Intersil CDRH2D14NP-1R5 3mhz dual step-down converters and dual low-input ldo Datasheet

3MHz Dual Step-Down Converters and Dual Low-Input
LDOs with I2C Compatible Interface
ISL9305
Features
The ISL9305 is an integrated mini Power Management IC
(mini-PMIC) ideal for applications of powering low-voltage
microprocessor or multiple voltage rails with battery as input
sources, such as a single Li-ion or Li-Polymer. ISL9305
integrates two high-efficiency 3MHz synchronous step-down
converters (DCD1 and DCD2) and two low-input, low-dropout
linear regulators (LDO1 and LDO2).
• Dual 800mA, Synchronous Step-down Converters and Dual
300mA, General-purpose LDOs
• Input Voltage Range
- DCD1/DCD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 5.5V
- LDO1/LDO2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5V to 5.5V
• 400kb/s I2C-bus Series Interface Transfers the Control Data
Between the Host Controller and the ISL9305
The 3MHz PWM switching frequency allows the use of very
small external inductors and capacitors. Both step-down
converters can enter skip mode under light load conditions to
further improve the efficiency and maximize the battery life.
For noise sensitive applications, they can also be programmed
through I2C interface to operate in forced PWM mode
regardless of the load current condition. The I2C interface
supports on-the-fly slew rate control of the output voltage from
0.825V to 3.6V at 25mV/step size for dynamic power saving.
Each step-down converter can supply up to 800mA load
current. The default output voltage can be set from 0.8V to VIN
using external feedback resistors on the adjustable version, or
the ISL9305 can be ordered in factory pre-set power-up default
voltages in increments of 100mV from 0.9V to 3.6V.
• Adjustable Output Voltage
- DCD1/DCD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8V to VIN
- Fixed Output I2C Programmability
• At 25mV/step . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.825V to 3.6V
• LDO1/LDO2 Output Voltage I2C Programmability
- At 50mV/step. . . . . . . . . . . . . . . . . . . . . . . . . . . 0.9V to 3.3V
• 50μA IQ (Typ) with DCD1/DCD2 in Skip Mode; 20μA IQ (Typ)
for each Enabled LDO
• On-the-fly I2C Programming of DC/DC and LDO Output
Voltages
• DCD1/DCD2 I2C Programmable Skip Mode Under Light
Load or Forced Fixed Switching Frequency PWM Mode
The ISL9305 also provides two 300mA low dropout (LDO)
regulators. The input voltage range is 1.5V to 5.5V allowing
them to be powered from one of the on-chip step-down
converters or directly from the battery. The default LDO
power-up output comes with factory pre-set fixed output
voltage options between 0.9V to 3.3V.
• Small, Thin, 4mmx4mm TQFN Package
Applications
• Cellular Phones, Smart Phones
• PDAs, Portable Media Players, Portable Instruments
The ISL9305 is available in a 4mmx4mm 16 Ld TQFN
package.
• Single Li-ion/Li-Polymer Battery-Powered Equipment
• DSP Core Power
Related Literature
• FN7724, ISL9305H Data Sheet
• AN1564 “ISL9305IRTZEVAL1Z and ISL9305HIRTZEVAL1Z
Evaluation Boards”
PG
2.3V TO 5.5V
VINDCD1
VINDCD2
C10
10µF
SDAT
SCLK
1.5V TO 5.5V
C2
1µF
1.5V TO 5.5V
C3
1µF
SW1
FB1
SW2
ISL9305
VINLDO1
FB2
VINLDO2
VOLDO1
VOLDO2
GNDDCD1GNDDCD2GNDLDO
L1 = 1.5µH
R1
800mA
*
R2
L2 = 1.5µH
R3
C4
4.7µF
800mA
*
R4
C5
4.7µF
300mA
300mA
C6
1µF
C7
1µF
*Only for adjustable output version. For fixed output version, directly
connect the FB pin to the output of the buck converter.
FIGURE 1. TYPICAL APPLICATION DIAGRAM
November 8, 2010
FN7605.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2008. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL9305
TABLE 1. TYPICAL APPLICATION PART LIST
PARTS
L1, L2
DESCRIPTION
MANUFACTURER
PART NUMBER
SPECIFICATIONS
SIZE
Inductor
Sumida
CDRH2D14NP-1R5
1.5µH/1.80A/50mΩ
3.0mmx3.0mmx1.55mm
C1
Input capacitor
Murata
GRM21BR60J106KE19L
10µF/6.3V
0805
C2, C3
Input capacitor
Murata
GRM185R60J105KE26D
1µF/6.3V
0603
C4, C5
Output capacitor
Murata
GRM219R60J475KE01D
4.7µF/6.3V
0805
C6, C7
Output capacitor
Murata
GRM185R60J105KE26D
1µF/6.3V
0603
R1, R2,
R3, R4
Resistor
Various
1%, SMD, 0.1Ω
0603
NOTE:
1. C4 and C5 are 10µF/6.3V for VODCD less than 1V.
Block Diagram
SHORT
CIRCUIT
PROTECTION
DCDPG
ANALOG/LOGIC
CIRCUIT INPUT
VINDCD1
10µF
SW1
DCD1
PGOOD WITH
1~200MS
DELAY TIME
BUCK CONVERTER
GNDDCD1
SW2
DCD2
BUCK CONVERTER
I2C
INTERFACE
4.7µF
GNDDCD2
VOLDO1
10µF
VINLDO2
1µF
LDO2
300mA
2
FB2
10µF
1µF
LDO1
300mA
SCLK
1.5µH
VINLDO1
THERMAL
SHUTDOWN
SDAT
4.7µF
FB1
VINDCD2
OVERCURRENT
PROTECTION
UVLO
VREF
OSC
1.5µH
VOLDO2
GNDLDO
10µF
FN7605.0
November 8, 2010
ISL9305
Pin Configuration
SW1
GNDCDC1
GNDDCD2
SW2
ISL9305
(16 LD 4X4 TQFN)
TOP VIEW
16
15
14
13
12 VINDCD2
VINDCD1 1
FB1 2
11 FB2
E-PAD
SCLK 3
10 DCDPG
9 GNDLDO
5
6
7
8
VINLDO1
VOLDO1
VOLDO2
VINLDO2
SDAT 4
Pin Descriptions
PIN
NUMBER
(TQFN)
NAME
DESCRIPTION
1
VINDCD1
Input voltage for buck converter DCD1 and it also serves as the power supply pin for the whole internal digital/ analog
circuits.
2
FB1
Feedback pin for DCD1, connect external voltage divider resistors between DCDC1 output, this pin and ground. For
fixed output versions, connect this pin directly to the DCD1 output.
3
SCLK
I2C interface clock pin.
4
SDAT
I2C interface data pin.
5
VINLDO1
Input voltage for LDO1.
6
VOLDO1
Output voltage of LDO1.
7
VOLDO2
Output voltage of LDO2.
8
VINLDO2
Input voltage for LDO2.
9
GNDLDO
Power ground for LDO1 and LDO2.
10
DCDPG
11
FB2
12
VINDCD2
13
SW2
14
GNDDCD2
Power ground for DCD2.
15
GNDDCD1
Power ground for DCD1.
16
SW1
Switching node for DCD1, connect to one terminal of the inductor.
E-pad
E-pad
Exposed Pad. Connect to system ground.
The DCDPG pin is an open-drain output to indicate the state of the DCD1/DCD2 output voltages. When both DCD1
and DCD2 are enabled, the output is released to be pulled high by an external pull-up resistor if both converter
voltages are within the power-good range. The pin will be pulled low if either DCD is outside their range. When only
one DCD is enabled, the state of the enabled DCD’s output will define the state of the DCDPG pin. The DCDPG state
can be programmed for a delay of up to 200ms before being released to rise high. The programming range is
1ms~200ms through the I2C interface.
Feedback pin for DCD2, connect external voltage divider resistors between DCD2 output, this pin and ground. For
fixed output versions, connect this pin directly to the DCD2 output.
Input voltage for buck converter DCD2.
Switching node for DCD2, connect to one terminal of the inductor.
3
FN7605.0
November 8, 2010
ISL9305
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART MARKING
FBSEL
DCD1
(V)
FBSEL
DCD2
(V)
SLV
LDO1
(V)
SLV
LDO2
(V)
TEMP. RANGE
(°C)
PACKAGE
Tape and Reel
(Pb-free)
PKG.
DWG. #
ISL9305IRTAANLZ-T
9305I AANLZ
Adj
Adj
3.3
2.9
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTBCNLZ-T
9305I BCNLZ
1.5
1.8
3.3
2.9
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTBFNCZ-T
9305I BFNCZ
1.5
2.5
3.3
1.8
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTWBNLZ-T
9305I WBNLZ
1.2
1.5
3.3
2.9
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTWCLBZ-T
9305I WCLBZ
1.2
1.8
2.9
1.5
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTWCNLZ-T
9305I WCNLZ
1.2
1.8
3.3
2.9
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTWCNYZ-T
9305I WCNYZ
1.2
1.8
3.3
0.9
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTWLNCZ-T
9305I WLNCZ
1.2
2.9
3.3
1.8
-40 to +85
16 Ld TQFN
L16.4x4G
ISL9305IRTZEVAL1Z
Evaluation Board
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL9305. For more information on MSL please see techbrief TB363.
4
FN7605.0
November 8, 2010
ISL9305
Absolute Maximum Ratings (Refer to ground)
Thermal Information
SW1, SW2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.5V to 6.5V
FB1, FB2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 3.6V
GNDDCD1, GNDDCD2, GNDLDO. . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 0.3V
All other pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
ESD Ratings
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . .3.5kV
Machine Model (Tested per JESD22-A115-A) . . . . . . . . . . . . . . . . . 2.2kV
Charged Device Model (Tested per JESD22-C101D) . . . . . . . . . . . 225V
Latch Up (Tested per JESD78B, Class II, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
16 Ld TQFN Package (Notes 4, 5) . . . . . . .
42
5
Maximum Junction Temperature Range . . . . . . . . . . . . . .-40°C to +150°C
Recommended Junction Temperature Range . . . . . . . . .-40°C to +125°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
VINDCD1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 5.5V
VINDCD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to VINDCD1
VINLDO1 and VINLDO2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5V to VINDCD1
DCD1 and DCD2 Output Current . . . . . . . . . . . . . . . . . . . . . 0mA to 800mA
LDO1 and LDO2 Output Current . . . . . . . . . . . . . . . . . . . . . . 0mA to 300mA
Operating Ambient Temperature . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. θJC, “case temperature” location is at the center of the exposed metal pad on the package underside.
