AD ADL5724-EVALZ Satellite communication Datasheet

FEATURES
FUNCTIONAL BLOCK DIAGRAM
Frequency range: 12.7 GHz to 15.4 GHz
Typical gain of >23.7 dB
Low noise input
Noise figure
2.1 dB typical at 12.7 GHz
2.4 dB typical at 15.4 GHz
High linearity input
≥2.0 dBm typical input third-order intercept (IIP3)
−8 dBm input 1 dB compression point (P1dB) at 15.4 GHz
Matched 50 Ω single-ended input
Matched 100 Ω differential outputs
8-lead, 2.00 mm × 2.00 mm LFCSP microwave packaging
VCC1
50Ω
SINGLE-ENDED
ADL5724
GND
VCC2
OUTN 100Ω
DIFFERENTIAL
OUTP
INPT
RBIAS
DNC
DNC = DO NOT CONNECT.
DO NOT CONNECT TO THIS PIN.
14317-001
Data Sheet
12.7 GHz to 15.4 GHz, Low Noise Amplifier
ADL5724
Figure 1.
APPLICATIONS
Point to point microwave radios
Instrumentation
Satellite communications (SATCOM)
Phased arrays
GENERAL DESCRIPTION
The ADL5724 is a narrow-band, high performance, low noise
amplifier (LNA) targeting microwave radio link receiver designs.
The monolithic silicon germanium (SiGe) design is optimized for
microwave radio link bands ranging from 12.7 GHz to 15.4 GHz.
The unique design offers a single-ended 50 Ω input impedance
and provides a 100 Ω balanced differential output that is ideal
for driving Analog Devices, Inc., differential downconverters
and radio frequency (RF) sampling analog-to-digital converters
(ADCs). This LNA provides noise figure performance that, in
Rev. 0
the past, required more expensive three-five (III-V) compounds
process technology to achieve.
The ADL5721 and ADL5723 to ADL5726 family of narrowband LNAs are each packaged in a tiny, thermally enhanced,
2.00 mm × 2.00 mm LFCSP package. The ADL5721 and
ADL5723 to ADL5726 family operates over the temperature
range of −40°C to +85°C.
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Tel: 781.329.4700
©2016 Analog Devices, Inc. All rights reserved.
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ADL5724* Product Page Quick Links
Last Content Update: 11/01/2016
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ADL5724
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................6
Applications ....................................................................................... 1
Theory of Operation .........................................................................8
Functional Block Diagram .............................................................. 1
Applications Information .................................................................9
General Description ......................................................................... 1
Layout .............................................................................................9
Revision History ............................................................................... 2
Differential vs. Single-Ended Output .........................................9
Specifications..................................................................................... 3
Evaluation Board ............................................................................ 10
AC Specifications.......................................................................... 3
Initial Setup ................................................................................. 10
DC Specifications ......................................................................... 3
Results .......................................................................................... 10
Absolute Maximum Ratings ............................................................ 4
Basic Connections for Operation ............................................. 11
Thermal Resistance ...................................................................... 4
Outline Dimensions ....................................................................... 12
ESD Caution .................................................................................. 4
Ordering Guide .......................................................................... 12
Pin Configuration and Function Descriptions ............................. 5
REVISION HISTORY
4/16—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet
ADL5724
SPECIFICATIONS
AC SPECIFICATIONS
VCC1 = 1.8 V, VCC2 = 3.3 V, RBIAS = 442 Ω, TA = 25°C, ZSOURCE = 50 Ω, ZLOAD = 100 Ω differential, unless otherwise noted.
Table 1.
Parameter
FREQUENCY RANGE
FREQUENCY = 12.7 GHz
Gain (S21)
Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (P1dB)
Input Return Loss (S11)
Output Return Loss (S22)
FREQUENCY = 15.4 GHz
Gain (S21)
Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (P1dB)
Input Return Loss (S11)
Output Return Loss (S22)
Test Conditions/Comments
Min
12.7
Δf = 1 MHz, input power (PIN) = −30 dBm per tone
Δf = 1 MHz, PIN = −30 dBm per tone
Typ
Max
15.4
Unit
GHz
26.4
2.1
2.0
−11
10
10
dB
dB
dBm
dBm
dB
dB
23.7
2.4
4.0
−8
7
10
dB
dB
dBm
dBm
dB
dB
DC SPECIFICATIONS
Table 2.
