DAC2900 DAC 290 0 www.ti.com SBAS166C – JUNE 2001 – REVISED SEPTEMBER 2008 Dual, 10-Bit, 125MSPS DIGITAL-TO-ANALOG CONVERTER FEATURES APPLICATIONS ● ● ● ● ● ● ● ● COMMUNICATIONS: Base Stations, WLL, WLAN Baseband I/Q Modulation 125MSPS UPDATE RATE SINGLE SUPPLY: +3.3V or +5V HIGH SFDR: 68dB at fOUT = 20MHz LOW GLITCH: 2pV-s LOW POWER: 310mW at +5V INTERNAL REFERENCE POWER-DOWN MODE: 23mW ● MEDICAL/TEST INSTRUMENTATION ● ARBITRARY WAVEFORM GENERATORS (ARB) ● DIRECT DIGITAL SYNTHESIS (DDS) DESCRIPTION The DAC2900 is a monolithic, 10-bit, dual-channel, high-speed Digital-to-Analog Converter (DAC), and is optimized to provide high dynamic performance while dissipating only 310mW on a +5V single supply. The DAC2900 combines high dynamic performance with a high throughput rate to create a cost-effective solution for a wide variety of waveform-synthesis applications: • Pin compatibility between family members provides 10-bit (DAC2900), 12-bit (DAC2902), and 14-bit (DAC2904) resolution. Operating with high update rates of up to 125MSPS, the DAC2900 offers exceptional dynamic performance, and enables the generation of very high output frequencies suitable for Direct IF applications. The DAC2900 has been optimized for communications applications in which separate I and Q data are processed while maintaining tight gain and offset matching. • Pin compatible to the AD9763 dual DAC. Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog output configurations. • All digital inputs are +3.3V and +5V logic compatible. The DAC2900 has an internal reference circuit, and allows use of an external reference. • Gain matching is typically 0.5% of full-scale, and offset matching is specified at 0.02% max. • The DAC2900 utilizes an advanced CMOS process; the segmented architecture minimizes output glitch energy, and maximizes dynamic performance. • The DAC2900 is available in a TQFP-48 package, and is specified over the extended industrial temperature range of –40°C to +85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2001-2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE SENSITIVITY +VA to AGND ........................................................................ –0.3V to +6V +VD to DGND ........................................................................ –0.3V to +6V AGND to DGND ................................................................. –0.3V to +0.3V +VA to +VD ............................................................................... –6V to +6V CLK, PD to DGND ..................................................... –0.3V to VD + 0.3V D0-D9 to DGND ......................................................... –0.3V to VD + 0.3V IOUT, IOUT to AGND ........................................................ –1V to VA + 0.3V BW, BYP to AGND ..................................................... –0.3V to VA + 0.3V REFIN, FSA to AGND ................................................. –0.3V to VA + 0.3V INT/EXT to AGND ...................................................... –0.3V to VA + 0.3V Junction Temperature .................................................................... +150°C Case Temperature ......................................................................... +100°C Storage Temperature .................................................................... +125°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC2900Y/250 DAC2900Y/1K Tape and Reel, 250 Tape and Reel, 1000 PRODUCT PACKAGE PACKAGE DESIGNATOR DAC2900Y TQFP-48 PFB –40°C to +85°C DAC2900Y " " " " " NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PRODUCT DAC2900 EVM ORDERING NUMBER DAC2900-EVM COMMENT Fully populated evaluation board. See user manual for details. ELECTRICAL CHARACTERISTICS At TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, and 50Ω doubly-terminated, unless otherwise noted. Independent Gain mode. DAC2900Y PARAMETER TEST CONDITIONS MIN RESOLUTION Output Update Rate (fCLOCK) STATIC ACCURACY(1) Differential Nonlinearity (DNL) Integral Nonlinearity (INL) DYNAMIC PERFORMANCE Spurious-Free Dynamic Range (SFDR) fOUT = 1MHz, fCLOCK = 50MSPS fOUT = 1MHz, fCLOCK = 26MSPS fOUT = 2.18MHz, fCLOCK = 52MSPS fOUT = 5.24MHz, fCLOCK = 52MSPS fOUT = 10.4MHz, fCLOCK = 78MSPS fOUT = 15.7MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 100MSPS fOUT = 20.2MHz, fCLOCK = 100MSPS fOUT = 20.1MHz, fCLOCK = 125MSPS fOUT = 40.2MHz, fCLOCK = 125MSPS Spurious-Free