EtronTech
EM638165
4M x 16 bit Synchronous DRAM (SDRAM)
Preliminary (Rev. 5.3, Dec. /2013)
Features
Overview
• Fast access time from clock: 4.5/5.4/5.4 ns
• Fast clock rate: 200/166/143 MHz
• Fully synchronous operation
• Internal pipelined architecture
• 1M word x 16-bit x 4-bank
• Programmable Mode registers
- CAS Latency: 2 or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: Sequential or Interleaved
- Burst stop function
- Optional drive strength control
• Auto Refresh and Self Refresh
• 4096 refresh cycles/64ms
• CKE power down mode
• Single +3.3V ± 0.3V power supply
• Operating Temperature: TA = 0~70°C
• Interface: LVTTL
• 54-pin 400 mil plastic TSOP II package
- Pb and Halogen Free
• 54-ball 8.0 x 8.0 x 1.2mm (max) FBGA package
- Pb free and Halogen free
The EM638165 SDRAM is a high-speed CMOS
synchronous DRAM containing 64 Mbits. It is
internally configured as 4 Banks of 1M word x 16
DRAM with a synchronous interface (all signals are
registered on the positive edge of the clock signal,
CLK). Read and write accesses to the SDRAM are
burst oriented; accesses start at a selected location
and continue for a programmed number of locations
in a programmed sequence. Accesses begin with the
registration of a Bank Activate command which is
then followed by a Read or Write command.
The EM638165 provides for programmable Read
or Write burst lengths of 1, 2, 4, 8, or full page, with a
burst termination option. An auto precharge function
may be enabled to provide a self-timed row precharge
that is initiated at the end of the burst sequence. The
refresh functions, either Auto or Self Refresh are easy
to use. By having a programmable mode register, the
system can choose the most suitable modes to
maximize its performance. These devices are well
suited for applications requiring high memory
bandwidth and particularly well suited to high
performance PC applications.
Table1. Key Specifications
EM638165
- 5/6/7
tCK3 Clock Cycle time(min.)
tAC3 Access time from CLK(max.)
5/6/7
4.5/5.4/5.4 ns
tRAS Row Active time(min.)
40/42/42
ns
tRC Row Cycle time(min.)
55/60/63
ns
ns
Table 2. Ordering Information
Part Number
Frequency
Package
EM638165TS -5G
200MHz
TSOP II
EM638165TS -6G
166MHz
TSOP II
EM638165TS -7G
143MHz
TSOP II
EM638165BM -5H
200MHz
FBGA
EM638165BM -6H
166MHz
FBGA
EM638165BM -7H
143MHz
FBGA
TS: indicates TSOPII Package
BM: indicates FBGA package
G: indicates Pb and Halogen Free for TSOPII Package
H: indicates Pb free and Halogen free
Etron Technology, Inc.
No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C.
TEL: (886)-3-5782345
FAX: (886)-3-5778671
Etron Technology, Inc. reserves the right to change products or specification without notice.
EtronTech
EM638165
Figure 1. Pin Assignment (Top View)
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
LDQM
WE#
CAS#
RAS#
CS#
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
Rev. 5.3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
Figure 2. Ball Assignment (Top View)
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC/RFU
UDQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS
2
1
2
3
A
VSS
DQ15
B
DQ14
C
…
7
8
9
VSSQ
VDDQ
DQ0
VDD
DQ13
VDDQ
VSSQ
DQ2
DQ1
DQ12
DQ11
VSSQ
VDDQ
DQ4
DQ3
D
DQ10
DQ9
VDDQ
VSSQ
DQ6
DQ5
E
DQ8
NC
VSS
VDD
LDQM
DQ7
F
UDQM
CLK
CKE
CAS#
RAS#
WE#
G
NC
A11
A9
BA0
BA1
CS#
H
A8
A7
A6
A0
A1
A10
J
VSS
A5
A4
A3
A2
VDD
Dec. /2013
EtronTech
EM638165
Figure 3. Block Diagram
CLOCK
BUFFER
Row
Decoder
CLK
CKE
1M x 16
CELL ARRAY
(BANK #A)
Column Decoder
COMMAND
DECODER
DQ Buffer
CONTROL
SIGNAL
GENERATOR
DQ0
~
CS#
RAS#
CAS#
WE#
DQ15
COLUMN
COUNTER
MODE
REGISTER
~
A0
A9
A11
BA0
BA1
Row
Decoder
A10/AP
1M x 16
CELL ARRAY
(BANK #B)
Column Decoder
Row
Decoder
LDQM, UDQM
1M x 16
CELL ARRAY
(BANK #C)
ADDRESS
BUFFER
REFRESH
COUNTER
Row
Decoder
Column Decoder
1M x 16
CELL ARRAY
(BANK #D)
Column Decoder
Rev. 5.3
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EtronTech
EM638165
Pin Descriptions
Table 3. Pin Details of EM638165
Symbol
Type
Description
CLK
Input
Clock: CLK is driven by the system clock. All SDRAM input signals are sampled
on the positive edge of CLK. CLK also increments the internal burst counter and
controls the output registers.
CKE
Input
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. If
CKE goes low synchronously with clock (set-up and hold time same as other
inputs), the internal clock is suspended from the next clock cycle and the state of
output and burst address is frozen as long as the CKE remains low. When all
banks are in the idle state, deactivating the clock controls the entry to the Power
Down and Self Refresh modes. CKE is synchronous except after the device enters
Power Down and Self Refresh modes, where CKE becomes asynchronous until
exiting the same mode. The input buffers, including CLK, are disabled during
Power Down and Self Refresh modes, providing low standby power.
BA0,BA1
Input
Bank Activate: BA0, BA1 input select the bank for operation.
BA1
BA0
Select Bank
0
0
BANK #A
0
1
BANK #B
1
0
BANK #C
1
1
BANK #D
A0-A11
Input
Address Inputs: A0-A11 are sampled during the BankActivate command (row
address A0-A11) and Read/Write command (column address A0-A7 with A10
defining Auto Precharge) to select one location out of the 1M available in the
respective bank. During a Precharge command, A10 is sampled to determine if all
banks are to be precharged (A10 = HIGH). The address inputs also provide the
op-code during a Mode Register Set command.
CS#
Input
Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the
command decoder. All commands are masked when CS# is sampled HIGH. CS#
provides for external bank selection on systems with multiple banks. It is
considered part of the command code.
RAS#
Input
Row Address Strobe: The RAS# signal defines the operation commands in
conjunction with the CAS# and WE# signals and is latched at the positive edges of
CLK. When RAS# and CS# are asserted "LOW" and CAS# is asserted "HIGH,"
either the BankActivate command or the Precharge command is selected by the
WE# signal. When the WE# is asserted "HIGH," the BankActivate command is
selected and the bank designated by BA is turned on to the active state. When the
WE# is asserted "LOW," the Precharge command is selected and the bank
designated by BA is switched to the idle state after the precharge operation.
CAS#
Input
Column Address Strobe: The CAS# signal defines the operation commands in
conjunction with the RAS# and WE# signals and is latched at the positive edges of
CLK. When RAS# is held "HIGH" and CS# is asserted "LOW," the column access
is started by asserting CAS# "LOW." Then, the Read or Write command is
selected by asserting WE# "LOW" or "HIGH."
WE#
Input
Write Enable: The WE# signal defines the operation commands in conjunction
with the RAS# and CAS# signals and is latched at the positive edges of CLK. The
WE# input is used to select the BankActivate or Precharge command and Read or
Write command.
Rev. 5.3
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Dec. /2013
EtronTech
LDQM,
UDQM
Input
DQ0-DQ15
Input /
Output
NC/RFU
-
VDDQ
Supply
EM638165
Data Input/Output Mask: Controls output buffers in read mode and masks
Input data in write mode.
Data I/O: The DQ0-15 input and output data are synchronized with the positive
edges of CLK. The I/Os are maskable during Reads and Writes.
No Connect: These pins should be left unconnected.
DQ Power: Provide isolated power to DQs for improved noise immunity.
