MSC1210 SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Precision Analog-to-Digital Converter (ADC) with 8051 Microcontroller and Flash Memory FEATURES ANALOG FEATURES D 24 Bits No Missing Codes D 22 Bits Effective Resolution at 10Hz D D D D D D D D D D − Low Noise: 75nV PGA From 1 to 128 Precision On-Chip Voltage Reference 8 Differential/Single-Ended Channels On-Chip Offset/Gain Calibration Offset Drift: 0.1ppm/°C Gain Drift: 0.5ppm/°C On-Chip Temperature Sensor Burnout Sensor Detection Single-Cycle Conversion Selectable Buffer Input Peripheral Features D 34 I/O Pins D Additional 32-Bit Accumulator D Three 16-Bit Timer/Counters D System Timers D Programmable Watchdog Timer D Full-Duplex Dual USARTs D Master/Slave SPI D 16-Bit PWM D Power Management Control D Idle Mode Current < 1mA D Stop Mode Current < 1mA D Programmable Brownout Reset D Programmable Low Voltage Detect D 24 Interrupt Sources D Two Hardware Breakpoints DIGITAL FEATURES GENERAL FEATURES Microcontroller Core D 8051-Compatible D High-Speed Core − 4 Clocks per Instruction Cycle D DC to 33MHz D Single Instruction 121ns D Dual Data Pointer D D D D Memory APPLICATIONS D Up To 32kB Flash Memory D Flash Memory Partitioning D Endurance 1M Erase/Write Cycles, D D D D D D 100 Year Data Retention In-System Serially Programmable External Program/Data Memory (64kB) 1,280 Bytes Data SRAM Flash Memory Security 2kB Boot ROM Programmable Wait State Control D D D D D D D D D D D D Pin-Compatible with MSC1211/12/13/14 Package: TQFP-64 Low Power: 4mW Industrial Temperature Range: −40°C to +125°C Power Supply: 2.7V to 5.25V Industrial Process Control Instrumentation Liquid/Gas Chromatography Blood Analysis Smart Transmitters Portable Instruments Weigh Scales Pressure Transducers Intelligent Sensors Portable Applications DAS Systems Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 2002−2008, Texas Instruments Incorporated ! ! www.ti.com "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 PACKAGE/ORDERING INFORMATION(1) PRODUCT FLASH MEMORY PACKAGE MARKING MSC1210Y2 4k MSC1210Y2 MSC1210Y3 8k MSC1210Y3 MSC1210Y4 16k MSC1210Y4 MSC1210Y5 32k MSC1210Y5 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or refer to our web site at www.ti.com. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS(1) MSC1210Yx UNITS Momentary 100 mA Continuous 10 mA AGND − 0.3 to AVDD + 0.3 V DVDD to DGND −0.3 to +6 V AVDD to AGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V VREF to AGND −0.3 to AVDD + 0.3 V Digital input voltage to DGND −0.3 to DVDD + 0.3 V Digital output voltage to DGND −0.3 to DVDD + 0.3 V Maximum junction temperature 150 °C Operating temperature range −40 to +125 °C Storage temperature range −65 to +150 °C Package power dissipation (TJ Max − TAMBIENT)/qJA W 200 mA Analog Inputs Input current Input voltage Power Supply Output current, all pins Output pin short-circuit Thermal Resistance Junction to ambient (qJA) 10 s High K (2s 2p) 62.9 °C/W Low K (1s) 78.2 °C/W Junction to case (qJC) 13.8 °C/W Continuous Digital Outputs Output current 100 mA I/O source/sink current 100 mA Power pin maximum 300 mA (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. MSC1210YX FAMILY FEATURES FEATURES(1) MSC1210Y2(2) MSC1210Y3(2) MSC1210Y4(2) MSC1210Y5(2) Flash Program Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k Flash Data Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k Internal Scratchpad RAM (Bytes) 256 256 256 256 Internal MOVX RAM (Bytes) 1024 1024 1024 1024 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data Externally Accessible Memory (Bytes) (1) All peripheral features are the same on all devices; the flash memory size is the only difference. (2) The last digit of the part number (N) represents the onboard flash size = (2N)kBytes. 2 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS: AVDD = 5V All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF ≡ (REF IN+) − (REF IN−) = +2.5V, unless otherwise noted. MSC1210Yx PARAMETER CONDITIONS MIN TYP MAX UNITS AVDD + 0.1 V AVDD − 1.5 V Analog Input (AIN0-AIN7, AINCOM) Analog Input Range Buffer OFF AGND − 0.1 Buffer ON AGND + 50mV Full-Scale Input Voltage Range (In+) − (In−) Differential Input Impedance Buffer OFF Input Current Buffer ON Bandwidth ±VREF/PGA MΩ 0.5 nA Fast Settling Filter −3dB 0.469 • fDATA Sinc2 Filter −3dB 0.318 • fDATA Sinc3 Filter −3dB Programmable Gain Amplifier User-Selectable Gain Range Input Capacitance Buffer On Input Leakage Current Multiplexer channel OFF, T = +25°C Burnout Current Sources Buffer On V 7/PGA(5) 0.262 • fDATA 1 128 9 pF 0.5 pA 2 µA ±VREF/(2•PGA) V ±1.5 % of Range 1 ppm/°C Offset DAC Offset DAC Range Offset DAC Monotonicity 8 Offset DAC Gain Error Offset DAC Gain Error Drift Bits System Performance Resolution 24 ENOB Bits See Typical Characteristics Output Noise See Typical Characteristics No Missing Codes Sinc3 Filter, Decimation > 360 Integral Nonlinearity End Point Fit, Differential Input Offset Error After Calibration Offset Drift(1) Before Calibration Gain Error(2) After Calibration Gain Error Drift(1) Before Calibration 24 Bits ±0.0015 % of FSR 7.5 ppm of FS 0.1 ppm of FS/°C 0.002 % 0.5 ppm/°C System Gain Calibration Range 80 120 % of FS System Offset Calibration Range −50 50 % of FS At DC ADC Common-Mode Rejection Normal-Mode Rejection Power-Supply Rejection 115 dB fCM = 60Hz, fDATA = 10Hz 130 dB fCM = 50Hz, fDATA = 50Hz 120 dB fCM = 60Hz, fDATA = 60Hz 120 dB fSIG = 50Hz, fDATA = 50Hz 100 dB fSIG = 60Hz, fDATA = 60Hz 100 dB 88 dB At DC, dB = −20log(∆VOUT/∆VDD)(3) 100 80 (1) Calibration can minimize these errors. The self-gain calibration cannot have a REF IN+ of more than AVDD −1.5V with Buffer ON. To calibrate gain, turn Buffer OFF. ∆VOUT is change in digital result. (4) 9pF switched capacitor at f SAMP clock frequency (see Figure 14). (5) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64). (2) (3) 3 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS: AVDD = 5V (continued) All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF ≡ (REF IN+) − (REF IN−) = +2.5V, unless otherwise noted. MSC1210Yx PARAMETER CONDITIONS MIN TYP MAX UNITS AVDD(2) V Voltage Reference Input Reference Input Range REF IN+, REF IN− VREF VREF ≡ (REF IN+) − (REF IN−) VREF Common-Mode Rejection Input Current(4) AGND 0.1 2.5 AVDD V At DC 130 dB fCM = 60Hz, fDATA = 60Hz 120 dB 3 µA VREF = 2.5V On-Chip Voltage Reference VREFH = 1 at +25°C, ACLK = 1MHz Output Voltage 2.495 VREFH = 0 at +25°C, ACLK = 1MHz 2.5 2.505 V 1.25 V 65 dB Short-Circuit Current Source 8 mA Short-Circuit Current Sink 50 µA Power-Supply Rejection Ratio Short-Circuit Duration Sink or Source Indefinite Drift Output Impedance Sourcing 100µA Startup Time from Power On CREF = 0.1µF Temperature Sensor Voltage T = +25°C Temperature Sensor Coefficient 5 ppm/°C 3 Ω 8 ms 115 mV 375 µV/°C Analog Power-Supply Requirements Analog Power-Supply Voltage Analog Current (IADC + IVREF) Analog Power-Supply Current ADC Current (IADC) VREF Supply Current (IVREF) (1) AVDD 4.75 5.0 4 V PDADC = 1, ALVDIS = 1, DAB = 1 <1 nA PGA = 1, Buffer OFF 200 µA PGA = 128, Buffer OFF 500 µA PGA = 1, Buffer ON 240 µA PGA = 128, Buffer ON 850 µA ADC ON, VREF = 2.5V 250 µA Calibration can minimize these errors. The self-gain calibration cannot have a REF IN+ of more than AVDD −1.5V with Buffer ON. To calibrate gain, turn Buffer OFF. (3) ∆V OUT is change in digital result. (4) 9pF switched capacitor at f SAMP clock frequency (see Figure 14). (5) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64). (2) 5.25 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS: AVDD = 3V All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF ≡ (REF IN+) − (REF IN−) = +1.25V, unless otherwise noted. MSC1210Yx PARAMETER CONDITIONS MIN TYP MAX UNITS ANALOG INPUT (AIN0-AIN7, AINCOM) Analog Input Range Buffer OFF AGND − 0.1 AVDD + 0.1 V Buffer ON AGND + 50mV AVDD − 1.5 V Full-Scale Input Voltage Range (In+) − (In−) Differential Input Impedance Buffer OFF Input Current Buffer ON Bandwidth ±VREF/PGA MΩ 0.5 nA Fast Settling Filter −3dB 0.469 • fDATA Sinc2 Filter −3dB 0.318 • fDATA Sinc3 Filter −3dB Programmable Gain Amplifier User-Selectable Gain Range 0.262 • fDATA 1 Input Capacitance 128 9 Input Leakage Current Multiplexer channel OFF, T = +25°C Burnout Current Sources Sensor Input Open Circuit V 7/PGA(5) pF 0.5 pA 2 µA ±VREF/(2•PGA) V ±1.5 % of Range 1 ppm/°C OFFSET DAC Offset DAC Range Offset DAC Monotonicity 8 Offset DAC Gain Error Offset DAC Gain Error Drift Bits SYSTEM PERFORMANCE Resolution 24 ENOB Bits See Typical Characteristics Output Noise See Typical Characteristics No Missing Codes Sinc3 Filter Integral Nonlinearity End Point Fit, Differential Input Offset Error After Calibration 7.5 ppm of FS Offset Drift(1) Before Calibration 0.1 ppm of FS/°C Gain Error(2) After Calibration Gain Error Drift(1) Before Calibration 24 Bits ±0.0015 % of FSR 0.005 % 0.5 ppm/°C System Gain Calibration Range 80 120 % of FS System Offset Calibration Range −50 50 % of FS At DC ADC Common-Mode Rejection Normal-Mode Rejection Power-Supply Rejection (1) (2) (3) (4) (5) 100 115 dB fCM = 60Hz, fDATA = 10Hz 130 dB fCM = 50Hz, fDATA = 50Hz 120 dB fCM = 60Hz, fDATA = 60Hz 120 dB fSIG = 50Hz, fDATA = 50Hz 100 dB fSIG = 60Hz, fDATA = 60Hz 100 dB At DC, dB = −20log(∆VOUT/∆VDD)(3) 85 dB Calibration can minimize these errors. The self-gain calibration cannot have a REF IN+ of more than AVDD −1.5V with Buffer ON. To calibrate gain, turn Buffer OFF. ∆VOUT is change in digital result. 9pF switched capacitor at fSAMP clock frequency (see Figure 14). The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64). 5 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS: AVDD = 3V (continued) All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF ≡ (REF IN+) − (REF IN−) = +1.25V, unless otherwise noted. MSC1210Yx PARAMETER CONDITIONS MIN TYP MAX UNITS AVDD(2) V AVDD V VOLTAGE REFERENCE INPUT Reference Input Range REF IN+, REF IN− VREF VREF ≡ (REF IN+) − (REF IN−) VREF Common-Mode Rejection Input Current(4) AGND 0.1 1.25 At DC 130 dB fCM = 60Hz, fDATA = 60Hz 120 dB VREF = 1.25V 1.5 µA ON-CHIP VOLTAGE REFERENCE Output Voltage VREFH = 0 at +25°C, ACLK = 1MHz 1.245 1.25 1.255 V Power-Supply Rejection Ratio 65 dB Short-Circuit Current Source 8 mA 50 µA Short-Circuit Current Sink Short-Circuit Duration Sink or Source Indefinite Drift 5 ppm/°C Output Impedance Sourcing 100µA 3 Ω Startup Time from Power OFF CREF = 0.1µF 8 ms Temperature Sensor Voltage T = +25°C Temperature Sensor Coefficient 115 mV 375 µV/°C ANALOG POWER-SUPPLY REQUIREMENTS Analog Power-Supply Voltage Analog Current (IADC + IVREF) Analog Power-Supply Current ADC Current (IADC) VREF Supply Current (IVREF) (1) AVDD 2.7 3.6 PDADC = 1, ALVDIS = 1, DAB = 1 <1 nA PGA = 1, Buffer OFF 200 µA PGA = 128, Buffer OFF 500 µA PGA = 1, Buffer ON 240 µA PGA = 128, Buffer ON 850 µA ADC ON, , VREF = 1.25V 240 µA Calibration can minimize these errors. The self-gain calibration cannot have a REF IN+ of more than AVDD −1.5V with Buffer ON. To calibrate gain, turn Buffer OFF. ∆VOUT is change in digital result. (4) 9pF switched capacitor at f SAMP clock frequency (see Figure 14). (5) The input impedance for PGA = 128 is the same as that for PGA = 64 (that is, 7MΩ/64). (2) (3) 6 V "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 DIGITAL CHARACTERISTICS: DVDD = 2.7V to 5.25V All specifications from TMIN to TMAX, fOSC = 1MHz, unless otherwise specified. MSC1210Yx PARAMETER CONDITIONS MIN TYP MAX 2.7 UNITS DIGITAL POWER-SUPPLY REQUIREMENTS Digital Power-Supply Voltage DVDD 3.0 3.6 V Normal Mode, fOSC = 1MHz 1.4 1.6 mA Normal Mode, fOSC = 8MHz 8 9 mA Stop Mode(1) Digital Power-Supply Current DVDD µA 0.5 4.75 5.0 5.25 V 2 2.2 mA Normal Mode, fOSC = 8MHz 17 18 mA Stop Mode(1) 0.5 Normal Mode, fOSC = 1MHz µA DIGITAL INPUT/OUTPUT (CMOS) Logic Level VIH (except XIN pin) 0.6 • DVDD DVDD V VIL (except XIN pin) DGND 0.2 • DVDD V I/O Pin Hysteresis Ports 0−3, Input Leakage Current, Input Mode VIH = DVDD or VIH = 0V Pins EA, XIN Input Leakage Current VOL, ALE, PSEN, Ports 0−3, All Output Modes VOH, ALE, PSEN, Ports 0−3, Strong Drive Output IOL = 1mA pA <1 pA IOH = 1mA 0.4 1.5 DVDD − 0.4 IOH = 30mA Flash Programming Mode Only Pin RST, Pull-Down Resistor (1) mV <1 DGND IOL = 30mA Ports 0−3, Pull-Up Resistors Pins ALE, PSEN, Pull-Up Resistors 700 DVDD − 0.1 V V DVDD V DVDD − 1.5 V 9 kΩ 9 kΩ 500 kΩ Digital Brownout Detect disabled (HCR1.2 = 1), Low Voltage Detect disabled (LVDCON.3 =1). Ports configured for CMOS output low. If in External Oscillation mode, the oscillator must be disabled. FLASH MEMORY CHARACTERISTICS: DVDD = 2.7V to 5.25V MSC1210Yx PARAMETER CONDITIONS Flash Memory Endurance Flash Memory Data Retention MIN TYP 100,000 1,000,000 Set with FER in FTCON 10 Flash Memory Write Time Set with FWR in FTCON 30 UNITS cycles 100 Mass and Page Erase Time Flash Programming Current MAX years ms 40 µs DVDD = 3.0V 10 mA DVDD = 5.0V 25 mA 7 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 AC ELECTRICAL CHARACTERISTICS(1)(2): DVDD = 2.7V to 5.25V 2.7V to 3.6V SYMBOL 4.75V to 5.25V PARAMETER MIN MAX MIN MAX UNITS External Crystal Frequency (fOSC) External Clock Frequency (fOSC) External Ceramic Resonator Frequency (fOSC) 1 0 1 18 18 16 1 0 1 33 33 16 MHz MHz MHz FIGURE System Clock 1/tCLK(4) 4 Program Memory tLHLL 1 ALE Pulse Width 1.5tCLK − 5 1.5tCLK − 5 ns tAVLL 1 Address Valid to ALE LOW 0.5tCLK − 10 0.5tCLK − 7 ns tLLAX 1 Address Hold After ALE LOW 0.5tCLK 0.5tCLK tLLIV 1 ALE LOW to Valid Instruction In tLLPL 1 ALE LOW to PSEN LOW 0.5tCLK 0.5tCLK tPLPH 1 PSEN Pulse Width 2tCLK − 5 2tCLK − 5 tPLIV 1 PSEN LOW to Valid Instruction in tPXIX 1 Input Instruction Hold After PSEN tPXIZ 1 Input Instruction Float After PSEN tCLK − 5 tCLK ns tAVIV 1 Address to Valid Instruction In 3tCLK − 40 3tCLK − 25 ns tPLAZ 1 PSEN LOW to Address Float 0 0 ns tRLRH 2 RD Pulse Width (tMCS = 0)(5) RD Pulse Width (tMCS > 0)(5) 2tCLK − 5 tMCS − 5 2tCLK − 5 tMCS − 5 ns ns tWLWH 3 WR Pulse Width (tMCS = 0)(5) WR Pulse Width (tMCS > 0)(5) 2tCLK − 5 tMCS − 5 2tCLK − 5 tMCS − 5 ns ns tRLDV 2 RD LOW to Valid Data In (tMCS = 0)(5) RD LOW to Valid Data In (tMCS > 0)(5) tRHDX 2 Data Hold After Read tRHDZ 2 Data Float After Read (tMCS = 0)(5) Data Float After Read (tMCS > 0)(5) tCLK 2tCLK tCLK 2tCLK ns ns tLLDV 2 ALE LOW to Valid Data In (tMCS = 0)(5) ALE LOW to Valid Data In (tMCS > 0)(5) 2.5tCLK − 40 tCLK + tMCS − 40 2.5tCLK − 25 tCLK + tMCS − 25 ns ns tAVDV 2 Address to Valid Data In (tMCS = 0)(5) Address to Valid Data In (tMCS > 0)(5) 3tCLK − 40 3tCLK − 25 1.5tCLK + tMCS − 40 1.5tCLK + tMCS − 25 ns ns tLLWL 2, 3 ALE LOW to RD or WR LOW (tMCS = 0)(5) ALE LOW to RD or WR LOW (tMCS > 0)(5) 0.5tCLK − 5 tCLK − 5 0.5tCLK + 5 tCLK + 5 ns ns tAVWL 2, 3 Address to RD or WR LOW (tMCS = 0)(5) Address to RD or WR LOW (tMCS > 0)(5) tCLK − 5 2tCLK − 5 tQVWX 3 Data Valid to WR Transition tWHQX 3 Data Hold After WR tRLAZ 2 RD LOW to Address Float 2, 3 RD or WR HIGH to ALE HIGH (tMCS = 0)(5) RD or WR HIGH to ALE HIGH (tMCS > 0)(5) −5 tCLK − 5 tHIGH 4 HIGH Time(3) 15 10 tLOW 4 LOW Time(3) 15 10 tR tF 4 Rise Time(3) 5 5 ns 4 Fall Time(3) 5 5 ns 2.5tCLK − 35 2tCLK − 40 5 ns 2.5tCLK − 25 ns ns ns 2tCLK − 30 −5 ns ns Data Memory tWHLH 2tCLK − 40 tMCS − 40 −5 2tCLK − 30 tMCS − 30 −5 0.5tCLK + 5 tCLK + 5 0.5tCLK − 5 tCLK − 5 ns ns ns tCLK − 5 2tCLK − 5 ns ns −8 −5 ns tCLK − 8 tCLK − 5 −0.5tCLK − 5 5 tCLK + 5 ns −0.5tCLK − 5 ns 5 ns ns −5 tCLK − 5 tCLK + 5 External Clock (1) (2) (3) (4) (5) 8 Parameters are valid over operating temperature range, unless otherwise specified. Load capacitance for Port 0, ALE, and PSEN = 100pF; load capacitance for all other outputs = 80pF. These values are characterized but not 100% production tested. In the MSC1210, fOSC = fCLK. tCLK = 1/fosc = one oscillator clock period. tMCS is a time period related to the Stretch MOVX selection. The following table shows the value of tMCS for each stretch selection: MD2 MD1 MD0 MOVX DURATION 0 0 0 2 Machine Cycles tMCS 0 0 0 1 3 Machine Cycles (default) 4tCLK 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 4 Machine Cycles 5 Machine Cycles 6 Machine Cycles 7 Machine Cycles 8 Machine Cycles 9 Machine Cycles 8tCLK 12tCLK 16tCLK 20tCLK 24tCLK 28tCLK ns ns "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 EXPLANATION OF THE AC SYMBOLS Each Timing Symbol has five characters. The first character is always ‘t’ (= time). The other characters, depending on their positions, indicate the name of a signal or the logical status of that signal. The designators are: RRD Signal AAddress CClock tTime DInput Data VValid HLogic Level HIGH WWR Signal IInstruction (program memory contents) XNo Longer a Valid Logic Level LLogic Level LOW, or ALE ZFloat PPSEN Examples: (1) tAVLL = Time for address valid to ALE LOW. QOutput Data (2) tLLPL = Time for ALE LOW to PSEN LOW. tLHLL ALE tAVLL t PLPH tLLPL tLLIV tPLIV PSEN tPXIZ t LLAX tPLAZ A0−A7 PORT 0 tPXIX INSTR IN A0−A7 tAVIV A8−A15 PORT 2 A8−A15 Figure 1. External Program Memory Read Cycle ALE tWHLH PSEN tLLDV tLLWL tRLRH RD tAVLL t LLAX tRLAZ PORT 0 tRHDZ tRLDV A0−A7 from RI or DPL t RHDX DATA IN A0−A7from PCL INSTR IN t AVWL tAVDV PORT 2 P2.0−P2.7 or A8−A15 from DPH A8−A15 from PCH Figure 2. External Data Memory Read Cycle 9 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ALE tWHLH PSEN tLLWL tWLWH WR tAVLL tLLAX tQ V W X tWHQX t DW PORT 0 A0−A7 from RI or DPL DATA OUT A0−A7 from PCL tAVWL PORT 2 P2.0−P2.7or A8−A15 from DPH A 8−A15 from PCH Figure 3. External Data Memory Write Cycle t HIGH VIH1 0.8V tf tr VIH1 0.8V VIH1 tLOW VIH1 0.8V t CLK Figure 4. External Clock Drive CLK 10 0.8V INSTR IN "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 RESET AND POWER-ON TIMING tRW RST tRRD tRFD tRRD tRFD PSEN ALE t RS tRH EA NOTE: PSEN and ALE are internally pulled up with ~9kΩ during RST high. Figure 5. Reset Timing tRW RST tRFD tRRD PSEN tRS tRRD tRH ALE NOTE: PSEN and ALE are internally pulled up with ~9kΩ during RST high. Figure 6. Parallel Flash Programming Power-On Timing (EA is ignored) tRW RST tRRD tRS tRH PSEN t RFD t RRD ALE NOTE: PSEN and ALE are internally pulled up with ~9kΩ during RST high. Figure 7. Serial Flash Programming Power-On Timing (EA is ignored) SYMBOL PARAMETER MIN MAX 2tOSC — ns RST rise to PSEN ALE internal pull HIGH — 5 µs tRFD RST falling to PSEN and ALE start — (217 + 512)tOSC ns tRS Input signal to RST falling setup time tOSC — ns tRH RST falling to input signal hold time (217 + 512)tOSC — ns tRW RST width tRRD UNIT 11 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 PIN ASSIGNMENTS P0.3/AD3 P0.4/AD4 P0.5/AD5 58 P0.2/AD2 59 P0.1/AD1 P1.2/RxD1 60 P0.0/AD0 P1.3/TxD1 61 P1.0/T2 P1.4/INT2/SS 62 P1.1/T2EX P1.5/INT3/MOSI 63 DGND P1.6/INT4/MISO 64 DVDD P1.7/INT5/SCLK PAG PACKAGE TQFP-64 (TOP VIEW) 57 56 55 54 53 52 51 50 49 XOUT 1 48 EA XIN 2 47 P0.6/AD6 P3.0/RxD0 3 46 P0.7/AD7 P3.1/TxD0 4 45 ALE P3.2/INT0 5 44 PSEN/OSCCLK/MODCLK P3.3/INT1/TONE/PWM 6 43 P2.7/A15 P3.4/T0 7 42 DV DD P3.5/T1 8 P3.6/WR 9 41 DGND MSC1210 40 P2.6/A14 P3.7/RD 10 39 P2.5/A13 DV DD 11 38 P2.4/A12 DGND 12 37 P2.3/A11 20 21 22 23 24 25 26 27 28 29 30 31 32 AIN7/EXTA AINCOM AGND AVDD REF IN− REF IN+ REF OUT NC(1) 19 AIN5 18 AIN6/EXTD 17 AIN4 33 NC (1) AIN3 34 P2.0/A08 NC(1) 16 AIN2 DV DD 15 AIN1 35 P2.1/A09 AIN0 36 P2.2/A10 AGND RST 13 DV DD 14 NOTE: (1) NC pin must be left unconnected. 12 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 PIN DESCRIPTIONS PIN # NAME 1 XOUT 2 XIN 3−10 P3.0–P3.7 DESCRIPTION The crystal oscillator pin XOUT supports parallel resonant AT cut fundamental frequency crystals and ceramic resonators. XOUT serves as the output of the crystal amplifier. The crystal oscillator pin XIN supports parallel resonant AT cut fundamental frequency crystals and ceramic resonators. XIN can also be an input if there is an external clock source instead of a crystal. Port 3 is a bidirectional I/O port. The alternate functions for Port 3 are listed below. PORT 3.x Alternate Name(s) Alternate Use P3.0 RxD0 Serial port 0 input P3.1 TxD0 Serial port 0 output P3.2 INT0 External interrupt 0 P3.3 INT1/TONE/PWM External interrupt 1/TONE/PWM output P3.4 T0 Timer 0 external input P3.5 T1 Timer 1 external input P3.6 WR External data memory write strobe P3.7 RD External data memory read strobe 11, 14, 15, 42, 58 DVDD Digital power supply 12, 41, 57 DGND Digital ground 13 RST A HIGH on the reset input for two tOSC periods resets the device. 