16-Bit, 250 kSPS, Unipolar/Bipolar Programmable Input PulSAR® ADC AD7610 FEATURES FUNCTIONAL BLOCK DIAGRAM TEMP REFBUFIN REF REFGND VCC VEE DVDD AGND PDREF AD7610 REF AMP AVDD SERIAL DATAPORT SERIAL CONFIGURATION PORT 16 REF PDBUF IN+ SWITCHED CAP DAC IN– DGND OVDD OGND D[15:0] SER/PAR BYTESWAP CLOCK CNVST PD RESET PARALLEL INTERFACE OB/2C BUSY CONTROL LOGIC AND CALIBRATION CIRCUITRY RD CS BIPOLAR 06395-001 Multiple pins/software programmable input ranges: 5 V, 10 V, ±5 V, ±10 V Pins or serial SPI®-compatible input ranges/mode selection Throughput: 250 kSPS 16-bit resolution with no missing codes INL: ±0.75 LSB typ, ±1.5 LSB max (±23 ppm of FSR) SNR: 94 dB @ 2 kHz iCMOS® process technology 5 V internal reference: typical drift 3 ppm/°C; On-chip temperature sensor No pipeline delay (SAR architecture) Parallel (16- or 8-bit bus) and serial 5 V/3.3 V interface SPI-/QSPI™-/MICROWIRE™-/DSP-compatible Power dissipation 90 mW @ 250 kSPS 10 mW @ 1 kSPS 48-lead LQFP and LFCSP (7 mm × 7 mm) packages TEN Figure 1. APPLICATIONS Process control Medical instruments High speed data acquisition Digital signal processing Instrumentation Spectrum analysis ATE GENERAL DESCRIPTION The AD7610 is a 16-bit charge redistribution successive approximation register (SAR), architecture analog-to-digital converter (ADC) fabricated on Analog Devices, Inc.’s iCMOS high voltage process. The device is configured through hardware or via a dedicated write only serial configuration port for input range and operating mode. The AD7610 contains a high speed 16-bit sampling ADC, an internal conversion clock, an internal reference (and buffer), error correction circuits, and both serial and parallel system interface ports. A falling edge on CNVST samples the analog input on IN+ with respect to a ground sense, IN−. The AD7610 features four different analog input ranges: 0 V to 5 V, 0 V to 10 V, ±5 V, and ±10 V. Power consumption is scaled linearly with throughput. The device is available in Pb-free 48-lead, lowprofile quad flat package (LQFP) and a lead frame chip-scale (LFCSP_VQ) package. Operation is specified from −40°C to +85°C. Table 1. 48-Lead 14-/16-/18-Bit PulSAR Selection Type Pseudo Differential 100 kSPS to 250 kSPS AD7651 AD7660 AD7661 500 kSPS to 570 kSPS AD7650 AD7652 AD7664 AD7666 AD7665 800 kSPS to 1000 kSPS AD7653 AD7667 True Bipolar AD7610 AD7663 True Differential AD7675 AD7676 AD7612 AD7671 AD7951 AD7677 18-Bit, True Differential Multichannel/ Simultaneous AD7678 AD7679 AD7674 >1000 kSPS AD7621 AD7622 AD7623 AD7641 AD7643 AD7654 AD7655 Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. AD7610 TABLE OF CONTENTS Features .............................................................................................. 1 Driver Amplifier Choice ........................................................... 20 Applications....................................................................................... 1 Voltage Reference Input/Output .............................................. 20 Functional Block Diagram .............................................................. 1 Power Supplies ............................................................................ 21 General Description ......................................................................... 1 Conversion Control ................................................................... 22 Revision History ............................................................................... 2 Interfaces.......................................................................................... 23 Specifications..................................................................................... 3 Digital Interface.......................................................................... 23 Timing Specifications .................................................................. 5 Parallel Interface......................................................................... 23 Absolute Maximum Ratings............................................................ 7 Serial Interface ............................................................................ 24 ESD Caution.................................................................................. 7 Master Serial Interface............................................................... 24 Pin Configuration and Function Descriptions............................. 8 Slave Serial Interface .................................................................. 26 Typical Performance Characteristics ........................................... 11 Hardware Configuration ........................................................... 28 Terminology .................................................................................... 15 Software Configuration ............................................................. 28 Theory of Operation ...................................................................... 16 Microprocessor Interfacing....................................................... 29 Overview...................................................................................... 16 Application Information................................................................ 30 Converter Operation.................................................................. 16 Layout Guidelines....................................................................... 30 Transfer Functions...................................................................... 17 Evaluating Performance ............................................................ 30 Typical Connection Diagram ................................................... 18 Outline Dimensions ....................................................................... 31 Analog Inputs.............................................................................. 19 Ordering Guide .......................................................................... 31 REVISION HISTORY 10/06—Revision 0: Initial Version Rev. 0 | Page 2 of 32 AD7610 SPECIFICATIONS AVDD = DVDD = 5 V; OVDD = 2.7 V to 5.5 V; VCC = 15 V; VEE = −15 V; VREF = 5 V; all specifications TMIN to TMAX, unless otherwise noted. Table 2. Parameter RESOLUTION ANALOG INPUT Voltage Range, VIN Analog Input CMRR Input Current Input Impedance THROUGHPUT SPEED Complete Cycle Throughput Rate DC ACCURACY Integral Linearity Error 2 No Missing Codes2 Differential Linearity Error2 Transition Noise Zero Error (Unipolar or Bipolar) Zero Error Temperature Drift Bipolar Full-Scale Error Unipolar Full-Scale Error Full-Scale Error Temperature Drift Power Supply Sensitivity AC ACCURACY Dynamic Range Signal-to-Noise Ratio Signal-to-(Noise + Distortion) (SINAD) Total Harmonic Distortion Spurious-Free Dynamic Range –3 dB Input Bandwidth Aperture Delay Aperture Jitter Transient Response INTERNAL REFERENCE Output Voltage Temperature Drift Line Regulation Long-Term Drift Turn-On Settling Time REFERENCE BUFFER REFBUFIN Input Voltage Range Conditions/Comments Min 16 VIN+ − VIN− = 0 V to 5 V VIN+ − VIN− = 0 V to 10 V VIN+ − VIN− = ±5 V VIN+ − VIN− = ±10 V VIN− to AGND fIN = 100 kHz VIN = ±5 V, ±10 V @ 250 kSPS See Analog Inputs section −0.1 −0.1 −5.1 −10.1 −0.1 Typ Max Unit Bits +5.1 +10.1 +5.1 +10.1 +0.1 V V V V V dB μA 4 250 μs kSPS +1.5 LSB 3 Bits LSB LSB LSB ppm/°C LSB LSB ppm/°C LSB 75 100 1 −1.5 16 −1 ±0.75 +1.5 0.55 −35 +35 ±1 −50 −70 +50 +70 ±1 3 AVDD = 5 V ± 5% VIN = 0 V to 5 V, fIN = 2 kHz, −60 dB VIN = 0 V to 10 V, ±5 V, fIN = 2 kHz, −60 dB VIN = ±10 V, fIN = 2 kHz, −60 dB VIN = 0 V to 5 V, 0 V to 10 V, fIN = 2 kHz VIN = ±5 V, ±10 V, fIN = 2 kHz VIN = 0 V to 5 V, fIN = 20 kHz VIN = ±5 V, fIN = 2 kHz VIN = 0 V to 10 V, ±5 V, fIN = 2 kHz VIN = ±10 V, fIN = 2 kHz fIN = 2 kHz fIN = 2 kHz VIN = 0 V to 5 V Full-scale step PDREF = PDBUF = low REF @ 25°C –40°C to +85°C AVDD = 5 V ± 5% 1000 hours CREF = 22 μF PDREF = high Rev. 0 | Page 3 of 32 92.5 92 93.5 94 94.5 93 94 93.5 92.5 93 93.5 −107 107 650 2 5 500 dB 4 dB dB dB dB dB dB dB dB dB dB kHz ns ps rms ns 4.965 5.000 ±3 ±15 50 10 5.035 V ppm/°C ppm/V ppm ms 2.4 2.5 2.6 V AD7610 Parameter EXTERNAL REFERENCE Voltage Range Current Drain TEMPERATURE PIN Voltage Output Temperature Sensitivity Output Resistance DIGITAL INPUTS Logic Levels VIL VIH IIL IIH DIGITAL OUTPUTS Data Format Pipeline Delay 5 VOL VOH POWER SUPPLIES Specified Performance AVDD DVDD OVDD VCC VEE Operating Current 7 , 8 AVDD With Internal Reference With Internal Reference Disabled DVDD OVDD VCC VEE Power Dissipation With Internal Reference With Internal Reference Disabled In Power-Down Mode 9 TEMPERATURE RANGE 10 Specified Performance Conditions/Comments PDREF = PDBUF = high REF 250 kSPS throughput Min Typ Max Unit 4.75 5 30 AVDD + 0.1 V μA @ 25°C 311 1 4.33 −0.3 2.1 −1 −1 mV mV/°C kΩ +0.6 OVDD + 0.3 +1 +1 V V μA μA 0.4 V V 5.25 5.25 5.25 15.75 0 V V V V V Parallel or serial 16-bit ISINK = 500 μA ISOURCE = –500 μA OVDD − 0.6 4.75 6 4.75 2.7 7 −15.75 5 5 15 −15 @ 250 kSPS throughput 8 6.3 3.3 0.3 1.4 0.8 0.7 VCC = 15 V, with internal reference buffer VCC = 15 V VEE = −15 V @ 250 kSPS throughput PDREF = PDBUF = low PDREF = PDBUF = high PD = high TMIN to TMAX 90 70 10 −40 1 mA mA mA mA mA mA mA 110 90 mW mW μW +85 °C With VIN = 0 V to 5 V or 0 V to 10 V ranges, the input current is typically 40 μA. In all input ranges, the input current scales with throughput. See the Analog Inputs section. Linearity is tested using endpoints, not best fit. All linearity is tested with an external 5 V reference. 3 LSB means least significant bit. All specifications in LSB do not include the error contributed by the reference. 4 All specifications in dB are referred to a full-scale range input, FSR. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified. 5 Conversion results are available immediately after completed conversion. 6 4.75 V or VREF – 0.1 V, whichever is larger. 7 Tested in parallel reading mode. 8 With internal reference, PDREF = PDBUF = low; with internal reference disabled, PDREF = PDBUF = high. With internal reference buffer, PDBUF = low. 9 With all digital inputs forced to OVDD. 10 Consult sales for extended temperature range. 2 Rev. 0 | Page 4 of 32 AD7610 TIMING SPECIFICATIONS AVDD = DVDD = 5 V; OVDD = 2.7 V to 5.5 V; VCC = 15 V; VEE = −15 V; VREF = 5 V; all specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter CONVERSION AND RESET (See Figure 33 and Figure 34) Convert Pulse Width Time Between Conversions CNVST Low to BUSY High Delay BUSY High (Except Master Serial Read After Convert) Aperture Delay End of Conversion to BUSY Low Delay Conversion Time Acquisition Time RESET Pulse Width PARALLEL INTERFACE MODES (See Figure 35 and Figure 37) CNVST Low to DATA Valid Delay DATA Valid to BUSY Low Delay Bus Access Request to DATA Valid Bus Relinquish Time MASTER SERIAL INTERFACE MODES1 (See Figure 39 and Figure 40) CS Low to SYNC Valid Delay CS Low to Internal SDCLK Valid Delay1 CS Low to SDOUT Delay CNVST Low to SYNC Delay, Read During Convert SYNC Asserted to SDCLK First Edge Delay Internal SDCLK Period2 Internal SDCLK High2 Internal SDCLK Low2 SDOUT Valid Setup Time2 SDOUT Valid Hold Time2 SDCLK Last Edge to SYNC Delay2 CS High to SYNC HI-Z CS High to Internal SDCLK HI-Z CS High to SDOUT HI-Z BUSY High in Master Serial Read After Convert2 CNVST Low to SYNC Delay, Read After Convert SYNC Deasserted to BUSY Low Delay SLAVE SERIAL/SERIAL CONFIGURATION INTERFACE MODES1 (See Figure 42, Figure 43, and Figure 45) External SDCLK, SCCLK Setup Time External SDCLK Active Edge to SDOUT Delay SDIN/SCIN Setup Time SDIN/SCIN Hold Time External SDCLK/SCCLK Period External SDCLK/SCCLK High External SDCLK/SCCLK Low 1 2 Symbol Min t1 t2 t3 t4 t5 t6 t7 t8 t9 10 4 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32 t33 t34 t35 t36 t37 Typ Max 35 1.45 2 10 1.45 380 10 1.41 20 40 15 2 10 10 10 560 3 30 15 10 4 5 5 45 10 10 10 See Table 4 1.31 25 5 2 5 5 25 10 10 ns μs ns μs ns ns μs ns ns μs ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns μs ns 18 In serial interface modes, the SDSYNC, SDSCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum. In serial master read during convert mode. See Table 4 for serial mode read after convert mode. Rev. 0 | Page 5 of 32 Unit ns ns ns ns ns ns ns AD7610 Table 4. Serial Clock Timings in Master Read After Convert Mode DIVSCLK[1] DIVSCLK[0] SYNC to SDCLK First Edge Delay Minimum Internal SDCLK Period Minimum Internal SDCLK Period Maximum Internal SDCLK High Minimum Internal SDCLK Low Minimum SDOUT Valid Setup Time Minimum SDOUT Valid Hold Time Minimum SDCLK Last Edge to SYNC Delay Minimum BUSY High Width Maximum 1.6mA TO OUTPUT PIN Symbol t18 t19 t19 t20 t21 t22 t23 t24 t28 0 0 3 30 45 15 10 4 5 5 2.25 0 1 20 60 90 30 25 20 8 7 3.00 1 0 20 120 180 60 55 20 35 35 4.40 1 1 20 240 360 120 115 20 90 90 7.30 Unit ns ns ns ns ns ns ns ns μs IOL 1.4V CL 60pF 2V IOH tDELAY tDELAY 2V 0.8V Figure 2. Load Circuit for Digital Interface Timing, SDOUT, SYNC, and SCLK Outputs, CL = 10 pF 2V 0.8V Figure 3. Voltage Reference Levels for Timing Rev. 0 | Page 6 of 32 06395-003 NOTES 1. IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND SDOUT ARE DEFINED WITH A MAXIMUM LOAD CL OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM. 0.8V 06395-002 500µA AD7610 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Analog Inputs/Outputs IN+, IN−1 to AGND REF, REFBUFIN, TEMP, REFGND to AGND Ground Voltage Differences AGND, DGND, OGND Supply Voltages AVDD, DVDD, OVDD AVDD to DVDD, AVDD to OVDD DVDD to OVDD VCC to AGND, DGND VEE to GND Digital Inputs PDREF, PDBUF2 Internal Power Dissipation3 Internal Power Dissipation4 Junction Temperature Storage Temperature Range Rating VEE − 0.3 V to VCC + 0.3 V AVDD + 0.3 V to AGND − 0.3 V ±0.3 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION −0.3 V to +7 V ±7 V ±7 V –0.3 V to +16.5 V +0.3 V to −16.5 V −0.3 V to OVDD +0.3 V ±20 mA 700 mW 2.5 W 125°C −65°C to +125°C 1 See the Analog Inputs section. See the Voltage Reference Input section. Specification is for the device in free air: 48-Lead LQFP; θJA = 91°C/W, θJC = 30°C/W. 4 Specification is for the device in free air: 48-Lead LFCSP; θJA = 26°C/W. 2 3 Rev. 0 | Page 7 of 32 AD7610 48 47 46 45 44 43 42 REF REFGND IN– VCC VEE AGND IN+ AVDD TEMP REFBUFIN PDREF PDBUF PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 41 40 39 38 37 AGND 1 36 BIPOLAR 35 CNVST AGND 3 34 PD BYTESWAP 4 33 RESET PIN 1 AVDD 2 OB/2C 5 AD7610 32 CS OGND 6 TOP VIEW (Not to Scale) 31 RD 30 TEN SER/PAR 8 29 BUSY 9 28 D15/SCCS D1 10 27 D14/SCCLK D2/DIVSCLK[0] 11 26 D13/SCIN D3/DIVSCLK[1] 12 25 D12/HW/SW OGND 7 D0 06395-004 D11/RDERROR D10/SYNC D9/SDCLK D8/SDOUT DGND DVDD OVDD OGND D7/RDC/SDIN D6/INVSCLK D4/EXT/INT D5/INVSYNC 13 14 15 16 17 18 19 20 21 22 23 24 Figure 4. Pin Configuration Table 6. Pin Function Descriptions Pin No. 1, 3, 42 Mnemonic AGND Type 1 P 2, 44 4 AVDD BYTESWAP P DI 5 OB/2C DI 2 6, 7, 17 OGND P 8 SER/PAR DI 9, 10 D[0:1] DO 11, 12 D[2:3] or DIVSCLK[0:1] DI/O 13 D4 or EXT/INT DI/O Description Analog Power Ground Pins. Ground reference point for all analog I/O. All analog I/O should be referenced to AGND and should be connected to the analog ground plane of the system. In addition, the AGND, DGND, and OGND voltages should be at the same potential. Analog Power Pins. Nominally 4.75 V to 5.25 V and decoupled with 10 μF and 100 nF capacitors. Parallel Mode Selection (8-Bit/16-Bit). When high, the LSB is output on D[15:8] and the MSB is output on D[7:0]; when low, the LSB is output on D[7:0] and the MSB is output on D[15:8]. Straight Binary/Binary Twos Complement Output. When high, the digital output is straight binary. When low, the MSB is inverted resulting in a twos complement output from its internal shift register. Input/Output Interface Digital Power Ground. Ground reference point for digital outputs. Should be connected to the system digital ground ideally at the same potential as AGND and DGND. Serial/Parallel Selection Input. When SER/PAR = low, the parallel mode is selected. When SER/PAR = high, the serial modes are selected. Some bits of the data bus are used as a serial port and the remaining data bits are high impedance outputs. Bit 0 and Bit 1 of the parallel port data output bus. These pins are always outputs regardless of the state of SER/PAR. In parallel mode, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus. Serial Data Division Clock Selection. In serial master read after convert mode (SER/PAR = high, EXT/INT = low, RDC/SDIN = low) these inputs can be used to slow down the internally generated serial data clock that clocks the data output. In other serial modes, these pins are high impedance outputs. In parallel mode, this output is used as Bit 4 of the parallel port data output bus. Serial Data Clock Source Select. In serial mode, this input is used to select the internally generated (master) or external (slave) serial data clock for the AD7610 output data. When EXT/INT = low, master mode; the internal serial data clock is selected on SDCLK output. When EXT/INT = high, slave mode; the output data is synchronized to an external clock signal (gated by CS) connected to the SDCLK input. Rev. 0 | Page 8 of 32 AD7610 Pin No. 14 Mnemonic D5 or INVSYNC Type1 DI/O 15 D6 or INVSCLK DI/O 16 D7 or RDC or DI/O Description In parallel mode, this output is used as Bit 5 of the parallel port data output bus. Serial Data Invert Sync Select. In serial master mode (SER/PAR = high, EXT/INT = low). This input is used to select the active state of the SYNC signal. When INVSYNC = low, SYNC is active high. When INVSYNC = high, SYNC is active low. In parallel mode, this output is used as Bit 6 of the parallel port data output bus. In all serial modes, invert SDCLK/SCCLK select. This input is used to invert both SDCLK and SCCLK. When INVSCLK = low, the rising edge of SDCLK/SCCLK are used. When INVSCLK = high, the falling edge of SDCLK/SCCLK are used. In parallel mode, this output is used as Bit 7 of the parallel port data output bus. Serial Data Read During Convert. In serial master mode (SER/PAR = high, EXT/INT = low) RDC is used to select the read mode. See the Master Serial Interface section. When RDC = low, the current result is read after conversion. Note the maximum throughput is not attainable in this mode. When RDC = high, the previous conversion result is read during the current conversion. SDIN 18 OVDD P 19 DVDD P 20 DGND P 21 D8 or SDOUT DO 22 D9 or SDCLK DI/O 23 D10 or SYNC DO 24 D11 or RDERROR DO 25 D12 or HW/SW DI/O 26 D13 or SCIN DI/O Serial Data In. In serial slave mode (SER/PAR = high EXT/INT = high) SDIN can be used as a data input to daisychain the conversion results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SDCLK periods after the initiation of the read sequence. Input/Output Interface Digital Power. Nominally at the same supply as the supply of the host interface 2.5 V, 3 V, or 5 V and decoupled with 10 μF and 100 nF capacitors. Digital Power. Nominally at 4.75 V to 5.25 V and decoupled with 10 μF and 100 nF capacitors. Can be supplied from AVDD. Digital Power Ground. Ground reference point for digital outputs. Should be connected to system digital ground ideally at the same potential as AGND and OGND. In parallel mode, this output is used as Bit 8 of the parallel port data output bus. Serial Data output. In all serial modes this pin is used as the serial data output synchronized to SDCLK. Conversion results are stored in an on-chip register. The AD7610 provides the conversion result, MSB first, from its internal shift register. The data format is determined by the logic level of OB/2C. When EXT/INT = low, (master mode) SDOUT is valid on both edges of SDCLK. When EXT/INT = high (slave mode). When INVSCLK = low, SDOUT is updated on SDCLK rising edge. When INVSCLK = high, SDOUT is updated on SDCLK falling edge. In parallel mode, this output is used as Bit 9 of the parallel port data output bus. Serial Data Clock. In all serial modes, this pin is used as the serial data clock input or output, dependent on the logic state of the EXT/INT pin. The active edge where the data SDOUT is updated depends on the logic state of the INVSCLK pin. In parallel mode, this output is used as Bit 10 of the parallel port data output bus. Serial Data Frame Synchronization. In serial master mode (SER/PAR = high, EXT/INT= low), this output is used as a digital output frame synchronization for use with the internal data clock. When a read sequence is initiated and INVSYNC = low, SYNC is driven high and remains high while the SDOUT output is valid. When a read sequence is initiated and INVSYNC = high, SYNC is driven low and remains low while the SDOUT output is valid. In parallel mode, this output is used as Bit 11 of the parallel port data output bus. Serial Data Read Error. In serial slave mode (SER/PAR = high, EXT/INT = high), this output is used as an incomplete data read error flag. If a data read is started and not completed when the current conversion is complete, the current data is lost and RDERROR is pulsed high. In parallel mode, this output is used as Bit 12 of the parallel port data output bus. Serial Configuration Hardware/Software Select. In serial mode, this input is used to configure the AD7610 by hardware or software. See the Hardware Configuration section and Software Configuration section. When HW/SW = low, the AD7610 is configured through software using the serial configuration register. When HW/SW = high, the AD7610 is configured through dedicated hardware input pins. In parallel mode, this output is used as Bit 13 of the parallel port data output bus. Serial Configuration Data Input. In serial software configuration mode (SER/PAR = high, HW/SW = low) this input is used to serially write in, MSB first, the configuration data into the serial configuration register. The data on this input is latched with SCCLK. See the Software Configuration section. Rev. 0 | Page 9 of 32 AD7610 Pin No. 27 Mnemonic D14 or SCCLK Type 1 DI/O 28 D15 or SCCS DI/O 29 BUSY DO 30 TEN DI2 31 32 RD CS DI DI 33 RESET DI 34 PD DI2 35 CNVST DI 36 37 BIPOLAR REF DI2 AI/O 38 39 40 41 43 45 REFGND IN− VCC VEE IN+ TEMP AI AI P P AI AO 46 REFBUFIN AI 47 PDREF DI 48 PDBUF DI Description In parallel mode, this output is used as Bit 14 of the parallel port data output bus. Serial Configuration Clock. In serial software configuration mode (SER/PAR = high, HW/SW = low) this input is used to clock in the data on SCIN. The active edge where the data SCIN is updated depends on the logic state of the INVSCLK pin. See the Software Configuration section. In parallel mode, this output is used as Bit 15 of the parallel port data output bus. Serial Configuration Chip Select. In serial software configuration mode (SER/PAR = high, HW/SW = low) this input enables the serial configuration port. See the Software Configuration section. Busy Output. Transitions high when a conversion is started, and remains high until the conversion is complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be used as a data ready clock signal. Note that in master read after convert mode (SER/PAR = high, EXT/INT = low, RDC = low) the busy time changes according to Table 4. Input Range Select. Used in conjunction with BIPOLAR per the following: Input Range BIPOLAR TEN 0 V to 5 V Low Low 0 V to 10 V Low High ±5 V High Low ±10 V High High Read Data. When CS and RD are both low, the interface parallel or serial output bus is enabled. Chip Select. When CS and RD are both low, the interface parallel or serial output bus is enabled. CS is also used to gate the external clock in slave serial mode (not used for serial programmable port). Reset Input. When high, reset the AD7610. Current conversion, if any, is aborted. The falling edge of RESET resets the data outputs to all zero’s (with OB/2C = high) and clears the configuration register. See the Digital Interface section. If not used, this pin can be tied to OGND. Power-Down Input. When PD = high, power down the ADC. Power consumption is reduced and conversions are inhibited after the current one is completed. The digital interface remains active during power down. Conversion Start. A falling edge on CNVST puts the internal sample-and-hold into the hold state and initiates a conversion. Input Range Select. See description for Pin 30. Reference Input/Output. When PDREF/PDBUF = low, the internal reference and buffer are enabled, producing 5 V on this pin. When PDREF/PDBUF = high, the internal reference and buffer are disabled, allowing an externally supplied voltage reference up to AVDD volts. Decoupling with at least a 22 μF is required with or without the internal reference and buffer. See the Reference Decoupling section. Reference Input Analog Ground. Connected to analog ground plane. Analog Input Ground Sense. Should be connected to the analog ground plane or to a remote sense ground. High Voltage Positive Supply. Normally +7 V to +15 V. High Voltage Negative Supply. Normally 0 V to −15 V (0 V in unipolar ranges). Analog Input. Referenced to IN−. Temperature Sensor Analog Output. Enabled when the internal reference is turned on (PDREF = PDBUF = low). See the Temperature Sensor section. Reference Buffer Input. When using an external reference with the internal reference buffer (PDBUF = low, PDREF = high), applying 2.5 V on this pin produces 5 V on the REF pin. See the Voltage Reference Input section. Internal Reference Power-Down Input. When low, the internal reference is enabled. When high, the internal reference is powered down, and an external reference must be used. Internal Reference Buffer Power-Down Input. When low, the buffer is enabled (must be low when using internal reference). When high, the buffer is powered-down. 1 AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DI/O = bidirectional digital; DO = digital output; P = power. In serial configuration mode (SER/PAR = high, HW/SW = low), this input is programmed with the serial configuration register and this pin is a don’t care. See the Hardware Configuration section and Software Configuration section. 2 Rev. 0 | Page 10 of 32 AD7610 TYPICAL PERFORMANCE CHARACTERISTICS 1.5 1.0 1.0 0.5 0.5 DNL (LSB) 1.5 0 –0.5 –0.5 –1.0 –1.0 –1.5 0 16384 32768 65536 49152 CODE –1.5 0 16384 32768 Figure 5. Integral Nonlinearity vs. Code 65536 Figure 8. Differential Nonlinearity vs. Code 250 180 NEGATIVE INL NEGATIVE DNL 160 POSITIVE INL 200 POSITIVE DNL 140 NUMBER OF UNITS NUMBER OF UNITS 49152 CODE 06395-008 0 06395-005 INL (LSB) AVDD = DVDD = 5 V; OVDD = 5 V; VCC = 15 V; VEE = −15 V; VREF = 5 V; TA = 25°C. 150 100 120 100 80 60 40 50 –0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 1.0 0.8 INL DISTRIBUTION (LSB) 0 –1.0 06395-006 0 –1.0 –0.8 –0.6 –0.4 –0.2 0 0.2 0.4 0.6 1.0 0.8 DNL DISTRIBUTION (LSB) Figure 6. Integral Nonlinearity Distribution (296 Devices) 06395-009 20 Figure 9. Differential Nonlinearity Distribution (296 Devices) 250000 140000 σ = 0.44 127179 211404 132700 σ = 0.51 120000 200000 COUNTS 150000 100000 80000 60000 40000 0 27510 0 0 4 7FFF 8000 8001 8002 20000 22202 8003 8004 0 0 8005 8006 CODE IN HEX Figure 7. Histogram of 261,120 Conversions of a DC Input at the Code Center 0 0 0 1072 8000 8001 8002 8003 8004 169 0 0 8005 8006 8007 CODE IN HEX Figure 10. Histogram of 261,120 Conversions of a DC Input at the Code Transition Rev. 0 | Page 11 of 32 06395-010 50000 06395-007 COUNTS 100000 AD7610 SNR, SINAD REFERRED TO FULL SCALE (dB) –20 AMPLITUDE (dB OF FULL SCALE) 95.0 fS = 250kSPS fIN = 19.95kHz SNR = 93.4dB THD = –107dB SFDR = 114dB SINAD = 93dB –40 –60 –80 –100 –120 –140 0 25 50 75 100 125 FREQUENCY (kHz) ±5V 94.5 94.0 0V TO 10V 0V TO 5V 93.5 93.0 –60 06395-011 –160 SNR SINAD ±10V –50 –40 –30 –20 –10 0 INPUT LEVEL (dB) 06395-014 0 Figure 14. SNR and SINAD vs. Input Level (Referred to Full Scale) Figure 11. FFT 20 kHz 96 16.0 –70 120 –80 110 SNR 90 15.4 ENOB 88 15.2 86 15.0 84 14.8 82 14.6 1 14.4 100 10 SFDR 100 –90 THD –100 FREQUENCY (kHz) –110 –130 70 1 60 100 10 FREQUENCY (kHz) Figure 15. THD, Harmonics, and SFDR vs. Frequency 96 96 VIN = 0V TO 5V VIN = 0V TO 10V VIN = ±5V VIN = ±10V 95 VIN = 0V TO 5V VIN = 0V TO 10V VIN = ±5V VIN = ±10V 95 94 93 93 92 91 91 –35 –15 5 25 45 65 TEMPERATURE (°C) 85 105 125 06395-013 92 90 –55 –35 –15 5 25 45 65 TEMPERATURE (°C) Figure 16. SINAD vs. Temperature Figure 13. SNR vs. Temperature Rev. 0 | Page 12 of 32 85 105 125 06395-016 SINAD (dB) 94 SNR (dB) 80 SECOND HARMONIC Figure 12. SNR, SINAD, and ENOB vs. Frequency 90 –55 90 THIRD HARMONIC –120 06395-012 80 THD, HARMONICS (dB) 15.6 ENOB (Bits) SNR, SINAD (dB) 92 SFDR (dB) 15.8 SINAD 06395-015 94 AD7610 –96 126 VIN = 0V TO 5V VIN = 0V TO 10V VIN = ±5V VIN = ±10V –100 VIN = 0V TO 5V VIN = 0V TO 10V VIN = ±5V VIN = ±10V 124 122 –104 SFDR (dB) THD (dB) 120 –108 –112 118 116 114 –116 112 –120 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 108 –55 06395-017 –124 –55 5 25 45 65 85 105 125 Figure 20. SFDR vs. Temperature (Excludes Harmonics) 5.012 5 ZERO ERROR POSITIVE FS ERROR NEGATIVE FS ERROR 4 3 5.010 5.008 