TI CD74AC245M96 Octal-bus transceiver three-state, non-inverting Datasheet

CD54/74AC245,
CD54/74ACT245
Data sheet acquired from Harris Semiconductor
SCHS245B
Octal-Bus Transceiver,
Three-State, Non-Inverting
September 1998 - Revised October 2000
Features
Description
• Buffered Inputs
The ’AC245 and ’ACT245 are octal-bus transceivers that
utilize Advanced CMOS Logic technology. They are noninverting
three-state
bidirectional
transceiver-buffers
intended for two-way transmission from “A” bus to “B” bus or
“B” bus to “A”. The logic level present on the direction input
(DIR) determines the data direction. When the output enable
input (OE) is HIGH, the outputs are in the high-impedance
state.
• Typical Propagation Delay
- 4ns at VCC = 5V, TA = 25oC, CL = 50pF
• Exceeds 2kV ESD Protection per MIL-STD-883,
Method 3015
[ /Title
(CD74
AC245
,
CD74
ACT24
5)
/Subject
(OctalBus
Transceiver,
ThreeState,
NonInverting)
/Autho
r ()
/Keywords
(Harris
Semiconductor,
Advan
ced
CMOS
, Harris
Semicon-
• SCR-Latchup-Resistant CMOS Process and Circuit
Design
Ordering Information
• Speed of Bipolar FAST™/AS/S with Significantly
Reduced Power Consumption
PART
NUMBER
• Balanced Propagation Delays
• AC Types Feature 1.5V to 5.5V Operation and
Balanced Noise Immunity at 30% of the Supply
• ±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50Ω Transmission Lines
TEMP.
RANGE (oC)
PACKAGE
CD54AC245F3A
-55 to 125
20 Ld CERDIP
CD74AC245E
-55 to 125
20 Ld PDIP
CD74AC245M
-55 to 125
20 Ld SOIC
CD74AC245SM
-55 to 125
20 Ld SSOP
CD54ACT245F3A
-55 to 125
20 Ld CERDIP
CD74ACT245E
-55 to 125
20 Ld PDIP
CD74ACT245M
-55 to 125
20 Ld SOIC
CD74ACT245SM
-55 to 125
20 Ld SSOP
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact your local TI sales office or
customer service for ordering information.
Pinout
CD54AC245, CD54ACT245
(CERDIP)
CD74AC245, CD74ACT245
(PDIP, SOIC, SSOP)
TOP VIEW
DIR
1
A0
2
19 OE
A1
3
18 B0
A2
4
17 B1
A3
5
16 B2
A4
6
15 B3
A5
7
14 B4
A6
8
13 B5
A7
9
12 B6
GND 10
11 B7
20 VCC
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
Copyright © 2000, Texas Instruments Incorporated
1
CD54/74AC245, CD54/74ACT245
Functional Diagram
A0
A1
A2
A3
A4
A5
A6
A7
2
18
3
17
4
16
5
15
6
14
7
13
8
12
9
11
B0
B1
B2
B3
B4
B5
B6
B7
1
DIR
19
OE
TRUTH TABLE
CONTROL INPUTS
OE
DIR
OPERATION
L
L
B Data to A Bus
L
H
A Data to B Bus
H
X
Isolation
H = High Level, L = Low Level, X = Irrelevant
To prevent excess currents in the High-Z (isolation) modes, all I/O
terminals should be terminated with 10kΩ to 1MΩ resistors.
2
CD54/74AC245, CD54/74ACT245
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA
Thermal Resistance (Typical, Note 5)
θJA (oC/W)
E Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
69
M Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
58
SM Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
70
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Slew Rate, dt/dv
AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)
AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)
ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. For up to 4 outputs per device, add ±25mA for each additional output.