Electrical Specifications Unless otherwise noted, all parameter limits are guaranteed over the recommended operating conditions and
the typical specifications are measured at the following conditions: TA = +25°C, VINDCD1 = 3.6V, VINDCD2 = 3.3V. For LDO1 and LDO2,
VINLDOx = VOLDOx + 0.5V to 5.5V with VINLDOx always no higher than VINDCD1, L1 = L2 = 1.5µH, C1 = 10µF, C4 = C5 = 4.7µF, C2 = C3 = C6 =
C7 = 1µF, IOUT = 0A for DCD1, DCD2, LDO1 and LDO2 (see Figure 1 on page 1 for more details).
PARAMETER
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
2.3
-
5.5
V
Rising
-
2.2
2.3
V
Falling
1.9
2.1
-
V
SYMBOL
TEST CONDITIONS
VINDCD1, VINDCD2 Voltage Range
VINDCD1, VINDCD2 Undervoltage
Lockout Threshold
VUVLO
Quiescent Supply Current on VINDCD1
IVIN1
Only DCD1 enabled, no load and no switching
on DCD1
-
40
60
µA
IVIN2
Only DCD1 and LDO1 enabled, with no load and
no switching on DCD1
-
65
95
µA
IVIN3
Both DCD1 and DCD2 enabled, no load and no
switching on both DCD1 and DCD2
-
50
75
µA
IVIN4
Only LDO1 and LDO2 enabled
-
75
100
µA
IVIN5
DCD1, DCD2, LDO1 and LDO2 are enabled,
with no load and no switching on both DCD1
and DCD2
-
100
130
µA
IVIN6
Only one DCD in forced PWM mode, no load
-
4
7.5
mA
VINDCD1 = 5.5V, DCD1, DCD2, LDO1 and LDO2
are disabled through I2C interface,
VINDCD1 = 4.2V
-
0.15
5
µA
Thermal Shutdown
-
155
-
°C
Thermal Shutdown Hysteresis
-
30
-
°C
0.785
0.8
0.815
V
-
0.001
-
µA
Shutdown Supply Current
ISD
DCD1 AND DCD2
FB1, FB2 Regulation Voltage
VFB
FB1, FB2 Bias Current
IFB
5
FB = 0.75V
FN7605.0
November 8, 2010
ISL9305
Electrical Specifications Unless otherwise noted, all parameter limits are guaranteed over the recommended operating conditions and
the typical specifications are measured at the following conditions: TA = +25°C, VINDCD1 = 3.6V, VINDCD2 = 3.3V. For LDO1 and LDO2,
VINLDOx = VOLDOx + 0.5V to 5.5V with VINLDOx always no higher than VINDCD1, L1 = L2 = 1.5µH, C1 = 10µF, C4 = C5 = 4.7µF, C2 = C3 = C6 =
C7 = 1µF, IOUT = 0A for DCD1, DCD2, LDO1 and LDO2 (see Figure 1 on page 1 for more details). (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
(Note 6)
TYP
MAX
(Note 6)
UNIT
Output Voltage Accuracy
VIN = VO + 0.5V to 5.5V (minimal 2.3V),
1mA load
-3
-
+3
%
Line Regulation
VIN = VO + 0.5V to 5.5V (minimal 2.3V)
-
0.1
-
%/V
800
-
-
mA
VIN = 3.6V, IO = 200mA
-
0.14
0.2
Ω
VIN = 2.3V, IO = 200mA
-
0.24
0.40
Ω
VIN = 3.6V, IO = 200mA
-
0.11
0.2
Ω
VIN = 2.3V, IO = 200mA
-
0.18
0.34
Ω
1.075
1.3
1.6
A
-
100
-
%
-
0.005
1
µA
2.6
3.0
3.4
MHz
-
70
-
ns
-
115
-
Ω
-
-
0.25
V
Maximum Output Current
P-Channel MOSFET ON-resistance
N-Channel MOSFET ON-resistance
P-Channel MOSFET Peak Current Limit
IPK
SW Maximum Duty Cycle
SW Leakage Current
VIN = 5.5V
PWM Switching Frequency
fS
SW Minimum ON-time
VFB = 0.75V
Bleeding Resistor
PG
Output Low Voltage
Sinking 1mA, FB1 = FB2 = 0.7V
Rising Delay Time
Based on 1ms programmed nominal delay
time
0.6
1.1
1.8
ms
Falling Delay Time
Based on 1ms programmed nonimal delay
time
-
30
-
µs
PG Pin Leakage Current
PG = VINDCD1 = VINDCD2 = 3.6V
-
0.005
0.1
µA
PG Low Rising Threshold
Percentage of nominal regulation voltage
-
91
-
%
PG Low Falling Threshold
Percentage of nominal regulation voltage
-
87
-
%
PG High Rising Threshold
Percentage of nominal regulation voltage
-
112
-
%
PG High Falling Threshold
Percentage of nominal regulation voltage
-
109
-
%
No higher than VINDCD1
1.5
-
5.5
V
VINDCD1 = 2.3V, Rising
-
1.41
1.46
V
VINDCD1 = 2.3V, Falling
1.33
1.37
-
V
350
425
540
mA
IO = 300mA, VO ≤ 2.1V
-
125
250
mV
IO = 300mA, 2.1V < VO ≤ 2.8V
-
100
200
mV
IO = 300mA, VO > 2.8V
-
80
170
mV
Power Supply Rejection Ratio
IO= 300mA @ 1kHz, VIN = 3.6V, VO = 2.6V,
TA = +25°C
-
55
-
dB
Output Voltage Noise
VIN = 4.2V, IO = 10mA, TA = +25°C, BW = 10Hz
to 100kHz
-
45
-
µVRMS
LDO1 AND LDO2
VINLDO1, VINLDO2 Supply Voltage
VINLDO1, VINLDO2 Undervoltage
Lock-out Threshold
VUVLO
Internal Peak Current Limit
