Rohm BU52011HFV Omnipolar detection hall ic Datasheet

Hall IC Series
Omnipolar Detection
Hall ICs
BU52001GUL, BU52011HFV, BU52021HFV,
BU52015GUL, BU52025G, BU52051NVX, BD7411G
No.10045ECT02
●Description
The bipolar Hall ICs are magnetic switches that can operate both S-and N-pole , upon which the output goes from Hi to
Low. In addition to regular single-output Hall ICs, We offers a line up of dual-output units with a reverse output terminal
(active High).
●Features
1) Omnipolar detection
2) Micropower operation (small current using intermittent operation method)(BD7411G is excluded.)
3) Ultra-compact CSP package (BU52001GUL,BU52015GUL)
4) Ultra-Small outline package HVSOF5 (BU52011HFV,BU52021HFV)
5) Ultra-Small outline package SSON004X1216 (BU52051NVXV)
6) Small outline package (BU52025G,BD7411G)
7) Line up of supply voltage
For 1.8V Power supply voltage(BU52011HFV,BU52015GUL,BU52051NVX)
For 3.0V Power supply voltage (BU52001GUL)
For 3.3V Power supply voltage (BU52021HFV,BU52025G)
For 5.0V Power supply voltage (BD7411G)
8) Dual output type (BU52015GUL)
9) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc.
●Product Lineup
Product name
BU52001GUL
BU52015GUL
BU52051NVX
BU52011HFV
BU52021HFV
BU52025G
BD7411G
Supply
voltage
(V)
2.40～3.30
1.65～3.30
1.65～3.30
1.65～3.30
2.40～3.60
2.40～3.60
4.50～5.50
Operate
point
(mT)
+/-3.7※
+/-3.0※
+/-3.0※
+/-3.0※
+/-3.7※
+/-3.7※
+/-3.4※
Hysteresis
(mT)
Period
(ms)
0.8
0.9
0.9
0.9
0.8
0.8
0.4
50
50
50
50
50
50
-
Supply current
(AVG)
(A)
8.0μ
5.0μ
5.0μ
5.0μ
8.0μ
8.0μ
2.0m
Output type
Package
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
CMOS
VCSP50L1
VCSP50L1
SSON004X1216
HVSOF5
HVSOF5
SSOP5
SSOP5
※Plus is expressed on the S-pole; minus on the N-pole
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Absolute Maximum Ratings
BU52001GUL (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
Power Supply Voltage
VDD
-0.1～+4.5※1
V
Output Current
IOUT
±1
mA
Power Dissipation
Pd
420
※2
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-40～+125
℃
※1. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52015GUL (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
Power Supply Voltage
VDD
-0.1～+4.5※3
V
Output Current
IOUT
±0.5
mA
※4
mW
Power Dissipation
Pd
Operating Temperature Range
Topr
-40～+85
420
℃
Storage Temperature Range
Tstg
-40～+125
℃
※3. Not to exceed Pd
※4. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52051NVX (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
Power Supply Voltage
VDD
-0.1～+4.5※5
V
Output Current
IOUT
±0.5
mA
Power Dissipation
Pd
2049※6
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-40～+125
℃
LIMIT
UNIT
※5. Not to exceed Pd
※6. Reduced by 20.49mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
BU52011HFV (Ta=25℃)
PARAMETERS
SYMBOL
※7
Power Supply Voltage
VDD
Output Current
IOUT
-0.1～+4.5
±0.5
mA
V
Power Dissipation
Pd
536※8
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-40～+125
℃
※7. Not to exceed Pd
※8. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
BU52021NVX (Ta=25℃)
PARAMETERS
Technical Note
SYMBOL
LIMIT
UNIT
※9
Power Supply Voltage
