except power
supply, RES,
P43, PB0 to PB7
P43
Active
mode
current
dissipation
Typ
ISUB
ISUBSP
VCC
—
Rev. 6.00 Aug 04, 2006 page 438 of 626
REJ09B0144-0600
7.5
16
µA
f = 1MHz,
VIN =0 V,
Ta = 25°C
Reference
value
*6
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit Test Condition
Notes
Watch
mode
current
dissipation
IWATCH
VCC
—
2.8
6
µA
VCC = 2.7 V, 3
2 kHz crystal
oscillator
LCD not used
*3
*5
*6
Standby
mode
current
dissipation
ISTBY
VCC
—
1.0
5.0
µA
32 kHz crystal
oscillator not used
*3
*5
RAM data
retaining
voltage
VRAM
VCC
1.5
—
—
V
Allowable
output low
current
(per pin)
IOL
Output pins
except port 3
—
—
2.0
mA
Port 3
—
—
10.0
All output pins
—
—
0.5
Allowable
output low
current
(total)
∑ IOL
Output pins
except port 3
—
—
40.0
Port 3
—
—
80.0
All output pins
—
—
20.0
Allowable
–IOH
output high
current
(per pin)
All output pins
—
—
2.0
—
—
0.2
Allowable
∑ – IOH
output high
current
(total)
All output pins
—
—
15.0
—
—
10.0
*3
*5
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
Except the above
mA
VCC = 4.0 V to 5.5 V
Except the above
Notes: 1. Applies to the Mask ROM products.
2. Applies to the HD6473827R.
Rev. 6.00 Aug 04, 2006 page 439 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
3. Pin states during current measurement.
Mode
Active (high-speed)
mode (IOPE1)
RES
Pin
Internal State
Other
Pins
LCD Power
Supply
VCC
Only CPU operates
VCC
Halted
Oscillator Pins
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
Active (mediumspeed) mode (IOPE2)
Sleep mode
VCC
Only timers operate
VCC
Halted
Subactive mode
VCC
Only CPU operates
VCC
Halted
Subsleep mode
VCC
Only timers operate,
CPU stops
VCC
Halted
Watch mode
VCC
Only time base
operates, CPU stops
VCC
Halted
Standby mode
VCC
CPU and timers both
stop
VCC
Halted
System clock oscillator:
crystal
Subclock oscillator:
crystal
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
4. The guaranteed temperature as an electrical characteristic for Die products is 75°C.
5. Excludes current in pull-up MOS transistors and output buffers.
6. When internal step-down circuit is used.
Rev. 6.00 Aug 04, 2006 page 440 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.2.3
AC Characteristics
Table 15.3 lists the control signal timing, and tables 15.4 lists the serial interface timing.
Table 15.3 Control Signal Timing
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C*4
(including subactive mode) unless otherwise indicated.
Values
Applicable
Symbol Pins
Min Typ
Max
Unit
Test Condition
System clock
oscillation
frequency
fOSC
2
—
16
MHz
VCC = 4.5 V to 5.5 V *2
2
—
10
VCC = 2.7 V to 5.5 V
2
—
4
VCC = 1.8 V to 5.5 V
OSC clock (φOSC)
cycle time
tOSC
62.5 —
500
ns
(1000)
VCC = 4.5 V to 5.5 V Figure 15.1
*2*3
100
—
500
(1000)
VCC = 2.7 V to 5.5 V Figure 15.1
250
—
500
(1000)
VCC = 1.8 V to 5.5 V *3
2
—
128
244.1 µs
Item
System clock (φ)
cycle time
OSC1, OSC2
OSC1, OSC2
tcyc
Reference
Figure
tOSC
—
—
Subclock oscillation fW
frequency
X1, X2
—
32.768 —
or 38.4
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5 or —
26.0
µs
Figure 15.1
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
*1
2
—
—
tcyc
Instruction cycle
time
Oscillation
stabilization time
tsubcyc
trc
OSC1, OSC2
—
20
45
µs
Figure 15.9
Figure 15.9
VCC = 2.2 V to 5.5 V *2
—
0.1
8
ms
Figure 15.9
Figure 15.9
VCC = 2.2 V to 5.5 V
—
—
50
ms
Except the above
Rev. 6.00 Aug 04, 2006 page 441 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Oscillation
stabilization time
trc
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
25
—
—
ns
Item
External clock low
width
External clock rise
time
External clock fall
time
Pin RES low width
Test Condition
Reference
Figure
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPL
40
—
—
VCC = 2.7 V to 5.5 V Figure 15.1
100
—
—
VCC = 1.8 V to 5.5 V
X1
—
15.26
or
13.02
—
µs
OSC1
25
—
—
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPr
40
—
—
VCC = 2.7 V to 5.5 V Figure 15.1
100
—
—
VCC = 1.8 V to 5.5 V
X1
—
15.26
or
13.02
—
µs
OSC1
—
—
6
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPf
—
—
10
VCC = 2.7 V to 5.5 V Figure 15.1
—
—
25
VCC = 1.8 V to 5.5 V
X1
—
—
55.0
ns
OSC1
—
—
6
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tREL
—
—
10
VCC = 2.7 V to 5.5 V Figure 15.1
—
—
25
VCC = 1.8 V to 5.5 V
X1
—
—
55.0
ns
RES
10
—
—
tcyc
Rev. 6.00 Aug 04, 2006 page 442 of 626
REJ09B0144-0600
Figure 15.2
Section 15 Electrical Characteristics
Applicable
Symbol Pins
Item
Input pin high width tIH
Input pin low width
UD pin minimum
modulation width
Notes: 1.
2.
3.
4.
tIL
tUDH
tUDL
Values
Min
Typ
Max
Unit
2
IRQ0 to IRQ4,
WKP0 to WKP7
ADTRG, TMIC
TMIF, TMIG,
AEVL, AEVH
—
—
tcyc
2
IRQ0 to IRQ4,
WKP0 to WKP7,
ADTRG, TMIC,
TMIF, TMIG,
AEVL, AEVH
—
UD
—
Test Condition
Reference
Figure
Figure 15.3
tsubcyc
—
tcyc
Figure 15.3
tsubcyc
4
—
tcyc
Figure 15.4
tsubcyc
Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
Internal power supply step-down circuit not used
Figures in parentheses are the maximum tOSC rate with external clock input.
The guaranteed temperature as an electrical characteristic for Die products is 75°C.
Table 15.4 Serial Interface (SCI3-1, SCI3-2) Timing
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C*2
(including subactive mode) unless otherwise indicated.
Values
Item
Input clock
cycle
Symbol
Asynchronous
tscyc
Synchronous
Input clock pulse width
tSCKW
Transmit data delay time
(synchronous)
tTXD
Receive data setup time
(synchronous)
tRXS
Receive data hold time
(synchronous)
tRXH
Min
Typ
Max
Unit
Test Conditions
Reference
Figure
4
—
—
—
—
tcyc or
tsubcyc
Figure 15.5
6
0.4
—
0.6
tscyc
Figure 15.5
—
—
1
—
1
tcyc or
tsubcyc
VCC = 4.0 V to 5.5 V Figure 15.6
—
200.0
—
—
ns
VCC = 4.0 V to 5.5 V Figure 15.6 *1
400.0
—
—
200.0
—
—
400.0
—
—
Except the above
Except the above
ns
Figure 15.6
VCC = 4.0 V to 5.5 V Figure 15.6 *1
Except the above
Figure 15.6
Notes: 1. When internal step-down circuit is not used.
2. The guaranteed temperature as an electrical characteristic for Die products is 75°C.
Rev. 6.00 Aug 04, 2006 page 443 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.2.4
A/D Converter Characteristics
Table 15.5 shows the A/D converter characteristics.
Table 15.5 A/D Converter Characteristics
VCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C*6 (including subactive mode)
unless otherwise indicated.
Item
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Analog power AVCC
supply voltage
AVCC
1.8
—
5.5
V
Analog input
voltage
AN0 to AN7
– 0.3
—
AVCC + 0.3
V
AVCC
—
—
1.5
mA
AVCC
—
600
—
µA
AVIN
Analog power AIOPE
supply current
AISTOP1
Test Condition
Notes
*1
AVCC = 5 V
*2
Reference
value
*3
AISTOP2
AVCC
—
—
5
µA
Analog input
capacitance
CAIN
AN0 to AN7
—
—
15.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
10
bit
Nonlinearity
error
—
—
±2.5
LSB
—
—
±5.5
AVCC = 2.0 V to 5.5 V
VCC = 2.0 V to 5.5 V
—
—
±7.5
Except the above
—
—
±0.5
Quantization
error
Rev. 6.00 Aug 04, 2006 page 444 of 626
REJ09B0144-0600
LSB
AVCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*4
*5
Section 15 Electrical Characteristics
Item
Absolute
accuracy
Conversion
time
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Test Condition
Notes
—
—
±3.0
LSB
AVCC = 3.0 V to 5.5 V
VCC = 3.0 V to 5.5 V
*4
—
—
±6.0
AVCC = 2.0 V to 5.5 V
VCC = 2.0 V to 5.5 V
—
—
±8.0
Except the above
*5
12.4
—
124
AVCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*4
62
—
124
µs
Except the above
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. When internal step-down circuit is not used.
5. Conversion time 62 µs
6. The guaranteed temperature as an electrical characteristic for Die products is 75°C.
Rev. 6.00 Aug 04, 2006 page 445 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.2.5
LCD Characteristics
Table 15.6 shows the LCD characteristics.
Table 15.6 LCD Characteristics
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C*3
(including subactive mode) unless otherwise specified.
Applicable
Test
Conditions
Values
Item
Symbol Pins
Segment driver
drop voltage
VDS
SEG1 to
SEG32
ID = 2 µA
V1 = 2.7 to 5.5 V
—
—
0.6
V
*1
Common driver
drop voltage
VDC
COM1 to
COM4
ID = 2 µA
V1 = 2.7 to 5.5 V
—
—
0.3
V
*1
Between V1 and
VSS
0.5
3.0
9.0
MΩ
2.2
—
5.5
V
LCD power supply RLCD
split-resistance
Liquid crystal
display voltage
VLCD
V1
Min Typ Max Unit Notes
*2
Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or
common pin.
2. When the liquid crystal display voltage is supplied from an external power source,
ensure that the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
3. The guaranteed temperature as an electrical characteristic for Die products is 75°C.
Rev. 6.00 Aug 04, 2006 page 446 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Table 15.7 AC Characteristics for External Segment Expansion
VCC = 1.8 V to 5.5 V, VSS = 0.0 V, Ta = –20°C to +75°C*2 (including subactive mode) unless
otherwise specified.
Item
Test
Applicable
Symbol Pins
Conditions
Clock high width
tCWH
Clock low width
Clock setup time
tCWL
tCSU
Values
Min
Typ Max
Reference
Unit Figure
CL1, CL2
*1
800
—
—
ns
Figure 15.7
CL2
*1
800
—
—
ns
Figure 15.7
CL1, CL2
*1
500
—
—
ns
Figure 15.7
Data setup time
tSU
DO
*1
300
—
—
ns
Figure 15.7
Data hold time
tDH
DO
*1
300
—
—
ns
Figure 15.7
*1
–1000 —
1000 ns
Figure 15.7
—
170
Figure 15.7
M delay time
tDM
M
Clock rise and fall
times
tCT
CL1, CL2
—
ns
Notes: 1. Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
2. The guaranteed temperature as an electrical characteristic for Die products is 75°C.
Rev. 6.00 Aug 04, 2006 page 447 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.3
H8/3827R Group Absolute Maximum Ratings (Wide-Range
Specification)
Table 15.8 lists the absolute maximum ratings.
Table 15.8 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC, CVCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Programming voltage
VPP
–0.3 to +13.0
V
Input voltage
Ports other than Port B
Vin
–0.3 to VCC +0.3
V
Port B
AVin
–0.3 to AVCC +0.3
V
Operating temperature
Topr
–40 to +85
°C
Storage temperature
Tstg
–55 to +125
°C
Note: Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics. Exceeding
these values can result in incorrect operation and reduced reliability.
Rev. 6.00 Aug 04, 2006 page 448 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.4
H8/3827R Group Electrical Characteristics (Wide-Range
Specification)
15.4.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures.
1. Power Supply Voltage and Oscillator Frequency Range
38.4
fW (kHz)
fosc (MHz)
16.0
10.0
32.768
4.0
2.0
1.8
2.7
4.5
5.5
VCC (V)
1.8
3.0
4.5
5.5
VCC (V)
• Active (high-speed) mode
• All operating modes
• Sleep (high-speed) mode
• Internal power supply step-down circuit not used
fosc (MHz)
Note: fosc is the oscillator frequency. When external
clocks are used, fosc=1MHz is the minimum.
10.0
4.0
2.0
1.8
2.7
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
• Internal power supply step-down circuit used
Note: fosc is the oscillator frequency. When external
clocks are used, fosc=1MHz is the minimum.
Rev. 6.00 Aug 04, 2006 page 449 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
2. Power Supply Voltage and Operating Frequency Range
φ (MHz)
8.0
5.0
19.2
2.0
16.384
1.0
(0.5)
4.5
5.5
VCC (V)
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=1MHz.
9.6
φSUB (kHz)
2.7
1.8
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
• Internal power supply step-down circuit not used
8.192
4.8
4.096
1000
φ (kHz)
1.8
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
250
1.8
2.7
4.5
5.5
VCC (V)
• Active (medium-speed) mode (except A/D converter)
• Sleep (medium-speed) mode (except A/D converter)
• Internal power supply step-down circuit not used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=15.625kHz.
5.0
φ (MHz)
5.5
VCC (V)
15.625
(7.813)
2.0
1.0
(0.5)
1.8 2.7
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
• Internal power supply step-down circuit used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=1MHz.
625
φ (kHz)
3.6
625
250
15.625
(7.813)
1.8
2.7
5.5
VCC (V)
• Active (medium-speed) mode (except A/D converter)
• Sleep (medium-speed) mode (except A/D converter)
• Internal power supply step-down circuit used
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=15.625kHz.
Rev. 6.00 Aug 04, 2006 page 450 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
3. Analog Power Supply Voltage and A/D Converter Operating Range
1000
φ (kHz)
1.0
625
500
0.5
1.8
2.7
4.5
1.8
5.5
2.7
4.5
5.5
AVCC (V)
AVCC (V)
• Active (high-speed) mode
• Active (medium-speed) mode
• Sleep (high-speed) mode
• Sleep (medium-speed) mode
• Internal power supply step-down circuit
not used and used
• Internal power supply step-down circuit not used
φ (kHz)
φ (MHz)
5.0
625
500
1.8
2.7
4.5
5.5
AVCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode
• Internal power supply step-down circuit used
Rev. 6.00 Aug 04, 2006 page 451 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.4.2
DC Characteristics
Table 15.9 lists the DC characteristics.
Table 15.9 DC Characteristics
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C
(including subactive mode) unless otherwise indicated.
Values
Item
Symbol Applicable Pins Min
Input high
voltage
VIH
Typ
Max
Unit Test Condition
V
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
0.8 VCC
—
VCC + 0.3
0.9 VCC
—
VCC + 0.3
RXD31, RXD32,
UD
0.7 VCC
—
VCC + 0.3
0.8 VCC
—
VCC + 0.3
0.8 VCC
—
VCC + 0.3
0.9 VCC
—
VCC + 0.3
X1
0.9 VCC
—
VCC + 0.3
V
VCC = 1.8 V to 5.5 V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
0.7 VCC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 VCC
—
VCC + 0.3
Except the above
PB0 to PB7
0.7 VCC
—
AVCC + 0.3
VCC = 4.0 V to 5.5 V
0.8 VCC
—
AVCC + 0.3
Except the above
OSC1
Note: Connect the TEST pin to VSS.
Rev. 6.00 Aug 04, 2006 page 452 of 626
REJ09B0144-0600
VCC = 4.0 V to 5.5 V
Except the above
V
VCC = 4.0 V to 5.5 V
Except the above
V
VCC = 4.0 V to 5.5 V
Except the above
Notes
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Input low
voltage
VIL
Max
Unit Test Condition
V
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
–0.3
—
0.2 VCC
–0.3
—
0.1 VCC
RXD31, RXD32,
UD
–0.3
—
0.3 VCC
–0.3
—
0.2 VCC
Except the above
–0.3
—
0.2
When internal stepdown circuit is
used.
–0.3
—
0.2 VCC
–0.3
—
0.1 VCC
X1
–0.3
—
0.1 VCC
V
VCC = 1.8 V to 5.5 V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3,
PB0 to PB7
–0.3
—
0.3 VCC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 VCC
P10 to P17,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
VCC – 1.0 —
—
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–IOH = 0.5 mA
VCC – 0.3 —
—
–IOH = 0.1 mA
OSC1
Output high VOH
voltage
Typ
Notes
VCC = 4.0 V to 5.5 V
Except the above
V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
Except the above
Except the above
V
VCC = 4.0 V to 5.5 V
–IOH = 1.0 mA
Rev. 6.00 Aug 04, 2006 page 453 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit Test Condition
Output low
voltage
VOL
—
—
0.6
V
—
—
0.5
IOL = 0.4 mA
P50 to P57, P60
to P67, P70 to
P77, P80 to P87,
PA0 to PA3
—
—
0.5
IOL = 0.4 mA
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
—
—
20.0
—
—
1.0
OSC1, X1,
P10 to P17,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
—
—
1.0
PB0 to PB7
—
—
1.0
P10 to P17,
P30 to P37,
P50 to P57,
P60 to P67
50.0
—
300.0
—
35.0
—
Input/output | IIL |
leakage
current
Pull-up
MOS
current
–Ip
P10 to P17,
P40 to P42
RES, P43
Rev. 6.00 Aug 04, 2006 page 454 of 626
REJ09B0144-0600
µA
µA
Notes
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
VIN = 0.5 V to
VCC – 0.5 V
*2
*1
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AVCC – 0.5 V
µA
VCC = 5 V,
VIN = 0 V
VCC = 2.7 V,
VIN = 0 V
Reference
value
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Input
CIN
capacitance
Subsleep
mode
current
dissipation
Unit Test Condition
pF
Notes
—
—
15.0
RES
—
—
80.0
*2
—
—
15.0
*1
—
—
50.0
*2
—
—
15.0
*1
PB0 to PB7
—
—
15.0
IOPE1
VCC
—
4.5
6.5
mA
Active (high-speed) *3
*4
mode VCC = 5 V,
*5
fOSC = 10MHz
IOPE2
VCC
—
1.3
2.0
mA
Active (mediumspeed) mode
VCC = 5 V,
fOSC = 10MHz
Divided by 128
*3
*4
*5
VCC
—
2.5
4.0
mA
VCC=5 V,
fOSC=10MHz
*3
*4
*5
VCC
—
15
30
µA
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/2)
*3
*4
*5
—
8
—
µA
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/8)
*3
*4
VCC = 2.7 V,
LCD on 32 kHz
crystal oscillator
(φSUB=φw/2)
*3
*4
*5
Sleep mode ISLEEP
current
dissipation
Subactive
mode
current
dissipation
Max
All input pins
except power
supply, RES,
P43, PB0 to PB7
P43
Active
mode
current
dissipation
Typ
ISUB
ISUBSP
VCC
—
7.5
16
µA
f = 1MHz,
VIN =0 V,
Ta = 25°C
Reference
value
*5
Rev. 6.00 Aug 04, 2006 page 455 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit Test Condition
Notes
Watch
mode
current
dissipation
IWATCH
VCC
—
2.8
6
µA
VCC = 2.7 V 3
2 kHz crystal
oscillator
LCD not used
*3
*4
*5
Standby
mode
current
dissipation
ISTBY
VCC
—
1.0
5.0
µA
32 kHz crystal
oscillator not used
*3
*4
RAM data
retaining
voltage
VRAM
VCC
1.5
—
—
V
Allowable
output low
current
(per pin)
IOL
Output pins
except port 3
—
—
2.0
mA
Port 3
—
—
10.0
All output pins
—
—
0.5
Allowable
output low
current
(total)
∑ IOL
Output pins
except port 3
—
—
40.0
Port 3
—
—
80.0
All output pins
—
—
20.0
Allowable
–IOH
output high
current
(per pin)
All output pins
—
—
2.0
—
—
0.2
Allowable
∑ – IOH
output high
current
(total)
All output pins
—
—
15.0
—
—
10.0
Notes: 1. Applies to the Mask ROM products.
2. Applies to the HD6473827R.
Rev. 6.00 Aug 04, 2006 page 456 of 626
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*3
*4
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
Except the above
mA
VCC = 4.0 V to 5.5 V
Except the above
Section 15 Electrical Characteristics
3. Pin states during current measurement.
Mode
Active (high-speed)
mode (IOPE1)
RES
Pin
Internal State
Other
Pins
LCD Power
Supply
VCC
Only CPU operates
VCC
Halted
Oscillator Pins
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
Active (mediumspeed) mode (IOPE2)
Sleep mode
VCC
Only timers operate
VCC
Halted
Subactive mode
VCC
Only CPU operates
VCC
Halted
Subsleep mode
VCC
Only timers operate,
CPU stops
VCC
Halted
Watch mode
VCC
Only time base
operates, CPU stops
VCC
Halted
Standby mode
VCC
CPU and timers both
stop
VCC
Halted
System clock oscillator:
crystal
Subclock oscillator:
crystal
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
4. Excludes current in pull-up MOS transistors and output buffers.
5. When internal step-down circuit is used.
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Section 15 Electrical Characteristics
15.4.3
AC Characteristics
Table 15.10 lists the control signal timing, and tables 15.11 lists the serial interface timing.
Table 15.10 Control Signal Timing
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C
(including subactive mode) unless otherwise indicated.
Values
Applicable
Symbol Pins
Min Typ
Max
Unit
Test Condition
System clock
oscillation
frequency
fOSC
2
—
16
MHz
VCC = 4.5 V to 5.5 V *2
2
—
10
VCC = 2.7 V to 5.5 V
2
—
4
VCC = 1.8 V to 5.5 V
OSC clock (φOSC)
cycle time
tOSC
62.5 —
500
ns
(1000)
VCC = 4.5 V to 5.5 V Figure 15.1
*2*3
100
—
500
(1000)
VCC = 2.7 V to 5.5 V Figure 15.1
250
—
500
(1000)
VCC = 1.8 V to 5.5 V *3
2
—
128
244.1 µs
Item
System clock (φ)
cycle time
OSC1, OSC2
OSC1, OSC2
tcyc
Reference
Figure
tOSC
—
—
Subclock oscillation fW
frequency
X1, X2
—
32.768 —
or 38.4
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5 or —
26.0
µs
Figure 15.1
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
*1
2
—
—
tcyc
tsubcyc
—
20
45
µs
Figure 15.9
Figure 15.9
VCC = 2.2 V to 5.5 V *2
—
0.1
8
ms
Figure 15.9
Figure 15.9
VCC = 2.2 V to 5.5 V
—
—
50
ms
Except the above
Instruction cycle
time
Oscillation
stabilization time
trc
OSC1, OSC2
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Section 15 Electrical Characteristics
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Oscillation
stabilization time
trc
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
25
—
—
ns
Item
External clock low
width
External clock rise
time
External clock fall
time
Pin RES low width
Test Condition
Reference
Figure
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPL
40
—
—
VCC = 2.7 V to 5.5 V Figure 15.1
100
—
—
VCC = 1.8 V to 5.5 V
X1
—
15.26
or
13.02
—
µs
OSC1
25
—
—
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPr
40
—
—
VCC = 2.7 V to 5.5 V Figure 15.1
100
—
—
VCC = 1.8 V to 5.5 V
X1
—
15.26
or
13.02
—
µs
OSC1
—
—
6
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tCPf
—
—
10
VCC = 2.7 V to 5.5 V Figure 15.1
—
—
25
VCC = 1.8 V to 5.5 V
X1
—
—
55.0
ns
OSC1
—
—
6
ns
VCC = 4.5 V to 5.5 V Figure 15.1
*2
tREL
—
—
10
VCC = 2.7 V to 5.5 V Figure 15.1
—
—
25
VCC = 1.8 V to 5.5 V
X1
—
—
55.0
ns
RES
10
—
—
tcyc
Figure 15.2
Rev. 6.00 Aug 04, 2006 page 459 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Applicable
Symbol Pins
Item
Input pin high width tIH
Input pin low width
UD pin minimum
modulation width
tIL
tUDH
tUDL
Values
Min
Typ
Max
Unit
2
IRQ0 to IRQ4,
WKP0 to WKP7
ADTRG, TMIC
TMIF, TMIG,
AEVL, AEVH
—
—
tcyc
2
IRQ0 to IRQ4,
WKP0 to WKP7,
ADTRG, TMIC,
TMIF, TMIG,
AEVL, AEVH
—
UD
—
Reference
Figure
Test Condition
Figure 15.3
tsubcyc
—
tcyc
Figure 15.3
tsubcyc
4
—
tcyc
Figure 15.4
tsubcyc
Notes: 1. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
2. Internal power supply step-down circuit not used
3. Figures in parentheses are the maximum tOSC rate with external clock input.
Table 15.11 Serial Interface (SCI3-1, SCI3-2) Timing
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C unless
otherwise indicated.
Values
Item
Input clock
cycle
Min
Typ
Max
Unit
tscyc
4
—
—
Figure 15.5
Figure 15.5
6
—
—
tcyc or
tsubcyc