( 3.3V± 0.3V )
VSSQ
Supply
DQ Ground: Provide isolated ground to DQs for improved noise immunity.
(0V)
VDD
Supply
Power Supply: +3.3V ± 0.3V
VSS
Supply
Ground
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EM638165
Operation Mode
Fully synchronous operations are performed to latch the commands at the positive edges of CLK. Table 4
shows the truth table for the operation commands.
Table 4. Truth Table (Note (1), (2))
Command
State
CKEn-1 CKEn DQM BA0,1 A10 A0-9,11
Idle(3)
H
X
X
V
BankPrecharge
Any
H
X
X
V
L
PrechargeAll
Any
H
X
X
X
BankActivate
Row address
CS# RAS# CAS# WE#
L
L
H
H
X
L
L
H
L
H
X
L
L
H
L
Column
address
(A0 ~ A7)
L
H
L
L
L
H
L
L
Column
address
(A0 ~ A7)
L
H
L
H
L
H
L
H
Write
Active(3)
H
X
V
V
L
Write and AutoPrecharge
Active(3)
H
X
V
V
H
Read
Active(3)
H
X
V
V
L
Read and Autoprecharge
Active(3)
H
X
V
V
H
Mode Register Set
Idle
H
X
X
OP code
L
L
L
L
Extended Mode Register Set
Idle
H
X
X
OP code
L
L
L
L
No-Operation
Any
H
X
X
X
X
X
L
H
H
H
Active(4)
H
X
X
X
X
X
L
H
H
L
Device Deselect
Any
H
X
X
X
X
X
H
X
X
X
AutoRefresh
Idle
H
H
X
X
X
X
L
L
L
H
SelfRefresh Entry
Idle
H
L
X
X
X
X
L
L
L
H
SelfRefresh Exit
Idle
L
H
X
X
X
X
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
H
X
X
X
L
H
H
H
Burst Stop
(SelfRefresh)
Clock Suspend Mode Entry
Active
Power Down Mode Entry
Any(5)
Clock Suspend Mode Exit
Power Down Mode Exit
H
H
L
L
X
X
X
X
X
X
X
X
Active
L
H
X
X
X
X
X
X
X
X
Any
L
H
X
X
X
X
H
X
X
X
L
H
H
H
X
X
X
X
X
X
(PowerDown)
Data Write/Output Enable
Active
H
X
L
X
X
X
Data Mask/Output Disable
Active
H
X
H
X
X
X
X
X
Note: 1. V=Valid, X=Don't Care L=Low level H=High level
2. CKEn signal is input level when commands are provided.
CKEn-1 signal is input level one clock cycle before the commands are provided.
3. These are states of bank designated by BA signal.
4. Device state is 1, 2, 4, 8, and full page burst operation.
5. Power Down Mode can not enter in the burst operation.
When this command is asserted in the burst cycle, device state is clock suspend mode.
Rev. 5.3
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EtronTech
EM638165
Commands
1
BankActivate
(RAS# = "L", CAS# = "H", WE# = "H", BAs = Bank, A0-A11 = Row Address)
The BankActivate command activates the idle bank designated by the BA0, 1 signal. By latching the row
address on A0 to A11 at the time of this command, the selected row access is initiated. The read or write
operation in the same bank can occur after a time delay of tRCD(min.) from the time of bank activation. A
subsequent BankActivate command to a different row in the same bank can only be issued after the
previous active row has been precharged (refer to the following figure). The minimum time interval
between successive BankActivate commands to the same bank is defined by tRC(min.). The SDRAM has
four internal banks on the same chip and shares part of the internal circuitry to reduce chip area;
therefore it restricts the back-to-back activation of the two banks. tRRD(min.) specifies the minimum time
required between activating different banks. After this command is used, the Write command and the
Block Write command perform the no mask write operation.
T0
T1
T2
T3
Tn+3
Tn+4
Tn+5
Tn+6
CLK
ADDRESS
Bank A
Row Addr.
Bank A
Col Addr.
Bank B
Row Addr.
RAS# - CAS# delay(tRCD)
COMMAND
Bank A
Activate
NOP
NOP
Bank A
Row Addr.
RAS# - RAS# delay time(tRRD)
Bank B
Activate
R/W A with
AutoPrecharge
NOP
NOP
Bank A
Activate
RAS# - Cycle time(tRC)
AutoPrecharge
Begin
Don’t Care
Figure 4. BankActivate Command Cycle (Burst Length = n)
2
BankPrecharge command
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Bank, A10 = "L", A0-A9 and A11 = Don't care)
The BankPrecharge command precharges the bank designated by BA signal. The precharged bank is
switched from the active state to the idle state. This command can be asserted anytime after tRAS(min.) is
satisfied from the BankActivate command in the desired bank. The maximum time any bank can be
active is specified by tRAS(max.). Therefore, the precharge function must be performed in any active bank
within tRAS(max.). At the end of precharge, the precharged bank is still in the idle state and is ready to be
activated again.
3
PrechargeAll command
(RAS# = "L", CAS# = "H", WE# = "L", BAs = Don’t care, A10 = "H", A0-A9 and A11 = Don't care)
The PrechargeAll command precharges all banks simultaneously and can be issued even if all banks are
not in the active state. All banks are then switched to the idle state.
4
Read command
(RAS# = "H", CAS# = "L", WE# = "H", BAs = Bank, A10 = "L", A0-A7 = Column Address)
The Read command is used to read a burst of data on consecutive clock cycles from an active row in an
active bank. The bank must be active for at least tRCD(min.) before the Read command is issued. During
read bursts, the valid data-out element from the starting column address will be available following the
CAS latency after the issue of the Read command. Each subsequent data-out element will be valid by
the next positive clock edge (refer to the following figure). The DQs go into high-impedance at the end of
the burst unless other command is initiated. The burst length, burst sequence, and CAS latency are
determined by the mode register, which is already programmed. A full-page burst will continue until
terminated (at the end of the page it will wrap to column 0 and continue.
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EM638165
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
READ A
NOP
NOP
CAS# Latency=2
tCK2, DQ
DOUT A0
CAS# Latency=3
tCK3, DQ
NOP
NOP
NOP
NOP
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
NOP
NOP
DOUT A3
Figure 5. Burst Read Operation (Burst Length = 4, CAS# Latency = 2, 3)
The read data appears on the DQs subject to the values on the DQM inputs two clocks earlier (i.e. DQM
latency is two clocks for output buffers). A read burst without the auto precharge function may be
interrupted by a subsequent Read or Write command to the same bank or the other active bank before
the end of the burst length. It may be interrupted by a BankPrecharge/ PrechargeAll command to the
same bank too. The interrupt coming from the Read command can occur on any clock cycle following a
previous Read command (refer to the following figure).
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
READ A
READ B
NOP
CAS# Latency=2
tCK2, DQ
DOUT A0
CAS# Latency=3
tCK3, DQ
NOP
NOP
NOP
NOP
NOP
DOUT B0
DOUT B1
DOUT B2
DOUT B3
DOUT A0
DOUT B0
DOUT B1
DOUT B2
NOP
DOUT B3
Figure 6. Read Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3)
The DQM inputs are used to avoid I/O contention on the DQ pins when the interrupt comes from a Write
command. The DQMs must be asserted (HIGH) at least two clocks prior to the Write command to
suppress data-out on the DQ pins. To guarantee the DQ pins against I/O contention, a single cycle with
high-impedance on the DQ pins must occur between the last read data and the Write command (refer to
the following three figures). If the data output of the burst read occurs at the second clock of the burst
write, the DQMs must be asserted (HIGH) at least one clock prior to the Write command to avoid internal
bus contention.