16, 32, 33 NC No connection. This pin must be left unconnected. 17, 27 AGND 18 AIN0 Analog input channel 0 19 AIN1 Analog input channel 1 20 AIN2 Analog input channel 2 21 AIN3 Analog input channel 3 22 AIN4 Analog input channel 4 23 AIN5 Analog input channel 5 24 AIN6, EXTD Analog input channel 6, digital low-voltage detect input, generates DLVD interrupt 25 AIN7, EXTA Analog input channel 7, analog low-voltage detect input, generates ALVD interrupt 26 AINCOM 28 AVDD Analog ground Analog common for single-ended inputs or analog input for differential inputs Analog power supply. AVDD must rise above 2.0V to disable Analog Brownout Reset function. 29 REF IN– Voltage reference negative input (must be tied to AGND for internal VREF) 30 REF IN+ Voltage reference positive input 31 REF OUT Internal voltage reference output (tie to REF IN+ for internal VREF use) 34−40, 43 P2.0−P2.7 Port 2 is a bidirectional I/O port. The alternate functions for Port 2 are listed below. Refer to P2DDR, SFR B1h−B2h. PORT 2.x Alternate Name Alternate Use P2.0 A8 Address bit 8 P2.1 A9 Address bit 9 P2.2 A10 Address bit 10 P2.3 A11 Address bit 11 P2.4 A12 Address bit 12 P2.5 A13 Address bit 13 P2.6 A14 Address bit 14 P2.7 A15 Address bit 15 13 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 PIN DESCRIPTIONS (continued) PIN # NAME DESCRIPTION 44 PSEN, OSCCLK, MODCLK Program store enable. Connected to optional external memory as a chip enable. PSEN provides an active low pulse. In programming mode, PSEN is used as an input along with ALE to define serial or parallel programming mode. PSEN is held HIGH for parallel programming mode and LOW for serial programming. This pin can also be selected (when not using external memory) to output the oscillator clock, modulator clock, HIGH, or LOW. Care should be taken so that loading on this pin does not inadvertently cause the device to enter programming mode. ALE PSEN Program Mode Selection(1) NC or DVDD NC or DVDD Normal operation (User Application mode) 0 NC or DVDD Parallel programming NC or DVDD 0 Serial programming 0 0 Reserved 45 ALE Address Latch Enable: Used for latching the low byte of the address during an access to external memory. ALE is emitted at a constant rate of 1/4 the oscillator frequency, and can be used for external timing or clocking. One ALE pulse is skipped during each access to external data memory. In programming mode, ALE is used as an input along with PSEN to define serial or parallel programming mode. ALE is held HIGH for serial programming mode and LOW for parallel programming. This pin can also be selected (when not using external memory) to output HIGH or LOW. Care should be taken so that loading on this pin does not inadvertently cause the device to enter programming mode. 48 EA External Access Enable: EA must be externally held LOW at the end of RESET to enable the device to fetch code from external program memory locations starting with 0000h. No internal pull-up on this pin. 46, 47, 49−54 P0.0−P0.7 55, 56, 59−64 P1.0−P1.7 Port 0 is a bidirectional I/O port. The alternate functions for Port 0 are listed below. Refer to P1DDR, SFR AEh−AFh. PORT 0.x Alternate Name Alternate Use P0.0 AD0 Address/Data bit 0 P0.1 AD1 Address/Data bit 1 P0.2 AD2 Address/Data bit 2 P0.3 AD3 Address/Data bit 3 P0.4 AD4 Address/Data bit 4 P0.5 AD5 Address/Data bit 5 P0.6 AD6 Address/Data bit 6 P0.7 AD7 Address/Data bit 7 Port 0 is a bidirectional I/O port. The alternate functions for Port 0 are listed below. Refer to P1DDR, SFR AEh−AFh. PORT 0.x Alternate Name(s) Alternate Use P1.0 T2 T2 input P1.1 T2EX T2 external input P1.2 RxD1 Serial port input P1.3 TxD1 Serial port output P1.4 INT2/SS External Interrupt / Slave Select P1.5 INT3/MOSI External Interrupt / Master Out−Slave In P1.6 INT4/MISO External Interrupt / Master In−Slave Out P1.7 INT5/SCK External Interrupt / Serial Clock (1) The program mode is changed during the falling edge of the reset signal. 14 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 TYPICAL CHARACTERISTICS AVDD = +5V, DVDD = +5V, fOSC = 8MHz, PGA = 1, fMOD = 15.625Hz, Bipolar, Buffer ON, and VREF = (REF IN+) − (REF IN−) = +2.5V, unless otherwise specified. EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO 22 23 22 21 20 19 18 17 16 15 14 13 12 11 10 PGA8 19 PGA128 18 PGA16 17 PGA32 PGA64 PGA128 16 15 14 Sinc3 Filter, Buffer OFF Sinc3 Filter, Buffer OFF 13 12 10 100 Data Rate (SPS) 0 1000 22 1000 1500 2000 fMOD fDATA EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO 22 PGA8 PGA4 PGA2 21 500 Decimation Ratio = EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO PGA2 PGA1 PGA8 PGA4 21 PGA1 20 20 19 19 ENOB (rms) ENOB (rms) PGA4 20 PGA32 PGA64 1 18 17 PGA128 PGA64 PGA32 16 PGA16 15 18 17 PGA16 PGA32 PGA128 PGA64 16 15 14 14 Sinc3 Filter, Buffer ON 13 AVDD = 3V, Sinc3 Filter, VREF = 1.25V, Buffer OFF 13 12 12 0 500 1000 1500 Decimation Ratio = 2000 0 500 f MOD 1000 1500 Decimation Ratio = fDATA EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO 2000 f MOD fDATA EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO 22 22 PGA2 21 PGA4 PGA2 PGA8 21 PGA1 20 20 19 19 ENOB (rms) ENOB (rms) PGA2 PGA1 21 PGA1 PGA8 ENOB (rms) ENOB (rms) EFFECTIVE NUMBER OF BITS vs DATA RATE 18 17 16 PGA16 15 PGA32 PGA128 PGA64 PGA4 18 17 PGA32 PGA16 PGA64 PGA128 16 15 14 14 AVDD = 3V, Sinc3 Filter, VREF = 1.25V, Buffer ON 13 PGA8 PGA1 Sinc2 Filter 13 12 12 0 500 1000 Decimation Ratio = 1500 fMOD fDATA 2000 0 500 1000 Decimation Ratio = 1500 2000 fMOD fDATA 15 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 TYPICAL CHARACTERISTICS (Continued) AVDD = +5V, DVDD = +5V, fOSC = 8MHz, PGA = 1, fMOD = 15.625Hz, Bipolar, Buffer ON, and VREF = (REF IN+) − (REF IN−) = +2.5V, unless otherwise specified. FAST SETTLING FILTER EFFECTIVE NUMBER OF BITS vs DECIMATION RATIO EFFECTIVE NUMBER OF BITS vs fMOD (set with ACLK) 20 25 19 Gain 1 18 fMOD = 203kHz 20 Gain 16 16 ENOB (rms) ENOB 17 15 14 Gain 128 13 12 fMOD = 15.6kHz f MOD = 110kHz 15 fMOD = 31.25kHz 10 5 fMOD = 62.5kHz 11 10 0 0 500 1500 1000 2000 1 10 100 1k Data Rate (SPS) 10k 100k 1.5 2.5 Decimation Value EFFECTIVE NUMBER OF BITS vs fMOD (set with ACLK) WITH FIXED DECIMATION 25 NOISE vs INPUT SIGNAL 0.8 DEC = 2020 DEC = 500 0.7 DEC = 255 15 Noise (rms, ppm of FS) ENOB (rms) 20 DEC = 50 DEC = 20 10 5 DEC = 10 100 1k Data Rate (SPS) 10k 0.5 0.4 0.3 0.2 0.1 0 −2.5 0 10 0.6 100k −1.5 GAIN vs TEMPERATURE 1.00010 External 21.5 1.00006 Gain (Normalized) 21.0 Internal ENOB (rms) 0.5 VIN (V) EFFECTIVE NUMBER OF BITS vs INPUT SIGNAL (Internal and External VREF) 22.0 −0.5 20.5 20.0 19.5 1.00002 0.99998 0.99994 19.0 0.99990 18.5 18.0 − 2.5 0.99986 − 1.5 − 0.5 0.5 VIN (V) 16 1.5 2.5 −50 −30 −10 10 30 Temperature (°C) 50 70 90 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 TYPICAL CHARACTERISTICS (Continued) AVDD = +5V, DVDD = +5V, fOSC = 8MHz, PGA = 1, fMOD = 15.625Hz, Bipolar, Buffer ON, and VREF = (REF IN+) − (REF IN−) = +2.5V, unless otherwise specified. INTEGRAL NONLINEARITY vs INPUT SIGNAL INTEGRAL NONLINEARITY vs INPUT SIGNAL 10 30 VREF = AVDD, Buffer OFF 8 20 −40_ C 4 2 INL (ppm of FS) INL (ppm of FS) 6 +85_C 0 −2 +25_ C −4 −6 10 0 −10 −20 −8 −10 −2.5 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 −30 2.5 VIN = −VREF 0 VIN (V) ADC INTEGRAL NONLINEARITY vs VREF INL ERROR vs PGA 100 35 Buffer OFF 90 30 80 AVDD = 3V 25 INL (ppm of FS) ADC INL (ppm of FS) VIN = +VREF VIN (V) 20 AVDD = 5V 15 10 70 60 50 40 30 20 5 10 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1 2 4 8 VREF (V) MAXIMUM ANALOG SUPPLY CURRENT 1.6 64 128 ADC CURRENT vs PGA AVDD = 5V, Buffer = ON 800 Buffer = OFF +25_C 700 1.3 1.2 −40_ C 1.1 1.0 0.9 600 IADC (µ A) Analog Supply Current (mA) 1.4 32 900 +85_ C PGA = 128 ADC ON Brownout Detect ON 1.5 16 PGA Setting 500 AVDD = 3V, Buffer = ON 400 Buffer = OFF 300 0.8 200 0.7 100 0.6 0.5 2.5 3.0 3.5 4.0 4.5 Analog Supply Voltage (V) 5.0 5.5 0 0 1 2 4 8 16 32 64 128 PGA Setting 17 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 TYPICAL CHARACTERISTICS (Continued) AVDD = +5V, DVDD = +5V, fOSC = 8MHz, PGA = 1, fMOD = 15.625Hz, Bipolar, Buffer ON, and VREF = (REF IN+) − (REF IN−) = +2.5V, unless otherwise specified. VREFOUT vs LOAD CURRENT 2.510 4000 2.508 3500 2.506 3000 2.504 VREFOUT (V) Number of Occurrences HISTOGRAM OF OUTPUT DATA 4500 2500 2000 1500 2.502 2.500 2.498 2.496 1000 2.494 500 2.492 0 −2 −1.5 −1 −0.5 2.490 0 0.5 1 1.5 2 0 ppm of FS 0.4 0.8 1.2 1.6 2.0 2.4 VREFOUT Current Load (mA) OFFSET DAC: GAIN vs TEMPERATURE OFFSET DAC: OFFSET vs TEMPERATURE 1.00006 10 8 1.00004 4 Normalized Gain Offset (ppm of FSR) 6 2 0 −2 −4 −6 −8 1.00002 1 0.99998 0.99996 −10 −12 0.99994 −40 +25 +85 −40 +25 Temperature (°C) Temperature (°C) DIGITAL CURRENT vs FREQUENCY DIGITAL STOP CURRENT vs FREQUENCY with EXT CLOCK 100 5V All Periph ON 5V All Periph OFF 5V All Periph ON IDLE Digital Current (µA) Supply Current (mA) 100 3V All Periph ON 3V All Periph OFF 3V All Periph ON IDLE 10 1 10 1 0.1 1 10 100 Clock Frequency (MHz) 18 +85 1000 0 10 20 Clock Frequency (MHz) 30 40 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 TYPICAL CHARACTERISTICS (Continued) AVDD = +5V, DVDD = +5V, fOSC = 8MHz, PGA = 1, fMOD = 15.625Hz, Bipolar, Buffer ON, and VREF = (REF IN+) − (REF IN−) = +2.5V, unless otherwise specified. DIGITAL SUPPLY CURRENT vs SUPPLY VOLTAGE NORMALIZED GAIN vs PGA 101 +85°C 100 15 −40°C +25°C Buffer OFF Normalized Gain (%) 10 5 99 98 Buffer ON 97 0 96 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1 4 8 16 32 64 PGA Setting CMOS DIGITAL OUTPUT HISTOGRAM OF TEMPERATURE SENSOR VALUES 5.0 128 200 4.5 3.5 3V Low Output 3.0 Number of Occurrences 5V Low Output 4.0 2.5 2.0 1.5 5V 1.0 0.5 150 100 50 3V 0 117.0 116.5 116.0 115.5 Output Current (mA) 115.0 70 114.5 60 114.0 50 113.5 40 113.0 30 112.5 20 112.0 10 111.0 0 0 Temperature Sensor Value (mV) INTERNAL VREF vs AVDD 5 3 1.25V 1 Internal VREF (V) Output Voltage (V) 2 Supply Voltage (V) 111.5 Digital Supply Current (mA) 20 −1 2.5V −3 −5 −7 −9 −11 −13 −15 2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5 AVDD (V) 19 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 The microcontroller core is 8051 instruction set compatible. The microcontroller core is an optimized 8051 core that executes up to three times faster than the standard 8051 core, given the same clock source. That makes it possible to run the device at a lower external clock frequency and achieve the same performance at lower power than the standard 8051 core. DESCRIPTION The MSC1210Yx is a completely integrated family of mixed-signal devices incorporating a high-resolution delta-sigma ADC, 8-channel multiplexer, burnout current sources, selectable buffered input, offset DAC (digital-to-analog converter), PGA (programmable gain amplifier), temperature sensor, voltage reference, 8-bit microcontroller, Flash Program Memory, Flash Data Memory, and Data SRAM, as shown in Figure 8. The MSC1210Yx allows the user to uniquely configure the Flash and SRAM memory maps to meet the needs of their application. The Flash is programmable down to 2.7V using both serial and parallel programming methods. The Flash endurance is 1 million Erase/Write cycles. In addition, 1280 bytes of RAM are incorporated on-chip. On-chip peripherals include an additional 32-bit accumulator, an SPI-compatible serial port, dual USARTs, multiple digital input/output ports, watchdog timer, low-voltage detect, on-chip power-on reset, 16-bit PWM, and system timers, brownout reset, and three timer/counters. The part has separate analog and digital supplies, which can be independently powered from 2.7V to +5.25V. At +3V operation, the power dissipation for the part is typically less than 4mW. The MSC1210Yx is packaged in a TQFP-64 package. The device accepts low-level differential or single-ended signals directly from a transducer. The ADC provides 24 bits of resolution and 24 bits of no-missing-code performance using a Sinc3 filter with a programmable sample rate. The ADC also has a selectable filter that allows for high-resolution single-cycle conversion. AVDD AGND REF OUT The MSC1210Yx is designed for high-resolution measurement applications in smart transmitters, industrial process control, weigh scales, chromatography, and portable instrumentation. REF IN+ (1) REF IN− DVD D DGND +AVDD LVD VR EF Timers/ Counters EA ALE PSEN BOR Temperature Sensor AIN0 8−Bit PGA Offset WDT REF AIN1 Alternate Functions AIN2 AIN3 AIN4 MUX BUFFER PGA Modulator AIN5 Up to 32K FLASH AIN6 AIN7 AINCOM 1.2K SRAM PORT0 8 ADDR DATA PORT1 8 T2 SPI/EXT USART2 PORT2 8 ADDR PORT3 8 USART1 EXT T0 T1 RW Digital Filter ACC 8051 SFR Clock Generator SPI RST POR AGND XIN XOUT NOTE (1) REF IN− must be tied to AGND when using internal VREF. Figure 8. Block Diagram 20 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ENHANCED 8051 CORE MSC121 Timing Single−Byte, Single−Cycle Instruction ALE PSEN 0 AD0−AD7 PORT 2 4 Cycles CLK 12 Cycles Standard 8051 Timing All instructions in the MSC1210 family perform exactly the same functions as they would in a standard 8051. The effect on bits, flags, and registers is the same. However, the timing is different. The MSC1210 family utilizes an efficient 8051 core which results in an improved instruction execution speed of between 1.5 and 3 times faster than the original core for the same external clock speed (4 clock cycles per instruction versus 12 clock cycles per instruction, as shown in Figure 9). The internal system clock is equal to the external oscillator frequency. This translates into an effective throughput improvement of more than 2.5 times, using the same code and same external clock speed. Therefore, a device frequency of 33MHz for the MSC1210Yx actually performs at an equivalent execution speed of 82.5MHz compared to the standard 8051 core. This allows the user to run the device at slower external clock speeds which reduces system noise and power consumption, but provides greater throughput. This performance difference can be seen in Figure 10. The timing of software loops will be faster with the MSC1210. However, the timer/counter operation of the MSC1210 may be maintained at 12 clocks per increment or optionally run at 4 clocks per increment. ALE PSEN AD0−AD7 PORT 2 Single−Byte, Single−Cycle Instruction Figure 10. Comparison of MSC1210 Timing to Standard 8051 Timing The MSC1210 also provides dual data pointers (DPTRs) to speed block Data Memory moves. Table 1. Memory Cycle Stretching. Stretching of MOVX timing as defined by MD2, MD1, and MD0 bits in CKCON register (address 8Eh). Additionally, it can stretch the number of memory cycles to access external Data Memory from between two and nine instruction cycles in order to accommodate different speeds of memory or devices, as shown in Table 1. The MSC1210 provides an external memory interface with a 16-bit address bus (P0 and P2). The 16-bit address bus makes it necessary to multiplex the low address byte through the P0 port. To enhance P0 and P2 for high-speed memory access, hardware configuration control is provided to configure the ports for external memory/peripheral interface or general-purpose I/O. CKCON (8Eh) MD2:MD0 INSTRUCTION CYCLES (for MOVX) RD or WR STROBE WIDTH (SYS CLKs) RD or WR STROBE WIDTH (ms) AT 12MHz 000 2 2 0.167 001 3 (default) 4 0.333 010 4 8 0.667 011 5 12 1.000 100 6 16 1.333 101 7 20 1.667 110 8 24 2.000 111 9 28 2.333 CLK instr_cycle cpu_cycle n+1 C1 C2 n+2 C3 C4 C1 C2 C3 C4 C1 Figure 9. Instruction Timing Cycle 21 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 MSC1210Y5. This gives the user the ability to add or subtract software functions and to freely migrate between family members. Thus, the MSC1210 can become a standard device used across several application platforms. Furthermore, improvements were made to peripheral features that off-load processing from the core, and the user, to further improve efficiency. For instance, 32-bit accumulation can be done through the summation register to significantly reduce the processing overhead for the multiple byte data from the ADC or other sources. This allows for 32-bit addition and shifting to be accomplished in a few instruction cycles, compared to hundreds of instruction cycles through a software implementation. Family Development Tools The MSC1210 is fully compatible with the standard 8051 instruction set. This means that the user can develop software for the MSC1210 with their existing 8051 development tools. Additionally, a complete, integrated development environment is provided with each demo board, and third-party developers also provide support. Family Device Compatibility The hardware functionality and pin configuration across the MSC1210 family are fully compatible. To the user the only difference between family members is the memory configuration. This makes migration between family members simple. Code written for the MSC1210Y2 can be executed directly on an MSC1210Y3, MSC1210Y4, or SYS Clock Oscillator Power Down Modes The MSC1210 can power down several of the on-chip peripherals and put the CPU into IDLE. For more information, see the Idle Mode and Stop Mode sections. STOP SCK SPICON 9A tCLK PDCON.0 PWMHI A3 PDCON.4 USEC PWM Clock Flash Write Timing FTCON (30µs to 40µs) [3:0] EF µs FB ms MSECH MSECL FD FC PWMLOW A2 FTCON [7:4] EF Flash Erase Timing (5ms to 11ms) milliseconds interrupt MSINT FA PDCON.1 Internal VREF seconds interrupt SECINT F9 100ms HMSEC WDTCON FF FE watchdog PDCON.2 ACLK F6 ADC Power Down divide by 64 ADCON3 DF ADCON2 DE Decimation Ratio ADCON0 PDCON.3 ADC Output Rate DC fSAMP (see Figure 14) fMOD Timers 0/1/2 IDLE USART0/1 CPU Clock Figure 11. MSC1210 Timing Chain and Clock Control 22 fDATA "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 it is possible to have up to eight fully differential input channels. It is also possible to switch the polarity of the differential input pair to negate any offset voltages. OVERVIEW The MSC1210 ADC structure is shown in Figure 12. The figure lists the components that make up the ADC, along with the corresponding special function register (SFR) associated with each component. In addition, current sources are supplied that will source or sink current to detect open or short circuits on the pins. ADC INPUT MULTIPLEXER TEMPERATURE SENSOR The input multiplexer provides for any combination of differential inputs to be selected as the input channel, as shown in Figure 13. If AIN0 is selected as the positive differential input channel, any other channel can be selected as the negative differential input channel. With this method, On-chip diodes provide temperature sensing capability. When the configuration register for the input MUX is set to all 1s, the diodes are connected to the input of the ADC. All other channels are open. AVDD AIN0 AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AINCOM Burnout Detect REFIN+ fSAMP Input Multiplexer In+ Sample and Hold Buffer In− Σ PGA Temperature Sensor Burnout Detect D7h ADMUX REFIN+ fMOD Offset DAC REFIN− AGND DCh ADC0N0 F6h f DATA ACLK E6h ODAC A6h AIE.5 A6h AIE.6 A7h AISTAT.5 A7h AISTAT.6 FAST VIN ∆Σ ADC Modulator SINC2 SINC3 AUTO REFIN− Σ X Offset Calibration Register Gain Calibration Register ADC Result Register Summation Block Σ DDh ADCON1 OCR GCR ADRES DEh ADCON2 D3h D2h D1h D6h D5h D4h DBh DAh D9h DFh ADCON3 SUMR E5h E4h E3h E2h E1h SSCON Figure 12. MSC1210 ADC Structure 23 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 The input impedance of the MSC1210 without the buffer is 7MΩ/PGA. The buffer is controlled by the state of the BUF bit in the ADC control register (ADCON0 DCh). AIN 0 ADC ANALOG INPUT AIN 1 When the buffer is not selected, the input impedance of the analog input changes with ACLK clock frequency (ACLK F6h) and gain (PGA). The relationship is: AV D D Burnout Detect Current Source AIN 2 Impedance (W) + ǒf AIN 3 In+ AIN Impedance(W) + AIN 4 1 @ CS SAMP Ǔ 10 Ǔ ǒACLK Frequency Ǔ @ ǒ7MW PGA 6 In− where ACLK frequency + AIN 5 Burnout Detect Current Sink AIN 6 and modclk + f MOD + Temperature Sensor f CLK (ACLK)1) f ACLK . 