Product Guide 1211F Series, Bi-Color Right Angle SMT LED ■ Features ■ Applications • Bi-color right angle LED • Measures 3.0L x 2.0W x 1.0H • Same dimensions as mono-color / 1101F type • Highly reliable, space- and cost-efficient • Edge-lighting applications such as use in cellular telephones • Indicators for PCs, servers, modems, printers or scanners ■ Outline Dimensions Unit: mm Tolerances + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Color Lens Color Forward Voltage V Wavelength MIN. TYP. IF Peak λp TYP. Dominant λd TYP. Spectral Line Half Width λ ∆λ TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR GaAsP Orange (AA) 2.1 3.0 20 605 606 30 20 2.2 2.8 20 100 4 GaP Green (PG) 3.7 5.2 20 560 567 30 20 2.1 2.8 20 100 4 GaAsP Yellow (AY) 2.1 3.0 20 580 590 30 20 2.2 2.8 20 100 4 GaP Green (PG) 3.7 5.2 20 560 567 30 20 2.1 2.8 20 100 4 12.4 17.6 20 660 647 30 20 1.7 2.3 20 100 4 3.7 20 560 567 30 20 2.1 2.8 20 100 4 12.4 17.6 20 660 647 30 20 1.7 2.3 20 100 4 6.2 570 572 30 20 2.1 2.8 20 100 4 mA µA V AAPG1211F AYPG1211F GaAlAs Red (BR) GaP Green (PG) GaAlAs Red (BR) GaP Yellow-Green (PY) BRPG1211F BRPY1211F Luminous Intensity IV (Ta=25°C) Units Milky White 5.2 8.8 mcd 20 mA nm mA V (2 θ 1/2) 150° Deg. ■ Absolute Maximum Ratings (Ta=25°C) Yellow (AY) Green (PG) Red (BR) Yellow-Green (PY) Orange (AA) Green (PG) Red (BR) Green (PG) Symbol AYPG BRPY AAPG BRPG Pd 70 70 70 70 mW Forward Current IF 25 25 25 25 mA Peak Forward Current IFM 60 60 60 60 mA Reverse Voltage VR 4 4 4 4 V Item Power Dissipation Units Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.36 (DC) 0.86 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. ■ Taping Specifications ■ Operation Current Derating Chart (DC) +0.1 0 (0.2) 1.75 + 0.1 4+ 0.1 (2.3) Center Hole Center Hole 4+ 0.1 3.5 + 0.05 2+0.05 (φ 1.1) Quantity on tape: 3000 pieces per reel (3.35) 8.0 + 0.2 φ 1.5 (1.2) 2+0.5 φ 21+0.8 Direction to pull AYPG, BRPY, AAPG, BRPG +1 φ 60 -0 φ 13+0.2 φ 13+0.2 9+0.3 11.4+1 +0 φ 180 3 ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: 1 0° 1 PG -70° -70° -80° -80° X BR 150 Pre-heating Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max -40° 2. Cleaning: -50° -50° -60° Operation Heating Temperature rise: 5°C/sec. -30° -40° -50° -10° -20° -30° -40° -60° 0° -20° -30° -50° AY -10° -20° -20° -30° -40° °C 240 ~ LED Surface Temperature ■ Spatial Distribution -60° -60° PY -70° -70° -80° -80° X • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PG1211F-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com