VDD
Output Current
IOUT
-0.1～+4.5
±1
mA
V
Power Dissipation
Pd
536※10
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-40～+125
℃
LIMIT
UNIT
※9. Not to exceed Pd
※10. Reduced by5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
BU52025G (Ta=25℃)
PARAMETERS
SYMBOL
※11
Power Supply Voltage
VDD
Output Current
IOUT
-0.1～+4.5
±1
mA
V
Power Dissipation
Pd
540※12
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-40～+125
℃
※11. Not to exceed Pd
※12. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
BD7411G (Ta=25℃)
PARAMETERS
SYMBOL
LIMIT
UNIT
※13
Power Supply Voltage
VDD
Output Current
IOUT
-0.3～+7.0
±1
mA
V
Power Dissipation
Pd
540※14
mW
Operating Temperature Range
Topr
-40～+85
℃
Storage Temperature Range
Tstg
-55～+150
℃
※13. Not to exceed Pd
※14. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70 mm×1.6mm Glass-epoxy PCB)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
3/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Magnetic, Electrical Characteristics
BU52001GUL (Unless otherwise specified, VDD＝3.0V, Ta＝25℃)
LIMIT
PARAMETERS
SYMBOL
MIN
TYP
Power Supply Voltage
MAX
UNIT
CONDITIONS
VDD
2.4
3.0
3.3
BopS
BopN
BrpS
BrpN
BhysS
BhysN
-5.5
0.8
-
3.7
-3.7
2.9
-2.9
0.8
0.8
5.5
-0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD
-0.4
-
-
V
Output Low Voltage
VOL
-
-
0.4
V
Supply Current
IDD(AVG)
-
8
12
μA
Average
Supply Current During Startup Time
IDD (EN)
-
4.7
-
mA
During Startup Time Value
Supply CurrentDuring Standby Time
IDD (DIS)
-
3.8
-
μA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
BrpN<B<BrpS
IOUT =-1.0mA
B<BopN,BopS<B
IOUT =+1.0mA
※15
※15
※15 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
BU52015GUL (Unless otherwise specified, VDD＝1.80V, Ta＝25℃)
LIMIT
PARAMETERS
SYMBOL
MIN
TYP
MAX
Power Supply Voltage
Operate Point
Release Point
Hysteresis
Period
Output High Voltage
Output Low Voltage
VDD
1.65
1.80
3.30
BopS
BopN
BrpS
BrpN
BhysS
BhysN
-5.0
0.6
-
3.0
-3.0
2.1
-2.1
0.9
0.9
5.0
-0.6
-
Tp
-
50
100
VOH
VDD
-0.2
-
-
UNIT
CONDITIONS
V
mT
mT
mT
ms
V
VOL
-
-
0.2
V
Supply Current 1
IDD1(AVG)
-
5
8
μA
Supply Current During Startup Time 1
IDD1(EN)
-
2.8
-
mA
Supply CurrentDuring Standby Time 1
IDD1(DIS)
-
1.8
-
μA
Supply Current 2
IDD2(AVG)
-
8
12
μA
Supply Current During Startup Time 2
IDD2(EN)
-
4.5
-
mA
Supply CurrentDuring Standby Time 2
IDD2(DIS)
-
4.0
-
μA
OUT1: BrpN<B<BrpS
OUT2: B<BopN, BopS<B
IOUT = -0.5mA
OUT1: B<BopN, BopS<B
OUT2: BrpN<B<BrpS
IOUT = +0.5mA
※16
※16
VDD=1.8V, Average
VDD=1.8V,
During Startup Time Value
VDD=1.8V,
During Standby Time Value
VDD=2.7V, Average
VDD=2.7V,
During Startup Time Value
VDD=2.7V,
During Standby Time Value
※16 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
4/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
BU52051NVX , BU52011HFV (Unless otherwise specified, VDD＝1.80V, Ta＝25℃)
BU52021HFV,BU52025G (Unless otherwise specified, VDD＝3.0V, Ta＝25℃)
LIMIT
PARAMETERS
SYMBOL
UNIT
MIN
TYP MAX
Power Supply Voltage
CONDITIONS
VDD
2.4
3.0
3.6
BopS
BopN
BrpS
BrpN
BhysS
BhysN
-5.5
0.8
-
3.7
-3.7
2.9
-2.9
0.8
0.8
5.5
-0.8
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD
-0.4
-
-
V
Output Low Voltage
VOL
-
-
0.4
V
Supply Current
IDD(AVG)
-
8
12
μA
Average
Supply Current During Startup Time
IDD (EN)
-
4.7
-
mA
During Startup Time Value
Supply CurrentDuring Standby Time
IDD (DIS)
-
3.8
-
μA
During Standby Time Value
Operate Point
Release Point
Hysteresis
Period
V
mT
mT
mT
BrpN<B<BrpS
IOUT =-1.0mA
B<BopN, BopS<B
IOUT =+1.0mA
※17
※17
※17 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
BD7411G (Unless otherwise specified, VDD＝5.0V, Ta＝25℃)
LIMIT
PARAMETERS
SYMBOL
MIN
TYP
Power Supply Voltage
MAX
UNIT
VDD
4.5
5.0
5.5
BopS
BopN
BrpS
BrpN
BhysS
BhysN
-5.6
1.5
-
3.4
-3.4
3.0
-3.0
0.4
0.4
5.6
-1.5
-
mT
Output High Voltage
VOH
4.6
-
-
V
Output Low Voltage
VOL
-
-
0.4
V
Supply Current
IDD
-
2
4
mA
Operate Point
Release Point
Hysteresis
CONDITIONS
V
mT
mT
BrpN<B<BrpS
IOUT =-1.0mA
B<BopN, BopS<B
IOUT =+1.0mA
※18
※18
※18 B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
5/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Figure of measurement circuit
Tp
Bop/Brp
VDD
VDD
VDD
200Ω
VDD
OUT
100μF
GND
Oscilloscope
OUT
GND
V
The period is monitored by Oscilloscope.
Bop and Brp are measured with applying the magnetic field
from the outside.
Fig.1
Fig.2
Bop,Brp measurement circuit
Tp measurement circuit
VOH
VDD
GND
Fig.3
Product Name
OUT
100μF
VDD
IOUT
V
IOUT
BU52001GUL, BU52021HFV,
BU52025G, BD7411G
1.0mA
BU52015GUL, BU52051NVX,
BU52011HFV
0.5mA
VOH measurement circuit
VOL
Product Name
IOUT
BU52001GUL, BU52021HFV, BU52025G,
BD7411G
1.0mA
BU52015GUL, BU52051NVX,
BU52011HFV
0.5mA
VDD
VDD
OUT
100μF
GND
Fig.4
V
IOUT
VOL measurement circuit
IDD
A
VDD
VDD
OUT
C
GND
Fig.5
Product Name
C
BU52001GUL,BU52015GUL,BU52051NVX,
BU52011HFV, BU52021HFV, BU52025G
2200μF
BD7411G
100μF
IDD measurement circuit
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
6/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
8.0
6.0
VDD=3.0V
4.0
Bop S
2.0
Brp S
0.0
-2.0
Brp N
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
100
6.0
Ta = 25°C
4.0
90
80
Bop S
2.0
PERIOD [ms]
8.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
●Technical (Reference) Data
BU52001GUL (VDD=2.4V～3.3V type)
Brp S
0.0
Brp N
-2.0
-4.0
-8.0
2.0
20 40 60 80 100
2.4
2.8
3.2
60
50
40
30
20
10
Bop N
-6.0
VDD=3.0V
70
0
3.6
-60 -40 -20 0
SUPPLY VOLTAGE ［V］
AMBIENT TEMPERATURE [℃]
Fig.7 Bop,Brp- Supply voltage
Ta =
70
60
50
40
30
20
10
0
2.0
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
14.0
12.0
VDD=3.0V
10.0
8.0
6.0
4.0
2.0
0.0
3.6
-60 -40 -20
Fig.8 TP– Ambient
temperature
AVERAGE SUPPLY CURRENT [µA]
PERIOD [ms]
100
90
80
AVERAGE SUPPLY CURRENT [µA]
Fig.6 Bop,Brp–
Ambient temperature
0
20 40
60
14.0
12.0
Ta = 25°C
10.0
8.0
6.0
4.0
2.0
0.0
2.0
80 100
AMBIENT TEMPERATURE [℃]
Fig.9 TP– Supply voltage
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
3.6
Fig.11 IDD – Supply voltage
Fig.10 IDD– Ambient
temperature
8.0
VDD=1.8V
Bop S
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
100
6.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
AVERAGE SUPPLY CURRENT [µA]
Ta = 25°C
PERIOD [ms]
70
60
50
40
30
20
10
0
2.6
3.0
3.4
50
40
30
10
