MPTS Series Polymeric PTC Feature and Applications UL E223037 ROHS Compliant & Halogen Free Excellent for high density applications Surface Mount, 0805, 1206, 1210, 1812, 2920 Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 0.05A ~ 3.0A Maximum Voltage: 6V ~ 60V Temperature Range: -40ºC to 85ºC MPTS 0805 L 10 R Meritek Series 0805 1206 Size 1210 1812 2920 Current rating Semi-circular Termination Rev.7 MPTS Series Polymeric PTC Electrical Characteristics (23ºC) MPTS0805 Part Number MPTS0805L010R MPTS0805L020R MPTS0805L035R MPTS0805L050R MPTS0805L075R MPTS0805L100R Hold Current Trip Current Rated Voltage Max Current Typical Power IH, A 0.10 0.20 0.35 0.50 0.75 1.00 IT, A 0.30 0.50 0.75 1.00 1.50 1.95 VMAX, Vdc 15 9 6 6 6 6 IMAX, A 100 100 100 100 40 40 Pd, W 0.5 0.5 0.5 0.5 0.6 0.6 Max Time to Trip Current Amp 0.50 8.00 8.00 8.00 8.00 8.00 Time Sec 1.50 0.02 0.10 0.10 0.20 0.30 Resistance RMIN Ω 0.700 0.400 0.250 0.150 0.090 0.060 R1MAX Ω 6.000 3.500 1.200 0.850 0.350 0.210 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0805 Part Number MPTS0805L010R MPTS0805L020R MPTS0805L035R MPTS0805L050R MPTS0805L075R MPTS0805L100R A Min 2.00 2.00 2.00 2.00 2.00 2.00 B Max 2.30 2.30 2.30 2.30 2.30 2.30 Min 1.20 1.20 1.20 1.20 1.20 1.20 C Max 1.50 1.50 1.50 1.50 1.50 1.50 Min 0.55 0.55 0.45 0.55 0.55 0.75 D Max 1.00 1.00 0.75 1.25 1.25 1.80 Min 0.20 0.20 0.20 0.20 0.20 0.20 E Max 0.60 0.60 0.60 0.60 0.60 0.60 Min 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 Rev.7 MPTS Series Polymeric PTC Thermal Derating Curve Typical Time-To-Trip at 23ºC A 100 B C D E F 10 Time-to-trip (S) A =MPTS0805L010R B =MPTS0805L020R C =MPTS0805L035R D =MPTS0805L050R E =MPTS0805L075R F =MPTS0805L100R 1 0.1 0.01 0.1 1 10 Fault current (A) Rev.7 MPTS Series Polymeric PTC The dimension in the table below provides the recommended pad layout for each MPTS0805 device Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal All 0805 Series 1.20 1.00 1.50 Time maintained above: Temperature(TL) Time (tL) Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. Theses changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds 217 ℃ 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ 20-40 seconds 6 ℃/second max. 8 minutes max. Rev.7 Polymeric PTC MPTS Series Electrical Characteristics (23º) MPTS1206 Part Number MPTS1206L005R MPTS1206L010R MPTS1206L012R MPTS1206L016R MPTS1206L020R MPTS1206L025R MPTS1206L035R MPTS1206L050R MPTS1206L050-24R MPTS1206L075R MPTS1206L075-16R MPTS1206L100R MPTS1206L110R MPTS1206L150R MPTS1206L200R Max Time to Trip Resistance Hold Current Trip Current Rated Voltage Max Current Typical Power Current Time RMIN R1MAX IH, A 0.05 0.10 0.12 0.16 0.20 0.25 0.35 0.50 0.50 0.75 0.75 1.00 1.10 1.50 2.00 IT, A 0.15 0.25 0.39 0.45 0.40 0.50 0.75 1.00 1.00 1.50 1.50 1.80 2.20 3.00 3.50 VMAX, Vdc 60 60 48 48 30 16 16 8 24 6 16 6 6 6 6 IMAX, A 10 10 10 10 10 40 40 40 100 100 100 100 100 100 100 Pd, W 0.4 0.4 0.6 0.6 0.4 0.6 0.4 0.4 0.6 0.6 0.6 0.6 0.8 0.8 0.8 Amp 0.25 0.50 1.00 1.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 Sec 1.50 1.00 0.20 0.30 0.10 0.08 0.10 0.10 0.10 0.20 0.20 0.30 0.30 1.00 1.50 Ω 3.60 1.60 1.40 1.10 0.600 0.550 0.300 0.150 0.150 0.090 0.090 0.055 0.040 0.030 0.018 Ω 50.00 15.00 6.50 5.00 2.500 2.300 1.200 0.700 0.750 0.290 0.290 0.210 0.180 0.120 0.080 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev.7 MPTS Series Polymeric PTC Product Dimensions (Millimeters) MPTS1206 Part Number MPTS1206L005R MPTS1206L010R MPTS1206L012R MPTS1206L016R MPTS1206L020R MPTS1206L025R MPTS1206L035R MPTS1206L050R MPTS1206L050-24R MPTS1206L075R MPTS1206L075-16R MPTS1206L100R MPTS1206L110R MPTS1206L150R