AIC AIC1086-28XY 1.5a low dropout positive regulator Datasheet

AIC1086
1.5A Low Dropout Positive Regulator







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
FEATURES
Dropout Voltage 1.3V at 1.5A Output Current.
Fast Transient Response.
Line Regulation, typical at 0.015%.
Load Regulation, typical at 0.1%.
Current Limiting and Thermal Protection.
Adjustable Output Voltage or Fixed at 1.8V, 2.5V,
2.85V, 3.3V, and 5V.
Standard 3-Pin Power Packages.
DESCRIPTION
The AIC1086 is a low dropout three-terminal
regulator designed to provide output current up
to 1.5A. The device is available in an adjustable
version and fixed output voltage of 1.8V, 2.5V,
2.85V, 3.3V and 5V. Dropout voltage of
maximum of 1.5V is guaranteed at 1.5A output
current. The quality of low dropout voltage and
fast transient response make this device ideal




APPLICATIONS
for low voltage microprocessor applications.
Post Regulator for Switching Supply.
Battery Chargers.
PC Add-On Card.
The AIC1086 requires output capacitance of a
minimum of 10μF for stability. Built-in output
current limiting and thermal limiting provide
maximal protection to the AIC1086 against fault
conditions.

TYPICAL APPLICATION CIRCUIT
3
VIN
5V
AIC1086
1 ADJ
C1 +
10F
2
VOUT
3.3V
RF1
125
+
1%
C2
RF2
10F
205
(Note1)
1%
VREF
VREF=VOUT - VADJ=1.25V (typ.)
VOUT=VREF x (1+RF2/RF1)+ IADJ x RF2
IADJ=55A (typ.)
(1) C1 needed if device is far away from filter
capacitors.
(2) C2 required for stability.
Adjustable Voltage Regulator
VIN
5V
3
AIC1086-33
2
VOUT
3.3V
1
C1 +
10F
+C2
10F
GND
(Note1)
Fixed Voltage Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1086G-02
20121225
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1086

ORDERING INFORMATION
AIC1086-XX XX XX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
BG: BAG (for SOT-223)
TO-252 (CE&PE)
TOP VIEW
1: ADJ
2: VOUT (TAB)
3: VIN
PACKAGING TYPE
E: TO-252
M: TO-263
T: TO-220
Y: SOT-223
1
2
3
1
2
3
TO-263 (CM&PM)
TOP VIEW
C: COMMERCIAL
P: LEAD FREE COMMERCIAL
G: GREEN PACKAGE
1: ADJ
2: VOUT (TAB)
3: VIN
TO-220
(CT&PT)
OUTPUT VOLTAGE
DEFAULT: ADJUSTABLE
18: 1.8V
25: 2.5V
28: 2.85V
33: 3.3V
50: 5.0V
FRONT VIEW
1 2
1: ADJ
2: VOUT (TAB)
3: VIN
Example: AIC1086-28CETR
2.85V version in TO-252 Package &
3
SOT-223
(CY&PY)
TOP VIEW
Taping & Reel Packing Type
AIC1086-28PMTR
2.85V version in TO-263 Lead Free
Package & Taping & Reel Packing
1: ADJ
2: VOUT (TAB)
3: VIN
1
2
3
Type

SOT-223 Marking
Part No.
AIC1086
CY
1086
PY
1086P
GY
1086G
AIC1086-18XY
AX18
AX18P
AX18G
AIC1086-25XY
AX25
AX25P
AX25G
AIC1086-28XY
AX28
AX28P
AX28G
AIC1086-33XY
AX33
AX33P
AX33G
AIC1086-50XY
AX50
AX50P
AX50G
2
AIC1086

ABSOLUTE MAXIMUM RATINGS
VIN pin to ADJ/ GND pin ...........................…….......…….....…………............................7V
Operating Temperature Range ……………………………….............…….....-40C to 85C
Operating Junction Temperature Range ............…….....………......................0C ~ 125C
Storage Temperature Range
...............................………….................-65C ~ 150C
Maximum Junction Temperature
125C
Lead Temperature (Soldering, 10 sec)
260C
Thermal Resistance (Junction to Case)
TO-220
………........……...…………...3C /W
TO-252 …....……....………………..12.5C /W
SOT-223
…....……..………..………..15C /W
TO-263 .………………………………....3C /W
Thermal Resistance Junction to Ambient
TO-252
…………………………..…100C/W
(Assume no ambient airflow, no heatsink) TO-263
….....…….....……………...60C /W
SOT-223 …..……..……...…..……...155C /W
TO-220
…....……....………………..50C /W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
 TEST CIRCUIT
Refer to TYPICAL APPLICATION CIRCUIT.
3
AIC1086