2 5.006 VREF (V) 1 0 –1 5.004 5.002 –2 5.000 –3 –5 –55 –35 –15 5 25 45 65 85 105 125 TEMPERATURE (°C) 4.996 –55 Figure 18. Zero Error, Positive and Negative Full Scale vs. Temperature –15 5 25 45 65 85 105 125 TEMPERATURE (°C) Figure 21. Typical Reference Voltage Output vs. Temperature (3 Devices) 100000 60 10000 OPERATING CURRENTS (µA) 50 40 30 20 10 DVDD 1000 100 10 AVDD VCC +15V VEE –15V ALL MODES 1 0.1 OVDD 0.01 1 2 3 4 5 6 REFERENCE DRIFT (ppm/°C) 7 8 Figure 19. Reference Voltage Temperature Coefficient Distribution (247 Devices) Rev. 0 | Page 13 of 32 0.001 10 PDREF = PDBUF = HIGH 100 1000 10000 100000 SAMPLING RATE (SPS) Figure 22. Operating Currents vs. Sample Rate 1000000 06395-022 0 06395-019 0 –35 06395-021 4.998 –4 06395-018 ZERO ERROR, FULL SCALE ERROR (LSB) –15 TEMPERATURE (°C) Figure 17. THD vs. Temperature NUMBER OF UNITS –35 06395-020 110 AD7610 50 PD = PDBUF = PDREF = HIGH VEE = –15V VCC = +15V 600 DVDD OVDD AVDD 500 OVDD = 2.7V @ 85°C 45 OVDD = 2.7V @ 25°C 40 t12 DELAY (ns) 35 400 300 30 25 OVDD = 5V @ 85°C 20 OVDD = 5V @ 25°C 15 200 10 100 0 –35 –15 5 25 45 65 85 105 TEMPERATURE (°C) Figure 23. Power-Down Operating Currents vs. Temperature 0 50 100 150 CL (pF) Figure 24. Typical Delay vs. Load Capacitance CL Rev. 0 | Page 14 of 32 200 06395-024 0 –55 5 06395-023 POWER-DOWN OPERATING CURRENTS (nA) 700 AD7610 TERMINOLOGY Least Significant Bit (LSB) The least significant bit, or LSB, is the smallest increment that can be represented by a converter. For an analog-to-digital converter with N bits of resolution, the LSB expressed in volts is LSB(V ) = VINp-p (max ) 2N Integral Nonlinearity Error (INL) Linearity error refers to the deviation of each individual code from a line drawn from negative full-scale through positive fullscale. The point used as negative full-scale occurs a ½ LSB before the first code transition. Positive full-scale is defined as a level 1½ LSBs beyond the last code transition. The deviation is measured from the middle of each code to the true straight line. Differential Nonlinearity Error (DNL) In an ideal ADC, code transitions are 1 LSB apart. Differential nonlinearity is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed. Bipolar Zero Error The difference between the ideal midscale input voltage (0 V) and the actual voltage producing the midscale output code. Unipolar Offset Error The first transition should occur at a level ½ LSB above analog ground. The unipolar offset error is the deviation of the actual transition from that point. Full-Scale Error The last transition (from 111…10 to 111…11) should occur for an analog voltage 1½ LSB below the nominal full-scale. The fullscale error is the deviation in LSB (or % of full-scale range) of the actual level of the last transition from the ideal level and includes the effect of the offset error. Closely related is the gain error (also in LSB or % of full-scale range), which does not include the effects of the offset error. Dynamic Range Dynamic range is the ratio of the rms value of the full-scale to the rms noise measured for an input typically at −60 dB. The value for dynamic range is expressed in decibels. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal and is expressed in decibels. Signal-to-(Noise + Distortion) Ratio (SINAD) SINAD is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels. Spurious-Free Dynamic Range (SFDR) The difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal. Effective Number of Bits (ENOB) ENOB is a measurement of the resolution with a sine wave input. It is related to SINAD and is expressed in bits by ENOB = [(SINADdB − 1.76)/6.02] Aperture Delay Aperture delay is a measure of the acquisition performance measured from the falling edge of the CNVST input to when the input signal is held for a conversion. Transient Response The time required for the AD7610 to achieve its rated accuracy after a full-scale step function is applied to its input. Reference Voltage Temperature Coefficient Reference voltage temperature coefficient is derived from the typical shift of output voltage at 25°C on a sample of parts at the maximum and minimum reference output voltage (VREF) measured at TMIN, T(25°C), and TMAX. It is expressed in ppm/°C as TCVREF ( ppm/°C ) = VREF ( Max ) – VREF ( Min ) VREF ( 25°C ) × ( TMAX – TMIN ) × 10 6 where: VREF (Max) = maximum VREF at TMIN, T(25°C), or TMAX. VREF (Min) = minimum VREF at TMIN, T(25°C), or TMAX. VREF (25°C) = VREF at 25°C. TMAX = +85°C. TMIN = –40°C. Signal-to-Noise Ratio (SNR) SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels. Rev. 0 | Page 15 of 32 AD7610 THEORY OF OPERATION IN+ REF REFGND MSB 32,768C 16,384C LSB 4C 2C C SWA SWITCHES CONTROL C BUSY COMP OUTPUT CODE 65,536C SWB CNVST 06395-025 IN– CONTROL LOGIC Figure 25. ADC Simplified Schematic OVERVIEW CONVERTER OPERATION The AD7610 is a very fast, low power, precise, 16-bit analog-todigital converter (ADC) using successive approximation capacitive digital-to-analog converter (CDAC) architecture. The AD7610 is a successive approximation ADC based on a charge redistribution DAC. Figure 25 shows the simplified schematic of the ADC. The CDAC consists of two identical arrays of 16 binary weighted capacitors, which are connected to the two comparator inputs. The AD7610 can be configured at any time for one of four input ranges with inputs in parallel and serial hardware modes or by a dedicated write only, SPI-compatible interface via a configuretion register in serial software mode. The AD7610 uses Analog Device’s patented iCMOS high voltage process to accommodate 0 to 5 V, 0 to 10 V, ±5 V, and ±10 V input ranges without the use of conventional thin films. Only one acquisition cycle, t8, is required for the inputs to latch to the correct configuration. Resetting or power cycling is not required for reconfiguring the ADC. The AD7610 is capable of converting 250,000 samples per second (250 kSPS) and power consumption scales linearly with throughput making it useful for battery powered systems. The AD7610 provides the user with an on-chip track-and-hold, successive approximation ADC that does not exhibit any pipeline or latency, making it ideal for multiple multiplexed channel applications. For unipolar input ranges, the AD7610 typically requires three supplies; VCC, AVDD (which can supply DVDD), and OVDD which can be interfaced to either 5 V, 3.3 V, or 2.5 V digital logic. For bipolar input ranges, the AD7610 requires the use of the additional VEE supply. During the acquisition phase, terminals of the array tied to the comparator’s input are connected to AGND via SW+ and SW−. All independent switches are connected to the analog inputs. Thus, the capacitor arrays are used as sampling capacitors and acquire the analog signal on IN+ and IN− inputs. A conversion phase is initiated once the acquisition phase is complete and the CNVST input goes low. When the conversion phase begins, SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the REFGND input. Therefore, the differential voltage between the inputs (IN+ and IN−) captured at the end of the acquisition phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between REFGND and REF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4 through VREF/65536). The control logic toggles these switches, starting with the MSB first, in order to bring the comparator back into a balanced condition. After the completion of this process, the control logic generates the ADC output code and brings the BUSY output low. The device is housed in Pb-free, 48-lead LQFP or tiny LFCSP 7 mm × 7 mm packages that combine space savings with flexibility. In addition, the AD7610 can be configured as either a parallel or serial SPI-compatible interface. Rev. 0 | Page 16 of 32 AD7610 Using the OB/2C digital input or via the configuration register, the AD7610 offers two output codings: straight binary and twos complement. See Figure 26 and Table 7 for the ideal transfer characteristic and digital output codes for the different analog input ranges, VIN. Note that when using the configuration register, the OB/2C input is a don’t care and should be tied to either high or low. ADC CODE (Straight Binary) TRANSFER FUNCTIONS 111...111 111...110 111...101 000...010 000...001 000...000 –FSR + 1 LSB +FSR – 1 LSB +FSR – 1.5 LSB ANALOG INPUT Figure 26. ADC Ideal Transfer Function Table 7. Output Codes and Ideal Input Voltages Description FSR −1 LSB FSR − 2 LSB Midscale + 1 LSB Midscale Midscale − 1 LSB −FSR + 1 LSB −FSR 1 2 VIN = 5 V 4.999924 V 4.999847 V 2.500076 V 2.5 V 2.499924 V 76.3 μV 0V VREF = 5 V VIN = 10 V VIN = ±5 V 9.999847 V +4.999847 V 9.999695 V +4.999695 V 5.000153 V +152.6 μV 5.000000 V 0V 4.999847 V −152.6 μV 152.6 μV −4.999847 V 0V −5 V VIN = ±10 V +9.999695 V +9.999390 V +305.2 μV 0V −305.2 μV −9.999695 V −10 V This is also the code for overrange analog input (VIN+ − VIN− above VREF − VREFGND). This is also the code for overrange analog input (VIN+ − VIN− below VREF − VREFGND). Rev. 0 | Page 17 of 32 Digital Output Code Straight Binary Twos Complement 0xFFFF 1 0x7FFF1 0xFFFE 0x7FFE 0x8001 0x0001 0x8000 0x0000 0x7FFF 0xFFFF 0x0001 0x8001 0x0000 2 0x80002 06395-026 –FSR –FSR + 0.5 LSB AD7610 TYPICAL CONNECTION DIAGRAM Figure 27 shows a typical connection diagram for the AD7610 using the internal reference, serial data and serial configuration interfaces. Different circuitry from that shown in Figure 27 is optional and is discussed in the following sections. DIGITAL SUPPLY (+5V) NOTE 5 DIGITAL INTERFACE SUPPLY (+2.5V, +3.3V, OR +5V) 10Ω ANALOG SUPPLY (+5V) 100nF 10µF 10µF AVDD +7V TO +15.75V SUPPLY 10µF 100nF 10µF 100nF AGND 100nF DGND 10µF 100nF DVDD OVDD VCC OGND MICROCONVERTER/ MICROPROCESSOR/ DSP BUSY SDCLK –7V TO –15.75V SUPPLY SERIAL PORT 1 SDOUT SCCLK VEE SERIAL PORT 2 SCIN NOTE 6 REF CREF 22µF NOTE 4 100nF NOTE 3 SCCS REFBUFIN REFGND CNVST AD7610 50Ω NOTE 7 D OB/2C NOTE 2 15Ω IN+ OVDD HW/SW BIPOLAR CC ANALOG INPUT– 2.7nF TEN IN– NOTE 1 CLOCK NOTE 3 PDREF PDBUF PD RD CS RESET NOTES 1. SEE ANALOG INPUT SECTION. ANALOG INPUT(–) IS REFERENCED TO AGND ±0.1V. 2. THE AD8021 IS RECOMMENDED. SEE DRIVER AMPLIFIER CHOICE SECTION. 