64 AGND AIN 7 80 • I I NOTE: The input impedance for PGA = 128 is the same as that for 7MW ). PGA = 64 ( that is, 64 AIN CO M Figure 14 shows the basic input structure of the MSC1210. RSWITCH (3k typical) Figure 13. Input Multiplexer Configuration High Impedance > 1GΩ AIN BURNOUT DETECT When the Burnout Detect (BOD) bit is set in the ADC control configuration register (ADCON0 DCh), two current sources are enabled. The current source on the positive input channel sources approximately 2µA of current. The current source on the negative input channel sinks approximately 2µA. This allows for the detection of an open circuit (full-scale reading) or short circuit (small differential reading) on the selected input differential pair. Buffer should be on for sensor burnout detection. ADC INPUT BUFFER The analog input impedance is always high, regardless of PGA setting (when the buffer is enabled). With the buffer enabled, the input voltage range is reduced and the analog power-supply current is higher. If the limitation of input voltage range is acceptable, then the buffer is always preferred. CS (9pF typical) Sampling Frequency = f SAMP AGND PGA 1 2 4 to 128 PGA 1 2 4 8 16 32 64 128 NOTE: BIPOLAR MODE FULL-SCALE RANGE ±VREF ±VREF/2 ±VREF/4 ±VREF/8 ±VREF/16 ±VREF/32 ±VREF/64 ±VREF/128 UNIPOLAR MODE FULL-SCALE RANGE +VREF +VREF/2 +VREF/4 +VREF/8 +VREF/16 +VREF/32 +VREF/64 +VREF/128 CS 9pF 18pF 36pF fSAMP fMOD fMOD fMOD fMOD S 2 fMOD S 4 fMOD S 8 fMOD S 16 fMOD S 16 fMOD = ACLK frequency/64 Figure 14. Analog Input Structure 24 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ADC PGA The PGA can be set to gains of 1, 2, 4, 8, 16, 32, 64, or 128. Using the PGA can actually improve the effective resolution of the ADC. For instance, with a PGA of 1 on a ±2.5V full-scale range, the ADC can resolve to 1.5µV. With a PGA of 128 on a ±19mV full-scale range, the ADC can resolve to 75nV, as shown in Table 2. Table 2. ENOB versus PGA (Bipolar Mode) PGA SETTING FULL-SCALE RANGE (V) ENOB(1) AT 10HZ RMS MEASUREMENT RESOLUTION (nV) 1 ±2.5V 21.7 1468 2 ±1.25 21.5 843 4 ±0.625 21.4 452 8 ±0.313 21.2 259 16 ±0.156 20.8 171 32 ±0.0781 20.4 113 64 ±0.039 20 74.5 128 ±0.019 19 74.5 (1) ENOB = Log2(FSR/RMS Noise) = Log2(224) − Log2(σCODES) = 24 − Log2(σCODES) ADC OFFSET DAC The analog input to the PGA can be offset (in bipolar mode) by up to half the full-scale input range of the PGA by using the ODAC register (SFR E6h). The ODAC (Offset DAC) register is an 8-bit value; the MSB is the sign and the seven LSBs provide the magnitude of the offset. Since the ODAC introduces an analog (instead of digital) offset to the PGA, using the ODAC does not reduce the range of the ADC. For system calibration, the appropriate signal must be applied to the inputs. The system offset command requires a zero differential input signal. It then computes an offset value that will nullify offsets in the system. The system gain command requires a positive full-scale differential input signal. It then computes a value to nullify gain errors in the system. Each of these calibrations will take seven tDATA periods to complete. Calibration should be performed after power on. It should also be done after a change in temperature, decimation ratio, buffer, Power Supply, voltage reference, or PGA. The Offset DAC wil affect offset calibration; therefore, the value of the Offset DAC should be zero until prior to performing a calibration. At the completion of calibration, the ADC Interrupt bit goes HIGH which indicates the calibration is finished and valid data is available. ADC DIGITAL FILTER The Digital Filter can use either the Fast Settling, Sinc2, or Sinc3 filter, as shown in Figure 15. In addition, the Auto mode changes the Sinc filter after the input channel or PGA is changed. When switching to a new channel or new PGA value, it will use the Fast Settling filter for the next two conversions (the first of which should be discarded). It will then use the Sinc2 followed by the Sinc3 filter to improve noise performance. Adjustable Digital Filter Sinc3 ADC MODULATOR The modulator is a single-loop 2nd-order system. The modulator runs at a clock speed (fMOD) that is derived from the CLK using the value in the Analog Clock (ACLK) register (SFR F6h). The data rate is: Modulator Sinc2 Data Out Fast Settling f MOD Data Rate + Decimation Ratio where f MOD + f CLK f + ACLK (ACLK)1) @ 64 64 and Decimation Ratio is set in [ADCON3:ADCON2]. FILTER SETTLING TIME SETTLING TIME FILTER (Conversion Cycles)(1) Sinc3 3 Sinc2 2 Fast 1 NOTE: (1) MUX change may add one cycle. ADC CALIBRATION The offset and gain errors in the MSC1210, or the complete system, can be reduced with calibration. Calibration is controlled through the ADCON1 register (SFR DDh), bits CAL2:CAL0. Each calibration process takes seven tDATA (data conversion time) periods to complete. Therefore, it takes 14 tDATA periods to complete both an offset and gain calibration. AUTO MODE FILTER SELECTION CONVERSION CYCLE 1 2 3 Discard Fast Sinc2 4 Sinc3 Figure 15. Filter Step Responses 25 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 This combines the low-noise advantage of the Sinc3 filter with the quick response of the Fast Settling Time filter. The frequency response of each filter is shown in Figure 16. SINC3 FILTER RESPONSE (−3dB = 0.262 • fDATA) 0 VOLTAGE REFERENCE −20 −40 Gain (dB) The MSC1210 can use either an internal or external voltage reference. The voltage reference selection is controlled via ADC Control Register 0 (ADCON0, SFR DCh). The default power-up configuration for the voltage reference is 2.5V internal. −80 The internal voltage reference can be selected as either 1.25V or 2.5V. The analog power supply (AVDD) must be within the specified range for the selected internal voltage reference. The valid ranges are: VREF = 2.5 internal (AVDD = 3.3V to 5.25V) and VREF = 1.25 internal (AVDD = 2.7V to 5.25V). If the internal VREF is selected, then the REFOUT pin must be connected to REFIN+, and AGND must be connected to REFIN−. The REFOUT pin should also have a 0.1µF capacitor connected to AGND, as close as possible to the pin. If the internal VREF is not used, then VREF should be disabled in ADCON0. For applications requiring higher performance than that obtainable from the internal reference, use an external precision reference such as the REF50xx. The internal reference performance can be observed in the noise (and ENOB) versus input signal graphs in the Typical Characteristics section. All the rest of the ENOB plots are obtained with the inputs shorted together. By shorting the inputs, the inherent noise performance of only the ADC can be determined and displayed. When the inputs are not shorted, the extra noise comes from the reference. As can be seen in the ENOB vs Input Signal graph, the external reference adds about 0.7 bits of noise, whereas the internal reference adds about 2.3 bits of noise. This ENOB performance of 19.4 represents 21.16 bits of noise. With an LSB of 298nV, that translates to 6.3µV, or a peak−to−peak noise of almost 42µV. An external reference provides the best noise, drift, and repeatability performance for high−precision applications. −100 −120 0 1 2 3 4 5 4 5 f DATA SINC2 FILTER RESPONSE (−3dB = 0.318 • fDATA ) 0 −20 Gain (dB) −40 −60 −80 −100 −120 0 1 2 3 fDATA FAST SETTLING FILTER RESPONSE (−3dB = 0.469 • f DATA) 0 −20 −40 Gain (dB) If the external voltage reference is selected, it can be used as either a single-ended input or differential input, for ratiometric measures. When using an external reference, it is important to note that the input current will increase for VREF with higher PGA settings and with a higher modulator frequency. The external voltage reference can be used over the input range specified in the Electrical Characteristics section. −60 −60 −80 −100 −120 0 1 2 3 4 f DATA NOTE: fDATA = Normalized Data Output Rate = 1/tDATA Figure 16. Filter Frequency Responses 26 5 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 RESET POWER-ON RESET The device can be reset from the following sources: The on-chip power-on reset (POR) circuitry releases the device from reset at approximately DVDD = 2.0V. The POR accommodates power-supply ramp rates as slow as 1V/10ms. To ensure proper operation, the power supply should ramp monotonically. Note that as the device is released from reset and program execution begins, the device current consumption may increase, which may result in a power-supply voltage drop. If the power supply ramps at a slower rate, is not monotonic, or a brownout condition occurs (where the supply does not drop below the 2.0V threshold), then improper device operation may occur. The on-chip brownout reset may provide benefit in these conditions. D D D D D Power-on reset External reset Software reset Watchdog timer reset Brownout reset An external reset is accomplished by taking the RST pin high for two tOSC periods, followed by taking the RST pin low. A software reset is accomplished through the System Reset register (SRTST, 0F7h). A watchdog timer reset is enabled and controlled through Hardware Configuration Register 0 (HCR0) and the Watchdog Timer register (WDTCON, 0FFh). A brownout reset is enabled through Hardware Configuration Register 1 (HCR1). External reset, software reset, and watchdog timer reset complete after 217 clock cycles. A brownout reset completes after 215 clock cycles. All sources of reset cause the digital pins to be pulled high from the initiation of the reset. For an external reset, taking the RST pin high stops device operation, crystal oscillation, and causes all digital pins to be pulled high from that point. Taking the RST pin low initiates the reset procedure. A recommended external reset circuit is shown in Figure 17. The serial 10kΩ resistor is recommended for any external reset circuit configuration. DVDD MSC1210 0.1µF 10kΩ 13 RST 1MΩ Figure 17. Typical Reset Circuit BROWNOUT RESET The brownout reset (BOR) is enabled through Hardware Configuration Register 1 (HCR1). If the conditions for proper POR are not met or the device encounters a brownout condition that does not generate a POR, the BOR can be used to ensure proper device operation. The BOR will hold the state of the device when the power supply drops below the threshold level programmed in HCR1, and then generate a reset when the supply rises above the threshold level. Note that as the device is released from reset, and program execution begins, the device current consumption may increase, which may result in a power-supply voltage drop, which may initiate another brownout condition. The BOR level should be chosen to match closely with the application. For example, with a high external clock frequency, the BOR level should match the minimum operating voltage range for the device, or improper operation may still occur. Note that AVDD must rise above 2.0V for the Analog Brownout Reset function to be disabled; otherwise, it will be enabled and hold the device in reset. The BOR voltage is not calibrated until the end of the reset cycle; therefore, the actual BOR voltage will be approxiamtely 25% higher than the selected voltage. This can create a condition where the reset never ends (for example, when selecting a 4.5V BOR voltage for a 5V power supply). 27 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 IDLE MODE POWER CONSUMPTION CONSIDERATIONS Idle mode is entered by setting the IDLE bit in the Power Control register (PCON, 087h). In Idle mode, the CPU, Timer0, Timer1, and USARTs are stopped, but all other peripherals and digital pins remain active. The device can be returned to active mode via an active internal or external interrupt. This mode is typically used for reducing power consumption between ADC samples. The following consumption: suggestions will reduce current 1. Use the lowest supply voltage that will work in the application for both AVDD and DVDD. 2. Use the lowest clock frequency that will work in the application. 3. Use Idle mode and the system clock divider whenever possible. Note that the system clock divider also affects the ADC clock. 4. Avoid using 8051-compatible I/O mode on the I/O ports. The internal pull-up resistors will draw current when the outputs are low. STOP MODE 5. Use the delay line for Flash Memory control by setting the FRCM bit in the FMCON register (SFR EEh) Stop mode is entered by setting the STOP bit in the Power Control register (PCON, 087h). In Stop mode, all internal clocks are halted. This mode has the lowest power consumption. The device can be returned to active mode only via an external or power-on reset. 6. Power down peripherals when they are not needed. Refer to SFR PDCON, LVDCON, and ADCON0. By configuring the device prior to entering Idle mode, further power reductions can be achieved (while in Idle mode). These reductions include powering down peripherals not in use in the PDCON register (0F1h). By configuring the device prior to entering Stop mode, further power reductions can be achieved (while in Stop mode). These power reductions include halting the external clock into the device, configuring all digital I/O pins as open drain with low output drive, disabling the ADC buffer, disabling the internal VREF, and setting PDCON to 0FFh to power down all peripherals. In Stop mode, if the brownout reset is enabled, there is approximately 25µA of draw from the power supply. To achieve zero current (≈ 100nA) in Stop mode, disable the brownout reset via HCR1. In Stop mode, all digital pins retain their values. MEMORY MAP The MSC1210 contains on-chip SFR, Flash Memory, Scratchpad SRAM Memory, Boot ROM, and SRAM. THe SFR registers are primarily used for control and status. The standard 8051 features and additional peripheral features of the MSC1210 are controlled through the SFR. Reading from an undefined SFR and writing to undefined SFR registers is not recommended, and will have indeterminate effects. Flash Memory is used for both Program Memory and Data Memory. The user has the ability to select the partition size of Program and Data Memories. The partition size is set through hardware configuration bits, which are programmed through either the parallel or serial programming methods. Both Program and Data Flash Memories are erasable and writable (programmable) in User Application mode (UAM). However, program execution can only occur from Program Memory. As an added precaution, a lock feature can be activated through the hardware configuration bits, which disables erase and writes to 4kB of Program Flash Memory or the entire Program Flash Memory in UAM. The MSC1210 includes 1kB of SRAM on-chip. SRAM starts at address 0 and is accessed through the MOVX instruction. This SRAM can also be located to start at 8400h and can be accessed as both Program and Data Memory. 28 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 FLASH MEMORY The page size for Flash memory is 128 bytes. The respective page must be erased before it can be written to, regardless of whether it is mapped to Program or Data Memory space. The MSC1210 uses a memory addressing scheme that separates Program Memory (FLASH/ROM) from Data Memory (FLASH/RAM). Each area is 64kB beginning at address 0000h and ending at FFFFh, as shown in Figure 18. The program and data segments can overlap since they are accessed in different ways. Program Memory is fetched by the microcontroller automatically. There is one instruction (MOVC) that is used to explicitly read the program area. This is commonly used to read lookup tables. 2k Internal Boot ROM External Program Memory 1k RAM or External External Memory On−Chip Flash The MSC1210 has two Hardware Configuration registers (HCR0 and HCR1) that are programmable only during Flash Memory Programming mode. Data Memory FFFFh FFFFh F800h External Data Memory Mapped to Both Memory Spaces (von Neumann) Configuration Memory 8800h 8400h 7FFFh, 32k (Y5) 1k RAM or External 8800h 83FFh, 33k (Y5) 3FFFh, 16k (Y4) On−Chip Flash 43FFh, 17k (Y4) 1FFFh, 8k (Y3) Select in MCON Select in MCON Select in HCR0 Program Memory The Data Memory area is accessed explicitly using the MOVX instruction. This instruction provides multiple ways of specifying the target address. It is used to access the 64kB of Data Memory. The address and data range of devices with on-chip Program and Data Memory overlap the 64kB memory space. When on-chip memory is enabled, accessing memory in the on-chip range will cause the device to access internal memory. Memory accesses beyond the internal range will be addressed externally via Ports 0 and 2. 13FFh, 5k (Y2) 0FFFh, 4k (Y2) 0000h, 0k 23FFh, 9k (Y3) 1k RAM or External 03FFh, 1k UAM: Read Only FPM: Read/Write Flash User Programming Application Mode Mode Address Address(1) 807Fh 7Fh 8079h 79h 8070h 70h 8000h 00h UAM: Read Only FPM: Read Only UAM: Read Only FPM: Read/Write NOTE: (1) Can be accessed using CADDR or the faddr_data_read Boot ROM routine. Figure 18. Memory Map 29 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 The MSC1210 allows the user to partition the Flash Memory between Program Memory and Data Memory. For instance, the MSC1210Y5 contains 32kB of Flash Memory on-chip. Through the HW configuration registers, the user can define the partition between Program Memory (PM) and Data Memory (DM), as shown in Table 3 and Table 4. The MSC1210 family offers four memory configurations, as shown. Table 3. MSC1210 Flash Partitioning HCR0 MSC1210Y2 MSC1210Y3 MSC1210Y4 DFSEL PM DM PM DM PM DM MSC1210Y5 PM DM 000 0kB 4kB 0kB 8kB 0kB 16kB 0kB 32kB 001 0kB 4kB 0kB 8kB 0kB 16kB 0kB 32kB 010 0kB 4kB 0kB 8kB 0kB 16kB 16kB 16kB 011 0kB 4kB 0kB 8kB 8kB 8kB 24kB 8kB 100 0kB 4kB 4kB 4kB 12kB 4kB 28kB 4kB 101 2kB 2kB 6kB 2kB 14kB 2kB 30kB 2kB 110 3kB 1kB 7kB 1kB 15kB 1kB 31kB 1kB 111 (default) 4kB 0kB 8kB 0kB 16kB 0kB 32kB 0kB NOTE: When a 0kB program memory configuration is selected, program execution is external. Table 4. MSC1210 Flash Memory Partitioning HCR0 MSC1210Y3 MSC1210Y4 MSC1210Y5 DFSEL MSC1210Y2 PM DM PM DM PM DM PM DM 000 0000 040013FF 0000 040023FF 0000 040043FF 0000 040083FF 001 0000 040013FF 0000 040023FF 0000 040043FF 0000 040083FF 010 0000 040013FF 0000 040023FF 0000 040043FF 00003FFF 040043FF 011 0000 040013FF 0000 040023FF 00001FFF 040023FF 00005FFF 040023FF 100 0000 040013FF 00000FFF 040013FF 00002FFF 040013FF 00006FFF 040013FF 101 000007FF 04000BFF 000017FF 04000BFF 000037FF 04000BFF 000077FF 04000BFF 110 00000BFF 040007FF 00001BFF 040007FF 00003BFF 040007FF 00007BFF 040007FF 111 (default) 00000FFF 0000 00001FFF 0000 00003FFF 0000 00007FFF 0000 NOTE: Program memory accesses above the highest listed address will access external program memory. 30 It is important to note that the Flash Memory is readable and writable by the user through the MOVX instruction when configured as either Program or Data Memory (via the MXWS bit in the MWS, SFR 8Fh). This means that the user may partition the device for maximum Flash Program Memory size (no Flash Data Memory) and use Flash Program Memory as Flash Data Memory. This may lead to undesirable behavior if the PC points to an area of Flash Program Memory that is being used for data storage. Therefore, it is recommended to use Flash partitioning when Flash Memory is used for data storage. Flash partitioning prohibits execution of code from Data Flash Memory. Additionally, the Program Memory erase/write can be disabled through hardware configuration bits (HCR0), while still providing access (read/write/erase) to Data Flash Memory. The effect of memory mapping on Program and Data Memory is straightforward. The Program Memory is decreased in size from the top of internal Program Memory. Therefore, if the MSC1210Y5 is partitioned with 31kB of Flash Program Memory and 1kB of Flash Data Memory, external Program Memory execution will begin at 7C00h (versus 8000h for 32kB). The Flash Data Memory is added on top of the SRAM memory. Therefore, access to Data Memory (through MOVX) will access SRAM for addresses 0000h−03FFh and access Flash Memory for addresses 0400h−07FFh. Data Memory The MSC1210 can address 64kB of Data Memory. The MOVX instruction is used to access the Data SRAM Memory. This includes 1,024 bytes of on-chip Data SRAM Memory. The data bus values do not appear on Port 0 (during data bus timing) for internal memory access. The MSC1210 also has on-chip Flash Data Memory which is readable and writable (depending on Memory Write Select register) during normal operation (full VDD range). This memory is mapped into the external Data Memory space directly above the SRAM. The MOVX instruction is used to write the flash memory. Flash memory must be erased before it can be written. Flash memory is erased in 128 byte pages. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 CONFIGURATION MEMORY The MSC1210 Configuration Memory consists of 128 bytes. In UAM, all Configuration Memory is readable using the faddr_data_read Boot ROM routine, and the CADDR and CDATA registers. In UAM, however, none of the Configuration Memory is writable. be accessed indirectly. Thus, a direct reference to one of the upper 128 locations must be an SFR access. Direct RAM is reached at locations 0 to 7Fh (0 to 127). FFh In serial or parallel programming mode, all Configuration Memory is readable. Most locations are also writable, except for addresses 8070h through 8079h, which are read-only. The two hardware configuration registers reside in configuration memory at 807Eh (HCR1) and 807Fh (HCR0). Figure 19 shows the configuration memory mapping for programming mode and UAM. Note that reading/writing configuration memory in Flash Programming mode (FPM) requires 16-bit addressing, whereas reading configuration memory in User Application mode (UAM) requires only 8-bit addressing. 255 Indirect RAM 80h FFh Direct Special Function Registers 80h 128 7Fh SFR Registers Direct RAM 0000h Scratchpad RAM Figure 20. Register Map User Application Mode (Read−Only) Flash Programming Mode 0807Fh 0807Eh HCR0 HCR1 08079h Read−Only in Both FPM and UAM 7Fh 7Fh 79h 08070h 70h 08000h 00h UAM Address SFRs are accessed directly between 80h and FFh (128 to 255). The RAM locations between 128 and 255 can be reached through an indirect reference to those locations. Scratchpad RAM is available for general-purpose data storage. It is commonly used in place of off-chip RAM when the total data contents are small. When off-chip RAM is needed, the Scratchpad area will still provide the fastest general-purpose access. Within the 256 bytes of RAM, there are several special-purpose areas. Bit Addressable Locations NOTE: All Configuration Memory is R/W in programming mode, except addresses 8070h−8079h, which are read−only. All Configuration Memory is read−only in UAM. Figure 19. Configuration Memory Map REGISTER MAP The Register Map is illustrated in Figure 20. It is entirely separate from the Program and Data Memory areas mentioned before. A separate class of instructions is used to access the registers. There are 256 potential register locations. In practice, the MSC1210 has 256 bytes of Scratchpad RAM and up to 128 SFRs. This is possible, since the upper 128 Scratchpad RAM locations can only In addition to direct register access, some individual bits are also accessible. These are individually addressable bits in both the RAM and SFR area. In the Scratchpad RAM area, registers 20h to 2Fh are bit addressable. This provides 128 (16 × 8) individual bits available to software. A bit access is distinguished from a full-register access by the type of instruction. In the SFR area, any register location ending in a 0 or 8 is bit addressable. Figure 21 shows details of the on-chip RAM addressing including the locations of individual RAM bits. Working Registers As part of the lower 128 bytes of RAM, there are four banks of Working Registers, as shown in Figure 21. The Working Registers are general-purpose RAM locations that can be addressed in a special way. They are designated R0 31 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 through R7. Since there are four banks, the currently selected bank will be used by any instruction using R0—R7. This allows software to change context by simply switching banks. This is controlled via the Program Status Word register (PSW; 0D0h) in the SFR area described below. Registers R0 and R1 also allow their contents to be used for indirect addressing of the upper 128 bytes of RAM. Thus, an instruction can designate the value stored in R0 (for example) to address the upper RAM. The 16 bytes immediately above the R0—R7 registers are bit addressable; any of the 128 bits in this area can be directly accessed using bit addressable instructions. FFh Indirect RAM Stack Another use of the Scratchpad area is for the programmer’s stack. This area is selected using the Stack Pointer (SP; 81h) SFR. Whenever a call or interrupt is invoked, the return address is placed on the Stack. It also is available to the programmer for variables, etc., since the Stack can be moved and there is no fixed location within the RAM designated as Stack. The Stack Pointer will default to 07h on reset. The user can then move it as needed. A convenient location would be the upper RAM area (> 7Fh) since this is only available indirectly. The SP will point to the last used value. Therefore, the next value placed on the Stack is put at SP + 1. Each PUSH or CALL will increment the SP by the appropriate value. Each POP or RET will decrement as well. Program Memory 7Fh After reset, the CPU begins execution from Program Memory location 0000h. The selection of where Program Memory execution begins is made by tying the EA pin to DVDD for internal access, or DGND for external access. When EA is tied to DVDD, any PC fetches outside the internal Program Memory address occur from external memory. If EA is tied to DGND, then all PC fetches address external memory. The standard internal Program Memory size for MSC1210 family members is shown in Table 5. If enabled the Boot ROM will appear from address F800h to FFFFh. 2Fh 7F 7E 7D 7C 7B 7A 79 78 2Eh 77 76 75 74 73 72 71 70 2Dh 6F 6E 6D 6C 6B 6A 69 68 2Ch 67 66 65 64 63 62 61 60 2Bh 5F 5E 5D 5C 5B 5A 59 58 2Ah 57 56 55 54 53 52 51 50 29h 4F 4E 4D 4C 4B 4A 49 48 28h 47 46 45 44 43 42 41 40 27h 3F 3E 3D 3C 3B 3A 39 38 26h 37 36 35 34 33 32 31 30 25h 2F 2E 2D 2C 2B 2A 29 24h 27 26 25 24 23 22 23h 1F 1E 1D 1C 1B 22h 17 16 15 14 21h 0F 0E 0D 20h 07 06 05 Bit Addressable Direct RAM PRODUCT STANDARD INTERNAL PROGRAM MEMORY SIZE (BYTES) 28 MSC1210Y5 32k 21 20 MSC1210Y4 16k 1A 19 18 MSC1210Y3 8k 13 12 11 10 MSC1210Y2 4k 0C 0B 0A 09 08 04 03 02 01 00 Boot ROM 1Fh There is a 2kB Boot ROM that controls operation during serial or parallel programming. The Boot ROM routines can be accessed during the user mode if it is enabled. The Boot ROM routines are listed in Table 6. When enabled, the Boot ROM routines will be located at memory addresses F800h−FFFFh during user mode. In program mode the Boot ROM is located in the first 2kB of Program Memory. For additional information, refer to Application Note SBAA085, MSC1210 ROM Routines, available for download from the TI web site (www.ti.com). Bank 3 18h 17h Bank 2 10h 0Fh Bank 1 08h 07h Bank 0 0000h MSB LSB Figure 21. Scratchpad Register Addressing 32 Table 5. MSC1210 Maximum Internal Program Memory Sizes "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Table 6. MSC1210 Boot ROM Routines ADDRESS ROUTINE C DECLARATIONS DESCRIPTION FFD5 put_string void put_string (char code *string); Output string FFD7 page_erase char page_erase (int faddr, char fdata, char fdm); Erase flash page FFD9 write_flash Assembly only; DPTR = address, R5 = data Fast flash write FFDB write_flash_chk char write_flash_chk (int faddr, char fdata, char fdm); Write flash byte, verify FFDD write_flash_byte char write_flash_byte (int faddr, char fdata, char fdm); Write flash byte FFDF faddr_data_read char faddr_data_read (char faddr); Read HW config byte from addr FFE1 data_x_c_read char data_x_c_read (int faddr, char fdm); Read xdata or code byte FFE3 tx_byte void tx_byte (char); Send byte to USART0 FFE5 tx_hex void tx_hex (char); Send hex value to USART0 FFE7 putok void putok (void); Send “OK” to USART0 FFE9 rx_byte char rx_byte (void); Read byte from USART0 FFEB rx_byte_echo char rx_byte_echo (void); Read and echo byte on USART0 FFED rx_hex_echo int rx_hex_echo (void); Read and echo hex on USART0 FFEF rx_hex_int_echo int rx_hex_int_echo (void); Read int as hex and echo: USART0 FFF1 rx_hex_rev_echo int rx_hex_rev_echo (void); Read int reversed as hex and echo: USART0 FFF3 autobaud void autobaud (void); Set baud rate with received CR FFF5 putspace4 void putspace4 (void); Output 4 spaces to USART0 FFF7 putspace3 void putspace3 (void); Output 3 spaces to USART0 FFF9 putspace2 void putspace2 (void); Output 2 spaces to USART0 FFFB putspace1 void putspace1 (void); Output 1 space to USART0 Output CR, LF to USART0 FFFB putcr void putcr (void); F979 cmd_parse void cmd_parser (void); See SBAA076 FD37 monitor_isr void monitor_isr ( ) interrupt 6 Push registers and call cmd_parser 33 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ACCESSING EXTERNAL MEMORY If external memory is used, P0 and P2 can be configured as address and data lines. If external memory is not used, P0 and P2 can be configured as general-purpose I/O lines through the Hardware Configuration Register. To enable access to external memory, bits 0 and 1 of the HCR1 register must be set to 0. When these bits are enabled all memory addresses for both internal and external memory will appear on ports 0 and 2. During the data portion of the cycle for internal memory, Port 0 will be zero for security purposes. Accesses to external memory are of two types: accesses to external Program Memory and accesses to external Data Memory. Accesses to external Program Memory use signal PSEN (program store enable) as the read strobe. Accesses to external Data Memory use RD or WR (alternate functions of P3.7 and P3.6) to strobe the memory. External Program Memory and external Data Memory may be combined if desired by applying the RD and PSEN signals to the inputs of an AND gate and using the output of the gate as the read strobe to the external Program/Data Memory. Program fetches from external Program Memory always use a 16-bit address. Accesses to external Data Memory can use either a 16-bit address (MOVX @DPTR) or an 8-bit address (MOVX @RI). If Port 2 is selected for external memory use (HCR1, bit 0), it cannot be used as general-purpose I/O. This bit (or Bit 1 of HCR1) also forces bits P3.6 and P3.7 to be used for WR and RD instead of I/O. Port 2, P3.6, and P3.7 should all be written to ‘1.’ If an 8-bit address is being used (MOVX @RI), the contents of the MPAGE (92h) SFR remain at the Port 2 pins throughout the external memory cycle. This will facilitate paging. In any case, the low byte of the address is time-multiplexed with the data byte on Port 0. The ADDR/DATA signals use CMOS drivers in the Port 0, Port 2, WR, and RD output buffers. Thus, in this application the Port 0 pins are not open-drain outputs, and do not require external pull-ups for high-speed access. Signal ALE (Address Latch Enable) should be used to capture the address byte into an external latch. The address byte is valid at the negative transition of ALE. Then, in a write cycle, the data byte to be written appears on Port 0 just before WR is activated, and remains there until after WR is deactivated. In a read cycle, the incoming byte is accepted at Port 0 just before the read strobe is deactivated. 34 The functions of Port 0 and Port 2 are selected in Hardware Configuration Register 1. This can only be changed during the Flash Program mode. There is no conflict in the use of these registers; they will either be used as general-purpose I/O or for external memory access. The default state is for Port 0 and Port 2 to be used as general-purpose I/O. If an external memory access is attempted when they are configured as general-purpose I/O, the values of Port 0 and Port 2 will not be affected. External Program Memory is accessed under two conditions: 1. Whenever signal EA is LOW during reset, then all future accesses are external; or 2. Whenever the Program Counter (PC) contains a number that is outside of the internal Program Memory address range, if the ports are enabled. If Port 0 and Port 2 are selected for external memory, all 8 bits of Port 0 and Port 2, as well as P3.6 and P3.7, are dedicated to an output function and may not be used for general-purpose I/O. During external program fetches, Port 2 outputs the high byte of the PC. Programming Flash Memory There are four sections of Flash Memory for programming: 1. 128 configuration bytes. 2. Reset sector (4kB) (not to be confused with the 2kB Boot ROM). 3. Program Memory. 4. Data Memory. Flash Programming Mode There are two programming modes: parallel and serial. The programming mode is selected by the state of the ALE and PSEN signals during power-on reset. Serial programming mode is selected with PSEN = 0 and ALE = 1. Parallel programming mode is selected with PSEN = 1 and ALE = 0 (see Figure 22). If they are both HIGH, the MSC1210 will operate in normal user mode. Both signals LOW is a reserved mode and is not defined. Programming mode is exited with a reset (BOR, WDT, software, or POR) and the normal mode selected. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 The MSC1210 is shipped with Flash Memory erased (all 1s). Parallel programming methods typically involve a third-party programmer. Serial programming methods typically involve in-system programming. UAM allows Flash Program and Data Memory programming. The actual code for Flash programming cannot execute from Flash. That code must execute from the Boot ROM, internal (von Neumann) RAM or external memory. HOST MSC1210 PSEL P2[7] AddrHi[6:0] NC Flash Programmer P2[6:0] PSEN AddrLo[7:0] P1[7:0] Data[7:0] ALE P0[7:0] Cmd[2:0] Figure 23 shows the serial programming conection. P3[7:5] Req Serial programming mode works through USART0, and has special protocols, which are discussed at length in Application Note SBAA076, Programming the MSC1210, available for download at www.ti.com. The serial programming mode works at a maximum baud rate determined by fOSC. P3[4] P3[3] P3[2] RST XIN ACK Pass RST CLK Figure 22. Parallel Programming Configuration MSC1210 Reset Circuit RST AVDD DVDD P3.1 TXD PSEN Serial Port 0 Not Connected Clock Source P3.0 RXD RS232 Transceiver ALE Host PC or Serial Terminal XIN NOTE: Serial programming is selected with PSEN = 0 and ALE = 1 or open. Figure 23. Serial Programming Connection 35 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 INTERRUPTS HARDWARE CONFIGURATION MEMORY The MSC1210 uses a three-priority interrupt system. As shown in Table 7, each interrupt source has an independent priority bit, flag, interrupt vector, and enable (except that nine interrupts share the Auxiliary Interrupt [AI] at the highest priority). In addition, interrupts can be globally enabled or disabled. The interrupt structure is compatible with the original 8051 family. All of the standard interrupts are available. The 128 configuration bytes can only be written during the program mode. The bytes are accessed through SFR registers CADDR (SFR 93h) and CDATA (SFR 94h). Two of the configuration bytes control Flash partitioning and system control. If the security bit is set, these bits can not be changed except with a Mass Erase command that erases all of the Flash Memory including the 128 configuration bytes. Table 7. Interrupt Summary INTERRUPT PRIORITY CONTROL ADDR NUM PRIORITY FLAG ENABLE DVDD Low Voltage/HW Breakpoint 33h 6 HIGH EDLVB (AIE.0)(1) EBP (BPCON.0)(1) EDLVB (AIE.0)(1) EBP (BPCON.0)(1) N/A AVDD Low Voltage 33h 6 0 EALV (AIE.1)(1) EALV (AIE.1)(1) N/A (AIE.2)(1) (AIE.2)(1) N/A ESPIT (AIE.3)(1) N/A INTERRUPT/EVENT SPI Receive 33h 6 0 ESPIR SPI Transmit 33h 6 0 ESPIT (AIE.3)(1) Milliseconds Timer 33h 6 0 EMSEC (AIE.4)(1) (AIE.5)(1) ESPIR EMSEC EADC (AIE.4)(1) ADC 33h 6 0 EADC Summation Register 33h 6 0 ESUM (AIE.6)(1) ESUM (AIE.6)(1) (AIE.7)(1) (AIE.7)(1) ESEC N/A (AIE.5)(1) N/A N/A Seconds Timer 33h 6 0 ESEC External Interrupt 0 03h 0 1 IE0 (TCON.1)(2) EX0 (IE.0)(4) PX0 (IP.0) Timer 0 Overflow 0Bh 1 2 TF0 (TCON.5)(3) ET1 (IE.1)(4) PT0 (IP.1) (TCON.3)(2) (IE.2)(4) PX1 (IP.2) EX1 N/A External Interrupt 1 13h 2 3 IE1 Timer 1 Overflow 0Bh 3 4 TF1 (TCON.7)(3) ET1 (IE.3)(4) PT1 (IP.3) (IE.4)(4) PS0 (IP.4) Serial Port 0 23h 4 5 RI_0 (SCON0.0) TI_0 (SCON0.1) ES0 Timer 2 Overflow 2Bh 5 6 TF2 (T2CON.7) ET2 (IE.5)(4) PT2 (IP.5) (IE.6)(4) PS1 (IP.6) Serial Port 1 3Bh 7 7 RI_1 (SCON1.0) TI_1 (SCON1.1) ES1 External Interrupt 2 43h 8 8 IE2 (EXIF.4) EX2 (EIE.0)(4) PX2 (EIP.0) (EIE.1)(4) PX3 (EIP.1) External Interrupt 3 4Bh 9 9 IE3 (EXIF.5) EX3 External Interrupt 4 53h 10 10 IE4 (EXIF.6) EX4 (EIE.2)(4) PX4 (EIP.2) External Interrupt 5 5Bh 11 11 IE5 (EXIF.7) EX5 (EIE.3)(4) PX5 (EIP.3) Watchdog 63h 12 12 LOW WDTI (EICON.3) EWDI (EIE.4)(4) PWDI (EIP.4) (1) These interrupts set the AI flag (EICON.4) and are enabled by EAI (EICON.5). (2) If edge-triggered, cleared automatically by hardware when the service routine is vectored to. If level-triggered, the flag follows the state of the pin. (3) Cleared automatically by hardware when interrupt vector occurs. (4) Globally enabled by EA (IE.7). 36 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Hardware Configuration Register 0 (HCR0)—Accessed Using SFR Registers CADDR and CDATA. CADDR 7Fh bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 EPMA PML RSL EBR EWDR DFSEL2 DFSEL1 DFSEL0 NOTE: HCR0 is programmable only in Flash Programming mode, but can be read in User Application mode using the CADDR and CDATA SFRs or the faddr_data_read Boot ROM routine. EPMA bit 7 Enable Programming Memory Access (Security Bit). 0: After reset in programming modes, Flash Memory can only be accessed in UAM until a mass erase is done. 1: Fully Accessible (default) PML bit 6 Program Memory Lock (PML has Priority Over RSL). 0: Enable all Flash Programming modes in program mode, can be written in UAM. 1: Enable read-only for program mode; cannot be written in UAM (default). RSL bit 5 Reset Sector Lock. The reset sector can be used to provide another method of Flash Memory programming. This will allow Program Memory updates without changing the jumpers for in-circuit code updates or program development. The code in this boot sector would then provide the monitor and programming routines with the ability to jump into the main Flash code when programming is finished. 0: Enable Reset Sector Writing 1: Enable Read-Only Mode for Reset Sector (4kB) (default) EBR bit 4 Enable Boot ROM. Boot ROM is 2kB of code located in ROM, not to be confused with the 4kB Boot Sector located in Flash Memory. 0: Disable Internal Boot ROM 1: Enable Internal Boot ROM (default) EWDR bit 3 Enable Watchdog Reset. 0: Disable Watchdog Reset 1: Enable Watchdog Reset (default) DFSEL bits 2−0 Data Flash Memory Size (see Table 3 and Table 4). 