LM809, LM810 www.ti.com SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 LM809/LM810 3-Pin Microprocessor Reset Circuits Check for Samples: LM809, LM810 FEATURES DESCRIPTION • The LM809/810 microprocessor supervisory circuits can be used to monitor the power supplies in microprocessor and digital systems. They provide a reset to the microprocessor during power-up, powerdown and brown-out conditions. 1 2 • • • • • • Precise Monitoring of 3V, 3.3V, and 5V Supply Voltages Superior Upgrade to MAX809/810 Fully Specified Over Temperature 140ms Min. Power-On Reset Pulse Width, 240ms Typical – Active-Low RESET Output (LM809) – Active-High RESET Output (LM810) Ensured RESET Output Valid for VCC≥1V Low Supply Current, 15µA Typ Power Supply Transient Immunity APPLICATIONS • • • • • • Microprocessor Systems Computers Controllers Intelligent Instruments Portable/Battery-Powered Equipment Automotive Connection Diagrams Top View Figure 1. 3-Lead SOT-23-3 Package See Package Number DBZ ( ) are for LM810 The function of the LM809/810 is to monitor the VCC supply voltage, and assert a reset signal whenever this voltage declines below the factory-programmed reset threshold. The reset signal remains asserted for 240ms after VCC rises above the threshold. The LM809 has an active-low RESET output, while the LM810 has an active-high RESET output. Seven standard reset voltage options are available, suitable for monitoring 5V, 3.3V, and 3V supply voltages. With a low supply current of only 15µA, the LM809/810 are ideal for use in portable equipment. The LM809/LM810 are available in the 3-pin SOT-23 package and in the 6-Lead SON package. Typical Application Circuit Top View Figure 2. 6-Lead SON Package See Package Number NGB0006A () are for LM810 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM809, LM810 SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Pin Descriptions PIN SON SOT-23 1 1 3 NAME GND Ground reference RESET (LM809) Active-low output. RESET remains low while VCC is below the reset threshold, and for 240ms after VCC rises above the reset threshold. RESET (LM810) Active-high output. RESET remains high while VCC is below the reset threshold, and for 240ms after VCC rises above the reset threshold. 2 5 FUNCTION 3 VCC Supply Voltage (+5V, +3.3V, or +3.0V) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to 6.0V VCC −0.3V to (VCC+ 0.3V) RESET, RESET Input Current, VCC Pin 20mA Output Current, RESET, RESET Pin 20mA Rate of Rise, VCC 100V/µs ESD Rating (3) 2kV Continuous Power Dissipation (4) Thermal Resistance, θJA 320mW SON-6 152°C/W SOT-23-3 326°C/W −40°C to +105°C Ambient Temperature Range Maximum Junction Temperature 125°C −65°C to +160°C Storage Temperature Range Lead Temperature (soldering, 10sec) (1) (2) (3) (4) 2 +300°C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the device operates correctly. Operating ratings do not imply ensured performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. At elevated temperatures, devices must be derated based on package thermal resistance. The device in the SOT-23-3 package must be derated at 4mW/°C at ambient temperatures above 70°C. The device has internal thermal protection. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 Electrical Characteristics VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for 4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version (1). Parameter VCC Range Test Conditions Supply Current TA = −40°C to +105°C 1.2 5.5 TA = +85°C to +105°C LM8_ _ -4.38 LM8_ _ -4.00 Reset Threshold (2) LM8_ _ -3.08 LM8_ _ -2.93 LM8_ _ -2.63 LM8_ _ -2.45 VCC<5.5V, LM8_ _ 4.63/4.38/4.00 18 60 VCC<3.6V, LM8_ _ 3.08/2.93/2.63/2.45 15 50 VCC<5.5V, LM8_ _ 4.63/4.38/4.00 100 VCC<3.6V, LM8_ _ 3.08/2.93/2.63/2.45 100 TA = +25°C 4.56 TA = −40°C to +85°C 4.50 TA = +85°C to +105°C 4.40 TA = +25°C 4.31 TA = −40°C to +85°C 4.25 TA = +85°C to +105°C 4.16 TA = +25°C 3.93 TA = −40°C to +85°C 3.89 4.10 TA = +85°C to +105°C 3.80 4.20 TA = +25°C 3.04 TA = −40°C to +85°C 3.00 3.15 TA = +85°C to +105°C 2.92 3.23 TA = +25°C 2.89 TA = −40°C to +85°C 2.85 3.00 TA = +85°C to +105°C 2.78 3.08 TA = +25°C 2.59 TA = −40°C to +85°C 2.55 TA = +85°C to +105°C 2.50 TA = +25°C 2.41 TA = −40°C to +85°C 2.38 2.52 TA = +85°C to +105°C 2.33 2.57 Reset Threshold Temperature Coefficient VCC to Reset Delay (2) Reset Active Timeout Period VOL RESET Output Voltage Low (LM809) (1) (2) RESET Output Voltage High (LM809) 4.63 VCC = VTH to (VTH − 100mV) Units V µA 4.70 4.75 4.86 4.38 4.45 4.50 4.56 4.00 3.08 2.93 2.63 4.06 3.11 V 2.96 2.66 2.70 2.76 2.45 2.49 30 ppm/°C 20 TA = −40°C to +85°C 140 TA = +85°C to +105°C 100 240 µs 560 840 VCC = VTH min, ISINK = 1.2mA, LM8092.45/2.63/2.93/3.08 0.3 VCC = VTH min, ISINK = 3.2mA, LM8094.63/4.38/4.00 0.4 VCC > 1.0V, ISINK = 50µA VOH Max 5.5 LM8_ _ -4.63 VTH Typ 1.0 TA = −40°C to +85°C ICC Min TA = 0°C to +70°C ms V 0.3 VCC > VTH max, ISOURCE = 500µA, LM8092.45/2.63/2.93/3.08 0.8VCC VCC > VTH max, ISOURCE = 800µA, LM8094.63/4.38/4.00 VCC−1.5 V Production testing done at TA = +25°C, over temperature limits specified by design only. RESET Output for LM809, RESET output for LM810. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 3 LM809, LM810 SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com Electrical Characteristics (continued) VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for 4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63/2.45 version(1). Parameter 4 VOL RESET Output Voltage Low (LM810) VOH RESET Output Voltage High (LM810) Test Conditions Min Typ Max VCC = VTH max, ISINK = 1.2mA, LM8102.63/2.93/3.08 0.3 VCC = VTH max, ISINK = 3.2mA, LM8104.63/4.38/4.00 0.4 1.8V < VCC < VTH min, ISOURCE = 150μA Submit Documentation Feedback 0.8VCC Units V V Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 Typical Performance Characteristics Supply Current vs Temperature (No Load, LM8_ _-2.63/2.93/3.08) Supply Current vs Temperature (No Load, LM8_ _-4.63/4.38) Figure 3. Figure 4. Power-Down Reset Delay vs Temp (LM8_ _-2.63/2.93/3.08) Power-Down Reset Delay vs Temperature (LM8_ _-4.63/4.38) Figure 5. Figure 6. Power-Up Reset Timeout vs Temperature Normalized Reset Threshold vs Temperature Figure 7. Figure 8. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 5 LM809, LM810 SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com APPLICATIONS INFORMATION Benefits of Precision Reset Thresholds A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage. A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63V and 3.08V options of the LM809/810 use highly accurate circuitry to ensure that the reset threshold occurs only within this range (for 5V and 3.3V supplies). The other voltage options have the same tight tolerance to ensure a reset signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds apply to 3V, 3.3V, and 5V nominal supply voltages. Table 1. Reset Thresholds Related to Common Supply Voltages Reset Threshold 3.0V 3.3V 5.0V 4.63 ± 3% 90 - 95% 4.38 ± 3% 85 - 90% 4.00 ± 3% 78 - 82% 3.08 ± 3% 90 - 95% 2.93 ± 3% 86 - 90% 2.63 ± 3% 85 - 90% 77 - 81% 2.45 ± 3% 79 - 84% 72 - 76% Ensuring a Valid Reset Output Down to VCC = 0V When VCC falls below 1V, the LM809 RESET output no longer sinks current. A high-impedance CMOS logic input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100kΩ resistor should be connected from the RESET output to ground, as shown in Figure 9. A 100kΩ pull-up resistor to VCC is also recommended for the LM810, if RESET is required to remain valid for VCC < 1V. Figure 9. RESET Valid to VCC = Ground Circuit Negative-Going VCC Transients The LM809/810 are relatively immune to short negative-going transients or glitches on VCC. Figure 10 shows the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In general, as the magnitude of the transient increases, going further below the threshold, the maximum allowable pulse width decreases. Typically, for the 4.63V and 4.38V version of the LM809/810, a VCC transient that goes 100mV below the reset threshold and lasts 20µs or less will not cause a reset pulse. A 0.1 µF bypass capacitor mounted as close as possible to the VCC pin will provide additional transient rejection. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 LM809, LM810 www.ti.com SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 Figure 10. Maximum Transient Duration without Causing a Reset Pulse vs. Reset Comparator Overdrive Interfacing to µPs with Bidirectional Reset Pins Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the LM809 RESET output. To ensure a correct output on the LM809 even when the microprocessor reset pin is in the opposite state, connect a 4.7kΩ resistor between the LM809 RESET output and the µP reset pin, as shown in Figure 11. Buffer the LM809 RESET output to other system components. Figure 11. Interfacing to Microprocessors with Bidirectional Reset I/O SON Mounting The SON package requires special mounting techniques which are detailed in Texas Instruments Application Note AN-1187. Referring to the section PCB Design Recommendations, it should be noted that the pad style which should be used with the SON package is the NSMD (non-solder mask defined) type. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 7 LM809, LM810 SNVS052D – SEPTEMBER 1999 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision C (May 2013) to Revision D • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM809 LM810 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM809M3-2.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S3B LM809M3-2.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3-2.93 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S4B LM809M3-2.93/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3-3.08 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S5B LM809M3-3.08/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3-4.38/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S7B LM809M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 S8B LM809M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM809M3X-2.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S3B LM809M3X-2.93/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S4B LM809M3X-3.08/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S5B LM809M3X-4.38/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM809M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 S8B LM810M3-4.63 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 105 SEB LM810M3-4.63/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB LM810M3X-4.63/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 105 SEB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 1 S7B Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 178.0 8.4 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 178.0 LM809M3-2.93 SOT-23 DBZ 3 1000 178.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 LM809M3-3.08 SOT-23 DBZ 3 LM809M3-3.08/NOPB SOT-23 DBZ LM809M3-4.38/NOPB SOT-23 DBZ LM809M3-4.63 SOT-23 W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3-4.63 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM809M3-2.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-2.93/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-3.08/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.38/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM809M3X-2.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-2.93/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-3.08/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.38/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM809M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM810M3-4.63 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3-4.63/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM810M3X-4.63/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated