Freescale Semiconductor Technical Data MPX5700 Rev 8, 01/2007 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5700 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPX5700 SERIES INTEGRATED PRESSURE SENSOR 0 to 700 kPa (0 to 101.5 psi) 15 to 700 kPa (2.18 to 101.5 psi) 0.2 to 4.7 V OUTPUT Features • • • • • 2.5% Maximum Error over 0° to 85°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Available in Absolute, Differential and Gauge Configurations Patented Silicon Shear Stress Strain Gauge Durable Epoxy Unibody Element MPX5700D CASE 867-08 ORDERING INFORMATION Device Type Case Type Options MPX Series Order Number Device Marking Basic Element Differential 867 MPX5700D MPX5700D Absolute 867 MPX5700A MPX5700A Ported Elements Differential Dual Ports 867C MPX5700DP MPX5700DP Gauge 867B MPX5700GP MPX5700GP Gauge, Axial 867E MPX5700GS MPX5700D Absolute 867B MPX5700AP MPX5700AP Absolute, Axial 867E MPX5700AS MPX5700A Absolute, Axial PC Mount 867F MPX5700ASX MPX5700A MPX5700AP CASE 867B-04 MPX5700DP CASE 867C-05 MPX5700AS CASE 867E-03 VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 4, 5, and 6 are no connects Figure 1. Fully Integrated Pressure Sensor Schematic © Freescale Semiconductor, Inc., 2007. All rights reserved. MPX5700ASX CASE 867F-03 PIN NUMBERS 1 Vout 4 N/C 2 GND 5 N/C 3 VS 6 N/C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Table 1. Maximum Ratings(1) Parametrics Symbol Value Unit (P2 ≤ 1 Atmosphere) P1max 2800 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C (2) Maximum Pressure 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Pressure Range(1) Gauge, Differential: MPX5700D Absolute: MPX5700A Supply Voltage(2) Supply Current Zero Pressure Offset(3) Gauge, Differential (0 to 85°C) Absolute (0 to 85°C) Symbol Min Typ Max Unit POP 0 15 — — 700 700 kPa VS 4.75 5.0 5.25 Vdc IO — 7.0 10 mAdc Voff 0.088 0.184 0.2 — 0.313 0.409 Vdc Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc Accuracy(6) (0 to 85°C) — — — ±2.5 %VFSS V/P — 6.4 —- mV/kPa Sensitivity (7) tR — 1.0 —- ms Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc Warm-Up Time(8) — — 20 —- ms Response Time 1. 2. 3. 4. 5. 1.0 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. Table 3. Mechanical Characteristics Characteristics Weight, Basic Element (Case 867) Typ Unit 4.0 grams MPX5700 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. (For use of the MPX5700D in a high-pressure cyclic application, consult the factory.) The MPX5700 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor 5.0 Transfer Function: Vout = VS*(0.0012858*P+0.04) ± Error VS = 5.0 Vdc Temperature = 0 to 85°C 4.5 4.0 3.5 Output (V) performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Typical 3.0 2.5 Maximum 2.0 Minimum 1.5 1.0 0.5 0 0 100 200 500 400 300 Differential Pressure (kPa) 700 600 800 Figure 2. Output versus Pressure Differential Fluoro Silicone Die Coat Fluoro Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Lead Frame Lead Frame RTV Die Bond Die P1 Wire Bond P2 Epoxy Case Stainless Steel Metal Cover Epoxy Case DIFFERENTIAL/GAUGE ELEMENT P2 RTV Die Bond ABSOLUTE ELEMENT Figure 3. Cross-Sectional Diagrams (not to scale) +5 V Vout Output Vs IPS 1.0 µF 0.01 µF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPX5700 Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Freescale MPX Part Number MPX5700D, MPX5700A pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 867 Pressure (P1) Side Identifier Stainless Steel Cap MPX5700DP 867C Side with Part Marking MPX5700GP, MPX5700AP 867B Side with Port Attached MPX5700GS, MPX5700AS 867E Side with Port Attached MPX5700ASX 867F Side with Port Attached MPX5700 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). R POSITIVE PRESSURE (P1) M B -AN PIN 1 SEATING PLANE 1 2 3 4 5 DIM A B C D F G J L M N R S L 6 -TG J S F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30˚ NOM 30˚ NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN CASE 867-08 ISSUE N BASIC ELEMENT P 0.25 (0.010) M T Q -A- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N -Q- PORT #2 VACUUM (P2) B PIN 1 1 C SEATING PLANE -T- -TJ 2 3 4 5 K 6 S SEATING PLANE G F D 6 PL 0.13 (0.005) M A M DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX CASE 867C-05 ISSUE F PRESSURE AND VACUUM SIDES PORTED (DP) MPX5700 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G PRESSURE SIDE PORTED (AP, GP) MPX5700 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A C DIM A B C D E F G J K N S V V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 K 4 3 2 1 S J N 5 G F E D 6 PL -T- 0.13 (0.005) M T B M INCHES MILLIMETERS MAX MIN MAX MIN 18.28 0.720 17.53 0.690 6.48 6.22 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.69 0.027 0.033 4.72 4.52 0.178 0.186 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 9.53 8.76 0.375 0.345 7.87 7.62 0.300 0.310 6.10 5.59 0.220 0.240 4.93 4.62 0.194 0.182 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) T Q M 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D PRESSURE SIDE AXIAL PORT (ASX) MPX5700 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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