000: Reserved 001: 32kB, 16kB, 8kB, or 4kB Data Flash Memory 010: 16kB, 8kB, or 4kB Data Flash Memory 011: 8kB or 4kB Data Flash Memory 100: 4kB Data Flash Memory 101: 2kB Data Flash Memory 110: 1kB Data Flash Memory 111: No Data Flash Memory (default) 37 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Hardware Configuration Register 1 (HCR1) CADDR 7Eh bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 DBLSEL1 DBLSEL0 ABLSEL1 ABLSEL0 DAB DDB EGP0 EGP23 NOTE: HCR1 is programmable only in Flash Programming mode, but can be read in User Application mode using the CADDR and CDATA SFRs or the faddr_data_read Boot ROM routine. DBLSEL bits 7−6 Digital Brownout Level Select 00: 4.5V 01: 4.2V 10: 2.7V 11: 2.5V (default) ABLSEL bits 5−4 Analog Brownout Level Select 00: 4.5V 01: 4.2V 10: 2.7V 11: 2.5V (default) DAB bit 3 Disable Analog Power-Supply Brownout Reset 0: Enable Analog Brownout Reset 1: Disable Analog Brownout Reset (default) (will not disable unless AVDD > 2.0V) DDB bit 2 Disable Digital Power-Supply Brownout Reset 0: Enable Digital Brownout Reset 1: Disable Digital Brownout Reset (default) EGP0 bit 1 Enable General-Purpose I/O for Port 0 0: Port 0 is Used for External Memory, P3.6 and P3.7 Used for WR and RD. 1: Port 0 is Used as General-Purpose I/O (default) EGP23 bit 0 Enable General-Purpose I/O for Ports 2 and 3 0: Port 2 is Used for External Memory, P3.6 and P3.7. Used for WR and RD. 1: Port 2 and Port3 are Used as General-Purpose I/O (default) Configuration Memory Programming Certain key functions such as Brownout Reset and Watchdog Timer are controlled by the hardware configuration bits. These bits are nonvolatile and can only be changed through serial and parallel programming. Other peripheral control and status functions, such as ADC configuration, timer setup, and Flash control, are controlled through the SFRs. 38 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 SFR Definitions (Boldface definitions indicate that the register is unique to the MSC1210Yx) ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 RESET VALUES 80h P0 P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 FFh 81h SP 07h 82h DPL0 00h 83h DPH0 00h 84h DPL1 00h 85h DPH1 00h 86h DPS 0 0 0 0 0 0 0 SEL 00h 87h PCON SMOD 0 1 1 GF1 GF0 STOP IDLE 30h 88h TCON TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 00h 89h TMOD −−−−−−−−−−−−−−− Timer 1 −−−−−−−−−−−−−−− GATE C/T M1 M0 −−−−−−−−−−−−−−− Timer 0 −−−−−−−−−−−−−−− GATE C/T M1 00h M0 8Ah TL0 00h 8Bh TL1 00h 8Ch TH0 00h 8Dh TH1 8Eh CKCON 0 0 T2M T1M T0M MD2 MD1 MD0 8Fh MWS 0 0 0 0 0 0 0 MXWS 00h 90h P1 P1.7 INT5/SCK P1.6 INT4/MISO P1.5 INT3/MOSI P1.4 INT2/SS P1.3 TXD1 P1.2 RXD1 P1.1 T2EX P1.0 T2 FFh 91h EXIF IE5 IE4 IE3 IE2 1 0 0 0 08h 92h MPAGE 00h 93h CADDR 00h 94h CDATA 00h 95h MCON BPSEL 0 0 98h SCON0 SM0_0 SM1_0 SM2_0 99h SBUF0 9Ah SPICON 9Bh SPIDATA 9Dh SPITCON A0h P2 A1h PWMCON A2h PWMLOW TONELOW PWM7 TDIV7 A3h PWMHI TONEHI A5h A6h 00h 01h RAMMAP 00h RI_0 00h 96h 97h REN_0 TB8_0 RB8_0 TI_0 00h SCK2 SCK1 SCK0 0 ORDER MSTR CPHA CPOL 00h 00h CLK_EN DRV_DLY DRV_EN P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 FFh PPOL PWMSEL SPDSEL TPCNTL2 TPCNTL1 TPCNTL0 00h PWM6 TDIV6 PWM5 TDIV5 PWM4 TDIV4 PWM3 TDIV3 PWM2 TDIV2 PWM1 TDIV1 PWM0 TDIV0 00h PWM15 TDIV15 PWM14 TDIV14 PWM13 TDIV13 PWM12 TDIV12 PWM11 TDIV11 PWM10 TDIV10 PWM9 TDIV9 PWM8 TDIV8 00h PAI 0 0 0 0 PAI3 PAI2 PAI1 PAI0 00h AIE ESEC ESUM EADC EMSEC ESPIT ESPIR EALV EDLVB 00h A7h AISTAT SEC SUM ADC MSEC SPIT SPIR ALVD DLVD 00h A8h IE EA ES1 ET2 ES0 ET1 EX1 ET0 EX0 00h A9h BPCON BP 0 0 0 0 0 PMSEL EBP 00h AAh BPL 00h ABh BPH 00h ACh P0DDRL P03H P03L P02H P02L P01H P01L P00H P00L 00h ADh P0DDRH P07H P07L P06H P06L P05H P05L P04H P04L 00h P2.7 P2.6 00h A4h 39 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 SFR Definitions (continued) (Boldface definitions indicate that the register is unique to the MSC1210Yx) ADDRESS REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 RESET VALUES AEh P1DDRL P13H P13L P12H P12L P11H P11L P10H P10L 00h AFh P1DDRH P17H P17L P16H P16L P15H P15L P14H P14L 00h B0h P3 P3.7 RD P3.6 WR P3.5 T1 P3.4 T0 P3.3 INT1 P3.2 INT0 P3.1 TXD0 P3.0 RXD0 FFh B1h P2DDRL P23H P23L P22H P22L P21H P21L P20H P20L 00h B2h P2DDRH P27H P27L P26H P26L P25H P25L P24H P24L 00h B3h P3DDRL P33H P33L P32H P32L P31H P31L P30H P30L 00h B4h P3DDRH P37H P37L P36H P36L P35H P35L P34H P34L 00h IP 1 PS1 PT2 PS0 PT1 PX1 PT0 PX0 80h C0h SCON1 SM0_1 SM1_1 SM2_1 REN_1 TB8_1 RB8_1 TI_1 RI_1 00h C1h SBUF1 B5h B6h B7h B8h B9h BAh BBh BCh BDh BEh BFh 00h C2h C3h C4h C5h C6h EWU EWUWDT EWUEX1 EWUEX0 00h TR2 C/T2 CP/RL2 00h C7h C8h T2CON TF2 EXF2 RCLK TCLK EXEN2 C9h CAh RCAP2L 00h CBh RCAP2H 00h CCh TL2 00h CDh TH2 00h CEh CFh D0h PSW D1h OCL D2h OCM D3h OCH D4h GCL D5h GCM D6h GCH MSB D7h ADMUX INP3 INP2 INP1 INP0 INN3 INN2 INN1 INN0 D8h EICON SMOD1 1 EAI AI WDTI 0 0 0 40h D9h ADRESL LSB 00h DAh ADRESM 40 CY AC F0 RS1 RS0 OV F1 P 00h LSB 00h 00h MSB 00h LSB 5Ah ECh 5Fh 01h 00h "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 SFR Definitions (continued) (Boldface definitions indicate that the register is unique to the MSC1210Yx) ADDRESS REGISTER BIT 7 DBh ADRESH MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 RESET VALUES DCh ADCON0 — BOD EVREF VREFH EBUF PGA2 PGA1 PGA0 30h DDh ADCON1 — POL SM1 SM0 — CAL2 CAL1 CAL0 0000_0000b DEh ADCON2 DR7 DR6 DR5 DR4 DR3 DR2 DR1 DR0 1Bh DFh ADCON3 0 0 0 0 0 DR10 DR9 DR8 06h E0h ACC E1h SSCON E2h SUMR0 00h E3h SUMR1 00h E4h SUMR2 00h E5h SUMR3 00h E6h ODAC E7h LVDCON ALVDIS ALVD2 ALVD1 ALVD0 DLVDIS DLVD2 DLVD1 DLVD0 00h E8h EIE 1 1 1 EWDI EX5 EX4 EX3 EX2 E0h E9h HWPC0 0 0 0 0 0 0 EAh HWPC1 0 0 0 0 0 0 EBh HDWVER xxh ECh Reserved 00h EDh Reserved 00h EEh FMCON 0 PGERA 0 FRCM 0 BUSY 1 0 02h EFh FTCON FER3 FER2 FER1 FER0 FWR3 FWR2 FWR1 FWR0 A5h F0h B B.7 B.6 B.5 B.4 B.3 B.2 B.1 B.0 00h F1h PDCON 0 0 0 PDPWM PDADC PDWDT PDST PDSPI 1Fh F2h PASEL 0 0 PSEN2 PSEN1 PSEN0 0 ALE1 ALE0 00h F6h ACLK 0 FREQ6 FREQ5 FREQ4 FREQ3 FREQ2 FREQ1 FREQ0 03h F7h SRST 0 0 0 0 0 0 0 RSTREQ 00h F8h EIP 1 1 1 PWDI PX5 PX4 PX3 PX2 E0h F9h SECINT WRT SECINT6 SECINT5 SECINT4 SECINT3 SECINT2 SECINT1 SECINT0 7Fh FAh MSINT WRT MSINT6 MSINT5 MSINT4 MSINT3 MSINT2 MSINT1 MSINT0 7Fh FBh USEC 0 0 0 FREQ4 FREQ3 FREQ2 FREQ1 FREQ0 FCh MSECL 9Fh FDh MSECH 0Fh FEh HMSEC FFh WDTCON 00h 00h SSCON1 SSCON0 SCNT2 SCNT1 SCNT0 SHF2 SHF1 SHF0 00h 00h MEMORY SIZE 0 0 0000_00xxb 00h F3h F4h F5h 03h 63h EWDT DWDT RWDT WDCNT4 WDCNT3 WDCNT2 WDCNT1 WDCNT0 00h 41 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Table 8. Special Function Register Cross Reference SFR ADDRESS FUNCTIONS CPU INTERRUPTS PORTS SERIAL COMM. POWER AND CLOCKS TIMER COUNTERS P0 80h Port 0 SP 81h Stack Pointer X DPL0 82h Data Pointer Low 0 X DPH0 83h Data Pointer High 0 X DPL1 84h Data Pointer Low 1 X DPH1 85h Data Pointer High 1 X DPS 86h Data Pointer Select X PCON 87h Power Control TCON 88h Timer/Counter Control X X TMOD 89h Timer Mode Control X X TL0 8Ah Timer0 LSB X TL1 8Bh Timer1 LSB X TH0 8Ch Timer0 MSB X TH1 8Dh Timer1 MSB CKCON 8Eh Clock Control MWS 8Fh Memory Write Select P1 90h Port 1 EXIF 91h External Interrupt Flag MPAGE 92h Memory Page CADDR 93h Configuration Address CDATA 94h Configuration Data MCON 95h Memory Control SCON0 98h Serial Port 0 Control X SBUF0 99h Serial Data Buffer 0 X SPI Control X I2C Control X SPI Data X I2C Data X SPI Transmit Control X SPICON I2CCON 9Ah SPIDATA I2CDATA 9Bh SPITCON I2CSTAT 9Dh A0h Port 2 PWMCON A1h PWM Control PWMLOW TONELOW A2h PWMHI TONEHI A3h FLASH MEMORY ADC X X X X X X X X X X X X X I2C Status P2 PWM X X X X X PWM Low Byte X Tone Low Byte X PWM HIgh Byte X Tone Low Byte X PAI A5h Pending Auxiliary Interrupt X X X X X X AIE A6h Auxiliary Interrupt Enable X X X X X X AISTAT A7h Auxiliary Interrupt Status X X X X X X IE A8h Interrupt Enable X BPCON A9h Breakpoint Control X X BPL AAh Breakpoint Low Address X X BPH ABh Breakpoint High Address X P0DDRL ACh Port 0 Data Direction Low X P0DDRH ADh Port 0 Data Direction High X P1DDRL AEh Port 1 Data Direction Low X P1DDRH AFh Port 1 Data Direction High X P3 B0h Port 3 X 42 X "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Table 8. Special Function Register Cross Reference (continued) SFR ADDRESS FUNCTIONS CPU INTERRUPTS PORTS SERIAL COMM. POWER AND CLOCKS TIMER COUNTERS PWM FLASH MEMORY ADC P2DDRL B1h Port 2 Data Direction Low X P2DDRH B2h Port 2 Data Direction High X P3DDRL B3h Port 3 Data Direction Low X P3DDRH B4h Port 3 Data Direction High IP B8h Interrupt Priority SCON1 C0h Serial Port 1 Control X SBUF1 C1h Serial Data Buffer 1 X EWU C6h Enable Wake Up X T2CON C8h Timer 2 Control X X RCAP2L CAh Timer 2 Capture LSB X X RCAP2H CBh Timer 2 Capture MSB X X TL2 CCh Timer 2 LSB TH2 CDh Timer 2 MSB PSW D0h Program Status Word OCL D1h ADC Offset Calibration Low Byte X OCM D2h ADC Offset Calibration Mid Byte X OCH D3h ADC Offset Calibration High Byte X GCL D4h ADC Gain Calibration Low Byte X GCM D5h ADC Gain Calibration Mid Byte X GCH D6h ADC Gain Calibration High Byte X ADMUX D7h ADC Input Multiplexer EICON D8h Enable Interrupt Control ADRESL D9h ADC Results Low Byte X ADRESM DAh ADC Results Middle Byte X ADRESH DBh ADC Results High Byte X ADCON0 DCh ADC Control 0 X ADCON1 DDh ADC Control 1 X ADCON2 DEh ADC Control 2 X ADCON3 DFh ADC Control 3 ACC E0h Accumulator X SSCON E1h Summation/Shifter Control X X SUMR0 E2h Summation 0 X X SUMR1 E3h Summation 1 X X SUMR2 E4h Summation 2 X X SUMR3 E5h Summation 3 X X ODAC E6h Offset DAC LVDCON E7h Low Voltage Detect Control EIE E8h Extended Interrupt Enable HWPC0 E9h Hardware Product Code 0 X HWPC1 EAh Hardware Product Code 1 X HWVER EBh Hardware Version X FMCON EEh Flash Memory Control X FTCON EFh Flash Memory Timing Control X X X X X X X X X X X X X X X X X 43 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Table 8. Special Function Register Cross Reference (continued) SFR ADDRESS FUNCTIONS CPU INTERRUPTS PORTS SERIAL COMM. POWER AND CLOCKS TIMER COUNTERS X X X PWM FLASH MEMORY B F0h Second Accumulator PDCON F1h Power Down Control PASEL F2h PSEN/ALE Select ACLK F6h Analog Clock SRST F7h System Reset EIP F8h Extended Interrupt Priority X SECINT F9h Seconds Timer Interrupt X X MSINT FAh Milliseconds Timer Interrupt X X USEC FBh One Microsecond TImer X MSECL FCh One Millisecond TImer Low Byte X X MSECH FDh One Millisecond Timer High Byte X X HMSEC FEh One Hundred Millisecond TImer X WDTCON FFh Watchdog Timer HCR0 3Fh Hardware Configuration Reg. 0 HCR1 3Eh Hardware Configuration Reg. 1 44 ADC X X X X X X X X X X X X X X "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 0 (P0) SFR 80h P0.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 FFh Port 0. This port functions as a multiplexed address/data bus during external memory access, and as a generalpurpose I/O port when external memory access is not needed. During external memory cycles, this port will contain the LSB of the address when ALE is HIGH, and Data when ALE is LOW. When used as a general-purpose I/O, this port drive is selected by P0DDRL and P0DDRH (ACh, ADh). Whether Port 0 is used as general-purpose I/O or for external memory access is determined by the Flash Configuration Register (HCR1.1) Stack Pointer (SP) SFR 81h SP.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value SP.7 SP.6 SP.5 SP.4 SP.3 SP.2 SP.1 SP.0 07h Stack Pointer. The stack pointer identifies the location where the stack will begin. The stack pointer is incremented before every PUSH or CALL operation and decremented after each POP or RET/RETI. This register defaults to 07h after reset. Data Pointer Low 0 (DPL0) SFR 82h DPL0.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value DPL0.7 DPL0.6 DPL0.5 DPL0.4 DPL0.3 DPL0.2 DPL0.1 DPL0.0 00h Data Pointer Low 0. This register is the low byte of the standard 8051 16-bit data pointer. DPL0 and DPH0 are used to point to non-scratchpad data RAM. The current data pointer is selected by DPS (SFR 86h). Data Pointer High 0 (DPH0) SFR 83h DPH0.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value DPH0.7 DPH0.6 DPH0.5 DPH0.4 DPH0.3 DPH0.2 DPH0.1 DPH0.0 00h Data Pointer High 0. This register is the high byte of the standard 8051 16-bit data pointer. DPL0 and DPH0 are used to point to non-scratchpad data RAM. The current data pointer is selected by DPS (SFR 86h). Data Pointer Low 1 (DPL1) SFR 84h DPL1.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value DPL1.7 DPL1.6 DPL1.5 DPL1.4 DPL1.3 DPL1.2 DPL1.1 DPL1.0 00h Data Pointer Low 1. This register is the low byte of the auxiliary 16-bit data pointer. When the SEL bit (DPS.0, SFR 86h) is set, DPL1 and DPH1 are used in place of DPL0 and DPH0 during DPTR operations. 45 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Data Pointer High 1 (DPH1) SFR 85h DPH1.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value DPH1.7 DPH1.6 DPH1.5 DPH1.4 DPH1.3 DPH1.2 DPH1.1 DPH1.0 00h Data Pointer High. This register is the high byte of the auxiliary 16-bit data pointer. When the SEL bit (DPS.0, SFR 86h) is set, DPL1 and DPH1 are used in place of DPL0 and DPH0 during DPTR operations. Data Pointer Select (DPS) SFR 86h SEL bit 0 7 6 5 4 3 2 1 0 Reset Value 0 0 0 0 0 0 0 SEL 00h Data Pointer Select. This bit selects the active data pointer. 0: Instructions that use the DPTR will use DPL0 and DPH0. 1: Instructions that use the DPTR will use DPL1 and DPH1. Power Control (PCON) SFR 87h 7 6 5 4 3 2 1 0 Reset Value SMOD 0 1 1 GF1 GF0 STOP IDLE 30h SMOD bit 7 Serial Port 0 Baud Rate Doubler Enable. The serial baud rate doubling function for Serial Port 0. 0: Serial Port 0 baud rate will be a standard baud rate. 1: Serial Port 0 baud rate will be double that defined by baud rate generation equation when using Timer 1. GF1 bit 3 General-Purpose User Flag 1. This is a general-purpose flag for software control. GF0 bit 2 General-Purpose User Flag 0. This is a general-purpose flag for software control. STOP bit 1 Stop Mode Select. Setting this bit will halt the oscillator and block external clocks. This bit will always read as a 0. All DACs and digital pins keep their respective output values. Exit with RESET. IDLE bit 0 Idle Mode Select. Setting this bit will freeze the CPU, Timer 0, 1, and 2, and the USARTs; other peripherals remain active. All DACs and digital pins keep their respective output values. This bit will always be read as a 0. Exit with AI (A6h) and EWU (C6h) interrupts.The internal reference remains unchanged. 46 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Timer/Counter Control (TCON) SFR 88h 7 6 5 4 3 2 1 0 Reset Value TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 00h TF1 bit 7 Timer 1 Overflow Flag. This bit indicates when Timer 1 overflows its maximum count as defined by the current mode. This bit can be cleared by software and is automatically cleared when the CPU vectors to the Timer 1 interrupt service routine. 0: No Timer 1 overflow has been detected. 1: Timer 1 has overflowed its maximum count. TR1 bit 6 Timer 1 Run Control. This bit enables/disables the operation of Timer 1. Halting this timer will preserve the current count in TH1, TL1. 0: Timer is halted. 1: Timer is enabled. TF0 bit 5 Timer 0 Overflow Flag. This bit indicates when Timer 0 overflows its maximum count as defined by the current mode. This bit can be cleared by software and is automatically cleared when the CPU vectors to the Timer 0 interrupt service routine. 0: No Timer 0 overflow has been detected. 1: Timer 0 has overflowed its maximum count. TR0 bit 4 Timer 0 Run Control. This bit enables/disables the operation of Timer 0. Halting this timer will preserve the current count in TH0, TL0. 0: Timer is halted. 1: Timer is enabled. IE1 bit 3 Interrupt 1 Edge Detect. This bit is set when an edge/level of the type defined by IT1 is detected. If IT1 = 1, this bit will remain set until cleared in software or the start of the External Interrupt 1 service routine. If IT1 = 0, this bit will inversely reflect the state of the INT1 pin. IT1 bit 2 Interrupt 1 Type Select. This bit selects whether the INT1 pin will detect edge or level triggered interrupts. 0: INT1 is level triggered. 1: INT1 is edge triggered. IE0 bit 3 Interrupt 0 Edge Detect. This bit is set when an edge/level of the type defined by IT0 is detected. If IT0 = 1, this bit will remain set until cleared in software or the start of the External Interrupt 0 service routine. If IT0 = 0, this bit will inversely reflect the state of the INT0 pin. IT0 bit 2 Interrupt 0 Type Select. This bit selects whether the INT0 pin will detect edge or level triggered interrupts. 0: INT0 is level triggered. 1: INT0 is edge triggered. 47 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Timer Mode Control (TMOD) 7 6 5 4 3 2 TIMER 1 SFR 89h GATE C/T 1 0 M1 M0 Reset Value 00h TIMER 0 M1 M0 GATE C/T GATE bit 7 Timer 1 Gate Control. This bit enables/disables the ability of Timer 1 to increment. 0: Timer 1 will clock when TR1 = 1, regardless of the state of pin INT1. 1: Timer 1 will clock only when TR1 = 1 and pin INT1 = 1. C/T bit 6 Timer 1 Counter/Timer Select. 0: Timer is incremented by internal clocks. 1: Timer is incremented by pulses on T1 pin when TR1 (TCON.6, SFR 88h) is 1. M1, M0 bits 5−4 Timer 1 Mode Select. These bits select the operating mode of Timer 1. M1 M0 0 0 MODE Mode 0: 8-bit counter with 5-bit prescale. 0 1 Mode 1: 16 bits. 1 0 Mode 2: 8-bit counter with auto reload. 1 1 Mode 3: Timer 1 is halted, but holds its count. GATE bit 3 Timer 0 Gate Control. This bit enables/disables the ability of Timer 0 to increment. 0: Timer 0 will clock when TR0 = 1, regardless of the state of pin INT0 (software control). 1: Timer 0 will clock only when TR0 = 1 and pin INT0 = 1 (hardware control). C/T bit 2 Timer 0 Counter/Timer Select. 0: Timer is incremented by internal clocks. 1: Timer is incremented by pulses on pin T0 when TR0 (TCON.4, SFR 88h) is 1. M1, M0 bits 1−0 Timer 0 Mode Select. These bits select the operating mode of Timer 0. M1 M0 MODE 0 0 Mode 0: 8-bit counter with 5-bit prescale. 0 1 Mode 1: 16 bits. 1 0 Mode 2: 8-bit counter with auto reload. 1 1 Mode 3: Two 8-bit counters. Timer 0 LSB (TL0) SFR 8Ah TL0.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value TL0.7 TL0.6 TL0.5 TL0.4 TL0.3 TL0.2 TL0.1 TL0.0 00h Timer 0 LSB. This register contains the least significant byte of Timer 0. Timer 1 LSB (TL1) SFR 8Bh TL1.7−0 bits 7−0 48 7 6 5 4 3 2 1 0 Reset Value TL1.7 TL1.6 TL1.5 TL1.4 TL1.3 TL1.2 TL1.1 TL1.0 00h Timer 1 LSB. This register contains the least significant byte of Timer 1. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Timer 0 MSB (TH0) SFR 8Ch TH0.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value TH0.7 TH0.6 TH0.5 TH0.4 TH0.3 TH0.2 TH0.1 TH0.0 00h Timer 0 MSB. This register contains the most significant byte of Timer 0. Timer 1 MSB (TH1) SFR 8Dh TH1.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value TH1.7 TH1.6 TH1.5 TH1.4 TH1.3 TH1.2 TH1.1 TH1.0 00h Timer 1 MSB. This register contains the most significant byte of Timer 1. Clock Control (CKCON) SFR 8Eh 7 6 5 4 3 2 1 0 Reset Value 0 0 T2M T1M T0M MD2 MD1 MD0 01h T2M bit 5 Timer 2 Clock Select. This bit controls the division of the system clock that drives Timer 2. This bit has no effect when the timer is in baud rate generator or clock output mode. Clearing this bit to 0 maintains 8051 compatibility. This bit has no effect on instruction cycle timing. 0: Timer 2 uses a divide-by-12 of the crystal frequency. 1: Timer 2 uses a divide-by-4 of the crystal frequency. T1M bit 4 Timer 1 Clock Select. This bit controls the division of the system clock that drives Timer 1. Clearing this bit to 0 maintains 8051 compatibility. This bit has no effect on instruction cycle timing. 0: Timer 1 uses a divide-by-12 of the crystal frequency. 1: Timer 1 uses a divide-by-4 of the crystal frequency. T0M bit 3 Timer 0 Clock Select. This bit controls the division of the system clock that drives Timer 0. Clearing this bit to 0 maintains 8051 compatibility. This bit has no effect on instruction cycle timing. 0: Timer 0 uses a divide-by-12 of the crystal frequency. 1: Timer 0 uses a divide-by-4 of the crystal frequency. MD2, MD1, MD0 bits 2−0 Stretch MOVX Select 2−0. These bits select the time by which external MOVX cycles are to be stretched. This allows slower memory or peripherals to be accessed without using ports or manual software intervention. The width of the RD or WR strobe will be stretched by the specified interval, which will be transparent to the software except for the increased time to execute the MOVX instruction. All internal MOVX instructions on devices containing MOVX SRAM are performed at the 2 instruction cycle rate. MD2 MD1 MD0 STRETCH VALUE MOVX DURATION RD or WR STROBE WIDTH (SYS CLKs) RD or WR STROBE WIDTH (ms) at 12MHz 0 0 0 0 0 1 0 2 Instruction Cycles 2 0.167 1 3 Instruction Cycles (default)(1) 4 0 1 0.333 0 2 4 Instruction Cycles 8 0 0.667 1 1 3 5 Instruction Cycles 12 1.000 1 0 0 4 6 Instruction Cycles 16 1.333 1 0 1 5 7 Instruction Cycles 20 1.667 1 1 0 6 8 Instruction Cycles 24 2.000 1 1 1 7 9 Instruction Cycles 28 2.333 (1) For applications without external memory, no extra cycle is needed. To increase speed, set MD2, MD1, and MD0 to ‘000’. 