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Transmit data delay time
(synchronous)
tTXD
—
—
1
VCC = 4.0 V to 5.5 V Figure 15.6
—
—
1
tcyc or
tsubcyc
Receive data setup time
(synchronous)
tRXS
200.0
—
—
ns
VCC = 4.0 V to 5.5 V Figure 15.6*
400.0
—
—
Receive data hold time
(synchronous)
tRXH
200.0
—
—
400.0
—
—
Note:
*
Asynchronous
Test Conditions
Reference
Figure
Symbol
Synchronous
When internal step-down circuit is not used.
Rev. 6.00 Aug 04, 2006 page 460 of 626
REJ09B0144-0600
Except the above
Except the above
ns
Figure 15.6
VCC = 4.0 V to 5.5 V Figure 15.6*
Except the above
Figure 15.6
Section 15 Electrical Characteristics
15.4.4
A/D Converter Characteristics
Table 15.12 shows the A/D converter characteristics of the H8/3827R.
Table 15.12 A/D Converter Characteristics
VCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C unless otherwise indicated.
Item
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Analog power AVCC
supply voltage
AVCC
1.8
—
5.5
V
Analog input
voltage
AN0 to AN7
– 0.3
—
AVCC + 0.3
V
AVCC
—
—
1.5
mA
AVCC
—
600
—
µA
AVIN
Analog power AIOPE
supply current
AISTOP1
Test Condition
Notes
*1
AVCC = 5 V
*2
Reference
value
*3
AISTOP2
AVCC
—
—
5
µA
Analog input
capacitance
CAIN
AN0 to AN7
—
—
15.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
10
bit
Nonlinearity
error
—
—
±2.5
LSB
—
—
±5.5
AVCC = 2.0 V to 5.5 V
VCC = 2.0 V to 5.5 V
—
—
±7.5
Except the above
—
—
±0.5
Quantization
error
AVCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*4
*5
LSB
Rev. 6.00 Aug 04, 2006 page 461 of 626
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Section 15 Electrical Characteristics
Item
Absolute
accuracy
Conversion
time
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Test Condition
Notes
—
—
±3.0
LSB
AVCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*4
—
—
±6.0
AVCC = 2.0 V to 5.5 V
VCC = 2.0 V to 5.5 V
—
—
±8.0
Except the above
*5
12.4
—
124
AVCC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
*4
62
—
124
µs
Except the above
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. When internal step-down circuit is not used.
5. Conversion time 62 µs
Rev. 6.00 Aug 04, 2006 page 462 of 626
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Section 15 Electrical Characteristics
15.4.5
LCD Characteristics
Table 15.13 shows the LCD characteristics.
Table 15.13 LCD Characteristics
VCC = 1.8 V to 5.5 V, AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C
(including subactive mode) unless otherwise specified.
Values
Applicable Test
Symbol Pins
Conditions
Min Typ Max Unit Notes
Segment driver
drop voltage
VDS
SEG1 to
SEG32
ID = 2 µA
V1 = 2.7 to 5.5 V
—
—
0.6
V
*1
Common driver
drop voltage
VDC
COM1 to
COM4
ID = 2 µA
V1 = 2.7 to 5.5 V
—
—
0.3
V
*1
Between V1 and
VSS
0.5
3.0
9.0
MΩ
2.2
—
5.5
V
Item
LCD power supply RLCD
split-resistance
Liquid crystal
display voltage
VLCD
V1
*2
Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or
common pin.
2. When the liquid crystal display voltage is supplied from an external power source,
ensure that the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
Rev. 6.00 Aug 04, 2006 page 463 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Table 15.14 AC Characteristics for External Segment Expansion
VCC = 1.8 V to 5.5 V, VSS = 0.0 V, Ta = –40°C to +85°C (including subactive mode) unless
otherwise specified.
Item
Test
Applicable
Symbol Pins
Conditions
Min
Typ Max
Reference
Unit Figure
Clock high width
tCWH
CL1, CL2
*
800
—
—
ns
Figure 15.7
Clock low width
tCWL
CL2
*
800
—
—
ns
Figure 15.7
Clock setup time
tCSU
CL1, CL2
*
500
—
—
ns
Figure 15.7
Data setup time
tSU
DO
*
300
—
—
ns
Figure 15.7
Data hold time
tDH
DO
*
300
—
—
ns
Figure 15.7
M delay time
tDM
M
*
–1000 —
1000 ns
Figure 15.7
Clock rise and fall
times
tCT
CL1, CL2
—
170
Figure 15.7
Note:
*
Values
—
ns
Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
Rev. 6.00 Aug 04, 2006 page 464 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.5
H8/3827S Group Absolute Maximum Ratings
Table 15.15 lists the absolute maximum ratings.
Table 15.15 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Notes
V
*1
Power supply voltage
VCC
–0.3 to +4.3
Analog power supply voltage
AVCC
–0.3 to +4.3
V
Input voltage
Ports other than Port B
Vin
–0.3 to VCC +0.3
V
Port B
AVin
–0.3 to AVCC +0.3
V
Topr
–20 to +75 (Regular
specifications)
°C
Operating temperature
–40 to +85 (wide-range
specifications)
+75 (products shipped as
2
chips)*
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. Power may be applied when the temperature is between –20 and –75°C.
Rev. 6.00 Aug 04, 2006 page 465 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.6
H8/3827S Group Electrical Characteristics
15.6.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures.
1. Power Supply Voltage and Oscillator Frequency Range
fW (kHz)
fosc (MHz)
38.4
10.0
32.768
4.0
2.0
1.8
2.7
3.6
VCC (V)
1.8
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
Note: fosc is the oscillator frequency. When external
clocks are used, fosc=1MHz is the minimum.
Rev. 6.00 Aug 04, 2006 page 466 of 626
REJ09B0144-0600
3.6
• All operating modes
Section 15 Electrical Characteristics
φ (MHz)
2. Power Supply Voltage and Operating Frequency Range
5.0
19.2
2.0
16.384
1.0
(0.5)
1.8
2.7
3.6
9.6
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=1MHz.
φSUB (kHz)
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
8.192
4.8
4.096
φ (kHz)
1.8
3.6
625
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
250
15.625
(7.813)
1.8
2.7
3.6
VCC (V)
• Active (medium-speed) mode (except A/D converter)
• Sleep (medium-speed) mode (except A/D converter)
Note: Figures in parentheses are the minimum operating
frequency of a case external clocks are used.
When using an oscillator, the minimum operating
frequency is φ=15.625kHz.
3. Analog Power Supply Voltage and A/D Converter Operating Range
φ (kHz)
φ (MHz)
5.0
1.0
625
500
0.5
1.8
2.7
3.6
AVCC (V)
1.8
2.7
3.6
AVCC (V)
• Active (high-speed) mode
• Active (medium-speed) mode
• Sleep (high-speed) mode
• Sleep (medium-speed) mode
Rev. 6.00 Aug 04, 2006 page 467 of 626
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Section 15 Electrical Characteristics
15.6.2
DC Characteristics
Table 15.16 lists the DC characteristics of the H8/3827S Group.
Table 15.16 DC Characteristics
Values
Item
Symbol Applicable Pins Min
Input high
voltage
VIH
Typ
Max
Unit Test Condition
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
0.9 VCC
—
VCC + 0.3
V
RXD31, RXD32,
UD
0.8 VCC
—
VCC + 0.3
V
OSC1
0.9 VCC
—
VCC + 0.3
V
X1
0.9 VCC
—
VCC + 0.3
V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
0.8 VCC
—
VCC + 0.3
V
PB0 to PB7
0.8 VCC
—
AVCC + 0.3
Note: Connect the TEST pin to VSS.
Rev. 6.00 Aug 04, 2006 page 468 of 626
REJ09B0144-0600
Notes
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Input low
voltage
VIL
Output high VOH
voltage
Typ
Max
Unit Test Condition
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG
SCK31, SCK32,
ADTRG
–0.3
—
0.1 VCC
V
RXD31, RXD32,
UD
–0.3
—
0.2 VCC
V
OSC1
–0.3
—
0.1 VCC
V
X1
–0.3
—
0.1 VCC
V
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3,
PB0 to PB7
–0.3
—
0.2 VCC
V
P10 to P17,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
VCC – 0.3 —
—
V
Notes
–IOH = 0.1 mA
Rev. 6.00 Aug 04, 2006 page 469 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit Test Condition
Output low
voltage
VOL
V
Input/output | IIL |
leakage
current
Pull-up
MOS
current
–Ip
P10 to P17,
P40 to P42
—
—
0.5
P50 to P57, P60
to P67, P70 to
P77, P80 to P87,
PA0 to PA3
—
—
0.5
P30 to P37
—
—
0.5
RES, OSC1, X1,
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
—
—
1.0
PB0 to PB7
—
—
1.0
P10 to P17,
P30 to P37,
P50 to P57,
P60 to P67
10.0
—
300.0
Rev. 6.00 Aug 04, 2006 page 470 of 626
REJ09B0144-0600
IOL = 0.4 mA
IOL = 0.4 mA
IOL = 0.4 mA
µA
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AVCC – 0.5 V
µA
VCC = 3 V,
VIN = 0 V
Notes
Section 15 Electrical Characteristics
Values
Typ Max
Unit
Test Condition
Input
CIN
capacitance
Item
Symbol Applicable Pins Min
All input pins
except power
supply
—
—
pF
f = 1MHz,
VIN =0 V,
Ta = 25°C
Active
mode
current
dissipation
VCC
—
3
0.4 *
mA
Active (high-speed)
mode
VCC = 1.8 V,
fOSC = 2 MHz
—
3
1.4 *
Active (high-speed)
mode
VCC = 3 V,
fOSC = 4 MHz
—
3.5 5.5
Active (high-speed)
mode
VCC = 3 V,
fOSC = 10 MHz
—
3
0.1 *
Active (medium-speed)
mode
VCC = 1.8 V,
fOSC = 2 MHz
φOSC/128
—
3
0.3 *
Active (medium-speed)
mode
VCC = 3 V,
fOSC = 4 MHz
φOSC/128
—
0.7 1.6
Active (medium-speed)
mode
VCC = 3 V,
fOSC = 10 MHz
φOSC/128
—
3
0.2 *
—
3
0.6 *
VCC = 3 V,
fOSC = 4 MHz
—
1.4 2.9
VCC = 3 V,
fOSC = 10 MHz
IOPE1
IOPE2
Sleep mode ISLEEP
current
dissipation
VCC
VCC
15.0
mA
VCC = 1.8 V,
fOSC = 2 MHz
Notes
*1
*2
*1
*2
Rev. 6.00 Aug 04, 2006 page 471 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Subactive
mode
current
dissipation
Symbol Applicable Pins Min
ISUB
VCC
Typ
Max
Unit
Test Condition
Notes
—
8
*3
µA
VCC = 1.8 V,
LCD on 32 kHz crystal
oscillator
(φSUB = φW/2)
*1
*2
—
4
*3
VCC = 2.7 V,
LCD on 32 kHz crystal
oscillator
(φSUB = φW/8)
—
14
*3
VCC = 2.7 V,
LCD on 32 kHz crystal
oscillator
(φSUB = φW/2)
*1
*2
Subsleep
mode
current
dissipation
ISUBSP
VCC
—
5.0
12
µA
VCC = 2.7 V,
LCD on 32 kHz crystal
oscillator (φSUB=φw/2)
Watch
mode
current
dissipation
IWATCH
VCC
—
1.4
*3
µA
*1
VCC = 1.8 V,
*2
Ta = 25°C
32 kHz crystal oscillator
LCD not used
—
2.2
*3
VCC = 2.7 V,
Ta = 25°C
32 kHz crystal oscillator
LCD not used
—
2.8
6
VCC = 2.7 V,
32 kHz crystal oscillator
LCD not used
—
0.3
*3
—
0.5
*3
32 kHz crystal oscillator
not used
VCC = 2.7 V,
Ta = 25°C
—
1
5
Except the above
1.5
—
—
Standby
mode
current
dissipation
RAM data
retaining
voltage
ISTBY
VRAM
VCC
VCC
Rev. 6.00 Aug 04, 2006 page 472 of 626
REJ09B0144-0600
µA
V
32 kHz crystal oscillator *1
*2
not used
VCC = 1.8 V,
Ta = 25°C
Section 15 Electrical Characteristics
Values
Item
Symbol Applicable Pins Min
Typ
Max
Unit
Allowable
output low
current
(per pin)
IOL
All output pins
—
—
0.5
mA
Allowable
output low
current
(total)
∑ IOL
All output pins
—
—
20.0
mA
–IOH
Allowable
output high
current
(per pin)
All output pins
—
—
0.2
mA
∑ – IOH
Allowable
output high
current
(total)
All output pins
—
—
10.0
mA
Test Condition
Notes
Notes: 1. Pin states during current measurement.
Mode
Active (high-speed)
mode (IOPE1)
RES
Pin
Internal State
Other
Pins
LCD Power
Supply
VCC
Only CPU operates
VCC
Halted
Oscillator Pins
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
Active (mediumspeed) mode (IOPE2)
Sleep mode
VCC
Only timers operate
VCC
Halted
Subactive mode
VCC
Only CPU operates
VCC
Halted
Subsleep mode
VCC
Only timers operate,
CPU stops
VCC
Halted
Watch mode
VCC
Only time base
operates, CPU stops
VCC
Halted
Standby mode
VCC
CPU and timers both
stop
VCC
Halted
System clock oscillator:
crystal
Subclock oscillator:
crystal
System clock oscillator:
crystal
Subclock oscillator:
Pin X1 = GND
2. Excludes current in pull-up MOS transistors and output buffers.
3. The maximum current consumption value (standard) is 1.1 × typ.
Rev. 6.00 Aug 04, 2006 page 473 of 626
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Section 15 Electrical Characteristics
15.6.3
AC Characteristics
Table 15.17 lists the control signal timing, and tables 15.18 lists the serial interface timing of the
H8/3827S.
Table 15.17 Control Signal Timing
Values
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition
System clock
oscillation
frequency
fOSC
2
—
10
MHz
VCC = 2.7 V to 3.6 V
2
—
4
VCC = 1.8 V to 3.6 V
OSC clock (φOSC)
cycle time
tOSC
100
—
500
ns
(1000)
VCC = 2.7 V to 3.6 V Figure 15.1
250
—
500
(1000)
VCC = 1.8 V to 3.6 V *2
2
—
128
tOSC
Item
System clock (φ)
cycle time
OSC1, OSC2
OSC1, OSC2
tcyc
Reference
Figure
—
—
128
µs
Subclock oscillation fW
frequency
X1, X2
—
32.768
or 38.4
—
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5 or
26.0
—
µs
Figure 15.1
Subclock (φSUB)
cycle time
tsubcyc
2
—
8
tW
*1
2
—
—
tcyc
Instruction cycle
time
Rev. 6.00 Aug 04, 2006 page 474 of 626
REJ09B0144-0600
tsubcyc
Section 15 Electrical Characteristics
Item
Oscillation
stabilization time
Min
Typ
Max
Unit
Test Condition
trc
—
20
45
µs
Ceramic Oscillator
Figure 15.9
Parameters
VCC = 2.2 V to 3.6 V
—
80
—
—
0.8
2
—
1.2
3
Crystal Oscillator
Parameters
VCC = 2.2 V to 3.6 V
—
4.0
—
Crystal Oscillator
Parameters
Except the above
—
—
50
Except the above
—
—
2
—
4
—
40
—
—
100
—
—
X1
—
15.26 or —
13.02
µs
OSC1
40
—
—
ns
100
—
—
X1
—
15.26 or —
13.02
µs
OSC1
—
—
10
ns
—
—
25
X1
—
—
55.0
OSC1
—
—
10
OSC1, OSC2
X1, X2
External clock high
width
External clock low
width
External clock rise
time
External clock fall
time
Pin RES low width
Values
Applicable
Symbol Pins
tCPH
tCPL
tCPr
tCPf
tREL
OSC1
Ceramic Oscillator
Parameters
Except the above
ms
s
—
—
25
X1
—
—
55.0
RES
10
—
—
Reference
Figure
Crystal Oscillator
Parameters
VCC = 2.7 V to 3.6 V
VCC = 2.2 V to 3.6 V
Except the above
ns
VCC = 2.7 V to 3.6 V Figure 15.1
VCC = 1.8 V to 3.6 V
VCC = 2.7 V to 3.6 V Figure 15.1
VCC = 1.8 V to 3.6 V
VCC = 2.7 V to 3.6 V Figure 15.1
VCC = 1.8 V to 3.6 V
ns
VCC = 2.7 V to 3.6 V Figure 15.1
VCC = 1.8 V to 3.6 V
tcyc
Figure 15.2
Rev. 6.00 Aug 04, 2006 page 475 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Applicable
Symbol Pins
Item
Input pin high width tIH
Input pin low width
UD pin minimum
modulation width
tIL
tUDH
tUDL
Values
Min
Typ
Max
Unit
IRQ0 to IRQ4, 2
WKP0 to
WKP7
ADTRG,
TMIC TMIF,
TMIG, AEVL,
AEVH
—
—
tcyc
IRQ0 to IRQ4, 2
WKP0 to
WKP7,
ADTRG,
TMIC, TMIF,
TMIG, AEVL,
AEVH
—
UD
—
Reference
Figure
Test Condition
Figure 15.3
tsubcyc
—
tcyc
Figure 15.3
tsubcyc
4
—
tcyc
Figure 15.4
tsubcyc
Notes: 1. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
2. Figures in parentheses are the maximum tOSC rate with external clock input.
Table 15.18 Serial Interface (SCI3-1, SCI3-2) Timing
Values
Item
Input clock
cycle
Asynchronous
Test Conditions
Reference
Figure
Symbol
Min
Typ
Max
Unit
tscyc
4
—
—
Figure 15.5
6
—
—
tcyc or
tsubcyc
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 15.5
Transmit data delay time
(synchronous)
tTXD
—
—
1
tcyc or
tsubcyc
Figure 15.6
Receive data setup time
(synchronous)
tRXS
400.0
—
—
ns
Figure 15.6
Receive data hold time
(synchronous)
tRXH
400.0
—
—
ns
Figure 15.6
Synchronous
Rev. 6.00 Aug 04, 2006 page 476 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.6.4
A/D Converter Characteristics
Table 15.19 shows the A/D converter characteristics.
Table 15.19 A/D Converter Characteristics
Item
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Analog power AVCC
supply voltage
AVCC
1.8
—
3.6
V
Analog input
voltage
AN0 to AN7
– 0.3
—
AVCC + 0.3
V
AVCC
—
—
1.2
mA
AVCC
—
600
—
µA
AVIN
Analog power AIOPE
supply current
AISTOP1
Test Condition
Notes
*1
AVCC = 3.0 V
*2
Reference
value
*3
AISTOP2
AVCC
—
—
5
µA
Analog input
capacitance
CAIN
AN0 to AN7
—
—
15.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
10
bit
Nonlinearity
error
—
—
±3.5
LSB
—
—
±5.5
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
—
±7.5
Except the above
—
—
±0.5
Quantization
error
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
*4
LSB
Rev. 6.00 Aug 04, 2006 page 477 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Item
Absolute
accuracy
Conversion
time
Applicable
Symbol Pins
Values
Min
Typ
Max
Unit
Test Condition
—
±2
±4
LSB
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
—
±2.5
±6
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
±3
±8
Except the above
12.4
—
124
62
—
124
µs
Notes
*4
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
Except the above
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. Conversion time 62 µs
Rev. 6.00 Aug 04, 2006 page 478 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.6.5
LCD Characteristics
Table 15.20 shows the LCD characteristics.
Table 15.20 LCD Characteristics
Values
Applicable Test
Symbol Pins
Conditions
Min Typ Max Unit Notes
Segment driver
drop voltage
VDS
SEG1 to
SEG32
ID = 2 µA
V1 = 2.7 to 3.6 V
—
—
0.6
V
*1
Common driver
drop voltage
VDC
COM1 to
COM4
ID = 2 µA
V1 = 2.7 to 3.6 V
—
—
0.3
V
*1
Between V1 and
VSS
1.5
3.5
7
MΩ
2.2
—
3.6
V
Item
LCD power supply RLCD
split-resistance
Liquid crystal
display voltage
VLCD
V1
*2
Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or
common pin.
2. When the liquid crystal display voltage is supplied from an external power source,
ensure that the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
Table 15.21 AC Characteristics for External Segment Expansion
Item
Values
Applicable Test
Symbol Pins
Typ
Conditions Min
Max
Reference
Unit Figure
Clock high width
tCWH
CL1, CL2
*
800.0
—
—
ns
Figure 15.7
Clock low width
tCWL
CL2
*
800.0
—
—
ns
Figure 15.7
Clock setup time
tCSU
CL1, CL2
*
500.0
—
—
ns
Figure 15.7
Data setup time
tSU
DO
*
300.0
—
—
ns
Figure 15.7
Data hold time
tDH
DO
*
300.0
—
—
ns
Figure 15.7
M delay time
tDM
M
–1000.0 —
1000.0 ns
Figure 15.7
Clock rise and fall
times
tCT
CL1, CL2
—
170.0
Figure 15.7
Note:
*
—
ns
Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
Rev. 6.00 Aug 04, 2006 page 479 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.7
Absolute Maximum Ratings of H8/38327 Group and
H8/38427 Group
Table 15.22 lists the absolute maximum ratings.
Table 15.22 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Note
Power supply voltage
VCC
–0.3 to +7.0
V
*1
CVCC
–0.3 to +4.3
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Input voltage
Other than port B
Vin
–0.3 to VCC +0.3
V
Port B
AVin
–0.3 to AVCC +0.3
V
2
*
°C
–20 to +75
(regular specifications)
2
–40 to +85*
(wide-range temperature
specifications)
3
+75*
(chip shipment
specifications)
Operating temperature
Topr
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Permanent damage may result if maximum ratings are exceeded. Normal operation
should be under the conditions specified in Electrical Characteristics. Exceeding these
values can result in incorrect operation and reduced reliability.
2. The operating temperature ranges from –20°C to +75°C when programming or erasing
the flash memory.
3. The temperature range in which power may be applied to the device is –20°C to +75°C.
Rev. 6.00 Aug 04, 2006 page 480 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
15.8
Electrical Characteristics of H8/38327 Group and H8/38427 Group
15.8.1
Power Supply Voltage and Operating Ranges
The power supply voltage and operating ranges (shaded portions) are shown below.
1. Power Supply Voltage and Oscillation Frequency Range
• H8/38327 Group
16.0
fosc (MHz)
fW (kHz)
38.4
32.768
2.0
2.7
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
2.7
5.5
VCC (V)
2.7
5.5
VCC (V)
• All operating modes
• H8/38427 Group
16.0
fW (kHz)
fosc (MHz)
38.4
10.0
32.768
2.0
2.7
4.5 5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
• All operating modes
Note: fosc is the oscillator frequency. When an external clock is used 1 MHz is the minimum
fosc value.
Rev. 6.00 Aug 04, 2006 page 481 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
2. Power Supply Voltage and Operating Frequency Range
• H8/38327 Group
8.0
19.2
φ (MHz)
16.384
1.0
(0.5)*1
2.7
5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
φSUB (kHz)
9.6
8.192
4.8
4.096
1000
φ (kHz)
2.7
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
15.625
(7.813)*2
2.7
5.5
VCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode (except A/D converter)
• H8/38427 Group
8.0
φ (MHz)
19.2
5.0
16.384
1.0
(0.5)*1
2.7
4.5 5.5
VCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode (except CPU)
φSUB (kHz)
9.6
8.192
4.8
4.096
1000
2.7
φ (kHz)
625
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
15.625
(7.813)*2
2.7
4.5 5.5
VCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode (except A/D converter)
Notes 1. The figure in parentheses ( ) indicates the minimum operating frequency when an external clock is
used. When the resonator is used the minimum operating frequency (φ) is 1 MHz.
2. The figure in parentheses ( ) indicates the minimum operating frequency when an external clock is
used. When the resonator is used the minimum operating frequency (φ) is 15.625 kHz.
Rev. 6.00 Aug 04, 2006 page 482 of 626
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Section 15 Electrical Characteristics
3. Analog Power Supply Voltage and A/D Converter Operating Range
• H8/38327 Group
φ (kHz)
φ (MHz)
8.0
1.0
0.5
1000
500
2.7
2.7
5.5
AVCC (V)
5.5
AVCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode
• Active (high-speed) mode
• Sleep (high-speed) mode
5.0
φ (kHz)
φ (MHz)
• H8/38427 Group
1.0
(0.5)
1000
625
500
2.7
5.5
AVCC (V)
• Active (high-speed) mode
• Sleep (high-speed) mode
2.7
4.5 5.5
AVCC (V)
• Active (medium-speed) mode
• Sleep (medium-speed) mode
Rev. 6.00 Aug 04, 2006 page 483 of 626
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Section 15 Electrical Characteristics
15.8.2
DC Characteristics
Table 15.23 lists the DC characteristics.
Table 15.23
DC Characteristics
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, unless otherwise specified
Values
Item
Symbol
Input high VIH
voltage
Applicable Pins
Min
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG, ADTRG,
SCK31, SCK32
Max
Unit
Test Condition
VCC × 0.8 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
VCC × 0.9 —
VCC + 0.3
RXD31, RXD32,
UD
VCC × 0.7 —
VCC + 0.3
VCC × 0.8 —
VCC + 0.3
OSC1
VCC × 0.8 —
VCC + 0.3
VCC × 0.9 —
VCC + 0.3
P10 to P17,
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
VCC × 0.7 —
VCC + 0.3
VCC × 0.8 —
VCC + 0.3
PB0 to PB7
VCC × 0.7 —
AVCC + 0.3 V
VCC = 4.0 V to 5.5 V
VCC × 0.8 —
AVCC + 0.3
Other than above
VCC × 0.9 —
VCC + 0.3
EXCL
Note: Connect the TEST pin to VSS.