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
CLK
DQM
COMMAND
NOP
NOP
Bank A
Activate
NOP
CAS# Latency=2
tCK2, DQ
NOP
READ A
WRITE A
NOP
NOP
NOP
DIN A0
DIN A1
DIN A2
DIN A3
Figure 7. Read to Write Interval (Burst Length ≥ 4, CAS# Latency = 2)
Rev. 5.3
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EtronTech
EM638165
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
DQM
COMMAND
NOP
READ A
NOP
NOP
NOP
CAS# Latency=3
tCK3, DQ
NOP
WRITE B
NOP
NOP
DIN B0
DIN B1
DIN B2
DOUT A0
Must be Hi-Z before
the Write Command
Don’t Care
Figure 8. Read to Write Interval (Burst Length ≧ 4, CAS# Latency = 3)
T1
T0
T2
T3
T4
T5
T6
T7
T8
CLK
DQM
COMMAND
NOP
NOP
READ A
NOP
NOP
WRITE B
NOP
NOP
NOP
DIN B0
DIN B1
DIN B2
DIN B3
CAS# Latency=2
tCK2, DQ
Must be Hi-Z before
the Write Command
Don’t Care
Figure 9. Read to Write Interval (Burst Length ≥ 4, CAS# Latency = 2)
A read burst without the auto precharge function may be interrupted by a BankPrecharge/ PrechargeAll
command to the same bank. The following figure shows the optimum time that BankPrecharge/
PrechargeAll command is issued in different CAS latency.
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
Bank,
Col A
ADDRESS
Bank
Row
Bank (s)
tRP
COMMAND
READ A
CAS# Latency=2
tCK2, DQ
CAS# Latency=3
tCK3, DQ
NOP
NOP
DOUT A0
NOP
Precharge
NOP
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
NOP
Activate
NOP
DOUT A3
Figure 10. Read to Precharge (CAS# Latency = 2, 3)
5 Read and AutoPrecharge command
(RAS# = "H", CAS# = "L", WE# = "H", BAs = Bank, A10 = "H", A0-A7 = Column Address)
The Read and AutoPrecharge command automatically performs the precharge operation after the read
operation. Once this command is given, any subsequent command cannot occur within a time delay of
{tRP(min.) + burst length}. At full-page burst, only the read operation is performed in this command and the
auto precharge function is ignored.
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EM638165
6 Write command
(RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "L", A0-A7 = Column Address)
The Write command is used to write a burst of data on consecutive clock cycles from an active row in an
active bank. The bank must be active for at least tRCD(min.) before the Write command is issued. During write
bursts, the first valid data-in element will be registered coincident with the Write command. Subsequent data
elements will be registered on each successive positive clock edge (refer to the following figure). The DQs
remain with high-impedance at the end of the burst unless another command is initiated. The burst length and
burst sequence are determined by the mode register, which is already programmed. A full-page burst will
continue until terminated (at the end of the page it will wrap to column 0 and continue).
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
DQ
WRITE A
NOP
NOP
NOP
NOP
NOP
DIN A0
DIN A1
DIN A2
DIN A3
don’t care
NOP
NOP
The first data element and the write
are registered on the same clock edge
Figure 11. Burst Write Operation (Burst Length = 4)
A write burst without the auto precharge function may be interrupted by a subsequent Write,
BankPrecharge/PrechargeAll, or Read command before the end of the burst length. An interrupt coming from
Write command can occur on any clock cycle following the previous Write command (refer to the following
figure).
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
DQ
WRITE A
WRITE B
NOP
NOP
NOP
DIN A0
DIN B0
DIN B1
DIN B2
DIN B3
NOP
NOP
NOP
Figure 12. Write Interrupted by a Write (Burst Length = 4)
The Read command that interrupts a write burst without auto precharge function should be issued one cycle
after the clock edge in which the last data-in element is registered. In order to avoid data contention, input
data must be removed from the DQs at least one clock cycle before the first read data appears on the outputs
(refer to the following figure). Once the Read command is registered, the data inputs will be ignored and
writes will not be executed.
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
NOP
WRITE A
READ B
CAS# Latency=2
tCK2, DQ
DIN A0
don’t care
CAS# Latency=3
tCK3, DQ
DIN A0
don’t care
NOP
don’t care
NOP
NOP
NOP
NOP
DOUT B0
DOUT B1
DOUT B2
DOUT B3
DOUT B0
DOUT B1
DOUT B2
NOP
DOUT B3
Input data must be removed from the DQ at
least one clock cycle before the Read data
appears on the outputs to avoid data contention
Figure 13. Write Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3)
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EM638165
The BankPrecharge/PrechargeAll command that interrupts a write burst without the auto precharge function
should be issued m cycles after the clock edge in which the last data-in element is registered, where m equals
tWR/tCK rounded up to the next whole number. In addition, the DQM signals must be used to mask input data,
starting with the clock edge following the last data-in element and ending with the clock edge on which the
BankPrecharge/PrechargeAll command is entered (refer to the following figure).
T1
T2
T3
T4
T5
T6
T7
T0
CLK
DQM
tRP
COMMAND
WRITE
NOP
NOP
Bank
Col n
ADDRESS
Precharge
NOP
NOP
Activate
NOP
ROW
Bank (s)
tWR
DIN
n
DQ
DIN
N+1
Don’t Care
Note: The LDQM/UDQM can remain low in this example if the length of the write burst is 1 or 2.
Figure 14. Write to Precharge
7
Write and AutoPrecharge command
(RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "H", A0-A7 = Column Address)
The Write and AutoPrecharge command performs the precharge operation automatically after the write
operation. Once this command is given, any subsequent command can not occur within a time delay of
{(burst length -1) + tWR + tRP(min.)}. At full-page burst, only the write operation is performed in this
command and the auto precharge function is ignored.
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
CLK
COMMAND
Bank A
Activate
NOP
NOP
WRITE A
Auto Precharge
NOP
NOP
NOP
NOP
NOP
Bank A
Activate
tDAL
DQ
DIN A0
tDAL=tWR+tRP
DIN A1
Begin AutoPrecharge
Bank can be reactivated at
completion of tDAL
Figure 15. Burst Write with Auto-Precharge (Burst Length = 2)
8
Mode Register Set command (RAS# = "L", CAS# = "L", WE# = "L", A0-A11 = Register Data)
The mode register stores the data for controlling the various operating modes of SDRAM. The Mode
Register Set command programs the values of CAS latency, Addressing Mode and Burst Length in the
Mode register to make SDRAM useful for a variety of different applications. The default values of the
Mode Register after power-up are undefined; therefore this command must be issued at the power-up
sequence. The state of pins A0~A9 and A11 in the same cycle is the data written to the mode register.
Two clock cycles are required to complete the write in the mode register (refer to the following figure).
The contents of the mode register can be changed using the same command and the clock cycle
requirements during operation as long as all banks are in the idle state.
Rev. 5.3
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Dec. /2013
EtronTech
EM638165
Table 5. Mode Register Bitmap
BA1 BA0
RFU*
0
A9
0
1
A11 A10
RFU*
A9
WBL
Write Burst Length
Burst
Single Bit
A8
0
1
0
A8
A7
Test Mode
A7
0
0
1
A6
A5
A4
CAS Latency
Test Mode
Normal
Vendor Use Only
Vendor Use Only
A3
BT
A3
0
1
A2
A1
A0
Burst Length
Burst Type
Sequential
Interleave
A6
0
0
0
0
1
A5
A4
CAS Latency
A2
A1
A0
Burst Length
0
0
Reserved
0
0
0
1
0
1
Reserved
0
0
1
2
1
0
2 clocks
0
1
0
4
1
1
3 clocks
0
1
1
8
0
0
Reserved
1
1
1
Full Page (Sequential)
All other Reserved
All other Reserved
*Note: RFU (Reserved for future use) should stay “0” during MRS cycle.
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
CLK
CKE
tMRD
CS#
RAS#
CAS#
WE#
BA0,1
A10
Address Key
A0-A9,
A11
DQM
DQ
tRP
Hi-Z
PrechargeAll
Mode Register
Set Command
Any
Command
Don’t Care
Figure 16. Mode Register Set Cycle
Rev. 5.3
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EtronTech
EM638165
• Burst Length Field (A2~A0)
This field specifies the data length of column access using the A2~A0 pins and selects the Burst Length
to be 2, 4, 8, or full page.
