To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. “Standard”: 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. H5N2519P Silicon N Channel MOS FET High Speed Power Switching REJ03G0478-0200 Rev.2.00 Nov.19.2004 Features • Low on-resistance • Low leakage current • High speed switching Outline TO-3P D 1. Gate 2. Drain (Flange) 3. Source G S 1 2 3 Absolute Maximum Ratings (Ta = 25°C) Item Drain to Source voltage Gate to Source voltage Drain current Drain peak current Body-Drain diode reverse Drain current Avalanche current Avalanche energy Channel dissipation Channel to case thermal impedance Channel temperature Storage temperature Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1% 2. Value at Tc = 25°C 3. STch = 25°C, Tch ≤ 150°C Rev.2.00 Nov. 19, 2004 page 1 of 6 Symbol VDSS VGSS ID Note1 ID (pulse) IDR Note3 IAP EARNote3 Pch Note2 θch-c Tch Tstg Ratings 250 ±30 65 195 65 22 30.2 150 0.833 150 –55 to +150 Unit V V A A A A mJ W °C/W °C °C H5N2519P Electrical Characteristics (Ta = 25°C) Item Drain to Source breakdown voltage Zero Gate voltage drain current Gate to Source leak current Gate to Source cutoff voltage Forward transfer admittance RDS(on) Min 250 — — 3.0 28 — Typ — — — — 47 0.029 Max — 1 ±0.1 4.5 — 0.035 Unit V µA µA V S Ω Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd — — — — — — — — — — 4900 700 75 65 310 220 220 120 28 52 — — — — — — — — — — pF pF pF ns ns ns ns nC nC nC VDS = 25 V VGS = 0 f = 1 MHz Body-Drain diode forward voltage Body-Drain diode reverse recovery time VDF trr — — 1.10 200 1.65 — V ns IF = 65 A, VGS = 0 Note4 Body-Drain diode reverse recovery charge Notes: 4. Pulse test Qrr — 1.6 — µC Static Drain to Source on state resistance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total Gate charge Gate to Source charge Gate to Drain charge Rev.2.00 Nov. 19, 2004 page 2 of 6 Symbol V(BR)DSS IDSS IGSS VGS(off) |yfs| Test conditions ID = 10 mA, VGS = 0 VDS = 250 V, VGS = 0 VGS = ±30 V, VDS = 0 VDS = 10 V, ID = 1 mA ID = 32.5 A, VDS = 10 V Note4 ID = 32.5 A, VGS = 10 VNote4 ID = 32.5 A VGS = 10 V RL = 3.9 Ω Rg = 10 Ω VDD = 200 V VGS = 10 V ID = 65 A IF = 65 A, VGS = 0 diF/dt = 100 A/µs H5N2519P Main Characteristics Power vs. Temperature Derating ID (A) 300 150 100 100 50 PW DC 30 Drain Current Pch (W) Channel Dissipation Maximum Safe Operation Area 1000 200 er 10 10 s m s( 1s at ion 3 Operation in 1 this area is limited by RDS(on) ho t) (T 25 °C ) 0.3 0 50 100 150 Case Temperature Ta = 25°C 200 1 Tc (°C) 100 VDS = 10 V Pulse Test Pulse Test 7V 6V 60 5.5 V 40 5V 20 ID (A) 6.5 V Drain Current 80 10 V 30 3 10 100 300 1000 Drain to Source Voltage VDS (V) Typical Transfer Characteristics Typical Output Characteristics 100 ID (A) = c= 0.1 Drain Current Op 10 µ 0µ s s 10 1m 80 60 40 20 Tc = 75°C VGS = 4.5 V 0 4 8 12 Drain to Source Voltage 0 16 20 VDS (V) Drain to Source Saturation Voltage VDS(on) (V) 2.5 Pulse Test I D = 65 A 2 1.5 Drain to Source on State Resistance RDS(on) (Ω) Drain to Source Saturation Voltage vs. Gate to Source Voltage 