Dynamic Range within a Window fOUT = 1.0MHz, fCLOCK = 50MSPS fOUT = 5.02MHz, fCLOCK = 50MSPS fOUT = 5.03MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 125MSPS Total Harmonic Distortion (THD) fOUT = 1MHz, fCLOCK = 50MSPS fOUT = 5.02MHz, fCLOCK = 50MSPS fOUT = 5.03MHz, fCLOCK = 78MSPS fOUT = 5.04MHz, fCLOCK = 125MSPS Multitone Power Ratio fOUT = 2.0MHz to 2.99MHz, fCLOCK = 65MSPS TYP MAX 10 125 TA = +25°C TMIN to TMAX TA = +25°C TMIN to TMAX To Nyquist 0dBFS Output –6dBFS Output –12dBFS Output 2MHz Span 10MHz Span 10MHz Span 10MHz Span +1.0 ±0.25 –1.0 70 +1.0 LSB LSB LSB LSB 80 75 70 80 80 80 75 71 80 68 61 56 dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc 86 80 80 80 dBc dBc dBc dBc –77 –74 –73 –70 8 Tone with 110kHz Spacing 0dBFS Output Bits MSPS ±0.25 –1.0 UNIT 80 –68 dBc dBc dBc dBc dBc DAC2900 2 www.ti.com SBAS166C ELECTRICAL CHARACTERISTICS (continued) At TMIN to TMAX, +VA = +5V, +VD = +3.3V, differential transformer coupled output, and 50Ω doubly-terminated, unless otherwise noted. Independent Gain mode. DAC2900Y PARAMETER DYNAMIC PERFORMANCE (Cont.) Signal-to-Noise Ratio (SNR) fOUT = 5.02MHz, fCLOCK = 50MHz Signal-to-Noise and Distortion (SINAD) fOUT = 5.02MHz, fCLOCK = 50MHz Channel Isolation fOUT = 1MHz, fCLOCK = 52MSPS fOUT = 20MHz, fCLOCK = 125MSPS Output Settling Time(2) Output Rise Time(2) Output Fall Time(2) Glitch Impulse DC ACCURACY Full-Scale Output Range(3)(FSR) Output Compliance Range Gain Error—Full-Scale Gain Error Gain Matching Gain Drift Offset Error Offset Drift Power-Supply Rejection, +VA Power-Supply Rejection, +VD Output Noise Output Resistance Output Capacitance TEST CONDITIONS POWER SUPPLY Supply Voltages +VA +VD Supply Current IVA(5) IVA(5) IVD(5) IVD(6) Power Dissipation(5) Power Dissipation(6) Power Dissipation(5) Power Dissipation Thermal Resistance, TQFP-48 θJA θJC TEMPERATURE RANGE Specified Operating TYP MAX UNIT 0dBFS Output 62 dBc 0dBFS Output 61.5 dBc 85 77 30 2 2 2 dBc dBc ns ns ns pV-s to 0.1% 10% to 90% 10% to 90% All Bits HIGH, IOUT With Internal Reference With External Reference With Internal Reference With Internal Reference With Internal Reference With Internal Reference +5V, ±10% +3.3V, ±10% IOUT = 20mA, RLOAD = 50Ω IOUT = 2mA 2 –1.0 –5 –2.5 –2.0 ±1 ±1 0.5 ±50 –0.02 +0.02 –0.2 –0.025 +0.2 +0.025 50 30 200 6 +1.18 +1.25 ±50 100 0.3 +0.5 +VD = +5V +VD = +5V +VD = 3.3V +VD = 3.3V +VD = 3.3V +VD = 3.3V 20 +1.25 +5 +2.5 +2.0 ±0.2 IOUT, IOUT to Ground REFERENCE/CONTROL AMP Reference Voltage Reference Voltage Drift Reference Output Current Reference Multiplying Bandwidth Input Compliance Range DIGITAL INPUTS Logic Coding Logic High Voltage, VIH Logic Low Voltage, VIL Logic High Voltage, VIH Logic Low Voltage, VIL Logic High Current, IIH(4) Logic Low Current Input Capacitance MIN 3.5 2 +3.0 +3.0 VA = +5V, lOUT = 20mA Power-Down Mode VA = +5V, VD = 3.3V, lOUT = 20mA VA = +5V, VD = 3.3V, lOUT = 20mA VA = +5V, VD = 3.3V, lOUT = 2mA Power-Down Mode +1.31 +1.25 Straight Binary 5 0 3 0 ±10 ±10 5 –40 –40 V ppmFSR/°C nA MHz V 0.8 V V V V µA µA pF +5 +3.3 +5.5 +5.5 V V 58 1.7 4.2 17 310 348 130 23 65 3 7 19.5 350 390 mA mA mA mA mW mW mW mW 1.2 38 °C/W °C/W 60 13 Ambient Ambient mA V %FSR %FSR %FSR ppmFSR/°C %FSR ppmFSR/°C %FSR/V %FSR/V pA/√Hz pA/√Hz kΩ pF +85 +85 °C °C NOTES: (1) At output lOUT, while driving a virtual ground. (2) Measured single-ended into 50Ω load. (3) Nominal full-scale output current is 32 x IREF; see Application Information section for details. (4) Typically 45µA for the PD pin, which has an internal pull-down resistor. (5) Measured at fCLOCK = 25MSPS and fOUT = 1MHz. (6) Measured at fCLOCK = 100MSPS and fOUT = 40MHz. DAC2900 SBAS166C 3 www.ti.com PIN CONFIGURATION +VA IOUT1 IOUT1 FSA1 REFIN GSET FSA2 IOUT2 IOUT2 AGND PD TQFP-48 NC Top View 48 47 46 45 44 43 42 41 40 39 38 37 D9_1 (MSB) 1 36 NC D8_1 2 35 NC D7_1 3 34 NC D6_1 4 33 NC D5_1 5 32 D0_2 D4_1 6 D3_1 7 30 D2_2 D2_1 8 29 D3_2 D1_1 9 28 D4_2 D0_1 10 27 D5_2 NC 11 26 D6_2 NC 12 25 D7_2 31 D1_2 13 14 15 16 17 18 19 20 21 22 23 24 NC NC DGND +VD WRT1 CLK1 CLK2 WRT2 DGND +VD D9_2 (MSB) D8_2 DAC2900 PIN DESCRIPTIONS PIN DESIGNATOR 1-10 11-14 15 16 17 18 19 20 21 22 23-32 33-36 37 38 39 40 41 42 43 D[9:0]_1 NC DGND +VD WRT1 CLK1 CLK2 WRT2 DGND +VD D[9:0]_2 NC PD AGND IOUT2 IOUT2 FSA2 GSET REFIN 44 45 46 47 48 FSA1 IOUT1 IOUT1 +VA NC DESCRIPTION Data Port DAC1, Data Bit 9 (MSB) to Bit 0 (LSB). No Connection Digital