0
-8.0
1.8
2.2
2.6
3.0
3.4
-60 -40 -20 0
3.8
3.8
SUPPLY VOLTAGE [V]
Fig.15 TP– Supply voltage
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
14.0
12.0
10.0
VDD=1.8V
8.0
6.0
4.0
2.0
0.0
-60 -40 -20
0
20
40
60 80 100
AMBIENT TEMPERATURE [℃]
Fig.16 IDD– Ambient
temperature
7/19
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.14 TP – Ambient
temperature
Fig.13 Bop,Brp– Supply voltage
90
2.2
60
SUPPLY VOLTAGE ［V］
100
1.8
VDD=1.8V
80
70
20
-6.0
AMBIENT TEMPERATURE [℃]
1.4
Bop S
4.0
1.4
Fig.12 Bop,Brp–
Ambient temperature
80
90
Ta = 25°C
AVERAGE SUPPLY CURRENT [µA]
6.0
PERIOD [ms]
8.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
BU52015GUL, BU52051NVX, BU52011HFV (VDD=1.65V～3.3V type)
14.0
12.0
Ta = 25°C
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
Fig.17 IDD – Supply voltage
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
8.0
Bop S
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
Ta = 25°C
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
2.0
20 40 60 80 100
2.4
AVERAGE SUPPLY CURRENT [µA]
PERIOD [ms]
Ta = 25°C
60
50
40
30
20
10
0
2.0
2.4
2.8
3.2
3.6
3.2
3.6
90
80
VDD=3.0V
70
60
50
40
30
20
10
0
4.0
-60 -40 -20 0
14.0
Fig.20 TP – Ambient
temperature
14.0
12.0
VDD=3.0V
10.0
8.0
6.0
4.0
2.0
0.0
4.0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.19 Bop,Brp– Supply voltage
Fig.18 Bop,Brp–
Ambient temperature
80
70
2.8
100
SUPPLY VOLTAGE ［V］
AMBIENT TEMPERATURE [℃]
100
90
Bop S
4.0
AVERAGE SUPPLY CURRENT [µA]
VDD=3.0V
4.0
6.0
AVERAGE SUPPLY CURRENT [µA]
8.0
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
BU52021HFV, BU52025G (VDD=2.4V～3.6V type)
-60 -40 -20
SUPPLY VOLTAGE [V]
0
20 40 60
12.0
8.0
6.0
4.0
2.0
0.0
2.0
80 100
2.4
2.8
3.2
3.6
4.0
SUPPLY VOLATAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.23 IDD – Supply voltage
Fig.22 IDD – Ambient
temperature
Fig.21 TP – Supply voltage
Ta = 25°C
10.0
6.0
Bop S
VDD=5.0V
4.0
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
6.0
Ta = 25°C
4.0
Bop S
2.0
Brp S
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
4.0
4.5
5.0
5.5
6.0
SUPPLY VOLTAGE ［V］
AMBIENT TEMPERATURE [℃]
Fig.25
Fig.24 Bop,Brp–
Ambient temperature
AVERAGE SUPPLY CURRENT [mA]
AVERAGE SUPPLY CURRENT [mA]
8.0
8.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
BD7411G (VDD=4.5V～5.5V type)
Bop,Brp– Supply voltage
6.0
5.0
VDD=5.0V
4.0
3.0
2.0
1.0
0.0
-60 -40 -20
0
20
40
60
80 100
AMBIENT TEMPERATURE [℃]
Fig.26 IDD – Ambient
temperature
6.0
5.0
Ta = 25°C
4.0
3.0
2.0
1.0
0.0
4.0
4.5
5.0
5.5
6.0
SUPPLY VOLTAGE [V]
Fig.27 IDD – Supply voltage
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
8/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Block Diagram
BU52001GUL
ＶDD
0.1μF
Adjust the bypass capacitor value
A1
as necessary, according to voltage
noise conditions, etc.
TIMING LOGIC
LATCH
×
SAMPLE
& HOLD
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
HALL
The CMOS output terminals enable direct
B1
OUT connection to the PC, with no external
pull-up resistor required.
A2
GND
Fig.28
PIN No.
PIN NAME
FUNCTION
A1
VDD
POWER SUPPLY
A2
GND
GROUND
B1
OUT
OUTPUT
B2
N.C.
