plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module Features Description · S21 = 33.3 dB@2010 MHz = 32.7 dB@2025 MHz · NF of 2.0 dB over Frequency · Unconditionally Stable · High OIP3@Low Current Specifications Parameter Typ.@T = 25 C, Vs = 5 V, Freq. = 2017.5 MHz, Zo.sys = 50 ohms Unit Frequency Range Min 2010 Gain dB 32 Gain Flatness dB Noise Figure dB Output IP3 (1) dBm S11/S22 (2) Typ dBm Max 2025 33 44 0.3 0.5 2.0 2.1 Website: www.asb.co.kr E-mail: [email protected] Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -18/-10 28 30 sec - 1 Supply Current mA 460 500 Supply Voltage V 5 Impedance 50 Switching Time (3) More Information 47 dB Output P1dB 2-stage Single Type Specifications MHz C o u pl er C o u pl er · Single 5 V Supply APM2017-P29 is an internally matched amplifier minimodule for such application band in SMD package with the output P1dB of 30 dBm. It is compactly designed for low current consumption and high OIP3. Integrating all the components for biasing and matching within the module enhances production yield and throughput as well. It passes through the stringent DC, RF, and reliability tests. Not sample test but 100% quality control test is made before packing. Max. RF Input Power dBm C.W 23~25 (before fail) Package Type & Size mm Surface Mount Type, 13Wx13Lx3.8H Note: Operating temperature is –40 C to +85 C. 1) OIP3 is measured with two tones at an output power of 15 dBm/tone separated by 1 MHz. 2) S11, S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to 5 V Outline Drawing (Unit: mm) plerow Pin Number Function APM2017-P29 3 RF In ASB Inc. 8 RF Out (Top View) (Bottom View) Solder Stencil Area 1/6 Vs Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Side View) Ø 0.3 plated thru holes to ground plane 10 Others 2 x Ø 2.0 plated thru holes to screw on heat sinker www.asb.co.kr December 2009 plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module S-parameters Typical Performance (Measured) 2010~2025 MHz +5 V Noise Figure S-parameters & K Factor OIP3 2/6 P1dB www.asb.co.kr December 2009 plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module Output Channel Power (@ ACLR=-45dBc, +/-5MHz Offset) ACLR vs Channel Power OIP3 vs Output Power (@ 1MHz offset, 1-tone power) ** Test Source : Agilent E4433B (3GPP W-CDMA Test Model-1 64DPCH) 3/6 www.asb.co.kr December 2009 plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module RF Performance with Voltage Change 1. S-parameter 2010 MHz 2017.5 MHz 2025 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) 4.50 V 33.09 -21.12 -13.31 32.98 0.20 -20.95 -13.39 32.89 -20.78 -13.40 4.75 V 33.14 -20.87 -12.85 33.04 0.19 -20.54 -12.90 32.95 -20.55 -12.86 5.00 V 33.26 -20.63 -12.51 33.16 0.19 -20.29 -12.54 33.07 -20.12 -12.56 5.25 V 33.34 -20.74 -12.24 33.23 0.20 -20.45 -12.27 33.14 -20.31 -12.25 5.50 V 33.36 -21.02 -12.06 33.25 0.21 -20.72 -12.10 33.15 -20.51 -12.09 2. OIP3, P1dB & NF 2010 MHz 2017.5 MHz 2025 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) 4.50 V 40.02 29.70 1.543 40.01 29.65 1.571 40.18 29.66 1.583 4.75 V 42.72 30.20 1.682 42.63 30.15 1.685 42.01 30.14 1.707 5.00 V 47.45 30.53 1.743 47.34 30.50 1.808 47.25 30.45 1.843 5.25 V 49.90 30.70 1.927 50.03 30.77 1.938 49.73 30.75 1.959 5.50 V 46.40 30.90 2.060 46.51 30.96 2.076 46.40 30.92 2.098 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 2010 MHz 2017.5 MHz 2025 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) -45 C 34.39 -17.54 -12.28 34.23 0.25 -17.77 -12.27 34.14 -18.03 -12.32 -10 C 33.96 -18.54 -12.36 33.76 0.27 -18.75 -12.36 33.69 -18.97 -12.33 25 C 33.26 -20.02 -12.32 33.11 0.22 -20.01 -12.37 33.04 -20.26 -12.38 60 C 32.80 -20.94 -12.42 32.64 0.25 -21.21 -12.47 32.55 -21.36 -12.43 85 C 32.24 -22.43 -12.65 32.07 0.24 -22.74 -12.67 32.00 -22.77 -12.59 2. OIP3, P1dB & NF 2010 MHz 2017.5 MHz 2025 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) -45 C 44.60 30.12 1.509 44.57 30.15 1.527 44.32 30.05 1.555 -10 C 45.70 30.35 1.653 45.62 30.22 1.650 45.40 30.12 1.687 25 C 47.45 30.47 1.736 47.35 30.40 1.753 47.10 30.30 1.805 60 C 49.92 30.05 2.112 49.87 29.96 2.143 49.74 29.90 2.151 85 C 47.65 29.82 2.641 47.60 29.71 2.676 47.50 29.65 2.753 Note: tested at Vs= 5V. 4/6 www.asb.co.kr December 2009 plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 APM IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout Vs 20~40 sec 260 C Ramp-up (3 C/sec) 200 C Ramp-down (6 C/sec) OUT IN 150 C 60~180 sec 5/6 Size 40x40 mm (for APM Series – 13x13 mm) www.asb.co.kr December 2009 plerowTM APM2017-P29 Low Noise & High OIP3 Medium Power Amplifier Module Channel Power vs. ACLR Test Configuration APM2017 – P29 Evaluation Board attached with Heat Sink Evaluation Board * In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat sink for testing a module. 6/6 www.asb.co.kr December 2009