LM60/LM60-Q1 www.ti.com SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 LM60/LM60-Q1 2.7V, SOT-23 or TO-92 Temperature Sensor Check for Samples: LM60/LM60-Q1 FEATURES DESCRIPTION • • • • • The LM60/LM60-Q1 is a precision integrated-circuit temperature sensor that can sense a −40°C to +125°C temperature range while operating from a single +2.7V supply. The LM60/LM60-Q1's output voltage is linearly proportional to Celsius (Centigrade) temperature (+6.25 mV/°C) and has a DC offset of +424 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the LM60/LM60-Q1 ranges from +174 mV to +1205 mV for a −40°C to +125°C temperature range. The LM60/LM60-Q1 is calibrated to provide accuracies of ±2.0°C at room temperature and ±3°C over the full −25°C to +125°C temperature range. 1 Calibrated linear scale factor of +6.25 mV/°C Rated for full −40°C to +125°C range Suitable for remote applications Available in SOT-23 and TO-92 packages LM60Q is AEC-Q100 Grade 1 qualified and is manufactured on an Automotive Grade flow. APPLICATIONS • • • • • • • Automotive Cell Phones & Computers Power Supply Modules Battery Management FAX Machines & Printers HVAC & Disk Drives Appliances KEY SPECIFICATIONS • • • • • • • • Accuracy at 25°C: ±2.0°C and ±3.0°C (max) Accuracy for −40°C to +125°C: ±4.0°C (max) Accuracy for −25°C to +125°C: ±3.0°C (max) Temperature Slope: +6.25mV/°C Power Supply Voltage Range: +2.7V to +10V Current Drain at 25°C: 110μA (max) Nonlinearity: ±0.8°C (max) Output Impedance: 800Ω (max) The LM60/LM60-Q1's linear output, +424 mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the LM60/LM60-Q1's quiescent current is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the LM60/LM60-Q1 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. TYPICAL APPLICATION LM60/LM60-Q1 CONNECTION DIAGRAMS SOT-23 (TOP VIEW) SVA-1268102 VO = (+6.25 mV/°C × T°C) + 424 mV SVA-1268101 TO-92 (BOTTOM VIEW) Temperature (T) Typical VO +125°C +1205 mV +100°C +1049 mV +25°C +580 mV 0°C +424 mV –25°C +268 mV –40°C +174 mV Figure 1. Full-Range Centigrade Temperature Sensor (−40°C to 125°C) Operating from a Single Li-Ion Battery Cell SVA-1268123 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2012, Texas Instruments Incorporated LM60/LM60-Q1 SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION ORDER NUMBER DEVICE TOP MARK LM60BIM3 T6B LM60BIM3X T6B LM60CIM3 T6C LM60CIM3X T6C LM60QIM3 L60Q LM60QIM3X L60Q ACCURACY OVER SPECIFIED TEMPERATURE RANGE SPECIFIED TEMPERATURE RANGE ±3 –25°C ≤ TA ≤ +125°C ±4 –40°C ≤ TA ≤ +125°C ±4 –40°C ≤ TA ≤ +125°C LM60BIZ LM60BIZ ±3 –25°C ≤ TA ≤ +125°C LM60CIZ LM60CIZ ±4 –40°C ≤ TA ≤ +125°C ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT Supply voltage +12 to −0.2 V Output voltage (+VS + 0.6) to −0.6 V Output current 10 mA 5 mA Input Current at any pin (2) Human Body Model ESD Susceptibility (3) Machine Model 2500 V SOT-23 250 V TO-92 200 V −65 to +150 °C 125 °C Storage temperature Maximum junction temperature (TJMAX) (1) (2) (3) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. RECOMMENDED OPERATING CONDITIONS (1) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TMIN ≤ TA ≤ TMAX Specified Temperature Range: LM60B –25 ≤ TA ≤ +125 °C LM60C/LM60-Q1 –40 ≤ TA ≤ +125 °C 10 V SOT-23 450 °C/W TO-92 180 °C/W Supply Voltage Range (+VS) Thermal Resistance, θJA (1) (2) 2 (2) 2.7 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air. Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 LM60/LM60-Q1 www.ti.com SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 ELECTRICAL CHARACTERISTICS Unless otherwise noted, these specifications apply for +VS = +3.0 VDC and ILOAD = 1 μA. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. PARAMETER CONDITIONS TYPICAL (1) Accuracy (3) Output Voltage at 0°C +6.25 (1) (2) (3) (4) (5) (6) ±3.0 °C (max) ±3.0 ±4.0 °C (max) ±0.6 ±0.8 °C (max) mV 6 mV/°C (min) 6.5 mV/°C (max) 800 800 Ω (max) +3.0 V ≤ +VS ≤ +10 V ±0.3 ±0.3 mV/V (max) +2.7 V ≤ +VS ≤ +3.3 V ±2.3 ±2.3 mV (max) 110 110 μA (max) 125 125 μA (max) +2.7 V ≤ +VS ≤ +10 V 82 +2.7 V ≤ +VS ≤ +10 V ±5.0 μA (max) 0.2 μA/°C ±0.2 °C Temperature Coefficient of Quiescent Current Long Term Stability (6) ±2.0 UNITS (Limit) 6.44 Output Impedance Change of Quiescent Current Limits (2) 6.06 Sensor Gain (Average Slope) Quiescent Current LM60C/LM60-Q1 +424 Nonlinearity (4) Line Regulation (5) LM60B Limits (2) TJ = TMAX = +125°C for 1000 hours Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Limits are specified to National's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and +6.25 mV/°C times the device's case temperature plus 424 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 3 LM60/LM60-Q1 SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13. Thermal Resistance Junction to Air Thermal Time Constant SVA-1268104 SVA-1268103 Figure 2. Figure 3. Thermal Response in Still Air with Heat Sink Thermal Response in Stirred Oil Bath with Heat Sink SVA-1268106 SVA-1268105 Figure 4. Figure 5. Start-Up Voltage vs Temperature Thermal Response in Still Air without a Heat Sink 0 SVA-1268107 SVA-1268108 Figure 6. Figure 7. Quiescent Current vs Temperature Accuracy vs Temperature SVA-1268110 SVA-1268109 Figure 8. 4 Figure 9. Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 LM60/LM60-Q1 www.ti.com SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 TYPICAL CHARACTERISTICS (continued) To generate these curves the LM60/LM60-Q1 was mounted to a printed circuit board as shown in Figure 13. Noise Voltage Supply Voltage vs Supply Current SVA-1268112 SVA-1268111 Figure 10. Figure 11. Start-Up Response SVA-1268122 Figure 12. Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 5 LM60/LM60-Q1 SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 www.ti.com LM60/LM60-Q1 APPLICATION INFORMATION SVA-1268114 NOTE: 1/2" Square Printed Circuit Board with 2 oz. Copper Foil or Similar. Figure 13. Printed Circuit Board Used for Heat Sink to Generate All Curves Mounting The LM60/LM60-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM60/LM60-Q1 is sensing will be within about +0.1°C of the surface temperature that LM60/LM60-Q1's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM60/LM60Q1 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM60/LM60-Q1 die is directly attached to the GND pin. The lands and traces to the LM60/LM60-Q1 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM60/LM60-Q1's temperature to deviate from the desired temperature. Alternatively, the LM60/LM60-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM60/LM60-Q1 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM60/LM60-Q1 or its connections. The thermal resistance junction to ambient (θJA ) is the parameter used to calculate the rise of a device junction temperature due to the device power dissipation. For the LM60/LM60-Q1 the equation used to calculate the rise in the die temperature is as follows: TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL] where IQ is the quiescent current and IL is the load current on the output. Table 1 summarizes the rise in die temperature of the LM60/LM60-Q1 without any loading, and the thermal resistance for different conditions. 6 Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 LM60/LM60-Q1 www.ti.com SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 Table 1. Temperature Rise of LM60/LM60-Q1 Due to Self-Heating and Thermal Resistance (θJA) SOT-23 (1) no heat sink Still air SOT-23 (2) small heat fin θJA (°C/W) TJ − TA (°C) θJA (°C/W) 450 0.17 Moving air (1) (2) (3) TO-92 (1) no heat fin TJ − TA (°C) θJA 260 0.1 180 0.07 TO-92 (3) small heat fin TJ − TA θJA TJ − TA 180 0.07 140 0.05 90 0.034 70 0.026 Part soldered to 30 gauge wire. Heat sink used is 1/2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 13. Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar. Capacitive Loads The LM60/LM60-Q1 handles capacitive loading well. Without any special precautions, the LM60/LM60-Q1 can drive any capacitive load as shown in Figure 14. Over the specified temperature range the LM60/LM60-Q1 has a maximum output impedance of 800Ω. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 μF be added from +V S to GND to bypass the power supply voltage, as shown in Figure 15. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF output capacitor with the 800Ω output impedance will form a 199 Hz lowpass filter. Since the thermal time constant of the LM60/LM60-Q1 is much slower than the 6.3 ms time constant formed by the RC, the overall response time of the LM60/LM60-Q1 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM60/LM60-Q1. LM60/LM60-Q1 LM60/LM60-Q1 SVA-1268115 SVA-1268116 Figure 14. LM60/LM60-Q1 No Decoupling Required for Capacitive Load Figure 15. LM60/LM60-Q1 with Filter for Noisy Environment SVA-1268117 Figure 16. Simplified Schematic Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 7 LM60/LM60-Q1 SNIS119D – MAY 2004 – REVISED NOVEMBER 2012 www.ti.com Applications Circuits V+ VTEMP R3 VT1 R4 VT2 LM4040 V+ VT R1 4.1V U3 0.1 F LM60/LM60-Q1 LM60 U2 R2 VTemp (Low = overtemp alarm) + U1 - VOUT VOUT LM7211 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 SVA-1268118 Figure 17. Centigrade Thermostat LM60/LM60-Q1 SVA-1268119 Figure 18. Conserving Power Dissipation with Shutdown 8 Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated Product Folder Links: LM60/LM60-Q1 PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM60BIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 125 T6B LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 TBD Call TI Call TI LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -25 to 125 LM60 BIZ LM60CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIM3X ACTIVE SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 T6C LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 125 LM60 CIZ LM60QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM60QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM60 BIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF LM60, LM60-Q1 : • Catalog: LM60 • Automotive: LM60-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 LM60BIM3/NOPB SOT-23 DBZ 3 1000 178.0 LM60BIM3X SOT-23 DBZ 3 3000 178.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 LM60CIM3 SOT-23 DBZ 3 LM60CIM3/NOPB SOT-23 DBZ LM60CIM3X SOT-23 DBZ LM60CIM3X/NOPB SOT-23 DBZ 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM60BIM3 SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60BIM3/NOPB SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60BIM3X SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60CIM3 SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60CIM3/NOPB SOT-23 DBZ 3 1000 203.0 190.0 41.0 LM60CIM3X SOT-23 DBZ 3 3000 206.0 191.0 90.0 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 206.0 191.0 90.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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