ON MC10173P Quad 2-input multiplexer/ latch Datasheet

MC10173
Quad 2-Input Multiplexer/
Latch
The MC10173 is a quad two channel multiplexer with latch. It
incorporates common clock and common data select inputs. The select
input determines which data input is enabled. A high (H) level enables
data inputs D00, D10, D20, and D30 and a low (L) level enables data
inputs D01, D11, D21, D31. Any change on the data input will be
reflected at the outputs while the clock is low. The outputs are latched
on the positive transition of the clock. While the clock is in the high
state, a change in the information present at the data inputs will not
affect the output information.
• PD = 275 mW typ/pkg (No Load)
• tpd = 2.5 ns typ
• tr, tf = 2.0 ns typ (20%–80%)
http://onsemi.com
MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620
MC10173L
AWLYYWW
1
16
PDIP–16
P SUFFIX
CASE 648
LOGIC DIAGRAM
MC10173P
AWLYYWW
1
SELECT 9
1
1 Q0
D00 6
PLCC–20
FN SUFFIX
CASE 775
10173
AWLYYWW
D01 5
A
WL
YY
WW
2 Q1
D10 4
= Assembly Location
= Wafer Lot
= Year
= Work Week
D11 3
DIP PIN ASSIGNMENT
15 Q2
D20 13
D21 12
14 Q3
D30 11
D31 10
VCC = PIN 16
VEE = PIN 8
CLOCK 7
Q0
1
16
VCC
Q1
2
15
Q2
D11
3
14
Q3
D10
4
13
D20
D01
5
12
D21
D00
6
11
D30
CLOCK
7
10
D31
VEE
8
9
SELECT
TRUTH TABLE
SELECT
CLOCK
Q0n+1
H
L
X
L
L
H
D00
D01
Q0n
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables
on page 18 of the ON Semiconductor MECL Data Book
(DL122/D).
ORDERING INFORMATION
Device
 Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7
1
Package
Shipping
MC10173L
CDIP–16
25 Units / Rail
MC10173P
PDIP–16
25 Units / Rail
MC10173FN
PLCC–20
46 Units / Rail
Publication Order Number:
MC10173/D
MC10173
ELECTRICAL CHARACTERISTICS
Test Limits
Characteristic
Symbol
Pin
Under
Test
Max
Unit
Power Supply Drain Current
IE
8
73
66
73
mAdc
IinH
5
6
7
9
470
470
400
400
295
295
250
250
295
295
250
250
µAdc
IinL
All
0.5
Input Current
–30°C
Min
+25°C
Max
Min
Typ
+85°C
Max
0.5
Min
µAdc
0.3
Output Voltage
Logic 1
VOH
1
2
–1.060
–1.060
–0.890
–0.890
–0.960
–0.960
–0.810
–0.810
–0.890
–0.890
–0.700
–0.700
Vdc
Output Voltage
Logic 0
VOL
1
2
–1.890
–1.890
–1.675
–1.675
–1.850
–1.850
–1.650
–1.650
–1.825
–1.825
–1.615
–1.615
Vdc
Threshold Voltage
Logic 1
VOHA
1
2
–1.080
–1.080
Threshold Voltage
Logic 0
VOLA
1
2
–0.980
–0.980
–0.910
–0.910
–1.655
–1.655
–1.630
–1.630
Vdc
–1.595
–1.595
Switching Times (50Ω Load)
Propagation
Delay
Vdc
ns
Data Input
t6+1+
t6–1–
t5+1+
t5–1–
1
1
1
1
0.8
0.8
0.8
0.8
3.7
3.7
3.7
3.7
1.0
1.0
1.0
1.0
2.5
2.5
2.5
2.5
3.5
3.5
3.5
3.5
1.1
1.1
1.1
1.1
5.3
5.3
5.3
5.3
Clock Input
t7–1+
t7–1–
1
1
1.6
1.6
7.2
7.2
1.6
1.6
4.5
4.5
6.8
6.8
1.4
1.4
6.8
6.8
Select Input
t9+1+
t9+1–
t9–1+
t9–1–
1
1
1
1
1.1
1.1
1.1
1.1
6.2
6.2
6.2
6.2
1.3
1.3
1.3
1.3
3.5
3.5
3.5
3.5
5.7
5.7
5.7
5.7
1.2
1.2
1.2
1.2
6.7
6.7
6.7
6.7
Setup TIme
Data Input
Select Input
tsetup
tsetup
1
1
2.0
3.0
2.0
3.0
1.5
2.5
2.0
3.0
Hold TIme
Data Input
Select Input
thold
thold
1
1
2.5
1.5
2.5
1.5
0.0
–0.5
2.5
1.5
Rise Time
(20 to 80%)
t+
1
1.2
4.0
1.5
2.0
3.5
1.4
4.0
Fall Time
(20 to 80%)
t–
1
1.2
4.0
1.5
2.0
3.5
1.4
4.0
* VILmin applied to each input pin, one at a time.
