MC74AC138, MC74ACT138 1−of−8 Decoder/Demultiplexer T h e M C 7 4 A C 1 3 8 / 7 4 A C T 1 3 8 i s a h i g h−s p e e d 1 −o f −8 decoder/demultiplexer. This device is ideally suited for high−speed bipolar memory chip select address decoding. The multiple input enables allow parallel expansion to a 1−of−24 decoder using just three MC74AC138/74ACT138 devices or a 1−of−32 decoder using four MC74AC138/74ACT138 devices and one inverter. • • • • • w Demultiplexing Capability Multiple Input Enable for Easy Expansion Active LOW Mutually Exclusive Outputs Outputs Source/Sink 24 mA ′ACT138 Has TTL Compatible Inputs http://onsemi.com DIP−16 N SUFFIX CASE 648 16 1 These devices are available in Pb−free package(s). Specifications herein apply to both standard and Pb−free devices. Please see our website at www.onsemi.com for specific Pb−free orderable part numbers, or contact your local ON Semiconductor sales office or representative. VCC O0 O1 O2 O3 O4 O5 O6 16 15 14 13 12 11 10 9 16 16 16 1 A0 2 A1 3 A2 4 E1 5 E2 6 E3 7 O7 E1 E2 E3 Figure 2. Logic Symbol A0−A2 Address Inputs E1−E2 Enable Inputs E3 Enable Input O0−O7 Outputs © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 6 EIAJ−16 M SUFFIX CASE 966 Package Shipping MC74AC138N PDIP−16 25 Units/Rail MC74ACT138N PDIP−16 25 Units/Rail MC74AC138D SOIC−16 48 Units/Rail MC74ACT138D SOIC−16 48 Units/Rail MC74AC138DR2 SOIC−16 2500 Tape & Reel MC74ACT138DR2 SOIC−16 2500 Tape & Reel MC74AC138DT TSSOP−16 96 Units/Rail MC74ACT138DT TSSOP−16 96 Units/Rail MC74AC138DTR2 TSSOP−16 2500 Tape & Reel MC74ACT138DTR2 TSSOP−16 2500 Tape & Reel PIN ASSIGNMENT FUNCTION 1 Device O0 O1 O2 O3 O4 O5 O6 O7 PIN 1 TSSOP−16 DT SUFFIX CASE 948F ORDERING INFORMATION 8 GND Figure 1. Pinout: 16−Lead Packages Conductors (Top View) A0 A1 A2 1 SO−16 D SUFFIX CASE 751B MC74AC138M EIAJ−16 50 Units/Rail MC74ACT138M EIAJ−16 50 Units/Rail MC74AC138MEL EIAJ−16 2000 Tape & Reel MC74ACT138MEL EIAJ−16 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. 1 Publication Order Number: MC74AC138/D MC74AC138, MC74ACT138 FUNCTIONAL DESCRIPTION HIGH. This multiple enabled function allows easy parallel expansion of the device to a 1−of−32 (5 lines to 32 lines) decoder with just four MC74AC138/74ACT138 devices and one inverter (See Figure 4). The MC74AC138/74ACT138 can be used as an 8−output demultiplexer by using one of the active LOW Enable inputs as the data input and the other Enable inputs as strobes. The Enable inputs which are not used must be permanently tied to their appropriate active−HIGH or active−LOW state. The MC74AC138/74ACT138 high−speed 1−of−8 decoder/demultiplexer accepts three binary weighted inputs (A0, A1, A2) and, when enabled, provides eight mutually exclusive active−LOW outputs (O0−O7). The MC74AC138/74ACT138 features three Enable inputs, two active−LOW (E1, E2) and one active−HIGH (E3). All outputs will be HIGH unless E1 and E2 are LOW and E3 is TRUTH TABLE Inputs Outputs E1 E2 E3 A0 A1 A2 O0 O1 O2 O3 O4 O5 O6 O7 H X X X H X X X L X X X X X X X X X H H H H H H H H H H H H H H H H H H H H H H H H L L L L L L L L H H H H L H L H L L H H L L L L L H H H H L H H H H L H H H H L H H H H H H H H H H H H H H H H L L L L L L L L H H H H L H L H L L H H H H H H H H H H H H H H H H H H H H H H L H H H H L H H H H L H H H H L H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial A2 07 NOTE: A1 E1 E2 E3 A0 06 05 04 03 02 01 00 This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram http://onsemi.com 2 MC74AC138, MC74ACT138 A0 A1 A2 ′04 A3 A4 H 123 A0 A1 A2 123 E 00 01 02 03 04 05 06 07 A0 A1 A2 123 E A0 A1 A2 00 01 02 03 04 05 06 07 123 E 00 01 02 03 04 05 06 07 A0 A1 A2 E 00 01 02 03 04 05 06 07 00 031 Figure 4. Expansion to 1−of−32 Decoding MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature −65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH IOL Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − Unit V V ns/V ns/V − − 140 °C −40 25 85 °C Output Current − High − − −24 mA Output Current − Low − − 24 mA 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 3 MC74AC138, MC74ACT138 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ Unit Conditions Guaranteed Limits VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 5.5 − ±0.1 5.5 − 5.5 5.5 VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic Output Current IOHD ICC Maximum Quiescent Supply Current V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 μA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1.0 μA VI = VCC, GND − 75 mA VOLD = 1.65 V Max − − −75 mA VOHD = 3.85 V Min − 8.0 80 μA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 4 V IOUT = −50 μA MC74AC138, MC74ACT138 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay An to On 3.3 5.0 1.5 1.5 8.5 6.5 13.0 9.5 1.5 1.5 15.0 10.5 ns 3−6 tPHL Propagation Delay An to On 3.3 5.0 1.5 1.5 8.0 6.0 12.5 9.0 1.5 1.5 14.0 10.5 ns 3−6 tPLH Propagation Delay E1 or E2 to On 3.3 5.0 1.5 1.5 11.0 8.0 15.0 11.0 1.5 1.5 16.0 12.0 ns 3−6 tPHL Propagation Delay E1 or E2 to On 3.3 5.0 1.5 1.5 9.5 7.0 13.5 9.5 1.5 1.5 15.0 10.5 ns 3−6 tPLH Propagation Delay E3 to On 3.3 5.0 1.5 1.5 11.0 8.0 15.5 11.0 1.5 1.5 16.5 12.5 ns 3−6 tPHL Propagation Delay E3 to On 3.3 5.0 1.5 1.5 8.5 6.0 13.0 8.0 1.5 1.0 14.0 9.5 ns 3−6 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage V V IOUT = −50 μA *VIN = VIL or VIH −24 mA IOH −24 mA IOUT = 50 μA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 μA VI = VCC, GND ΔICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 μA VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 5 MC74AC138, MC74ACT138 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay An to On 5.0 1.5 7.0 10.5 1.5 11.5 ns 3−6 tPHL Propagation Delay An to On 5.0 1.5 6.5 10.5 1.5 11.5 ns 3−6 tPLH Propagation Delay E1 or E2 to On 5.0 2.5 8.0 11.5 2.0 12.5 ns 3−6 tPHL Propagation Delay E1 or E2 to On 5.0 2.0 7.5 11.5 2.0 12.5 ns 3−6 tPLH Propagation Delay E3 to On 5.0 2.5 8.0 12.0 2.0 13.0 ns 3−6 tPHL Propagation Delay E3 to On 5.0 2.0 6.5 10.5 1.5 11.5 ns 3−6 *Voltage Range 5.0 V is 5.0 V ± 0.5 V CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 60 pF VCC = 5.0 V MARKING DIAGRAMS DIP−16 SO−16 MC74AC138N AWLYYWW AC138 AWLYWW MC74ACT138N AWLYYWW ACT138 AWLYWW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 6 TSSOP−16 EIAJ−16 AC 138 ALYW 74AC138 ALYW ACT 138 ALYW 74ACT138 ALYW MC74AC138, MC74ACT138 PACKAGE DIMENSIONS PDIP−16 N SUFFIX 16 PIN PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B F C DIM A B C D F G H J K L M S L S SEATING PLANE −T− K H G D M J 16 PL 0.25 (0.010) M T A M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SO−16 D SUFFIX 16 PIN PLASTIC SOIC PACKAGE CASE 751B−05 ISSUE J −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 7 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74AC138, MC74ACT138 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX 16 PIN PLASTIC TSSOP PACKAGE CASE948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D DETAIL E H G EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE966−01 ISSUE O 16 LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) http://onsemi.com 8 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74AC138, MC74ACT138 Notes http://onsemi.com 9 MC74AC138, MC74ACT138 Notes http://onsemi.com 10 MC74AC138, MC74ACT138 Notes ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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