Ground Digital Supply, +3.0V to +5.5V DAC1 Input Latches Write Signal Clock Input DAC1 Clock Input DAC2 DAC2 Input Latches Write Signal Digital Ground Digital Supply, +3.0V to +5.5V Data Port DAC2, Data Bit 9 (MSB) to Bit 0 (LSB). No Connection Power-Down Function Control Input; H = DAC in power-down mode; L = DAC in normal operation (Internal pull-down for default L). Analog Ground Current Output DAC2. Full-scale with all bits of data port 2 high. Complementary Current Output DAC2. Full-scale with all bits of data port 2 low. Full-Scale Adjust, DAC2. Connect External RSET Resistor Gain-Setting Mode (H = 1 Resistor, L = 2 Resistor) Internal Reference Voltage output; External Reference Voltage input. Bypass with 0.1µF to AGND for internal reference operation. Full-Scale Adjust, DAC1. Connect External RSET Resistor Complementary Current Output DAC1. Full-scale with all bits of data port 1 low. Current Output DAC1. Full-scale with all bits of data port 1 high. Analog Supply, +3.0V to +5.5V No Connection DAC2900 4 www.ti.com SBAS166C TIMING DIAGRAM tS DATA IN tH D[9:0](n) D[9:0](n + 1) tLPW WRT1 WRT2 tCPW CLK1 CLK2 tCW tSET IOUT1 IOUT(n) 50% IOUT(n + 1) IOUT2 tPD SYMBOL DESCRIPTION MIN tS tH tLPW, tCPW tCW Input Setup Time Input Hold Time Latch/Clock Pulsewidth Delay Rising CLK Edge to Rising WRT Edge Propagation Delay Settling Time (0.1%) 2 1.5 3.5 0 tPD tSET DIGITAL INPUTS AND TIMING The data input ports of the DAC2900 accept a standard positive coding with data bit D9 being the most significant bit (MSB). The converter outputs support a clock rate of up to 125MSPS. The best performance will typically be achieved with a symmetrical duty cycle for write and clock; however, the duty cycle may vary as long as the timing specifications are met. Also, the setup and hold times may be chosen within their specified limits. All digital inputs of the DAC2900 are CMOS-compatible. The logic thresholds depend on the applied digital supply voltages, such that they are set to approximately half the supply voltage: Vth = +VD/2 (±20% tolerance). The DAC2900 is designed to operate with a digital supply (+VD) of +3.0V to +5.5V. MAX UNITS tPW – 2 ns ns ns ns 4 1 30 ns ns The two converter channels within the DAC2900 consist of two independent, 10-bit, parallel data ports. Each DAC channel is controlled by its own set of write (WRT1, WRT2) and clock (CLK1, CLK2) inputs. Here, the WRT lines control the channel input latches and the CLK lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the WRT line. This data is presented to the DAC latch on the following falling edge of the WRT signal. On the next rising edge of the CLK line, the DAC is updated with the new data and the analog output signal will change accordingly. The double latch architecture of the DAC2900 results in a defined sequence for the WRT and CLK signals, expressed by parameter tCW. A correct timing is observed when the rising edge of CLK occurs at the same time, or before, the rising edge of the WRT signal. This condition can simply be met by connecting the WRT and CLK lines together. Note that all specifications were measured with the WRT and CLK lines connected together. DAC2900 SBAS166C TYP 5 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, +VA = +5V, +VD = +3.3V, differential output IOUTFS = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise noted. TYPICAL INL 0.50 0.40 0.40 0.30 0.30 0.20 0.20 INL (LSBs) DNL (LSBs) TYPICAL DNL 0.50 0.10 0.00 –0.10 0.10 0.00 –0.10 –0.20 –0.20 –0.30 –0.30 –0.40 –0.40 –0.50 –0.50 0 200 400 600 800 1k 0 200 400 Code SFDR vs fOUT AT 26MSPS 1k SFDR vs fOUT AT 52MSPS 0dBFS 0dBFS 80 75 SFDR (dBc) 80 SFDR (dBc) 800 85 85 –6dBFS 70 75 –6dBFS 70 –12dBFS –12dBFS 65 65 60 60 0 2 4 6 fOUT (MHz) 8 10 12 0 5 SFDR vs fOUT AT 78MSPS 10 15 fOUT (MHz) 20 25 SFDR vs fOUT AT 100MSPS 85 85 0dBFS 0dBFS 80 80 –6dBFS –6dBFS 75 75 SFDR (dBc) SFDR (dBc) 600 Code 70 –12dBFS 65 70 –12dBFS 65 60 60 55 50 55 0 5 10 15 20 fOUT (MHz) 25 30 0 35 5 10 15 20 25 fOUT (MHz) 30 35 40 45 DAC2900 6 www.ti.com SBAS166C TYPICAL CHARACTERISTICS (continued) At TA = +25°C, +VA = +5V, +VD = +3.3V, differential output IOUTFS = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise noted. SFDR vs fOUT AT 125MSPS SFDR vs IOUT AND fOUT AT 78MSPS, 0dBFS 84 85 82 80 80 –6dBFS 5mA 78 –12dBFS SFDR (dBc) SFDR (dBc) 75 70 65 0dBFS 20mA 76 74 10mA 72 70 2mA 68 60 66 64 55 62 50 60 10 20 30 fOUT (MHz) 40 50 60 0 5 SFDR vs TEMPERATURE AT 125MSPS, 0dBFS 85 25 GAIN AND OFFSET DRIFT 75 70 20MHz 65 40MHz 60 Gain Error (% FS) 10MHz 55 50 –40 –20 0 0.004 0.6 2MHz 80 SFDR (dBc) 20 0.8 90 20 40 Temperature (°C) 60 0.003 Offset Error 0.4 0.002 0.2 0.001 0 0 –0.2 –0.001 Gain Error –0.4 –0.002 –0.6 –0.003 –0.8 –40 80 85 –0.004 –20 0 IVD vs RATIO AT +VD = 3.3V 20 40 Temperature (°C) 60 80 85 IVA vs IOUTFS 60 25 125MSPS 55 100MSPS 20 50 45 78MSPS 15 IVA (mA) IVD (mA) 10 15 fOUT (MHz) Offset Error (% FS) 0 52MSPS 10 40 35 30 25 26MSPS 5 20 15 0 0.00 10 0.05 0.10 0.15 0.20 0.25 0.30 Ratio (fOUT/fCLK) 0.35 0.40 0.45 0 DAC2900 SBAS166C 5 10 15 IOUTFS (mA) 20 25 7 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, +VA = +5V, +VD = +3.3V, differential output IOUTFS = 20mA, 50Ω double-terminated load, SFDR up to Nyquist, unless otherwise noted. SINGLE-TONE SFDR SINGLE-TONE SFDR 10 10 fCLOCK = 52MSPS 0 –20 –30 –40 –50 –60 fOUT = 20.2MHz –10 Amplitude = 0dBFS Magnitude (dBm) Magnitude (dBm) –10 fCLOCK = 100MSPS 0 fOUT = 5.23MHz –20 –30 –40 –50 –60 –70 –70 –80 –80 –90 Amplitude = 0dBFS –90 0 4 8 12 Frequency (MHz) 16 20 0 10 DUAL-TONE SFDR 40 50 FOUR-TONE SFDR 10 10 fCLOCK = 78MSPS 0 –20 Amplitude = 0dBFS –30 –40 –50 –60 fOUT2 = 6.75MHz –20 fOUT3 = 7.25MHz –30 fOUT4 = 7.75MHz –40 Amplitude = 0dBFS –50 –60 –70 –70 –80 –80 –90 fOUT1 = 6.25MHz –10 Magnitude (dBm) fOUT2 = 10.44MHz fCLOCK = 50MSPS 0 fOUT1 = 9.44MHz –10 Magnitude (dBm) 20 30 Frequency (MHz) –90 0 7.8 15.6 23.4 Frequency (MHz) 31.2 39.0 0 5 15 10 Frequency (MHz) 20 25 DAC2900 8 www.ti.com SBAS166C APPLICATION INFORMATION DAC TRANSFER FUNCTION THEORY OF OPERATION The full-scale output current, IOUTFS, is the summation of the two complementary output currents: The architecture of the DAC2900 uses the current steering technique to enable fast switching and a high update rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to deliver a fullscale output current of up to 20mA, as shown in Figure 1. An internal decoder addresses the differential current switches each time the DAC is updated and a corresponding output current is formed by steering all currents to either output summing node, IOUT or IOUT. The complementary outputs deliver a differential output signal, which improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peakto-peak output signal swing by a factor of two, compared to single-ended operation. IOUTFS = IOUT + IOUT The individual output currents depend on the DAC code and can be expressed as: IOUT = IOUTFS × (Code/1024) (2) IOUT = IOUTFS × (1023 – Code)/1024 (3) where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the reference current IREF, which is determined by the reference voltage and the external setting resistor, RSET. The segmented architecture results in a significant reduction of the glitch energy, improves the dynamic performance (SFDR), and DNL. The current outputs maintain a very high output impedance of greater than 200kΩ. IOUTFS = 32 × IREF = 32 × VREF /RSET The full-scale output current is determined by the ratio of the internal reference voltage (1.24V) and an external resistor, RSET. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current that can range from 2mA to 20mA, depending on the value of RSET. +VD +VD Input Latch 1 DAC Latch 1 VOUT = IOUT × RLOAD (5) VOUT = IOUT × RLOAD (6) +VA DAC1 Segmented Switches Current Sources lOUT1 lOUT1 REFIN WRT1 FSA1 CLK1 DAC2900 CLK2 Reference Control Amplifier FSA2 GSET PD WRT2 Data Input Port 2 D[9:0]_2 (4) In most cases the complementary outputs will drive resistive loads or a terminated transformer. A signal voltage will develop at each output according to: The DAC2900 is split into a digital and an analog portion, each of which is powered through its own supply pin. The digital section includes edge-triggered input latches and the decoder logic, while the analog section consists of the current source array with its associated switches, and the reference circuitry. Data Input Port 1 D[9:0]_1 (1) Input Latch 2 DGND DAC Latch 2 DGND DAC2 Segmented Switches Current Sources lOUT2 lOUT2 AGND FIGURE 1. Block Diagram of the DAC2900. DAC2900 SBAS166C 9 www.ti.com The value of the load resistance is limited by the output compliance specification of the DAC2900. To maintain specified linearity performance, the voltage for IOUT and IOUT should not exceed the maximum allowable compliance range. The two single-ended output