Table 6. Burst Length Field
A2
A1
A0
Burst Length
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
8
1
0
0
Reserved
1
0
1
Reserved
1
1
0
Reserved
1
1
1
Full Page
• Burst Type Field (A3)
The Burst Type can be one of two modes, Interleave Mode or Sequential Mode.
Table 7. Burst Type Field
A3
Burst Type
0
Sequential
1
Interleave
• Burst Definition, Addressing Sequence of Sequential and Interleave Mode
Table 8. Burst Definition
Burst Length
2
4
8
Full page
Rev. 5.3
Start Address
A2
A1
A0
X
X
0
X
X
1
X
0
0
X
0
1
X
1
0
X
1
1
0
0
0
0
0
1
0
1
0
0
1
1
1
0
0
1
0
1
1
1
0
1
1
1
location = 0-255
Sequential
0, 1
1, 0
0, 1, 2, 3
1, 2, 3, 0
2, 3, 0, 1
3, 0, 1, 2
0, 1, 2, 3, 4, 5, 6, 7
1, 2, 3, 4, 5, 6, 7, 0
2, 3, 4, 5, 6, 7, 0, 1
3, 4, 5, 6, 7, 0, 1, 2
4, 5, 6, 7, 0, 1, 2, 3
5, 6, 7, 0, 1, 2, 3, 4
6, 7, 0, 1, 2, 3, 4, 5
7, 0, 1, 2, 3, 4, 5, 6
n, n+1, n+2, n+3, …255, 0,
1, 2, … n-1, n, …
13
Interleave
0, 1
1, 0
0, 1, 2, 3
1, 0, 3, 2
2, 3, 0, 1
3, 2, 1, 0
0, 1, 2, 3, 4, 5, 6, 7
1, 0, 3, 2, 5, 4, 7, 6
2, 3, 0, 1, 6, 7, 4, 5
3, 2, 1, 0, 7, 6, 5, 4
4, 5, 6, 7, 0, 1, 2, 3
5, 4, 7, 6, 1, 0, 3, 2
6, 7, 4, 5, 2, 3, 0, 1
7, 6, 5, 4, 3, 2, 1, 0
Not Support
Dec. /2013
EtronTech
EM638165
• CAS Latency Field (A6~A4)
This field specifies the number of clock cycles from the assertion of the Read command to the first read
whole value satisfying the following formula must be programmed into this field.
tCAC(min) ≤ CAS Latency X tCK
Table 9. CAS latency Field
A6
A5
A4
CAS Latency
0
0
0
Reserved
0
0
1
Reserved
0
1
0
2 clocks
0
1
1
3 clocks
1
X
X
Reserved
• Test Mode field (A8~A7)
These two bits are used to enter the test mode and must be programmed to "00" in normal operation.
Table 10. Test Mode Field
A8
A7
Test Mode
0
0
Normal mode
0
1
Vendor Use Only
1
X
Vendor Use Only
• Write Burst Length (A9)
This bit is used to select the write burst mode. When the A9 bit is "0", the Burst-Read-Burst-Write mode
is selected. When the A9 bit is "1", the Burst-Read-Single-Write mode is selected.
Table 11. Write Burst Length
A9
Write Burst Mode
0
Burst-Read-Burst-Write
1
Burst-Read-Single-Write
Note: A10 and BA0, 1 should stay “L” during mode set cycle.
• Extended Mode Register Bitmap
Table 12.Extended Mode Register Bitmap
BA1 BA0 A11 A10
0
1
0
0
A1
0
1
Rev. 5.3
A9
0
A8
0
A7
0
A6
0
A5
0
A4
0
A3
0
A2
0
A1
DS
A0
0
Address Field
Extended Mode Register
Drive Strength
Full
Weak
14
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EtronTech
9
EM638165
No-Operation command
(RAS# = "H", CAS# = "H", WE# = "H")
The No-Operation command is used to perform a NOP to the SDRAM which is selected (CS# is Low).
This prevents unwanted commands from being registered during idle or wait states.
10
Burst Stop command
(RAS# = "H", CAS# = "H", WE# = "L")
The Burst Stop command is used to terminate either fixed-length or full-page bursts. This command is
only effective in a read/write burst without the auto precharge function. The terminated read burst ends
after a delay equal to the CAS latency (refer to the following figure). The termination of a write burst is
shown in the following figure.
CLK
COMMAND
T0
READ A
T1
NOP
CAS# Latency=2
tCK2, DQ
T2
T3
NOP
NOP
T4
Burst
Stop
T5
NOP
T6
T7
NOP
T8
NOP
NOP
The burst ends after a delay equal to the CAS# Latency
DOUT A0
CAS# Latency=3
tCK3, DQ
DOUT A1
DOUT A2
DOUT A3
DOUT A0
DOUT A1
DOUT A2
DOUT A3
Figure 17. Termination of a Burst Read Operation (Burst Length ＞ 4, CAS# Latency = 2, 3)
T0
T1
T2
T3
T4
T5
T6
T7
T8
CLK
COMMAND
DQ
NOP
WRITE A
NOP
NOP
Burst
Stop
DIN A0
DIN A1
DIN A2
don’t care
NOP
NOP
NOP
NOP
Figure 18. Termination of a Burst Write Operation (Burst Length = X)
11 Device Deselect command (CS# = "H")
The Device Deselect command disables the command decoder so that the RAS#, CAS#, WE# and
Address inputs are ignored, regardless of whether the CLK is enabled. This command is similar to the No
Operation command.
12
AutoRefresh command
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "H", A0-A11 = Don't care)
The AutoRefresh command is used during normal operation of the SDRAM and is analogous to CAS#before-RAS# (CBR) Refresh in conventional DRAMs. This command is non-persistent, so it must be
issued each time a refresh is required. The addressing is generated by the internal refresh controller.
This makes the address bits a "don't care" during an AutoRefresh command. The internal refresh counter
increments automatically on every auto refresh cycle to all of the rows. The refresh operation must be
performed 4096 times within 64ms. The time required to complete the auto refresh operation is specified
by tRC(min.). To provide the AutoRefresh command, all banks need to be in the idle state and the device
must not be in power down mode (CKE is high in the previous cycle). This command must be followed by
NOPs until the auto refresh operation is completed. The precharge time requirement, tRP(min), must be
met before successive auto refresh operations are performed.
Rev. 5.3
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EtronTech
EM638165
13 SelfRefresh Entry command
(RAS# = "L", CAS# = "L", WE# = "H", CKE = "L", A0-A11 = Don't care)
The SelfRefresh is another refresh mode available in the SDRAM. It is the preferred refresh mode for
data retention and low power operation. Once the SelfRefresh command is registered, all the inputs to
the SDRAM become "don't care" with the exception of CKE, which must remain LOW. The refresh
addressing and timing is internally generated to reduce power consumption. The SDRAM may remain in
SelfRefresh mode for an indefinite period. The SelfRefresh mode is exited by restarting the external clock
and then asserting HIGH on CKE (SelfRefresh Exit command).
14 SelfRefresh Exit command
This command is used to exit from the SelfRefresh mode. Once this command is registered, NOP or
Device Deselect commands must be issued for tXSR(min.) because time is required for the completion of
any bank currently being internally refreshed. If auto refresh cycles in bursts are performed during normal
operation, a burst of 4096 auto refresh cycles should be completed just prior to entering and just after
exiting the SelfRefresh mode.
15
Clock Suspend Mode Entry / PowerDown Mode Entry command (CKE = "L")
When the SDRAM is operating the burst cycle, the internal CLK is suspended (masked) from the
subsequent cycle by issuing this command (asserting CKE "LOW"). The device operation is held intact
while CLK is suspended. On the other hand, when all banks are in the idle state, this command performs
entry into the PowerDown mode. All input and output buffers (except the CKE buffer) are turned off in the
PowerDown mode. The device may not remain in the Clock Suspend or PowerDown state longer than
the refresh period (64ms) since the command does not perform any refresh operations.