Rev. 6.00 Aug 04, 2006 page 484 of 626
REJ09B0144-0600
Typ
Other than above
V
VCC = 4.0 V to 5.5 V
Other than above
V
VCC = 4.0 V to 5.5 V
Other than above
V
VCC = 4.0 V to 5.5 V
Other than above
V
Notes
Section 15 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
RES,
WKP0 to WKP7,
IRQ0 to IRQ4,
AEVL, AEVH,
TMIC, TMIF,
TMIG, ADTRG,
SCK31, SCK32
– 0.3
—
VCC × 0.2
V
VCC = 4.0 V to 5.5 V
– 0.3
—
VCC × 0.1
RXD31, RXD32,
UD
– 0.3
—
VCC × 0.3
– 0.3
—
VCC × 0.2
OSC1
– 0.3
—
VCC × 0.2
– 0.3
—
VCC × 0.1
EXCL
– 0.3
—
0.1 VCC
V
P10 to P17
P30 to P37,
P40 to P43,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3,
PB0 to PB7
– 0.3
—
VCC × 0.3
V
– 0.3
—
VCC × 0.2
P10 to P17
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
VCC – 1.0 —
—
VCC – 0.5 —
—
Output
high
voltage
VOH
Notes
Other than above
V
VCC = 4.0 V to 5.5 V
Other than above
V
VCC = 4.0 V to 5.5 V
Other than above
VCC = 4.0 V to 5.5 V
Other than above
V
VCC = 4.0 V to 5.5 V
–IOH = 1.0 mA
VCC = 4.0 V to 5.5 V
–IOH = 0.5 mA
VCC – 0.3 —
—
–IOH = 0.1 mA
Rev. 6.00 Aug 04, 2006 page 485 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Symbol
Output low VOL
voltage
Applicable Pins
Min
Typ
Max
Unit
Test Condition
P10 to P17,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
—
—
0.6
V
VCC = 4.0 V to 5.5 V
—
—
0.5
IOL = 0.4 mA
P30 to P37
—
—
1.0
VCC = 4.0 V to 5.5 V
Notes
IOL = 1.6 mA
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Input/
output
leakage
current
| IIL |
Pull-up
MOS
current
–Ip
Input
capacitance
Cin
—
—
0.5
RES, P43,
P10 to P17,
OSC1, X1,
P30 to P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
—
—
1.0
PB0 to PB7
—
—
1.0
P10 to P17,
P30 to P37,
P50 to P57,
P60 to P67
20
—
200
—
40
—
All input pins
except power
supply pin
—
—
15.0
Rev. 6.00 Aug 04, 2006 page 486 of 626
REJ09B0144-0600
IOL = 0.4 mA
µA
VIN = 0.5 V to VCC –
0.5 V
VIN = 0.5 V to AVCC
– 0.5 V
µA
VCC = 5.0 V,
VIN = 0.0 V
VCC = 2.7 V,
VIN = 0.0 V
pF
f = 1 MHz,
VIN = 0.0 V,
Ta = 25°C
Reference
value
Section 15 Electrical Characteristics
Values
Item
Symbol
Active
IOPE1
mode
current
consumption
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Notes
VCC
—
0.8
—
mA
Active (high-speed)
mode
VCC = 2.7 V,
fOSC = 2 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
—
1.2
—
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
—
1.0
—
—
1.5
—
—
2.0
—
—
2.4
—
—
4.0
7.0
—
4.9
7.0
Active (high-speed)
mode
VCC = 5 V,
fOSC = 2 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
Active (high-speed)
mode
VCC = 5 V,
fOSC = 4 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
Active (high-speed)
mode
VCC = 5 V,
fOSC = 10 MHz
*1 *3 *4
*2 *3 *4
Rev. 6.00 Aug 04, 2006 page 487 of 626
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Section 15 Electrical Characteristics
Values
Item
Symbol
Active
IOPE2
mode
current
consumption
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Notes
VCC
—
0.4
—
mA
Active (mediumspeed) mode
VCC = 2.7 V,
fOSC = 2 MHz,
φOSC/128
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
—
0.7
—
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
—
0.5
—
—
1.0
—
—
0.8
—
—
1.2
—
—
1.2
3.0
—
1.7
3.0
Rev. 6.00 Aug 04, 2006 page 488 of 626
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Active (mediumspeed) mode
VCC = 5 V,
fOSC = 2 MHz,
φOSC/128
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
Active (mediumspeed) mode
VCC = 5 V,
fOSC = 4 MHz,
φOSC/128
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
Active (mediumspeed) mode
VCC = 5 V,
fOSC = 10 MHz,
φOSC/128
*1 *3 *4
*2 *3 *4
Section 15 Electrical Characteristics
Values
Item
Symbol
Sleep
ISLEEP
mode
current
consumption
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Notes
VCC
—
0.5
—
mA
VCC = 2.7 V,
fOSC = 2 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
—
0.8
—
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
Subactive ISUB
mode
current
consumption
VCC
—
0.7
—
—
1.2
—
—
1.1
—
—
1.6
—
—
1.9
5.0
—
2.6
5.0
—
12
—
—
15
—
—
18
50
—
30
50
VCC = 5 V,
fOSC = 2 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
VCC = 5 V,
fOSC = 4 MHz
*1 *3 *4
Approx.
max. value
= 1.1 ×
Typ.
*2 *3 *4
VCC = 5 V,
fOSC = 10 MHz
µA
VCC = 2.7 V,
LCD on,
32-kHz crystal
resonator used
(φSUB = φW/8)
VCC = 2.7 V,
LCD on,
32-kHz crystal
resonator used
(φSUB = φW/2)
*1 *3 *4
*2 *3 *4
*1 *3 *4
Reference
value
*2 *3 *4
Reference
value
*1 *3 *4
*2 *3 *4
Rev. 6.00 Aug 04, 2006 page 489 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Notes
Subsleep ISUBSP
mode
current
consumption
Symbol
VCC
—
3.8
16
µA
VCC = 2.7 V,
LCD on,
32-kHz crystal
resonator used
(φSUB = φW/2)
*3 *4
Watch
IWATCH
mode
current
consumption
VCC
—
1.8
—
µA
VCC = 2.7 V,
Ta = 25°C,
32-kHz crystal
resonator used,
LCD not used
Standby
ISTBY
mode
current
consumption
—
VCC
1.8
—
—
3.0
6.0
—
0.3
—
—
—
—
0.3
0.4
0.5
VCC = 2.7 V,
32-kHz crystal
resonator used,
LCD not used
µA
—
VCC = 2.7 V,
Ta = 25°C,
32-kHz crystal
resonator not used
VCC = 2.7 V,
Ta = 25°C,
32-kHz crystal
resonator not used
VCC = 5.0 V,
Ta = 25°C,
32-kHz crystal
resonator not used
—
—
*1 *3 *4
Reference
value
*2 *3 *4
Reference
value
*3 *4
*1 *3 *4
Reference
value
*2 *3 *4
Reference
value
*1 *3 *4
Reference
value
*2 *3 *4
Reference
value
—
1.0
5.0
32-kHz crystal
resonator not used
RAM data VRAM
retaining
voltage
VCC
2.0
—
—
V
Allowable IOL
output low
current
(per pin)
Output pins
except port 3
—
—
2.0
mA
Allowable ∑IOL
output low
current
(total)
Port 3
—
—
10.0
All output pins
—
—
0.5
Output pins
except port 3
—
—
40.0
Port 3
—
—
80.0
All output pins
—
—
20.0
Rev. 6.00 Aug 04, 2006 page 490 of 626
REJ09B0144-0600
*5
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
*3 *4
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
Section 15 Electrical Characteristics
Values
Item
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable –IOH
output
high
current
(per pin)
Symbol
All output pins
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
—
—
0.2
Allowable ∑–IOH
output
high
current
(total)
All output pins
—
—
15.0
—
—
10.0
Notes
Other than above
mA
VCC = 4.0 V to 5.5 V
Other than above
Notes: Connect the TEST pin to VSS.
1. Applies to the mask-ROM version.
2. Applies to the F-ZTAT version.
3. Pin states when current consumption is measured
Mode
Active (high-speed)
mode (IOPE1)
RES
Pin
Internal State
Other
Pins
LCD Power
Supply
VCC
Only CPU operates
VCC
Stops
VCC
Only all on-chip timers
operate
VCC
Stops
Subactive mode
VCC
Only CPU operates
VCC
Stops
Subsleep mode
VCC
Only all on-chip timers
operate
VCC
Stops
VCC
Only clock time base
operates
System clock:
crystal resonator
Subclock:
crystal resonator
CPU stops
Watch mode
System clock:
crystal resonator
Subclock:
Pin X1 = GND
Active (mediumspeed) mode (IOPE2)
Sleep mode
Oscillator Pins
VCC
Stops
VCC
Stops
CPU stops
Standby mode
VCC
CPU and timers
both stop
System clock:
crystal resonator
Subclock:
Pin X1 = GND
4. Except current which flows to the pull-up MOS or output buffer
5. Voltage maintained in standby mode
Rev. 6.00 Aug 04, 2006 page 491 of 626
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Section 15 Electrical Characteristics
15.8.3
AC Characteristics
Table 15.24 lists the control signal timing and table 15.25 lists the serial interface timing.
Table 15.24 Control Signal Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, unless otherwise specified
Item
Symbol
System clock
oscillation
frequency
fOSC
OSC clock (φOSC)
cycle time
tOSC
System clock (φ)
cycle time
Applicable
Pins
OSC1,
OSC2
OSC1,
OSC2
tcyc
Values
Min
Typ
Max
Unit
Test Condition
2.0
—
16.0
MHz
2.0
—
16.0
VCC = 4.5 to 5.5 V
2.0
—
10.0
VCC = 2.7 to 5.5 V
62.5
—
500
ns
(1000)
62.5
—
500
(1000)
VCC = 4.5 to 5.5 V
100
—
500
(1000)
VCC = 2.7 to 5.5 V
2
—
128
tOSC
Reference
Figure
*3
*4
Figure
15.1*2 *3
Figure
15.1*2 *4
—
—
128
µs
Subclock oscillation fW
frequency
X1, X2,
EXCL
—
32.768
or 38.4
—
kHz
Watch clock (φW)
cycle time
tW
X1, X2,
EXCL
—
30.5 or
26.0
—
µs
Figure
15.1
Subclock (φSUB)
cycle time
tsubcyc
2
—
4
tW
*1
2
—
—
tcyc
tsubcyc
—
20
45
µs
—
80
—
—
0.8
2
—
—
50
—
—
2.0
Instruction cycle
time
Oscillation
stabilization time
trc
trc
OSC1,
OSC2
X1, X2
Rev. 6.00 Aug 04, 2006 page 492 of 626
REJ09B0144-0600
Ceramic resonator Figure
(VCC = 3.0 to 5.5 V) 15.10
Ceramic resonator
other than above
ms
Crystal resonator
Other than above
s
Section 15 Electrical Characteristics
Item
Symbol
External clock high tCPH
width
External clock low
width
External clock rise
time
External clock fall
time
tCPL
tCPr
tCPf
Values
Applicable
Pins
Min
Typ
Max
Unit
OSC1
25
—
—
ns
25
—
—
—
Test Condition
Reference
Figure
Figure
15.1*3
VCC = 4.5 to 5.5 V
VCC = 2.7 to 5.5 V
Figure
15.1*4
40
—
EXCL
—
15.26 or —
13.02
µs
Figure
15.1
OSC1
25
—
—
ns
Figure
15.1*3
25
—
—
VCC = 4.5 to 5.5 V
40
—
—
VCC = 2.7 to 5.5 V
EXCL
—
15.26 or —
13.02
µs
Figure
15.1
OSC1
—
—
6
ns
Figure
15.1*3
—
—
6
VCC = 4.5 to 5.5 V
—
—
10
VCC = 2.7 to 5.5 V
EXCL
—
—
55.0
OSC1
—
—
6
—
—
6
VCC = 4.5 to 5.5 V
VCC = 2.7 to 5.5 V
Figure
15.1*4
Figure
15.1*4
Figure
15.1
ns
Figure
15.1*3
Figure
15.1*4
—
—
10
EXCL
—
—
55.0
10
—
—
tcyc
Figure 15.2
Figure 15.3
Figure
15.1
RES pin low
width
tREL
RES
Input pin high
width
tIH
IRQ0 to IRQ4, 2
WKP0 to
WKP7,
ADTRG,
TMIC, TMIF,
TMIG
—
—
tcyc
tsubcyc
AEVL, AEVH 32
—
—
ns
Rev. 6.00 Aug 04, 2006 page 493 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Item
Symbol
Input pin low
width
tIL
UD pin minimum
transition width
tUDH
Applicable
Pins
Values
Min
Typ
Max
Unit
IRQ0 to IRQ4, 2
WKP0 to
WKP7,
ADTRG,
TMIC, TMIF,
TMIG
—
—
tcyc
tsubcyc
AEVL, AEVH 32
—
—
ns
UD
—
—
tcyc
tsubcyc
4
tUDL
Test Condition
Reference
Figure
Figure 15.3
Figure 15.4
Notes: 1. Determined by the SA1 and SA0 bits in the system control register 2 (SYSCR2).
2. The figure in parentheses ( ) indicates the maximum fosc value when an external clock
is used.
3. Also applies to H8/38327 Group.
4. Also applies to H8/38427 Group.
Table 15.25
Serial Interface (SCI3) Timing
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, unless otherwise specified
Values
Item
Symbol
Min
Typ Max Unit
Input clock Asynchronous
tscyc
cycle
Clocked synchronous
4
—
—
6
—
Input clock pulse width
tSCKW
0.4
—
Transmit data delay time
(clocked synchronous)
tTXD
—
Receive data setup time
(clocked synchronous)
tRXS
Receive data hold time
(clocked synchronous)
tRXH
Rev. 6.00 Aug 04, 2006 page 494 of 626
REJ09B0144-0600
Test
Condition
Reference
Figure
Figure 15.5
—
tcyc or
tsubcyc
0.6
tscyc
Figure 15.5
—
1
tcyc or
tsubcyc
Figure 15.6
200
—
—
ns
Figure 15.6
200
—
—
ns
Figure 15.6
Section 15 Electrical Characteristics
15.8.4
A/D Converter Characteristics
Table 15.26 shows the A/D converter characteristics.
Table 15.26
A/D Converter Characteristics
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, unless otherwise specified
Values
Applicable
Pins
Min
Typ
Max
Unit
Analog power supply AVCC
voltage
AVCC
2.7
—
5.5
V
Analog input voltage
AN0 to
AN3
– 0.3
—
AVCC + 0.3 V
Analog power supply AIOPE
current
AISTOP1
AVCC
—
—
1.5
mA
AVCC
—
600
—
µA
*2
Reference
value
AISTOP2
AVCC
—
—
5.0
µA
*3
Analog input
capacitance
CAIN
AN0 to
AN7
—
—
15.0
pF
Allowable signal
source impedance
RAIN
—
—
10.0
kΩ
Resolution (data
length)
—
—
10
bit
Nonlinearity error
—
—
±3.5
LSB
—
—
±7.5
Item
Symbol
AVIN
Reference
Figure
*1
AVCC = 5.0 V
AVCC = 4.0 V
to 5.5 V
AVCC = 2.7 V
to 5.5 V
Quantization error
—
—
±0.5
LSB
Absolute accuracy
—
±2.0
±4.0
LSB
—
±2.0
±8.0
7.8
—
124
12.4
—
124
Conversion time
Test
Condition
AVCC = 4.0 V
to 5.5 V
AVCC = 2.7 V
to 5.5 V
µs
*4
*5
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. Also applies to H8/38327 Group.
5. Also applies to H8/38427 Group.
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Section 15 Electrical Characteristics
15.8.5
LCD Characteristics
Table 15.27 shows the LCD characteristics.
Table 15.27 LCD Characteristics
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, unless otherwise specified
Item
Symbol
Segment driver
step-down voltage
VDS
Common driver
step-down voltage
VDC
LCD power supply
split-resistance
RLCD
Liquid crystal
display voltage
VLCD
Applicable
Pins
Values
Reference
Figure
Min
Typ
Max
Unit
Test Condition
SEG1 to
SEG32
—
—
0.6
V
*1
ID = 2 µA
V1 = 2.7 V to 5.5 V
COM1 to
COM4
—
—
0.3
V
*1
ID = 2 µA
V1 = 2.7 V to 5.5 V
1.5
3.0
7.0
MΩ
Between V1 and
VSS
2.7
—
5.5
V
V1
*2
Notes: 1. The voltage step-down from power supply pins V1, V2, V3, and VSS to each segment
pin or common pin.
2. When the liquid crystal display voltage is supplied from an external power supply,
ensure that the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
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Section 15 Electrical Characteristics
15.8.6
Flash Memory Characteristics
Table 15.28
Flash Memory Characteristics
Condition: AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, VCC = 2.7 V to 5.5 V (range of operating
voltage when reading), VCC = 3.0 V to 5.5 V (range of operating voltage when
programming/erasing), Ta = –20°C to +75°C (range of operating temperature when
programming/erasing: product with regular specifications, product with wide-range
temperature specifications)
Values
Item
Symbol
Min
Typ
Max
Unit
Programming time*1*2*4
Test
Conditions
tP
—
7
200
ms/128 bytes
Erase time*1*3*5
tE
—
100
1200
ms/block
Reprogramming count
NWEC
1000*8
10000*9 —
Data retain period
tDRP
10*10
—
—
year
Programming
Wait time after
SWE-bit setting*1
x
1
—
—
µs
Wait time after
PSU-bit setting*1
y
50
—
—
µs
Wait time after
P-bit setting*1*4
z1
28
30
32
µs
1≤n≤6
z2
198
200
202
µs
7 ≤ n ≤ 1000
z3
8
10
12
µs
Additional
programming
Wait time after
P-bit clear*1
α
5
—
—
µs
Wait time after
PSU-bit clear*1
β
5
—
—
µs
Wait time after
PV-bit setting*1
γ
4
—
—
µs
Wait time after
dummy write*1
ε
2
—
—
µs
Wait time after
PV-bit clear*1
η
2
—
—
µs
Wait time after
SWE-bit clear*1
θ
100
—
—
µs
Maximum
programming
count*1*4*5
N
—
—
1000
times
times
Rev. 6.00 Aug 04, 2006 page 497 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Values
Item
Erase
Notes:
Symbol
Min
Typ
Max
Unit
Wait time after
SWE-bit setting*1
x
1
—
—
µs
Wait time after
ESU-bit setting*1
y
100
—
—
µs
Wait time after
E-bit setting*1*6
z
10
—
100
ms
Wait time after
E-bit clear*1
α
10
—
—
µs
Wait time after
ESU-bit clear*1
β
10
—
—
µs
Wait time after
EV-bit setting*1
γ
20
—
—
µs
Wait time after
dummy write*1
ε
2
—
—
µs
Wait time after
EV-bit clear*1
η
4
—
—
µs
Wait time after
SWE-bit clear*1
θ
100
—
—
µs
Maximum erase
count*1*6*7
N
—
—
120
times
Test
Conditions
1. Set the times according to the program/erase algorithms.
2. Programming time per 128 bytes (Shows the total period for which the P bit in FLMCR1 is set. It
does not include the programming verification time.)
3. Block erase time (Shows the total period for which the E bit in FLMCR1 is set. It does not include
the erase verification time.)
4. Maximum programming time (tP (max))
tP (max) = Wait time after P-bit setting (z) × maximum number of writes (N)
5. The maximum number of writes (N) should be set according to the actual set value of z1, z2, and
z3 to allow programming within the maximum programming time (tP (max)).
The wait time after P-bit setting (z1 and z2) should be alternated according to the number of writes
(n) as follows:
1≤n≤6
z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Maximum erase time (tE (max))
tE (max) = Wait time after E-bit setting (z) × maximum erase count (N)
7. The maximum number of erases (N) should be set according to the actual set value of z to allow
erasing within the maximum erase time (tE (max)).
8. This minimum value guarantees all characteristics after reprogramming (the guaranteed range is
from 1 to the minimum value).
9. Reference value when the temperature is 25°C (normally reprogramming will be performed by this
count).
10. This is a data retain characteristic when reprogramming is performed within the specification range
including this minimum value.
Rev. 6.00 Aug 04, 2006 page 498 of 626
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Section 15 Electrical Characteristics
15.9
Operation Timing
Figures 15.1 to 15.7 show timing diagrams.
t OSC , tw
VIH
OSC1
x1
VIL
t CPH
t CPL
t CPr
t CPf
Figure 15.1 Clock Input Timing
RES
VIL
tREL
Figure 15.2 RES Low Width
IRQ0 to IRQ4,
WKP0 to WKP7,
ADTRG,
TMIC, TMIF,
TMIG,
AEVL, AEVH
VIH
VIL
t IL
t IH
Figure 15.3 Input Timing
Rev. 6.00 Aug 04, 2006 page 499 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
VIH
UD
VIL
tUDL
tUDH
Figure 15.4 UD Pin Minimum Modulation Width Timing
t SCKW
SCK 31
SCK 32
t scyc
Figure 15.5 SCK3 Input Clock Timing
Rev. 6.00 Aug 04, 2006 page 500 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
t scyc
SCK 31 VIH or VOH *
SCK 32 VIL or VOL *
t TXD
TXD31
TXD32
(transmit data)
VOH*
VOL
t RXS
t RXH
RXD31
RXD32
(receive data)
Note: * Output timing reference levels
Output high
VOH = 1/2Vcc + 0.2 V
Output low
VOL = 0.8 V
Load conditions are shown in figure 15.8.
Figure 15.6 SCI3 Synchronous Mode Input/Output Timing
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Section 15 Electrical Characteristics
tCT
VCC – 0.5V
0.4V
CL1
tCWH
tCWH
tCSU
VCC – 0.5V
CL2
0.4V
tCSU
tCWL
tCT
VCC – 0.5V
0.4V
DO
tSU
M
tDH
0.4V
tDM
Figure 15.7 Segment Expansion Signal Timing
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Section 15 Electrical Characteristics
15.10
Output Load Circuit
VCC
2.4 kΩ
Output pin
12 k Ω
30 pF
Figure 15.8 Output Load Condition
15.11
Resonator
LS
CS
OSC1
RS
OSC2
CO
Ceramic Oscillator Parameters
Manufacturer Products Name
Frequency 4 MHz
RS
CSTLS
Manufacturer's Publicly Released Values MURATA
4M00G
Max. 8.8
53/56
Max. 36 pF
CO
Crystal Oscillator Parameters
Manufacturer Products Name
Frequency 4.193 MHz
RS
Manufacturer's Publicly Released Values Nihon Denpa NR-18
Max. 100
Kogyo
CO
Max. 16 pF
Figure 15.9 Resonator Equivalent Circuit
Rev. 6.00 Aug 04, 2006 page 503 of 626
REJ09B0144-0600
Section 15 Electrical Characteristics
Crystal resonator
Resonating Frequency
Manufacturer
Model
C1, C2
4 MHz
Nihon Denpa Kogyo
NR-18
12pF ± 20%
10 MHz
Ceramic resonator
Resonating Frequency
Manufacturer
Model
C1, C2
2 MHz
MURATA
CSTCC2M00G53-B0
15pF ± 20%
CSTCC2M00G56-B0
47pF ± 20%
CSTLS4M00G53-B0
15pF ± 20%
CSTLS4M00G56-B0
47pF ± 20%
CSTLS10M0G53-B0
15pF ± 20%
CSTLS10M0G56-B0
47pF ± 20%
4 MHz
10 MHz
Figure 15.10 Resonator Equivalent Circuit
15.12
Usage Note
Each of the products covered in this manual satisfy the electrical characteristics indicated.
However, the actual electrical characteristics, operating margin and noise margin may differ from
the indicated values due to differences in the manufacturing process, built-in ROM, layout pattern
and other factors.
If a system evaluation test is conducted with the ZTAT or F-ZTAT version, when switching to a
mask ROM version, perform the same evaluation test with the mask ROM version.
Rev. 6.00 Aug 04, 2006 page 504 of 626
REJ09B0144-0600
Appendix A CPU Instruction Set
Appendix A CPU Instruction Set
A.1
Instructions
Operation Notation
Rd8/16
General register (destination) (8 or 16 bits)
Rs8/16
General register (source) (8 or 16 bits)
Rn8/16
General register (8 or 16 bits)
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#xx: 3/8/16
Immediate data (3, 8, or 16 bits)
d: 8/16
Displacement (8 or 16 bits)
@aa: 8/16
Absolute address (8 or 16 bits)
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Exclusive logical OR
→
Move
—
Logical complement
Condition Code Notation
↔
Symbol
Modified according to the instruction result
*
Not fixed (value not guaranteed)
0
Always cleared to 0
—
Not affected by the instruction execution result
Rev. 6.00 Aug 04, 2006 page 505 of 626
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Appendix A CPU Instruction Set
Table A.1 lists the H8/300L CPU instruction set.
Table A.1
Instruction Set
B @Rs16 → Rd8
MOV.B @(d:16, Rs), Rd
B @(d:16, Rs16)→ Rd8
MOV.B @Rs+, Rd
B @Rs16 → Rd8
Rs16+1 → Rs16
MOV.B @aa:8, Rd
B @aa:8 → Rd8
2
— —
MOV.B @aa:16, Rd
B @aa:16 → Rd8
4
— —
MOV.B Rs, @Rd
B Rs8 → @Rd16
MOV.B Rs, @(d:16, Rd)
B Rs8 → @(d:16, Rd16)
MOV.B Rs, @–Rd
B Rd16–1 → Rd16
Rs8 → @Rd16
MOV.B Rs, @aa:8
B Rs8 → @aa:8
2
— —
MOV.B Rs, @aa:16
B Rs8 → @aa:16
4
— —
MOV.W #xx:16, Rd
W #xx:16 → Rd
MOV.W Rs, Rd
W Rs16 → Rd16
MOV.W @Rs, Rd
W @Rs16 → Rd16
— —
2
W @aa:16 → Rd16
MOV.W Rs, @Rd
W Rs16 → @Rd16
— —
4
— —
2
— —
4
— —
2
— —
2
— —
4
— —
2
— —
4
2
— —
— —
— —
0 — 4
0 — 6
0 — 6
0 — 4
0 — 4
0 — 6
0 — 4
0 — 6
0 — 6
0 — 6
0 — 4
0 — 2
0 — 4
0 — 6
0 — 6
0 — 6
0 — 4
0 — 6
MOV.W Rs, @–Rd
W Rd16–2 → Rd16
Rs16 → @Rd16
MOV.W Rs, @aa:16
W Rs16 → @aa:16
POP Rd
W @SP → Rd16
SP+2 → SP
2
— —
↔ ↔
↔ ↔
4
0 — 2
0 — 2
0 — 6
PUSH Rs
W SP–2 → SP
Rs16 → @SP
2
— —
↔
↔
MOV.W Rs, @(d:16, Rd) W Rs16 → @(d:16, Rd16)
— —
2
W @Rs16 → Rd16
Rs16+2 → Rs16
MOV.W @aa:16, Rd
— —
2
MOV.W @(d:16, Rs), Rd W @(d:16, Rs16) → Rd16
MOV.W @Rs+, Rd
— —
4
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
MOV.B @Rs, Rd
— —
2
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
B #xx:8 → Rd8
B Rs8 → Rd8
↔ ↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔ ↔
MOV.B #xx:8, Rd
MOV.B Rs, Rd
No. of States
Condition Code
I H N Z V C
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
@(d:16, Rn)
@Rn
2
Rn
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
0 — 6
Rev. 6.00 Aug 04, 2006 page 506 of 626
REJ09B0144-0600
2
— —
4
— —
0 — 6
0 — 6
Appendix A CPU Instruction Set
W Rd16+Rs16 → Rd16
ADDX.B #xx:8, Rd
B Rd8+#xx:8 +C → Rd8
—
2
— (1)
2
—
(2)
No. of States
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
@(d:16, Rn)
@Rn
—
2
↔ ↔ ↔ ↔ ↔
ADD.W Rs, Rd
2
↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
B Rd8+#xx:8 → Rd8
B Rd8+Rs8 → Rd8
Condition Code
I H N Z V C
↔ ↔
↔ ↔
↔ ↔ ↔ ↔ ↔
ADD.B #xx:8, Rd
