MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Features
Usable Past 80GHz
Low Series Resistance
Low Capacitance
High Cutoff Frequency
Silicon Nitride Passivation
Polyimide Scratch Protection
Lead Free (RoHS Compliant)
Designed for Easy Circuit Insertion
Available in Pocket Tape and Reel
Can be Mounted with Solder or Conductive
Epoxy
MADS-001317– 1500
Ordering Information
Description and Applications
M/A-COM's MADS-001317-1500 single is a gallium
arsenide flip chip Schottky barrier diode. This device is fabricated on OMCVD epitaxial material using
a process designed for high device uniformity and
extremely low parasitics. This diode is fully passivated with silicon nitride and has an additional
layer of polyimide for scratch protection. The protective coating prevents damage to the junction during
automated or manual handling. The flip chip configuration is suitable for pick and place insertion.
This device with can be attached with solder or conductive epoxy. The high cutoff frequency of this diode allows use through millimeter wave frequencies.
Typical applications include single and double balanced mixers in PCN transceivers and radios, police
radar detectors, and automotive radar detectors.
Part Number
Package
MADS-001317-1500AG
Gel Pack
MADS-001317-1500AP
Pocket Tape and Reel
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
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MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Electrical Specifications @ + 25 °C
Parameters and Test Conditions
Symbol
MADS-001317-1500
Units
Min.
Junction Capacitance at 0V at 1 MHz
Cj
pF
Total Capacitance at 0V at 1 MHz1
Ct
pF
Dynamic Resistance at 9.5 - 10.5mA
Rs
Ohms
Forward Voltage at +1mA
Vf1
Volts
Reverse Breakdown Voltage at -10uA
Vbr
Volts
Typ.
Max.
.020
.030
.045
.060
4
7
.60
.70
.80
4.5
7
Notes:
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Forward Current vs Temperature
Forward Current (mA)
100.00
25°C
+125°C
10.00
- 50°C
1.00
0.10
0.01
0.00
0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00
Forward Voltage (V)
Absolute Maximum Ratings 1
Parameter
Absolute Maximum
Operating Temperature
-65 °C to +125 °C
Storage Temperature
-65 °C to +150 °C
Incident LO Power
+20 dBm
Incident RF Power
+20 dBm .
Mounting Temperature
+260 °C
Electrostatic Discharge ( ESD ) Classification
2
Class 0
1. Operation of this device above any one of these parameters may cause permanent damage.
2. Human Body Model
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Mounting Techniques
Die attach for these devices is made simple through the use of surface mount die attach technology.
This chip was designed to be inserted onto hard or soft substrates with the junction side down. This chip can be
mounted with conductive epoxy or with solder.
Solder Die Attach:
This device can be mounted with Sn63/Pb37 or RoHS compliant solder.
Typical reflow profiles are provided on M/A-Com application note M538, “ Surface Mounting Instructions”
which can be found @ www.macomtech.com
Epoxy Die Attach:
This device can also be attached with conductive epoxy. The assembly can be preheated to 125 - 150°C.
Use a minimum amount of epoxy. Cure epoxy as per manufacturer’s instructions.
Handling Procedures
The following precautions should be observed to avoid damaging these chips:
Cleanliness:
The chips should be handled in a clean environment.
Do not attempt to clean die after installation.
Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static
electricity. Proper ESD techniques should be used when handling these devices.
General Handling: The protective polymer coating on the active areas of these die provides scratch
protection, particularly for the metal air bridge which contacts the anode. Die can
be handled with tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
Flip Chip Outline Drawing
1. Pad finish is .2 microns of gold over 4 microns of nickel.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-001317-1500
Solderable GaAs Flip Chip Schottky Diode
Rev. V4
M/A-COM Technology Solutions Inc. All rights reserved.
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6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support