voltages can be combined to find the total differential output swing: VOUTDIFF = VOUT – VOUT = (2 × Code – 1023) × IOUTFS × RLOAD (7) 1024 ANALOG OUTPUTS The DAC2900 provides two complementary current outputs, IOUT and IOUT. The simplified circuit of the analog output stage representing the differential topology is shown in Figure 2. The output impedance of IOUT and IOUT results from the parallel combination of the differential switches, along with the current sources and associated parasitic capacitances. +VA DAC2900 be adapted to the output of the DAC2900 by selecting a suitable transformer while maintaining optimum voltage levels at IOUT and IOUT. Furthermore, using the differential output configuration in combination with a transformer will be instrumental for achieving excellent distortion performance. Common-mode errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with high output frequencies. For those applications requiring the optimum distortion and noise performance, it is recommended to select a full-scale output of 20mA. A lower full-scale range down to 2mA may be considered for applications that require a low power consumption, but can tolerate a slightly reduced performance level. OUTPUT CONFIGURATIONS The current outputs of the DAC2900 allow for a variety of configurations, some of which are illustrated in Table I. As mentioned previously, utilizing the converter's differential outputs will yield the best dynamic performance. Such a differential output circuit may consist of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most applications with ac coupling, while op amps will be suitable for a DC-coupled configuration. INPUT CODE (D9 - D0) IOUT IOUT 11 1111 1111 20mA 0mA 00 0000 0000 10mA 10mA 00 0000 0000 0mA 20mA TABLE I. Input Coding versus Analog Output Current. IOUT IOUT RL RL The single-ended configuration may be considered for applications requiring a unipolar output voltage. Connecting a resistor from either one of the outputs to ground will convert the output current into a ground-referenced voltage signal. To improve on the DC linearity an I-to-V converter can be used instead. This will result in a negative signal excursion and, therefore, requires a dual supply amplifier. FIGURE 2. Equivalent Analog Output. The signal voltage swing that may develop at the two outputs, IOUT and IOUT, is limited by a negative and positive compliance. The negative limit of –1V is given by the breakdown voltage of the CMOS process, and exceeding it will compromise the reliability of the DAC2900, or even cause permanent damage. With the full-scale output set to 20mA, the positive compliance equals 1.25V, operating with an analog supply of +VA = 5V. Note that the compliance range decreases to about 1V for a selected output current of IOUTFS = 2mA. Care should be taken that the configuration of the DAC2900 does not exceed the compliance range to avoid degradation of the distortion performance and integral linearity. Best distortion performance is typically achieved with the maximum full-scale output signal limited to approximately 0.5VPP. This is the case for a 50Ω doubly terminated load and a 20mA full-scale output current. A variety of loads can DIFFERENTIAL WITH TRANSFORMER Using an RF transformer provides a convenient way of converting the differential output signal into a single-ended signal while achieving excellent dynamic performance (see Figure 3). The appropriate transformer should be carefully selected based on the output frequency spectrum and impedance requirements. The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable impedance ratio (winding ratio), the transformer can be used to provide optimum impedance matching while controlling the compliance voltage for the converter outputs. The model shown, ADTT1-1 (by MiniCircuits), has a 1:1 ratio and may be used to interface the DAC2900 to a 50Ω load. This results in a 25Ω load for each of the outputs, IOUT and IOUT. The output signals are AC coupled and inherently isolated because of its magnetic coupling. DAC2900 10 www.ti.com SBAS166C As shown in Figure 3, the transformer center tap is connected to ground. This forces the voltage swing on IOUT and IOUT to be centered at 0V. In this case the two resistors, RL, may be replaced with one, RDIFF, or omitted altogether. This approach should only be used if all components are close to each other, and if the VSWR is not