ADD.B Rs, Rd
Rn
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
2
2
2
2
B Rd8+Rs8 +C → Rd8
2
—
ADDS.W #1, Rd
W Rd16+1 → Rd16
2
— — — — — — 2
ADDS.W #2, Rd
W Rd16+2 → Rd16
2
— — — — — — 2
INC.B Rd
B Rd8+1 → Rd8
2
— —
B Rd8 decimal adjust → Rd8
2
— *
SUB.B Rs, Rd
B Rd8–Rs8 → Rd8
2
—
SUB.W Rs, Rd
W Rd16–Rs16 → Rd16
2
— (1)
SUBX.B #xx:8, Rd
B Rd8–#xx:8 –C → Rd8
2
—
2
— 2
* (3) 2
(2)
↔ ↔ ↔ ↔
DAA.B Rd
(2)
↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔
↔ ↔
↔
↔ ↔ ↔ ↔ ↔ ↔
ADDX.B Rs, Rd
2
2
2
SUBX.B Rs, Rd
B Rd8–Rs8 –C → Rd8
2
—
SUBS.W #1, Rd
W Rd16–1 → Rd16
2
— — — — — — 2
(2)
2
2
— — — — — — 2
B Rd8–1 → Rd8
2
— —
DAS.B Rd
B Rd8 decimal adjust → Rd8
2
— *
NEG.B Rd
B 0–Rd → Rd
2
—
B Rd8–#xx:8
B Rd8–Rs8
2
2
—
—
CMP.W Rs, Rd
W Rd16–Rs16
2
— (1)
— 2
* — 2
↔ ↔ ↔ ↔
CMP.B #xx:8, Rd
CMP.B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔
↔
W Rd16–2 → Rd16
↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
SUBS.W #2, Rd
DEC.B Rd
2
2
2
2
Rev. 6.00 Aug 04, 2006 page 507 of 626
REJ09B0144-0600
Appendix A CPU Instruction Set
2
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
↔
↔
2
↔
↔
0
↔
2
0
↔
2
0
↔
2
0
↔
2
0
↔
— —
↔
↔
2
↔
B Rd8⊕#xx:8 → Rd8
B Rd8⊕Rs8 → Rd8
↔
↔
XOR.B #xx:8, Rd
— —
↔
↔
— —
2
XOR.B Rs, Rd
Condition Code
I H N Z V C
2
0 — 2
0 — 2
0 — 2
0 — 2
0 — 2
0 — 2
NOT.B Rd
B Rd → Rd
2
— —
SHAL.B Rd
B
2
— —
2
— —
2
— —
2
— — 0
2
— —
2
— —
C
0
b7
SHAR.B Rd
B
B
C
SHLR.B Rd
B
0
B
b0
0
C
b7
ROTXL.B Rd
b0
C
b7
b0
C
b7
ROTXR.B Rd
b0
B
b7
Rev. 6.00 Aug 04, 2006 page 508 of 626
REJ09B0144-0600
0 — 2
b0
b7
SHLL.B Rd
No. of States
— —
B Rd8∨#xx:8 → Rd8
B Rd8∨Rs8 → Rd8
Implied
2
OR.B #xx:8, Rd
OR.B Rs, Rd
2
@@aa
— —
B Rd8∧#xx:8 → Rd8
B Rd8∧Rs8 → Rd8
@(d:8, PC)
2
AND.B #xx:8, Rd
AND.B Rs, Rd
@aa: 8/16
— — (5) (6) — — 14
@–Rn/@Rn+
— — — — — — 14
2
@(d:16, Rn)
2
B Rd16÷Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
@Rn
B Rd8 × Rs8 → Rd16
DIVXU.B Rs, Rd
Operation
Rn
MULXU.B Rs, Rd
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
b0
C
Appendix A CPU Instruction Set
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
@(d:16, Rn)
No. of States
↔
2
0
2
2
— —
2
— —
2
— — — — — — 2
b0
B
C
b7
0
↔
ROTR.B Rd
Condition Code
↔
↔
b7
I H N Z V C
↔
↔
C
@Rn
B
Operation
Rn
ROTL.B Rd
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
b0
BSET #xx:3, Rd
B (#xx:3 of Rd8) ← 1
BSET #xx:3, @Rd
B (#xx:3 of @Rd16) ← 1
BSET #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 1
BSET Rn, Rd
B (Rn8 of Rd8) ← 1
BSET Rn, @Rd
B (Rn8 of @Rd16) ← 1
BSET Rn, @aa:8
B (Rn8 of @aa:8) ← 1
BCLR #xx:3, Rd
B (#xx:3 of Rd8) ← 0
BCLR #xx:3, @Rd
B (#xx:3 of @Rd16) ← 0
BCLR #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 0
BCLR Rn, Rd
B (Rn8 of Rd8) ← 0
BCLR Rn, @Rd
B (Rn8 of @Rd16) ← 0
BCLR Rn, @aa:8
B (Rn8 of @aa:8) ← 0
BNOT #xx:3, Rd
B (#xx:3 of Rd8) ←
(#xx:3 of Rd8)
BNOT #xx:3, @Rd
B (#xx:3 of @Rd16) ←
(#xx:3 of @Rd16)
BNOT #xx:3, @aa:8
B (#xx:3 of @aa:8) ←
(#xx:3 of @aa:8)
BNOT Rn, Rd
B (Rn8 of Rd8) ←
(Rn8 of Rd8)
BNOT Rn, @Rd
B (Rn8 of @Rd16) ←
(Rn8 of @Rd16)
BNOT Rn, @aa:8
B (Rn8 of @aa:8) ←
(Rn8 of @aa:8)
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
— — — — — — 8
Rev. 6.00 Aug 04, 2006 page 509 of 626
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Appendix A CPU Instruction Set
B (Rn8 of Rd8) → Z
B (Rn8 of @Rd16) → Z
BTST Rn, @aa:8
B (Rn8 of @aa:8) → Z
BLD #xx:3, Rd
B (#xx:3 of Rd8) → C
BLD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BLD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BILD #xx:3, Rd
B (#xx:3 of Rd8) → C
BILD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BILD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BST #xx:3, Rd
B C → (#xx:3 of Rd8)
BST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BIST #xx:3, Rd
B C → (#xx:3 of Rd8)
BIST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BIST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BIAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BIAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BIAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
BOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BIOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BIOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
Rev. 6.00 Aug 04, 2006 page 510 of 626
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— — —
4
2
— — —
— — —
4
— — —
4
2
— — —
— — 6
— — 6
— — 2
— — 6
— — 6
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
No. of States
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
4
— — 2
— — — — —
↔ ↔ ↔ ↔ ↔ ↔
BTST Rn, Rd
BTST Rn, @Rd
I H N Z V C
— — —
2
6
6
2
6
6
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
4
2
— — — — —
— — — — —
4
— — — — —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
B (#xx:3 of @Rd16) → Z
B (#xx:3 of @aa:8) → Z
2
Condition Code
↔ ↔ ↔ ↔ ↔ ↔
BTST #xx:3, @Rd
BTST #xx:3, @aa:8
@(d:16, Rn)
Operation
@Rn
B (#xx:3 of Rd8) → Z
Rn
BTST #xx:3, Rd
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
2
6
6
2
6
6
2
6
6
2
6
Appendix A CPU Instruction Set
B C⊕(#xx:3 of Rd8) → C
B C⊕(#xx:3 of @Rd16) → C
BXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BIXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
BIXOR #xx:3, @Rd
B C⊕(#xx:3 of @Rd16) → C
BIXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
I H N Z V C
— — — — —
2
— — — — —
4
— — — — —
4
— — — — —
2
— — — — —
4
— — — — —
4
— — — — —
No. of States
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
4
Condition Code
↔ ↔ ↔ ↔ ↔ ↔ ↔
BXOR #xx:3, Rd
BXOR #xx:3, @Rd
@(d:16, Rn)
Operation
@Rn
B C∨(#xx:3 of @aa:8) → C
Rn
BIOR #xx:3, @aa:8
Branching
Condition
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
6
2
6
6
2
6
6
BRA d:8 (BT d:8)
— PC ← PC+d:8
2
— — — — — — 4
BRN d:8 (BF d:8)
— PC ← PC+2
2
— — — — — — 4
BHI d:8
— If
condition
is true
— then
— PC ←
PC+d:8
— else next;
—
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
—
C∨Z=0
2
— — — — — — 4
C∨Z=1
2
— — — — — — 4
C=0
2
— — — — — — 4
C=1
2
— — — — — — 4
Z=0
2
— — — — — — 4
Z=1
2
— — — — — — 4
BVC d:8
—
V=0
2
— — — — — — 4
BVS d:8
—
V=1
2
— — — — — — 4
BPL d:8
—
N=0
2
— — — — — — 4
BMI d:8
—
N=1
2
— — — — — — 4
BGE d:8
—
N⊕V = 0
2
— — — — — — 4
BLT d:8
—
N⊕V = 1
2
— — — — — — 4
BGT d:8
—
Z ∨ (N⊕V) = 0
2
— — — — — — 4
BLE d:8
—
Z ∨ (N⊕V) = 1
JMP @Rn
— PC ← Rn16
JMP @aa:16
— PC ← aa:16
JMP @@aa:8
— PC ← @aa:8
BSR d:8
— SP–2 → SP
PC → @SP
PC ← PC+d:8
2
— — — — — — 4
2
— — — — — — 4
4
— — — — — — 6
2
2
— — — — — — 8
— — — — — — 6
Rev. 6.00 Aug 04, 2006 page 511 of 626
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Appendix A CPU Instruction Set
— SP–2 → SP
PC → @SP
PC ← Rn16
JSR @aa:16
— SP–2 → SP
PC → @SP
PC ← aa:16
JSR @@aa:8
2
I
H N Z V C
— — — — — — 6
4
SP–2 → SP
PC → @SP
PC ← @aa:8
Condition Code
No. of States
Implied
@@aa
@(d:8, PC)
@aa: 8/16
@–Rn/@Rn+
@(d:16, Rn)
@Rn
Rn
Operation
JSR @Rn
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (bytes)
— — — — — — 8
2
— — — — — — 8
RTE
— CCR ← @SP
SP+2 → SP
PC ← @SP
SP+2 → SP
2
SLEEP
— Transit to sleep mode.
2 — — — — — — 2
LDC #xx:8, CCR
B #xx:8 → CCR
LDC Rs, CCR
B Rs8 → CCR
↔ ↔
↔ ↔
2
2
— — — — — — 2
2
↔ ↔
↔ ↔
↔ ↔
10
↔ ↔
↔
↔
2 — — — — — — 8
↔
↔
↔
— PC ← @SP
SP+2 → SP
↔
RTS
2
2
2
ORC #xx:8, CCR
B CCR∨#xx:8 → CCR
2
XORC #xx:8, CCR
B CCR⊕#xx:8 → CCR
2
NOP
— PC ← PC+2
2 — — — — — — 2
EEPMOV
— if R4L≠0
Repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
Until R4L=0
else next;
4 — — — — — — (4)
Notes: (1)
(2)
(3)
(4)
↔ ↔ ↔
↔ ↔ ↔
B CCR∧#xx:8 → CCR
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
B CCR → Rd8
↔ ↔ ↔
STC CCR, Rd
ANDC #xx:8, CCR
2
2
2
Set to 1 when there is a carry or borrow from bit 11; otherwise cleared to 0.
If the result is zero, the previous value of the flag is retained; otherwise the flag is cleared to 0.
Set to 1 if decimal adjustment produces a carry; otherwise retains value prior to arithmetic operation.
The number of states required for execution is 4n + 9 in the H8/3827R Group and 4n + 8 in the
H8/3827S Group, H8/38327 Group and H8/38427 Group (n = value of R4L).
(5) Set to 1 if the divisor is negative; otherwise cleared to 0.
(6) Set to 1 if the divisor is zero; otherwise cleared to 0.
Rev. 6.00 Aug 04, 2006 page 512 of 626
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Appendix A CPU Instruction Set
A.2
Operation Code Map
Table A.2 is an operation code map. It shows the operation codes contained in the first byte of the
instruction code (bits 15 to 8 of the first instruction word).
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 0.
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 1.
Rev. 6.00 Aug 04, 2006 page 513 of 626
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Rev. 6.00 Aug 04, 2006 page 514 of 626
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OR
XOR
AND
MOV
C
D
E
F
Note: * The PUSH and POP instructions are identical in machine language to MOV instructions.
SUBX
BILD
8
BVC
B
BIAND
BAND
BIST
BLD
BST
BEQ
MOV
NEG
NOT
LDC
7
CMP
BIXOR
BXOR
RTE
BNE
AND
ANDC
6
A
BIOR
BOR
BSR
BCS
XOR
XORC
5
ADDX
BTST
RTS
BCC
OR
ORC
4
9
BCLR
BLS
ROTR
ROTXR
LDC
3
ADD
BNOT
BHI
ROTL
ROTXL
STC
2
8
7
BSET
DIVXU
MULXU
5
6
BRN
SHAR
SHLR
SLEEP
1
BRA
SHAL
SHLL
NOP
0
4
3
2
1
Low
SUB
ADD
MOV
BVS
9
JMP
BPL
DEC
INC
A
C
CMP
MOV
BLT
D
JSR
BGT
SUBX
ADDX
E
Bit-manipulation instructions
BGE
MOV *
EEPMOV
BMI
SUBS
ADDS
B
BLE
DAS
DAA
F
Table A.2
0
High
Appendix A CPU Instruction Set
Operation Code Map
Appendix A CPU Instruction Set
A.3
Number of Execution States
The tables here can be used to calculate the number of states required for instruction execution.
Table A.4 indicates the number of states required for each cycle (instruction fetch, read/write,
etc.), and table A.3 indicates the number of cycles of each type occurring in each instruction. The
total number of states required for execution of an instruction can be calculated from these two
tables as follows:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1, L = M = N = 0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
—
Internal operation
SN
Note:
*
1
Depends on which on-chip module is accessed. See section 2.9.1, Notes on Data
Access for details.
Rev. 6.00 Aug 04, 2006 page 515 of 626
REJ09B0144-0600
Appendix A CPU Instruction Set
Table A.4
Number of Cycles in Each Instruction
Instruction
Fetch
I
Instruction
Mnemonic
ADD
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W Rs, Rd
1
ADDS
ADDS.W #1, Rd
1
ADDS.W #2, Rd
1
ADDX
ADDX.B #xx:8, Rd
1
ADDX.B Rs, Rd
1
AND
Branch
Stack
Addr. Read Operation
J
K
Byte Data
Access
L
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
BAND #xx:3, @Rd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
Bcc
BCLR
BIAND
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
BLT d:8
2
BGT d:8
2
BLE d:8
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @Rd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
BCLR Rn, @Rd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @Rd
2
1
BIAND #xx:3, @aa:8
2
1
Rev. 6.00 Aug 04, 2006 page 516 of 626
REJ09B0144-0600
Word Data
Access
M
Internal
Operation
N
Appendix A CPU Instruction Set
Instruction
Fetch
I
Branch
Stack
Addr. Read Operation
J
K
Byte Data
Access
L
Instruction
Mnemonic
BILD
BILD #xx:3, Rd
1
BILD #xx:3, @Rd
2
1
BILD #xx:3, @aa:8
2
1
BIOR
BIST
BIXOR
BLD
BNOT
BOR
BSET
BIOR #xx:3, Rd
1
BIOR #xx:3, @Rd
2
1
BIOR #xx:3, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @Rd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @Rd
2
1
BIXOR #xx:3, @aa:8
2
1
BLD #xx:3, Rd
1
BLD #xx:3, @Rd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @Rd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @Rd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @Rd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @Rd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @Rd
2
2
BSET Rn, @aa:8
2
2
BSR
BSR d:8
2
BST
BST #xx:3, Rd
1
BST #xx:3, @Rd
2
2
BST #xx:3, @aa:8
2
2
BTST #xx:3, Rd
1
BTST #xx:3, @Rd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST Rn, @Rd
2
BTST
Word Data
Access
M
Internal
Operation
N
1
1
Rev. 6.00 Aug 04, 2006 page 517 of 626
REJ09B0144-0600
Appendix A CPU Instruction Set
Instruction
Mnemonic
Instruction
Fetch
I
BTST
BTST Rn, @aa:8
2
BXOR
BXOR #xx:3, Rd
1
BXOR #xx:3, @Rd
2
1
BXOR #xx:3, @aa:8
2
1
CMP. B #xx:8, Rd
1
CMP. B Rs, Rd
1
CMP
DAA
CMP.W Rs, Rd
1
DAA.B Rd
1
DAS
DAS.B Rd
1
DEC
DEC.B Rd
1
DIVXU
DIVXU.B Rs, Rd
1
EEPMOV
EEPMOV
2
INC
INC.B Rd
1
JMP
JMP @Rn
2
JMP @aa:16
2
JMP @@aa:8
2
JSR
LDC
MOV
JSR @Rn
2
JSR @aa:16
2
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
Branch
Stack
Addr. Read Operation
J
K
Byte Data
Access
L
Word Data
Access
M
1
12
2
1*
2n+2 *
1
2
1
2
1
1
1
2
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
MOV.B @Rs, Rd
1
MOV.B @(d:16, Rs), Rd
2
1
MOV.B @Rs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B Rs, @Rd
1
1
MOV.B Rs, @(d:16, Rd)
2
1
MOV.B Rs, @–Rd
1
1
MOV.B Rs, @aa:8
1
1
MOV.B Rs, @aa:16
2
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @Rs, Rd
1
MOV.W @(d:16, Rs), Rd
2
1
MOV.W @Rs+, Rd
1
1
MOV.W @aa:16, Rd
2
1
Rev. 6.00 Aug 04, 2006 page 518 of 626
REJ09B0144-0600
Internal
Operation
N
1
2
2
1
2
Appendix A CPU Instruction Set
Instruction
MOV
Mnemonic
Instruction
Fetch
I
Byte Data
Access
L
Word Data
Access
M
MOV.W Rs, @Rd
1
MOV.W Rs, @(d:16, Rd)
2
1
MOV.W Rs, @–Rd
1
1
MOV.W Rs, @aa:16
2
1
MULXU
MULXU.B Rs, Rd
1
NEG
NEG.B Rd
1
NOP
NOP
1
NOT
NOT.B Rd
1
OR
Branch
Stack
Addr. Read Operation
J
K
Internal
Operation
N
1
2
12
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
ORC
ORC #xx:8, CCR
1
ROTL
ROTL.B Rd
1
ROTR
ROTR.B Rd
1
ROTXL
ROTXL.B Rd
1
ROTXR
ROTXR.B Rd
1
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHAL
SHAL.B Rd
1
SHAR
SHAR.B Rd
1
SHLL
SHLL.B Rd
1
SHLR
SHLR.B Rd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
SUB
SUB.B Rs, Rd
1
SUB.W Rs, Rd
1
SUBS
SUBS.W #1, Rd
1
SUBS.W #2, Rd
1
POP
POP Rd
1
1
2
PUSH
PUSH Rs
1
1
2
SUBX
SUBX.B #xx:8, Rd
1
SUBX.B Rs, Rd
1
XOR
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XORC
XORC #xx:8, CCR
1
Notes: 1.
2.
n: Initial value in R4L. The source and destination operands are accessed n + 1 times each.
1 in the H8/3827R Group and 0 in the H8/3827S Group, H8/38327 Group, and H8/38427 Group.
Rev. 6.00 Aug 04, 2006 page 519 of 626
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Appendix B Internal I/O Registers
Appendix B Internal I/O Registers
B.1
Addresses
Upper Address: H'F0
Lower
Register
Address Name
Bit Names
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ROM
H'20
FLMCR1
—
SWE
ESU
PSU
EV
PV
E
P
H'21
FLMCR2
FLER
—
—
—
—
—
—
—
H'22
FLPWCR
PDWND
—
—
—
—
—
—
—
H'23
EBR
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
FENR
FLSHE
—
—
—
—
—
—
—
H'24
H'25
H'26
H'27
H'28
H'29
H'2A
H'2B
H'2C
H'2D
H'2E
H'2F
Rev. 6.00 Aug 04, 2006 page 520 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
Upper Address: H'FF
Lower
Register
Address Name
H'90
WEGR
Bit Names
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
WKEGS7 WKEGS6 WKEGS5 WKEGS4 WKEGS3 WKEGS2 WKEGS1 WKEGS0 System
control
H'91
SPCR
—
—
SPC32
SPC31
SCINV3
SCINV2
SCINV1
SCINV0
SCI
H'92
CWOSR
—
—
—
—
—
—
—
CWOS
Timer A
H'95
ECCSR
OVH
OVL
—
CH2
CUEH
CUEL
CRCH
CRCL
H'96
ECH
ECH7
ECH6
ECH5
ECH4
ECH3
ECH2
ECH1
ECH0
Asynchronous event
counter
H'97
ECL
ECL7
ECL6
ECL5
ECL4
ECL3
ECL2
ECL1
ECL0
H'98
SMR31
COM31
CHR31
PE31
PM31
STOP31
MP31
CKS311
CKS310
H'99
BRR31
BRR317
BRR316
BRR315
BRR314
BRR313
BRR312
BRR311
BRR310
H'93
H'94
H'9A
SCR31
TIE31
RIE31
TE31
RE31
MPIE31
TEIE31
CKE31
CKE310
H'9B
TDR31
TDR317
TDR316
TDR315
TDR314
TDR313
TDR312
TDR311
TDR310
H'9C
SSR31
TDRE31
RDRF31
OER31
FER31
PER31
TEND31
MPBR31
MPBT31
H'9D
RDR31
RDR317
RDR316
RDR315
RDR314
RDR313
RDR312
RDR311
RDR310
SCI31
H'9E
H'9F
H'A0
H'A1
H'A2
H'A3
H'A4
H'A5
H'A6
H'A7
H'A8
SMR32
COM32
CHR32
PE32
PM32
STOP32
MP32
CKS321
CKS320
H'A9
BRR32
BRR327
BRR326
BRR325
BRR324
BR323
BRR322
BRR321
BRR320
H'AA
SCR32
TIE32
RIE32
TE32
RE32
MPIE32
TEIE32
CKE321
CKE320
H'AB
TDR32
TDR327
TDR326
TDR325
TDR324
TDR323
TDR322
TDR321
TDR320
H'AC
SSR32
TDRE32
RDRF32
OER32
FER32
PER32
TEND32
MPBR32
MPBT32
H'AD
RDR32
RDR327
RDR326
RDR325
RDR324
RDR323
RDR322
RDR321
RDR320
TMA
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
SCI32
H'AE
H'AF
H'B0
Timer A
Rev. 6.00 Aug 04, 2006 page 521 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
Upper Address: H'FF
Lower
Register
Address Name
Bit Names
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
TCA3
Timer A
H'B1
TCA
TCA7
TCA6
TCA5
TCA4
TCA2
TCA1
TCA0
H'B2
TCSRW
B6WI
TCWE
B4WI
TCSRWE B2WI
WDON
BOW1
WRST
Watchdog
H'B3
TCW
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCWO
timer
H'B4
TMC
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Timer C
H'B5
TCC/TLC
TCC/
TLC7
TCC6/
TLC6
TCC5/
TLC5
TCC4/
TLC4
TCC3/
TLC3
TCC2/
TLC2
TCC1/
TLC1
TCC0/
TLC0
H'B6
TCRF
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
H'B7
TCSRF
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
H'B8
TCFH
TCFH7
TCFH6
TCFH5
TCFH4
TCFH3
TCFH2
TCFH1
TCFH0
H'B9
TCFL
TCFL7
TCFL6
TCFL5
TCFL4
TCFL3
TCFL2
TCFL1
TCFL0
H'BA
OCRFH
OCRFH7
OCRFH6
OCRFH5
OCRFH4
OCRFH3
OCRFH2
OCRFH1
OCRFH0
H'BB
OCRFL
OCRFL7
OCRFL6
OCRFL5
OCRFL4
OCRFL3
OCRFL2
OCRFL1
OCRFL0
H'BC
TMG
OVFH
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
CKS0
H'BD
ICRGF
ICRGF7
ICRGF6
ICRGF5
ICRGF4
ICRGF3
ICRGF2
ICRGF1
ICRGFO
H'BE
ICRGR
ICRGR7
ICRGR6
ICRGR5
ICRGR4
ICRGR3
ICRGR2
ICRGR1
ICRGRO
Timer F
Timer G
H'BF
H'C0
LPCR
DTS1
DTS0
CMX
SGX
SGS3
SGS2
SGS1
SGS0
LCD
H'C1
LCR
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
controller/
H'C2
LCR2
LCDAB
—
—
—
CDS3
CDS2
CDS1
CDS0
driver
H'C3
H'C4
ADRRH
ADR9
ADR8
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
A/D
H'C5
ADRRL
ADR1
ADR0
—
—
—
—
—
—
converter
H'C6
AMR
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
—
H'C7
ADSR
ADSF
—
—
—
—
—
—
H'C8
PMR1
IRQ3
IRQ2
IRQ1
IRQ4
TMIG
TMOFH
TMOFL
TMOW
H'C9
PMR2
EXCL
—
—
—
—
—
—
—
H'CA
PMR3
AEVL
AEVH
WDCKS
NCS
IRQ0
RESO
UD
PWM
PMR5
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
H'D0
PWCR
—
—
—
—
—
—
PWCR1
PWCR0
H'D1
PWDRU
—
—
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0 PWM
H'D2
PWDRL
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
PDR1
P17
I/O port
H'CB
H'CC
H'CD
H'CE
H'CF
Bit 14
H'D3
H'D4
P16
P15
Rev. 6.00 Aug 04, 2006 page 522 of 626
REJ09B0144-0600
P14
P13
P12
P11
P10
I/O Port
Appendix B Internal I/O Registers
Upper Address: H'FF
Lower
Register
Address Name
Bit Names
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
P30
H'D5
Module
Name
I/O Port
H'D6
PDR3
P37
P36
P35
P34
P33
P32
P31
H'D7
PDR4
—
—
—
—
P43
P42
P41
P40
H'D8
PDR5
P57
P56
P55
P54
P53
P52
P51
P50
H'D9
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
H'DA
PDR7
P77
P76
P75
P74
P73
P72
P71
P70
H'DB
PDR8
P87
P86
P85
P84
P83
P82
P81
P80
H'DD
PDRA
—
—
—
—
PA3
PA2
PA1
PA0
H'DE
PDRB
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
H'E0
PUCR1
PUCR17
PUCR16
PUCR15
PUCR14
PUCR13
PUCR12
PUCR11
PUCR10
H'E1
PUCR3
PUCR37
PUCR36
PUCR35
PUCR34
PUCR33
PUCR32
PUCR31
PUCR30
H'E2
PUCR5
PUCR57
PUCR56
PUCR55
PUCR54
PUCR53
PUCR52
PUCR51
PUCR50
H'E3
PUCR6
PUCR67
PUCR66
PUCR65
PUCR64
PUCR63
PUCR62
PUCR61
PUCR60
H'E4
PCR1
PCR17
PCR16
PCR15
PCR14
PCR13
PCR12
PCR11
PCR10
H'E6
PCR3
PCR37
PCR36
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
H'E7
PCR4
—
—
—
—
—
PCR42
PCR41
PCR40
H'E8
PCR5
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
H'E9
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
H'EA
PCR7
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
H'EB
PCR8
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
PCRA
—
—
—
—
PCRA3
PCRA2
PCRA1
PCRA0
H'F0
SYSCR1
SSBY
STS2
STS1
STS0
LSON
—
MA1
MA0
System
H'F1
SYSCR2
—
—
—
NESEL
DTON
MSON
SA1
SA0
control
H'F2
IEGR
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
H'F3
IENR1
IENTA
—
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
H'F4
IENR2
IENDT
IENAD
—
IENTG
IENTFH
IENTFL
IENTC
IENEC
H'F6
IRR1
IRRTA
—
—
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
H'F7
IRRI2
IRRDT
IRRAD
—
IRRTG
IRRTFH
IRRTFL
IRRTC
IRREC
H'DC
H'DF
I/O Port
H'E5
H'EC
H'ED
H'EE
H'EF
H'F5
H'F8
Rev. 6.00 Aug 04, 2006 page 523 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
Upper Address: H'FF
Bit Names
Lower
Register
Address Name
Bit 7
H'F9
IWPR
IWPF7
IWPF6
H'FA
CKSTPR1 —
S31CKST
P
H'FB
CKSTPR2 —
—
—
—
Bit 6
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
System
S32CKST
P
ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP control
Bit 5
H'FC
H'FD
H'FE
H'FF
Legend:
SCI: Serial Communication Interface
Rev. 6.00 Aug 04, 2006 page 524 of 626
REJ09B0144-0600
AECKSTP WDCKST
P
PWCKSTP LDCKSTP
Appendix B Internal I/O Registers
B.2
Functions
Register
acronym
Register
name
Address to which the
register is mapped
Name of
on-chip
supporting
module
Timer C
H'B4
TMC—Timer mode register C
Bit
numbers
Bit
Initial bit
values
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
Possible types of access
R
Read only
W
Write only
R/W Read and write
Clock select
0 0 0 Internal clock: φ/8192
1 Internal clock: φ/2048
1 0 Internal clock: φ/512
1 Internal clock: φ/64
1 0 0 Internal clock: φ/16
1 Internal clock: φ/4
1 0 Internal clock: φ W/4
1 External event (TMIC): Rising or falling edge
Names of the
bits. Dashes
(—) indicate
reserved bits.
Full name
of bit
Descriptions
of bit settings
Counter up/down control
0 0 TCC is an up-counter
1 TCC is a down-counter
1 * TCC up/down control is determined by input at pin
UD. TCC is a down-counter if the UD input is high,
and an up-counter if the UD input is low.
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
*: Don’t care
Rev. 6.00 Aug 04, 2006 page 525 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
FLMCR1—Flash Memory Control Register 1
Bit
H'F020
Flash Memory
7
6
5
4
3
2
1
0

