CM6310 EMI Filter with ESD Protection for SIM Card Applications Product Description http://onsemi.com The CM6310 is a 24−bump EMI filter with ESD protection device for data line application in a 0.5 mm pitch, 5 x 5 CSP form factor. It is fully compliant with IEC 61000−4−2. The CM6310 is RoHS II compliant. Features • 24−Bump, 2.60 mm X 2.60 mm Footprint Chip Scale Package • These Devices are Pb−Free and are RoHS Compliant WLCSP24 CASE 567CJ ELECTRICAL SCHEMATIC Input n RI/O Output n GND 1 of 10 Filter Channels MARKING DIAGRAM + CM6310 WWYY XXXXXX CM6310 WWYY XXXXXX = CM6310 = Date Code = Last six digits of lot# ORDERING INFORMATION Device Package Shipping† CM6310 CSP−24 (Pb−Free) 5000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 April, 2011 − Rev. 8 1 Publication Order Number: CM6310/D CM6310 PACKAGE / PINOUT DIAGRAMS Top View (Bumps Down View) Orientation Marking 1 2 + A 3 4 Bottom View (Bumps Up View) 5 5 4 3 2 1 A A1 Corner Indicator B B CM6310 C C D D E E Table 1. PIN DESCRIPTIONS Pin Description B1 Channel 1 Input C1 A2 Pin Description D1 Channel 1 Output Channel 2 Input E1 Channel 2 Output Channel 3 Input D2 Channel 3 Output C2 Channel 4 Input E2 Channel 4 Output B2 Channel 5 Input D3 Channel 5 Output C3 Channel 6 Input E3 Channel 6 Output A5 Channel 7 Input D4 Channel 7 Output C4 Channel 8 Input E4 Channel 8 Output B5 Channel 9 Input D5 Channel 9 Output C5 Channel 10 Input E5 Channel 10 Output A3 GND B3 GND A4 GND B4 GND ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Units Storage Temperature Range –55 to +150 °C Operating Temperature Range –40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol RI/O C Parameter Conditions Resistance Min Typ Max Units 900 1000 1100 W Capacitance per line At 1 MHz, VIN = 0 V 80 100 120 pF VBR Breakdown voltage (Reverse) IR = 1 mA 6 8 10 V ILEAK Leakage current at stand off voltage VRM VRM = 3 V per line 500 nA VESD ESD Protection Peak Discharge Voltage a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Note 2) ±15 ±15 1. All parameters specified at TA = 25°C unless otherwise noted. 2. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. http://onsemi.com 2 kV CM6310 RF CHARACTERISTICS TA = 255C, DC bias = 0 V, 50 W Environment Using Evaluation PCB Figure 1. Typical Filter Frequency Response MECHANICAL SPECIFICATION Vertical Structure Specification* Table 4. VERTICAL STRUCTURE DIMENSIONS (nominal) Ref. Parameter a Die Thickness b Bump Standoff UBM−(Ti/Cu) d Material Dimension Silicon 406 mm 240 mm Plated Cu 5.0 mm Sputtered Cu 0.4 mm Sputtered Ti 0.1 mm e UBM Wetting Area Diameter 280 mm f Solder Bump Diameter after Bump Reflow 320 mm c Metal Pad g Metal Pad Diameter D2 D1 AlSiCu 1.5 mm 324 mm 0.406 mm Finished Thickness 0.650 mm Figure 2. Sectional View * Daisy Chain CM6010 http://onsemi.com 3 CM6310 PACKAGE DIMENSIONS WLCSP24, 2.6x2.6 CASE 567CJ−01 ISSUE O ÈÈ PIN A1 REFERENCE D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B DIM A A1 A2 b D E e E 2X 0.05 C 2X 0.05 C TOP VIEW MILLIMETERS MIN MAX 0.69 0.61 0.21 0.27 0.41 REF 0.29 0.34 2.60 BSC 2.60 BSC 0.50 BSC A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 24X A1 A1 PACKAGE OUTLINE e b 0.05 C A B 0.03 C C SIDE VIEW SEATING PLANE E e D 0.50 PITCH C B 24X 0.50 PITCH A 1 2 3 4 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM6310/D