ON NBSG111 2.5v/3.3v sige differential 1:10 clock/data driver with rsecl output Datasheet

NBSG111
2.5V/3.3VSiGe Differential
1:10 Clock/Data Driver
with RSECL* Outputs
*Reduced Swing ECL
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Description
The NBSG111 is a 1−to−10 differential clock/data driver. The
device is functionally equivalent to the LVEP111 device with much
higher bandwidth and lower EMI capabilities.
Inputs incorporate internal 50 termination resistors (input to VT
pad) and accept NECL (Negative ECL), PECL (Positive ECL),
LVTTL, LVCMOS, CML, or LVDS. Outputs are RSECL (Reduced
Swing ECL), 400 mV.
The Q[0:9] / Q[0:9] outputs have a differential synchronous enable
(EN/EN) pin. The synchronous enable pin is used to avoid a runt clock
pulse when the device is enabled/disabled as can happen with an
asynchronous control. The internal flip flop is clocked on the falling
edge of selected clock (CLK0/CLK0 or CLK1/CLK1), therefore all
associated specification limits are referenced to the negative edge of
the selected clock input.
The VBB and VMM pins are internally generated voltage supplies
available to this device only. The VBB is used for single−ended NECL
or PECL inputs and the VMM pin is used for LVCMOS inputs. For
single−ended input operation, the unused differential input is
connected to VBB or VMM as a switching reference voltage. VBB or
VMM may also rebias AC coupled inputs. When used, decouple VBB
and VMM via a 0.01 F capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB and VMM outputs should be left open.
MARKING
DIAGRAM*
SG
111
LYW
FCBGA−49
BA SUFFIX
CASE 489A
SG111
L
Y
W
= Device Code
= Wafer Lot
= Year
= Work Week
*For further details, refer to Application Note
AND8002/D
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Features
•
•
•
•
•
•
•
•
•
•
Maximum Input Clock Frequency > 6 GHz Typical
Maximum Input Data Rate > 6 Gb/s Typical
300 ps Typical Propagation Delay
60 ps Typical Rise and Fall Times
RSPECL Output with Operating Range: VCC = 2.375 V to
3.465 V with VEE = 0 V
RSNECL Output with RSNECL or NECL Inputs with
Operating Range: VCC = 0 V with VEE = −2.375 V to −3.465 V
RSECL Output Level (400 mV Peak−to−Peak Output), Differential
Output
50 Internal Input Termination Resistors
Compatible with Existing 2.5 V/3.3 V LVEP and EP Devices
VBB and VMM Reference Voltage Output
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 8
1
Publication Order Number:
NBSG111/D
NBSG111
1
2
3
4
5
6
7
A
VEE
Q9
Q9
Q8
Q8
Q7
VEE
B
Q0
VMM
CLK1
CLK1
VCC
NC
Q7
C
Q0
VEE
VTCLK1
VTCLK1
VTSEL
SEL
Q6
D
Q1
EN
VTEN
VCC
VTSEL
SEL
Q6
E
Q1
EN
VTEN
VTCLK0
VTCLK0
VEE
Q5
F
Q2
NC
VCC
CLK0
CLK0
VBB
Q5
G
VEE
Q2
Q3
Q3
Q4
Q4
VEE
Figure 1. BGA−49 Pinout (Top View)
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NBSG111
Table 1. PIN DESCRIPTION
Pin
Name
I/O
A1,A7,G1,G7,C2,E6
VEE
−
Negative Supply Voltage. All VEE Pins Must be Externally Connected to Power Supply to Guarantee Proper Operation.
Description
F3,D4,B5
VCC
−
Positive Supply Voltage. All VCC Pins Must be Externally Connected
to Power Supply to Guarantee Proper Operation.
B2
VMM
−
LVCMOS Reference Voltage Output (VCC − VEE) / 2.