4. Unless otherwise specified, all voltages are referenced to ground.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VIH
-
-
1.5
1.2
-
1.2
-
1.2
-
V
3
2.1
-
2.1
-
2.1
-
V
5.5
3.85
-
3.85
-
3.85
-
V
1.5
-
0.3
-
0.3
-
0.3
V
3
-
0.9
-
0.9
-
0.9
V
5.5
-
1.65
-
1.65
-
1.65
V
1.5
1.4
-
1.4
-
1.4
-
V
AC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
VIL
VOH
-
VIH or VIL
-
-0.05
-0.05
3
2.9
-
2.9
-
2.9
-
V
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-4
3
2.58
-
2.48
-
2.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
3
CD54/74AC245, CD54/74ACT245
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
PARAMETER
Low Level Output Voltage
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VOL
VIH or VIL
0.05
1.5
-
0.1
-
0.1
-
0.1
V
0.05
3
-
0.1
-
0.1
-
0.1
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
12
3
-
0.36
-
0.44
-
0.5
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
Input Leakage Current
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
Three-State Leakage
Current
IOZ
VIH or VIL
VO = VCC
or GND
-
5.5
-
±0.5
-
±5
-
±10
µA
Quiescent Supply Current
MSI
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
High Level Input Voltage
VIH
-
-
4.5 to
5.5
2
-
2
-
2
-
V
Low Level Input Voltage
VIL
-
-
4.5 to
5.5
-
0.8
-
0.8
-
0.8
V
High Level Output Voltage
VOH
VIH or VIL
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
ACT TYPES
Low Level Output Voltage
VOL
VIH or VIL
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
Three-State or Leakage
Current
IOZ
VIH or VIL
VO = VCC
or GND
-
5.5
-
±0.5
-
±5
-
±10
µA
Quiescent Supply Current
MSI
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
∆ICC
VCC
-2.1
-
4.5 to
5.5
-
2.4
-
2.8
-
3
mA
Input Leakage Current
Additional Supply Current per
Input Pin TTL Inputs High
1 Unit Load
NOTES:
6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize
power dissipation.
7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC.
4
CD54/74AC245, CD54/74ACT245
ACT Input Load Table
INPUT
UNIT LOAD
An, Bn
0.83
OE
0.64
DIR
0.25
NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications
Table, e.g., 2.4mA max at 25oC.
Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case)
-40oC TO 85oC
PARAMETER
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
tPLH, tPHL
1.5
-
-
96
-
-
106
ns
3.3
(Note 9)
3.2
-
10.8
3
-
11.9
ns
5
(Note 10)
2.2
-
7.7
2.1
-
8.5
ns
1.5
-
-
159
-
-
175
ns
3.3
4.7
-
15.9
4.4
-
17.5
ns
5
3.7
-
12.7
3.5
-
14
ns
1.5
-
-
159
-
-
175
ns
3.3
5.6
-
19
5.3
-
21
ns
5
3.7
-
12.7
3.5
-
14
ns
AC TYPES
Propagation Delay,
Data to Output
Propagation Delay,
Output Disable to Output
Propagation Delay,
Output Enable to Output
tPLZ, tPHZ
tPZL, tPZH
Minimum (Valley) VOH During
Switching of Other Outputs
(Output Under Test Not Switching)
VOHV
See Figure 1
5
-
4 at
25oC
-
-
4 at
25oC
-
V
Maximum (Peak) VOL During
Switching of Other Outputs
(Output Under Test Not Switching)
VOLP
See Figure 1
5
-
1 at
25oC
-
-
1 at
25oC
-
V
Three-State Output Capacitance
CO
-
-
15
-
-
15
-
pF
Input Capacitance
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
57
-
-
57
-
pF
Propagation Delay,
Data to Output
tPLH, tPHL
5
(Note 10)
2.7
-
9.1
2.5
-
10
ns
Propagation Delay,
Output Disable to Output
tPLZ, tPHZ
5
3.7
12.7
3.5
14
ns
Propagation Delay,
Output Enable to Output
tPZL, tPZH
5
3.8
13.1
3.6
14.4
ns
Minimum (Valley) VOH During
Switching of Other Outputs
(Output Under Test Not Switching)
VOHV
See Figure 1
5
-
4 at
25oC
-
-
4 at
25oC
-
V
Maximum (Peak) VOL During
Switching of Other Outputs
(Output Under Test Not Switching)
VOLP
See Figure 1
5
-
1 at
25oC
-
-
1 at
25oC
-
V
Power Dissipation Capacitance
ACT TYPES
5
CD54/74AC245, CD54/74ACT245
Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case)
(Continued)
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
Three-State Output Capacitance
CO
-
-
15
-
-
15
-
pF
Input Capacitance
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
57
-
-
57
-
pF
PARAMETER
Power Dissipation Capacitance
NOTES:
8. Limits tested 100%
9. 3.3V Min is at 3.6V, Max is at 3V.
