STMicroelectronics M29DW128F70ZA1F 128 mbit (16mb x8 or 8mb x16, multiple bank, page, boot block) 3v supply flash memory Datasheet

M29DW128F
128 Mbit (16Mb x8 or 8Mb x16, Multiple Bank, Page, Boot Block)
3V supply Flash memory
Feature summary
■
Supply voltage
– VCC = 2.7V to 3.6V for Program, Erase and
Read
– VPP =12V for Fast Program (optional)
■
Asynchronous Random/Page Read
– Page width: 8 Words
– Page access: 25, 30ns
– Random access: 60, 70ns
■
TSOP56 (NF)
14 x 20mm
BGA
Programming time
– 10µs per Byte/Word typical
– 4 Words / 8 Bytes Program
– 32-Word Write Buffer
■
Erase Verify
■
Memory blocks
– Quadruple Bank Memory Array:
16Mbit+48Mbit+48Mbit+16Mbit
– Parameter Blocks (at Top and Bottom)
TBGA64 (ZA)
10 x 13mm
■
Low power consumption
– Standby and Automatic Standby
■
Hardware Block Protection
– VPP/WP Pin for fast program and write
protect of the four outermost parameter
blocks
■
Dual Operation
– While Program or Erase in one bank, Read
in any of the other banks
■
■
Program/Erase Suspend and Resume modes
– Read from any Block during Program
Suspend
– Read and Program another Block during
Erase Suspend
Security features
– Standard Protection
– Password Protection
■
Extended Memory Block
– Extra block used as security block or to
store additional information
■
Unlock Bypass Program
– Faster Production/Batch Programming
■
■
Common Flash Interface
– 64 bit Security Code
Electronic Signature
– Manufacturer Code: 0020h
– Device Code: 227Eh + 2220h + 2200h
■
ECOPACK® packages available
■
100,000 Program/Erase cycles per block
October 2006
Rev 7
1/94
www.st.com
1
Contents
M29DW128F
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2
Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3
4
2.1
Address Inputs (A0-A22) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2
Data Inputs/Outputs (DQ0-DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3
Data Inputs/Outputs (DQ8-DQ14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4
Data Input/Output or Address Input (DQ15A–1) . . . . . . . . . . . . . . . . . . . 14
2.5
Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.6
Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.7
Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.8
VPP/Write Protect (VPP/WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.9
Reset/Block Temporary Unprotect (RP) . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.10
Ready/Busy Output (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.11
Byte/Word Organization Select (BYTE) . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.12
VCC supply voltage (2.7V to 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.13
VSS Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
Bus Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2
Bus Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3
Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.4
Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5
Automatic Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6
Special Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6.2
Verify Extended Block Protection Indicator . . . . . . . . . . . . . . . . . . . . . . 19
3.6.3
Verify Block Protection Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6.4
Hardware Block Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.6.5
Temporary Unprotect of high voltage Protected Blocks . . . . . . . . . . . . . 20
Hardware Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.1
2/94
3.6.1
Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
M29DW128F
4.2
5
Temporary Block Unprotect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Software Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1
5.2
6
Contents
Standard Protection mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.1
Block Lock/Unlock Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.2
Non-Volatile Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Password Protection mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2.1
Block Lock/Unlock Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2.2
Non-Volatile Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1
6.2
6.3
Standard commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.1
Read/Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.2
Auto Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.1.3
Read CFI Query command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.4
Blank Verify command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.5
Chip Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.1.6
Block Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.1.7
Erase Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.1.8
Erase Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1.9
Program Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1.10
Program Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.1.11
Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Fast Program commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.2.1
Write to Buffer and Program command . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.2.2
Write to Buffer and Program Confirm command . . . . . . . . . . . . . . . . . . 37
6.2.3
Write to Buffer and Program Abort and Reset command . . . . . . . . . . . 37
6.2.4
Double Word Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.2.5
Quadruple Word Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.2.6
Double byte Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.2.7
Quadruple byte Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.2.8
Octuple byte Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.2.9
Unlock Bypass command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.2.10
Unlock Bypass Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.2.11
Unlock Bypass Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Block Protection commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.3.1
Enter Extended Block command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3/94
Contents
7
M29DW128F
6.3.2
Exit Extended Block command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.3.3
Set Extended Block Protection bit command . . . . . . . . . . . . . . . . . . . . . 42
6.3.4
Verify Extended Block Protection bit command . . . . . . . . . . . . . . . . . . . 42
6.3.5
Password Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.3.6
Password Verify command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.7
Password Protection Unlock command . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.8
Set Password Protection mode command . . . . . . . . . . . . . . . . . . . . . . . 43
6.3.9
Verify Password Protection mode command . . . . . . . . . . . . . . . . . . . . . 43
6.3.10
Set Standard Protection mode command . . . . . . . . . . . . . . . . . . . . . . . 44
6.3.11
Verify Standard Protection mode command . . . . . . . . . . . . . . . . . . . . . 44
6.3.12
Set Non-Volatile Modify Protection bit command . . . . . . . . . . . . . . . . . . 44
6.3.13
Verify Non-Volatile Modify Protection bit command . . . . . . . . . . . . . . . . 44
6.3.14
Clear Non-Volatile Modify Protection bits command . . . . . . . . . . . . . . . 45
6.3.15
Set Lock bit command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.3.16
Clear Lock bit command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.3.17
Verify Lock bit command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.3.18
Set Lock-Down bit command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.3.19
Verify Lock-Down bit command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.1
Data Polling bit (DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.2
Toggle bit (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.3
Error bit (DQ5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.4
Erase Timer bit (DQ3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.5
Alternative Toggle bit (DQ2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.6
Write to Buffer and Program Abort bit (DQ1) . . . . . . . . . . . . . . . . . . . . . . 50
8
Dual Operations and Multiple Bank architecture . . . . . . . . . . . . . . . . . 53
9
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
10
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
11
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
12
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
4/94
M29DW128F
Contents
Appendix A Block addresses and Read/Modify Protection Groups . . . . . . . . . 69
Appendix B Common Flash Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Appendix C Extended Memory Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
C.1
Factory Locked Section of the Extended Block . . . . . . . . . . . . . . . . . . . . . 83
C.2
Customer Lockable Section of the Extended Block. . . . . . . . . . . . . . . . . . 84
Appendix D High Voltage Block Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
D.1
Programmer technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
D.2
In-System technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Appendix E Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
5/94
List of tables
M29DW128F
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
Table 38.
Table 39.
Table 40.
Table 41.
Table 42.
Table 43.
6/94
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bank architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Bus operations, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read Electronic Signature, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Block Protection, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Bus operations, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Read Electronic Signature, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Block Protection, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Hardware Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Block Protection status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Standard Commands, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Standard Commands, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Fast Program Commands, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Fast Program Commands, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Block Protection Commands, 8-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Block Protection Commands, 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Protection Command Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Program, Erase Times and Program, Erase Endurance Cycles. . . . . . . . . . . . . . . . . . . . . 48
Status Register bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Dual Operations allowed in other Banks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Dual Operations allowed in same Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Write AC characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Write AC characteristics, Chip Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Toggle and Alternative Toggle bits AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Reset/Block Temporary Unprotect AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
TSOP56 – 56 lead Plastic Thin Small Outline, 14 x 20mm, package mechanical data . . . 66
TBGA64 10x13mm - 8x8 active ball array, 1mm pitch, package mechanical data. . . . . . . 67
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Block Addresses and Protection Groups . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Query Structure Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
CFI Query Identification String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
CFI Query System Interface information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Primary Algorithm-Specific Extended Query table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Security Code Area. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Extended Block Address and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Programmer technique Bus operations, 8-bit or 16-bit mode . . . . . . . . . . . . . . . . . . . . . . . 86
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
M29DW128F
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
TBGA connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Block Addresses (x8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Addresses (x16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Block Protection State diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Software Protection scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Data Polling flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Toggle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
AC measurement Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Random Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Page Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Write AC waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Write AC waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Toggle and Alternative Toggle bits mechanism, Chip Enable Controlled . . . . . . . . . . . . . . 63
Toggle and Alternative Toggle bits mechanism, Output Enable Controlled . . . . . . . . . . . . 63
Reset/Block Temporary Unprotect AC waveforms (No Program/Erase ongoing) . . . . . . . 64
Reset/Block Temporary Unprotect During Program/Erase Operation AC waveforms . . . . 64
Accelerated Program Timing waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
TSOP56 – 56 lead Plastic Thin Small Outline, 14 x 20mm, package outline . . . . . . . . . . . 66
TBGA64 10x13mm - 8x8 active ball array, 1mm pitch, package outline . . . . . . . . . . . . . . 67
Programmer equipment Group Protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Programmer equipment Chip Unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
In-System equipment Group Protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
In-System equipment Chip Unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Write to Buffer and Program flowchart and Pseudo Code . . . . . . . . . . . . . . . . . . . . . . . . . 91
7/94
Summary description
1
M29DW128F
Summary description
The M29DW128F is a 128 Mbit (16Mb x8 or 8Mb x16) non-volatile memory that can be
read, erased and reprogrammed. These operations can be performed using a single low
voltage (2.7 to 3.6V) supply. At Power-up the memory defaults to its Read mode.
The M29DW128F features an asymmetrical block architecture, with 16 parameter and 254
main blocks, divided into four Banks, A, B, C and D, providing multiple Bank operations.
While programming or erasing in one bank, read operations are possible in any other bank.
The bank architecture is summarized in Table 2. Eight of the Parameter Blocks are at the top
of the memory address space, and eight are at the bottom.
Program and Erase commands are written to the Command Interface of the memory. An onchip Program/Erase Controller simplifies the process of programming or erasing the
memory by taking care of all of the special operations that are required to update the
memory contents. The end of a program or erase operation can be detected and any error
conditions identified. The command set required to control the memory is consistent with
JEDEC standards. The Chip Enable, Output Enable and Write Enable signals control the
bus operations of the memory. They allow simple connection to most microprocessors, often
without additional logic.
The device supports Asynchronous Random Read and Page Read from all blocks of the
memory array.
The M29DW128F has one extra 256 byte block (Extended Block) that can be accessed
using a dedicated command. The Extended Block can be protected and so is useful for
storing security information. However the protection is irreversible, once protected the
protection cannot be undone.
Each block can be erased independently, so it is possible to preserve valid data while old
data is erased.
The device features four different levels of hardware and software block protection to avoid
unwanted program or erase (modify). The software block protection features are available in
16 bit memory organization only:
●
●
Hardware Protection:
–
The VPP/WP provides a hardware protection of the four outermost parameter
blocks (two at the top and two at the bottom of the address space).
–
The RP pin temporarily unprotects all the blocks previously protected using a High
Voltage Block Protection technique (see Appendix D: High Voltage Block
Protection).
Software Protection
–
Standard Protection
–
Password Protection
The memory is offered in TSOP56 (14 x 20mm) and TBGA64 (10 x 13mm, 1mm pitch)
packages. The 8-bit Bus mode is only available when the M29DW128F is delivered in
TSOP56 package. In order to meet environmental requirements, ST offers the M29DW128F
in ECOPACK® packages. ECOPACK packages are Lead-free. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com. The memory is supplied with all the bits erased (set to ’1’).
8/94
M29DW128F
Summary description
Table 1.
Signal names
A0-A22
Address Inputs
DQ0-DQ7
Data Inputs/Outputs
DQ8-DQ14
Data Inputs/Outputs
DQ15A–1
Data Input/Output or Address Input
E
Chip Enable
G
Output Enable
W
Write Enable
RP
Reset/Block Temporary Unprotect
RB
Ready/Busy Output
BYTE
Byte/Word Organization Select(1)
VCC
Supply voltage
VPP/WP
VPP/Write Protect
VSS
Ground
NC
Not Connected Internally
1. The x8 organization is only available in TSOP56 Package while the x16 organization is available for both
packages.
Figure 1.
Logic diagram
VPP/WP
VCC
23
15
A0-A22
DQ0-DQ14
DQ15A–1
W
E
M29DW128F
G
RB
RP
BYTE
VSS
AI09208b
9/94
Summary description
Table 2.
M29DW128F
Bank architecture
Parameter Blocks
Bank
Bank size
Main Blocks
No. of
Blocks
Block size
No. of
Blocks
Block size
A
16 Mbit
8
8 Kbytes/ 4 KWords
31
64 Kbytes/ 32 KWords
B
48 Mbit
—
—
96
64 Kbytes/ 32 KWords
C
48 Mbit
—
—
96
64 Kbytes/ 32 KWords
D
16 Mbit
8
8 Kbytes/ 4 KWords
31
64 Kbytes/ 32 KWords
Figure 2.
TSOP connections
NC
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
W
RP
A21
VPP/WP
RB
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
1
56
14
43
M29DW128F
15
42
28
29
NC
NC
A16
BYTE
VSS
DQ15A–1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
G
VSS
E
A0
NC
VCC
AI09209c
10/94
M29DW128F
Figure 3.
Summary description
TBGA connections (top view through package)
1
2
3
4
5
6
7
8
A
NC
A3
A7
RB
W
A9
A13
NC
B
NC
A4
A17
VPP/WP
RP
A8
A12
A22
C
NC
A2
A6
A18
A21
A10
A14
NC
D
NC
A1
A5
A20
A19
A11
A15
VCC
E
NC
A0
DQ0
DQ2
DQ5
DQ7
A16
VSS
F
VCC
E
DQ8
DQ10
DQ12
DQ14
NC
NC
G
NC
G
DQ9
DQ11
VCC
DQ13
DQ15
NC
H
NC
VSS
DQ1
DQ3
DQ4
DQ6
VSS
NC
AI09210c
11/94
Summary description
Figure 4.
M29DW128F
Block Addresses (x8)
(x8)
Address lines A22-A0, DQ15A-1
000000h
800000h
64 KBytes
8 KBytes
001FFFh
80FFFFh
Total of 8
Parameter
Blocks
Total of 96
Main Blocks
Bank C
00E000h
DF0000h
64 KBytes
8 KBytes
Bank A
00FFFFh
010000h
DFFFFFh
E00000h
64 KBytes
64 KBytes
01FFFFh
E0FFFFh
Total of 31
Main Blocks
Total of 31
Main Blocks
1F0000h
FE0000h
64 KBytes
64 KBytes
1FFFFFh
200000h
Bank D
FEFFFFh
FF0000h
8 KBytes
64 KBytes
20FFFFh
FF1FFFh
Total of 96
Main Blocks
Bank B
7F0000h
Total of 8
Parameter
Blocks
FFE000h
8 KBytes
64 KBytes
7FFFFFh
FFFFFFh
AI08966
1. Also see Appendix A and Table 34 for a full listing of the Block Addresses.
12/94
M29DW128F
Figure 5.
Summary description
Block Addresses (x16)
(x16)
Address lines A22-A0
400000h
000000h
4 KWords
32 KWords
407FFFh
000FFFh
Total of 8
Parameter
Blocks
Total of 96
Main Blocks
Bank C
6F8000h
007000h
4 KWords
Bank A
32 KWords
6FFFFFh
700000h
007FFFh
008000h
32 KWords
32 KWords
707FFFh
00FFFFh
Total of 31
Main Blocks
Total of 31
Main Blocks
7F0000h
0F8000h
32 KWords
32 KWords
0FFFFFh
100000h
Bank D
7F7FFFh
7F8000h
32 KWord
4 KWords
7F8FFFh
107FFFh
Total of 8
Parameter
Blocks
Total of 96
Main Blocks
Bank B
7FF000h
3F8000h
4 KWords
32 KWords
3FFFFFh
7FFFFFh
AI08967
1. Also see Appendix A, Table 34 for a full listing of the Block Addresses.
13/94
Signal descriptions
2
M29DW128F
Signal descriptions
See Figure 1: Logic diagram, and Table 1: Signal names, for a brief overview of the signals
connected to this device.
2.1
Address Inputs (A0-A22)
The Address Inputs select the cells in the memory array to access during Bus Read
operations. During Bus Write operations they control the commands sent to the Command
Interface of the Program/Erase Controller.
2.2
Data Inputs/Outputs (DQ0-DQ7)
The Data I/O outputs the data stored at the selected address during a Bus Read operation.
During Bus Write operations they represent the commands sent to the Command Interface
of the internal state machine.
2.3
Data Inputs/Outputs (DQ8-DQ14)
The Data I/O outputs the data stored at the selected address during a Bus Read operation
when BYTE is High, VIH. When BYTE is Low, VIL, these pins are not used and are high
impedance. During Bus Write operations the Command Register does not use these bits.
When reading the Status Register these bits should be ignored.
2.4
Data Input/Output or Address Input (DQ15A–1)
When the device is in x16 Bus mode, this pin behaves as a Data Input/Output pin (as DQ8DQ14). When the device is in x8 Bus mode, this pin behaves as an address pin; DQ15A–1
Low will select the LSB of the addressed Word, DQ15A–1 High will select the MSB.
Throughout the text consider references to the Data Input/Output to include this pin when
the device operates in x16 bus mode and references to the Address Inputs to include this
pin when the device operates in x8 bus mode except when stated explicitly otherwise.
2.5
Chip Enable (E)
The Chip Enable pin, E, activates the memory, allowing Bus Read and Bus Write operations
to be performed. When Chip Enable is High, VIH, all other pins are ignored.
2.6
Output Enable (G)
The Output Enable pin, G, controls the Bus Read operation of the memory.
14/94
M29DW128F
2.7
Signal descriptions
Write Enable (W)
The Write Enable pin, W, controls the Bus Write operation of the memory’s Command
Interface.
2.8
VPP/Write Protect (VPP/WP)
The VPP/Write Protect pin provides two functions. The VPP function allows the memory to
use an external high voltage power supply to reduce the time required for Program
operations. This is achieved by bypassing the unlock cycles and/or using the multiple Word
(2 or 4 at-a-time) or multiple byte Program (2, 4 or 8 at-a-time) commands.
The Write Protect function provides a hardware method of protecting the four outermost
boot blocks (two at the top, and two at the bottom of the address space). When VPP/Write
Protect is Low, VIL, the memory protects the four outermost boot blocks; Program and Erase
operations in these blocks are ignored while VPP/Write Protect is Low, even when RP is at
VID.
When VPP/Write Protect is High, VIH, the memory reverts to the previous protection status
of the four outermost boot blocks. Program and Erase operations can now modify the data
in these blocks unless the blocks are protected using Block Protection.
Applying VPPH to the VPP/WP pin will temporarily unprotect any block previously protected
(including the four outermost parameter blocks) using a High Voltage Block Protection
technique (In-System or Programmer technique). See Table 9: Hardware Protection for
details.
When VPP/Write Protect is raised to VPP the memory automatically enters the Unlock
Bypass mode. When VPP/Write Protect returns to VIH or VIL normal operation resumes.
During Unlock Bypass Program operations the memory draws IPP from the pin to supply the
programming circuits. See the description of the Unlock Bypass command in the Command
Interface section. The transitions from VIH to VPP and from VPP to VIH must be slower than
tVHVPP, see Figure 20.
Never raise VPP/Write Protect to VPP from any mode except Read mode, otherwise the
memory may be left in an indeterminate state.
The VPP/Write Protect pin must not be left floating or unconnected or the device may
become unreliable. A 0.1µF capacitor should be connected between the VPP/Write Protect
pin and the VSS Ground pin to decouple the current surges from the power supply. The PCB
track widths must be sufficient to carry the currents required during Unlock Bypass Program,
IPP.