Parameter
POWER INTERFACE
Voltage
VCC1
VCC2
Quiescent Current vs. Temperature
VCC1
VCC2
Test Conditions/Comments
TA = 25°C
−40°C ≤ TA ≤ +85°C
TA = 25°C
−40°C ≤ TA ≤ +85°C
Rev. 0 | Page 3 of 12
Min
Typ
Max
Unit
1.65
3.1
1.8
3.3
1.95
3.5
V
V
19.4
19.4
90.0
90.3
mA
mA
mA
mA
ADL5724
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
Supply Voltages
VCC1
VCC2
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering, 60 sec)
Rating
2.25 V
4.1 V
150°C/W
−40°C to +85°C
−55°C to +125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
θJA is thermal resistance, junction to ambient (°C/W), θJB is
thermal resistance, junction to board (°C/W), and θJC is thermal
resistance, junction to case (°C/W).
Table 4. Thermal Resistance
Package Type
8-Lead LFCSP
1
θJA1
39.90
θJB1
23.88
θJC1
3.71
Unit
°C/W
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance for a printed circuit board (PCB) with 3 × 4 vias.
ESD CAUTION
Rev. 0 | Page 4 of 12
Data Sheet
ADL5724
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VCC1 1
INPT 3
RBIAS 4
8 VCC2
ADL5724
TOP VIEW
(Not to Scale)
7 OUTN
6 OUTP
5 DNC
NOTES
1. DNC = DO NOT CONNECT. DO NOT
CONNECT TO THIS PIN.
2. THE EXPOSED PAD MUST BE
SOLDERED TO A LOW IMPEDANCE
GROUND PLANE.
3. THE DEVICE NUMBER ON THE FIGURE
DOES NOT INDICATE THE LABEL ON
THE PACKAGE. REFER TO THE PIN 1
INDICATOR FOR THE PIN LOCATIONS.
14317-002
GND 2
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
2
3
4
Mnemonic
VCC1
GND
INPT
RBIAS
5
6, 7
8
DNC
OUTP, OUTN
VCC2
EPAD (EP)
Description
1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
Ground.
RF Input. This is a 50 Ω single-ended input.
Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to
place the RBIAS resistor as close to the pin as possible.
Do Not Connect. Do not connect to this pin.
RF Outputs. These pins are 100 Ω differential outputs.
3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible.
Exposed Pad. The exposed pad must be soldered to a low impedance ground plane.
Rev. 0 | Page 5 of 12
ADL5724
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
35
10
TA = –40°C
TA = +25°C
TA = +85°C
30
9
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
8
NOSIE FIGURE (dB)
GAIN (dB)
25
20
15
10
7
6
5
4
3
2
5
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.4
15.1
0
12.7
14317-003
0
12.7
Figure 3. Gain vs. Frequency for Various Temperatures
35
0
–5
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
TA = –40°C
TA = +25°C
TA = +85°C
–10
INPUT P1dB (dBm)
25
20
15
10
–15
–20
–25
–30
5
–35
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.4
15.1
–40
12.7
14317-004
0
12.7
Figure 4. Gain vs. Frequency for Various Supply Voltages
10
9
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
14317-007
GAIN (dB)
13.3
Figure 6. Noise Figure vs. Frequency for Various Supply Voltages
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
30
13.0
14317-006
1
Figure 7. Input P1dB vs. Frequency for Various Temperatures
0
TA = –40°C
TA = +25°C
TA = +85°C
–5
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
8
INPUT P1dB (dBm)
6
5
4
3
–15
–20
–25
–30
2
0
12.7
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
Figure 5. Nosie Figure vs. Frequency for Various Temperatures
–40
12.7
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
Figure 8. Input P1dB vs. Frequency for Various Supply Voltages
Rev. 0 | Page 6 of 12
14317-008
–35
1
14317-005
NOISE FIGURE (dB)
–10
7
Data Sheet
20
15
ADL5724
0
TA = –40°C
TA = +25°C
TA = +85°C
–5
INPUT RETURN LOSS (dB)
10
INPUT IP3 (dBm)
5
0
–5
–10
–15
–20
TA = –40°C
TA = +25°C
TA = +85°C
–10
–15
–20
–25
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
–30
12.7
14317-009
–30
12.7
Figure 9. Input IP3 vs. Frequency for Various Temperatures
20
15
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
Figure 11. Input Return Loss vs. Frequency for Various Temperatures
0
3.1V/1.65V
3.3V/1.8V
3.5V/1.95V
TA = –40°C
TA = +25°C
TA = +85°C
–5
OUTPUT RETURN LOSS (dB)
10
5
0
–5
–10
–15
–20
–10
–15
–20
–25
–30
12.7
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
Figure 10. Input IP3 vs. Frequency for Various Supply Voltages
–30
12.7
13.0
13.3
13.6 13.9 14.2 14.5
FREQUENCY (GHz)
14.8
15.1
15.4
14317-012
–25
14317-010
INPUT IP3 (dBm)
13.0
14317-011
–25
Figure 12. Output Return Loss vs. Frequency for Various Temperatures
Rev. 0 | Page 7 of 12
ADL5724
Data Sheet
THEORY OF OPERATION
The ADL5724 is a narrow-band, high performance, low noise
amplifier targeting microwave radio link receiver designs. The
monolithic SiGe design is optimized for microwave radio link
bands ranging from 12.7 GHz to 15.4 GHz.