Dropout Voltage
NOTE:
6. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
6
FN7605.0
November 8, 2010
ISL9305
Theory of Operation
DCD1 and DCD2 Introduction
Both the DCD1 and DCD2 converters on ISL9305 use the
peak-current-mode pulse-width modulation (PWM) control scheme
for fast transient response and pulse-by-pulse current limiting.
Both converters are able to supply up to 800mA load current. The
default output voltage ranges from 0.8V to 3.6V depending on the
factory pre-set configuration and can be programmed via the I2C
interface in the range of 0.825V to 3.6V at 25mV/step with a
programmable slew rate. An open-drain DCDPG (DCD Power-Good)
signal is also provided to monitor the DCD1 and DCD2 output
voltages. Optionally, both DCD1 and DCD2 can be programmed to
be actively discharged via an on-chip bleeding resistor (typical
115Ω) when the converter is disabled.
Skip Mode (PFM Mode) for DCD1/DCD2
Under light load condition, the DCD1 and DCD2 can be
programmed to automatically enter a pulse-skipping mode to
minimize the switching loss by reducing the switching frequency.
Figure 2 illustrates the skip mode operation. A zero-cross sensing
circuit monitors the current flowing through the SW node for zero
crossing. When it is detected to cross zero for 16 consecutive
cycles, the regulator enters the skip mode. During the 16
consecutive cycles, the inductor current could be negative. The
counter is reset to zero when the sensed current flowing through
the SW node does not cross zero during any cycle within the 16
consecutive cycles. Once the converter enters the skip mode, the
pulse modulation is controlled by an internal comparator while
each pulse cycle remains synchronized to the PWM clock. The
P-Channel MOSFET is turned on at the rising edge of the clock
and turned off when its current reaches ~20% of the peak
current limit. As the average inductor current in each cycle is
higher than the average current of the load, the output voltage
rises cycle-over-cycle. When the output voltage is sensed to reach
1.5% above its nominal voltage, the P-Channel MOSFET is turned
off immediately and the inductor current is fully discharged to
zero and stays at zero. The output voltage reduces gradually due
to the load current discharging the output capacitor. When the
output voltage drops to the nominal voltage, the P-Channel
MOSFET will be turned on again, repeating the previous
operations.
The regulator resumes normal PWM mode operation when the
output voltage is sensed to drop below 1.5% of its nominal
voltage value as shown in Figure 3.
16 CYCLES
CLOCK
20% PEAK CURRENT LIMIT
IL
0
1.015*VOUT_NOMINAL
VOUT
VOUT_NOMINAL
FIGURE 2. SKIP MODE OPERATION WAVEFORMS
vEAMP
vCSA
d
iL
vOUT
FIGURE 3. PWM OPERATION WAVEFORMS
7
FN7605.0
November 8, 2010
ISL9305
Soft-Start
Low Dropout Operation
The soft-start reduces the in-rush current during the start-up stage.
The soft-start block limits the current rising speed so that the
output voltage rises in a controlled fashion.
Both DCD1 and DCD2 converters feature the low dropout
operation to maximize the battery life. When the input voltage
drops to a level that the converter can no longer operate under
switching regulation to maintain the output voltage, the
P-Channel MOSFET is completely turned on (100% duty cycle).
The dropout voltage under such a condition is the product of the
load current and the ON-resistance of the P-Channel MOSFET.
Minimum required input voltage VIN under such condition is the
sum of output voltage plus the voltage drop across the inductor
and the P-Channel MOSFET switch.
Overcurrent Protection
The overcurrent protection for DCD1 and DCD2 is provided on
ISL9305 for when an overload condition occurs. When the current at
P-Channel MOSFET is sensed to reach the current limit, the
internal protection circuit is triggered to turn off the P-Channel
MOSFET immediately.