15/94
Signal descriptions
2.9
M29DW128F
Reset/Block Temporary Unprotect (RP)
The Reset/Block Temporary Unprotect pin can be used to apply a Hardware Reset to the
memory or to temporarily unprotect all the blocks previously protected using a High Voltage
Block Protection technique (In-System or Programmer technique).
Note that if VPP/WP is at VIL, then the four outermost parameter blocks will remain protected
even if RP is at VID.
A Hardware Reset is achieved by holding Reset/Block Temporary Unprotect Low, VIL, for at
least tPLPX. After Reset/Block Temporary Unprotect goes High, VIH, the memory will be
ready for Bus Read and Bus Write operations after tPHEL or tRHEL, whichever occurs last.
See the Ready/Busy Output section, Table 30: Reset/Block Temporary Unprotect AC
characteristics and Figure 18 and Figure 19 for more details.
Holding RP at VID will temporarily unprotect all the blocks previously protected using a High
Voltage Block Protection technique. Program and erase operations on all blocks will be
possible. The transition from VIH to VID must be slower than tPHPHH.
2.10
Ready/Busy Output (RB)
The Ready/Busy pin is an open-drain output that can be used to identify when the device is
performing a Program or erase operation. During Program or erase operations Ready/Busy
is Low, VOL. Ready/Busy is high-impedance during Read mode, Auto Select mode and
Erase Suspend mode.
After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy
becomes high-impedance. See Table 30: Reset/Block Temporary Unprotect AC
characteristics and Figure 18 and Figure 19.
The use of an open-drain output allows the Ready/Busy pins from several memories to be
connected to a single pull-up resistor. A Low will then indicate that one, or more, of the
memories is busy.
2.11
Byte/Word Organization Select (BYTE)
It is used to switch between the x8 and x16 Bus modes of the memory when the
M29DW128F is delivered in TSOP56 package. When Byte/Word Organization Select is
Low, VIL, the memory is in x8 mode, when it is High, VIH, the memory is in x16 mode.
16/94
M29DW128F
2.12
Signal descriptions
VCC supply voltage (2.7V to 3.6V)
VCC provides the power supply for all operations (Read, Program and Erase).
The Command Interface is disabled when the VCC Supply Voltage is less than the Lockout
Voltage, VLKO. This prevents Bus Write operations from accidentally damaging the data
during power up, power down and power surges. If the Program/Erase Controller is
programming or erasing during this time then the operation aborts and the memory contents
being altered will be invalid.
A 0.1µF capacitor should be connected between the VCC Supply Voltage pin and the VSS
Ground pin to decouple the current surges from the power supply. The PCB track widths
must be sufficient to carry the currents required during Program and erase operations, ICC2.
2.13
VSS Ground
VSS is the reference for all voltage measurements. The device features two VSS pins both of
which must be connected to the system ground.
17/94
Bus operations
3
M29DW128F
Bus operations
There are five standard bus operations that control the device. These are Bus Read
(Random and Page modes), Bus Write, Output Disable, Standby and Automatic Standby.
Dual operations are possible in the M29DW128F, thanks to its multiple bank architecture.
While programming or erasing in one banks, read operations are possible in any of the other
banks. Write operations are only allowed in one bank at a time.
See Table 3 and Table 6, Bus Operations, for a summary. Typically glitches of less than 5ns
on Chip Enable, Write Enable, and Reset/Block Temporary Unprotect pins are ignored by
the memory and do not affect bus operations.
3.1
Bus Read
Bus Read operations read from the memory cells, or specific registers in the Command
Interface. To speed up the read operation the memory array can be read in Page mode
where data is internally read and stored in a page buffer. The Page has a size of 8 Words
and is addressed by the address inputs A0-A2.
A valid Bus Read operation involves setting the desired address on the Address Inputs,
applying a Low signal, VIL, to Chip Enable and Output Enable and keeping Write Enable
High, VIH. The Data Inputs/Outputs will output the value, see Figure 12: Random Read AC
waveforms, Figure 13: Page Read AC waveforms, and Table 26: Read AC characteristics,
for details of when the output becomes valid.
3.2
Bus Write
Bus Write operations write to the Command Interface. A valid Bus Write operation begins by
setting the desired address on the Address Inputs. The Address Inputs are latched by the
Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs
last. The Data Inputs/Outputs are latched by the Command Interface on the rising edge of
Chip Enable or Write Enable, whichever occurs first. Output Enable must remain High, VIH,
during the whole Bus Write operation. See Figure 14 and Figure 15, Write AC Waveforms,
and Table 27 and Table 28, Write AC Characteristics, for details of the timing requirements.
3.3
Output Disable
The Data Inputs/Outputs are in the high impedance state when Output Enable is High, VIH.
3.4
Standby
When Chip Enable is High, VIH, the memory enters Standby mode and the Data
Inputs/Outputs pins are placed in the high-impedance state. To reduce the Supply Current to
the Standby Supply Current, ICC2, Chip Enable should be held within VCC ± 0.2V. For the
Standby current level see Table 25: DC Characteristics. During program or erase operations
the memory will continue to use the Program/Erase Supply Current, ICC3, for Program or
Erase operations until the operation completes.
18/94
M29DW128F
3.5
Bus operations
Automatic Standby
If CMOS levels (VCC ± 0.2V) are used to drive the bus and the bus is inactive for 300ns or
more the memory enters Automatic Standby where the internal Supply Current is reduced to
the Standby Supply Current, ICC2. The Data Inputs/Outputs will still output data if a Bus
Read operation is in progress.
3.6
Special Bus operations
Additional bus operations can be performed to read the Electronic Signature, verify the
Protection Status of the Extended Memory Block (second section), and apply and remove
Block Protection. These bus operations are intended for use by programming equipment
and are not usually used in applications. They require VID to be applied to some pins.
3.6.1
Read Electronic Signature
The memory has two codes, the Manufacturer code and the Device code used to identify
the memory. These codes can accessed by performing read operations with control signals
and addresses set as shown in Table 4 and Table 6. These codes can also be accessed by
issuing an Auto Select command (see Section 6.1.2: Auto Select command).
3.6.2
Verify Extended Block Protection Indicator
The Extended Block is divided in two sections of which one is Factory Locked and the
second one is either Customer Lockable or Customer Locked.
The Protection Status of the second section of the Extended Block (Customer Lockable or
Customer Locked) can be accessed by reading the Extended Block Protection Indicator.
This is performed by applying the signals as shown in Table 5 and Table 8. The Protection
Status of the Extended Block is then output on bits DQ7 and DQ6 of the Data Input/Outputs.
(see Table 3 and Table 6, Bus Operations).
The Protection Status of the Extended Block can also be accessed by issuing an Auto
Select command (see Section 6.1.2: Auto Select command).
3.6.3
Verify Block Protection Status
The Protection Status of a Block can be directly accessed by performing a read operation
with control signals and addresses set as shown in Table 5 and Table 8. If the Block is
protected, then 01h (in x8 mode) is output on Data Input/Outputs DQ0-DQ7, otherwise 00h
is output.
3.6.4
Hardware Block Protect
The VPP/WP pin can be used to protect the four outermost parameter blocks. When VPP/WP
is at VIL the four outermost parameter blocks are protected and remain protected regardless
of the Block Protection Status or the Reset/Block Temporary Unprotect pin state.
19/94
Bus operations
3.6.5
M29DW128F
Temporary Unprotect of high voltage Protected Blocks
The RP pin can be used to temporarily unprotect all the blocks previously protected using the In-System
or the Programmer protection technique (High Voltage techniques). Refer to Section 2.9: Reset/Block
Temporary Unprotect (RP).
Table 3.
Bus operations, 8-bit mode(1)
Address Inputs
Operation
E
G
W
RP
Data Inputs/Outputs
VPP/WP
A22-A0, DQ15A-1
DQ14-DQ8
DQ7-DQ0
Bus Read
VIL
VIL
VIH
VIH
VIH
Cell Address
Hi-Z
Data Output
Bus Write
VIL
VIH
VIL
VIH
VIH
Command Address
Hi-Z
Data Input
X
VIH
VIH
VIH
VIH
X
Hi-Z
Hi-Z
VIH
X
X
VIH
VIH
X
Hi-Z
Hi-Z
Output Disable
Standby
1. X = VIL or VIH.
Table 4.
Read Electronic Signature, 8-bit mode(1)
Data
Inputs/Outputs
Address Inputs
Read Cycle
E
G
W
A22-A10 A9
A8
A7-A6 A5-A4
Manufacturer Code
X
Device Code (Cycle 1)
Device Code (Cycle 2)
VIL VIL VIH
X
VID
X
VIL
VIL
Device Code (Cycle 3)
A3
A2
A1
A0
DQ15A-1
DQ14DQ8
DQ7DQ0
VIL
VIL
VIL
VIL
X
Hi-Z
20h
VIL
VIL
VIL
VIH
X
Hi-Z
7Eh
VIH
VIH
VIH
VIL
X
Hi-Z
20h
VIH
VIH
VIH
VIH
X
Hi-Z
00h
1. X = VIL or VIH.
Table 5.
Block Protection, 8-bit mode(1)
Address Inputs
Operation
E
G
W
RP
Verify Extended
Block
Protection
Indicator (bits
VIL VIL VIH VIH
DQ6, DQ7)
VPP/
A5
A22
A3WP
A11A1
A9 A8 A7 A6 A2
A10
A4
A12
BA
X
X
X
VIH
Verify Block
Protection
Status
Temporary
Block
Unprotect (3)
Data Inputs/Outputs
VID
X
A0
DQ15 DQ14
A-1
-DQ8
VIH
X
VIL
X
80h (Customer
Lockable)
C0h (Customer
Locked)(2)
VIL VIH
VIL
Hi-Z
BKA
X
X
X
VID
VIL
X
VIL
Valid
DQ7-DQ0
01h (protected)
00h
(unprotected)
Data Input
1. X = VIL or VIH. BKA Bank Address, BA any Address in the Block.
2. This indicates the protection status of the second section of the Extended Block; the first section of the Extended Block
being always Factory Locked.
3. The RP pin unprotects all the blocks that have been previously protected using a High Voltage protection Technique.
20/94
M29DW128F
Table 6.
Bus operations
Bus operations, 16-bit mode(1)
Operation
E
G
W
RP
VPP/
WP
Address Inputs
Data Inputs/Outputs
A22-A0
DQ15A-1, DQ14-DQ0
Bus Read
VIL
VIL
VIH
VIH
VIH
Cell Address
Data Output
Bus Write
VIL
VIH
VIL
VIH
VIH
Command Address
Data Input
X
VIH
VIH
VIH
VIH
X
Hi-Z
VIH
X
X
VIH
VIH
X
Hi-Z
Output Disable
Standby
1. X = VIL or VIH.
Table 7.
Read Electronic Signature, 16-bit mode(1)
Address Inputs
Read Cycle
E
G
W
A22A10
A9
A8
A7A6
Manufacturer Code
A5A4
A3
A2
A1
A0
DQ15A-1, DQ14-DQ0
X
VIL
VIL
VIL
VIL
0020h
VIL
VIL
VIL
VIH
227Eh
VIH
VIH
VIH
VIL
2220h
VIH
VIH
VIH
VIH
2200h
Device Code (Cycle 1)
Device Code (Cycle 2)
VIL
VIL
VIH
X
VID
X
VIL
Data Inputs/Outputs
VIL
Device Code (Cycle 3)
1. X = VIL or VIH.
Table 8.
Block Protection, 16-bit mode(1)
Address Inputs
Operation
Verify Extended
Block Indicator
(bits DQ6, DQ7)
E
G
W
VPP/
RP
WP A22- A11A9
A12 A10
BA
VIL VIL VIH VIH
VID
X
BKA
X
X
X
VID
A6
X
A5- A3A1
A4 A2
X
X
X
VIH
Verify Block
Protection Status
Temporary Block
Unprotect (3)
A8 A7
Data Inputs/Outputs
VIL
VIL
VIL
Valid
VIL
A0
DQ15A-1, DQ14-DQ0
VIH
0080h
(Customer Lockable)
00C0h
(Customer Locked)(2)
VIL
0001h (protected)
0000h (unprotected)
VIH
Data Input
1. X = VIL or VIH. BKA Bank Address, BA Any Address in the Block.
2. This indicates the protection status of the second section of the Extended Block; the first section of the Extended Block
being always Factory Locked.
3. The RP pin unprotects all the blocks that have been previously protected using a High Voltage protection Technique.
21/94
Hardware Protection
4
M29DW128F
Hardware Protection
The M29DW128F features hardware protection/unprotection. Refer to Table 9 for details on hardware
block protection/unprotection using VPP/WP and RP pins.
4.1
Write Protect
The VPP/WP pin protects the four outermost parameter blocks (refer to Section 2: Signal descriptions for
a detailed description of the signals).
4.2
Temporary Block Unprotect
When held at VID, the Reset/Block Temporary Unprotect pin, RP, will temporarily unprotect all the blocks
previously protected using a High Voltage Block Protection technique.
Table 9.
Hardware Protection
VPP/WP
RP
Function
VIH
4 outermost parameter blocks protected from
Program/Erase operations
VID
All blocks temporarily unprotected except the 4
outermost blocks(1)
VIH or VID
VID
All blocks temporarily unprotected(1)
VPPH
VIH or VID
All blocks temporarily unprotected(1)
VIL
1. The temporary unprotection is valid only for the blocks that have been protected using the High Voltage Protection
Technique (see Appendix D: High Voltage Block Protection). The blocks protected using a software protection method
(Standard, Password) do not follow this rules.
22/94
M29DW128F
5
Software Protection
Software Protection
The M29DW128F has two different Software Protection modes: the Standard Protection
mode and the Password Protection mode.
On first use all parts default to the Standard Protection mode and the customer is free to
activate the Standard or the Password Protection mode.
The desired protection mode is activated by setting one of two one-time programmable bits,
the Standard Protection Mode Lock bit or the Password Protection Mode Lock bit.
Programming the Standard and the Password Protection Mode Lock bit to ‘1’ will
permanently activate the Standard Protection mode and the Password Protection mode,
respectively. These two bits are one-time programmable and non-volatile, once the
Protection mode has been programmed, it cannot be changed and the device will
permanently operate in the selected Protection mode. It is recommended to activate the
desired Software Protection mode when first programming the device.
The device is shipped with all blocks unprotected. The Block Protection Status can be read
by issuing the Auto Select command (see Table 10: Block Protection status).
The Standard and Password Protection modes offer two levels of protection, a Block
Lock/Unlock protection and a Non-Volatile protection.
For the four outermost parameter blocks, an even higher level of block protection can be
achieved by locking the blocks using the Non-Volatile Protection and then by holding the
VPP/WP pin Low.
5.1
Standard Protection mode
5.1.1
Block Lock/Unlock Protection
It is a flexible mechanism to protect/unprotect a block or a group of blocks from program or
erase operations.
A volatile Lock bit is assigned to each block or group of blocks. When the lock bit is set to ‘1’
the associated block or group of blocks is protected from program/erase operations, when
the Lock bit is set to ‘0’ the associated block or group of blocks is unprotected and can be
programmed or erased.
The Lock bits can be set (‘1’) and cleared (‘0’) individually as often as required by issuing a
Set Lock Bit command and Clear Lock bit command, respectively.
After a Power-up or Hardware Reset, all the Lock bits are cleared to ‘0’ (block unlocked).
23/94
Software Protection
5.1.2
M29DW128F
Non-Volatile Protection
A Non-Volatile Modify Protection bit is assigned to each block or group of blocks.
When a Non-Volatile Modify Protection bit is set to ‘1’ the associated block or group of
blocks is protected, preventing any program or erase operations in this block or group of
blocks.
The Non-Volatile Modify Protection bits are set individually by issuing a Set Non-Volatile
Modify Protection bit command. They are non-volatile and will remain set through a
hardware reset or a power-down/power-up sequence.
The Non-Volatile Modify Protection bits cannot be cleared individually, they can only be
cleared all at the same time by issuing a Clear Non-Volatile Modify Protection bits
command.
However if any one of the Non-Volatile Modify Protection bits has to be cleared, care should
be taken to preprogram to ‘1’ all the Non-Volatile Modify Protection bits prior to issuing the
Clear Non-Volatile Modify Protection bits in order to prevent the over-erasure of previously
cleared Non Volatile Modify Protection bits. It is crucial to prevent over-erasure because the
process may lead to permanent damage to the Non-Volatile Modify Protection bits and the
device does not have any built-in means of preventing over-erasure.
The device features a volatile Lock-Down bit which can be used to prevent changing the
state of the Non-Volatile Modify Protection bits. When set to ‘1’, the Non-Volatile Modify
Protection bits can no longer be modified; when set to ‘0’, the Non-Volatile Modify Protection
bits can be set and reset using the Set Non-Volatile Modify Protection bit command and the
Clear Non-Volatile Modify Protection bits command, respectively.
The Lock-Down bit is set by issuing the Set Lock-Down bit Command. It is not cleared using
a command, but through a hardware reset or a power-down/power-up sequence.
The parts are shipped with the Non-Volatile Modify Protection bits set to ‘0’.
Locked blocks and Non-Volatile Locked blocks can co-exist in the same memory array.
Refer to Table 10: Block Protection status and Figure 7: Software Protection scheme for
details on the block protection mechanism.
5.2
Password Protection mode
The Password Protection mode provides a more advanced level of software protection than
the Standard Protection mode.
Prior to entering the Password Protection mode, it is necessary to set a password and to
verify it (see Section 6.3.5: Password Program command and Section 6.3.6: Password
Verify command). The Password Protection mode is then activated by programming the
Password Protection Mode Lock bit to ‘1’. The Reset/Block Temporary Unprotect pin, RP,
can be at VID or at VIH.
This operation is not reversible and once the bit is programmed the device will permanently
remain in the Password Protection mode.
The Password Protection mode uses the same protection mechanisms as the Standard
Protection mode (Block Lock/Unlock, Non-Volatile Protection).
24/94
M29DW128F
5.2.1
Software Protection
Block Lock/Unlock Protection
The Block Lock/Unlock Protection operates exactly in the same way as in the Standard Protection mode.
5.2.2
Non-Volatile Protection
The Non-Volatile Protection is more advanced in the Password Protection mode.
In this mode, the Lock-Down bit cannot be cleared through a hardware reset or a power-down/power-up
sequence.
The Lock-Down bit is cleared by issuing the Password Protection Unlock command along with the correct
password.
Once the correct Password has been provided, the Lock-Down bit is cleared and the Non-Volatile Modify
Protection bits can be set or reset using the appropriate commands (the Set Non-Volatile Modify
Protection bit command or the Clear Non-Volatile Modify Protection bits command, respectively).
If the Password provided is not correct, the Lock-Down bit remains locked and the state of the NonVolatile Modify Protection bits cannot be modified.
The Password is a 64-bit code located in the memory space. It must be programmed by the user prior to
selecting the Password Protection mode. The Password is programmed by issuing a Password Program
command and checked by issuing a Password Verify command. The Password should be unique for each
part.
Once the device is in Password Protection mode, the Password can no longer be read or retrieved.
Moreover, all commands to the address where the password is stored, are disabled. Refer to Table 10:
Block Protection status and Figure 7: Software Protection scheme for details on the block protection
scheme.
Table 10.