F6
VBB
−
ECL Reference Voltage Output
E4
VTCLK0
−
Internal 50 Termination Pin for CLK0. See Table 4. (Note 1)
F4
CLK0
ECL, CML, LVCMOS, LVDS,
LVTTL Input
E5
VTCLK0
−
F5
CLK0
ECL, CML, LVCMOS, LVDS,
LVTTL Input
C4
VTCLK1
−
B4
CLK1
ECL, CML, LVCMOS, LVDS,
LVTTL Input
C3
VTCLK1
−
B3
CLK1
ECL, CML, LVCMOS, LVDS,
LVTTL Input
B1,D1,F1,G3,G5,F7,
D7,B7,A5,A3
Q[0:9]
RSECL Output
Noninverted Differential Outputs [0:9]. Typically Terminated with
50 to VTT = VCC − 1.5 V
C1,E1,G2,G4,G6,E7,
C7,A6,A4,A2
Q[0:9]
RSECL Output
Inverted Differential Outputs [0:9]. Typically Terminated with 50 to
VTT = VCC − 1.5 V
D5
VTSEL
−
D6
SEL
ECL, CML, LVCMOS, LVDS,
LVTTL Input
C5
VTSEL
−
C6
SEL
ECL, CML, LVCMOS, LVDS,
LVTTL Input
D3
VTEN
−
D2
EN
ECL, CML, LVCMOS, LVDS,
LVTTL Input
E3
VTEN
−
E2
EN
ECL, CML, LVCMOS, LVDS,
LVTTL Input
F2,B6
NC
−
Noninverted Differential Input CLK0. Internal 75 k to VEE.
Internal 50 Termination Pin for CLK0. See Table 4. (Note 1)
Inverted Differential Input CLK0. Internal 75 k to VEE and 36.5 k
to VCC.
Internal 50 Termination Pin 1. See Table 4. (Note 1)
Noninverted Differential Input CLK1. Internal 75 k to VEE.
Internal 50 Termination Pin for CLK1. See Table 4. (Note 1)
Inverted Differential Input CLK1. Internal 75 k to VEE and 36.5 k
to VCC.
Internal 50 Termination Pin for SEL. See Table 4. (Note 1)
Noninverted Differential Select Logic Input. Internal 75 k to VEE.
Internal 50 Termination Pin for SEL. See Table 4. (Note 1)
Inverted Differential Select Logic Input. Internal 75 k to VEE and
36.5 k to VCC.
Internal 50 Termination Pin for EN. See Table 4. (Note 1)
Noninverted Differential Output Enable Pin. Internal 75 k to VEE.
Internal 50 termination Pin for EN. See Table 4. (Note 1)
Inverted Differential Output Enable Pin. Internal 75 k to VEE and
36.5 k to VCC.
No Connect. The NC Pins are Electrically Connected to the Die and
”MUST BE” Left Open.
1. In the differential configuration when the input termination pins (VTCLK, VTDCLK) are connected to a common termination voltage and
if no signal is applied, then the device will be susceptible to self−oscillation.