MPTS1206L200R A Min 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 B Max 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 Min 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 C Max 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 Min 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.25 0.90 0.45 0.45 0.45 0.45 0.80 0.85 D Max 0.85 0.85 0.85 0.75 0.75 0.75 0.75 0.55 1.30 1.25 1.25 1.00 1.00 1.40 1.60 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Rev.7 MPTS Series Polymeric PTC Thermal Derating Curve Typical Time-To-Trip at 23º A B C DE F G H I J KL 100 Time-to-trip (S) Z= MPTS1206L005R A= MPTS1206L010R B= MPTS1206L012R C= MPTS1206L016R D= MPTS1206L020R E= MPTS1206L025R F= MPTS1206L035R G= MPTS1206L050R MPTS1206L050-24R H= MPTS1206L075R MPTS1206L075-16R I= MPTS1206L100R J= MPTS1206L110R K= MPTS1206L150R L= MPTS1206L200R 10 1 0.1 0.01 0.1 1 10 100 Fault current (A) Rev.7 MPTS Series Polymeric PTC The dimension in the table below provides the recommended pad layout for each MPTS1206 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Device A Nominal B Nominal All 1206 Series 2.00 1.00 Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 1.90 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage together components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. Theses changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev.7 Polymeric PTC MPTS Series Electrical Characteristics (23º) MPTS1210 Part Number MPTS1210L005R MPTS1210L010R MPTS1210L020R MPTS1210L035R MPTS1210L050R MPTS1210L075R MPTS1210L110R MPTS1210L150R MPTS1210L175R MPTS1210L200R Max Time to Trip Resistance Hold Current Trip Current Rated Voltage Max Current Typical Power Current Time RMIN R1MAX IH, A 0.05 0.10 0.20 0.35 0.50 0.75 1.10 1.50 1.75 2.00 IT, A 0.15 0.25 0.40 0.70 1.00 1.50 2.20 3.00 4.00 4.00 VMAX, Vdc 60 60 30 16 16 8 6 6 6 6 IMAX, A 10 10 10 40 40 40 100 100 100 100 Pd, W 0.60 0.60 0.60 0.60 0.60 0.60 0.80 0.80 0.80 0.80 Amp 0.25 0.50 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 Sec 3.00 1.50 0.02 0.20 0.10 0.10 0.30 0.50 0.60 1.00 Ω 3.600 1.600 0.800 0.320 0.250 0.130 0.060 0.040 0.020 0.015 Ω 50.000 15.000 5.000 1.300 0.900 0.400 0.210 0.110 0.080 0.070 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev.7 Polymeric PTC MPTS Series Product Dimensions (Millimeters) MPTS1210 Part Number MPTS1210L005R MPTS1210L010R MPTS1210L020R MPTS1210L035R MPTS1210L050R MPTS1210L075R MPTS1210L110R MPTS1210L150R MPTS1210L175R MPTS1210L200R A Min 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 B Max 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 Min 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 C Max 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 Min 0.60 0.60 0.40 0.40 0.30 0.30 0.60 0.50 0.80 0.80 D Max 1.15 1.15 0.85 0.80 0.75 0.70 1.00 0.90 1.40 1.40 Min 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Rev.7 MPTS Series Polymeric PTC Thermal Derating Curve Typical Time-To-Trip at 23ºC B C D E FG H IJ 100 10 Time-to-trip (S) A =MPTS1210L005R B =MPTS1210L010R C =MPTS1210L020R D =MPTS1210L035R E =MPTS1210L050R F =MPTS1210L075R G =MPTS1210L110R H =MPTS1210L150R I= MPTS1210L175R J =MPTS1210L200R 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Rev.7 MPTS Series Polymeric PTC The dimension in the table below provides the recommended pad layout for each MPTS1210 device Pad dimensions (millimeters) B A Device Nominal Nominal All 1210 Series 2.00 1.00 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) Time (tL) 217 ℃ 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 2.80 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. Theses changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev.7 MPTS Series Polymeric PTC Electrical Characteristics (23º) MPTS1812 Part Number MPTS1812L010R MPTS1812L014R MPTS1812L020R MPTS1812L035R MPTS1812L050R MPTS1812L075R MPTS1812L075-24R MPTS1812L075-33R MPTS1812L110R MPTS1812L110-16R MPTS1812L110-24R MPTS1812L125R MPTS1812L150R MPTS1812L150-12R MPTS1812L150-24R MPTS1812L160R MPTS1812L160-12R MPTS1812L160-16R MPTS1812L200R MPTS1812L260R MPTS1812L260-13R MPTS1812L260-16R MPTS1812L300R Hold Trip Current Current Max Time to Trip Resistance Rated Voltage Max Current Typical Power Current Time RMIN R1MAX IH, A IT, A VMAX, Vdc IMAX, A Pd, W Amp Sec Ω Ω 0.10 0.14 0.20 0.35 0.50 0.75 0.75 0.75 1.10 1.10 1.10 1.25 1.50 1.50 1.50 1.60 1.60 1.60 2.00 2.60 2.60 2.60 3.00 0.30 0.30 0.40 0.70 1.00 1.50 1.50 1.50 2.20 2.20 2.20 2.50 3.00 3.00 3.00 3.20 3.20 3.20 3.50 5.00 5.00 5.00 5.00 60 60 30 16 16 16 24 33 8 16 24 6 8 12 24 8 12 16 8 6 13.2 16 6 10 10 10 40 40 40 40 40 100 100 100 40 100 100 100 100 100 100 100 100 100 100 100 0.8 0.8 0.8 0.8 0.8 0.8 1.0 1.0 0.8 0.8 1.0 0.8 0.8 1.0 1.0 0.8 1.0 1.0 1.0 1.0 1.3 1.3 1.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 0.020 0.008 0.020 0.100 0.150 0.200 0.200 0.200 0.300 0.500 0.500 0.400 0.500 0.500 1.500 0.500 1.000 1.000 2.000 2.500 5.000 5.000 4.000 1.600 1.200 0.800 0.320 0.150 0.110 0.110 0.110 0.040 0.040 0.060 0.050 0.040 0.040 0.040 0.030 0.030 0.030 0.020 0.015 0.015 0.015 0.012 15.00 6.500 5.000 1.500 1.000 0.450 0.290 0.400 0.210 0.180 0.200 0.140 0.110 0.110 0.120 0.100 0.100 0.100 0.070 0.047 0.050 0.050 0.040 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev.7 Polymeric PTC MPTS Series Product Dimensions (Millimeters) MPTS1812 Part Number A B C D E Min Max Min Max Min Max Min Max Min Max MPTS1812L010R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L014R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L020R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L035R 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65 MPTS1812L050R 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 MPTS1812L075R 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 MPTS1812L075-24R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L075-33R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L110R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L110-16R 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 MPTS1812L110-24R 4.37 4.73 3.07 3.41 0.80 1.30 0.25 0.95 0.25 0.65 MPTS1812L125R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L150R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L150-12R 4.37 4.73 3.07 3.41 0.60 1.10 0.25 0.95 0.25 0.65 MPTS1812L150-24R 4.37 4.73 3.07 3.41 0.60 1.55 0.25 0.95 0.25 0.65 MPTS1812L160R 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 MPTS1812L160-12R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 MPTS1812L160-16R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 MPTS1812L200R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 MPTS1812L260R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 MPTS1812L260-13R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L260-16R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L300R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 Rev.7 MPTS Series Polymeric PTC Thermal Derating Curve ---- MPTS1812L010R MPTS1812L014R MPTS1812L020R MPTS1812L035R MPTS1812L050R ── MPTS1812L075R MPTS1812L075-24R MPTS1812L075-33R MPTS1812L110R MPTS1812L110-16R MPTS1812L110-24R MPTS1812L125R MPTS1812L150R MPTS1812L150-12R MPTS1812L150-24R MPTS1812L160R MPTS1812L160-12R MPTS1812L160-16R MPTS1812L200R MPTS1812L260R MPTS1812L260-13R MPTS1812L260-16R MPTS1812L300R Typical