10. 5V Min is at 5.5V, Max is at 4.5V.
11. CPD is used to determine the dynamic power consumption per channel.
AC: PD = VCC2 fi (CPD + CL)
ACT: PD = VCC2 fi (CPD + CL) + VCC ∆ICC where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
VOH
OTHER
OUTPUTS
VOL
VOH
VOHV
OUTPUT
UNDER
TEST
VOLP
VOL
NOTES:
12. Input pulses have the following characteristics: PRR ≤ 1MHz, tr = 3ns, SKEW 1ns.
13. R.F. fixture with 700MHz design rules required. IC should be soldered into test board and bypassed with 0.1µF capacitor. Scope and
probes require 700MHz bandwidth.
FIGURE 1. SIMULTANEOUS SWITCHING TRANSIENT WAVEFORMS
6
CD54/74AC245, CD54/74ACT245
tf = 3ns
tr = 3ns
INPUT LEVEL
90%
OUTPUTS
DISABLED
VS
10%
tPLZ
GND
tPZL
OUTPUT:
LOW TO OFF
TO LOW
VS
0.2 VCC
tPHZ
VOL (≠ VCC)
tPZH
0.8 VCC
VS
OUTPUT:
HIGH TO OFF
TO HIGH
OUTPUTS
ENABLED
OUTPUTS
DISABLED
OUTPUTS
ENABLED
GND (tPHZ, tPZH)
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
OPEN (tPHL, tPLH)
2 VCC (tPLZ, tPZL)
RL
500Ω (OPEN DRAIN)
OUT
RL
CL
500Ω
50pF
(NOTE 14)
DUT WITH
THREESTATE
OUTPUT
NOTE:
14. For AC Series only: When VCC = 1.5V, RL = 1kΩ.
FIGURE 2. THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUIT
tr = 3ns
tf = 3ns
INPUT
LEVEL
90%
VS
10%
An
GND
tPHL
tPLH
VS
Bn
FIGURE 3. PROPAGATION DELAY TIMES
OUTPUT
RL (NOTE)
500Ω
DUT
OUTPUT
LOAD
CL
50pF
NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.
AC
ACT
VCC
3V
Input Switching Voltage, VS
0.5 VCC
1.5V
Output Switching Voltage, VS
0.5 VCC
0.5 VCC
Input Level
FIGURE 4. PROPAGATION DELAY TIMES
7
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
CD54AC245F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54ACT245F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD74AC245E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC245EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC245M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245SM
OBSOLETE
SSOP
DB
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245SM96
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC245SM96G4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT245EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT245M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245M96G4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245SM
OBSOLETE
SSOP
DB
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245SM96
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT245SM96G4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Oct-2007
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74AC245M96
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
CD74AC245SM96
DB
20
SITE 41
330
16
8.2
7.5
2.5
12
16
Q1
CD74ACT245M96
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
CD74ACT245SM96
DB
20
SITE 41
330
16
8.2
7.5
2.5
12
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74AC245M96
DW
20
SITE 41
346.0
346.0
41.0
CD74AC245SM96
DB
20
SITE 41
346.0
346.0
33.0
CD74ACT245M96
DW
20
SITE 41
346.0
346.0
41.0
CD74ACT245SM96
DB
20
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
Similar pages