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NBSG111
Table 2. FUNCTION TABLE
SEL
EN
Active Input
L
L
H
H
L
H
L
H
Disabled Outputs
CLK0, CLK0
Disabled Outputs
CLK1, CLK1
2. SEL/EN are the inverse of SEL/EN unless specified otherwise.
Q0 (B1)
Q0 (C1)
Q1 (D1)
Q1 (E1)
(C5) VTSEL
(C6) SEL
Q2 (F1)
R1
RTIN
Q2 (G2)
R2
Q3 (G3)
(E4) VTCLK0
(F4) CLK0
(F5) CLK0
(E5) VTCLK0
(B4) CLK1
(C4) VTCLK1
(B3) CLK1
(C3) VTCLK1
(D6) SEL
(D5) VTSEL
(D3) VTEN
RTIN
R2
RTIN
RTIN R2
RTIN
(D2) EN
R1
0
R2
RTIN R2
Q4 (G5)
R2
R2
R1
Q3 (G4)
RTIN
Q4 (G6)
SYNC
Q5 (F7)
Q5 (E7)
1
(E2) EN
(E3) VTEN
R1
Q6 (D7)
RTIN R2
Q6 (C7)
(F6) VBB
Q7 (B7)
(A1, A7, G1, G7) VEE
Q7 (A6)
Q8 (A5)
Q8 (A4)
(B5, D4, F3) VCC
Q9 (A3)
(B2) VMM
Q9 (A2)
Figure 2. Logic Diagram
Table 3. INTERFACING OPTIONS
INTERFACING OPTIONS
CONNECTIONS
CML
Connect VTCLK0, VTCLK1, VTEN, VTSEL and
VTCLK0, VTCLK1, VTEN, VTSEL to VCC
LVDS
Connect VTCLK0, VTCLK1, VTEN, VTSEL and
VTCLK0, VTCLK1, VTEN, VTSEL Together
AC−COUPLED
Bias VTCLK0, VTCLK1, VTEN, VTSEL and
VTCLK0, VTCLK1, VTEN, VTSEL Inputs within
Common Mode Range (VIHCMR)
RSECL, PECL, NECL
Standard ECL Termination Techniques
LVTTL, LVCMOS
See Text on Page 1. Unused Differential Input Switching Voltage
Reference Range is from VEE + 1125 mV to VCC − 75 mV
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NBSG111
Table 4. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor, R2
(CLK0, CLK0, CLK1, CLK1, SEL, SEL, EN, EN)
75 k
Internal Input Pullup Resistor, R1 (CLK0, CLK1, SEL, EN)
36.5 k
ESD Protection
> 2 kV
> 100 V
> 1 kV
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity (Note 3)
Flammability Rating
Level 3
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
479
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
3.6
V
3.6
−3.6
V
V
−3.6
V
2.8
|VCC − VEE|
V
V
VCC
Positive Power Supply
VEE = 0 V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VEE
Negative Power Supply
VCC = 0 V
VINPP
Differential Input Voltage |CLK − CLK|
VCC − VEE w 2.8 V
VCC − VEE t 2.8 V
IOUT
Output Current
Continuous
Surge
25
50
mA
mA
IIN
Input Current Through RT (50 Resistor)
Static
Surge
45
80
mA
mA
IBB
VBB Sink/Source
1
mA
IMM
VMM Sink/Source
1
mA
TA
Operating Temperature Range
−40 to +70
°C
Tstg
Storage Temperature Range
−65 to +150
°C
JA
Thermal Resistance (Junction−to−Ambient)
(Note 4)
0 LFPM
500 LFPM
49 FCBGA
49 FCBGA
67
57
°C/W
°C/W
JC
Thermal Resistance (Junction−to−Case)
2S2P (Note 4)
49 FCBGA
2 to 4
°C/W
Tsol
Wave Solder
< 15 sec.
225
°C
VI VCC
VI VEE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power).
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NBSG111
Table 6. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 2.5 V; VEE = 0 V (Note 5)
−40°C
Symbol
Characteristic
25°C
70°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
70
85
110
70
85
110
70
85
110
mA
IEE
Negative Power Supply Current
VOH
Output HIGH Voltage (Note 6)
1365
1520
1615
1410
1530
1660
1435
1560
1685
mV
VOUTPP
Output Voltage Amplitude
305
420
545
305
420
545
305
420
545
mV
VIH
Input HIGH Voltage
(Single−Ended) (Notes 8 and 9)
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
mV
VIL
Input LOW Voltage
(Single−Ended) (Notes 8 and 10)
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
mV
VBB
PECL Output Voltage Reference
1025
1100
1265
1025
1100
1265
1025
1100
1265
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 7)
2.5
1.2
2.5
1.2
2.5
V
VMM
LVCMOS Output Voltage Reference
(@ 2.5 VCC)
RTIN
Internal Input Termination Resistor
IIH
IIL
1.2
mV
1050
1250
1450
1050
1250
1450
1050
1250
1450
45
50
55
45
50
55
45
50
55
Input HIGH Current (@ VIH)
30
100
30
100
30
100
A
Input LOW Current (@ VIL)
25
100
25
100
25
100
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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NBSG111
Table 7. DC CHARACTERISTICS, INPUT WITH RSPECL OUTPUT VCC = 3.3 V; VEE = 0 V (Note 11)
−40°C
Symbol
Characteristic
25°C
70°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
70
85
110
70
85
110
70
85
110
mA
IEE
Negative Power Supply Current
VOH
Output HIGH Voltage (Note 6)
2165
2320
2415
2210
2330
2460
2235
2360
2485
mV
VOUTPP
Output Voltage Amplitude
305
420
545
305
420
545
305
420
545
mV
VIH
Input HIGH Voltage
(Single−Ended) (Notes 8 and 9)
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
mV
VIL
Input LOW Voltage
(Single−Ended) (Notes 8 and 10)
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
mV
VBB
PECL Output Voltage Reference
1825
1900
2065
1825
1900
2065
1825
1900
2065
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 7)
3.3
1.2
3.3
1.2
3.3
V
VMM
LVCMOS Output Voltage Reference
(@ 3.3 VCC)
RTIN
Internal Input Termination Resistor
IIH
IIL
1.2
mV
1450
1650
1850
1450
1650
1850
1450
1650
1850
45
50
55
45
50
55
45
50
55
Input HIGH Current (@ VIH)
30
100
30
100
30
100
A
Input LOW Current (@ VIL)
25
100
25
100
25
100
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −0.965 V. VMM varies (VCC − VEE) / 2 with VCC and VEE.