DCD Short-Circuit Protection
The ISL9305 provides Short-Circuit Protection for both DCD1 and
DCD2. The feedback voltage is monitored for output short-circuit
protection. When the output voltage is sensed to be lower than a
certain threshold, the internal circuit will change the PWM
oscillator frequency to a lower frequencies in order to protect the
IC from damage. The P-Channel MOSFET peak current limit
remains active during this state.
Active Output Voltage Discharge For
DCD1/DCD2
The ISL9305 offers a feature to actively discharge the output
voltage of DCD1 and DCD2 via an internal bleeding resistor
(typical 115Ω) when the channel is disabled. This feature is
enabled by default, thus outputs can be disabled individually
through programming the control bit in DCD_PARAMETER
register.
Undervoltage Lock-out (UVLO)
Thermal Shutdown
An undervoltage lock-out (UVLO) circuit is provided on ISL9305.
The UVLO circuit block can prevent abnormal operation in the
event that the supply voltage is too low to guarantee proper
operation. The UVLO on VINDCD1 is set for a typical 2.2V with
100mV hysteresis. VINLDO1 and VINLDO2 are set for a typical
1.4V with 50mV hysteresis. When the input voltage is sensed to
be lower than the UVLO threshold, the related channel is
disabled.
The ISL9305 provides built-in thermal protection function with
thermal shutdown threshold temperature set at +155°C with
+25°C hysteresis (typical). When the die temperature is sensed
to reach +155°C, the regulator is completely shut down and as
the temperature is sensed to drop to +130°C (typical), the device
resumes normal operation starting from the soft-start.
DCDPG (DCD Power-Good)
The ISL9305 is a high frequency switching charger and hence the
PCB layout is a very important design practice to ensure a
satisfactory performance.
ISL9305 offers an open-drain Power-Good signal with
programmable delay time for monitoring the converters DCD1
and DCD2 output voltages status.
When both DCD1 and DCD2 are enabled and their output
voltages are within the power-good window, an internal
power-good signal is issued to turn off the open-drain MOSFET so
the DCDPG pin voltage can be externally pulled high after a
programmed delay time. If either DCD1 or DCD2 output voltages
or both of them are not within the power-good window, the
DCDPG outputs an open-drain logic low signal after the
programmed delay time.
When there is only one DCD converter (either DCD1 or DCD2) is
enabled, then the DCDPG only indicates the status of this active
DCD converter. For example, if only DCD1 converter is enabled
and DCD2 converter is disabled, when DCD1 output is within the
power-good window, internal power-good signal will be issued to
turn off the open-drain MOSFET so the DCDPG pin voltage is
externally pulled high after the programmed delay time. If output
voltage of DCD1 is outside the power-good window, the DCDPG
outputs an open-drain logic low signal after the programmed
delay time. It is similar when only DCD2 is enabled and DCD1 is
disabled. When both converters are disabled, DCDPG always
outputs the open-drain logic low signal.
8
Board Layout Recommendations
The power loop is composed of the output inductor L, the output
capacitor COUT, the SW pin and the PGND pin. It is important to
make the power loop as small as possible and the connecting
traces among them should be direct, short and wide; the same
practice should be applied to the connection of the VIN pin, the
input capacitor CIN and PGND.
The switching node of the converter, the SW pin, and the traces
connected to this node are very noisy, so keep the voltage
feedback trace and other noise sensitive traces away from these
noisy traces.
The input capacitor should be placed as close as possible to the
VIN pin. The ground of the input and output capacitors should be
connected as close as possible as well. In addition, a solid ground
plane is helpful for a good EMI performance.
The ISL9305 employs a thermal enhanced TQFN package with
an exposed pad. The exposed pad should be properly soldered on
thermal pad of the board in order to remove heat from the IC. The
thermal pad should be big enough for 9 vias as shown in
Figure 4.
FN7605.0
November 8, 2010
ISL9305
I2C Slave Address
The ISL9305 serves as a slave device and the 7-bit default chip
address is 1101000, as shown in Figure 5 According to the I2C
specifications, here the value of Bit 0 determines the direction of
the message (“0” means “write” and “1” means “read”).
MSB
FIGURE 4. EXPOSED THERMAL PAD
LSB
1
1
0
1
0
0
0
R/W
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
I2C Compatible Interface
The ISL9305 offers an I2C compatible interface, using two pins:
SCLK for the serial clock and SDAT for serial data respectively.
According to the I2C specifications, a pull-up resistor is needed
for the clock and data signals to connect to a positive supply.
When the ISL9305 and the host use different supply voltages,
the pull-up resistors should be connected to the higher voltage
rail.
FIGURE 5. I2C SLAVE ADDRESS
I2C Protocol
Figures 6, 7, and 8 show three typical I2C-bus transaction
protocols.
Signal timing specifications should satisfy the standard I2C bus
specification. The maximum bit rate is 400kb/s and more details
regarding the I2C specifications can be found from Philips.