3. THE CONFIGURATION SHOWN IS USING THE INTERNAL REFERENCE. SEE VOLTAGE REFERENCE INPUT SECTION. 4. A 22µF CERAMIC CAPACITOR (X5R, 1206 SIZE) IS RECOMMENDED (FOR EXAMPLE, PANASONIC ECJ4YB1A226M). SEE VOLTAGE REFERENCE INPUT SECTION. 5. OPTION, SEE POWER SUPPLY SECTION. 6. THE VCC AND VEE SUPPLIES SHOULD BE VCC = [VIN(MAX) +2V] and VEE = [VIN(MIN) –2V] FOR BIPOLAR INPUT RANGES. FOR UNIPOLAR INPUT RANGES, VEE CAN BE 0V. SEE POWER SUPPLY SECTION. 7. OPTIONAL LOW JITTER CNVST, SEE CONVERSION CONTROL SECTION. Figure 27. Typical Connection Diagram Shown with Serial Interface and Serial Programmable Port Rev. 0 | Page 18 of 32 06395-027 ANALOG INPUT + U1 SER/PAR AD7610 Input Range Selection In parallel mode and serial hardware mode, the input range is selected by using the BIPOLAR (bipolar) and TEN (10 Volt range) inputs. See Table 6 for pin details and the Hardware Configuration section and Software Configuration section for programming the mode selection with either pins or configuration register. Note that when using the configuration register, the BIPOLAR and TEN inputs are don’t cares and should be tied to either high or low. For instance, by using IN− to sense a remote signal ground, ground potential differences between the sensor and the local ADC ground are eliminated. 100 90 80 70 CMRR (dB) ANALOG INPUTS Input Structure 60 50 40 30 Figure 28 shows an equivalent circuit for the input structure of the AD7610. 20 D1 D3 D2 D4 IN+ OR IN– CPIN 0 AVDD 1 10 100 1000 FREQUENCY (kHz) RIN VEE AGND 10000 Figure 29. Analog Input CMRR vs. Frequency CIN 06395-028 VCC 06395-029 10 0 TO 5V RANGE ONLY Figure 28. AD7610 Simplified Analog Input The four diodes, D1 to D4, provide ESD protection for the analog inputs, IN+ and IN−. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V, because this causes the diodes to become forward-biased and to start conducting current. These diodes can handle a forwardbiased current of 120 mA maximum. For instance, these conditions could eventually occur when the input buffer’s U1 supplies are different from AVDD, VCC, and VEE. In such a case, an input buffer with a short-circuit current limitation can be used to protect the part although most op amps’ short circuit current is <100 mA. Note that D3 and D4 are only used in the 0 V to 5 V range to allow for additional protection in applications that are switching from the higher voltage ranges. This analog input structure allows the sampling of the differential signal between IN+ and IN−. By using this differential input, small signals common to both inputs are rejected as shown in Figure 29, which represents the typical CMRR over frequency. During the acquisition phase for ac signals, the impedance of the analog inputs, IN+ and IN−, can be modeled as a parallel combination of Capacitor CPIN and the network formed by the series connection of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically 5 kΩ and is a lumped component comprised of serial resistors and the on resistance of the switches. CIN is primarily the ADC sampling capacitor and depending on the input range selected is typically 48 pF in the 0 V to 5 V range, typically 24 pF in the 0 V to 10 V and ±5 V ranges and typically 12 pF in the ±10 V range. During the conversion phase, when the switches are opened, the input impedance is limited to CPIN. Since the input impedance of the AD7610 is very high, it can be directly driven by a low impedance source without gain error. To further improve the noise filtering achieved by the AD7610 analog input circuit, an external, one-pole RC filter between the amplifier’s outputs and the ADC analog inputs can be used, as shown in Figure 27. However, large source impedances signifiantly affect the ac performance, especially total harmonic distortion (THD). The maximum source impedance depends on the amount of THD that can be tolerated. The THD degrades as a function of the source impedance and the maximum input frequency. Rev. 0 | Page 19 of 32 AD7610 DRIVER AMPLIFIER CHOICE Although the AD7610 is easy to drive, the driver amplifier must meet the following requirements: • • For multichannel, multiplexed applications, the driver amplifier and the AD7610 analog input circuit must be able to settle for a full-scale step of the capacitor array at a 16-bit level (0.0015%). For the amplifier, settling at 0.1% to 0.01% is more commonly specified. This differs significantly from the settling time at a 16-bit level and should be verified prior to driver selection. The AD8021 op amp combines ultralow noise and high gain bandwidth and meets this settling time requirement even when used with gains of up to 13. The noise generated by the driver amplifier needs to be kept as low as possible to preserve the SNR and transition noise performance of the AD7610. The noise coming from the driver is filtered by the external 1-pole low-pass filter as shown in Figure 27. The SNR degradation due to the amplifier is SNRLOSS ⎛ ⎞ ⎜ ⎟ VNADC ⎜ ⎟ = 20 log ⎜ ⎟ π ⎜⎜ VNADC 2 + f −3dB (NeN )2 ⎟⎟ 2 ⎝ ⎠ The AD8022 can also be used when a dual version is needed and a gain of 1 is present. The AD829 is an alternative in applications where high frequency (above 100 kHz) performance is not required. In applications with a gain of 1, an 82 pF compensation capacitor is required. The AD8610 is an option when low bias current is needed in low frequency applications. Since the AD7610 uses a large geometry, high voltage input switch, the best linearity performance is obtained when using the amplifier at its maximum full power bandwidth. Gaining the amplifier to make use of the more dynamic range of the ADC results in increased linearity errors. For applications requiring more resolution, the use of an additional amplifier with gain should precede a unity follower driving the AD7610. See Table 8 for a list of recommended op amps. Table 8. Recommended Driver Amplifiers Amplifier ADA4841-x where: VNADC is the noise of the ADC, which is: AD829 AD8021 AD8022 VINp-p 2 VNADC = 2 SNR 10 20 AD8610/AD8620 f–3dB is the cutoff frequency of the input filter (3.9 MHz). N is the noise factor of the amplifier (+1 in buffer configuration). eN is the equivalent input voltage noise density of the op amp, in nV/√Hz. • The AD8021 meets these requirements and is appropriate for almost all applications. The AD8021 needs a 10 pF external compensation capacitor that should have good linearity as an NPO ceramic or mica type. Moreover, the use of a noninverting +1 gain arrangement is recommended and helps to obtain the best signal-to-noise ratio. The driver needs to have a THD performance suitable to that of the AD7610. Figure 15 shows the THD vs. frequency that the driver should exceed. Typical Application 12 V supply, very low noise, low distortion, low power, low frequency ±15 V supplies, very low noise, low frequency ±12 V supplies, very low noise, high frequency ±12 V supplies, very low noise, high frequency, dual ±13 V supplies, low bias current, low frequency, single/dual VOLTAGE REFERENCE INPUT/OUTPUT The AD7610 allows the choice of either a very low temperature drift internal voltage reference, an external reference or an external buffered reference. The internal reference of the AD7610 provides excellent performance and can be used in almost all applications. However, the linearity performance is guaranteed only with an external reference. Rev. 0 | Page 20 of 32 AD7610 Temperature Sensor Internal Reference (REF = 5 V) (PDREF = Low, PDBUF = Low) To use the internal reference, the PDREF and PDBUF inputs must be low. This enables the on-chip band gap reference, buffer, and TEMP sensor resulting in a 5.00 V reference on the REF pin. The internal reference is temperature-compensated to 5.000 V ±35 mV. The reference is trimmed to provide a typical drift of 3 ppm/°C. This typical drift characteristic is shown in Figure 19. When the internal reference is enabled (PDREF = PDBUF = low), the on-chip temperature sensor output (TEMP) is enabled and can be use to measure the temperature of the AD7610. To improve the calibration accuracy over the temperature range, the output of the TEMP pin is applied to one of the inputs of the analog switch (such as ADG779), and the ADC itself is used to measure its own temperature. This configuration is shown in Figure 30. External 2.5 V Reference and Internal Buffer (REF = 5 V) (PDREF = High, PDBUF = Low) TEMP ADG779 To use an external reference with the internal buffer, PDREF should be high and PDBUF should be low. This powers down the internal reference and allows the 2.5 V reference to be applied to REFBUFIN producing 5 V on the REF pin. The internal reference buffer is useful in multiconverter applications since a buffer is typically required in these applications. POWER SUPPLIES External 5 V Reference (PDREF = High, PDBUF = High) The AD7610 uses five sets of power supply pins: To use an external reference directly on the REF pin, PDREF and PDBUF should both be high. PDREF and PDBUF power down the internal reference and the internal reference buffer, respectively. For improved drift performance, an external reference such as the ADR445 or ADR435 is recommended. • AVDD: analog 5 V core supply • VCC: analog high