Block Protection status
Volatile Non-Volatile
Block
Lock-Down
Lock
Modify
Protection
bit
Protection bit
bit
status
0
0
Block Protection status
0
00h
0
0
1
0
1
0
1
0
0
1
1
0
0
1
1
1
0
1
1
1
1
01h
Block
Unprotected
Block
Program/
Erase
Protected
Non-Volatile Modify Protection bit can be
modified(1)
Non-Volatile Modify Protection bit cannot be
modified(1)
Non-Volatile Modify Protection bit can be
modified(1)
Non-Volatile Modify Protection bit cannot be
modified(1)
1. The Lock bit can always be modified by issuing a Clear Lock bit command or by taking the device through a Power-up or
Hardware Reset.
25/94
Software Protection
Figure 6.
M29DW128F
Block Protection State diagram
Set Standard Protection
Mode
Default:
Standard
Protection
Standard
Protection
Set Password Protection
Mode
Password
Protection
ai11503
Figure 7.
Software Protection scheme
Parameter Block or
Up to 4 Main Blocks
Lock Bit
Non-Volatile Modify
Protection Bit
Lock-Down bit
Standard Protection
mode
Block Lock/Unlock Protection
Non-Volatile Protection
Password Protection
mode
AI11504
26/94
M29DW128F
6
Command interface
Command interface
All Bus Write operations to the memory are interpreted by the Command Interface.
Commands consist of one or more sequential Bus Write operations. Failure to observe a
valid sequence of Bus Write operations will result in the memory returning to Read mode.
The long command sequences are imposed to maximize data security.
The address used for the commands changes depending on whether the memory is in 16bit or 8-bit mode.
6.1
Standard commands
See either Table 12, or Table 11, depending on the configuration that is being used, for a
summary of the Standard commands.
6.1.1
Read/Reset command
The Read/Reset command returns the memory to Read mode. It also resets the errors in
the Status Register. Either one or three Bus Write operations can be used to issue the
Read/Reset command.
The Read/Reset command can be issued, between Bus Write cycles before the start of a
program or erase operation, to return the device to Read mode. If the Read/Reset command
is issued during the time-out of a Block erase operation, the memory will take up to 10µs to
abort. During the abort period no valid data can be read from the memory.
The Read/Reset command will not abort an Erase operation when issued while in Erase
Suspend.
6.1.2
Auto Select command
The Auto Select command is used to read the Manufacturer Code, the Device Code, the
Protection Status of each block (Block Protection Status) and the Extended Block Protection
Indicator. It can be addressed to either Bank.
Three consecutive Bus Write operations are required to issue the Auto Select command.
Once the Auto Select command is issued Bus Read operations to specific addresses output
the Manufacturer Code, the Device Code, the Extended Block Protection Indicator and a
Block Protection Status (see Table 11 and Table 12 in conjunction with Table 4, Table 5,
Table 7 and Table 8). The memory remains in Auto Select mode until a Read/Reset or CFI
Query command is issued.
27/94
Command interface
6.1.3
M29DW128F
Read CFI Query command
The Read CFI Query Command is used to put the addressed bank in Read CFI Query
mode. Once in Read CFI Query mode Bus Read operations to the same bank will output
data from the Common Flash Interface (CFI) Memory Area. If the read operations are to a
different bank from the one specified in the command then the read operations will output
the contents of the memory array and not the CFI data.
One Bus Write cycle is required to issue the Read CFI Query Command. Care must be
taken to issue the command to one of the banks (A22-A19) along with the address shown in
Table 3 and Table 6. Once the command is issued subsequent Bus Read operations in the
same bank (A22-A19) to the addresses shown in Appendix B: Common Flash Interface
(CFI) (A7-A0), will read from the Common Flash Interface Memory Area.
This command is valid only when the device is in the Read Array or Auto Select mode. To
enter Read CFI query mode from Auto Select mode, the Read CFI Query command must
be issued to the same bank address as the Auto Select command, otherwise the device will
not enter Read CFI Query mode.
The Read/Reset command must be issued to return the device to the previous mode (the
Read Array mode or Auto Select mode). A second Read/Reset command is required to put
the device in Read Array mode from Auto Select mode.
See Appendix B, Table 35, Table 36, Table 37, Table 38, Table 39 and Table 40 for details on
the information contained in the Common Flash Interface (CFI) memory area.
6.1.4
Blank Verify command
The Blank Verify command is used to check if a block is blank or in other words, if it has
been successfully erased and all its bits set to '1'. Three cycles are required to issue a Verify
command:
1.
The command starts with two unlock cycles.
2.
The third bus write cycle sets up the Verify command code along with the address of
the block to be checked.
3.
Bus Read operations during the Blank Verify operation output the Status Register on
Data Inputs/Outputs (see 7: Status Register).
After the Blank Verify command has completed, the memory returns to Read mode, unless
an error has occurred. When an error occurs, the memory continues to output the Status
Register. A Read/Reset command must be issued to reset the error condition and return to
Read mode.F
6.1.5
Chip Erase command
The Chip Erase command can be used to erase the entire chip. Six Bus Write operations
are required to issue the Chip Erase Command and start the Program/Erase Controller.
If any blocks are protected, then these are ignored and all the other blocks are erased. If all
of the blocks are protected the Chip Erase operation appears to start but will terminate
within about 100µs, leaving the data unchanged. No error condition is given when protected
blocks are ignored.
During the erase operation the memory will ignore all commands, including the Erase
Suspend command. It is not possible to issue any command to abort the operation. Typical
chip erase times are given in Table 18. All Bus Read operations during the Chip Erase
28/94
M29DW128F
Command interface
operation will output the Status Register on the Data Inputs/Outputs. See the section on the
Status Register for more details.
After the Chip Erase operation has completed the memory will return to the Read mode,
unless an error has occurred. When an error occurs the memory will continue to output the
Status Register. A Read/Reset command must be issued to reset the error condition and
return to Read mode.
The Chip Erase Command sets all of the bits in unprotected blocks of the memory to ’1’. All
previous data is lost.
29/94
Command interface
6.1.6
M29DW128F
Block Erase command
The Block Erase command can be used to erase a list of one or more blocks in one or more
Banks. It sets all of the bits in the unprotected selected blocks to ’1’. All previous data in the
selected blocks is lost.
Six Bus Write operations are required to select the first block in the list. Each additional
block in the list can be selected by repeating the sixth Bus Write operation using the address
of the additional block. The Block Erase operation starts the Program/Erase Controller after
a time-out period of 50µs after the last Bus Write operation. Once the Program/Erase
Controller starts it is not possible to select any more blocks. Each additional block must
therefore be selected within 50µs of the last block. The 50µs timer restarts when an
additional block is selected. After the sixth Bus Write operation a Bus Read operation within
the same Bank will output the Status Register. See the Status Register section for details on
how to identify if the Program/Erase Controller has started the Block Erase operation.
If any selected blocks are protected then these are ignored and all the other selected blocks
are erased. If all of the selected blocks are protected the Block Erase operation appears to
start but will terminate within about 100µs, leaving the data unchanged. No error condition is
given when protected blocks are ignored.
During the Block Erase operation the memory will ignore all commands except the Erase
Suspend command and the Read/Reset command which is only accepted during the 50µs
time-out period. Typical block erase times are given in Table 18.
After the Erase operation has started all Bus Read operations to the Banks being erased will
output the Status Register on the Data Inputs/Outputs. See the section on the Status
Register for more details.
After the Block Erase operation has completed the memory will return to the Read mode,
unless an error has occurred.
When an error occurs, Bus Read operations to the Banks where the command was issued
will continue to output the Status Register. A Read/Reset command must be issued to reset
the error condition and return to Read mode.
6.1.7
Erase Suspend command
The Erase Suspend command may be used to temporarily suspend a Block or multiple
Block Erase operation. One Bus Write operation specifying the Bank Address of one of the
Blocks being erased is required to issue the command. Issuing the Erase Suspend
command returns the whole device to Read mode.
The Program/Erase Controller will suspend within the Erase Suspend Latency time (see
Table 18 for value) of the Erase Suspend Command being issued. Once the Program/Erase
Controller has stopped the memory will be set to Read mode and the Erase will be
suspended. If the Erase Suspend command is issued during the period when the memory is
waiting for an additional block (before the Program/Erase Controller starts) then the Erase is
suspended immediately and will start immediately when the Erase Resume Command is
issued. It is not possible to select any further blocks to erase after the Erase Resume.
During Erase Suspend it is possible to Read and Program cells in blocks that are not being
erased; both Read and Program operations behave as normal on these blocks. If any
attempt is made to program in a protected block or in the suspended block then the Program
command is ignored and the data remains unchanged. The Status Register is not read and
no error condition is given. Reading from blocks that are being erased will output the Status
Register.
30/94
M29DW128F
Command interface
It is also possible to issue the Auto Select, Read CFI Query and Unlock Bypass commands
during an Erase Suspend. The Read/Reset command must be issued to return the device to
Read Array mode before the Resume command will be accepted.
During Erase Suspend a Bus Read operation to the Extended Block will output the
Extended Block data. Once in the Extended Block mode, the Exit Extended Block command
must be issued before the erase operation can be resumed.
6.1.8
Erase Resume command
The Erase Resume command is used to restart the Program/Erase Controller after an
Erase Suspend. The command must include the Bank Address of the Erase-Suspended
Bank, otherwise the Program/Erase Controller is not restarted.
The device must be in Read Array mode before the Resume command will be accepted. An
Erase can be suspended and resumed more than once.
6.1.9
Program Suspend command
The Program Suspend command allows the system to interrupt a program operation so that
data can be read from any block. When the Program Suspend command is issued during a
program operation, the device suspends the program operation within the Program Suspend
Latency time (see Table 18 for value) and updates the Status Register bits. The Bank
Addresses of the Block being programmed must be specified in the Program Suspend
command.
After the program operation has been suspended, the system can read array data from any
address. However, data read from Program-Suspended addresses is not valid.
The Program Suspend command may also be issued during a program operation while an
erase is suspended. In this case, data may be read from any addresses not in Erase
Suspend or Program Suspend. If a read is needed from the Extended Block area (One-time
Program area), the user must use the proper command sequences to enter and exit this
region.
The system may also issue the Auto Select command sequence when the device is in the
Program Suspend mode. The system can read as many Auto Select codes as required.
When the device exits the Auto Select mode, the device reverts to the Program Suspend
mode, and is ready for another valid operation. See Auto Select command sequence for
more information.
6.1.10
Program Resume command
After the Program Resume command is issued, the device reverts to programming. The
controller can determine the status of the program operation using the DQ7 or DQ6 status
bits, just as in the standard program operation. See Write Operation Status for more
information.
The system must write the Program Resume command, specifying the Bank addresses of
the Program-Suspended Block, to exit the Program Suspend mode and to continue the
programming operation.
Further issuing of the Resume command is ignored. Another Program Suspend command
can be written after the device has resumed programming.
31/94
Command interface
6.1.11
M29DW128F
Program command
The Program command can be used to program a value to one address in the memory array
at a time. The command requires four Bus Write operations, the final Write operation latches
the address and data in the internal state machine and starts the Program/Erase Controller.
Programming can be suspended and then resumed by issuing a Program Suspend
command and a Program Resume command, respectively (see Section 6.1.9: Program
Suspend command and Section 6.1.10: Program Resume command paragraphs).
If the address falls in a protected block then the Program command is ignored, the data
remains unchanged. The Status Register is never read and no error condition is given.
After programming has started, Bus Read operations in the Bank being programmed output
the Status Register content, while Bus Read operations to the other Bank output the
contents of the memory array. See the section on the Status Register for more details.
Typical program times are given in Table 18.
After the program operation has completed the memory will return to the Read mode, unless
an error has occurred. When an error occurs Bus Read operations to the Bank where the
command was issued will continue to output the Status Register. A Read/Reset command
must be issued to reset the error condition and return to Read mode.
One of the Erase Commands must be used to set all the bits in a block or in the whole
memory from ’0’ to ’1’.
32/94
M29DW128F
Table 11.
Command interface
Standard Commands, 8-bit mode(1)(2)
Command
Length
Bus operations
1st
Add
2nd
Data Add Data
3rd
4th
Add
Data
5th
6th
Add Data Add Data Add Data
1
X
F0
3
AAA
AA
555
55
X
F0
3
AAA
AA
555
55
(BKA)
AAA
90
(3)
(3)
Program
4
AAA
AA
555
55
AAA
A0
PA
PD
Blank Verify Command
3
AAA
AA
555
55
BA
BC
Verify
3
AAA
AA
555
55
BA
BC
Chip Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
AAA
10
Block Erase
6
+
AAA
AA
555
55
AAA
80
AAA
AA
555
55
BA
30
Erase/Program Suspend
1
BKA
B0
Erase/Program Resume
1
BKA
30
Read CFI Query
1
(BKA)
AAA
98
Read/Reset
Manufacturer Code
Device Code
Auto
Select
Extended Block Protection
Indicator
Block Protection Status
1. Grey cells represent Read cycles. The other cells are Write cycles.
2. X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block, BKA Bank Address. All values in the
table are in hexadecimal.
3. The Auto Select addresses and data are given in Table 4: Read Electronic Signature, 8-bit mode, and Table 5: Block
Protection, 8-bit mode, except for A9 that is ‘Don’t Care’.
33/94
Command interface
Table 12.
M29DW128F
Standard Commands, 16-bit mode(1)(2)
Command
Length
Bus operations
1st
Add
2nd
3rd
Data Add Data
4th
Add
Data
Add
5th
6th
Data Add Data
Add
Data
1
X
F0
3
555
AA
2AA
55
X
F0
3
555
AA
2AA
55
(BKA)
555
90
(3)
(3)
Program
4
555
AA
2AA
55
555
A0
PA
PD
Blank Verify Command
3
555
AA
2AA
55
BA
BC
Verify
3
555
AA
2AA
55
BA
BC
Chip Erase
6
555
AA
2AA
55
555
80
555
AA
2AA
55
555
10
Block Erase
6+
555
AA
2AA
55
555
80
555
AA
2AA
55
BA
30
Erase/Program Suspend
1
BKA
B0
Erase/Program Resume
1
BKA
30
Read CFI Query
1
(BKA)
555
98
Read/Reset
Manufacturer Code
Device Code
Auto Select Extended Block
Protection Indicator
Block Protection Status
1. Grey cells represent Read cycles. The other cells are Write cycles.
2. X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block, BKA Bank Address. All values in the
table are in hexadecimal.
3. The Auto Select addresses and data are given in Table 7: Read Electronic Signature, 16-bit mode, and Table 8: Block
Protection, 16-bit mode, except for A9 that is ‘Don’t Care’.
34/94
M29DW128F
6.2
Command interface
Fast Program commands
The M29DW128F offers a set of Fast Program commands to improve the programming
throughput:
●
Write to Buffer and Program
●
Double and Quadruple Word, Program
●
Double, Quadruple and Octuple Byte Program
●
Unlock Bypass.
See either Table 14, or Table 13, depending on the configuration that is being used, for a
summary of the Fast Program commands.
When VPPH is applied to the VPP/Write Protect pin the memory automatically enters the Fast
Program mode. The user can then choose to issue any of the Fast Program commands.
Care must be taken because applying a VPPH to the VPP/WP pin will temporarily unprotect
any protected block.
Only one bank can be programmed at any one time. The other bank must be in Read mode
or Erase Suspend.
After programming has started, Bus Read operations in the Bank being programmed output
the Status Register content, while Bus Read operations to the other Bank output the
contents of the memory array. Fast program commands can be suspended and then
resumed by issuing a Program Suspend command and a Program Resume command,
respectively (see Section 6.1.9: Program Suspend command and Section 6.1.10: Program
Resume command paragraphs.)
After the fast program operation has completed, the memory will return to the Read mode,
unless an error has occurred. When an error occurs Bus Read operations to the Bank
where the command was issued will continue to output the Status Register. A Read/Reset
command must be issued to reset the error condition and return to Read mode. One of the
Erase Commands must be used to set all the bits in a block or in the whole memory from ’0’
to ’1’.
Typical Program times are given in Table 18: Program, Erase Times and Program, Erase
Endurance Cycles.
35/94
Command interface
6.2.1
M29DW128F
Write to Buffer and Program command
The Write to Buffer and Program Command makes use of the device’s 64-byte Write Buffer
to speed up programming. 32 Words/64 bytes can be loaded into the Write Buffer. Each
Write Buffer has the same A5-A22 addresses.The Write to Buffer and Program command
dramatically reduces system programming time compared to the standard non-buffered
Program command.
When issuing a Write to Buffer and Program command, the VPP/WP pin can be either held
High, VIH or raised to VPPH.
See Table 18 for details on typical Write to Buffer and Program times in both cases.
Five successive steps are required to issue the Write to Buffer and Program command:
1.
The Write to Buffer and Program command starts with two unlock cycles.
2.
The third Bus Write cycle sets up the Write to Buffer and Program command. The setup
code can be addressed to any location within the targeted block.
3.
The fourth Bus Write cycle sets up the number of Words/bytes to be programmed.
Value N is written to the same block address, where N+1 is the number of Words/bytes
to be programmed. N+1 must not exceed the size of the Write Buffer or the operation
will abort.
4.
The fifth cycle loads the first address and data to be programmed.
5.
Use N Bus Write cycles to load the address and data for each Word/bytes into the
Write Buffer. Addresses must lie within the range from the start address+1 to the start
address + N-1. Optimum performance is obtained when the start address corresponds
to a 64 byte boundary. If the start address is not aligned to a 64 byte boundary, the total
programming time is doubled.
All the addresses used in the Write to Buffer and Program operation must lie within the
same page.
To program the content of the Write Buffer, this command must be followed by a Write to
Buffer and Program Confirm command.
If an address is written several times during a Write to Buffer and Program operation, the
address/data counter will be decremented at each data load operation and the data will be
programmed to the last word loaded into the Buffer.
Invalid address combinations or failing to follow the correct sequence of Bus Write cycles
will abort the Write to Buffer and Program.
The Status Register bits DQ1, DQ5, DQ6, DQ7 can be used to monitor the device status
during a Write to Buffer and Program operation.
If is not possible to detect Program operation fails when changing programmed data from ‘0’
to ‘1’, that is when reprogramming data in a portion of memory already programmed. The
resulting data will be the logical OR between the previous value and the current value.
A Write to Buffer and Program Abort and Reset command must be issued to abort the Write
to Buffer and Program operation and reset the device in Read mode.
During Write to Buffer and Program operations, the bank being programmed will accept
Program/Erase Suspend commands.
See Appendix E, Figure 27: Write to Buffer and Program flowchart and Pseudo Code, for a
suggested flowchart on using the Write to Buffer and Program command.
36/94
M29DW128F
6.2.2
Command interface
Write to Buffer and Program Confirm command
The Write to Buffer and Program Confirm command is used to confirm a Write to Buffer and
Program command and to program the N+1 Words/bytes loaded in the Write Buffer by this
command.
6.2.3
Write to Buffer and Program Abort and Reset command
The Write to Buffer and Program Abort and Reset command is used to abort Write to Buffer
and Program command.
6.2.4
Double Word Program command
This is used to write two adjacent Words in x16 mode, simultaneously. The addresses of the
two Words must differ only in A0.
Three bus write cycles are necessary to issue the command:
6.2.5
1.
The first bus cycle sets up the command.
2.
The second bus cycle latches the Address and the Data of the first Word to be written.
3.
The third bus cycle latches the Address and the Data of the second Word to be written
and starts the Program/Erase Controller.
Quadruple Word Program command
This is used to write a page of four adjacent Words, in x16 mode, simultaneously. The
addresses of the four Words must differ only in A1 and A0.
Five bus write cycles are necessary to issue the command:
6.2.6
1.
The first bus cycle sets up the command.
2.
The second bus cycle latches the Address and the Data of the first Word to be written.
3.
The third bus cycle latches the Address and the Data of the second Word to be written.
4.
The fourth bus cycle latches the Address and the Data of the third Word to be written.
5.
The fifth bus cycle latches the Address and the Data of the fourth Word to be written
and starts the Program/Erase Controller.
Double byte Program Command
This is used to write two adjacent bytes in x8 mode, simultaneously. The addresses of the
two bytes must differ only in DQ15A-1.
Three bus write cycles are necessary to issue the command:
1.
The first bus cycle sets up the command.
2.
The second bus cycle latches the Address and the Data of the first byte to be written.
3.
The third bus cycle latches the Address and the Data of the second byte to be written
and starts the Program/Erase Controller.
37/94
Command interface
6.2.7
M29DW128F
Quadruple byte Program command
This is used to write four adjacent bytes in x8 mode, simultaneously. The addresses of the
four bytes must differ only in A0, DQ15A-1.
Five bus write cycles are necessary to issue the command.
6.2.8
1.
The first bus cycle sets up the command.
2.
The second bus cycle latches the Address and the Data of the first byte to be written.
3.
The third bus cycle latches the Address and the Data of the second byte to be written.
4.
The fourth bus cycle latches the Address and the Data of the third byte to be written.
5.
The fifth bus cycle latches the Address and the Data of the fourth byte to be written and
starts the Program/Erase Controller.
Octuple byte Program command
This is used to write eight adjacent bytes, in x8 mode, simultaneously. The addresses of the
eight bytes must differ only in A1, A0 and DQ15A-1.
Nine bus write cycles are necessary to issue the command:
6.2.9
1.
The first bus cycle sets up the command.
2.
The second bus cycle latches the Address and the Data of the first byte to be written.
3.
The third bus cycle latches the Address and the Data of the second byte to be written.
4.
The fourth bus cycle latches the Address and the Data of the third byte to be written.
5.
The fifth bus cycle latches the Address and the Data of the fourth byte to be written.
6.
The sixth bus cycle latches the Address and the Data of the fifth byte to be written.
7.
The seventh bus cycle latches the Address and the Data of the sixth byte to be written.
8.
The eighth bus cycle latches the Address and the Data of the seventh byte to be
written.
9.
The ninth bus cycle latches the Address and the Data of the eighth byte to be written
and starts the Program/Erase Controller.
Unlock Bypass command
The Unlock Bypass command is used in conjunction with the Unlock Bypass Program
command to program the memory faster than with the standard program commands. When
the cycle time to the device is long, considerable time saving can be made by using these
commands. Three Bus Write operations are required to issue the Unlock Bypass command.
Once the Unlock Bypass command has been issued the bank enters Unlock Bypass mode.
When in Unlock Bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset
commands are valid. The Unlock Bypass Program command can then be issued to program
addresses within the bank, or the Unlock Bypass Reset command can be issued to return
the bank to Read mode. In Unlock Bypass mode the memory can be read as if in Read
mode.
38/94
M29DW128F
6.2.10
Command interface
Unlock Bypass Program command
The Unlock Bypass Program command can be used to program one address in the memory array at a
time. The command requires two Bus Write operations, the final write operation latches the address and
data and starts the Program/Erase Controller.
The Program operation using the Unlock Bypass Program command behaves identically to the Program
operation using the Program command. The operation cannot be aborted, a Bus Read operation to the
Bank where the command was issued outputs the Status Register. See the Program command for details
on the behavior.
6.2.11
Unlock Bypass Reset command
The Unlock Bypass Reset command can be used to return to Read/Reset mode from Unlock Bypass
mode. Two Bus Write operations are required to issue the Unlock Bypass Reset command. Read/Reset
command does not exit from Unlock Bypass mode.
Table 13.
Fast Program Commands, 8-bit mode(1)
Command
Length
Bus Write operations
1st
2nd
3rd
4th
5th
6th
Add
Data
Add
Data
Add
Data
Add
Data
Add
BA
N(2)
PA
(3)
PD
Write to Buffer
and Program
N
+
5
AAA
AA
555
55
BA
25
Write to Buffer
and Program
Abort and
Reset
3
AAA
AA
555
55
AAA
F0
Write to Buffer
and Program
Confirm
1
Double byte
Program
BA
Data
(5)
29
3
AAA
50
PA0
PD0
PA1
PD1
Quadruple byte
Program
5
AAA
56
PA0
PD0
PA1
PD1
PA2
PD2
PA3
PD3
Octuple byte
Program
9
AAA
8B
PA0
PD0
PA1
PD1
PA2
PD2
PA3
PD3
Unlock Bypass
3
AAA
AA
555
55
AAA
20
Unlock Bypass
Program
2
X
A0
PA
PD
Unlock Bypass
Reset
2
X
90
X
00
Add
WBL
7th
Data
(4)
PD
PA4
PD4
8th
9th
Add
Data
Add
Data
Add
Data
PA5
PD5
PA6
PD6
PA7
PD7
1.
X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block, BKA Bank Address, WBL Write Buffer Location. All
values in the table are in hexadecimal.
2.
The maximum number of cycles in the command sequence is 68. N+1 is the number of bytes to be programmed during the Write to Buffer
and Program operation.
3.
Each buffer has the same A5-A22 addresses. A0-A4 and A-1 are used to select a byte within the N+1 byte page.
4.
The 6th cycle has to be issued N time. WBL scans the byte inside the page.
5.
BA must be identical to the address loaded during the Write to buffer and Program 3rd and 4th cycles.
39/94
Command interface
Table 14.
M29DW128F
Fast Program Commands, 16-bit mode(1)
Command
Length
Bus Write operations
1st
2nd
3rd
4th
5th
6th
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
N+
5
555
AA
2AA
55
BA
25
BA
N(2)
PA(3)
PD
Write to Buffer and Program Abort and
Reset
3
555
AA
2AA
55
555
F0
Write to Buffer and Program Confirm
1
BA(5)
29
Double Word Program
3
555
50
PA0
PD0
PA1
PD1
Quadruple Word Program
5
555
56
PA0
PD0
PA1
PD1
PA2
PD2
PA3
PD3
Unlock Bypass
3
555
AA
2AA
55
555
20
Unlock Bypass Program
2
X
A0
PA
PD
Unlock Bypass Reset
2
X
90
X
00
Write to Buffer and Program
Add
WBL
(4)
1. X Don’t Care, PA Program Address, PD Program Data, BA Any address in the Block, BKA Bank Address, WBL Write
Buffer Location. All values in the table are in hexadecimal.
2. The maximum number of cycles in the command sequence is 36. N+1 is the number of Words to be programmed during
the Write to Buffer and Program operation.
3. Each buffer has the same A5-A22 addresses. A0-A4 are used to select a Word within the N+1 Word page.
4. The 6th cycle has to be issued N time. WBL scans the Word inside the page.
5. BA must be identical to the address loaded during the Write to buffer and Program 3rd and 4th cycles.
40/94
Data
PD
M29DW128F
6.3
Command interface
Block Protection commands
Blocks or groups of blocks can be protected against accidental program, erase or read
operations. The Protection Groups are shown in Appendix A, Table 34: Block Addresses
and Protection Groups. The device block protection scheme is shown in Figure 7: Software
Protection scheme and Figure 6: Block Protection State diagram. See either Table 15, or
Table 16, depending on the configuration that is being used, for a summary of the Block
Protection commands.
Only the commands related to the Extended Block Protection are available in both 8 bit and
16 bit memory configuration. The other block protection commands are available in 16-bit
configuration only.
6.3.1
Enter Extended Block command
The M29DW128F has one extra 256-byte block (Extended Block) that can only be accessed
using the Enter Extended Block command.
Three Bus Write cycles are required to issue the Extended Block command. Once the
command has been issued the device enters the Extended Block mode where all Bus Read
or Program operations are conducted on the Extended Block. Once the device is in the
Extended Block mode, the Extended Block is addressed by using the addresses occupied
by the boot blocks in the other operating modes (see Table 34: Block Addresses and
Protection Groups).
The device remains in Extended Block mode until the Exit Extended Block command is
issued or power is removed from the device. After power-up or a hardware reset, the device
reverts to the Read mode where commands issued to the Boot Block Address space will
address the Boot Blocks.
Note that when the device is in the Extended Block mode, the VPP/WP pin cannot be used
for fast programming and the Unlock Bypass mode is not available.
The Extended Block cannot be erased, and can be treated as one-time programmable
(OTP) memory. In Extended Block mode only array cell locations (Bank A) with the same
addresses as the Extended Block are not accessible. In Extended Block mode dual
operations are allowed and the Extended Block physically belongs to Bank A.
In Extended Block mode, Erase, Chip Erase, Erase Suspend and Erase resume commands
are not allowed.
To exit from the Extended Block mode the Exit Extended Block command must be issued.
The Extended Block can be protected by setting the Extended Block Protection bit to ‘1’;
however once protected the protection cannot be undone.
6.3.2
Exit Extended Block command
The Exit Extended Block command is used to exit from the Extended Block mode and return
the device to Read mode. Four Bus Write operations are required to issue the command.
41/94
Command interface
6.3.3
M29DW128F
Set Extended Block Protection bit command
The Set Extended Block Protection bit command programs the Extended Block Protection
bit to ‘1’ thus preventing the second section of the Extended Block from being programmed.
A Read/Reset command must be issued to abort a Set Extended Block Protection bit
command.
Six successive steps are required to issue the Set Extended Block Protection bit command.
6.3.4
1.
The command starts with two unlock cycles.
2.
The third Bus Write cycle sets up the Set Extended Block Protection bit command.
3.
The fourth Bus Write Cycle programs the Extended Block Protection bit to ‘1’.
4.
The last two cycles verify the value programmed at the Extended Block Protection bit
address: if bit DQ0 of Data Inputs/Outputs is set to ’1’, it indicates that the Extended
Block Protection bit has been successfully programmed. If DQ0 is ‘0’, the Set Extended
Block Protection bit command must be issued and verified again.
Verify Extended Block Protection bit command
The Verify Extended Block Protection bit command reads the status of the Extended Block
Protection bit on bit DQ0 of the Data Inputs/Outputs. If DQ0 is ‘1’, the second section of the
Extended Block is protected from program operations.
6.3.5
Password Program command
The Password Program Command is used to program the 64-bit Password used in
Password Protection mode.
Four cycles are required to program the Password:
1.
The first two cycles are unlock cycles.
2.
The third cycle issues the Password Program command.
3.
The fourth cycle inputs the 16-bit data required to program the Password.
To program the 64-bit Password, the complete command sequence must be entered four
times at four consecutive addresses selected by A1 to A0.
Read operations can be used to read the Status Register during a Password Program
operation. All other operations are forbidden.
The Password can be checked by issuing a Password Verify command.
Once Password Program operation has completed, a Read/ Reset command must be
issued to return the device to Read mode. The Password Protection mode can then be
selected.
By default, all Password bits are set to ‘1’.
42/94
M29DW128F
6.3.6
Command interface
Password Verify command
The Password Verify Command is used to verify the Password used in Password Protection
mode. To verify the 64-bit Password, the complete command sequence must be entered
four times at four consecutive addresses selected by A1 to A0. If the Password Mode
Locking bit is programmed and the user attempts to verify the Password, the device will
output all F’s onto the I/O data bus. The Password is output regardless of the bank address.
The user must issue a Read/reset command to return the device to Read mode.
Dual operations are not allowed during a Password Verify operation.
6.3.7
Password Protection Unlock command
The Password Protection Unlock command is used to clear the Lock-Down bit in order to
unprotect all Non-Volatile Modify Protection bits when the device is in Password Protection
mode. The Password Protection Unlock command must be issued along with the correct
Password.
The complete command sequence must be entered for each 16 bits of the Password.
There must be a 2µs delay between successive Password Protection Unlock commands in
order to prevent hackers from cracking the Password by trying all possible 64-bit
combinations. If this delay is not respected, the latest command will be ignored.
6.3.8
Set Password Protection mode command
The Set Password Protection Mode command puts the device in Password Protection mode
by programming the Password Protection Mode Lock bit to ‘1’. This command can be issued
either with the Reset/Block Temporary Unprotect pin, RP, at VID or at VIH.
Six cycles are required to issue a Set Password Protection Mode command:
1.
The first two cycles are unlock cycles.
2.
The third cycle issues the command.
3.
The fourth and fifth cycles select the address (see Table 34).
4.
The last cycle verifies if the operation has been successful. If DQ0 is set to ’1’, the
device has successfully entered the Password Protection mode. If DQ0 is ‘0’, the
operation has failed and the command must be re-issued.
There must be a 100µs delay between the fourth and fifth cycles.
Once the Password Protection mode is activated the device will permanently remain in this
mode.
6.3.9
Verify Password Protection mode command
The Verify Password Protection Mode command reads the status of the Password
Protection Mode Lock bit. If it is ‘1’, the device is in Password Protection mode.
43/94
Command interface
6.3.10
M29DW128F
Set Standard Protection mode command
The Set Standard Protection Mode command puts the device in Standard Protection mode
by programming the Standard Protection Mode Lock bit to ‘1’.
Six cycles are required to issue the Standard Protection Mode command:
1.
The first two cycles are unlock cycles.
2.
The third cycle issues the program command.
3.
The fourth and fifth cycles select the address (see Table 34).
4.
The last cycle verifies if the operation has been successful. If DQ0 is set to ’1’, the
Standard Protection Mode has been successfully activated. If DQ0 is ‘0’, the operation
has failed and the command must be re-issued.
There must be a 100µs delay between the fourth and fifth cycles.
Once the Standard Protection mode is activated the device will permanently remain in this
mode.
6.3.11
Verify Standard Protection mode command
The Verify Standard Protection Mode command reads the status of the Standard Protection
Mode Lock bit. If it is ‘1’, the device is in Standard Protection mode.
6.3.12
Set Non-Volatile Modify Protection bit command
A block or group of blocks can be protected from program or erase by issuing a Set NonVolatile Modify Protection bit command along with the block address. This command sets
the Non-Volatile Modify Protection bit to ‘1’ for a given block or group of blocks.
Six cycles are required to issue the command:
1.
The first two cycles are unlock cycles.
2.
The third cycle issues the program command.
3.
The fourth and fifth cycles select the address (see Table 34).
4.
The last cycle verifies if the operation has been successful. If DQ0 is set to ’1’, the NonVolatile Modify Protection bit has been successfully programmed. If DQ0 is ‘0’, the
operation has failed and the command must be re-issued.
There must be a 100µs delay between the fourth and fifth cycles.
The Non-Volatile Modify Protection bits are erased simultaneously by issuing a Clear NonVolatile Modify Protection bits command except if the Lock-Down bit is set to ‘1’.
The Non-Volatile Modify Protection bits can be set a maximum of 100 times.
6.3.13
Verify Non-Volatile Modify Protection bit command
The status of a Non-Volatile Modify Protection bit for a given block or group of blocks can be
read by issuing a Verify Non-Volatile Modify Protection Bit command along with the block
address.
44/94
M29DW128F
6.3.14
Command interface
Clear Non-Volatile Modify Protection bits command
This command is used to clear all Non-Volatile Modify Protection bits. No specific block
address is required. If the Lock-Down bit is set to ‘1’, the command will fail.
Six cycles are required to issue a Clear Non-Volatile Modify Protection bits command:
1.
The first two cycles are unlock cycles.
2.
The third cycle issues the command.
3.
The last three cycles verify if the operation has been successful. If DQ0 is set to ’0’, all
Non-Volatile Modify Protection bits have been successfully cleared. If DQ0 is ‘1’, the
operation has failed and the command must be re-issued.
There must be a 12ms delay between the fourth and fifth cycles.
6.3.15
Set Lock bit command
The Set Lock bit command individually sets the Lock bit to ‘1’ for a given block or group of
blocks.
If the Non-Volatile Lock bit for the same block or group of blocks is set, the block is locked
regardless of the value of the Lock bit. (see Table 10: Block Protection status).
6.3.16
Clear Lock bit command
The Clear Lock bit command individually clears (sets to ‘0’) the Lock bit for a given block or
group of blocks.
If the Non-Volatile Lock bit for the same block or group of blocks is set, the block or group of
blocks remains locked (see Table 10: Block Protection status).
6.3.17
Verify Lock bit command
The status of a Lock bit for a given block can be read by issuing a Verify Lock bit command
along with the block address.
6.3.18
Set Lock-Down bit command
This command is used to set the Lock-Down bit to ‘1’ thus protecting the Non-Volatile Modify
Protection bits from program and erase.
There is no Unprotect Lock-Down bit command.
6.3.19
Verify Lock-Down bit command
This command is used to read the status of the Lock-Down bit. The status is output on bit
DQ1. If DQ1 is ‘1’, all the Non-Volatile Modify Protection bits are protected from program or
erase operations.
45/94
Command interface
M29DW128F
Block Protection Commands, 8-bit mode(1)(2)
Table 15.
Length
Bus operations
Command
1st
2nd
3rd
4th
5th
Add
Data
Add
Data
Add
Data
Add
Data
Set Extended Block Protection bit
6
AAA
AA
555
55
AAA
60
OW
68
Verify Extended Block Protection
bit
4
AAA
AA
555
55
AAA
60
OW
DQ0
Enter Extended Block
3
AAA
AA
555
55
AAA
88
Exit Extended Block
4
AAA
AA
555
55
AAA
90
X
00
Add
OW
(3)
6th
Data
Add
Data
48
OW
DQ0
1. OW Extended Block Protection bit Address (A7-A0=’00011010’), X Don’t Care. All values in the table are in hexadecimal.
2. Grey cells represent Read cycles. The other cells are Write cycles.
3. A 100µs timeout is required between cycles 4 and 5.
Table 16.
Block Protection Commands, 16-bit mode (1)(2)(3)(4)
Command
Length
Bus operations
1st
Add
2nd
3rd
4th
Data Add Data Add Data
5th
Data
Add
Data
Add
Data
OW
48
OW
DQ0
PWA
[1]
RPW
[1]
PWA
[2]
RPW
[2]
PL
48
PL
DQ0
(BA)/
NVMP
48
(BA)/
NVMP
DQ0
6
555
AA
2AA
55
555
60
OW
68
Verify Extended
Block
Protection bit
4
555
AA
2AA
55
555
60
OW
DQ0
Enter Extended
Block
3
555
AA
2AA
55
555
88
Exit Extended
Block
4
555
AA
2AA
55
555
90
X
00
Password
Program (5)(7)(8)
4
555
AA
2AA
55
555
38
X[0-3]
PW
[0-3]
Password
Verify(8)(9)
4
555
AA
2AA
55
555
C8
PWA
[0-3]
RPW
[0-3]
Password
Protection
Unlock(7)(10)(11)
7
555
AA
2AA
55
555
28
Set Password
Protection
mode(5)(6)
6
555
AA
2AA
55
555
60
PL
68
Verify Password
Protection
mode
4
555
AA
2AA
55
555
60
PL
DQ0
6
555
AA
2AA
55
555
60
(BA)/
NVMP
68
(6)
46/94
7th
Add
Set Extended
Block
Protection
bit(5)(6)
Set NonVolatile Modify
Protection bit(5)
6th
PWA[0] RPW[0]
Add
Data
PWA RPW
[3]
[3]
M29DW128F
Table 16.