49 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Memory Write Select (MWS) SFR 8Fh MXWS bit 0 7 6 5 4 3 2 1 0 Reset Value 0 0 0 0 0 0 0 MXWS 00h MOVX Write Select. This allows writing to the internal Flash program memory. 0: No writes are allowed to the internal Flash program memory. 1: Writing is allowed to the internal Flash program memory, unless PML (HCR0) or RSL (HCR0) are on. Port 1 (P1) SFR 90h 7 6 5 4 3 2 1 0 Reset Value P1.7 INT5/SCK P1.6 INT4/MISO P1.5 INT3/MOSI P1.4 INT2/SS P1.3 TXD1 P1.2 RXD1 P1.1 T2EX P1.0 T2 FFh P1.7−0 bits 7−0 General-Purpose I/O Port 1. This register functions as a general-purpose I/O port. In addition, all the pins have an alternative function listed below. Each of the functions is controlled by several other SFRs. The associated Port 1 latch bit must contain a logic ‘1’ before the pin can be used in its alternate function capacity. To use the alternate function, set the appropriate mode in P1DDRL (SFR AEh), P1DDRH (SFR AFh). INT5/SCK bit 7 External Interrupt 5. A falling edge on this pin will cause an external interrupt 5 if enabled. SPI Clock. The master clock for SPI data transfers. INT4/MISO External Interrupt 4. A rising edge on this pin will cause an external interrupt 4 if enabled. bit 6 Master In Slave Out. For SPI data transfers, this pin receives data for the master and transmits data from the slave. INT3/MOSI External Interrupt 3. A falling edge on this pin will cause an external interrupt 3 if enabled. bit 5 Master Out Slave In. For SPI data transfers, this pin transmits master data and receives slave data. INT2/SS bit 4 External Interrupt 2. A rising edge on this pin will cause an external interrupt 2 if enabled. Slave Select. During SPI operation, this pin provides the select signal for the slave device but does not control the output drive of MISO. TXD1 bit 3 Serial Port 1 Transmit. This pin transmits the serial Port 1 data in serial port modes 1, 2, 3, and emits the synchronizing clock in serial port mode 0. RXD1 bit 2 Serial Port 1 Receive. This pin receives the serial Port 1 data in serial port modes 1, 2, 3, and is a bidirectional data transfer pin in serial port mode 0. T2EX bit 1 Timer 2 Capture/Reload Trigger. A 1 to 0 transition on this pin will cause the value in the T2 registers to be transferred into the capture registers, if enabled by EXEN2 (T2CON.3, SFR C8h). When in auto-reload mode, a 1 to 0 transition on this pin will reload the Timer 2 registers with the value in RCAP2L and RCAP2H if enabled by EXEN2 (T2CON.3, SFR C8h). T2 bit 0 Timer 2 External Input. A 1 to 0 transition on this pin will cause Timer 2 to increment. 50 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 External Interrupt Flag (EXIF) SFR 91h 7 6 5 4 3 2 1 0 Reset Value IE5 IE4 IE3 IE2 1 0 0 0 08h IE5 bit 7 External Interrupt 5 Flag. This bit will be set when a falling edge is detected on INT5. This bit must be cleared manually by software. Setting this bit in software will cause an interrupt if enabled. IE4 bit 6 External Interrupt 4 Flag. This bit will be set when a rising edge is detected on INT4. This bit must be cleared manually by software. Setting this bit in software will cause an interrupt if enabled. IE3 bit 5 External Interrupt 3 Flag. This bit will be set when a falling edge is detected on INT3. This bit must be cleared manually by software. Setting this bit in software will cause an interrupt if enabled. IE2 bit 4 External Interrupt 2 Flag. This bit will be set when a rising edge is detected on INT2. This bit must be cleared manually by software. Setting this bit in software will cause an interrupt if enabled. Memory Page (MPAGE) 7 6 5 4 3 2 1 0 SFR 92h MPAGE bits 7−0 Reset Value 00h The 8051 uses Port 2 for the upper 8 bits of the external data memory access by MOVX A,@Ri and MOVX @Ri,A instructions. The MSC1210 uses register MPAGE instead of Port 2. To access external data memory using the MOVX A,@Ri and MOVX @Ri,A instructions, the user should preload the upper byte of the address into MPAGE (versus preloading into P2 for the standard 8051). Configuration Address Register (CADDR) (write-only) 7 6 5 4 3 2 1 0 SFR 93h CADDR bits 7−0 Reset Value 00h Configuration Address Register. This register supplies the address for reading bytes in the 128 bytes of Flash Configuration memory. This is a write-only register. CAUTION: If this register is written to while executing from Flash Memory, the CDATA register will be incorrect. The faddr_data_read routine in the Boot ROM can be used for this purpose. Configuration Data Register (CDATA) (read-only) 7 SFR 94h CDATA bits 7−0 6 5 4 3 2 1 0 Reset Value 00h Configuration Data Register. This register will contain the data in the 128 bytes of Flash Configuration memory that are located at the last written address in the CADDR register. This is a read-only register. 51 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Memory Control (MCON) SFR 95h 7 6 5 4 3 2 1 0 Reset Value BPSEL 0 0 — — — — RAMMAP 00h BPSEL bit 7 Breakpoint Address Selection Write: Select one of two Breakpoint registers: 0 or 1. 0: Select breakpoint register 0. 1: Select breakpoint register 1. Read: Provides the Breakpoint register that created the last interrupt: 0 or 1. RAMMAP bit 0 Memory Map 1kB extended SRAM. 0: Address is: 0000h—03FFh (default) (Data Memory) 1: Address is 8400h—87FFh (Data and Program Memory) Serial Port 0 Control (SCON0) SFR 98h SM0−2 bits 7−5 7 6 5 4 3 2 1 0 Reset Value SM0_0 SM1_0 SM2_0 REN_0 TB8_0 RB8_0 TI_0 RI_0 00h Serial Port 0 Mode. These bits control the mode of serial Port 0. Modes 1, 2, and 3 have 1 start and 1 stop bit in addition to the 8 or 9 data bits. MODE SM0 SM1 SM2 0 0 0 0 0 0 0 1 Synchronous Synchronous 8 bits 8 bits 12 pCLK(1) 4 pCLK(1) 1(2) 1(2) 0 0 1 1 0 1 Asynchronous Valid Stop Required(3) 10 bits 10 bits Timer 1 or 2 Baud Rate Equation Timer 1 Baud Rate Equation 2 1 0 0 Asynchronous 11 bits 2 1 0 1 Asynchronous with Multiprocessor Communication(4) 11 bits 64 pCLK(1) (SMOD = 0) 32 pCLK(1) (SMOD = 1) 64 pCLK(1) (SMOD = 0) 32 pCLK(1) (SMOD = 1) 3(2) 3(2) 1 1 1 1 0 1 Asynchronous Asynchronous with Multiprocessor Communication(4) 11 bits 11 bits (1) (2) (3) (4) FUNCTION LENGTH PERIOD Timer 1 or 2 Baud Rate Equation Timer 1 or 2 Baud Rate Equation pCLK will be equal to tCLK, except that pCLK will stop for IDLE. For modes 1 and 3, the selection of Timer 1 or 2 for baud rate is specified via the T2CON (C8h) register. RI_0 will only be activated when a valid STOP is received. RI_0 will not be activated if bit 9 = 0. REN_0 bit 4 Receive Enable. This bit enables/disables the serial Port 0 received shift register. 0: Serial Port 0 reception disabled. 1: Serial Port 0 received enabled (modes 1, 2, and 3). Initiate synchronous reception (mode 0). TB8_0 bit 3 9th Transmission Bit State. This bit defines the state of the 9th transmission bit in serial Port 0 modes 2 and 3. RB8_0 bit 2 9th Received Bit State. This bit identifies the state of the 9th reception bit of received data in serial Port 0 modes 2 and 3. In serial port mode 1, when SM2_0 = 0, RB8_0 is the state of the stop bit. RB8_0 is not used in mode 0. TI_0 bit 1 Transmitter Interrupt Flag. This bit indicates that data in the serial Port 0 buffer has been completely shifted out. In serial port mode 0, TI_0 is set at the end of the 8th data bit. In all other modes, this bit is set at the end of the last data bit. This bit must be manually cleared by software. RI_0 bit 0 Receiver Interrupt Flag. This bit indicates that a byte of data has been received in the serial Port 0 buffer. In serial port mode 0, RI_0 is set at the end of the 8th bit. In serial port mode 1, RI_0 is set after the last sample of the incoming stop bit subject to the state of SM2_0. In modes 2 and 3, RI_0 is set after the last sample of RB8_0. This bit must be manually cleared by software. 52 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Serial Data Buffer 0 (SBUF0) 7 6 5 4 3 2 1 0 SFR 99h SBUF0 bits 7−0 Reset Value 00h Serial Data Buffer 0. Data for Serial Port 0 is read from or written to this location. The serial transmit and receive buffers are separate registers, but both are addressed at this location. SPI Control (SPICON). Any change resets the SPI interface, counters, and pointers. PDCON controls which is enabled. SFR 9Ah SCK bits 7−5 7 6 5 4 3 2 1 0 Reset Value SCK2 SCK1 SCK0 0 ORDER MSTR CPHA CPOL 00h 0 Reset Value SCK Selection. Selection of tCLK divider for generation of SCK in Master mode. SCK2 SCK1 SCK0 SCK PERIOD 0 0 0 0 0 1 tCLK/2 tCLK/4 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 tCLK/8 tCLK/16 tCLK/32 tCLK/64 tCLK/128 tCLK/256 ORDER bit 3 Set Bit Order for Transmit and Receive. 0: Most Significant Bits First 1: Least Significant Bits First MSTR bit 2 SPI Master Mode. 0: Slave Mode 1: Master Mode CPHA bit 1 Serial Clock Phase Control. 0: Valid data starting from half SCK period before the first edge of SCK 1: Valid data starting from the first edge of SCK CPOL bit 0 Serial Clock Polarity. 0: SCK idle at logic LOW 1: SCK idle at logic HIGH SPI Data Register (SPIDATA) 7 SFR 9Bh SPIDATA bits 7−0 6 5 4 3 2 1 00h SPI Data Register. Data for SPI is read from or written to this location. The SPI transmit and receive buffers are separate registers, but both are addressed at this location. Read to clear the receive interrupt and write to clear the transmit interrupt. 53 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 SPI Transmit Control Register (SPITCON) 7 6 SFR 9Dh 5 4 3 CLK_EN DRV_DLY DRV_EN CLK_EN bit 5 SCK Driver Enable. 0: Disable SCK Driver (Master Mode) 1: Enable SCK Driver (Master Mode) DRV_DLY bit 4 Drive Delay. (Refer to DRV_EN bit) 0: Drive output immediately 1: Drive output after current byte transfer DRV_EN bit 3 Drive Enable. DRV_DLY DRV_EN 0 0 Tristate immediately 0 1 Drive immediately 1 0 Tristate after the current byte transfer 1 1 Drive after the current byte transfer 2 1 0 Reset Value 00h MOSI or MISO OUTPUT CONTROL Port 2 (P2) 7 6 5 4 3 2 1 0 SFR A0h P2 bits 7−0 Reset Value FFh Port 2. This port functions as an address bus during external memory access, and as a general-purpose I/O port. During external memory cycles, this port will contain the MSB of the address. Whether Port 2 is used as general-purpose I/O or for external memory access is determined by the Flash Configuration Register (HCR1.0). PWM Control (PWMCON) SFR A1h 7 6 5 4 3 2 1 0 Reset Value — — PPOL PWMSEL SPDSEL TPCNTL2 TPCNTL1 TPCNTL0 00h PPOL bit 5 Period Polarity. Specifies the starting level of the PWM pulse. 0: ON Period. PWM Duty register programs the ON period. 1: OFF Period. PWM Duty register programs the OFF period. PWMSEL bit 4 PWM Register Select. Select which 16-bit register is accessed by PWMLOW/PWMHIGH. 0: Period (must be 0 for TONE mode) 1: Duty SPDSEL bit 3 Speed Select. 0: 1MHz (the USEC Clock) 1: SYSCLK TPCNTL bits 2−0 Tone Generator/Pulse Width Modulation Control. 54 TPCNTL.2 TPCNTL.1 TPCNTL.0 MODE 0 0 0 Disable (default) 0 0 1 PWM 0 1 1 TONE—Square 1 1 1 TONE—Staircase "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Tone Low (TONELOW)/PWM Low (PWMLOW) SFR A2h 7 6 5 4 3 2 1 0 Reset Value TDIV7 PWM7 TDIV6 PWM6 TDIV5 PWM5 TDIV4 PWM4 TDIV3 PWM3 TDIV2 PWM2 TDIV1 PWM1 TDIV0 PWM0 00h TDIV7−0 bits 7−0 Tone Divisor. The low order bits that define the half-time period. For staircase mode the output is high impedance for the last 1/4 of this period. PWMLOW bits 7−0 Pulse Width Modulator Low Bits. These 8 bits are the least significant 8 bits of the PWM register. Tone High (TONEHI)/PWM High (PWMHI) SFR A3h 7 6 5 4 3 2 1 0 Reset Value TDIV15 PWM15 TDIV14 PWM14 TDIV13 PWM13 TDIV12 PWM12 TDIV11 PWM11 TDIV10 PWM10 TDIV9 PWM9 TDIV8 PWM8 00h TDIV15−8 bits 7−0 Tone Divisor. The high order bits that define the half time period. For staircase mode the output is high impedance for the last 1/4 of this period. PWMHI bits 7−0 Pulse Width Modulator High Bits. These 8 bits are the high order bits of the PWM register. Pending Auxiliary Interrupt (PAI) SFR A5h PAI bits 3−0 7 6 5 4 3 2 1 0 Reset Value — — — — PAI3 PAI2 PAI1 PAI0 00h Pending Auxiliary Interrupt Register. The results of this register can be used as an index to vector to the appropriate interrupt routine. All of these interrupts vector through address 0033h. PAI3 PAI2 PAI1 PAI0 AUXILIARY INTERRUPT STATUS 0 0 0 0 No Pending Auxiliary IRQ 0 0 0 1 Digital Low Voltage IRQ Pending 0 0 1 0 Analog Low Voltage IRQ Pending 0 0 1 1 SPI Receive IRQ Pending. 0 1 0 0 SPI Transmit IRQ Pending. 0 1 0 1 One Millisecond System Timer IRQ Pending. 0 1 1 0 Analog-to-Digital Conversion IRQ Pending. 0 1 1 1 Accumulator IRQ Pending. 1 0 0 0 One Second System Timer IRQ Pending. 55 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Auxiliary Interrupt Enable (AIE) SFR A6h 7 6 5 4 3 2 1 0 Reset Value ESEC ESUM EADC EMSEC ESPIT ESPIR EALV EDLVB 00h Interrupts are enabled by EICON.4 (SFR D8H). The other interrupts are controlled by the IE and EIE registers. ESEC bit 7 Enable Seconds Timer Interrupt (lowest priority auxiliary interrupt). Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of Seconds Timer Interrupt before masking. ESUM bit 6 Enable Summation Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of Summation Interrupt before masking. EADC bit 5 Enable ADC Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of ADC Interrupt before masking. EMSEC bit 4 Enable Millisecond System Timer Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of Millisecond System Timer Interrupt before masking. ESPIT bit 3 Enable SPI Transmit Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of SPI Transmit Interrupt before masking. ESPIR bit 2 Enable SPI Receive Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of SPI Receive Interrupt before masking. EALV bit 1 Enable Analog Low Voltage Interrupt. Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of Analog Low Voltage Interrupt before masking. EDLVB bit 0 Enable Digital Low Voltage or Breakpoint Interrupt (highest priority auxiliary interrupt). Write: Set mask bit for this interrupt 0 = masked, 1 = enabled. Read: Current value of Digital Low Voltage or Breakpoint Interrupt before masking. 56 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Auxiliary Interrupt Status Register (AISTAT) SFR A7h 7 6 5 4 3 2 1 0 Reset Value SEC SUM ADC MSEC SPIT SPIR ALVD DLVD 00h SEC bit 7 Second System Timer Interrupt Status Flag (lowest priority AI). 0: SEC interrupt inactive or masked. 1: SEC Interrupt active. (It is set inactive by reading the SECINT register.) SUM bit 6 Summation Register Interrupt Status Flag. 0: SUM interrupt inactive or masked. 1: SUM interrupt active. (It is set inactive by reading the lowest byte of the Summation register.) ADC bit 5 ADC Interrupt Status Flag. 0: ADC interrupt inactive or masked (If active, it is set inactive by reading the lowest byte of the Data Output Register). 1: ADC interrupt active. (If active, no new data will be written to the Data Output Register.) MSEC bit 4 Millisecond System Timer Interrupt Status Flag. 0: MSEC interrupt inactive or masked. 1: MSEC interrupt active. (It is set inactive by reading the MSINT register.) SPIT bit 3 SPI Transmit Interrupt Status Flag. 0: SPI transmit interrupt inactive or masked. 1: SPI transmit interrupt active. (It is set inactive by writing to the SPIDATA register.) SPIR bit 2 SPI Receive Interrupt Status Flag. 0: SPI receive interrupt inactive or masked. 1: SPI receive interrupt active. (It is set inactive by reading from the SPIDATA register.) ALVD bit 1 Analog Low Voltage Detect Interrupt Status Flag. 0: ALVD interrupt inactive or masked. 1: ALVD interrupt active. (Interrupt stays active until the AVDD voltage exceeds the threshold.) DLVD bit 0 Digital Low Voltage Detect or Breakpoint Interrupt Status Flag (highest priority AI). 0: DLVD interrupt inactive or masked. 1: DLVD interrupt active. (Interrupt stays active until the DVDD voltage exceeds the threshold or the Breakpoint is cleared.) 57 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Interrupt Enable (IE) SFR A8h 7 6 5 4 3 2 1 0 Reset Value EA ES1 ET2 ES0 ET1 EX1 ET0 EX0 00h EA bit 7 Global Interrupt Enable. This bit controls the global masking of all interrupts except those in AIE (SFR A6h). 0: Disable interrupt sources. This bit overrides individual interrupt mask settings for this register. 1: Enable all individual interrupt masks. Individual interrupts in this register will occur if enabled. ES1 bit 6 Enable Serial Port 1 Interrupt. This bit controls the masking of the serial Port 1 interrupt. 0: Disable all serial Port 1 interrupts. 1: Enable interrupt requests generated by the RI_1 (SCON1.0, SFR C0h) or TI_1 (SCON1.1, SFR C0h) flags. ET2 bit 5 Enable Timer 2 Interrupt. This bit controls the masking of the Timer 2 interrupt. 0: Disable all Timer 2 interrupts. 1: Enable interrupt requests generated by the TF2 flag (T2CON.7, SFR C8h). ES0 bit 4 Enable Serial port 0 interrupt. This bit controls the masking of the serial Port 0 interrupt. 0: Disable all serial Port 0 interrupts. 1: Enable interrupt requests generated by the RI_0 (SCON0.0, SFR 98h) or TI_0 (SCON0.1, SFR 98h) flags. ET1 bit 3 Enable Timer 1 Interrupt. This bit controls the masking of the Timer 1 interrupt. 0: Disable Timer 1 interrupt. 1: Enable interrupt requests generated by the TF1 flag (TCON.7, SFR 88h). EX1 bit 2 Enable External Interrupt 1. This bit controls the masking of external interrupt 1. 0: Disable external interrupt 1. 1: Enable interrupt requests generated by the INT1 pin. ET0 bit 1 Enable Timer 0 Interrupt. This bit controls the masking of the Timer 0 interrupt. 0: Disable all Timer 0 interrupts. 1: Enable interrupt requests generated by the TF0 flag (TCON.5, SFR 88h). EX0 bit 0 Enable External Interrupt 0. This bit controls the masking of external interrupt 0. 0: Disable external interrupt 0. 1: Enable interrupt requests generated by the INT0 pin. 58 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Breakpoint Control (BPCON) SFR A9h 7 6 5 4 3 2 1 0 Reset Value BP 0 0 0 0 0 PMSEL EBP 00h Writing to register sets the breakpoint condition specified by MCON, BPL, and BPH. BP bit 7 Breakpoint Interrupt. This bit indicates that a break condition has been recognized by a hardware breakpoint register(s). Read: Status of Breakpoint Interrupt. Will indicate a breakpoint match for any of the breakpoint registers. Write: 0: No effect. 1: Clear Breakpoint 1 for breakpoint register selected by MCON (SFR 95h). PMSEL bit 1 Program Memory Select. Write this bit to select memory for address breakpoints of register selected in MCON (SFR 95h). 0: Break on address in data memory. 1: Break on address in program memory. EBP bit 0 Enable Breakpoint. This bit enables this breakpoint register. Address of breakpoint register selected by MCON (SFR 95h). 0: Breakpoint disabled. 1: Breakpoint enabled. Breakpoint Low (BPL) Address for BP Register Selected in MCON (95h) SFR AAh BPL.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value BPL.7 BPL.6 BPL.5 BPL.4 BPL.3 BPL.2 BPL.1 BPL.0 00h Breakpoint Low Address. The low 8 bits of the 16-bit breakpoint address. Breakpoint High Address (BPH) Address for BP Register Selected in MCON (95h) SFR ABh BPH.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value BPH.7 BPH.6 BPH.5 BPH.4 BPH.3 BPH.2 BPH.1 BPH.0 00h Breakpoint High Address. The high 8 bits of the 16-bit breakpoint address. 59 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 0 Data Direction Low Register (P0DDRL) SFR ACh P0.3 bits 7−6 P0.2 bits 5−4 P0.1 bits 3−2 P0.0 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P03H P03L P02H P02L P01H P01L P00H P00L 00h Port 0 Bit 3 Control. P03H P03L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 2 Control. P02H P02L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 1 Control. P01H P01L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 0 Control. P00H P00L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 0 also controlled by EA and Memory Access Control HCR1.1. 