voltage positive supply • VEE: high voltage negative supply • DVDD: digital 5 V core supply Reference Decoupling • OVDD: digital input/output interface supply Whether using an internal or external reference, the AD7610 voltage reference input (REF) has a dynamic input impedance; therefore, it should be driven by a low impedance source with efficient decoupling between the REF and REFGND inputs. This decoupling depends on the choice of the voltage reference, but usually consists of a low ESR capacitor connected to REF and REFGND with minimum parasitic inductance. A 22 μF (X5R, 1206 size) ceramic chip capacitor (or 47 μF tantalum capacitor) is appropriate when using either the internal reference or the ADR445/ADR435 external reference. Core Supplies The placement of the reference decoupling is also important to the performance of the AD7610. The decoupling capacitor should be mounted on the same side as the ADC right at the REF pin with a thick PCB trace. The REFGND should also connect to the reference decoupling capacitor with the shortest distance and to the analog ground plane with several vias. The high voltage bipolar supplies, VCC and VEE are required and must be at least 2 V larger than the maximum input, VIN. For example, if using the bipolar 10 V range, the supplies should be ±12 V minimum. Sufficient decoupling of these supplies is also required consisting of at least a 10 μF capacitor and 100 nF on each supply. For unipolar operation, the VEE supply can be grounded with some slight THD performance degradation. For applications that use multiple AD7610 or other PulSAR devices, it is more effective to use the internal reference buffer to buffer the external 2.5 V reference voltage. The voltage reference temperature coefficient (TC) directly impacts full scale; therefore, in applications where full-scale accuracy matters, care must be taken with the TC. For instance, a ±15 ppm/°C TC of the reference changes full-scale by ±1 LSB/°C. CC AD7610 06395-030 TEMPERATURE SENSOR IN+ ANALOG INPUT Figure 30. Use of the Temperature Sensor The AVDD and DVDD supply the AD7610 analog and digital cores respectively. Sufficient decoupling of these supplies is required consisting of at least a 10 μF capacitor and 100 nF on each supply. The 100 nF capacitors should be placed as close as possible to the AD7610. To reduce the number of supplies needed, the DVDD can be supplied through a simple RC filter from the analog supply, as shown in Figure 27. High Voltage Supplies Digital Output Supply The OVDD supplies the digital outputs and allows direct interface with any logic working between 2.3 V and 5.25 V. OVDD should be set to the same level as the system interface. Sufficient decoupling is required consisting of at least a 10 μF capacitor and 100 nF with the 100 nF placed as close as possible to the AD7610. Rev. 0 | Page 21 of 32 AD7610 Power Sequencing Power Down The AD7610 is independent of power supply sequencing and is very insensitive to power supply variations on AVDD over a wide frequency range as shown in Figure 31. Setting PD = high powers down the AD7610, thus reducing supply currents to their minimums as shown in Figure 23. When the ADC is in power down, the current conversion (if any) is completed and the digital bus remains active. To further reduce the digital supply currents, drive the inputs to OVDD or OGND. 80 EXT REF 75 Power down can also be programmed with the configuration register. See the Software Configuration section for details. Note that when using the configuration register, the PD input is a don’t care and should be tied to either high or low. INT REF 70 60 55 CONVERSION CONTROL 50 45 40 30 1 10 100 1000 10000 FREQUENCY (kHz) 06395-031 35 The AD7610 is controlled by the CNVST input. A falling edge on CNVST is all that is necessary to initiate a conversion. Detailed timing diagrams of the conversion process are shown in Figure 33. Once initiated, it cannot be restarted or aborted, even by the power-down input, PD, until the conversion is complete. The CNVST signal operates independently of CS and RD signals. Figure 31. AVDD PSRR vs. Frequency t2 t1 Power Dissipation vs. Throughput The AD7610 automatically reduces its power consumption at the end of each conversion phase. During the acquisition phase, the operating currents are very low, which allows a significant power savings when the conversion rate is reduced (see Figure 32). This feature makes the AD7610 ideal for very low power, batteryoperated applications. It should be noted that the digital interface remains active even during the acquisition phase. To reduce the operating digital supply currents even further, drive the digital inputs close to the power rails (that is, OVDD and OGND). t4 t3 t6 t5 MODE ACQUIRE CONVERT t7 ACQUIRE CONVERT t8 Figure 33. Basic Conversion Timing Although CNVST is a digital signal, it should be designed with special care with fast, clean edges, and levels with minimum overshoot, undershoot, or ringing. The CNVST trace should be shielded with ground and a low value (such as 50 Ω) serial resistor termination should be added close to the output of the component that drives this line. 100 For applications where SNR is critical, the CNVST signal should have very low jitter. This can be achieved by using a dedicated oscillator for CNVST generation, or by clocking CNVST with a high frequency, low jitter clock, as shown in Figure 27. 10 1 BUSY PDREF = PDBUF = HIGH 1 10 100 1000 10000 100000 SAMPLING RATE (kSPS) 1000000 06395-032 POWER DISSIPATION (mW) 1000 CNVST 06395-033 PSRR (dB) 65 Figure 32. Power Dissipation vs. Sample Rate Rev. 0 | Page 22 of 32 AD7610 INTERFACES CS = RD = 0 The AD7610 has a versatile digital interface that can be set up as either a serial or a parallel interface with the host system. The serial interface is multiplexed on the parallel data bus. The AD7610 digital interface also accommodates 2.5 V, 3.3 V, or 5 V logic. In most applications, the OVDD supply pin is connected to the host system interface 2.5 V to 5.25 V digital supply. Finally, by using the OB/2C input pin, both twos complement or straight binary coding can be used. Two signals, CS and RD, control the interface. When at least one of these signals is high, the interface outputs are in high impedance. Usually, CS allows the selection of each AD7610 in multicircuit applications and is held low in a single AD7610 design. RD is generally used to enable the conversion result on the data bus. t1 CNVST t10 BUSY t4 t3 DATA BUS t11 PREVIOUS CONVERSION DATA 06395-035 DIGITAL INTERFACE NEW DATA Figure 35. Master Parallel Data Timing for Reading (Continuous Read) Slave Parallel Interface In slave parallel reading mode, the data can be read either after each conversion, which is during the next acquisition phase, or during the following conversion, as shown in Figure 36 and Figure 37, respectively. When the data is read during the conversion, it is recommended that it is read only during the first half of the conversion phase. This avoids any potential feedthrough between voltage transients on the digital interface and the most critical analog conversion circuitry. RESET The RESET input is used to reset the AD7610. A rising edge on RESET aborts the current conversion (if any) and tristates the data bus. The falling edge of RESET resets the AD7610 and clears the data bus and configuration register. See Figure 34 for the RESET timing details. CS t9 RD RESET BUSY BUSY DATA BUS DATA BUS CNVST CURRENT CONVERSION t12 06395-036 06395-034 t8 t13 Figure 36. Slave Parallel Data Timing for Reading (Read After Convert) Figure 34. RESET Timing PARALLEL INTERFACE CS = 0 The AD7610 is configured to use the parallel interface when SER/PAR is held low. t1 CNVST, RD Master Parallel Interface BUSY t4 t3 DATA BUS PREVIOUS CONVERSION t12 t13 Figure 37. Slave Parallel Data Timing for Reading (Read During Convert) Rev. 0 | Page 23 of 32 06395-037 Data can be continuously read by tying CS and RD low, thus requiring minimal microprocessor connections. However, in this mode, the data bus is always driven and cannot be used in shared bus applications (unless the device is held in RESET). Figure 35 details the timing for this mode. AD7610 8-Bit Interface (Master or Slave) MASTER SERIAL INTERFACE The BYTESWAP pin allows a glueless interface to an 8-bit bus. As shown in Figure 38, when BYTESWAP is low, the LSB byte is output on D[7:0] and the MSB is output on D[15:8]. When BYTESWAP is high, the LSB and MSB bytes are swapped; the LSB is output on D[15:8] and the MSB is output on D[7:0]. By connecting BYTESWAP to an address line, the 16-bit data can be read in two bytes on either D[15:8] or D[7:0]. This interface can be used in both master and slave parallel reading modes. The pins multiplexed on D[10:2] and used for the master serial interface are: DIVSCLK[0], DIVSCLK[1], EXT/INT, INVSYNC, INVSCLK, RDC, SDOUT, SDCLK and SYNC. Internal Clock (SER/PAR = High, EXT/INT = Low) The AD7610 is configured to generate and provide the serial data clock, SDCLK, when the EXT/INT pin is held low. The AD7610 also generates a SYNC signal to indicate to the host when the serial data is valid. The SDCLK, and the SYNC signals can be inverted, if desired using the INVSCLK and INVSYNC inputs, respectively. Depending on the input, RDC, the data can be read during the following conversion or after each conversion. Figure 39 and Figure 40 show detailed timing diagrams of these two modes. CS RD BYTESWAP HIGH BYTE t12 PINS D[7:0] HI-Z LOW BYTE LOW BYTE t12 HI-Z t13 HIGH BYTE HI-Z 06395-038 PINS D[15:8] Read After Convert (RDC = Low, DIVSCLK[1:0] = [0 to 3]) HI-Z Figure 38. 