Command interface
Block Protection Commands, 16-bit mode (continued)(1)(2)(3)(4)
Command
Length
Bus operations
1st
Add
2nd
3rd
4th
Data Add Data Add Data
5th
6th
Add
Data
Add
Data
7th
Add
Data
Verify NonVolatile Modify
Protection bit
4
555
AA
2AA
55
555
60
(BA)/
NVMP
48
(BA)/
NVMP
DQ0
Clear NonVolatile Modify
Protection
bits(12)(13)(14)
6
555
AA
2AA
55
555
60
NVMP
60
(BA)/
NVMP
40
(BA)/
NVMP
DQ0
Set Lock-Down
bit
3
555
AA
2AA
55
555
78
Verify LockDown bit(15)
4
555
AA
2AA
55
555
58
BA
DQ1
Set Lock bit(7)
4
555
AA
2AA
55
555
48
BA
X1h
Clear Lock bit(7) 4
555
AA
2AA
55
555
48
BA
X0h
Verify Lock bit
4
555
AA
2AA
55
555
58
BA
DQ0
Set Standard
Protection
mode(5)(6)
6
555
AA
2AA
55
555
60
SL
68
SL
48
SL
DQ0
Verify Standard
Protection
mode(5)
4
555
AA
2AA
55
555
60
SL
DQ0
Add
Data
1. Grey cells represent Read cycles. The other cells are Write cycles.
2. SA Protection Group Address, BA Any address in the Block, BKA Bank Address, SL Standard Protection Mode Lock bit
Address, PL Password Protection Mode Lock bit Address, PW Password Data, PWA Password Address, RPW Password
Data Being Verified, NVMP Non-Volatile Modify Protection bit Address, OW Extended Block Protection bit Address, X Don’t
Care. All values in the table are in hexadecimal.
3. Addresses are described in Table 34.
4. During Unlock and Command cycles, if the lower address bits are 555h or 2AAh then the address bits higher than A11
(except where BA is required) and data bits higher than DQ7 are Don't Care.
5. A Reset Command must be issued to return to the Read mode.
6. The 4th Bus Write cycle programs a protection bit (Extended Block Protection bit, Password Protection Mode Lock bit,
Standard Protection Mode Lock bit, and a block NVMP bit). The 5th and 6th cycles verify that the bit has been successively
programmed when DQ0=1. If DQ0=0 in the 6th cycle, the program command must be issued again and verified again. A
100µs delay is required between the 4th and the 5th cycle.
7. Data is latched on the rising edge of W.
8. The entire command sequence must be entered for each portion of the password.
9. The command sequence returns FFh if the Password Protection Mode locking bit is set.
10. The password is written over four consecutive cycles, at addresses [0-3]
11. A 2µs timeout is required between any two portions of the password.
12. A 10ms delay is required between the 4th and the 5th cycle.
13. A 12ms timeout is required between cycles 4 and 5.
14. Cycle 4 erases all Non-Volatile Modify Protection bits. Cycles 5 and 6 verify that the bits have been successfully cleared
when DQ0=0. If DQ0=1 in the 6th cycle, the erase command must be issued again and verified again. Before issuing the
erase command, all Non-Volatile Modify Protection bits should be programmed to prevent over erasure.
15. DQ1=1 if the Non-Volatile Modify Protection bit is locked, DQ1 = 0 if it is unlocked.
47/94
Command interface
Table 17.
M29DW128F
Protection Command Addresses
Bit
Condition
Address Inputs A7-A0
Other Address Inputs
RP at VIH
00001010
X
RP at VID
10001010
X
Standard Protection Mode Lock bit Address (SL)
00010010
X
Non-Volatile Modify Protection bit Address (NVMP)
00000010
Block Protection Group
Address
Extended Block Protection bit Address (OW)
00011010
X
Password Protection Mode Lock bit Address
(PL)
Table 18.
Program, Erase Times and Program, Erase Endurance Cycles
Parameter
Min
Chip Erase
Typ(1)(2)
Max(2)
Unit
80
400(3)
s
(4)
6
s
50(4)
µs
10
200(3)
µs
90
700(3)
µs
280
1400(3)
µs
10
200(3)
µs
90
700(3)
µs
280
1400(3)
µs
80
400(3)
s
40
200
(3)
s
20
100
(3)
s
Chip Program (Octuple byte or Quadruple Word)
10
50(3)
s
Program Suspend Latency Time
5
15
µs
Block Erase (64 kbytes)
0.8
Erase Suspend Latency Time
Single or Multiple byte Program
(1, 2, 4 or 8 bytes at-a-time)
Byte Program
Write to Buffer and Program
(64 bytes at-a-time)
VPP/WP =VPPH
VPP/WP=VIH
Single or Multiple Word Program
(1, 2 or 4 Words at-a-time)
Word Program
Write to Buffer and Program
(32 Words at-a-time)
VPP/WP=VPPH
VPP/WP=VIH
Chip Program (byte by byte)
Chip Program (Word by Word)
Chip Program (Quadruple byte or Double Word)
Program/Erase Cycles (per Block)
Data Retention
100,000
cycles
20
years
1. Typical values measured at room temperature and nominal voltages.
2. Sampled, but not 100% tested.
3. Maximum value measured at worst case conditions for both temperature and VCC after 100,00 program/erase cycles.
4. Maximum value measured at worst case conditions for both temperature and VCC.
48/94
M29DW128F
7
Status Register
Status Register
The M29DW128F has one Status Register. The Status Register provides information on the
current or previous Program or Erase operations executed in each bank. The various bits
convey information and errors on the operation. Bus Read operations from any address
within the Bank, always read the Status Register during Program and Erase operations. It is
also read during Erase Suspend when an address within a block being erased is accessed.
The bits in the Status Register are summarized in Table 19: Status Register bits.
7.1
Data Polling bit (DQ7)
The Data Polling bit can be used to identify whether the Program/Erase Controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Data
Polling bit is output on DQ7 when the Status Register is read.
During Program operations the Data Polling bit outputs the complement of the bit being
programmed to DQ7. After successful completion of the Program operation the memory
returns to Read mode and Bus Read operations from the address just programmed output
DQ7, not its complement.
During Erase operations the Data Polling bit outputs ’0’, the complement of the erased state
of DQ7. After successful completion of the Erase operation the memory returns to Read
mode.
In Erase Suspend mode the Data Polling bit will output a ’1’ during a Bus Read operation
within a block being erased. The Data Polling bit will change from a ’0’ to a ’1’ when the
Program/Erase Controller has suspended the Erase operation.
Figure 8: Data Polling flowchart, gives an example of how to use the Data Polling bit. A Valid
Address is the address being programmed or an address within the block being erased.
7.2
Toggle bit (DQ6)
The Toggle bit can be used to identify whether the Program/Erase Controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Toggle
bit is output on DQ6 when the Status Register is read.
During a Program/Erase operation the Toggle bit changes from ’0’ to ’1’ to ’0’, etc., with
successive Bus Read operations at any address. After successful completion of the
operation the memory returns to Read mode.
During Erase Suspend mode the Toggle bit will output when addressing a cell within a block
being erased. The Toggle bit will stop toggling when the Program/Erase Controller has
suspended the Erase operation.
Figure 9: Toggle flowchart, gives an example of how to use the Data Toggle bit. Figure 16
and Figure 17 describe Toggle bit timing waveform.
49/94
Status Register
7.3
M29DW128F
Error bit (DQ5)
The Error bit can be used to identify errors detected by the Program/Erase Controller. The
Error bit is set to ’1’ when a Program, Block Erase or Chip Erase operation fails to write the
correct data to the memory. If the Error bit is set a Read/Reset command must be issued
before other commands are issued. The Error bit is output on DQ5 when the Status Register
is read.
Note that the Program command cannot change a bit set to ’0’ back to ’1’ and attempting to
do so will set DQ5 to ‘1’. A Bus Read operation to that address will show the bit is still ‘0’.
One of the Erase commands must be used to set all the bits in a block or in the whole
memory from ’0’ to ’1’.
7.4
Erase Timer bit (DQ3)
The Erase Timer bit can be used to identify the start of Program/Erase Controller operation
during a Block Erase command. Once the Program/Erase Controller starts erasing the
Erase Timer bit is set to ’1’. Before the Program/Erase Controller starts the Erase Timer bit
is set to ’0’ and additional blocks to be erased may be written to the Command Interface.
The Erase Timer bit is output on DQ3 when the Status Register is read.
7.5
Alternative Toggle bit (DQ2)
The Alternative Toggle bit can be used to monitor the Program/Erase controller during Erase
operations. The Alternative Toggle bit is output on DQ2 when the Status Register is read.
During Chip Erase and Block Erase operations the Toggle bit changes from ’0’ to ’1’ to ’0’,
etc., with successive Bus Read operations from addresses within the blocks being erased. A
protected block is treated the same as a block not being erased. Once the operation
completes the memory returns to Read mode.
During Erase Suspend the Alternative Toggle bit changes from ’0’ to ’1’ to ’0’, etc. with
successive Bus Read operations from addresses within the blocks being erased. Bus Read
operations to addresses within blocks not being erased will output the memory array data as
if in Read mode.
After an Erase operation that causes the Error bit to be set, the Alternative Toggle bit can be
used to identify which block or blocks have caused the error. The Alternative Toggle bit
changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read Operations from addresses
within blocks that have not erased correctly. The Alternative Toggle bit does not change if
the addressed block has erased correctly.
Figure 16 and Figure 17 describe Alternative Toggle bit timing waveform.
7.6
Write to Buffer and Program Abort bit (DQ1)
The Write to Buffer and Program Abort bit, DQ1, is set to ‘1’ when a Write to Buffer and
Program operation aborts. The Write to Buffer and Program Abort and Reset command
must be issued to return the device to Read mode (see Write to Buffer and Program in
COMMANDS section).
50/94
M29DW128F
Table 19.
Status Register
Status Register bits(1)(2)
Operation
Address
DQ7
DQ6
DQ5
DQ3
DQ2
DQ1
RB
Program
Bank Address
DQ7
Toggle
0
–
–
0
0
Program During Erase
Suspend
Bank Address
DQ7
Toggle
0
–
–
–
0
Write to Buffer and
Program Abort
Bank Address
DQ7
Toggle
0
–
–
1
0
Program Error
Bank Address
DQ7
Toggle
1
–
–
–
Hi-Z
Chip Erase
Any Address
0
Toggle
0
1
Toggle
–
0
Block Erase before
timeout
Erasing Block
0
Toggle
0
0
Toggle
–
0
Non-Erasing Block
0
Toggle
0
0
No Toggle
–
0
Erasing Block
0
Toggle
0
1
Toggle
–
0
Non-Erasing Block
0
Toggle
0
1
No Toggle
–
0
Erasing Block
1
No Toggle
0
–
Toggle
–
Hi-Z
–
Hi-Z
Block Erase
Erase Suspend
Non-Erasing Block
Data read as normal
Good Block Address
0
Toggle
1
1
No Toggle
–
Hi-Z
Faulty Block Address
0
Toggle
1
1
Toggle
–
Hi-Z
Erase Error
1. Unspecified data bits should be ignored.
2. Figure 16 and Figure 17 describe Toggle and Alternative Toggle bits timing waveforms.
Figure 8.
Data Polling flowchart
START
READ DQ5 & DQ7
at VALID ADDRESS
DQ7
=
DATA
YES
NO
NO
DQ5 = 1
YES
READ DQ7
at VALID ADDRESS
DQ7
=
DATA
NO
FAIL
YES
PASS
AI07760
51/94
Status Register
Figure 9.
M29DW128F
Toggle flowchart
START
READ DQ6
ADDRESS = BA
READ
DQ5 & DQ6
ADDRESS = BA
DQ6
=
TOGGLE
NO
YES
NO
DQ5
=1
YES
READ DQ6
TWICE
ADDRESS = BA
DQ6
=
TOGGLE
NO
YES
FAIL
PASS
AI08929b
1. BA = Address of Bank being Programmed or Erased.
52/94
M29DW128F
8
Dual Operations and Multiple Bank architecture
Dual Operations and Multiple Bank architecture
The Multiple Bank Architecture of the M29DW128F gives greater flexibility for software developers to split
the code and data spaces within the memory array. The Dual Operations feature simplifies the software
management of the device by allowing code to be executed from one bank while another bank is being
programmed or erased.
The Dual Operations feature means that while programming or erasing in one bank, read operations are
possible in another bank with zero latency.
Only one bank at a time is allowed to be in program or erase mode. However, certain commands can
cross bank boundaries, which means that during an operation only the banks that are not concerned with
the cross bank operation are available for dual operations. For example, if a Block Erase command is
issued to erase blocks in both Bank A and Bank B, then only Banks C or D are available for read
operations while the erase is being executed.
If a read operation is required in a bank, which is programming or erasing, the program or erase
operation can be suspended.
Also if the suspended operation was erase then a program command can be issued to another block, so
the device can have one block in Erase Suspend mode, one programming and other banks in read mode.
By using a combination of these features, read operations are possible at any moment.
Table 20 and Table 21 show the dual operations possible in other banks and in the same bank. Note that
only the commonly used commands are represented in these tables.
Table 20.
Dual Operations allowed in other Banks(1)
Commands allowed in another bank
Status of Bank
Read/
Reset
Read
Read CFI
Status
Query
(2)
Register
Auto
Select
Program
Erase
Program/
Erase
Suspend
Program/
Erase
Resume
Idle
Yes
Yes(3)
Yes
Yes
Yes
Yes
Yes(3)
Yes(4)
Programming
Yes
No
No
No
–
–
No
No
Erasing
Yes
No
No
No
–
–
No
No
Program Suspended
Yes
No
Yes
Yes
No
No
-
Yes(5)
Erase Suspended
Yes
No
Yes
Yes
Yes
No
-
Yes(6)
1. If several banks are involved in a program or erase operation, then only the banks that are not concerned with the
operation are available for dual operations.
2. Read Status Register is not a command. The Status Register can be read during a block program or erase operation.
3. Only after a program or erase operation in that bank.
4. Only after a Program or Erase Suspend command in that bank.
5. Only a Program Resume is allowed if the bank was previously in Program Suspend mode.
6. Only an Erase Resume is allowed if the bank was previously in Erase Suspend mode.
53/94
Dual Operations and Multiple Bank architecture
Table 21.
M29DW128F
Dual Operations allowed in same Bank
Commands allowed in same Bank
Status of Bank
Read/
Reset
Read
Status
Register
Read CFI
Query
Auto
Select
Program
Erase
Program/
Erase
Suspend
Program/
Erase
Resume
(1)
Idle
Yes
Yes
Yes
Yes
Yes
Yes
Yes(2)
Yes(3)
Programming
No
Yes
No
No
–
–
Yes(4)
–
(5)
–
Erasing
No
Yes
No
No
–
No
Yes
Program
Suspended
Yes(6)
No
Yes
Yes
No
–
–
Yes
Erase Suspended
Yes(6)
Yes(7)
Yes
Yes
Yes(6)
No
–
Yes
1. Read Status Register is not a command. The Status Register can be read by addressing the block being programmed or
erased.
2. Only after a program or erase operation in that bank.
3. Only after a Program or Erase Suspend command in that bank.
4. Only a Program Suspend.
5. Only an Erase suspend.
6. Not allowed in the Block or Word that is being erased or programmed.
7. The Status Register can be read by addressing the block being erase suspended.
54/94
M29DW128F
9
Maximum rating
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. Exposure to Absolute Maximum Rating conditions
for extended periods may affect device reliability. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the
Operating sections of this specification is not implied. Refer also to the STMicroelectronics
SURE Program and other relevant quality documents.
Table 22.
Absolute maximum ratings
Symbol
Parameter
Min
Max
Unit
TBIAS
Temperature Under Bias
–50
125
°C
TSTG
Storage Temperature
–65
150
°C
–0.6
VCC +0.6
V
voltage(1)(2)
VIO
Input or Output
VCC
Supply voltage
–0.6
4
V
VID
Identification voltage
–0.6
13.5
V
Program voltage
–0.6
13.5
V
VPP(3)
1. Minimum voltage may undershoot to –2V during transition and for less than 20ns during transitions.
2. Maximum voltage may overshoot to VCC +2V during transition and for less than 20ns during transitions.
3. VPP must not remain at 12V for more than a total of 80hrs.
55/94
DC and AC parameters
10
M29DW128F
DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics Tables that
follow, are derived from tests performed under the Measurement Conditions summarized in
Table 23: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Table 23.
Operating and AC measurement conditions
M29DW128F
Parameter
60
70
Min
Max
Min
Max
VCC supply voltage
2.7
3.6
2.7
3.6
V
Ambient Operating Temperature
–40
85
–40
85
°C
Load capacitance (CL)
30
Input Rise and Fall Times
30
10
Input pulse voltages
10
V
VCC/2
VCC/2
V
VCC
VCC/2
0V
AI05557
Figure 11. AC measurement Load Circuit
VCC
VCC
25kΩ
DEVICE
UNDER
TEST
CL
0.1µF
ns
0 to VCC
Figure 10. AC measurement I/O waveform
VPP
pF
0 to VCC
Input and Output Timing Ref. voltages
25kΩ
0.1µF
CL includes JIG capacitance
AI05558
56/94
Unit
M29DW128F
Table 24.
Device capacitance
Symbol
CIN
COUT
DC and AC parameters
Parameter
Input capacitance
Output capacitance
Max(1)
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Test condition
Min
1. Sampled only, not 100% tested.
Table 25.
Symbol
DC Characteristics
Parameter
Test condition
Min
Max
Unit
0V ≤VIN ≤VCC
±1
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
0V ≤VOUT ≤VCC
±1
µA
Supply Current (Read)
E = VIL, G = VIH,
f = 6MHz
10
mA
Supply Current (Standby)
E = VCC ±0.2V,
RP = VCC ±0.2V
100
µA
VPP/WP =
VIL or VIH
20
mA
VPP/WP =
VPPH
20
mA
ICC1(1)
ICC2
ICC3(1)(2)
Supply Current
(Program/Erase)
Program/Erase
Controller active
VIL
Input Low voltage
–0.5
0.8
V
VIH
Input High voltage
0.7VCC
VCC +0.3
V
11.5
12.5
V
VPPH
Voltage for VPP/WP Program
Acceleration
VCC = 2.7V ±10%
IPP
Current for VPP/WP Program
Acceleration
VCC =2.7V ±10%
15
mA
VOL
Output Low voltage
IOL = 1.8mA
0.45
V
VOH
Output High voltage
IOH = –100µA
VID
Identification voltage
11.5
12.5
V
Program/Erase Lockout supply
voltage
1.8
2.3
V
VLKO
VCC –0.4
V
1. In Dual operations the Supply Current will be the sum of ICC1(read) and ICC3 (program/erase).
2. Sampled only, not 100% tested.
57/94
DC and AC parameters
M29DW128F
Figure 12. Random Read AC waveforms
tAVAV
A0-A22/
A–1
VALID
tAVQV
tAXQX
E
tELQV
tEHQX
tELQX
tEHQZ
G
tGLQX
tGHQX
tGHQZ
tGLQV
DQ0-DQ7/
DQ8-DQ15
VALID
tBHQV
BYTE
tELBL/tELBH
tBLQZ
AI08970
58/94
DQ0-DQ15
G
E
tELQV
tAVQV
VALID
tGLQV
VALID
tAVQV1
VALID
A0-A2
VALID
VALID
A3-A22
A-1
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
tGHQZ
tGHQX
tEHQZ
VALID
VALID
AI08971c
tEHQX
M29DW128F
DC and AC parameters
Figure 13. Page Read AC waveforms
59/94
DC and AC parameters
Table 26.
