MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS M/A-COM Products Rev. V5 Features • • • • • • • • Surface Mount No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant Description This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Applications These packageless devices are suitable for moderate incident power applications, ≤ 10W/C.W. or where the peak power is ≤ 50W, pulse width is ≤ 1μS, and duty cycle is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts. Absolute Maximum Ratings1@ TAMB = +25°C (unless otherwise specified) Parameter Absolute Maximum MADP-042…-13060 305 405 505 905 C.W. Incident Power dBm 40 44 43 35 Forward Current 250 mA Reverse Voltage -80 V Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C Mounting Temperature +280°C for 10 seconds G D DIM E F INCHES MM MIN MAX MIN MAX A 0.040 0.042 1.025 1.075 B 0.021 0.023 0.525 0.575 C 0.004 0.008 0.102 0.203 D 0.013 0.015 0.325 0.375 E 0.011 0.013 0.275 0.325 F 0.013 0.015 0.325 0.375 G 0.019 0.021 0.475 0.525 Notes: 1. Backside metal: 0.1 μM thick. 2. Yellow hatched areas indicate backside ohmic gold contacts. 3. All devices have the same outline dimensions ( A to G). 1. Exceeding these limits may cause permanent damage. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS M/A-COM Products Rev. V5 Electrical Specifications @ TAMB = + 25 °C Parameter Symbol Conditions Units Min Typ Max MADP-042305-13060 Min Typ Max MADP-042505-13060 Capacitance Capacitance Capacitance Capacitance Resistance Resistance Forward Voltage CT1,3 CT1,3 CT1,3 CT1,3 RS2,3 RS2,3 VF - 10V, 1 MHz 1 - 10 V, 1 GHz 1,3 - 40 V, 1 MHz 1 - 40 V, 1 GHz 1,3 + 20 mA, 1 GHz 2,3 + 50 mA, 1 GHz 2,3 + 10 mA pF pF pF pF W W V 0.14 0.15 0.13 0.14 1.32 1.18 0.87 0.28 0.28 0.27 0.27 0.83 0.76 0.84 Reverse Leakage Current IR -80V uA Input Third Order Intercept Point IIP3 F 1= 1000 MHz F2 = 1010 MHz Input Power = +20 dBm I bias = + 20 mA dBm 72 76 C.W. Thermal Resistance θ °C/W 145 115 Lifetime TL nS 180 210 Parameter Symbol +10 mA / -6 mA ( 50% - 90% V ) Conditions Units 0.22 0.22 1.00 10 Min Typ Max MADP-042405-13060 1. 2. 3. 4. 1,3 Capacitance CT Capacitance CT1,3 Capacitance 0.40 1.00 10 Min Typ Max MADP-042905-13060 - 10 V, 1 MHz 1 pF 0.61 - 10 V, 1 GHz 1,3 pF 0.61 CT1,3 - 40 V, 1 MHz 1 pF 0.57 Capacitance CT1,3 - 40 V, 1 GHz 1,3 pF 0.58 0.06 Resistance RS2,3 + 20 mA, 1 GHz 2,3 W 0.62 3.14 Resistance RS2,3 + 50 mA, 1 GHz 2,3 W 0.58 Forward Voltage VF + 10 mA V 0.82 Reverse Leakage Current IR -80V uA Input Third Order Intercept Point IIP3 F 1= 1000 MHz F2 = 1010 MHz Input Power = +20 dBm I bias = + 20 mA dBm 80 65 C.W. Thermal Resistance θ4 °C/W 100 185 Lifetime TL nS 255 140 +10 mA / -6 mA ( 50% - 90% V ) 0.75 0.40 0.06 0.18 0.06 0.75 0.06 0.18 2.60 1.00 0.93 10 1.00 10 Total capacitance, CT, is equivalent to the sum of junction capacitance ,CJ , and parasitic capacitance, Cpar. Series resistance RS is equivalent to the total diode resistance : RS = RJ ( Junction Resistance) + RC ( Ohmic Resistance) RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package. Theta (θ) is measured with the die mounted in an ODS-1134 package. Specifications Subject to Change Without Notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS M/A-COM Products Rev. V5 Typical Performance @ TAMB = +25 °C Ct vs. V Ct @ 1GHz Rs vs. I Rs @ 1GHz 0.800 10.000 0.700 042405 0.600 042905 Rs (ohm) Ct (pF) 0.500 0.400 0.300 042505 0.200 042305 0.100 042905 042305 042505 1.000 042405 0.000 0 5 10 15 20 25 30 35 0.100 0.001 40 0.010 Bias (V) Ct vs. F Ct @ 10V 0.700 042405 042405 0.600 0.600 0.500 0.500 0.400 Ct (pF) Ct (pF) Ct vs. F Ct @ 40V 0.700 042505 0.300 0.200 0.400 042505 0.300 0.200 042305 042305 0.100 0.100 042905 042905 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 0.000 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) Freq (Hz) Rs @ 10mA Rs vs. F Rs @ 20mA 4.50E+00 Rs vs. F 4.00E+00 042905 4.00E+00 042905 3.50E+00 3.50E+00 3.00E+00 2.50E+00 2.00E+00 042305 1.50E+00 042505 1.00E+00 5.00E-01 042405 0.00E+00 Rs (ohm) 3.00E+00 Rs (ohm) 0.100 Bias (A) 2.50E+00 2.00E+00 042305 1.50E+00 042505 1.00E+00 5.00E-01 042405 0.00E+00 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+ 00 08 08 08 08 09 09 09 09 09 Freq (Hz) Freq (Hz) ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS M/A-COM Products Rev. V5 Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature. Typically 1 hour at 150°C. When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of 60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in Application Note M538 , “Surface Mounting Instructions“ and can viewed on the MA-COM website @ www.macom.com Ordering Information The MADP-042XX5-13060 series of surmounts may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM website @ www.macom.com. Part Number Tape and Reel Tape and Reel Surf Tape Pocket Tape MADP-042305-13060G MADP-042305-13060T MADP-042305-13060P MADP-042405-13060G MADP-042405-13060T MADP-042405-13060P MADP-042505-13060G MADP-042505-13060T MADP-042505-13060P MADP-042905-13060G MADP-042905-13060T MADP-042905-13060P Gel Pack ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice.