Diodes DMN3730UFB4 30v n-channel enhancement mode mosfet Datasheet

A Product Line of
Diodes Incorporated
DMN3730UFB4
30V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(on)
ID
TA = +25°C
460m @ VGS= 4.5V
0.9A
560m @ VGS= 2.5V
0.7A
V(BR)DSS
30V
Features and Benefits
Description
This MOSFET is designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
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0.4mm Ultra Low Profile Package for Thin Application
0.6mm2 Package Footprint, 10 times Smaller than SOT23
Low VGS(th), can be driven directly from a battery
Low RDS(on)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
ESD Protected Gate 2kV
Qualified to AEC-Q101 Standards for High Reliability
ideal for high efficiency power management applications.
Mechanical Data
Applications
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Load Switch
Portable Applications
Power Management Functions
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Case: X2-DFN1006-3
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper Leadframe; Solderable
per MIL-STD-202, Method 208 e4
Weight: 0.001 grams (Approximate)
Drain
X2-DFN1006-3
Body
Diode
S
Gate
D
G
ESD PROTECTED TO 2kV
Bottom View
Top View
Gate
Protection
Diode
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN3730UFB4-7
DMN3730UFB4-7B
Notes:
Marking
NF
NF
Reel size (inches)
7
7
Tape width (mm)
8
8
Quantity per reel
3,000
10,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
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A Product Line of
Diodes Incorporated
DMN3730UFB4
Marking Information
From date code 1527 (YYWW),
this changes to:
NF
NF
Top View
Bar Denotes Gate and Source Side
Top View
Dot Denotes Drain Side
NF
NF
NF
NF
NF
NF
DMN3730UFB4-7
NF
Top View
Bar Denotes Gate and Source Side
NF = Part Marking Code
NF
NF
NF
DMN3730UFB4-7B
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
Value
Drain-Source Voltage
Characteristic
VDSS
30
Gate-Source Voltage
VGSS
±8
(Note 6)
Continuous Drain Current
ID
VGS = 4.5V TA = +70°C (Note 6)
(Note 5)
Pulsed Drain Current
V
0.91
0.73
0.75
(Note 7)
Unit
IDM
3
Symbol
Value
0.69
0.47
180
258
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Notes:
(Note 6)
(Note 5)
(Note 6)
(Note 5)
PD
RθJA
TJ, TSTG
-55 to +150
Unit
W
°C/W
°C
5. For a device surface mounted on a minimum recommended pad layout of an FR4 PCB, in still air conditions; the device is measured when operating in
steady-state condition.
6. Same as note 4, except the device measured at t  10 seconds.
7. Same as note 4, except the device is pulsed at duty cycle of 1% for a pulse width of 10µs.
DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
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DMN3730UFB4
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
30
—
—
V
VGS = 0V, ID = 10μA
Zero Gate Voltage Drain Current
IDSS
—
—
1
µA
VDS = 30V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
3
µA
VGS = ±8V, VDS = 0V
VGS(th)
0.45
—
0.95
V
VDS = VGS, ID = 250μA
—
—
—
—
—
—
460
ON CHARACTERISTICS
Gate Threshold Voltage
Static Drain-Source On-Resistance (Note 8)
RDS(on)
560
VGS = 4.5V, ID = 200mA
mΩ
730
VGS = 2.5V, ID = 100mA
VGS = 1.8V, ID = 75mA
Forward Transfer Admittance
|Yfs|
40
—
—
mS
VDS = 3V, ID = 10mA
Diode Forward Voltage (Note 8)
VSD
—
0.7
1.2
V
VGS = 0V, IS = 300mA
Input Capacitance
Ciss
—
64.3
—
pF
Output Capacitance
Coss
—
6.1
—
pF
Reverse Transfer Capacitance
Crss
—
4.5
—
pF
Gate Resistance
Rg
—
70
—
Ω
Total Gate Charge
Qg
—
1.6
—
nC
Gate-Source Charge
Qgs
—
0.2
—
nC
Gate-Drain Charge
Qgd
—
0.2
—
nC
Turn-On Delay Time
tD(on)
—
3.5
—
ns
Turn-On Rise Time
tr
—
2.8
—
ns
Turn-Off Delay Time
tD(off)
—
38
—
ns
tf
—
13
—
ns
DYNAMIC CHARACTERISTICS (Note 9)
Turn-Off Fall Time
VDS = 25V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VGS = 4.5V, VDS = 15V,
ID = 1A
VDS = 10V, ID = 1A
VGS = 10V, RG = 6Ω
8. Measured under pulsed conditions to minimize self-heating effect. Pulse width  300µs; duty cycle  2%
9. For design aid only, not subject to production testing.
Notes:
2.0
2.0
VGS = 10V
VGS = 4.5V
VDS = 5V
VGS = 2.5V
1.5
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 3.0V
VGS = 2.0V
VGS = 1.5V
1.0
0.5
1.5
1.0
0.5
TA = 150°C
TA = 125°C
TA = 85°C
T A = 25°C
TA = -55°C
0
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
5
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0
0
0.5
1
1.5
2
2.5
V GS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristic
3
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0.8
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
DMN3730UFB4
0.6
VGS = 1.8V
0.4
VGS = 2.5V
VGS = 4.5V
0.2
0
0
0.4
0.8
1.2
1.6
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
1.4
VGS = 2.5V
ID = 500mA
1.2
1.0
0.8
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 On-Resistance Variation with Temperature
1.2
TA = 125°C
TA = 85°C
0.4
TA = 25°C
TA = -55°C
0.2
0
0.25
0.5
0.75
1
1.25
ID, DRAIN CURRENT (A)
Fig. 4 Typical On-Resistance
vs. Drain Current and Temperature
1.5
0.8
0.6
VGS = 2.5V
ID = 500mA
0.4
VGS = 4.5V
ID = 1.0A
0.2
0
-50
2.0
1.0
1.6
IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
TA = 150°C
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 6 On-Resistance Variation with Temperature
-25
0.8
ID = 1mA
0.6
ID = 250µA
0.4
TA = 25°C
1.2
0.8
0.4
0.2
0
-50 -25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
Document number: DS35017 Rev. 8 - 2
0.6
0
RDSON, DRAIN-SOURCE ON-RESISTANCE ()
R DSON, DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
VGS = 4.5V
ID = 1.0A
DMN3730UFB4
VGS = 4.5V
2
1.6
0.6
-50
0.8
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0
0
0.2
0.4
0.6
0.8
1
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 8 Diode Forward Voltage vs. Current
1.2
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DMN3730UFB4
100
10,000
IDSS, LEAKAGE CURRENT (nA)
C, CAPACITANCE (pF)
Ciss
Coss
10
Crss
TA = 150°C
1,000
TA = 125°C
100
TA = 85°C
10
TA = 25°C
f = 1MHz
1
1
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Typical Total Capacitance
30
0
5
10
15
20
25
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Leakage Current
vs. Drain-Source Voltage
30
VGS, GATE-SOURCE VOLTAGE (V)
8
VDS = 15V
ID = 1A
6
4
2
0
0
0.5
1
1.5
2
2.5
Qg, TOTAL GATE CHARGE (nC)
Fig. 11 Gate-Charge Characteristics
3
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.9
D = 0.05
RJA (t) = r(t) * R JA
RJA = 253°C/W
D = 0.02
0.01 D = 0.01
P(pk)
t2
TJ - TA = P * RJA(t)
Duty Cycle, D = t 1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
t1
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 12 Transient Thermal Response
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10
100
1,000
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DMN3730UFB4
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
A1
Seating Plane
D
b
Pin #1 ID
e
E b2
X2-DFN1006-3
Dim Min Max Typ
A
 0.40 
A1 0.00 0.05 0.03
b
0.10 0.20 0.15
b2 0.45 0.55 0.50
D 0.95 1.05 1.00
E 0.55 0.65 0.60
e
0.35
L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3
0.40
z
0.02 0.08 0.05
All Dimensions in mm
z
L3
L2
L1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
Y
Dimensions
C
G1
G2
X
X1
Y
Y1
Y1
G2
X
G1
Value (in mm)
0.70
0.30
0.20
0.40
1.10
0.25
0.70
X1
DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
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DMN3730UFB4
Document number: DS35017 Rev. 8 - 2
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