SWE
ESU
PSU
EV
PV
E
P
Initial value
0
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Program
0
Program mode cleared (initial value)
1
Transition to program mode
[Setting condition]
When SWE = 1 and PSU = 1
Erase
0
Erase mode cleared (initial value)
1
Transition to erase mode
[Setting condition]
When SWE = 1 and ESU = 1
Program-Verify
0
Program-verify mode cleared (initial value)
1
Transition to program-verify mode
[Setting condition]
When SWE = 1
Erase-Verify
0
Erase-verify mode cleared (initial value)
1
Transition to erase-verify mode
[Setting condition]
When SWE = 1
Program-Setup
0
Program-setup cleared (initial value)
1
Program setup
[Setting condition]
When SWE = 1
Erase-Setup
0
Erase-setup cleared (initial value)
1
Erase setup
[Setting condition]
When SWE = 1
Software write enable bit
0
Writing/erasing disabled (initial value)
1
Writing/erasing enabled
Rev. 6.00 Aug 04, 2006 page 526 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
FLMCR2—Flash Memory Control Register 2
Bit
H'F021
Flash Memory
7
6
5
4
3
2
1
0
FLER







Initial value
0
0
0
0
0
0
0
0
Read/Write
R







Flash memory error
Note: A write to FLMCR2 is prohibited.
FLPWCR—Flash Memory Power Control Register
Bit
H'F022
Flash Memory
7
6
5
4
3
2
1
0
PDWND







Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W







Power-down Disable
0 When the system transits to sub-active mode,
the flash memory changes to low-power mode
1 When the system transits to sub-active mode,
the flash memory changes to normal mode
Rev. 6.00 Aug 04, 2006 page 527 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
EBR—Erase Block Register
Bit
H'F023
Flash Memory
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Blocks 7 to 0
0 When a block of EB7 to EB0 is not selected (initial value)
1 When a block of EB7 to EB0 is selected
Note: Set the bit of EBR to H'00 when erasing.
FENR Flash Memory Enable Register
Bit
H'F02B
Flash Memory
7
6
5
4
3
2
1
0
FLSHE







Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W







Flash Memory Control Register Enable
0 The flash memory control register cannot be accessed
1 The flash memory control register can be accessed
Rev. 6.00 Aug 04, 2006 page 528 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
WEGR—Wakeup Edge Select Register
Bit
7
6
5
H'90
4
3
System control
2
1
0
WKEGS7 WKEGS6 WKEGS5 WKEGS4 WKEGS3 WKEGS2 WKEGS1 WKEGS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
WKPn edge selected
0
1
WKPn pin falling edge detected
WKPn pin rising edge detected
(n = 0 to 7)
Rev. 6.00 Aug 04, 2006 page 529 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SPCR—Serial Port Control Register
Bit
H'91
SCI
7
6
5
4
—
—
SPC32
SPC31
3
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
2
1
RXD31 pin input data inversion switch
0
1
RXD31 input data is not inverted
RXD31 input data is inverted
TXD31 pin output data inversion switch
0
1
TXD31 output data is not inverted
TXD31 output data is inverted
RXD32 pin input data inversion switch
0
1
RXD32 input data is not inverted
RXD32 input data is inverted
TXD32 pin output data inversion switch
0
1
TXD32 output data is not inverted
TXD32 output data is inverted
P35TXD31 pin function switch
0
1
Functions as P35 I/O pin
Functions as TXD31 output pin
P42/TXD32pin function switch
0
1
Function as P42 I/O pin
Function as TXD32 output pin
Rev. 6.00 Aug 04, 2006 page 530 of 626
REJ09B0144-0600
0
SCINV3 SCINV2 SCINV1 SCINV0
Appendix B Internal I/O Registers
CWOSR—Subclock Output Select Register
Bit
H'92
Timer A
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
CWOS
Initial value
1
1
1
1
1
1
1
0
Read/Write
R
R
R
R
R
R
R
R/W
TMOW pin clock select
0
1
Clock output from TMA is output
φW is output
Rev. 6.00 Aug 04, 2006 page 531 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
ECCSR—Event Counter Control/Status Register
Bit
H'95
AEC
7
6
5
4
3
2
1
0
OVH
OVL
—
CH2
CUEH
CUEL
CRCH
CRCL
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
Counter reset control L
0 ECL is reset
1 ECL reset is cleared
and count-up function
is enabled
Counter reset control H
0 ECH is reset
1 ECH reset is cleared and
count-up function is enabled
Count-up enable L
0 ECL event clock input is disabled.
ECL value is held
1 ECL event clock input is enabled
Count-up enable H
0 ECH event clock input is disabled.
ECH value is held
1 ECH event clock input is enabled
Channel select
0 ECH and ECL are used together as a singlechannel 16-bit event counter
1
ECH and ECL are used as two independent
8-bit event counter channels
Counter overflow L
0 ECL has not overflowed
1 ECL has overflowed
Counter overflow H
0 ECH has not overflowed
1 ECH has overflowed
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Aug 04, 2006 page 532 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
ECH—Event Counter H
Bit
H'96
AEC
7
6
5
4
3
2
1
0
ECH7
ECH6
ECH5
ECH4
ECH3
ECH2
ECH1
ECH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
Note: ECH and ECL can also be used as the upper and lower halves, respectively, of a 16-bit
event counter (EC).
ECL—Event Counter L
Bit
H'97
AEC
7
6
5
4
3
2
1
0
ECL7
ECL6
ECL5
ECL4
ECL3
ECL2
ECL1
ECL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
Note: ECH and ECL can also be used as the upper and lower halves, respectively, of a 16-bit
event counter (EC).
Rev. 6.00 Aug 04, 2006 page 533 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SMR31—Serial Mode Register 31
Bit
H'98
SCI31
7
6
5
4
3
2
COM31
CHR31
PE31
PM31
STOP31
MP31
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
1
0
CKS311 CKS310
Clock select
0 0 φ clock
0 1 φw/2 clock
1 0 φ/16 clock
1 1 φ/64 clock
Multiprocessor mode
0 Multiprocessor communication
function disabled
1 Multiprocessor communication
function enabled
Stop bit length
0 1 stop bit
1 2 stop bits
Parity mode
0 Even parity
1 Odd parity
Parity enable
0 Parity bit addition and checking disabled
1 Parity bit addition and checking enabled
Character length
0 8-bit data/5-bit data
1 7-bit data/5-bit data
Communication mode
0 Asynchronous mode
1 Synchronous mode
Rev. 6.00 Aug 04, 2006 page 534 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
BRR31—Bit Rate Register31
Bit
7
H'99
6
5
4
3
SCI31
2
1
0
BRR317 BRR316 BRR315 BRR314 BRR313 BRR312 BRR311 BRR310
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Serial transmit/receive bit rate
Rev. 6.00 Aug 04, 2006 page 535 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SCR31—Serial Control Register 31
Bit
H'9A
3
SCI31
7
6
5
4
TIE31
RIE31
TE31
RE31
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
2
1
Clock enable
Bit 0
Bit 1
CKE311 CKE310
0
0
0
1
1
0
1
1
Communication Mode
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Description
Clock Source
SCK 3 Pin Function
I/O port
Internal clock
Serial clock output
Internal clock
Clock output
Internal clock
Reserved (Do not specify this combination)
Clock input
External clock
Serial clock input
External clock
Reserved (Do not specify this combination)
Reserved (Do not specify this combination)
Transmit end interrupt enable
0
1
Transmit end interrupt request (TEI) disabled
Transmit end interrupt request (TEI) enabled
Multiprocessor interrupt enable
0
Multiprocessor interrupt request disabled (normal receive operation)
[Clearing condition]
When data is received in which the multiprocessor bit is set to 1
1
Multiprocessor interrupt request enabled
The receive interrupt request (RXI), receive error interrupt request (ERI), and setting of the
RDRF, FER, and OER flags in the serial status register (SSR), are disabled until data with
the multiprocessor bit set to 1 is received.
Receive enable
0
Receive operation disabled (RXD pin is I/O port)
1
Receive operation enabled (RXD pin is receive data pin)
Transmit enable
0
Transmit operation disabled (TXD pin is transmit data pin)
1
Transmit operation enabled (TXD pin is transmit data pin)
Receive interrupt enable
0
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) disabled
1
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) enabled
Transmit interrupt enable
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
Rev. 6.00 Aug 04, 2006 page 536 of 626
REJ09B0144-0600
0
MPIE31 TEIE31 CKE311 CKE310
Appendix B Internal I/O Registers
TDR31—Transmit Data Register 31
Bit
7
6
H'9B
5
4
SCI31
3
2
1
0
TDR317 TDR316 TDR315 TDR314 TDR313 TDR312 TDR311 TDR310
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for transfer to TSR
Rev. 6.00 Aug 04, 2006 page 537 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SSR31—Serial Status Register31
Bit
7
H'9C
6
4
5
TDRE31 RDRF31 OER31
Initial value
1
0
*
Read/Write
R/(W)
0
0
*
*
R/(W)
3
FER31
R/(W)
2
R/(W)
1
*
R/(W)
1
0
0
R
R
R/W
Multiprocessor bit transfer
0
A 0 multiprocessor bit is transmitted
1
A 1 multiprocessor bit is transmitted
Multiprocessor bit receive
0
Data in which the multiprocessor bit is 0 has been received
1
Data in which the multiprocessor bit is 1 has been received
Transmit end
0
Transmission in progress
[Clearing conditions] • After reading TDRE31 = 1, cleared by writing 0 to TDRE
• When data is written to TDR31 by an instruction
1
Transmission ended
[Setting conditions]
• When bit TE in serial control register 31 (SCR31) is cleared to 0
• When bit TDRE31 is set to 1 when the last bit of a transmit character is sent
Parity error
0
Reception in progress or completed normally
[Clearing condition] After reading PER31 = 1, cleared by writing 0 to PER31
1
A parity error has occurred during reception
[Setting condition] When the number of 1 bits in the receive data plus parity bit does not match the parity
designated by the parity mode bit (PM31) in the serial mode register (SMR31)
Framing error
0
Reception in progress or completed normally
[Clearing condition] After reading FER31 = 1, cleared by writing 0 to FER31
1
A framing error has occurred during reception
[Setting condition] When the stop bit at the end of the receive data is checked for a value of 1 at completion of
reception, and the stop bit is 0
Overrun error
0
Reception in progress or completed
[Clearing condition] After reading OER31 = 1, cleared by writing 0 to OER31
1
An overrun error has occurred during reception
[Setting condition] When the next serial reception is completed with RDRF31 set to 1
Receive data register full
0
There is no receive data in RDR31
[Clearing conditions] • After reading RDRF31 = 1, cleared by writing 0 to RDRF31
• When RDR31 data is read by an instruction
1
There is receive data in RDR31
[Setting condition] When reception ends normally and receive data is transferred from RSR31 to RDR31
Transmit data register empty
0
Transmit data written in TDR31 has not been transferred to TSR31
[Clearing conditions] • After reading TDRE31 = 1, cleared by writing 0 to TDRE31
• When data is written to TDR31 by an instruction
1
Transmit data has not been written to TDR31, or transmit data written in TDR31 has been transferred to TSR31
[Setting conditions] • When bit TE in serial control register 31 (SCR31) is cleared to 0
• When data is transferred from TDR31 to TSR31
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Aug 04, 2006 page 538 of 626
REJ09B0144-0600
0
PER31 TEND31 MPBR31 MPBT31
0
*
SCI3
Appendix B Internal I/O Registers
RDR31—Receive Data Register 31
Bit
7
6
H'9D
5
4
3
SCI31
2
1
0
RDR317 RDR316 RDR315 RDR314 RDR313 RDR312 RDR311 RDR310
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Serial receiving data are stored
Rev. 6.00 Aug 04, 2006 page 539 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SMR32—Serial Mode Register 32
Bit
H'A8
SCI32
7
6
5
4
3
2
COM32
CHR32
PE32
PM32
STOP32
MP32
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
1
0
CKS321 CKS320
Clock select
0 0 φ clock
0 1 φw/2 clock
1 0 φ/16 clock
1 1 φ/64 clock
Multiprocessor mode
0 Multiprocessor communication
function disabled
1 Multiprocessor communication
function enabled
Stop bit length
0 1 stop bit
1 2 stop bits
Parity mode
0 Even parity
1 Odd parity
Parity enable
0 Parity bit addition and checking disabled
1 Parity bit addition and checking enabled
Character length
0 8-bit data/5-bit data
1 7-bit data/5-bit data
Communication mode
0 Asynchronous mode
1 Synchronous mode
Rev. 6.00 Aug 04, 2006 page 540 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
BRR32—Bit Rate Register 32
Bit
7
6
H'A9
5
4
3
SCI32
2
1
0
BRR327 BRR326 BRR325 BRR324 BRR323 BRR322 BRR321 BRR3120
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Serial transmit/receive bit rate
Rev. 6.00 Aug 04, 2006 page 541 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SCR32—Serial Control Register 32
Bit
H'AA
3
SCI32
7
6
5
4
TIE32
RIE32
TE32
RE32
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
2
1
Clock enable
Bit 0
Bit 1
CKE321 CKE320
0
0
0
1
1
0
1
1
Communication Mode
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Description
Clock Source
SCK 3 Pin Function
I/O port
Internal clock
Serial clock output
Internal clock
Clock output
Internal clock
Reserved (Do not specify this combination)
Clock input
External clock
Serial clock input
External clock
Reserved (Do not specify this combination)
Reserved (Do not specify this combination)
Transmit end interrupt enable
0
1
Transmit end interrupt request (TEI) disabled
Transmit end interrupt request (TEI) enabled
Multiprocessor interrupt enable
0
Multiprocessor interrupt request disabled (normal receive operation)
[Clearing condition]
When data is received in which the multiprocessor bit is set to 1
1
Multiprocessor interrupt request enabled
The receive interrupt request (RXI), receive error interrupt request (ERI), and setting of the
RDRF, FER, and OER flags in the serial status register (SSR), are disabled until data with
the multiprocessor bit set to 1 is received.
Receive enable
0
Receive operation disabled (RXD pin is I/O port)
1
Receive operation enabled (RXD pin is receive data pin)
Transmit enable
0
Transmit operation disabled (TXD pin is transmit data pin)
1
Transmit operation enabled (TXD pin is transmit data pin)
Receive interrupt enable
0
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) disabled
1
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) enabled
Transmit interrupt enable
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
Rev. 6.00 Aug 04, 2006 page 542 of 626
REJ09B0144-0600
0
MPIE32 TEIE32 CKE321 CKE320
Appendix B Internal I/O Registers
TDR32—Transmit Data Register 32
Bit
7
6
H'AB
5
4
SCI32
3
2
1
0
TDR327 TDR326 TDR325 TDR324 TDR323 TDR322 TDR321 TDR320
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for transfer to TSR
Rev. 6.00 Aug 04, 2006 page 543 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SSR32—Serial Status Register 32
Bit
7
H'AC
6
4
5
TDRE32 RDRF32 OER32
Initial value
1
0
*
Read/Write
R/(W)
0
0
*
*
R/(W)
3
FER32
R/(W)
2
R/(W)
1
*
R/(W)
1
0
0
R
R
R/W
Multiprocessor bit transfer
0
A 0 multiprocessor bit is transmitted
1
A 1 multiprocessor bit is transmitted
Multiprocessor bit receive
0
Data in which the multiprocessor bit is 0 has been received
1
Data in which the multiprocessor bit is 1 has been received
Transmit end
0
Transmission in progress
[Clearing conditions] • After reading TDRE32 = 1, cleared by writing 0 to TDRE32
• When data is written to TDR32 by an instruction
1
Transmission ended
[Setting conditions]
• When bit TE in serial control register 32 (SCR32) is cleared to 0
• When bit TDRE32 is set to 1 when the last bit of a transmit character is sent
Parity error
0
Reception in progress or completed normally
[Clearing condition] After reading PER32 = 1, cleared by writing 0 to PER32
1
A parity error has occurred during reception
[Setting condition] When the number of 1 bits in the receive data plus parity bit does not match the parity
designated by the parity mode bit (PM32) in the serial mode register (SMR32)
Framing error
0
Reception in progress or completed normally
[Clearing condition] After reading FER32 = 1, cleared by writing 0 to FER32
1
A framing error has occurred during reception
[Setting condition] When the stop bit at the end of the receive data is checked for a value of 1 at completion of
reception, and the stop bit is 0
Overrun error
0
Reception in progress or completed
[Clearing condition] After reading OER32 = 1, cleared by writing 0 to OER32
1
An overrun error has occurred during reception
[Setting condition] When the next serial reception is completed with RDRF32 set to 1
Receive data register full
0
There is no receive data in RDR32
[Clearing conditions] • After reading RDRF32 = 1, cleared by writing 0 to RDRF32
• When RDR32 data is read by an instruction
1
There is receive data in RDR32
[Setting condition] When reception ends normally and receive data is transferred from RSR32 to RDR32
Transmit data register empty
0
Transmit data written in TDR32 has not been transferred to TSR32
[Clearing conditions] • After reading TDRE32 = 1, cleared by writing 0 to TDRE32
• When data is written to TDR32 by an instruction
1
Transmit data has not been written to TDR32, or transmit data written in TDR32 has been transferred to TSR32
[Setting conditions] • When bit TE32 in serial control register 32 (SCR32) is cleared to 0
• When data is transferred from TDR32 to TSR32
Note: * Only a write of 0 for flag clearing is possible.
Rev. 6.00 Aug 04, 2006 page 544 of 626
REJ09B0144-0600
0
PER32 TEND32 MPBR32 MPBT32
0
*
SCI32
Appendix B Internal I/O Registers
RDR32—Receive Data Register 32
Bit
7
6
H'AD
5
4
3
SCI32
2
1
0
RDR327 RDR326 RDR325 RDR324 RDR323 RDR322 RDR321 RDR320
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Serial receiving data are stored
Rev. 6.00 Aug 04, 2006 page 545 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TMA—Timer Mode Register A
Bit
H'B0
Timer A
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
Internal clock select
Prescaler and Divider Ratio
TMA3 TMA2 TMA1 TMA0 or Overflow Period
0
0
0
0
PSS
φ/8192
1
PSS
φ/4096
PSS
φ/2048
1
0
PSS
φ/512
1
1
0
0
φ/256
PSS
1
φ/128
PSS
φ/32
1
0
PSS
φ/8
1
PSS
0
0
0
1s
1
PSW
1
0.5 s
PSW
0.25 s
1
0
PSW
0.03125 s
1
PSW
1
0
0
PSW and TCA are reset
1
1
0
1
Clock output select*
0 0 0 φ/32
1 φ/16
1 0 φ/8
1 φ/4
1 0 0 φ W/32
1 φ W/16
1 0 φ W/8
1 φ W/4
Note: * Values when the CWOS bit in CWOSR is cleared to 0.
When the CWOS bit is set to 1, φW is output regardless
of the value of bits TMA7 to TMA5.
Rev. 6.00 Aug 04, 2006 page 546 of 626
REJ09B0144-0600
Function
Interval
timer
Time
base
(when
using
32.768 kHz)
Appendix B Internal I/O Registers
TCA—Timer Counter A
Bit
H'B1
Timer A
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
Rev. 6.00 Aug 04, 2006 page 547 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TCSRW—Timer Control/Status Register W
Bit
H'B2
Watchdog timer
7
6
5
4
3
2
1
0
B6WI
TCWE
B4WI
TCSRWE
B2WI
WDON
B0WI
WRST
Initial value
1
0
1
0
R
0
R/(W)*
1
R
0
R/(W)*
1
Read/Write
R
R/(W) *
R
R/(W) *
Watchdog timer reset
0 [Clearing conditions]
• Reset by RES pin
• When TCSRWE = 1, and 0 is written in both B0WI and WRST
1 [Setting condition]
When TCW overflows and a reset signal is generated
Bit 0 write inhibit
0 Bit 0 is write-enabled
1 Bit 0 is write-protected
Watchdog timer on
0 Watchdog timer operation is disabled
1 Watchdog timer operation is enabled
Bit 2 write inhibit
0 Bit 2 is write-enabled
1 Bit 2 is write-protected
Timer control/status register W write enable
0 Data cannot be written to bits 2 and 0
1 Data can be written to bits 2 and 0
Bit 4 write inhibit
0 Bit 4 is write-enabled
1 Bit 4 is write-protected
Timer counter W write enable
0 Data cannot be written to TCW
1 Data can be written to TCW
Bit 6 write inhibit
0 Bit 6 is write-enabled
1 Bit 6 is write-protected
Note: * Write is permitted only under certain conditions.
Rev. 6.00 Aug 04, 2006 page 548 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TCW—Timer Counter W
Bit
H'B3
Watchdog timer
7
6
5
4
3
2
1
0
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
TMC—Timer Mode Register C
Bit
H'B4
Timer C
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
Clock select
0 0 0 Internal clock: φ/8192
0 0 1 Internal clock: φ/2048
0 1 0 Internal clock: φ/512
0 1 1 Internal clock: φ/64
1 0 0 Internal clock: φ/16
1 0 1 Internal clock: φ/4
1 1 0 Internal clock: φW /4
External event (TMIC): Counting
1 1 1
on rising or falling edge
Counter up/down control
0 0 TCC is an up-counter
0 1 TCC is a down-counter
1 * Hardware control of TCC up/down operation by UD pin input
UD pin input high: Down-counter
UD pin input low: Up-counter
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
* : Don’t care
Rev. 6.00 Aug 04, 2006 page 549 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TCC—Timer Counter C
Bit
H'B5
Timer C
7
6
5
4
3
2
1
0
TCC7
TCC6
TCC5
TCC4
TCC3
TCC2
TCC1
TCC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
Note: TCC is assigned to the same address as TLC. In a read, the TCC value is read.
TLC—Timer Load Register C
Bit
H'B5
Timer C
7
6
5
4
3
2
1
0
TLC7
TLC6
TLC5
TLC4
TLC3
TLC2
TLC1
TLC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reload value
Note: TLC is assigned to the same address as TCC. In a write, the TLC value is written.
Rev. 6.00 Aug 04, 2006 page 550 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TCRF—Timer Control Register F
Bit
H'B6
Timer F
7
6
5
4
3
2
1
0
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Clock select L
0
*
*
1
1
1
0
0
1
0
1
0
1
1
1
Counting on external event (TMIF)
rising/falling edge
Internal clock φ/32
Internal clock φ/16
Internal clock φ/4
Internal clock φw/4
Toggle output level L
0
1
Low level
High level
Clock select H
0
*
*
1
1
1
0
0
1
0
1
0
1
1
1
Toggle output level H
0
1
16-bit mode, counting on TCFL
overflow signal
Internal clock φ/32
Internal clock φ/16
Internal clock φ/4
Internal clock φw/4
* : Don’t care
Low level
High level
Rev. 6.00 Aug 04, 2006 page 551 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TCSRF—Timer Control/Status Register F
Bit
Timer F
7
6
5
4
3
2
1
0
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
0
0
0
0
0
0
0
0
R/W
R/W
Initial value
*
Read/Write
H'B7
*
R/(W)
R/(W)
R/W
R/W
R/(W)
Counter clear L
0
TCFL clearing by compare match is disabled
1
TCFL clearing by compare match is enabled
Timer overflow interrupt enable L
0
TCFL overflow interrupt request is disabled
1
TCFL overflow interrupt request is enabled
Compare match flag L
0
[Clearing condition]
After reading CMFL = 1, cleared by writing 0 to CMFL
1
[Setting condition]
Set when the TCFL value matches the OCRFL value
Timer overflow flag L
0
[Clearing condition]
After reading OVFL = 1, cleared by writing 0 to OVFL
1
[Setting condition]
Set when TCFL overflows from H'FF to H'00
Counter clear H
0
16-bit mode: TCF clearing by compare match is disabled
8-bit mode: TCFH clearing by compare match is disabled
1
16-bit mode: TCF clearing by compare match is enabled
8-bit mode: TCFH clearing by compare match is enabled
Timer overflow interrupt enable H
0
TCFH overflow interrupt request is disabled
1
TCFH overflow interrupt request is enabled
Compare match flag H
0
[Clearing condition]
After reading CMFH = 1, cleared by writing 0 to CMFH
1
[Setting condition]
Set when the TCFH value matches the OCRFH value
Timer overflow flag H
0
[Clearing condition]
After reading OVFH = 1, cleared by writing 0 to OVFH
1
[Setting condition]
Set when TCFH overflows from H'FF to H'00
Note: * Bits 7, 6, 3, and 2 can only be written with 0, for flag clearing.
Rev. 6.00 Aug 04, 2006 page 552 of 626
REJ09B0144-0600
*
*
R/(W)
Appendix B Internal I/O Registers
TCFH—8-Bit Timer Counter FH
Bit
H'B8
Timer F
7
6
5
4
3
2
1
0
TCFH7
TCFH6
TCFH5
TCFH4
TCFH3
TCFH2
TCFH1
TCFH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
Note: TCFH and TCFL can also be used as the upper and lower halves, respectively,
of a 16-bit event counter (TCF).
TCFL—8-Bit Timer Counter FL
Bit
H'B9
Timer F
7
6
5
4
3
2
1
0
TCFL7
TCFL6
TCFL5
TCFL4
TCFL3
TCFL2
TCFL1
TCFL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
Note: TCFH and TCFL can also be used as the upper and lower halves, respectively,
of a 16-bit event counter (TCF).
Rev. 6.00 Aug 04, 2006 page 553 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
OCRFH—Output Compare Register FH
Bit
7
6
5
H'BA
4
3
Timer F
2
1
0
OCRFH7 OCRFH6 OCRFH5 OCRFH4 OCRFH3 OCRFH2 OCRFH1 OCRFH0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: ECH and ECL can also be used as the upper and lower halves, respectively, of a 16-bit
output compare register (OCRF).
OCRFL—Output Compare Register FL
Bit
7
6
5
H'BB
4
3
Timer F
2
1
0
OCRFL7 OCRFL6 OCRFL5 OCRFL4 OCRFL3 OCRFL2 OCRFL1 OCRFL0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: ECH and ECL can also be used as the upper and lower halves, respectively, of a 16-bit
output compare register (OCRF).
Rev. 6.00 Aug 04, 2006 page 554 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
TMG—Timer Mode Register G
Bit
H'BC
Timer G
7
6
5
4
3
2
1
0
CKS0
OVFH
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
W
W
W
W
W
W
Clock select
0 0
0 1
Internal clock: counting on φ/64
Internal clock: counting on φ/32
1 0
1 1
Internal clock: counting on φ/2
Internal clock: counting on φw/4
Counter clear
0 0 TCG clearing is disabled
0 1 TCG cleared by falling edge of input capture input signal
1 0 TCG cleared by rising edge of input capture input signal
1 1 TCG cleared by both edges of input capture input signal
Input capture interrupt edge select
0 Interrupt generated on rising edge of input capture input signal
1 Interrupt generated on falling edge of input capture input signal
Timer overflow interrupt enable
0 TCG overflow interrupt request is disabled
1 TCG overflow interrupt request is enabled
Timer overflow flag L
0
[Clearing condition]
After reading OVFL = 1, cleared by writing 0 to OVFL
1
[Setting condition]
Set when TCG overflows from H'FF to H'00
Timer overflow flag H
0
[Clearing condition]
After reading OVFH = 1, cleared by writing 0 to OVFH
1
[Setting condition]
Set when TCG overflows from H'FF to H'00
Note: * Bits 7 and 6 can only be written with 0, for flag clearing.
Rev. 6.00 Aug 04, 2006 page 555 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
ICRGF—Input Capture Register GF
Bit
7
6
H'BD
5
4
3
Timer G
2
1
0
ICRGF7 ICRGF6 ICRGF5 ICRGF4 ICRGF3 ICRGF2 ICRGF1 ICRGF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Stores TCG value at falling edge of input capture signal
ICRGR—Input Capture Register GR
Bit
7
6
H'BE
5
4
3
Timer G
2
1
0
ICRGR7 ICRGR6 ICRGR5 ICRGR4 ICRGR3 ICRGR2 ICRGR1 ICRGR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Stores TCG value at rising edge of input capture signal
Rev. 6.00 Aug 04, 2006 page 556 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
LPCR—LCD Port Control Register
Bit
H'C0
LCD controller/driver
7
6
5
4
3
2
1
0
DTS1
DTS0
CMX
SGX
SGS3
SGS2
SGS1
SGS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock enable
Function of Pins SEG32 to SEG1
Notes
SEG32
SEG28
SEG24
SEG16
SEG12
SEG8
SEG4
SEG20
SGX SGS3 SGS2 SGS1 SGS0 to SEG29 to SEG25 to SEG21 to SEG17 to SEG13 to SEG9 to SEG5 to SEG1
0
0
0
(Initial value)
0
0
Port
Port
Port
Port
Port
Port
Port
Port
0
0
1
0
Port
Port
Port
Port
Port
Port
Port
Port
0
1
0
SEG
SEG
Port
Port
Port
Port
Port
Port
*
1
0
0
SEG
SEG
SEG
SEG
Port
Port
Port
Port
*
1
1
0
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
*
1
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
*
*
*
0
0
0
1
0
Port*
Port
Port
Port
Port
Port
Port
Port
Use prohibited
*
*
*
*
Bit 4
Bit 3
Bit 2 Bit 1 Bit 0
* : Don't care
Note: * SEG32 to SEG29 are external expansion pins.
Bit 4
SGX
0
1
Description
Pins SEG32to SEG29*
Pins CL1, CL2, DO, M
(Initial value)
Note: * These pins function as ports when the setting of SGS3 to SGS0 is 0000 or 0001.
In the case of the H8/38327 Group and H8/38427 Group the initial values of these bits must not be changed.
Duty select, common function select
Bit 7 Bit 6 Bit 5
Duty Cycle Common Drivers
DTS1 DTS0 CMX
0
0
COM1
0
Static
1
COM4 to COM1
0
1
0
COM2 to COM1
1/2 duty
1
COM4 to COM1
0
0
1
COM3 to COM1
1/3 duty
1
COM4 to COM1
0
1
1
COM4 to COM1
1/4 duty
1
Notes
COM4 to COM2 output the same waveform as COM1
COM4 outputs the same waveform as COM3 and COM2 outputs the same waveform as COM1
COM4 outputs a non-selected waveform
—
Rev. 6.00 Aug 04, 2006 page 557 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
LCR—LCD Control Register
Bit
H'C1
LCD controller/driver
7
6
5
4
3
2
1
0
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Frame frequency select
Bit 3 Bit 2 Bit 1 Bit 0
CKS3 CKS2 CKS1 CKS0
0
0
0
1
1
1
1
1
1
1
1
*
*
*
0
0
0
0
1
1
1
1
0
0
1
0
0
1
1
0
0
1
1
Display data control
0 Blank data is displayed
1 LCD RAM data is displayed
Display function activate
0 LCD controller/driver operation halted
1 LCD controller/driver operates
LCD drive power supply on/off control
0 LCD drive power supply off
1 LCD drive power supply on
Rev. 6.00 Aug 04, 2006 page 558 of 626
REJ09B0144-0600
0
1
*
0
1
0
1
0
1
0
1
Operating Clock
φW
φW/2
φW/4
φ/2
φ/4
φ/8
φ/16
φ/32
φ/64
φ/128
φ/256
* : Don’t care
Appendix B Internal I/O Registers
LCR2—LCD Control Register 2
Bit
H'C2
LCD
7
6
5
4
3
2
1
0
LCDAB
—
—
—
CDS3
CDS2
CDS1
CDS0
Initial value
0
1
1
0
0
0
0
0
Read/Write
R/W
—
—
R/W
R/W
R/W
R/W
R/W
Charge/discharge pulse duty cycle select
Bit 3 Bit 2 Bit 1 Bit 0
Duty Cycle
CDS3 CDS2 CDS1 CDS0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
1
1
1
1
0
1
0
0
1
1
0
0
1
1
*
*
0
1
0
1
0
1
0
1
*
*
1
1/8
2/8
3/8
4/8
5/8
6/8
0
1/16
1/32
* : Don’t care
A waveform/B waveform switching control
0 Drive using A waveform
1 Drive using B waveform
Rev. 6.00 Aug 04, 2006 page 559 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
ADRRH—A/D Result Register H
ADRRL—A/D Result Register L
H'C4
H'C5
A/D converter
ADRRH
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
ADR9
ADR8
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R
R
R
R
R
R
R
R
A/D conversion result
ADRRL
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
ADR1
ADR0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Not fixed Not fixed
R
R
A/D conversion result
Rev. 6.00 Aug 04, 2006 page 560 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
AMR—A/D Mode Register
Bit
H'C6
A/D converter
7
6
5
4
3
2
1
0
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Channel select
Bit 3 Bit 2 Bit 1
CH3 CH2 CH1
0
0
*
1
0
1
1
0
0
1
1
1
*
Bit 0
CH0
*
0
1
0
1
0
1
0
1
*
Analog Input Channel
No channel selected
AN 0
AN 1
AN 2
AN 3
AN 4
AN 5
AN 6
AN 7
Setting prohibited
* : Don’t care
External trigger select