A1
COMMENT
A2
B1
OPEN or Short to GND.
B2
Surface
A2
A1
B2
B1
Reverse
BU52015GUL
VDD
B2
0.1μF
Adjust the bypass capacitor value
as
necessary,
according
OUT1
connection to the PC, with no external pull-up
VDD
resistor required.
A2
OUT2
B1
GND
Fig.29
PIN No.
PIN NAME
FUNCTION
A1
OUT1
Output pin (Active Low)
A2
OUT2
Output pin (Active High)
B1
GND
GROUND
B2
VDD
Power Supply Voltage
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
COMMENT
A1
B1
A2
B2
Surface
9/19
to
voltage noise conditions, etc.
The CMOS output terminals enable direct
GND
LATCH
×
A1
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
A2
A1
B2
B1
Reverse
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
BU52051NVX
ＶDD
0.1μF
4
Adjust the bypass capacitor
value as necessary, according to
voltage noise conditions, etc.
TIMING LOGIC
LATCH
×
The CMOS output terminals enable direct
SAMPLE
& HOLD
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
HALL
1
OUT
connection to the PC, with no external
pull-up resistor required.
2
GND
Fig.30
4
PIN No.
PIN NAME
FUNCTION
1
OUT
OUTPUT
2
GND
GROUND
3
N.C.
4
VDD
3
3
COMMENT
OPEN or Short to GND.
2
1
Reverse
1
2
Surface
POWER SUPPLY
4
BU52011HFV,BU52021HFV
ＶDD
0.1μF
Adjust the bypass capacitor value
4
as
necessary,
according
to
voltage noise conditions, etc.
TIMING LOGIC
LATCH
×
The CMOS output terminals enable
SAMPLE
& HOLD
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
HALL
5
OUT
direct connection to the PC, with no
external pull-up resistor required.
2
GND
Fig.31
PIN No.
PIN NAME
FUNCTION
1
N.C.
2
GND
3
N.C.
4
VDD
POWER SUPPLY
5
OUT
OUTPUT
COMMENT
5
4
4
1
2
3
Surface
3
5
OPEN or Short to GND.
GROUND
OPEN or Short to GND.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10/19
2
1
Reverse
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
BU52025G
ＶDD
0.1μF
4
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
LATCH
×
The CMOS output terminals enable direct
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
5
OUT
connection to the PC, with no external pull-up
resistor required.
2
GND
Fig.32
PIN No.
PIN NAME
FUNCTION
COMMENT
1
N.C.
2
GND
3
N.C.
4
VDD
POWER SUPPLY
5
OUT
OUTPUT
OPEN or Short to GND.
5
4
4
5
1
2
3
Surface
3
2
1
Reverse
GROUND
OPEN or Short to GND.
BD7411G
ＶDD
5
0.1μF
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
TIMING LOGIC
connection to the PC, with no external pull-up
LATCH
×
The CMOS output terminals enable direct
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
REG
resistor required.
4
OUT
2
GND
Fig.33
PIN No.
PIN NAME
FUNCTION
1
N.C.
2
GND
3
N.C.
4
OUT
OUTPUT
5
VDD
POWER SUPPLY
COMMENT
OPEN or Short to GND.
5
4
4
5
1
2
3
Surface
3
2
1
Reverse
GROUND
OPEN or Short to GND.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
11/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Description of Operations
(Micropower Operation)
The Omnipolar detection Hall IC adopts an intermittent
operation method to save energy. At startup, the Hall
elements, amp, comparator and other detection circuits
power ON and magnetic detection begins. During standby,
the detection circuits power OFF, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
IDD
Period
Startup time
Standby
t
Fig.34
※BD7411G don’t adopts an intermittent operation method.
(Offset Cancelation)
VDD
I
B×
＋
Hall Voltage
－
GND
Fig.35
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Reference period: 50ms (MAX100ms)
Reference startup time: 48μs
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
When Hall elements are connected as shown in Fig. 35 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge.
This is known as Hall voltage.