The unique design of the ADL5724 offers a single-ended 50 Ω
input impedance via the INPT pin, and provides a 100 Ω
balanced differential output via the OUTP and OUTN pins.
This LNA is ideal for driving Analog Devices differential
downconverters and RF sampling ADCs.
The ADL5724 provides cost-effective noise figure performance
without requiring more expensive III-V compounds process
technology.
The ADL5724 is available in a 2.00 mm × 2.00 mm LFCSP package,
and operates over the temperature range of −40°C to +85°C.
Rev. 0 | Page 8 of 12
Data Sheet
ADL5724
APPLICATIONS INFORMATION
10
LAYOUT
9
8
NOSIE FIGURE (dB)
Solder the exposed pad on the underside of the ADL5724 to a
low thermal and electrical impedance ground plane. This pad is
typically soldered to an exposed opening in the solder mask on
the evaluation board. Connect the ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package.
7
6
5
4
3
2
13.3
13.6
13.9
14.2
14.5
14.8
15.1
15.4
14317-018
13.0
15.1
15.4
14317-021
0
12.7
15.1
15.4
14317-020
1
FREQUENCY (GHz)
Figure 15. Noise Figure vs. Frequency
20
14317-016
15
10
Figure 13. Evaluation Board Layout for the ADL5724 Package
DIFFERENTIAL vs. SINGLE-ENDED OUTPUT
0
–5
–10
–15
–20
–25
–30
12.7
30
–5
25
–10
INPUT P1dB (dBm)
0
15
10
13.3
13.6
13.9
14.2
14.5
14.8
Figure 16. Input IP3 vs. Frequency
35
20
13.0
FREQUENCY (GHz)
–15
–20
–25
–30
5
0
12.7
–35
13.0
13.3
13.6
13.9
14.2
14.5
FREQUENCY (GHz)
14.8
15.1
15.4
14317-017
GAIN (dB)
This section provides the test results that compare the ADL5724
using a differential vs. a single-ended output. When using the
device as a single-ended output, use the RFOP output on the
evaluation board and terminate RFON to 50 Ω. Note that the
converse can be done as well; however, doing so produces
slightly different results from the plots shown in this section
because there is some amplitude imbalance between the two
differential ports, RFOP and RFON. The output trace and
connector loss were not deembedded for these measurements.
INPUT IP3 (dBm)
5
Figure 14. Gain vs. Frequency
–40
12.7
13.0
13.3
13.6
13.9
14.2
14.5
14.8
FREQUENCY (GHz)
Figure 17. Input P1dB vs. Frequency
Rev. 0 | Page 9 of 12
ADL5724
Data Sheet
EVALUATION BOARD
The ADL5724-EVALZ comes with an ADL5724 chip. It supports
a single 5 V supply for ease of use. Note that, for 5 V operation,
the 3.3 V and 1.8 V test loops are for evaluation purposes only.
When using a 3.3 V or 1.8 V supply, remove the R1 and R2
resistors from the evaluation board. Figure 19 shows the
ADL5724-EVALZ lab bench setup.
RESULTS
INITIAL SETUP
Figure 18 shows the results of differential output for an input of
12.7 GHz at −15 dBm. The hybrid and board loss were not
deembedded.
Figure 18 shows the expected results when testing the
ADL5724-EVALZ using the Rev. A version of the evaluation
board and its software. Note that future iterations of the software
may produce different results. See the ADL5724 product page
for the most recent software version.
To set up the ADL5724-EVALZ, take the following steps:
4.
RESOLUTION BANDWIDTH = 20kHz
VIDEO BANDWIDTH = 20kHz
10 SWEEP = 301ms (1001pts)
1
0
–10
–20
–30
–40
–50
–60
See Figure 19 for the ADL5724-EVALZ lab bench setup.
–70
–80
12.65 12.66 12.67 12.68 12.69 12.70 12.71 12.72 12.73 12.74 12.75
FREQUENCY (GHz)
Figure 18. Test Results at 12.7 GHz
+5V DC
GND
RFON
SPECTRUM
ANALYZER
INPUT
RFOP
RF FREQUENCY GENERATOR
180° HYBRID FOR DIFFERENTIAL
TO SINGLE ENDED OUTPUT
Figure 19. ADL5724-EVALZ Lab Bench Setup
Rev. 0 | Page 10 of 12
14317-013
3.