M29DW128F
Read AC characteristics
M29DW128F
Symbol
Alt
Parameter
Test condition
Unit
60
70
tAVAV
tRC
Address Valid to Next Address Valid
E = VIL,
G = VIL
Min
60
70
ns
tAVQV
tACC
Address Valid to Output Valid
E = VIL,
G = VIL
Max
60
70
ns
tAVQV1
tPAGE
Address Valid to Output Valid (Page)
E = VIL,
G = VIL
Max
25
30
ns
tELQX(1)
tLZ
Chip Enable Low to Output Transition
G = VIL
Min
0
0
ns
tELQV
tCE
Chip Enable Low to Output Valid
G = VIL
Max
60
70
ns
tGLQX(1)
tOLZ
Output Enable Low to Output
Transition
E = VIL
Min
0
0
ns
tGLQV
tOE
Output Enable Low to Output Valid
E = VIL
Max
20
25
ns
tEHQZ(1)
tHZ
Chip Enable High to Output Hi-Z
G = VIL
Max
25
25
ns
tGHQZ(1)
tDF
Output Enable High to Output Hi-Z
E = VIL
Max
25
25
ns
tEHQX
tGHQX
tAXQX
tOH
Chip Enable, Output Enable or
Address Transition to Output Transition
Min
0
0
ns
tELBL
tELBH
tELFL
tELFH
Chip Enable to BYTE Low or High(2)
Max
5
5
ns
tBLQZ
tFLQZ
BYTE Low to Output Hi-Z(2)
Max
25
25
ns
Max
30
30
ns
tBHQV
tFHQV
BYTE High to Output
1. Sampled only, not 100% tested.
2. TSOP56 package only.
60/94
Valid(2)
M29DW128F
DC and AC parameters
Figure 14. Write AC waveforms, Write Enable Controlled
tAVAV
A0-A22/
A–1
VALID
tWLAX
tAVWL
tWHEH
E
tELWL
tWHGL
G
tGHWL
tWLWH
W
tWHWL
tDVWH
DQ0-DQ7/
DQ8-DQ15
tWHDX
VALID
VCC
tVCHEL
RB
tWHRL
AI08972
Table 27.
Write AC characteristics, Write Enable Controlled
M29DW128F
Symbol
Alt
Parameter
Unit
60
70
tAVAV
tWC
Address Valid to Next Address Valid
Min
60
70
ns
tELWL
tCS
Chip Enable Low to Write Enable Low
Min
0
0
ns
tWLWH
tWP
Write Enable Low to Write Enable High
Min
45
45
ns
tDVWH
tDS
Input Valid to Write Enable High
Min
45
45
ns
tWHDX
tDH
Write Enable High to Input Transition
Min
0
0
ns
tWHEH
tCH
Write Enable High to Chip Enable High
Min
0
0
ns
tWHWL
tWPH
Write Enable High to Write Enable Low
Min
30
30
ns
tAVWL
tAS
Address Valid to Write Enable Low
Min
0
0
ns
tWLAX
tAH
Write Enable Low to Address Transition
Min
45
45
ns
Output Enable High to Write Enable Low
Min
0
0
ns
tOEH
Write Enable High to Output Enable Low
Min
0
0
ns
tBUSY
Program/Erase Valid to RB Low
Max
30
30
ns
tVCS
VCC High to Chip Enable Low
Min
50
50
µs
tGHWL
tWHGL
tWHRL
(1)
tVCHEL
1. Sampled only, not 100% tested.
61/94
DC and AC parameters
M29DW128F
Figure 15. Write AC waveforms, Chip Enable Controlled
tAVAV
A0-A22/
A–1
VALID
tELAX
tAVEL
tEHWH
W
tWLEL
tEHGL
G
tGHEL
tELEH
E
tEHEL
tDVEH
DQ0-DQ7/
DQ8-DQ15
tEHDX
VALID
VCC
tVCHWL
RB
tEHRL
AI08973
Table 28.
Write AC characteristics, Chip Enable Controlled
M29DW128F
Symbol
Alt
Parameter
Unit
60
70
tAVAV
tWC
Address Valid to Next Address Valid
Min
60
70
ns
tWLEL
tWS
Write Enable Low to Chip Enable Low
Min
0
0
ns
tELEH
tCP
Chip Enable Low to Chip Enable High
Min
45
45
ns
tDVEH
tDS
Input Valid to Chip Enable High
Min
45
45
ns
tEHDX
tDH
Chip Enable High to Input Transition
Min
0
0
ns
tEHWH
tWH
Chip Enable High to Write Enable High
Min
0
0
ns
tEHEL
tCPH
Chip Enable High to Chip Enable Low
Min
30
30
ns
tAVEL
tAS
Address Valid to Chip Enable Low
Min
0
0
ns
tELAX
tAH
Chip Enable Low to Address Transition
Min
45
45
ns
Output Enable High Chip Enable Low
Min
0
0
ns
tGHEL
tEHGL
tOEH
Chip Enable High to Output Enable Low
Min
0
0
ns
tEHRL(1)
tBUSY
Program/Erase Valid to RB Low
Max
30
30
ns
tVCHWL
tVCS
VCC High to Write Enable Low
Min
50
50
µs
1. Sampled only, not 100% tested.
62/94
M29DW128F
DC and AC parameters
Figure 16. Toggle and Alternative Toggle bits mechanism, Chip Enable Controlled
Address Outside the Bank
being Programmed or Erased
A0-A22
Address Outside the Bank
being Programmed or Erased
Address in the Bank
being Programmed or Erased
tAXEL
E
G
tELQV
Data
DQ2(1)/DQ6(2)
Read Operation outside the Bank
Being Programmed or Erased
tELQV
Toggle/
Alt.Toggle Bit
Toggle/
Alt.Toggle Bit
Read Operation in the Bank
Being Programmed or Erased
Data
Read Operation Outside the Bank
Being Programmed or Erased
AI08914e
1. The Toggle bit is output on DQ6.
2. The Alternative Toggle bit is output on DQ2.
3. Refer to Table 26: Read AC characteristics for the value of tELQV.
Figure 17. Toggle and Alternative Toggle bits mechanism, Output Enable Controlled
Address Outside the Bank
being Programmed/Erased
A0-A22
Address Outside the Bank
being Programmed/Erased
Address in the Bank
being Programmed/Erased
tAXGL
G
E
tGLQV
Data
DQ2(1)/DQ6(2)
Read Operation outside Bank
Being Programmed or Erased
tGLQV
Toggle/
Alt.Toggle Bit
Toggle/
Alt.Toggle Bit
Read Operation in Bank
Being Programmed or Erased
Data
Read Operation outside Bank
Being Programmed or Erased
AI08915e
1. The Toggle bit is output on DQ6.
2. The Alternative Toggle bit is output on DQ2.
3. Refer to Table 26: Read AC characteristics for the value of tGLQV.
Table 29.
Toggle and Alternative Toggle bits AC characteristics
M29DW128F
Symbol
Alt
Parameter
Unit
60
70
tAXEL
Address Transition to Chip Enable Low
Min
10
10
ns
tAXGL
Address Transition to Output Enable Low
Min
10
10
ns
63/94
DC and AC parameters
M29DW128F
Figure 18. Reset/Block Temporary Unprotect AC waveforms (No Program/Erase ongoing)
RB
E, G
tPHEL,
tPHGL
RP
tPLPX
AI11300b
Figure 19. Reset/Block Temporary Unprotect During Program/Erase Operation AC waveforms
tPLYH
RB
tRHEL, tRHGL
E, G
RP
tPLPX
AI11301b
Figure 20. Accelerated Program Timing waveforms
VPP
VPP/WP
VIL or VIH
tVHVPP
tVHVPP
AI05563
64/94
M29DW128F
Table 30.
DC and AC parameters
Reset/Block Temporary Unprotect AC characteristics
M29DW128F
Symbol
Alt
Parameter
Unit
60
RP Low to Read mode, during Program or
Erase
Max
20
µs
tRP
RP Pulse Width
Min
500
ns
tRH
RP High to Write Enable Low, Chip Enable
Low, Output Enable Low
Min
50
ns
tRPD
RP Low to Standby Mode.
Min
20
ns
tRB
RB High to Write Enable Low, Chip Enable
Low, Output Enable Low
Min
0
ns
tPLYH(1)
tREADY
tPLPX
tPHEL,
tPHGL(1)
tRHEL
tRHGL(1)
70
1. Sampled only, not 100% tested.
65/94
Package mechanical
11
M29DW128F
Package mechanical
Figure 21. TSOP56 – 56 lead Plastic Thin Small Outline, 14 x 20mm, package outline
A2
1
N
e
E
B
N/2
D1
A
CP
D
DIE
C
α
A1
TSOP-b
L
1. Drawing is not to scale.
Table 31.
TSOP56 – 56 lead Plastic Thin Small Outline, 14 x 20mm, package mechanical data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.200
Max
0.0472
A1
0.100
0.050
0.150
0.0039
0.0020
0.0059
A2
1.000
0.950
1.050
0.0394
0.0374
0.0413
B
0.220
0.170
0.270
0.0087
0.0067
0.0106
0.100
0.210
0.0039
0.0083
C
CP
0.100
0.0039
D
20.000
19.800
20.200
0.7874
0.7795
0.7953
D1
18.400
18.300
18.500
0.7244
0.7205
0.7283
e
0.500
–
–
0.0197
–
–
E
14.000
13.900
14.100
0.5512
0.5472
0.5551
L
0.600
0.500
0.700
0.0236
0.0197
0.0276
α
3°
0
5°
3°
0
5°
N
56
66/94
56
M29DW128F
Package mechanical
Figure 22. TBGA64 10x13mm - 8x8 active ball array, 1mm pitch, package outline
D
D1
FD
FE
E
SD
SE
E1
ddd
BALL "A1"
A
e
b
A2
A1
BGA-Z23
1. Drawing is not to scale.
Table 32.
TBGA64 10x13mm - 8x8 active ball array, 1mm pitch, package mechanical data
millimeters
inches
Symbol
Typ
Min
A
Max
Typ
Min
1.200
A1
0.300
A2
0.800
b
0.200
0.350
Max
0.0472
0.0118
0.0079
0.0138
0.0138
0.0197
0.0315
0.350
0.500
D
10.000
9.900
10.100
0.3937
0.3898
0.3976
D1
7.000
–
–
0.2756
–
–
ddd
0.100
0.0039
e
1.000
–
–
0.0394
–
–
E
13.000
12.900
13.100
0.5118
0.5079
0.5157
E1
7.000
–
–
0.2756
–
–
FD
1.500
–
–
0.0591
–
–
FE
3.000
–
–
0.1181
–
–
SD
0.500
–
–
0.0197
–
–
SE
0.500
–
–
0.0197
–
–
67/94
Part numbering
12
Part numbering
Table 33.
Ordering information scheme
Example:
M29DW128F
M29DW128F
70 NF 1 T
Device type
M29
Architecture
D = Dual Operation
Operating voltage
W = VCC = 2.7 to 3.6V
Device function
128F = 128 Mbit (x8/x16), Multiple Bank, Page, Boot Block, 16+48+48+16
partitioning, Flash Memory
Speed
60 = 60ns
70 = 70ns
Package
NF = TSOP56: 14 x 20 mm
ZA = TBGA64: 10 x13mm, 1mm pitch
Temperature range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = ECOPACK Package, Standard Packing
F = ECOPACK Package, Tape & Reel 24mm Packing
Note:
This product is also available with the Extended Block factory locked. For further details and
ordering information contact your nearest ST sales office.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Office.
68/94
M29DW128F
Block addresses and Read/Modify Protection Groups
Appendix A
Table 34.
Bank A
Bank
Block addresses and Read/Modify Protection
Groups
Block Addresses and Protection Groups
Block
Size
(kbytes/KWords)
Protection Block
Group
(x8)
(x16)
0
8/4
Protection Group
000000h-001FFFh(1)
000000h–000FFFh(1)
1
8/4
Protection Group
002000h-003FFFh(1)
001000h–001FFFh(1)
2
8/4
Protection Group
004000h-005FFFh(1)
002000h–002FFFh(1)
3
8/4
Protection Group
006000h-007FFFh(1)
003000h–003FFFh(1)
4
8/4
Protection Group
008000h-009FFFh(1)
004000h–004FFFh(1)
5
8/4
Protection Group
00A000h-00BFFFh(1)
005000h–005FFFh(1)
6
8/4
Protection Group
00C000h-00DFFFh(1)
006000h–006FFFh(1)
7
8/4
Protection Group
00E000h-00FFFFh(1)
007000h–007FFFh(1)
8
64/32
010000h-01FFFFh
008000h–00FFFFh
9
64/32
020000h-02FFFFh
010000h–017FFFh
10
64/32
030000h-03FFFFh
018000h–01FFFFh
11
64/32
040000h-04FFFFh
020000h–027FFFh
12
64/32
050000h-05FFFFh
028000h–02FFFFh
Protection Group
Protection Group
13
64/32
060000h-06FFFFh
030000h–037FFFh
14
64/32
070000h-07FFFFh
038000h–03FFFFh
15
64/32
080000h-08FFFFh
040000h–047FFFh
16
64/32
090000h-09FFFFh
048000h–04FFFFh
Protection Group
17
64/32
0A0000h-0AFFFFh
050000h–057FFFh
18
64/32
0B0000h-0BFFFFh
058000h–05FFFFh
19
64/32
0C0000h-0CFFFFh
060000h–067FFFh
20
64/32
0D0000h-0DFFFFh
068000h–06FFFFh
Protection Group
21
64/32
0E0000h-0EFFFFh
070000h–077FFFh
22
64/32
0F0000h-0FFFFFh
078000h–07FFFFh
23
64/32
100000h-10FFFFh
080000h–087FFFh
24
64/32
110000h-11FFFFh
088000h–08FFFFh
Protection Group
25
64/32
120000h-12FFFFh
090000h–097FFFh
26
64/32
130000h-13FFFFh
098000h–09FFFFh
69/94
Block addresses and Read/Modify Protection Groups
Table 34.
Bank
M29DW128F
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
27
64/32
28
64/32
Protection Block
Group
(x8)
(x16)
140000h-14FFFFh
0A0000h–0A7FFFh
150000h-15FFFFh
0A8000h–0AFFFFh
Bank A
Protection Group
29
64/32
160000h-16FFFFh
0B0000h–0B7FFFh
30
64/32
170000h-17FFFFh
0B8000h–0BFFFFh
31
64/32
180000h-18FFFFh
0C0000h–0C7FFFh
32
64/32
190000h-19FFFFh
0C8000h–0CFFFFh
Protection Group
33
64/32
1A0000h-1AFFFFh
0D0000h–0D7FFFh
34
64/32
1B0000h-1BFFFFh
0D8000h–0DFFFFh
35
64/32
1C0000h-1CFFFFh
0E0000h–0E7FFFh
36
64/32
1D0000h-1DFFFFh
0E8000h–0EFFFFh
Protection Group
37
64/32
1E0000h-1EFFFFh
0F0000h–0F7FFFh
38
64/32
1F0000h-1FFFFFh
0F8000h–0FFFFFh
39
64/32
200000h-20FFFFh
100000h–107FFFh
40
64/32
210000h-21FFFFh
108000h–10FFFFh
Protection Group
41
64/32
220000h-22FFFFh
110000h–117FFFh
42
64/32
230000h-23FFFFh
118000h–11FFFFh
43
64/32
240000h-24FFFFh
120000h–127FFFh
44
64/32
250000h-25FFFFh
128000h–12FFFFh
Bank B
Protection Group
45
64/32
260000h-26FFFFh
130000h–137FFFh
46
64/32
270000h-27FFFFh
138000h–13FFFFh
47
64/32
280000h-28FFFFh
140000h–147FFFh
48
64/32
290000h-29FFFFh
148000h–14FFFFh
Protection Group
49
64/32
2A0000h-2AFFFFh
150000h–157FFFh
50
64/32
2B0000h-2BFFFFh
158000h–15FFFFh
51
64/32
2C0000h-2CFFFFh
160000h–167FFFh
52
64/32
2D0000h-2DFFFFh
168000h–16FFFFh
Protection Group
53
64/32
2E0000h-2EFFFFh
170000h–177FFFh
54
64/32
2F0000h-2FFFFFh
178000h–17FFFFh
55
64/32
300000h-30FFFFh
180000h–187FFFh
56
64/32
310000h-31FFFFh
188000h–18FFFFh
Protection Group
70/94
57
64/32
320000h-32FFFFh
190000h–197FFFh
58
64/32
330000h-33FFFFh
198000h–19FFFFh
M29DW128F
Table 34.
Bank
Block addresses and Read/Modify Protection Groups
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
59
64/32
60
64/32
Protection Block
Group
(x8)
(x16)
340000h-34FFFFh
1A0000h–1A7FFFh
350000h-35FFFFh
1A8000h–1AFFFFh
Protection Group
61
64/32
360000h-36FFFFh
1B0000h–1B7FFFh
62
64/32
370000h-37FFFFh
1B8000h–1BFFFFh
63
64/32
380000h-38FFFFh
1C0000h–1C7FFFh
64
64/32
390000h-39FFFFh
1C8000h–1CFFFFh
Protection Group
65
64/32
3A0000h-3AFFFFh
1D0000h–1D7FFFh
66
64/32
3B0000h-3BFFFFh
1D8000h–1DFFFFh
67
64/32
3C0000h-3CFFFFh
1E0000h–1E7FFFh
68
64/32
3D0000h-3DFFFFh
1E8000h–1EFFFFh
Protection Group
69
64/32
3E0000h-3EFFFFh
1F0000h–1F7FFFh
70
64/32
3F0000h-3FFFFFh
1F8000h–1FFFFFh
71
64/32
400000h–40FFFFh
200000h–207FFFh
72
64/32
410000h–41FFFFh
208000h–20FFFFh
Bank B
Protection Group
73
64/32
420000h–42FFFFh
210000h–217FFFh
74
64/32
430000h–43FFFFh
218000h–21FFFFh
75
64/32
440000h–44FFFFh
220000h–227FFFh
76
64/32
450000h–45FFFFh
228000h–22FFFFh
Protection Group
77
64/32
460000h–46FFFFh
230000h–237FFFh
78
64/32
470000h–47FFFFh
238000h–23FFFFh
79
64/32
480000h–48FFFFh
240000h–247FFFh
80
64/32
490000h–49FFFFh
248000h–24FFFFh
Protection Group
81
64/32
4A0000h–4AFFFFh
250000h–257FFFh
82
64/32
4B0000h–4BFFFFh
258000h–25FFFFh
83
64/32
4C0000h–4CFFFFh
260000h–267FFFh
84
64/32
4D0000h–4DFFFFh
268000h–26FFFFh
Protection Group
85
64/32
4E0000h–4EFFFFh
270000h–277FFFh
86
64/32
4F0000h–4FFFFFh
278000h–27FFFFh
87
64/32
500000h–50FFFFh
280000h–287FFFh
88
64/32
510000h–51FFFFh
288000h–28FFFFh
Protection Group
89
64/32
520000h–52FFFFh
290000h–297FFFh
90
64/32
530000h–53FFFFh
298000h–29FFFFh
71/94
Block addresses and Read/Modify Protection Groups
Table 34.