ELECTRICAL CHARACTERISTICS
(VIN=5V, TJ=25C, IO=10mA, unless otherwise specified) (Note2)
PARAMETER
Reference Voltage
Output Voltage
TEST CONDITIONS
MIN.
TYP.
MAX.
AIC1086 (ADJ), TJ=25C
1.238
1.25
1.262
0CTJ125C
1.225
1.25
1.275
AIC1086-18, VIN=3.3V
1.78
1.80
1.82
AIC1086-25, VIN=5V
2.47
2.50
2.53
AIC1086-28, VIN=5V
2.82
2.85
2.88
AIC1086-33, VIN=5V
3.26
3.30
3.33
AIC1086-50, VIN=7V
4.95
5.00
5.05
0.015
0.2
0.035
0.2
TJ=25C, IO=10mA ~1.5A
0.1
0.3
0CTJ125C
0.2
0.4
1.3
1.5
2.75VIN7V, VOUT=1.25V
Line Regulation
TJ=25C
0CTJ125C
Load Regulation
Dropout Voltage
Current Limit
Adjusted Pin Current (IADJ)
Adjusted Pin Current Change
(IADJ)
VOUT, VREF=1%, IO=1.5A
0CTJ125C
0CTJ125C
1.5
2.75VIN7V, 10mAIO 1.5A
0CTJ125C
2.75VIN7V, 10mAIO1.5A
0CTJ125C
2.0
UNIT
V
V
%
%
V
A
55
120
A
0.2
5
A
Temperature Stability
IO=0.5A, 0CTJ125C
GND Current
2.65VIN7V
10
14
mA
Minimum Load Current
0CTJ125C
5
10
mA
RMS Output Noise (% of VOUT)
10Hzf10KHz
0.003
%
Ripple Rejection Ratio
120Hz input ripple,COUT=25F
72
dB
0.5
60
%
Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic
capacitor is not suggested.
Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low ON time.
Note 4: Current limit is measured by pulsing a short time.
Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops
100mV below the value measured with a 1V differential.
4
AIC1086
Minimum Input/ Output Differential (V)
TYPICAL PERFORMANCE CHARACTERISTICS
Minimum Operating Current
5
TA=125C
4
3
TA=25C
2
TA=0C
1
0
1
2
3
4
5
6
7
8
9
Input/ Output Differential (V)
Fig. 1 AIC1086 Min. Load Current
(Adjustable Version)
0.08
IOUT=500mA (30mS Plus)
0.07
TA=125C
Output Voltage Deviation (%)
Thermal Regulation (%/W)
2.0
1.8
1.6
TA=0C
1.4
1.2
TA=50C
1.0
TA=125C
0.8
0.6
0.4
0.2
0.0
0
200
400
600
800
1000
1200 1400
1600
Output Current (mA)
Fig. 2 AIC1086 Dropout Voltage
1.6
0.09
0.06
0.05
0.04
0.03
0.02
0.01
0.5
1.0
1.5
2.0
2.5
3.0
1.2
IOUT=0.5A
0.8
0.4
0.0
-0.4
-0.8
-1.2
-1.6
3.5
Power (Watt)
Fig. 3 AIC1086 (ADJ) Power vs. Thermal Regulation
-20
0
20
40
60
80
100
120
140
Temperature (C)
Fig. 4 AIC1086 (ADJ) Temperature Stability
-20
Ripple Rejection Ratio (dB)

COUT=3.3F
-30
-40
COUT=10F
-50
-60
COUT=25F
-70
-80 1
10
2
10
3
10
4
10
5
10
Frequency (Hz)
6
10
7
10
Fig. 5 AIC1086 (ADJ) Ripple Rejection Ratio (dB)
5
AIC1086

TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Output Voltage
(mV, AC)
Output Voltage
(V, AC)
0.1
0.05
0
-0.05
VIN=5V
CIN=1F
COUT=10F (Tantalum)
VOUT=3.3V
0.4A
0.1A
0
40
80
120
160
200
Time (S)
--50
CIN=1F
COUT=10F (Tantalum)
VOUT=3.3V
7.0
6.0
0
10
20
30
40
50
Time (S)
Fig. 7 Line Transient Response
Fig. 6 Load Transient Response

0
--100
Input Voltage (V)
Load Current
-0.1
50
BLOCK DIAGRAM
VIN
+
GM
Current Amp.
-
VREF +
1.25V
Thermal
Limit
Current
Limit
55A
VOUT
For fixed voltage
device
ADJ

GND
PIN DESCRIPTIONS
ADJ PIN
-
Providing VREF=1.25V (typ.) for adjustable VOUT. VREF=VOUT-VADJ and IADJ=55A (typ.)
(GND PIN - Power ground.)
VOUT PIN -
Adjustable output voltage.
VIN PIN
Power Input.
-
6
AIC1086

APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. Input capacitor at
10F with a 10F aluminum electrolytic output
capacitor is recommended.
board material, and the ambient temperature.
When the IC mounting with good thermal
conductivity is used, the junction temperature
will be low even when large power dissipation
applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
POWER DISSIPATION
The AIC1086 obtains thermal-limiting circuitry,
which is designed to protect the device against
overload condition. For continuous load
condition,
maximum
rating
of
junction
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1086 depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The rate of
temperature rise is greatly affected by the
mounting pad configuration on the PCB, the
PMAX 
(TJ-max - TA )
Rθ JA
Where TJ-max is the maximum allowable junction
temperature (125C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
 APPLICATION EXAMPLES
3
Vin
5V
TTL
AIC1086
+ C1
10uF
R3
1k
2
Vout
3.3V
R1
125
1 ADJ
MMBT2222A
R4
1k
+
3
Vin
5V
+ C1
10uF
C2
10uF
2
AIC1086
R1
125
1 ADJ
+
C2
100uF
R2
205
Cadj
R2
205
Vout
3.3V
* Cadj can improve ripple rejection
Fig. 8 VOUT=3.3V with Shutdown
3
Vin
5V
+ C1
10uF
AIC1086
1 ADJ
Fig. 9 Improving Ripple Rejection
T1
2
R1
125
Vout
1.25V
+
D1
3
Vin
C2
10uF
+
C1
10uF
AIC1086-33
2
1
FLOATING INPUT
Fig. 10 VOUT=1.25V Application Circuit
+
C2
100uF
Vout
-3.3V
Fig. 11 Low Dropout Negative Supply
7
AIC1086

PHYSICAL DIMENSIONS

TO-220 (unit: mm)
A
A1
E1
THERMAL PAD
H1
Q
E
L
L1
D1
D
D2
P
A
b2
A
e
A2
S
Y
M
B
O
L
b
c
WITH PLATING
BASE METAL
SECTION A-A
Note: 1. Refer to JEDEC TO-220AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-220
MILLIMETERS
MIN.
MAX.
A
3.56
4.82
A1
0.51
1.39
A2
2.04
2.92
b
0.38
1.01
b2
1.15
1.77
c
0.35
0.61
D
14.23
16.51
D1
8.38
9.02
D2
11.75
12.88
E
9.66
10.66
E1
6.86
e
H1
L
8.90
2.54 BSC
5.85
6.85
12.70
14.73
L1
--
6.35
P
3.54
4.08
Q
2.54
3.42
8
AIC1086

TO-252 (unit: mm)
A
E
c2
E1
THERMAL PAD
L4
H
D
D1
L3
b3
A
A
e
SEE VIEW B
S
Y
M
B
O
L
b
c
WITH PLATING
BASE METAL
SECTION A-A

GAUGE PLANE
SEATING PLANE
L1
VIEW B
A1
L2
L
TO-252-3L
MILLIMETERS
MIN.
MAX.
A
2.19
2.38
A1
0.00
0.13
b
0.64
0.89
b3
4.95
5.46
c
0.46
0.61
c2
0.46
0.89
D
5.33
6.22
D1
4.60
6.00
E
6.35
6.73
E1
3.90
5.46
e
2.28 BSC
H
9.40
10.41
L
1.40
1.78
L1
2.67 REF
L2
0.51 BSC
L3
0.89
2.03
L4
--
1.02

0°
8°
Note: 1. Refer to JEDEC TO-252AA and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
9
AIC1086

SOT-223(unit: mm)
D
A
A
E
E1
b2
SEE VIEW B
e
e1
WITH PLATING
c
A
A2
b
BASE METAL
A1
SECTION A-A
GAUGE PLANE
SEATING PLANE
0.25
VIEW B
θ
L
Note: 1. Refer to JEDEC TO-261AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
SOT-223
MILLIMETERS
MIN.
MAX.
A
1.80
A1
0.02
0.10
A2
1.55
1.65
b
0.66
0.84
b2
2.90
3.10
c
0.23
0.33
D
6.30
6.70
E
6.70
7.30
E1
3.30
e
e1
L
θ
3.70
2.30 BSC
4.60 BSC
0.90
0°
8°
10
AIC1086

TO-263 (unit: mm)
A
c2
E1
THERMAL PAD
L2
H
D
D1
L1
E
A
b2
A
e
SEE VIEW B
S
Y
M
B
O
L
b
c
WITH PLATING
BASE METAL
SECTION A-A

GAUGE PLANE
SEATING PLANE
A1
L3
L
VIEW B
Note: 1. Refer to JEDEC TO-263AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-263-3L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
b2
1.14
1.78
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
D1
6.86
--
E
9.65
10.67
E1
6.23
e
-2.54 BSC
H
14.61
15.88
L
1.78
2.79
L1
--
1.68
L2
--
θ
1.78
0.25 BSC
L3
0°
8°
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its
use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems
are devices or systems which, (і) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform,
when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant
injury to the user.
11