Datasheet Load Switch ICs for Portable Equipment BD2202G-LB BD2206G-LB General Description Key Specifications This is the product guarantees long time support in Industrial market. The High-side switch, which has over-current protection function, is used for the power supply line of a memory card slot. In the switch part, an N-channel MOSFET with low ON resistance has been 1 circuit integrated. The switch goes OFF when the over-current condition lasts longer than the over-current shutdown time. The OFF switch is set to latch off mode. The operating voltage range is 2.7V to 3.6V and the current limit value is set on 400mA, 1A. Moreover, functions of soft start, under voltage lockout, and over temperature protection are integrated. Input voltage range: 2.7V to 3.6V ON resistance : 150mΩ(Typ.) Over current threshold: BD2202G 0.25A min., 1.0A max. BD2206G 0.8A min., 1.6A max. Standby current: 0.01μA (Typ.) Operating temperature range: -25℃ to +85℃ Package W(Typ.) D(Typ.) H (Max.) 2.90mm x 2.80mm x 1.25mm SSOP5 Features Long time support a product for Industrial applications. Single low on-resistance (Typ. = 150mΩ) Nch MOS FET Continuous load current ¾ 0.2A: (BD2202G) ¾ 0.5A: (BD2206G) Control input logic: Active-High Soft start function Over current protection circuit Over temperature protection circuit Under voltage lockout SSOP5 Applications Industrial Equipment, Memory card slots of STB, Digital still camera, Cell Phones, Notebook PC. Typical Application Circuit VIN Cin VIN Current limit Charge pump VOUT UVLO Control logic Cout Thermal shutdown EN OFF Rout ON GND Lineup Min. 0.25A 0.8A Over current threshold Typ. Max. 1.0A - 1.6A ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Control input logic Package Orderable Part Number High SSOP5 Reel of 3000 BD2202G-LBTR High SSOP5 Reel of 3000 BD2206G-LBTR ○This product has no designed protection against radioactive rays. 1/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Block Diagram VIN Current limit Charge pump VOUT GND UVLO Control logic Thermal shutdown EN Pin Configuration TOP VIEW 1 VIN VOUT 5 2 GND 3 EN NC 4 Pin Description Pin Number Pin Name I/O 1 VIN I Power supply input terminal. Input terminal to the power switch and supply of the internal circuit. 2 GND I Ground. 3 EN I Power Switch enable input. Active-High Switch on input. Logic high turns the switch on. 4 N.C - No connection. 5 VOUT O Power switch output. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Pin function 2/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Absolute Maximum Ratings Parameter Supply voltage EN voltage OUT voltage Storage temperature Power dissipation *1 Symbol VIN VEN VOUT TSTG PD Limits -0.3 to 6.0 -0.3 to 6.0 -0.3 to VIN + 0.3 -55 to 150 675*1 Unit V V V °C mW Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating: 5.4mW/℃ for operating above Ta=25℃ Recommended Operating Range ◎BD2202G Parameter Symbol Limits Unit VIN 2.7 to 3.6 V TOPR -25 to 85 °C ILO 0 to 200 mA Symbol Limits Unit VIN 2.7 to 3.6 V TOPR -25 to 85 °C ILO 0 to 500 mA Operating voltage range Operating temperature range Operating load current ◎BD2206G Parameter Operating voltage range Operating temperature range Operating load current Electrical Characteristics ◎BD2202G (Unless otherwise specified, VIN = 3.3V, Ta = 25°C) DC characteristics Limits Parameter Symbol Min. Typ. Max. Unit Condition Operating current IDD - 70 90 μA VEN = 3.3V, VOUT = OPEN Standby current ISTB - 0.01 1 μA VEN = 0V, VOUT = OPEN EN input voltage VEN 2.0 - - V High level input - - 0.8 V Low level input EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 3.3V ON resistance RON - 150 200 mΩ IOUT = 50mA Over-current Threshold ITH 0.25 - 1.0 A Short-circuit output current ISC 200 - 600 mA Output leak current UVLO threshold VOUT = 0V ILEAK - 0.01 10 μA VEN = 0V, VOUT = 0V VTUVH 2.1 2.3 2.5 V VIN increasing VTUVL 2.0 2.2 2.4 V VIN decreasing AC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Output rise time TON1 0.25 1.2 6 ms ROUT=500Ω, COUT=0.1μF Output turn on time TON2 0.4 2 10 ms ROUT=500Ω, COUT=0.1μF Output fall time TOFF1 50 100 200 μs ROUT=500Ω, COUT=0.1μF TOFF2 50 100 200 μs ROUT=500Ω, COUT=0.1μF Over current shutdown time 1 TBLANK1 5 10 15 ms At continuous over current Over current shutdown time 2 TBLANK2 3 - 15 ms At discontinuous over current Output turn off time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Electrical Characteristics - continued ◎BD2206G (Unless otherwise specified, VIN = 3.3V, Ta = 25°C) DC characteristics Limits Parameter Symbol Min. Typ. Max. Operating current IDD Standby current ISTB Unit Condition - 70 90 μA - 0.01 1 μA VEN = 0V, VOUT = OPEN 2.0 - - V High level input VEN = 3.3V, VOUT = OPEN EN input voltage VEN - - 0.8 V Low level input EN input current IEN -1.0 0.01 1.0 μA VEN = 0V or VEN = 3.3V ON resistance RON - 150 200 mΩ IOUT = 50mA Over-current Threshold ITH 0.8 - 1.6 A Short-circuit output current ISC 750 - 1350 mA VOUT = 0V ILEAK - 0.01 10 μA VEN = 0V, VOUT = 0V VTUVH 2.1 2.3 2.5 V VIN increasing VTUVL 2.0 2.2 2.4 V VIN decreasing Output leak current UVLO threshold AC characteristics Parameter Symbol Limits Min. Typ. Max. Unit Condition Output rise time TON1 0.25 1.2 6 ms ROUT=500Ω, COUT=0.1μF Output turn on time TON2 0.4 2 10 ms ROUT=500Ω, COUT=0.1μF Output fall time TOFF1 50 100 200 μs ROUT=500Ω, COUT=0.1μF Output turn off time TOFF2 50 100 200 μs ROUT=500Ω, COUT=0.1μF Over current shutdown time 1 TBLANK1 5 10 15 ms At continuous over current Over current shutdown time 2 TBLANK2 3 - 15 ms At discontinuous over current www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Measurement Circuits VIN GND GND EN EN NC A. Operating current VIN NC B. EN input voltage, Output rise / fall time OUT OUT VIN GND EN OUT VIN OUT GND NC EN C.ON resistance NC D. Over current protection characteristics Figure 1. Measurement circuits Timing Diagrams VEN 50% 50% TON2 Over current detection TOFF2 90% VOUT 90% IOUT VOUT 10% TON1 10% TOFF1 TBLANK Figure 2. Switch Turn on / off time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 3. Over current limits characteristics 5/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves 90 80 OPERATING CURRENT : IDD [μA] OPERATING CURRENT : IDD [μA] 80 90 Ta=25°C 70 60 50 40 30 20 70 60 50 40 30 20 10 10 0 -50 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 50 100 Figure 5. Operating current EN Enable 1.0 1.0 VIN=3.3V Ta=25°C 0.6 0.4 0.2 0.0 0.8 ISTB[uA] OPERATING CURRENT 0.8 ISTB[uA] 0 AMBIENT TEMPERATURE : Ta [°C] Figure 4. Operating current EN Enable OPERATING CURRENT VIN=3.3V 0.6 0.4 0.2 0.0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 -50 0 50 100 AMBIENT TEMPERATURE : Ta [℃ ] Figure 6. Operating current EN Disable www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 7. Operating current EN Disable 6/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves - continued 2.0 2.0 VIN=3.3 V ENABLE INPUT VOLTAGE VEN, V/EN[V] ENABLE INPUT VOLTAGE VEN, V/EN[V] 0 Ta=25°C Low to High 1.5 Low to High 1.5 High to Low High to Low 1.0 1.0 0.5 0.5 0.0 0.0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] 4 Figure 8. EN input voltage Figure 9. EN input voltage 250 250 VIN=3.3V Ta=25°C 200 ON RESISTANCE : R ON [mΩ] ON RESISTANCE : R ON [mΩ] 200 150 150 100 100 50 50 0 2 2.5 3 3.5 0 -50 4 SUPPLY VOLTAGE : VDD[V] Figure 10. ON resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE : Ta [℃] Figure 11. ON resistance 7/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves - continued 0.6 0.6 VIN=3.3V SHORT CIRCUIT CURRENT : ISC[A] SHORT CIRCUIT CURRENT : ISC[A] Ta=25°C 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 4 Figure 12. Short circuit output current (BD2202G) Figure 13. Short circuit output current (BD2202G) 1.35 SHORT CIRCUIT CURRENT : ISC[A] 1.35 SHORT CIRCUIT CURRENT : ISC[A] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ta=25°C 1.25 1.15 1.05 0.95 0.85 0.75 VIN=3.3V 1.25 1.15 1.05 0.95 0.85 0.75 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] Figure 14. Short circuit output current (BD2206G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 15. Short circuit output current (BD2206G) 8/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves - continued OVER CURRENT SHUTDOWN TIME : TBLANK1[ms] OVER CURRENT SHUTDOWN TIME : TBLANK1[ms] 15 Ta=25°C 14 13 12 11 10 9 8 7 6 5 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 15 VIN=3.3V 14 13 12 11 10 9 8 7 6 5 -50 Figure 16. Over current shutdown time 100 Figure 17. Over current shutdown time 2500 2500 Ta=25°C VIN=3.3V 2000 RISE TIME : TON1 [us] 2000 RISE TIME : TON1 [us] 0 50 SUPPLY VOLTAGE : Ta[℃] 1500 1000 500 1500 1000 500 0 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 18. Output rise time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 19. Output rise time 9/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves - continued 2500 2500 Ta=25°C VIN=3.3V 2000 TURN ON TIME : TON2 [us] TURN ON TIME : TON2 [ms] 2000 1500 1000 1500 1000 500 500 0 0 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 4 Figure 20. Output turn on time Figure 21. Output turn on time 200 200 VIN=3.3V Ta=25°C 150 FALL TIME : TOFF1[us] FALL TIME : TOFF1[us] 150 100 100 50 50 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] -50 4 Figure 22. Output fall time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 23. Output fall time 10/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Performance Curves - continued 200 200 VIN=3.3V TURN OFF TIME : TOFF2[us] TURN OFF TIME : TOFF2[us] Ta=25°C 150 150 100 100 50 50 2 2.5 3 3.5 SUPPLY VOLTAGE : VIN [V] 4 -50 Figure 24. Output turn off time Figure 25. Output turn off time 0.20 UVLO HYSTERESIS VOLTAGE : VHYS[V] 2.5 2.4 TURN OFF TIME : TOFF2[us] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] VUVLOH 2.3 2.2 VUVLOL 2.1 2 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃ ] Figure 26. UVLO threshold voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.16 0.12 0.08 0.04 0.00 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Figure 27. UVLO hysteresis voltage 11/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Wave Forms VOUT (1/div.) VOUT (1/div.) VIN=3.3V RL=500Ω CL=0.1uF V/EN (1/div.) VIN=3.3V RL=500Ω CL=0.1uF V/EN (1/div.) TIME (0.5div.) TIME (0.5div.) Figure 28. Output turn on response Figure 29. Output turn off response IOUT (0.1A/div.) IOUT (0.2A/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VEN (1V/div.) VEN (1V/div.) TIME (2ms/div.) TIME (2ms/div.) Figure 30. Current limit response Enable into short circuit (BD2202G) Figure 31. Current limit response Enable into short circuit (BD2206G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Wave Forms - continued IOUT (0.2A/div.) IOUT (0.2A/div.) VIN=3.3V CIN=10uF CL=0.1uF VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VOUT (1V/div.) TIME (2ms/div.) TIME (2ms/div.) Figure 32. Current limit response Output shorted to GND (BD2202G) Figure 33. Current limit response Output shorted to GND (BD2206G) IOUT (0.1A/div.) IOUT (0.2A/div.) VIN=3.3V CIN=10uF CL=0.1uF VIN=3.3V CIN=10uF CL=0.1uF VOUT (1V/div.) VOUT (1V/div.) TIME (5ms/div.) TIME (5ms/div.) Figure 34. Current limit response Ramped load (1A/10ms) (BD2202G) Figure 35. Current limit response Ramped load (1A/10ms) (BD2206G) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Typical Wave Forms - continued VIN (1V/div.) VIN (1V/div.) VOUT (1V/div.) VOUT (1V/div.) RL=500Ω CL=0.1uF IOUT (10mA/div.) RL=500Ω CL=0.1uF IOUT (10mA/div.) TIME (5ms/div.) TIME (500ms/div.) Figure 36. UVLO VIN rising Figure 37. UVLO VIN falling Typical application circuit VIN Cin VIN Current limit Charge pump VOUT UVLO Control logic Cout EN OFF ON Rout Thermal shutdown GND Application Information When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended. This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Operation Description BD2202G and BD2206G are high side switch ICs with over-current protection function. The operating voltage range is from 2.7V to 3.6V and the current limit value is set to 400mA and 1A respectively. When an over-current condition lasts longer than its over-current shutdown time, the switch turns OFF. The OFF switch is set to latch mode. The switch set to latch mode returns to normal by toggling EN pin from High to Low to High. 1.Switch On/Off control VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN terminal is used also as power source input to internal control circuit. When the switch is turned on from EN control input, VIN and VOUT are connected by a 150mΩ switch. In normal condition, the switch is bidirectional. Therefore, when the voltage of VOUT is higher than VIN the current flows from VOUT to VIN. In the switch MOSFET, there is a parasitic diode (body diode) between drain and source. So, even when the switch is off, when voltage of VOUT is higher than VIN, the current flows through the body diode from VOUT to VIN. 2. Over current detection (OCD) The over current detection circuit limits current flowing in switch MOSFET when it exceeds its limit threshold. There are three types of responses against over current. The over current detection circuit is in operation when the power switch is ON (when EN signal is active). 