CXL5002M/P CMOS-CCD 1/2H Delay Line for NTSC Description The CXL5002M/P are general-purpose CMOS-CCD delay line ICs that provide 1/2H delay time for NTSC. CXL5002M 8 pin SOP (Plastic) CXL5002P 8 pin DIP (Plastic) Features • Low power consumption 70mW (Typ.) • Small size package (8-pin SOP, DIP) • Low differential gain DG = 3% (Typ.) • Input signal amplitude 180 IRE (= 1.28Vp-p, Max.) • Low input clock amplitude operation 150mVp-p (Min.) • Built-in peripheral circuits (clock driver, timing generator, autobias, and output circuits) Functions • 340-bit CCD register • Clock drivers • Autobias circuit • Sync tip clamp circuit • Sample and hold circuit Structure CMOS-CCD Absolute Maximum Ratings (Ta = 25°C) • Supply voltage VDD 11 V • Supply voltage VCL 6 V • Operating temperature Topr –10 to +60 °C • Storage temperature Tstg –55 to +150 °C • Allowable power dissipation PD CXL5002M 350 mW CXL5002P 480 mW Recommended Operating Conditions Supply voltage VDD 9 ± 5% V VCL 5 ± 5% V Recommended Clock Conditions • Input clock amplitude VCK 150mVp-p to 1.0Vp-p (250mVp-p typ.) • Clock frequency fCK 10.7MHz Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E50586B79-PS CXL5002M/P IN AUTO FEED OUT Blook Diagram 8 7 6 5 ref. AUTO BIAS CIRCUIT (1 BIT) CLAMP CIRCUIT 340-BIT SHIFT REGISTER AMP φ2 4 VDD VCL 3 CLK VSS AMP DUTY CONTROL CIRCUIT CLOCK DRIVERS 2 S/H φ1 φ2 φ1 1 AMP Pin Description Pin No. Symbol Description Impedance [Ω] Pin No. Symbol Description Impedance [Ω] 1 VSS GND 5 OUT Signal output 2 VCL 5V power supply 6 FEED Feedback DC output > 100k 3 CLK Clock input 7 AUTO Autobias DC output 4 VDD 9V power supply 8 IN > 100k –2– Signal input 600 to 1k 10k > 100k CXL5002M/P Electrical Characteristics (Ta = 25°C, VDD = 9.0V, VCL = 5.0V, fCK = 10.7MHz, VCK = 250mVp-p sine wave, See "Electrical characteristics test circuit") Item Symbol IDD SW conditions Measuring point 1 2 Measuring condition — 4 5 mA A2 — 7 9 mA a V1 –3 0 3 dB b, c b V1 –3.0 –2.1 — dB — 3 5 % e a S — 3 5 deg — — 55 60 — dB V3 3.5 5.0 6.5 V V4 3.5 5.0 6.5 V V5 1.3 2.3 3.3 V V6 1.7 2.7 3.7 V a a IG 250kHz, 1.28Vp-p, sine wave input IG = 20 log (Output voltage [Vp-p] / 1.28 [Vp-p]) a Frequency response fG Dissipation at 3.5MHz in relation to 250kHz fG = 20 log (V3.58MHz/ V250kHz) (Note 1) Differential gain DG 5-staircase wave input Y = 140 IRE (= 1.0Vp-p) Measure S point with vector scope (Note 2) Insertion gain ICL Differential phase DP Allowable input amplitude Noise — — — S: Input = 250kHz, 1.0Vp-p output (Vp-p) f a V2 N: Input = DC ground output (mVrms) d a d a a a VIN-AC S/N VIN-AC Output DC voltage VAUTO-DC VFEED-DC 250kHz, 1.28Vp-p, VOUT-DC sine wave input Typ. Max. Unit A1 250kHz, 1.28Vp-p, sine wave input Supply current Min. –3– 1.28 Vp-p V2 250kHz, 300mVp-p sine wave 3.58MHz, 300mVp-p sine wave Ground 5-staircase wave 250kHz, 1.0Vp-p sine wave c. d. e. f. 0.1µF V3 1MΩ a VBIAS 100k b SW2 –4– 5V A2 2 1 A1 4 9V V6 5.1k CLK fCK = 10.7MHz VCK = 250mVp-p sine wave 3 V5 0.01µF CXL5002M/P 5 6 7 8 VSS b. 0.1µF IN 0.01µF V4 AUTO VCL 250kHz, 1.28Vp-p sine wave SW1 FEED CLK a. OUT VDD