Product Folder Order Now Support & Community Tools & Software Technical Documents LMH1297 SNLS572 – MARCH 2017 LMH1297 12G UHD-SDI Bidirectional I/O With Integrated Reclocker 1 Features 2 Applications • • • • • • • • BODY SIZE (NOM) 5.00 mm × 5.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram Cable EQ TX_RX M U X CDR M U X 100-Ÿ Driver OUT0± DE VOD SDI_IO± Cable Driver LDO IN0± EQ SDI_OUT± PCB EQ Cable Driver Control Power Management Control Logic Serial Interface MODE_SEL SS-N_ADDR0 MISO_ADDR1 SCK_SCL MOSI_SDA • • PACKAGE QFN (32) EQ/CD_SEL SDI_OUT_SEL SDI_VOD OUT0_SEL HOST_EQ0 OUT_CTRL ENABLE LOCK-N • • PART NUMBER LMH1297 EN • Device Information(1) VIN • An additional 75-Ω driver output allows the LMH1297 to support a variety of system functions. In EQ (Equalizer) Mode, this second 75-Ω driver can be used as a loop-through output. In CD (Cable Driver) Mode, this 75-Ω driver can be used as a second fanout cable driver. The host-side 100-Ω driver can also be used as a loop-back output in CD Mode for monitoring purposes. VDD_CDR • The LMH1297 is a 12G UHD-SDI 75-Ω bidirectional I/O with integrated reclocker. This device can be configured either in input mode as an adaptive cable equalizer or in output mode as a dual cable driver, allowing system designers the flexibility to use a single BNC either as an input or output port, simplifying UHD video hardware designs. The integrated reclocker locks to all supported SMPTE data rates up to 11.88 Gbps in both modes. The bidirectional I/O has an on-chip 75-Ω termination and return loss compensation network that meets the stringent SMPTE return loss requirements. VSS • 3 Description 75-Ÿ 7HUP RL Network • • SMPTE Compatible Serial Digital Interface UHDTV/4K/8K/HDTV/SDTV Video IP Media Gateway Digital Video Processing and Editing 75-Ÿ 7HUP RL Network • User-Configurable Adaptive Cable Equalizer or Cable Driver With Integrated Reclocker Supports ST-2082-1 (12G), ST-2081-1 (6G), ST-424 (3G), ST-292 (HD), and ST-259 (SD) Compatible With DVB-ASI and AES10 (MADI) Integrated Reclocker Locks to SMPTE Rates of 11.88 Gbps, 5.94 Gbps, 2.97 Gbps, 1.485 Gbps, or Divide-by-1.001 Sub-Rates and 270 Mbps On-Chip 75-Ω Termination and Return Loss Compensation Network EQ (Equalizer) Mode: – Adaptive Cable Equalizer With Integrated Reclocker – 100-Ω Output Driver With De-Emphasis – Reclocked 75-Ω Loop-Through Output – EQ Mode Cable Reach (Belden 1694A, SDI_OUT Disabled): – 75 m at 11.88 Gbps – 120 m at 5.94 Gbps – 200 m at 2.97 Gbps – 300 m at 1.485 Gbps – 600 m at 270 Mbps Cable Driver (CD) Mode: – Dual Differential Output Cable Drivers With Integrated Reclocker – Adaptive PCB Input Equalizer – Reclocked 100-Ω Loopback Output Automatic Pre-Emphasis and Slew Rate Control on 75-Ω Outputs Polarity Inversion on 75-Ω and 100-Ω Outputs Automatic Power Save in Absence of Input Signal – Power Dissipation: 25 mW (Typical) Power-Down Control Through ENABLE Pin Single 2.5-V Supply – EQ Mode Power Dissipation: 275 mW (Typical) – CD Mode Power Dissipation: 315 mW (Typical) Programmable Through Pins, SPI, or SMBus Interface –40°C to +85°C Operating Temperature Range 5-mm × 5-mm, 32-pin QFN Package VDD_LDO 1 Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMH1297 SNLS572 – MARCH 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Device and Documentation Support.................... 6.2 6.3 6.4 6.5 6.6 6.7 1 1 1 2 3 4 7 6.1 Documentation Support ............................................ 4 Receiving Notification of Documentation Updates.... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Export Control Notice................................................ Glossary .................................................................... 4 4 4 4 4 4 Mechanical, Packaging, and Orderable Information ............................................................. 4 4 Revision History 2 DATE REVISION NOTES March 2017 * Initial release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LMH1297 LMH1297 www.ti.com SNLS572 – MARCH 2017 5 Description (continued) The on-chip reclocker attenuates high-frequency jitter and fully regenerates the data using a clean, low-jitter clock. The reclocker has a built-in loop filter and does not require any input reference clock. The LMH1297 also has an internal eye opening monitor and a programmable pin for CDR lock indication, input carrier detect, or hardware interrupts to support system diagnostics and board bring-up. The LMH1297 is powered from a single 2.5-V supply. It is offered in a small 5-mm × 5-mm, 32-pin QFN package. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LMH1297 3 LMH1297 SNLS572 – MARCH 2017 www.ti.com 6 Device and Documentation Support 6.1 Documentation Support 6.1.1 Related Documentation For related documentation, see the following: • Absolute Maximum Ratings for Soldering (SNOA549) • LMH1297 Programming Guide (SNAU204) • QFN/SON PCB Attachment Application Report (SLUA271) 6.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 6.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 6.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 6.6 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 6.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LMH1297 PACKAGE OPTION ADDENDUM www.ti.com 8-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH1297RTVR PREVIEW WQFN RTV 32 1000 TBD Call TI Call TI -40 to 85 LMH1297RTVT PREVIEW WQFN RTV 32 250 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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