MC10EL04, MC100EL04 5VECL 2-Input AND/NAND The MC10EL/100EL04 is a 2-input AND/NAND gate. The device is functionally equivalent to the E104 device with higher performance capabilities. With propagation delays and output transition times significantly faster than the E104, the EL04 is ideally suited for those applications which require the ultimate in AC performance. The 100 Series contains temperature compensation. http://onsemi.com MARKING DIAGRAMS* Features • 240 ps Propagation Delay • ESD Protection: > 1 kV Human Body Model, • • • • • • • • > 100 V Machine Model PECL Mode Operating Range: VCC = 4.2 V to 5.7 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V to −5.7 V Internal Input Pulldown Resistors Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level 1 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V−0 @ 0.125, Oxygen Index 28 to 34 Transistor Count = 45 devices Pb−Free Packages are Available NC 1 8 VCC D0 2 7 Q D1 3 6 Q NC 4 5 VEE 8 8 HEL89 ALYW G 8 1 SOIC−8 D SUFFIX CASE 751 1 1 8 8 1 TSSOP−8 DT SUFFIX CASE 948R KEL89 ALYW G 1 8 HL89 ALYWG G H = MC10 K = MC100 A = Assembly Location L Y W G 1 KL89 ALYWG G = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Figure 1. Logic Diagram and Pinout Table 1. PIN DESCRIPTION PIN FUNCTION D0, D1 Q, Q VCC VEE NC ECL Data Inputs ECL Data Outputs Positive Supply Negative Supply No Connect © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 5 1 Publication Order Number: MC10EL04/D MC10EL04, MC100EL04 Table 2. MAXIMUM RATINGS Rating Units VCC Symbol PECL Mode Power Supply Parameter VEE = 0 V Condition 1 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SOIC−8 SOIC−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free Condition 2 VI VCC VI VEE Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. 10EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 1) −40°C Symbol Characteristic Typ Max 14 17 3920 4010 4110 Output LOW Voltage (Note 2) 3050 3200 Input HIGH Voltage 3770 VIL Input LOW Voltage 3050 IIH Input HIGH Current IEE Power Supply Current VOH Output HIGH Voltage (Note 4) VOL VIH Min 25°C D0 D1 Typ Max 14 17 4020 4105 4190 3350 3050 3210 4110 3870 3500 3050 250 150 Min 85°C Typ Max Unit 14 17 mA 4090 4185 4280 mV 3370 3050 3227 3405 mV 4190 3940 4280 mV 3520 3050 3555 mV 250 150 Min 250 150 mA IIL Input LOW Current 0.5 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C or VEE can vary +0.06 V / −0.5 V for −40°C. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 2 MC10EL04, MC100EL04 Table 4. 10EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 3) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 14 17 14 17 14 17 mA VOH Output HIGH Voltage (Note 4) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 4) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV VIH Input HIGH Voltage −1230 −890 −1130 −810 −1060 −720 mV VIL Input LOW Voltage −1950 −1500 −1950 −1480 −1950 −1445 mV IIH Input HIGH Current D0 D1 250 150 250 150 250 150 mA IIL Input LOW Current 0.5 0.5 0.3 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input and output parameters vary 1:1 with VCC. VEE can vary +0.25 V / −0.5 V for +25°C and +85°C or VEE can vary +0.06 V / −0.5 V for −40°C. 4. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. 100EL SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V (Note 5) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 20 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 6) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 6) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV VIH Input HIGH Voltage 3835 4120 3835 4120 3835 4120 mV VIL Input LOW Voltage 3190 3525 3190 3525 3190 3525 mV IIH Input HIGH Current IIL Input LOW Current D0 D1 250 150 0.5 250 150 0.5 250 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 6. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10EL04, MC100EL04 Table 6. 100EL SERIES NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V (Note 7) −40°C Symbol Characteristic Min 25°C Typ Max 14 17 Min 85°C Typ Max 14 17 Min Typ Max Unit 16 20 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 8) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 8) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV VIH Input HIGH Voltage −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage −1810 −1475 −1810 −1475 −1810 −1475 mV IIH Input HIGH Current IIL Input LOW Current 250 150 D0 D1 0.5 250 150 0.5 250 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. Input and output parameters vary 1:1 with VCC. VEE can vary +0.8 V / −0.5 V. 8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 7. AC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V or VCC = 0.0 V; VEE= −5.0 V (Note 9) −40°C Symbol Characteristic fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay to Output tJITTER Cycle−to−Cycle Jitter tr tf Output Rise/Fall Times Q (20% − 80%) Min Typ 25°C Max Min TBD 70 235 225 85°C Max Min TBD 410 130 TBD 100 Typ 240 100 225 Max TBD 370 155 TBD 350 Typ 265 GHz 395 TBD 350 100 225 Unit ps ps 350 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 9. 10 Series: VEE can vary +0.25 V / −0.5 V for +25°C and +85°C. or VEE can vary +0.06 V / −0.5 V for −40°C. 100 Series: VEE can vary +0.8 V / −0.5 V. http://onsemi.com 4 MC10EL04, MC100EL04 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC10EL04, MC100EL04 ORDERING INFORMATION Package Shipping † SOIC−8 98 Units / Rail MC10EL04DG SOIC−8 (Pb−Free) 98 Units / Rail MC10EL04DR2 SOIC−8 2500 / Tape & Reel MC10EL04DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10EL04DT TSSOP−8 100 Units / Rail MC10EL04DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10EL04DTR2 TSSOP−8 2500 / Tape & Reel MC10EL04DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel Device MC10EL04D MC100EL04D SOIC−8 98 Units / Rail MC100EL04DG SOIC−8 (Pb−Free) 98 Units / Rail MC100EL04DR2 SOIC−8 2500 / Tape & Reel MC100EL04DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100EL04DT TSSOP−8 100 Units / Rail MC100EL04DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100EL04DTR2 TSSOP−8 2500 / Tape & Reel MC100EL04DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 MC10EL04, MC100EL04 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10EL04, MC100EL04 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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