important. A complete power transfer from the DAC output to the load can be realized, but the output compliance range should be observed. Alternatively, if the center tap is not connected, the signal swing will be centered at RL × IOUTFS/2. However, in this case, the two resistors, RL, must be used to enable the necessary DC-current flow for both outputs. ADTT1-1 (Mini-Circuits) 1:1 IOUT DAC2900 RL 50Ω Optional RDIFF RS IOUT RL 50Ω FIGURE 3. Differential Output Configuration Using an RF Transformer. DIFFERENTIAL CONFIGURATION USING AN OP AMP If the application requires a DC-coupled output, a difference amplifier may be considered, as shown in Figure 4. Four external resistors are needed to configure the voltage-feedback op amp OPA680 as a difference amplifier performing the differential to single-ended conversion. Under the shown configuration, the DAC2900 generates a differential output signal of 0.5VPP at the load resistors, RL. The resistor values shown were selected to result in a symmetric 25Ω loading for each of the current outputs since the input impedance of the difference amplifier is in parallel to resistors RL, and should be considered. The OPA680 is configured for a gain of two. Therefore, operating the DAC2900 with a 20mA full-scale output will produce a voltage output of ±1V. This requires the amplifier to operate from a dual power supply ( 5V). The tolerance of the resistors typically sets the limit for the achievable common-mode rejection. An improvement can be obtained by fine tuning resistor R4. This configuration typically delivers a lower level of AC performance than the previously discussed transformer solution because the amplifier introduces another source of distortion. Suitable amplifiers should be selected based on their slew-rate, harmonic distortion, and output swing capabilities. High-speed amplifiers like the OPA680 or OPA687 may be considered. The AC performance of this circuit may be improved by adding a small capacitor, CDIFF, between the outputs IOUT and IOUT (as shown in Figure 4). This will introduce a real pole to create a low-pass filter in order to slew-limit the DAC fast output signal steps, which otherwise could drive the amplifier into slew-limitations or into an overload condition; both would cause excessive distortion. The difference amplifier can easily be modified to add a level shift for applications requiring the single-ended output voltage to be unipolar (that is, swing between 0V and +2V). DUAL TRANSIMPEDANCE OUTPUT CONFIGURATION The circuit example of Figure 5 shows the signal output currents connected into the summing junctions of the dual voltage-feedback op amp OPA2680 that is set up as a transimpedance stage, or I-to-V converter. With this circuit, the DAC output will be kept at a virtual ground, minimizing the effects of output impedance variations, which results in the best DC linearity (INL). As mentioned previously, care should be taken not to drive the amplifier into slew-rate limitations, and produce unwanted distortion. +5V 50Ω 1/2 OPA2680 R2 402Ω RF1 DAC2900 R1 200Ω IOUT –VOUT = IOUT • RF1 CD1 CF1 IOUT DAC2900 IOUT OPA680 COPT RL 26.1Ω R3 200Ω RL 28.7Ω RF2 VOUT IOUT –5V +5V CD2 R4 402Ω CF2 1/2 OPA2680 –VOUT = IOUT • RF2 50Ω FIGURE 4. Difference Amplifier Provides Differential to Single-Ended Conversion and DC-Coupling. –5V FIGURE 5. Dual, Voltage-Feedback Amplifier OPA2680 Forms Differential Transimpedance Amplifier. DAC2900 SBAS166C 11 www.ti.com The DC gain for this circuit is equal to feedback resistor RF. At high frequencies, the DAC output impedance (CD1, CD2) will produce a zero in the noise gain for the OPA2680 that may cause peaking in the closed-loop frequency response. CF is added across RF to compensate for this noise gain peaking. To achieve a flat transimpedance frequency response, the pole in each feedback network should be set to: INTERNAL REFERENCE OPERATION The DAC2900 has an on-chip reference circuit, which consists of a 1.24V bandgap reference and two control amplifiers, one for each DAC. The full-scale output current (IOUTFS) of the DAC2900 is determined by the reference voltage, VREF, and the value of resistor RSET. IOUTFS can be calculated by: IOUTFS = 32 × IREF = 32 × VREF / RSET 1 GBP = 2 πR F C F 4 πR F C D (8) with GBP = Gain Bandwidth Product of OPA which will give a corner frequency f-3dB of approximately: f –3dB = GBP 2 πR F C D (10) As shown in