25°C –25°C 2 4 6 Gate to Source Voltage 8 10 VGS (V) Static Drain to Source on State Resistance vs. Drain Current 0.2 Pulse Test VGS = 10 V 0.1 0.05 32.5 A 1 0.02 0.5 0 10 A 0.01 12 4 8 Gate to Source Voltage Rev.2.00 Nov. 19, 2004 page 3 of 6 16 20 VGS (V) 1 2 5 10 20 50 Drain Current ID (A) 100 Forward Transfer Admittance vs. Drain Current Static Drain to Source on State Resistance vs. Temperature 0.100 Pulse Test V GS = 10 V 0.080 Forward Transfer Admittance |yfs| (S) Static Drain to Source on State Resistance RDS(on) (Ω) H5N2519P I D = 65 A 0.060 32.5 A 0.040 10 A 0.020 0 –40 0 40 80 120 Case Temperature Tc (°C) 100 50 20 10 75°C 2 1 0.2 0.2 100 50 20 10 0.1 Drain Current ID (A) 50 100 Ciss 1000 200 100 VGS = 0 f = 1 MHz 10 0 20 40 60 80 100 Drain to Source Voltage VDS (V) 20 300 16 12 VDD 8 V DS = 200 V 100 V 50 V 40 80 120 160 Gate Charge Qg (nC) Rev.2.00 Nov. 19, 2004 page 4 of 6 4 0 200 10000 Switching Time t (ns) VGS VGS (V) 20 V DS = 50 V 100 V 200 V 400 Crss 50 0.3 1 3 10 30 100 Reverse Drain Current IDR (A) I D = 65 A Coss 500 di / dt = 100 A / µs V GS = 0, Ta = 25°C Gate to Source Voltage VDS (V) 10 20 2000 Dynamic Input Characteristics Drain to Source Voltage 5 5000 Capacitance C (pF) Reverse Recovery Time trr (ns) 2 10000 200 0 0.5 1 Typical Capacitance vs. Drain to Source Voltage 500 100 V DS = 10 V Pulse Test 0.5 160 1000 200 25°C 5 Body-Drain Diode Reverse Recovery Time 500 Tc = –25°C 1000 Switching Characteristics V GS = 10 V, V DD = 125 V PW = 5 µs, duty < 1 % R g =10 Ω tf tr t d(off) 100 tf t d(on) tr 10 0.1 0.3 1 3 Drain Current 10 30 ID (A) 100 H5N2519P Gate to Source Cutoff Voltage vs. Case Temperature Reverse Drain Current vs. Source to Drain Voltage 5 Gate to Source Cutoff Voltage V GS(off) (V) Reverse Drain Current IDR (A) 100 80 60 V GS = 0 V 40 20 10 V 5V Pulse Test 0 0.4 0.8 1.2 Source to Drain Voltage 1.6 2.0 V DS = 10 V I D = 10 mA 4 3 1 mA 0.1 mA 2 1 0 -50 VSD (V) 0 50 100 150 Case Temperature Tc (°C) 200 Normalized Transient Thermal Impedance γ s (t) Normalized Transient Thermal Impedance vs. Pulse Width 3 Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 0.833°C/W, Tc = 25°C 0.1 0.05 PDM 0.03 0.02 1 0.0 0.01 10 µ D= e PW uls p ot T h 1s PW T 100 µ 1m 10 m 100 m Pulse Width PW (s) Switching Time Test Circuit 1 Waveform Vout Monitor Vin Monitor 10 90% D.U.T. RL Vin 10Ω Vin 10 V V DD = 125 V Vout 10% 10% 90% td(on) Rev.2.00 Nov. 19, 2004 page 5 of 6 tr 10% 90% td(off) tf H5N2519P Package Dimensions Unit: mm 4.8 ± 0.2 1.5 0.3 19.9 ± 0.2 2.0 14.9 ± 0.2 0.5 1.0 φ3.2 ± 0.2 5.0 ± 0.3 As of January, 2003 15.6 ± 0.3 1.6 2.0 1.4 Max 18.0 ± 0.5 2.8 1.0 ± 0.2 3.6 0.6 ± 0.2 0.9 1.0 5.45 ± 0.5 5.45 ± 0.5 Package Code JEDEC JEITA Mass (reference value) TO-3P — Conforms 5.0 g Ordering Information Part Name H5N2519P-E Quantity 30 pcs Shipping Container Plastic magazine Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.2.00 Nov. 19, 2004 page 6 of 6 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. 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