Bank
M29DW128F
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
91
64/32
92
64/32
Protection Block
Group
(x8)
(x16)
540000h–54FFFFh
2A0000h–2A7FFFh
550000h–55FFFFh
2A8000h–2AFFFFh
Protection Group
93
64/32
560000h–56FFFFh
2B0000h–2B7FFFh
94
64/32
570000h–57FFFFh
2B8000h–2BFFFFh
95
64/32
580000h–58FFFFh
2C0000h–2C7FFFh
96
64/32
590000h–59FFFFh
2C8000h–2CFFFFh
Protection Group
97
64/32
5A0000h–5AFFFFh
2D0000h–2D7FFFh
98
64/32
5B0000h–5BFFFFh
2D8000h–2DFFFFh
99
64/32
5C0000h–5CFFFFh
2E0000h–2E7FFFh
100
64/32
5D0000h–5DFFFFh
2E8000h–2EFFFFh
Protection Group
101
64/32
5E0000h–5EFFFFh
2F0000h–2F7FFFh
102
64/32
5F0000h–5FFFFFh
2F8000h–2FFFFFh
103
64/32
600000h–60FFFFh
300000h–307FFFh
104
64/32
610000h–61FFFFh
308000h–30FFFFh
Bank B
Protection Group
105
64/32
620000h–62FFFFh
310000h–317FFFh
106
64/32
630000h–63FFFFh
318000h–31FFFFh
107
64/32
640000h–64FFFFh
320000h–327FFFh
108
64/32
650000h–65FFFFh
328000h–32FFFFh
Protection Group
109
64/32
660000h–66FFFFh
330000h–337FFFh
110
64/32
670000h–67FFFFh
338000h–33FFFFh
111
64/32
680000h–68FFFFh
340000h–347FFFh
112
64/32
690000h–69FFFFh
348000h–34FFFFh
Protection Group
113
64/32
6A0000h–6AFFFFh
350000h–357FFFh
114
64/32
6B0000h–6BFFFFh
358000h–35FFFFh
115
64/32
6C0000h–6CFFFFh
360000h–367FFFh
116
64/32
6D0000h–6DFFFFh
368000h–36FFFFh
Protection Group
117
64/32
6E0000h–6EFFFFh
370000h–377FFFh
118
64/32
6F0000h–6FFFFFh
378000h–37FFFFh
119
64/32
700000h–70FFFFh
380000h–387FFFh
120
64/32
710000h–71FFFFh
388000h–38FFFFh
Protection Group
72/94
121
64/32
720000h–72FFFFh
390000h–397FFFh
122
64/32
730000h–73FFFFh
398000h–39FFFFh
M29DW128F
Table 34.
Bank
Block addresses and Read/Modify Protection Groups
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
123
64/32
124
64/32
Protection Block
Group
(x8)
(x16)
740000h–74FFFFh
3A0000h–3A7FFFh
750000h–75FFFFh
3A8000h–3AFFFFh
Bank B
Protection Group
125
64/32
760000h–76FFFFh
3B0000h–3B7FFFh
126
64/32
770000h–77FFFFh
3B8000h–3BFFFFh
127
64/32
780000h–78FFFFh
3C0000h–3C7FFFh
128
64/32
790000h–79FFFFh
3C8000h–3CFFFFh
Protection Group
129
64/32
7A0000h–7AFFFFh
3D0000h–3D7FFFh
130
64/32
7B0000h–7BFFFFh
3D8000h–3DFFFFh
131
64/32
7C0000h–7CFFFFh
3E0000h–3E7FFFh
132
64/32
7D0000h–7DFFFFh
3E8000h–3EFFFFh
Protection Group
133
64/32
7E0000h–7EFFFFh
3F0000h–3F7FFFh
134
64/32
7F0000h-7FFFFFh
3F8000h-3FFFFFh
135
64/32
800000h–80FFFFh
400000h–407FFFh
136
64/32
810000h–81FFFFh
408000h–40FFFFh
Protection Group
137
64/32
820000h–82FFFFh
410000h–417FFFh
138
64/32
830000h–83FFFFh
418000h–41FFFFh
139
64/32
840000h–84FFFFh
420000h–427FFFh
140
64/32
850000h–85FFFFh
428000h–42FFFFh
Bank C
Protection Group
141
64/32
860000h–86FFFFh
430000h–437FFFh
142
64/32
870000h–87FFFFh
438000h–43FFFFh
143
64/32
880000h–88FFFFh
440000h–447FFFh
144
64/32
890000h–89FFFFh
448000h–44FFFFh
Protection Group
145
64/32
8A0000h–8AFFFFh
450000h–457FFFh
146
64/32
8B0000h–8BFFFFh
458000h–45FFFFh
147
64/32
8C0000h–8CFFFFh
460000h–467FFFh
148
64/32
8D0000h–8DFFFFh
468000h–46FFFFh
Protection Group
149
64/32
8E0000h–8EFFFFh
470000h–477FFFh
150
64/32
8F0000h-8FFFFFh
478000h–47FFFFh
151
64/32
900000h-90FFFFh
480000h–487FFFh
152
64/32
910000h–91FFFFh
488000h–48FFFFh
Protection Group
153
64/32
920000h–92FFFFh
490000h–497FFFh
154
64/32
930000h–93FFFFh
498000h–49FFFFh
73/94
Block addresses and Read/Modify Protection Groups
Table 34.
Bank
M29DW128F
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
155
64/32
156
64/32
Protection Block
Group
(x8)
(x16)
940000h–94FFFFh
4A0000h–4A7FFFh
950000h–95FFFFh
4A8000h–4AFFFFh
Protection Group
157
64/32
960000h–96FFFFh
4B0000h–4B7FFFh
158
64/32
970000h–97FFFFh
4B8000h–4BFFFFh
159
64/32
980000h–98FFFFh
4C0000h–4C7FFFh
160
64/32
990000h–99FFFFh
4C8000h–4CFFFFh
Protection Group
161
64/32
9A0000h–9AFFFFh
4D0000h–4D7FFFh
162
64/32
9B0000h–9BFFFFh
4D8000h–4DFFFFh
163
64/32
9C0000h–9CFFFFh
4E0000h–4E7FFFh
164
64/32
9D0000h–9DFFFFh
4E8000h–4EFFFFh
Protection Group
165
64/32
9E0000h–9EFFFFh
4F0000h–4F7FFFh
166
64/32
9F0000h–9FFFFFh
4F8000h-4FFFFFh
167
64/32
A00000h–A0FFFFh
500000h–507FFFh
168
64/32
A10000h–A1FFFFh
508000h–50FFFFh
Bank C
Protection Group
169
64/32
A20000h–A2FFFFh
510000h–517FFFh
170
64/32
A30000h–A3FFFFh
518000h–51FFFFh
171
64/32
A40000h–A4FFFFh
520000h–527FFFh
172
64/32
A50000h–A5FFFFh
528000h–52FFFFh
Protection Group
173
64/32
A60000h–A6FFFFh
530000h–537FFFh
174
64/32
A70000h–A7FFFFh
538000h–53FFFFh
175
64/32
A80000h–A8FFFFh
540000h–547FFFh
176
64/32
A90000h–A9FFFFh
548000h–54FFFFh
Protection Group
177
64/32
AA0000h–AAFFFFh
550000h–557FFFh
178
64/32
AB0000h–ABFFFFh
558000h–55FFFFh
179
64/32
AC0000h–ACFFFFh
560000h–567FFFh
180
64/32
AD0000h–ADFFFFh
568000h–56FFFFh
Protection Group
181
64/32
AE0000h–AEFFFFh
570000h–577FFFh
182
64/32
AF0000h-AFFFFFh
578000h–57FFFFh
183
64/32
B00000h–B0FFFFh
580000h–587FFFh
184
64/32
B10000h–B1FFFFh
588000h–58FFFFh
Protection Group
74/94
185
64/32
B20000h–B2FFFFh
590000h–597FFFh
186
64/32
B30000h-B3FFFFh
598000h–59FFFFh
M29DW128F
Table 34.
Bank
Block addresses and Read/Modify Protection Groups
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
187
64/32
188
64/32
Protection Block
Group
(x8)
(x16)
B40000h–B4FFFFh
5A0000h–5A7FFFh
B50000h–B5FFFFh
5A8000h–5AFFFFh
Protection Group
189
64/32
B60000h–B6FFFFh
5B0000h–5B7FFFh
190
64/32
B70000h-B7FFFFh
5B8000h–5BFFFFh
191
64/32
B80000h–B8FFFFh
5C0000h–5C7FFFh
192
64/32
B90000h–B9FFFFh
5C8000h–5CFFFFh
Protection Group
193
64/32
BA0000h–BAFFFFh
5D0000h–5D7FFFh
194
64/32
BB0000h–BBFFFFh
5D8000h–5DFFFFh
195
64/32
BC0000h–BCFFFFh
5E0000h–5E7FFFh
196
64/32
BD0000h–BDFFFFh
5E8000h–5EFFFFh
Protection Group
197
64/32
BE0000h–BEFFFFh
5F0000h–5F7FFFh
198
64/32
BF0000h–BFFFFFh
5F8000h-5FFFFFh
199
64/32
C00000h–C0FFFFh
600000h–607FFFh
200
64/32
C10000h–C1FFFFh
608000h–60FFFFh
Bank C
Protection Group
201
64/32
C20000h–C2FFFFh
610000h–617FFFh
202
64/32
C30000h–C3FFFFh
618000h–61FFFFh
203
64/32
C40000h–C4FFFFh
620000h–627FFFh
204
64/32
C50000h–C5FFFFh
628000h–62FFFFh
Protection Group
205
64/32
C60000h–C6FFFFh
630000h–637FFFh
206
64/32
C70000h-C7FFFFh
638000h–63FFFFh
207
64/32
C80000h–C8FFFFh
640000h–647FFFh
208
64/32
C90000h–C9FFFFh
648000h–64FFFFh
Protection Group
209
64/32
CA0000h–CAFFFFh
650000h–657FFFh
210
64/32
CB0000h–CBFFFFh
658000h–65FFFFh
211
64/32
CC0000h–CCFFFFh
660000h–667FFFh
212
64/32
CD0000h–CDFFFFh
668000h–66FFFFh
Protection Group
213
64/32
CE0000h–CEFFFFh
670000h–677FFFh
214
64/32
CF0000h-CFFFFFh
678000h–67FFFFh
215
64/32
D00000h–D0FFFFh
680000h–687FFFh
216
64/32
D10000h–D1FFFFh
688000h–68FFFFh
Protection Group
217
64/32
D20000h–D2FFFFh
690000h–697FFFh
218
64/32
D30000h–D3FFFFh
698000h–69FFFFh
75/94
Block addresses and Read/Modify Protection Groups
Table 34.
Bank
M29DW128F
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
219
64/32
220
64/32
Protection Block
Group
(x8)
(x16)
D40000h–D4FFFFh
6A0000h–6A7FFFh
D50000h–D5FFFFh
6A8000h–6AFFFFh
Bank C
Protection Group
221
64/32
D60000h–D6FFFFh
6B0000h–6B7FFFh
222
64/32
D70000h-D7FFFFh
6B8000h–6BFFFFh
223
64/32
D80000h-D8FFFFh
6C0000h–6C7FFFh
224
64/32
D90000h-D9FFFFh
6C8000h–6CFFFFh
Protection Group
225
64/32
DA0000h-DAFFFFh
6D0000h–6D7FFFh
226
64/32
DB0000h-DBFFFFh
6D8000h–6DFFFFh
227
64/32
DC0000h-DCFFFFh
6E0000h–6E7FFFh
228
64/32
DD0000h-DDFFFFh
6E8000h–6EFFFFh
Protection Group
229
64/32
DE0000h-DEFFFFh
6F0000h–6F7FFFh
230
64/32
DF0000h-DFFFFFh
6F8000h-6FFFFFh
231
64/32
E00000h-E0FFFFh
700000h–707FFFh
232
64/32
E10000h-E1FFFFh
708000h–70FFFFh
Protection Group
233
64/32
E20000h-E2FFFFh
710000h–717FFFh
234
64/32
E30000h-E3FFFFh
718000h–71FFFFh
235
64/32
E40000h-E4FFFFh
720000h–727FFFh
236
64/32
E50000h-E5FFFFh
728000h–72FFFFh
Bank D
Protection Group
237
64/32
E60000h-E6FFFFh
730000h–737FFFh
238
64/32
E70000h-E7FFFFh
738000h–73FFFFh
239
64/32
E80000h-E8FFFFh
740000h–747FFFh
240
64/32
E90000h-E9FFFFh
748000h–74FFFFh
Protection Group
241
64/32
EA0000h-EAFFFFh
750000h–757FFFh
242
64/32
EB0000h-EBFFFFh
758000h–75FFFFh
243
64/32
EC0000h-ECFFFFh
760000h–767FFFh
244
64/32
ED0000h-EDFFFFh
768000h–76FFFFh
Protection Group
245
64/32
EE0000h-EEFFFFh
770000h–777FFFh
246
64/32
EF0000h-EFFFFFh
778000h–77FFFFh
247
64/32
F00000h-F0FFFFh
780000h–787FFFh
248
64/32
F10000h-F1FFFFh
788000h–78FFFFh
Protection Group
76/94
249
64/32
F20000h-F2FFFFh
790000h–797FFFh
250
64/32
F30000h-F3FFFFh
798000h–79FFFFh
M29DW128F
Table 34.
Bank
Block addresses and Read/Modify Protection Groups
Block Addresses and Protection Groups (continued)
Block
Size
(kbytes/KWords)
251
64/32
252
64/32
Protection Block
Group
(x8)
(x16)
F40000h-F4FFFFh
7A0000h–7A7FFFh
F50000h-F5FFFFh
7A8000h–7AFFFFh
Protection Group
253
64/32
F60000h-F6FFFFh
7B0000h–7B7FFFh
254
64/32
F70000h-F7FFFFh
7B8000h–7BFFFFh
255
64/32
F80000h-F8FFFFh
7C0000h–7C7FFFh
256
64/32
F90000h-F9FFFFh
7C8000h–7CFFFFh
Bank D
Protection Group
257
64/32
FA0000h-FAFFFFh
7D0000h–7D7FFFh
258
64/32
FB0000h-FBFFFFh
7D8000h–7DFFFFh
259
64/32
FC0000h-FCFFFFh
7E0000h–7E7FFFh
260
64/32
FD0000h-FDFFFFh
7E8000h–7EFFFFh
261
64/32
FE0000h-FEFFFFh
7F0000h-7F7FFFh
Protection Group
(1)
262
8/4
Protection Group
FF0000h-FF1FFFh
7F8000h-7F8FFFh(1)
263
8/4
Protection Group
FF2000h-FF3FFFh(1)
7F9000h-7F9FFFh(1)
264
8/4
Protection Group
FF4000h-FF5FFFh(1)
7FA000h-7FAFFFh(1)
265
8/4
Protection Group
FF6000h-FF7FFFh(1)
7FB000h-7FBFFFh(1)
266
8/4
Protection Group
FF8000h-FF9FFFh(1)
7FC000h-7FCFFFh(1)
267
8/4
Protection Group
FFA000h-FFBFFFh(1)
7FD000h-7FDFFFh(1)
268
8/4
Protection Group
FFC000h-FFDFFFh(1)
7FE000h-7FEFFFh(1)
269
8/4
Protection Group
FFE000h-FFFFFFh(1)
7FF000h-7FFFFFh(1)
1. Parameter Blocks.
77/94
Common Flash Interface (CFI)
Appendix B
M29DW128F
Common Flash Interface (CFI)
The Common Flash Interface is a JEDEC approved, standardized data structure that can be read from
the Flash memory device. It allows a system software to query the device to determine various electrical
and timing parameters, density information and functions supported by the memory. The system can
interface easily with the device, enabling the software to upgrade itself when necessary.
When the Read CFI Query command is issued the addressed bank enters Read CFI Query mode and
read operations in the same bank (A22-A19) output the CFI data. Table 35, Table 36, Table 37, Table 38,
Table 39 and Table 40 show the addresses (A-1, A0-A10) used to retrieve the data.
The CFI data structure also contains a security area where a 64 bit unique security number is written
(see Table 40: Security Code Area). This area can be accessed only in Read mode by the final user. It is
impossible to change the security number after it has been written by ST.
Table 35.
Query Structure Overview(1)
Address
Sub-section Name
Description
x16
x8
10h
20h
CFI Query Identification String
Command set ID and algorithm data offset
1Bh
36h
System Interface Information
Device timing & voltage information
27h
4Eh
Device Geometry Definition
Flash device layout
40h
80h
Primary Algorithm-specific Extended
Query table
Additional information specific to the Primary
Algorithm (optional)
61h
C2h
Security Code Area
64 bit unique device number
1. Query data are always presented on the lowest order data outputs.
Table 36.
CFI Query Identification String(1)
Address
Data
x16
x8
10h
20h
0051h
11h
22h
0052h
12h
24h
0059h
13h
26h
0002h
14h
28h
0000h
15h
2Ah
0040h
16h
2Ch
0000h
17h
2Eh
0000h
18h
30h
0000h
19h
32h
0000h
1Ah
34h
0000h
Description
“Q”
Query Unique ASCII String "QRY"
"R"
"Y"
AMD
Primary Algorithm Command Set and Control Interface ID code 16 bit
ID code defining a specific algorithm
Compatible
Address for Primary Algorithm extended Query table (see Table 39)
P = 40h
Alternate Vendor Command Set and Control Interface ID Code
second vendor - specified algorithm supported
NA
Address for Alternate Algorithm extended Query table
NA
1. Query data are always presented on the lowest order data outputs (DQ7-DQ0) only. DQ8-DQ15 are ‘0’.
78/94
Value
M29DW128F
Table 37.
Common Flash Interface (CFI)
CFI Query System Interface information(1)
Address
Data
x16
x8
1Bh
36h
Description
Value
0027h
VCC Logic Supply Minimum Program/Erase voltage
bit 7 to 4BCD value in volts
bit 3 to 0BCD value in 100mV
2.7V
3.6V
1Ch
38h
0036h
VCC Logic Supply Maximum Program/Erase voltage
bit 7 to 4BCD value in volts
bit 3 to 0BCD value in 100mV
1Dh
3Ah
00B5h
VPP [Programming] Supply Minimum Program/Erase voltage
bit 7 to 4HEX value in volts
bit 3 to 0BCD value in 100mV
11.5V
1Eh
3Ch
00C5h
VPP [Programming] Supply Maximum Program/Erase voltage
bit 7 to 4HEX value in volts
bit 3 to 0BCD value in 10mV
12.5V
1Fh
3Eh
0004h
Typical timeout per single byte/Word program = 2n µs
16µs
20h
21h
40h
42h
0000h
0009h
Typical timeout for minimum size write buffer program =
2n
µs
n
Typical timeout per individual block erase = 2 ms
n
22h
44h
0000h
Typical timeout for full Chip Erase = 2 ms
23h
46h
0005h
Maximum timeout for byte/Word program = 2n times typical
24h
25h
26h
48h
4Ah
4Ch
0000h
0004h
0000h
Maximum timeout for write buffer program = 2 times typical
n
Maximum timeout per individual block erase = 2 times typical
Maximum timeout for Chip Erase =
512ms
NA
n
2n
NA
times typical
512µs
NA
8s
NA
1. The values given in the above table are valid for both packages.
79/94
Common Flash Interface (CFI)
Table 38.
M29DW128F
Device Geometry Definition(1)
Address
Data
x16
x8
27h
4Eh
28h
Description
0018h
Device Size = 2n in number of bytes
0001h
TBGA64
(x16 only)
0002h
TSOP56
Flash Device Interface Code description
(x8/x16)
Both
Packages
50h
29h
52h
0000h
2Ah
54h
0006h
2Bh
56h
0000h
2Ch
58h
2Dh
2Eh
Value
16
Mbytes
x8, x16
Async.
Maximum number of bytes in Multiple-byte program or Page= 2n
64
0003h
Number of Erase Block Regions(1). It specifies the number of regions
containing contiguous Erase Blocks of the same size.
3
5Ah
5Ch
0007h
0000h
Erase Block Region 1 Information
Number of Erase Blocks of identical size = 0007h+1
8
2Fh
30h
5Eh
60h
0020h
0000h
Erase Block Region 1 Information
Block size in Region 1 = 0020h * 256 byte
31h
32h
62h
64h
00FDh
0000h
Erase Block Region 2 Information
Number of Erase Blocks of identical size = 00FDh+1
33h
34h
66h
68h
0000h
0001h
Erase Block Region 2 Information
Block size in Region 2 = 0100h * 256 byte
35h
36h
6Ah
6Ch
0007h
0000h
Erase Block Region 3 information
Number of Erase Blocks of identical size = 0007h + 1
37h
38h
6Eh
70h
0020h
0000h
Erase Block Region 3 information
Block size in region 3 = 0020h * 256 bytes
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase Block Region 4 information
8
Kbytes
254
64
Kbytes
8
8
Kbytes
1. Erase Block Region 1 corresponds to addresses 000000h to 007FFFh; Erase block Region 2 corresponds to addresses
008000h to 3F7FFFh and Erase Block Region 3 corresponds to addresses 3F8000h to 3FFFFFh.
80/94
0
M29DW128F
Table 39.
Common Flash Interface (CFI)
Primary Algorithm-Specific Extended Query table (1)
Address
Data
Description
Value
x16
x8
40h
80h
0050h
41h
82h
0052h
42h
84h
0049h
43h
86h
0031h
Major version number, ASCII
"1"
44h
88h
0033h
Minor version number, ASCII
"3"
Yes
"P"
Primary Algorithm Extended Query table unique ASCII string “PRI”
"R"
"I"
45h
8Ah
000Ch
Address Sensitive Unlock (bits 1 to 0)
00 = required, 01= not required
Silicon Revision Number (bits 7 to 2)
46h
8Ch
0002h
Erase Suspend
00 = not supported, 01 = Read only, 02 = Read and Write
2
47h
8Eh
0001h
Block Protection
00 = not supported, x = number of sectors in per group
1
48h
90h
0001h
Temporary Block Unprotect
00 = not supported, 01 = supported
49h
92h
0006h
Block Protect /Unprotect
06 = M29DW128F
4Ah
94h
00E7
Simultaneous Operations,
x = number of blocks (excluding Bank A)
231
4Bh
96h
0000h
Burst Mode, 00 = not supported, 01 = supported
No
4Ch
98h
0002h
Page Mode, 00 = not supported, 02 = 8-Word page
Yes
4Dh
9Ah
00B5h
VPP Supply Minimum Program/Erase voltage
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100mV
11.5V
4Eh
9Ch
00C5h
VPP Supply Maximum Program/Erase voltage
bit 7 to 4 HEX value in volts
bit 3 to 0 BCD value in 100mV
12.5V
T/B
Yes
Yes
6
4Fh
9Eh
0001h
Top/Bottom Boot Block Flag
00h = Uniform device
01h = 8 x8 Kbyte Blocks or 4KWords, Top and Bottom Boot with
Write Protect
02h = Bottom boot device
03h = Top Boot Device
04h = Both Top and Bottom
50h
A0h
0001h
Program Suspend, 00 = not supported, 01 = supported
57h
AEh
0004h
Bank Organization, 00 = data at 4Ah is zero
X = number of banks
4
58h
B0h
0027h
Bank A information
X = number of blocks in Bank A
39
81/94
Common Flash Interface (CFI)
Table 39.
M29DW128F
Primary Algorithm-Specific Extended Query table (continued)(1)
Address
Data
Description
Value
x16
x8
59h
B2h
0060h
Bank B information
X = number of blocks in Bank B
96
5Ah
B4h
0060h
Bank C information
X = number of blocks in Bank C
96
5Bh
B6h
0027h
Bank D information
X = number of blocks in Bank D
39
1. The values given in the above table are valid for both packages.
Table 40.
Security Code Area
Address
Data
x16
x8
61h
C3h, C2h
XXXX
62h
C5h, C4h
XXXX
63h
C7h, C6h
XXXX
64h
C9h, C8h
XXXX
Description
64 bit: unique device number
82/94
M29DW128F
Extended Memory Block
Appendix C
Extended Memory Block
The M29DW128F has an extra block, the Extended Block, that can be accessed using a
dedicated command.
This Extended Block is 128 Words in x16 mode and 256 bytes in x8 mode. It is used as a
security block (to provide a permanent security identification number) or to store additional
information.
The Extended Block is divided into two memory areas of 64 Words each:
●
The first one is Factory Locked.
●
The second one is Customer Lockable. It is up to the customer to protect it from
program operations. Its status is indicated by bit DQ6 and DQ7. When DQ7 is set to ‘1’
and DQ6 to ‘0’, it indicates that this second memory area is Customer Lockable. When
DQ7 and DQ6 are both set to ‘1’, it indicates that the second part of the Extended Block
is Customer Locked and protected from program operations. Bit DQ7 being
permanently locked to either ‘1’ or ‘0’ is another security feature which ensures that a
customer lockable device cannot be used instead of a factory locked one.
Bits DQ6 and DQ7 are the most significant bits in the Extended Block Protection Indicator
and a specific procedure must be followed to read it. See “Section 3.6.2: Verify Extended
Block Protection Indicator” and Table 5 and Table 8, Block Protection, for details of how to
read bit DQ7.
The Extended Block can only be accessed when the device is in Extended Block mode. For
details of how the Extended Block mode is entered and exited, refer to the Section 6.1.11:
Program command and Section 6.3.2: Exit Extended Block command paragraphs, and to
Table 15 and Table 16, Block Protection Commands.
C.1
Factory Locked Section of the Extended Block
The first section of The Extended Block is permanently protected from program operations
and cannot be unprotected. The Random Number, Electronic Serial Number (ESN) and
Security Identification Number (see Table 41: Extended Block Address and Data) are written
in this section in the factory.
83/94
Extended Memory Block
C.2
M29DW128F
Customer Lockable Section of the Extended Block
The device is delivered with the second section of the Extended Block "Customer Lockable": bits DQ7
and DQ6 are set to '1' and '0' respectively. It is up to the customer to program and protect this section of
the Extended Block but care must be taken because the protection is not reversible.
There are three ways of protecting this section:
●
Issue the Enter Extended Block command to place the device in Extended Block mode, then use the
In-System Technique with RP either at VIH or at VID. Refer to Section D.2: In-System technique in
Appendix D: High Voltage Block Protection, and to the corresponding flowcharts Figure 25 and
Figure 26 for a detailed explanation of the technique).
●
Issue the Enter Extended Block command to place the device in Extended Block mode, then use the
Programmer Technique. Refer to Section D.1: Programmer technique in Appendix D: High Voltage
Block Protection, and to the corresponding flowcharts Figure 23 and Figure 24 for a detailed
explanation of the technique).
●
Issue a Set Extended Block Protection bit command to program the Extended Block Protection bit to
‘1’ thus preventing the second section of the Extended Block from being programmed.
Bit DQ6 of the Extended Block Protection Indicator is automatically set to '1' to indicate that the second
section of the Extended Block is Customer Locked.
Once the Extended Block is programmed and protected, the Exit Extended Block command must be
issued to exit the Extended Block mode and return the device to Read mode.
Table 41.
Extended Block Address and Data
Address(1)
Data
Device
x8
x16
Factory Locked
Customer Lockable
000000h00007Fh
000000h00003Fh
Random Number, ESN(2),
Security Identification Number
Unavailable
000080h0000FFh
000040h00007Fh
Unavailable
Determined by
Customer
M29DW128F
1. See Table 34: Block Addresses and Protection Groups.
2. ESN = Electronic Serial Number.
84/94
M29DW128F
Appendix D
High Voltage Block Protection
High Voltage Block Protection
The High Voltage Block Protection can be used to prevent any operation from modifying the
data stored in the memory. The blocks are protected in groups, refer to Appendix A, Table 34
for details of the Protection Groups. Once protected, Program and Erase operations within
the protected group fail to change the data.
There are three techniques that can be used to control Block Protection, these are the
Programmer technique, the In-System technique and Temporary Unprotection. Temporary
Unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is
described in the Signal Descriptions section.
To protect the Extended Block issue the Enter Extended Block command and then use
either the Programmer or In-System technique. Once protected issue the Exit Extended
Block command to return to read mode. The Extended Block protection is irreversible, once
protected the protection cannot be undone.
D.1
Programmer technique
The Programmer technique uses high (VID) voltage levels on some of the bus pins. These
cannot be achieved using a standard microprocessor bus, therefore the technique is
recommended only for use in Programming Equipment.
To protect a group of blocks follow the flowchart in Figure 23: Programmer equipment Group
Protect flowchart. To unprotect the whole chip it is necessary to protect all of the groups first,
then all groups can be unprotected at the same time. To unprotect the chip follow Figure 24:
Programmer equipment Chip Unprotect flowchart. Table 42: Programmer technique Bus
operations, 8-bit or 16-bit mode, gives a summary of each operation.
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before
reaching the end. Chip Unprotect can take several seconds and a user message should be
provided to show that the operation is progressing.
85/94
High Voltage Block Protection
D.2
M29DW128F
In-System technique
The In-System technique requires a high voltage level on the Reset/Blocks Temporary Unprotect pin, RP
. This can be achieved without violating the maximum ratings of the components on the
microprocessor bus, therefore this technique is suitable for use after the memory has been fitted to the
system.
(1)
To protect a group of blocks follow the flowchart in Figure 25: In-System equipment Group Protect
flowchart. To unprotect the whole chip it is necessary to protect all of the groups first, then all the groups
can be unprotected at the same time. To unprotect the chip follow Figure 26: In-System equipment Chip
Unprotect flowchart.
The timing on these flowcharts is critical. Care should be taken to ensure that, where a pause is
specified, it is followed as closely as possible. Do not allow the microprocessor to service interrupts that
will upset the timing and do not abort the procedure before reaching the end. Chip Unprotect can take
several seconds and a user message should be provided to show that the operation is progressing.
Note:
RP can be either at VIH or at VID when using the In-System Technique to protect the
Extended Block.
Table 42.
Programmer technique Bus operations, 8-bit or 16-bit mode
Operation
E
G
W
Address Inputs
A0-A22
Data Inputs/Outputs
DQ15A–1, DQ14-DQ0
Block (Group) Protect(1)
VIL
VID
VIL Pulse
A9 = VID, A12-A22 Block Address
Others = X
X
Chip Unprotect
VID
VID
VIL Pulse
A6 = VIH, A9 = VID, A12 = VIH,
A15 = VIH Others = X
X
Block (Group) Protect
Verify
VIL
VIL
VIH
A0 = VIL, A1 = VIH, A2-A7 = VIL,
A9 = VID, A12-A22 Block Address
Others = X
Pass = xx01h
Retry = xx00h.
VIH
A0 = VIL, A1 = VIH, A2 -A5 = VIL,
A6 = VIH, A7 = VIL,
A9 = VID, A12-A22 Block Address
Others = X
Pass = xx00h
Retry = xx01h.
Block (Group) Unprotect
Verify
VIL
VIL
1. Block Protection Groups are shown inAppendix A, Table 34.
86/94
M29DW128F
Flowcharts
Appendix E
Flowcharts
Figure 23. Programmer equipment Group Protect flowchart
START
Set-up
ADDRESS =
GROUP ADDRESS
W = VIH
n=0
G, A9 = VID,
E = VIL
Wait 4µs
Protect
W = VIL
Wait 100µs
W = VIH
E, G = VIH, A1 = VIH
A0, A2 to A7 = VIL
E = VIL
Verify
Wait 4µs
G = VIL
Wait 60ns
Read DATA
DATA = 01h
End
YES
NO
++n
= 25
NO
YES
A9 = VIH
E, G = VIH
A9 = VIH
E, G = VIH
PASS
FAIL
AI07756b
1. Block Protection Groups are shown in Appendix A, Table 34.
87/94
Flowcharts
M29DW128F
Figure 24. Programmer equipment Chip Unprotect flowchart
START
Set-up
PROTECT ALL
GROUPS
n=0
CURRENT GROUP = 0
A6, A12, A15 = VIH(1)
E, G, A9 = VID
Wait 4µs
Unprotect
W = VIL
Wait 10ms
W = VIH
E, G = VIH
ADDRESS = CURRENT
GROUP ADDRESS
A0, A2, A3, A4, A5, A7 = VIL
A1, A6 = VIH
E = VIL
Wait 4µs
INCREMENT
CURRENT GROUP
Verify
G = VIL
Wait 60ns
Read DATA
NO
NO
DATA = 00h
++n
= 1000
YES
LAST
GROUP
End
YES
A9 = VIH
E, G = VIH
FAIL
NO
YES
A9 = VIH
E, G = VIH
PASS
AI07757b
1. Block Protection Groups are shown in Appendix A, Table 34.
88/94
M29DW128F
Flowcharts
Figure 25. In-System equipment Group Protect flowchart
Set-up
START
n=0
RP = VID
Protect
WRITE 60h
ADDRESS = GROUP ADDRESS
A0, A2, A3, A6 = VIL, A1 = VIH
WRITE 60h
ADDRESS = GROUP ADDRESS
A0, A2, A3, A6 = VIL, A1 = VIH
Wait 100µs
Verify
WRITE 40h
ADDRESS = GROUP ADDRESS
A0, A2, A3, A6 = VIL, A1 = VIH
Wait 4µs
READ DATA
ADDRESS = GROUP ADDRESS
A1 = VIH, A0, A2 to A7 = VIL
DATA = 01h
NO
End
YES
RP = VIH
++n
= 25
ISSUE READ/RESET
COMMAND
RP = VIH
PASS
NO
YES
ISSUE READ/RESET
COMMAND
FAIL
AI07758b
1. Block Protection Groups are shown in Appendix A, Table 34.
2. RP can be either at VIH or at VID when using the In-System Technique to protect the Extended Block.
89/94
Flowcharts
M29DW128F
Figure 26. In-System equipment Chip Unprotect flowchart
START
PROTECT ALL GROUPS
Set-up
n=0
CURRENT GROUP = 0
RP = VID
WRITE 60h
ANY ADDRESS WITH
A1 = VIH, A0, A2 to A7 = VIL
Unprotect
WRITE 60h
ANY ADDRESS WITH
A0, A2, A3, A4, A5, A7 = VIL
A1, A6 = VIH
Wait 10ms
Verify
WRITE 40h
ADDRESS =
CURRENT GROUP ADDRESS
A1 = VIH, A0, A2 to A7 = VIL
Wait 4µs
INCREMENT
CURRENT GROUP
READ DATA
ADDRESS =
CURRENT GROUP ADDRESS
A1 = VIH, A0, A2 to A7 = VIL
NO
End
NO
DATA = 00h
++n
= 1000
YES
YES
LAST
GROUP
NO
YES
RP = VIH
RP = VIH
ISSUE READ/RESET
COMMAND
ISSUE READ/RESET
COMMAND
FAIL
PASS
AI07759d
1. Block Protection Groups are shown in Appendix A, Table 34.
90/94
M29DW128F
Flowcharts
Figure 27. Write to Buffer and Program flowchart and Pseudo Code
Start
Write to Buffer F0h
Command,
Block Address
Write n(1),
Block Address
First Part of the
Write to Buffer and Program Command
Write Buffer Data,
Start Address
X=n
YES
X=0
NO
Abort Write
to Buffer
YES
Write to a Different
Block Address
NO
Write Next Data,(3)
Program Address Pair
Write to Buffer and
Program Aborted(2)
X = X-1
Program Buffer
to Flash Block Address
Read Status Register
(DQ1, DQ5, DQ7) at
Last Loaded Address
YES
DQ7 = Data
NO
NO
DQ1 = 1
NO
DQ5 = 1
YES
YES
Check Status Register
(DQ5, DQ7) at
Last Loaded Address
DQ7 = Data
YES
(4)
NO
FAIL OR ABORT(5)
END
AI08968b
1. n+1 is the number of addresses to be programmed.
2. A Write to Buffer and Program Abort and Reset must be issued to return the device in Read mode.
91/94
Flowcharts
M29DW128F
3. When the block address is specified, any address in the selected block address space is acceptable. However when
loading Write Buffer address with data, all addresses must fall within the selected Write Buffer page.
4. DQ7 must be checked since DQ5 and DQ7 may change simultaneously.
5. If this flowchart location is reached because DQ5=’1’, then the Write to Buffer and Program command failed. If this
flowchart location is reached because DQ1=’1’, then the Write to Buffer and Program command aborted. In both cases, the
appropriate reset command must be issued to return the device in Read mode: a Reset command if the operation failed, a
Write to Buffer and Program Abort and Reset command if the operation aborted.
6. See Table 11 and Table 12, for details on Write to Buffer and Program command sequence.
92/94
M29DW128F
Revision history
Revision history
Table 43.
Document revision history
Date
Revision
Changes
02-Aug-2005
1.0
First Issue derived from the M29DW128F/FS datasheet revision 0.5.
13-Oct-2005
2.0
Table 18: Program, Erase Times and Program, Erase Endurance
Cycles updated.
02-Dec-2005
3.0
Datasheet status updated to “FULL DATASHEET“.
Program Suspend Latency time updated in Table 18: Program, Erase
Times and Program, Erase Endurance Cycles.
13-Mar-2006
4.0
Table 19: Status Register bits: DQ7 changed into DQ7 for Program,
Program Error and Program during Erase Suspend operations.
Section 6.2.1: Write to Buffer and Program command, and
Section 6.2.2: Write to Buffer and Program Confirm command
updated to cover 8-bit mode. Note 2, Note 3, and Note 4 updated in
Table 13: Fast Program Commands, 8-bit mode.
13-Jun-2006
5
Blank Verify command added in Section 6: Command interface.
Input/output supply voltage, VCCQ, removed.
20-Jun-2006
6
Address Inputs A7-A0 modified for NVMPbits in Table 17: Protection
Command Addresses.
26-Oct-2006
7
Updated Table 19: Status Register bits; updated blank verify
command description and removed verify command in Section 6:
Command interface.
93/94
M29DW128F
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
94/94