0 Disables start of A/D conversion by external trigger
1 Enables start of A/D conversion by rising or falling edge
of external trigger at pin ADTRG
Clock select
Bit 7
CKS Conversion Period
0
62/φ
1
31/φ
Conversion Time
φ = 1 MHz φ = 5 MHz
62 µs
31 µs
12.4 µs
—
Rev. 6.00 Aug 04, 2006 page 561 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
ADSR—A/D Start Register
Bit
H'C7
A/D converter
7
6
5
4
3
2
1
0
ADSF
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
—
—
—
—
—
—
—
A/D status flag
0 Read Indicates completion of A/D conversion
Write Stops A/D conversion
1 Read Indicates A/D conversion in progress
Write Starts A/D conversion
Rev. 6.00 Aug 04, 2006 page 562 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PMR1—Port Mode Register 1
Bit
H'C8
I/O port
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
IRQ4
TMIG
TMOFH
TMOFL
TMOW
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P10/TMOW pin function switch
0 Functions as P10 I/O pin
1 Functions as TMOW output pin
P11/TMOFL pin function switch
0 Functions as P11 I/O pin
1 Functions as TMOFL output pin
P12/TMOFH pin function switch
0 Functions as P12 I/O pin
1 Functions as TMOFH output pin
P13/TMIG pin function switch
0 Functions as P13 I/O pin
1 Functions as TMIG input pin
P14/IRQ4/ADTRG pin function switch
0 Functions as P14 I/O pin
1 Functions as IRQ4/ADTRG input pin
P15/IRQ1/TMIC pin function switch
0 Functions as P15 I/O pin
1 Functions as IRQ1/TMIC input pin
P16/IRQ2 pin function switch
0 Functions as P16 I/O pin
1 Functions as IRQ2 input pin
P17/IRQ3/TMIF pin function switch
0 Functions as P17 I/O pin
1 Functions as IRQ3/TMIF input pin
Rev. 6.00 Aug 04, 2006 page 563 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PMR2—Port Mode Register 2
Bit
H'C9
I/O port
7
6
5
4
3
2
1
0
EXCL
—
—
—
—
—
—
—
Initial value
0
1
0
1
1
0
0
0
Read/Write
R/W
R
R/W
R
R
R/W
R/W
R/W
P31/UD/EXCL pin function switch
0 Functions as P31/UD I/O pin
1 Functions as EXCL input pin
Note: The information on this register applies to the H8/38327 Group and H8/38427 Group.
Rev. 6.00 Aug 04, 2006 page 564 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PMR3—Port Mode Register 3
Bit
H'CA
I/O port
7
6
5
4
3
2
1
0
AEVL
AEVH
WDCKS
NCS
IRQ0
RESO*
UD
PWM
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P30/PWM pin function switch
0 Functions as P30 I/O pin
1 Functions as PWM output pin
P31/UD pin function switch
0 Functions as P31 I/O pin
1 Functions as UD input pin
P32/RESO pin function switch
0 Functions as P32 I/O pin
1 Functions as RESO I/O pin
P43/IRQ0 pin function switch
0 Functions as P43 I/O pin
1 Functions as IRQ0 input pin
TMIG noise canceler select
0 Noise cancellation function not used
1 Noise cancellation function used
Watchdog timer switch
0 φ8192
1 φW/4
P36/AEVH pin function switch
0 Functions as P36 I/O pin
1 Functions as AEVH input pin
P37/AEVL pin function switch
0 Functions as P37 I/O pin
1 Functions as AEVL input pin
Note: * In the H8/38327 Group and H8/38427 Group this bit is reserved and cannot be written to.
Rev. 6.00 Aug 04, 2006 page 565 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PMR5—Port Mode Register 5
Bit
H'CC
I/O port
7
6
5
4
3
2
1
0
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P5n/WKPn/SEGn+1 pin function switch
0 Functions as P5n I/O pin
1 Functions as WKPn input pin
(n = 7 to 0)
PWCR—PWM Control Register
Bit
H'D0
14-bit PWM
7
6
5
4
3
2
—
—
—
—
—
—
Initial value
1
1
1
1
1
1
0
0
Read/Write
—
—
—
—
—
—
W
W
1
0
PWCR1 PWCR0
Clock select
0 The input clock is φ/2 (tφ* = 2/φ)
The conversion period is 16,384/φ, with a minimum modulation width of 1/φ
The input clock is φ/4 (tφ* = 4/φ)
The conversion period is 32,768/φ, with a minimum modulation width of 2/φ
1 The input clock is φ/8 (tφ* = 8/φ)
The conversion period is 65,536/φ, with a minimum modulation width of 4/φ
The input clock is φ/16 (tφ* = 16/φ)
The conversion period is 131,072/φ, with a minimum modulation width of 8/φ
Note: * tφ: Period of PWM input clock
Rev. 6.00 Aug 04, 2006 page 566 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PWDRU—PWM Data Register U
Bit
H'D1
14-bit PWM
7
6
—
—
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
5
4
3
2
1
0
PWDRU5 PWDRU4PWDRU3 PWDRU2 PWDUR1 PWDRU0
Upper 6 bits of data for generating PWM waveform
PWDRL—PWM Data Register L
Bit
7
6
H'D2
5
4
3
14-bit PWM
2
1
0
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Lower 8 bits of data for generating PWM waveform
PDR1—Port Data Register 1
Bit
H'D4
I/O ports
7
6
5
4
3
2
1
0
P17
P16
P15
P14
P1 3
P1 2
P11
P10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 1 pins
PDR3—Port Data Register 3
Bit
H'D6
I/O ports
7
6
5
4
3
2
1
0
P3 7
P36
P35
P34
P33
P32
P31
P30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 3 pins
Rev. 6.00 Aug 04, 2006 page 567 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PDR4—Port Data Register 4
Bit
H'D7
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
P43
P42
P41
P40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
R
R/W
R/W
R/W
Data for port pins P42 to P40
Pin P43 state is read
PDR5—Port Data Register 5
Bit
H'D8
I/O ports
7
6
5
4
3
2
1
0
P5 7
P56
P55
P54
P53
P52
P51
P50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 5 pins
PDR6—Port Data Register 6
Bit
H'D9
I/O ports
7
6
5
4
3
2
1
0
P6 7
P66
P65
P64
P63
P62
P61
P60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 6 pins
PDR7—Port Data Register 7
Bit
H'DA
I/O ports
7
6
5
4
3
2
1
0
P7 7
P76
P75
P74
P73
P72
P71
P70
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 7 pins
Rev. 6.00 Aug 04, 2006 page 568 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PDR8—Port Data Register 8
Bit
H'DB
I/O ports
7
6
5
4
3
2
1
0
P8 7
P86
P85
P84
P83
P82
P81
P80
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data for port 8 pins
PDRA—Port Data Register A
Bit
H'DD
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
PA3
PA2
PA1
PA0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
Data for port A pins
PDRB—Port Data Register B
Bit
Read/Write
H'DE
I/O ports
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
R
R
R
R
R
R
R
R
Data for port B pins
Rev. 6.00 Aug 04, 2006 page 569 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PUCR1—Port Pull-Up Control Register 1
Bit
7
6
5
H'E0
4
3
I/O ports
2
1
0
PUCR17 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 1 input pull-up MOS control
0 Input pull-up MOS is off
1 Input pull-up MOS is on
Note: When the PCR1 specification is 0. (Input port specification)
PUCR3—Port Pull-Up Control Register 3
Bit
7
6
5
H'E1
4
3
I/O ports
2
1
0
PUCR3 7 PUCR36 PUCR35 PUCR34 PUCR33 PUCR32 PUCR31 PUCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 3 input pull-up MOS control
0 Input pull-up MOS is off
1 Input pull-up MOS is on
Note: When the PCR3 specification is 0. (Input port specification)
PUCR5—Port Pull-Up Control Register 5
Bit
7
6
5
H'E2
4
3
I/O ports
2
1
0
PUCR5 7 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 5 input pull-up MOS control
0 Input pull-up MOS is off
1 Input pull-up MOS is on
Note: When the PCR5 specification is 0. (Input port specification)
Rev. 6.00 Aug 04, 2006 page 570 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PUCR6—Port Pull-Up Control Register 6
Bit
7
6
5
H'E3
4
I/O ports
3
2
1
0
PUCR6 7 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 6 input pull-up MOS control
0 Input pull-up MOS is off
1 Input pull-up MOS is on
Note: When the PCR6 specification is 0. (Input port specification)
PCR1—Port Control Register 1
Bit
H'E4
I/O ports
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
PCR13
PCR1 2
PCR11
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 1 input/output select
0 Input pin
1 Output pin
PCR3—Port Control Register 3
Bit
H'E6
I/O ports
7
6
5
4
3
2
1
0
PCR3 7
PCR3 6
PCR3 5
PCR3 4
PCR3 3
PCR32
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 3 input/output select
0 Input pin
1 Output pin
Rev. 6.00 Aug 04, 2006 page 571 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PCR4—Port Control Register 4
Bit
H'E7
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR42
PCR41
PCR40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Port 4 input/output select
0 Input pin
1 Output pin
PCR5—Port Control Register 5
Bit
H'E8
I/O ports
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 5 input/output select
0 Input pin
1 Output pin
PCR6—Port Control Register 6
Bit
H'E9
I/O ports
7
6
5
4
3
2
1
0
PCR6 7
PCR6 6
PCR6 5
PCR6 4
PCR6 3
PCR6 2
PCR6 1
PCR6 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 6 input/output select
0 Input pin
1 Output pin
Rev. 6.00 Aug 04, 2006 page 572 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
PCR7—Port Control Register 7
Bit
H'EA
I/O ports
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 7 input/output select
0 Input pin
1 Output pin
PCR8—Port Control Register 8
Bit
H'EB
I/O ports
7
6
5
4
3
2
1
0
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 8 input/output select
0 Input pin
1 Output pin
PCRA—Port Control Register A
Bit
H'ED
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
PCRA 3
PCRA 2
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
W
W
W
W
PCRA 1 PCRA 0
Port A input/output select
0 Input pin
1 Output pin
Rev. 6.00 Aug 04, 2006 page 573 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SYSCR1—System Control Register 1
Bit
H'F0
System control
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
—
MA1
MA0
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
—
R/W
R/W
Active (medium-speed)
mode clock select
0 0 φ osc /16
1 φ osc /32
1 0 φ osc /64
1 φ osc/128
Low speed on flag
0 The CPU operates on the system clock (φ)
1 The CPU operates on the subclock (φ SUB)
Standby timer select 2 to 0
0 0 0 Wait time = 8,192 states
1 Wait time = 16,384 states
1 0 Wait time = 32,768 states
1 Wait time = 65,536 states
1 0 0 Wait time = 131,072 states
1 Wait time = 2 states
1 0 Wait time = 8 states
1 Wait time = 16 states
Software standby
0 • When a SLEEP instruction is executed in active mode, a transition is
made to sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition
is made to subsleep mode
1 • When a SLEEP instruction is executed in active mode, a transition is
made to standby mode or watch mode
• When a SLEEP instruction is executed in subactive mode, a transition
is made to watch mode
Rev. 6.00 Aug 04, 2006 page 574 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
SYSCR2—System Control Register 2
Bit
H'F1
System control
7
6
5
4
3
2
1
0
—
—
—
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Subactive mode clock select
Medium speed on flag
0 0 φ W/8
1 φ W/4
1 * φ W/2
*: Don’t care
0 Operates in active (high-speed) mode
1 Operates in active (medium-speed) mode
Direct transfer on flag
0 • When a SLEEP instruction is executed in active mode, a transition is
made to standby mode, watch mode, or sleep mode
• When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode
1 • When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in active (medium-speed) mode, a direct
transition is made to active (high-speed) mode if SSBY = 0, MSON = 0, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1
• When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0,
and MSON = 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 1
Noise elimination sampling frequency select
0 Sampling rate is φ OSC/16
1 Sampling rate is φ OSC/4
Rev. 6.00 Aug 04, 2006 page 575 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IEGR—IRQ Edge Select Register
Bit
H'F2
System control
7
6
5
4
3
2
1
0
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
Initial value
0
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
IRQ0 edge select
0 Falling edge of IRQ0 pin input is detected
1 Rising edge of IRQ0 pin input is detected
IRQ1 edge select
0 Falling edge of IRQ1, TMIC pin input is detected
1 Rising edge of IRQ1, TMIC pin input is detected
IRQ2 edge select
0 Falling edge of IRQ2 pin input is detected
1 Rising edge of IRQ2 pin input is detected
IRQ3 edge select
0 Falling edge of IRQ3, TMIF pin input is detected
1 Rising edge of IRQ3, TMIF pin input is detected
IRQ4 edge select
0 Falling edge of IRQ4 pin and ADTRG pin is detected
1 Rising edge of IRQ4 pin and ADTRG pin is detected
Rev. 6.00 Aug 04, 2006 page 576 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IENR1—Interrupt Enable Register 1
Bit
H'F3
System control
7
6
5
4
3
2
1
0
IENTA
—
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IRQ4 to IRQ0 interrupt enable
0 Disables IRQ4 to IRQ0 interrupt requests
1 Enables IRQ4 to IRQ0 interrupt requests
Wakeup interrupt enable
0 Disables WKP7 to WKP0 interrupt requests
1 Enables WKP7 to WKP0 interrupt requests
Timer A interrupt enable
0 Disables timer A interrupt requests
1 Enables timer A interrupt requests
Rev. 6.00 Aug 04, 2006 page 577 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IENR2—Interrupt Enable Register 2
Bit
H'F4
7
6
5
4
IENDT
IENAD
—
IENTG
3
System control
1
0
IENTC
IENEC
2
IENTFH IENTFL
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Asynchronous event counter interrupt enable
0 Disables asynchronous event counter
interrupt requests
1 Enables asynchronous event counter
interrupt requests
Timer C interrupt enable
0 Disables timer C interrupt requests
1 Enables timer C interrupt requests
Timer FL interrupt enable
0 Disables timer FL interrupt requests
1 Enables timer FL interrupt requests
Timer FH interrupt enable
0 Disables timer FH interrupt requests
1 Enables timer FH interrupt requests
Timer G interrupt enable
0 Disables timer G interrupt requests
1 Enables timer G interrupt requests
A/D converter interrupt enable
0 Disables A/D converter interrupt requests
1 Enables A/D converter interrupt requests
Direct transition interrupt enable
0 Disables direct transition interrupt requests
1 Enables direct transition interrupt requests
Rev. 6.00 Aug 04, 2006 page 578 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IRR1—Interrupt Request Register 1
Bit
H'F6
System control
7
6
5
4
3
2
1
0
IRRTA
—
—
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
Initial value
0
0
1
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
—
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
IRQ4 to IRQ0 interrupt request flags
0 [Clearing condition]
When IRRIn = 1, it is cleared by writing 0
1 [Setting condition]
When pin IRQn is designated for interrupt
input and the designated signal edge is input
(n = 4 to 0)
Timer A interrupt request flag
0 [Clearing condition]
When IRRTA = 1, it is cleared by writing 0
1 [Setting condition]
When the timer A counter value overflows (from H'FF to H'00)
Note: * Bits 7 and 4 to 0 can only be written with 0, for flag clearing.
Rev. 6.00 Aug 04, 2006 page 579 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IRR2—Interrupt Request Register 2
Bit
7
6
5
IRRDT
IRRAD
—
H'F7
4
3
1
0
IRRTC
IRREC
2
IRRTG IRRTFH IRRTFL
System control
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/W
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Asynchronous event counter interrupt request flag
0 [Clearing condition]
When IRREC = 1, it is cleared by writing 0
1 [Setting condition]
When the asynchronous event counter value overflows
Timer C interrupt request flag
0 [Clearing condition]
When IRRTC = 1, it is cleared by writing 0
1 [Setting condition]
When the timer C counter value overflows
(from H'FF to H'00) or underflows (from H'00 to H'FF)
Timer FL interrupt request flag
0 [Clearing condition]
When IRRTFL = 1, it is cleared by writing 0
1 [Setting condition]
When counter FL and output compare register FL
match in 8-bit timer mode
Timer FH interrupt request flag
0 [Clearing condition]
When IRRTFH = 1, it is cleared by writing 0
1 [Setting condition]
When counter FH and output compare register FH match
in 8-bit timer mode, or when 16-bit counters FL and FH
and output compare registers FL and FH match in 16-bit timer mode
Timer G interrupt request flag
0 [Clearing condition]
When IRRTG = 1, it is cleared by writing 0
1 [Setting condition]
When the TMIG pin is designated for TMIG input and
the designated signal edge is input
A/D converter interrupt request flag
0 [Clearing condition]
When IRRAD = 1, it is cleared by writing 0
1 [Setting condition]
When the A/D converter completes conversion and
ADSF is reset
Direct transition interrupt request flag
0 [Clearing condition]
When IRRDT = 1, it is cleared by writing 0
1 [Setting condition]
When a SLEEP instruction is executed while DTON is
set to 1, and a direct transition is made
Note: * Bits 7, 6 and 4 to 0 can only be written with 0, for flag clearing.
Rev. 6.00 Aug 04, 2006 page 580 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
IWPR—Wakeup Interrupt Request Register
Bit
H'F9
System control
7
6
5
4
3
2
1
0
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Wakeup interrupt request register
0 [Clearing condition]
When IWPFn = 1, it is cleared by writing 0
1 [Setting condition]
When pin WKPn is designated for wakeup input and a
falling edge is input at that pin
(n = 7 to 0)
Note: * All bits can only be written with 0, for flag clearing.
Rev. 6.00 Aug 04, 2006 page 581 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
CKSTPR1—Clock Stop Register 1
Bit
7
—
6
H'FA
4
5
3
2
System control
1
0
S31CKSTP S32CKSTP ADCKSTP TGCKSTP TFCKSTP TCCKSTP TACKSTP
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Timer A module standby mode control
0 Timer A is set to module standby mode
1 Timer A module standby mode is cleared
Timer C module standby mode control
0 Timer C is set to module standby mode
1 Timer C module standby mode is cleared
Timer F module standby mode control
0 Timer F is set to module standby mode
1 Timer F module standby mode is cleared
Timer G interrupt enable
0 Timer G is set to module standby mode
1 Timer G module standby mode is cleared
A/D converter module standby mode control
0 A/D converter is set to module standby mode
1 A/D converter module standby mode is cleared
SCI3-2 module standby mode control
0 SCI3-2 is set to module standby mode
1 SCI3-2 module standby mode is cleared
SCI3-1 module standby mode control
0 SCI3-1 is set to module standby mode
1 SCI3-1 module standby mode is cleared
Rev. 6.00 Aug 04, 2006 page 582 of 626
REJ09B0144-0600
Appendix B Internal I/O Registers
CKSTPR2—Clock Stop Register 2
Bit
H'FB
System control
7
6
5
4
—
—
—
—
Initial value
1
1
1
1
1
1
1
1
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
3
2
1
0
AECKSTP WDCKSTP PWCKSTP LDCKSTP
LCD module standby mode control
0 LCD is set to module standby mode
1 LCD module standby mode is cleared
PWM module standby mode control
0 PWM is set to module standby mode
1 PWM module standby mode is cleared
WDT module standby mode control
0 WDT is set to module standby mode
1 WDT module standby mode is cleared
Asynchronous event counter module standby mode control
0 Asynchronous event counter is set to module standby mode
1 Asynchronous event counter module standby mode is cleared
Rev. 6.00 Aug 04, 2006 page 583 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
Appendix C I/O Port Block Diagrams
C.1
Block Diagrams of Port 1
SBY
(low level
during reset
and in standby
mode)
PUCR1n
VCC
VCC
PDR1n
P1n
VSS
PCR1n
Internal data bus
PMR1n
IRQn–4/n*
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
*: n = 7 to 5 → n−4
n=4→n
Figure C.1 (a) Port 1 Block Diagram (Pins P17 to P14)
Rev. 6.00 Aug 04, 2006 page 584 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PUCR13
VCC
PMR13
PDR13
P13
VSS
Internal data bus
VCC
PCR13
Timer G
module
TMIG
Figure C.1 (b) Port 1 Block Diagram (Pin P13)
Rev. 6.00 Aug 04, 2006 page 585 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
Timer F
module
SBY
TMOFH (P12)
TMOFL (P11)
PUCR1n
VCC
PMR1n
PDR1n
P1n
PCR1n
VSS
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
n= 2, 1
Figure C.1 (c) Port 1 Block Diagram (Pin P12, P11)
Rev. 6.00 Aug 04, 2006 page 586 of 626
REJ09B0144-0600
Internal data bus
VCC
Appendix C I/O Port Block Diagrams
Timer A
module
SBY
TMOW
PUCR10
VCC
VCC
PDR10
P10
PCR10
VSS
PDR1:
PCR1:
PMR1:
PUCR1:
Internal data bus
PMR10
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (d) Port 1 Block Diagram (Pin P10)
Rev. 6.00 Aug 04, 2006 page 587 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.2
Block Diagrams of Port 3
SBY
PUCR3n
VCC
PMR3n
P3n
PDR3n
VSS
Internal data bus
VCC
PCR3n
AEC module
AEVH(P36)
AEVL(P37)
PDR3:
Port data register 3
PCR3:
Port control register 3
PMR3:
Port mode register 3
PUCR3: Port pull-up control register 3
n=7 to 6
Figure C.2 (a) Port 3 Block Diagram (Pin P37 to P36)
Rev. 6.00 Aug 04, 2006 page 588 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PUCR35
SCINV1
VCC
VCC
SPC31
SCI31 module
P35
PDR35
PCR35
Internal data bus
TXD31
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
SCINV1: Bit 1 of serial port control register (SPCR)
SPC31: Bit 4 of serial port control register (SPCR)
Figure C.2 (b) Port 3 Block Diagram (Pin P35)
Rev. 6.00 Aug 04, 2006 page 589 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PUCR34
VCC
VCC
SCI31 module
RE31
P34
PDR34
PCR34
VSS
SCINV0
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
SCINV0: Bit 0 of serial port control register (SPCR)
Figure C.2 (c) Port 3 Block Diagram (Pin P34)
Rev. 6.00 Aug 04, 2006 page 590 of 626
REJ09B0144-0600
Internal data bus
RXD31
Appendix C I/O Port Block Diagrams
SBY
PUCR33
SCI31 module
VCC
SCKIE31
SCKOE31
VCC
SCKO31
SCKI31
P33
PCR33
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
Internal data bus
PDR33
PUCR3: Port pull-up control register 3
Figure C.2 (d) Port 3 Block Diagram (Pin P33)
Rev. 6.00 Aug 04, 2006 page 591 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
RESO
PUCR32
VCC
PMR32
P32
PDR32
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
Internal data bus
VCC
PCR32
PMR3: Port mode register 3
PUCR3: Port pull-up control register 3
Figure C.2 (e-1) Port 3 Block Diagram (Pin P32, H8/3827R Group and H8/3827S Group)
Rev. 6.00 Aug 04, 2006 page 592 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PUCR32
VCC
PMR32
P32
PDR32
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
Internal data bus
VCC
PCR32
PMR3: Port mode register 3
PUCR3: Port pull-up control register 3
Figure C.2 (e-2) Port 3 Block Diagram (Pin P32 in the Mask ROM Version of the H8/38327
Group and H8/38427 Group)
Rev. 6.00 Aug 04, 2006 page 593 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
Reset signal
(low level during reset)
PUCR32
VCC
PMR32
P32
PDR32
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
Internal data bus
VCC
PCR32
PMR3: Port mode register 3
PUCR3: Port pull-up control register 3
Figure C.2 (e-3) Port 3 Block Diagram (Pin P32 in the F-ZTAT Version of the H8/38327
Group and H8/38427 Group)
Rev. 6.00 Aug 04, 2006 page 594 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PUCR31
PMR31
PDR31
P31
VSS
Internal data bus
VCC
VCC
PCR31
Timer C
module
UD
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
Figure C.2 (f-1) Port 3 Block Diagram (Pin P31, H8/3827R Group and H8/3827S Group)
Rev. 6.00 Aug 04, 2006 page 595 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
PMR27
PUCR31
VCC
PMR31
PDR31
P31
VSS
Internal data bus
VCC
PCR31
Timer C
module
UD
PDR3:
PCR3:
PMR3:
PMR2:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port mode register 2
Port pull-up control register 3
Subclock
oscillator
Clock
input
Figure C.2 (f-2) Port 3 Block Diagram (Pin P31, H8/38327 Group and H8/38427 Group)
Rev. 6.00 Aug 04, 2006 page 596 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
PWM module
SBY
PWM
PUCR30
VCC
PMR30
P30
PDR30
VSS
Internal data bus
VCC
PCR30
PDR3:
Port data register 3
PCR3:
Port control register 3
PMR3: Port mode register 3
PUCR3: Port pull-up control register 3
Figure C.2 (g) Port 3 Block Diagram (Pin P30)
Rev. 6.00 Aug 04, 2006 page 597 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.3
Block Diagrams of Port 4
Internal data bus
PMR33
P43
IRQ0
PMR3: Port mode register 3
Figure C.3 (a) Port 4 Block Diagram (Pin P43)
Rev. 6.00 Aug 04, 2006 page 598 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
SCINV3
VCC
SPC32
SCI32 module
TXD32
P42
PCR42
VSS
PDR4:
Port data register 4
PCR4:
Port control register 4
Internal data bus
PDR42
SCINV3: Bit 3 of serial port control register (SPCR)
SPC32:
Bit 5 of serial port control register (SPCR)
Figure C.3 (b) Port 4 Block Diagram (Pin P42)
Rev. 6.00 Aug 04, 2006 page 599 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
SBY
VCC
SCI32 module
RE32
RXD32
P41
PCR41
VSS
SCINV2
PDR4:
Port data register 4
PCR4:
Port control register 4
SCINV2: Bit 2 of serial port control register (SPCR)
Figure C.3 (c) Port 4 Block Diagram (Pin P41)
Rev. 6.00 Aug 04, 2006 page 600 of 626
REJ09B0144-0600
Internal data bus
PDR41
Appendix C I/O Port Block Diagrams
SBY
SCI32 module
SCKIE32
SCKOE32
VCC
SCKO32
SCKI32
P40
PCR40
VSS
Internal data bus
PDR40
PDR4: Port data register 4
PCR4: Port control register 4
Figure C.3 (d) Port 4 Block Diagram (Pin P40)
Rev. 6.00 Aug 04, 2006 page 601 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.4
Block Diagram of Port 5
SBY
PUCR5n
VCC
VCC
P5n
PDR5n
VSS
PCR5n
Internal data bus
PMR5n
WKPn
PDR5:
Port data register 5
PCR5:
Port control register 5
PMR5: Port mode register 5
PUCR5: Port pull-up control register 5
n = 7 to 0
Figure C.4 Port 5 Block Diagram
Rev. 6.00 Aug 04, 2006 page 602 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.5
Block Diagram of Port 6
SBY
VCC
PDR6n
VCC
PCR6n
P6n
Internal data bus
PUCR6n
VSS
PDR6:
Port data register 6
PCR6:
Port control register 6
PUCR6: Port pull-up control register 6
n = 7 to 0
Figure C.5 Port 6 Block Diagram
Rev. 6.00 Aug 04, 2006 page 603 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.6
Block Diagram of Port 7
SBY
PDR7n
PCR7n
P7n
VSS
PDR7: Port data register 7
PCR7: Port control register 7
n = 7 to 0
Figure C.6 Port 7 Block Diagram
Rev. 6.00 Aug 04, 2006 page 604 of 626
REJ09B0144-0600
Internal data bus
VCC
Appendix C I/O Port Block Diagrams
C.7
Block Diagrams of Port 8
VCC
PDR8n
PCR8n
P8n
Internal data bus
SBY
VSS
PDR8: Port data register 8
PCR8: Port control register 8
n= 7 to 0
Figure C.7 Port 8 Block Diagram
Rev. 6.00 Aug 04, 2006 page 605 of 626
REJ09B0144-0600
Appendix C I/O Port Block Diagrams
C.8
Block Diagram of Port A
SBY
VCC
PCRAn
PAn
VSS
PDRA: Port data register A
PCRA: Port control register A
n = 3 to 0
Figure C.8 Port A Block Diagram
Rev. 6.00 Aug 04, 2006 page 606 of 626
REJ09B0144-0600
Internal data bus
PDRAn
Appendix C I/O Port Block Diagrams
C.9
Block Diagram of Port B
Internal
data bus
PBn
A/D module
DEC
AMR3 to AMR0
VIN
n = 7 to 0
Figure C.9 Port B Block Diagram
Rev. 6.00 Aug 04, 2006 page 607 of 626
REJ09B0144-0600
Appendix D Port States in the Different Processing States
Appendix D Port States in the Different Processing States
Table D.1
Port States Overview
Port
Reset
Sleep
Subsleep
Standby
Watch
Subactive Active
P17 to
P10
High
impedance
Retained
Retained
High
Retained
1
impedance*
Functions
Functions
P37 to
P30
High
Retained
2
impedance*
Retained
High
Retained
1
impedance*
Functions
Functions
P43 to
P40
High
impedance
Retained
Retained
High
impedance
Retained
Functions
Functions
P57 to
P50
High
impedance
Retained
Retained
High
Retained
1
impedance*
Functions
Functions
P67 to
P60
High
impedance
Retained
Retained
High
impedance
Retained
Functions
Functions
P77 to
P70
High
impedance
Retained
Retained
High
impedance
Retained
Functions
Functions
P87 to
P80
High
impedance
Retained
Retained
High
impedance
Retained
Functions
Functions
PA3 to
PA0
High
impedance
Retained
Retained
High
impedance
Retained
Functions
Functions
PB7 to
PB0
High
impedance
High
High
High
impedance impedance impedance
High
High
High
impedance impedance impedance
Notes: 1. High level output when MOS pull-up is in on state.
2. Reset output from P32 pin only (H8/3827R Group and H8/3827S Group).
On-chip pull-up MOS turns on for pin P32 only (F-ZTAT Version of the H8/38327 Group
and H8/38427 Group).
Rev. 6.00 Aug 04, 2006 page 608 of 626
REJ09B0144-0400
Appendix E List of Product Codes
Appendix E List of Product Codes
Table E.1
H8/3827R Group, H8/3827S Group, and H8/38327 Group Product Code Lineup
Product Type
H8/3827R
Group
H8/3822R
H8/3823R
Mask
ROM
versions
Mask
ROM
versions
Regular
products
H8/3825R
Mask
ROM
versions
Mask
ROM
versions
Mark Code
Package
(Package Code)
HD6433822RH
HD6433822R(***)H
80-pin QFP (FP-80A)
80-pin QFP (FP-80B)
HD6433822RF
HD6433822R(***)F
HD6433822RW
HD6433822R(***)W
80-pin TQFP (TFP-80C)
HCD6433822R