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90˚ angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
12/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
(Magnetic Field Detection Mechanism)
S
N
S
S
S
N
N
Flux
Flux
Fig.36
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
N
S
N
S
S
N
OUT [V]
Flux
Flux
High
High
High
Low
Low
Bop N
Brp N
N-Pole
0
Magnetic flux density [mT]
B
Brp S
Bop S
S-Pole
Fig.37
The Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is
an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when
distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the
magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output
mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and
output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.)
This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
13/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
Standby time
Startup time
Supply current
(Intermittent action)
Indefinite
OUT
High
(No magnetic
field present)
Indefinite
OUT
(Magnetic
field present)
Low
Fig.38
The Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig. 38. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
※BD7411G don’t adopts an intermittent operation method.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment
applications. Fig. 39 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 40 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
Magnetic flux density[mT]
9
t=3mm
8
7
t=1mm
t=2mm
6
5
4
3
2
1
7.6mm
0
0
2
4
6
8
9.2mm 10.4mm
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.39
X
t
Y
X=Y=4mm
t=1mm,2mm,3mm
Magnet size
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
Magnet
t
L: Variable
…Flux density measuring point
Fig.40 Magnet Dimensions and
Flux Density Measuring Point
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
14/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Position of the Hall Effect IC(Reference)
VCSP50L1
0.6
0.55
0.55
0.8
0.6
0.8
0.35
SSOP5
HVSOF5
SSON004X1216
1.45
0.8
0.6
0.2
0.2
(UNIT：mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
VCSP50L1
SSON004X1216
Please avoid having potential overstress from
PCB material, strength, mounting positions.
If you had any further questions or concerns,
please contact your Rohm sales and affiliate.
HVSOF5
SSOP5
(UNIT：mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
15/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Terminal Equivalent Circuit Diagram
OUT , OUT1, OUT2
Because they are configured for CMOS (inverter) output, the
output pins require no external resistance and allow direct
connection to the PC. This, in turn, enables reduction of the
current that would otherwise flow to the external resistor
during magnetic field detection, and supports overall low
current (micropower) operation.
VDD
GND
Fig.41
●Operation Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or
orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the
magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the
design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
Magnet
Slide
d
Hall IC
L
Fig.42
Flux
A
B
S
N
Flux
Fig.43
Magnetic fux density[mT]
6) Slide-by position sensing
Fig.42 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and
the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in
Fig.43, the magnetic field runs in opposite directions at Point A and Point B. Since the Omnipolar detection Hall IC can
detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the
process of position detection. Fig. 44 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic
field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This
demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and
prevents malfunctions.
10
8
6
4
2
0
-2
-4
-6
-8
-10
Reverse
0
1
2
3
4
5
6
7
8
9
10
Horizontal distance from the magnet [mm]
Fig.44
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way,
care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
17/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
●Ordering part number
B
D
7
Part No.
4
1
1
Part No.
52001,52015
52025,7411
52051
52011,52021
G
-
T
Package
GUL: VSCP50L1
G: SSOP5
NVX: SSON004X1216
HFV: HVSOF5
R
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1 )
TR: Embossed tape and reel
(SSOP5, HVSOF5, SSON004X1216)
VCSP50L1 (BU52001GUL,BU52015GUL)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
(Unit:mm)
Reel
)
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
0.05±0.05
1.1±0.05
1.25Max.
)
+0.05
0.42 −0.04
0.95
0.1
Direction of feed
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
18/19
∗ Order quantity needs to be multiple of the minimum quantity.
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV,
BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
SSON004X1216
<Tape and Reel information>
1.6 ± 0.1
1.2±0.1
Embossed carrier tape
Quantity
5000pcs
Direction
of feed
0.6MAX
1PIN MARK
1
2
4
3
+0.03
0.02 -0.02
0.65±0.1
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(0.12)
S
0.8 ± 0.1
0.2 ± 0.1
0.08 S
+0.05
0.2 -0.04
Tape
Direction of feed
1pin
0.75±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF5
<Tape and Reel information>
4
(0.3)
3000pcs
0.2MAX
Embossed carrier tape
Quantity
4
(0.91)
5
Tape
5
(0.41)
(0.05)
1.0±0.05
(0.8)
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 –0.02
1.6±0.05
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
19/19
∗ Order quantity needs to be multiple of the minimum quantity.
2010.01 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
R1010A