8-Bit and 16-Bit Parallel Interface SERIAL INTERFACE The AD7610 has a serial interface (SPI-compatible) multiplexed on the data pins D[15:2]. The AD7610 is configured to use the serial interface when SER/PAR is held high. Data Interface The AD7610 outputs 16 bits of data, MSB first, on the SDOUT pin. This data is synchronized with the 16 clock pulses provided on the SDCLK pin. The output data is valid on both the rising and falling edge of the data clock. Serial Configuration Interface The AD7610 can be configured through the serial configuration register only in serial mode as the serial configuration pins are also multiplexed on the data pins D[15:12]. See the Hardware Configuration section and Software Configuration section for more information. Setting RDC = low, allows the read after conversion mode. Since the AD7610 is limited to 250kSPS and the time between conversions, t2 = 4μs, this mode is the most recommended serial mode. Unlike the other serial modes, the BUSY signal returns low after the 16 data bits are pulsed out and not at the end of the conversion phase, resulting in a longer BUSY width (See Table 4 for BUSY timing specifications). The DIVSCLK[1:0] inputs control the SDCLK period and SDOUT data rate. As a result, the maximum throughput can only be achieved in two of the DIVSCLK[1:0] settings. In this mode, the AD7610 generates a discontinuous SDCLK however, a fixed period and hosts supporting both SPI and serial ports can also be used. Read During Convert (RDC = High) Setting RDC = high, allows the master read (previous conversion result) during conversion mode. In this mode, the serial clock and data toggle at appropriate instances, minimizing potential feed through between digital activity and critical conversion decisions. In this mode, the SDCLK period changes since the LSBs require more time to settle and the SDCLK is derived from the SAR conver-sion cycle. In this mode, the AD7610 generates a discontinuous SDCLK of two different periods and the host should use an SPI interface. Rev. 0 | Page 24 of 32 AD7610 EXT/INT = 0 RDC/SDIN = 0 INVSCLK = INVSYNC = 0 CS, RD t3 CNVST t28 BUSY t30 t29 t25 SYNC t18 t19 t14 t20 t24 t21 1 2 D15 D14 SDCLK 3 14 15 D2 D1 t26 16 t15 t27 X t16 D0 06395-039 SDOUT t23 t22 Figure 39. Master Serial Data Timing for Reading (Read After Convert) EXT/INT = 0 RDC/SDIN = 1 INVSCLK = INVSYNC = 0 CS, RD t1 CNVST t3 BUSY t17 t25 SYNC t14 t19 t20 t21 SDCLK t15 1 t24 2 3 14 15 t18 t16 X t22 t27 D15 D14 D2 D1 D0 06395-040 SDOUT t26 16 t23 Figure 40. Master Serial Data Timing for Reading (Read Previous Conversion During Convert) Rev. 0 | Page 25 of 32 AD7610 The pins multiplexed on D[11:4] used for slave serial interface are: EXT/INT, INVSCLK, SDIN, SDOUT, SDCLK and RDERROR. External Clock (SER/PAR = High, EXT/INT = High) Setting the EXT/INT = high allows the AD7610 to accept an externally supplied serial data clock on the SDCLK pin. In this mode, several methods can be used to read the data. The external serial clock is gated by CS. When CS and RD are both low, the data can be read after each conversion or during the following conversion. A clock can be either normally high or normally low when inactive. For detailed timing diagrams, see Figure 42 and Figure 43. While the AD7610 is performing a bit decision, it is important that voltage transients be avoided on digital input/output pins, or degradation of the conversion result may occur. This is particularly important during the last 475 ns of the conversion phase because the AD7610 provides error correction circuitry that can correct for an improper bit decision made during the first part of the conversion phase. For this reason, it is recommended that any external clock provided, is a discontinuous clock that transitions only when BUSY is low, or, more importantly, that it does not transition during the last 475 ns of BUSY high. CNVST signal. Note that the SDIN input is latched on the opposite edge of SDCLK used to shift out the data on SDOUT (SDCLK falling edge when INVSCLK = low). Therefore, the MSB of the upstream converter follows the LSB of the down-stream converter on the next SDCLK cycle. In this mode, the 40 MHz SDCLK rate cannot be used since the SDIN to SDCLK setup time, t33, is less than the minimum time specified. (SDCLK to SDOUT delay, t32, is the same for all converters when simultaneously sampled). For proper operation, the SDCLK edge for latching SDIN (or ½ period of SDCLK) needs to be: t 1 / 2 SDCLK = t 32 + t 33 Or the max SDCLK frequency needs to be: 1 f SDCLK = 2(t 32 + t 33 ) If not using the daisy-chain feature, the SDIN input should be tied either high or low. BUSY OUT BUSY BUSY AD7610 AD7610 #2 (UPSTREAM) #1 (DOWNSTREAM) RDC/SDIN External Discontinuous Clock Data Read After Conversion Since the AD7610 is limited to 250 kSPS, the time between conversions, t4 = 4 μs, and the conversion time, t7 = 1.45 μs. This makes the read after conversion mode the most recommended serial slave mode since the time to read the data is t4 − t7. Figure 42 shows the detailed timing diagrams for this method. After a conversion is complete, indicated by BUSY returning low, the conversion result can be read while both CS and RD are low. Data is shifted out MSB first with 16 clock pulses and, depending on the SDCLK frequency, can be valid on the falling and rising edges of the clock. One advantage of this method is that conversion performance is not degraded because there are no voltage transients on the digital interface during the conversion process. Another advantage is the ability to read the data at any speed up to 40 MHz, which accommodates both the slow digital host interface and the fastest serial reading. Daisy-Chain Feature Also in the read after convert mode, the AD7610 provides a daisychain feature for cascading multiple converters together using the serial data input, SDIN, pin. This feature is useful for reducing component count and wiring connections when desired, for instance, in isolated multiconverter applications. See Figure 42 for the timing details. SDOUT RDC/SDIN SDOUT CNVST CNVST CS CS SCLK SCLK DATA OUT SCLK IN CS IN CNVST IN 06395-041 SLAVE SERIAL INTERFACE Figure 41. Two AD7610 Devices in a Daisy-Chain Configuration External Clock Data Read During Previous Conversion Figure 43 shows the detailed timing diagrams for this method. During a conversion, while both CS and RD are low, the result of the previous conversion can be read. The data is shifted out, MSB first, with 16 clock pulses, and is valid on both the rising and falling edge of the clock. The 16 bits have to be read before the current conversion is complete; otherwise, RDERROR is pulsed high and can be used to interrupt the host interface to prevent incomplete data reading. To reduce performance degradation due to digital activity, a fast discontinuous clock of at least 40 MHz is recommended to ensure that all the bits are read during the first half of the SAR conversion phase. The daisy-chain feature should not be used in this mode since digital activity occurs during the second half of the SAR conversion phase likely resulting in performance degradation. An example of the concatenation of two devices is shown in Figure 41. Simultaneous sampling is possible by using a common Rev. 0 | Page 26 of 32 AD7610 discontinuous SDCLK whenever possible to minimize potential incorrect bit decisions. For the different modes, the use of a slower SDCLK such as 20 MHz in warp mode, 15 MHz in normal mode and 13 MHz in impulse mode can be used. External Clock Data Read After/During Conversion It is also possible to begin to read data after conversion and continue to read the last bits after a new conversion has been initiated. This method allows the full throughput and the use of a slower SDCLK frequency. Again, it is recommended to use a SER/PAR = 1 EXT/INT = 1 RD = 0 INVSCLK = 0 CS BUSY t31 SDCLK t35 t31 X* 1 2 3 t32 t36 4 15 14 16 17 18 19 t37 SDOUT D15 D14 D13 D2 D1 D0 X15 X14 X15 X14 X13 X2 X1 X0 Y15 Y14 t16 t33 t34 06395-042 SDIN *A DISCONTINUOUS SDCLK IS RECOMMENDED. Figure 42. Slave Serial Data Timing for Reading (Read After Convert) SER/PAR = 1 EXT/INT = 1 RD = 0 INVSCLK = 0 CS CNVST BUSY SDCLK t35 t31 X* 1 2 3 15 t32 X* 16 X* X* X* X* t37 D15 SDOUT t36 D1 D14 D0 DATA = SDIN t27 t16 *A DISCONTINUOUS SDCLK IS RECOMMENDED. Figure 43. Slave Serial Data Timing for Reading (Read Previous Conversion During Convert) Rev. 0 | Page 27 of 32 06395-043 t31 AD7610 HARDWARE CONFIGURATION The AD7610 can be configured at any time with the dedicated hardware pins BIPOLAR, TEN, OB/2C, and PD for parallel mode (SER/PAR = low) or serial hardware mode (SER/ PAR = high, HW/SW = high). Programming the AD7610 for input range configuration can be done before or during conversion. Like the RESET input, the ADC requires at least one acquisition time to settle as indicated in Figure 44. See Table 6 for pin descriptions. Note that these inputs are high impedance when using the software configuration mode. SOFTWARE CONFIGURATION The pins multiplexed on D[15:12] used for software configuration are: HW/SW, SCIN, SCCLK, and SCCS. The AD7610 is programmed using the dedicated write-only serial configurable port (SCP) for conversion mode, input range selection, output coding, and power-down using the serial configuration register. See Table 9 for details of each bit in the configuration register. The SCP can only be used in serial software mode selected with SER/PAR = high and HW/SW = low since the port is multiplexed on the parallel interface. The SCP is accessed by asserting the port’s chip select, SCCS, and then writing SCIN synchronized with SCCLK, which (like SDCLK) is edge sensitive depending