2-1 When the switch is turned on while the output is in short-circuit status When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status immediately. 2-2 When the output short-circuits while the switch is on When the output short-circuits or high-current load is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out. 2-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 3.Over current shutdown When the over current detection circuit detects an over current, TBLANK timer starts working. When the over current condition disappears before TBLANK2 stage, TBLANK timer is reset. When the over current condition progresses to more than TBLANK1, the switch is shut off. The OFF switch is set to latch off mode. The latch is reset when EN terminal is toggled or when UVLO is detected. 4.Under voltage lockout (UVLO) UVLO keeps the power switch off until VIN voltage exceeds 2.3V (Typ.). Moreover, from a power switch ON situation, if VIN voltage drops to 2.2V (Typ.), the power switch is set to OFF. UVLO has a 100mV hysteresis. The under voltage lock out circuit is in operation when power switch is ON (when EN signal is active). 5.Thermal shutdown When the chip temperature increases to 160°C (Typ.), the thermal shut down circuit works and the power switch is turned OFF. When the chip temperature falls to 140°C (Typ.), the power switch output returns to normal. This operation will repeat itself until the causes of the chip temperature rise are removed or until the power switch output is turned off. The thermal shutdown circuit is in operation when the power switch is ON (when EN signal is active). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB TBLANK2 TBLANK1 Output current ON OFF ON Switch sta tus EN voltage Figure 38. Over-current detection, shutdown operation (return with EN input) TBLANK2 TBLANK1 Output current ON OFF ON Switch sta tus VTUVL VIN voltage VTUVH Figure 39. Over-current detection, shutdown operation (return with UVLO operation) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Power Dissipation (SSOP5) 700 POWER DISSIPATION : Pd [mW 600 500 400 300 200 100 0 0 25 50 75 100 AMBIENT TEMPERATURE : Ta [℃ ] 125 150 Figure 40. Power dissipation curve (Pd-Ta Curve) I/O Equivalence Circuit Pin Name Pin Number EN 3 VOUT 5 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Equivalence circuits 17/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Operational Notes (1) Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. (2) Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. (4) Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) Ground voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) Short between Pins and Mounting Errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. (7) Operation under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (8) Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (9) Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin B B Pin A N P+ N P+ P E N N P+ B N P+ P C N E P substrate Parasitic element P substrate GND GND Parasitic element Figure 41. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 GND Parasitic GND element Other adjacent elements Example of monolithic IC structure 18/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB (10)GND Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. (11)External capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. (12)Thermal Shutdown Circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. (13) Thermal Consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Ordering Information B D 2 2 0 x Part Number G - LBTR Package G : SSOP5 Product class LB for Industrial applications Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP5 (TOP VIEW) Part Number Marking LOT Number Part Number Part Number Marking BD2202G AN BD2206G AR www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Physical Dimension Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 21/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet BD2202G-LB BD2206G-LB Revision History Date Revision 13.Mar.2012 001 21.Feb.2014 002 Changes New Release Delete sentence “and log life cycle” in General Description and Futures (page 1). Change “Industrial Applications” to “Industrial Equipment” in Applications (page 1). Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel Information”). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/22 TSZ02201-0E3E0H300370-1-2 21.Feb.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001