16
Clock Suspend Mode Exit / PowerDown Mode Exit command (CKE= "H")
When the internal CLK has been suspended, the operation of the internal CLK is reinitiated from the
subsequent cycle by providing this command (asserting CKE "HIGH", the command should be NOP or
deselect). When the device is in the PowerDown mode, the device exits this mode and all disabled
buffers are turned on to the active state. tPDE (min.) is required when the device exits from the
PowerDown mode. Any subsequent commands can be issued after one clock cycle from the end of this
command.
17
Data Write / Output Enable, Data Mask / Output Disable command (DQM = "L", "H")
During a write cycle, the DQM signal functions as a Data Mask and can control every word of the input
data. During a read cycle, the DQM functions as the controller of output buffers. DQM is also used for
device selection, byte selection and bus control in a memory system.
Rev. 5.3
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EtronTech
EM638165
Table 13. Absolute Maximum Rating
Symbol
Item
- 5/6/7
Unit Note
VIN, VOUT
Input, Output Voltage
- 1.0 ~ 4.6
V
1
VDD, VDDQ
Power Supply Voltage
-1.0 ~ 4.6
V
1
TA
Ambient Temperature
0 ~ 70
°C
1
TSTG
Storage Temperature
- 55 ~ 150
°C
1
PD
Power Dissipation
1
W
1
IOS
Short Circuit Output Current
50
mA
1
Table 14. Recommended D.C. Operating Conditions (TA = 0~70°C)
Symbol
Parameter
Min.
Typ.
Max.
Unit Note
VDD
Power Supply Voltage
3.0
3.3
3.6
V
2
VDDQ
Power Supply Voltage(for I/O Buffer)
3.0
3.3
3.6
V
2
VIH
LVTTL Input High Voltage
2.0
－
VDDQ+0.3
V
2
VIL
LVTTL Input Low Voltage
- 0.3
－
0.8
V
2
IIL
Input Leakage Current
( 0V ≤ VIN ≤ VDD, All other pins not under test = 0V )
- 10
－
10
µA
IOL
Output Leakage Current
Output disable, 0V ≤ VOUT ≤ VDDQ)
- 10
－
10
µA
VOH
LVTTL Output "H" Level Voltage
( IOUT = -2mA )
2.4
－
－
V
VOL
LVTTL Output "L" Level Voltage
( IOUT = 2mA )
－
－
0.4
V
Table 15. Capacitance (VDD = 3.3V, f = 1MHz, TA = 25°C)
Symbol
CI
CI/O
Parameter
Min.
Max.
Unit
Input Capacitance
1
4
pF
Input/Output Capacitance
2
5
pF
Note: These parameters are periodically sampled and are not 100% tested.
Rev. 5.3
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Dec. /2013
EtronTech
EM638165
Table 16. D.C. Characteristics (VDD = 3.3V ± 0.3V, TA = 0~70°C)
Description/Test condition
Operating Current
tRC ≥ tRC(min), Outputs Open
One bank active
Precharge Standby Current in non-power down mode
tCK = 15ns, CS# ≥ VIH(min), CKE ≥ VIH
Input signals are changed every 2clks
Precharge Standby Current in non-power down mode
tCK = ∞, CLK ≤ VIL(max), CKE ≥ VIH
Precharge Standby Current in power down mode
tCK = 15ns, CKE ≤ VIL(max)
Precharge Standby Current in power down mode
tCK = ∞, CKE ≤ VIL(max)
Active Standby Current in non-power down mode
tCK = 15ns, CKE ≥ VIH(min), CS# ≥ VIH(min)
Input signals are changed every 2clks
Active Standby Current in non-power down mode
CKE ≥ VIH(min), CLK ≤ VIL(max), tCK = ∞
Operating Current (Burst mode)
tCK =tCK(min), Outputs Open, Multi-bank interleave
Refresh Current
tRC ≥ tRC(min)
Self Refresh Current
CKE ≤ 0.2V ; for other inputs VIH≧VDD - 0.2V, VIL ≤ 0.2V
Rev. 5.3
-5
-6
Max.
-7
IDD1
55
50
45
IDD2N
20
20
20
IDD2NS
12
12
12
IDD2P
2
2
2
IDD2PS
2
2
2
IDD3N
30
30
30
IDD3NS
25
25
25
IDD4
80
75
70
3, 4
IDD5
65
60
55
3
IDD6
2
2
2
Symbol
18
Unit Note
3
mA
Dec. /2013
EtronTech
EM638165
Table 17. Electrical Characteristics and Recommended A.C. Operating Conditions
(VDD = 3.3V±0.3V, TA = 0~70°C) (Note: 5, 6, 7, 8)
Symbol
-5
A.C. Parameter
-6
-7
Min.
Max.
Min.
Max.
Min.
Max.
55
-
60
-
63
-
15
-
18
-
21
-
15
-
18
-
21
-
10
-
12
-
14
-
40
100K
42
100K
42
100K
2
-
2
-
2
-
1
-
1
-
1
-
CL* = 2
-
-
9
-
10
-
CL* = 3
5
-
6
-
7
-
Unit Note
tWR
Row cycle time
(same bank)
RAS# to CAS# delay
(same bank)
Precharge to refresh/row activate
command (same bank)
Row activate to row activate delay
(different banks)
Row activate to precharge time
(same bank)
Write recovery time
tCCD
CAS# to CAS# Delay time
tCK
Clock cycle time
tCH
Clock high time
2
-
2.5
-
2.5
-
10
tCL
Clock low time
2
-
2.5
-
2.5
-
10
Access time from CLK
(positive edge)
CL* = 2
-
-
-
6
-
6
10
tAC
CL* = 3
-
4.5
-
5.4
-
5.4
tOH
Data output hold time
2
-
2.5
-
2.5
-
tLZ
Data output low impedance
0
-
0
-
0
-
tHZ
Data output high impedance
-
4.5
-
5.4
-
5.4
8
tIS
Data/Address/Control Input set-up time
1.5
-
1.5
-
1.5
-
10
tIH
Data/Address/Control Input hold time
0.8
-
0.8
-
0.8
-
10
tPDE
Power Down Exit set-up time
tIS+tCK
-
tIS+tCK
-
tIS+tCK
-
tMRD
Mode Register Set Command Cycle Time
2
-
2
-
2
-
tCK
tREFI
Average Refresh Interval Time
-
15.6
-
15.6
-
15.6
µs
tXSR
Exit Self-Refresh to any Command
tRC+tIS
-
tRC+tIS
-
tRC+tIS
-
ns
tRC
tRCD
tRP
tRRD
tRAS
ns
tCK
9
ns
9
* CL is CAS Latency
Note:
1. Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device.
2. All voltages are referenced to VSS. VIH (Max) = 4.6V for pulse width ≦3ns. VIL(Min) = -1.0V for pulse width
≦ 3ns.
3. These parameters depend on the cycle rate and these values are measured by the cycle rate under the
minimum value of tCK and tRC. Input signals are changed one time during every 2 tCK.
4. These parameters depend on the output loading. Specified values are obtained with the output open.
5. Power-up sequence is described in Note 11.
6. A.C. Test Conditions
Rev. 5.3
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EM638165
Table 18. LVTTL Interface
Reference Level of Output Signals
1.4V / 1.4V
Output Load
Reference to the Under Output Load (B)
Input Signal Levels
2.4V / 0.4V
Transition Time (Rise and Fall) of Input Signals
1ns
Reference Level of Input Signals
1.4V
1.4V
3.3V
50Ω
1.2KΩ
Output
Output
30pF
Z0=50Ω
870Ω
Figure 19.1 LVTTL D.C. Test Load (A)
30pF
Figure 19.2 LVTTL A.C. Test Load (B)
7. Transition times are measured between VIH and VIL. Transition (rise and fall) of input signals are in a fixed
slope (1 ns).
8. tHZ defines the time in which the outputs achieve the open circuit condition and are not at reference levels.
9. If clock rising time is longer than 1 ns, ( tR / 2 -0.5) ns should be added to the parameter.
10. Assumed input rise and fall time tT ( tR & tF ) = 1 ns
If tR or tF is longer than 1 ns, transient time compensation should be considered, i.e., [(tr + tf)/2 - 1] ns should
be added to the parameter.
11. Power up Sequence
Power up must be performed in the following sequence.