20
14317-014
2.
Power up the ADL5724-EVALZ with a 5 V dc supply. The
supply current of the evaluation board is approximately
114 mA, which is a combination of the VCC1 (1.8 V) and
the VCC2 (3.3 V) currents.
Connect the signal generator to the input of theADL5724EVALZ.
Connect RFOP and RFON to a 180° hybrid that works
within the 12.7 GHz to 15.4 GHz frequency range.
Connect the difference output of the hybrid to the
spectrum analyzer. The sum port of the hybrid must be
terminated to 50 Ω.
POWER OUTPUT (dBm)
1.
Data Sheet
ADL5724
BASIC CONNECTIONS FOR OPERATION
Figure 20 shows the basic connections for operating the ADL5724 as it is implemented on the evaluation board of the device.
1.8V
3.3V
C5
0.1UF
C1
4.7NF
C2
33PF
C3
33PF
C4
4.7NF
AGND
AGND
AGND
AGND
AGND
C6
0.1UF
AGND
OUTN
DUTA
RFIN
1
1 VCC1
2
GND
3
INPT
4 RBIAS
RFIN
25-146-1000-92
CNSRI2516100092_SW109201A5 2 3 4
AGND
RBIAS
442
AGND
VCC2
OUTN
OUTP
DNC
8
7
6
5
1
572X_RFON
25-146-1000-92
4 3 2 CNSRI2516100092_SW109201A5
AGND
PAD
PAD ADL5724
OUTP
AGND
1.8V
AGND
572X_RFOP
25-146-1000-92
4 3 2 CNSRI2516100092_SW109201A5
AGND
R4
10K
DNI
R3
1
1
5V
RED
1
3P3V
RED
1
1P8V
RED
1
GND
BLK
P1
1
2
0
5V
3.3V
1.8V
AGND
69157-102HLF
AGND
U1
U2
ADM7170ACPZ-1.8
R1
0
C7
4.7UF
1
2
VOUT
VOUT
AGND
VIN
VIN
EN
SS
SENSE
EP GND
PAD 6
AGND
ADM7172ACPZ-3.3
5V
8
7
5
4
3
C9
4.7UF
AGND
C8
1000PF
AGND
3.3V
R2
0
C10
4.7UF
1
2
VOUT1
VOUT2
VIN1
VIN2
EN
SS
SENSE
AGND
EP
5V
8
7
5
4
3
GND
PAD 6
AGND
C12
4.7UF
AGND
C11
1000PF
AGND
14317-015
1.8V
Figure 20. Evaluation Board Schematic
Table 6. Evaluation Board Configuration Options
Component
3P3V, 1P8V, GND, 5V
RFIN, 572X_RFOP, 572x_RFON
RBIAS
R1,R2
R3
R4
C1 to C12
Function
Power supplies and ground.
Input, output, and data.
442 Ω for RBIAS.
1.8 V and 3.3 V regulator connections.
Do not install (DNI).
Pull-up or pull-down resistor.
The capacitors provide the required decoupling of the supply
related pins.
P1
U1
U2
DUTA
Jumper to change bands, 2-pin jumper.
ADM7170ACPZ-1.8 1.8 V regulator.
ADM7172ACPZ-3.3 3.3 V regulator.
ADL5724 device under test (DUT).
Rev. 0 | Page 11 of 12
Default Condition
Not applicable
Not applicable
R1 = 442 Ω (0402)
R2 = 0 Ω (0402)
R3 = DNI (0402)
R4 = 10 kΩ (0402)
C1, C4 = 4.7 nF (0402),
C2, C3 = 33 pF (0402),
C5, C6 = 0.1 µF (0402),
C7, C9, C10, C12 = 4.7 µF (0603),
C8,C11 = 1000 pF (0603)
Not applicable
Not applicable
Not applicable
Not applicable
ADL5724
Data Sheet
OUTLINE DIMENSIONS
1.70
1.60
1.50
2.10
2.00 SQ
1.90
0.50 BSC
8
5
1.10
1.00
0.90
EXPOSED
PAD
0.425
0.350
0.275
1
4
TOP VIEW
0.60
0.55
0.50
BOTTOM VIEW
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.25
0.20
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
01-14-2013-C
PIN 1 INDEX
AREA
0.15 REF
Figure 21. 8-Lead Lead Frame Chip Scale Package [LFCSP]
2.00 mm × 2.00 mm Body, and 0.55 mm Package Height
(CP-8-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADL5724ACPZN-R7
ADL5724-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Z = RoHS-Compliant Part.
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14317-0-4/16(0)
Rev. 0 | Page 12 of 12
Package Option
CP-8-10