6. All outputs loaded with 50 to VCC − 1.5 V. VOH/VOL measured at VIH/VIL (Typical).
7. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
8. VTHR is the voltage applied to the complementary input, typically VBB or VMM. VTHR(MIN) = VIHCMR + 75 mV. VTHR(MAX) = VIHCMR − 75 mV.
9. VIH cannot exceed VCC.
10. VIL always w VEE.
11. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.165 V. VMM varies (VCC − VEE) / 2 with VCC and VEE.
*Typicals used for testing purposes.
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NBSG111
Table 8. DC CHARACTERISTICS, NECL OR RSNECL INPUT WITH NECL OUTPUT
VCC = 0 V; VEE = −3.465 V to −2.375 V (Note 12)
−40°C
Symbol
Characteristic
25°C
70°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
70
85
110
70
85
110
70
85
110
mA
VOH
Output HIGH Voltage (Note 13)
−1135
−980
−885
−1090
−970
−840
−1065
−940
−815
mV
VOUTPP
Output Voltage Amplitude
305
420
545
305
420
545
305
420
545
mV
VIH
Input HIGH Voltage
(Single−Ended) (Notes 15 and 16)
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
VTHR
+ 75
VCC −
1000*
VCC
mV
VIL
Input LOW Voltage
(Single−Ended) (Notes 15 and 17)
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
VIH −
2500
VCC −
1400*
VTHR
− 75
mV
VBB
NECL Output Voltage Reference
−1475
−1400
−1235
−1475
−1400
−1235
−1475
−1400
−1235
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 14)
VMM
LVCMOS Output Voltage Reference
(@ − 2.5 VEE)
(@ − 3.3 VEE)
RTIN
Internal Input Termination Resistor
IIH
Input HIGH Current (@ VIH)
IIL
Input LOW Current (@ VIL)
VEE+1.2
−1450
−1850
−1250
−1650
45
0.0
VEE+1.2
−1050
−1450
−1450
−1850
−1250
−1650
50
55
45
30
100
25
100
0.0
VEE+1.2
0.0
−1050
−1450
V
mV
−1050
−1450
−1450
−1850
−1250
−1650
50
55
45
50
55
30
100
30
100
A
25
100
25
100
A
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
12. Input and output parameters vary 1:1 with VCC.
13. All outputs loaded with 50 to VCC − 1.5 V. VOH/VOL measured at VIH/VIL (Typical).
14. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
15. VTHR is the voltage applied to the complementary input, typically VBB or VMM. VTHR(MIN) = VIHCMR + 75 mV. VTHR(MAX) = VIHCMR − 75 mV.
16. VIH cannot exceed VCC.
17. VIL always w VEE.
*Typicals used for testing purposes.
