MRS1504T3 Surface Mount Standard Recovery Power Rectifier SMB Power Surface Mount Package Features mesa epitaxial construction with glass passivation. Ideally suited for high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Features • Compact Package with J−Bend Leads Ideal for Automated Handling • Stable, High Temperature, Glass Passivated Junction • Pb−Free Package is Available http://onsemi.com STANDARD RECOVERY RECTIFIER 1.5 AMPERES, 400 VOLTS Mechanical Characteristics: • • • • • • Case: Molded Epoxy Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 95 mg (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Maximum Temperature of 260°C / 10 Seconds for Soldering Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead SMB CASE 403A PLASTIC MARKING DIAGRAM MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 400 V IO 1.5 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TI = 118°C) IFRM 3.0 A Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 50 A Tstg, TC −55 to 150 °C TJ −55 to 150 °C Symbol Value Unit Thermal Resistance, Junction−to−Lead (Note 1) Rtjl 18 °C/W Thermal Resistance, Junction−to−Ambient (on 1″ sq. Cu. PCB pattern) Rtja 79 °C/W Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TI = 118°C) Storage/Operating Case Temperature Range Operating Temperature Range THERMAL CHARACTERISTICS Rating June, 2006 − Rev. 4 A = Assembly Location Y = Year WW = Work Week RGG = Device Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device MRS1504T3 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Minimum pad size. © Semiconductor Components Industries, LLC, 2006 AYWW RGG G G 1 MRS1504T3G Package Shipping † SMB 2500/Tape & Reel SMB (Pb−Free) 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MRS1504T3/D MRS1504T3 ELECTRICAL CHARACTERISTICS Rating Symbol Maximum Instantaneous Forward Voltage (Note 2), see Figure 2 (IF = 1.5 A) (IF = 2.25 A) VF Maximum Instantaneous Reverse Current, see Figure 4 (VR = 400 V) (VR = 200 V) IR TJ = 25_C TJ = 100_C 1.04 1.10 0.96 1.02 1.0 0.5 340 180 Unit V mA 100 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0% 100 10 TJ = 100°C TJ = 150°C 1.0 TJ = 25°C TJ = −40°C 0.1 0.6 0.8 1.0 1.2 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 1.6 100 10 TJ = 100°C 1.0 TJ = 150°C TJ = 25°C 0.1 0.6 0.8 1.0 1.2 1.4 1.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 10E−6 I R, MAXIMUM REVERSE CURRENT (AMPS) I R, REVERSE CURRENT (AMPS) 100E−6 10E−3 TJ = 150°C 1.0E−3 TJ = 150°C TJ = 100°C TJ = 100°C 100E−6 1.0E−6 100E−9 10E−6 1.0E−6 TJ = 25°C 10E−9 1.0E−9 0 TJ = 25°C 100E−9 10E−9 400 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 0 2.5 dc 2.5 FREQ = 20 kHz dc 2.0 2.0 SQUARE WAVE 1.5 Ipk/Io = 5 Ipk/Io = 20 20 40 60 80 100 120 TL, LEAD TEMPERATURE (°C) Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20 0.5 0 0 Ipk/Io = p 1.0 Ipk/Io = 10 0.5 SQUARE WAVE 1.5 Ipk/Io = p 1.0 400 Figure 4. Maximum Reverse Current PFO , AVERAGE POWER DISSIPATION (WATTS) I O , AVERAGE FORWARD CURRENT (AMPS) Figure 3. Typical Reverse Current 100 200 300 VR, REVERSE VOLTAGE (VOLTS) 140 160 0 0 Figure 5. Current Derating 0.5 1.0 1.5 2.0 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 6. Forward Power Dissipation http://onsemi.com 2 2.5 MRS1504T3 100 C, CAPACITANCE (pF) TJ = 25°C 10 1.0 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (VOLTS) 70 80 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZE Figure 7. Capacitance 1.0 50% 20% 0.1 10% 5.0% 2.0% 0.01 1.0% Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 T, TIME (s) R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 8. Thermal Response, Junction−to−Lead 1.0 50% 0.1 20% 10% 5.0% 2.0% 0.01 1.0% 0.001 0.00001 Rtjl(t) = Rtjl*r(t) 0.0001 0.001 0.01 0.1 1.0 T, TIME (s) Figure 9. Thermal Response, Junction−to−Ambient http://onsemi.com 3 10 100 1,000 MRS1504T3 PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. HE E b DIM A A1 b c D E HE L L1 D MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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