S
SLAVE ADDRESS
0 A
REGISTER ADDRESS
A
DATA BYTE 1
A
SYSTEM HOST
R/W
AUTO INCREMENT
REGISTER ADDRESS
OPTIONAL
DATA BYTE 2
A
DATA BYTE N
AUTO INCREMENT
REGISTER ADDRESS
A
ISL9305
A – ACKNOWLEDGE
N – NOT ACKNOWLEDGE
S – START
P – STOP
P
AUTO INCREMENT
REGISTER ADDRESS
FIGURE 6. I 2C WRITE
S
SLAVE ADDRESS
0 A
REGISTER ADDRESS
A
S
SLAVE ADDRESS
1
A
SYSTEM HOST
R/W
ISL9305
R/W
OPTIONAL
DATA BYTE 1
A
DATA BYTE 2
AUTO INCREMENT
REGISTER ADDRESS
A
AUTO INCREMENT
REGISTER ADDRESS
DATA BYTE N
N
P
A – ACKNOWLEDGE
N – NOT ACKNOWLEDGE
S – START
P – STOP
AUTO INCREMENT
REGISTER ADDRESS
FIGURE 7. I2C READ SPECIFYING REGISTER ADDRESS
9
FN7605.0
November 8, 2010
ISL9305
OPTIONAL
S
SLAVE ADDRESS
1 A
DATA BYTE 1
A
DATA BYTE 2
AUTO INCREMENT
REGISTER ADDRESS
R/W
A
DATA BYTE N
AUTO INCREMENT
REGISTER ADDRESS
N
P
AUTO INCREMENT
REGISTER ADDRESS
SYSTEM HOST A – ACKNOWLEDGE
N – NOT ACKNOWLEDGE
S – START
ISL9305
P – STOP
FIGURE 8. I2C READ NOT SPECIFYING REGISTER ADDRESS
I2C Control Registers
TABLE 2. BUCK CONVERTERS OUTPUT VOLTAGE CONTROL REGISTER
All the registers are reset at initial start-up.
BIT
DCD OUTPUT VOLTAGE CONTROL REGISTER
B7
Reserve
DCD1OUT, address 0x00h; DCD2OUT, address 0x01h
B6
B5
10
NAME
ACCESS
RESET
-
0
DCDxOUT-6
R/W
0
DCDxOUT-5
R/W
0
B4
DCDxOUT-4
R/W
1
B3
DCDxOUT-3
R/W
0
B2
DCDxOUT-2
R/W
0
B1
DCDxOUT-1
R/W
0
B0
DCDxOUT-0
R/W
0
DESCRIPTION
Refer to Table 3
Refer to Table 3
FN7605.0
November 8, 2010
ISL9305
TABLE 3. DCD1 AND DCD2 OUTPUT VOLTAGE SETTING
DCDOUT
<7:0>
DCD OUTPUT
VOLTAGE
(V)
DCDOUT
<7:0>
DCD OUTPUT
VOLTAGE
(V)
DCDOUT
<7:0>
DCD OUTPUT
VOLTAGE
(V)
DCDOUT
<7:0>
DCD OUTPUT
VOLTAGE
(V)
00
0.825
20
1.625
40
2.425
60
3.225
01
0.850
21
1.650
41
2.450
61
3.250
02
0.875
22
1.675
42
2.475
62
3.275
03
0.900
23
1.700
43
2.500
63
3.300
04
0.925
24
1.725
44
2.525
64
3.325
05
0.950
25
1.750
45
2.550
65
3.350
06
0.975
26
1.775
46
2.575
66
3.375
07
1.000
27
1.800
47
2.600
67
3.400
08
1.025
28
1.825
48
2.625
68
3.425
09
1.050
29
1.850
49
2.650
69
3.450
0A
1.075
2A
1.875
4A
2.675
6A
3.475
0B
1.100
2B
1.900
4B
2.700
6B
3.500
0C
1.125
2C
1.925
4C
2.725
6C
3.525
0D
1.150
2D
1.950
4D
2.750
6D
3.550
0E
1.175
2E
1.975
4E
2.775
6E
3.575
0F
1.200
2F
2.000
4F
2.800
6F
3.600
10
1.225
30
2.025
50
2.825
11
1.250
31
2.050
51
2.850
12
1.275
32
2.075
52
2.875
13
1.300
33
2.100
53
2.900
14
1.325
34
2.125
54
2.925
15
1.350
35
2.150
55
2.950
16
1.375
36
2.175
56
2.975
17
1.400
37
2.200
57
3.000
18
1.425
38
2.225
58
3.025
19
1.450
39
2.250
59
3.050
1A
1.475
3A
2.275
5A
3.075
1B
1.500
3B
2.300
5B
3.100
1C
1.525
3C
2.325
5C
3.125
1D
1.550
3D
2.350
5D
3.150
1E
1.575
3E
2.375
5E
3.175
1F
1.600
3F
2.400
5F
3.200
LDO1 AND LDO2 OUTPUT VOLTAGE CONTROL
REGISTERS
LDO1OUT, address 0x02h and LDO2OUT, address 0x03h.