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NBSG111
Table 9. AC CHARACTERISTICS VCC = 0 V; VEE = −3.465 V to −2.375 V or VCC = 2.375 V to 3.465 V; VEE = 0 V
−40°C
Symbol
Characteristic
fin < 3 GHz
fin = 5.5 GHz
25°C
Min
Typ
Max
305
180
420
250
250
430
400
300
550
450
350
700
500
2
5
15
15
20
85
70°C
Min
Typ
Max
305
150
420
220
250
430
400
300
550
450
350
700
500
2
5
15
15
20
85
Min
Typ
Max
305
100
420
200
250
430
400
300
600
480
350
750
550
ps
2
5
15
15
20
85
ps
Unit
VOUTPP
Output Voltage Amplitude
(See Figure 3) (Note 18)
tPLH,
tPHL
Propagation Delay to Output Differential
Output Enable
Clock Select
tSKEW
Duty Cycle Skew (Note 19)
Within−Device Skew (Note 20)
Device−to−Device Skew (Note 21)
tS
Setup Time to CLK (EN to Selected CLK0:1)
110
70
110
70
115
80
ps
tH
Hold Time (EN to Selected CLK0:1)
110
70
110
70
115
80
ps
tJITTER
RMS Random Clock Jitter(Figure 3)
(Note 23)
fin = 5 GHz
Peak−to−Peak Data Dependent Jitter
(Note 24)
fin = 5 Gb/s
VINPP
Input Voltage Swing/Sensitivity
(Differential Configuration) (Note 22)
tr
tf
Output Rise/Fall Times (20% − 80%) @ 1 GHz
Q, Q
0.5
2.0
0.5
2.0
0.5
mV
2.0
ps
14
75
40
2600
75
80
40
60
60
2600
75
80
40
2600
60
80
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
18. Measured using a 500 mV source, 50% duty cycle clock source. All outputs loaded with 50 to VCC − 1.5 V. Input edge rates 40 ps
(20% − 80%).
19. tSKEW = |tPLH − tPHL| for a nominal 50% differential clock input waveform (Figure 4).
20. Within−Device skew is measured between outputs under identical transitions and conditions on any one device.
21. Device−to−Device skew for identical transitions at identical VCC levels.
22. VINPP (MAX) cannot exceed VCC − VEE (applicable only when VCC −VEE t 2600 mV).
23. Additive RMS jitter with 50% duty cycle clock signal at 5 GHz.
24. Additive Peak−to−Peak jitter with input NRZ data at PRBS 231−1 at 5 Gb/s.
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NBSG111
10.0
9.0
8.0
Q AMP (mV)
450
7.0
6.0
3.3 V
350
5.0
4.0
2.5 V
RMS JITTER (ps)
OUTPUT VOLTAGE AMPLITUDE (mV)
550
3.0
250
2.0
RMS JITTER (ps)
150
1
2
1.0
3
4
5
6
0.0
INPUT FREQUENCY (GHz)
Figure 3. Output Voltage Amplitude (VOUTPP) / RMS Jitter vs.
Input Frequency (fin) at Ambient Temperature (Typical)
CLK
VINPP = VIH(CLK) − VIL(CLK)
CLK
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tPHL
tPLH
Figure 4. AC Reference Measurement
Q
Zo = 50 D
Receiver
Device
Driver
Device
Q
D
Zo = 50 50 50 VTT
VTT = VCC − 2.0 V
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping †
NBSG111BA
FCBGA−49
100 Units / Tray
NBSG111BAR2
FCBGA−49
500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NBSG111
PACKAGE DIMENSIONS
FCBGA−49
BA SUFFIX
PLASTIC 8x8 mm (1.0 mm pitch) BGA FLIP CHIP PACKAGE
CASE 489A−02
ISSUE A
A
B
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M−1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE C.
4. DATUM C (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
6. 489A−01 OBSOLETE, NEW STANDARD 489A−02.
A
D
A2
ÉÉ
ÉÉ
TERMINAL A1 CORNER
Z
E
4X
DIM
A
A1
A2
b
D
D1
E
E1
e
Z
DETAIL A
0.15 C
D1
e
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
NOTE 5
A
B
e
E1
49 X
0.20 C
b NOTE 3
C
0.15
M
C A B
D
0.08
M
C
E
NOTE 4
0.12 C
G
6
5
4
3
2
C
SEATING
PLANE
F
7
MILLIMETERS
MIN
MAX
−−−
1.40
0.3
0.5
0.91 REF
0.40
0.60
8.00 BSC
6.00 BSC
8.00 BSC
6.00 BSC
1.00 BSC
49 X
1
VIEW Z−Z
A1
DETAIL A
(ROTATED 90 _ C.W.)
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NBSG111/D
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