Electrical Characteristics Test Circuit Note 4) Note 3) V1 BPF LPF 9V V2 Vector scope S CXL5002M/P CXL5002M/P Note 1) Frequency response measuring condition V3.58MHz (Output signal voltage [Vp-p] at 3.58MHz input) V250kHz (Output signal voltage [Vp-p] at 250kHz input) Set Pin 8 (IN) voltage [V] = VIN-DC + 640mV. [V] 3.58MHz, 300mVp-p sine wave 250kHz, 300mVp-p sine wave 640mV (adjust with VBIAS) VIN-DC Note 2) Differential gain and differential phase measuring condition 5-staircase wave signal Chroma 40 IRE 140 IRE (1.0Vp-p) 40 IRE 1H 63.5µs DG and DP are measured at output S point by vector scope. Note 3) LPF frequency response Note 4) BPF frequency response [dB] 0 –3 [dB] 0 –3 –50 –50 0 5.8 10.7 Frequency [MHz] 0 50 200 4.1M 10.7M Frequency [Hz] –5– CXL5002M/P Application Circuit 9V 5.1k 0.01µF 0.1µF 0.1µF L. P. F signal output Composite video signal input 8 7 6 5 2SA1175 1MΩ CXL5002M/P 1 2 4 3 0.01µF 0.01µF 47µF fCK = 10.7MHz CLK VCK = 250mVp-p sine wave 0.01µF 47µF 5V 9V Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. Example of Representative Characteristics Frequency response vs. Ambient temperature Input = 300mVp-p 3.58MHz, sine wave –1 –2 –3 –4 –1 –2 –3 –4 –20 0 20 40 60 Ta – Ambient temperature [°C] 4.7 Frequency response vs. Supply voltage Input = 300mVp-p 3.58MHz, sine wave 1 –1 –2 –3 Input = 1.28Vp-p 250kHz, sine wave 0 –1 –2 –3 –4 8.5 5.0 5.3 VCL – Supply voltage [V] Insertion gain vs. Ambient temperature IG – Insertion gain [dB] 0 fG – Frequency response [dB] Input = 300mVp-p 3.58MHz, sine wave 0 fG – Frequency response [dB] 0 fG – Frequency response [dB] Frequency response vs. Supply voltage 9.0 VDD – Supply voltage [V] 9.5 –20 –6– 0 20 40 60 Ta – Ambient temperature [°C] CXL5002M/P Insertion gain vs. Supply voltage Input = 1.28Vp-p 250kHz, sine wave 0 –1 –2 –3 0 –1 –2 –3 4.7 5.0 5.3 VCL – Supply voltage [V] 8.5 9.0 VDD – Supply voltage [V] Differential gain vs. Supply voltage 4 4 DG – Differential gain [%] DG – Differential gain [%] Differential gain vs. Ambient temperature 3 2 3 2 1 1 0 –20 Input = 1.28Vp-p 250kHz, sine wave 1 IG – Insertion gain [dB] 1 IG – Insertion gain [dB] Insertion gain vs. Supply voltage 0 0 20 40 60 Ta – Ambient temperature [°C] 4.7 Differential gain vs. Supply voltage 5.0 5.3 VCL – Supply voltage [V] Frequency response 0 –1 Gain [dB] DG – Differential gain [%] 4 3 –2 –3 2 –4 10k 1 0 8.5 100k Frequency [Hz] 9.0 VDD – Supply voltage [V] 9.5 –7– 1M 9.5 CXL5002M/P Package Outline Unit: mm CXL5002M 8PIN SOP (PLASTIC) + 0.4 1.85 – 0.15 + 0.4 6.1 – 0.1 8 5 1 + 0.2 0.1 – 0.05 6.9 7.9 ± 0.4 + 0.3 5.3 – 0.1 0.15 0.5 ± 0.2 4 + 0.1 0.2 – 0.05 0.45 ± 0.1 1.27 0.24 M PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SOP-8P-L01 LEAD TREATMENT SOLDER PLATING EIAJ CODE SOP008-P-0300 LEAD MATERIAL 42/COPPER ALLOY PACKAGE MASS 0.1g JEDEC CODE CXL5002P + 0.3 6.4 – 0.1 + 0.4 9.4 – 0.1 5 7.62 8 + 0.1 0.05 0.25 – 8PIN DIP (PLASTIC) 0° to 15° 4 1 + 0.4 3.7 – 0.1 3.0 MIN 0.5 MIN 2.54 0.5 ± 0.1 1.2 ± 0.15 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 LEAD MATERIAL COPPER ALLOY PACKAGE MASS 0.5g JEDEC CODE –8–