on the state of INVSCLK. See Figure 45 for timing details. SCIN is clocked into the configuration register MSB first. The configuration register is an internal shift register that begins with Bit 8, the start bit. The 9th SPPCLK edge updates the register and allows the new settings to be used. As indicated in the timing diagram, at least one acquisition time is required from the 9th SCCLK edge. Bits [4:3] and [1:0] are reserved bits and are not written to while the SCP is being updated. The SCP can be written to at any time, up to 40 MHz, and it is recommended to write to while the AD7610 is not busy converting, as detailed in Figure 45. In this mode, the full 750 kSPS is not HW/SW = 0 attainable because the time required for SCP access is (t31+ 9 × 1/ SCCLK +t8) minimum. If the full throughput is required, the SCP can be written to during conversion, however it is not recommended to write to the SCP during the last 475 ns of conversion (BUSY = high) or performance degradation can result. In addition, the SCP can be accessed in both serial master and serial slave read during and read after convert modes. Note that at power up, the configuration register is undefined. The RESET input clears the configuration register (sets all bits to 0), thus placing the configuration to 0 V to 5 V input, normal mode, and twos complemented output. Table 9. Configuration Register Description Bit 8 Name START 7 BIPOLAR 6 5 TEN PD 4 3 2 RSV RSV OB/2C 1 0 RSV RSV PD = 0 Description START bit. With the SCP enabled (SCCS = low), when START is high, the first rising edge of SCCLK (INVSCLK = low) begins to load the register with the new configuration. Input Range Select. Used in conjunction with Bit 6, TEN, per the following: Input Range BIPOLAR TEN 0 V to 5 V Low Low 0 V to 10 V Low High ±5 V High Low ±10 V High High Input Range Select. See Bit 7, BIPOLAR. Power Down. PD = Low, normal operation. PD = High, power down the ADC. The SCP is accessible while in power down. To power up the ADC, write PD = low on the next configuration setting. Reserved. Reserved. Output Coding OB/2C = Low, use twos complement output. OB/2C = High, use straight binary output. Reserved. Reserved. SER/PAR = 0, 1 t8 t8 CNVST BUSY BIPOLAR, TEN 06395-044 WARP, IMPULSE Figure 44. Hardware Configuration Timing Rev. 0 | Page 28 of 32 AD7610 BIP = 0 OR 1 TEN = 0 OR 1 WARP = 0 OR 1 IMPULSE = 0 OR 1 SER/PAR = 1 HW/SW = 0 INVSCLK = 0 t8 PD = 0 CNVST BUSY t31 SCCS t31 SCCLK t35 1 2 3 4 t36 6 5 7 8 9 t37 SCIN X START BIPOLAR TEN PD X X OB/2C X 06395-045 t33 t34 Figure 45. Serial Configuration Port Timing The AD7610 is ideally suited for traditional dc measurement applications supporting a microprocessor, and ac signal processing applications interfacing to a digital signal processor. The AD7610 is designed to interface with a parallel 8-bit or 16-bit wide interface, or with a general-purpose serial port or I/O ports on a microcontroller. A variety of external buffers can be used with the AD7610 to prevent digital noise from coupling into the ADC. SPI Interface The AD7610 is compatible with SPI and QSPI digital hosts and DSPs such as Blackfin® ADSP-BF53x and ADSP-218x/ ADSP-219x. Figure 46 shows an interface diagram between the AD7610 and the SPI-equipped ADSP-219x. To accommodate the slower speed of the DSP, the AD7610 acts as a slave device, and data must be read after conversion. This mode also allows the daisy-chain feature. The convert command could be initiated in response to an internal timer interrupt. The reading process can be initiated in response to the end-ofconversion signal (BUSY going low) using an interrupt line of the DSP. The serial peripheral interface (SPI) on the ADSP-219x is configured for master mode (MSTR) = 1, clock polarity bit (CPOL) = 0, clock phase bit (CPHA) = 1, and SPI interrupt enable (TIMOD) = 0 by writing to the SPI control register (SPICLTx). It should be noted that to meet all timing requirements, the SPI clock should be limited to 17 Mbps allowing it to read an ADC result in less than 1 μs. When a higher sampling rate is desired, use one of the parallel interface modes. DVDD AD7610* SER/PAR EXT/INT BUSY CS SDOUT RD SCLK INVSCLK CNVST ADSP-219x* PFx SPIxSEL (PFx) MISOx SCKx PFx OR TFSx *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 46. Interfacing the AD7610 to SPI Interface Rev. 0 | Page 29 of 32 06395-046 MICROPROCESSOR INTERFACING AD7610 APPLICATION INFORMATION LAYOUT GUIDELINES While the AD7610 has very good immunity to noise on the power supplies, exercise care with the grounding layout. To facilitate the use of ground planes that can be easily separated, design the printed circuit board that houses the AD7610 so that the analog and digital sections are separated and confined to certain areas of the board. Digital and analog ground planes should be joined in only one place, preferably underneath the AD7610, or as close as possible to the AD7610. If the AD7610 is in a system where multiple devices require analog-to-digital ground connections, the connections should still be made at one point only, a star ground point, established as close as possible to the AD7610. To prevent coupling noise onto the die, avoid radiating noise, and to reduce feedthrough: The DVDD supply of the AD7610 can be either a separate supply or come from the analog supply, AVDD, or from the digital interface supply, OVDD. When the system digital supply is noisy, or fast switching digital signals are present, and no separate supply is available, it is recommended to connect the DVDD digital supply to the analog supply AVDD through an RC filter, and to connect the system supply to the interface digital supply OVDD and the remaining digital circuitry. See Figure 27 for an example of this configuration. When DVDD is powered from the system supply, it is useful to insert a bead to further reduce high frequency spikes. The AD7610 has four different ground pins: REFGND, AGND, DGND, and OGND. • REFGND senses the reference voltage and, because it carries pulsed currents, should be a low impedance return to the reference. • AGND is the ground to which most internal ADC analog signals are referenced; it must be connected with the least resistance to the analog ground plane. • DGND must be tied to the analog or digital ground plane depending on the configuration. • OGND is connected to the digital system ground. • Do not run digital lines under the device. • Do run the analog ground plane under the AD7610. • Do shield fast switching signals, like CNVST or clocks, with digital ground to avoid radiating noise to other sections of the board, and never run them near analog signal paths. • Avoid crossover of digital and analog signals. • Run traces on different but close layers of the board, at right angles to each other, to reduce the effect of feedthrough through the board. The power supply lines to the AD7610 should use as large a trace as possible to provide low impedance paths and reduce the effect of glitches on the power supply lines. Good decoupling is also important to lower the impedance of the supplies presented to the AD7610, and to reduce the magnitude of the supply spikes. Decoupled ceramic capacitors, typically 100 nF, should be placed on each of the power supplies pins, AVDD, DVDD, and OVDD, VCC, and VEE. The capacitors should be placed close to, and ideally right up against, these pins and their corresponding ground pins. Additionally, low ESR 10 μF capacitors should be located in the vicinity of the ADC to further reduce low frequency ripple. The layout of the decoupling of the reference voltage is important. To minimize parasitic inductances, place the decoupling capacitor close to the ADC and connect it with short, thick traces. EVALUATING PERFORMANCE A recommended layout for the AD7610 is outlined in the EVALAD7610CB evaluation board documentation. The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from a PC via the EVAL-CONTROL BRD3. Rev. 0 | Page 30 of 32 AD7610 OUTLINE DIMENSIONS 0.75 0.60 0.45 9.20 9.00 SQ 8.80 1.60 MAX 37 48 36 1 PIN 1 0.15 0.05 7.20 7.00 SQ 6.80 TOP VIEW 1.45 1.40 1.35 0.20 0.09 7° 3.5° 0° 0.08 COPLANARITY SEATING PLANE (PINS DOWN) 25 12 13 24 0.27 0.22 0.17 VIEW A 0.50 BSC LEAD PITCH VIEW A 051706-A ROTATED 90° CCW COMPLIANT TO JEDEC STANDARDS MS-026-BBC Figure 47. 48-Lead Low Profile Quad Flat Package [LQFP] (ST-48) Dimensions shown in millimeters 7.00 BSC SQ 0.60 MAX 37 36 PIN 1 INDICATOR TOP VIEW 12° MAX 48 5.25 5.10 SQ 4.95 25 24 13 12 0.25 MIN 5.50 REF 0.05 MAX 0.02 NOM 0.50 BSC 1 (BOTTOM VIEW) 0.80 MAX 0.65 TYP SEATING PLANE PIN 1 INDICATOR EXPOSED PAD 6.75 BSC SQ 0.50 0.40 0.30 1.00 0.85 0.80 0.30 0.23 0.18 0.60 MAX 0.20 REF PADDLE CONNECTED TO VEE. THIS CONNECTION IS NOT REQUIRED TO MEET THE ELECTRICAL PERFORMANCES. COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2 Figure 48. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7 mm × 7 mm Body, Very Thin Quad (CP-48-1) Dimensions shown in millimeters ORDERING GUIDE Model AD7610BCPZ 1 AD7610BCPZ-RL1 AD7610BSTZ1 AD7610BSTZ-RL1 EVAL-AD7610CB 2 EVAL-CONTROL BRD3 3 1 2 3 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 48-Lead Low Profile Quad Flat Package (LQFP) 48-Lead Low Profile Quad Flat Package (LQFP) Evaluation Board Controller Board Package Option CP-48-1 CP-48-1 ST-48 ST-48 Z = Pb-free part. This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD3 for evaluation/demonstration purposes. This board allows a PC to control and communicate with all Analog Devices evaluation boards ending with the CB designators. Rev. 0 | Page 31 of 32 AD7610 NOTES ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06395-0-10/06(0) Rev. 0 | Page 32 of 32