60 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 0 Data Direction High Register (P0DDRH) SFR ADh P0.7 bits 7−6 P0.6 bits 5−4 P0.5 bits 3−2 P0.4 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P07H P07L P06H P06L P05H P05L P04H P04L 00h Port 0 Bit 7 Control. P07H P07L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 6 Control. P06H P06L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 5 Control. P05H P05L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 0 Bit 4 Control. P04H P04L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 0 also controlled by EA and Memory Access Control HCR1.1. 61 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 1 Data Direction Low Register (P1DDRL) SFR AEh P1.3 bits 7−6 P1.2 bits 5−4 P1.1 bits 3−2 P1.0 bits 1−0 62 7 6 5 4 3 2 1 0 Reset Value P13H P13L P12H P12L P11H P11L P10H P10L 00h Port 1 Bit 3 Control. P13H P13L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 2 Control. P12H P12L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 1 Control. P11H P11L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 0 Control. P10H P10L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 1 Data Direction High Register (P1DDRH) SFR AFh P1.7 bits 7−6 P1.6 bits 5−4 P1.5 bits 3−2 P1.4 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P17H P17L P16H P16L P15H P15L P14H P14L 00h Port 1 Bit 7 Control. P17H P17L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 6 Control. P16H P16L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 5 Control. P15H P15L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 1 Bit 4 Control. P14H P14L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input 63 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 3 (P3) SFR B0h 7 6 5 4 3 2 1 0 Reset Value P3.7 RD P3.6 WR P3.5 T1 P3.4 T0 P3.3 INT1 P3.2 INT0 P3.1 TXD0 P3.0 RXD0 FFh P3.7−0 bits 7−0 General-Purpose I/O Port 3. This register functions as a general-purpose I/O port. In addition, all the pins have an alternative function listed below. Each of the functions is controlled by several other SFRs. The associated Port 3 latch bit must contain a logic ‘1’ before the pin can be used in its alternate function capacity. RD bit 7 External Data Memory Read Strobe. This pin provides an active low read strobe to an external memory device. If Port 0 or Port 2 is selected for external memory in the HCR1 register, this function will be enabled even if a ‘1’ is not written to this latch bit. When external memory is selected, the settings of P3DRRH are ignored. WR bit 6 External Data Memory Write Strobe. This pin provides an active low write strobe to an external memory device. If Port 0 or Port 2 is selected for external memory in the HCR1 register, this function will be enabled even if a ‘1’ is not written to this latch bit. When external memory is selected, the settings of P3DRRH are ignored. T1 bit 5 Timer/Counter 1 External Input. A 1 to 0 transition on this pin will increment Timer 1. T0 bit 4 Timer/Counter 0 External Input. A 1 to 0 transition on this pin will increment Timer 0. INT1 bit 3 External Interrupt 1. A falling edge/low level on this pin will cause an external interrupt 1 if enabled. INT0 bit 2 External Interrupt 0. A falling edge/low level on this pin will cause an external interrupt 0 if enabled. TXD0 bit 1 Serial Port 0 Transmit. This pin transmits the serial Port 0 data in serial port modes 1, 2, 3, and emits the synchronizing clock in serial port mode 0. RXD0 bit 0 Serial Port 0 Receive. This pin receives the serial Port 0 data in serial port modes 1, 2, 3, and is a bidirectional data transfer pin in serial port mode 0. 64 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 2 Data Direction Low Register (P2DDRL) SFR B1h P2.3 bits 7−6 P2.2 bits 5−4 P2.1 bits 3−2 P2.0 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P23H P23L P22H P22L P21H P21L P20H P20L 00h Port 2 Bit 3 Control. P23H P23L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 2 Control. P22H P22L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 1 Control. P21H P21L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 0 Control. P20H P20L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 2 also controlled by EA and Memory Access Control HCR1.1. 65 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 2 Data Direction High Register (P2DDRH) SFR B2h P2.7 bits 7−6 P2.6 bits 5−4 P2.5 bits 3−2 P2.4 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P27H P27L P26H P26L P25H P25L P24H P24L 00h Port 2 Bit 7 Control. P27H P27L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 6 Control. P26H P26L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 5 Control. P25H P25L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 2 Bit 4 Control. P24H P24L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 2 also controlled by EA and Memory Access Control HCR1.1. 66 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 3 Data Direction Low Register (P3DDRL) SFR B3h P3.3 bits 7−6 P3.2 bits 5−4 P3.1 bits 3−2 P3.0 bits 1−0 7 6 5 4 3 2 1 0 Reset Value P33H P33L P32H P32L P31H P31L P30H P30L 00h Port 3 Bit 3 Control. P33H P33L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 3 Bit 2 Control. P32H P32L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 3 Bit 1 Control. P31H P31L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 3 Bit 0 Control. P30H P30L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input 67 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Port 3 Data Direction High Register (P3DDRH) SFR B4h P3.7 bits 7−6 7 6 5 4 3 2 1 0 Reset Value P37H P37L P36H P36L P35H P35L P34H P34L 00h Port 3 Bit 7 Control. P37H P37L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 3.7 also controlled by EA and Memory Access Control HCR1.1. P3.6 bits 5−4 Port 3 Bit 6 Control. P36H P36L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input NOTE: Port 3.6 also controlled by EA and Memory Access Control HCR1.1. P3.5 bits 3−2 P3.4 bits 1−0 68 Port 3 Bit 5 Control. P35H P35L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input Port 3 Bit 4 Control. P34H P34L 0 0 Standard 8051 (Pull-Up) 0 1 CMOS Output 1 0 Open Drain Output 1 1 Input "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Interrupt Priority (IP) SFR B8h 7 6 5 4 3 2 1 0 Reset Value 1 PS1 PT2 PS0 PT1 PX1 PT0 PX0 80h PS1 bit 6 Serial Port 1 Interrupt. This bit controls the priority of the serial Port 1 interrupt. 0 = Serial Port 1 priority is determined by the natural priority order. 1 = Serial Port 1 is a high priority interrupt. PT2 bit 5 Timer 2 Interrupt. This bit controls the priority of the Timer 2 interrupt. 0 = Timer 2 priority is determined by the natural priority order. 1 = Timer 2 priority is a high priority interrupt. PS0 bit 4 Serial Port 0 Interrupt. This bit controls the priority of the serial Port 0 interrupt. 0 = Serial Port 0 priority is determined by the natural priority order. 1 = Serial Port 0 is a high priority interrupt. PT1 bit 3 Timer 1 Interrupt. This bit controls the priority of the Timer 1 interrupt. 0 = Timer 1 priority is determined by the natural priority order. 1 = Timer 1 priority is a high priority interrupt. PX1 bit 2 External Interrupt 1. This bit controls the priority of external interrupt 1. 0 = External interrupt 1 priority is determined by the natural priority order. 1 = External interrupt 1 is a high priority interrupt. PT0 bit 1 Timer 0 Interrupt. This bit controls the priority of the Timer 0 interrupt. 0 = Timer 0 priority is determined by the natural priority order. 1 = Timer 0 priority is a high priority interrupt. PX0 bit 0 External Interrupt 0. This bit controls the priority of external interrupt 0. 0 = External interrupt 0 priority is determined by the natural priority order. 1 = External interrupt 0 is a high priority interrupt. 69 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Serial Port 1 Control (SCON1) SFR C0h SM0−2 bits 7−5 7 6 5 4 3 2 1 0 Reset Value SM0_1 SM1_1 SM2_1 REN_1 TB8_1 RB8_1 TI_1 RI_1 00h Serial Port 1 Mode. These bits control the mode of serial Port 1. Modes 1, 2, and 3 have 1 start and 1 stop bit in addition to the 8 or 9 data bits. MODE SM0 SM1 SM2 0 0 0 0 0 0 0 1 FUNCTION Synchronous Synchronous LENGTH 8 bits 8 bits PERIOD 12 pCLK(1) 4 pCLK(1) 1 1 0 0 1 1 0 1 Asynchronous Valid Stop Required(2) 10 bits 10 bits Timer 1 Baud Rate Equation Timer 1 or Baud Rate Equation 2 1 0 0 Asynchronous 11 bits 2 1 0 1 Asynchronous with Multiprocessor Communication(3) 11 bits 64 pCLK(1) (SMOD = 0) 32 pCLK(1) (SMOD = 1) 64 pCLK(1) (SMOD = 0) 32 pCLK(1) (SMOD = 1) 3 3 1 1 1 1 0 1 Asynchronous Asynchronous with Multiprocessor Communication(3) 11 bits 11 bits Timer 1 Baud Rate Equation Timer 1 Baud Rate Equation (1) p CLK will be equal to tCLK, except that pCLK will stop for IDLE. (2) RI_0 will only be activated when a valid STOP is received. (3) RI_0 will not be activated if bit 9 = 0. REN_1 bit 4 Receive Enable. This bit enables/disables the serial Port 1 received shift register. 0 = Serial Port 1 reception disabled. 1 = Serial Port 1 received enabled (modes 1, 2, and 3). Initiate synchronous reception (mode 0). TB8_1 bit 3 9th Transmission Bit State. This bit defines the state of the 9th transmission bit in serial Port 1 modes 2 and 3. RB8_1 bit 2 9th Received Bit State. This bit identifies the state of the 9th reception bit of received data in serial Port 1 modes 2 and 3. In serial port mode 1, when SM2_1 = 0, RB8_1 is the state of the stop bit. RB8_1 is not used in mode 0. TI_1 bit 1 Transmitter Interrupt Flag. This bit indicates that data in the serial Port 1 buffer has been completely shifted out. In serial port mode 0, TI_1 is set at the end of the 8th data bit. In all other modes, this bit is set at the end of the last data bit. This bit must be cleared by software to transmit the next byte. RI_1 bit 0 Receiver Interrupt Flag. This bit indicates that a byte of data has been received in the serial Port 1 buffer. In serial port mode 0, RI_1 is set at the end of the 8th bit. In serial port mode 1, RI_1 is set after the last sample of the incoming stop bit subject to the state of SM2_1. In modes 2 and 3, RI_1 is set after the last sample of RB8_1. This bit must be cleared by software to receive the next byte. 70 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Serial Data Buffer 1 (SBUF1) 7 6 5 4 3 2 1 0 SFR C1h Reset Value 00h SBUF1.7−0 Serial Data Buffer 1. Data for serial Port 1 is read from or written to this location. The serial transmit and receive bits 7−0 buffers are separate registers, but both are addressed at this location. Enable Wake Up (EWU) Waking Up from IDLE Mode SFR C6h 7 6 5 4 3 2 1 0 Reset Value — — — — — EWUWDT EWUEX1 EWUEX0 00h Auxiliary interrupts will wake up from IDLE. They are enabled with EAI (EICON.5, SFR D8h). EWUWDT bit 2 Enable Wake Up Watchdog Timer. Wake using watchdog timer interrupt. 0 = Don’t wake up on watchdog timer interrupt. 1 = Wake up on watchdog timer interrupt. EWUEX1 bit 1 Enable Wake Up External 1. Wake using external interrupt source 1. 0 = Don’t wake up on external interrupt source 1. 1 = Wake up on external interrupt source 1. EWUEX0 bit 0 Enable Wake Up External 0. Wake using external interrupt source 0. 0 = Don’t wake up on external interrupt source 0. 1 = Wake up on external interrupt source 0. 71 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Timer 2 Control (T2CON) SFR C8h 7 6 5 4 3 2 1 0 Reset Value TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/RL2 00h TF2 bit 7 Timer 2 Overflow Flag. This flag will be set when Timer 2 overflows from FFFFh. It must be cleared by software. TF2 will only be set if RCLK and TCLK are both cleared to 0. Writing a 1 to TF2 forces a Timer 2 interrupt if enabled. EXF2 bit 6 Timer 2 External Flag. A negative transition on the T2EX pin (P1.1) will cause this flag to be set based on the EXEN2 (T2CON.3) bit. If set by a negative transition, this flag must be cleared to 0 by software. Setting this bit in software will force a timer interrupt if enabled. RCLK bit 5 Receive Clock Flag. This bit determines the serial Port 0 timebase when receiving data in serial modes 1 or 3. 0 = Timer 1 overflow is used to determine receiver baud rate for USART0. 1 = Timer 2 overflow is used to determine receiver baud rate for USART0. Setting this bit will force Timer 2 into baud rate generation mode. The timer will operate from a divide by 2 of the external clock. TCLK bit 4 Transmit Clock Flag. This bit determines the serial Port 0 timebase when transmitting data in serial modes 1 or 3. 0 = Timer 1 overflow is used to determine transmitter baud rate for USART0. 1 = Timer 2 overflow is used to determine transmitter baud rate for USART0. Setting this bit will force Timer 2 into baud rate generation mode. The timer will operate from a divide by 2 of the external clock. EXEN2 bit 3 Timer 2 External Enable. This bit enables the capture/reload function on the T2EX pin if Timer 2 is not generating baud rates for the serial port. 0 = Timer 2 will ignore all external events at T2EX. 1 = Timer 2 will capture or reload a value if a negative transition is detected on the T2EX pin. TR2 bit 2 Timer 2 Run Control. This bit enables/disables the operation of Timer 2. Halting this timer will preserve the current count in TH2, TL2. 0 = Timer 2 is halted. 1 = Timer 2 is enabled. C/T2 bit 1 Counter/Timer Select. This bit determines whether Timer 2 will function as a timer or counter. Independent of this bit, Timer 2 runs at 2 clocks per tick when used in baud rate generator mode. 0 = Timer 2 functions as a timer. The speed of Timer 2 is determined by the T2M bit (CKCON.5). 1 = Timer 2 will count negative transitions on the T2 pin (P1.0). CP/RL2 bit 0 Capture/Reload Select. This bit determines whether the capture or reload function is used for Timer 2. If either RCLK or TCLK is set, this bit will not function and the timer will function in an auto-reload mode following each overflow. 0 = Auto-reloads will occur when Timer 2 overflows or a falling edge is detected on T2EX if EXEN2 = 1. 1 = Timer 2 captures will occur when a falling edge is detected on T2EX if EXEN2 = 1. Timer 2 Capture LSB (RCAP2L) 7 SFR CAh RCAP2L bits 7−0 72 6 5 4 3 2 1 0 Reset Value 00h Timer 2 Capture LSB. This register is used to capture the TL2 value when Timer 2 is configured in capture mode. RCAP2L is also used as the LSB of a 16-bit reload value when Timer 2 is configured in auto-reload mode. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Timer 2 Capture MSB (RCAP2H) 7 6 5 4 3 2 1 0 Reset Value SFR CBh RCAP2H bits 7−0 00h Timer 2 Capture MSB. This register is used to capture the TH2 value when Timer 2 is configured in capture mode. RCAP2H is also used as the MSB of a 16-bit reload value when Timer 2 is configured in auto-reload mode. Timer 2 LSB (TL2) 7 6 5 4 3 2 1 0 Reset Value SFR CCh TL2 bits 7−0 00h Timer 2 LSB. This register contains the least significant byte of Timer 2. Timer 2 MSB (TH2) 7 6 5 4 3 2 1 0 Reset Value SFR CDh TH2 bits 7−0 00h Timer 2 MSB. This register contains the most significant byte of Timer 2. Program Status Word (PSW) SFR D0h 7 6 5 4 3 2 1 0 Reset Value CY AC F0 RS1 RS0 OV F1 P 00h CY bit 7 Carry Flag. This bit is set when the last arithmetic operation resulted in a carry (during addition) or a borrow (during subtraction). Otherwise, it is cleared to 0 by all arithmetic operations. AC bit 6 Auxiliary Carry Flag. This bit is set to 1 if the last arithmetic operation resulted in a carry into (during addition), or a borrow (during subtraction) from the high-order nibble. Otherwise, it is cleared to 0 by all arithmetic operations. F0 bit 5 User Flag 0. This is a bit-addressable, general-purpose flag for software control. RS1, RS0 bits 4−3 Register Bank Select 1−0. These bits select which register bank is addressed during register accesses. RS1 RS0 REGISTER BANK 0 0 0 ADDRESS 00h − 07h 0 1 1 08h − 0Fh 1 0 2 10h − 17h 1 1 3 18h − 1Fh OV bit 2 Overflow Flag. This bit is set to 1 if the last arithmetic operation resulted in a carry (addition), borrow (subtraction), or overflow (multiply or divide). Otherwise it is cleared to 0 by all arithmetic operations. F1 bit 1 User Flag 1. This is a bit-addressable, general-purpose flag for software control. P bit 0 Parity Flag. This bit is set to 1 if the modulo-2 sum of the 8 bits of the accumulator is 1 (odd parity); and cleared to 0 on even parity. 73 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ADC Offset Calibration Register Low Byte (OCL) 7 6 5 4 3 2 1 SFR D1h OCL bits 7−0 0 Reset Value LSB 00h ADC Offset Calibration Register Low Byte. This is the low byte of the 24-bit word that contains the ADC offset calibration. A value that is written to this location will set the ADC offset calibration value. ADC Offset Calibration Register Middle Byte (OCM) 7 6 5 4 3 2 1 0 SFR D2h OCM bits 7−0 Reset Value 00h ADC Offset Calibration Register Middle Byte. This is the middle byte of the 24-bit word that contains the ADC offset calibration. A value that is written to this location will set the ADC offset calibration value. ADC Offset Calibration Register High Byte (OCH) 7 SFR D3h OCH bits 7−0 6 5 4 3 2 1 0 MSB Reset Value 00h ADC Offset Calibration Register High Byte. This is the high byte of the 24-bit word that contains the ADC offset calibration. A value that is written to this location will set the ADC offset calibration value. ADC Gain Calibration Register Low Byte (GCL) 7 6 5 4 3 2 1 SFR D4h GCL bits 7−0 0 Reset Value LSB 5Ah ADC Gain Calibration Register Low Byte. This is the low byte of the 24-bit word that contains the ADC gain calibration. A value that is written to this location will set the ADC gain calibration value. ADC Gain Calibration Register Middle Byte (GCM) 7 6 5 4 3 2 1 0 SFR D5h GCM bits 7−0 Reset Value ECh ADC Gain Calibration Register Middle Byte. This is the middle byte of the 24-bit word that contains the ADC gain calibration. A value that is written to this location will set the ADC gain calibration value. ADC Gain Calibration Register High Byte (GCH) 7 SFR D6h GCH bits 7−0 74 MSB 6 5 4 3 2 1 0 Reset Value 5Fh ADC Gain Calibration Register High Byte. This is the high byte of the 24-bit word that contains the ADC gain calibration. A value that is written to this location will set the ADC gain calibration value. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ADC Multiplexer Register (ADMUX) SFR D7h INP3−0 bits 7−4 INN3−0 bits 3−0 7 6 5 4 3 2 1 0 Reset Value INP3 INP2 INP1 INP0 INN3 INN2 INN1 INN0 01h Input Multiplexer Positive Channel. This selects the positive signal input. INP3 INP2 INP1 INP0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 1 1 1 0 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 POSITIVE INPUT AIN0 (default) AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AINCOM Temperature Sensor (requires ADMUX = FFh) Input Multiplexer Negative Channel. This selects the negative signal input. INN3 INN2 INN1 INN0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 1 1 1 0 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 NEGATIVE INPUT AIN0 AIN1 (default) AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AINCOM Temperature Sensor (requires ADMUX = FFh) 75 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Enable Interrupt Control (EICON) SFR D8h 7 6 5 4 3 2 1 0 Reset Value SMOD1 1 EAI AI WDTI 0 0 0 40h SMOD1 bit 7 Serial Port 1 Mode. When this bit is set the serial baud rate for Port 1 will be doubled. 0 = Standard baud rate for Port 1 (default). 1 = Double baud rate for Port 1. EAI bit 5 Enable Auxiliary Interrupt. The Auxiliary Interrupt accesses nine different interrupts which are masked and identified by SFR registers PAI (SFR A5h), AIE (SFR A6h), and AISTAT (SFR A7h). 0 = Auxiliary Interrupt disabled (default). 1 = Auxiliary Interrupt enabled. AI bit 4 Auxiliary Interrupt Flag. AI must be cleared by software before exiting the interrupt service routine, after the source of the interrupt is cleared. Otherwise, the interrupt occurs again. Setting AI in software generates an Auxiliary Interrupt, if enabled. 0 = No Auxiliary Interrupt detected (default). 