http://onsemi.com
2
MC10173
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
Characteristic
Power Supply Drain Current
@ Test Temperature
VIHmax
VILmin
VIHAmin
VILAmax
VEE
–30°C
–0.890
–1.890
–1.205
–1.500
–5.2
+25°C
–0.810
–1.850
–1.105
–1.475
–5.2
+85°C
–0.700
–1.825
–1.035
–1.440
–5.2
Symbol
Pin
Under
Test
IE
8
Input Current
5
6
7
9
IinL
All
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
VEE
(VCC)
Gnd
8
16
8
8
8
8
16
16
16
16
*
8
16
VILmin
VIHAmin
VILAmax
5
6
7
9
Output Voltage
Logic 1
VOH
1
2
6, 9
5
7
7
8
8
16
16
Output Voltage
Logic 0
VOL
1
2
9
7
7
8
8
16
16
Threshold Voltage
Logic 1
VOHA
1
2
9
7
7
8
8
16
16
Threshold Voltage
Logic 0
VOLA
1
2
9
7
7
6
5
8
8
16
16
+1.11V
+0.31V
Pulse In
Pulse Out
–3.2 V
+2.0 V
9
9
7
7
7
7
6
6
5
5
1
1
1
1
8
8
8
8
16
16
16
16
5, 7
5, 7
1
1
8
8
16
16
9
9
9
9
1
1
1
1
8
8
8
8
16
16
16
16
Switching Times
Propagation Delay
(50Ω Load)
6
5
Data Input
t6+1+
t6–1–
t5+1+
t5–1–
1
1
1
1
Clock Input
t7–1+
t7–1–
1
1
Select Input
t9+1+
t9+1–
t9–1+
t9–1–
1
1
1
1
6
5
5
6
Data Input
Select Input
tsetup
tsetup
1
1
6
5, 7
7, 9
1
1
8
8
16
16
Data Input
Select Input
thold
thold
1
1
6
5, 7
7, 9
1
1
8
8
16
16
Rise Time
(20 to 80%)
t+
1
5
7
1
8
16
Fall Time
(20 to 80%)
t–
1
7
1
8
16
Setup TIme
Hold TIme
7
7
7
7
* VILmin applied to each input pin, one at a time.
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
http://onsemi.com
3
MC10173
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180)
B
Y BRK
–N–
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
–L–
–M–
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D–D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
0.007 (0.180)
H
M
T L-M
S
N
S
K1
K
C
E
F
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L-M
S
N
S
0.007 (0.180)
M
T L-M
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
http://onsemi.com
4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
--0.025
--0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2
10 0.310
0.330
0.040
---
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
--0.64
--8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2
10 7.88
8.38
1.02
---
N
S
MC10173
PACKAGE DIMENSIONS
–A–
16
9
1
8
–B–
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
S
T A
M
http://onsemi.com
5
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
--0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
15 0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
--5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
15 0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
10 0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
10 0.51
1.01
MC10173
Notes
http://onsemi.com
6
MC10173
Notes
http://onsemi.com
7
MC10173
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: [email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Email: [email protected]
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
http://onsemi.com
8
MC10173/D
Similar pages