Figure 7, the external resistor RSET connects to the FSA pin (Full-Scale Adjust). The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is determined by the ratio of VREF and RSET (see Equation 10). The full-scale output current, IOUTFS, results from multiplying IREF by a fixed factor of 32. (9) +5V The full-scale output voltage is simply defined by the product of IOUTFS × RF, and has a negative unipolar excursion. To improve on the ac performance of this circuit, adjustment of RF and/or IOUTFS should be considered. Further extensions of this application example may include adding a differential filter at the OPA2680 output followed by a transformer, in order to convert to a single-ended signal. +VA DAC2900 IREF = VREF RSET FSA REFIN RSET 2kΩ Ref Control Amp Current Sources 0.1µF SINGLE-ENDED CONFIGURATION Using a single load resistor connected to the one of the DAC outputs, a simple current-to-voltage conversion can be accomplished. The circuit in Figure 6 shows a 50Ω resistor connected to IOUT, providing the termination of the further connected 50Ω cable. Therefore, with a nominal output current of 20mA, the DAC produces a total signal swing of 0V to 0.5V into the 25Ω load. IOUTFS = 20mA VOUT = 0V to +0.5V DAC2900 50Ω FIGURE 7. Internal Reference Configuration. Using the internal reference, a 2kΩ resistor value results in a full-scale output of approximately 20mA. Resistors with a tolerance of 1% or better should be considered. Selecting higher values, the output current can be adjusted from 20mA down to 2mA. Operating the DAC2900 at lower than 20mA output currents may be desirable for reasons of reducing the total power consumption, improving the distortion performance, or observing the output compliance voltage limitations for a given load condition. IOUT IOUT +1.24V Ref. 50Ω 25Ω FIGURE 6. Driving a Doubly Terminated 50Ω Cable Directly. It is recommended to bypass the REFIN pin with a ceramic chip capacitor of 0.1µF or more. The control amplifier is internally compensated, and its small signal bandwidth is approximately 0.3MHz. Different load resistor values may be selected as long as the output compliance range is not exceeded. Additionally, the output current, IOUTFS, and the load resistor, may be mutually adjusted to provide the desired output signal swing and performance. DAC2900 12 www.ti.com SBAS166C GAIN SETTING OPTIONS EXTERNAL REFERENCE OPERATION The full-scale output current on the DAC2900 can be set two ways: either for each of the two DAC channels independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42) must be LOW (that is, connected to AGND). In this mode, two external resistors are required—one RSET connected to the FSA1 pin (pin 44) and the other to the FSA2 pin (pin 41). In this configuration, the user has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the compensation of possible gain mismatches elsewhere within the transmit signal path. The internal reference can be disabled by simply applying an external reference voltage into the REFIN pin, which in this case functions as an input, as shown in Figure 8. The use of an external reference may be considered for applications that require higher accuracy and drift performance, or to add the ability of dynamic gain control. While a 0.1µF capacitor is recommended to be used with the internal reference, it is optional for the external reference operation. The reference input, REFIN, has a high input impedance (1MΩ) and can easily be driven by various sources. Note that the voltage range of the external reference should stay within the compliance range of the reference input (0.1V to 1.25V). Alternatively, bringing the GSET pin HIGH (that is, connected to +VA), the DAC2900 will switch into the simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one external RSET resistor connected to the FSA1 pin, while any present resistor at the FSA2 pin must be removed. The formula for deriving the correct RSET remains unchanged (for example, RSET = 2kΩ will result in a 20mA output for both DACs). POWER-DOWN MODE The DAC2900 features a power-down function which can be used to reduce the total supply current to less than 6mA over the specified supply range of 3.0V to 5.5V. Applying a logic HIGH to the PD pin will initiate the power-down mode, while a logic LOW enables normal operation. When left unconnected, an internal active pull-down circuit will enable the normal