1) Power must be applied to VDD and VDDQ(simultaneously) when CKE= “L”, DQM= “H” and all input signals
are held "NOP" state .
2) Start clock and maintain stable condition for minimum 200 µs, then bring CKE= “H” and, it is
recommended that DQM is held "HIGH" (VDD levels) to ensure DQ output is in high impedance.
3) All banks must be precharged.
4) Extended Mode Register set command and Mode Register Set command must be asserted to initialize
the Mode register.
5) A minimum of 2 Auto-Refresh dummy cycles must be required to stabilize the internal circuitry of the
device.
* The Auto Refresh command can be issue before or after Mode Register Set command
Rev. 5.3
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EM638165
Timing Waveforms
Figure 20. AC Parameters for Write Timing (Burst Length=4)
T0
CLK
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tCH
tCL
CKE
tIS
tIS
Begin Auto
Precharge Bank A
tIH
Begin Auto
Precharge Bank B
CS#
RAS#
CAS#
WE#
BA0,1
tIH
A10
RAx
RBx
RAy
tIS
A0-A9,
A11
RAx
CAx
RBx
CBx
RAy
CAy
DQM
tRCD
tDAL
tIS
tRC
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Ax1
Write with
Auto Precharge
Command
Bank A
Ax2
Activate
Command
Bank B
tWR
tIH
Ax3
Bx0
Bx1
Write with
Auto Precharge
Command
Bank B
Bx2
Bx3
Ay0
Activate
Command
Bank A
Write
Command
Bank A
Ay1
Ay2
Ay3
Precharge
Command
Bank A
Don’t Care
Rev. 5.3
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Dec. /2013
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EM638165
Figure 21. AC Parameters for Read Timing (Burst Length=2, CAS# Latency=2)
T0
CLK
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16
tCH tCL
CKE
tIS
Begin Auto
Precharge Bank B
tIS
tIH
tIH
CS#
RAS#
CAS#
WE#
BA0,1
tIH
A10
RAx
RBx
RAy
tIS
A0-A9,
A11
RAx
CAx
RBx
CBx
RAy
tRRD
tRAS
DQM
Hi-Z
tRP
tHZ
tLZ
DQ
tRC
tAC
tRCD
Ax0
Ax1
Bx0
tHZ
tOH
Activate
Command
Bank A
Read
Command
Bank A
Bx1
Read with
Precharge
Auto Precharge Command
Command
Bank A
Bank B
Activate
Command
Bank B
Activate
Command
Bank A
Don’t Care
Rev. 5.3
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Dec. /2013
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EM638165
Figure 22. Auto Refresh (Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
tRC
tRC
tRP
CAx
tRCD
DQM
DQ
Ax0
Precharge All
Command
Auto Refresh
Command
Auto Refresh
Command
Activate
Command
Bank A
Ax1
Read
Command
Bank A
Don’t Care
Rev. 5.3
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Dec. /2013
EtronTech
EM638165
Figure 23. Power on Sequence and Auto Refresh
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High Level
Is reguired
Minimum for 2 Refresh Cycles are required
CS#
RAS#
CAS#
WE#
BA0,1
BA0=H
BA1=L
BA0=L
BA1=L
A10
Address Key
A0-A9,
A11
DQM
DQ
tRP
tMRD
tMRD
Hi-Z
Precharge All
Command
Inputs must be
Stable for
200µs
Mode Register
Extended
Mode Register Set Command
Set Command
1st Auto Refresh(*)
Command
2nd Auto Refresh(*)
Command
Any
Command
Don’t Care
Note(*): The Auto Refresh command can be issue before or after Mode Register Set command
Rev. 5.3
24
Dec. /2013
EtronTech
EM638165
Figure 24. Self Refresh Entry & Exit Cycle
T0
T1 T2 T3 T4
CLK
*Note 1
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19
*Note 2
CKE
tXSR
*Note 5
*Note 3,4
*Note 8
tPDE
tIS tIH
*Note 6
tIS
CS#
*Note 7
RAS#
*Note 9
CAS#
WE#
BA0,1
A10
A0-A9,
A11
DQM
DQ
Hi-Z
Hi-Z
Self Refresh Exit
Self Refresh Entry
Auto Refresh
Don’t Care
Note: To Enter SelfRefresh Mode
1. CS#, RAS# & CAS# with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don't care except for CKE.
3. The device remains in SelfRefresh mode as long as CKE stays "low".
4. Once the device enters SelfRefresh mode, minimum tRAS is required before exit from SelfRefresh.
5.
6.
7.
8.
9.
To Exit SelfRefresh Mode
System clock restart and be stable before returning CKE high.
Enable CKE and CKE should be set high for valid setup time and hold time.
CS# starts from high.
Minimum tXSR is required after CKE going high to complete SelfRefresh exit.
4096 cycles of burst AutoRefresh is required before SelfRefresh entry and after SelfRefresh exit if the
system uses burst refresh.
Rev. 5.3
25
Dec. /2013
EtronTech
EM638165
Figure 25.1. Clock Suspension During Burst Read (Using CKE)
(Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Clock Suspend
1 Cycle
Ax2
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
Don’t Care
Rev. 5.3
26
Dec. /2013
EtronTech
EM638165
Figure 25.2. Clock Suspension During Burst Read (Using CKE)
(Burst Length=4, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Ax2
Clock Suspend
1 Cycle
Clock Suspend
2 Cycles
Ax3
Clock Suspend
3 Cycles
Don’t Care
Rev. 5.3
27
Dec. /2013
EtronTech
EM638165
Figure 26. Clock Suspension During Burst Write (Using CKE)
(Burst Length=4)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
Hi-Z
DAx0
Activate
Command
Bank A
Rev. 5.3
DAx1
Clock Suspend
1 Cycle
Write
Command
Bank A
DAx2
DAx3
Clock Suspend
3 Cycles
Clock Suspend
2 Cycles
Don’t Care
28
Dec. /2013
EtronTech
EM638165
Figure 27. Power Down Mode and Clock Suspension (Burst Length=4, CAS# Latency=2)
T0
T1
CLK
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
tIH tIS
tPDE
CKE
Valid
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
DQM
DQ
tHZ
Hi-Z
Ax0
ACTIVE
Activate
Read
STANDBY
Command
Command
Bank A
Bank A
Power Down
Power Down
Mode
Exit
Mode Entry
Rev. 5.3
Ax1
Ax2
Clock Suspension
Start
Ax3
Clock Suspension
End
Precharge
Command
Bank A
Power Down
Mode Entry
29
PRECHARGE
STANDBY
Power Down
Mode Exit
Any
Command
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 28.1. Random Column Read (Page within same Bank)
(Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAw
A0-A9,
A11
RAw
RAz
CAw
CAx
CAy
RAz
CAz
DQM
DQ
Hi-Z
Aw0
Activate
Command
Bank A
Read
Command
Bank A
Aw1
Aw2
Aw3
Read
Command
Bank A
Ax0
Ax1
Read
Command
Bank A
Ay0
Ay1
Ay2
Ay3
Precharge
Command
Bank A
Az0
Activate
Command
Bank A
Read
Command
Bank A
Don’t Care
Rev. 5.3
30
Dec. /2013
EtronTech
EM638165
Figure 28.2. Random Column Read (Page within same Bank)
(Burst Length=4, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAw
A0-A9,
A11
RAw
RAz
CAw
CAx
CAy
RAz
CAz
DQM
DQ
Hi-Z
Aw0
Activate
Command
Bank A
Read
Command
Bank A
Aw1
Aw2
Read
Command
Bank A
Aw3
Ax0
Read
Command
Bank A
Ax1
Ay0
Ay1
Ay2
Precharge
Command
Bank A
Ay3
Activate
Command
Bank A
Read
Command
Bank A
Don’t Care
Rev. 5.3
31
Dec. /2013
EtronTech
EM638165
Figure 29. Random Column Write (Page within same Bank)
(Burst Length=4)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBw
A0-A9,
A11
RBw
RBz
CBw
CBx
CBy
RBz
CBz
DQM
DQ
Hi-Z
DBw0 DBw1 DBw2 DBw3 DBx0
Activate
Command
Bank B
Write
Command
Bank B
DBx1
Write
Command
Bank B
DBy0 DBy1 DBy2
Write
Command
Bank B
DBy3
DBz0
Precharge
Command
Bank B
Activate
Command
Bank B
DBz1
Write
Command
Bank B
Don’t Care
Rev. 5.3
32
Dec. /2013
EtronTech
EM638165
Figure 30.1. Random Row Read (Interleaving Banks)
(Burst Length=8, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBx
A0-A9,
A11
RBx
CBx
Hi-Z
Activate
Command
Bank B
Rev. 5.3
RBy
RAx
CAx
RBy
tAC
tRCD
DQM
DQ
RAx
tRP
Bx0
Read
Command
Bank B
CBy
Bx1
Bx2
Bx3
Bx4
Bx5
Activate
Command
Bank A
33
Bx6
Bx7
Ax0
Read
Command
Bank A
Precharge
Command
Bank B
Ax1
Ax2
Ax3
Activate
Command
Bank B
Ax4
Ax5
Ax6
Ax7
Read
Command
Bank B
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 30.2. Random Row Read (Interleaving Banks)
(Burst Length=8, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBx
A0-A9,
A11
RBx
CBx
Hi-Z
Activate
Command
Bank B
RBy
RAx
CAx
RBy
tAC
tRCD
DQM
DQ
RAx
tRP
Bx0
Read
Command
Bank B
CBy
Bx1
Bx2
Bx3
Bx4
Activate
Command
Bank A
Bx5
Bx6
Read
Command
Bank A
Bx7
Ax0
Precharge
Command
Bank B
Ax1
Ax2
Ax3
Activate
Command
Bank B
Ax4
Ax5
Ax6
Read
Command
Bank B
Ax7
By0
Precharge
Command
Bank A
Don’t Care
Rev. 5.3
34
Dec. /2013
EtronTech
EM638165
Figure 31. Random Row Write (Interleaving Banks)
(Burst Length=8)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
RAy
RBx
CBx
tRCD
DQM
DQ
RBx
Hi-Z
Activate
Command
Bank A
tWR*
DAx0
DAx1
Write
Command
Bank A
DAx2 DAx3
DAx4
DAx5 DAx6
DAx7
Activate
Command
Bank B
DBx0
CAy
tRP
DBx1 DBx2 DBx3
Write
Command
Bank B
Precharge
Command
Bank A
tWR*
DBx4
DBx5 DBx6
Activate
Command
Bank A
DBx7
DAy0
DAy1 DAy2
Write
Command
Bank A
DAy3
Precharge
Command
Bank B
Don’t Care
*tWR>tWR (min.)
Rev. 5.3
RAy
35
Dec. /2013
EtronTech
EM638165
Figure 32.1. Read and Write Cycle (Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
DQM
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Ax1
Ax2
Ax3
DAy0 DAy1
Read
Command
Bank A
Write
Command
Bank A
DAy3
The Write Data
is Masked with a
Zero Clock
Latency
Az0
Read
Command
Bank A
Az1
Az3
The Read Data
is Masked with a
Two Clock
Latency
Don’t Care
Rev. 5.3
36
Dec. /2013
EtronTech
EM638165
Figure 32.2. Read and Write Cycle (Burst Length=4, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
DQM
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev. 5.3
Ax1
Ax2
Ax3
Read
Command
Bank A
DAy0 DAy1
Write
Command
Bank A
37
DAy3
The Write Data
is Masked with a
Zero Clock
Read
Latency
Command
Bank A
Az0
Az1
Az3
The Read Data
is Masked with a
Two Clock
Latency
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 33.1. Interleaving Column Read Cycle (Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
T5 T6
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAy
RBx
CBw
CBx
Ax3
Bw0
CBy
CAy
CBz
tRCD
DQM
tAC
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Activate
Command
Bank B
Ax2
Read
Command
Bank B
Bw1
Read
Command
Bank B
Bx0
Bx1
Read
Command
Bank B
By0
By1
Read
Command
Bank A
Ay0
Ay1
Read
Command
Bank B
Bz0
Bz1
Precharge
Command
Bank A
Bz2
Bz3
Precharge
Command
Bank B
Don’t Care
Rev. 5.3
38
Dec. /2013
EtronTech
EM638165
Figure 33.2. Interleaved Column Read Cycle (Burst Length=4, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAx
RBx
CBx
CBy
CBz
CAy
tRCD
DQM
tAC
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev. 5.3
Read
Command
Bank A
Activate
Command
Bank B
Ax1
Ax2
Read
Command
Bank B
Ax3
Bx0
Read
Command
Bank B
Bx1
By0
Read
Command
Bank B
By1
Bz0
Read
Command
Bank A
Bz1
Ay0
Precharge
Command
Bank B
Ay1
Ay2
Ay3
Precharge
Command
Bank A
Don’t Care
39
Dec. /2013
EtronTech
EM638165
Figure 34. Interleaved Column Write Cycle (Burst Length=4)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBw
CAx
RBw
CBw
CBx
CBy
CAy
CBz
tWR
tRCD
tWR
DQM
tRRD>tRRD (min)
DQ
Hi-Z
DAx0
Activate
Command
Bank A
Rev. 5.3
DAx1
DAx2 DAx3 DBw0 DBw1 DBx0 DBx1 DBy0
Write
Command
Bank A
Activate
Command
Bank B
Write
Command
Bank B
Write
Command
Bank B
40
DBy1
Write
Command
Bank B
DAy0 DAy1 DBz0
Write
Command
Bank A
DBz1
DBz2
Write
Command
Bank B
Precharge
Command
Bank A
DBz3
Precharge
Command
Bank B
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 35.1. Auto Precharge after Read Burst (Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank B
High
Begin Auto
Precharge
Bank A
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBx
CAx
RBy
RBx
CBx
CAy
RBy
CBy
RAz
tRP
DQM
DQ
RAz
Hi-Z
Activate
Command
Bank A
Ax0
Read
Command
Bank A
Ax1
Activate
Command
Bank B
Ax2
Ax3
Bx0
Read with
Auto Precharge
Command
Bank B
Bx1
Bx2
Bx3
Read with
Auto precharge
Command
Bank A
Ay0
Ay1
Ay2
Activate
Command
Bank B
Ay3
By0
By1
By2
Read with
Activate
Auto Precharge Command
Command
Bank A
Bank B
Don’t Care
Rev. 5.3
41
Dec. /2013
EtronTech
EM638165
Figure 35.2. Auto Precharge after Read Burst (Burst Length=4, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
CAy
RBy
CBy
tRP
DQM
DQ
Hi-Z
Activate
Command
Bank A
Rev. 5.3
Ax0
Read
Command
Bank A
Activate
Command
Bank B
Ax1
Ax2
Ax3
Bx0
Read with
Auto Precharge
Command
Bank B
Bx1
Bx2
Read with
Auto Precharge
Command
Bank A
Bx3
Ay0
Ay1
Activate
Command
Bank B
Ay2
Ay3
By0
By1
By2
Read with
Auto Precharge
Command
Bank B
Don’t Care
42
Dec. /2013
EtronTech
EM638165
Figure 36. Auto Precharge after Write Burst (Burst Length=4)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
CAy
RBy
CBy
tDAL
DQM
DQ
Hi-Z
Activate
Command
Bank A
Rev. 5.3
DAx0 DAx1
DAx2
Write
Command
Bank A
Activate
Command
Bank B
DAx3
DBx0 DBx1 DBx2
DBx3
Write with
Auto Precharge
Command
Bank B
DAy0 DAy1 DAy2
Write with
Auto Precharge