11
TABLE 4. LDOX OUTPUT VOLTAGE CONTROL REGISTERS
BIT
NAME
ACCESS
RESET
B7
Reserve
-
0
B6
Reserve
-
0
B5
LDOxOUT-5
R/W
0
B4
LDOxOUT-4
R/W
0
B3
LDOxOUT-3
R/W
1
B2
LDOxOUT-2
R/W
1
B1
LDOxOUT-1
R/W
0
B0
LDOxOUT-0
R/W
0
DESCRIPTION
Refer to Table 5 for
output voltage
settings
FN7605.0
November 8, 2010
ISL9305
TABLE 5. LDOX OUTPUT VOLTAGE SETTINGS
LDOOUT
<7:0>
LDO OUTPUT
VOLTAGE (V)
LDOOUT
<7:0>
LDO OUTPUT
VOLTAGE (V)
LDOOUT
<7:0>
LDO OUTPUT
VOLTAGE (V)
LDOOUT
<7:0>
LDO OUTPUT
VOLTAGE (V)
00
0.90
10
1.70
20
2.50
30
3.30
01
0.95
11
1.75
21
2.55
31
3.35
02
1.00
12
1.80
22
2.60
32
3.40
03
1.05
13
1.85
23
2.65
33
3.45
04
1.10
14
1.90
24
2.70
34
3.50
05
1.15
15
1.95
25
2.75
35
3.55
06
1.20
16
2.00
26
2.80
36
3.60
07
1.25
17
2.05
27
2.85
08
1.30
18
2.10
28
2.90
09
1.35
19
2.15
29
2.95
0A
1.40
1A
2.20
2A
3.00
0B
1.45
1B
2.25
2B
3.05
0C
1.50
1C
2.30
2C
3.10
0D
1.55
1D
2.35
2D
3.15
0E
1.60
1E
2.40
2E
3.20
0F
1.65
1F
2.45
2F
3.25
DCD1 AND DCD2 CONTROL REGISTER
SYSTEM CONTROL REGISTER
DCD_PARAMETER, address 0x04h
SYS_PARAMETER, address 0x05h
TABLE 6. DCD_PARAMETER REGISTER
TABLE 7. SYS_PARAMETER REGISTER
BIT
NAME
ACCESS
RESET
DESCRIPTION
BIT
NAME
ACCESS
RESET
B7
-
-
0
Reserved
DESCRIPTION
B7
-
-
0
Reserved
R/W
0
I2C function enable.
0-disabled; 1-enabled
DCDPOR Delay Time Setting,
DCDPOR[1:0]:
00 to 1ms
01 to 50ms
10 to 150ms
11 to 200m
B6
DCD_PHASE
R/W
0
DCD1 and DCD2 PWM switch
selection. 0-in phase; 1 to
180° out-of-phase.
B6
I2C_EN
B5
DCDPOR_1
R/W
1
B5
DCD2_ULTRA
R/W
0
Ultrasonic feature under PFM
mode for DCD2. 0-disabled;
1-enabled.
B4
DCDPOR_0
R/W
0
B4
DCD1_ULTRA
R/W
0
Ultrasonic feature under PFM
mode for DCD1. 0-disabled;
1-enabled.
B3
LDO2_EN
R/W
1
LDO2 enable selection.
0-disable, 1-enable.
B2
LDO1_EN
R/W
1
LDO1 enable selection.
0-disable, 1-enable
B1
DCD2_EN
R/W
1
DCD2 enable selection.
0-disable, 1-enable.
B0
DCD1_EN
R/W
1
DCD2 enable selection.
0-disable, 1-enable
B3
DCD2_BLD
R/W
1
Selection of DCD2 for active
output voltage discharge
when disabled. 0-disabled; 1enabled.
B2
DCD1_BLD
R/W
1
Selection of DCD1 for active
output voltage discharge
when disabled. 0-disabled; 1enabled.
B1
DCD2_MODE
R/W
1
Selection on DCD2 of auto
PFM/PWM mode (= 1) or
forced PW mode (= 0).
B0
DCD1_MODE
R/W
1
Selection on DCD1 of auto
PFM/PWM mode (= 1) or
forced PW mode (= 0).
12
FN7605.0
November 8, 2010
ISL9305
DCD OUTPUT VOLTAGE SLEW RATE CONTROL
REGISTER
DCD_SRCTL, address 0x06h
TABLE 8.