operation of the converter. +5V +VA DAC2900 IREF = VREF RSET FSA REFIN External Reference Ref Control Amp Current Sources RSET +1.24V Ref. FIGURE 8. External Reference Configuration. DAC2900 SBAS166C 13 www.ti.com GROUNDING, DECOUPLING AND LAYOUT INFORMATION Proper grounding and bypassing, short lead length, and the use of ground planes are particularly important for high-frequency designs. Multilayer PCBs are recommended for best performance since they offer distinct advantages such as minimization of ground impedance, separation of signal layers by ground layers, etc. The DAC2900 uses separate pins for its analog and digital supply and ground connections. The placement of the decoupling capacitor should be such that the analog supply (+VA) is bypassed to the analog ground (AGND), and the digital supply bypassed to the digital ground (DGND). In most cases 0.1µF ceramic chip capacitors at each supply pin are adequate to provide a low impedance decoupling path. Keep in mind that their effectiveness largely depends on the proximity to the individual supply and ground pins. Therefore they should be located as close as physically possible to those device leads. Whenever possible, the capacitors should be located immediately under each pair of supply/ground pins on the reverse side of the pc board. This layout approach will minimize the parasitic inductance of component leads and PCB runs. Further supply decoupling with surface-mount tantalum capacitors (1µF to 4.7µF) may be added as needed in proximity of the converter. Low noise is required for all supply and ground connections to the DAC2900. It is recommended to use a multilayer PCB utilizing separate power and ground planes. Mixed signal designs require particular attention to the routing of the different supply currents and signal traces. Generally, analog supply and ground planes should only extend into analog signal areas, such as the DAC output signal and the reference signal. Digital supply and ground planes must be confined to areas covering digital circuitry, including the digital input lines connecting to the converter, as well as the clock signal. The analog and digital ground planes should be joined together at one point underneath the DAC. This can be realized with a short track of approximately 1/8 inch (3mm). The power to the DAC2900 should be provided through the use of wide pcb runs or planes. Wide runs will present a lower trace impedance, further optimizing the supply decoupling. The analog and digital supplies for the converter should only be connected together at the supply connector of the pc board. In the case of only one supply voltage being available to power the DAC, ferrite beads along with bypass capacitors may be used to create an LC filter. This will generate a low-noise analog supply voltage, which can then be connected to the +VA supply pin of the DAC2900. While designing the layout, it is important to keep the analog signal traces separated from any digital line, in order to prevent noise coupling onto the analog signal path. DAC2900 14 www.ti.com SBAS166C Revision History DATE REVISION 9/08 C PAGE SECTION DESCRIPTION 1 – 2 Pkg/Ordering Info Table Updated Package/Ordering Information table. 3 Electrical Characteristics Changed values for Supply Current and Power Dissipation. Updated front page to standard format. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DAC2900 SBAS166C 15 www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 21-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) DAC2900Y/1K ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2900Y/1KG4 ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2900Y/250 ACTIVE TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC2900Y/250G4 ACTIVE TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DAC2900Y/1K TQFP PFB 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 DAC2900Y/250 TQFP PFB 48 250 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC2900Y/1K TQFP PFB 48 1000 367.0 367.0 38.0 DAC2900Y/250 TQFP PFB 48 250 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MTQF019A – JANUARY 1995 – REVISED JANUARY 1998 PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 48 13 0,13 NOM 1 12 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,05 MIN 0°– 7° 1,05 0,95 Seating Plane 0,75 0,45 0,08 1,20 MAX 4073176 / B 10/96 NOTES: A. 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