MC10H165 8−Input Priority Encoder Description The MC10H165 is an 8−Input Priority Encoder. This 10H part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay, and no increases in power−supply current. http://onsemi.com Features MARKING DIAGRAMS* • Propagation Delay, Data−to−Output, 2.2 ns Typical • Improved Noise Margin 150 mV (Over Operating Voltage and • • • 16 Temperature Range) Voltage Compensated MECL 10K Compatible Pb−Free Packages are Available* MC10H165L AWLYYWW TRUTH TABLE DATA INPUTS 1 CDIP−16 L SUFFIX CASE 620A OUTPUTS D0 D1 D2 D3 D4 D5 D6 D7 H L L L L L L L L X H L L L L L L L X X H L L L L L L X X X H L L L L L X X X X H L L L L X X X X X H L L L X X X X X X H L L X X X X X X X H L Q3 Q2 Q1 Q0 H H H H H H H H L L L L L H H H H L L L H H L L H H L L H L H L H L H L 16 MC10H165P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 DIP PIN ASSIGNMENT 1 1 20 VCC1 1 16 VCC2 Q1 2 15 Q2 Q0 3 14 Q3 CLOCK 4 13 D2 D0 5 12 D5 D7 6 11 D4 D1 7 10 D3 VEE 8 9 D6 10H165G AWLYYWW 20 1 PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 7 1 Publication Order Number: MC10H165/D MC10H165 Table 1. MAXIMUM RATINGS Symbol Rating Unit VEE Power Supply (VCC = 0) Characteristic −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C − Continuous − Surge Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit IE Power Supply Current − 144 − 131 − 144 mA IinH Input Current High Pin 4 Data Inputs − − 510 600 − − 320 370 − − 320 370 0.5 − 0.5 − 0.3 − mA −0.735 Vdc mAdc IinL Input Current Low VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. Table 3. AC PARAMETERS 0° Symbol 25° 75° Min Max Min Max Min Max Propagation Delay Data Input → Output Clock Input → Output 0.7 0.7 3.4 2.2 0.7 0.7 3.4 2.2 0.7 0.7 3.4 2.2 tset Set−up Time 3.0 − 3.0 − 3.0 − ns thold Hold Time 0.5 − 0.5 − 0.5 − ns tr Rise Time 0.5 2.4 0.5 2.4 0.5 2.4 ns tf Fall Time 0.5 2.4 0.5 2.4 0.5 2.4 ns tpd Characteristic Unit ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H165 8−INPUT PRIORITY ENCODER The MC10H165 is a device designed to encode eight inputs to a binary coded output. The output code is that of the highest order input. Any input of lower priority is ignored. Each output incorporates a latch allowing synchronous operation. When the clock is low the outputs follow the inputs and latch when the clock goes high. This device is very useful for a variety of applications in checking system status in control processors, peripheral controllers, and testing systems. The input is active when high, (e.g., the three binary outputs are low when input D0 is high). The Q3 output is high when any input is high. This allows direct extension into another priority encoder when more than eight inputs are necessary. The MC10H165 can also be used to develop binary codes from random logic inputs, for addressing ROMs, RAMs, or for multiplexing data. LOGIC DIAGRAM C4 . VCC1 = PIN 1 . VCC2 = PIN 16 . VEE = PIN 8 D0 5 D1 7 3 Q0 D2 13 D3 10 D4 11 2 Q1 D5 12 15 Q2 D6 9 D7 6 14 Q3 Numbers at ends of terminals denote pin numbers for L and P packages. http://onsemi.com 3 MC10H165 APPLICATION INFORMATION A typical application of the MC10H165 is the decoding of system status on a priority basis. A 64−line priority encoder is shown in the figure below. System status lines are connected to this encoder such that, when a given condition exists, the respective input will be at a logic high level. This scheme will select the one of 64 different system conditions, as represented at the encoder inputs, which has priority in determining the next system operation to be performed. The binary code showing the address of the highest priority input present will appear at the encoder outputs to control other system logic functions. 64−LINE PRIORITY ENCODER LSB Z 1/2 MC10H101 Z Z MC10H164 MC10H164 MC10H164 X0 . . . . . . . X7 A B C X0 . . . . . . . X7 A B C X0 . . . . . . . X7 A B C Six bit output word yielding number of highest priority channel present at input System Clock D0 Q1 Q2 C Q0 MC10H165 Q3 D0 C Q0 D0 MC10H165 C D7 D0 MC10H165 C MC10H165 C D0 Q1 Q2 Q3 Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q0 Q1 Q2 Q3 C Q0 MC10H165 D7 D0 Q1 Q2 Q3 C Q0 D7 MC10H165 D7 D0 D7 Q3 D7 Q0 Q1 Q2 Q2 Q3 D7 C D0 Q1 D7 D0 Lowest Priority Input Q0 D7 MC10H165 Highest Priority Input MC10H165 C Q1 Q2 Q3 http://onsemi.com 4 MSB MC10H165 ORDERING INFORMATION Package Shipping † MC10H165FN PLLC−20 46 Units / Rail MC10H165FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H165FNR2 PLLC−20 500 / Tape & Reel MC10H165FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H165L CDIP−16 25 Unit / Rail MC10H165P PDIP−16 25 Unit / Rail MC10H165PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC10H165 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E B 0.007 (0.180) M T L−M Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 G1 X V 0.010 (0.250) S T L−M S N S VIEW D−D A 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z C H −T− VIEW S G1 0.010 (0.250) S T L−M SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S S N S N S K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L−M NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 6 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H165 PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B M L 16X 0.25 (0.010) E F C K T N SEATING PLANE G 16X 0.25 (0.010) M D T A http://onsemi.com 7 M J T B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H165 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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