1 = Auxiliary Interrupt detected. WDTI bit 3 Watchdog Timer Interrupt Flag. WDTI must be cleared by software before exiting the interrupt service routine. Otherwise, the interrupt will occur again. Setting WDTI in software generates a watchdog time interrupt, if enabled. The Watchdog timer can generate an interrupt or reset. The interrupt is available only if the reset action is disabled in HCR0. 0 = No Watchdog Timer Interrupt detected (default). 1 = Watchdog Timer Interrupt detected. ADC Results Register Low Byte (ADRESL) 7 6 5 4 3 2 1 SFR D9h ADRESL bits 7−0 0 Reset Value LSB 00h The ADC Results Low Byte. This is the low byte of the 24-bit word that contains the ADC converter results. Reading from this register clears the ADC interrupt. However, AI in EICON (SFR D8h) must also be cleared. ADC Results Register Middle Byte (ADRESM) 7 6 5 4 3 2 1 0 SFR DAh ADRESM bits 7−0 Reset Value 00h The ADC Results Middle Byte. This is the middle byte of the 24-bit word that contains the ADC converter results. ADC Results Register High Byte (ADRESH) 7 SFR DBh ADRESH bits 7−0 76 MSB 6 5 4 3 2 1 0 Reset Value 00h The ADC Results High Byte. This is the high byte of the 24-bit word that contains the ADC converter results. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ADC Control Register 0 (ADCON0) 7 SFR DCh 6 5 4 3 2 1 0 Reset Value BOD EVREF VREFH EBUF PGA2 PGA1 PGA0 30h BOD bit 6 Burnout Detect. When enabled this connects a positive current source to the positive channel and a negative current source to the negative channel. If the channel is open circuit then the ADC results will be full-scale. 0 = Burnout Current Sources Off (default). 1 = Burnout Current Sources On. EVREF bit 5 Enable Internal Voltage Reference. If the internal voltage reference is not used, it should be turned off to save power and reduce noise. 0 = Internal Voltage Reference Off. 1 = Internal Voltage Reference On (default). NOTE: REFIN− must be connected to AGND, and REFOUT to REFIN+. VREFH bit 4 Voltage Reference High Select. The internal voltage reference can be selected to be 2.5V or 1.25V. 0 = REFOUT is 1.25V. 1 = REFOUT is 2.5V (default). EBUF bit 3 Enable Buffer. Enable the input buffer to provide higher input impedance but limits the input voltage range and dissipates more power. 0 = Buffer disabled (default). 1 = Buffer enabled. PGA2−0 bits 2−0 Programmable Gain Amplifier. Sets the gain for the PGA from 1 to 128. PGA2 PGA1 PGA0 GAIN 0 0 0 1 (default) 0 0 1 2 0 1 0 4 0 1 1 8 1 0 0 16 1 0 1 32 1 1 0 64 1 1 1 128 77 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 ADC Control Register 1 (ADCON1) SFR DDh POL bit 6 7 6 5 4 3 2 1 0 Reset Value — POL SM1 SM0 — CAL2 CAL1 CAL0 0000 0000b Polarity. Polarity of the ADC result and Summation register. 0 = Bipolar. 1 = Unipolar. The LSB size is 1/2 the size of bipolar (twice the resolution). POL ANALOG INPUT DIGITAL OUTPUT +FSR 7FFFFFh ZERO 000000h 0 1 SM1−0 bits 5−4 CAL2−0 bits 2−0 −FSR 800000h +FSR FFFFFFh ZERO 000000h −FSR 000000h Settling Mode. Selects the type of filter or auto select which defines the digital filter settling characteristics. SM1 SM0 SETTLING MODE 0 0 Auto 0 1 1 0 Fast Settling Filter Sinc2 Filter 1 1 Sinc3 Filter Calibration Mode Control Bits. Writing to these bits starts ADC calibration. CAL2 CAL1 CAL0 CALIBRATION MODE 0 0 0 No Calibration (default) 0 0 1 Self-Calibration, Offset and Gain 0 1 0 Self-Calibration, Offset only 0 1 1 Self-Calibration, Gain only 1 0 0 System Calibration, Offset only (requires external connection) 1 0 1 System Calibration, Gain only (requires external connection) 1 1 0 Reserved 1 1 1 Reserved NOTE: Read Value—000b. ADC Control Register 2 (ADCON2) SFR DEh DR7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value DR7 DR6 DR5 DR4 DR3 DR2 DR1 DR0 1Bh Decimation Ratio LSB. ADC Control Register 3 (ADCON3) SFR DFh DR10−8 bits 2−0 78 7 6 5 4 3 2 1 0 Reset Value — — — — — DR10 DR9 DR8 06h Decimation Ratio Most Significant 3 Bits. The output data rate = fCLK/[(ACLK + 1) S 64 S Decimation Ratio]. "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Accumulator (A or ACC) SFR E0h ACC.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value ACC.7 ACC.6 ACC.5 ACC.4 ACC.3 ACC.2 ACC.1 ACC.0 00h Accumulator. This register serves as the accumulator for arithmetic and logic operations. Summation/Shifter Control (SSCON) SFR E1h 7 6 5 4 3 2 1 0 Reset Value SSCON1 SSCON0 SCNT2 SCNT1 SCNT0 SHF2 SHF1 SHF0 00h The Summation register is powered down when the ADC is powered down. If all zeroes are written to this register the 32-bit SUMR3−0 registers will be cleared. The Summation registers will do sign extend if Bipolar is selected in ADCON1. SSCON1−0 Summation/Shift Count. bits 7−6 SOURCE SSCON1 SSCON0 CPU 0 0 Values written to the SUM registers are accumulated when the SUMR0 value is written (sum/shift ignored) ADC 0 1 Summation register Enabled. Source is ADC, summation count is working. CPU 1 0 Shift Enabled. Summation register is shifted by SHF Count bits. It takes four system clocks to execute. ADC 1 1 Accumulate and Shift Enable. Values are accumulated for SUM Count times and then shifted by SHF Count. SCNT2−0 bits 5−3 SHF2−0 bits 2−0 MODE Summation Count. When the summation is complete an interrupt will be generated unless masked. Reading the SUMR0 register clears the interrupt. SCNT2 SCNT1 SCNT0 SUMMATION COUNT 0 0 0 2 0 0 1 4 0 1 0 8 0 1 1 16 1 0 0 32 1 0 1 64 1 1 0 128 1 1 1 256 Shift Count. SHF2 SHF1 SHF0 SHIFT DIVIDE 0 0 0 1 2 0 0 1 2 4 0 1 0 3 8 0 1 1 4 16 1 0 0 5 32 1 0 1 6 64 1 1 0 7 128 1 1 1 8 256 79 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Summation Register 0 (SUMR0) 7 6 5 4 3 2 1 SFR E2h SUMR0 bits 7−0 0 Reset Value LSB 00h Summation Register 0. This is the least significant byte of the 32-bit summation register or bits 0 to 7. Write: Will cause values in SUMR3−0 to be added to the summation register. Read: Will clear the Summation Count Interrupt. AI in EICON (SFR D8h) must also be cleared. Summation Register 1 (SUMR1) 7 6 5 4 3 2 1 0 Reset Value SFR E3h SUMR1 bits 7−0 00h Summation Register 1. These are bits 8−15 of the 32-bit summation register. Summation Register 2 (SUMR2) 7 6 5 4 3 2 1 0 Reset Value SFR E4h SUMR2 bits 7−0 00h Summation Register 2. These are bits 16−23 of the 32-bit summation register. Summation Register 3 (SUMR3) 7 SFR E5h SUMR3 bits 7−0 6 5 4 3 2 1 0 Reset Value MSB 00h Summation Register 3. This is the most significant byte of the 32-bit summation register or bits 24−31. Offset DAC Register (ODAC) 7 6 5 4 SFR E6h 3 2 1 0 Reset Value 00h ODAC bits 7−0 bit 7 Offset DAC Register. This register will shift the input by up to half of the ADC full-scale input range. The offset DAC value is summed with the ADC input prior to conversion. Writing 00h or 80h to ODAC turns off the offset DAC. Offset DAC Sign bit. 0 = Positive 1 = Negative bit 6−0 Offset + ǒ Ǔ ODAC ƪ 6 : 0ƫ *V REF bit7 @ @ (* 1) 127 2 @ PGA NOTE: ODAC cannot be used to offset the input so that the buffer can be used for AGND signals. Offset DAC should be cleared before offset calibration, since the offset DAC output is applied directly to the ADC input. 80 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Low Voltage Detect Control (LVDCON) SFR E7h 7 6 5 4 3 2 1 0 Reset Value ALVDIS ALVD2 ALVD1 ALVD0 DLVDIS DLVD2 DLVD1 DLVD0 00h NOTE: By default, both analog and digital low-voltage detections are enabled, which causes approximately 25µA of current consumption from the power supply. To minimize this power consumption, both low-voltage detections should be disabled before entering Stop mode. ALVDIS bit 7 Analog Low Voltage Detect Disable. 0 = Enable Detection of Low Analog Supply Voltage 1 = Disable Detection of Low Analog Supply Voltage ALVD2−0 bits 6−4 Analog Voltage Detection Level. ALVD2 ALVD1 ALVD0 VOLTAGE LEVEL 0 0 0 0 0 1 AVDD 2.7V (default) AVDD 3.0V 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 AVDD 3.3V AVDD 4.0V AVDD 4.2V AVDD 4.5V AVDD 4.7V External Voltage AIN7 compared to 1.2V DLVDIS bit 3 Digital Low Voltage Detect Disable. 0 = Enable Detection of Low Digital Supply Voltage 1 = Disable Detection of Low Digital Supply Voltage DLVD2−0 bits 2−0 Digital Voltage Detection Level. DLVD2 DLVD1 DLVD0 VOLTAGE LEVEL 0 0 0 0 0 1 DVDD 2.7V (default) DVDD 3.0V 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 DVDD 3.3V DVDD 4.0V DVDD 4.2V DVDD 4.5V DVDD 4.7V External Voltage AIN6 compared to 1.2V 81 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Extended Interrupt Enable (EIE) SFR E8h 7 6 5 4 3 2 1 0 Reset Value 1 1 1 EWDI EX5 EX4 EX3 EX2 E0h EWDI bit 4 Enable Watchdog Interrupt. This bit enables/disables the watchdog interrupt. The Watchdog timer is enabled by (SFR FFh) and PDCON (SFR F1h) registers. 0 = Disable the Watchdog Interrupt 1 = Enable Interrupt Request Generated by the Watchdog Timer EX5 bit 3 External Interrupt 5 Enable. This bit enables/disables external interrupt 5. 0 = Disable External Interrupt 5 1 = Enable External Interrupt 5 EX4 bit 2 External Interrupt 4 Enable. This bit enables/disables external interrupt 4. 0 = Disable External Interrupt 4 1 = Enable External Interrupt 4 EX3 bit 1 External Interrupt 3 Enable. This bit enables/disables external interrupt 3. 0 = Disable External Interrupt 3 1 = Enable External Interrupt 3 EX2 bit 0 External Interrupt 2 Enable. This bit enables/disables external interrupt 2. 0 = Disable External Interrupt 2 1 = Enable External Interrupt 2 Hardware Product Code Register 0 (HWPC0) (read-only) SFR E9h 7 6 5 4 3 2 1 0 Reset Value 0 0 0 0 0 0 MEMORY SIZE 0000_00xxb HWPC1.7−0 Hardware Product Code LSB. Read-only. bits 7−0 MEMORY SIZE MODEL FLASH MEMORY 4kB 0 0 MSC1210Y2 0 1 MSC1210Y3 8kB 1 0 MSC1210Y4 16kB 1 1 MSC1210Y5 32kB Hardware Product Code Register 1 (HWPC1) (read-only) SFR EAh 7 6 5 4 3 2 1 0 Reset Value 0 0 0 0 0 0 0 0 00h HWPC1.7−0 Hardware Product Code MSB. Read-only. bits 7−0 82 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Hardware Version Register (HDWVER) 7 6 5 4 3 2 1 0 Reset Value SFR EBh Flash Memory Control (FMCON) SFR EEh 7 6 5 4 3 2 1 0 Reset Value 0 PGERA 0 FRCM 0 BUSY 1 0 02h PGERA bit 6 Page Erase. 0 = MOVX to Flash will perform a byte write operation 1 = MOVX to Flash will perform a page erase operation FRCM bit 4 Frequency Control Mode. 0 = Bypass (default) 1 = Use Delay Line. Saves power when reading Flash (recommended) BUSY bit 2 Write/Erase BUSY Signal. 0 = Idle or Available 1 = Busy Flash Memory Timing Control Register (FTCON) SFR EFh 7 6 5 4 3 2 1 0 Reset Value FER3 FER2 FER1 FER0 FWR3 FWR2 FWR1 FWR0 A5h Refer to Flash Timing Characteristics. FER3−0 bits 7−4 Set Erase. Flash Erase Time = (1 + FER) • (MSEC + 1) • tCLK. A minimum of 10ms is needed for industrial temperature range. A minimum of 4ms is needed for commercial temperature range. FWR3−0 bits 3−0 Set Write. Flash Write Time = (1 + FWR) • (USEC + 1) • 5 • tCLK. Write time should be 30−40µs. B Register (B) SFR F0h B.7−0 bits 7−0 7 6 5 4 3 2 1 0 Reset Value B.7 B.6 B.5 B.4 B.3 B.2 B.1 B.0 00h B Register. This register serves as a second accumulator for certain arithmetic operations. 83 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Power-Down Control Register (PDCON) SFR F1h 7 6 5 4 3 2 1 0 Reset Value 0 0 0 PDPWM PDADC PDWDT PDST PDSPI 1Fh Turning peripheral modules off puts the MSC1210 in the lowest power mode. PDPWM bit 4 Pulse Width Module Control. 0 = PWM On 1 = PWM Power Down PDADC bit 3 ADC Control. 0 = ADC On 1 = ADC, VREF, and summation registers are powered down. PDWDT bit 2 Watchdog Timer Control. 0 = Watchdog Timer On 1 = Watchdog Timer Power Down PDST bit 1 System Timer Control. 0 = System Timer On 1 = System Timer Power Down PDSPI bit 0 SPI System Control. 0 = SPI System On 1 = SPI System Power Down PSEN/ALE Select (PASEL) SFR F2h PSEN2−0 bits 5−3 ALE1−0 bits 1−0 7 6 5 4 3 2 1 0 Reset Value 0 0 PSEN2 PSEN1 PSEN0 0 ALE1 ALE0 00h PSEN Mode Select. PSEN2 PSEN1 PSEN0 0 0 x PSEN 0 1 x CLK 1 0 x ADC MODCLK 1 1 0 LOW 1 1 1 HIGH ALE Mode Select. ALE1 ALE0 0 x ALE 1 0 LOW 1 1 HIGH NOTE: For power-saving purposes, it is recommended that the PSEN and ALE pins be set to low or high mode when external memory is not used. 84 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Analog Clock (ACLK) SFR F6h 7 6 5 4 3 2 1 0 Reset Value 0 FREQ6 FREQ5 FREQ4 FREQ3 FREQ2 FREQ1 FREQ0 03h FREQ6−0 Clock Frequency − 1. This value + 1 divides the system clock to create the ADC clock. bit 6−0 f ACLK + f CLK f CLK + FREQ ) 1 ACLK ) 1 f CLK f MOD + (ACLK ) 1) @ 64 f MOD Output Data Rate + Decimation System Reset Register (SRST) SFR F7h RSTREQ bit 0 7 6 5 4 3 2 1 0 Reset Value 0 0 0 0 0 0 0 RSTREQ 00h Reset Request. Setting this bit to 1 and then clearing to 0 will generate a system reset. Extended Interrupt Priority (EIP) SFR F8h 7 6 5 4 3 2 1 0 Reset Value 1 1 1 PWDI PX5 PX4 PX3 PX2 E0h PWDI bit 4 Watchdog Interrupt Priority. This bit controls the priority of the watchdog interrupt. 0 = The watchdog interrupt is low priority. 1 = The watchdog interrupt is high priority. PX5 bit 3 External Interrupt 5 Priority. This bit controls the priority of external interrupt 5. 0 = External interrupt 5 is low priority. 1 = External interrupt 5 is high priority. PX4 bit 2 External Interrupt 4 Priority. This bit controls the priority of external interrupt 4. 0 = External interrupt 4 is low priority. 1 = External interrupt 4 is high priority. PX3 bit 1 External Interrupt 3 Priority. This bit controls the priority of external interrupt 3. 0 = External interrupt 3 is low priority. 1 = External interrupt 3 is high priority. PX2 bit 0 External Interrupt 2 Priority. This bit controls the priority of external interrupt 2. 0 = External interrupt 2 is low priority. 1 = External interrupt 2 is high priority. 85 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Seconds Timer Interrupt (SECINT) SFR F9h 7 6 5 4 3 2 1 0 Reset Value WRT SECINT6 SECINT5 SECINT4 SECINT3 SECINT2 SECINT1 SECINT0 7Fh This system clock is divided by the value of the 16-bit register MSECH:MSECL. Then, the 1ms timer tick is divided by the register HMSEC that provides the 100ms signal used by this seconds timer. Therefore, the seconds timer can generate an interrupt that occurs from 100ms to 12.8 seconds. Reading this register clears the Seconds Interrupt. This Interrupt can be monitored in the AIE register. WRT bit 7 Write Control. Determines whether to write the value immediately or wait until the current count is finished. Read = 0. 0 = Delay Write Operation. The SEC value is loaded when the current count expires. 1 = Write Immediately. The counter is loaded once the CPU completes the write operation. SECINT6−0 Seconds Count. Normal operation uses 100ms as the clock interval, and would equal: (SEC + 1)/10 seconds. bits 6−0 Seconds Interrupt = (1 + SEC) • (HMSEC + 1) • (MSEC + 1) • tCLK Milliseconds Interrupt (MSINT) SFR FAh 7 6 5 4 3 2 1 0 Reset Value WRT MSINT6 MSINT5 MSINT4 MSINT3 MSINT2 MSINT1 MSINT0 7Fh The clock used for this timer is the 1ms clock, which results from dividing the system clock by the values in registers MSECH:MSECL. Reading this register clears the milliseconds interrupt. AI in EICON (SFR D8h) must also be cleared. WRT bit 7 Write Control. Determines whether to write the value immediately or wait until the current count is finished. Read = 0. 0 = Delay Write Operation. The MSINT value is loaded when the current count expires. 1 = Write Immediately. The MSINT counter is loaded once the CPU completes the write operation. MSINT6−0 bits 6−0 Seconds Count. Normal operation would use 1ms as the clock interval. MS Interrupt Interval = (1 + MSINT) • (MSEC + 1) • tCLK One Microsecond Register (USEC) SFR FBh FREQ4−0 bits 4−0 7 6 5 4 3 2 1 0 Reset Value 0 0 0 FREQ4 FREQ3 FREQ2 FREQ1 FREQ0 03h Clock Frequency − 1. This value + 1 divides the system clock to create a 1µs clock. USEC = CLK/(FREQ + 1). This clock is used to set Flash write time. See FTCON (SFR EFh). One Millisecond Low Register (MSECL) SFR FCh 7 6 5 4 3 2 1 0 Reset Value MSECL7 MSECL6 MSECL5 MSECL4 MSECL3 MSECL2 MSECL1 MSECL0 9Fh MSECL7−0 One Millisecond Low. This value in combination with the next register is used to create a 1ms clock. bits 7−0 1ms = (MSECH • 256 + MSECL + 1) • tCLK. This clock is used to set Flash erase time. See FTCON (SFR EFh). 86 "#$%$& www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 One Millisecond High Register (MSECH) SFR FDh 7 6 5 4 3 2 1 0 Reset Value MSECH7 MSECH6 MSECH5 MSECH4 MSECH3 MSECH2 MSECH1 MSECH0 0Fh MSECH7−0 One Millisecond High. This value in combination with the previous register is used to create a 1ms clock. bits 7−0 1ms = (MSECH • 256 + MSECL + 1) • tCLK One Hundred Millisecond Register (HMSEC) SFR FEh 7 6 5 4 3 2 1 0 Reset Value HMSEC7 HMSEC6 HMSEC5 HMSEC4 HMSEC3 HMSEC2 HMSEC1 HMSEC0 63h HMSEC7−0 One Hundred Millisecond. This clock divides the 1ms clock to create a 100ms clock. bits 7−0 100ms = (MSECH • 256 + MSECL + 1) • (HMSEC + 1) • tCLK Watchdog Timer Register (WDTCON) SFR FFh 7 6 5 4 3 2 1 0 Reset Value EWDT DWDT RWDT WDCNT4 WDCNT3 WDCNT2 WDCNT1 WDCNT0 00h EWDT bit 7 Enable Watchdog (R/W). Write 1/Write 0 sequence sets the Watchdog Enable Counting bit. DWDT bit 6 Disable Watchdog (R/W). Write 1/Write 0 sequence clears the Watchdog Enable Counting bit. RWDT bit 5 Reset Watchdog (R/W). Write 1/Write 0 sequence restarts the Watchdog Counter. WDCNT4−0 Watchdog Count (R/W). bits 4−0 Watchdog expires in (WDCNT + 1) • HMSEC to (WDCNT + 2) • HMSEC, if the sequence is not asserted. There is an uncertainty of 1 count. 87 www.ti.com SBAS203J − MARCH 2002 − REVISED JANUARY 2008 Revision History DATE REV PAGE SECTION DESCRIPTION 1/08 J 70 Serial Port Mode 1 Deleted note (2) from SM0−2 table. 10/07 I 26 Voltage Reference Added paragraph to end of section. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 88 PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MSC1210Y2PAGR ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y2PAGRG4 ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y2PAGT ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y2PAGTG4 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y3PAGR ACTIVE TQFP PAG 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y3PAGRG4 ACTIVE TQFP PAG 64 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y3PAGT ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y3PAGTG4 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y4PAGR ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y4PAGRG4 ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y4PAGT ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y4PAGTG4 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y5PAGR ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y5PAGRG4 ACTIVE TQFP PAG 64 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y5PAGT ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR MSC1210Y5PAGTG4 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2008 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing MSC1210Y2PAGR TQFP PAG 64 SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1500 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y2PAGT TQFP PAG 64 250 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y3PAGR TQFP PAG 64 1000 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y3PAGT TQFP PAG 64 250 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y4PAGR TQFP PAG 64 1500 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y4PAGT TQFP PAG 64 250 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y5PAGR TQFP PAG 64 1500 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 MSC1210Y5PAGT TQFP PAG 64 250 330.0 24.8 13.0 13.0 1.5 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MSC1210Y2PAGR TQFP PAG 64 1500 346.0 346.0 41.0 MSC1210Y2PAGT TQFP PAG 64 250 346.0 346.0 41.0 MSC1210Y3PAGR TQFP PAG 64 1000 346.0 346.0 41.0 MSC1210Y3PAGT TQFP PAG 64 250 346.0 346.0 41.0 MSC1210Y4PAGR TQFP PAG 64 1500 346.0 346.0 41.0 MSC1210Y4PAGT TQFP PAG 64 250 346.0 346.0 41.0 MSC1210Y5PAGR TQFP PAG 64 1500 346.0 346.0 41.0 MSC1210Y5PAGT TQFP PAG 64 250 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996 PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 48 0,08 M 33 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4040282 / C 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated