ON MRS1504T3 Surface mount standard recovery power rectifier Datasheet

MRS1504T3
Surface Mount Standard
Recovery Power Rectifier
SMB Power Surface Mount Package
Features mesa epitaxial construction with glass passivation. Ideally
suited for high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
• Pb−Free Package is Available
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STANDARD RECOVERY
RECTIFIER
1.5 AMPERES, 400 VOLTS
Mechanical Characteristics:
•
•
•
•
•
•
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Maximum Temperature of 260°C / 10 Seconds for Soldering
Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
400
V
IO
1.5
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TI = 118°C)
IFRM
3.0
A
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM
50
A
Tstg, TC
−55 to 150
°C
TJ
−55 to 150
°C
Symbol
Value
Unit
Thermal Resistance, Junction−to−Lead
(Note 1)
Rtjl
18
°C/W
Thermal Resistance, Junction−to−Ambient
(on 1″ sq. Cu. PCB pattern)
Rtja
79
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TI = 118°C)
Storage/Operating Case Temperature Range
Operating Temperature Range
THERMAL CHARACTERISTICS
Rating
June, 2006 − Rev. 4
A
= Assembly Location
Y
= Year
WW = Work Week
RGG = Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MRS1504T3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum pad size.
© Semiconductor Components Industries, LLC, 2006
AYWW
RGG G
G
1
MRS1504T3G
Package
Shipping †
SMB
2500/Tape & Reel
SMB
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MRS1504T3/D
MRS1504T3
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 2), see Figure 2
(IF = 1.5 A)
(IF = 2.25 A)
VF
Maximum Instantaneous Reverse Current, see Figure 4
(VR = 400 V)
(VR = 200 V)
IR
TJ = 25_C
TJ = 100_C
1.04
1.10
0.96
1.02
1.0
0.5
340
180
Unit
V
mA
100
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%
100
10
TJ = 100°C
TJ = 150°C
1.0
TJ = 25°C
TJ = −40°C
0.1
0.6
0.8
1.0
1.2
1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
1.6
100
10
TJ = 100°C
1.0
TJ = 150°C
TJ = 25°C
0.1
0.6
0.8
1.0
1.2
1.4
1.6
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
10E−6
I R, MAXIMUM REVERSE CURRENT (AMPS)
I R, REVERSE CURRENT (AMPS)
100E−6
10E−3
TJ = 150°C
1.0E−3
TJ = 150°C
TJ = 100°C
TJ = 100°C
100E−6
1.0E−6
100E−9
10E−6
1.0E−6
TJ = 25°C
10E−9
1.0E−9
0
TJ = 25°C
100E−9
10E−9
400
100
200
300
VR, REVERSE VOLTAGE (VOLTS)
0
2.5
dc
2.5
FREQ = 20 kHz
dc
2.0
2.0
SQUARE WAVE
1.5
Ipk/Io = 5
Ipk/Io = 20
20
40
60
80
100
120
TL, LEAD TEMPERATURE (°C)
Ipk/Io = 5
Ipk/Io = 10
Ipk/Io = 20
0.5
0
0
Ipk/Io = p
1.0
Ipk/Io = 10
0.5
SQUARE WAVE
1.5
Ipk/Io = p
1.0
400
Figure 4. Maximum Reverse Current
PFO , AVERAGE POWER DISSIPATION (WATTS)
I O , AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Typical Reverse Current
100
200
300
VR, REVERSE VOLTAGE (VOLTS)
140
160
0
0
Figure 5. Current Derating
0.5
1.0
1.5
2.0
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
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2
2.5
MRS1504T3
100
C, CAPACITANCE (pF)
TJ = 25°C
10
1.0
0
10
20
30
40
50
60
VR, REVERSE VOLTAGE (VOLTS)
70
80
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZE
Figure 7. Capacitance
1.0
50%
20%
0.1
10%
5.0%
2.0%
0.01
1.0%
Rtjl(t) = Rtjl*r(t)
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
T, TIME (s)
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 8. Thermal Response, Junction−to−Lead
1.0
50%
0.1
20%
10%
5.0%
2.0%
0.01
1.0%
0.001
0.00001
Rtjl(t) = Rtjl*r(t)
0.0001
0.001
0.01
0.1
1.0
T, TIME (s)
Figure 9. Thermal Response, Junction−to−Ambient
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3
10
100
1,000
MRS1504T3
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
HE
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.13
2.45
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.096
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MRS1504T3/D
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