Command
Bank A
DAy3
DBy0 DBy1 DBy2
Activate
Command
Bank B
DBy3
Write with
Auto Precharge
Command
Bank B
Don’t Care
43
Dec. /2013
EtronTech
EM638165
Figure 37.1. Full Page Read Cycle (Burst Length=Full Page, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
tRP
DQM
DQ
Hi-Z
Activate
Command
Bank A
Ax
Read
Command
Bank A
Ax+1
Ax+2
Ax-2
Ax-1
Ax
Ax+1
Bx
Bx+1
Bx+2
Bx+3
The burst counter wraps
Activate
Read
Command from the highest order
Command
page address back to zero Bank B
Bank B
during this time interval
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
Bursting beginning with the starting address
Rev. 5.3
44
Bx+4
Bx+5
Bx+6
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 37.2. Full Page Read Cycle (Burst Length=Full Page, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
tRP
DQM
DQ
Hi-Z
Activate
Command
Bank A
Ax
Read
Command
Bank A
Activate
Command
Bank B
Ax+1
Ax+2
Ax-2
Ax-1
Ax
Ax+1
Bx
Bx+1
Bx+2
Read
Command
Bank B
The burst counter wraps
from the highest order
page address back to zero
during this time interval
Bx+3
Bx+4
Bx+5
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
Bursting beginning with the starting address
Rev. 5.3
45
Dec. /2013
EtronTech
EM638165
Figure 38. Full Page Write Cycle (Burst Length=Full Page)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RBy
RBx
CAx
RBx
CBx
RBy
DQM
Data is ignored
DQ
Hi-Z
Activate
Command
Bank A
Rev. 5.3
DAx
DAx+1
Write
Command
Bank A
DAx+2
DAx+3
DAx-1
DAx
DAx+1
Activate
Command
Bank B
The burst counter wraps
from the highest order
page address back to zero
during this time interval
DBx
DBx+1
DBx+2
DBx+3
DBx+4
DBx+5
Write
Command
Bank B
Full Page burst operation does not
terminate when the burst length is satisfied;
the burst counter increments and continues
bursting beginning with the starting address
46
Precharge
Command
Bank B
Burst Stop
Command
Activate
Command
Bank B
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 39. Byte Read and Write Operation (Burst Length=4, CAS# Latency=2)
T0
T1 T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
CAx
CAy
CAz
LDQM
UDQM
DQ0-DQ7
Ax0
DQ8-DQ15
Activate
Command
Bank A
Read
Command
Bank A
Ax1
Ax2
Ax1
Ax2
Upper Byte
is masked
DAy1
Ax3
DAy0
Lower Byte
is masked
DAy1
Write
Command
Bank A
Day2
DAy3
Upper Byte
is masked
Az0
Read
Command
Bank A
Az1
Az2
Az1
Az2
Lower Byte
is masked
Az3
Lower Byte
is masked
Don’t Care
Rev. 5.3
47
Dec. /2013
EtronTech
EM638165
Figure 40. Random Row Read (Interleaving Banks)
(Burst Length=4, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
Begin Auto
Precharge
Bank B
Begin Auto
Precharge
Bank A
Begin Auto
Precharge
Bank B
High
Begin Auto
Precharge
Bank A
CS#
RAS#
CAS#
WE#
BA0,1
A10
RBu
A0-A9,
A11
RBu
RAu
CBu
RAv
RBv
RAu
CAu
RBv
CBv
tRP
RBw
RAv
CAv
RBw
tRP
tRP
DQM
DQ
Bu0
Activate
Command
Bank B
Rev. 5.3
Activate
Command
Bank A
Read
Bank B
with Auto
Precharge
Bu1
Bu2
Bu3
Read
Bank A
with Auto
Precharge
Au0
Au1
Au2
Activate
Command
Bank B
48
Au3
Bv0
Activate
Command
Bank A
Read
Bank B
with Auto
Precharge
Bv1
Bv2
Bv3
Read
Bank A
with Auto
Precharge
Av0
Av1
Av2
Av3
Activate
Command
Bank B
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 41. Full Page Random Column Read (Burst Length=Full Page, CAS# Latency=2)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
RBx
A0-A9,
A11
RAx
RBx
RBw
CAx
CBx
CBy
CAy
CAz
CBz
RBw
tRP
DQM
tRRD
DQ
Hi-Z
Ax0
Activate
Command
Bank A
Rev. 5.3
tRCD
Ax1
Bx0
Activate
Read
Command
Command
Bank B
Bank B
Read
Read
Command
Command
Bank A
Bank A
Ay0
Ay1
Read
Command
Bank B
By0
By1
Read
Command
Bank A
Az0
Az1
Az2
Read
Command
Bank B
Bz0
Bz1
Bz2
Precharge
Activate
Command Bank B
Command
(Precharge Temination) Bank B
Don’t Care
49
Dec. /2013
EtronTech
EM638165
Figure 42. Full Page Random Column Write (Burst Length=Full Page)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
RBx
A0-A9,
A11
RAx
RBx
RBw
CAx
CBx
CBy
CAy
CAz
CBz
RBw
tWR
tRP
DQM
tRRD
DQ
Hi-Z
DAx0 DAx1
Activate
Command
Bank A
Rev. 5.3
tRCD
Activate
Command
Bank B
Write
Command
Bank A
DBx0
DAy0
DAy1 DBy0 DBy1
Write
Command
Bank B
Write
Command
Bank A
Write
Command
Bank B
DAz0
DAz1
Write
Command
Bank A
DAz2
DBz0
DBz1
Write
Command
Bank B
DBz2
Precharge
Activate
Command Bank B
Command
(Precharge Temination) Bank B
Write Data
are masked
50
Don’t Care
Dec. /2013
EtronTech
EM638165
Figure 43. Precharge Termination of a Burst
(Burst Length=4, 8 or Full Page, CAS# Latency=3)
T0
T1
T2 T3 T4
T5 T6
T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22
CLK
CKE
High
CS#
RAS#
CAS#
WE#
BA0,1
A10
RAx
A0-A9,
A11
RAx
RAy
CAx
RAz
RAy
tWR
CAy
RAz
tRP
tRP
DQM
DQ
DAx0 DAx1
Activate
Command
Bank B
Rev. 5.3
Precharge
Write
Command
Command
Bank A
Bank A
Precharge Termination
of a Write Burst
Write Data are masked
Ay0
Activate
Command
Bank A
Read
Command
Bank A
Ay1
Precharge
Command
Bank A
Ay2
Activate
Command
Bank A
Precharge Termination
of a Read Burst
Don’t Care
51
Dec. /2013
EtronTech
EM638165
Figure 44. 54 Pin TSOP II Package Outline Drawing Information
Symbol
A
A1
A2
B
C
D
E
e
HE
L
L1
S
y
θ
Min
Dimension in inch
Nom
Max
--0.002
0.035
0.01
0.004
0.87
0.395
--0.455
0.016
----0°
----0.039
0.014
0.006
0.875
0.400
0.031
0.463
0.02
0.032
0.028
-----
0.047
0.008
0.043
0.018
0.008
0.88
0.405
--0.471
0.024
----0.004
8°
Min
Dimension in mm
Nom
Max
--0.05
0.9
0.25
0.12
22.09
10.03
--11.56
0.4
------0°
----1.0
0.35
0.165
22.22
10.16
0.8
11.76
0.5
0.84
0.71
-----
1.2
0.2
1.1
0.45
0.21
22.35
10.29
--11.96
0.6
----0.1
8°
Notes:
1. Dimension D&E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Dimension S includes end flash.
4. Controlling dimension: mm
Rev. 5.3
52
Dec. /2013
EtronTech
EM638165
Figure 45. 54 Ball TFBGA Package Outline Drawing Information
A1 INDEX
Bottom View
TOP View
Side View
Symbol
A
A1
A2
D
E
D1
E1
e
b
F
Rev. 5.3
Dimension in inch
Min
Nom Max
--0.047
0.010 0.012 0.014
-0.033
-0.311 0.315 0.319
0.311 0.315 0.319
-0.252
--0.252
--0.031
-0.016 0.018 0.020
-0.126
--
53
Dimension in mm
Min
Nom Max
--1.20
0.25 0.30 0.35
-0.85
-7.90 8.00 8.10
7.90 8.00 8.10
-6.40
--6.40
--0.80
-0.40 0.45 0.50
-3.20
--
Dec. /2013