Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT 3.0A Surface Mount Schottky Barrier Rectifiers - 20V-100V Features Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. SOD-123HT • Low profile surface mounted application in order to optimize board space. • Tiny plastic SMD package. • Low power loss, high efficiency. • High current capability, l ow forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of 0.146(3.7) 0.130(3.3) 0.012(0.3) Typ. 0.071(1.8) 0.055(1.4) MIL-STD-19500 /228 0.039(1.0) 0.024(0.6) • Suffix "-H" indicates Halogen-free part, ex.FM320-MHT-H. 0.031(0.8) Typ. 0.083(2.1) Mechanical data 0.075(1.9) 0.004(0.10)Typ. • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123HT • Terminals :Plated terminals, solderable per MIL-STD-750, 0.016(0.4)Typ. 0.051(1.3) 0.043(1.1) 0.032(0.8) 0.024(0.6) 0.0335(0.85) 0.0296(0.75) 0.047(1.2) 0.039(1.0) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.011 gram 0.047(1.2) 0.039(1.0) Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) Symbol CONDITIONS Forward rectified current See Fig.1 Forward surge current 8.3ms single half sine-wave (JEDEC methode) MIN. TYP. O V R = V RRM T J = 100 C Thermal resistance Diode junction capacitance 3.0 A I FSM 50 A 10 mA R θJA 70 O C/W Junction to case R θJC 35 O CJ 160 C/W pF f=1MHz and applied 4V DC reverse voltage T STG *1 V RRM (V) V RMS*2 (V) *3 VR (V) FM320-MHT 20 14 20 FM330-MHT 30 21 30 FM340-MHT 40 28 40 FM350-MHT 50 35 50 FM360-MHT 60 42 60 FM380-MHT 80 56 80 FM3100-MHT 100 70 100 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.2 IR Junction to ambient Storage temperature SYMBOLS UNIT IO O V R = V RRM T J = 25 C Reverse current MAX. *4 VF (V) Operating temperature T J, ( OC) 0.55 -55 to +125 -65 O +175 C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 -55 to +150 *4 Maximum forward voltage@I F=3.0A 0.85 Document ID Page 2 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Rating and characteristic curves (FM320-MHT THRU FM3100-MHT) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 3.0 50 HT 0-M 10 M3 ~F HT 0-M 35 FM HT -M 40 M3 ~F HT 0-M 32 FM 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT INSTANTANEOUS FORWARD CURRENT,(A) 2.5 20V ~ 40V 10 50V ~ 60V 80V ~ 100V 3.0 1.0 0.1 TJ=25 C Pulse Width 300us 1% Duty Cycle PEAK FORWARD SURGE CURRENT,(A) 50 .01 40 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 30 8.3ms Single Half TJ=25 C Sine Wave 20 JEDEC method 10 FIG.5 - TYPICAL REVERSE 0 1 5 50 10 CHARACTERISTICS 100 100 20V~40V 50V~100V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE,(pF) 700 600 500 400 300 200 TJ=100°C 1.0 0.1 TJ=25°C 0.01 100 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Document ID Page 3 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Marking Type number Marking code FM320-MHT FM330-MHT FM340-MHT FM350-MHT FM360-MHT FM380-MHT FM3100-MHT 32 33 34 35 36 38 310 Suggested solder pad layout SOD-123HT 0.036 (0.90) 0.044 (1.10) 0.048 (1.20) 0.075 (1.90) 0.036 (0.90) 0.028 (0.70) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123HT Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT Reel packing PACKAGE REEL SIZE SOD-123HT 7" COMPONENT SPACING REEL (pcs) (m/m) 4.0 3,000 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*123*183 178 382*257*387 240,000 9.0 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <3 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Document ID Page 6 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7 Chip Schottky Barrier Rectifier Formosa MS FM320-MHT THRU FM3100-MHT High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=125 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Document ID Page 7 DS-12163O Issued Date Revised Date 2010/05/10 2011/11/15 Revision B Page. 7