Die
Wide-range
specification
products
HD6433822RD
HD6433822R(***)H
80-pin QFP (FP-80A)
HD6433822RE
HD6433822R(***)F
80-pin QFP (FP-80B)
HD6433822RWI
HD6433822R(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6433823RH
HD6433823R(***)H
80-pin QFP (FP-80A)
80-pin QFP (FP-80B)
Wide-range
specification
products
H8/3824R
Product Code
Regular
products
HD6433823RF
HD6433823R(***)F
HD6433823RW
HD6433823R(***)W
80-pin TQFP (TFP-80C)
HCD6433823R

Die
HD6433823RD
HD6433823R(***)H
80-pin QFP (FP-80A)
HD6433823RE
HD6433823R(***)F
80-pin QFP (FP-80B)
HD6433823RWI
HD6433823R(***)W
80-pin TQFP (TFP-80C)
HD6433824RH
HD6433824R(***)H
80-pin QFP (FP-80A)
HD6433824RF
HD6433824R(***)F
80-pin QFP (FP-80B)
HD6433824RW
HD6433824R(***)W
80-pin TQFP (TFP-80C)
HCD6433824R

Die
Wide-range
specification
products
HD6433824RD
HD6433824R(***)H
80-pin QFP (FP-80A)
HD6433824RE
HD6433824R(***)F
80-pin QFP (FP-80B)
HD6433824RWI
HD6433824R(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6433825RH
HD6433825R(***)H
80-pin QFP (FP-80A)
HD6433825RF
HD6433825R(***)F
80-pin QFP (FP-80B)
HD6433825RW
HD6433825R(***)W
80-pin TQFP (TFP-80C)
Wide-range
specification
products
HCD6433825R

Die
HD6433825RD
HD6433825R(***)H
80-pin QFP (FP-80A)
HD6433825RE
HD6433825R(***)F
80-pin QFP (FP-80B)
HD6433825RWI
HD6433825R(***)W
80-pin TQFP (TFP-80C)
Rev. 6.00 Aug 04, 2006 page 609 of 626
REJ09B0144-0600
Appendix E List of Product Codes
Product Code
Mark Code
Package
(Package Code)
HD6433826RH
HD6433826R(***)H
80-pin QFP (FP-80A)
HD6433826RF
HD6433826R(***)F
80-pin QFP (FP-80B)
HD6433826RW
HD6433826R(***)W
80-pin TQFP (TFP-80C)
HCD6433826R

Die
Wide-range
specification
products
HD6433826RD
HD6433826R(***)H
80-pin QFP (FP-80A)
HD6433826RE
HD6433826R(***)F
80-pin QFP (FP-80B)
HD6433826RWI
HD6433826R(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6433827RH
HD6433827R(***)H
80-pin QFP (FP-80A)
HD6433827RF
HD6433827R(***)F
80-pin QFP (FP-80B)
HD6433827RW
HD6433827R(***)W
80-pin TQFP (TFP-80C)
HCD6433827R

Die
Wide-range
specification
products
HD6433827RD
HD6433827R(***)H
80-pin QFP (FP-80A)
HD6433827RE
HD6433827R(***)F
80-pin QFP (FP-80B)
HD6433827RWI
HD6433827R(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6473827RH
HD6473827RH
80-pin QFP (FP-80A)
80-pin QFP (FP-80B)
Product Type
H8/3827R
Group
H8/3826R
H8/3827R
Mask
ROM
versions
Mask
ROM
versions
ZTAT
versions
Regular
products
HD6473827RF
HD6473827RF
HD6473827RW
HD6473827RW
80-pin TQFP (TFP-80C)
HD6473827RD
HD6473827RH
80-pin QFP (FP-80A)
HD6473827RE
HD6473827RF
80-pin QFP (FP-80B)
HD6473827RWI
HD6473827RW
80-pin TQFP (TFP-80C)
Regular
products
HD6433824SH
HD6433824S(***)H
80-pin QFP (FP-80A)
HD6433824SW
HD6433824S(***)W
80-pin TQFP (TFP-80C)
HCD6433824S

Die
Wide-range
specification
products
HD6433824SD
HD6433824S(***)H
80-pin QFP (FP-80A)
HD6433824SWI
HD6433824S(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6433825SH
HD6433825S(***)H
80-pin QFP (FP-80A)
HD6433825SW
HD6433825S(***)W
80-pin TQFP (TFP-80C)
HCD6433825S

Die
Wide-range
specification
products
HD6433825SD
HD6433825S(***)H
80-pin QFP (FP-80A)
HD6433825SWI
HD6433825S(***)W
80-pin TQFP (TFP-80C)
Wide-range
specification
products
H8/3827S
Group
H8/3824S
H8/3825S
Mask
ROM
versions
Mask
ROM
versions
Rev. 6.00 Aug 04, 2006 page 610 of 626
REJ09B0144-0400
Appendix E List of Product Codes
Product Type
H8/3827S
Group
H8/3826S
H8/3827S
H8/38327
Group
H8/38322
H8/38323
H8/38324
Product Code
Mask
ROM
versions
Mask
ROM
versions
Mask
ROM
versions
Mask
ROM
versions
Mask
ROM
versions
F-ZTAT
versions
Mark Code
Package
(Package Code)
80-pin QFP (FP-80A)
HD6433826SH
HD6433826S(***)H
HD6433826SW
HD6433826S(***)W
80-pin TQFP (TFP-80C)
HCD6433826S

Die
Wide-range
specification
products
HD6433826SD
HD6433826S(***)H
80-pin QFP (FP-80A)
HD6433826SWI
HD6433826S(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD6433827SH
HD6433827S(***)H
80-pin QFP (FP-80A)
HD6433827SW
HD6433827S(***)W
80-pin TQFP (TFP-80C)
HCD6433827S

Die
Wide-range
specification
products
HD6433827SD
HD6433827S(***)H
80-pin QFP (FP-80A)
HD6433827SWI
HD6433827S(***)W
80-pin TQFP (TFP-80C)
Regular
products
HD64338322H
38322H
80-pin QFP (FP-80A)
HD64338322W
38322W
80-pin TQFP (TFP-80C)
HCD64338322

Wide-range
specification
products
HD64338322HW 38322H
80-pin QFP (FP-80A)
HD64338322WW 38322W
80-pin TQFP (TFP-80C)
Regular
products
HD64338323H
38323H
80-pin QFP (FP-80A)
HD64338323W
38323W
80-pin TQFP (TFP-80C)
HCD64338323

Die
Regular
products
Die
Wide-range
specification
products
HD64338323HW 38323H
80-pin QFP (FP-80A)
HD64338323WW 38323W
80-pin TQFP (TFP-80C)
Regular
products
HD64338324H
38324H
80-pin QFP (FP-80A)
HD64338324W
38324W
80-pin TQFP (TFP-80C)
HCD64338324

Die
Wide-range
specification
products
HD64338324HW 38324H
80-pin QFP (FP-80A)
HD64338324WW 38324W
80-pin TQFP (TFP-80C)
Regular
products
HD64F38324H
F38324H
80-pin QFP (FP-80A)
HD64F38324W
F38324W
Wide-range
specification
products
HD64F38324HW F38324H
80-pin QFP (FP-80A)
HD64F38324WW F38324W
80-pin TQFP (TFP-80C)
80-pin TQFP (TFP-80C)
Rev. 6.00 Aug 04, 2006 page 611 of 626
REJ09B0144-0600
Appendix E List of Product Codes
Product Type
H8/38327
Group
H8/38325
H8/38326
H8/38327
Mask
ROM
versions
Mask
ROM
versions
Mask
ROM
versions
F-ZTAT
versions
H8/38427
Group
H8/38422
H8/38423
Mask
ROM
versions
Mask
ROM
versions
Regular
products
Product Code
Mark Code
Package
(Package Code)
HD64338325H
38325H
80-pin QFP (FP-80A)
HD64338325W
38325W
80-pin TQFP (TFP-80C)
HCD64338325

Die
Wide-range
specification
products
HD64338325HW 38325H
80-pin QFP (FP-80A)
HD64338325WW 38325W
80-pin TQFP (TFP-80C)
Regular
products
HD64338326H
38326H
80-pin QFP (FP-80A)
HD64338326W
38326W
80-pin TQFP (TFP-80C)
HCD64338326

Die
Wide-range
specification
products
HD64338326HW 38326H
80-pin QFP (FP-80A)
HD64338326WW 38326W
80-pin TQFP (TFP-80C)
Regular
products
HD64338327H
38327H
80-pin QFP (FP-80A)
HD64338327W
38327W
80-pin TQFP (TFP-80C)
HCD64338327

Wide-range
specification
products
HD64338327HW 38327H
80-pin QFP (FP-80A)
HD64338327WW 38327W
80-pin TQFP (TFP-80C)
Regular
products
HD64F38327H
F38327H
80-pin QFP (FP-80A)
HD64F38327W
F38327W
80-pin TQFP (TFP-80C)
HCD64F38327

Die
Die
Wide-range
specification
products
HD64F38327HW F38327H
80-pin QFP (FP-80A)
HD64F38327WW F38327W
80-pin TQFP (TFP-80C)
Regular
products
HD64338422H
38422H
80-pin QFP (FP-80A)
HD64338422W
38422W
80-pin TQFP (TFP-80C)
HCD64338422

Die
Wide-range
specification
products
HD64338422HW 38422H
80-pin QFP (FP-80A)
HD64338422WW 38422W
80-pin TQFP (TFP-80C)
Regular
products
HD64338423H
38423H
80-pin QFP (FP-80A)
HD64338423W
38423W
80-pin TQFP (TFP-80C)
HCD64338423

Wide-range
specification
products
Rev. 6.00 Aug 04, 2006 page 612 of 626
REJ09B0144-0400
Die
HD64338423HW 38423H
80-pin QFP (FP-80A)
HD64338423WW 38423W
80-pin TQFP (TFP-80C)
Appendix E List of Product Codes
Product Type
H8/38427
Group
H8/38424
Mask
ROM
versions
F-ZTAT
versions
H8/38425
H8/38426
H8/38427
Mask
ROM
versions
Mask
ROM
versions
Mask
ROM
versions
F-ZTAT
versions
Regular
products
Product Code
Mark Code
Package
(Package Code)
HD64338424H
38424H
80-pin QFP (FP-80A)
HD64338424W
38424W
80-pin TQFP (TFP-80C)
HCD64338424

Die
Wide-range
specification
products
HD64338424HW 38424H
80-pin QFP (FP-80A)
HD64338424WW 38424W
80-pin TQFP (TFP-80C)
Regular
products
HD64F38424H
F38424H
80-pin QFP (FP-80A)
HD64F38424W
F38424W
Wide-range
specification
products
HD64F38424HW F38424H
80-pin QFP (FP-80A)
HD64F38424WW F38424W
80-pin TQFP (TFP-80C)
Regular
products
HD64338425H
38425H
80-pin QFP (FP-80A)
HD64338425W
38425W
80-pin TQFP (TFP-80C)
HCD64338425

Wide-range
specification
products
HD64338425HW 38425H
80-pin QFP (FP-80A)
HD64338425WW 38425W
80-pin TQFP (TFP-80C)
Regular
products
HD64338426H
38426H
80-pin QFP (FP-80A)
HD64338426W
38426W
80-pin TQFP (TFP-80C)
HCD64338426

Wide-range
specification
products
HD64338426HW 38426H
80-pin QFP (FP-80A)
HD64338426WW 38426W
80-pin TQFP (TFP-80C)
Regular
products
HD64338427H
38427H
80-pin QFP (FP-80A)
HD64338427W
38427W
80-pin TQFP (TFP-80C)
HCD64338427

Die
80-pin TQFP (TFP-80C)
Die
Die
Wide-range
specification
products
HD64338427HW 38427H
80-pin QFP (FP-80A)
HD64338427WW 38427W
80-pin TQFP (TFP-80C)
Regular
products
HD64F38427H
80-pin QFP (FP-80A)
Wide-range
specification
products
F38427H
HD64F38427W
F38427W
80-pin TQFP (TFP-80C)
HCD64F38427

Die
HD64F38427HW F38427H
80-pin QFP (FP-80A)
HD64F38427WW F38427W
80-pin TQFP (TFP-80C)
Note: For mask ROM versions, (***) is the ROM code.
Rev. 6.00 Aug 04, 2006 page 613 of 626
REJ09B0144-0600
Appendix F Package Dimensions
Appendix F Package Dimensions
Dimensional drawings of H8/3827R Group, H8/3827S Group, H8/38327 Group, and H8/38427
Group packages FP-80A, FP-80B and TFP-80C are shown in figures F.1, F.2 (only H8/3827R
Group) and F.3 below.
JEITA Package Code
P-QFP80-14x14-0.65
RENESAS Code
PRQP0080JB-A
Previous Code
FP-80A/FP-80AV
MASS[Typ.]
1.2g
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HD
*1
D
60
41
61
40
bp
Reference
Symbol
c
c1
HE
ZE
Terminal cross section
1
14
A2
2.70
HD
16.9
17.2
17.5
HE
16.9
17.2
17.5
c
A2
A
A1
L1
Detail F
*3
y
bp
3.05
A1
0.00
0.10
0.25
bp
0.24
0.32
0.40
0.12
0.17
x
M
θ
Rev. 6.00 Aug 04, 2006 page 614 of 626
REJ09B0144-0400
0˚
8˚
0.65
0.12
x
0.10
y
0.83
ZD
ZE
L1
0.22
0.15
e
L
Figure F.1 FP-80A Package Dimensions
0.30
c1
θ
e
E
c
L
Max
14
b1
20
ZD
F
Nom
A
21
80
Dimension in Millimeters
Min
D
*2
E
b1
0.83
0.5
0.8
1.6
1.1
Appendix F Package Dimensions
JEITA Package Code
P-QFP80-14x20-0.80
RENESAS Code
PRQP0080GD-B
Previous Code
FP-80B/FP-80BV
MASS[Typ.]
1.7g
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
HD
*1
D
64
41
65
40
bp
Reference
Symbol
c
c1
HE
Dimension in Millimeters
Min
Nom
D
20
E
14
Max
*2
E
b1
ZE
A2
Terminal cross section
25
80
2.70
HD
24.4
24.8
HE
18.4
18.8
A
1
24
A1
0.00
0.20
0.30
bp
0.29
0.37
0.45
0.12
0.17
θ
A1
L
L1
Detail F
e
*3
y
bp
M
x
0.35
c1
c
A2
A
c
F
19.2
3.10
b1
ZD
25.2
θ
e
10˚
0.8
x
0.15
y
0.15
ZD
0.8
ZE
L
L1
0.22
0.15
0˚
1.0
1.0
1.2
1.4
2.4
Figure F.2 FP-80B Package Dimensions
Rev. 6.00 Aug 04, 2006 page 615 of 626
REJ09B0144-0600
Appendix F Package Dimensions
JEITA Package Code
P-TQFP80-12x12-0.50
RENESAS Code
PTQP0080KC-A
Previous Code
TFP-80C/TFP-80CV
MASS[Typ.]
0.4g
HD
*1
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
D
60
41
61
40
bp
Reference
Symbol
c
c1
HE
Dimension in Millimeters
Min
Nom
D
12
E
12
Max
*2
E
b1
A2
Terminal cross section
ZE
bp
Detail F
x
M
14.2
1.20
A1
0.00
0.10
0.20
bp
0.17
0.22
0.27
θ
0.20
0.12
0.17
0.22
0.15
0˚
x
0.10
y
0.10
ZD
1.25
ZE
L1
Figure F.3 TFP-80C Package Dimensions
8˚
0.5
e
L
Rev. 6.00 Aug 04, 2006 page 616 of 626
REJ09B0144-0400
14.2
c
L
A1
*3
14.0
c1
L1
y
13.8
c
A2
F
A
Index mark
θ
e
14.0
HE
b1
20
1
ZD
13.8
A
21
80
1.00
HD
1.25
0.4
0.5
1.0
0.6
Appendix G Specifications of Chip Form
Appendix G Specifications of Chip Form
The specifications of the chip form of the HCD6433827R, HCD6433826R, HCD6433825R,
HCD6433824R, HCD6433823R, and HCD6433822R are shown in figure G.1.
X-direction 6.10 ± 0.05
Y-direction 6.23 ± 0.05
0.28 ± 0.22
Maximum plain
X-direction 6.10 ± 0.25
Y-direction 6.23 ± 0.25
Max 0.03
(Unit: mm)
Figure G.1 Chip Sectional Figure
The specifications of the chip form of the HCD6433827S, HCD6433826S, HCD6433825S, and
HCD6433824S are shown in figure G.2.
X-direction 3.55 ± 0.05
Y-direction 3.45 ± 0.05
0.28 ± 0.22
Maximum plain
X-direction 3.55 ± 0.25
Y-direction 3.45 ± 0.25
Max 0.03
(Unit: mm)
Figure G.2 Chip Sectional Figure
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Appendix G Specifications of Chip Form
The specifications of the chip form of the HCD64F38327 and HCD64F38427 are shown in figure
G.3.
X-direction 4.35 ± 0.05
Y-direction 4.83 ± 0.05
Pattern side
0.28 ± 0.22
Chip back
Maximum plain
X-direction 4.35 ± 0.25
Y-direction 4.83 ± 0.25
Max 0.03
(Unit: mm)
Figure G.3 Chip Sectional Figure
The specifications of the chip form of the H8/38327 Group (mask ROM version) and H8/38427
Group (mask ROM version) are shown in figure G.4.
X-direction 3.45 ± 0.05
Y-direction 3.39 ± 0.05
Pattern side
0.28 ± 0.22
Chip back
Maximum plain
X-direction 3.45 ± 0.25
Y-direction 3.39 ± 0.25
Max 0.03
(Unit: mm)
Figure G.4 Chip Sectional Figure
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Appendix H Form of Bonding Pads
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD6433827R, HCD6433826R, HCD6433825R,
HCD6433824R, HCD6433823R, and HCD6433822R is shown in figure H.1.
Bonding area
5 to 8 µm
90 µm
Metal Layer
90 µm
5 to 8 µm
Figure H.1 Bonding Pad Form
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Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD6433827S, HCD6433826S, HCD6433825S, and
HCD6433824S is shown in figure H.2.
Bonding area
2.5 µm
75 µm
Metal Layer
75 µm
Figure H.2 Bonding Pad Form
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2.5 µm
Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64F38327, HCD64F38427, H8/38327 Group (mask
ROM version), and H8/38427 Group (mask ROM version) is shown in figure H.3.
Metal Layer
5 µm
65 µm
Bonding area
5 µm
65 µm
Figure H.3 Bonding Pad Form
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Appendix I Specifications of Chip Tray
Appendix I Specifications of Chip Tray
The specifications of the chip tray for the HCD6433827R, HCD6433826R, HCD6433825R,
HCD6433824R, HCD6433823R, and HCD6433822R is shown in figure I.1.
51
Chip orientation
Chip
6.23
Type code
51
6.10
Chip-tray code name
Manufactured by DAINIPPON INK
AND CHEMICALS, INCORPORATED
Code name: CT054
Characteristic engraving: TCT066066-041
8.7±0.1
6.6±0.05
X
X'
8.1±0.15
6.6±0.05
0.4±0.1
1.8±0.1
8.7±0.1
8.1±0.1
Cross-sectional view: X to X'
(Unit: mm)
Figure I.1 Specifications of Chip Tray
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4.0±0.1
Appendix I Specifications of Chip Tray
The specifications of the chip tray for the HCD6433827S, HCD6433826S, HCD6433825S, and
HCD6433824S is shown in figure I.2.
51
Chip orientation
Type
code
Chip
3.45
Base
type code
51
3.55
Chip-tray code name
Manufactured by DAINIPPON INK
AND CHEMICALS, INCORPORATED
Code name: CT065
Characteristic engraving: TCT4040-060
4.9±0.1
4.0±0.05
X
X'
5.9±0.1
4.0±0.05
0.6±0.1
1.8±0.1
4.9±0.1
4.0±0.1
5.9±0.1
Cross-sectional view: X to X'
(Unit: mm)
Figure I.2 Specifications of Chip Tray
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Appendix I Specifications of Chip Tray
The specifications of the chip tray for the HCD64F38327 and HCD64F38427 is shown in figure
I.3.
51
Chip orientation
Type
code
4.83
Chip
51
4.35
Chip-tray code name
Code name: CT037
Characteristic engraving: 2CT049049-070
5.4 ± 0.1
4.9 ± 0.05
X'
X
6.6 ± 0.1
4.9 ± 0.05
0.7 ± 0.1
1.8 ± 0.1
4.0 ± 0.1
5.4 ± 0.1
6.6 ± 0.1
Cross-sectional view: X to X'
Figure I.3 Specifications of Chip Tray
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(Unit: mm)
Appendix I Specifications of Chip Tray
The specifications of the chip tray for the H8/38327 Group (mask ROM version) and H8/38427
Group (mask ROM version) is shown in figure I.4.
51
Chip orientation
Chip
Type
code
3.39
51
3.45
Chip-tray code name
Code name: CT022
Characteristic engraving: TCT036036-060
4.48 ± 0.1
3.6 ± 0.05
X'
X
5.34 ± 0.1
3.6 ± 0.05
0.6 ± 0.1
1.8 ± 0.1
4.0 ± 0.1
4.48 ± 0.1
5.34 ± 0.1
Cross-sectional view: X to X'
(Unit: mm)
Figure I.4 Specifications of Chip Tray
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Appendix I Specifications of Chip Tray
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Renesas 8-Bit Single-Chip Microcomputer
Hardware Manual
H8/3827R Group, H8/3827S Group, H8/38327 Group,
H8/38427 Group
Publication Date: 1st Edition, September, 1999
Rev.6.00, August 04, 2006
Published by:
Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by:
Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
©2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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Colophon 6.0
H8/3827R Group, H8/3827S Group,
H8/38327 Group, H8/38427 Group
Hardware Manual