BIT
NAME
ACCESS
RESET
DESCRIPTION
B7
DCD2SR_2
R/W
0
B6
DCD2SR_1
R/W
0
B5
DCD2SR_0
R/W
1
B4
Reserve
-
0
Reserved
B3
DCD1SR_2
R/W
0
B2
DCD1SR_1
R/W
0
B1
DCD1SR_0
R/W
1
DCD1 Slew Rate Setting,
DCD1SR[2:0]:
000 to 0.225mV/µs
001 to 0.45mV/µs
010 to 0.90mV/µs
011 to 1.8mV/µs
100 to 3.6mV/µs
101 to 7.2mV/µs
110 to 14.4mV/µs
111 to immediate
B0
Reserve
-
0
DCD2 Slew Rate Setting,
DCD2SR[2:0]:
000 to 0.225mV/µs
001 to 0.45mV/µs
010 to 0.90mV/µs
011 to 1.8mV/µs
100 to 3.6mV/µs
101 to 7.2mV/µs
110 to 14.4mV/µs
111 to immediate
Reserved
Typical Operating Conditions
VODCD1(20mV/DIV, AC-COUPLING)
SW2(5V/DIV)
VODCD1(20mV/DIV, AC-COUPLING)
IL1 (500mA/DIV)
VODCD2(20mV/DIV, AC-COUPLING)
VODCD2(20mV/DIV, AC-COUPLING)
SW1(5V/DIV)
FIGURE 9. DCD OUTPUT VOLTAGE RIPPLE (VIN = 4.2V, FULL LOAD AT
DCD1 AND DCD2)
13
IL2 (500mA/DIV)
FIGURE 10. DCD OUTPUT VOLTAGE RIPPLE (VIN = 4.2V, PFM MODE)
FN7605.0
November 8, 2010
ISL9305
Typical Operating Conditions (Continued)
VODCD1 (100mV/DIV
VOLDO1 (100mV/DIV
VODCD2 (10mV/DIV)
VOLDO2 (10mV/DIV)
IOUT_LDO1 (200mA/DIV
IOUT_VODCD1 (500mA/DIV
FIGURE 11. DCD OUTPUT TRANSIENT RESPONSE (VIN = 4.2V, LOAD
STEP: 80mA to 800mA)
FIGURE 12. LDO OUTPUT TRANSIENT RESPONSE (VIN = 4.2V, STEP
LOAD: 30mA TO 300mA)
IL2 (200mA/DIV)
VODCD1 (2V/DIV)
VODCD2 (1V/DIV)
IL1 (200mA/DIV)
SW1 (5V/DIV)
VOLDO1 (1V/DIV)
VOLDO2 (2V/DIV)
SW2 (5V/DIV)
FIGURE 14. DCD1 and DCD2 SWITCHING WAVEFORM (VIN = 5V, FULL
LOAD ON TWO CHANNELS)
1.83
1.23
1.82
1.22
1.81
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
FIGURE 13. START-UP SEQUENCY (V IN = 4.2V, NO LOAD)
1.80
VIN = 5.5V
1.79
VIN = 3.6V
1.78
VIN = 2.8V
1.20
VIN = 5.5V
VIN = 3.6V
VIN = 2.8V
1.19
1.18
1.77
1.76
1.21
1
10
100
1000
OUTPUT CURRENT (mA)
FIGURE 15. DCD OUTPUT VOLTAGE vs LOAD (VOUT = 1.2V,
PFM/PWM)
14
10000
1.17
1
10
100
1000
OUTPUT CURRENT (mA)
10000
FIGURE 16. DCD OUTPUT VOLTAGE vs LOAD (VOUT = 1.2V,
PFM/PWM)
FN7605.0
November 8, 2010
ISL9305
100
100
VIN = 2.8V
80
70
VIN = 3.6V
60
VIN = 5.5V
50
40
30
EFFICIENCY (%)
80
EFFICIENCY (%)
VIN = 2.8V
90
90
70
40
30
20
10
10
1
10
100
0
0.1
1k
1
10
100
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
FIGURE 17. EFFICIENCY vs OUTPUT CURRENT (VOUT = 1.8V, FORCED
PWM MODE)
58
56
QUIESCENT CURRENT (µA)
RIPPLE REJECTION RATIO (dB)
60
50
40
PSRR
30
10
1k
FIGURE 18. EFFICIENCY vs OUTPUT CURRENT (VOUT = 1.8V, PFM to
PWM)
70
20
VIN = 5.5V
50
20
0
0.1
VIN = 3.6V
60
VIN = 3.6V
VOUT = 2.6V
LOAD = 300mA
0
0.1
1
52
50
100
1000
FIGURE 19. RIPPLE REJECTION RATIO vs FREQUENCY
15
+25°C
48
46
44
42
10
FREQUENCY (kHz)
+85°C
54
40
2.5
-40°C
VO = 1.2V
DCD1 = DCD2 = NO SWITCHING, NO LOAD
LDO1 = LDO2 = DISABLED
3.0
3.5
4.0
4.5
5.0
INPUT VOLTAGE (V)
5.5
6.0
FIGURE 20. QUIESCENT CURRENT vs INPUT VOLTAGE
FN7605.0
November 8, 2010
ISL9305
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev.
DATE
REVISION
11/8/10
FN7605.0
CHANGE
Initial Release
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page
on intersil.com: ISL9305
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN7605.0
November 8, 2010
ISL9305
Package Outline Drawing
L16.4x4G
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/10
4X 1.95
4.00
12X 0.65
A
B
13
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
16
1
4.00
12
2 . 10 ± 0 . 10
9
(4X)
4
0.15
8
TOP VIEW
5
0.10 M C A B
16X 0 . 50 ± 0 . 1
4 0.30 ± 0.05
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0.75
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
( 3 . 6 TYP )
(
( 12X 0 . 65 )
2 . 10 )
C
0 . 2 REF
5
( 16X 0 . 30 )
0 . 00 MIN.
0 . 05 MAX.
( 16 X 0 . 70 )
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO220K.
either a mold or mark feature.
17
FN7605.0
November 8, 2010