Time-To-Trip at 23ºC AB C 100 D E F GHI J KL M 10 Time-to-trip (S) A = MPTS1812L010R B = MPTS1812L014R C = MPTS1812L020R D = MPTS1812L035R E = MPTS1812L050R F = MPTS1812L075R MPTS1812L075-24R MPTS1812L075-33R G = MPTS1812L110R MPTS1812L110-16R MPTS1812L110-24R H = MPTS1812L125R I = MPTS1812L150R MPTS1812L150-12R MPTS1812L150-24R J = MPTS1812L160R MPTS1812L160-12R MPTS1812L160-16R K = MPTS1812L200R L = MPTS1812L260R MPTS1812L260-13R MPTS1812L260-16R M = MPTS1812L300R 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Rev.7 MPTS Series Polymeric PTC The dimension in the table below provides the recommended pad layout for each MPTS1812 device Pad dimensions (millimeters) B A Device Nominal Nominal All 1812 Series 3.45 1.78 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 3.50 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. Theses changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev.7 Polymeric PTC MPTS Series Electrical Characteristics (23ºC) MPTS2920 Part Number MPTS2920L030R MPTS2920L050R MPTS2920L075R MPTS2920L100R MPTS2920L125R MPTS2920L150R MPTS2920L185R MPTS2920L200R MPTS2920L250R MPTS2920L260R MPTS2920L300R Hold Current Trip Current Rated Voltage Max Current Typical Power IH, A 0.30 0.50 0.75 1.10 1.25 1.50 1.85 2.00 2.50 2.60 3.00 IT, A 0.60 1.00 1.50 2.20 2.50 3.00 3.70 4.00 5.00 5.20 5.20 VMAX,Vdc 60 60 33 33 33 33 33 16 16 6 6 IMAX, A 10 10 40 40 40 40 40 40 40 40 40 Pd, W 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Max Time to Trip Current A 1.5 2.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Time Sec 3.0 4.0 0.3 0.5 2.0 2.0 2.5 4.5 16.0 20.0 25.0 Resistance RMIN Ω 1.000 0.300 0.180 0.090 0.050 0.050 0.040 0.035 0.025 0.020 0.010 R1MAX Ω 4.800 1.400 1.000 0.410 0.250 0.230 0.150 0.120 0.085 0.075 0.048 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev.7 MPTS Series Polymeric PTC Product Dimensions (Millimeters) MPTS2920 Part Number MPTS2920L030R MPTS2920L050R MPTS2920L075R MPTS2920L100R MPTS2920L125R MPTS2920L150R MPTS2920L185R MPTS2920L200R MPTS2920L250R MPTS2920L260R MPTS2920L300R A Min 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 B Max 7.98 7.98 7.98 7.98 7.98 7.98 7.98 7.98 7.98 7.98 7.98 Min 4.80 4.80 4.80 4.80 4.80 4.80 4.80 4.80 4.80 4.80 4.80 C Max 5.44 5.44 5.44 5.44 5.44 5.44 5.44 5.44 5.44 5.44 5.44 Min 0.60 0.60 0.40 0.40 0.40 0.40 0.30 0.30 0.30 0.30 0.40 D Max 1.15 1.15 1.15 1.00 0.90 0.90 0.90 0.90 0.90 0.90 0.90 Min 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 E Max 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 Min 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 Max 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 Rev.7 MPTS Series Polymeric PTC Thermal Derating Curve ---- MPTS2920L030R MPTS2920L050R MPTS2920L075R MPTS2920L100R ── MPTS2920L125R MPTS2920L150R MPTS2920L185R MPTS2920L200R MPTS2920L250R MPTS2920L260R MPTS2920L300R Typical Time-To-Trip at 23ºC A B C D EFGHIJK 100 10 Time-to-trip (S) A = MPTS2920L030R B = MPTS2920L050R C = MPTS2920L075R D = MPTS2920L100R E = MPTS2920L125R F = MPTS2920L150R G = MPTS2920L185R H = MPTS2920L200R I = MPTS2920L250R J = MPTS2920L260R K= MPTS2920L300R 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Rev.7 MPTS Series Polymeric PTC The dimension in the table below provides the recommended pad layout for each MPTS2920 device Pad dimensions (millimeters) B A Device Nominal Nominal All 2920 Series 5.10 2.30 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) Time (tL) 217 ℃ 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 5.60 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. Theses changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev.7